Thermal diffusion member and electronic device comprising same

Abstract

An electronic device according to an embodiment disclosed in the present document may include: a housing; a first electronic component arranged in a first region inside the housing; a second electronic component arranged in a second region different from the first region inside the housing; and a thermal diffusion member arranged in a heat radiation region formed from the first region to the second region, and including a first portion corresponding to the first region, a second portion corresponding to the second region, and a connection portion connecting the first portion with the second portion, wherein the thermal diffusion member may include at least one recess. Other various embodiments identified through the specification are possible.

Description

Heat spreading member and electronic device including same

[0001] Embodiments disclosed in this document relate to a member capable of lowering the temperature of an internal component of an electronic device and an electronic device including the same.

[0002] Electronic devices are becoming increasingly miniaturized, while their functions are becoming increasingly diverse. As electronic devices become smaller and slimmer, the electrical components embedded in these devices may be positioned with increasingly narrow or concentrated gaps between them and surrounding structures. This, in turn, can generate high temperatures as they perform various functions. The high temperatures generated within these devices can cause malfunctions, damage the internal electrical components, and even cause discomfort to the user. Therefore, electronic devices may incorporate heat dissipation structures that effectively dissipate the heat generated by these internal electrical components to the surroundings.

[0003] An electronic device according to one embodiment disclosed in the present document includes a housing, a first electronic component disposed in a first area inside the housing, a second electronic component disposed in a second area inside the housing different from the first area, and a heat spreading member disposed in a heat dissipation area formed from the first area to the second area, the heat spreading member including a first portion corresponding to the first area and a second portion corresponding to the second area, and a connecting portion connecting the first portion and the second portion, wherein the heat spreading member may include at least one recess.

[0004] A heat spreading member according to one embodiment disclosed in the present document may include a first portion, a second portion through which heat is spread from the first portion, a connecting portion connecting the first portion and the second portion, and a first recess extending from at least a portion of the first portion past the connecting portion to at least a portion of the second portion.

[0005] FIG. 1 is a diagram showing the configuration of an electronic device according to one embodiment.

[0006] FIG. 2 is a diagram showing the configuration of an electronic device according to one embodiment.

[0007] FIGS. 3A to 3D are drawings showing the structure of a heat spreading member of an electronic device according to various embodiments.

[0008] FIG. 4 is a drawing for explaining a change in the stiffness of a heat diffusion member of an electronic device according to one embodiment.

[0009] Figure 5 shows the results of simulating the extent of damage to a heat diffusion member of an electronic device due to a drop impact according to one embodiment.

[0010] FIG. 6 is a drawing showing a flange structure of a heat diffusion member according to various embodiments.

[0011] Fig. 7 is a drawing showing the structure of a heat diffusion member according to one embodiment.

[0012] FIG. 8 is a drawing illustrating a heat spreading member disposed in an electronic device, according to one embodiment.

[0013] FIG. 9 illustrates an electronic device within a network environment according to various embodiments.

[0014] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0015] FIG. 1 is a diagram illustrating a configuration of an electronic device according to one embodiment. For example, the left drawing of FIG. 1 illustrates the internal structure of the electronic device as viewed from the display direction of the electronic device, the center drawing of FIG. 1 illustrates the internal structure of the electronic device as viewed from the rear side (the side opposite the display) of the electronic device, and the right drawing of FIG. 1 illustrates a cross-section along line AA'.

[0016] According to one embodiment, an electronic device (100) (e.g., electronic device (901) of FIG. 9) may include a heat spreading member (110) within a housing. For example, the housing may include a support structure (120). For example, the support structure (120) may form at least a portion of a side housing of the electronic device (100). The heat spreading member (110) may be disposed within a space within the support structure (120).

[0017] According to one embodiment, the electronic device (100) may include a heat spreading member (110) (e.g., heat spreading member (301, 303, 305) of FIG. 3, heat spreading member (430) of FIG. 4, or heat spreading member (820) of FIG. 8) within a housing, a support structure (120), a shielding member (130), a heat transfer member (140), a memory (150), a processor (160), and / or a substrate (170) (e.g., a circuit board (170)).

[0018] According to one embodiment, the heat spreading member (110) can spread heat generated in a first region (e.g., a first component (e.g., a processor (160))) within the electronic device (100) to a second region different from the first region within the electronic device (100). For example, the heat spreading member (110) can lower the temperature within the electronic device (e.g., the first component) by spreading heat generated from the first component, which generates relatively high temperature heat within the electronic device (100), to another region. For example, the heat spreading member (110) can include a vapor chamber. For example, referring to FIG. 1, the heat spreading member (110) can have a generally uniform width and be arranged along one direction (e.g., vertically or horizontally) of the electronic device. For example, the heat spreading member (110) can spread heat generated from a component arranged in the first region along the longitudinal direction. In one embodiment, the heat spreading member (110) may be secured to the support structure (120) via adhesive tape, or may be secured to the support structure (120) via laser welding.

[0019] In one embodiment, a support structure (120) (e.g., a metal front structure) may secure a heat spreading member (110). In one embodiment, the support structure (120) may be formed of a metal material. In one embodiment, the support structure (120) may be positioned below the heat spreading member (110) to support the heat spreading member (110).

