Heat dissipation system and method, and device to be cooled, electronic device and storage medium

Abstract

Provided in the embodiments of the present disclosure are a heat dissipation system and method, and a device to be cooled, an electronic device and a storage medium. The system comprises: a piezoelectric heat dissipation apparatus (1), a natural heat dissipation apparatus (2), a temperature sensor (3) and a control unit (4), wherein the piezoelectric heat dissipation apparatus (1) and the natural heat dissipation apparatus (2) are arranged on a heat source (5), and the control unit (4) is electrically connected to the temperature sensor (3) and the piezoelectric heat dissipation apparatus (1); the temperature sensor (3) measures the temperature of the heat source; the natural heat dissipation apparatus (2) performs natural heat dissipation; the piezoelectric heat dissipation apparatus (1) performs natural heat dissipation and performs airflow heat dissipation by means of a piezoelectric effect; and the control unit (4) acquires the temperature of the heat source, controls, when the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation apparatus (1) to operate and to generate an airflow so as to make the natural heat dissipation apparatus (2) and the piezoelectric heat dissipation apparatus (1) perform airflow heat dissipation, and controls, when the temperature of the heat source is less than the temperature threshold, the piezoelectric heat dissipation apparatus (1) to stop operating so as to make the natural heat dissipation apparatus (2) and the piezoelectric heat dissipation apparatus (1) perform natural heat dissipation.

Description

Heat dissipation system, method, device to be cooled, electronic device, and storage medium

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202311283463.9 filed on September 27, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation system, method, device to be cooled, electronic device, and storage medium. Background Art

[0004] Modern electronic products are characterized by powerful functionality and compact size. For example, wireless home devices like routers, switches, and optical modems are extremely powerful. Televisions, computers, tablets, and mobile phones all require connection to these devices. However, these electronic products suffer from high power consumption and heat generation during use.

[0005] Summary of the Invention

[0006] Embodiments of the present disclosure provide a heat dissipation system, method, device to be cooled, electronic device, and storage medium.

[0007] In a first aspect, an embodiment of the present disclosure provides a heat dissipation system, comprising: a piezoelectric heat dissipation device, a natural heat dissipation device, a temperature sensor and a control unit; wherein the piezoelectric heat dissipation device and the natural heat dissipation device are arranged on the heat source of the equipment to be cooled, and the control unit is electrically connected to the temperature sensor and the piezoelectric heat dissipation device, respectively; the temperature sensor is configured to detect the temperature of the heat source; the natural heat dissipation device is configured to perform natural heat dissipation; the control unit is configured to obtain the temperature of the heat source, and when the temperature of the heat source is greater than or equal to a preset temperature threshold, control the piezoelectric heat dissipation device to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation; when the temperature of the heat source is less than the temperature threshold, control the piezoelectric heat dissipation device to stop operating, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation.

[0008] In the second aspect, an embodiment of the present disclosure provides a heat dissipation method, based on the heat dissipation system and applied to a control unit of the heat dissipation system, the method includes: obtaining the heat source temperature of the device to be dissipated; when the heat source temperature is greater than or equal to a preset temperature threshold, controlling the piezoelectric heat dissipation device of the heat dissipation system to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation; when the heat source temperature is less than the temperature threshold, controlling the piezoelectric heat dissipation device to stop operating, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation.

[0009] In a third aspect, an embodiment of the present disclosure provides a device to be cooled, including: the cooling system described above.

[0010] In a fourth aspect, an embodiment of the present disclosure provides an electronic device, comprising: one or more processors; a memory on which one or more programs are stored, wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the heat dissipation method; and one or more input / output (I / O) interfaces connected between the processor and the memory and configured to implement information interaction between the processor and the memory.

[0011] In a fifth aspect, an embodiment of the present disclosure provides a computer-readable storage medium having a computer program stored thereon, and the computer program implements the heat dissipation method when executed by a processor. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In the accompanying drawings of the embodiments of the present disclosure:

[0013] FIG1 is a block diagram of a heat dissipation system according to an embodiment of the present disclosure;

[0014] FIG2 is a block diagram of a piezoelectric heat dissipation device according to an embodiment of the present disclosure;

[0015] FIG3 is a schematic diagram of a first heat sink provided by an embodiment of the present disclosure being disposed on a second heat sink;

[0016] FIG4 is a schematic diagram showing the correspondence between different temperature levels, different swing frequency levels, and window opening and closing conditions in a heat source temperature rising scenario provided by an embodiment of the present disclosure;

[0017] FIG5 is a schematic diagram showing the correspondence between different temperature levels, different swing frequency levels, and window opening and closing conditions in a heat source temperature drop scenario provided by an embodiment of the present disclosure;

[0018] FIG6 is a connection diagram of a window opening control device provided in an embodiment of the present disclosure;

[0019] FIG7 is a block diagram of a window opening control device according to an embodiment of the present disclosure;

[0020] FIG8 is a flow chart of a heat dissipation method provided by an embodiment of the present disclosure;

[0021] FIG9 is a block diagram of a device to be cooled provided by an embodiment of the present disclosure;

[0022] FIG10 is a block diagram of an electronic device according to an embodiment of the present disclosure;

[0023] FIG11 is a block diagram showing the composition of a computer-readable storage medium provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the communication perception data processing method and computer-readable storage medium provided by the embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0025] The present disclosure will be described more fully hereinafter with reference to the accompanying drawings, but the illustrated embodiments may be embodied in different forms, and the present disclosure should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that the present disclosure will be thorough and complete and will fully understand the scope of the present disclosure to those skilled in the art.

