Chuck device

Abstract

The present invention relates to the technical field of wafer clamping, and specifically relates to a chuck device. The device comprises: an annular support base. A plurality of small gears are rotatably arranged at the top of the support base, a limiting column is eccentrically arranged at the top of each small gear, a large gear is rotationally arranged in the support base, and the large gear is meshed with the small gears; an annular connecting plate is slidably arranged below the large gear, a plurality of connecting blocks are arranged on the connecting plate, and a plurality of lifting / lowering ejector pins are arranged at the tops of the connecting blocks; and abutting blocks are arranged at the top of the connecting plate, an abutting surface is arranged at the edge of the top of each abutting block, linkage blocks are arranged on the large gear, and abutting wheels are arranged on the linkage blocks, wherein the abutting wheels always abut against the abutting surfaces. By means of the abutting surfaces abutting against each other, when the connecting plate slides upwards, the abutting wheels can push the abutting surfaces upwards, so that the large gear rotates and drives the small gears to rotate, so as to release a wafer, and the wafer is lifted.

Description

A chuck device Technical Field

[0001] The invention belongs to the technical field of wafer clamping, and in particular relates to a chuck device. Background Art

[0002] In the wafer processing process, many process steps require a chuck to clamp the wafer for corresponding processing. In the wet process of the wafer, the wafer needs to be clamped and rotated at high speed. There are generally two ways to clamp the wafer. One is to lift the wafer carried on the chuck by a pin, that is, the pin passes through the chuck to lift the wafer carried on it, so as to take and place the wafer, or retract the pin under the chuck to put the wafer down. The other is to use the Bernoulli flotation method, that is, spraying gas under the wafer to lift the wafer.

[0003] However, both clamping methods have inherent drawbacks. With ejector pins, the pins can easily contaminate or scratch the wafer during cleaning. In some processes, physical contact between the chuck and the patterned portion of the wafer is prohibited because the wafer faces downward. While air flotation can avoid physical contact with the wafer, the proximity of the wafer to the carrier makes it difficult to grasp after cleaning. Therefore, a chuck device with a simple structure, stable clamping, and convenient gripping is essential. Summary of the Invention

[0004] The object of the present invention is to provide a chuck device with a simple structure, stable clamping and convenient grasping.

[0005] In order to solve the above technical problems, the present invention provides a chuck device, comprising: an annular support seat, a plurality of small gears are rotatably provided on the top of the support seat, a limiting column is eccentrically provided on the top of the small gear, a large gear is rotatably provided inside the support seat, and the large gear is meshed with the small gear; an annular connecting plate is slidably provided below the large gear, a plurality of connecting blocks are provided on the connecting plate, a plurality of lifting pins are provided on the top of the connecting block, and an abutment block is provided on the top of the connecting plate, an abutment surface is provided on the edge of the top of the abutment block, a linkage block is provided on the large gear, and an abutment wheel is provided on the linkage block, wherein the abutment wheel always abuts against the abutment surface.

[0006] Preferably, a plurality of linkage notches are provided on the large gear, the linkage blocks are arranged in the linkage notches, and the abutment blocks are slidably arranged in the linkage notches.

[0007] Preferably, a mounting groove is provided on the top of the large gear, and the mounting groove is connected to the linkage notch; a mounting block is integrally provided on the side wall of the linkage block, and the mounting block is clamped in the mounting groove, and the abutment wheel is rotatably provided on the side wall of the linkage block.

[0008] Preferably, the connection block is in a "T" shape, the crossbeam of the connection block is connected to the top of the connection plate by bolts, and the lifting pin is arranged at the end of the longitudinal beam of the connection block.

[0009] Preferably, a plurality of lifting notches are provided on the inner wall of the support seat, and the lifting pins are clamped in the lifting notches.

[0010] Preferably, a support ring is integrally provided on the inner wall of the support seat, a plurality of reset springs are provided on the support ring, and the other end of the reset spring is connected to the bottom of the large gear.

[0011] Preferably, a plurality of lifting cylinders are provided at the bottom of the connecting plate, piston rods of the lifting cylinders are connected to the lifting plate, a plurality of abutment columns are provided at the top of the lifting plate, and the abutment columns are connected to the bottom of the connecting plate.

[0012] Preferably, a mounting plate is provided on the top of the large gear, and a plurality of ventilation holes are opened on the mounting plate.