[0020] In one embodiment, the shielding member (130) can reduce or block electromagnetic interference occurring inside the electronic device (100). In one embodiment, the shielding member (130) can be formed of a material such as metal or nanofiber (e.g., nano TIM). In one embodiment, the shielding member (130) can include a conductive shielding film. In one embodiment, the shielding member (130) can be disposed under the support structure (120).

[0021] In one embodiment, a heat transfer member (140) (e.g., a gel TIM member) can transfer heat from inside the electronic device (e.g., a component inside the electronic device) to the heat spreading member (110). In one embodiment, the heat transfer member (140) can be disposed below the shielding member (130). For example, the heat transfer member (140) can be disposed between a first component that is a heat source (e.g., a processor (160)) and the heat spreading member (110).

[0022] According to one embodiment, the memory (150) and the processor (160) may be disposed on the substrate (170). According to one embodiment, the memory (150) may include a universal flash storage (UFS). According to one embodiment, the memory (150) may store data used in the electronic device (100). According to one embodiment, the processor (160) may control the overall operation of the electronic device. For example, the processor (160) may be a heat source that emits heat at a relatively higher temperature than other components within the electronic device (100).

[0023] According to one embodiment, the electronic device may include a battery (not shown). For example, at least a portion of the heat spreading member (110) may be arranged to overlap the battery. For example, the heat spreading member (110) may spread heat generated from a first component (e.g., a processor (160)) toward the battery. For example, the heat spreading member (110) may spread heat emitted from a processor (160) that emits relatively high heat toward a battery that has a relatively low temperature, thereby lowering the temperature of the processor (160), thereby preventing malfunction due to high temperature and damage to internal components of the electronic device (100).

[0024] According to one embodiment, the components and internal arrangement of the electronic device in FIG. 1 are not limited to those illustrated in FIG. 1.

[0025]

[0026] FIG. 2 is a diagram showing the configuration of an electronic device according to one embodiment. Hereinafter, descriptions overlapping with those of FIG. 1 will be omitted or briefly described. According to one embodiment, the components and internal arrangement of the electronic device in FIG. 2 are not limited to those illustrated in FIG. 2. For example, the left drawing of FIG. 2 illustrates the internal structure of the electronic device as viewed from the display direction of the electronic device, the central drawing of FIG. 2 illustrates the internal structure of the electronic device as viewed from the rear side (the side opposite the display) of the electronic device, and the right drawing of FIG. 2 illustrates a cross-section along line BB'.

[0027] According to one embodiment, an electronic device (200) (e.g., electronic device (901) of FIG. 9) may include a heat spreading member (210) (e.g., heat spreading members (301, 303, 305) of FIG. 3, heat spreading member (430) of FIG. 4, or heat spreading member (820) of FIG. 8) within a housing, a support structure (220), a shielding member (230), a heat transfer member (240), an additional heat transfer member (280), a memory (250), a processor (260), and / or a substrate (270).

[0028] Compared to FIG. 1, the electronic device (200) may further include an additional heat transfer member (280). In one embodiment, the support structure (220) or the shielding member (230) may include some openings. In one embodiment, the additional heat transfer member (280) may be disposed between the processor (260) and the heat spreading member (210) so that heat emitted from the processor (260) may be directly transferred to the heat spreading member (210). For example, the additional heat transfer member (280) may include a member formed of a metal material (e.g., a metal block or a copper block). For example, the additional heat transfer member (280) may contact the heat spreading member (210) and the heat transfer member (240), and the heat transfer member (240) may contact the processor (260). Accordingly, heat generated in the processor (260) may be transferred to the heat transfer member (240) and the additional heat transfer member. The heat can be transferred to the heat spreading member (210) through the additional heat transfer member (280). For example, the heat generated in the processor (260) can be more easily transferred to the heat spreading member (210) by the additional heat transfer member (280).

[0029] In one embodiment, the heat spreading member (210) may not be formed with the same width but may include regions with different widths. For example, the heat spreading member (210) may be formed with a narrower width in a region corresponding to a component (e.g., the processor (260)) that emits relatively high temperature heat inside the electronic device (200), and may be formed with a wider width in a region where heat is spread (e.g., a region overlapping with a battery). In one embodiment, when the heat spreading member (210) has a wider width (larger area), the heat spreading performance may be increased, making it more efficient in lowering the temperature of the components inside the electronic device (200). For example, when the heat spreading member (210) has a wider width (larger area), the rigidity of the heat spreading member (210) may be weakened, increasing the possibility of damage such as deformation or weld separation when an external impact is applied. Hereinafter, a structure capable of enhancing the resistance of the heat diffusion member (210) to external impact will be described in more detail in FIG. 3a and below.

[0030]

[0031] FIGS. 3A to 3D are diagrams illustrating the structure of a heat diffusion member of an electronic device according to various embodiments. According to one embodiment, an electronic device (not shown) (e.g., an electronic device (901) of FIG. 9) may include a heat diffusion member (301, 303, 305) (e.g., a heat diffusion member (110) of FIG. 1, a heat diffusion member (210) of FIG. 2, a heat diffusion member (430) of FIG. 4, or a heat diffusion member (820) of FIG. 8).

