Drive shaft, head table, semiconductor manufacturing device, and method for manufacturing semiconductor device

Abstract

Provided is technology capable of reducing the diffusion of particles.　A drive shaft comprises: a ball screw having a slider for mounting a movable body, a screw shaft, and balls; and a rotary motor for driving the ball screw. The slider comprises: a slider body having a nut part that is screwed to the screw shaft via the balls; and a first block and a second block which are provided at opposite ends of the slider body in the extension direction of the screw shaft. Each of the first block and the second block has a through-hole into which the screw shaft is inserted, and a first flow path for suctioning in a first gap provided between the inner surface of the through-hole and the screw shaft. The minimum inner diameter of the through-hole is larger than the maximum outer diameter of the screw shaft. The first gap communicates with the outside of the slider and the nut part.

Description

Drive shaft, head table, semiconductor manufacturing apparatus, and method of manufacturing semiconductor device

[0001] The present disclosure relates to a drive shaft and is applicable to, for example, a die bonder that uses a ball screw.

[0002] One process in the manufacturing process of a semiconductor device is a die bonding process in which a die is picked up using a pickup head or a bond head and then placed on an intermediate stage or a substrate. The drive shaft that moves the pickup head or the bond head may be composed of a ball screw and a servo motor (see, for example, JP 2017-69418 A). The ball screw is a mechanical component that is composed of a screw shaft, a nut, a ball, and the like, and converts rotational motion into linear motion.

[0003] JP 2017-69418 A

[0004] Particles emitted from the ball screw may spread.

[0005] An object of the present disclosure is to provide a technology capable of reducing the diffusion of particles. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings.

[0006] A brief overview of a representative aspect of the present disclosure is as follows. Specifically, the drive shaft includes a slider carrying a moving body, a ball screw having a screw shaft and balls, and a rotary motor driving the ball screw. The slider includes a slider body having a nut portion threadedly engaged with the screw shaft via the balls, and a first block and a second block provided at both ends of the slider body in the extension direction of the screw shaft. The first block and the second block each have a through hole through which the screw shaft is inserted and a first flow path for suctioning a first gap provided between the inner surface of the through hole and the screw shaft. The minimum inner diameter of the through hole is larger than the maximum outer diameter of the screw shaft. The first gap communicates with the outside of the slider and the nut portion.

[0007] According to the present disclosure, it is possible to reduce the diffusion of particles.

[0008] FIG. 1 is a schematic top view showing an example of the configuration of a die bonder in an embodiment. FIG. 2 is a diagram illustrating the schematic configuration when viewed from the direction of arrow A in FIG. 1. FIG. 3 is a block diagram illustrating the schematic configuration of a control system of the die bonder shown in FIG. 1. FIG. 4 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. 1. FIG. 5 is a side view showing the configuration of the pickup head table shown in FIG. 1. FIG. 6 is a side view showing the configuration of the Z drive shaft of the pickup head table shown in FIG. 5. FIG. 7 is a cross-sectional view of the Z drive shaft taken along line A1-A2 in FIG. 6. FIG. 8 is a cross-sectional view of the Z drive shaft taken along line B1-B2 in FIG. 6. FIG. 9 is a cross-sectional view of the Z drive shaft taken along line C1-C2 in FIG. 6. FIG. 10 is a cross-sectional view of the Z drive shaft taken along line D1-D2 in FIG. 7. FIG. 11 is a cross-sectional view of the Z drive shaft taken along line E1-E2 in FIG. 10.

[0009] Hereinafter, embodiments will be described with reference to the drawings. However, in the following description, the same components will be assigned the same reference numerals, and repeated description may be omitted. Note that, in order to clarify the description, the width, thickness, shape, etc. of each part may be shown schematically compared to the actual embodiment. Furthermore, the dimensional relationships, ratios, etc. of each element between multiple drawings do not necessarily match.

[0010] The configuration of a die bonder, which is an embodiment of a semiconductor manufacturing apparatus, will be described with reference to Figures 1 and 2. Figure 1 is a schematic top view showing an example of the configuration of the die bonder in the embodiment. Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1.