[0013] The beneficial effects of the present invention are:

[0014] 1. By rotating the large gear, the small gear can be driven to rotate, thereby driving the limit pin on the top of the small gear to complete the loosening / clamping of the wafer;

[0015] 2. The sliding setting of the connecting plate can realize the lifting and lowering of the lifting pin, and can lift the wafer when the limit column releases the wafer, so that the wafer is easy to grab;

[0016] 3. Through the abutment between the abutment surfaces, when the connecting plate slides upward, the abutment wheel can push the abutment surface upward, so that the large gear rotates and drives the small gear to rotate, thereby releasing the wafer and lifting the wafer at the same time;

[0017] On the contrary, after the wafer is placed on the lifting pins, the connecting plate slides downward, and the wafer can be placed to a specified height, while completing the clamping of the wafer.

[0018] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the present invention.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] FIG1 is an exploded view of a preferred embodiment of a chuck device of the present invention;

[0022] FIG2 is an exploded view of a preferred embodiment of a chuck device of the present invention;

[0023] FIG3 is a cross-sectional view of a preferred embodiment of the chuck device of the present invention.

[0024] In the picture:

[0025] 100, support seat; 101, lifting notch; 102, support ring; 103, return spring;

[0026] 200, pinion; 201, limit column;

[0027] 300, large gear; 301, linkage block; 3011, mounting block; 302, abutment wheel; 303, linkage notch; 304, mounting groove; 305, mounting plate; 3051, vent hole;

[0028] 400, abutment block; 401, abutment surface; 402, connection plate; 4021, connection block; 403, lifting pin;

[0029] 500, lifting cylinder; 501, lifting plate; 502, abutment column. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention. Example 1

[0031] As shown in Figures 1-3, the present invention provides a chuck device, comprising: an annular support base 100, a plurality of small gears 200 rotatably disposed on the top of the support base 100, a limiting post 201 eccentrically disposed on the top of the small gears 200, and a large gear 300 rotatably disposed inside the support base 100, the large gear 300 meshing with the small gears 200; in short, rotating the large gear 300 can drive the small gears 200 to rotate, thereby driving the limiting post 201 on the top of the small gears 200 to complete the loosening / clamping of the wafer;

[0032] An annular connecting plate 402 is slidably provided below the large gear 300. A plurality of connecting blocks 4021 are provided on the connecting plate 402. A plurality of lifting pins 403 are provided on top of the connecting blocks 4021. Furthermore, the sliding arrangement of the connecting plate 402 enables the lifting of the lifting pins 403. When the limiting pillars 201 release the wafer, the wafer can be lifted to facilitate grasping of the wafer.

[0033] In addition, an abutment block 400 is provided on the top of the connecting plate 402, and an abutment surface 401 is provided on the edge of the top of the abutment block 400. A linkage block 301 is provided on the large gear 300, and an abutment wheel 302 is provided on the linkage block 301, wherein the abutment wheel 302 always abuts against the abutment surface 401; further, through the abutment between the abutment surface 401 and the abutment surface 401, when the connecting plate 402 slides upward, the abutment wheel 302 can push the abutment surface 401 upward to rotate the large gear 300 and drive the small gear 200 to rotate, thereby releasing the wafer and lifting the wafer at the same time; conversely, after placing the wafer on the lifting pin 403, the connecting plate 402 slides downward, and the wafer can be placed to a specified height, and the wafer is clamped at the same time.

[0034] The large gear 300 is provided with a plurality of linkage notches 303, the linkage block 301 is arranged in the linkage notches 303, and the abutment block 400 is slidably arranged in the linkage notches 303; in short, by setting the linkage notches 303, the linkage block 301 and the abutment block 400 can be accommodated, which can effectively reduce the height of the chuck device.

[0035] A mounting groove 304 is provided on the top of the large gear 300, and the mounting groove 304 is connected to the linkage notch 303; a mounting block 3011 is integrally provided on the side wall of the linkage block 301, and the mounting block 3011 is clamped in the mounting groove 304, and the abutment wheel 302 is rotatably set on the side wall of the linkage block 301; in short, the mounting groove 304 is connected to the connecting notch, and the linkage block 301 can be installed in the linkage notch 303, thereby reducing the height of the chuck device of the present invention.

[0036] The connecting block 4021 is in a "T" shape, the crossbeam of the connecting block 4021 is connected to the top of the connecting plate 402 by bolts, and the lifting pin 403 is arranged at the end of the longitudinal beam of the connecting block 4021; in short, by setting the connecting block 4021 into a "T" shape, the connection end between the connecting block 4021 and the connecting plate 402 can be strengthened, so that the lifting pin 403 can be stably lifted and lowered to drive the wafer to rise / fall, and the structure is simple and reliable.

