Cover plate assembly and preparation method therefor, and photoelectric apparatus

Abstract

A cover plate assembly (100) and a preparation method therefor, and a photoelectric apparatus. The cover plate assembly (100) comprises: a cover plate main body (1) and a heat dissipation plate (2), wherein the cover plate main body (1) is made of a first metal material; the heat dissipation plate (2) is embedded in the cover plate main body (1), and the heat dissipation plate (2) is made of a second metal material; and the melting point of the first metal material is less than the melting point of the second metal material, and the thermal conductivity of the first metal material is less than the thermal conductivity of the second metal material. Further provided are a preparation method for the cover plate assembly (100), and a photoelectric apparatus comprising the cover plate assembly (100).

Description

Cover plate assembly and preparation method thereof, and optoelectronic device

[0001] Related applications

[0002] This application claims priority to Chinese patent application No. 202311532163.X filed on November 15, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of optoelectronic technology, and in particular to a cover assembly, a preparation method thereof, and an optoelectronic device. Background Art

[0004] With the widespread construction of data center networks and the advancement of the "East-West Computing" strategy, the bandwidth demand for optical networks has grown at a high rate of more than 20%, driving the optical transport network to continue to evolve towards higher speeds and larger capacities.

[0005] Currently, single-wavelength 100G / 200G wavelength division multiplexing equipment has been commercialized on a large scale in carrier backbone networks. Single-wavelength 400G systems are moving from metropolitan area networks to backbone networks, becoming a focus of industry attention. 400G CFP2 optical module technology is mature, and 800G / 1.6T CFP2 optical modules are under development. This environment poses greater challenges to the development of CFP2 optical modules. With the demand for higher speeds and greater capacity, module thermal power consumption increases accordingly, placing increasingly stringent demands on heat dissipation. Traditional zinc or aluminum alloy covers cannot meet these requirements.

[0006] Summary of the Invention

[0007] The main purpose of this application is to provide a cover assembly, a preparation method thereof, and a photoelectric device.

[0008] To achieve the above-mentioned purpose, the present application proposes a cover assembly, comprising: a cover body, the material of the cover body being a first metal material; and a heat sink, embedded in the cover body, the material of the heat sink being a second metal material; wherein, the melting point of the first metal material is lower than the melting point of the second metal material, and the thermal conductivity of the first metal material is lower than the thermal conductivity of the second metal material. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0010] FIG1 is a schematic structural diagram of a cover plate assembly in the prior art;

[0011] FIG2 is a schematic structural diagram of a cover plate assembly according to a first embodiment of the present application;

[0012] FIG3 is a perspective exploded schematic diagram of the cover plate assembly in FIG2 ;

[0013] FIG4 is a schematic structural diagram of the heat dissipation plate in the cover plate assembly in FIG2 ;

[0014] FIG5 is a cross-sectional view of the heat dissipation plate in the cover plate assembly in FIG2 ;

[0015] FIG6 is a partial enlarged view of the center A of the heat dissipation plate in FIG5;

[0016] FIG7 is a schematic diagram of the inner structure of the cover plate assembly in FIG2 .

[0017] Description of reference numerals:

[0018] 100 cover plate assembly; 1 cover plate body; 2 heat sink; 21 embedding portion; 211 embedding insert; 2111 positioning portion; 21111 positioning hole. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below. If specific conditions are not specified in the embodiments, they are carried out according to conventional conditions or the conditions recommended by the manufacturer. If the reagents or instruments used are not specified by the manufacturer, they are all conventional products that can be purchased commercially. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or schemes that A and B meet simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the ability of those of ordinary skill in the art to achieve. When the combination of technical solutions is contradictory or cannot be achieved, it should be considered that the combination of such technical solutions does not exist and is not within the scope of protection required by this application. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of this application.

[0020] With the widespread construction of data center networks and the advancement of the "East-West Computing" strategy, the bandwidth demand for optical networks has grown at a high rate of more than 20%, driving the optical transport network to continue to evolve towards higher speeds and larger capacities.