[0011] The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device) 80. The Y2-Y1 direction is the front-to-rear direction of the die bonder 1, the X2-X1 direction is the left-to-right direction, and the Z1-Z2 direction is the up-to-down direction. The wafer supply unit 10 is located on the front side of the die bonder 1, and the bonding unit 40 is located on the rear side.

[0012] The wafer supply unit 10 includes a wafer cassette lifter 11 , a wafer holder 12 , a peeling unit 13 , and a wafer recognition camera 14 .

[0013] A wafer cassette lifter 11 moves a wafer cassette (not shown), which stores a plurality of wafer rings WR, up and down to the wafer transport height. A wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) removes wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0014] A wafer W is adhered (attached) to a dicing tape DT, and the wafer W is divided into a plurality of dies D. The dicing tape DT is held by a wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the dies D as workpieces are semiconductor chips, glass chips, or MEMS (Micro Electro Mechanical Systems). A film-like adhesive material DF called a die attach film (DAF) may be attached between the wafer W and the dicing tape DT. The adhesive material DF hardens when heated.

[0015] The wafer holder 12 is moved in the X1-X2 and Y1-Y2 directions by a drive unit (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The wafer holder 12 also rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 is moved in the vertical direction by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0016] The wafer recognition camera 14 detects the pick-up position of the die D to be picked up from the wafer W and inspects the surface of the die D.

[0017] The pickup unit 20 has a pickup head 21 as a moving body and a pickup head table 23. The pickup head 21 is provided with a collet 22 that suction-holds the peeled die D at its tip. The pickup head 21 picks up a die D from the wafer supply unit 10 and places it on the intermediate stage 31. The pickup head table 23 moves the pickup head 21 in the Z1-Z2 direction, the Y1-Y2 direction, and the X1-X2 direction. The pickup head table 23 may also rotate the pickup head 21.

[0018] The intermediate stage unit 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has suction holes that suck the placed die D. The placed die D is temporarily held on the intermediate stage 31. The intermediate stage 31 is both a placement stage on which the die D is placed and a pickup stage on which the die D is picked up.

[0019] The bonding section 40 includes a bond head 41, a bond head table 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that suction-holds a die D at its tip. The bond head table moves the bond head 41 in the Z1-Z2, Y1-Y2, and X1-X2 directions. The bond head table 43 may also rotate the bond head 41. The substrate recognition camera 44 captures an image of the substrate S and recognizes the bond position. Here, the substrate S may be, for example, a wiring board or a lead frame. The substrate S has multiple product areas (hereinafter referred to as package areas P) that will ultimately become a single package. The substrate S also has position recognition marks (not shown) for the package areas P. The bond stage 46 is raised when the die D is placed on the substrate S, supporting the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum-adsorbing the substrate S, and is capable of fixing the substrate S. The bond stage 46 also has a heating unit (not shown) for heating the substrate S.

[0020] With this configuration, the bond head 41 corrects the pick-up position and posture based on the image data of the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die D onto the package area P of the substrate S based on the image data of the substrate recognition camera 44, or bonds the die D by stacking it on top of a die that has already been bonded onto the package area P of the substrate S.

[0021] The transport unit 50 has transport claws 51 that grip and transport the substrate S, and a transport lane 52 along which the substrate S moves. The substrate S moves in the X1 direction by driving a nut (not shown) of the transport claws 51 provided on the transport lane 52 with a ball screw (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading unit 70 and hands the substrate S over to the substrate unloading unit 70.

[0022] The substrate supply unit 60 removes the substrate S, which has been stored in a transport jig and carried in, from the transport jig and supplies it to the transport unit 50. The substrate unloading unit 70 stores the substrate S, which has been transported by the transport unit 50, in the transport jig.

[0023] Next, the control unit 80 will be described with reference to Fig. 3. Fig. 3 is a block diagram showing the schematic configuration of the control system of the die bonder shown in Fig. 1.

[0024] The control system 8 includes a control unit (control device) 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 is broadly divided into a control / arithmetic unit 81 mainly composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus line 84, and a power supply unit 85. The storage device 82 includes a main storage device 82a and an auxiliary storage device 82b. The main storage device 82a is composed of a RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage device 82b is composed of a HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data, image data, and the like required for control.

