Suction plate, cutting device, and method for manufacturing electronic component

Abstract

The present invention provides a suction plate with which it is possible to form a half-cut groove with high accuracy.　Provided is a suction plate for holding an object to be cut having a substrate and a resin layer, the suction plate including: a base member that includes a base part which is disposed on a base that is provided with a suction mechanism, and a projection part which is formed so as to protrude upward from the base part and has a suction surface that is capable of sucking the resin layer; and a frame-like member that is disposed so as to surround the periphery of the projection part and has a mounting surface which is formed so as to be positioned above the suction surface, and on which the substrate can be mounted. At least one of the base member and the frame-like member is provided with a discharge passage through which foreign substances in a specified space that is defined by the projection part and the frame-like member can be discharged to the outside of the specified space.

Description

Suction plate, cutting device, and method for manufacturing electronic components

[0001] The present invention relates to a technique for a suction plate, a cutting device, and a method for manufacturing electronic components.

[0002] Patent Document 1 discloses a cutting device that uses a blade to perform half cuts and full cuts on a workpiece placed on a table. The cutting device described in Patent Document 1 can correct the height position of the blade based on the amount of blade wear. By correcting the height position of the blade in this way, it is possible to reduce variations in the depth of half-cut grooves formed in the workpiece.

[0003] Japanese Patent Application Laid-Open No. 2022-151243

[0004] Here, since high dimensional accuracy is generally required for half-cut grooves, there is a demand for technology that can form half-cut grooves with higher accuracy.

[0005] The present invention was made in consideration of the above-mentioned circumstances, and the problem it aims to solve is to provide a suction plate, a cutting device, and a method for manufacturing electronic components that are capable of forming half-cut grooves with high precision.

[0006] The problem that the present invention aims to solve is as described above, and in order to solve this problem, the suction plate of the present invention is an suction plate that holds a cutting object having a substrate and a resin layer, and comprises: a base member that has a base that is placed on a base provided with a suction mechanism, and a protrusion that is formed to protrude upward from the base and has an suction surface that can suction the resin layer; and a frame-shaped member that is arranged to surround the periphery of the protrusion and has a mounting surface that is formed to be positioned above the suction surface and on which the substrate can be placed, and at least one of the base member and the frame-shaped member has an exhaust passage that can exhaust foreign matter within a defined space defined by the protrusion and the frame-shaped member to outside the defined space.

[0007] The cutting device according to the present invention includes the suction plate and the base on which the suction mechanism is provided.

[0008] In addition, the method for manufacturing electronic components according to the present invention includes a half-cut process in which a half cut is made on the object to be cut using the cutting device, and a full-cut process in which a full cut is made on the object to be cut that has been half-cut in the half-cut process using the cutting device.

[0009] According to the present invention, half-cut grooves can be formed with high precision.

[0010] 10 。 (a) A bottom view showing a package substrate. (b) A side view showing a package substrate. A perspective view showing a semiconductor package on which a step portion is formed. A plan view schematically showing the configuration of a cutting device. A side view schematically showing the configuration of the cutting device. A block diagram showing the electrical connection relationship of the cutting device. A side cross-sectional view showing the configuration of a table. (a) A plan view schematically showing half-cut grooves formed in a package substrate. (b) A side view schematically showing half-cut grooves formed in a package substrate. A flowchart showing the half-cut procedure. An exploded perspective view showing a suction plate. A plan view showing a suction plate. A plan view showing a base portion. (a) A diagram schematically showing the X1-X1 cross section in FIG. 10. (b) A diagram schematically showing the X2-X2 cross section in FIG. 10. A perspective view showing a path through which foreign matter is discharged in the suction plate. A bottom view showing a base portion. (a) A plan view showing a suction plate on which a chamfered portion is formed. (b) A plan view showing a suction plate according to a first modified example. FIG. 10 is a plan view showing a suction plate according to a second modified example.

[0011] In the following description, the explanation will be given according to the directions indicated by the arrows in the drawings. For the sake of convenience, the drawings used in the following description are drawn in a schematic manner with shapes and numbers appropriately omitted or exaggerated.

[0012] <Configuration of Package Substrate 70> First, the package substrate 70 will be described below as an example of an object to be cut by the cutting device 1.

[0013] The package substrate 70 shown in FIG. 1 is, for example, a wettable flank QFN (Quad Flat Non-leaded) package substrate. The package substrate 70 includes a substrate 71 formed of a metal such as a copper plate, and a rectangular resin layer 72 that seals one surface of the substrate 71 with resin. A lead frame, a printed wiring board, or the like can be used as the substrate 71. In this embodiment, as an example, a lead frame is used as the substrate 71. Note that, hereinafter, of the two surfaces of the substrate 71, the surface on which the resin layer 72 is formed will be referred to as the first surface, and the surface opposite the first surface will be referred to as the second surface.

[0014] Semiconductor chip mounting portions (die pads) (not shown) are arranged in a matrix on the first surface of the substrate 71. Electronic elements 73, such as semiconductor chips, resistor elements, and capacitor elements, are fixed to the die pads. The substrate 71 is formed of a metal such as copper (Cu) or 42 alloy (Fe—Ni) and is conductive. A lead-free metal plating layer or a lead-free solder plating layer (not shown) may be pre-formed on the surface of the substrate 71. Numerous leads serving as terminals for connection to the outside are arranged around each die pad. These numerous leads are each connected to tie bars, which are metal frames arranged in a grid pattern on the substrate 71. Multiple electrodes (not shown) provided on each electronic element 73 are electrically connected to the respective leads arranged around the die pad via bonding wires made of gold or copper wire.

[0015] The substrate 71 of this embodiment has a rectangular used area 71a and a non-used area 71b surrounding the used area 71a. The non-used area 71b includes the outer edge of the substrate 71 and is not used as a product and is later removed. On the other hand, the used area 71a is used as a product and includes the die pad, leads, and tie bars of the lead frame described above. The resin layer 72 is molded in a rectangular shape to cover the used area 71a of the substrate 71 and a portion of the non-used area 71b outside the used area 71a. In other words, the electronic element 73 and bonding wires arranged in the used area 71a are sealed by the resin layer 72. By forming the resin layer 72, a step is formed between the first surface of the substrate 71 and the end face of the resin layer 72 (the lower surface in FIG. 1B ) by the thickness of the resin layer 72.

