Solid state disk device and electronic device

Abstract

A solid state disk device (100) and an electronic device (200). The solid state disk device (100) comprises a circuit board (1), a thermally conductive metal block (5), a control chip (2), a memory (4), and an insertion structure (3). The circuit board (1) comprises a heat dissipation area (12) and an electronic part area (11). The thermally conductive metal block (5) is embedded in the heat dissipation area (12), and the heat dissipation area (12) occupies at least one half of a wide side surface of the circuit board (1). The thermally conductive metal block (5) can be provided with a heat dissipation through hole (52) on the basis of actual requirements. Two end surfaces (51) of the thermally conductive metal block (5) are exposed on two sides of the circuit board (1). The control chip (2) and the memory (4) are fixedly arranged in the electronic part area (11). The solid state disk device (100) can be connected to a slot (2013) of an electronic device (200) by means of the insertion structure (3). The thermally conductive metal block (5) is not connected to a circuit in the circuit board (1) used for connecting the control chip (2) and the memory (4). The heat dissipation area (12) is not provided with the control chip (2) or the memory (4).

Description

Solid state drive device and electronic device Technical Field

[0001] The present invention relates to a solid state drive device and an electronic device, and more particularly to a solid state drive device (SSD) with good heat dissipation effect and an electronic device comprising the solid state drive device. Background Art

[0002] In the prior art, solid-state drives (SSDs) installed in computers generate a significant amount of heat during operation. This is especially true for SSDs installed in laptops. Because laptops are relatively confined, the heat generated by the SSDs during operation is difficult to dissipate. Therefore, laptop manufacturers install SSD devices such as fans and water coolers around the SSDs to dissipate the heat generated during operation. However, installing either a fan or a water cooler significantly increases the cost of the laptop.

[0003] Summary of the Invention

[0004] The present invention discloses a solid state hard disk device and an electronic device, which are mainly used to improve the problem of poor heat dissipation effect of existing common solid state hard disks.

[0005] One embodiment of the present invention discloses a solid-state hard disk device, which includes: a circuit board, which includes a heat dissipation area and an electronic component area, the heat dissipation area occupies at least half of a wide side surface of the circuit board; the circuit board includes a through hole in the heat dissipation area; a heat-conducting metal block, at least a portion of which is fixedly disposed in the through hole, and both end surfaces of the heat-conducting metal block are exposed on both sides of the circuit board; at least one control chip, which is fixedly disposed in the electronic component area; at least one memory, which is fixedly disposed in the electronic component area; a plug-in structure, which is disposed at one end of the circuit board; the solid-state hard disk device can be connected to a slot of an electronic device through the plug-in structure; wherein the heat-conducting metal block is not connected to the circuit in the circuit board used to connect the control chip and the memory; and no control chip or memory is disposed in the heat dissipation area.

[0006] Preferably, the circuit board is a multi-layer board structure, the circuit board includes multiple layers of core boards, each layer of core boards includes a through hole, and the through holes of each core board are interconnected to form a through hole; the multiple layers of core boards are connected to each other by an adhesive, and the heat-conducting metal block is fixed to the multiple layers of core boards by the adhesive.

[0007] Preferably, the circuit board is provided with at least one auxiliary heat-conducting structure on a side opposite to the side where the control chip is provided. The auxiliary heat-conducting structure is not connected to the circuit in the circuit board used to connect the control chip and the memory, and is connected to the heat-conducting metal block.

[0008] Preferably, the circuit board further includes at least one thermal conductive through-hole in the electronic component area. The thermal conductive through-hole is set through the circuit board and is adjacent to one of the control chip and the memory. A thermal conductive block is filled in the thermal conductive through-hole, and one end of the thermal conductive block is connected to the auxiliary thermal conductive structure; the thermal conductive block is not connected to the circuit in the circuit board used to connect the control chip and the memory.

[0009] Preferably, the heat-conducting metal block further includes at least one heat-dissipating through-hole, and the heat-dissipating through-hole passes through the heat-conducting metal block.

[0010] Preferably, at least one end surface of the heat-conducting metal block is formed with at least one heat-conducting channel, and both ends of the heat-conducting channel have openings communicating with the outside.