[0025] The input / output device 83 includes a monitor 83a that displays the device status and other information, a touch panel 83b that inputs operator instructions, a mouse 83c that operates the monitor 83a, and an image capture device 83d that captures image data from the optical system 88. The input / output device 83 also includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls the XY table (not shown) of the wafer supply unit 10, the pickup head table 23, the drive unit of the bond head table 43, and the drive unit of the peeling unit 13. The I / O signal control device 83f captures or controls signals from a signal unit 87 that includes switches and volumes that control the brightness of various sensors and lighting devices. The optical system 88 includes a wafer recognition camera 14, a stage recognition camera 34, and a substrate recognition camera 44. The wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44 digitize light intensity and color. The control and calculation device 81 takes in necessary data via a bus line 84, performs calculations, controls the pickup head 21 and the like, and sends information to a monitor 83a and the like.

[0026] The control unit 80 stores image data captured by the wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44 in the storage device 82 via the image capture device 83d. Using software programmed based on the stored image data, the control / arithmetic unit 81 positions the package area P of the die D and the substrate S and inspects the surfaces of the die D and the substrate S. Based on the positions of the package area P of the die D and the substrate S calculated by the control / arithmetic unit 81, the software drives the drive unit 86 via the motor control device 83e. Through this process, the die on the wafer is positioned, and the pickup head table 23 and the bond head table 43 are operated to bond the die D onto the package area P of the substrate S.

[0027] A part of the manufacturing process of a semiconductor device using the die bonder 1 (a method for manufacturing a semiconductor device) will be described with reference to Fig. 4. Fig. 4 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by a control unit 80.

[0028] (Wafer Loading Step: Step S1) The wafer ring WR is supplied to the wafer cassette of the wafer cassette lifter 11. The supplied wafer ring WR is then supplied to the wafer holder 12.

[0029] (Substrate Carry-in Process: Process S2) The transport jig storing the substrate S is supplied to the substrate supply unit 60. In the substrate supply unit 60, the substrate S is taken out of the transport jig and fixed to the transport claws 51.

[0030] (Pickup process: process S3) After process S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 14, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder, and the die is positioned accordingly. Note that the die position reference point is previously held at a predetermined position on the wafer holder 12 as the initial setting for the device. The image data is processed to inspect the surface of the die D.

[0031] The positioned die D is peeled off from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D peeled off from the dicing tape DT is attracted to and held by a collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0032] The stage recognition camera 34 photographs the die D on the intermediate stage 31, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder, and the die is positioned accordingly. Note that the die position reference point is previously held at a predetermined position on the intermediate stage 31 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

[0033] After transporting the die D to the intermediate stage 31, the pickup head 21 is returned to the wafer supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, the dies D are peeled off one by one from the dicing tape DT according to the same procedure.

[0034] (Bonding process: process S4) The substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and image data is acquired by the image capture. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder 1. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting of the device.

[0035] The suction position of the bond head 41 is corrected based on the amount of deviation of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41 that has suctioned the die D from the intermediate stage 31 bonds the die D to a predetermined position on the substrate S supported by the bond stage 46. The substrate recognition camera 44 photographs the die D bonded to the substrate S, and based on the image data acquired by photographing, an inspection is performed to determine whether the die D has been bonded to the desired position, etc.

[0036] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until a die D is bonded to all the package areas P of the substrate S.

[0037] (Substrate Carry-Out Process: Process S5) The substrate S to which the die D is bonded is transported to the substrate carrying-out section 70. In the substrate carrying-out section 70, the substrate S is removed from the transport claws 51 and stored in a transport jig. The transport jig storing the substrate S is carried out from the die bonder 1.

[0038] As described above, the die D is mounted on the substrate S and carried out from the die bonder 1. Thereafter, for example, a transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, where the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to a molding process, where the die D and the Au wires are sealed with molding resin (not shown), thereby completing a semiconductor package.

[0039] In the case of stack bonding, following the wire bonding process, a transport jig on which a substrate S on which a die D is mounted is loaded and stored is carried into a die bonder, where the die D is stacked on top of the die D mounted on the substrate S, and after being carried out of the die bonder, the die D is electrically connected to the electrodes of the substrate S via Au wires in a wire bonding process. The dies D above the second tier are peeled from the dicing tape DT using the method described above, then transported to the bonding section and stacked on top of the dies D. After the above process is repeated a predetermined number of times, the substrate S is transported to a molding process, where multiple dies D and Au wires are sealed with molding resin (not shown) to complete a stack package.