[0016] In addition to the above-mentioned examples, the substrate 71 constituting the package substrate 70 may be a semiconductor substrate, a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, or the like. If the substrate is not made of metal and is not conductive, it is sufficient that the portion of the substrate that comes into contact with the frame member 150 of the suction plate 100 (the outer periphery described below) is configured to be conductive. Furthermore, the substrate 71 constituting the package substrate 70 may or may not be provided with wiring.

[0017] By performing half cuts and full cuts on the package substrate 70 shown in Fig. 1, a semiconductor package (electronic component) 80 as shown in Fig. 2 is manufactured. Note that a specific method for performing half cuts and full cuts on the package substrate 70 will be described later.

[0018] The semiconductor package 80 shown in FIG. 2 has a step 81 formed at the boundary between the top surface (the surface on which the terminals 82 are formed) and the side surface. When the semiconductor package 80 is surface-mounted, the solder penetrates into the step 81. This allows a fillet-like solder connection structure to be realized for the semiconductor package 80, ensuring reliable connection. Furthermore, because the solder penetrates into the step 81 and forms a fillet, the solder connection state can be easily observed from the side surface of the semiconductor package 80 during visual inspection after mounting. As such, the semiconductor package 80 has various advantages. A method for forming the step 81 will be described later.

[0019] <Configuration of Cutting Device> Next, the configuration of the cutting device 1 will be described with reference to FIGS. 3 to 5. FIG.

[0020] The cutting apparatus 1 cuts the package substrate 70 to produce a plurality of semiconductor packages 80, which are cut products. In this embodiment, "cutting" includes separating the object to be cut into a plurality of individual cut products and removing a portion of the object to be cut. Hereinafter, cutting that separates the object to be cut into a plurality of individual cut products will be referred to as a "full cut," and cutting that removes a portion of the object in the thickness direction without separating it will be referred to as a "half cut." The cutting apparatus 1 mainly includes a cutting unit 10, a holding unit 20, a detection unit 30, a control unit 40, etc.

[0021] 3 and 4 is for cutting the package substrate 70. The cutting unit 10 mainly includes a blade 11 and a spindle unit 12. The cutting device 1 may have a twin-spindle configuration including a pair of spindle units 12, or a single-spindle configuration including only one spindle unit 12.

[0022] The blade 11 is an annular blade and is detachably attached to the tip of the spindle 12. The blade 11 can rotate around the X axis.

[0023] The spindle 12 supports the blade 11 and rotates the blade 11. The spindle 12 is disposed to extend in the X-axis direction. The spindle 12 can be moved along the X-axis and Z-axis in FIGS. 3 and 4 by a movement mechanism (not shown). The movement of the spindle 12 (the operation of the movement mechanism) is controlled by a control unit 40, which will be described later. Note that, hereinafter, the Z-axis direction in FIGS. 3 and 4 may also be referred to as the height direction of the spindle 12 and the blade 11.

[0024] The blade 11 attached to the spindle 12 rotates at high speed by receiving rotation from the spindle 12, thereby performing half cuts and full cuts on the package substrate 70. Hereinafter, the blade for half cuts will be referred to as the first blade 11A, and the blade for full cuts will be referred to as the second blade 11B, and the first blade 11A and the second blade 11B will be collectively referred to as the blade 11. The first blade 11A has a first thickness, and the second blade 11B has a second thickness that is smaller than the first thickness. In other words, the thickness of the second blade 11B is thinner than the thickness of the first blade 11A. In this embodiment, either the first blade 11A or the second blade 11B is attached to the spindle 12, and cutting is performed.

[0025] The first blade 11A is made of a conductive material. When attached to the spindle 12, the first blade 11A is electrically connected to the spindle 12. The spindle 12 is electrically connected to a detection circuit 32, which will be described later.

[0026] When half-cutting the package substrate 70, the first blade 11A moves relative to the table 50 (described later), thereby cutting the package substrate 70. Specifically, a portion of the package substrate 70 is removed in the thickness direction. By performing half-cuts along the longitudinal and lateral directions on the package substrate 70, a half-cut groove G1 extending in the longitudinal direction of the package substrate 70 and a half-cut groove G2 extending in the lateral direction of the package substrate 70 are formed (see FIG. 7A). On the other hand, when full-cutting the package substrate 70, the second blade 11B moves relative to the table 50, thereby cutting the package substrate 70 along the groove pattern. As a result, the portions of the half-cut grooves G1 and G2 are separated, and the package substrate 70 is divided into a plurality of separate semiconductor packages 80 (see FIG. 2).

[0027] 3 and 4 holds the package substrate 70. The holding unit 20 mainly includes a table 50 and a moving mechanism 60. The cutting device 1 may have a twin-cut table configuration including two holding units 20, one holding unit 20, or three or more holding units 20.

[0028] The table 50 shown in FIG. 6 mainly comprises a base 51, a suction plate 100, a suction mechanism 52, and the like.

[0029] The suction plate 100 is fixed to the base 51. The base 51 has a first portion 51a that contacts the lower surface of the suction plate 100, and a second portion 51c that is fixed to the lower surface of the first portion 51a via an insulating layer 51b. The first portion 51a and the second portion 51c are made of a conductive material such as stainless steel.

[0030] An air passage 51d is formed in the first portion 51a, and the air passage 51d is connected to a recess 161 of the suction plate 100, which will be described later. The air passage 51d is formed to penetrate from the top surface to the bottom surface of the first portion 51a. A through-hole 51e is formed in the second portion 51c, and the through-hole 51e is connected to the air passage 51d of the first portion 51a. A pipe 52a of the suction mechanism 52, which will be described later, is arranged in the through-hole 51e.