[0026] The accompanying drawings of the embodiments of the present disclosure are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the specification. Together with the detailed embodiments, they are used to explain the present disclosure and do not constitute a limitation of the present disclosure. The above and other features and advantages will become more apparent to those skilled in the art by describing the detailed embodiments with reference to the accompanying drawings.

[0027] In the absence of conflict, the various embodiments of the present disclosure and the various features therein may be combined with each other.

[0028] The terms used in this disclosure are only used to describe specific embodiments and are not intended to limit the disclosure. As used in this disclosure, the term "and / or" includes any and all combinations of one or more related enumerated items. As used in this disclosure, the singular forms "a" and "the" are also intended to include plural forms, unless the context clearly indicates otherwise. As used in this disclosure, the terms "comprising" and "made of" specify the presence of the features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof.

[0029] Unless otherwise defined, all terms (including technical and scientific terms) used in this disclosure have the same meanings as those commonly understood by those skilled in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning unless expressly defined in this disclosure.

[0030] Today's electronic products are characterized by powerful functions and small size, especially wireless home products, such as routers, switches, optical modems, etc., which are very powerful. Televisions, computers, tablets, mobile phones, etc. need to be connected to routers, switches, etc., especially home router products. Almost all smart devices are associated with routers or optical modems. These home products are characterized by high power consumption and severe heat generation, which usually makes users feel hot to the touch and even makes users worry about product safety issues.

[0031] As the size of home products becomes smaller and smaller, users are paying more and more attention to the heat generated by the devices. Poor heat dissipation will cause heat to accumulate inside the shell, directly affecting the actual performance and life of the product, and even affecting the actual user experience. Therefore, a good heat dissipation system can effectively improve the product's service life and actual performance, and give customers a better experience.

[0032] The current cooling architecture of home products (such as home routers) mainly adopts natural cooling or forced cooling structure. The natural cooling structure mainly relies on heat sinks to dissipate heat, radiating the heat from the chip and the structure. The forced cooling mainly adds a fan device to the heat sink to dissipate heat quickly, which can effectively reduce the temperature of the entire device.

[0033] Natural cooling devices are simple, essentially adding heat sinks of various shapes to the circuit, such as flat plate heat sinks and toothed heat sinks. Since home appliances are characterized by being quiet and noiseless, most devices currently use natural cooling devices to achieve this, relying entirely on a single heat sink. However, this has the disadvantage of limited cooling capacity for high-power devices. Some high-end products typically use forced cooling, adding fans to the heat sink to quickly radiate heat away. However, the disadvantages are that fans are noisy over long periods of operation, have a short lifespan, and are prone to damage. Home appliances have long lifespans, and any fan failure can lead to overheating and potential damage.

[0034] The embodiment of the present disclosure takes into account the stability and silent characteristics of home products (the router or optical modem device is noiseless) and provides a new heat dissipation solution. This heat dissipation solution not only solves the characteristics of slow natural heat dissipation, but also solves the overheating problem of the product. It can effectively reduce product power consumption and temperature and ensure product system stability.

[0035] The heat dissipation system of the disclosed embodiments can be applied to any product requiring heat dissipation, particularly products requiring silent heat dissipation, including but not limited to in-vehicle devices, user equipment (UE), mobile devices, computing devices, etc. UEs may include but are not limited to home-side communication transfer devices (e.g., routers, optical modems, etc.), home appliances, etc. The heat dissipation method of the disclosed embodiments can be implemented by a processor invoking computer-readable program instructions stored in a memory, or by a server.

[0036] The following is a detailed introduction to the embodiments of the present disclosure.

[0037] An embodiment of the present disclosure provides a heat dissipation system A, as shown in FIG1 , comprising: a piezoelectric heat dissipation device 1, a natural heat dissipation device 2, a temperature sensor 3 and a control unit 4. The piezoelectric heat dissipation device 1 and the natural heat dissipation device 2 are arranged on the heat source 5 of the device B to be cooled, and the control unit 4 is electrically connected to the temperature sensor 3 and the piezoelectric heat dissipation device 1, respectively. The temperature sensor 3 is configured to detect the temperature of the heat source. The natural heat dissipation device 2 is configured to perform natural heat dissipation. The piezoelectric heat dissipation device 1 is configured to perform natural heat dissipation and perform airflow heat dissipation through the piezoelectric effect. The control unit 4 is configured to obtain the temperature of the heat source, and when the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation device 1 is controlled to operate and generate airflow, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 perform airflow heat dissipation; when the temperature of the heat source is less than the temperature threshold, the piezoelectric heat dissipation device 1 is controlled to stop operating, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 perform natural heat dissipation.

