Three-dimensional imaging control apparatus and three-dimensional imaging system

Abstract

Disclosed in the present application are a three-dimensional imaging control apparatus and a three-dimensional imaging system. The apparatus comprises: an addressing surface assembly (10), an imaging surface assembly (20) and a control assembly (30), wherein the addressing surface assembly (10) is arranged corresponding to a first laser, the imaging surface assembly (20) is arranged corresponding to a second laser, and an incident direction of the second laser and an incident direction of the first laser form a preset angle; and the control assembly (30) is electrically connected to the imaging surface assembly (20) and the addressing surface assembly (10), and is used for performing two-dimensional slicing on a target three-dimensional image to obtain a slice image sequence, for controlling, on the basis of the slice image sequence and by means of the addressing surface assembly (10), the first laser to periodically move on a set level in a dual-frequency up-conversion material, so as to form a mobile addressing surface, and for controlling, by means of the imaging surface assembly (20), the second laser to project a slice image in the slice image sequence onto the addressing surface corresponding to the slice image, such that the slice image in the slice image sequence is switched as the addressing surface moves, so as to form a target three-dimensional image. Thus, the target three-dimensional image can be made clear, fine and stable.

Description

Three-dimensional imaging control device, three-dimensional imaging system

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 28, 2023, with application number 2023112792551 and application name “Three-dimensional imaging control device, three-dimensional imaging system”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of three-dimensional display technology, and in particular to a three-dimensional imaging control device and a three-dimensional imaging system. Background Art

[0003] New display devices have been developed and widely used, but they are currently limited to flat-panel displays and can only display image information on a two-dimensional plane. They do not have image depth information. In some special fields, such as medical CT, industrial flaw detection, and medical education, depth information is very important. With the help of physical depth of field, information on all dimensions of the original object can be intuitively and comprehensively displayed.

[0004] Application Contents

[0005] The present application aims to solve at least one of the technical problems in the related art to a certain extent. To this end, the first object of the present application is to provide a three-dimensional imaging control device that can make the target three-dimensional image clear, delicate and stable.

[0006] The second objective of this application is to provide a three-dimensional imaging system.

[0007] To achieve the above objectives, a first embodiment of the present application provides a three-dimensional imaging control device, comprising: an addressing surface assembly, an imaging surface assembly, and a control assembly, wherein the addressing surface assembly corresponds to a first laser setting, and the imaging surface assembly corresponds to a second laser setting, wherein an incident direction of the second laser forms a preset angle with an incident direction of the first laser;

[0008] Among them, the control component is electrically connected to the imaging surface component and the addressing surface component, respectively, and is used to perform two-dimensional slicing of the target three-dimensional image to obtain a slice image sequence, and according to the slice image sequence, the addressing surface component controls the first laser to periodically move to a set layer in the dual-frequency up-conversion material through the addressing surface component to form a moving addressing surface, and controls the second laser through the imaging surface component to project the slice image in the slice image sequence onto the addressing surface corresponding to the slice image, so that the slice image in the slice image sequence is switched as the addressing surface moves, to form the target three-dimensional image.

[0009] According to the three-dimensional imaging control device of the embodiment of the present application, a slice image sequence is obtained by performing two-dimensional slicing on the target three-dimensional image, and according to the slice image sequence, the addressing surface component controls the first laser to move periodically to a set layer in the dual-frequency up-conversion material through the addressing surface component to form a moving addressing surface, and the imaging surface component controls the second laser to project the slice image in the slice image sequence onto the addressing surface corresponding to the slice image, so that the slice image in the slice image sequence is switched as the addressing surface moves to form the target three-dimensional image, which can make the target three-dimensional image clear, delicate and stable.

[0010] In addition, the three-dimensional imaging control device of the embodiment of the present application may also have the following additional technical features:

[0011] According to one embodiment of the present application, the imaging surface component includes: a digital light processing DLP control card and a digital micromirror device DMD, and the DLP control card is electrically connected to the DMD; wherein the control component is electrically connected to the DLP control card, and is used to load the slice image sequence into the DLP control card for storage, and load the configured imaging time and imaging interval of the slice image sequence in the DMD into the DLP control card, so that the DLP control card controls the DMD to perform spatial light modulation on the second laser according to the slice image sequence, the imaging time and the imaging interval, so as to realize the projection of the slice image in the slice image sequence onto the addressing surface corresponding to the slice image.

