Deposition mask for depositing OLED pixels

Abstract

A deposition mask, according to an embodiment of the present invention, comprises a support part and a mask part on the support part, wherein the support part comprises a first layer and a second layer, the first layer has a thermal expansion coefficient smaller than that of the second layer, the first layer has a hardness greater than that of the second layer, and the second layer contains the same material as that of the mask part. In addition, the coefficient of linear thermal expansion of the first layer is 0.3-0.7*10-6㎝ / ㎝℃, and that of the second layer is 1.4-2.0*10-6㎝ / ㎝℃.

Description

Deposition mask for OLED pixel deposition

[0001] The embodiment relates to a deposition mask for OLED pixel deposition.

[0002] Display devices are applied to various devices. For example, the display devices are applied to small devices such as smartphones or tablet PCs. Alternatively, the display devices are applied to large devices such as TVs, monitors, or public displays (PDs). Recently, demand for ultra-high definition (UHD) resolutions exceeding 500 PPI (Pixels Per Inch) has been increasing. Accordingly, display devices with high resolution are being applied to both small and large devices.

[0003] Display devices are classified into LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diode) depending on the driving method.

[0004] The above LCD is a display device driven by liquid crystals. In addition, OLED is a display device driven by organic materials.

[0005] The OLED can display an infinite contrast ratio, has a response speed over 1,000 times faster than LCD, and offers an excellent viewing angle. Accordingly, the OLED is attracting attention as a display device that can replace the LCD.

[0006] The OLED includes a light-emitting layer. The light-emitting layer includes an organic material. The organic material is deposited on a substrate using a deposition mask. The deposition mask may include an open mask (OM) or a fine metal mask (FMM). A deposition pattern corresponding to the pattern formed on the deposition mask is formed on the substrate. Accordingly, the deposition pattern can function as a pixel.

[0007] The open mask described above is a thin plate that forms a deposition pattern only at specific locations when manufacturing OLEDs. The open mask is used in the deposition process for forming a light-emitting layer on a backplane after it has been completed during the display manufacturing process. In other words, the open mask is a mask that has no covering area within the display's operating range, allowing deposition on the entire display surface. Therefore, the open mask is used when depositing a light-emitting layer using a light-emitting material of a single color.

[0008] On the other hand, a fine metal mask is used to differentiate the colors of the sub-pixels of the light-emitting layer. Therefore, the fine metal mask includes ultra-fine holes. The process using the fine metal mask requires multiple deposition steps. Consequently, the process requires precise alignment. Consequently, the process using the fine metal mask is more difficult than the process using an open mask.

[0009] When the light-emitting layer of the OLED is deposited using an open mask, only a light-emitting layer of a single color is formed. Therefore, a separate color filter (C / F) is required to implement various colors. On the other hand, when the fine metal mask is used, an RGB light-emitting layer can be formed. Therefore, a separate color filter is not required. In other words, the technology using the fine metal mask is difficult. However, compared to the method using an open mask, it does not require a filter to block light, so the light efficiency is good.

[0010] Meanwhile, as products using display devices become larger, the demand for larger deposition masks is increasing.

[0011] However, when a large-area deposition mask is secured to a frame, warpage of the deposition mask may increase. Consequently, the alignment of the through-holes may be misaligned. Consequently, the quality of the deposition pattern may be reduced.

[0012] Therefore, a new structure of a deposition mask that can solve the above problems is required.

[0013] As a technology related to the above deposition mask, Korean Publication No. KR10-2020-0058072 (2020.05.27) is disclosed.

[0014] The embodiment provides a deposition mask having improved reliability.

[0015] The technical tasks to be achieved in the proposed embodiment are not limited to the technical tasks mentioned above, and other technical tasks not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the proposed embodiment belongs from the description below.

[0016] A deposition mask according to an embodiment comprises a support portion; and a mask portion on the support portion, wherein the support portion comprises a first layer and a second layer, a coefficient of thermal expansion of the first layer is smaller than a coefficient of thermal expansion of the second layer, a hardness of the first layer is larger than a hardness of the second layer, and the second layer comprises the same material as the mask portion.

[0017] In addition, the linear thermal expansion coefficient of the first layer is 0.3 to 0.7*10 -6 cm / cm℃, and the linear thermal expansion coefficient of the second layer is 1.4 to 2.0*10 -6 It is cm / cm℃.

[0018] In addition, the difference in linear thermal expansion coefficient between the first layer and the second layer is 1 to 1.5*10 -6 It is cm / cm℃.

[0019] Additionally, the Vickers hardness (HV) of the first layer is 1100 to 1200, and the Vickers hardness (HV) of the second layer is 100 to 200.

[0020] Additionally, the first layer includes quartz, and the second layer includes invar.

[0021] In addition, the thickness of the support portion is greater than the thickness of the mask portion, and the thickness of the support portion is 100 ㎛ to 15 mm.

[0022] Additionally, the thickness of the first layer is greater than the thickness of the second layer, and the thickness of the second layer is 1 to 2 times the thickness of the mask portion.