[0038] The heat dissipation system of the disclosed embodiment can achieve airflow heat dissipation and natural heat dissipation through the piezoelectric heat dissipation device, and can achieve natural heat dissipation through the natural heat dissipation device. The two devices dissipate heat together, ensuring the heat dissipation effect, and can quickly dissipate heat for the product. The airflow heat dissipation achieved by the piezoelectric heat dissipation device is to generate airflow through the piezoelectric effect. The vibration noise caused by the piezoelectric effect is extremely small, so that the product can also achieve a silent effect during the airflow heat dissipation period, improving the user experience. In addition, compared with the fan lamp heat dissipation device, the piezoelectric heat dissipation device is small in size, occupies less space, has a long life, is not easy to damage, and is convenient for use in small products such as routers and optical modem devices. The heat dissipation system also includes a control unit, which can adjust the heat dissipation scheme according to the temperature of the heat source (using airflow heat dissipation and natural heat dissipation, or only using natural heat dissipation), realizing the intelligent control of the heat dissipation system, so that it can quickly dissipate and cool down when the temperature is high, ensuring the heat dissipation effect.

[0039] In the embodiment of the present disclosure, the heat source 5 may include, but is not limited to, a PCB (printed circuit board) of the device to be cooled and heat-generating components, such as chips, mounted on the PCB. The type, quantity, shape, size, and structure of the heat source 5 are not limited herein.

[0040] In the embodiments disclosed herein, there is no limitation on the composition structures of the piezoelectric heat dissipation device 1 and the natural heat dissipation device 2. Any equipment or device that can achieve natural heat dissipation can be used as the natural heat dissipation device 2, and any equipment or device that can achieve heat dissipation through the piezoelectric effect can be used as the piezoelectric heat dissipation device 1.

[0041] In the embodiment of the present disclosure, the natural heat dissipation device 2 may include but is not limited to a flat plate heat sink and a toothed heat sink.

[0042] In the embodiment of the present disclosure, there are no restrictions on the location, number, layout, etc. of the piezoelectric heat dissipation device 1 and the natural heat dissipation device 2 on the heat source 5, and they can be defined according to needs.

[0043] In an embodiment of the present disclosure, as shown in Figure 2, the piezoelectric heat dissipation device 1 may include but is not limited to: at least one swingable first heat sink 11, a piezoelectric sheet 12 for driving the first heat sink 11 to swing, and a piezoelectric power supply device 13; the first heat sink 11 is connected to the piezoelectric sheet 12, and the piezoelectric sheet 12 is electrically connected to the piezoelectric power supply device 13; the control unit 4 is electrically connected to the piezoelectric power supply device 13; the natural heat dissipation device 2 may include at least one second heat sink 21.

[0044] In the embodiment of the present disclosure, the piezoelectric sheet 12 may be a metal sheet or a thin sheet containing metal, and may be powered by the piezoelectric power supply device 13 . The piezoelectric sheet 12 may vibrate after being energized, thereby driving the first heat sink 11 to swing.

[0045] In the embodiment of the present disclosure, in order to minimize the sound generated by the vibration of the piezoelectric sheet 12 , the piezoelectric sheet 12 may be made of a sound-absorbing material, or a sound-absorbing material may be provided on the piezoelectric sheet 12 .

[0046] In the disclosed embodiment, the piezoelectric sheet 12 and the first heat sink 11 can be integrated or separately. In an integrated configuration, the first heat sink 11 can be directly connected to the piezoelectric power supply 13 as the piezoelectric sheet 12, so that the first heat sink 11 vibrates when energized. In a separate configuration, the piezoelectric sheet 12 and the first heat sink 11 are each treated as an individual unit, with the first heat sink 11 connected to the piezoelectric sheet 12, which in turn is connected to the piezoelectric power supply 13.

[0047] In the embodiment of the present disclosure, the first heat sink 11 may include one or more fins, and the second heat sink 21 may include one or more fins. The number of the first heat sink 11 and the second heat sink 21 is not limited.

[0048] In the embodiment of the present disclosure, the first heat sink 11 and / or the second heat sink 21 can be directly or indirectly connected to the heat source 5 to conduct the heat generated by the heat source 5 and dissipate it. For example, the first heat sink 11 and the second heat sink 21 can be set on the heat source 5 through a preset heat dissipation pad.

[0049] In the embodiment of the present disclosure, the first heat sink 11 can be directly disposed on the heat source 5 , can be disposed on the heat source 5 through a heat dissipation pad, or can be disposed on the second heat sink 21 .