[0037] The inner wall of the support base 100 is provided with a plurality of lifting notches 101, and the lifting pins 403 are clamped in the lifting notches 101; in short, the setting of the lifting notches 101 can prevent the lifting pins 403 from shaking when sliding up and down, thereby improving the stability of wafer lifting.

[0038] The inner wall of the support seat 100 is integrally provided with a support ring 102, and a number of reset springs 103 are provided on the support ring 102, and the other end of the reset spring 103 is connected to the bottom of the large gear 300; in short, through the setting of the reset spring 103, the large gear 300 can be always tightened to prevent the small gear 200 from loosening, thereby causing the wafer to loosen, thereby improving the stability of the wafer during the cleaning process.

[0039] A number of lifting cylinders 500 are provided at the bottom of the connecting plate 402, the piston rods of the lifting cylinders 500 are connected to the lifting plate 501, and a number of abutment columns 502 are provided on the top of the lifting plate 501, and the abutment columns 502 are connected to the bottom of the connecting plate 402; in short, through the setting of the lifting cylinders 500, the lifting and lowering of the connecting plate 402 can be completed, the structure is simple and reliable, and the stability of use is improved.

[0040] A mounting plate 305 is provided on the top of the large gear 300, and a plurality of ventilation holes 3051 are opened on the mounting plate 305; in short, through the cooperation between the mounting plate 305 and the ventilation holes 3051, the wafer can be set up, and the wafer can be floated according to the Bernoulli principle by cooperating with the air source.

[0041] All components used in this application are standard components or components known to those skilled in the art. Their structures and principles are readily known to those skilled in the art through technical manuals or routine experimental methods. Furthermore, the software programs involved in this application are all prior art, and this application does not involve any improvements to the software programs.

[0042] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0043] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0044] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. There may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed may be through some communication interface, indirect coupling or communication connection of devices or units, which may be electrical, mechanical or other forms.

[0045] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0046] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0047] With the above-described preferred embodiments of the present invention as a guide, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A chuck device, characterized in that: include: An annular support seat (100), wherein a plurality of small gears (200) are rotatably provided on the top of the support seat (100), a limiting column (201) is eccentrically provided on the top of the small gears (200), and a large gear (300) is rotatably provided inside the support seat (100), and the large gear (300) meshes with the small gears (200); An annular connecting plate (402) is slidably disposed below the large gear (300), a plurality of connecting blocks (4021) are disposed on the connecting plate (402), and a plurality of lifting pins (403) are disposed on the top of the connecting block (4021); and The top of the connecting plate (402) is provided with an abutment block (400), the top edge of the abutment block (400) is provided with an abutment surface (401), the large gear (300) is provided with a linkage block (301), and the linkage block (301) is provided with an abutment wheel (302), wherein The abutment wheel (302) always abuts against the abutment surface (401).

2. A chuck device as claimed in claim 1, characterized in that: The large gear (300) is provided with a plurality of linkage notches (303), the linkage block (301) is arranged in the linkage notches (303), and the abutment block (400) is slidably arranged in the linkage notches (303).

3. A chuck device as claimed in claim 2, characterized in that: A mounting groove (304) is provided on the top of the large gear (300), and the mounting groove (304) is communicated with the linkage notch (303); The side wall of the linkage block (301) is integrally provided with a mounting block (3011), the mounting block (3011) is clamped in the mounting groove (304), and the abutment wheel (302) is rotatably arranged on the side wall of the linkage block (301).

4. A chuck device as claimed in claim 3, characterized in that: The connection block (4021) is in a "T" shape, the crossbeam of the connection block (4021) is connected to the top of the connection plate (402) by means of bolts, and the lifting pin (403) is arranged at the end of the longitudinal beam of the connection block (4021).

5. A chuck device as claimed in claim 4, characterized in that: The inner wall of the support seat (100) is provided with a plurality of lifting notches (101), and the lifting ejector pins (403) are clamped in the lifting notches (101).

6. A chuck device as claimed in claim 5, characterized in that: A support ring (102) is integrally provided on the inner wall of the support seat (100), a plurality of return springs (103) are provided on the support ring (102), and the other end of the return spring (103) is connected to the bottom of the large gear (300).

7. A chuck device as claimed in claim 6, characterized in that: A plurality of lifting cylinders (500) are arranged at the bottom of the connecting plate (402), piston rods of the lifting cylinders (500) are connected to the lifting plate (501), a plurality of abutment columns (502) are arranged at the top of the lifting plate (501), and the abutment columns (502) are connected to the bottom of the connecting plate (402).

8. A chuck device as claimed in claim 7, characterized in that: A mounting plate (305) is provided on the top of the large gear (300), and a plurality of ventilation holes (3051) are provided on the mounting plate (305).

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