[0023] In addition, the mask portion includes a deposition region and a non-deposition region, the deposition region includes a plurality of effective regions, each effective region includes a first effective region and a second effective region surrounding the first effective region, a through hole is arranged on the first effective region, and a dummy through hole is arranged on the second effective region.

[0024] Additionally, the support includes a plurality of holes overlapping each effective area, the holes including a short-width area and a long-width area, the short-width area overlapping the first effective area, and the short-width area not overlapping the second effective area.

[0025] Additionally, the second layer is disposed on at least one of the lower, upper, and side portions of the first layer.

[0026] In addition, the second layer is disposed below and above the first layer, the second layer includes a 2-1 layer disposed below the first layer and a 2-2 layer disposed above the second layer, and at least one of the 2-1 layer and the 2-2 layer includes a groove.

[0027] Additionally, the home overlaps the non-deposited area.

[0028] Additionally, the non-deposited region includes a half-etched portion and an open portion, and the groove overlaps at least one of the half-etched portion and the open portion.

[0029] Additionally, the thickness of the mask portion is 5 ㎛ to 40 ㎛, and the length of the mask portion is more than 1200 mm to 2500 mm.

[0030] Additionally, the second layer is joined to a mask frame that fixes the mask portion and the support portion.

[0031] Additionally, the second layer comprises the same material as the mask frame.

[0032] Meanwhile, a deposition mask according to an embodiment includes a support portion; and a plurality of mask portions on the support portion, wherein the support portion includes invar, quartz, or a mixture thereof, and the mask portions include a first mask portion and a second mask portion, wherein the first mask portion and the second mask portion are spaced apart from each other.

[0033] In addition, the first mask portion and the second mask portion each include a deposition region and a non-deposition region, the deposition region includes a plurality of effective regions, each effective region includes a first effective region and a second effective region surrounding the first effective region, a through hole is arranged on the first effective region, and a dummy through hole is arranged on the second effective region.

[0034] In addition, the support portion includes a plurality of holes overlapping the effective area of ​​the first mask portion and the effective area of ​​the second mask portion, the holes including a short-width area and a long-width area, the short-width area overlapping the first effective area, and the short-width area not overlapping the second effective area.

[0035] A deposition mask according to an embodiment includes a support member. The support member supports the mask.

[0036] The above support includes a first layer and a second layer.

[0037] The first layer has a relatively small coefficient of thermal expansion and high rigidity. This prevents deformation and damage to the support. Consequently, the reliability of the deposition mask is enhanced. Furthermore, misalignment of the through-holes can be prevented.

[0038] The second layer comprises a material identical or similar to at least one of the mask and the mask frame. Accordingly, the support member can be easily bonded to the mask and the mask frame. Accordingly, the process efficiency and reliability of the deposition mask are improved.

[0039] The support member may include a plurality of grooves. At least one of the mask and the mask frame is bonded while filling the interior of the grooves. Accordingly, the bonding strength of the support member, the mask, and the mask frame is enhanced. Consequently, the process efficiency and reliability of the deposition mask are improved.

[0040] The support member includes a plurality of holes. The holes overlap an effective area of ​​the mask. Specifically, the holes overlap through holes of the mask. In addition, the holes do not overlap dummy through holes of the mask. Accordingly, an organic material can be prevented from passing through the dummy through holes. Accordingly, an adjacent deposition pattern can be prevented from overlapping by an organic material passing through the dummy through holes. In addition, a shadow effect of the deposition pattern can be reduced. Accordingly, the deposition efficiency of the deposition mask is improved.

[0041] FIG. 1 is a drawing illustrating the combination of a deposition mask and a frame according to an embodiment.

[0042] FIG. 2 is a cross-sectional view of an organic material deposition device including a deposition mask according to an embodiment.

[0043] FIG. 3 is a drawing illustrating a deposition pattern formed on a deposition substrate by a through hole of a deposition mask according to an embodiment.

[0044] FIG. 4 is a drawing illustrating a deposition mask being tensioned according to an embodiment.

[0045] Figure 5 is a plan view of a deposition mask according to an embodiment.

[0046] Figure 6 is a cross-sectional view taken along area AA' of Figure 5.

[0047] Fig. 7 is a plan view of a support portion of a deposition mask according to an embodiment.

[0048] Figures 8 to 11 are cross-sectional views taken along the BB' area of ​​Figure 7.

[0049] Fig. 12 is a plan view of a deposition mask according to another embodiment.

[0050] Figures 13 to 16 are cross-sectional views of a deposition mask and frame combined according to an embodiment.

[0051] FIGS. 17 to 19 are drawings illustrating various combinations of a deposition mask and a frame according to an embodiment.

[0052] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and one or more of the components between the embodiments can be selectively combined or substituted within the scope of the technical idea of ​​the present invention. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention can be interpreted as having a meaning that can be generally understood by a person having ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, can be interpreted in consideration of the contextual meaning of the related technology.