[0012] According to one embodiment of the present application, the DLP control card includes: a first FPGA chip, a second FPGA chip, a storage chip and a DLP chip, the DLP chip is electrically connected to the first FPGA chip and the second FPGA chip respectively, and the storage chip is electrically connected to the first FPGA chip and the second FPGA chip respectively; wherein the control component is electrically connected to the second FPGA chip, and is used to load the slice image sequence to the storage chip through the second FPGA chip, and transmit the imaging time and the imaging interval to the DLP chip, so that the DLP chip is used to control the DMD to perform spatial light modulation on the second laser according to the slice image sequence, the imaging time and the imaging interval, wherein the first FPGA chip is used to transmit the slice image sequence in the storage chip to the DLP chip.

[0013] According to one embodiment of the present application, the addressing surface assembly includes: a laser marking control card and a galvanometer, and the laser marking control card is electrically connected to the galvanometer and the DLP control card respectively; wherein, the control assembly is electrically connected to the laser marking control card, and is used to generate a yaw position instruction according to the slice image sequence, and send the yaw position instruction to the laser marking control card, so that the laser marking control card controls the galvanometer to move according to a number of strokes, so that the first laser cycle moves to a set layer in the dual-frequency up-conversion material.

[0014] According to one embodiment of the present application, the laser marking control card is also used to output a synchronization signal to the DLP control card each time the galvanometer moves one of the strokes, so that the DLP control card synchronously switches the next slice image to the DMD according to the synchronization signal; or the DLP control card is also used to output a synchronization signal to the laser marking control card when starting to switch the next slice image to the DMD, so that the laser marking control card synchronously controls the galvanometer to move one of the strokes according to the synchronization signal.

[0015] According to one embodiment of the present application, the galvanometer includes: a yaw motor, a position sensor, a reflective lens and a drive board, the drive board is electrically connected to the yaw motor and the position sensor respectively, the reflective lens is fixed on the motor shaft of the yaw motor, the position sensor is electrically connected to the yaw motor to collect the position signal of the yaw motor and feed it back to the drive board; wherein, the laser marking control card is electrically connected to the drive board, and is used to send the yaw position instruction to the drive board, so that the drive board drives the yaw motor according to the yaw position instruction and the position signal to drive the reflective lens to swing.

[0016] According to one embodiment of the present application, the second FPGA chip is electrically connected to the storage chip through a PCI interface, is electrically connected to the control component through a USB interface, and is electrically connected to the laser marking control card through an IO interface.

[0017] According to one embodiment of the present application, the laser marking control card is electrically connected to the control component via a USB interface, and is electrically connected to the second FPGA chip via an IO interface.

[0018] According to one embodiment of the present application, the first laser is a line laser, and the product of the beam width of the line laser and the number of layers of the set layer is determined according to the size of the target three-dimensional image; the second laser is a circular spot laser, and the circular spot laser covers the DMD.

[0019] To achieve the above-mentioned objectives, the second embodiment of the present application proposes a three-dimensional imaging system, comprising: a first laser for emitting a first laser, a second laser for emitting a second laser, a dual-frequency up-conversion material, and the three-dimensional imaging control device.

[0020] According to the three-dimensional imaging system of the embodiment of the present application, the three-dimensional imaging control device described above can make the target three-dimensional image clear, delicate and stable.

[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] FIG1 is a schematic structural diagram of a three-dimensional imaging control device according to an embodiment of the present application;

[0023] FIG2 is a schematic structural diagram of a three-dimensional imaging control device according to a first specific embodiment of the present application;

[0024] FIG3 is a schematic structural diagram of a three-dimensional imaging control device according to a second specific embodiment of the present application;

[0025] FIG4 is a schematic structural diagram of a three-dimensional imaging system according to an embodiment of the present application. DETAILED DESCRIPTION

[0026] Among existing naked-eye three-dimensional display technologies, three-dimensional volume display technology is the most intuitive solution, and the physical depth information of its voxels is real.

