Structure for connecting upper and lower plates of vapor chamber

Abstract

The present application discloses a structure for connecting upper and lower plates of a vapor chamber, comprising: a bottom plate, an upper plate, support columns, and an assembling structure. A cavity is formed between the upper plate and the bottom plate, and a capillary structure is provided in the cavity; the support columns are mounted between the bottom plate and the upper plate, and the bottom plate and the upper plate are connected to each other by means of the support columns; and the bottom plate and / or the upper plate are / is mounted on the support columns by means of the assembling structure. When the upper plate and the bottom plate are assembled, the upper plate and the bottom plate can be directly welded at an assembling position by methods such as laser welding, eliminating the need for conventional sintering or diffusion welding, and thus avoiding excessive heating on the overall vapor chamber, so as to ensure that the vapor chamber has enough strength. After assembling, welding can be directly carried out by methods such as laser welding, so that the efficiency of connecting the upper and lower plates can be improved, and compared with the conventional sintering or diffusion welding methods, laser welding has the advantage of low energy consumption in manufacturing processes, thereby effectively achieving the effects of energy saving and efficiency improvement.

Description

Connection structure of upper and lower plates of uniform temperature plate Technical Field

[0001] The present application relates to the field of electronic thermal conductivity, and in particular to a connection structure of upper and lower plates of a temperature equalizing plate. Background Art

[0002] As is well known, during the production of a vapor chamber, as shown in Figure 1 , the capillary structure 300 is typically bonded to the upper plate 200 and the bottom plate 100 through sintering or diffusion welding. The capillary structure 300 includes a support column 500 disposed between the upper plate 200 and the bottom plate 100, with a copper powder ring 550 surrounding the support column 500. However, this processing method presents the following problems:

[0003] 1. Sintering or diffusion welding will reduce the hardness of the material, resulting in a decrease in the overall strength of the vapor chamber;

[0004] 2. Due to the use of sintering or diffusion welding, the material needs to be heated to above 400-500℃, which consumes relatively high energy.

[0005] 3. The traditional process takes a long time and has low production efficiency.

[0006] Summary of the Invention

[0007] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a connection structure between the upper and lower plates of a heat spreader, which can improve at least some aspects of the heat spreader's strength, energy consumption during production, and production efficiency.

[0008] According to the first aspect of the embodiment of the present application, the upper and lower plate connection structure of the temperature equalizing plate includes: a base plate, an upper plate, a support column and an assembly structure; the upper plate is installed on the base plate, a cavity is provided between the upper plate and the base plate, and a capillary structure is provided in the cavity; the support column is installed between the base plate and the upper plate, and the base plate and the upper plate are connected to each other through the support column; the assembly structure is provided on the support column, the base plate and / or the upper plate are installed on the support column through the assembly structure, and the base plate and the upper plate are relatively positioned through the support column.

[0009] The upper and lower plate connection structure of the temperature-vaporizing plate according to the embodiments of the present application has at least the following beneficial effects: the support columns can provide relative support for the bottom plate and the upper plate, thereby stably forming a cavity between the bottom plate and the upper plate, thereby facilitating the placement of a capillary structure within the cavity to enhance thermal conductivity. Once the bottom plate and the upper plate are assembled via the support columns, the relative positioning effect of the assembled structure and the support columns can be directly and effectively achieved.

[0010] After the upper plate and the bottom plate are assembled, they can be directly welded at the joint position by laser welding or other methods, thereby abandoning the original sintering or diffusion welding methods, thereby avoiding overheating of the whole and ensuring that the temperature plate has sufficient strength.

[0011] After assembly, they can be directly welded by laser welding or other methods, which not only improves the efficiency of combining the upper and lower plates, but also has the advantage of low process energy consumption compared to the original sintering or diffusion welding methods, thus effectively achieving energy-saving and efficiency-enhancing effects.

[0012] According to some embodiments of the present application, the assembly structure includes a boss arranged at the end of the support column, the bottom plate and / or the upper plate are provided with a mounting hole, and the boss is inserted into the mounting hole.

[0013] According to some embodiments of the present application, both ends of the support column are provided with the boss, the bottom plate and the upper plate are provided with mounting holes, the bottom plate and the upper plate are respectively installed on both sides of the support column and are connected to the support column through the boss and the mounting holes.

[0014] According to some embodiments of the present application, the support column is integrally formed on one of the bottom plate and the upper plate, and the mounting hole is provided on the other of the bottom plate and the upper plate.

[0015] According to some embodiments of the present application, the assembly structure includes a welding platform provided on the bottom plate and / or the upper plate, and the welding platform can be connected to the end surface of the support column to facilitate subsequent welding of the two.