[0053] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “and (and) at least one (or more) of B, C,” it may include one or more of all combinations that can be combined with A, B, and C.

[0054] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0055] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0056] Additionally, when it is described as being formed or disposed "above or below" each component, above or below includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or disposed between the two components.

[0057] Additionally, when expressed as “upper or lower,” it can include the meaning of not only the upward direction but also the downward direction based on one component.

[0058]

[0059] A deposition mask according to an embodiment is described with reference to the drawings below.

[0060] The deposition mask described below is a fine metal mask (FMM) that can form an RGB pixel pattern on a deposition substrate by depositing organic materials such as red, green, and blue on the deposition substrate, and the description below does not apply to an open mask (OM).

[0061]

[0062] FIGS. 1 to 4 are drawings for explaining a process of depositing an organic material on a deposition substrate (300) using a deposition mask (100) according to an embodiment.

[0063] Referring to FIGS. 1 to 4, the organic material deposition device includes a deposition mask (100), a mask frame (200), a deposition substrate (300), an organic material deposition vessel (400), and a vacuum chamber (500).

[0064] The deposition mask (100) includes at least one of a metal and a non-metal. Specifically, the deposition mask (100) includes a metal and a non-metal. The deposition mask (100) will be described in detail below.

[0065] The above deposition mask (100) includes an effective portion. An organic material passes through the effective portion. The effective portion includes a plurality of through holes (TH). The through holes (TH) are formed to correspond to a pattern to be formed on the deposition substrate (300).

[0066] The mask frame (200) includes an opening (205). The through hole (TH) is positioned on an area corresponding to the opening (205). Accordingly, an organic material supplied to the organic material deposition container (400) is deposited on the deposition substrate (300). The deposition mask (100) is positioned and fixed on the mask frame (200). For example, the deposition mask (100) is fixed on the mask frame (200) by welding.

[0067] The mask frame (200) above includes a material having a low coefficient of thermal expansion. For example, the mask frame (200) includes Invar. Accordingly, the mask frame (200) can be prevented from being deformed during the welding process.

[0068] The above deposition substrate (300) is a substrate used when manufacturing a display device. For example, an OLED pixel pattern is formed on the deposition substrate (300). To form pixels, which are the three primary colors of light, organic patterns of red, green, and blue are formed on the deposition substrate (300). That is, an RGB pattern is formed on the deposition substrate (300).

[0069] The organic deposition vessel (400) is a crucible. An organic material is placed inside the crucible. The organic deposition vessel (400) moves within the vacuum chamber (500). That is, the organic deposition vessel (400) moves in one direction within the vacuum chamber (500). For example, the organic deposition vessel (400) moves in the width direction of the deposition mask (100) within the vacuum chamber (500).

[0070] A heat source and / or current is supplied to the organic material deposition container (400). As a result, the organic material is deposited on the deposition substrate (300).

[0071]

[0072] Referring to FIG. 3, the deposition mask (100) includes a first surface (1S) and a second surface (2S). In detail, the deposition mask (100) includes a mask portion (110) and a support portion (120). The mask (100) includes the first surface (1S) and the second surface (2S). The first surface (1S) and the second surface (2S) are surfaces that are opposite to each other.

[0073] The first surface (1S) includes a small hole (V1). The second surface (2S) includes a facing hole (V2). For example, a plurality of small holes (V1) and a plurality of facing holes (V2) are formed on the first surface (1S) and the second surface (2S), respectively.

[0074] In addition, the deposition mask (100) includes a through hole (TH). The through hole (TH) is formed by a connecting portion (CA) connecting the boundaries of the small-surface hole (V1) and the large-surface hole (V2).

[0075] The width of the above-mentioned facing hole (V2) is greater than the width of the above-mentioned small-surface hole (V1). The width of the above-mentioned small-surface hole (V1) is measured at the first surface (1S). The width of the above-mentioned facing hole (V2) is measured at the second surface (2S).

[0076] In addition, the width of the connection portion (CA) has a set size. In detail, the width of the connection portion (CA) may be 15 μm to 33 μm. In more detail, the width of the connection portion (CA) may be 19 μm to 33 μm. In more detail, the width of the connection portion (CA) may be 20 μm to 27 μm. If the width of the connection portion (CA) exceeds 33 μm, it is difficult to implement a resolution of 500 PPI or higher. In addition, if the width of the connection portion (CA) is less than 15 μm, defects may occur during the deposition process.

[0077] The above-mentioned small hole (V1) faces the deposition substrate (300). The above-mentioned small hole (V1) is positioned close to the deposition substrate (300). Accordingly, the above-mentioned small hole (V1) has a shape corresponding to the deposition pattern (DP).

[0078] The above-mentioned facing hole (V2) faces the organic material deposition container (400). Accordingly, the organic material supplied from the organic material deposition container (400) can be accommodated in a wide width by the facing hole (V2). In addition, a fine pattern can be quickly formed on the deposition substrate (300) through the small-faced hole (V1).