[0031] The suction plate 100 mainly includes a base member 110 and a frame-shaped member 150 .

[0032] The base member 110 includes a plate-like portion 111 formed in a rectangular plate shape and a protruding portion 112 protruding upward from the plate-like portion 111. The plate-like portion 111 is one embodiment of a base according to the present invention. The plate-like portion 111 is formed to have a greater vertical thickness than the protruding portion 112. The upper surface of the protruding portion 112 forms an adsorption surface 112a capable of adsorbing the resin layer 72 of the package substrate 70. As shown in the enlarged view of FIG. 6 , a thin resin film 113 is provided on the adsorption surface 112a. For ease of explanation, the resin film 113 is not shown in other figures. The resin film 113 is not necessarily provided; it may be omitted or another member (e.g., a flexible plate-like member) may be provided instead.

[0033] A recess 114 is formed in the bottom surface of the base member 110. The recess 114 is formed in roughly the same shape as the suction surface 112a when viewed from the bottom. A plurality of suction holes 115 are also formed in the base member 110. The suction holes 115 are formed so as to penetrate the base member 110 from top to bottom. More specifically, the upper ends of the suction holes 115 open in the suction surface 112a, and the lower ends of the suction holes 115 open in the recess 114. Note that through holes (not shown) are formed in the resin film 113 at positions corresponding to the suction holes 115.

[0034] Forming the recess 114 makes it possible to shorten the overall length of the suction hole 115, thereby improving the suction force through the suction hole 115. A plurality of vertically extending pillar portions 116 are formed in the recess 114. The configuration of the pillar portions 116 will be described later.

[0035] The frame-shaped member 150 is formed so as to surround the periphery of the protrusion 112 from the sides. Specifically, an opening 151 corresponding to the protrusion 112 is formed in the frame-shaped member 150. With the protrusion 112 inserted into the inside of the opening 151 of the frame-shaped member 150, the frame-shaped member 150 is placed on the base member 110. In this state, the upper surface of the frame-shaped member 150 is located above the suction surface 112a of the protrusion 112. The upper surface of the frame-shaped member 150 forms a placement surface 152 on which the substrate 71 of the package substrate 70 can be placed.

[0036] In this way, by arranging the frame-shaped member 150 so as to surround the periphery of the protruding portion 112, a recessed portion 161 is formed by the protruding portion 112 and the frame-shaped member 150. Furthermore, this recessed portion 161 defines an arrangement space 162 in which the resin layer 72 of the package substrate 70 is to be arranged. Note that the arrangement space 162 is one embodiment of a defined space according to the present invention.

[0037] The shape of the recess 161 in a plan view is generally the same as or slightly larger than the shape (rectangular shape) of the resin layer 72 of the package substrate 70. The depth of the recess 161 (arrangement space 162) is generally the same as or slightly larger than the thickness of the resin layer 72. The depth of the recess 161 refers to the depth from the mounting surface 152 of the frame-shaped member 150 to the adsorption surface 112a (more specifically, the upper surface of the resin film 113 provided on the adsorption surface 112a). By configuring the recess 161 in this way, the resin layer 72 can be accommodated in the recess 161 when the package substrate 70 is placed on the frame-shaped member 150.

[0038] When the resin layer 72 is accommodated in the recess 161, the unused region 71b (hereinafter also referred to as the "periphery") (see FIG. 1) of the substrate 71 comes into contact with the upper surface of the mounting surface 152 of the frame member 150 that is located outside the recess 161. Because the frame member 150 and the base member 110 are formed of a conductive material such as stainless steel, when the peripheral portion of the package substrate 70 is placed on the frame member 150, the frame member 150 and the base member 110 are electrically connected to the package substrate 70.

[0039] The suction plate 100 is formed with a discharge passage for discharging foreign matter from the recess 161 (arrangement space 162). The specific configuration of the discharge passage will be described later.

[0040] The suction mechanism 52 sucks the package substrate 70 onto the table 50 by suction through the suction holes 115. The suction mechanism 52 mainly includes a pipe 52a, a pump 52b, and the like.

[0041] At least a portion of the piping 52a is disposed in the through-hole 51e of the second portion 51c and is connected to the lower end of the air passage 51d. A pump 52b is connected to the piping 52a. By driving the pump 52b, air is sucked through the through-hole 51e and the recess 114 and the plurality of suction holes 115. As a result, the resin layer 72 is sucked onto the suction surface 112a, and the package substrate 70 is held on the suction plate 100. Even if the thickness of the resin layer 72 is thinner than expected and the resin layer 72 does not contact the upper surface of the suction surface 112a when the package substrate 70 is placed on the suction plate 100, the air within the recess 161 closed by the package substrate 70 is sucked in, creating a negative pressure within the recess 161. As a result, the substrate 71 is sucked downward and the resin layer 72 contacts and is held against the suction surface 112a.

[0042] The moving mechanism 60 shown in Figures 3 and 4 is for moving the table 50. The moving mechanism 60 supports the table 50 from below. The moving mechanism 60 can rotate the table 50 in the θ direction in Figure 3 (i.e., on a horizontal plane). The moving mechanism 60 can also move the table 50 along the Y axis in Figure 3. The operation of the holding unit 20 is controlled by the control unit 40, which will be described later.

[0043] 3 and 4 is for detecting the positions of the spindle portion 12 and the first blade 11A in the height direction (Z-axis direction). The detection unit 30 mainly includes a CCS (Contact Cutter Setup) block 31, a detection circuit 32, a detection device 33, etc.

[0044] The CCS block 31 is attached to the side of the table 50 and can move together with the table 50. The CCS block 31 is conductive and is electrically connected to the suction plate 100. Therefore, when the package substrate 70 is placed on the suction plate 100, the package substrate 70 and the CCS block 31 are electrically connected.