[0011] Preferably, the solid state drive device further includes an auxiliary heat sink, a portion of which is fixed to a surface of at least one of the control chip and the memory, and a portion of which is fixed to a surface of the heat-conducting metal block.

[0012] Preferably, at least one memory is further provided on the side of the circuit board opposite to the side where the control chip is provided.

[0013] Preferably, the solid-state drive device complies with the PCIe Gen5 M.2 specification.

[0014] One embodiment of the present invention discloses an electronic device, comprising: the solid-state hard disk device of the present invention described above, a body, a cover, and an auxiliary heat sink, wherein a circuit board is disposed in the body, the circuit board having a slot, and a portion of the slot and the circuit board is exposed from an opening in the body; the plug-in structure of the solid-state hard disk device is used to be plugged into the slot, the cover is detachably fixed to the body, and the cover can cover the opening; the auxiliary heat sink is fixed to the inner side of the cover; when the cover is fixed to the body and the plug-in structure of the solid-state hard disk device is plugged into the slot, a portion of the auxiliary heat sink is attached to at least one of the control chip and the memory, and a portion of the auxiliary heat sink is attached to a portion of the heat-conducting metal block.

[0015] In summary, the storage device and electronic device of the present invention can effectively increase the heat dissipation effect of the storage device during operation through the design of thermally conductive metal, thereby preventing the storage device from malfunctioning due to high temperature.

[0016] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] 1 and 2 are schematic diagrams of a solid-state hard disk device according to a first embodiment of the present invention from different perspectives.

[0018] FIG3 is a schematic cross-sectional view of FIG1 along the III-III section line.

[0019] FIG. 4 is a side view of a second embodiment of a solid state drive device according to the present invention.

[0020] FIG. 5 is a partially exploded schematic diagram of a third embodiment of a solid state drive device according to the present invention.

[0021] FIG. 6 is a schematic diagram of another side of the third embodiment of the solid state drive device of the present invention.

[0022] FIG7 is a schematic cross-sectional view of FIG5 along the VII-VII section line.

[0023] FIG. 8 is a schematic diagram of a solid state drive device according to a fourth embodiment of the present invention.

[0024] 9 and 10 are schematic diagrams of a sixth embodiment of a solid-state drive device according to the present invention from different viewing angles.

[0025] 11 and 12 are schematic diagrams of a seventh embodiment of a solid-state drive device according to the present invention from different viewing angles.

[0026] FIG13 is a schematic cross-sectional view of FIG11 along the XIII-XIII section line.

[0027] FIG. 14 is a schematic cross-sectional view of an electronic device according to an eighth embodiment of the present invention.

[0028] FIG. 15 is a partially exploded schematic diagram of the electronic device of the present invention. DETAILED DESCRIPTION

[0029] In the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used to emphasize that most of the relevant content described in the subsequent description appears in the specific figure, but it does not limit the subsequent description to only referring to the specific figure.

[0030] Please refer to Figures 1 to 3 . Figures 1 and 2 are schematic diagrams of a first embodiment of a solid-state drive device according to the present invention from different perspectives, and Figure 3 is a schematic cross-sectional view taken along line III-III of Figure 1 . The solid-state drive device 100 according to the present invention comprises a circuit board 1, a control chip 2, a plug-in structure 3, a plurality of memory cells 4, and a heat-conducting metal block 5. The solid-state drive device 100 according to the present invention is a solid-state drive (SSD), particularly suitable for use as an SSD installed in a laptop computer. For example, the solid-state drive device 100 according to the present invention can be used as a SATA M.2 SSD, an NVMe M.2 SSD, a PCIe Gen5 M.2 SSD, etc. It should be noted that because the solid-state drive device 100 according to the present invention has better heat dissipation than traditional solid-state drives, it is particularly suitable for use as a PCIe Gen5 M.2 SSD, as PCIe Gen5 M.2 SSDs generate relatively more heat during operation.