[0079] Accordingly, the organic material received by the above-mentioned surface hole (V1) is deposited on the deposition substrate (300) by the above-mentioned small surface hole (V1). Accordingly, one of the red, green, or blue pixel patterns is formed on the deposition substrate (300). Subsequently, the above-mentioned process is repeated. Accordingly, all of the red, green, or blue pixel patterns are formed on the deposition substrate (300).

[0080] Referring to FIG. 4, the deposition mask (100) is tensioned in one direction to be fixed to the mask frame. In detail, the deposition mask (100) is tensioned in the longitudinal direction.

[0081] The aperture area of ​​the deposition mask (100) varies from region to region. Accordingly, the magnitude of the tensile force applied to each region may vary. Accordingly, the tensile length of the deposition mask (100) may vary from region to region.

[0082] Additionally, the alignment of the through-holes may be misaligned due to the stress generated by the above-mentioned tension. As the deposition mask expands in size, the misalignment may increase. Consequently, the quality of the deposition pattern deposited using the deposition mask may deteriorate.

[0083] Below, a deposition mask that can solve the above problems is described.

[0084]

[0085] Referring to FIGS. 5 and 6, the deposition mask (100) may include a plurality of layers. In detail, the deposition mask (100) includes a mask portion (110) and a support portion (120).

[0086] The above mask (100) is placed on a support (120). In detail, the mask (100) and the support (120) are joined.

[0087] The mask portion (110) comprises a metal. Specifically, the mask portion (110) comprises a metal having a low coefficient of thermal expansion. For example, the mask portion (110) may comprise an iron-nickel alloy. For example, the mask portion (110) may comprise Invar.

[0088] The above mask portion (110) includes a deposition area (DA) and a non-deposition area (NDA).

[0089] The above deposition area (DA) is an area for forming a deposition pattern. The deposition area (DA) can be defined as an area from the point where the through hole first begins to the point where it ends in the longitudinal direction of the mask (100).

[0090] The above deposition area (DA) includes an effective area (AA) and an ineffective area (UA). The effective area (AA) is an area where a through hole (TH) and an island portion (IS) are formed. The ineffective area (UA) is an area where the through hole (TH) and the island portion (IS) are not formed. The island portion (IS) is an area where the mask portion (110) is not etched.

[0091] In addition, the deposition area (DA) includes a plurality of effective areas (AA). The effective areas (AA) include a first effective area (AA1) and a second effective area (AA2). The second effective area (AA) is arranged to surround the first effective area (AA1). The area of ​​the first effective area (AA1) is larger than the area of ​​the second effective area (AA2).

[0092] A plurality of through holes (TH) are arranged in the first effective area (AA1). A plurality of dummy through holes (DTH) are arranged in the second effective area (AA2).

[0093] The organic material passes through the first effective area (AA1). In addition, the organic material does not pass through the second effective area (AA2). Specifically, the organic material does not move in the direction of the dummy through hole (TH). Therefore, the organic material passes through the through hole (TH) and is deposited on the deposition substrate (300).

[0094] The uniformity of the above-mentioned through hole (TH) can be improved by the above-mentioned dummy through hole (DTH). In addition, the stress difference between the first effective area (AA1) and the non-effective area (UA) can be reduced by the above-mentioned second effective area (AA2). Accordingly, cracks can be prevented from occurring in the effective area (AA) and the non-effective area (UA).

[0095] The above deposition area (DA) includes a plurality of separation areas (IA1, IA2). The separation areas (IA1, IA2) are arranged between adjacent effective areas. The plurality of effective areas are separated by the separation areas (IA1, IA2).

[0096] The above non-deposition area (NDA) is an area that does not participate in deposition. The non-deposition area (NDA) may include a half-etched portion (HF) and an open portion. The half-etched portion (HF) can disperse stress generated when the mask portion (110) is tensioned. In addition, the open portion is an area where a clamp is fixed to tension the mask portion (110). Accordingly, wave deformation of the mask portion (110) can be reduced.

[0097] The above mask portion (110) may have a set thickness. In detail, the thickness (T1) of the mask portion (110) may be 5 µm to 40 µm, 10 µm to 30 µm, or 15 µm to 25 µm.

[0098] The mask portion (110) may have a set length. In detail, the length (L1) of the mask portion (110) may be greater than 1200 mm. More specifically, the length of the mask portion (110) may be greater than 1200 mm to 2500 mm, 1500 mm to 2000 mm, or 1700 mm to 1900 mm.

[0099] The length (L1) of the mask portion (110) may be less than or equal to the length (L2) of the support portion (120). For example, the length (L1) of the mask portion (110) may be less than the length (L2) of the support portion (120).

[0100] When the length of the mask portion (110) is 1200 mm or less, the tensioning process can be controlled to prevent the alignment of the through holes from being misaligned. However, when the length of the mask portion (110) exceeds 1200 mm, the alignment of the through holes may be misaligned during the tensioning process.

[0101] To solve this, the deposition mask (100) includes a support member (120). The support member (120) supports the mask member (110).