[0016] According to some embodiments of the present application, a structural column is provided in the cavity, two ends of the structural column are respectively against the bottom plate and the upper plate, and the capillary structure is distributed on the periphery of the structural column.

[0017] According to some embodiments of the present application, the structural column is integrally formed on one of the bottom plate and the upper plate, and an end face of the structural column abuts against the other of the bottom plate and the upper plate.

[0018] According to some embodiments of the present application, the bottom plate and the upper plate are both integrally formed with the structural columns, and the structural columns located on the upper plate and the structural columns located on the bottom plate abut against each other.

[0019] According to some embodiments of the present application, a frame for enclosing the cavity is provided around the bottom plate and / or the upper plate.

[0020] According to some embodiments of the present application, both the bottom plate and the upper plate have the frame, and the two frames are abutted against each other and welded together.

[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] FIG1 is a schematic diagram of a connection structure of an existing temperature vapor chamber;

[0024] FIG2 is a schematic diagram of the connection structure of the upper and lower plates of the temperature equalizing plate according to an embodiment of the present application;

[0025] FIG3 is a schematic diagram of a support column of the upper and lower plate connection structure of the temperature equalizing plate shown in FIG2 ;

[0026] FIG4 is a schematic diagram of an embodiment of the upper and lower plates of the connection structure of the upper and lower plates of the temperature equalizing plate shown in FIG2 , in which both the upper plate and the lower plate are assembled and connected to the support column;

[0027] FIG5 is a schematic diagram of an embodiment in which both the upper plate and the bottom plate of the upper and lower plate connection structure of the temperature equalizing plate shown in FIG2 have structural columns;

[0028] FIG6 is a schematic diagram of an embodiment of an integrated support column and bottom plate of the upper and lower plate connection structure of the temperature equalizing plate shown in FIG2 ;

[0029] FIG. 7 is a schematic diagram of a welding station for connecting the upper and lower plates of the temperature equalizing plate shown in FIG. 2 .

[0030] Reference numerals: bottom plate 100; welding platform 140; mounting hole 150; upper plate 200; capillary structure 300; frame 400; support column 500; copper powder ring 550; boss 570; structural column 600; DETAILED DESCRIPTION

[0031] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0032] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0033] In the description of this application, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The terms "first" and "second" are used solely to distinguish technical features and are not to be construed as indicating or implying relative importance, or as implicitly specifying the number or order of the technical features indicated.

[0034] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0035] 2 , a connection structure of the upper and lower plates of a temperature equalizing plate is shown, comprising: a base plate 100, an upper plate 200, a support column 500 and an assembling structure; the upper plate 200 is mounted on the base plate 100, a cavity is provided between the upper plate 200 and the base plate 100, and a capillary structure 300 is provided in the cavity; the support column 500 is mounted between the base plate 100 and the upper plate 200, the base plate 100 and the upper plate 200 are connected to each other through the support column 500, and the capillary structure 300 extends to the support column 500; the assembling structure is provided on the support column 500, the base plate 100 and / or the upper plate 200 are mounted on the support column 500 through the assembling structure, and the base plate 100 and the upper plate 200 are relatively positioned through the support column 500. The support column 500 can provide relative support to the bottom plate 100 and the upper plate 200, so that a cavity can be stably formed between the bottom plate 100 and the upper plate 200, thereby facilitating the laying of the capillary structure 300 for increasing thermal conductivity in the cavity. After the bottom plate 100 and the upper plate 200 are assembled through the support column 500, the relative positioning effect of the assembled structure and the support column 500 can be directly and effectively obtained. After the upper plate 200 and the bottom plate 100 are assembled, the upper plate 200 and the bottom plate 100 can be directly welded at the splicing position by laser welding or other methods, thereby abandoning the original sintering or diffusion welding methods, thereby avoiding overheating of the whole to ensure that the temperature equalizing plate has sufficient strength. After assembly, laser welding or other methods can be directly used for welding, which not only improves the efficiency of combining the upper and lower plates, but also has the advantage of low process energy consumption compared to the original sintering or diffusion welding methods, thereby effectively achieving energy saving and efficiency improvement.

[0036] Specifically, both the upper plate 200 and the bottom plate 100 are laser welded to the support pillars 500, replacing the currently commonly used diffusion welding. Laser welding has the advantages of simple operation and high welding speed, so it can quickly and effectively achieve the effect of welding the upper plate 200 and the bottom plate 100.

[0037] It is envisioned that the capillary structure 300 can be a copper powder-supported mesh, porous honeycomb, or other structural component, as long as it can achieve the effect of improving thermal conductivity. The specific implementation of the capillary structure 300 is not limited and can be adjusted accordingly according to actual conditions, and is not limited here.