[0031] The circuit board 1 includes an electronic component area 11 and a heat dissipation area 12. The electronic component area 11 is provided with a control chip 2, memory 4, resistors, and other necessary electronic components required for the operation of the solid-state drive. The control chip 2 is, for example, a variety of microprocessors. The number and location of the control chip 2 and memory 4 are not limited to those shown in the figure. One end of the circuit board 1 has a plug-in structure 3. The plug-in structure 3 is, for example, a plug-in structure that complies with the PCIe specification. The solid-state drive device 100 can be connected to a slot of an electronic device (such as a laptop computer, motherboard, etc.) through the plug-in structure 3.

[0032] The heat dissipation area 12 is not equipped with electronic components such as the control chip 2 and the memory 4. The heat dissipation area 12 occupies at least half of a wide side of the circuit board 1. In practical applications, if the heat dissipation area 12 occupies at least one-third of the wide side of the circuit board, the heat dissipation effect of the storage device can be further improved.

[0033] The thermally conductive metal block 5 is, for example, a metal with high thermal conductivity, such as copper. It is embedded in the heat dissipation area 12 of the circuit board 1. Specifically, the circuit board 1 includes a through-hole 13 in the heat dissipation area 12. The thermally conductive metal block 5 is fixedly mounted in the through-hole 13, with both end surfaces 51 of the thermally conductive metal block 5 exposed on the two wide side surfaces of the circuit board 1.

[0034] As shown in Figure 3, in one practical application, the circuit board 1 can be, for example, a multilayer circuit board. A multilayer circuit board includes multiple core boards (cores), and each core board 14 can have a perforation of the same size at the same location. When multiple core boards 14 are stacked, the perforations of each core board 14 will be interconnected, forming the through-holes 13, and the thermally conductive metal blocks 5 can be correspondingly disposed in the through-holes 13. Before the multiple core boards 14 are pressed together, a circuit board adhesive 20 is disposed between each core board 14, and the thermally conductive metal blocks 5 can be connected to the multiple core boards 14 via the multiple adhesives 20. When the multiple core boards 14 are stacked together via the adhesive 20, and the thermally conductive metal blocks 5 are also disposed in the through-holes 13 via the adhesive 20, the multiple core boards 14 and the thermally conductive metal blocks 5 can be pressed together to form a multilayer circuit board using relevant pressing equipment. The manufacturing method of the multilayer circuit board can be varied according to actual needs. The above description is only used to illustrate one specific embodiment in which the thermally conductive metal blocks 5 are embedded in the circuit board 1.

[0035] It is worth mentioning that the heat-conducting metal block 5 is mainly used to assist in heat dissipation during the operation of the solid-state hard disk device 100. Therefore, the heat-conducting metal block 5 is not connected to the circuit in the circuit board 1 used to connect the control chip 2 and the memory 4. In the embodiment where the circuit board 1 is a multi-layer circuit board, the surface or interior of each core board 14, adjacent to the perforation, may also be provided with a copper circuit (or other material with good thermal conductivity). The multiple copper circuits are used to connect to the heat-conducting metal block 5, and the multiple copper circuits are not connected to other electronic components such as the control chip 2 or the memory 4. In other words, the multiple copper circuits are only used to connect to the heat-conducting metal block 5. As a result, part of the heat energy generated during the operation of the solid-state hard disk device 100 can be transferred to the heat-conducting metal block 5 through the circuit board 1 and the multiple copper circuits, and then transferred outward by the heat-conducting metal block 5.

[0036] As shown in FIG3 , it should be noted that in the drawings of this embodiment, the two end surfaces 51 of the heat-conducting metal block 5 are shown as being flush with the front surface 15 and the back surface 16 of the circuit board 1 , respectively. However, the present invention is not limited to this embodiment. In different embodiments, at least one of the two end surfaces 51 of the heat-conducting metal block 5 may not be flush with the corresponding front surface 15 and back surface 16 of the circuit board 1 .

[0037] As described above, the solid-state drive device 100 of the present invention, by embedding a heat-conducting metal block 5 in the circuit board 1, allows the heat energy generated during operation of the solid-state drive device 100 to be transferred outward through the circuit board 1 and the heat-conducting metal block 5. This can significantly enhance the heat dissipation effect of the solid-state drive device 100 and significantly reduce the problem of the solid-state drive device 100 not being able to operate normally due to heat accumulation.