[0021] Currently, single-wavelength 100G / 200G wavelength division multiplexing equipment has been commercialized on a large scale in carrier backbone networks. Single-wavelength 400G systems are moving from metropolitan area networks to backbone networks, becoming a focus of industry attention. 400G CFP2 optical module technology is mature, and 800G / 1.6T CFP2 optical modules are under development. This environment poses greater challenges to the development of CFP2 optical modules. With the demand for higher speeds and greater capacity, module thermal power consumption increases accordingly, placing increasingly stringent demands on heat dissipation. The thermal conductivity of traditional aluminum alloy covers, at 120W / (mK), cannot meet these requirements.

[0022] As shown in Figure 1, the use of a copper cover (thermal conductivity 380W / (mk)) can improve the heat dissipation performance of the cover assembly. However, due to the high melting point of copper and copper alloys, above 1000°C, it is difficult to form complex structures by injection molding. Machine cutting is the only option, which is very inefficient. This is especially true at the edges of the cover assembly and the locations of special-shaped structures. It is very difficult to ensure cutting accuracy, resulting in low efficiency and affecting production efficiency.

[0023] In view of this, as shown in Figure 2, the present application proposes a cover assembly 100, including: a cover body and a heat sink, the cover body is made of a first metal material; the heat sink is embedded in the cover body, and the heat sink is made of a second metal material; wherein the melting point of the first metal material is lower than the melting point of the second metal material, and the thermal conductivity of the first metal material is lower than the thermal conductivity of the second metal material.

[0024] In the technical method of the present application, the heat sink 2 is embedded in the cover body 1, and the material of the cover body has a lower melting point, and the material of the heat sink 2 has a higher thermal conductivity, so that the material of the cover body 1 is easier to injection mold, and the material of the heat sink 2 has a higher thermal conductivity, thereby improving the heat dissipation performance of the cover assembly 100. The cover body 1 is the main part of the cover assembly 100. Because it adopts a first metal material with a lower melting point, it is convenient to mold it into a complex structure, such as a structure with a concave and convex surface such as a buckle. The material of the heat sink 2 adopts a second metal with better thermal conductivity, which can enhance the heat dissipation performance of the cover assembly 100.

[0025] When the heat sink 2 is located in the middle area, the cover body 1 is located around the heat sink 2. The cover body 1 is an area with a more complex shape and is composed of a metal with a lower melting point, which is more conducive to injection molding. The heat sink 2 in the middle area with a simpler shape adopts a second metal material with better heat dissipation effect. It does not require a complex molding process and can be processed by mechanical cutting, which can meet the needs and improve preparation efficiency.

[0026] In any embodiment of the present application, the melting point of the first metal material is less than or equal to 700°C. The melting point of the first metal material is not higher than 700°C, which is conducive to improving the mold forming performance of the first metal material. When the melting point of the first metal material is higher than 700°C, it is difficult to further increase the heat resistance temperature of the mold, which is not conducive to mold forming and can only be machined, affecting processing efficiency.

[0027] In any embodiment of the present application, the thermal conductivity of the second metal material is greater than or equal to 260 W / mk. The thermal conductivity of the second metal material is not less than 260 W / mk, which can maintain the heat dissipation efficiency of the heat sink 2 within an appropriate range and improve the heat dissipation performance of the cover assembly 100.

[0028] The melting point of the first metal material and the thermal conductivity of the second metal material may be limited simultaneously or separately. When both are set, the heat dissipation performance and the casting processing efficiency of the cover plate assembly 100 are higher.

[0029] In any embodiment of the present application, the second metal includes at least one of copper and its alloys, silver and its alloys, and gold and its alloys. The thermal conductivity of copper is 380 W / mk, the thermal conductivity of silver is 429 W / mk, and the thermal conductivity of gold is 316.2 W / mk, all of which can further improve the heat dissipation performance of the cover assembly 100.

[0030] In any embodiment of the present application, the first metal includes at least one of zinc and its alloys, nickel and its alloys, and aluminum and its alloys, which can further enhance the mold forming capability of the cover plate assembly 100 and improve production efficiency.

[0031] The second metal and the first metal may be selected simultaneously or separately. When selected simultaneously, the heat dissipation performance and the mold processing efficiency of the cover plate assembly 100 are higher.

[0032] In any embodiment of the present application, the area of ​​the heat sink 2 is S1, and the area of ​​the cover body 1 is S2, where S1:(S1+S2) is between 10% and 90%. The area ratio of the heat sink 2 in the cover assembly 100 affects the heat dissipation performance of the cover assembly 100. Within this range, the heat dissipation performance of the cover assembly 100 can be improved.