[0045] The detection circuit 32 is configured to conduct electricity via the first blade 11A and the CCS block 31 when the first blade 11A comes into contact with the upper surface of the CCS block 31. The detection circuit 32 is electrically connected to the CCS block 31 and the spindle portion 12. A detection device 33 is incorporated in the detection circuit 32. Furthermore, since the suction plate 100 is conductive and is in contact with the CCS block 31 (see FIG. 6 ), the detection circuit 32 also conducts electricity when the first blade 11A comes into contact with a conductive portion of the package substrate 70.

[0046] The detection circuit 32 is configured to apply a constant voltage between the CCS block 31 and the spindle portion 12 using a power supply (not shown). The detection device 33 detects changes in the presence or absence of current flow in the detection circuit 32. More specifically, the detection device 33 detects contact between the first blade 11A (more precisely, the outer edge of the first blade 11A) and the CCS block 31, and contact between the first blade 11A and the package substrate 70, and notifies the control unit 40 (described later).

[0047] 3 to 5 is electrically connected to the cutting unit 10, the holding unit 20, and the detection unit 30, and controls the operations of each of the units 10 to 30. The control unit 40 may be configured integrally with each of the units 10 to 30, or may be configured separately from each of the units 10 to 30. As shown in Fig. 5, the control unit 40 mainly includes a control unit 41, a display unit 42, an input unit 43, a memory unit 44, etc.

[0048] The control unit 41 includes a CPU, RAM, ROM, etc. The ROM stores an operation program 41a for controlling the operation of each of the units 10 to 30. The CPU reads out the operation program 41a from the ROM and executes it. The ROM is used as appropriate for the CPU's arithmetic processing. The operation program 41a may be stored in the storage unit 44 instead of in the ROM.

[0049] The display unit 42 is configured to display various types of information to the user, and is also configured to display a user interface screen for receiving input of cutting parameters and detection parameters (described later) from the user. The display unit 42 can be realized in any manner, such as a liquid crystal display element, a liquid crystal display, an organic EL display, or a touch panel display.

[0050] The input unit 43 is used to input, for example, various fixed values ​​and various parameters for cutting. The input unit 43 can be realized in any form, such as a keyboard, push buttons, or a touch panel display. When the input unit 43 is realized as a touch panel display, the input unit 43 may also function as the display unit 42.

[0051] The parameters for cutting are not particularly limited, but include, for example, cutting parameters that specify the positions at which the package substrate 70 should be cut. Since the package substrate 70 is usually cut according to a grid-like cutting pattern, the vertical and horizontal cutting lines are determined by determining the cutting parameters.

[0052] <Calculation of Half-Cut Height> Next, calculation of the half-cut height by the control unit 41 will be described. The half-cut height is the position of the bottom edge of the first blade 11A when half-cutting the package substrate 70. The control unit 41 controls the height position of the spindle unit 12 to move the first blade 11A toward the top surface of the CCS block 31. The control unit 41 recognizes the height coordinate of the spindle unit 12 when contact between a new, unworn first blade 11A and the CCS block 31 is detected as a reference Z coordinate (hereinafter referred to as the reference coordinate). As a result, the height position of the spindle unit 12 and the height position of the first blade 11A are detected with respect to the top surface of the CCS block 31. Furthermore, the control unit 41 controls the height position of the spindle unit 12 to move the first blade 11A toward the top surface of the package substrate 70. The height position of the spindle portion 12 controlled by the control unit 41 is, specifically, for example, the position of the rotation axis of the spindle portion 12 in the Z-axis direction, and the control unit 41 can determine the position of the spindle portion 12 in the Z-axis direction by converting the rotation direction and rotation speed of the motor that moves the spindle portion 12 along the ball screw into a movement distance in the Z-axis coordinate.

[0053] As an example, the half-cut height can be calculated as follows. First, the distance from the top surface of the CCS block 31 to the top surface of the suction plate 100 (fixed value B) and the thickness of the package substrate 70 (fixed value C) are added to the reference coordinate (A), and the height coordinate (A+B+C-D-E) is calculated by subtracting the half-cut depth (fixed value D) and the correction amount (measured value E) due to wear of the first blade 11A at the start of the half-cut. The height position of the spindle 12 is then controlled so that the bottom end of the first blade 11A is positioned at the calculated coordinate (hereinafter referred to as the basic processing coordinate). The fixed values ​​are input and stored in the cutting device 1 in advance. The correction amount (measured value) caused by wear of the first blade 11A at the start of half cutting can be calculated from the height coordinate when the first blade 11A comes into contact with the CCS block 31 and the above-mentioned reference coordinate (for wear of the first blade 11A and the correction of the height position of the first blade 11A caused by that wear, see Patent Publication 2022-151243).

[0054] Furthermore, the height position of the spindle 12 is controlled taking into consideration the actual thickness of the package substrate 70. Specifically, the control unit 41 brings the first blade 11A into contact with the package substrate 70. From the height coordinate (F) at this time, the difference between the actual thickness of the package substrate 70 and the thickness of the package substrate 70 (fixed value C) is calculated as an offset amount (A+B+C-F) of the height of the package substrate 70. Then, taking this offset amount into consideration, the processing basic coordinates are corrected, and the height position of the spindle 12 is controlled so that the bottom end portion of the first blade 11A is positioned.

[0055] Furthermore, correction for wear on the first blade 11A caused by the half-cut is performed, for example, when the half-cut length or half-cut time exceeds a set value. That is, when the half-cut length or half-cut time exceeds a set value (this may be after the half-cut of one cutting line is completed or during the half-cut), the first blade 11A is brought into contact with the CCS block 31, and the height coordinate at this time is obtained. Then, from this and the above-mentioned reference coordinate, the correction amount caused by wear on the first blade 11A is calculated (see JP 2022-151243 A), and the height position of the spindle portion 12 is corrected.

