Electronic device

Abstract

An electronic device. The electronic device may comprise a mobile or fixed terminal having a middle frame, such as a mobile phone, a tablet computer, a notebook computer, a super-mobile personal computer, a handheld computer, a walkie-talkie, or a netbook. By means of providing a vapor chamber having an unequal thickness structure, the internal space of the electronic device can be fully utilized, effectively improving the heat dissipation performance of the electronic device. By means of arranging an insulating layer between the middle frame and the vapor chamber, costs are effectively reduced while achieving insulation performance.

Description

An electronic device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 20, 2023, with application number 202311552966.1 and invention name “An Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of communication equipment, and in particular to an electronic device. Background Art

[0003] Mobile phone power consumption and heat generation are key performance indicators for consumers. During use, the motherboard, power supply, and other components inside the phone will generate heat. Vapor chambers (VC) installed in the phone disperse this heat to prevent localized overheating of the phone, which could cause the electronic device to burn out. This also prevents a poor user experience caused by the failure to dissipate heat in a timely manner.

[0004] With the demand for lighter and thinner electronic devices such as mobile phones, the internal space of electronic devices, such as mobile phones, is limited, and the installation space of the heat spreader is limited. How to maximize the heat dissipation performance of the heat spreader within a limited space, improve the heat dissipation performance and user experience of electronic devices, and reduce costs at the same time is a technical problem that technical personnel in this field urgently need to solve.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide an electronic device that can maximize the heat dissipation performance of a heat spreader within a limited space, thereby improving the heat dissipation performance and user experience of the electronic device, while also effectively reducing costs.

[0007] In a first aspect, an embodiment of the present application provides an electronic device comprising a middle frame, a vapor chamber, and an insulating layer; the vapor chamber comprises at least two plate portions of varying thickness, the front surfaces of the respective plate portions being coplanar, and the front surface of the middle frame being provided with a mounting area corresponding to the vapor chamber; the insulating layer being fixedly disposed between the vapor chamber and the mounting area and covering the rear surface of the vapor chamber. The vapor chamber has an unequal thickness structure, which can fully utilize the internal space of the electronic device, ensure heat dissipation performance, avoid localized overheating, and enhance user experience. The insulating layer provides insulation between the middle frame and the vapor chamber, effectively reducing production costs and facilitating mass production. It can also prevent performance of the electronic device, such as heat dissipation and RSE performance, from being affected.

[0008] In one possible embodiment, the vapor chamber includes two plates, comprising a first plate portion and a second plate portion. The mounting area includes a first region corresponding to the first plate portion and a second region corresponding to the second plate portion. The insulating layer includes a first insulating layer and a second insulating layer, with the first insulating layer fixed between the first plate portion and the first region, and the second insulating layer fixed between the second plate portion and the second region. The two plates simplify the structure of the vapor chamber and the middle frame, and simplify the manufacturing process.

[0009] In one possible embodiment, the first insulating layer is an insulating adhesive layer, and the first region and the first plate portion are bonded and fixed via the first insulating layer. This configuration can simplify the overall structure and also simplify the installation operation between the middle frame and the heat spreader.

[0010] In one possible embodiment, when the first region and the first plate portion are bonded together via the first insulating layer, the distance between the second region and the second plate portion is greater than the thickness of the second insulating layer. The second insulating layer is provided with through-holes along the thickness direction, and the second region and the second plate portion are fixed together via glue provided in the through-holes. This arrangement can avoid the situation where, during the processing process, the first region and the first plate portion are bonded together via the insulating adhesive layer, but the second region and the second plate portion are not securely bonded together via the adhesive due to processing errors or other reasons. This ensures the stability of the bonding between the first region and the first plate portion and between the second region and the second plate portion, while also ensuring the flexibility of the fixing between the second region and the second plate portion.

[0011] In a possible embodiment, the second insulating layer is an insulating adhesive layer, and the second insulating layer is bonded and fixed to the second region or the second plate portion. This arrangement can make the structure simple and stable.