[0027] Dynamic volume scanning is a technique in which each cross-section of a three-dimensional object undergoes sequential, periodic motion in space to restore and display the three-dimensional volume. Two laser beams of specific power and wavelength intersect within a dual-frequency upconversion material. The energy level changes that cause visible light to be emitted at the intersection point. This technique is called dual-frequency upconversion. This application combines these two techniques to achieve 3D volume display within dual-frequency upconversion materials.

[0028] The following describes in detail embodiments of the present application, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0029] The following describes a three-dimensional imaging control device and a three-dimensional imaging system according to an embodiment of the present application with reference to Figures 1-4.

[0030] Figure 1 is a schematic diagram of the structure of a 3D imaging control device according to one embodiment of the present application. As shown in Figure 1 , the 3D imaging control device 100 comprises an addressing surface assembly 10, an imaging surface assembly 20, and a control assembly 30. The addressing surface assembly 10 corresponds to a first laser configuration, while the imaging surface assembly 20 corresponds to a second laser configuration. The incident direction of the second laser forms a predetermined angle with the incident direction of the first laser.

[0031] Specifically, the first and second laser beams are pre-modulated by the pre-stage optical system, and the method of the pre-stage optical system is not limited. Referring to Figure 2, the first laser 101 and the second laser 102 are fixed in position and direction. The first laser is incident on one end of the dual-frequency up-conversion material 230, penetrates the dual-frequency up-conversion material 230 along the direction of laser incidence, and exits at the other end. In this device, the surface formed by the path of the first laser 101 in the dual-frequency up-conversion material 230 is referred to as the cross-section addressing surface. The second laser 102 is perpendicular to the incident direction of the first laser 101 and passes through the entire dual-frequency up-conversion material 230. The intersection surface with the first laser 101 is referred to as the imaging surface. It should be noted that the first laser 101 can be a line laser, and the product of the line laser beam width and the number of layers is determined by the size of the target three-dimensional image 103. The second laser 102 can be a circular spot laser.

[0032] Specifically, dual-frequency upconversion 3D display is based on the physical phenomenon of two-level dual-frequency upconversion. Two laser beams of specific wavelengths intersect within a dual-frequency upconversion material to produce visible light. By precisely controlling the two laser beams to intersect within the dual-frequency upconversion material, the intersection surface excites the material to emit light, forming a luminescent surface. Simultaneously, controlling the intersection surface to scan within the dual-frequency upconversion material in a sequence of cycles creates a 3D luminous body. By controlling the shape of the imaging surface, the shape of the displayed 3D object can be controlled.

[0033] Furthermore, the control component 30 processes the slicing sequence of the three-dimensional model and controls the addressing plane and the imaging plane to precisely intersect according to the slicing sequence.

[0034] In this example, the control component 30 is electrically connected to the imaging surface component 20 and the addressing surface component 10, respectively, to perform two-dimensional slicing of a target three-dimensional image (e.g., a model of a three-dimensional object to be displayed) to obtain a sequence of slice images. Based on the sequence of slice images, the addressing surface component 10 controls the first laser to periodically move to a set layer in the dual-frequency upconversion material, forming a moving addressing surface. The imaging surface component 20 controls the second laser to project the slice images in the slice image sequence onto the addressing surface corresponding to the slice images, so that the slice images in the slice image sequence switch as the addressing surface moves, forming the target three-dimensional image. This allows the target three-dimensional image to be clear, detailed, and stable.

[0035] 2-3 , the imaging surface assembly 20 may include: a digital light processing (DLP) control card 21 and a digital micromirror device (DMD) 22 . The DLP control card 21 is electrically connected to the DMD 22 .

[0036] Specifically, the DLP control card 21 is responsible for signal transmission, image storage, and playback control. DMD22 22 is a micro-electromechanical system with electronic input and optical output. It is composed of an array of multiple high-speed digital light reflection switches, which can reliably modulate the input light source in space, thereby realizing active scanning imaging. It should be noted that the circular spot laser (i.e., the second laser) covers DMD22. After the incident circular spot laser is reflected by DMD22, the outgoing light must be perpendicular to the line laser 101 in the dual-frequency up-conversion material. The DMD22 and the DLP control card 21 are electrically connected via a flexible cable. The DLP control card 21 also has an electrical signal interface for external signal transmission and processing and internal information exchange.