[0040] The pickup head table 23 will be described with reference to Fig. 5. Fig. 5 is a side view showing the configuration of the pickup head table shown in Fig. 1.

[0041] The PH table 23 has a Z drive shaft 231 that moves the PH 21 in the Z1-Z2 direction, and a Y drive shaft 232 that moves the Z drive shaft 231 in the Y1-Y2 direction.

[0042] The Z drive shaft 231 lifts and lowers the pick-up head 21 to pick up the die D from the wafer holder 12 and place the die D on the intermediate stage 31 .

[0043] Y drive shaft 232 moves Z drive shaft 231 back and forth between a pickup position within wafer holder 12 and a placement position within intermediate stage 31 .

[0044] The Z drive shaft 231 will be described with reference to Figs. 6 to 9. Fig. 6 is a side view showing the configuration of the Z drive shaft of the pickup head table shown in Fig. 5. Fig. 7 is a cross-sectional view of the Z drive shaft taken along line A1-A2 in Fig. 6. Fig. 8 is a cross-sectional view of the Z drive shaft taken along line B1-B2 in Fig. 6. Fig. 9 is a cross-sectional view of the Z drive shaft taken along line C1-C2 in Fig. 6.

[0045] As shown in FIG. 6 , Z drive shaft 231 includes base 110 , bearings 120 and 130 , ball screw 140 , and rotary motor 150 .

[0046] As shown in FIG. 6, the base 110 extends in the Z1-Z2 direction. The base 110 has a pair of rails 111, 112 extending in the Z1-Z2 direction on the Y1 side and Y2 side. The rails 111, 112 are provided with recesses 111a, 112a in which linear guides 200a, 200b (described later) can slide. The cross section of the base 110 in the Y1-Y2 direction is U-shaped (see FIG. 8). The bearing 120 is provided at the end of the base 110 on the Z1 side. The bearing 130 is provided at the end of the base 110 on the Z2 side.

[0047] 6 and 7, the ball screw 140 includes a screw shaft 141, a slider 142, and balls 143. The screw shaft 141 extends in the Z1-Z2 direction between the bearing portion 120 and the bearing portion 130. The vicinity of the shaft end of the screw shaft 141 on the motor side is rotatably supported by the bearing portion 120. The end of the screw shaft 141 opposite the rotary motor 150 is rotatably supported by the bearing portion 120 and the bearing portion 130. The rotary shaft of the rotary motor 150 is connected to the screw shaft 141 via a coupling.

[0048] As shown in Fig. 7 , the slider 142 includes a slider body 200, a first block 201, a second block 202, a third block 203, a fourth block 204, and a fifth block 205. The slider 142 moves along the extension direction of the screw shaft 141. As shown in Fig. 8 , the slider body 200 has a pair of linear guides 200a, 200b on its side surfaces (Y1-side surface and Y2-side surface) parallel to the linear motion direction, and is slidable on a pair of rails 111, 112.

[0049] As shown in FIG. 7 , the slider body 200 has a through hole 200c through which the screw shaft 141 is inserted. The slider body 200 has a nut portion 200f in which a screw groove 200d is formed on the inner surface of the through hole 200c. A ball 143 is interposed between the screw groove 200d of the nut portion 200f and the screw groove 141a of the screw shaft 141. The minimum inner diameter of the through hole 200c is larger than the maximum outer diameter of the screw shaft 141, and there is a portion at the end of the nut portion 200f where the ball 143 is not interposed between the screw groove 200d and the screw groove 141a, and there is a gap between the screw groove 200d and the screw groove 141a at that portion. Furthermore, on the outer side of the nut portion 200f in the Z1-Z2 direction, there is a gap 200e (part of the through hole 200c) between the inner surface of the through hole 200c and the screw shaft 141. This gap 200e communicates with a first gap 201b (part of the through hole 201a) described below. Grease is provided between each of the screw grooves 141a, 200d and the balls 143. When the screw shaft 141 rotates, the balls 143 interposed between the inside of the slider body 200 and the screw shaft 141 roll, causing the slider body 200 to move linearly in the Z1-Z2 direction.

