Heating assemblies, systems, and methods of manufacture thereof

Abstract

Heater assemblies and systems are provided herein. In some implementations, a heater assembly (100) can include a heating element (106), a temperature sensor (108), and a thermally conductive first substrate (102). In some instances, the thermally conductive first substrate (102) can include a first channel (114) and a second channel (116), the first channel (114) being configured to receive at least a portion of the heating element (106) and the second channel (116) being configured to receive at least a portion of the temperature sensor (108). In some instances, a heater assembly system can include a second substrate (110) configured to contact, be adhered to, or to be coupled with the first substrate to at least partially enclose the heating element and temperature sensor therebetween. In some instances, a heater assembly system disclosed herein can include a plurality of heater assemblies disclosed herein and a structural support configured to couple each of the heater assemblies of the plurality together.

Description

HEATING ASSEMBLIES, SYSTEMS, AND METHODS OF MANUFACTURE THEREOFCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. Provisional Patent Application No.63 / 585,064, filed September 25, 2023, entitled, “Heating Assemblies, Systems, and Methods of Manufacture Thereof,” which is incorporated by reference herein in its entirety and for all purposes.FIELD

[0002] The subject matter described herein generally relates to electric heater and warmer units and more specifically relates to electric warmer plates.BACKGROUND

[0003] Warmer plates can be used to provide heat to an object by converting electrical current in a heating element of the warmer plate unit into thermal energy, which is then transferred to the object by conduction through a conductive material (e.g., plastic, metal, ceramic, and / or the like). The energy efficiency and speed with which thermal energy can be transferred to the object can depend on the materials and configuration of the warmer plate.SUMMARY

[0004] Aspects of the current subject matter relate to systems, devices, and methods for electric warmer devices. In some implementations, one or more of the following features may optionally be included in any feasible combination.

[0005] In one implementation, an exemplary heater assembly include a heating element, a temperature sensor; and, and a thermally conductive first substrate. The thermally conductive first substrate includes a first channel configured to receive at least a portion of the heating element, and a second channel configured to receive at least a portion of the temperature sensor. The heating element is positioned at least partially within the first channel and the substrate is configured to transfer thermal energy from at least a portion of the first channel through a thickness of at least a portion of the substrate. The temperature sensor is positioned at least partially within the second channel and is configured to measure a temperature of at least a portion of the first substrate.

[0006] In some implementations, the heater assembly can include a second substrate, in which the first substrate and the second substrate can define an enclosure configured to at least partially enclose the heating element and the temperature sensor therebetween. In such implementations, the second substrate can include a thermal insulator. In certain implementations, the second substrate can be in direct contact with at least a portion of the first substrate.

[0007] In some implementations, at least a portion of the first substrate can be electrically non- conductive.

[0008] In some implementations, at least a portion of the first channel can be anodized aluminum.

[0009] In some implementations, the heating element can be electrically isolated from the first substrate.

[0010] In some implementations, the heating element can be silicone insulated.

[0011] The some implementations, the first substrate can include a first surface and a second surface. The first surface can include the first and second channels and the second surface can be substantially flat.

[0012] In some implementations, the substrate can include a first surface and a second surface. The first surface can include the first and second channels and the second surface can be not flat.

[0013] In some implementations, the heating element can be coupled to an electrical power supply such that the heating element radiates thermal energy when electrical current is provided to the heating element from the power source.

[0014] In some implementations, the heating assembly can include a thermostat operably coupled to the temperature sensor. In certain implementations, the thermostat can be operably coupled to the power supply and the thermostat can be configured to control provision of electrical current from the power supply to the heating element based at least in part on a signal provided to the thermostat from the temperature sensor. The thermostat can include a switch configured to prevent electrical current from flowing from the power supply to the heating element based at least in part on the signal provided to the thermostat from the temperature sensor. In some implementations, the thermostat can be configured to prevent the electrical current from flowing from the power supply to the heating element when the signal from the temperature sensor to the thermostat indicates that a temperature of the first substrate is greater than or equal to a temperature limit. In such implementations, the thermostat can include anadjustable temperature controller, in which the adjustable temperature controller is configured to define the temperature limit.

[0015] In some implementations, the first channel can have a depth at least as large as a cross- sectional thickness of the heating element.

[0016] In some implementations, a depth of the first channel into the first substrate can be about 1% to about 10%, about 10% to about 20%, about 20% to about 25%, about 25% to about 35%, about 35% to about 50%, about 50% to about 65%, about 65% to about 75%, about 75% to about 85%, about 85% to about 95%, or about 95% to about 99% of a cross-sectional thickness of the first substrate.

[0017] In some implementations, the heating element can be selected from a flat cable heating element, a round cable heating element, or a ribbon heating element.

[0018] In some implementations, the heating element, the first substrate, and the temperature sensor can form an integrated unit.

[0019] In some implementations, the first substrate can include a material selected from iron, aluminum, or steel.

[0020] In some implementations, the first substrate can have a shape selected from a flat rectangle, a flat square, a flat triangle, a flat circle, a flat oval, or a flat ring.

[0021] In some implementations, the first substrate can have a maximum thickness of less than about 2 millimeters (mm), from about 2 mm to about 5 mm, from about 5 mm to about 10 mm, from about 10 mm to about 15 mm, from about 15 mm to about 20 mm, or greater than about 20 mm.

[0022] In some implementations, the second substrate can include a thermally conductive material.In certain implementations, the second substrate can include a first channel formed in an inner surface of the second substrate, in which the first channel of the second substrate is configured to receive at least a portion of the heating element. In some implementations, the second substrate can include a second channel formed in the inner surface of the second substrate, in which the second channel of the second substrate is configured to receive at least a portion of the heating element.

[0023] In some implementations, the heating assembly can include a second heating element and an insulating layer, in which the insulating layer is positioned between the first heating element and the second heating element, and the second substrate can include a first channel configured to receive at least a portion of the second heating element. In such implementations, the second substrate can include a second channel and a second temperature sensor, in whichthe second channel is formed in the inner surface of the second substrate, and the second channel of the second substrate is configured to receive at least a portion of the second temperature sensor.

[0024] In some implementations, the second substrate can be in direct contact with at least a portion of the first substrate. The second substrate can be thermally isolated from the first substrate by the insulating layer.

[0025] In some implementations, the insulating layer can include a thermally non-conductive material, optionally selected from a ceramic material or a porous material.

[0026] In some implementations, the second surface is substantially flat.

[0027] In some implementations, the second surface is not flat.

[0028] In some implementations, the second heating element can be coupled to an electrical power supply such that the heating element radiates thermal energy when electrical current is provided to the heating element from the power supply.

[0029] In some implementations, the temperature sensor can include one or more thermocouples.

[0030] In some implementations, the heater assembly can include a position sensor configured to detect at least one of a presence or a position of an object relative to a top surface of the thermally conductive first substrate.

[0031] In one implementation, an exemplary heater assembly system includes a first heater assembly according to the heater assembly described above, a second heater assembly according to the heater assembly described above, and a support structure configured to couple the first heater assembly to the second heater assembly.

[0032] In some implementations, the support structure, the first heater assembly, and the second heater assembly can define a space sized and shaped to receive an object to be heated.

[0033] In some implementations, the heater assembly system can include a third heater assembly according to the heater assembly described above. The support structure can be configured to couple the third heater assembly to the first heater assembly and the second heater assembly.

[0034] In one implementation, a method of manufacturing a heater assembly includes creating a first channel in a first substrate formed from a thermally conductive material, the first channel being configured to receive at least a portion of a heating element, creating a second channel in the first surface sized and shaped to receive at least a part of a temperature sensor, positioning the heating element at least partially within the first channel; and, positioning the temperature sensor at least partially within the second channel.

[0035] In some implementations, the method can include coupling the first substrate to a second substrate to define an enclosure configured to at least partially enclose the heating element and the temperature sensor therebetween.

[0036] In some implementations, the second substrate can include a thermally conductive material.