[0050] In the embodiment of the present disclosure, the first heat sink 11 can be arranged on one side, upper part, top, etc. of the heat source 5 and / or the second heat sink 21. The detailed setting method, position, quantity, etc. of the first heat sink 11 are not limited here.

[0051] In the embodiment of the present disclosure, as shown in FIG3 , a schematic diagram of a first heat sink 11 disposed on a second heat sink 21 is shown. In FIG3 , a plurality of second heat sinks 21 (e.g., 21-1, 21-2, 21-3, ..., 21-n, where n is a positive integer) are disposed in parallel, with one side of each second heat sink 21 connected to a first heat sink 11 (e.g., 11-1, 11-2, 11-3, ..., 11-n), and the plurality of first heat sinks 11 are all connected to the piezoelectric sheet 12.

[0052] In the embodiment of the present disclosure, since the first heat sink 11 needs to have a swinging space, no matter where the first heat sink 11 is set, a swinging space must be reserved for the first heat sink 11, and a swingable part can be reserved for the first heat sink 11. For example, the first heat sink 11 can be partially suspended on the heat source and / or the second heat sink 21.

[0053] In the embodiment of the present disclosure, for example, the second heat sink 21 can be selected as a toothed heat sink, and a portion of the plurality of first heat sinks 11 can be arranged on the plurality of teeth of the toothed heat sink, and can be arranged on the upper part or top part of the plurality of teeth, so that the air flow can take away the heat from the upper space of the toothed heat sink through swinging.

[0054] In the embodiment of the present disclosure, when there are multiple first heat sinks 11, each first heat sink 11 can be connected to a piezoelectric sheet 12, or multiple first heat sinks 11 can be connected to the same piezoelectric sheet 12. There is no limit on the number of piezoelectric sheets 12.

[0055] In the disclosed embodiment, the piezoelectric sheet 12 is typically thin. To enable the piezoelectric sheet 12 to vibrate and drive the first heat sink 11 to oscillate, the first heat sink 11 is configured to be thin. The specific thickness of the first heat sink 11 is not limited herein, as long as it can follow the vibration of the piezoelectric sheet 12. The first heat sink 11 can be a flexible heat sink to increase the swing amplitude, drive greater airflow, and enhance the heat dissipation effect.

[0056] In the embodiment of the present disclosure, based on the above settings, the temperature of the heat source 5 can be monitored in real time or periodically through the temperature sensor 3, and the control unit 4 can control the power supply or power off of the piezoelectric heat dissipation device 1 according to the detected heat source temperature, so as to achieve the purpose of controlling the operation or stop of the piezoelectric heat dissipation device 1, thereby controlling the first heat sink 11 in the piezoelectric heat dissipation device 1 to swing or stop, so that the piezoelectric heat dissipation device 1 can realize two heat dissipation modes: airflow heat dissipation and natural heat dissipation.

[0057] In the embodiment of the present disclosure, for example, when the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation device 1 is controlled to operate and generate airflow, so that the heat conducted by the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 is taken away by the airflow, thereby realizing airflow heat dissipation and natural heat dissipation; when the temperature of the heat source is lower than the temperature threshold, the piezoelectric heat dissipation device 1 is controlled to stop operating, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 perform natural heat dissipation.

[0058] In the embodiment disclosed herein, this embodiment scheme can be used to perform natural heat dissipation when the temperature of the heat source 5 is low, and to perform airflow heat dissipation and natural heat dissipation when the temperature of the heat source 5 is high, thereby achieving the purpose of saving energy when the temperature is low and quickly cooling when the temperature is high.

[0059] In the embodiment of the present disclosure, the control unit 4 controls the piezoelectric heat dissipation device 1 to operate and generate airflow, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 perform airflow heat dissipation, including: controlling the piezoelectric power supply device 13 to power the piezoelectric piece 12, so that the piezoelectric piece 12 vibrates to drive the first heat sink 11 to swing, and the airflow generated by the swing takes away the heat of the first heat sink 11 and the second heat sink 21.

[0060] The control unit 4 controls the piezoelectric heat dissipation device 13 to stop running, so that the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 perform natural heat dissipation, including: controlling the piezoelectric power supply device 13 to cut off the power to the piezoelectric piece 12, so that the piezoelectric piece 12 stops vibrating, and the first heat dissipation piece 11 stops swinging, and the first heat dissipation piece 11 and the second heat dissipation piece 21 perform natural heat dissipation.

[0061] In the embodiment of the present disclosure, the control unit 4 controls the power supply or power off of the piezoelectric heat dissipation device 1, mainly used to control the piezoelectric power supply device 13 to power on or power off the piezoelectric piece 12. The piezoelectric piece 12 will vibrate when powered on, and the piezoelectric piece 12 will stop vibrating when powered off.

[0062] In the embodiment of the present disclosure, the control unit 4 can also be configured to adjust the supply voltage of the piezoelectric power supply device 13 according to the temperature of the heat source, and adjust the swing frequency of the first heat sink 11 by changing the supply voltage.