[0037] In this example, the control component 30 is electrically connected to the DLP control card 21 and is used to load the slice image sequence into the DLP control card 21 for storage. It also loads the configured imaging time and imaging interval of the slice image sequence in the DMD 22 into the DLP control card 21, so that the DLP control card 21 controls the DMD 22 to perform spatial light modulation on the second laser according to the slice image sequence, imaging time, and imaging interval, thereby projecting the slice images in the slice image sequence onto the addressing surface corresponding to the slice images. Thus, the second laser is controlled by the DLP control card; by using a DMD with millions of micro-mirrors as the imaging surface light spatial modulation device, the imaging surface has millions of pixels. The pixels are superimposed on the addressing surface to form dense voxels, making the three-dimensional display more precise and detailed, and fully and comprehensively displaying the detailed information of the three-dimensional object from the inside out.

[0038] Optionally, the imaging surface of the present application can be imaged through a mask, but it can only form a static and simple three-dimensional object with no shape change in front and back; the imaging surface of the present application can also be imaged by scanning with a high-speed scanning galvanometer. Due to the limited scanning speed of the high-speed scanning galvanometer, it can only form a three-dimensional body with a smaller resolution. The number of complex and large three-dimensional voxels is huge, and it is difficult for the high-speed scanning galvanometer to complete the scanning on the imaging surface.

[0039] 3 , the DLP control card 21 includes a first FPGA (Field-Programmable Gate Array) chip 211, a second FPGA chip 212, a memory chip 213, and a DLP chip 214. The DLP chip 214 is electrically connected to the first FPGA chip 211 and the second FPGA chip 212, respectively. The memory chip 213 is electrically connected to the first FPGA chip 211 and the second FPGA chip 212, respectively.

[0040] Specifically, both the first FPGA chip 211 and the second FPGA chip 212 are provided with a PCI interface, and are electrically connected to the storage chip 213 via the PCI interface. The first FPGA chip 211 and the second FPGA chip 212 primarily perform data transmission and processing, and each includes a DDC (digital down converter)-FPGA and an APPS (applications)-FPGA. The DDC-FPGA is primarily used for data transmission between the storage chip 213 and the DLP chip 214, while the APPS-FPGA is used for configuring timing and time synchronization.

[0041] In this example, the control component 30 is electrically connected to the second FPGA chip 212, and is used to load the slice image sequence to the storage chip 213 through the second FPGA chip 212, and transmit the imaging time and imaging interval to the DLP chip 214, so that the DLP chip 214 is used to control the DMD22 to perform spatial light modulation on the second laser according to the slice image sequence, imaging time and imaging interval, wherein the first FPGA chip 211 is used to transmit the slice image sequence in the storage chip 213 to the DLP chip 214, and the second FPGA chip 212 is electrically connected to the control component 30 via a USB (Universal Serial Bus) interface.

[0042] Specifically, the second FPGA chip 212 is also provided with a USB interface, through which the control component 30 sends configuration instructions. The control component 30 initializes the DLP control card 21 and the laser marking control card 11 described below, loads the slice image sequence into the storage chip 213, configures the imaging time and imaging interval of the slice image sequence in the DMD 22, and sets the playback mode to passive mode, waiting for the synchronization signal to switch playback. The control component 30 can perform two-dimensional slicing of the target three-dimensional image (e.g., a model of a three-dimensional object to be displayed) to obtain the slice image sequence, and then initialize the DLP control card 21 and the laser marking control card 11 described below.

[0043] 2-3 , the addressing surface assembly 10 includes a laser marking control card 11 and a galvanometer 12 . The laser marking control card 11 is electrically connected to the galvanometer 12 and the DLP control card 21 .

[0044] Specifically, after the DLP control card 21 is configured, the control component 30 sets the pen number and jump parameters for the laser marking control card 11, loads the yaw position object and synchronization pulse object into the laser marking control card 11, and then begins marking. The imaging surface component 20 and the addressing surface component 10 begin operation, and the slice image sequence switches at high speed as the addressing surface in the dual-frequency upconversion material moves, forming a complete three-dimensional pattern. Finally, to end the 3D imaging, the laser marking control card 11 is controlled to exit the marking process, while the DLP control card 21 releases memory and exits.