[0037] In some implementations, the method can include creating a first channel in the second substrate of the second substrate, in which the first channel of the second substrate is configured to receive at least a part of the second heating element, creating a second channel in the second substrate, in which the second channel is configured to receive at least a part of the second temperature sensor, and positioning the insulating layer between the first heating element and the second heating element before coupling the first substrate to the second substrate.BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings, which are incorporated in and constitute a part of this specification, show certain implementations of the subject matter disclosed herein and, together with the description, help explain some of the principles associated with the disclosed implementations. In the drawings,

[0039] FIG. l is a diagram illustrating an exploded view of an example heater assembly consistent with implementations of the current subject matter;

[0040] FIG. 2 is a close-up view of channels in a heater assembly consistent with implementations of the current subject matter;

[0041] FIG. 3 is a perspective view of a heater assembly device consistent with implementations of the current subject matter;

[0042] FIG. 4A is a diagram illustrating an exploded view of an example double-sided heater assembly consistent with implementations of the current subject matter;

[0043] FIG. 4B shows a diagram of a length and thickness of a side wall of a heater assembly consistent with implementations of the current subject matter;

[0044] FIG. 4C shows perspective views of side walls useful in manufacture of a heater assembly consistent with implementations of the current subject matter;

[0045] FIG. 4D is a table of experimental data comparing current leakage in heater assemblies having aluminum side walls and in heater assemblies having thermoplastic side walls consistent with implementations of the current subject matter;

[0046] FIG. 4E is a graph of the experimental data shown in FIG. 4D;

[0047] FIG. 5 is a perspective view of a double-sided warmer plate consistent with implementations of the current subject matter;

[0048] FIG. 6 is a close-up view of a side rail of a double-sided warmer plate consistent with implementations of the current subject matter;

[0049] FIG. 7 is a diagram illustrating an exploded view of a single-sided heater assembly with an etched foil heating element and a plurality of insulating layers;

[0050] FIG. 8 is an image of an example warmer cabinet system having a plurality of warmer plates consistent with implementations of the current subject matter;

[0051] FIG. 9 shows heater data from an example etched foil warmer plate and an example cable heater warmer plate having channels consistent with implementations of the current subject matter;

[0052] FIG. 10 shows a graph of data shown in FIG. 9, illustrating differences in heater speed and efficiency of for an example etched foil warmer plate and an example cable heater warmer plate having channels consistent with implementations of the current subject matter;

[0053] FIG. 11 is a table illustrating CCh / kg emissions for an exemplary cable heater warmer plate consistent with implementations of the current subject matter and an exemplary etched foil warmer plate.

[0054] FIG. 12 is a diagram illustrating an exploded view of an example heater assembly consistent with implementations of the current subject matter; and

[0055] FIG. 13 is a diagram illustrating a view of an example heater assembly consistent with implementations of the current subject matter.DETAILED DESCRIPTION

[0056] Disclosed herein are heater assemblies, heater systems, and methods of use thereof, that may include a substrate (e.g., a thermally conductive first substrate with a heater surface) having a channel that is configured (e.g., sized and shaped) to receive a heating element. The features of the heater assemblies, heater systems, and methods of use thereof allow for lower cost of manufacture, fewer steps in a manufacturing process, faster temperature increase, more efficient maintenance of heater surface temperature, improved environmental sustainability, and / or decreased emissions associated with the manufacturing process relative to conventional assemblies, systems and methods.

[0057] Turning to FIG. 1, a heater assembly 100 disclosed herein can include a first substrate 102 and a heating element 106. Heater assemblies disclosed herein can include a heating element 106 configured to provide thermal energy to at least a portion of the first substrate102. In some instances, a heater assembly 100 or heater assembly system 200 can include a plurality of heating elements (e.g., as shown in FIG. 8 and FIG. 13). For example, a heater assembly system 200 can include a plurality of heating assemblies 100, e.g., wherein each heating assembly 100 can include a single heating element 106. In some instances, a heating assembly can include a plurality of heating elements 106, 406 (e.g., as shown in FIG. 13). First substrate 102 can be or can include a thermally conductive material, and can be used as a source of radiant heat. Non-limiting examples of suitable thermally conductive materials include metal(s), such as aluminum, steel, or iron, glass(es), ceramic(s), or plastic(s). In some cases, first substrate 102 can include a material selected from aluminum, ceramic glass, tempered glass, or the like, or any combination thereof. In some instances, all or a portion of heating element 106 can be disposed (e.g., positioned) within channel 114. In some instances (e.g., some implementations in which a heating assembly 100 includes a plurality of heating elements 106), a heating assembly 100 can include a plurality of first channels 114, wherein each of the first channels 114 is corresponds in size, shape, and / or positioning to a corresponding heating element 106 of the heating assembly 100. A heating element can be a resistive heating element. In some implementations, electrical current can be passed through at least a portion of heating element 106, which can cause at least a portion of heating element 106 to radiate thermal energy. In some instances, all or a portion of heating element 106 can be electrically isolated, e.g., by use of an insulating material. Non-limiting examples of suitable insulating materials include PVC, neoprene (polychloroprene), Teflon®, and the like. In some instances, all or a portion of heating element 106 can be silicone insulated.

[0058] In some implementations, heating element 106 can be in contact with or in close proximity with a first surface 103 of substrate 102. Substrate 102 can be formed entirely or in part from a thermally conductive material. Non-limiting examples of suitable thermally conductive materials include metal(s), such as aluminum, steel, or iron, glass(es), ceramic(s), or plastic(s). In some instances, all or a portion of substrate 102 can be electrically isolated (e.g., so that an electrical current does not pass from the heating element to the substrate 102). Passing electrical current through heating element 106 to cause heating element 106 to radiate thermal energy can cause thermal energy to be transferred to substrate 102, which can lead to thermal energy being conducted through a thickness of substrate 102 (and, in some instances, laterally through all or a part of a length and / or width of substrate 102) to all or a part of a second surface 104 (e.g., a heater surface) of cover 102. In this illustrated implementation, the thickness of substrate 102 is labeled as 149 and extends from a first outer-most surface 103 a of the substrate 102 to a second outer-most surface 104a of thesubstrate 102. In some instances, as shown in FIG. 1, the first outer-most surface 103a and the second outer-most surface 104a are at least partially opposing surfaces. A person skilled in the art will appreciate that the substrate can have a variety of thicknesses and therefore the thickness thereof is not limited to what is shown in the figures.

[0059] Thickness can refer to a dimension of substrate 102 that is perpendicular to a surface (e.g., heater surface 104) of substrate 102, e.g., wherein the heater surface is not in contact with the heating element but may be configured to contact or provide radiant heat to a target object to be heated by the heater assembly. In some instances, a substrate of heater assembly 100 can have a maximum thickness of less than about 2 millimeters (mm), from about 2 mm to 8 mm, from about 2 mm to about 5 mm, from about 4 mm to 6 mm, from 4 mm to 6 mm, from about 5 mm to about 10 mm, from about 10 mm to about 15 mm, from about 15 mm to about 20 mm, or greater than about 20 mm. In some instances, a substrate of heater assembly 100 can have an average thickness of less than about 2 millimeters (mm), from about 2 mm to about 5 mm, from about 5 mm to about 10 mm, from about 10 mm to about 15 mm, from about 15 mm to about 20 mm, or greater than about 20 mm. In some instances, a substrate of heater assembly 100 can have a minimum thickness of less than about 2 millimeters (mm), from about 2 mm to about 5 mm, from about 5 mm to about 10 mm, from about 10 mm to about 15 mm, from about 15 mm to about 20 mm, or greater than about 20 mm. It is also contemplated that the maximum thickness, average thickness, and minimum thickness of the substrate does not fall outside any of these respective recited ranges. It is further contemplated that the maximum thickness, average thickness, and minimum thickness of the substrate can be between any of these respective recited ranges.

[0060] Accordingly, a target object to be heated can be placed on or near the second surface 104 of substrate 102 (e.g., the heater surface of substrate 102) to heat the target object. Removing or reducing electrical current through the heating element 106 can allow the heating element 106 and / or all or a portion of substrate 102 to cool down after being heated (e.g., as thermal energy in the heating element 106 and / or the substrate 102 is radiated into the target object and / or the surrounding environment).

[0061] The heating element can have a variety of configurations. In some instances, the heating element can be or can include a flat cable heating element (e.g., wherein a top surface of the heating element can be a flat surface), a round cable heating element (e.g., wherein the heating element can have a constant or substantially constant cross-sectional diameter (e.g., thickness)), or a ribbon heating element (e.g., wherein a width of the heating element can be at least 1.5 times as large, at least twice as large, or at least 3 times as large as the thickness ofthe heating element). In some instances, the heating element can have an outer diameter from about 2 mm to about 8 mm. In some instances the outer diameter can be 4 ± 0.2 mm. It is also contemplated that the outer diameter of the heating element does not fall outside any of these recited ranges. It is further contemplated that the outer diameter of the heating element can be between any of these recited ranges.

[0062] The heating element can have any suitable shape. In some instances, a heating element 106 can have or can include a shape selected from a rectangle, a square, a triangle, a circle, an oval, a ring, a spiral pattern, a coil pattern, a zig-zag pattern, a grid pattern, or a waffle pattern. In some instances, a substrate of a heater assembly 100 can have or can include a shape selected from a rectangle, a square, a triangle, a circle, an oval, or a ring. In some instances, a heating element 106 can have a shape having one or more corners. In some instances, a heating element 106 can have a shape with no corners. In some instances, a heating element can include a shape having one or more curves. In some instances, a heating element can include a shape having no curves. In some instances, a heating element 106 can include one or more curves and one or more corners. In implementations where heater assembly 100 has a shape that includes corners, the corners can be rounded or chamfered or can terminate at a vertex.