[0102] The support member (120) includes a plurality of holes (H). The holes (H) have a short width and a long width. The organic material moves from the long width to the short width direction. Accordingly, the organic material can easily move to the effective area (AA) of the mask (100).

[0103] The above hole (H) may be positioned in an area overlapping the effective area (AA). Specifically, the hole (H) may be positioned in an area overlapping the first effective area (AA1). More specifically, the short width area of ​​the hole may be positioned in an area overlapping the first effective area (AA1).

[0104] Additionally, the hole (H) may be positioned in an area that does not overlap with the second effective area (AA2). In detail, the short width area of ​​the hole may be positioned in an area that does not overlap with the second effective area (AA2).

[0105] Accordingly, the short width area of ​​the hole (H) may overlap with the through hole (TH) and may not overlap with the dummy through hole (DTH). Accordingly, the organic material may be deposited on the deposition substrate (300) by sequentially passing through the hole (H) and the through hole (TH).

[0106]

[0107] Referring to FIGS. 7 to 11, the support member (120) may include a plurality of layers. Specifically, the support member (120) may include a first layer (121) and a second layer (122).

[0108] The second layer (122) can be placed in various positions depending on the bonding position of the mask frame (200).

[0109] Referring to Fig. 8, the second layer (122) may include a second-first layer (122a) and a second-second layer (122b). The second-first layer (122a) is disposed on the lower surface of the first layer (121). The second-second layer (122b) is disposed on the upper surface of the first layer (121).

[0110] Accordingly, the 2-1 layer (122a) can be bonded to the mask frame (200), and the 2-2 layer (122b) can be bonded to the mask portion (110).

[0111] Referring to Fig. 9, the second layer (122) can be placed on the side and upper surfaces of the first layer (121). Accordingly, the upper second layer (122) can be bonded to the mask portion (110), and the side second layer (122) can be bonded to the mask frame (200).

[0112] The above 2-1 layer (122a) can be bonded to the mask frame (200), and the above 2-2 layer (122b) can be bonded to the mask portion (110).

[0113] Referring to Fig. 10, the second layer (122) may be disposed on the lower surface, upper surface, and side surface of the first layer (121). In detail, the second layer (122) may be disposed to surround the outer surface of the first layer (121).

[0114] Accordingly, the upper second layer (122) can be bonded to the mask portion (110), and the lower and side second layers (122) can be bonded to the mask frame (200).

[0115]

[0116] The first layer (121) and the second layer (122) may comprise different materials. Specifically, the coefficients of thermal expansion of the first layer (121) and the second layer (122) may be different. Alternatively, the hardness of the first layer (121) and the second layer (122) may be different.

[0117] For example, the linear thermal expansion coefficient of the first layer (121) may be smaller than the linear thermal expansion coefficient of the second layer (122). For example, the linear thermal expansion coefficient of the first layer (121) may be 0.3 to 0.7*10 -6 It can be cm / cm℃. In addition, the linear thermal expansion coefficient of the second layer (122) is 1.4 to 2.0*10 -6 cm / cm℃. In addition, the difference in linear thermal expansion coefficients of the first layer (121) and the second layer (122) is 2*10 -6 It may be less than cm / cm℃. In detail, the difference in linear thermal expansion coefficients of the first layer (121) and the second layer (122) is 1 to 1.5*10 -6 It can be cm / cm℃.

[0118] The hardness of the first layer (121) may be greater than the hardness of the second layer (122). For example, the Vickers hardness (HV) of the first layer (121) may be 1100 to 1200. In addition, the Vickers hardness (HV) of the second layer (122) may be 100 to 200. In addition, the difference in Vickers hardness between the first layer (121) and the second layer (122) may be 1000 or less. In detail, the difference in Vickers hardness between the first layer (121) and the second layer (122) may be 800 to 1000.

[0119] The first layer (121) may include a different material from the mask portion (110). In addition, the second layer (122) may include the same or similar material as the mask portion (110). For example, the first layer (121) may include quartz. In addition, the second layer (122) may include invar.

[0120] The first layer (110) has a small coefficient of thermal expansion and high hardness. Therefore, the support member (120) can be reduced in deformation due to temperature changes. Accordingly, the alignment of the through-holes of the mask member (110) can be prevented from being misaligned due to deformation of the support member (120).

[0121] In addition, the support member (120) may have enhanced rigidity. Accordingly, damage to the support member (120) due to external impact can be prevented. Furthermore, impact can be prevented from being transmitted to the mask member (110) through the support member (120). Accordingly, the reliability of the deposition mask can be improved.

[0122] The second layer (120) has a relatively large coefficient of thermal expansion and a small hardness. However, the second layer (120) includes a material identical or similar to that of the mask portion (110) and the mask frame (200). Therefore, the support portion (120) can be easily bonded to the mask portion (110) and the mask frame (200) by the second layer (122).