[0012] In one possible embodiment, the vapor chamber further includes a transition section disposed between the first plate portion and the second plate portion, the mounting area further includes a transition region disposed between the first region and the second region, and the insulating layer further includes a transition layer disposed between the first insulating layer and the second insulating layer, the transition layer being located between the transition region and the transition section. The transition section includes an inclined surface or an arcuate surface connecting the first plate portion and the second plate portion, and the transition region includes an inclined surface or an arcuate surface connecting the first region and the second region. This arrangement prevents electrical conduction between the middle frame and the vapor chamber due to sharp corners at locations where the thickness of the vapor chamber or the middle frame changes, thereby improving insulation performance.

[0013] In one possible embodiment, the transition zone and the transition section are separated from each other, and at least one side of the transition layer between the front side and the transition section, and between the back side and the transition zone, is not bonded. This avoids the possibility of noise being generated during use due to a loose bond between the transition zone and the transition section.

[0014] In one possible embodiment, the first and second insulating layers are integrated with an insulating adhesive layer, and the transition layer further includes a spacer layer bonded to the surface of the insulating adhesive layer. This configuration simplifies the overall structure and installation, while ensuring reliable insulation.

[0015] In a possible embodiment, the spacer layer is bonded to the front surface of the insulating adhesive layer, which facilitates the overall installation operation.

[0016] In a possible embodiment, the spacer layer is a Mylar sheet, a graphite sheet or a foam layer. This arrangement is convenient for obtaining materials and low in cost.

[0017] In one possible embodiment, the first and second insulating layers are independent of each other, and the transition layer is bonded or overlapped with the first and second insulating layers at both ends and fixed to the transition region or section by adhesive. The transition layer may simply serve an insulating purpose, providing greater flexibility.

[0018] In one possible embodiment, the vapor chamber includes a main body and a skirt disposed circumferentially along the main body. Each plate portion is formed on the main body, and the mounting area includes an edge region adapted to mate with the skirt. The insulating layer includes a mating layer fixed between the skirt and the edge region, further ensuring overall insulation between the vapor chamber and the middle frame.

[0019] In a possible embodiment, the matching layer is fixed to the edge region by bonding, and the matching layer is fixed to the skirt by dispensing glue. This arrangement facilitates the fixing operation of the matching layer between the edge region and the skirt.

[0020] In a possible embodiment, the main body is an integrated structure, which can simplify the overall structure and the installation operation.

[0021] In one possible embodiment, the main body includes a base plate and at least one mating plate, with a portion of the base plate forming a plate portion, and each mating plate being fixed to the base plate to form a plate portion. This arrangement allows for greater flexibility in the shaping of the vapor chamber.

[0022] In one possible embodiment, the electronic device further includes a display screen and a rear housing, which are fixed to either side of the middle frame to form a housing, and a vapor chamber located between the middle frame and the display screen. The vapor chamber ensures the overall heat dissipation performance of the electronic device, thereby ensuring normal operation of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG1 is a schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application;

[0024] FIG2 is a schematic diagram of the structure of the inner frame and the insulating layer of the electronic device in the assembled state;

[0025] FIG3 is a schematic diagram of the structure of the electronic device in the assembled state of the heat spreader and the middle frame;

[0026] FIG4 is a schematic structural diagram of AA in FIG3 , wherein the first insulating layer and the second insulating layer are insulating adhesive layers of an integrated structure;

[0027] FIG5 is a schematic structural diagram of AA in FIG3 , wherein the first insulating layer and the second insulating layer are insulating adhesive layers of an integrated structure, and a spacer layer is provided on the front surface of the insulating adhesive layer;

[0028] 6 is a schematic structural diagram of AA in FIG3 , wherein the first insulating layer and the second insulating layer are insulating adhesive layers of an integrated structure, and a spacer layer is provided on the rear surface of the insulating adhesive layer;

[0029] 7 is a schematic structural diagram of AA in FIG3 , wherein the first insulating layer and the second insulating layer are insulating adhesive layers of an integrated structure, and the front and rear surfaces of the insulating adhesive layers are respectively provided with spacer layers;

[0030] FIG8 is a schematic structural diagram of AA in FIG3 , wherein the first insulating layer and the second insulating layer are split structures, and the transition layer is fixed to the transition region;

[0031] FIG9 is a schematic structural diagram of AA in FIG3 , wherein the first insulating layer and the second insulating layer are split structures, and the transition layer is fixed to the transition section;

[0032] FIG10 is a schematic structural diagram of AA in FIG3 , wherein the main body of the vapor chamber includes a bottom plate and a matching plate.