[0045] In this example, the control component 30 is electrically connected to the laser marking control card 11. It generates yaw position commands based on the slice image sequence and sends these yaw position commands to the laser marking control card 11, which controls the movement of the galvanometer 12 by a predetermined number of strokes to move the first laser cycle within a predetermined layer within the dual-frequency upconversion material. The laser marking control card 11 is electrically connected to the control component 30 via a USB interface.

[0046] Specifically, the laser marking control card 11 is provided with a USB interface. After receiving the yaw position instruction sent by the control component 30 through the USB interface, the yaw position instruction is transmitted to the galvanometer 12. The galvanometer 12 is a high-speed vector scanning device. According to the yaw position instruction transmitted by the laser marking control card 11, it oscillates according to a certain angle step cycle, so that the first laser cycle moves to the set layer in the dual-frequency up-conversion material, wherein the total stroke range of the galvanometer 12 can be divided into several strokes, and each stroke corresponds to an angle step of the galvanometer 12. It should be noted that the maximum yaw stroke and the minimum yaw angle step interval of the high-speed scanning galvanometer 12 are adjustable, and the delay between steps is adjustable. In addition, controlling the number of steps within the stroke range of the high-speed scanning galvanometer 12, that is, controlling the number of layers of the addressing surface, can also further control the number of voxels and the resolution of the three-dimensional display. Thus, the first laser is controlled by the laser marking control card.

[0047] Alternatively, a polygonal mirror can be used to control the yaw of the addressing surface. This requires a very stable rotation speed and a highly accurate position sensor to provide a zero-point signal. However, this makes it difficult to guarantee the repeatability of the addressing surface, and imaging may be jittery. Alternatively, a DMD can be used to control the yaw of the addressing surface. The DMD provides higher resolution and faster speeds on the addressing surface, making it a more optimal solution. However, DMD reflections cause significant laser power loss. If the laser power is sufficient, simply increase the laser power.

[0048] As an example, referring to Figure 3, the galvanometer 12 includes: a yaw motor 121, a position sensor 122, a reflective lens 123 and a drive board 124. The drive board 124 is electrically connected to the yaw motor 121 and the position sensor 122 respectively. The reflective lens 123 is fixed on the motor shaft of the yaw motor 121. The position sensor 122 is electrically connected to the yaw motor 121 to collect the position signal of the yaw motor 121 and feed it back to the drive board 124; wherein, the laser marking control card 11 is electrically connected to the drive board 124, and is used to send the yaw position instruction to the drive board 124, so that the drive board 124 drives the yaw motor 121 according to the yaw position instruction and the position signal to drive the reflective lens 123 to swing.

[0049] Specifically, the position sensor 122 converts the electrical connection signal of the yaw motor 121 into a position signal and feeds it back to the driver board 124. The laser marking control card 11 sends the yaw position command to the driver board 124. The driver board 124 drives the yaw motor 121 to swing according to the received yaw position command and position signal, and the reflective lens 123 swings along with the motor shaft of the yaw motor 121. The negative feedback loop formed by the yaw motor 121 and the position sensor 122 provides the galvanometer 12 with a very high scanning speed and repeatable positioning accuracy. Combined with the highly reflective reflective lens 123 on it, it can accurately deflect the incident light. Therefore, through the control of the position sensor and excellent negative feedback signal, the accuracy and position repeatability of the stepping swing stroke can be improved, and a dense cross-section surface layer can be provided on the addressing surface, making the three-dimensional display imaging very stable.

[0050] As an example, the laser marking control card 11 is further configured to output a synchronization signal to the DLP control card 21 each time the galvanometer 12 moves one stroke, so that the DLP control card 21 synchronously switches the next slice image to the DMD 22 according to the synchronization signal. Alternatively, the DLP control card 21 is further configured to output a synchronization signal to the laser marking control card 11 when starting to switch the next slice image to the DMD 22, so that the laser marking control card 11 synchronously controls the galvanometer 12 to move one stroke according to the synchronization signal. The laser marking control card 11 is electrically connected to the second FPGA chip 212 via an IO interface, and the second FPGA chip 212 is electrically connected to the laser marking control card 11 via an IO interface.

