Resin composition for molding and electronic component device

Abstract

This resin composition for molding comprises a curable resin, an inorganic filler containing a titanium-containing high dielectric filler, carbon black, and black titanium oxide.

Description

Molding resin composition and electronic component device

[0001] The present disclosure relates to a molding resin composition and an electronic component device.

[0002] As electronic devices become lighter, thinner, and smaller, semiconductor packages are becoming smaller and thinner. The semiconductor packages described above are obtained by encapsulating semiconductor elements with a thermosetting resin encapsulant, and as semiconductor packages become thinner, the encapsulating resin layer that encapsulates the semiconductor elements is also becoming thinner.

[0003] In resin-sealed semiconductor packages, various types of identification information, such as manufacturing lot numbers and logos, are printed on the surface of the encapsulating resin layer. Laser marking is known as one method of printing on the surface of the encapsulating resin layer. Laser marking is a technology in which the surface of the encapsulating resin layer is scraped away with laser light to print. Laser marking directly engraves the encapsulating resin layer, eliminating the need for additional processes such as cleaning, resulting in higher production efficiency than printing methods and improved durability of the printed area.

[0004] Examples of encapsulating resin compositions that take laser marking properties into consideration include compositions disclosed in Patent Documents 1 to 3.

[0005] JP 2006-278959 A JP 2016-113566 A JP 2018-162351 A

[0006] By using a composition that can produce a cured product with a high dielectric constant, it is possible to reduce the size of semiconductor packages. Therefore, in order to increase the dielectric constant of the cured product, a titanium-containing high-dielectric filler is sometimes added to the encapsulating resin composition. However, if the encapsulating resin composition contains a colorant such as carbon black together with the titanium-containing high-dielectric filler, the encapsulating resin layer cannot be deeply removed with laser light, and the laser processability may be insufficient.

[0007] One aspect of the present disclosure has been made in view of the above-described conventional circumstances, and has an object to provide a molding resin composition that is excellent in laser processability and an electronic component device using the same.

[0008] Specific means for achieving the above object are as follows. <1> A molding resin composition comprising: a curable resin; an inorganic filler including a titanium-containing high-dielectric filler; carbon black; and black titanium oxide. <2> The molding resin composition according to <1>, wherein the inorganic filler further comprises at least one other inorganic filler selected from the group consisting of silica particles and alumina particles. <3> The molding resin composition according to <1> or <2>, wherein the curable resin comprises an epoxy resin and the molding resin composition further comprises a curing agent. <4> The molding resin composition according to <3>, wherein the curing agent comprises an active ester compound. <5> The molding resin composition according to <3> or <4>, wherein the curing agent comprises at least one other curing agent selected from the group consisting of a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polymercaptan curing agent, a polyaminoamide curing agent, an isocyanate curing agent, and a blocked isocyanate curing agent, and an active ester compound. <6> The molding resin composition according to any one of <1> to <5>, wherein the content of the titanium-containing high-dielectric filler is 30% by volume to 80% by volume relative to the total volume of the inorganic filler. <7> The molding resin composition according to any one of <1> to <6>, wherein the total content of the carbon black and the black titanium oxide is 0.3% by mass to 4.0% by mass relative to the total volume of the molding resin composition. <8> The molding resin composition according to any one of <1> to <7>, which is used for a high-frequency device. <9> The molding resin composition according to any one of <1> to <7>, which is used for an antenna-in-package. <10> An electronic component device comprising: a support member; an electronic component placed on the support member; and a cured product of the molding resin composition according to any one of <1> to <7> that encapsulates the electronic component. <11> The electronic component device according to <10>, wherein the electronic component includes an antenna.

[0009] According to one aspect of the present disclosure, it is possible to provide a molding resin composition that is excellent in laser processability and an electronic component device using the same.

[0010] Hereinafter, embodiments for carrying out the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure.

[0011] In the present disclosure, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In numerical ranges described in stages in the present disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another staged numerical range. Furthermore, in numerical ranges described in the present disclosure, the upper or lower limit value of that numerical range may be replaced with a value shown in the examples. In the present disclosure, each component may contain multiple corresponding substances. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified. In the present disclosure, particles corresponding to each component may include multiple types of particles. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified. In the present disclosure, the terms "layer" and "film" include cases where the layer or film is formed over the entire area when the area in which the layer or film is present is observed, as well as cases where the layer or film is formed over only a portion of the area.

[0012] <Molding Resin Composition> The molding resin composition of the present disclosure includes a curable resin, an inorganic filler containing a titanium-containing high-dielectric filler, carbon black, and black titanium oxide. The inventors have discovered that even when an inorganic filler containing a titanium-containing high-dielectric filler is used, the combined use of carbon black and black titanium oxide improves laser processability and enables deeper laser cutting. Furthermore, the dielectric constant of the cured product of the molding resin composition can be adjusted by adjusting the content of the titanium-containing high-dielectric filler. For example, increasing the content of the titanium-containing high-dielectric filler makes it possible to achieve both a high dielectric constant and a large laser cutting depth.

[0013] Hereinafter, each component constituting the encapsulating resin composition of the present disclosure will be described.