[0033] In Figures 1 to 10, the reference numerals are explained as follows: 1 middle frame, 11 first area, 12 second area, 13 transition area; 2 heat spreader, 21 first plate portion, 22 second plate portion, 23 transition section, 24 skirt, 25 main body portion, 26 bottom plate, 27 matching plate; 3 insulating layer, 31 first insulating layer, 32 second insulating layer, 321 through hole, 33 transition layer, 34 spacer layer, 35 extension section, 36 matching layer, 37 exhaust structure; 4 dispensing; 5 gap; 6 display screen; 7 back cover. DETAILED DESCRIPTION

[0034] The embodiments of the present application provide an electronic device, including but not limited to a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a driving recorder, a wearable device, a virtual reality device, a wireless USB flash drive, a Bluetooth speaker / headphone, or a mobile or fixed terminal with a middle frame, such as a car front-end.

[0035] When the electronic device is a mobile phone or a tablet computer, as shown in Figures 1, 2 and 3, the electronic device includes a middle frame 1, a display screen 6 and a back cover 7. The display screen 6 can be fixed to the front side of the middle frame 1 by bonding, snapping, etc., and the back cover 7 can be fixed to the back side of the middle frame 1 by bonding, snapping, fastener connection, etc. The middle frame 1, the display screen 6 and the back cover 7 are combined to form a shell. The electronic device also includes components such as a motherboard, a battery and a vapor chamber (VC) plate 2 arranged in the shell. The heat dissipation performance of the electronic device can be improved by the vapor chamber 2.

[0036] Among them, the main board is fixed on the rear side of the middle frame 1, and the heat spreader 2 is fixed on the front side of the middle frame 1 and is located between the middle frame 1 and the display screen 6. When the electronic device is in use, the main board, battery and other components will generate heat. The heat spreader 2 can disperse the heat generated by the main board, battery, etc. to avoid local high temperature and cause the electronic device to burn out. At the same time, it can also provide protection for the main board and battery.

[0037] 1, "front" refers to the side toward the display screen 6, and "rear" refers to the side toward the rear housing 7.

[0038] When the electronic device is a laptop computer, the electronic device also includes a keyboard. The keyboard and the heat spreader 2 are both fixed to the middle frame 1, and the heat spreader 2 is located between the middle frame 1 and the keyboard. The setting of the heat spreader 2 can prevent the user from experiencing excessive heat generated locally during use, thereby affecting the user experience.

[0039] For the convenience of explanation, the following text takes the electronic device as an example to explain this solution in detail.

[0040] When the electronic device is assembled, the outer periphery of the middle frame 1 is visible from the outside. This portion can be made of either plastic or metal. If the outer periphery of the middle frame 1 is made of metal, it needs to be anodized to ensure good appearance and insulation properties. The mounting area of ​​the middle frame 1 within the housing, where it mates with the vapor chamber 2, is made of metal. The vapor chamber 2 is also made of metal (such as stainless steel or copper). Therefore, after the vapor chamber 2 is secured to the middle frame 1, insulation between the two must be ensured.

[0041] The thickness of vapor chamber 2 can be adjusted based on the space between middle frame 1 and display screen 6. It's easy to understand that the thicker vapor chamber 2 is, the better the heat dissipation. Therefore, to fully utilize the internal space of the electronic device and ensure heat dissipation performance, in this embodiment, as shown in FIG3 , vapor chamber 2 is configured to include a first plate portion 21 and a second plate portion 22 . The first and second plate portions 21 and 22 have different thicknesses, meaning that vapor chamber 2 has an unequal thickness structure.

[0042] Of course, in this embodiment, the vapor chamber 2 may also include a third plate portion, with the first plate portion 21, the second plate portion 22, and the third plate portion arranged in sequence. The second plate portion 22 has a different thickness from the first plate portion 21 and the third plate portion. The thickness of the first plate portion 21 and the third plate portion can be the same or different, depending on the actual space. Alternatively, the vapor chamber 2 may include more plates, that is, the vapor chamber 2 includes at least two plates of different thicknesses, which can be arranged according to the actual space and heat dissipation requirements.