[0063] In the embodiment of the present disclosure, the heat source temperature can be divided into multiple levels, and the power supply voltage of the piezoelectric power supply device 13 can also be set to multiple levels accordingly, so that the swing frequency of the first heat sink 11 has multiple levels accordingly.

[0064] In the embodiment of the present disclosure, the heat source temperature can be increased or decreased according to the respective corresponding multiple levels. The levels divided in the heat source temperature increase scene and the heat source temperature decrease scene can be the same or different.

[0065] In the embodiment of the present disclosure, as shown in Figures 4 and 5, for example, in a scenario where the heat source temperature rises, six levels can be set, namely 75°C, 85°C, 95°C, 105°C, 115°C, and 125°C. The swing frequencies corresponding to the temperatures of 75°C, 85°C, 95°C, 105°C, 115°C, and 125°C can be 0 Hz, 0 Hz, 30 Hz, 40 Hz, 50 Hz, and 50 Hz, respectively. In a scenario where the heat source temperature drops, six levels can be set, namely 75°C, 85°C, 95°C, 105°C, 115°C, and 125°C. The swing frequencies corresponding to the temperatures of 125°C, 115°C, 105°C, 95°C, 85°C, and 75°C can be 50 Hz, 50 Hz, 40 Hz, 30 Hz, 0 Hz, and 0 Hz, respectively.

[0066] In an embodiment of the present disclosure, as shown in FIG6 , the heat dissipation system A may further include: a window opening control device 6 ; the window opening control device 6 is electrically connected to the control unit 4 .

[0067] The device B to be cooled may include a housing 7 , on which at least one window 71 and a window baffle 72 for covering the window 71 may be provided.

[0068] The window opening control device 6 can be configured to control the movement of the window baffle 72 under the control of the control unit 4 to open or close the window 71 .

[0069] In the embodiment of the present disclosure, in order to improve the heat dissipation effect, at least one window 71 can be set on the device B to be cooled for ventilation. The shape, size, number and position of the window can be defined according to needs.

[0070] In the embodiment of the present disclosure, in order to prevent excessive dust accumulation inside the device B to be cooled due to the electrostatic effect after the window 71 is opened, thereby affecting the performance of the device, a window baffle 72 can be provided to block the window 71. The window baffle 72 can be configured as a movable structure. When the window 71 needs to be opened, the window baffle 72 can be moved away from the window 71. When the window 71 does not need to be opened, the window baffle 72 can be moved back to the window 71. The circumstances in which the window 71 needs to be opened include, but are not limited to, when the temperature of the heat source 5 is too high and rapid heat dissipation is required. By providing the window baffle 72, the purposes of rapid heat dissipation and dust prevention can be achieved at the same time.

[0071] In the embodiment of the present disclosure, the control unit 4 can also be configured to perform a first control on the window opening control device 6 to control the window baffle 72 to open the window 71 when the heat source temperature is greater than or equal to the temperature threshold; and to perform a second control on the window opening control device 6 to control the window baffle 72 to close the window 71 when the heat source temperature is less than the temperature threshold.

[0072] In the embodiment of the present disclosure, according to the foregoing content, when the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation device 1 can be controlled to operate and generate airflow, so that the heat conducted by the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 can be taken away by the airflow, thereby realizing airflow heat dissipation and natural heat dissipation; after the piezoelectric heat dissipation device 1 generates airflow, if the outer shell 7 is in a closed state at this time, for example, the window 71 is not opened, the airflow will only flow within the outer shell 7 and cannot exchange heat with the outside air, thereby failing to achieve the purpose of rapid heat dissipation. Therefore, airflow heat dissipation cannot be truly realized. At this time, it is necessary to control (such as the first control mentioned above) the window opening control device 6 to control the window baffle 72 to open the window 71.

[0073] In the embodiment of the present disclosure, when the temperature of the heat source is less than the temperature threshold, the piezoelectric heat dissipation device 1 is controlled to stop operating, allowing the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 to dissipate heat naturally. Since the temperature of the heat source 5 is not high at this time, the natural heat dissipation device 2 and the piezoelectric heat dissipation device 1 can dissipate heat naturally. Therefore, even if there is a shell at this time, the shell 7 can slowly exchange heat with the external environment to achieve natural heat dissipation. At this time, the window opening control device 6 can also be controlled (such as the second control described above) to control the window baffle 72 to open the window 71. Whether the window 71 needs to be opened can be determined by selecting an appropriate control strategy according to needs.

[0074] In the disclosed embodiment, as shown in FIG7 , the window opening control device 6 may include, but is not limited to, a relay 61, a spring 62, and a relay power supply 63. A first end of a window baffle 72 is connected to a first end of the spring 62, and a second end of the spring 62 is fixed to the housing 7. The second end of the window baffle 72 is connected to the movable contact of the relay 61. The relay 61 is electrically connected to the relay power supply 63. The relay power supply 63 is electrically connected to the control unit 4.

