Light emission module, vehicle lamp assembly and motor vehicle

Abstract

The present invention provides a light emission module (3), the light emission module (3) comprising: a substrate (51), on which a circuit and a light-emitting component (52) are arranged; and a heat dissipater (4), which contacts the substrate (51) and / or the light-emitting component (52) to dissipate heat for the substrate (51) and / or the light-emitting component (52). The heat dissipater (4) is a stamped member made of a metal material by means of a stamping process. The present invention also provides a vehicle lamp assembly (100) comprising such a light emission module, and a motor vehicle using such a vehicle lamp assembly.

Description

LIGHT EMISSION MODULE, VEHICLE LAMP ASSEMBLY AND MOTOR VEHICLE

[0001] The present invention relates to a light emission module, a vehicle lamp assembly comprising such a light emission module, and a motor vehicle using such a vehicle lamp assembly.Background

[0002] shows a vehicle lamp assembly from the prior art, andis an enlarged view of region A in.

[0003] As shown in FIGS. 1A and 1B, the vehicle lamp assembly includes a vehicle lamp housing and a light emission module mounted on the vehicle lamp housing. The light emission module includes a substrate and a light-emitting component (not visible in FIGS. 1A and 1B) located inside the vehicle lamp housing, and a heat dissipater located outside the vehicle lamp housing. In addition, the vehicle lamp housing has a lamp housing leg, which is connected to a supporting member as a vehicle body component by means of bolt fastening, so as to support the vehicle lamp housing by using the supporting member.

[0004] In such a conventional vehicle lamp assembly, the heat dissipater is generally a casting member made of a metal material by means of a casting or injection moulding process. Such a heat dissipater has a large weight (and a larger amount of material required accordingly), a high manufacturing cost, and a large length or width of the heat dissipater fin, which thus occupies a large part of the design space between the light emission module and the supporting member, and may even interfere with the supporting member or the fastening bolt.

[0005] Therefore, it is desirable to provide a new type of heat dissipater with a small volume, light weight, and low material and manufacturing costs, while ensuring that the heat dissipation effect of the heat dissipater is not deteriorated.Summary of the Invention

[0006] According to an aspect of the present invention, a light emission module is provided. The light emission module comprises: a substrate, on which a circuit and a light-emitting component are arranged; and a heat dissipater, which contacts the substrate and / or the light-emitting component to dissipate heat for the substrate and / or the light-emitting component. The heat dissipater is a stamped member made of a metal material by means of a stamping process. By adopting the above technical solution of the present invention, a new type of heat dissipater with a small volume, light weight, and low material and manufacturing costs can be provided while ensuring that the heat dissipation effect of the heat dissipater is not deteriorated.

[0007] Specifically, the heat dissipater comprises a heat dissipater main body and at least one heat dissipater fin extending from the heat dissipater main body, the heat dissipater main body being attached to the substrate and / or the light-emitting component. By adopting the above technical solution of the present invention, the heat dissipater can occupy only a small part of the design space between the light emission module and the supporting member, avoiding interference with the supporting member or the fastening bolt.

[0008] Preferably, the heat dissipater comprises at least one heat dissipater leg extending from the heat dissipater main body, and the heat dissipater leg is adapted to be connected to the supporting member, so that the heat dissipater can transfer heat to the supporting member while being supported by the supporting member. By adopting the above technical solution of the present invention, the heat dissipation efficiency of the heat dissipater can be improved.

[0009] Optionally, a plurality of stamping rivets are provided on the heat dissipater main body, and corresponding rivet holes are provided on the substrate so that the substrate and the heat dissipater main body are anchored together by using the stamping rivets. By adopting the above technical solution of the present invention, the substrate and the heat dissipater main body can be firmly and tightly fixed together so that the heat from the substrate is transferred to the heat dissipater main body.

[0010] Optionally, the plurality of stamping rivets are 3 stamping rivets, and the stamping rivets are not located on the same straight line so that the substrate is positioned before anchoring. By adopting the above technical solution of the present invention, the substrate can be positioned conveniently and accurately.

[0011] Optionally, the light emission module further comprises a light guide, a base of the light guide being aligned with the light-emitting component and mounted on the substrate to guide light emitted by the light-emitting component. The light-emitting component is an LED, and the LED is selected from one or more of an LED capable of emitting red light, an LED capable of emitting green light, an LED capable of emitting blue light, and an LED capable of emitting white light. By adopting the above technical solution of the present invention, the light emitted by the light-emitting component, which may be coloured, can be guided.