[0038] In certain embodiments, referring to FIG. 2 , the assembly structure includes a boss 570 disposed at the end of the support column 500. The bottom plate 100 and / or the upper plate 200 are provided with a mounting hole 150, and the boss 570 is inserted into the mounting hole 150. The interpenetration and cooperation between the boss 570 and the mounting hole 150 allows the support column 500 and the bottom plate 100 and the upper plate 200 to be directly and effectively positioned. As a result, the positional relationship between the bottom plate 100 and the upper plate 200 can be smoothly and accurately determined, thereby enabling the two to be directly welded, reducing the steps such as positioning required during the welding process, and facilitating efficient welding operations.

[0039] It is conceivable that the boss 570 can be directly laser welded at the mounting hole 150, thereby directly and effectively welding the support column 500 and the base plate 100 and upper plate 200 relative to each other, and the exposed mounting hole 150 and boss 570 facilitate the welding operation.

[0040] In certain embodiments, referring to Figures 2 and 3 , both ends of the support column 500 are provided with bosses 570, and both the bottom plate 100 and the top plate 200 are provided with mounting holes 150. The bottom plate 100 and the top plate 200 are respectively mounted on either side of the support column 500 and connected to the support column 500 via the bosses 570 and the mounting holes 150. Both the bottom plate 100 and the top plate are spliced ​​with the support column 500, and the two are assembled to each other via the support column 500. This effectively reduces the structural weight of the bottom plate 100 and the top plate 200, thereby reducing manufacturing difficulty and improving overall production efficiency.

[0041] In certain embodiments, referring to FIG. 4 , the support column 500 is integrally formed on one of the bottom plate 100 and the upper plate 200, and the mounting hole 150 is provided on the other of the bottom plate 100 and the upper plate 200. Since the support column 500 is integrally formed on one of the bottom plate 100 and the upper plate 200, the bottom plate 100 and the upper plate 200 can be conveniently and directly assembled by only assembling the other with the support column 500. This effectively reduces the number of steps required to assemble the upper plate 200 and the bottom plate 100, and improves overall production efficiency.

[0042] Specifically, the support column 500 is integrally formed on the bottom plate 100 by etching. Of course, the support column 500 can also be formed on the bottom plate 100 or the upper plate 200 by other methods, such as by stamping. The specific implementation method can be adjusted accordingly according to actual needs and is not limited here.

[0043] In certain embodiments, referring to FIG. 7 , the assembly structure includes a welding platform 140 disposed on the bottom plate 100 and / or the upper plate 200. The welding platform 140 can be aligned with the end surface of the support column 500 to facilitate subsequent welding of the two. The welding platform 140 provides a welding site, thereby facilitating welding of the support column 500 to the bottom plate 100 or the upper plate 200. This allows for direct and effective positioning of the support column 500, avoids the appearance of an incomplete structure caused by the provision of the mounting holes 150, and effectively improves the airtightness of the cavity between the bottom plate 100 and the upper plate 200.

[0044] Specifically, the support column 500 is integrally formed on the bottom plate 100 by etching, and the welding platform 140 is integrally formed on the upper plate 200 by etching, and the two are welded to each other. Of course, the support column 500 can also be located on the upper plate 200 and the welding platform 140 can be located on the bottom plate 100. The specific implementation method can be adjusted accordingly according to actual needs and is not limited here.

[0045] In some embodiments, referring to FIG2 , a structural column 600 is disposed within the cavity, with both ends of the structural column 600 abutting against the bottom plate 100 and the upper plate 200, respectively. The capillary structure 300 is distributed around the periphery of the structural column 600. The structural column 600 can form a diverse surface within the cavity, thereby facilitating the capillary structure 300 to extend in different directions within the cavity and improving the overall thermal conductivity.

[0046] In certain embodiments, referring to FIG4 , the structural column 600 is integrally formed with one of the bottom plate 100 and the upper plate 200, and the end surface of the structural column 600 abuts the other of the bottom plate 100 and the upper plate 200. The integral formation of the structural column 600 can directly and effectively eliminate the need for assembly of the structural column 600, thereby smoothly improving production efficiency. The structural column 600 is disposed on one of the bottom plate 100 and the upper plate 200 and abuts the other, so that heat from one of the bottom plate 100 and the upper plate 200 can be transferred to the other through the structural column 600, thereby smoothly achieving heat conduction and heat dissipation.

[0047] Specifically, the structural column 600 is integrally formed on the base plate 100 by etching. Of course, the structural column 600 can also be produced by stamping or other methods. The specific implementation method can be adjusted accordingly according to actual needs and is not limited here.