[0043] Compared with the solution of using a heat spreader 2 with an equal thickness structure, setting the heat spreader 2 with an unequal thickness structure can fully utilize the internal space of the electronic device without affecting the volume of the electronic device. At the same time, it can also improve the heat dissipation capacity of the heat spreader 2, ensure the overall heat dissipation performance of the electronic device, avoid local excessive temperature, and improve user experience.

[0044] In detail, the size of the installation space for installing the heat spreader 2 between the middle frame 1 and the display screen 6 is not uniform in the thickness direction. For example, in order to improve the battery life, the thickness of the battery is thicker, resulting in the installation space corresponding to the battery having a relatively small size in the thickness direction, while the installation space corresponding to the mainboard having a relatively large size in the thickness direction. The heat spreader 2 is configured to include at least two plate parts, and the size of each plate part (including area and thickness) can be set according to the size of the space where it is located to make full use of the installation space, so that the heat spreader 2 has an unequal thickness structure. In this way, the heat spreader 2 with the largest volume can be set in a limited installation space, thereby improving the overall heat dissipation capacity of the heat spreader 2.

[0045] The configuration of two plates can simplify the structure of the vapor chamber 2 and the middle frame 1 and simplify the processing. For the convenience of explanation, the following description will be based on the vapor chamber 2 including the first plate portion 21 and the second plate portion 22 as an example.

[0046] Since the thicknesses of the first plate portion 21 and the second plate portion 22 are different, and the front side surfaces of each plate portion are coplanar, the rear side surfaces of the first plate portion 21 and the second plate portion 22 can form a step structure. Accordingly, the installation area of ​​the front side surface of the middle frame 1 includes a first area 11 and a second area 12. The first area 11 is arranged corresponding to the first plate portion 21, and the second area 12 is arranged corresponding to the second plate portion 22. The surfaces of the first area 11 and the second area 12 are not coplanar and form a step structure.

[0047] To achieve insulation between the middle frame 1 and the vapor chamber 2, an insulating coating can be formed on the front surface of the middle frame 1 or on the rear surface of the vapor chamber 2 to ensure insulation between the middle frame 1 and the vapor chamber 2. Specifically, an insulating coating can be formed on the front surface of the middle frame 1 or on the rear surface of the vapor chamber 2 by anodizing or insulating spraying. The middle frame 1 and the vapor chamber 2 can then be fixed by adhesive bonding. However, forming an insulating coating on the front surface of the middle frame 1 or on the rear surface of the vapor chamber 2 is costly.

[0048] As shown in Figure 2, in this embodiment, an insulating layer 3 is provided between the middle frame 1 and the vapor chamber 2. This insulating layer 3 can cover the rear surface of the vapor chamber 2, ensuring the overall insulation between the middle frame 1 and the vapor chamber 2. At the same time, the provision of this insulating layer 3 does not affect the reliability, heat dissipation performance, and RSE (Radiation Spurious Emission) performance of the electronic device. In addition, there is no need to anodize or spray-coat the surface of the middle frame 1 or the vapor chamber 2. Insulation is achieved through the insulating layer 3, which can effectively reduce production costs and facilitate mass production. At the same time, it can also prevent the insulating coating formed on the surface of the vapor chamber 2 from affecting the heat dissipation performance of the vapor chamber 2.

[0049] Specifically, as shown in FIG. 2 , the insulating layer 3 includes a first insulating layer 31 and a second insulating layer 32 , wherein the first insulating layer 31 is located between the first region 11 and the first plate portion 21 , and the second insulating layer 32 is located between the second region 12 and the second plate portion 22 .

[0050] As shown in Figures 4, 5, 6, 7, 8 and 9, the first plate portion 21 and the second plate portion 22 are transitionally connected via a transition section 23, and the first area 11 and the second area 12 are also connected via a transition zone 13. The transition section 23 and the transition zone 13 are arranged correspondingly. The insulating layer 3 also includes a transition layer 33 located between the first insulating layer 31 and the second insulating layer 32, and the transition layer 33 is located between the transition section 23 and the transition zone 13.