[0012] Optionally, the substrate is a PCB (i.e., a printed circuit board) or a single-layer board made of a metal sheet, and / or one or more of a driver IC, an LED chip, a capacitor, and a resistor are arranged on the substrate. By adopting the above technical solution of the present invention, a suitable substrate can be adopted according to an actual application occasion.

[0013] According to another aspect of the present invention, a vehicle lamp assembly is provided. The vehicle lamp assembly comprises: a vehicle lamp housing, the vehicle lamp housing having at least one lamp housing leg, the lamp housing leg being adapted to be connected to a supporting member so as to support the vehicle lamp housing by using the supporting member; and the light emission module according to the previous aspect of the present invention, the light emission module being mounted on the vehicle lamp housing so that the substrate is located inside the vehicle lamp housing and the heat dissipater is located outside the vehicle lamp housing. A groove is provided on an outer surface of the vehicle lamp housing, and a corresponding rib is provided on the heat dissipater main body, and the rib is inserted in the groove when the light emission module is mounted in place on the vehicle lamp housing. By adopting the above technical solution of the present invention, the sealing between the outer surface of the vehicle lamp housing and the heat dissipater main body can be enhanced while obtaining the beneficial technical effect obtained by the technical solution according to the previous aspect of the present invention.

[0014] Preferably, the rib is formed by means of a stamping process. By adopting the above technical solution of the present invention, the rib can be manufactured by means of a stamping process in the process of manufacturing the heat dissipater by means of the stamping process, so that the types of manufacturing processes can be simplified, and the manufacturing cost of the heat dissipater can be reduced.

[0015] According to another aspect of the present invention, a motor vehicle is provided. The motor vehicle comprises: the vehicle lamp assembly according to the first aspect of the present invention; and a supporting member, which is a part of a body of the motor vehicle. The lamp housing leg and the heat dissipater leg are connected to the supporting member by means of at least one of bolt fastening, snap fastening, bonding, and welding. By adopting the above technical solution of the present invention, heat can be transferred to the body of the motor vehicle, thereby improving the heat dissipation efficiency of the heat dissipater.Brief Description of the Drawings

[0016] To make it easy to understand the present invention, the present invention will be described in more detail below on the basis of exemplary embodiments with reference to the drawings. In the drawings, identical or similar reference numerals are used to denote identical or similar members. It should be understood that the drawings are merely schematic, and the dimensions and proportions of the members in the drawings are not necessarily precise.

[0017] shows a vehicle lamp assembly from the prior art;

[0018] is an enlarged view of region A in;

[0019] andare three-dimensional views of a vehicle lamp assembly according to an exemplary embodiment of the present invention;

[0020] is an assembly state view of a light emission module and a supporting member according to an exemplary embodiment of the present invention;

[0021] is an exploded state view of an assembly shown in;

[0022] is a three-dimensional view of a heat dissipater according to an exemplary embodiment of the present invention;

[0023] is a three-dimensional view of the heat dissipater shown inafter a part is cut off along plane II-II;

[0024] is an enlarged view of region D in;

[0025] is a schematic cross-sectional view of a state in which a rib of a heat dissipater according to an exemplary embodiment of the present invention is inserted in a groove of a vehicle lamp housing; and

[0026] is a three-dimensional view of the light emission module shown in(wherein a light guide has been removed) after a part is cut off along plane I-I.Detailed Description of the Embodiments

[0027] FIGS. 2A and 2B are three-dimensional views of a vehicle lamp assembly according to an exemplary embodiment of the present invention.

[0028] As shown in FIGS. 2A to 2B, a vehicle lamp assembly 100 according to an exemplary embodiment of the present invention mainly includes a vehicle lamp housing 1 and a light emission module 3.The vehicle lamp housing 1 has at least one lamp housing leg 11. The lamp housing leg 11 is adapted to be connected to a supporting member 2, so as to support the vehicle lamp housing 1 by using the supporting member 2. The supporting member 2 is a part of a body of a motor vehicle. The light emission module 3 is mounted on the vehicle lamp housing 1 so that a part of the light emission module 3 is located inside the vehicle lamp housing 1, and another part of the light emission module 3 is located outside the vehicle lamp housing 1.

[0029] is an assembly state diagram of a light emission module and a supporting member according to an exemplary embodiment of the present invention.is an exploded state diagram of an assembly shown in.is a three-dimensional view of the light emission module shown in(wherein a light guide has been removed) after a part is cut off along plane I-I.