[0038] Please refer to Figure 4, which is a side schematic diagram of the second embodiment of the solid-state hard disk device of the present invention. The biggest difference between this embodiment and the aforementioned embodiment is that the solid-state hard disk device 100 can also include an auxiliary heat sink 6. A portion of the auxiliary heat sink 6 is fixedly disposed on the surface of at least one of the control chip 2 and the memory 4, and a portion of the auxiliary heat sink 6 is fixed to the surface of the heat-conducting metal block 5. The auxiliary heat sink 6 is, for example, various types of thermal pads (Thermal Pad), but is not limited to this. As long as it can be used to transfer heat energy, it falls within the scope of application of the auxiliary heat sink 6. In actual applications, the auxiliary heat sink 6 can be, for example, fixed to the control chip 2, the memory 4 and the heat-conducting metal block 5 using colloids such as heat dissipation glue and high-temperature resistant double-sided tape.

[0039] Through the design of auxiliary heat sink 6, the large amount of heat generated by control chip 2 and memory 4 during operation of solid-state drive device 100 can be transferred outward through auxiliary heat sink 6 and heat-conducting metal block 5, thereby achieving rapid heat dissipation. The specific material, size, and shape of auxiliary heat sink 6 can be varied according to needs and are not limited to those shown in the figure.

[0040] In one embodiment, a portion of the auxiliary heat sink 6 may, for example, simultaneously cover the surface of the control chip 2, the surfaces of all memories 4 located on the same side, and the entire surface of the heat-conducting metal block 5. In different embodiments, the auxiliary heat sink 6 may also cover only a portion of the surface of the heat-conducting metal block 5.

[0041] Please refer to Figures 5 to 7 together. Figure 5 is a partially exploded schematic diagram of the third embodiment of the solid-state hard disk device of the present invention, Figure 6 is a schematic diagram of the other side of the third embodiment of the solid-state hard disk device of the present invention, and Figure 7 is a cross-sectional schematic diagram along the VII-VII section line of Figure 5.

[0042] As shown in FIG6 , one difference between this embodiment and the previous embodiment is that an auxiliary heat-conducting structure 17 may be provided on the side of the circuit board 1 opposite to the side where the control chip 2 is provided, that is, on the back side 16 of the circuit board 1 . The auxiliary heat-conducting structure 17 may be, for example, copper foil (or a related metal with high thermal conductivity) laid on the surface of the circuit board 1 . The auxiliary heat-conducting structure 17 may be connected to the heat-conducting metal block 5 . For example, a portion of the auxiliary heat-conducting structure 17 may extend to the sidewall of the through-hole 13 , and the heat-conducting metal block 5 may directly contact the auxiliary heat-conducting structure 17 located in the through-hole 13 , thereby connecting them. In practical applications, the auxiliary heat-conducting structure 17 may be manufactured during the manufacturing process of the circuit board 1 , for example, but is not limited to this.

[0043] In different embodiments, the auxiliary thermal conductive structure 17 may be formed on the back side 16 of the circuit board 1 through relevant manufacturing processes after the thermal conductive metal block 5 has been embedded in the circuit board 1. In this example, a portion of the auxiliary thermal conductive structure 17 may be directly formed on the surface of the thermal conductive metal block 5, and the auxiliary thermal conductive structure 17 and the thermal conductive metal block 5 may be connected to each other.

[0044] As described above, the solid-state drive device 100 of this embodiment can further increase the heat dissipation surface of the solid-state drive device 100 through the design of the auxiliary heat-conducting structure 17 , thereby further improving the overall heat dissipation effect of the solid-state drive device 100 .