[0032] According to one embodiment, referring to FIG. 3A, the heat spreading member (301) may include a first portion (310), a second portion (320), and a connecting portion (330) connecting the first portion (310) and the second portion (320). According to one embodiment, the first portion (310) may be positioned on a first electronic component (e.g., a processor) that becomes a heat source that emits relatively high temperature heat inside the electronic device, and the second portion (320) may be positioned on a second electronic component (e.g., a battery) that is spaced apart from the heat source. According to one embodiment, the size (e.g., area) of the first portion (310) may be smaller than the size of the second portion (320). For example, as the size of the first portion (310) or the second portion (320) increases, the heat spreading performance (e.g., heat dissipation performance) of the heat spreading member (301) may increase. For example, the first part (310) may be placed at a position corresponding to a first area where a first electronic component (e.g., a processor) of the electronic device is placed, and the second part (320) may be placed at a position corresponding to a second area where a second electronic component (e.g., a battery) of the electronic device is placed.

[0033] According to one embodiment, the heat spreading member (301) can include at least one recess (and / or slot). For example, the heat spreading member (301) can include a first recess (341) extending from at least a portion of the first portion (310) past the connecting portion (330) to at least a portion of the second portion (320). For example, the first recess (341) can be formed along the longitudinal direction (e.g., longitudinal direction) of the heat spreading member (301). For example, the heat spreading member (301) can be susceptible to longitudinal bending deformation (e.g., longitudinally folded when the heat spreading member (301) has a longitudinal length greater than a transverse length), and the first recess (341) can reduce or prevent longitudinal bending deformation of the heat spreading member (301) by increasing longitudinal bending stiffness. For example, the first recess (341) may be formed along the centerline of the heat spreading member (301) extending from at least a portion of the first portion (310) to at least a portion of the second portion (320).

[0034] According to one embodiment, referring to FIG. 3B, the description overlapping with FIG. 3A is omitted or briefly described below. According to one embodiment, the heat spreading member (303) may include at least one recess (343, 350) (and / or a slot). For example, the heat spreading member (303) may include a first recess (343) formed in the longitudinal direction. For example, the heat spreading member (303) may include at least one second recess (350) formed in a second direction different from the first direction extending from the first part (e.g., the first part (310) of FIG. 3A) to the second part (e.g., the second part (320) of FIG. 3A) in the connecting part (e.g., the connecting part (330) of FIG. 3A) of the heat spreading member (303). For example, the heat spreading member (303) can include at least one second recess (350) in at least one of the first portion, the second portion, and / or the connecting portion. In one embodiment, the at least one second recess (350) can be connected to the first recess (343) at one point. In one embodiment, the at least one second recess (350) can be formed substantially perpendicular to the first recess (343). For example, the second recess (350) can be formed substantially in the short-length direction (e.g., the short-axis direction) of the heat spreading member (303). In one embodiment, the at least one second recess (350) can be formed in at least one of the first portion, the connecting portion, and / or the second portion. For example, the at least one second recess (350) can improve the torsional rigidity of the heat spreading member (303).

[0035] According to one embodiment, referring to FIG. 3C, the description overlapping with FIGS. 3A and 3B is omitted or briefly described below. According to one embodiment, the heat spreading member (305) may include at least one recess (345, 350) (and / or a slot). For example, the heat spreading member (305) may include a first recess (345) formed in the longitudinal direction. For example, the heat spreading member (305) may include at least one third recess (360) formed to have a specified angle with the first recess (345) in a second portion (e.g., the second portion (320) of FIG. 3A). For example, the at least one third recess (360) may include a recess that intersects the first recess (345) at a substantially right angle. For example, at least one third recess (360) can reduce the area of ​​a dome-shaped deformation that may occur in the second portion, and / or reduce the amount of dome-shaped deformation. For example, the first recess (345) and / or the third recess (360) can distribute a dome-shaped deformation that may occur throughout the second region into a plurality of smaller dome-shaped deformations. For example, the first recess (345) and / or the third recess (360) can distribute the amount of impact applied to the second region, thereby reducing the degree to which the second region is deformed.

[0036] Referring to FIG. 3d, the changes in strength and the shapes of natural vibration modes of the heat diffusion members (301, 303, 305) according to the first example (in the case of FIG. 3a), the second example (in the case of FIG. 3b), and the third example (in the case of FIG. 3c) are shown. For example, it can be confirmed that the strength of the heat diffusion members (301, 303, 305) increases significantly in the order of the first example, the second example, and the third example, and the natural vibration modes correspond to the first mode, the second mode, and the third mode, respectively. According to various embodiments, the position, shape, direction, and / or number of each recess can be determined in a direction that can improve the first mode, the second mode, and the third mode, which have a large influence on deformation, among the natural vibration modes of the heat diffusion members (301, 303, 305). For example, improving the bending characteristics of the heat diffusion member (301, 303, 305) in the long longitudinal direction (e.g., major axis direction) of the heat diffusion member (301, 303, 305) may be most effective in increasing the strength of the heat diffusion member (301, 303, 305). For example, if a recess is formed along the long longitudinal direction of the heat diffusion member (301, 303, 305), the effect of increasing the strength through the recess may be relatively the highest.