[0014] (Curable Resin) The molding resin composition of the present disclosure contains a curable resin. The curable resin may be either a thermosetting resin or a photocurable resin, and from the viewpoint of mass production, a thermosetting resin is preferred. Examples of thermosetting resins include epoxy resins, phenolic resins, melamine resins, urea resins, unsaturated polyester resins, alkyd resins, urethane resins, polyimide resins such as bismaleimide resins, polyamide resins, polyamideimide resins, silicone resins, and acrylic resins. From the viewpoint of moldability and electrical properties, the thermosetting resin is preferably at least one selected from the group consisting of epoxy resins and polyimide resins, more preferably at least one selected from the group consisting of epoxy resins and bismaleimide resins, and even more preferably an epoxy resin. The molding resin composition may contain only one type of curable resin, or may contain two or more types. Hereinafter, an epoxy resin will be described as an example of a curable resin.

[0015] -Epoxy Resin- The molding resin composition preferably contains an epoxy resin as the curable resin. When the molding resin composition contains an epoxy resin as the curable resin, the content of the epoxy resin relative to the entire curable resin is preferably 80% by mass or more, more preferably 90% by mass or more, and even more preferably 95% by mass or more. The content of the epoxy resin relative to the entire curable resin may be 100% by mass. There are no particular restrictions on the type of epoxy resin, as long as it has an epoxy group in the molecule.

[0016] Specific examples of epoxy resins include novolac epoxy resins (phenol novolac epoxy resins, orthocresol novolac epoxy resins, etc.) obtained by epoxidizing novolac resins obtained by condensing or co-condensing, under an acidic catalyst, at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, etc., and naphthol compounds such as α-naphthol, β-naphthol, dihydroxynaphthalene, etc., with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc.; triphenylmethane epoxy resins obtained by epoxidizing triphenylmethane phenolic resins obtained by condensing or co-condensing, under an acidic catalyst, the above-mentioned phenolic compound with an aromatic aldehyde compound such as benzaldehyde, salicylaldehyde, etc.; and novolac resins obtained by co-condensing, under an acidic catalyst, the above-mentioned phenolic compound and naphthol compound with an aldehyde compound. diphenylmethane-type epoxy resins which are diglycidyl ethers of bisphenol A, bisphenol F, or the like; biphenyl-type epoxy resins which are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene-type epoxy resins which are diglycidyl ethers of stilbene-based phenolic compounds; sulfur-containing epoxy resins which are diglycidyl ethers of bisphenol S, or the like; epoxy resins which are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester-type epoxy resins which are glycidyl esters of polycarboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine-type epoxy resins in which active hydrogen bonded to nitrogen atoms of aniline, diaminodiphenylmethane, isocyanuric acid, or the like is substituted with a glycidyl group; and dicyclopentadiene-type epoxy resins in which a co-condensation resin of dicyclopentadiene and a phenolic compound is epoxidized.Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which are produced by epoxidizing an intramolecular olefin bond; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenolic resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenolic resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenolic resins; and dicyclopentadiene-modified phenolic resins, which are glycidyl ethers of dicyclopentadiene-modified phenolic resins. Examples of suitable epoxy resins include pentadiene-modified epoxy resins; cyclopentadiene-modified epoxy resins, which are glycidyl ethers of cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified epoxy resins, which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins; naphthalene-type epoxy resins, which are glycidyl ethers of naphthalene ring-containing phenolic resins; halogenated phenol novolac-type epoxy resins; hydroquinone-type epoxy resins; trimethylolpropane-type epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; and aralkyl-type epoxy resins obtained by epoxidizing aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. Further examples of suitable epoxy resins include epoxidized acrylic resins. These epoxy resins may be used alone or in combination of two or more. The epoxy resin may be a biphenyl aralkyl-type epoxy resin or a biphenyl-type epoxy resin.

[0017] The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of a balance of various properties such as moldability, reflow resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq. The epoxy equivalent of the epoxy resin is a value measured by a method in accordance with JIS K 7236:2009.

[0018] When the epoxy resin is solid, the softening point or melting point of the epoxy resin is not particularly limited. The softening point or melting point of the epoxy resin is preferably 40°C to 180°C from the viewpoint of moldability and reflow resistance, and more preferably 50°C to 130°C from the viewpoint of handleability during preparation of the molding resin composition. The melting point or softening point of the epoxy resin is a value measured by differential scanning calorimetry (DSC) or a method in accordance with JIS K 7234:1986 (ring and ball method).

[0019] When the molding resin composition contains an epoxy resin as the curable resin, the mass proportion of the epoxy resin in the total amount of the molding resin composition is preferably 0.5% by mass to 30% by mass, more preferably 2% by mass to 20% by mass, and even more preferably 3.5% by mass to 13% by mass, from the viewpoints of strength, fluidity, heat resistance, moldability, and the like.

[0020] (Curing Agent) When the curable resin includes an epoxy resin, the molding resin composition of the present disclosure preferably includes a curing agent.

[0021] The type of curing agent is not particularly limited and can be selected from those commonly used as curing agents for epoxy resins. The curing agent may be used alone or in combination of two or more. Examples of curing agents include phenolic curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents, and active ester compounds. Among these, from the viewpoint of heat resistance, phenolic curing agents or amine curing agents are preferred as curing agents, and from the viewpoint of reducing the dielectric loss tangent, active ester compounds are preferred as cured products. For example, the cured product may contain a phenolic curing agent or an amine curing agent and an active ester compound.