[0050] As shown in FIG. 7 , the first block 201 and the second block 202 are disposed on either side of the slider body. The first block 201 is fixed in close contact with the Z2 side of the slider body. The second block 202 is fixed in close contact with the Z1 side of the slider body. As shown in FIGS. 8 and 9 , the first block 201 has a through hole 201a with a circular cross section through which the screw shaft 141 is inserted. The minimum inner diameter of the through hole 201a is larger than the maximum outer diameter of the screw shaft 141, and a first gap 201b is provided between the inner surface of the through hole 201a and the screw shaft 141. The inner surface of the through hole 201a is not threadedly engaged with the screw shaft 141. The end of the first block 201 on the Z2 side is open via the first gap 201b. The second block 202 is configured as a mirror image of the first block 201. The screw shaft between the first block 201 and the bearing portion 130 and between the second block 202 and the bearing portion 120 is not covered by the slider 142. In other words, the slider 142 is movable between the first block 201 and the bearing portion 130 and between the second block 202 and the bearing portion 120.

[0051] As shown in Fig. 7, the fifth block 205 is provided on the X2 side of the slider body 200. The third block 203 is provided on the X2 side of the first block 201, the second block 202, and the fifth block 205. The third block 203 is provided with a pickup head 21. As shown in Fig. 6, a suction pipe 161 is attached to the fourth block 204. A flexible air tube 162 is attached to the suction pipe 161, and the air tube 162 is connected to a vacuum pump (suction device) via a valve, a flow rate regulator, etc.

[0052] The rotary motor 150 is provided on the Z1 side of the bearing portion 120 and is, for example, a servo motor.

[0053] The dust collection mechanism provided on slider 142 will be described with reference to Figures 8 to 11. Figure 10 is a cross-sectional view of the Z drive shaft taken along line D1-D2 in Figure 7. Figure 11 is a cross-sectional view of the Z drive shaft taken along line E1-E2 in Figure 10. Arrows in Figures 10 and 11 schematically indicate flow paths, and ● indicates a junction or a flow path change point.

[0054] As shown in FIG. 8 , the first block 201 has a pair of first flow paths 201c and 201d that communicate with the first gap 201b. In other words, the first block 201 is provided with the first flow paths 201c and 201d that communicate with the sliding portion between the screw shaft 141 and the slider body 200. The cross sections of the first flow paths 201c and 201d are circular. The diameters of the first flow paths 201c and 201d are configured to be approximately the same as or larger than the width of the first gap 201b. The openings of the first flow paths 201c and 201d that communicate with the first gap 201b are provided at positions facing the Y2-side end and the Y1-side end of the screw shaft 141. The end of the first block 201 opposite the slider body 200 (Z2-side) is open, so the first flow paths 201c and 201d communicate with the outside of the slider 142. In other words, this opening is an air intake port, and the suction effect is improved. The first flow paths 202c and 202d of the second block 202 have the same configuration as the first flow paths 201c and 201d of the first block 201.

[0055] As shown in FIG. 9 , the first block 201 has a pair of second flow paths 201e and 201f that communicate with the second gap 111b between the rail 111 and the slider 142. In other words, the first block 201 is provided with the second flow path 201e that communicates with the sliding portion between the linear guide 200a and the rail 111. The cross sections of the second flow paths 201e and 201f are circular. The opening of the second flow path 201e that communicates with the second gap 111b is provided in a position facing the lower side of the recess 111a of the rail 111. The opening of the second flow path 201f that communicates with the second gap 112b is provided in a position facing the lower side of the recess 112a of the rail 112. The second flow paths 201e and 201f change direction at the through-hole 201a side and extend in the X2 direction to communicate with the fourth block 204. The second flow paths 202 e and 202 f of the second block 202 have the same configuration as the second flow paths 201 e and 201 f of the first block 201 .