[0063] Substrate 102 can include one or more channels. For example, first surface 103 of substrate 102 can include one or more channels (e.g., one or more channels 114). Channel(s) 114 formed in the first surface 103 of substrate 102 can be configured to receive at least a portion of heating element 106, for example, as shown in FIG. 1 and FIG. 2.

[0064] Further, channel(s) 114 can be formed in a variety of ways. In some instances, channel 114 can be machined or etched into surface 103 of substrate 102 or formed using microtubular or thick film processes, or other suitable processes. Positioning heating element 106 at least partially within channel 114 can allow a greater percentage of the heating element 106 to be in close proximity or in contact with substrate 102 (e.g., in close proximity or contact with a thermally conductive material of substrate 102), which can improve efficiency of thermal energy transfer from heating element 106 to substrate 102. As such, in some instances, at least a portion of the heating element is in direct contact with the substrate. In some instances, the heating element can be in indirect contact with the substrate, for example, when a material (e.g., an electrically insulating material) is positioned therebetween. In some instances, at least a portion of the heating element is in close proximity with the substrate. By way of example, when in close proximity, the heating element can be spaced apart from the substrate at a distance greater than zero and less than about 2 mm, or greater than zero andless than about 1 mm. It is also contemplated that the heating element can be spaced a distance from the substrate that does not fall outside any of these recited ranges. It is further contemplated that the heating element can be spaced a distance from the substrate that falls between any of these recited ranges.

[0065] Moreover, positioning all or a portion of heating element 106 entirely or partially within the one or more channels 114 can decrease the overall thickness 150 of the heater assembly 100 (e.g., because all or a part of the thickness of heating element 106 can be disposed within the thickness 149 of substrate 102). This, in turn, can allow for heater assembly devices and systems having a smaller thickness (e.g., without sacrificing heater efficiency), as compared to some existing heater assemblies. In some instances, this can allow for a greater range of shapes and applications of the heater assembly 100 that may not be possible in heater assemblies and systems lacking a channel 114. In some instances, all or a portion of substrate 102, including all or a portion of channel(s) 114 can be electrically isolated. For example, all or a portion of substrate 102 (for example, including all or a portion of channel(s) 114) can be or can include anodized aluminum.

[0066] Channel(s) 114 can have a depth of about 1% to about 10%, about 10% to about 20%, about 20% to about 25%, about 25% to about 35%, about 35% to about 50%, about 50% to about 65%, about 65% to about 75%, about 75% to about 85%, about 85% to about 95%, or about 95% to about 99% of a thickness 149 of substrate 102. In some instances, the channel(s) can have a depth (e.g., the distance the channel extends into the substrate) from about 1 mm to 7 mm. In some instances, the channel(s) 114 can have a depth of from about 0 mm to about 1 mm. In some instances, the channel(s) can have a depth of from about 1 mm to about 2 mm. In some instances, the channel(s) can have a depth of from about 2 mm to about 3 mm. In some instances, the channel(s) can have a depth from about 3 mm to about 4 mm. In some instances, the channel(s) can have a depth from about 4 mm to about 5 mm. In some instances, the channel(s) can have a depth from about 5 mm to about 6 mm. In some instances, the channel(s) can have a depth from about 6 mm to about 7 mm. In some instances, the channel(s) can have a depth greater than about 7 mm. In some instances, the channel(s) can have a depth of about 4 mm. It is also contemplated that the depth of the channel(s) that does not fall outside any of these recited ranges. It is further contemplated that the depth of the channel(s) can be between any of these recited ranges. In some cases, all or a portion of a cross-sectional width (e.g., thickness or diameter) of a heating element 106 (e.g., of a heating element cable or ribbon) can be partially or completely disposed within a channel 114 of a heater assembly 100 or system 200.

[0067] Channel(s) 114 can include one or more shapes, for example, to match all or a portion of the shape of a heating element 106 of the heater assemblies 100 and systems 200 described herein. In some cases, a channel 114 (and / or a heating element 106) of a heater assembly 100 or system 200 can have or can include a shape of a rectangular, a square shape, a triangular shape, a circular shape, a semi-circular shape, an oval-like shape, a ring-like shape, a spiral shape, a coil shape, a zig-zag shape, a wavy shape, a grid pattern, or a combination thereof. FIG. 13 shows a plurality of heating elements 406 formed into a shape comprising squared- spirals. A heating element 106 and / or a channel 114 (e.g., a channel in which the heating element is at least partially disposed) can comprise a plurality of shapes. For example, a heating element 106 and / or a channel 114 can include a straight portion and a curved portion. FIG. 12 shows a heating element 306 comprising a straight portion 333 and a curved portion 334. In some instances, a heating element 106 and / or a channel 114 can be shaped such that the shape of the heating element 106 and / or the channel 114 includes one or more open portions, e.g., wherein the shape or pattern of the shape is different or interrupted at the open portion 113, for instance, as shown in FIG. 12. In some cases, an interruption in the shape or pattern of a channel 114 and / or a heating element 106, for instance wherein a sensor 108 is positioned in the interruption to the shape (e.g., open portion of the shape), for example, to reduce the effect of direct heating from the heating element 106 on a sensor 108 positioned in the open portion. Without being bound by theory, positioning a temperature sensor 108 in an open portion of a shape of a heating element can reduce the impact of direct heating from the heating element 106 on measurements made by the temperature sensor 108, e.g., so that a greater portion of the dynamic range of the sensor 108 is reflective of the temperature of an object placed on a substrate 102 of the heater assembly 100 or system 200, which can result in more accurate temperature reading and, in some cases, conservation of energy (e.g., wherein measurements from the temperature sensor 108 are used, for example by a thermostat, to switch on and / or switch off power to the heating element 106). In some instances, a shape of a heating element 106 and / or a channel 114 can comprise a shape corresponding to a shape of a first substrate 102 and / or a second substrate 110. In some instances, the shape of a heating element 106 and / or a channel 114 can be selected to correspond to a specific usage (e.g., wherein a triangular shape is used for a heating element and corresponding channel in a triangular section of a heated wall). In some instances, a heating element 106 and / or a substrate 102 can comprise a shape that is entirely within a single spatial plane (e.g., as shown in FIG. 12). In some instances, a heating element 106 and / or a substrate 102 can comprise a shape that curves or extends out of a single spatialplane. In some instances, a heating assembly 100 or system 200 disposed within a curved wall or cooking appliance can comprise one or more heating elements 106 and / or one or more substrates 102 that curve out of a single plane (e.g., wherein the path of a heating element 106 extends in three different dimensions).

[0068] In some instances, improved heater efficiency, for example, as a result of features of the present subject matter including but not limited to implementations of heater assemblies and systems having one or more channels, can reduce the duty cycle of the heater assemblies and systems compared to existing technologies lacking those features. In some implementations, heater assemblies 100 and system 200 can provide improved response time, temperature accuracy, and / or heater efficiency when no additional material (e.g., intervening layer(s) such as an insulating layer) are disposed between the heating element 106 and the first surface 103 of the substrate 102, which can be a necessary additional component of existing heater assemblies.

[0069] A heater assembly 100 or system 200 disclosed herein can include one or more sensors. For example, a heater assembly 100 or system 200 can include one or more temperature sensors 108, one or more presence sensors, one or more photosensors 107, and / or one or more pressure sensors 107. In some instances, a sensor (e.g., a temperature sensor 108, a presence sensor, a photosensor 107, and / or a pressure sensor 107) can be disposed between a first substrate 102 and a second substrate 110 of the heating assembly 100 or system 200. In some instances, a sensor (e.g., a temperature sensor 108, a presence sensor, a photosensor, and / or a pressure sensor 107) can be disposed between an insulating layer 120 and a second substrate 110. In some instances, an insulating layer 120 can include a material that is a dielectric insulator (e.g., to protect an electrically conductive first substrate from contacting an energized portion of heating element 106. In some instances, a sensor (e.g., a temperature sensor 108, a presence sensor, a photosensor 107, and / or a pressure sensor 107) can be at least partially surrounded by a heating element 106. For example, a sensor (e.g., a temperature sensor 108, a presence sensor, a photosensor 107, and / or a pressure sensor 107) can be disposed in an opening of a shape of a heating element 106. In some instances, a heating assembly 100 or system 200 can include a plurality of sensors. For example, a heating assembly 100 or system 200 can include a plurality of sensors of the same type (e.g., temperature sensors, presence sensors, photosensors, or pressure sensors). In some instance, a heating assembly can include a plurality of sensors of different types. For example, FIG. 13 shows a heating assembly comprising both a plurality of temperature sensors 408 and a plurality pressure sensors 407.