[0033] The present application does not limit the shape of the heat sink 2. The heat sink 2 can be in various shapes such as circular, square, rectangular, triangular, trapezoidal, diamond, fan-shaped, etc., and can match the requirements of the chip or other components that need heat dissipation.

[0034] In any embodiment of the present application, the value of S1:(S1+S2) is 60% to 85%. When the area ratio of the heat sink 2 in the cover plate assembly 100 is within this range, the heat dissipation performance of the cover plate assembly 100 is most significantly improved, while the cost of the cover plate assembly 100 can be reduced.

[0035] In any embodiment of the present application, the cover body 1 is provided with a recessed area, and the heat sink 2 is embedded and installed in the recessed area. By providing the recessed area on the cover body 1 and embedding the heat sink 2 in the recessed area, the heat sink 2 can be embedded in the cover body 1 from the recessed area, the heat sink 2 performs the heat dissipation function, and the cover body 1 performs the covering function, thereby improving the firmness of the connection between the heat sink 2 and the cover body 1.

[0036] As shown in Figures 3 and 4, in any embodiment of the present application, an embedding portion 21 is extended from at least a portion of the circumference of the heat sink 2 toward the periphery of the heat sink 2 body, and the embedding portion 21 is embedded in the cover body 1. Because the heat sink 2 and the cover body 1 are made of different metals, there is a loose bond between the different metals, which may lead to the risk of falling off or leakage during long-term use. At the same time, due to the different expansion coefficients of different metals, the cover assembly 100 is easily deformed. By extending the embedding portion 21 from at least a portion of the circumference of the heat sink 2 toward the periphery of the heat sink 2 body, and embedding the embedding portion 21 into the cover body 1, the heat sink 2 can be embedded in the interior of the cover body 1, thereby improving the firmness of the bond between the heat sink 2 and the cover body 1 and reducing the risk of falling off or leakage. In some embodiments of the present application, as shown in Figures 5 and 6, the heat sink 2 can be partially provided with an extended embedded portion 21 on its circumference. For example, the heat sink 2 is square, with extended embedded portions 21 on three sides and a recessed fixing area on the other side. When the molten first metal material is molded, the liquid first metal material enters the heat sink 2 through the recessed fixing area, thereby improving the firmness of the connection between the heat sink 2 and the cover body 1. In particular, when the width of the cover body 1 at the connection between the heat sink 2 and the cover body 1 is narrow, which is not conducive to embedding the embedded portion 21 of the heat sink 2 into the cover body 1, the cover body 1 can be embedded into the heat sink 2 to improve the firmness of the connection between the heat sink 2 and the cover body 1. In some embodiments of the present application, the heat sink 2 can be provided with an extended embedded portion 21 on its entire circumference, thereby improving the firmness of the connection between the heat sink 2 and the cover body 1 and reducing the risk of falling off and leakage.

[0037] In any embodiment of the present application, the embedded portion 21 includes an embedded insert 211 that is thinned from the periphery of the heat sink 2 toward the cover body 1. By embedding the embedded portion 21 of the embedded insert 211 into the interior of the cover body 1, the contact area between the cover body 1 and the embedded insert 211 can be increased, further improving the secure connection between the heat sink 2 and the cover body 1 and reducing the risk of falling off or leakage.

[0038] In other embodiments of the present application, the embedded portion 21 may further include hooks extending in two opposite directions to position the heat sink 2 in two opposite directions, thereby reducing the relative movement of the heat sink 2 with respect to the cover assembly 100, improving the secure connection between the heat sink 2 and the cover body 1, and reducing the risk of falling off or leakage. This is not a limitation of the present application, and any structure that can improve the connection between the two may be used.

[0039] As shown in FIG4 , in any embodiment of the present application, the embedded insert 211 is provided with a positioning portion 2111 for positioning in a mating portion of the recessed area of ​​the cover body 1. Providing the positioning portion 2111 on the embedded insert 211 for positioning in a mating portion of the recessed area of ​​the cover body 1 allows the heat sink 2 to be further fixed to the cover body 1 while maintaining the secure connection provided by the embedded portion 21, thereby improving the secure connection between the heat sink 2 and the cover body 1 and reducing the risk of falling off or leakage.