[0123] The first layer (121) includes a different material from the mask portion (110) and the mask frame (200). Accordingly, the bonding strength between the first layer (121) and the mask portion (110) may be reduced. In addition, the bonding strength between the first layer (121) and the mask frame (200) may be reduced.

[0124] In addition, when a separate bonding layer is disposed in the area between the first layer (121) and the mask portion (110) and the area between the first layer (121) and the mask frame (200), the thickness and weight of the deposition mask (100) may increase. In addition, the shape of the support portion (120) may change due to a difference in thermal expansion coefficients between the bonding layer and the support portion (120).

[0125] Accordingly, a second layer (122) is placed on the first layer (121). The second layer (122) includes a material identical to or similar to at least one of the mask portion (110) and the mask frame (200).

[0126] Accordingly, the bonding strength of the mask portion (110) and the support portion (120) can be improved. In addition, the bonding strength of the mask frame (200) and the support portion (120) can be improved. In addition, the difference in the coefficients of thermal expansion between the first layer (121) and the second layer (122) has a set q range. That is, the difference in the coefficients of thermal expansion between the first layer (121) and the second layer (122) is small. Therefore, it is possible to prevent the shape of the deposition mask from being deformed due to the difference in the coefficients of thermal expansion between the first layer (121) and the second layer (122).

[0127]

[0128] The thickness (T2) of the support portion (120) may be different from the thickness (T1) of the mask portion (110). In detail, the thickness (T2) of the support portion (120) may be greater than the thickness (T1) of the mask portion (110). The thickness (T2) of the support portion (120) may be 20 times or more the thickness (T1) of the mask portion (110). For example, the thickness (T2) of the support portion (120) may be 100 ㎛ to 15 mm, 500 ㎛ to 10 mm, 1 mm to 8 mm, or 3 mm to 6 mm.

[0129] If the thickness (T2) of the support member (120) is less than 100 ㎛, the mask member (110) cannot be sufficiently supported on the support member (120). In addition, the support member (120) may be damaged by external impact. If the thickness (T2) of the support member (120) exceeds 15 ㎜, the overall thickness and weight of the deposition mask (100) increase. Accordingly, handling of the deposition mask may become difficult, which may reduce process efficiency. In addition, the thickness of the mask frame (200) may also increase.

[0130] The thicknesses of the first layer (121) and the second layer (122) may be different. In detail, the thickness (T2-1) of the first layer (121) may be greater than the thickness (T2-2) of the second layer (122).

[0131] The thickness (T2-2) of the second layer (122) may be greater than or equal to the thickness (T1) of the mask portion (110). Alternatively, the thickness (T2-2) of the second layer (122) may be greater than or equal to the thickness of the mask frame (200). For example, the thickness (T2-2) of the second layer (122) may be 1 to 2 times the thickness (T1) of the mask portion (110). Alternatively, the thickness (T2-2) of the second layer (122) may be 1 to 2 times the thickness of the mask frame (200).

[0132] If the thickness (T2-2) of the second layer (122) is less than the thickness of the mask portion (110) or the mask frame (200), a bonding defect of the second layer (122) may occur. Specifically, if the thickness (T2-2) of the second layer (122) becomes small, the first layer (121) may be exposed during the bonding process. Accordingly, the bonding strength of the support portion (120), the mask portion (110), and the mask frame (200) may decrease. Accordingly, the reliability of the deposition mask may decrease.

[0133]

[0134] Referring to Fig. 11, the support member (120) may include at least one groove (G). For example, the support member (120) may include a plurality of grooves (G).

[0135] The above groove (G) is formed on the second layer (122). For example, the groove (G) may be formed on at least one of the second-1 layer (122a) and the second-2 layer (122b).

[0136] The groove (G) may be arranged at two edge areas of the support portion (120). In detail, the grooves (G) may face each other in the longitudinal direction of the support portion (120). The bonding strength between the second layer (122) and the mask portion (110) or the bonding strength between the second layer (122) and the mask frame (200) may be improved by the groove (G).

[0137] The second layer (122) is joined to the mask portion (110) and the mask frame (200) by welding. That is, the second layer (122), the mask portion (110), and the mask frame (200) are partially melted and joined. The melted material of the mask portion (110) and the mask frame (200) can be joined while filling the inside of the groove (G). Therefore, since the mask portion (110) and the mask frame (200) are fixed by the groove (G), the joining force of the second layer (122), the mask portion (110), and the mask frame (200) can be improved.

[0138] The groove (G) does not overlap with the deposition area (DA) of the mask portion (110). The groove (G) may overlap with the non-deposition area (NDA) of the mask portion (110). The groove (G) may overlap with the half-etched portion (HF). Alternatively, the groove (G) may overlap with the open portion.

[0139] Accordingly, the groove (G) can be an alignment mark. For example, the groove (G) and the half-etched portion (HF) can be aligned. Alternatively, the groove (G) and the open portion can be aligned. In addition, the groove (G) and the alignment mark of the mask frame (200) can be aligned.

[0140] Accordingly, the alignment of the support portion (120), the mask portion (110), and the mask frame (200) can be improved. In addition, the process of forming a separate alignment mark on the support portion (120) can be omitted.