[0075] In the embodiment of the present disclosure, the control unit 4 performs a first control on the window opening control device 6 to control the window baffle 72 to open the window 71, including: controlling the relay power supply device 63 to power the relay 61, so as to pull the window baffle 72 to move in the first direction through the relay 61 to open the window 71.

[0076] The control unit 4 performs a second control on the window opening control device 6 to control the window baffle 72 to close the window 71, including: controlling the relay power supply device 63 to cut off the power to the relay 61, so that the spring 62 is released through the relay 61 to pull the window baffle 72 to move in the second direction to close the window 71.

[0077] In the embodiment of the present disclosure, a connecting rod can be provided on the window baffle 72, and the rod body of the connecting rod is fixed on the window baffle 72. One end of the connecting rod is connected to the spring 62, and the other end is connected to the moving contact of the relay 61, so that when the relay 61 is energized and the moving contact and the static contact are attracted, the connecting rod will be pulled, and the connecting rod will drive the window baffle 72 to move; similarly, when the relay 61 loses power and the moving contact and the static contact are released, the connecting rod is pulled back by the spring, and the connecting rod drives the window baffle 72 to return to its original position.

[0078] In the embodiment of the present disclosure, when one side of the shell 7 includes multiple windows 71, the multiple windows 71 can respectively correspond to a window baffle 72, and these window baffles 72 can be connected by the above-mentioned connecting rod so that when the connecting rod moves, all of these window baffles 72 can be driven to move together.

[0079] In the embodiment of the present disclosure, when the temperature sensor 3 detects that the heat source temperature is greater than or equal to the temperature threshold, the control unit 4 controls the piezoelectric power supply device 13 to output voltage to the piezoelectric disc 12, causing the piezoelectric disc 12 to vibrate and drive the first heat sink 11 to oscillate. The control unit 4 also controls the relay power supply device 63 to output voltage to the relay 61. When the relay 61 has voltage, the window block 72 is attracted, and the window 71 opens. Through the window 71, the airflow generated by the swinging of the first heat sink 11 flows out and removes the heat, which can effectively solve the problem of high-power heat dissipation. When the temperature sensor 3 detects that the heat source temperature is less than the temperature threshold, the control unit 4 controls the piezoelectric power supply device 13 to stop supplying power to the piezoelectric disc 12, causing the piezoelectric disc 12 to stop vibrating and the first heat sink 11 to stop oscillating. The first heat sink 11 dissipates heat naturally. The control unit 4 also controls the relay power supply device 63 to stop supplying power to the relay 61. When the relay 61 has no voltage, the window block 72 is released. The window block 72 is pulled back by the spring 62, and the window 71 is closed.

[0080] The embodiment of the present disclosure further provides a heat dissipation method, as shown in FIG8 , based on the heat dissipation system A and applied to the control unit of the heat dissipation system A. The method includes steps S11 - S12 .

[0081] In step S11 , the heat source temperature of the printed circuit board of the device to be cooled is obtained.

[0082] In step S12, when the heat source temperature is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation device of the heat dissipation system is controlled to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation; when the heat source temperature is lower than the temperature threshold, the piezoelectric heat dissipation device is controlled to stop operating, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation.

[0083] In an embodiment of the present disclosure, controlling the piezoelectric heat dissipation device of the heat dissipation system to operate and generate airflow so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation may include: controlling the piezoelectric power supply device of the piezoelectric heat dissipation device to power the piezoelectric sheet of the piezoelectric heat dissipation device so that the piezoelectric sheet vibrates to drive the first heat dissipation sheet of the piezoelectric heat dissipation device to swing, and the airflow generated by the swing takes away the heat from the first heat dissipation sheet and the second heat dissipation sheet of the natural heat dissipation device.

[0084] In an embodiment of the present disclosure, the piezoelectric heat dissipation device is controlled to stop running so that the natural heat dissipation device and the piezoelectric heat dissipation device can dissipate heat naturally, including: controlling the piezoelectric power supply device to cut off power to the piezoelectric piece so that the piezoelectric piece stops vibrating and the first heat sink stops swinging, and the first heat sink and the second heat sink dissipate heat naturally.

[0085] In the embodiment of the present disclosure, the method may further include: adjusting the supply voltage of the piezoelectric power supply device according to the temperature of the heat source, and adjusting the swing frequency of the first heat sink by changing the supply voltage.

[0086] In an embodiment of the present disclosure, the method may further include: when the heat source temperature is greater than or equal to a temperature threshold, performing a first control on the window opening control device of the heat dissipation system to control the window baffle of the device to be cooled to open the window on the outer casing of the device to be cooled; when the heat source temperature is less than the temperature threshold, performing a second control on the window opening control device to control the window baffle to close the window.

[0087] In an embodiment of the present disclosure, a first control is performed on a window opening control device of a heat dissipation system to control a window baffle of a device to be cooled to open a window on a housing of the device to be cooled, including: controlling a relay power supply device of the window opening control device to power a relay of the window opening control device, so as to pull the window baffle to a first direction by attracting the relay to open the window; and performing a second control on the window opening control device to control the window baffle to close the window, including: controlling the relay power supply device to de-energize the relay, so as to release the relay so that a spring of the window opening control device pulls the window baffle to a second direction to close the window.