[0070] A heater assembly or system disclosed herein can include a photosensor. In some instances, a photosensor (e.g., comprising one or more photoelectric transducers) can be configured to detect light passing through a first substrate (e.g., a cooking surface of the heating assembly or heating assembly system), for example, wherein the first substrate allows at least some light to pass therethrough (e.g., wherein the first substrate is transparent, semitransparent, or capable of filtering certain wavelengths of light). In some instances, detecting light, or a change in an intensity of light, passing through a first substrate (e.g., using a photosensor of the heating assembly or system) can allow for detection of an object on the surface of the first substrate. In some instances, an object placed on a first substrate (e.g., in order to heat the object using the heating assembly or system) can block or alter the intensity of light passing through the first substrate. A photosensor configured to detect light passing through a first surface or to detect a change in light passing through the first surface can produce a signal based on the change (e.g., decrease) in intensity or change in wavelength of light passing through the first substrate when the object is placed on the first substrate. The signal produced by the photosensor can be transmitted (e.g., wirelessly or via wired connection) to a controller (e.g., of a computer). The controller can then be used to operate the heating element of the heating assembly or system, e.g., wherein the controller allows or prevents electrical current from passing through the heating element (e.g., wherein electrical current passing through the heating element causes the heating element to emit thermal energy and heat at least a portion of the first substrate). In some cases, the controller can be configured to compare the signal from the photosensor to an absolute or relative threshold value, e.g., wherein electrical power is supplied to the heating element when the detected or measured light intensity value is below the threshold value and / or wherein electrical power is prevented from passing into the heating element when the detected or measured light intensity value is above the threshold value. In some instances, a relative threshold value can be a value that is a pre-determined amount higher or lower than a detected or measured average light intensity value or a light intensity value prior to a change in detected or measured light intensity. In some instances, an absolute threshold value can be a predetermined light intensity value or light frequency. In these and similar implementations, a heating assembly or system comprising a photosensor can be configured to turn on a heating element when an object placed on a cooking surface (e.g., first substrate) of the heating assembly or system and to turn off a heating element when the object is removed from the cooking surface (e.g., first substrate) or when no object is present.

[0071] A heater assembly or system disclosed herein can include a presence sensor. In some instances, a presence sensor. In some cases, a presence sensor can be configured to detect the presence or absence of an object on a first substrate of a heating assembly described herein, for example, using radar-based, image-based (e.g., infrared, visible light, and / or ultraviolet spectrum detection), electrical-resistance based, electrical capacitance-based, vibration-based, or acoustic-based sensor technology. A presence sensor configured to detect the presence or absence of an object on a first substrate of the heating assembly can produce and / or transmit a signal (e.g., wirelessly or via wired connection) to a controller (e.g., of a computer) based on detected input (e.g., movement across a portion of the sensor’s detection field, a change in electrical resistance or capacitance of a portion of the heating assembly operably coupled with the sensor, a change in air pressure, or a change in time between the transmission of a transmitted signal (e.g., radar signal) by the sensor and the detection of a reflected or returned signal in response to the transmitted signal. The controller can then be used to operate the heating element of the heating assembly or system, e.g., wherein the controller allows or prevents electrical current from passing through the heating element (e.g., wherein electrical current passing through the heating element causes the heating element to emit thermal energy and heat at least a portion of the first substrate). In some cases, the controller can be configured to compare the signal from the presence sensor to an absolute or relative threshold value. In some instances, a relative threshold value can be a value that is a pre-determined amount higher or lower than a detected or measured sensor parameter value to the introduction of an object onto the first substrate. In some instances, an absolute threshold value can be a predetermined value. In these and similar implementations, a heating assembly or system comprising a presence sensor can be configured to turn on a heating element when an object placed on a cooking surface (e.g., first substrate) of the heating assembly or system and to turn off a heating element when the object is removed from the cooking surface (e.g., first substrate) or when no object is present.

[0072] A heater assembly 100 or system 200 disclosed herein can include a pressure sensor 107. In some instances, a strain gauge, a force sensor, or a pressure sensor 107 (e.g., comprising one or more strain gauges) can be configured to detect or measure a force transmitted from the first substrate 102 to the pressure sensor or a change in vertical position of at least a portion of the first substrate 102 (e.g., as a result of an object being placed on the surface of the first substrate 102. In some instances, detecting a change in pressure or force exerted on the first substrate 102 (e.g., using a pressure sensor of the heating assembly 100 or system 200) can allow for detection of an object on the surface of the first substrate 102. Insome instances, an object placed on a first substrate 102 (e.g., in order to heat the object using the heating assembly 100 or system 200) can deform or vertically displace a portion of the first substrate. A strain gauge, pressure sensor, or force sensor configured to detect a force, pressure, or change in vertical position of the first substrate 102 (for example, by being coupled to or positioned beneath the first substrate) can produce a signal based on the detected or measured force, pressure, or change in position. The signal produced by the strain gauge, force sensor, or pressure sensor can be transmitted (e.g., wirelessly or via wired connection) to a controller (e.g., of a computer). The controller can then be used to operate the heating element 106 of the heating assembly 100 or system 200, e.g., wherein the controller allows or prevents electrical current from passing through the heating element (e.g., wherein electrical current passing through the heating element 106 causes the heating element to emit thermal energy and heat at least a portion of the first substrate 102). In some cases, the controller can be configured to compare the signal from the strain gauge, force sensor, or pressure sensor to an absolute or relative threshold value, e.g., wherein electrical power is supplied to the heating element when the detected or measured force, pressure, or vertical position value is below the threshold value and / or wherein electrical power is prevented from passing into the heating element when the detected or measured force, pressure, or vertical position value is above the threshold value. In some instances, a relative threshold value can be a value that is a pre-determined amount higher or lower than a detected or measured average force, pressure, or vertical position value or a force, pressure, or vertical position value prior to a change in detected or measured force, pressure, or vertical position. In some instances, an absolute threshold value can be a predetermined force, pressure, or vertical position value. In these and similar implementations, a heating assembly 100 or system 200 comprising a strain gauge, force sensor, or pressure sensor can be configured to turn on a heating element when an object placed on a cooking surface (e.g., first substrate) of the heating assembly or system and to turn off a heating element 106 when the object is removed from the cooking surface (e.g., first substrate) or when no object is present.

[0073] A heater assembly 100 or system 200 disclosed herein can include a temperature sensor 108. In some instances, a temperature sensor 108 can include a thermocouple. In some instances, a thermocouple can be a transducer configured to generate and transmit an electrical signal based on a temperature of the thermocouple or portion thereof (e.g., wherein the electrical signal includes temperature value data in the form of a modulated voltage of the electrical signal). The temperature measured by temperature sensor 108 can be indicative of atemperature of an object in physical contact with the thermocouple or, in some instances, of an object that is in close physical proximity to the thermocouple. In some instances, temperature sensor 108 can measure a temperature of one or more components of heater assembly 100 (e.g., a thermally conductive component of heater assembly 100, such as substrate 102). In some instances, the accuracy of temperature sensor 108 in measuring a temperature of a component of heater assembly 100 can advantageously increase as a distance between the thermocouple and the component is decreased. In some instances, the response time of temperature sensor 108 in measuring a temperature of a component of heater assembly 100 can advantageously decrease as a distance between the thermocouple and the component is decreased. Accordingly, a thermocouple can be used to measure a temperature of all or a portion of a component of heater assembly 100 (e.g., a thermally conductive component of heater assembly 100, such as substrate 102). In some implementations, heater assemblies 100 and system 200 can provide improved response time, temperature accuracy, and / or heater efficiency when no additional material (e.g., intervening layer(s) such as an insulating layer) are disposed between the temperature sensor 108 and the first surface 103 of the substrate 102, which can be a necessary additional component of existing heater assemblies.

[0074] A sensor (e.g., temperature sensor 108, a photosensor, a pressure sensor, a presence sensor or a force sensor) can include one or more wires 109 configured to transmit an electrical signal from the sensor (e.g., from a thermocouple of the temperature sensor) to a control device. In some instances, the control device can include a printed circuit board, thermostat, a display, and / or a computer. In some instances, the control device can include a power supply coupled to the heating element. In some implementations, the control device can regulate the flow of electrical current to the heating element from the power supply (e.g., using a thermostat), for example, based on the electrical signal received by the control device from the photosensor, pressure sensor, force sensor, strain gauge, or temperature sensor 108. In some instances, a temperature measurement can be displayed to a user on the display of the control device. In some instances, the control device can include a user input module (e.g., facilitated through user input via a touchscreen display, a keyboard, a mouse, a knob, a slider, a switch, one or more buttons, and / or a mobile device) configured to control the thermostat. As such, in some instances, the control device can be controlled by a computable device, such as a mobile device (e.g., a mobile phone). In such instances, the control device can be controlled by using a software application, e.g., a software application programmable to a mobile device. By way of an example, in such instances, activation and deactivation ofthe heating assembly can be controlled by a user of the software application on a mobile phone.