[0141]

[0142] Fig. 12 is a plan view of a deposition mask according to another embodiment.

[0143] Referring to FIG. 12, a deposition mask according to another embodiment includes a plurality of mask portions. In detail, a first mask portion (111) and a second mask portion (112) are arranged on the support portion (120).

[0144] The first mask portion (111) and the second mask portion (112) are placed on the same support portion (120). That is, the first mask portion (111) and the second mask portion (112) are placed on one support portion (120).

[0145] In Fig. 12, two mask portions are arranged on a single support. However, the embodiment is not limited thereto. In detail, three or more mask portions may be arranged on a single support.

[0146] The first mask portion (111) and the second mask portion (112) are spaced apart from each other on the support portion (120).

[0147] The above support (120) may include a single layer or multiple layers.

[0148] For example, the support member (120) may include a plurality of layers. Specifically, the support member (120) may include the first layer (121) and the second layer (122) in the same manner as in the embodiment described above.

[0149] Alternatively, the support (120) may include one layer. In detail, the support (120) may include only the first layer (121).

[0150] The support (120) may include quartz or invar. Alternatively, the support (120) may include a mixture of quartz and invar.

[0151] The first mask portion (111) and the second mask portion (112) are fixed by the support portion (120). Accordingly, when the first mask portion (111) and the second mask portion (112) are attached to the mask frame (200), the positions of the effective area (AA) and the uneffective area (UA) can be prevented from being misaligned.

[0152] In addition, since multiple mask portions are arranged on a single support member (120), the area of ​​the non-effective area and non-deposited area of ​​the mask portion can be reduced. Accordingly, more mask portions can be arranged on a mask frame of the same size. In other words, more effective areas can be arranged on a mask frame of the same size.

[0153] The support member includes a plurality of holes. Specifically, the support member includes a plurality of holes corresponding to the effective areas of the first mask member (111) and the second mask member (112).

[0154]

[0155] Referring to FIGS. 13 to 16, the deposition mask (100) is bonded to the frame (300).

[0156] Referring to FIG. 13, the mask portion (110) and the mask frame (200) are placed on the support portion (120) and joined.

[0157] In detail, the mask portion (110) and the second-second layer (122b) are fixed by welding. The mask portion (110) and the second-second layer (122b) are easily joined because they contain the same or similar materials.

[0158] In addition, the mask frame (200) and the second-first layer (122a) are fixed by welding. The mask frame (200) and the second-first layer (122a) are easily joined because they contain the same or similar materials.

[0159] Referring to Fig. 14, the mask portion (110) is placed on and bonded to the support portion (120).

[0160] In detail, the mask portion (110) and the upper second layer (122) are fixed by welding. The mask portion (110) and the second layer (122) are easily joined because they contain the same or similar materials.

[0161] In addition, the mask frame (200) and the second layer (122) of the side are fixed by welding. The mask frame (200) and the second layer (122) are easily joined because they contain the same or similar materials.

[0162] Referring to Fig. 15, the mask portion (110) is placed on and bonded to the support portion (120).

[0163] In detail, the mask portion (110) and the upper second layer (122) are fixed by welding. The mask portion (110) and the second layer (122) are easily joined because they contain the same or similar materials.

[0164] In addition, the mask frame (200) and the second layer (122) on the side and bottom are fixed by welding. The mask frame (200) and the second layer (122) are easily joined because they contain the same or similar materials.

[0165] Referring to Fig. 16, the mask portion (110) and the mask frame (200) are placed on the support portion (120) and joined.

[0166] In detail, the mask portion (110) and the second-second layer (122b) are fixed by welding. Since the mask portion (110) and the second-second layer (122b) contain the same or similar materials, they are easily joined. In addition, a portion of the mask portion (110) is inserted into the groove (G). Therefore, the bonding strength between the mask portion (110) and the support portion (120) is improved.

[0167] In addition, the mask frame (200) and the second-first layer (122a) are fixed by welding. Since the mask frame (200) and the second-first layer (122a) contain the same or similar materials, they are easily joined. In addition, a portion of the mask frame (200) is inserted into the groove (G). Therefore, the joining strength between the mask frame (200) and the support member (120) is improved.

[0168]

[0169] A deposition mask according to an embodiment includes a support member. The support member supports the mask.

[0170] The above support includes a first layer and a second layer.

[0171] The first layer has a relatively small coefficient of thermal expansion and high rigidity. This prevents deformation and damage to the support. Consequently, the reliability of the deposition mask is enhanced. Furthermore, misalignment of the through-holes can be prevented.

[0172] The second layer comprises a material identical or similar to at least one of the mask and the mask frame. Accordingly, the support member can be easily bonded to the mask and the mask frame. Accordingly, the process efficiency and reliability of the deposition mask are improved.

[0173] The support member may include a plurality of grooves. At least one of the mask and the mask frame is bonded while filling the interior of the grooves. Accordingly, the bonding strength of the support member, the mask, and the mask frame is enhanced. Consequently, the process efficiency and reliability of the deposition mask are improved.