[0088] In the embodiments of the present disclosure, any embodiment of the aforementioned heat dissipation system is applicable to the embodiment of the heat dissipation method and will not be described in detail here.

[0089] The embodiment of the present disclosure further provides a device B to be cooled, as shown in FIG9 , which may include: a heat source 5 and the cooling system A.

[0090] An embodiment of the present disclosure also provides an electronic device 100, as shown in Figure 10, which may include: one or more processors 101; a memory 102, on which one or more programs are stored, and when the one or more programs are executed by the one or more processors 101, the one or more processors 101 implement the heat dissipation method; one or more input / output I / O interfaces 103, connected between the processor 101 and the memory 102, and configured to implement information interaction between the processor 101 and the memory 102.

[0091] Among them, the processor 101 is a device with data processing capabilities, including but not limited to a central processing unit (CPU); the memory 102 is a device with data storage capabilities, including but not limited to random access memory (RAM, more specifically SDRAM, DDR, etc.), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and flash memory (FLASH); the I / O interface (read-write interface) 103 is connected between the processor 101 and the memory 102, and can realize information exchange between the processor 101 and the memory 102, including but not limited to a data bus (Bus), etc.

[0092] In some embodiments, the processor 101 , the memory 102 , and the I / O interface 103 are connected to each other via a bus 104 , and further connected to other components of the computing device.

[0093] The embodiment of the present disclosure further provides a computer-readable storage medium 200 , as shown in FIG11 . The computer-readable storage medium 200 stores a computer program, and when the computer program is executed by a processor, the heat dissipation method is implemented.

[0094] Those skilled in the art will appreciate that all or some of the steps, systems, and functional modules / units in the apparatus disclosed above may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0095] In hardware implementations, the division between functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed by several physical components in cooperation.

[0096] Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit (CPU), a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or temporary medium). As is well known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, random access memory (RAM, more specifically SDRAM, DDR, etc.), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory (FLASH) or other disk storage; compact disc (CD-ROM), digital versatile disc (DVD) or other optical disc storage; magnetic cassettes, tapes, disk storage or other magnetic storage; any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, as is well known to those skilled in the art, communication media typically embodies computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0097] The present disclosure has disclosed example embodiments, and although specific terms are employed, they are used and should be interpreted only in a general illustrative sense and not for purposes of limitation. In some instances, it will be apparent to those skilled in the art that, unless otherwise expressly indicated, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments. Therefore, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the scope of the present disclosure as set forth in the appended claims.

Claims

1. A heat dissipation system, comprising: Piezoelectric heat dissipation device, natural heat dissipation device, temperature sensor and control unit; The piezoelectric heat dissipation device and the natural heat dissipation device are arranged on the heat source of the device to be cooled, and the control unit is electrically connected to the temperature sensor and the piezoelectric heat dissipation device respectively; The temperature sensor is configured to detect the temperature of the heat source; The natural heat dissipation device is configured to perform natural heat dissipation; The piezoelectric heat dissipation device is configured to perform natural heat dissipation and airflow heat dissipation through the piezoelectric effect; The control unit is configured to obtain the temperature of the heat source, and when the temperature of the heat source is greater than or equal to a preset temperature threshold, control the piezoelectric heat dissipation device to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation; when the temperature of the heat source is less than the temperature threshold, control the piezoelectric heat dissipation device to stop operating, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation.

2. The heat dissipation system according to claim 1, wherein: The piezoelectric heat sink comprises at least one swingable first heat sink, a piezoelectric sheet for driving the first heat sink to swing, and a piezoelectric power supply device; The first heat sink is connected to the piezoelectric sheet, and the piezoelectric sheet is electrically connected to the piezoelectric power supply device; the control unit is electrically connected to the piezoelectric power supply device; the natural heat dissipation device includes at least one second heat sink; The control unit controls the piezoelectric heat dissipation device to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation, including: Controlling the piezoelectric power supply device to supply power to the piezoelectric sheet, so that the piezoelectric sheet vibrates to drive the first heat sink to swing, and the airflow generated by the swing takes away the heat of the first heat sink and the second heat sink; The control unit controls the piezoelectric heat dissipation device to stop running, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation, including: The piezoelectric power supply device is controlled to cut off power to the piezoelectric piece, so that the piezoelectric piece stops vibrating and the first heat sink stops swinging, and the first heat sink and the second heat sink perform natural heat dissipation.

3. The heat dissipation system according to claim 2, wherein: The control unit is further configured to adjust the supply voltage of the piezoelectric power supply device according to the temperature of the heat source, so as to adjust the oscillation frequency of the first heat sink by changing the supply voltage.