[0051] Specifically, the laser marking control card 11 is also provided with an IO interface. Each time the galvanometer 12 moves one stroke, a synchronization signal (for synchronizing the signal frame rate between the DLP control card 21, such as a TTL pulse signal) is output to the DLP control card 21 through the IO interface. The second FPGA chip 212 in the DLP control card 21 is also provided with an IO interface. The IO interface of the second FPGA chip 212 receives the synchronization signal output by the laser marking control card 11 and transmits the synchronization signal to the DLP chip 214, so that the DLP chip 214 synchronously switches the next slice image to the DMD 22 according to the synchronization signal. Alternatively, when the DLP chip 214 begins switching the next slice image to the DMD 22, it outputs a synchronization signal to the laser marking control card 11 through the IO interface of the second FPGA chip 212, so that the laser marking control card 11 synchronously controls the movement of the galvanometer 12 one stroke according to the synchronization signal. The synchronization signal is a pulsed electrical signal with a variable duty cycle and period. Its level amplitude is adjustable and is not limited to 3.3V or 5V.

[0052] It should be noted that the synchronization signal can be output by the high-speed scanning galvanometer 12 and the laser marking control card 11 to the DLP control card 21, wherein the synchronization signal is bidirectional, and the DLP control card 21 can be used as a synchronization signal output end or as a synchronization signal input end. The high-speed scanning galvanometer 12201 can also be used as a synchronization signal output end or a synchronization signal input end. In this application, the DLP control card 21 is used as the synchronization signal input end only as an example.

[0053] In addition, after the synchronization signal is sent, there is a certain delay in the imaging of the galvanometer 12 and DMD22. The delay is adjustable within a certain range. The contrast and brightness of the three-dimensional image can be adjusted by setting the imaging time and dark image time of the imaging surface, as well as the scanning speed of the addressing surface.

[0054] Thus, the imaging surface and the addressing surface are synchronized via the synchronization signal, and the imaging surface picture sequence can be correctly corresponded on the addressing surface.

[0055] It should be noted that due to the persistence of vision of the human eye, 3D images require that a slice image sequence be played sequentially within a minimum of 33ms to avoid the appearance of flickering. A slice image sequence triggers the DLP to play synchronously within a cycle from the start to the end of the addressing plane.

[0056] In summary, by using a DMD with millions of micro-mirrors as the imaging surface light spatial modulation device, there are millions of pixels on the imaging surface. The pixels are superimposed front and back on the addressing surface to form dense voxels, making the three-dimensional display more accurate and delicate, and can fully and comprehensively display the detailed information of the three-dimensional body from the inside out; through position sensors and excellent negative feedback signal control, the accuracy and position repeatability of the stepping swing stroke can be improved, and a dense cross-section surface layer can be provided on the addressing surface, making the three-dimensional display imaging very stable.

[0057] Figure 4 is a schematic diagram of the structure of a 3D imaging system according to one embodiment of the present application. As shown in Figure 4, the 3D imaging system 200 includes: a first laser 210 for emitting a first laser, a second laser 220 for emitting a second laser, a dual-frequency upconversion material 230, and the aforementioned 3D imaging control device 100.

[0058] Therefore, the three-dimensional imaging control device can make the target three-dimensional image clear, delicate and stable.

[0059] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0060] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0061] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0062] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0063] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0064] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A three-dimensional imaging control device, characterized in that: include: An addressing surface assembly, an imaging surface assembly and a control assembly, wherein the addressing surface assembly corresponds to a first laser setting, the imaging surface assembly corresponds to a second laser setting, and the incident direction of the second laser is at a preset angle to the incident direction of the first laser; The control component is electrically connected to the imaging surface component and the addressing surface component respectively, and is used to perform two-dimensional slicing of the target three-dimensional image to obtain a slice image sequence, and control the first laser to periodically move to a set layer in the dual-frequency up-conversion material through the addressing surface component according to the slice image sequence to form a moving addressing surface, and control the second laser through the imaging surface component to project the slice image in the slice image sequence onto the addressing surface corresponding to the slice image, so that the slice image in the slice image sequence is switched as the addressing surface moves, so as to form the target three-dimensional image.