[0037] According to one embodiment, by forming at least one recess in the heat spreading member (301, 303, 305), the strength of the heat spreading member (301, 303, 305) can be increased and the possibility of deformation and damage of the heat spreading member (301, 303, 305) from external impact (e.g., dropping of the electronic device or collision with an external object) can be reduced.

[0038] According to various embodiments, the shape, position, direction, and / or number of recesses formed in the heat spreading member (301, 303, 305) are not limited to those illustrated in FIGS. 3A to 3C.

[0039]

[0040] FIG. 4 is a drawing for explaining a change in the stiffness of a heat diffusion member of an electronic device according to one embodiment.

[0041] For example, 410 illustrates a first heat diffusion member (410) that does not include a recess (435), and 420 represents the stiffness of the first heat diffusion member (410) against an external impact. 430 illustrates a second heat diffusion member (430) (e.g., the heat diffusion member (301) of FIG. 3A) that includes a recess (435), and 440 represents the stiffness of the second heat diffusion member (430) against an external impact. For example, since the second heat diffusion member (430) disperses the external impact through the recess (435), the external impact amount (445) applied to the second heat diffusion member (430) can be in a smaller range and with a smaller intensity than the external impact amount (425) applied to the first heat diffusion member (410).

[0042] For example, the first heat diffusion member (410) may not include a recess (435) extending in the longitudinal direction at the center. In this case, since the first heat diffusion member (410) has relatively low rigidity (e.g., stiffness), there is a high possibility that deformation and / or damage may occur in response to an impact applied to the first heat diffusion member (410).

[0043] For example, the second heat diffusion member (430) may include a recess (435) extending longitudinally in the center. In this case, the rigidity of the second heat diffusion member (430) may be increased due to the recess (435). For example, when a relatively equal external impact is applied, the second heat diffusion member (430) may be less likely to be deformed and / or the degree of damage may be reduced.

[0044] For example, as illustrated in FIG. 4, when the first heat diffusion member (410) and the second heat diffusion member (430) have the same shape and the same thickness, and an external impact of the same magnitude is applied, the stiffness of the first heat diffusion member (410) and the second heat diffusion member (430) may vary significantly. For example, by forming the recess (435), the stiffness of the second heat diffusion member (430) may increase significantly more than the stiffness of the first heat diffusion member (410), and the resistance to the external impact (e.g., yield stress) may increase significantly.

[0045] According to one embodiment, FIG. 4 only shows a case where the heat diffusion member (e.g., the second heat diffusion member (430)) includes one recess (435) in the longitudinal direction, but if the heat diffusion member includes a recess (435) in each direction, the rigidity of the heat diffusion member against external impact in the corresponding direction can be increased.

[0046]

[0047] FIG. 5 shows the results of simulating the extent of damage due to a drop impact of a heat diffusion member of an electronic device according to one embodiment. For example, FIG. 5 shows the results of performing a half-sine wave stress simulation (using JEDEC H drop conditions) for a drop load of the JEDEC standard in order to check the extent of damage when changing the specifications (e.g., thickness) of a heat diffusion member (hereinafter referred to as a “vapor chamber (VC)”) of the same shape (e.g., a heat diffusion member (110) of FIG. 1, a heat diffusion member (210) of FIG. 2, a heat diffusion member (301, 303, 305) of FIG. 3, a heat diffusion member (430) of FIG. 4, or a heat diffusion member (820) of FIG. 8) or applying a strength-reinforced structure (e.g., a recess).

[0048] For example, when a standard drop simulation is performed from a specified height (e.g., 150 cm) for a first VC with a 0.29T specification, a second VC with a 0.35T specification, and a third VC with a 0.35T specification reinforcement structure, it can be confirmed that the stress decreases in the order of the first VC, the second VC, and the third VC, and the failure criterion (yield) decreases. For example, as shown in the table in Fig. 5, it can be confirmed that the degree of deformation (e.g., the highlighted area) is severe in the order of the first VC, the second VC, and the third VC.

[0049] According to one embodiment, when an electronic device (e.g., a terminal) including a VC (e.g., the electronic device (901) of FIG. 9) is dropped, a shear force (shear load) due to the inertia of the battery may occur, causing plastic deformation around the welding portion of the VC. For example, a load may be transmitted to the contact surface between the VC and the battery, causing a yield stress in the VC and deformation and damage to the joint portion of the VC. In FIG. 6 below, a flange structure for preventing deformation of the VC will be described in more detail.

[0050]

[0051] FIG. 6 is a drawing showing a flange structure of a heat diffusion member according to various embodiments. For example, FIG. 6 shows a structure (hereinafter referred to as a “flange structure”) of a designated edge region of a heat diffusion member (e.g., a heat diffusion member (110) of FIG. 1, a heat diffusion member (210) of FIG. 2, a heat diffusion member (301, 303, 305) of FIG. 3, a heat diffusion member (430) of FIG. 4, or a heat diffusion member (820) of FIG. 8).

[0052] In one embodiment, the first heat spreading member (601) may include a first plate (610) and a second plate (620). In one embodiment, the first plate (610) and the second plate (620) may be joined at an edge of the first heat spreading member (601) to form an outer appearance of the first heat spreading member (601). For example, the flange structure of the first heat spreading member (601) may have a significant effect on the rigidity of the first heat spreading member (601). For example, the first heat spreading member (601) may be secured to a support member within the electronic device by tape or laser welding. When laser welding is used, the flange structure may have a relatively greater effect on the rigidity of the first heat spreading member (601).