[0056] <Singling of Package Substrate 70> Next, a method for cutting the package substrate 70 to form semiconductor packages 80 will be described with reference to FIG. 7 . First, a first blade 11A having a first thickness is attached to the spindle 12. This first blade 11A is used to half-cut the package substrate 70 along a cutting line, forming a groove pattern consisting of multiple half-cut grooves G1 and G2, as shown in FIG. 7( a). Each time the formation of one half-cut groove G1 or G2 is completed, the cutting distance, as described below, may be determined. The outermost portion of the package substrate 70 cut by the first blade 11A is the boundary between the used region 71a and the unused region 71b (the dashed line shown in FIG. 7( a)). The unused region 71b does not contain a semiconductor chip or the like after full cutting and will not become a semiconductor package 80. This boundary line cut by the first blade 11A is located above the resin layer 72 and within the recess 161 in a plan view.

[0057] 7B is a schematic side view of the vicinity of the half-cut grooves G1 and G2 of the package substrate 70. After the groove pattern is formed, a second blade 11B having a second thickness smaller than the first thickness is attached to the spindle portion 12, and the package substrate 70 is fully cut at position P1 by the second blade 11B to separate the package substrate 70. Position P1 is preferably the center of the half-cut grooves G1 and G2. This results in the manufacture of multiple semiconductor packages 80 each having a step portion 81 formed therein as shown in FIG. 2. Note that the cross-sectional shape of the half-cut grooves G1 and G2 is not limited to the shape shown in FIG. 7B.

[0058] When forming a groove pattern in the package substrate 70 by half-cutting, it is important that half-cut grooves G1, G2 are formed on the package substrate 70 with as uniform a depth as possible, and high precision is required. Therefore, in this embodiment, the half-cutting is controlled as follows. The process of half-cutting the package substrate 70 (half-cut process) will be described below with reference to the flowcharts shown in FIGS. 6 and 8.

[0059] <Half-Cutting of Package Substrate 70> First, the package substrate 70 is aligned and placed in the recess 161 of the holding unit 20, and air is sucked through the suction holes 115 of the base member 110 to hold the package substrate 70 on the suction plate 100 (step S1). As a result, the unused region 71b of the substrate 71 of the package substrate 70 comes into contact with the upper surface of the suction plate 100 (the mounting surface 152 of the frame-shaped member 150), thereby establishing electrical conduction between the package substrate 70 and the suction plate 100.

[0060] Next, the spindle 12 and the moving mechanism 60 are operated to align the first blade 11A with the package substrate 70 (step S2). Subsequently, the spindle 12 is moved to bring the first blade 11A into contact with the CCS block 31, and the height position of the first blade 11A at this time is stored in the storage unit 44. As a result, as described above, the correction amount caused by wear of the first blade 11A is calculated and stored in the storage unit 44 (step S3).

[0061] Next, if the height of the top surface of the package substrate 70 has not been measured (NO in step S4), the spindle unit 12 is moved to bring the first blade 11A into contact with the second surface of the substrate 71 of the package substrate 70. More specifically, the first blade 11A is brought into contact with the unused area 71b of the second surface of the substrate 71 of the package substrate 70, the portion of the unused area 71b on the first surface side of the substrate 71 of the package substrate 70, where the resin layer 72 is formed below the unused area 71b. Because the outer periphery of the package substrate 70 is in contact with the suction plate 100, a current flows through the first blade 11A and the substrate 71, and the current flow is detected by the detector 33. As a result, the height position of the first blade 11A is calculated (step S5) and stored in the memory unit 44. Based on this, the offset amount described above is calculated and stored in the memory unit 44. On the other hand, if the height of the top surface of the package substrate 70 has been measured (YES in step S4), the half-cut height is calculated (step S6) as follows.

[0062] That is, the half-cut height by the first blade 11A is calculated from the correction amount and offset amount calculated as described above and the basic processing coordinates (step S6). Based on this, the height position of the bottom end portion of the first blade 11A is adjusted to a position lower by the amount of the half-cut cut from the height position at which the first blade 11A contacts the package substrate 70.

[0063] The spindle 12 is then moved to half-cut the package substrate 70 along the cutting lines (step S7). At this time, the cutting edge of the lower end of the first blade 11A is maintained at the half-cut height. In this process, if the cutting distance of the first blade 11A exceeds a set value when half-cutting along one cutting line is completed (YES in step S8), it is determined that the first blade 11A is worn, and the correction amount is calculated (step S3). On the other hand, if the cutting distance does not exceed the set value (NO in step S8), it is determined whether half-cuts have been performed along all cutting lines on the package substrate (step S9). In step S8, instead of determining the cutting distance, it may be determined whether the cutting time of the first blade 11A exceeds a set value.

[0064] In step S9, if half cuts have not been made on all cutting lines (NO in step S9), half cuts are made on another cutting line (step S7). If half cuts have been made on all cutting lines (YES in step S9), the package substrate 70 is washed and dried, and then removed from the suction plate 100 and carried out (step S10). Subsequently, the table 50 is washed with cleaning water and dried (step S11). When washing the table 50, foreign matter (e.g., cutting chips, etc.) in the recess 161 of the suction plate 100 is discharged to the outside through a discharge passage (described later). This prevents foreign matter from becoming trapped between the suction surface 112a of the suction plate 100 and the package substrate 70, allowing for highly accurate half cuts.

[0065] Thereafter, when half-cutting of all package substrates 70 is completed (YES in step S12), the operation of the cutting device 1 is terminated, and if package substrates 70 to be half-cut remain (NO in step S12), a new package substrate 70 is held on the suction plate 100 (step S1) and half-cutting continues.

[0066] Thereafter, the cutting device 1 can further perform a full-cutting process (full-cutting process). In this case, the blade is replaced, and a second blade 11B is attached to the spindle unit 12 in place of the first blade 11A. The replaced second blade 11B then performs the full-cutting process. The second blade 11B cuts and separates the package substrate 70 in the thickness direction according to the formed groove pattern. This results in semiconductor packages 80, which are a plurality of individual electronic components. After the full-cutting process is complete, the semiconductor packages 80 may be sent to another unit included in the cutting device 1.