[0056] 11 , the first flow paths 201c and 201d in the first block 201 extend in the X1 direction, change direction, and extend in the Z1 direction to merge with the second flow paths 201e and 201f. In other words, the first flow paths 201c and 201d are in communication with the second flow paths 201e and 201f. The first flow paths 202c and 202d in the second block 202 extend in the X1 direction, change direction, and extend in the Z2 direction to merge with the second flow paths 202e and 202f.

[0057] As shown in Figures 10 and 11, the third block 203 is provided with flow paths 203a, 203b, 203c, 203d, 203e, 203f, 203g, and 203h that constitute the third flow path. The flow paths 203a, 203b, 203c, 203d, 203e, 203f, 203g, and 203h have circular cross sections. The flow paths 203a and 203b communicate with the second flow paths 201e and 201f. The flow paths 203a and 203b extend in the Z1 direction and merge with the flow path 203e that extends in the Y1 direction. The flow paths 203c and 203d communicate with the second flow paths 202e and 202f. The flow paths 203c and 203d extend in the Z2 direction and merge with the flow path 203f that extends in the Y1 direction. Flow path 203e and flow path 203f communicate with flow path 203g extending in the Z1-Z2 direction. Flow path 203g communicates with flow path 203h extending in the Y1 direction. Fourth block 204 is provided with fourth flow path 204a that guides flow path 203h to the outside of fourth block 204. Fourth flow path 204a has a circular cross section. Fourth flow path 204a extends in the X2 direction and communicates with flow path 203h. Fourth flow path 204a communicates with suction pipe 161.

[0058] 6 to the air tube 162. The air tube 162 is connected to a vacuum pump. The vacuum pump generates negative pressure in the first flow paths 201c, 201d and the second flow paths 201e, 201f of the first block 201, the first flow paths 202c, 202d and the second flow paths 202e, 202f of the second block 202, the third flow path, and the fourth flow path 204a, and air is sucked in together with dust from the sliding portion between the screw shaft 141 and the slider body 200 and the sliding portion between the linear guides 200a, 200b and the rails 111, 112.

[0059] The embodiment has at least one of the following effects: (a) It is possible to suppress the diffusion of oil mist (particles) generated from the slider 142 of the ball screw 140 that drives the pickup head. This makes it possible to suppress the generation of foreign matter in an area that requires high cleanliness within the movable range of the pickup head (the product area below it).

[0060] (b) It is also possible to suppress the generation of foreign matter by enclosing the entire ball screw. However, if the movable range is wide, the operating opening of the ball screw (the area where there is no slider) becomes large, and the amount of exhaust suction required to suppress foreign matter must also be large in proportion to the opening area. In this embodiment, the slider 142 of the ball screw 140 can be made small in both the enclosing (enclosing) area and the opening area. This allows for a smaller amount of exhaust suction than when the entire ball screw is enclosed and suctioned. This allows for a compact design, can be manufactured inexpensively, and enables a wide movable range.

[0061] (c) Since the diffusion of foreign matter is suppressed, adhesion of foreign matter to semiconductor products (substrates, wafers, dies) processed in the mounting space of the die bonder can be suppressed.

[0062] The disclosure made by the present inventors has been specifically described above based on the embodiments, but it goes without saying that the present disclosure is not limited to the above embodiments and can be modified in various ways.

[0063] For example, in the embodiment, the Z drive axis is used as an example, but the present invention can also be applied to a drive unit that uses a ball screw on a Y drive axis (a drive axis that drives in the Y direction) or an X drive axis (a drive axis that drives in the X direction).

[0064] In the embodiment, a pickup head has been described as an example, but the present invention can also be applied to the X drive axis, Y drive axis, and Z drive axis of a bond head or a preform head that use ball screws.The present invention can also be applied to drive units that use ball screws other than those mentioned above.The present invention can also be applied to drive units that use ball screws in manufacturing equipment for products that require high cleanliness, such as semiconductor products (dies and substrates).

[0065] In the embodiment, an example has been described in which the second flow paths 201e, 201f of the first block 201 and the second flow paths 202e, 202f of the second block 202 join together in the third block 203. However, the second flow paths 201e, 201f and the second flow paths 202e, 202f may join together, for example, inside the first block 201 and the second block 202, other than the third block 203. Furthermore, the first flow paths 201c, 201d and the second flow paths 201e, 201f of the first block 201, and the first flow paths 202c, 202d and the second flow paths 202e, 202f of the second block 202 may be connected independently to a plurality of air tubes. In this case, it is possible to change the suction force for each flow path.