2. The three-dimensional imaging control device according to claim 1, characterized in that: The imaging surface assembly comprises: a digital light processing DLP control card and a digital micromirror device DMD, wherein the DLP control card is electrically connected to the DMD; Wherein, the control component is electrically connected to the DLP control card, and is used to load the slice image sequence into the DLP control card for storage, and load the configured imaging time and imaging interval of the slice image sequence in the DMD into the DLP control card, so that the DLP control card controls the DMD to perform spatial light modulation on the second laser according to the slice image sequence, the imaging time and the imaging interval, so as to project the slice image in the slice image sequence onto the addressing surface corresponding to the slice image.

3. The three-dimensional imaging control device according to claim 2, characterized in that: The DLP control card includes: a first FPGA chip, a second FPGA chip, a storage chip and a DLP chip, the DLP chip is electrically connected to the first FPGA chip and the second FPGA chip respectively, and the storage chip is electrically connected to the first FPGA chip and the second FPGA chip respectively; The control component is electrically connected to the second FPGA chip, and is used to load the slice image sequence into the storage chip through the second FPGA chip, and transmit the imaging time and the imaging interval to the DLP chip, so that the DLP chip is used to control the DMD to perform spatial light modulation on the second laser according to the slice image sequence, the imaging time and the imaging interval, and the first FPGA chip is used to transmit the slice image sequence in the storage chip to the DLP chip.

4. The three-dimensional imaging control device according to claim 3, characterized in that: The addressing surface assembly includes: a laser marking control card and a galvanometer, wherein the laser marking control card is electrically connected to the galvanometer and the DLP control card respectively; The control component is electrically connected to the laser marking control card, and is used to generate a yaw position instruction according to the slice image sequence, and send the yaw position instruction to the laser marking control card, so that the laser marking control card controls the galvanometer to move according to a number of strokes, so that the first laser periodically moves in the dual-frequency up-conversion material. Setting level.

5. The three-dimensional imaging control device according to claim 4, characterized in that: The laser marking control card is further used to output a synchronization signal to the DLP control card each time the galvanometer moves one of the strokes, so that the DLP control card synchronously switches the next slice image to the DMD according to the synchronization signal; or The DLP control card is also used to output a synchronization signal to the laser marking control card when starting to switch the next slice image to the DMD, so that the laser marking control card synchronously controls the galvanometer to move one stroke according to the synchronization signal.

6. The three-dimensional imaging control device according to claim 4, characterized in that: The galvanometer comprises: a yaw motor, a position sensor, a reflective lens and a driving board, wherein the driving board is electrically connected to the yaw motor and the position sensor respectively, the reflective lens is fixed on the motor shaft of the yaw motor, and the position sensor is electrically connected to the yaw motor to collect a position signal of the yaw motor and feed it back to the driving board; The laser marking control card is electrically connected to the driving board and is used to send the yaw position instruction to the driving board, so that the driving board drives the yaw motor to swing the reflective lens according to the yaw position instruction and the position signal.

7. The three-dimensional imaging control device according to claim 5, characterized in that: The second FPGA chip is electrically connected to the storage chip via a PCI interface, electrically connected to the control component via a USB interface, and electrically connected to the laser marking control card via an IO interface.

8. The three-dimensional imaging control device according to claim 7, characterized in that: The laser marking control card is electrically connected to the control component via a USB interface, and is electrically connected to the second FPGA chip via an IO interface.

9. The three-dimensional imaging control device according to claim 2, characterized in that: The first laser is a line laser, and the product of the beam width of the line laser and the number of layers of the set layer is determined according to the size of the target three-dimensional image; The second laser is a circular spot laser, and the circular spot laser covers the DMD.

10. A three-dimensional imaging system, characterized in that: include: A first laser for emitting a first laser, a second laser for emitting a second laser, a dual-frequency up-conversion material, and a three-dimensional imaging control device according to any one of claims 1-9.

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