[0022] Examples of phenolic curing agents include phenolic resins and polyhydric phenolic compounds having two or more phenolic hydroxyl groups in one molecule. Specific examples include polyhydric phenolic compounds such as resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenol; novolak-type phenolic resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene, with an aldehyde compound such as formaldehyde, acetaldehyde, or propionaldehyde, under an acidic catalyst; and phenolic compounds synthesized from the above-mentioned phenolic compounds and dimethoxyparaxylene, bis(methoxymethyl)biphenyl, or the like. Examples of suitable phenolic curing agents include aralkyl-type phenolic resins such as aryl aralkyl resins and naphthol aralkyl resins; paraxylylene-modified phenolic resins; metaxylylene-modified phenolic resins; melamine-modified phenolic resins; terpene-modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above-mentioned phenolic compounds with dicyclopentadiene; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensing or co-condensing the above-mentioned phenolic compounds with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst; and phenolic resins obtained by copolymerizing two or more of these. These phenolic curing agents may be used alone or in combination of two or more.

[0023] Specific examples of the amine curing agent include aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane, aromatic amine compounds such as diethyltoluenediamine, 3,3'-diethyl-4,4'-diaminodiphenylmethane, dimethylthiotoluenediamine, and 2-methylaniline, imidazole compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole, and 2-isopropylimidazole, and imidazoline compounds such as imidazoline, 2-methylimidazoline, and 2-ethylimidazoline. These amine curing agents may be used alone or in combination of two or more.

[0024] The content of the phenol resin is preferably 5% by mass to 50% by mass, more preferably 10% by mass to 40% by mass, and even more preferably 15% by mass to 30% by mass, based on the total amount of the epoxy resin.

[0025] When the phenolic curing agent contains a melamine-modified phenolic resin, the content of the melamine-modified phenolic resin is preferably 1% by mass to 20% by mass, more preferably 2% by mass to 15% by mass, and even more preferably 3% by mass to 10% by mass, based on the total amount of epoxy resin. When the content of the melamine-modified phenolic resin is 1% by mass or more based on the total amount of epoxy resin, the cured product of the molding resin composition tends to have improved adhesion (particularly adhesion at high temperatures) to adherends such as electronic components and support members on which the electronic components are mounted. When the content of the melamine-modified phenolic resin is 20% by mass or less based on the total amount of epoxy resin, rapid gelation tends to be suppressed and fluidity tends to be ensured.

[0026] The reactive group equivalent (e.g., hydroxyl group equivalent) of the phenolic curing agent or the active hydrogen equivalent of the amine-based curing agent is not particularly limited. From the viewpoint of the balance of various properties such as moldability, heat resistance, and electrical reliability, it is preferably 10 g / eq to 1000 g / eq, and more preferably 30 g / eq to 500 g / eq. The hydroxyl group equivalent in the case of a phenolic curing agent refers to a value calculated based on the hydroxyl value measured in accordance with JIS K0070:1992. Furthermore, the active hydrogen equivalent in the case of an amine-based curing agent refers to a value calculated based on the amine value measured in accordance with JIS K7237:1995.

[0027] When an active ester compound is used as a curing agent, the dielectric loss tangent of the cured product can be kept lower than when a phenolic or amine curing agent is used as the curing agent. The reason for this is presumed to be as follows: In the reaction between an epoxy resin and a phenolic or amine curing agent, secondary hydroxyl groups are generated. In contrast, in the reaction between an epoxy resin and an active ester compound, ester groups are generated instead of secondary hydroxyl groups. Since ester groups have lower polarity than secondary hydroxyl groups, molding resin compositions containing an active ester compound as a curing agent can keep the dielectric loss tangent of the cured product lower than molding resin compositions containing only a curing agent that generates secondary hydroxyl groups. Furthermore, while polar groups in a cured product increase the water absorption of the cured product, using an active ester compound as a curing agent can reduce the concentration of polar groups in the cured product, thereby suppressing the water absorption of the cured product. Furthermore, suppressing the water absorption of the cured product, in other words, reducing the polar molecule H ２ By reducing the O content, the dielectric loss tangent of the cured product can be further reduced.

[0028] The type of active ester compound is not particularly limited as long as it has one or more ester groups in the molecule that react with an epoxy group. Examples of the active ester compound include phenol ester compounds, thiophenol ester compounds, N-hydroxyamine ester compounds, and esterified products of heterocyclic hydroxy compounds.

[0029] Examples of active ester compounds include ester compounds obtained from at least one of an aliphatic carboxylic acid and an aromatic carboxylic acid and at least one of an aliphatic hydroxy compound and an aromatic hydroxy compound. Ester compounds using an aliphatic compound as a polycondensation component tend to have excellent compatibility with epoxy resins due to the presence of an aliphatic chain. Ester compounds using an aromatic compound as a polycondensation component tend to have excellent heat resistance due to the presence of an aromatic ring.

[0030] Specific examples of active ester compounds include aromatic esters obtained by the condensation reaction of an aromatic carboxylic acid with a phenolic hydroxyl group. Among these, aromatic esters obtained by the condensation reaction of an aromatic carboxylic acid with a phenolic hydroxyl group using a mixture of raw materials: an aromatic carboxylic acid component in which 2 to 4 hydrogen atoms on the aromatic ring of benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, diphenylsulfonic acid, etc. are substituted with carboxy groups; a monohydric phenol in which one hydrogen atom on the aromatic ring is substituted with a hydroxyl group; and a polyhydric phenol in which 2 to 4 hydrogen atoms on the aromatic ring are substituted with hydroxyl groups. That is, aromatic esters having structural units derived from the aromatic carboxylic acid component, structural units derived from the monohydric phenol, and structural units derived from the polyhydric phenol are preferred.