[0051] It is not difficult to understand that if the heat spreader 2 also includes a third plate portion, the front surface of the third plate portion is coplanar with the front surfaces of the first plate portion 21 and the second plate portion 22, and the rear surface of the third plate portion forms a step structure with the rear surface of the first plate portion 21 or the rear surface of the second plate portion 22, the installation area of ​​the middle frame 1 also includes a third area, and the insulating layer 3 also includes a third insulating layer 3 located between the third area and the third plate portion. A transition section 23 is provided on the rear surface of the heat spreader 2 between two adjacent plate portions of different thicknesses, and a transition area 13 is provided between two adjacent different areas of the middle frame 1. The insulating layer 3 also includes a transition layer 33 corresponding to each transition area 13.

[0052] Specifically, the transition section 23 can be an arcuate surface as shown in FIG4 or an inclined surface as shown in FIG5, so that the rear surface of the first plate portion 21 and the rear surface of the second plate portion 22 transition smoothly, and there is no sharp corner structure at the position between the first plate portion 21 and the second plate portion 22. The transition zone 13 can be an arcuate surface as shown in FIG4, FIG5, FIG6, FIG7, FIG8 and FIG9, or the transition zone 13 can also be an inclined surface, so that the first area 11 and the second area 12 are connected by the transition zone 13 to achieve a smooth transition, and there is no sharp corner structure at the position between the first area 11 and the second area 12. In this way, it is possible to avoid the situation where the middle frame 1 and the heat spreader 2 are conductive due to the presence of a sharp corner at the location where the thickness of the heat spreader 2 changes, and the insulation effect is good.

[0053] As shown in Figure 4, the first insulating layer 31 and the second insulating layer 32 are both insulating adhesive layers. The first area 11 and the first plate portion 21 are bonded and fixed by the first insulating layer 31, and the second area 12 and the second plate portion 22 are bonded and fixed by the second insulating layer 32. This arrangement can simplify the overall structure and also simplify the installation operation between the middle frame 1 and the heat spreader 2.

[0054] 4 , the first insulating layer 31 and the second insulating layer 32 are an integrated insulating adhesive layer, and a transition layer 33 is formed between the first insulating layer 31 and the second insulating layer 32 . The overall structure is simple and easy to install.

[0055] Alternatively, as shown in Figures 5, 6, 7, 8 and 9, the first insulating layer 31 is an insulating adhesive layer, and the first area 11 and the first plate portion 21 are bonded and fixed by the first insulating layer 31. Moreover, when the first area 11 and the first plate portion 21 are bonded and fixed by the first insulating layer 31, the distance between the second area 12 and the second plate portion 22 is greater than the thickness of the second insulating layer 32. In the installed state, a gap 5 is left between the second insulating layer 32 and the second area 12, or between the second insulating layer 32 and the second plate portion 22.

[0056] As shown in FIG2 , the second insulating layer 32 is provided with a through hole 321 along the thickness direction, and then the second region 12 and the second plate portion 22 are fixed by glue 4 located at the through hole 321 (as shown in FIG5 , FIG6 , FIG7 , FIG8 and FIG9 ). In other words, the first region 11 and the first plate portion 21 are fixed by bonding, and the second region 12 and the second plate portion 22 are fixed by glue 4.

[0057] This arrangement prevents the situation where, during the manufacturing process, the second region 12 and the second plate portion 22 cannot be securely bonded together by the adhesive after the first region 11 and the first plate portion 21 are bonded together by the insulating adhesive layer due to processing errors or other reasons. This ensures the stability of the bonding between the first region 11 and the first plate portion 21, and between the second region 12 and the second plate portion 22. It also reduces the machining accuracy of the middle frame 1 and the heat spreader 2, thereby reducing production costs. Furthermore, when fixed by the adhesive dispensing 4, the flexibility of the fixing between the second region 12 and the second plate portion 22 can be ensured, providing good applicability.

[0058] In addition, when the first region 11 and the first plate portion 21 are bonded and fixed by an insulating adhesive layer, and the second region 12 and the second plate portion 22 are fixed by glue 4, there is no restriction on the specific material of the second insulating layer 32. The second insulating layer 32 can be an insulating adhesive layer, which is convenient for directly bonding and fixing it to the second region 12 or the second plate portion 22. The structure is simple and the stability is good. Alternatively, the second insulating layer 32 can also be a Mylar sheet, a graphite sheet or foam, which can be fixed to the second region 12 or the second plate portion 22 by bonding.