[0066] In the embodiment, the flow path direction change portion is shown as 90 degrees, but it may be curved to form a flow path with low fluid resistance.

[0067] In the embodiment, an example using a die attach film has been described, but a preform section that applies adhesive to a substrate may be provided, eliminating the need for a die attach film. The preform section includes a preform head having a syringe that holds and applies a paste adhesive (workpiece), and a preform table that drives the preform head in vertical and horizontal directions. The preform table may be configured in the same manner as in the embodiment. The preform head may also be a cleaning head that cleans substrates, etc.

[0068] In the embodiment, a die bonder is described in which a pick-up head picks up a die from a wafer supply unit and places it on an intermediate stage, and a bond head bonds the die placed on the intermediate stage to a substrate, but this is not limited to this and the present invention can be applied to any die bonding device that picks up a die from a wafer supply unit.

[0069] For example, the present invention can be applied to a die bonder that does not have an intermediate stage and a pick-up head and that bonds a die from a wafer supply unit to a substrate with a bond head.

[0070] It is also applicable to a flip chip bonder that does not have an intermediate stage, picks up a die from a wafer supply unit, rotates the die pickup head upward, and delivers the die to the bond head, which then bonds the die to a substrate.

[0071] DESCRIPTION OF SYMBOLS 1... Die bonder (semiconductor manufacturing apparatus) 21... Pickup head (moving body) 23... Pickup head table 231... Z drive axis 111, 112... Rail 140... Ball screw 141... Screw shaft 142... Slider 143... Ball 150... Rotation motor 200... Slider body 200a... Linear guide 200f... Nut portion 201... First block 201b... First gap 201c, 201d... First flow path 202... Second block 202c, 202d... First flow path

Claims

1. A slider comprising a slider for mounting a moving body, a ball screw having a screw shaft and balls, a pair of rails along which the slider slides, and a rotary motor for driving the ball screw, wherein the slider comprises: a slider body having a nut portion screwed onto the screw shaft via the ball, a first block and a second block provided at both ends of the slider body in the extension direction of the screw shaft, and a pair of linear guides that slide on the rails, wherein the first block and the second block each have a through hole through which the screw shaft is inserted, and a first flow path for sucking a first gap provided between the inner surface of the through hole and the screw shaft, wherein the minimum inner diameter of the through hole is larger than the maximum outer diameter of the screw shaft, and the first gap is a drive shaft communicating between the outside of the slider and the nut portion.

2. The drive shaft according to claim 1, wherein the cross section of the first flow passage is circular.

3. A drive shaft according to claim 2, wherein the diameter of said first flow passage is approximately the same as the width of the gap between said slider body and said screw shaft.

4. A drive shaft according to claim 2, wherein the diameter of said first flow passage is larger than the width of the gap between said slider body and said screw shaft.

5. The drive shaft according to claim 1, wherein said first block and said second block each have a pair of said first flow passages.

6. The drive shaft according to claim 1, wherein a second gap is provided between said slider and said rail, and said first block and second block have second flow passages for sucking said second gap.

7. A drive shaft as claimed in claim 6, wherein the first flow passage of the first block merges with the second flow passage of the first block within the first block, and the first flow passage of the second block merges with the second flow passage of the second block within the second block.

8. The drive shaft according to claim 7, further comprising a third block connected to said first block and said second block and having a third flow passage, said second flow passage of said first block and said second flow passage of said second block joining said third flow passage.

9. The drive shaft according to claim 8, further comprising a fourth block connected to said third block and having a fourth flow passage, said third flow passage communicating with said fourth flow passage, and said fourth flow passage communicating with a flexible tube.

10. A head table comprising the drive shaft of claim 1, wherein the movable body is a head that holds a workpiece.

11. A semiconductor manufacturing device comprising the drive shaft of claim 1.

12. A method for manufacturing a semiconductor device, comprising the steps of: carrying a wafer ring into the semiconductor manufacturing equipment of claim 11; and picking up a die held by said wafer ring.

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