[0040] As shown in FIG4 , in any embodiment of the present application, the positioning portion 2111 includes a plurality of positioning holes 21111 arranged at intervals, and the matching portion includes a plurality of positioning posts (not shown) corresponding to the positioning holes. Through the plurality of positioning holes 21111 arranged at intervals, during the casting process, the molten material of the cover body 1 passes through the plurality of positioning holes 21111 arranged at intervals, and solidifies after cooling to form a plurality of positioning posts arranged at intervals. A locking structure is formed between each positioning post and the positioning hole 21111. Each positioning post firmly grasps the positioning hole 21111, firmly locking the heat sink 2 on the cover body 1, further improving the firmness of the combination of the heat sink 2 and the cover body 1, and reducing the risk of falling off or leakage. At the same time, this positioning structure is inside the cover body 1, and there are multiple of them, and the force is evenly distributed. A single positioning post and positioning hole 21111 are not easily damaged, thereby improving the service life of the cover assembly 100 and reducing the deformation of the cover assembly 100. The present application does not limit the shape of the positioning hole 21111, which can be a circular, square, triangular, trapezoidal or diamond shape, all of which can improve the firmness of the combination of the heat sink 2 and the cover body 1. Among them, the circular positioning hole 21111 is more evenly stressed and has the best effect of improving the firmness of the combination of the heat sink 2 and the cover body 1.

[0041] In any embodiment of the present application, the positioning portion 2111 includes a plurality of spaced-apart protrusions (not shown in the figure), and the mating portion includes a plurality of grooves (not shown in the figure) corresponding to and mating with the plurality of protrusions. By means of the plurality of spaced-apart protrusions and the plurality of spaced-apart grooves mating with the plurality of protrusions, the plurality of protrusions on the heat sink 2 are mated and positioned with the plurality of grooves on the cover body 1, thereby improving the firmness of the connection between the heat sink 2 and the cover body 1 and reducing the risk of falling off or leakage. To further improve the firmness of the connection between the heat sink 2 and the cover body 1, adjacent protrusions may protrude in opposite directions, respectively restricting the movement of the heat sink 2 in two opposite directions, thereby improving the firmness of the connection between the heat sink 2 and the cover body 1.

[0042] The present application also proposes a method for preparing a cover plate assembly 100 , comprising the following steps: providing the heat dissipation plate 2 ; and melt-die-casting at least one side of the heat dissipation plate 2 to form the cover plate body 1 , thereby obtaining the cover plate assembly 100 .

[0043] By embedding the heat sink 2 in the cover body 1, the material of the cover body has a lower melting point, and the material of the heat sink 2 has a higher thermal conductivity, so that the material of the cover body 1 is easier to injection mold, and the material of the heat sink 2 has a higher thermal conductivity, thereby improving the heat dissipation performance of the cover assembly 100. At the same time, since the cover body 1 is located on the outside, it is a region with a more complex shape and is composed of a metal with a lower melting point, which is more conducive to injection molding. The middle region with a simpler shape adopts a second metal material with better heat dissipation effect. No complex molding process is required, and machine processing can be used, which can meet the needs and improve preparation efficiency.

[0044] As shown in FIG7 , when the heat sink 2 is placed in the mold and the cover body 1 is formed by casting, since the heat sink 2 and the component that needs to dissipate heat will have certain contact bosses at their contact points, the contact bosses can be used as fixing devices for the heat sink 2 and the mold, thereby reducing the movement of the heat sink 2 during casting and improving the tightness of the connection between the heat sink 2 and the cover body 1.

[0045] In any embodiment of the present application, after the step of melt-die-casting at least one side of the heat dissipation plate 2 to form the cover plate body 1 to obtain the cover plate assembly 100 , the step further includes: sandblasting the cover plate assembly 100 .

[0046] In any embodiment of the present application, sandblasting has a good polishing effect on the cover plate assembly 100, and can improve the flatness of the surfaces of the heat dissipation plate 2 and the cover plate body 1.

[0047] The sandblasting may be made of corundum or other sandstones, which is not limited in this application.