[0067] The cutting device 1 can also be provided with a pressing mechanism for pressing down the package substrate 70 to be cut (particularly, half-cut). By pressing down the package substrate 70 with the pressing mechanism, half-cutting can be performed in a state where warping or lifting of the package substrate 70 is eliminated, or by contacting the first blade 11A to measure the height of the upper surface of the package substrate 70, half-cut grooves can be formed with higher precision. The pressing mechanism can be, for example, the mechanism described in JP 2022-79910 A.

[0068] <Configuration of the suction plate 100> The configuration of the suction plate 100 will be described in more detail below.

[0069] 9 to 12 is formed with a discharge passage for discharging foreign matter (e.g., cutting chips) from the recess 161 (arrangement space 162). Specifically, the discharge passage is mainly composed of a stepped portion 121, a chamfered portion 122, a first groove portion 123, a second groove portion 124, etc., which are formed in the base member 110.

[0070] The step portion 121 is formed along the outer peripheral edge of the upper end portion (attraction surface 112a) of the protrusion 112. The step portion 121 is formed around the entire circumference of the protrusion 112. As a result, the step portion 121 is formed so as to surround the periphery of the attraction surface 112a. The step portion 121 is formed so as to be slightly lower than the central portion (attraction surface 112a) of the protrusion 112. The step portion 121 is one embodiment of a third passage according to the present invention.

[0071] The chamfered portions 122 are formed by cutting out the four corners of the protruding portion 112, which is formed in a rectangular shape in a plan view. The chamfered portions 122 are formed from the upper end to the lower end of the protruding portion 112. By forming the chamfered portions 122, a gap is formed between the protruding portion 112 and the inner surface (opening 151) of the frame-shaped member 150 in the vertical direction. The upper end of the chamfered portions 122 is connected to the step portions 121. The chamfered portions 122 are one embodiment of a first passage according to the present invention.

[0072] 9 and 11 are formed along the short sides of the protruding portion 112, which is rectangular in plan view. The first grooves 123 are formed by recessing portions along the pair of short sides of the protruding portion 112 on the upper surface of the plate-like portion 111. As a result, the first grooves 123 are formed so as to extend in a direction parallel to the short sides of the package substrate 70 held by the suction plate 100.

[0073] The second grooves 124 shown in Figures 9, 10, and 11 are formed along the long sides of the protrusions 112, which are rectangular in plan view. The second grooves 124 are formed by recessing portions along the pair of long sides of the protrusions 112 on the upper surface of the plate-like portion 111. As a result, the second grooves 124 are formed to extend in a direction parallel to the long sides of the package substrate 70 held by the suction plate 100. Furthermore, both longitudinal ends of the second grooves 124 are formed to extend to the ends of the plate-like portion 111. As a result, both ends of the second grooves 124 are formed to open to the side surfaces of the plate-like portion 111. The second grooves 124 are one embodiment of a second passage according to the present invention.

[0074] The middle portion of the second groove portion 124 is connected to the first groove portion 123 near the corner of the protrusion 112. In this portion, the first groove portion 123 and the second groove portion 124 are connected to the chamfered portion 122. In this manner, the step portion 121, the chamfered portion 122, the first groove portion 123, and the second groove portion 124 are connected to one another.

[0075] When the frame-shaped member 150 is attached to the base member 110 having the step portion 121 etc. formed thereon, the side surface of the protrusion 112 and the inner surface (opening 151) of the frame-shaped member 150 are fitted together, thereby enabling the frame-shaped member 150 to be positioned relative to the base member 110.

[0076] 12 and 13 , when the frame-shaped member 150 is attached to the base member 110, the recess 161 (arrangement space 162) is connected to the outside of the suction plate 100 via the discharge passage (the step portion 121, the chamfered portion 122, the first groove portion 123, and the second groove portion 124). Therefore, when the table 50 (suction plate 100) is cleaned in step S11 of FIG. 8 , foreign matter in the recess 161 is discharged to the outside together with the cleaning water via the discharge passage (for example, along the dotted arrow in FIG. 12( b )). This makes it possible to prevent foreign matter from being caught between the suction surface 112 a of the suction plate 100 and the package substrate 70, thereby enabling high-precision half-cutting.

[0077] 12(a) and 14, the recess 114 is formed with a plurality of vertically extending pillar-shaped portions 116. The pillar-shaped portions 116 are formed, for example, in the shape of a rectangular pillar. The pillar-shaped portions 116 are formed so as to extend downward from the upper surface of the recess 114. The vertical length of the pillar-shaped portions 116 is formed to be approximately the same as the depth of the recess 114. The pillar-shaped portions 116 are formed in positions that do not overlap with the suction holes 115. The lower ends of the pillar-shaped portions 116 contact the upper surface of the base 51 (see FIG. 6). The pillar-shaped portions 116 can support the base member 110 in which the recess 114 is formed. This can prevent the base member 110 from deforming when the suction mechanism 52 sucks air and creates a negative pressure inside the recess 114.

[0078] The shape and number of the columnar portions 116 are not particularly limited. For example, the columnar portions 116 may be formed in a shape other than a rectangular column (such as a cylindrical shape). The arrangement and number of the columnar portions 116 may be changed as desired.

[0079] The discharge passage may be formed to be appropriately inclined to promote the discharge of foreign matter through the discharge passage. For example, the second groove 124 shown in FIG. 11 may be formed to slope downward from the center of the plate-like portion 111 toward both ends. This promotes the discharge of foreign matter flowing through the second groove 124 together with the cleaning water to the outside. In addition to the second groove 124, other portions (e.g., the step 121, the first groove 123, etc.) may also be inclined.

[0080] Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and appropriate modifications are possible within the scope of the technical idea of ​​the invention described in the claims.

[0081] For example, in the above embodiment, as shown in FIG. 15(a), an example is shown in which a chamfered portion 122 is formed at the corner of the protrusion 112 to connect the recess 161 (arrangement space 162) with the first groove portion 123 and the second groove portion 124 formed at the lower part of the protrusion 112, but the present invention is not limited to this.