[0031] Specific examples of the active ester compound include an active ester resin having a structure obtained by reacting a phenolic resin having a molecular structure in which phenolic compounds are bonded via alicyclic hydrocarbon groups with an aromatic dicarboxylic acid or a halide thereof, and an aromatic monohydroxy compound, as described in JP 2012-246367 A. As the active ester resin, a compound represented by the following structural formula (1) is preferred.

[0032]

[0033] In structural formula (1), R １are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; X is an unsubstituted benzene ring, an unsubstituted naphthalene ring, a benzene ring or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, or a biphenyl group; Y is a benzene ring, a naphthalene ring, or a benzene ring or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms; k is 0 or 1; and n represents the average number of repetitions and is 0.25 to 1.5.

[0034] Specific examples of the compound represented by structural formula (1) include the following exemplary compounds (1-1) to (1-10): In the structural formula, t-Bu is a tert-butyl group.

[0035]

[0036]

[0037] Other specific examples of the active ester compound include a compound represented by the following structural formula (2) and a compound represented by the following structural formula (3), which are described in JP 2014-114352 A.

[0038]

[0039] In structural formula (2), R １ and R ２ are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; Z is an ester-forming structural moiety (z1) selected from the group consisting of an unsubstituted benzoyl group, an unsubstituted naphthoyl group, a benzoyl group or naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); and at least one of Z is an ester-forming structural moiety (z1).

[0040] In structural formula (3), R １ and R ２are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; Z is an ester-forming structural moiety (z1) selected from the group consisting of an unsubstituted benzoyl group, an unsubstituted naphthoyl group, a benzoyl group or naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); and at least one of Z is an ester-forming structural moiety (z1).

[0041] Specific examples of the compound represented by structural formula (2) include the following exemplary compounds (2-1) to (2-6).

[0042]

[0043] Specific examples of the compound represented by structural formula (3) include the following exemplary compounds (3-1) to (3-6).

[0044]

[0045] Commercially available products may be used as the active ester compound. Examples of commercially available active ester compounds include "EXB9451", "EXB9460", "EXB9460S", and "HPC-8000-65T" (manufactured by DIC Corporation) as active ester compounds containing a dicyclopentadiene-type diphenol structure; "EXB9416-70BK", "EXB-8", and "EXB-9425" (manufactured by DIC Corporation) as active ester compounds containing an aromatic structure; "DC808" (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing an acetylated product of phenol novolac; and "YLH1026" (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing a benzoylated product of phenol novolac.

[0046] The ester equivalent (molecular weight / number of ester groups) of the active ester compound is not particularly limited. From the viewpoint of a balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 150 g / eq to 400 g / eq, more preferably 170 g / eq to 300 g / eq, and even more preferably 200 g / eq to 250 g / eq. The ester equivalent of the active ester compound is a value measured by a method in accordance with JIS K 0070:1992.

[0047] The equivalent ratio of the epoxy resin to the curing agent (the number of moles of epoxy groups in the resin / the total number of moles of reactive groups, active hydrogens, and ester groups in the curing agent) is not particularly limited, and from the viewpoint of minimizing the amount of unreacted groups, is preferably, for example, 0.7 to 1.6, more preferably 0.8 to 1.4, and even more preferably 0.9 to 1.2.

[0048] The softening point or melting point of the curing agent is not particularly limited. From the viewpoints of moldability and reflow resistance, the softening point or melting point of the curing agent is preferably 40°C to 180°C, and from the viewpoint of handleability during production of the molding resin composition, it is more preferably 50°C to 130°C. The melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.

[0049] The curing agent preferably contains at least one other curing agent selected from the group consisting of phenolic curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents, and an active ester compound, and more preferably contains an active ester compound and a phenolic curing agent. From the viewpoint of keeping the dielectric dissipation factor of the cured product low, the mass proportion of the active ester compound in the total amount of the active ester compound and the phenolic curing agent is preferably 40% by mass or more, more preferably 60% by mass or more. The mass proportion of the active ester compound in the total amount of the active ester compound and the phenolic curing agent may be 80% by mass or less, or may be 70% by mass or less.

[0050] When the molding resin composition contains an epoxy resin and a curing agent, the content of curable resins other than the epoxy resin may be less than 5% by mass, 4% by mass or less, or 3% by mass or less, relative to the total amount of the molding resin composition.

[0051] (Curing Accelerator) The molding resin composition may contain a curing accelerator. The type of curing accelerator is not particularly limited and can be selected depending on the type of epoxy resin, the desired properties of the molding resin composition, and the like.