[0059] In this embodiment, there are no restrictions on the number, size, shape, and arrangement of the through holes 321 provided in the second insulating layer 32. As shown in FIG2 , a row of through holes 321 is provided along the width direction of the middle frame 1. This row includes four through holes 321 spaced apart. Alternatively, two or more rows of through holes 321 may be provided, and the number of through holes 321 in each row may be the same or different. The through holes 321 may be elongated holes as shown in FIG2 , or circular holes, etc.

[0060] The first area 11 and the first plate portion 21, as well as the second area 12 and the second plate portion 22 are all planar fits, which can be fixed by bonding or glue 4 to ensure bonding stability. The transition area 13 and the transition section 23 are non-planar fits. In this embodiment, there is no bonding between the transition area 13 and the transition section 23, but they are separated from each other. That is to say, at least one side between the front side of the transition layer 33 and the transition section 23, and between the back side of the transition layer 33 and the transition area 13 is not bonded.

[0061] There are three specific situations:

[0062] In the first case, the transition layer 33 and the transition section 23 are not bonded, but the transition layer 33 and the transition zone 13 are bonded;

[0063] In the second case, the transition layer 33 and the transition section 23 are bonded, but the transition layer 33 and the transition zone 13 are not bonded;

[0064] In the third case, the transition layer 33 and the transition section 23 are not bonded together, and the transition layer 33 and the transition region 13 are not bonded together.

[0065] In this way, compared with the solution of bonding and fixing the two sides of the transition layer 33 to the transition section 23 and the transition area 13 respectively, it can avoid the situation where the transition layer 33 and the transition section 23 or the transition layer 33 and the transition area 13 are not firmly bonded, resulting in that when the user presses the position corresponding to the display screen 6 and the transition layer 33 during use, the bonding state is reached in the pressed state, and separation will occur when not pressed, resulting in noise during use, thereby improving the user experience.

[0066] As shown in Figures 5, 6 and 7, the first insulating layer 31 and the second insulating layer 32 can be an insulating adhesive layer of an integrated structure. At this time, the heat spreader 2 and the middle frame 1 are bonded and fixed by a whole piece of insulating adhesive layer, which can simplify the overall structure and installation operation and ensure reliable insulation. At the same time, a spacer layer 34 is provided between the heat spreader 2 and the middle frame 1. The spacer layer 34 has no bonding ability and is located between the transition section 23 and the transition zone 13. The spacer layer 34 is bonded to the insulating adhesive layer to form the above-mentioned transition layer 33. At this time, the insulating layer 3 includes an insulating adhesive layer and a spacer layer 34.

[0067] As shown in Figure 5 , the spacer layer 34 is positioned on the front surface of the insulating adhesive layer. At this point, the insulating adhesive layer is bonded to the transition region 13, while the spacer layer 34 is not bonded to the transition section 23, resulting in the first scenario described above. During installation, before securing the vapor chamber 2 to the middle frame 1, the insulating adhesive layer is first bonded to the middle frame 1, such that the insulating adhesive layer covers and bonds to the first region 11, the second region 12, and the transition region 13. The spacer layer 34 is then bonded to the position corresponding to the insulating adhesive layer and the transition region 13. Finally, the vapor chamber 2 is bonded to the insulating adhesive layer, facilitating installation.

[0068] Of course, the spacer layer 34 can also be set on the rear surface of the insulating adhesive layer, as shown in Figure 6. At this time, the insulating adhesive layer is bonded to the transition section 23, and the spacer layer 34 is not bonded to the transition area 13, forming the second situation mentioned above.

[0069] Alternatively, a spacer layer 34 may be provided on the front and rear surfaces of the insulating adhesive layer, as shown in FIG7 . In this case, the spacer layer 34 is not bonded to the transition section 23 , and the spacer layer 34 is not bonded to the transition zone 13 , forming the third situation mentioned above.

[0070] When the spacer layer 34 is only provided on one side of the insulating adhesive layer, the overall structure can be simplified, the thickness of the insulating transition layer 33 can be reduced, and the space requirement can be reduced. Moreover, when the spacer layer 34 is provided on the front surface of the insulating adhesive layer, the overall installation operation is facilitated.