[0045] As shown in Figures 5 and 7, another difference between this embodiment and the previous embodiment is that the circuit board 1 may include a plurality of heat-conducting through-holes 18 in the electronic component area 11, and each heat-conducting through-hole 18 is filled with a heat-conducting block 19, and one end of each heat-conducting block 19 is arranged adjacent to one of the control chip 2 and the memory 4, and the other end of the heat-conducting block 19 is connected to the auxiliary heat-conducting structure 17. With this design, when the solid-state hard disk device 100 is operating, part of the heat energy generated by the control chip 2 and the memory 4 can be transferred to the auxiliary heat-conducting structure 17 through the heat-conducting block 19, and then transferred to the outside through the large-area auxiliary heat-conducting structure 17. The size, setting position, and number of the heat-conducting blocks 19 can be designed according to actual needs and are not limited here. In one specific application, the heat-conducting block 19 can be, for example, a copper block.

[0046] It should be noted that the thermal pads 19 are only used to transfer heat generated by the operation of the control chip 2 or memory 4. Therefore, the thermal pads 19 are not connected to the circuitry within the circuit board 1 that connects to the control chip 2, memory 4, and other related electronic components. The number, size, and placement of the thermal pads 19 can be designed based on specific needs and are not limited to those shown in the figure. In practice, the thermal vias 18 and thermal pads 19 can be manufactured simultaneously during the manufacturing process of the circuit board 1.

[0047] It should be noted that, in practical applications, the two different features between this embodiment and the aforementioned embodiment are not limited to being present at the same time, and the two different features may also exist separately according to needs.

[0048] Please refer to Figures 2, 6, and 8. Figure 8 is a schematic diagram of a fourth embodiment of a solid-state drive device according to the present invention. In the embodiments shown in Figures 2 and 6, the circuit board 1 of the solid-state drive device 100 is manufactured using a single-sided punching method. Only one side of the circuit board 1 (the front side 15 of the circuit board 1) is provided with electronic components (control chip 2, memory 4, etc.). The other side of the circuit board 1 (the back side 16 of the circuit board 1) is free of electronic components.

[0049] As shown in FIG8 , the major difference between this embodiment and the embodiment of FIG6 is that at least one electronic component, such as memory 4, is also disposed on the back surface 16 of the circuit board 1. In contrast, in the example shown in FIG8 , the shape of the auxiliary heat-conducting structure 17 disposed on the back surface 16 of the circuit board 1 varies depending on the placement of the memory 4. The number of memory 4 disposed on the back surface 16 of the circuit board 1 is not limited to that shown in the figure, nor is the shape of the auxiliary heat-conducting structure 17.

[0050] As shown in FIG8 , it is worth mentioning that the memory 4 disposed on the back side 16 of the circuit board 1 may be disposed in a horizontal manner so that a larger area can be reserved on the back side 16 of the circuit board 1 for providing the auxiliary heat conducting structure 17 .

[0051] Please refer to Figures 9 and 10, which are schematic diagrams of the sixth embodiment of the solid-state hard disk device of the present invention from different perspectives. The biggest difference between this embodiment and the previous embodiment is that the heat-conducting metal block 5 can also include at least one heat dissipation through-hole 52, and the heat dissipation through-hole 52 is set through the heat-conducting metal block 5. Through the design of the heat dissipation through-hole 52, the heat dissipation area of ​​the heat-conducting metal block 5 can be further increased, thereby improving the heat dissipation effect of the solid-state hard disk device 100. The number, size, appearance, arrangement, etc. of the heat dissipation through-hole 52 can be designed according to actual needs and are not limited to those shown in the figure. The solid-state hard disk device 100 of this embodiment can also allow air to flow between the heat dissipation through-hole 52 through the design of the heat dissipation through-hole 52, thereby allowing heat energy to be transferred outward more quickly through the airflow.

[0052] It should be noted that in the drawings of this embodiment, the auxiliary heat-conducting structure 17 is provided on the back side 16 of the circuit board 1 as an example, but the present invention is not limited to this; in one of the variations of this embodiment, the back side 16 of the circuit board 1 may also not be provided with the auxiliary heat-conducting structure 17.

[0053] In addition, in the drawings of this embodiment, the circuit board 1 is manufactured by single-sided punching as an example, but the present invention is not limited to this. In one of the variations of this embodiment, the circuit board 1 can also be manufactured by double-sided punching, that is, the back side 16 of the circuit board 1 can also be provided with a memory or control chip.