[0048] In certain embodiments, referring to FIG5 , structural columns 600 are integrally formed on both the bottom plate 100 and the upper plate 200. The structural columns 600 located on the upper plate 200 abut against the structural columns 600 located on the bottom plate 100. Because the structural columns 600 are integrally formed on both the bottom plate 100 and the upper plate 200, heat from one can be directly and efficiently transferred to the structural columns 600 and then to the other through the structural columns 600. Furthermore, the integral formation of the structural columns 600 effectively reduces the number of components required for assembly, thereby significantly reducing the number of assembly steps and improving processing efficiency.

[0049] In some embodiments, referring to FIG6 , a frame 400 is provided around the bottom plate 100 and / or the upper plate 200 to seal the cavity. The frame 400 can effectively seal the cavity from the periphery, thereby effectively improving the airtightness of the cavity and effectively ensuring sufficient negative pressure within the cavity to enable the vapor chamber to operate smoothly and normally.

[0050] Specifically, the frame 400 is integrally formed on the bottom plate 100 by etching.

[0051] In certain embodiments, referring to FIG5 , both the bottom plate 100 and the top plate 200 have a frame 400 , which is abutted against each other and welded together. The two frames 400 not only seal the cavity from the edges of the bottom plate 100 and the top plate 200 but also provide welding sites between the bottom plate 100 and the top plate 200 , thereby facilitating intuitive and quick welding operations between the bottom plate 100 and the top plate 200 and effectively improving the efficiency of the production process.

[0052] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present application.

Claims

1. A temperature balancing plate upper and lower plate connection structure, characterized in that: include: Bottom plate (100); An upper plate (200) is mounted on the bottom plate (100), a cavity is provided between the upper plate (200) and the bottom plate (100), and a capillary structure (300) is provided in the cavity; A support column (500) is installed between the bottom plate (100) and the upper plate (200), and the bottom plate (100) and the upper plate (200) are connected to each other through the support column (500); An assembly structure is arranged on the support column (500); the bottom plate (100) and / or the upper plate (200) are mounted on the support column (500) via the assembly structure; the bottom plate (100) and the upper plate (200) are relatively positioned via the support column (500).

2. The upper and lower plate connection structure of the temperature equalizing plate according to claim 1, characterized in that: The assembly structure comprises a boss (570) arranged at the end of the support column (500); the bottom plate (100) and / or the upper plate (200) are provided with a mounting hole (150); and the boss (570) is inserted into the mounting hole (150).

3. The upper and lower plate connection structure of the temperature equalizing plate according to claim 2, characterized in that: Both ends of the support column (500) are provided with the bosses (570), and both the bottom plate (100) and the upper plate (200) are provided with mounting holes (150). The bottom plate (100) and the upper plate (200) are respectively mounted on both sides of the support column (500) and connected to the support column (500) via the bosses (570) and the mounting holes (150).

4. The upper and lower plate connection structure of the temperature equalizing plate according to claim 2, characterized in that: The support column (500) is integrally formed on the bottom plate (100) and the upper plate (200). One of them, the mounting hole (150) is provided on the other of the bottom plate (100) and the upper plate (200).

5. The upper and lower plate connection structure of the temperature equalizing plate according to claim 1, characterized in that: The assembly structure comprises a welding platform (140) arranged on the bottom plate (100) and / or the upper plate (200), and the welding platform (140) can be butted against the end surface of the support column (500) to facilitate subsequent welding of the two.

6. The upper and lower plate connection structure of the temperature equalizing plate according to claim 1, characterized in that: A structural column (600) is arranged in the cavity, two ends of the structural column (600) are respectively against the bottom plate (100) and the upper plate (200), and the capillary structure (300) is distributed on the periphery of the structural column (600).

7. The upper and lower plate connection structure of the temperature equalizing plate according to claim 6, characterized in that: The structural column (600) is integrally formed on one of the bottom plate (100) and the upper plate (200), and an end surface of the structural column (600) is in contact with the other of the bottom plate (100) and the upper plate (200).

8. The upper and lower plate connection structure of the temperature equalizing plate according to claim 6, characterized in that: The bottom plate (100) and the upper plate (200) are both integrally formed with the structural column (600), and the structural column (600) located on the upper plate (200) and the structural column (600) located on the bottom plate (100) are in contact with each other.

9. The upper and lower plate connection structure of the temperature equalizing plate according to claim 1, characterized in that: A frame (400) for closing the cavity is arranged around the bottom plate (100) and / or the upper plate (200).

10. The upper and lower plate connection structure of the temperature equalizing plate according to claim 9, characterized in that: The bottom plate (100) and the upper plate (200) both have the frame (400), and the two frames (400) abut against each other and are welded together.

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