[0082] As an example, FIG. 15B shows a suction plate 100A (base member 110A) according to a first modified example. In the base member 110A according to the first modified example, step portions 121 remain near the corners of the protrusions 112, and notches 125 are formed midway along one side of the protrusions 112, which are rectangular in plan view. In this configuration, the recesses 161 (arrangement space 162) are connected to the first grooves 123 and second grooves 124 formed in the lower part of the protrusions 112 via the notches 125. In addition, in this configuration, the side surfaces of the step portions 121 remaining at the corners of the protrusions 112 and the inner surface (opening 151) of the frame-shaped member 150 fit together, thereby enabling the frame-shaped member 150 to be positioned relative to the base member 110A.

[0083] In this way, the configuration of the discharge passage for discharging foreign matter from the recess 161 (arrangement space 162) is not particularly limited, and the configuration (shape, position, number of passages, etc.) can be changed arbitrarily as long as it is possible to discharge foreign matter from the recess 161.

[0084] For example, in the above embodiment, an example was shown in which the step portion 121 was formed on the outer peripheral edge of the protruding portion 112, but the step portion 121 (groove portion) may also be formed as appropriate in a portion other than the outer peripheral edge (for example, near the center) of the protruding portion 112. Furthermore, it is not always necessary to form the step portion 121 on the protruding portion 112, and the chamfered portion 122 and the recessed portion 161 may be directly connected.

[0085] In the above embodiment, the end of the second groove 124 is formed to open on the side surface of the base member 110 (plate-shaped portion 111), and foreign matter is discharged to the outside through this opening. However, the present invention is not limited to this. For example, instead of the second groove 124, the first groove 123 may be formed to open on the side surface of the base member 110, or both the first groove 123 and the second groove 124 may be formed to open on the side surface of the base member 110.

[0086] In addition, in the above embodiment, an example is shown in which a first groove portion 123 and a second groove portion 124 are formed to extend parallel to each side of the protrusion portion 112 which is rectangular in plan view, but the shape and extension direction of the groove portions are not limited to this, and groove portions can be formed in any shape and direction.

[0087] In the above embodiment, foreign matter is discharged to the outside (to the side of the base member 110) through the second groove 124 that opens on the side surface of the base member 110 (plate-shaped portion 111), but the present invention is not limited to this. For example, it is also possible to form a collection portion in the discharge passage that can collect foreign matter, and configure the discharge passage to collect foreign matter discharged from the recess 161 (arrangement space 162).

[0088] In addition, in the above embodiment, a rectangular shaped suction plate 100 (see Figure 10, etc.) is illustrated assuming that a rectangular package substrate 70 is to be cut, but the present invention is not limited to this, and the shape of the suction plate 100 can be changed as desired depending on the shape of the object to be cut (package substrate 70, etc.).

[0089] As an example, Fig. 16 shows a suction plate 100B (base member 110B) according to a second modified example. In the base member 110B according to the second modified example, the protrusion 112 is formed to be square in plan view. Although not shown, an opening 151 having a shape (square in plan view) corresponding to the protrusion 112 is also formed in the frame-shaped member 150. This allows the suction plate 100B to hold a square-shaped package substrate 70. The suction plate 100B having such a shape is suitable for suctioning a relatively large package substrate 70.

[0090] In the base member 110B according to the second modification shown in FIG. 16, similar to the base member 110A according to the first modification (see FIG. 15(b)), step portions 121 are left at the corners of the protruding portion 112, and notches 125 are formed on each side of the protruding portion 112. Furthermore, in the base member 110B according to the second modification, a plurality of third grooves 126 are formed parallel to the second grooves 124 so as to connect to the middle portions of the first grooves 123. The ends of the third grooves 126 are formed so as to open on the side surfaces of the base member 110B. In this way, by increasing the number of grooves that open on the side surfaces of the base member 110B, it is possible to efficiently promote the discharge of foreign matter.

[0091] In this way, the shape of the suction plate 100B (base member 110B) can be changed arbitrarily as long as it is a shape that can suction and hold the object to be cut (such as the package substrate 70).

[0092] Furthermore, in the above embodiment, the discharge passages (step portion 121, chamfered portion 122, first groove portion 123, second groove portion 124, etc.) are formed by appropriately processing the base member 110, but the discharge passages do not necessarily have to be formed in the base member 110. For example, the discharge passages may be formed by forming appropriate grooves, etc. in the frame-shaped member 150 instead of the base member 110, or by forming appropriate grooves, etc. in both the base member 110 and the frame-shaped member 150.

[0093] The cutting device 1 according to the above embodiment may also include units other than those described above. For example, the cutting device 1 may include a substrate supply unit that supplies package substrates 70, an inspection unit that inspects the package substrates 70 and / or the semiconductor packages 80, a cleaning unit that cleans and / or dries the cut semiconductor packages 80, a transport unit that transports the cut semiconductor packages 80 to the storage unit, etc.

[0094] <Notes> The suction plate 100 according to a first aspect of the present disclosure is a suction plate 100 for holding a package substrate 70 (object to be cut) having a substrate 71 and a resin layer 72, and comprises: a base member 110 including a plate-like portion 111 (base) disposed on a base 51 provided with a suction mechanism 52, and a protruding portion 112 formed to protrude upward from the plate-like portion 111 and having an suction surface 112a capable of suctioning the resin layer 72; and a frame-like member 150 disposed to surround the periphery of the protruding portion 112 and having a mounting surface 152 formed to be located above the suction surface 112a, on which the substrate 71 can be placed. At least one of the base member 110 and the frame member 150 has a discharge passage (step portion 121, chamfered portion 122, first groove portion 123, and / or second groove portion 124) formed therein that allows foreign matter within an arrangement space 162 (defined space) defined by the protrusion 112 and the frame member 150 to be discharged to the outside of the arrangement space 162. According to the suction plate 100 of the first side surface of the present disclosure, half-cut grooves can be formed with high precision. Specifically, because foreign matter within the arrangement space 162 can be discharged to the outside, it is possible to prevent foreign matter from becoming trapped between the suction surface 112a and the package substrate 70.