[0075] The sensor (e.g., strain gauge, pressure sensor, force sensor, photosensor, or temperature sensor) can be located at a variety of positions within the substrate. In some instances, a sensor can be positioned within the substrate so that it is located at the center of the heating element. In other instances, the sensor can be positioned at other areas within the substrate, and thus located at other positions along the heating element. In further instances, one or more additional sensors can be used and positioned along respective locations along the heating element. In instances where the heating assembly system includes two or more heating assemblies, each heating assembly can include a respective one or more sensors (one or more strain gauges, one or more pressure sensors, one or more photosensors, and / or one or more temperature sensors), which can be located at the center of or at other locations along their respective heating elements.

[0076] Alternatively, or in addition to, the heating assembly can include additional sensors, such as position sensor(s). In some instances, a position sensor can be configured to detect the presence and / or position of an object (e.g., cookware, such as a pot or pan) relative to the top surface of the heating assembly. Non-limiting examples of suitable position sensors include a pressure sensor, a photo-cell sensor, light barriers / photoelectric sensors, fiber optic sensors, capacitive sensors, ultrasonic sensors, magnetic proximity sensors, and light-band sensors. In some instances, the position sensor can be positioned within the substrate so it is located at the center of the heating element. In other instances, the position sensor can be positioned at other areas within the substrate, and thus located at other positions along the heating element. In further instances, additional position sensors can be used and positioned along respective locations along the heating element. In instances where the heating assembly system includes two or more heating assemblies, each heating assembly can include a respective one or more position sensors, which can be located at the center of or at other locations along their respective heating elements.

[0077] A heater assembly 100 or heater assembly system 200 can include one or more additional channels 116 (e.g., one or more second channels 116) configured to receive at least a portion of a temperature sensor 108 (e.g., thermocouple 102). In some instances, channel 116 can be sized and shaped to receive all or a portion of temperature sensor 108, for example, as shown in FIG. 1 and FIG. 2. Channel(s) 116 can have a depth of about 1% to about 10%, about 10% to about 20%, about 20% to about 25%, about 25% to about 35%, about 35% to about 50%, about 50% to about 65%, about 65% to about 75%, about 75% toabout 85%, about 85% to about 95%, or about 95% to about 99% of a thickness 149 of substrate 102. Thickness 149 can refer to a dimension of substrate 102 that is perpendicular to a surface (e.g., heater surface 104) of substrate 102, e.g., wherein the heater surface is not in contact with the heating element but may be configured to contact or provide radiant heat to a target object to be heated by the heater assembly. In some instances, improved heater efficiency, for example, as a result of features of the present subject matter including but not limited to implementations of heater assemblies and systems having one or more channels, can reduce the duty cycle of the heater assemblies and systems compared to existing technologies lacking those features.

[0078] An intervening layer including a thermally non-conductive material (e.g., a thermal insulating layer) and placed between a thermocouple and a target object to be measured can impair or prevent the thermocouple’s ability to measure the object’s temperature. In some instances, heater assemblies and systems 100 described herein can be manufactured without an intervening insulating layer, for example, as exemplified by single-sided heater assemblies shown in FIG. 1 and by double-sided heater assemblies shown in FIG. 4A. The ability to exclude an insulating layer 120 from the heater assemblies and systems 100 described herein can result in a heater assembly or system with fewer components (which can reduce costs by simplifying the manufacturing process) and a product with greater sustainability (e.g., by reducing the amount of emissions required for fabrication of the heater assembly) without sacrificing beneficial heater performance. In some implementations, heater assemblies 100 and system 200 can provide improved response time, temperature accuracy, and / or heater efficiency when no additional material (e.g., intervening layer(s) such as an insulating layer 120) are disposed between the heating element 106 and the first surface 103 of the substrate 102, which can be a necessary additional component of existing heater assemblies.

[0079] Heater assembly 100 can include a second substrate 110 (e.g., a bottom cover 110). In some instances, second substrate 110 can be thermally non-conductive or thermally insulating (e.g. , resistant to conduction of thermal energy therethrough). For example, a heater assembly having a heater surface on only one side of the assembly (e.g., a single-sided heater assembly, as shown in FIG. 1 and FIG. 3) can include a thermally non-conductive or thermally insulating substrate 110. In some instances, substrate 110 (e.g., second substrate 110) can comprise a material that is a dielectric insulator. In some instances, second substrate 110 can be an insulating substrate, for example, wherein the insulating substrate is thermally non-conductive. In some instances, a thermally non-conductive second substrate 110 can protect underlying materials (e.g., countertop surfaces, fabrics, or electronic equipment) fromthermal energy radiated by heating element 106. Substrate 110 can be or can include a ceramic material, a porous material, and / or silicone or silicone copolymer, for instance, to decrease or block thermal conduction through a thickness of or along a length and / or width of bottom cover 110. In some instances, at least a portion of first substrate 102 and at least a portion of second substrate 110 can be assembled, coupled, or adhered together to define an enclosure configured to at least partially enclose or completely enclose heating element 106 and, in some instances, temperature sensor 108 therebetween.

[0080] Turning to FIG. 4A, a heater assembly 100 can include a second substrate 110 (e.g., bottom cover 110), wherein the second substrate includes a thermally conductive material, such as aluminum, steel, or iron. A second substrate 110 can be configured to conduct thermal energy from a heating element 104 through a thickness of the second substrate 110 (and, optionally, through all or a portion of a width and / or length of the substrate 110) to all or a portion of an outer surface 112 (e.g., a heating surface) of the second substrate 110. In some instances, all or a portion of second substrate 110 can be in contact with or in close proximity to heating element 106 (e.g., to facilitate thermal energy transfer). In some implementations, a first surface (e.g., an inner surface) of the second substrate 110 can include one or more channels. In some instances, second substrate 110 can include one or more first channels 114 configured to receive all or a portion of heating element 106. In some instances, the one or more first channels 114 can be sized and shaped to receive all or a portion of heating element 106. In some instances, second substrate can include one or more second channels 116 configured to receive all or a portion of a temperature sensor 108. In some instances, second substrate can include one or more second channels 116 sized and shaped to receive all or a portion of temperature sensor 108. In some instances, all or a portion of the second substrate 110 can be electrically isolated. For example, all or a portion of second substrate 110 (e.g., including all or a portion of channel(s) 114, 116) can be or can include anodized aluminum. Channel(s) 114 of second substrate 110 can have a depth of about 1% to about 10%, about 10% to about 20%, about 20% to about 25%, about 25% to about 35%, about 35% to about 50%, about 50% to about 65%, about 65% to about 75%, about 75% to about 85%, about 85% to about 95%, or about 95% to about 99% of a thickness of substrate 110. Thickness can refer to a dimension of substrate 110 that is perpendicular to a surface (e.g., heater surface 112) of substrate 110, e.g., wherein the heater surface is not in contact with the heating element but may be configured to contact or provide radiant heat to a target object to be heated by the heater assembly. In some instances, a substrate 110 of heater assembly 100 can have a maximum thickness of less than about 2 millimeters (mm), from about 2 mm toabout 5 mm, from about 5 mm to about 10 mm, from about 10 mm to about 15 mm, from about 15 mm to about 20 mm, or greater than about 20 mm. In some instances, a substrate 110 of heater assembly 100 can have an average thickness of less than about 2 millimeters (mm), from about 2 mm to about 5 mm, from about 5 mm to about 10 mm, from about 10 mm to about 15 mm, from about 15 mm to about 20 mm, or greater than about 20 mm. In some instances, a substrate of heater assembly 100 can have a minimum thickness of less than about 2 millimeters (mm), from about 2 mm to about 5 mm, from about 5 mm to about 10 mm, from about 10 mm to about 15 mm, from about 15 mm to about 20 mm, or greater than about 20 mm.

[0081] In some implementations, first substrate 102 and second substrate 110 can be joined, adhered, coupled, or fastened together to define an enclosure configured to at least partially enclose or completely enclose the heating element 106 and the temperature sensor 108 therebetween. In some instances, heater assembly 100 can include one or more side walls 118, e.g., as shown in FIG. 4A, FIG. 4B, or FIG. 4C.