[0030] As shown in FIGS. 3A, 3B and 6, and with reference to FIGS. 2A to 2B, the light emission module 3 mainly includes the light guide 6, a light emission portion 5 and a heat dissipater 4. The light emission portion 5 includes, for example, an integrated circuit board optical component (PCBA), specifically a substrate 51. The substrate 51 is a PCB or a single-layer board made of a metal sheet. A circuit and a light-emitting component 52 (see, and they are not visible in FIGS. 3A and 3B) are provided on the substrate 51. In addition, one or more of a driver IC, an LED chip, a capacitor, and a resistor may also be provided on the substrate 51. The above-mentioned types and structures of the substrate 51 are only exemplary and not restrictive. Those skilled in the art can adopt a substrate 51 with a suitable type and structure according to an actual application occasion.

[0031] A base 61 of the light guide 6 is aligned with the light-emitting component 52 and is mounted on the substrate 51 by using a fastener 62 (such as a screw or a rivet) to guide light emitted by the light-emitting component 52. If necessary, a corresponding countersunk hole 49 may be provided on the surface of the heat dissipater main body 41 facing the substrate 51 to reserve an installation space for the end of the fastener 62, so as to avoid the end of the fastener 62 directly abutting against the heat dissipater main body 41 and causing interference between components. The countersunk hole 49 forms a raised portion 45 on the back of the heat dissipater main body 41.

[0032] The light-emitting component 52 may be an LED (i.e., a light-emitting diode). The LED may be selected from one or more of an LED capable of emitting red light, an LED capable of emitting green light, an LED capable of emitting blue light, and an LED capable of emitting white light. By adopting the above technical solution of the present invention, the light emitted by the light-emitting component, which may be coloured, can be guided.

[0033] The heat dissipater 4 (specifically, the heat dissipater main body 41) contacts the substrate 51 and / or the light-emitting component 52 to dissipate heat for the substrate 51 and / or the light-emitting component 52. When the light emission module 3 is mounted in place on the vehicle lamp housing 1, the light guide 6 and the light emission portion 5 (including the substrate 51 and the light-emitting component 52) are located inside the vehicle lamp housing 1, and the heat dissipater 4 is located outside the vehicle lamp housing 1. A plurality of through holes 44 may be provided on the heat dissipater main body 41, so that the heat dissipater 4 is fixed to the vehicle lamp housing 1 by using fasteners (such as screws) passing through the through holes 44.

[0034] One of the main features of the technical solution of the present invention is that the heat dissipater 4 is a stamped part made of metal material by means of a stamping process. By adopting the above technical solution of the present invention, a new type of heat dissipater with a small volume, light weight, and low material and manufacturing costs can be provided while ensuring that the heat dissipation effect of the heat dissipater is not deteriorated.

[0035] Specifically, the heat dissipater 4 includes a heat dissipater main body 41 and at least one heat dissipater fin 42 extending from the heat dissipater main body 41. The heat dissipater main body 41 is attached to the substrate 51 and / or the light-emitting component 52, so that the heat from the substrate 51 and / or the light-emitting component 52 is transferred to the heat dissipater main body 41. By adopting the above technical solution of the present invention, the substrate 51 and the heat dissipater main body 41 can be firmly and tightly fixed together so that the heat from the substrate 51 is transferred to the heat dissipater main body 51.

[0036] Preferably, the heat dissipater 4 includes at least one heat dissipater leg 43 extending from the heat dissipater main body 41, and the heat dissipater leg 43 is adapted to be connected to the supporting member 2, so that the heat dissipater 4 can transfer heat to the supporting member 2 while being supported by the supporting member 2, thereby further improving the heat dissipation efficiency of the heat dissipater 4. Optionally, the lamp housing leg 11 and the heat dissipater leg 43 are connected to the supporting member 2 by means of at least one of bolt fastening, snap fastening, bonding, and welding.

[0037] Optionally, a plurality of stamping rivets 48 are provided on the heat dissipater main body 41, and corresponding rivet holes 53 are provided on the substrate 51, so that the substrate 51 and the heat dissipater main body 41 are anchored together by using the stamping rivets 48. Optionally, the number of stamping rivets 48 is 3, and these stamping rivets 48 are not located on the same straight line, so that the substrate 51 is conveniently and accurately positioned before anchoring.

[0038] is a three-dimensional view of a heat dissipater according to an exemplary embodiment of the present invention.is a three-dimensional view of the heat dissipater shown inafter a part is cut off along plane II-II.is an enlarged view of region D in.

[0039] As shown in FIGS. 4A to 4C, a rib 47 is provided on the surface of the heat dissipater main body 41 facing the vehicle lamp housing 1. The rib 47 may be formed by means of a stamping process, and the rib 47 may be manufactured by means of the stamping process in the process of manufacturing the heat dissipater 4 by the stamping process, so that a stamping groove 46 is formed on the surface of the heat dissipater main body 41 opposite to the rib 47. By adopting the above-mentioned technical solution of the present invention, the types of manufacturing processes can be simplified and the manufacturing cost of the heat dissipater 4 can be reduced.