[0052] Specifically, diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole, derivatives of the cyclic amidine compounds, phenol novolac salts of the cyclic amidine compounds or their derivatives, and the addition of maleic anhydride to these compounds, quinone compounds such as 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone, diazofuran, compounds having intramolecular polarization obtained by adding a compound having a π bond, such as phenylmethane; cyclic amidinium compounds such as the tetraphenylborate salt of DBU, the tetraphenylborate salt of DBN, the tetraphenylborate salt of 2-ethyl-4-methylimidazole, and the tetraphenylborate salt of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide;organic phosphines such as primary phosphines such as ethylphosphine and phenylphosphine; secondary phosphines such as dimethylphosphine and diphenylphosphine; and tertiary phosphines such as triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkylalkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, trinaphthylphosphine, and tris(benzyl)phosphine; phosphine compounds such as complexes of the above organic phosphines with organoborons; and complexes of the above organic phosphines or the above phosphine compounds with maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, compounds having intramolecular polarization obtained by adding a compound having a π bond, such as quinone compounds, such as 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and anthraquinone, or diazophenylmethane; a compound having intramolecular polarization, which is obtained by reacting a halogenated phenol compound such as bromo-1-naphthol, 3-iodophenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-t-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, or 4-bromo-4'-hydroxybiphenyl, followed by a dehydrohalogenation step;Examples of the curing accelerator include tetra-substituted phosphonium compounds such as tetraphenylphosphonium, tetraphenylborate salts of tetra-substituted phosphonium such as tetraphenylphosphonium tetra-p-tolylborate, and salts of tetra-substituted phosphonium with phenolic compounds; phosphobetaine compounds; and adducts of phosphonium compounds with silane compounds. Examples of the curing accelerator capable of low-temperature curing include an adduct of tributylphosphine and 1,4-benzoquinone, dimethylaminopyridine, 2-ethyl-4-methylimidazole, 2-methylimidazole, and 1-benzyl-2-methylimidazole. One type of curing accelerator may be used alone, or two or more types may be used in combination.

[0053] When the molding resin composition contains a curing accelerator, the content of the curing accelerator is preferably 0.1% by mass to 8% by mass based on the total amount of the epoxy resin and the curing agent.

[0054] (Inorganic Filler) The molding resin composition contains an inorganic filler including a titanium-containing high dielectric filler.

[0055] The type of inorganic filler is not particularly limited as long as it contains a titanium-containing high dielectric filler, and may consist solely of a titanium-containing high dielectric filler, or may consist of a titanium-containing high dielectric filler and other inorganic fillers.

[0056] The titanium-containing high-dielectric filler is not particularly limited as long as it is a filler containing titanium element and has a high dielectric constant, and examples thereof include barium titanate, calcium titanate, strontium titanate, potassium titanate, magnesium titanate, lead titanate, aluminum titanate, lithium titanate, and zinc zirconate titanate. Preferred titanium-containing high-dielectric fillers are calcium titanate and strontium titanate, with calcium titanate being more preferred. One type of titanium-containing high-dielectric filler may be used alone, or two or more types may be used in combination. However, from the viewpoint of keeping the dielectric loss tangent of the cured product low, the content of barium titanate is preferably less than 1% by volume, more preferably less than 0.5% by volume, and even more preferably less than 0.1% by volume, of the total inorganic filler.

[0057] Examples of other inorganic fillers include inorganic materials such as silica (e.g., spherical silica, crystalline silica), glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite, spinel, mullite, titania, talc, clay, and mica. Inorganic fillers with flame retardant properties may also be used. Examples of inorganic fillers with flame retardant properties include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides (e.g., magnesium-zinc composite hydroxide), and zinc borate. The other inorganic filler preferably includes at least one selected from the group consisting of silica particles and alumina particles. One type of other inorganic filler may be used alone, or two or more types may be used in combination.

[0058] The inorganic filler may be in the form of powder, beads formed by spheroidizing the powder, fibers, or the like.

[0059] The content of the titanium-containing high dielectric filler is preferably 5% by volume to 100% by volume, more preferably 10% by volume to 80% by volume, and even more preferably 30% by volume to 80% by volume, based on the total inorganic filler.

[0060] The content (vol %) of the titanium-containing high dielectric filler relative to the entire inorganic filler can be determined by the following method. A thin slice sample of the cured molding resin composition is imaged using a scanning electron microscope (SEM). An arbitrary area S is identified in the SEM image, and the total area A of the inorganic fillers contained in area S is determined. Next, an SEM-EDX (energy dispersive X-ray spectrometer) is used to identify the elements of the inorganic filler, thereby determining the total area B of the titanium-containing high dielectric fillers contained within the total area A of the inorganic fillers. The total area B of the titanium-containing high dielectric fillers is divided by the total area A of the inorganic fillers, and converted into a percentage (%), which is the content (vol %) of the titanium-containing high dielectric filler relative to the entire inorganic filler. The area S is set to be sufficiently large compared to the size of the inorganic filler. For example, it is set to be large enough to contain 100 or more inorganic fillers. The area S may be the sum of multiple cross-sections.

[0061] The content of the inorganic filler is not particularly limited. From the viewpoint of fluidity and strength, the content of the inorganic filler is preferably 30% by volume to 90% by volume, more preferably 35% by volume to 85% by volume, and even more preferably 40% by volume to 80% by volume, based on the entire molding resin composition. When the content of the inorganic filler is 30% by volume or more based on the entire molding resin composition, the properties of the cured product, such as the thermal expansion coefficient, thermal conductivity, and elastic modulus, tend to be further improved. When the content of the inorganic filler is 90% by volume or less based on the entire molding resin composition, an increase in the viscosity of the molding resin composition is suppressed, and the fluidity is further improved, tending to result in better moldability.