[0054] Please refer to Figures 11 to 14. Figures 11 and 12 are schematic diagrams of the seventh embodiment of the solid-state hard disk device of the present invention from different perspectives. Figure 13 is a cross-sectional schematic diagram of Figure 11 along the XII-XII section line. Figure 14 is a cross-sectional schematic diagram of the eighth embodiment of the electronic device of the present invention. The biggest difference between this embodiment and the previous embodiment is that the two end surfaces 51 of the heat-conducting metal block 5 can also be formed with at least one heat-conducting channel 53. Each heat-conducting channel 53 is, for example, a groove formed at one end of the heat-conducting metal block 5, and the two ends of the groove have openings 54 connected to the outside. The shape, number, width, length, depth, and arrangement of the heat-conducting channels 53 can be varied according to actual needs and are not limited here.

[0055] In practical applications, the heat-conducting metal block 5 is, for example, a copper block. Before being embedded in the circuit board 1 , the heat-conducting metal block 5 may be processed by a related process (such as laser) to form a plurality of heat-conducting channels 53 at both ends of the copper block.

[0056] It should be noted that in the drawings of this embodiment, the auxiliary heat-conducting structure 17 is provided on the back side 16 of the circuit board 1 as an example, but the present invention is not limited to this; in one of the variations of this embodiment, the back side 16 of the circuit board 1 may also not be provided with the auxiliary heat-conducting structure 17.

[0057] In addition, in the drawings of this embodiment, the circuit board 1 is manufactured by double-sided punching as an example, but the present invention is not limited thereto. In one variation of this embodiment, the circuit board 1 can also be manufactured by single-sided punching.

[0058] As shown in Figure 13 , in one specific practical application of this embodiment, both end surfaces 51 of the heat-conducting metal block 5 can be flush with the front surface 15 and back surface 16 of the circuit board 1, respectively, while each heat-conducting channel 53 is formed by the inward concavity of the end surface of the heat-conducting metal block 5. As shown in Figure 14 , in another variation of this embodiment, both end surfaces 51 of the heat-conducting metal block 5 can be higher than the front surface 15 and back surface 16 of the circuit board 1, respectively.

[0059] Please refer to Figure 15, which shows a partially exploded schematic diagram of an electronic device according to the present invention. The electronic device 200 according to the present invention comprises a housing 201, a cover 202, at least one solid-state drive device 100, and two auxiliary heat sinks 6. The electronic device 200 is, for example, a portable electronic device such as a laptop computer, but is not limited thereto. The electronic device 200 may also be, for example, a desktop computer. The housing 201 comprises a housing 2011, a circuit board 2012, a screen, a keyboard, and other electronic components necessary for the operation of the electronic device 200. A portion of the circuit board 2012 is exposed through an opening 20111 in the housing 2011. The cover 202 is detachably secured to the housing 2011 and serves to conceal the opening 20111 in the housing 2011. The circuit board 2012 is provided with a slot 2013 for receiving the plug-in structure 3 of the solid-state drive device 100.

[0060] In practical applications, the solid-state drive device 100 of this embodiment may be the same as the solid-state drive device 100 described in any of the aforementioned embodiments. For detailed description of the solid-state drive device 100 , please refer to the aforementioned embodiments and will not be repeated here.

[0061] In actual applications, one of the auxiliary heat sinks 6 can be fixed to the inner side of the cover 202, for example. When the solid-state drive device 100 is fixedly mounted in the housing 2011 and the cover 202 is fixed to the housing 2011, a portion of the auxiliary heat sink 6 is attached to at least one of the control chip 2 and the memory 4 of the solid-state drive device 100, and a portion of the auxiliary heat sink 6 is attached to the heat-conducting metal block 5. The other auxiliary heat sink 6 is disposed on the side of the solid-state drive device 100 opposite the cover 202. The number and placement of the auxiliary heat sinks 6 are not limited to the above description.

[0062] In summary, the solid-state drive device 100 and electronic device 200 of the present invention, through designs such as the heat-conducting metal block 5, can effectively enhance the heat dissipation of the solid-state drive device 100 during operation, thereby allowing the solid-state drive device 100 to function normally during operation. Because the solid-state drive device 100 of the present invention has a better heat dissipation effect than traditional solid-state drive devices 100, the solid-state drive device 100 of the present invention can be used as a PCIe Gen5 M.2 SSD.