[0174] The support member includes a plurality of holes. The holes overlap an effective area of ​​the mask. Specifically, the holes overlap through holes of the mask. In addition, the holes do not overlap dummy through holes of the mask. Accordingly, an organic material can be prevented from passing through the dummy through holes. Accordingly, an adjacent deposition pattern can be prevented from overlapping by an organic material passing through the dummy through holes. In addition, a shadow effect of the deposition pattern can be reduced. Accordingly, the deposition efficiency of the deposition mask is improved.

[0175]

[0176] FIGS. 17 to 19 are drawings illustrating various combinations of a deposition mask and a frame according to an embodiment.

[0177] Referring to Fig. 17, the deposition mask (100) has a stick shape. In addition, a plurality of deposition masks may be combined with the mask frame (300). The plurality of deposition masks (100) may be arranged spaced apart from each other or in contact with each other. Each deposition mask (100) includes a plurality of effective areas (AA).

[0178] Therefore, multiple pixel patterns for the same electronic components can be formed using the above deposition mask.

[0179] The description of the deposition mask described above can be applied to the deposition mask of FIG. 16. However, the embodiment is not limited thereto.

[0180] Referring to FIG. 18, the deposition mask (100) includes a plurality of effective areas (AA). The plurality of effective areas (AA) may be arranged in a plurality of rows (horizontal) and a plurality of columns (vertical). Accordingly, the number of deposition masks bonded to the mask frame (300) is reduced. Accordingly, the efficiency of the deposition process is improved. In addition, the deposition mask may be used to form a plurality of pixel patterns for the same electronic components.

[0181] Referring to FIG. 19, a deposition mask (100) is bonded to the mask frame (300). The deposition mask (100) includes a plurality of effective areas (AA). The plurality of effective areas (AA) may be arranged in a plurality of rows (horizontal) and a plurality of columns (vertical). Accordingly, the number of deposition masks bonded to the mask frame is reduced. Accordingly, the efficiency of the deposition process is improved.

[0182] In addition, the effective areas (AA) may be defined as a plurality of unit areas (UN). The unit areas (UN) may include different through holes. Different mask portions (110) may be arranged in each of the unit areas (UN). Accordingly, the deposition mask (100) may have a plurality of mask portions (110) arranged on a single support portion (120).

[0183] Therefore, multiple pixel patterns for different electronic components can be formed using the above deposition mask.

[0184]

[0185] The features, structures, effects, etc. described in the above-described embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by those skilled in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be construed as being included within the scope of the present invention.

[0186] In addition, although the above description focuses on embodiments, these are merely examples and do not limit the present invention. Those skilled in the art to which the present invention pertains will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present embodiment. For example, each component specifically shown in the embodiments can be modified and implemented. In addition, differences related to such modifications and applications should be interpreted as being included within the scope of the present invention defined in the appended claims.

Claims

1. Support; and Including a mask portion on the above support portion, The above support comprises a first layer and a second layer, The coefficient of thermal expansion of the first layer is smaller than the coefficient of thermal expansion of the second layer, The hardness of the first layer is greater than the hardness of the second layer, The second layer is a deposition mask comprising the same material as the mask portion.

2. In paragraph 1, The linear thermal expansion coefficient of the first layer is 0.3 to 0.7*10 -6 cm / cm℃, The linear thermal expansion coefficient of the second layer is 1.4 to 2.0*10 -6 Deposition mask of cm / cm℃.

3. In paragraph 1, The difference in linear thermal expansion coefficient between the first layer and the second layer is 1 to 1.5*10 -6 Deposition mask of cm / cm℃.

4. In paragraph 1, The Vickers hardness (HV) of the first layer is 1100 to 1200, A deposition mask having a Vickers hardness (HV) of 100 to 200 of the second layer.

5. In paragraph 1, The first layer comprises quartz, The second layer is a deposition mask including Invar.

6. In paragraph 1, The thickness of the above support part is greater than the thickness of the above mask part, A deposition mask having a thickness of the support portion of 100㎛ to 15㎜.

7. In paragraph 1, The thickness of the first layer is greater than the thickness of the second layer, A deposition mask in which the thickness of the second layer is 1 to 2 times the thickness of the mask portion.

8. In paragraph 1, The above mask portion includes a deposition area and a non-deposition area, The above deposition area includes a plurality of effective areas, Each valid area includes a first valid area and a second valid area surrounding the first valid area, A through hole is arranged on the first effective area, A deposition mask having a dummy through hole arranged on the second effective area.

9. In paragraph 8, The support member includes a plurality of holes each overlapping with an effective area, The above hole includes a short width area and a long width area, The above short-range area overlaps with the first effective area, A deposition mask in which the above-mentioned single-width area does not overlap with the above-mentioned second effective area.

10. In paragraph 8, The second layer is a deposition mask disposed on at least one of the lower, upper, and side portions of the first layer.

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