[0062] The shape of the inorganic filler is not particularly limited, and examples thereof include spherical, elliptical, and irregular shapes. The inorganic filler may be crushed. The titanium-containing high-dielectric filler may be surface-treated.

[0063] The volume average particle size of the titanium-containing high dielectric filler is preferably 0.1 μm to 100 μm, more preferably 0.2 μm to 80 μm, and even more preferably 0.5 μm to 30 μm.

[0064] The average particle size of the other inorganic filler is not particularly limited. For example, the volume average particle size is preferably 20 μm or less, more preferably 0.1 μm to 20 μm, even more preferably 0.2 μm to 18 μm, and particularly preferably 0.3 μm to 15 μm. When the volume average particle size is 20 μm or less, the ability to fill narrow gaps tends to be improved. Furthermore, when the volume average particle size is 0.1 μm or more, the increase in viscosity of the molding resin composition tends to be further suppressed.

[0065] The volume average particle diameter of the inorganic filler can be measured as a volume average particle diameter (D50) using a laser diffraction scattering particle size distribution measuring device.

[0066] (Carbon Black and Black Titanium Oxide) The molding resin composition contains carbon black and black titanium oxide. The carbon black and black titanium oxide may each independently be used alone or in combination of two or more.

[0067] It is preferable that at least the black titanium oxide is surface-treated, and it is more preferable to use surface-treated black titanium oxide in combination with non-surface-treated carbon black.

[0068] Black titanium oxide is Ti ｎ O （２ｎ－１） (n is a positive integer). The black titanium oxide Ti ｎ O （２ｎ－１） It is preferable to use one in which n is 4 to 6 as the black titanium oxide. By making n 4 or more, the dispersibility of the black titanium oxide in the molding resin composition tends to be improved. On the other hand, by making n 6 or less, the printability by laser marking method tends to be further improved. The molding resin composition contains Ti as the black titanium oxide. ４ O ７ , Ti ５ O ９ , and Ti ６ O １１ It is preferable to include at least one of the following:

[0069] The surface-treated black titanium oxide may be black titanium oxide that has been surface-treated with a surface treatment agent. Examples of the surface treatment agent for black titanium oxide include coupling agents such as silane coupling agents and titanium coupling agents. One type of coupling agent may be used alone, or two or more types may be used in combination.

[0070] Examples of silane coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-(2-aminoethyl)aminopropyltrimethoxysilane, 3-(2-aminoethyl)aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-ureidopropyltriethoxysilane, octenyltrimethoxysilane, glycidoxyoctyltrimethoxysilane, and methacryloxyoctyltrimethoxysilane.

[0071] Examples of titanium coupling agents include isopropyl triisostearoyl titanate, isopropyl tris(dioctyl pyrophosphate) titanate, isopropyl tri(N-aminoethyl-aminoethyl) titanate, tetraoctyl bis(ditridecyl phosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecyl phosphite) titanate, bis(dioctyl pyrophosphate)oxyacetate titanate, bis(dioctyl pyrophosphate)ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacryl isostearoyl titanate, isopropyl tridodecyl benzenesulfonyl titanate, isopropyl isostearoyl diacryl titanate, isopropyl tri(dioctyl phosphate) titanate, isopropyl tricumyl phenyl titanate, and tetraisopropyl bis(dioctyl phosphite) titanate.

[0072] Examples of methods for surface treating black titanium oxide include a method in which a solution containing a coupling agent is added to a slurry containing black titanium oxide, the mixture is stirred, and then the surface-treated black titanium oxide is separated by filtration or the like and dried, and a method in which a coupling agent is sprayed onto the black titanium oxide and the mixture is dried.

[0073] The average particle size of the black titanium oxide is not particularly limited. For example, the volume average particle size of the black titanium oxide is preferably 0.01 μm to 1 μm, more preferably 0.015 μm to 0.1 μm, and even more preferably 0.02 μm to 0.07 μm. When the volume average particle size of the black titanium oxide is 0.01 μm or more, an increase in the viscosity of the molding resin composition tends to be further suppressed. When the volume average particle size of the black titanium oxide is 1 μm or less, the ability to fill narrow gaps tends to be further improved.

[0074] Examples of carbon black include acetylene black, ketjen black, thermal black, and furnace black.

[0075] The molding resin composition may contain colorants other than carbon black and black titanium oxide, such as known colorants such as organic dyes, organic pigments, red lead, and red iron oxide.

[0076] From the viewpoint of improving printability by laser marking, the content of carbon black in the molding resin composition is preferably 0.1% by mass to 1.0% by mass, and more preferably 0.2% by mass to 0.8% by mass.

[0077] The content of black titanium oxide in the molding resin composition is preferably 0.2% by mass to 3.0% by mass, and more preferably 0.5% by mass to 2.0% by mass, from the viewpoint of improving printability by laser marking.

[0078] The total content of carbon black and black titanium oxide in the molding resin composition is preferably 0.3 to 4.0% by mass, and more preferably 0.5 to 3.0% by mass.

[0079] The mass ratio of carbon black to black titanium oxide (carbon black / black titanium oxide) is preferably 0.01 to 10.0, more preferably 0.1 to 2.0, and even more preferably 0.2 to 1.0.

[0080] (Various Additives) In addition to the components described above, the molding resin composition may contain various additives such as coupling agents, ion exchangers, mold release agents, flame retardants, stress relaxation agents, etc. In addition to the additives exemplified below, the molding resin composition may also contain various additives known in the art, as needed.