[0053] According to one embodiment, the second heat diffusion member (603) represents a case where the thickness of the flange structure is increased compared to the first heat diffusion member (601). For example, the thickness (t2) of the flange structure of the second heat diffusion member (603) may be formed to be relatively thicker than the thickness (t1) of the flange structure of the first heat diffusion member (601). For example, when the thickness of the first plate (610) and / or the second plate (620) forming the flange structure is increased, the rigidity of the second heat diffusion member (603) may be increased. According to one embodiment, the thickness of the first plate (610) and / or the second plate (620) that are joined to each other in a designated area of ​​the edge of the second heat diffusion member (603) may be formed to be thicker than the thickness outside the designated area. According to one embodiment, a third plate (630) having a designated thickness may be joined between the first plate (610) and the second plate (620). For example, by additionally joining the third plate (630), the thickness of the flange structure of the second heat diffusion member (603) can be increased, and an effect that facilitates designing various welding surfaces (welding areas and / or shapes) can be obtained. For example, as the flange structure becomes thicker, the rigidity (e.g., stiffness) of the second heat diffusion member (603) can be increased.

[0054] According to one embodiment, at least one recess (635) (and / or slit) may be formed in the first plate (610) and / or the second plate (620) of the flange structure of the third heat diffusion member (605). For example, when the recess (635) is formed in the flange structure, the second cross-sectional moment may structurally increase due to the recess (635), and the rigidity of the heat diffusion member may increase. For example, the third heat diffusion member (605) is illustrated as having a plurality of recesses (635) formed in the upper portion (the first plate (610)) and the lower portion (the second plate (620)) of the flange structure of the second heat diffusion member (603), but the embodiment of the present invention is not limited thereto. For example, the shape, position, and / or number of the recesses (635) of the flange structure can be changed, and the recesses (635) can be formed in various flange structures including the flange structure of the first heat spreading member (601). For example, the recesses (635) can be formed in either the first plate (610) or the second plate (620), and the size, shape, and / or depth of the recesses (635) can be formed differently. For example, the depth of the recesses (635) can be formed to be equal to or shallower than the thicknesses of the first plate (610) and the second plate (620).

[0055] According to various embodiments, the shape of the flange structure and the form and number of the recesses are not limited to those illustrated in FIG. 6, and the shape of the flange structure, the method of adjusting the thickness, and / or the structure or number of the recesses may be changed.

[0056]

[0057] FIG. 7 is a diagram showing the structure of a heat spreading member according to one embodiment. For example, FIG. 7 illustrates a flange structure of a heat spreading member (e.g., a heat spreading member (110) of FIG. 1, a heat spreading member (210) of FIG. 2, a heat spreading member (301; 303; 305) of FIGS. 3A to 3C, a heat spreading member (430) of FIG. 4, a heat spreading member (601; 603; 605) of FIG. 6, or a heat spreading member (820) of FIG. 8) disposed inside an electronic device (e.g., an electronic device (100) of FIG. 1, an electronic device (200) of FIG. 2, an electronic device (800) of FIG. 8, or an electronic device (901) of FIG. 9) according to one embodiment.

[0058] In one embodiment, an edge (e.g., a flange structure) of a heat spreading member (e.g., a vapor chamfer) may be disposed in an area where a battery (740) (e.g., battery (989) of FIG. 9) is disposed within a housing of the electronic device. For example, a support structure (720) may be disposed on top of the battery (740). For example, the support structure (720) may be bonded to the battery (740) via a bonding tape (730). For example, a display (705) of the electronic device may be disposed on top of the support structure (720). In one embodiment, the support structure (720) may be formed to support and secure the heat spreading member. In one embodiment, the support structure (720) may be bonded to at least a portion of the heat spreading member via a bonding tape (710) or laser welding.

[0059] In one embodiment, the heat spreading member may include a first plate (750) and a second plate (760). For example, the first plate (750) and the second plate (760) may be joined at a designated edge region of the heat spreading member to form a flange structure (e.g., 601; 603; 605 of FIG. 6) of the heat spreading member. In one embodiment, the flange structure of the heat spreading member may be attached to at least a portion of one side of the upper structure and / or one side of the lower structure. For example, the flange structure of the heat spreading member may be attached to at least a portion of one side of an opposite side of the battery (740) (e.g., the display (705)). In another example, the flange structure of the heat spreading member may be attached to at least a portion of one side of the battery (740). For example, a space may be formed between the first plate (750) and the second plate (760) in the central region of the heat diffusion member (outside the above-mentioned region), and a structure for heat diffusion may be formed.

[0060] In one embodiment, the first plate (750) and the second plate (760) may have a thicker thickness in a region other than a designated region at an edge of the heat diffusion member (hereinafter referred to as a “flange structure” of the heat diffusion member). For example, a portion of the plates forming the flange structure of the heat diffusion member may be formed to have a thicker thickness than other portions. For example, a third plate may be bonded between the first plate (750) and the second plate (760) such that the portion forming the flange structure of the heat diffusion member may be formed to have a thicker thickness than other portions. In one embodiment, the flange structure of the heat diffusion member may include at least one recess. For example, due to the flange structure including the recess, the second moment of inertia of the flange structure may be increased, and the rigidity of the heat diffusion member may be increased. For example, a flange structure including a recess can be formed by bonding an additional plate including a recess to the outside of the first plate (750) and / or the second plate (760), thereby increasing the thickness of the flange structure.