[0082] The one or more side walls can be formed of a variety of materials. In some instances, side wall 118 can be formed from aluminum. In some instances, side wall 118 can be formed from a thermoplastic material, such as, e.g., polyether imide (PEI). In some instances, a side wall 118 can have a glass transition of from about 200 °C to about 215 °C. In some instances, a side wall 118 formed from a thermoplastic material can have a density of about 1.00 g / cm3to about 1.25 g / cm3, from about 1.25 g / cm to about 1.35 g / cm3, or greater than about 1.35 g / cm3(e.g., about 1.27 g / cm3). In some implementations, a thermoplastic side wall 118 can be flame retardant. In some implementations, a side wall 118 formed from a thermoplastic material can retain its mechanical properties for extended periods of time at temperatures from about 170 °C to about 180 °C, from about 180 °C to about 190 °C, or from about 190 °C to about 195 °C. In some instances, a side wall 118 formed from a thermoplastic material can retain its mechanical properties at peak temperatures from about 195 °C to about 210 °C. In some instances, a side wall 118 can be formed by extrusion or injection molding, e.g., at temperatures above 400 °C. Use of a thermoplastic material to form side wall(s) 118 can significantly decrease the weight of a heater assembly 100. For example, aluminum side wall pieces can weigh about 0.862 kg per piece, whereas thermoplastic material side wall pieces can weigh about 0.378 kg per piece. A side wall frame of a heater assembly having 12 pieces of aluminum side walls can have a total frame weight of about 10.3 kilograms (kg), whereas a side wall frame of a heater assembly having 12 pieces of thermoplastic material side walls can have a total frame weight of about 4.5 kg. FIG. 4B shows exemplarydimensions of a side wall piece 118. In some implementations, a side wall piece 118 of a heater assembly 100 can have a thickness 402 of about 1.0 mm to about 5.0 mm, from about 5.0 mm to about 10.0 mm, from about 10.0 mm to about 12.6 mm, from about 12.6 mm to about 15.0 mm, or greater than 15.0 mm. In some implementations, a side wall piece 118 of a heater assembly 100 can have a length 404 of about 1.0 mm to about 10.0 mm, from about 10.0 mm to about 25.0 mm, from about 25.0 mm to about 55.8 mm, from about 12.6 mm to about 15.0 mm, or greater than 15.0 mm. A side wall 118 can be solid or can include one or more slits, ports, or holes, for example to reduce weight of the side wall frame 118, for example, as shown in FIG. 4C. FIG. 4D shows experimental data regarding leakage current in different implementations of heater assemblies 100. These results are reproduced below in Table 1. These results show lower leakage current in heater assemblies 100 having thermoplastic side wall 118 frames.Table 1

[0083] FIG. 4E is a graphical representation of the data presented in FIG. 4D and in Table 1.

[0084] In some instances, first substrate 102, second substrate 110, and the one or more side walls 118 can be joined, adhered, coupled, or fastened together to define an enclosure configured to at least partially enclose or completely enclose the heating element 106 and the temperature sensor therebetween, e.g., as shown in FIG. 5. As shown in FIG. 6, one or more side walls 118 can have a port or hole through which one or more wires 105a, 105b, and / or 109 can pass, for example, to connect the heating element 106 and / or temperature sensor 108 to a thermostat and / or a power supply.

[0085] In some implementations, a heater assembly 100 or system 200 can include a thermostat. A thermostat of heater assembly 100 or system 200 can be operably coupled to a power source and a heating element 106 of the heater assembly or system 200, for example, to control provision of electrical current from the power supply to the heating element based at least in part on a signal provided to the thermostat from the temperature sensor 108 (e.g., from a thermocouple of the temperature sensor 108). In some instances, a thermostat can include a switch configured to open and close an electrical circuit to allow or prevent current from flowing from the power supply to the heating element (e.g., via one or more wires 105a, 105b), for example, based on an electrical signal from the temperature sensor 108 indicative of a temperature measured by the thermocouple. In some instances, the thermostat can be configured to open a switch to prevent flow of electrical energy from the power supply to the heating element 106 when an electrical signal from the temperature sensor 108 indicates a temperature at or above a predefined, conditional, or user defined temperature limit. In some instances, the thermostat can be configured to close a switch to allow flow of electrical energy from the power supply to the heating element 106 when an electrical signal from the temperature sensor 108 indicates a temperature below a predefined, conditional, or user defined temperature limit. In some instances, the thermostat can include an adjustable temperature controller, e.g., wherein the adjustable temperature controller is configured to define the temperature limit.

[0086] Also described herein are heater assembly systems 200, for example, as shown in FIG. 8. A heater assembly system 200 can include one or more heater assemblies 100 (e.g., as described herein) and a structural support 202 configured to couple the or more heater assemblies together. In some instances, the structural support can be configured to maintain a fixed distance and a fixed orientation of a first heater assembly 100a relative to a second heater assembly 100b. In some instances, the support structure, the first heater assembly, and the second heater assembly can define a space 210 configured (e.g., sized and shaped) to receive an object to be heated. In some instances, a heater assembly system 200 can include athird heater assembly, wherein the support structure is configured to maintain a fixed distance and a fixed orientation of the third heater assembly relative to the first heater assembly and the second heater assembly. In some implementations, a heater assembly system 200 can include 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more than 10 heater assemblies 100. In some instances, the heater assembly system 200 can be configured as a shelf or a rack, for example, wherein objects to be heated are placed on one or more substrates 102 of the one or more heater assemblies 100 of the heater assembly system 200. In some instances, a heater assembly system 200 can include a thermostat, a power supply, a display 220, and / or a computer (e.g., wherein the computer is operably coupled with the power supply, the display 220, and / or one or more heating elements of the one or more heater assemblies 100). In some instances, a power supply disclosed herein can be configured to deliver less than about 100 watts (W) of power, from about 100 watts to about 200 watts, from about 200 watts to about 300 watts, from about 300 watts to about 400 watts, from about 400 watts to about 600 watts, about 600 watts to about 700 watts, or more than 700 watts of power. In some instances, a single-sided heating assembly disclosed herein (e.g., a heating assembly 100 having a first thermally conductive substrate 102 but not a second thermally conductive substrate 110) can be operated at a wattage of less than 300 watts, from about 300 watts to about 400 watts, or from about 400 watts to about 500 watts. In some instances, a double-sided heating assembly disclosed herein (e.g., a heating assembly 100 having a first thermally conductive substrate 102 and a second thermally conductive substrate 110) can be operated at a wattage of from about 500 watts to about 600 watts, from about 600 watts to about 700 watts, or more than 700 watts. In some instances, a power supply disclosed herein can be configured to deliver power at less than about 110 volts, about 110 volts (V) to about 240 volts, or more than about 240 volts.

[0087] In some instances, a heater assembly 100 having a heating element 106, a temperature sensor 108 (e.g., which can include a thermocouple), and a thermally conductive first substrate, wherein the first substrate has a first channel configured to receive at least a portion of the heating element and a second channel configured to receive at least a portion of the temperature sensor 108 can improve heater efficiency, decrease duty cycle during use, and / or improve sustainability of the manufacturing process. For example, FIG. 9 shows experimental measurements of heater surface temperature of heater assemblies 100 according to this disclosure (“Heater with Channel”), e.g., as shown in FIG. 1, versus a heater assembly 300 shown in FIG. 7 (“Etched Foil Heater”).

[0088] As shown in FIG. 7, some heater assemblies have an etched foil heating element 307. Heater assemblies having an etched foil heating element 307 can include a layer of additional material (e.g., a layer of silicone rubber 320) on one or both sides of the etched foil heating element. As such, heater assemblies having an etched foil heating element 307 can have one or more layers of additional material (e.g., one or more intervening layers) between the heating element and a substrate used as a heater surface. The one or more intervening layers can prevent or attenuate conduction of thermal energy across the intervening layer(s) (e.g., an insulating layer, for instance, including silicone, ceramic, or a porous material). Heater assemblies having an etched foil heating element 307 can have one or more layers of additional material (e.g., one or more intervening layers) disposed between a temperature sensor 308 and the etched heating element 307 and / or between the temperature sensor 308 and the substrate 302, for instance, as shown in FIG. 7. A hole in an intervening layer can be positioned between a temperature sensor 308 and the etched foil heating element 307, for instance, as shown in FIG. 7. One or more patches 322 of insulating material can be placed over the temperature sensor 308 and hole, as shown in FIG. 7.