[0048] In some embodiments of the present application, the cover plate assembly 100 may be formed by: machining a copper heat sink 2;

[0049] The copper plate heat sink 2 is placed in a die-casting mold and positioned in the mold core through the boss inside the copper plate. Zinc liquid is injected into the die-casting mold and solidified to form a cover plate body 1. After die-casting, a die-cast cover plate assembly 100 is formed. The cover plate assembly 100 is polished with diamond abrasive and nickel-plated to obtain a finished cover plate assembly 100.

[0050] The cover plate assembly 100 was subjected to a tensile test and a salt spray test, and the results showed that the breaking tensile force was above 2000N, the salt spray test was qualified after 48 hours of continuous neutral salt spray test, and the flatness was 0.05.

[0051] Among them, the tensile test method is to separate the cover body 1 and the heat sink 2 to test the required force; the salt spray test method is the anti-corrosion performance requirements and test methods of communication products; the flatness test method is to use three-dimensional testing.

[0052] This application also proposes a photovoltaic device, including the cover plate assembly 100, or the cover plate assembly 100 prepared according to the preparation method of the cover plate assembly 100. The photovoltaic device has all the technical solutions of the cover plate assembly 100, and thus has all the intended effects, which will not be described in detail in this application.

[0053] The optoelectronic device may be an optical communication device such as an optical module or an optical transmission amplifier.

[0054] For those skilled in the art, various changes and modifications may be made to this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application should be included in the scope of patent protection of this application.

Claims

1. A cover plate assembly, comprising: A cover plate body, wherein the cover plate body is made of a first metal material; as well as, A heat sink, embedded in the cover body, wherein the heat sink is made of the second metal material; The melting point of the first metal material is lower than that of the second metal material, and the thermal conductivity of the first metal material is lower than that of the second metal material.

2. The cover plate assembly according to claim 1, wherein: The melting point of the first metal material is less than or equal to 700° C.; and / or, The thermal conductivity of the second metal material is greater than or equal to 260 W / mk.

3. The cover plate assembly according to claim 2, wherein: The second metal comprises at least one of copper and its alloys, silver and its alloys, and gold and its alloys; and / or, The first metal includes at least one of zinc and its alloys, nickel and its alloys, and aluminum and its alloys.

4. The cover plate assembly according to claim 1, wherein: The area of ​​the heat sink is S1, and the area of ​​the cover body is S2, wherein the value of S1:(S1+S2) is 10% to 90%.

5. The cover plate assembly according to claim 4, wherein: S1: The value of (S1+S2) is 60% to 85%.

6. The cover plate assembly according to claim 1, wherein: The cover plate body is provided with a recessed area, and the heat sink is embedded and installed in the recessed area.

7. The cover plate assembly according to claim 6, wherein: An embedding portion is extended from at least a portion of the circumference of the heat dissipation plate toward the periphery of the heat dissipation plate body, and the embedding portion is embedded in the cover plate body.

8. The cover plate assembly according to claim 7, wherein: The embedding portion includes an embedding insert that is thinned from the periphery of the heat dissipation plate toward the cover plate body.

9. The cover plate assembly according to claim 8, wherein: The embedded insert is provided with a positioning portion for positioning at a matching portion of the recessed area of ​​the cover plate body.

10. The cover plate assembly according to claim 9, wherein: The positioning portion includes a plurality of positioning holes arranged at intervals, and the matching portion includes a plurality of positioning posts correspondingly matched with the positioning holes.

11. The cover plate assembly according to claim 9, wherein: The positioning portion includes a plurality of protrusions arranged at intervals, and the matching portion includes a plurality of grooves corresponding to and matching with the plurality of protrusions.

12. A method for preparing a cover plate assembly according to any one of claims 1 to 11, wherein: The following steps are involved: Providing the heat sink; The cover plate body is formed by melt die-casting on at least one side of the heat dissipation plate to obtain a cover plate assembly.

13. The method for preparing a cover plate assembly according to claim 12, wherein: After the step of forming the cover plate body by melt die-casting at least one side of the heat dissipation plate to obtain the cover plate assembly, the method further includes: Sandblast the cover assembly.

14. An optoelectronic device, wherein: A cover plate assembly comprising the cover plate assembly as described in any one of claims 1 to 11, or a cover plate assembly prepared by the method for preparing the cover plate assembly as described in any one of claims 12 to 13.

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