[0061]

[0062] FIG. 8 is a drawing illustrating a heat spreading member disposed in an electronic device, according to one embodiment.

[0063] According to one embodiment, an electronic device (800) (e.g., electronic device (100) of FIG. 1, electronic device (200) of FIG. 2, or electronic device (901) of FIG. 9) may include a heat spreading member (820) (e.g., heat spreading member (110) of FIG. 1, heat spreading member (210) of FIG. 2, heat spreading members (301, 303, 305) of FIG. 3, heat spreading member (430) of FIG. 4, or heat spreading members (601; 603; 605) of FIG. 6). According to one embodiment, the heat spreading member (820) may spread heat generated from a first component (e.g., a processor) within the electronic device (800) to an area where a second component (e.g., a battery) is disposed. For example, the heat spreading member (820) can spread high temperature heat generated from a first component (e.g., a processor) to reduce the temperature of the first component (e.g., a processor) and prevent the first component (e.g., a processor) from malfunctioning, being damaged, and / or being destroyed due to the high temperature heat. For example, the heat spreading member (820) can lower the heat of the first component (e.g., a processor) that generates high temperature heat.

[0064] According to one embodiment, the heat spreading member (820) may include at least one recess (825, 827). According to one embodiment, the heat spreading member (820) may include a first recess (825) formed along a central portion of the heat spreading member (820). For example, the first recess (825) may be arranged along a longitudinal direction of the heat spreading member (820). For example, the first recess (825) may be formed in a line shape corresponding to the overall shape of the heat spreading member (820). According to one embodiment, the heat spreading member (820) may include a plurality of second recesses (827) on the left and right of the first recess (825) that have a smaller length and a smaller width than the first recess (825).

[0065] According to one embodiment, the heat spreading member (820) includes at least one recess (825, 827), so that the heat spreading member (820) has increased rigidity against external impact (e.g., dropping of the electronic device (800) and / or collision with an external object) and can be reduced in degree of deformation or damage caused by the external impact.

[0066] According to various embodiments, the location, direction, shape, and / or number of recesses included in the heat spreading member (820) are not limited to those illustrated in FIG. 8.

[0067]

[0068] As the area of ​​a heat diffusion member included in an electronic device increases, the proportion of the heat diffusion member within the electronic device may increase, resulting in an increase in low-order modes within the natural frequency modes. In this case, the magnitude of the force applied to the heat diffusion member when the electronic device is dropped may increase, and the possibility of the heat diffusion member being deformed or damaged by external impact may increase. Various embodiments of the present disclosure aim to provide a heat diffusion member and an electronic device including the heat diffusion member that can increase the rigidity of the heat diffusion member and reduce deformation and damage by external impact.

[0069] According to one embodiment, an electronic device (e.g., an electronic device (100) of FIG. 1, an electronic device (200) of FIG. 2, an electronic device (800) of FIG. 8, or an electronic device (901) of FIG. 9) comprises a housing, a first electronic component disposed in a first region inside the housing, a second electronic component disposed in a second region inside the housing different from the first region, and a heat spreading member (e.g., a heat spreading member (110) of FIG. 1, a heat spreading member (210) of FIG. 2, a heat spreading member (301) of FIGS. 3A to 3C) disposed in a heat dissipation region formed from the first region to the second region, the heat spreading member comprising a first portion corresponding to the first region (e.g., a first portion (310) of FIG. 3A) and a second portion corresponding to the second region (e.g., a second portion (320) of FIG. 3A)) and a connecting portion connecting the first portion and the second portion. 303; 305), the heat spreading member (430) of FIG. 4, the heat spreading member (601; 603; 605) of FIG. 6, or the heat spreading member (820) of FIG. 8. In one embodiment, the heat spreading member may include at least one recess (slit) (e.g., recess (341; 343; 350; 360) of FIGS. 3a to 3c, recess (435) of FIG. 4, or recess (825, 827) of FIG. 8).

[0070] According to one embodiment, a heat spreading member of an electronic device includes at least one recess to increase rigidity against external impact and disperse the external impact through the recess, thereby preventing or reducing deformation and / or damage caused by the external impact.

[0071] In one embodiment, the heat spreading member may include a vapor chamber.

[0072] In one embodiment, the at least one recess may include a first recess extending from at least a portion of the first portion of the heat spreading member past the connecting portion to at least a portion of the second portion.

[0073] In one embodiment, the first recess may be disposed along a centerline of the heat spreading member extending from at least a portion of the first portion to at least a portion of the second portion.

[0074] According to one embodiment, the at least one recess may include at least one second recess formed in a second direction different from the first direction extending from the first portion to the second portion in the connecting portion of the heat spreading member.

[0075] According to one embodiment, the at least one recess may include at least one third recess formed at a specified angle with the first recess in the second portion of the heat spreading member.

[0076] In one embodiment, the at least one third recess may include a recess intersecting the first recess at a right angle.