[0095] In the suction plate 100 of the second side surface according to the first side surface, the discharge passage is formed between the protrusion 112 and the frame-shaped member 150 and includes a chamfered portion 122 (first passage) connected to the arrangement space 162. According to the suction plate 100 of the second side surface of the present disclosure, foreign matter in the arrangement space 162 can be discharged to the outside via the chamfered portion 122.

[0096] In the suction plate 100 of the third side surface according to the second side surface, the discharge passage includes a second groove portion 124 (second passage) connecting the chamfered portion 122 and the side surface of the plate-shaped portion 111. According to the suction plate 100 of the third side surface of the present disclosure, foreign matter discharged from the arrangement space 162 can be discharged to the outside of the base member 110.

[0097] In the suction plate 100 of the fourth side according to the third side, the package substrate 70 is rectangular, and the second groove 124 is formed to extend in a direction parallel to at least one side (long side) of the package substrate 70 suctioned by the suction surface 112a. According to the suction plate 100 of the third side of the present disclosure, the second groove 124 is formed in a direction corresponding to the shape of the package substrate 70, thereby enabling the suction plate 100 to be formed relatively compact. In particular, in the above embodiment, the second groove 124 opening on the side of the base member 110 is formed only in a direction parallel to the long side of the package substrate 70 (one direction), thereby preventing a decrease in the rigidity of the base member 110. Note that "parallel" does not only have a strict meaning but also a substantial meaning. Therefore, even if the side of the package substrate 70 and the second groove 124 are not perfectly parallel, they are still parallel as long as they are within a tolerance due to, for example, the placement of the package substrate 70.

[0098] In the suction plate 100 of the fifth side face according to any one of the second to fourth sides, the discharge passage includes a step portion 121 (third passage) formed around the suction surface 112a and connected to the chamfered portion 122. According to the suction plate 100 of the fifth side face of the present disclosure, foreign matter can be guided to the chamfered portion 122 via the step portion 121, thereby effectively facilitating the discharge of foreign matter.

[0099] In the suction plate 100 of the sixth side surface according to any one of the first to fifth side surfaces, the thickness of the plate-like portion 111 in the vertical direction is formed to be thicker than the thickness of the protruding portion 112 in the vertical direction. According to the suction plate 100 of the sixth side surface of the present disclosure, by forming the thickness of the plate-like portion 111 in the vertical direction to be relatively thick, it becomes easier to ensure the flatness of the suction surface 112a.

[0100] In the suction plate 100 of the seventh side face according to any one of the first to sixth side faces, a recess 114 connected to a suction hole 115 formed in the suction face 112a is formed in the bottom surface of the base member 110, and at least one columnar portion 116 capable of contacting the base 51 is formed inside the recess 114. The suction plate 100 of the seventh side face according to the present disclosure can prevent the base member 110 from being deformed by negative pressure generated by the package substrate 70.

[0101] The cutting device 1 according to an eighth aspect of the present disclosure includes the suction plate 100 according to any one of the first to seventh aspects, and the base 51 provided with the suction mechanism 52. According to the cutting device 1 according to the eighth aspect of the present disclosure, half-cut grooves can be formed with high precision.

[0102] Furthermore, a method for manufacturing an electronic component according to a ninth aspect of the present disclosure includes a half-cutting step in which half-cuts are made to the package substrate 70 using the cutting device 1 according to the eighth aspect, and a full-cutting step in which full-cuts are made to the package substrate 70 that has been half-cut in the half-cutting step using the cutting device 1. According to the cutting device 1 according to the ninth aspect of the present disclosure, half-cut grooves can be formed with high precision.

[0103] REFERENCE SIGNS LIST 1 Cutting device 51 Base 52 Suction mechanism 70 Package substrate 71 Substrate 72 Resin layer 100 Suction plate 110 Base member 111 Plate-shaped portion 112 Protrusion 112a Suction surface 114 Recess 115 Suction hole 116 Column-shaped portion 121 Step portion 122 Chamfered portion 123 First groove portion 124 Second groove portion 150 Frame-shaped member 152 Placement surface 162 Arrangement space

Claims

1. An adsorption plate for holding an object to be cut having a substrate and a resin layer, comprising: a base member having a base portion placed on a base provided with a suction mechanism, and a protrusion formed to protrude upward from the base portion and having an adsorption surface capable of adsorbing the resin layer; and a frame-shaped member arranged to surround the periphery of the protrusion, and having a mounting surface formed above the adsorption surface, on which the substrate can be placed, wherein at least one of the base member and the frame-shaped member has a discharge passage formed to enable foreign matter within a defined space defined by the protrusion and the frame-shaped member to be discharged to outside the defined space.

2. The suction plate according to claim 1, wherein the discharge passage includes a first passage formed between the protrusion and the frame-shaped member and connected to the defined space.

3. The suction plate according to claim 2, wherein the discharge passage includes a second passage connecting the first passage and a side surface of the base.

4. The suction plate according to claim 3, wherein the object to be cut is formed in a rectangular shape, and the second passage is formed so as to extend in a direction parallel to at least one side of the object to be cut that is suctioned by the suction surface.

5. The suction plate according to any one of claims 2 to 4, wherein the discharge passage includes a third passage formed around the suction surface and connected to the first passage.

6. The suction plate according to any one of claims 1 to 5, wherein the vertical thickness of the base is greater than the vertical thickness of the protrusion.

7. An adsorption plate as described in any one of claims 1 to 6, wherein a recess is formed on the bottom surface of the base member which is connected to an adsorption hole formed in the adsorption surface, and at least one columnar portion capable of contacting the base is formed inside the recess.

8. A cutting device comprising: an adsorption plate according to any one of claims 1 to 7; and a base on which the suction mechanism is provided.

9. A method for manufacturing electronic components, comprising: a half-cut process in which a half-cut is applied to the object to be cut using the cutting device described in claim 8; and a full-cut process in which a full-cut is applied to the object to be cut that has been half-cut in the half-cut process using the cutting device.

Images