[0063] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, any equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the present invention.

Claims

1. A solid state hard disk device, It is characterized in that The solid state hard disk device comprises: A circuit board, comprising a heat dissipation area and an electronic component area, wherein the heat dissipation area occupies at least one half of a wide side surface of the circuit board; the circuit board comprises a through hole in the heat dissipation area; a heat-conducting metal block, at least a portion of which is fixedly disposed in the through hole, and both end surfaces of the heat-conducting metal block are exposed at two sides of the circuit board; At least one control chip, which is fixedly disposed in the electronic component area; At least one memory, which is fixedly disposed in the electronic component area; A plug-in structure is disposed at one end of the circuit board; the solid state hard disk device can be connected to a slot of an electronic device through the plug-in structure; The heat-conducting metal block is not connected to the circuit in the circuit board for connecting the control chip and the memory; and the heat dissipation area is not provided with the control chip or the memory.

2. The solid state hard disk device according to claim 1, It is characterized in that The circuit board is a multi-layer board structure, and the circuit board includes multiple layers of core boards. Each layer of the core boards includes a through hole, and the through holes of each core board are interconnected to jointly form the through hole; the multiple layers of the core boards are connected to each other by an adhesive, and the heat-conducting metal block is fixed to the multiple layers of the core boards by the adhesive.

3. The solid state hard disk device according to claim 1, It is characterized in that The circuit board is provided with at least one auxiliary heat-conducting structure on a side opposite to the side where the control chip is provided. The auxiliary heat-conducting structure is not connected to the circuit in the circuit board used to connect the control chip and the memory, and the auxiliary heat-conducting structure is connected to the heat-conducting metal block.

4. The solid state hard disk device according to claim 3, It is characterized in that The circuit board further includes at least one heat-conducting through hole in the electronic component area, the heat-conducting through hole is arranged to penetrate the circuit board, and the heat-conducting through hole is arranged adjacent to one of the control chip and the memory, the heat-conducting through hole is filled with a heat-conducting block, one end of the heat-conducting block is connected to the auxiliary heat-conducting structure; the heat-conducting block is not connected to the circuit in the circuit board used to connect the control chip and the memory.

5. The solid state hard disk device according to claim 1, It is characterized in that The heat-conducting metal block further includes at least one heat-dissipating through hole, and the heat-dissipating through hole passes through the heat-conducting metal block.

6. The solid state hard disk device according to claim 1, It is characterized in that At least one end surface of the heat-conducting metal block is formed with at least one heat-conducting channel, and both ends of the heat-conducting channel have openings communicating with the outside.

7. The solid state hard disk device according to claim 1, It is characterized in that The solid state hard disk device further includes an auxiliary heat sink, a portion of which is fixed to the surface of at least one of the control chip and the memory, and a portion of which is fixed to the surface of the heat conductive metal block.

8. The solid state hard disk device according to any one of claims 1 to 7, It is characterized in that The circuit board is further provided with at least one memory on a side opposite to the side where the control chip is provided.

9. The solid state hard disk device according to any one of claims 1 to 7, It is characterized in that The solid state drive device complies with the PCIe Gen5 M.2 specification.

10. An electronic device, It is characterized in that The electronic device comprises: a solid-state hard disk device according to any one of claims 1 to 6, a body, a cover body and an auxiliary heat sink, wherein a circuit main board is arranged in the body, the circuit main board has a slot, and the slot and a portion of the circuit main board are exposed from an opening of the body; the plug-in structure of the solid-state hard disk device is used to be plugged into the slot, the cover body is detachably fixed to the body, and the cover body can cover the opening; the auxiliary heat sink is fixed to the inner side of the cover body; when the cover body is fixed to the body and the plug-in structure of the solid-state hard disk device is plugged into the slot, a portion of the auxiliary heat sink is attached to at least one of the control chip and the memory, and a portion of the auxiliary heat sink is attached to a portion of the heat-conducting metal block.

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