[0077] In one embodiment, the heat spreading member may include a first plate and a second plate. In one embodiment, the first plate and the second plate may be bonded to each other at a designated edge region of the heat spreading member, and the first plate and the second plate may be formed to have a thickness thicker in the bonded region than in a region where they are not bonded to each other.

[0078] According to one embodiment, the heat spreading member may further include a third plate disposed between the first plate and the second plate in the mutually joined region to join the first plate and the second plate.

[0079] According to one embodiment, at least one of the first plate or the second plate may include at least one recess structure formed in a direction parallel to the edge of the heat spreading member in the area where the two plates are joined to each other.

[0080] According to one embodiment, a fourth plate may be joined, the fourth plate including at least one recess structure on at least one of the opposite surfaces of the first plate that are joined to the second plate or the opposite surfaces of the second plate that are joined to the first plate.

[0081] In one embodiment, the second region may be larger than the first region.

[0082] In one embodiment, the first electronic component may include a processor, and the second electronic component may include a battery.

[0083] In one embodiment, the heat dissipation member can spread heat generated from the first electronic component to the second region.

[0084] In one embodiment, a heat spreading member may include a first portion, a second portion through which heat spreads from the first portion, a connecting portion connecting the first portion and the second portion, and a first recess extending from at least a portion of the first portion past the connecting portion to at least a portion of the second portion.

[0085] In one embodiment, the first recess may be disposed along a centerline of the heat spreading member extending from at least a portion of the first portion to at least a portion of the second portion.

[0086] According to one embodiment, the heat spreading member may further include at least one second recess formed in a second direction different from the first direction extending from the first portion to the second portion in the connecting portion.

[0087] According to one embodiment, the heat spreading member further comprises at least one third recess formed in the second portion of the heat spreading member to have a specified angle with the first recess.

[0088] In one embodiment, the heat spreading member may include a first plate; and a second plate. In one embodiment, the first plate and the second plate may be bonded to each other at a first region designated as an edge of the heat spreading member, and the first plate and the second plate may be formed to have a thicker thickness in the first region than in a second region that is different from the first region.

[0089] According to one embodiment, at least one of the first plate or the second plate may include at least one recess structure formed in a direction parallel to the edge of the heat spreading member in the area where the two plates are joined to each other.

[0090]

[0091] FIG. 9 is a block diagram of an electronic device (901) within a network environment (900) according to various embodiments. Referring to FIG. 9 , in the network environment (900), the electronic device (901) may communicate with the electronic device (902) via a first network (998) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (904) or the server (908) via a second network (999) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (901) may communicate with the electronic device (904) via the server (908). According to one embodiment, the electronic device (901) may include a processor (920), a memory (930), an input module (950), an audio output module (955), a display module (960), an audio module (970), a sensor module (976), an interface (977), a connection terminal (978), a haptic module (979), a camera module (980), a power management module (988), a battery (989), a communication module (990), a subscriber identification module (996), or an antenna module (997). In some embodiments, the electronic device (901) may omit at least one of these components (e.g., the connection terminal (978)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (976), the camera module (980), or the antenna module (997)) may be integrated into one component (e.g., the display module (960)).

[0092] The processor (920) may control at least one other component (e.g., a hardware or software component) of the electronic device (901) connected to the processor (920) by executing, for example, software (e.g., a program (940)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (920) may store a command or data received from another component (e.g., a sensor module (976) or a communication module (990)) in a volatile memory (932), process the command or data stored in the volatile memory (932), and store the resulting data in a non-volatile memory (934). According to one embodiment, the processor (920) may include a main processor (921) (e.g., a central processing unit or an application processor) or a secondary processor (923) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (901) includes a main processor (921) and a secondary processor (923), the secondary processor (923) may be configured to use less power than the main processor (921) or to be specialized for a given function. The secondary processor (923) may be implemented separately from the main processor (921) or as a part thereof.

[0093] The auxiliary processor (923) may control at least a portion of functions or states associated with at least one component (e.g., a display module (960), a sensor module (976), or a communication module (990)) of the electronic device (901), for example, on behalf of the main processor (921) while the main processor (921) is in an inactive (e.g., sleep) state, or together with the main processor (921) while the main processor (921) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (923) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (980) or a communication module (990)). In one embodiment, the auxiliary processor (923) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (901) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (908)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0094] The memory (930) can store various data used by at least one component (e.g., the processor (920) or the sensor module (976)) of the electronic device (901). The data can include, for example, software (e.g., the program (940)) and input data or output data for commands related thereto. The memory (930) can include a volatile memory (932) or a non-volatile memory (934).

[0095] The program (940) may be stored as software in the memory (930) and may include, for example, an operating system (942), middleware (944), or an application (946).

[0096] The input module (950) can receive commands or data to be used in a component of the electronic device (901) (e.g., a processor (920)) from an external source (e.g., a user) of the electronic device (901). The input module (950) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0097] The audio output module (955) can output audio signals to the outside of the electronic device (901). The audio output module (955) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0098] The display module (960) can visually provide information to an external party (e.g., a user) of the electronic device (901). The display module (960) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (960) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0099] The audio module (970) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (970) can acquire sound through the input module (950), output sound through the sound output module (955), or an external electronic device (e.g., electronic device (902)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (901).