[0040] is a schematic cross-sectional view of a state in which a rib of a heat dissipater according to an exemplary embodiment of the present invention is inserted in a groove of a vehicle lamp housing.

[0041] As shown in, a corresponding groove 12 is provided on the outer surface of the vehicle lamp housing 1 so that the geometric structure of the groove 12 can match the geometric structure of the rib 47. In this way, when the light emission module 3 is mounted in place on the vehicle lamp housing 1, the rib 47 can be inserted in the groove 12. Optionally, a sealant 13 is provided in the groove 12. By adopting the above-mentioned technical solution of the present invention, the sealing between the outer surface of the vehicle lamp housing 1 and the heat dissipater main body 41 is enhanced.

[0042] Although the technical objectives, technical solutions, and technical effects of the present invention have been described in detail above with reference to specific embodiments, it should be understood that the above embodiments are only exemplary, but not restrictive. Within the substantive spirit and principles of the present invention, any modifications, equivalent substitutions, or improvements made by those skilled in the art shall be included within the scope of protection of the present invention.

Claims

Light emission module (3), comprising:a substrate (51), on which a circuit and a light-emitting component (52) are arranged; anda heat dissipater (4), which contacts the substrate (51) and / or the light-emitting component (52) to dissipate heat for the substrate (51) and / or the light-emitting component (52),wherein the heat dissipater (4) is a stamped member made of a metal material by means of a stamping process.Light emission module (3) according to Claim 1, wherein the heat dissipater (4) comprises a heat dissipater main body (41) and at least one heat dissipater fin (42) extending from the heat dissipater main body (41), the heat dissipater main body (41) being attached to the substrate (51) and / or the light-emitting component (52).Light emission module (3) according to Claim 1 or 2, wherein the heat dissipater (4) comprises at least one heat dissipater leg (43) extending from the heat dissipater main body (41), and the heat dissipater leg (43) is adapted to be connected to a supporting member (2), so that the heat dissipater (4) can transfer heat to the supporting member (2) while being supported by the supporting member (2).Light emission module (3) according to Claim 1 or 2, wherein a plurality of stamping rivets (48) are provided on the heat dissipater main body (41), and corresponding rivet holes (53) are provided on the substrate (51) so that the substrate (51) and the heat dissipater main body (41) are anchored together by using the stamping rivets (48).Light emission module (3) according to Claim 4, wherein the plurality of stamping rivets (48) are 3 stamping rivets, and the stamping rivets (48) are not located on the same straight line so that the substrate (51) is positioned before anchoring.Light emission module (3) according to Claim 1 or 2, further comprising a light guide (6), a base (61) of the light guide (6) being aligned with the light-emitting component (52) and mounted on the substrate (51) to guide light emitted by the light-emitting component (52),wherein the light-emitting component (52) is an LED, and the LED is selected from one or more of an LED capable of emitting red light, an LED capable of emitting green light, an LED capable of emitting blue light, and an LED capable of emitting white light.Light emission module (3) according to Claim 1 or 2, wherein the substrate (51) is a PCB or a single-layer board made of a metal sheet, and / orone or more of a driver IC, an LED chip, a capacitor, and a resistor are arranged on the substrate (51).Vehicle lamp assembly (100), comprising:a vehicle lamp housing (1), the vehicle lamp housing (1) having at least one lamp housing leg (11), the lamp housing leg (11) being adapted to be connected to a supporting member (2) so as to support the vehicle lamp housing (1) by using the supporting member (2); andthe light emission module (3) according to any one of Claims 1 - 7, the light emission module (3) being mounted on the vehicle lamp housing (1) so that the substrate (51) is located inside the vehicle lamp housing (1) and the heat dissipater (4) is located outside the vehicle lamp housing (1),wherein a groove (12) is provided on an outer surface of the vehicle lamp housing (1), and a corresponding rib (47) is provided on the heat dissipater main body (41), and the rib (47) is inserted in the groove (12) when the light emission module (3) is mounted in place on the vehicle lamp housing (1).Vehicle lamp assembly (100) according to Claim 8, wherein the rib (47) is formed by means of a stamping process.Motor vehicle, comprising:the vehicle lamp assembly (100) according to Claim 8 or 9; anda supporting member (2), which is a part of a body of the motor vehicle,wherein the lamp housing leg (11) and the heat dissipater leg (43) are connected to the supporting member (2) by means of at least one of bolt fastening, snap fastening, bonding, and welding.

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