[0081] (Method for Preparing Molding Resin Composition) The method for preparing the molding resin composition is not particularly limited. When the molding resin composition is solid, a common method includes thoroughly mixing predetermined amounts of components using a mixer or the like, melt-kneading the mixture using a mixing roll, extruder, or the like, cooling, and pulverizing the mixture. More specifically, a method includes uniformly stirring and mixing predetermined amounts of the above-mentioned components, kneading the mixture using a kneader, roll, extruder, twin-screw extruder, or the like that has been preheated to 70°C to 140°C, cooling, and pulverizing the mixture. When the molding resin composition is liquid, a common method includes weighing predetermined amounts of components, dispersing and kneading them using a three-roll mill, crusher, planetary mixer, hard mixer, homomixer, or the like. Furthermore, a method using a masterbatch in which the respective components are pre-dispersed and pre-heated is preferred in terms of uniform dispersion and flowability.

[0082] When the molding resin composition is solid, its shape is not particularly limited, and examples include powder, granules, tablets, pellets, etc. When the molding resin composition is in tablet or pellet form, it is preferable from the viewpoint of handleability that the dimensions and mass are set to match the molding conditions of the package. When the molding resin composition is in liquid form, the viscosity at 25°C is preferably less than 1000 Pa·s, more preferably 800 Pa·s or less, and even more preferably 500 Pa·s or less. In the present disclosure, the viscosity at 25°C refers to the value measured at a shear rate of 10 rpm using a rotary shear viscometer equipped with a cone plate (diameter 48 mm, cone angle 1°).

[0083] (Uses of Molding Resin Composition) The molding resin composition of this embodiment can be applied, for example, to the manufacture of electronic component devices, particularly high-frequency devices, as described below. In particular, in recent years, with the spread of fifth-generation mobile communication systems (5G), semiconductor packages (PKGs) used in electronic component devices have become increasingly sophisticated and miniaturized. As PKGs become smaller and more sophisticated, the development of antenna-in-package (AiP), which is a PKG with an antenna function, has also been progressing. In AiPs, radio waves used for communication are becoming higher in frequency to accommodate an increase in the number of channels due to the diversification of information, and sealing materials are required to have both a high dielectric constant and a low dielectric loss tangent. As described above, the molding resin composition of this embodiment can produce a cured product that has both a high dielectric constant and a low dielectric loss tangent. Therefore, the molding resin composition is particularly suitable for antenna-in-package (AiP) applications in high-frequency devices, in which an antenna arranged on a support member is sealed with the molding resin composition.

[0084] An electronic component device according to an embodiment of the present disclosure includes a support member, an electronic component disposed on the support member, and a cured product of the molding resin composition encapsulating the electronic component. Examples of the electronic component device include a support member such as a lead frame, a pre-wired tape carrier, a wiring board, glass, a silicon wafer, or an organic substrate, on which electronic components (active elements such as semiconductor chips, transistors, diodes, and thyristors, passive elements such as capacitors, resistors, and coils, and antennas) are mounted, and the resulting electronic component region is encapsulated with the molding resin composition (e.g., a high-frequency device).

[0085] The type of the support member is not particularly limited, and a support member generally used in the manufacture of electronic component devices can be used. The electronic component may include an antenna, or may include an antenna and an element other than an antenna. The antenna is not limited as long as it functions as an antenna, and may be an antenna element or wiring.

[0086] In the electronic component device of the present embodiment, if necessary, another electronic component may be disposed on the surface of the support member opposite to the surface on which the electronic component is disposed. The other electronic component may be encapsulated with the molding resin composition described above, or with another resin composition, or may not be encapsulated.

[0087] (Method for manufacturing an electronic component device) The method for manufacturing an electronic component device according to this embodiment includes the steps of placing electronic components on a support member and encapsulating the electronic components with the molding resin composition. The method for carrying out each of the above steps is not particularly limited, and can be carried out by a general method. Furthermore, the types of support member and electronic components used in manufacturing the electronic component device are not particularly limited, and support members and electronic components commonly used in manufacturing electronic component devices can be used.

[0088] Methods for encapsulating electronic components using the molding resin composition include low-pressure transfer molding, injection molding, compression molding, etc. Among these, low-pressure transfer molding is the most common.

[0089] The above-described embodiment will be specifically described below using examples, but the scope of the above-described embodiment is not limited to these examples.

[0090] <Preparation of molding resin compositions> The molding resin compositions of Examples and Comparative Examples were prepared by mixing the components shown below in the blending ratios (parts by mass) shown in Tables 1 and 2. These molding resin compositions were solid at room temperature and normal pressure. In Tables 1 and 2, blank spaces indicate that the component was not included.

[0091] Epoxy resin 1: biphenyl aralkyl type epoxy resin, epoxy equivalent 274 g / eq. Epoxy resin 2: biphenyl type epoxy resin, epoxy equivalent 192 g / eq.