[0089] Experimental data shows that the tested heater assemblies according to this disclosure achieved a temperature of 80°C in 9 minutes and 19 seconds, whereas the heater surface of etched foil heater assemblies with a silicone layer required 15 minutes and 11 seconds to reach the same temperature, which is equal to about a 38% shorter time required to reach 80°C. FIG. 10 shows a graph of the data presented in FIG. 9, illustrating the heater curves for the heater assembly technology disclosed herein (“Heater with Channel”) versus the “Etched Foil Heater” technology shown in FIG. 7. FIG. 11 shows final weights and emissions costs of heater assembly technology disclosed herein (“Heater with Channel”) and “Etched Foil Heater” technology shown in FIG. 7, as estimated from materials involved in manufacture. Estimates show that the manufacture of heater assemblies using the present technology is expected to be contribute less than half the amount of carbon dioxide emissions (about 1.9 kilograms carbon dioxide equivalent per unit (kgCO2eq / pc)) as the manufacture of “Etched Foil Heater” technology shown in FIG. 7 (about 4.2 kilograms carbon dioxide equivalent per unit (kgCO2eq / pc)), which can translate into lower costs of manufacturing. For the purposes of emission estimation in FIG. 11, the emission contribution of packaging and an aluminum substrate was not considered, as these were stipulated as equal between the two groups for purposes of comparison. In some instances, an emission factor of about 6.89 kg / CO2eq can be assumed for the contribution of aluminum components of a heater assembly 100. In some instances, heater assemblies and systems disclosed herein can be manufactured at less thanabout 40%, less than about 50%, less than about 60%, less than about 70%, less than about 80%, less than about 90%, or from 90% to 100% of the emissions (kgCO2eq / pc) compared to comparable existing heater assembly technologies. These results show that heater assemblies including channel(s) as described herein can offer advantages with respect to time required to achieve a target temperature and / or sustainability of manufacturing processes than existing technologies.

[0090] FIG. 12 shows a heating assembly 300 comprising a serigraph thick film heating element 306. As shown in FIG. 12, a thick film heating element 306 can be comprise a ribbon shape and can comprise an opening in the shape of the pattern (e.g., at or near the center of the heating element), for example, to allow space for one or more sensors to be positioned, as described herein. In some instances, a thick film heating element can have a thickness of greater than 10 micrometers. A heating element can include one or more electrically insulating layers, e.g., to prevent electrical current flow from a portion of heating element 306 to another electrically conductive material, which may include the first substrate 302 and / or one or more components underlying the second substrate 310. As shown in FIG. 12, a heating assembly can comprise an open portion 305 in a shape of a heating element 306, a wire 309 connecting a sensor to a controller of a computer, and / or an insulating layer 320.

[0091] FIG. 13 shows a heating assembly comprising a plurality of heating elements 406. Each of the heating elements depicted in FIG. 13 are shown as having a spiral shape; however, it is contemplated that a heating assembly 400 can include a plurality of heating elements 406, wherein each of the plurality of heating elements 406 have a different shape, such as one of the shapes described herein. It is also contemplated that a heating assembly 400 can include a plurality of heating elements 406, wherein two, three, four, five, or more than five of the heating elements are different shapes, sizes (e.g., as measured by height, width, or diameter of the shape of the entire heating element, or as measured by the height, width, diameter or thickness of the cable, ribbon, or wire used to form the heating element from which the shape of the heating element as a whole is formed), or types (e.g., thin film, thick film, cable heating element, ribbon, etched foil, etc.). In some cases, a thin film heating element can have a cross-sectional thickness of from about 0.10 mm to about 0.25 mm. In some instances, a thick film heating element can have a cross-sectional thickness of from about 0.26 mm to about 0.50 mm. As shown in FIG. 13, a heating assembly 400 can include a plurality of heating elements and a plurality of sensors 407, 408 (e.g., pressure sensors, force sensors, strain gauges, photosensors, or temperature sensors), wherein one or more sensors of the plurality of sensors corresponds to a position of each heating element of the plurality ofheating elements of the heating assembly. Such configurations can allow for specific control over heating of specific portions of the first substrate at which or near which each heating element is positioned. In some instances, providing separate sensors or separate groups of sensors (which may include one or more of temperature sensor(s), force sensor(s), pressure sensor(s), strain gauge(s), and / or photosensor(s)) associated with (e.g., operatively coupled to) respective heating elements of the plurality of heating elements can advantageously allow for individual control over separate portions of a first substrate 402 (e.g., heating surface, such as a cooking surface). In some cases, a heating assembly 400 can include a plurality of heating elements 406 and a plurality of separate first substrates 402 (e.g., wherein two or more of the plurality of separate first substrates are physically unconnected to one another or wherein two or more of the plurality of separate first substrates are connected to one another by an intervening substrate comprising a material that has low thermal conductivity, low electrical conductivity, or both (e.g., as compared to the first substrates)). In some cases, such arrangements can allow for improved separation of heating conditions between individual first substrates of the plurality of first substrates of heating assembly and / or can allow for improved esthetics and / or ergonomics of the heating assembly.

[0092] Various methods can be used to manufacture the heater assemblies described herein. In one implementation, the method of manufacturing a heater assembly can include: creating a first channel in a first substrate formed from a thermally conductive material, wherein the first channel is configured to receive at least a portion of a heating element; creating a second channel in the first surface sized and shaped to receive at least a part of a thermocouple; positioning the heating element at least partially within the first channel; and positioning the thermocouple at least partially within the second channel. A method of manufacturing can also include coupling the first substrate to a second substrate to define an enclosure configured to at least partially enclose or completely enclose the heating element and the thermocouple therebetween. In some instances, the second substrate can include a thermally conductive material. In some instances, a method of manufacturing a heater assembly can include creating a first channel in the second substrate of the second substrate, wherein the first channel of the second substrate is configured to receive at least a part of the second heating element; creating a second channel in the second substrate, wherein the second channel is configured to receive at least a part of the second thermocouple; and positioning the insulating layer between the first heating element and the second heating element before coupling the first substrate to the second substrate.Terminology

[0093] In the descriptions above and in the claims, phrases such as “at least one of’ or “one or more of’ may occur followed by a conjunctive list of elements or features. The term “and / or” may also occur in a list of two or more elements or features. Unless otherwise implicitly or explicitly contradicted by the context in which it used, such a phrase is intended to mean any of the listed elements or features individually or any of the recited elements or features in combination with any of the other recited elements or features. For example, the phrases “at least one of A and B;” “one or more of A and B;” and “A and / or B” are each intended to mean “A alone, B alone, or A and B together.” A similar interpretation is also intended for lists including three or more items. For example, the phrases “at least one of A, B, and C;” “one or more of A, B, and C;” and “A, B, and / or C” are each intended to mean “A alone, B alone, C alone, A and B together, A and C together, B and C together, or A and B and C together.” Use of the term “based on,” above and in the claims is intended to mean, “based at least in part on,” such that an unrecited feature or element is also permissible.

[0094] The subject matter described herein can be embodied in systems, apparatus, methods, computer programs and / or articles depending on the desired configuration. Any methods or the logic flows depicted in the accompanying figures and / or described herein do not necessarily require the particular order shown, or sequential order, to achieve desirable results. The implementations set forth in the foregoing description do not represent all implementations consistent with the subject matter described herein. Instead, they are merely some examples consistent with implementations related to the described subject matter. Although a few variations have been described in detail above, other modifications or additions are possible. In particular, further features and / or variations can be provided in addition to those set forth herein. The implementations described above can be directed to various combinations and subcombinations of the disclosed features and / or combinations and subcombinations of further features noted above. Furthermore, above described advantages are not intended to limit the application of any issued claims to processes and structures accomplishing any or all of the advantages.

[0095] As used herein in the specification and claims, including as used in the examples and unless otherwise expressly specified, all numbers may be read as if prefaced by the word “about” or “approximately,” even if the term does not expressly appear. The phrase “about” or “approximately” may be used when describing magnitude and / or position to indicate that the value and / or position described is within a reasonable expected range of values and / or positions. For example, a numeric value may have a value that is + / - 0.1% of the stated value(or range of values), + / - 1% of the stated value (or range of values), + / - 2% of the stated value (or range of values), + / - 5% of the stated value (or range of values), + / - 10% of the stated value (or range of values), etc. Any numerical values given herein should also be understood to include about or approximately that value, unless the context indicates otherwise. For example, if the value “10” is disclosed, then “about 10” is also disclosed. Any numerical range recited herein is intended to include all sub-ranges subsumed therein. It is also understood that when a value is disclosed that “less than or equal to” the value, “greater than or equal to the value” and possible ranges between values are also disclosed, as appropriately understood by the skilled artisan. For example, if the value “X” is disclosed the “less than or equal to X” as well as “greater than or equal to X” (e.g., where X is a numerical value) is also disclosed. It is also understood that the throughout the application, data is provided in a number of different formats, and that this data, represents endpoints and starting points, and ranges for any combination of the data points. For example, if a particular data point “10” and a particular data point “15” are disclosed, it is understood that greater than, greater than or equal to, less than, less than or equal to, and equal to 10 and 15 are considered disclosed as well as between 10 and 15. It is also understood that each unit between two particular units are also disclosed. For example, if 10 and 15 are disclosed, then 11, 12, 13, and 14 are also disclosed.