[0100] The sensor module (976) can detect the operating status (e.g., power or temperature) of the electronic device (901) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (976) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0101] The interface (977) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (901) with an external electronic device (e.g., the electronic device (902)). In one embodiment, the interface (977) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0102] The connection terminal (978) may include a connector through which the electronic device (901) may be physically connected to an external electronic device (e.g., the electronic device (902)). According to one embodiment, the connection terminal (978) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0103] The haptic module (979) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (979) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0104] The camera module (980) can capture still images and videos. According to one embodiment, the camera module (980) may include one or more lenses, image sensors, image signal processors, or flashes.

[0105] The power management module (988) can manage power supplied to the electronic device (901). According to one embodiment, the power management module (988) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0106] A battery (989) may power at least one component of the electronic device (901). In one embodiment, the battery (989) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0107] The communication module (990) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (901) and an external electronic device (e.g., electronic device (902), electronic device (904), or server (908)), and the performance of communication through the established communication channel. The communication module (990) may operate independently from the processor (920) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (990) may include a wireless communication module (992) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (994) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (904) via a first network (998) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (999) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (992) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (996) to identify or authenticate the electronic device (901) within a communication network such as the first network (998) or the second network (999).

[0108] The wireless communication module (992) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (992) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (992) can support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (992) can support various requirements specified in the electronic device (901), an external electronic device (e.g., the electronic device (904)), or a network system (e.g., the second network (999)). According to one embodiment, the wireless communication module (992) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

[0109] The antenna module (997) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (997) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (997) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (998) or the second network (999), may be selected from the plurality of antennas by, for example, the communication module (990). A signal or power may be transmitted or received between the communication module (990) and the external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (997).

[0110] According to various embodiments, the antenna module (997) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0111] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0112] According to one embodiment, commands or data may be transmitted or received between the electronic device (901) and an external electronic device (904) via a server (908) connected to a second network (999). Each of the external electronic devices (902 or 104) may be the same or a different type of device as the electronic device (901). According to one embodiment, all or part of the operations executed in the electronic device (901) may be executed in one or more of the external electronic devices (902, 104, or 108). For example, when the electronic device (901) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (901) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (901). The electronic device (901) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (901) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (904) may include an Internet of Things (IoT) device. The server (908) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (904) or the server (908) may be included in the second network (999).The electronic device (901) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0113] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0114] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0115] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0116] Various embodiments of the present document may be implemented as software (e.g., a program (940)) including one or more instructions stored in a storage medium (e.g., an internal memory (936) or an external memory (938)) readable by a machine (e.g., an electronic device (901)). For example, a processor (e.g., a processor (920)) of the machine (e.g., an electronic device (901)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0117] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0118] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, housing; A first electronic component arranged in a first region inside the housing; A second electronic component arranged in a second region different from the first region inside the housing; and A heat spreading member is disposed in a heat dissipation area formed from the first area to the second area, and includes a first part corresponding to the first area, a second part corresponding to the second area, and a connecting part connecting the first part and the second part. An electronic device wherein the heat spreading member comprises at least one recess.

2. In claim 1, The above heat spreading member is an electronic device including a vapor chamber.

3. In claim 1, At least one of the above recesses, An electronic device comprising a first recess extending from at least a portion of the first portion of the heat spreading member through the connecting portion to at least a portion of the second portion.

4. In claim 3, An electronic device wherein the first recess is disposed along a centerline of the heat spreading member extending from at least a portion of the first portion to at least a portion of the second portion.

5. In claim 1, At least one of the above recesses, An electronic device comprising at least one second recess formed in a second direction different from the first direction extending from the first portion to the second portion in the connecting portion of the heat spreading member.

6. In claim 3, At least one of the above recesses, An electronic device comprising at least one third recess formed in the second portion of the heat spreading member to have a specified angle with respect to the first recess.

7. In claim 6. At least one third recess, An electronic device comprising a recess intersecting the first recess at a right angle.

8. In claim 1, The above heat spreading member comprises a first plate and a second plate, An electronic device wherein the first plate and the second plate are joined to each other at an edge-designated area of ​​the heat spreading member, and the first plate and the second plate are formed to have a thickness thicker at the edge-designated area than at an area other than the edge-designated area.

9. In claim 8, An electronic device wherein the heat spreading member further includes a third plate disposed between the first plate and the second plate in the designated edge region to join the first plate and the second plate.

10. In claim 8, An electronic device wherein at least one of the first plate or the second plate includes at least one recessed structure formed in a direction parallel to a perimeter of the heat spreading member in the edge-designated region.

11. In claim 8, An electronic device wherein the heat spreading member comprises a fourth plate joined to at least one surface of the first plate opposite the surface that is joined to the second plate or the second plate opposite the surface that is joined to the first plate and including at least one recess structure.

12. In claim 1, The second region is an electronic device larger than the first region.

13. In claim 1, An electronic device wherein the first electronic component includes a processor and the second electronic component includes a battery.

14. In claim 1, The above heat spreading member is an electronic device that spreads heat generated from the first electronic component to the second region.

15. In the absence of heat diffusion, Part 1; A second part through which heat is diffused from the first part; a connecting portion connecting the first portion and the second portion; and A heat spreading member comprising a first recess extending from at least a portion of the first portion through the connecting portion to at least a portion of the second portion.

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