4. The heat dissipation system according to claim 2 or 3, wherein: The first heat sink is disposed on the second heat sink; and / or, The piezoelectric sheet and the first heat sink are integrated, and the first heat sink serves as the piezoelectric sheet.

5. The heat dissipation system according to any one of claims 1 to 4, wherein: The heat dissipation system further includes: a window opening control device; the window opening control device is electrically connected to the control unit; The heat dissipation device comprises a housing, the heat source is located in the housing, and the housing is provided with at least one window and a window baffle for covering the window; The window opening control device is configured to control the movement of the window baffle under the control of the control unit to open or close the window.

6. The heat dissipation system according to claim 5, wherein: The control unit is further configured to perform a first control on the window opening control device to control the window baffle to open the window when the heat source temperature is greater than or equal to the temperature threshold; and to perform a second control on the window opening control device to control the window baffle to close the window when the heat source temperature is less than the temperature threshold.

7. The heat dissipation system according to claim 6, wherein: The window opening control device comprises: a relay, a spring and a relay power supply device; The first end of the window baffle is connected to the first end of the spring, and the second end of the spring is fixed to the housing; The second end of the window baffle is connected to the moving contact of the relay; The relay is electrically connected to a relay power supply device; The relay power supply device is electrically connected to the control unit.

8. The heat dissipation system according to claim 7, wherein: The control unit performs a first control on the window opening control device to control the window baffle to open the window, including: Controlling the relay power supply device to supply power to the relay, so that the window baffle is pulled to move in a first direction by the relay being attracted to open the window; and The control unit performs a second control on the window opening control device to control the window baffle to close the window, including: The relay power supply device is controlled to cut off power to the relay, so that the spring pulls the window baffle to move in the second direction through the release of the relay to close the window.

9. A heat dissipation method, based on the heat dissipation system according to any one of claims 1 to 8, applied to a control unit of the heat dissipation system, the method comprising: Obtain the heat source temperature of the device to be cooled; When the temperature of the heat source is greater than or equal to a preset temperature threshold, the piezoelectric heat dissipation device of the heat dissipation system is controlled to operate and generate airflow, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation; when the temperature of the heat source is less than the temperature threshold, the piezoelectric heat dissipation device is controlled to stop operating, so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation.

10. The heat dissipation method according to claim 9, wherein: The controlling the piezoelectric heat dissipation device of the heat dissipation system to operate and generate airflow so that the natural heat dissipation device and the piezoelectric heat dissipation device perform airflow heat dissipation includes: Controlling the piezoelectric power supply device of the piezoelectric heat dissipation device to supply power to the piezoelectric sheet of the piezoelectric heat dissipation device, so that the piezoelectric sheet vibrates to drive the first heat dissipation sheet of the piezoelectric heat dissipation device to swing, and the airflow generated by the swing takes away the heat of the first heat dissipation sheet and the second heat dissipation sheet of the natural heat dissipation device; The controlling the piezoelectric heat dissipation device to stop operating so that the natural heat dissipation device and the piezoelectric heat dissipation device perform natural heat dissipation includes: The piezoelectric power supply device is controlled to cut off power to the piezoelectric piece, so that the piezoelectric piece stops vibrating and the first heat sink stops swinging, and the first heat sink and the second heat sink perform natural heat dissipation.

11. The heat dissipation method according to claim 10, further comprising: The power supply voltage of the piezoelectric power supply device is adjusted according to the temperature of the heat source, and the swing frequency of the first heat sink is adjusted by changing the power supply voltage.

12. The heat dissipation method according to any one of claims 9 to 11, further comprising: When the temperature of the heat source is greater than or equal to the temperature threshold, the window opening control device of the heat dissipation system is first controlled to control the window baffle of the device to be cooled to open the window on the housing of the device to be cooled; when the temperature of the heat source is less than the temperature threshold, the window opening control device is second controlled to control the window baffle to close the window.

13. The heat dissipation method according to claim 12, wherein: The first control of the window opening control device of the heat dissipation system to control the window baffle of the device to be cooled to open the window on the housing of the device to be cooled comprises: The relay power supply device controlling the window opening control device supplies power to the relay of the window opening control device, so that the window baffle is pulled to move in the first direction by the relay being attracted to open the window; The second control of the window opening control device to control the window baffle to close the window includes: The relay power supply device is controlled to cut off power to the relay, so that the spring of the window opening control device pulls the window baffle to move in the second direction through the release of the relay to close the window.

14. A device to be cooled, comprising: A heat source and a heat dissipation system as described in any one of claims 1 to 8; the heat dissipation system is used to dissipate heat from the heat source.

15. An electronic device, comprising: one or more processors; A memory having one or more programs stored thereon, wherein when the one or more programs are executed by the one or more processors, the one or more processors implement the heat dissipation method according to any one of claims 9 to 13; One or more input / output I / O interfaces are connected between the processor and the memory and are configured to implement information interaction between the processor and the memory.

16. A computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the heat dissipation method according to any one of claims 9 to 13.

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