[0096] Spatially relative terms, such as “forward”, “rearward”, “under”, “below”, “lower”, “over”, “upper” and the like, may be used herein for ease of description to describe one element or feature’s relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is inverted, elements described as “under” or “beneath” other elements or features would then be oriented “over” the other elements or features. Thus, the exemplary term “under” can encompass both an orientation of over and under. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. Similarly, the terms “upwardly”, “downwardly”, “vertical”, “horizontal” and the like are used herein for the purpose of explanation only unless specifically indicated otherwise.

[0097] Additionally, section headings shall not limit or characterize the invention(s) set out in any claims that may issue from this disclosure. Specifically, and by way of example, although the headings refer to a “Technical Field,” such claims should not be limited by the language chosen under this heading to describe the so-called technical field. Further, the description of a technology in the “Background” is not to be construed as an admission that technology isprior art to any invention(s) in this disclosure. Neither is the “Summary” to be considered as a characterization of the invention(s) set forth in issued claims. Furthermore, any reference to this disclosure in general or use of the word “invention” in the singular is not intended to imply any limitation on the scope of the claims set forth below. Multiple inventions may be set forth according to the limitations of the multiple claims issuing from this disclosure, and such claims accordingly define the invention(s), and their equivalents, that are protected thereby.

Claims

CLAIMSWhat is claimed is:

1. A heater assembly, the heater assembly comprising: a heating element; a temperature sensor; and a thermally conductive first substrate comprising: a first channel configured to receive at least a portion of the heating element, and a second channel configured to receive at least a portion of the temperature sensor; wherein the heating element is positioned at least partially within the first channel and the substrate is configured to transfer thermal energy from at least a portion of the first channel through a thickness of at least a portion of the substrate, wherein the temperature sensor is positioned at least partially within the second channel and is configured to measure a temperature of at least a portion of the first substrate.

2. The heater assembly of claim 1, further comprising a second substrate, wherein the first substrate and the second substrate define an enclosure configured to at least partially enclose the heating element and the temperature sensor therebetween.

3. The heater assembly of claim 2, wherein the second substrate comprises a thermal insulator.

4. The heater assembly of claim 2 or claim 3, wherein the second substrate is in direct contact with at least a portion of the first substrate.

5. The heater assembly of any one of claims 1-4, wherein at least a portion of the first substrate is electrically non-conductive.

6. The heater assembly of any one of claims 1-5, wherein at least a portion of the first channel is anodized aluminum.

7. The heater assembly of any one of claims 1-6, wherein the heating element is electrically isolated from the first substrate.

8. The heater assembly of any one of claims 1-7, wherein the heating element is silicone insulated.

9. The heater assembly of any one of claims 1-8, wherein the first substrate comprises a first surface and a second surface, wherein the first surface comprises the first and second channels and wherein the second surface is substantially flat.

10. The heater assembly of any one of claims 1-8, wherein the first substrate comprises a first surface and a second surface, wherein the first surface comprises the first and second channels and wherein the second surface is not flat.

11. The heater assembly of any one of claims 1-10, wherein the heating element is coupled to an electrical power supply such that the heating element radiates thermal energy when electrical current is provided to the heating element from the power source.

12. The heater assembly of any one of claims 1-11, further comprising a thermostat operably coupled to the temperature sensor.

13. The heater assembly of claim 12, wherein the thermostat is operably coupled to the power supply and wherein the thermostat is configured to control provision of electrical current from the power supply to the heating element based at least in part on a signal provided to the thermostat from the temperature sensor.

14. The heater assembly of claim 13, wherein the thermostat comprises a switch configured to prevent electrical current from flowing from the power supply to the heating element based at least in part on the signal provided to the thermostat from the temperature sensor.

15. The heater assembly of claim 14, wherein the thermostat is configured to prevent the electrical current from flowing from the power supply to the heating element when the signal from the temperature sensor to the thermostat indicates that a temperature of the first substrate is greater than or equal to a temperature limit.

16. The heater assembly of claim 15, wherein the thermostat comprises an adjustable temperature controller, wherein the adjustable temperature controller is configured to define the temperature limit.

17. The heater assembly of any one of claims 1-16, wherein the first channel has a depth at least as large as a cross-sectional thickness of the heating element.

18. The heater assembly of any one of claims 1-17, wherein a depth of the first channel into the first substrate is about 1% to about 10%, about 10% to about 20%, about 20% to about 25%, about 25% to about 35%, about 35% to about 50%, about 50% to about 65%, about 65% to about 75%, about 75% to about 85%, about 85% to about 95%, or about 95% to about 99% of a cross-sectional thickness of the first substrate.

19. The heater assembly of any one of claims 1-18, wherein the heating element is selected from a flat cable heating element, a round cable heating element, or a ribbon heating element.

20. The heater assembly of any one of claims 1-19, wherein the heating element, the first substrate, and the temperature sensor form an integrated unit.

21. The heater assembly of any one of claims 1-20, wherein the first substrate comprises a material selected from iron, aluminum, or steel.

22. The heater assembly of any one of claims 1-19, wherein the first substrate has a shape selected from a flat rectangle, a flat square, a flat triangle, a flat circle, a flat oval, or a flat ring.

23. The heater assembly of any one of claims 1-20, wherein the first substrate has a maximum thickness of less than about 2 millimeters (mm), from about 2 mm to about 5 mm, from about 5 mm to about 10 mm, from about 10 mm to about 15 mm, from about 15 mm to about 20 mm, or greater than about 20 mm.

24. The heater assembly of any one of claims 1-23, wherein the second substrate comprises a thermally conductive material.

25. The heater assembly of claim 24, wherein the second substrate comprises a first channel formed in an inner surface of the second substrate, wherein the first channel of the second substrate is configured to receive at least a portion of the heating element.

26. The heater assembly of claim 24 or claim 25, wherein the second substrate comprises a second channel formed in the inner surface of the second substrate, and wherein the second channel of the second substrate is configured to receive at least a portion of the heating element.

27. The heater assembly of claim 24, further comprising a second heating element and an insulating layer, wherein the insulating layer is positioned between the first heating element and the second heating element, and wherein the second substrate comprises a first channel configured to receive at least a portion of the second heating element.

28. The heater assembly of claim 27, wherein the second substrate comprises a second channel and a second temperature sensor, wherein the second channel is formed in the inner surface of the second substrate, and wherein the second channel of the second substrate is configured to receive at least a portion of the second temperature sensor.

29. The heater assembly of any one of claims 1-24, wherein the second substrate is in direct contact with at least a portion of the first substrate.

30. The heater assembly of claim 29, wherein the second substrate is thermally isolated from the first substrate by the insulating layer.

31. The heater assembly of any one of claims 27-30, wherein the insulating layer comprises a thermally non-conductive material, optionally selected from a ceramic material or a porous material.

32. The heater assembly of any one of claims 1-31, wherein the second surface is substantially flat.

33. The heater assembly of any one of claims 1-31, wherein the second surface is not flat.

34. The heater assembly of any one of claims 27-33, wherein the second heating element is coupled to an electrical power supply such that the heating element radiates thermal energy when electrical current is provided to the heating element from the power supply.

35. The heating assembly of any one of claims 1 -34, wherein the temperature sensor comprises one or more thermocouples.

36. The heater assembly of any one of claims 1-35, further comprising a position sensor configured to detect at least one of a presence or a position of an object relative to a top surface of the thermally conductive first substrate.

37. A heater assembly system, comprising: a first heater assembly according to any one of claims 1-34; a second heater assembly according to any one of claims 1-34; and a support structure configured to couple the first heater assembly to the second heater assembly.

38. The heater assembly system of claim 35, wherein the support structure, the first heater assembly, and the second heater assembly define a space sized and shaped to receive an object to be heated.

39. The heater system of claim 35 or claim 36, further comprising a third heater assembly according to any one of claims 1-48, wherein the support structure is configured to couple the third heater assembly to the first heater assembly and the second heater assembly.

40. A method of manufacturing a heater assembly, the method comprising: creating a first channel in a first substrate formed from a thermally conductive material, wherein the first channel is configured to receive at least a portion of a heating element; creating a second channel in the first surface sized and shaped to receive at least a part of a temperature sensor; positioning the heating element at least partially within the first channel; andpositioning the temperature sensor at least partially within the second channel.

41. The method of claim 38, further comprising: coupling the first substrate to a second substrate to define an enclosure configured to at least partially enclose the heating element and the temperature sensor therebetween.

42. The method of manufacturing a heater assembly of claim 38 or claim 39, wherein the second substrate comprises a thermally conductive material.

43. The method of any one of claims 38-40, further comprising: creating a first channel in the second substrate of the second substrate, wherein the first channel of the second substrate is configured to receive at least a part of the second heating element; creating a second channel in the second substrate, wherein the second channel is configured to receive at least a part of the second temperature sensor; and positioning the insulating layer between the first heating element and the second heating element before coupling the first substrate to the second substrate.

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