[0092] Curing agent 1: active ester compound, DIC Corporation, product name "EXB-8" Curing agent 2: melamine-modified phenolic resin, reactive group equivalent 120 g / eq Curing agent 3: biphenyl aralkyl-type phenolic resin, hydroxyl group equivalent 199 g / eq

[0093] Curing accelerator: Triphenylphosphine / 1,4-benzoquinone adduct Coupling agent: N-phenyl-3-aminopropyltrimethoxysilane Mold release agent: Montan acid ester wax

[0094] Carbon black 1: Carbon black, Mitsubishi Chemical Corporation, product name "MA100" Carbon black 2: Carbon black, Mitsubishi Chemical Corporation, product name "MA600" Carbon black 3: Carbon black, Tokai Carbon Co., Ltd., product name "#40FF" Carbon black 4: Carbon black, Tokai Carbon Co., Ltd., product name "#20FF"

[0095] ・Carbodiimide: Cyclic carbodiimide ・Silicone: Silicone resin

[0096] Inorganic filler 1: alumina particles, volume average particle size: 13 μm, specific surface area: approximately 1.0 m ２ / g Inorganic filler 2: alumina particles, volume average particle size: 1.5 μm, specific surface area: approximately 1.0 m ２ / g Inorganic filler 3: alumina particles, volume average particle size: 0.3 μm, specific surface area: approximately 6.0 m ２ / g Inorganic filler 4: calcium titanate particles, volume average particle size: 0.25 μm, specific surface area: approximately 14.0 m ２ / g Inorganic filler 5: calcium titanate particles, volume average particle size: 23 μm, specific surface area: approximately 1.0 m ２ / g Black titanium oxide: black titanium oxide particles surface-treated with a coupling agent, volume average particle size: 0.6 μm, specific surface area: approximately 40 m ２ / g

[0097] The volume-average particle size of each inorganic filler was a value obtained by the following measurement. Specifically, the inorganic filler was first added to a dispersion medium (water) in an amount ranging from 0.01% by mass to 0.1% by mass, and the mixture was dispersed in a bath-type ultrasonic cleaner for 5 minutes. Five milliliters of the resulting dispersion was poured into a cell, and the particle size distribution was measured at 25°C using a laser diffraction / scattering particle size distribution analyzer (HORIBA, Ltd., LA920). The particle size at an integrated value of 50% (volume basis) in the resulting particle size distribution was taken as the volume-average particle size.

[0098] <Evaluation of Molding Resin Composition> (Dielectric Constant and Dielectric Loss Tangent) The molding resin composition was charged into a vacuum hand press and molded under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 600 seconds. Post-curing was carried out at 175°C for 6 hours to obtain a plate-shaped cured product (12.5 mm long, 25 mm wide, 0.2 mm thick). This plate-shaped cured product was used as a test piece and the dielectric constant and dielectric loss tangent were measured at a temperature of 25±3°C and 10 GHz using a dielectric constant measuring device (Agilent Technologies, product name "Network Analyzer N5227A"). The results are shown in Tables 1 and 2 ("Dielectric Constant" and "Dielectric Loss Tangent" in the tables).

[0099] (Fluidity: Spiral Flow) Using a spiral flow measurement mold conforming to EMMI-1-66, the molding resin composition was molded under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds, and the flow distance (cm) was determined. The results are shown in Tables 1 and 2 ("Flow distance (cm)" in the tables).

[0100] (Printing Evaluation) Characters were marked on a cured product of the molding resin composition using a YAG laser marker (MD-H9800) manufactured by Keyence Corporation under conditions of an excitation source output of 50%, a Q-switch frequency of 10 kHz, and a scan speed of 500 mm / sec. The marking depth (μm) at which the marked characters were visible was determined using a digital microscope (VHX-7000) manufactured by Keyence Corporation. The results are shown in Tables 1 and 2.

[0101]

[0102]

[0103] As shown in Tables 1 and 2, it can be seen that the molding resin compositions of Examples had better printability than the molding resin compositions of Comparative Examples.

[0104] The disclosure of Japanese Patent Application No. 2023-188830, filed on November 2, 2023, is incorporated herein by reference in its entirety. All documents, patent applications, and technical standards mentioned herein are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A molding resin composition comprising: a curable resin; an inorganic filler including a titanium-containing high dielectric filler; carbon black; and black titanium oxide.

2. The molding resin composition according to claim 1, wherein the inorganic filler further contains another inorganic filler which is at least one type selected from the group consisting of silica particles and alumina particles.

3. The molding resin composition according to claim 1, wherein the curable resin comprises an epoxy resin, and the molding resin composition further comprises a curing agent.

4. The molding resin composition according to claim 3, wherein the curing agent comprises an active ester compound.

5. The molding resin composition according to claim 3, wherein the curing agent comprises at least one other curing agent selected from the group consisting of a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, a polymercaptan curing agent, a polyaminoamide curing agent, an isocyanate curing agent, and a blocked isocyanate curing agent, and an active ester compound.

6. The molding resin composition according to claim 1, wherein the content of said titanium-containing high dielectric filler is 30% by volume to 80% by volume based on the total volume of said inorganic filler.

7. The molding resin composition according to claim 1, wherein the total content of said carbon black and said black titanium oxide is 0.3% by mass to 4.0% by mass based on the entire molding resin composition.

8. The molding resin composition according to any one of claims 1 to 7, which is used in a high-frequency device.

9. The molding resin composition according to any one of claims 1 to 7, which is used for an antenna-in-package.

10. An electronic component device comprising: a support member; an electronic component placed on the support member; and a cured product of the molding resin composition according to any one of claims 1 to 7, encapsulating the electronic component.

11. The electronic component device of claim 10, wherein the electronic component includes an antenna.

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