[0071] In this embodiment, the spacer layer 34 can be a sheet material having insulating properties but no adhesive function, such as a Mylar sheet, a graphite sheet, or a foam layer, which is easy to obtain and low in cost.

[0072] As shown in Figures 5, 6 and 7, extension sections 35 are respectively provided on both sides of the spacer layer 34. The extension section 35 on one side is sandwiched between the first area 11 and the first plate portion 21, and the extension section 35 on the other side is sandwiched between the second area 12 and the second plate portion 22. That is to say, the extension section 35 can extend to the planar structures on both sides to ensure that the transition layer 33 can completely cover the transition area 13 and the transition section 23, and ensure that the transition area 13 and the transition section 23 are completely non-bonded.

[0073] At least part of the glue 4 between the second area 12 and the second plate portion 22 also passes through the extension section 35, that is, at least part of the through holes 321 of the second insulating layer 32 is set to pass through the extension section 35, so that the stability of the spacer layer 34 can be further guaranteed.

[0074] As shown in Figures 8 and 9, the first insulating layer 31 and the second insulating layer 32 can also be independent insulating adhesive layers. In this case, two large insulating adhesive layers can be arranged between the heat spreader 2 and the middle frame 1. The transition layer 33 is located between the two large insulating adhesive layers. The two sides of the transition layer 33 are respectively connected or overlapped with the first insulating layer 31 and the second insulating layer 32 to ensure overall insulation. The transition layer 33 can only play an insulating effect, and such a setting has better flexibility.

[0075] As shown in FIG8 , the transition layer 33 can be fixed to the transition region 13 by bonding, gluing, or the like. Alternatively, as shown in FIG9 , the transition layer 33 can be fixed to the transition section 23 by bonding, gluing, or the like. The transition layer 33 can be a sheet material having insulating properties but no adhesive properties, such as a Mylar sheet, a graphite sheet, or a foam layer.

[0076] Taking the Mylar sheet as an example, when the first insulating layer 31 and the second insulating layer 32 are an integrated insulating adhesive layer, and a spacer layer 34 is bonded to the surface of the insulating adhesive layer, the spacer layer 34 formed by the Mylar sheet only needs to play a role in preventing adhesion. When the first insulating layer 31 and the second insulating layer 32 are independent insulating adhesive layers, the insulating layer 3 formed by the Mylar sheet needs to play the role of insulation and preventing adhesion at the same time. At this time, the thickness of the Mylar sheet must be greater than the thickness of the above-mentioned spacer layer 34.

[0077] As shown in Figure 2, the insulation layer 3 is also provided with a vent structure 37, which facilitates exhaust and ensures the performance of the electronic device. Specifically, the vent structure 37 is a linear structure provided in the insulation layer 3, which facilitates exhaust while ensuring insulation between the middle frame 1 and the vapor chamber 2. The length, number, and arrangement of the linear structures can be determined based on the specific situation and are not specifically limited here.

[0078] An insulating isolation layer is further provided between the heat spreader 2 and the display screen 6 . The insulating isolation layer may be a Mylar sheet, a graphite sheet or a foam. Moreover, when the insulating isolation layer is a graphite sheet, it is more conducive to heat dissipation.

[0079] As shown in Figure 3, the heat spreader 2 includes a main body 25 and a skirt 24, wherein each plate portion is formed on the main body 25, that is, the main body 25 includes a first plate portion 21, a second plate portion 22 and a transition section 23, and the skirt 24 is arranged along the circumference of the main body 25. Accordingly, the installation area also includes an edge area arranged along the circumference, and the first area 11, the second area 12 and the transition area 13 are all located in the space enclosed by the edge area. The insulating layer 3 also includes a matching layer 36 arranged between the skirt 24 and the edge area. Specifically, the matching layer 36 can be an insulating glue layer or a Mylar layer, a graphite layer, or a foam layer. The matching layer 36 and the edge area can be fixed by back glue, and the matching layer 36 and the skirt 24 can be fixed by glue 4.

[0080] As shown in Figures 4, 5, 6, 7, 8 and 9, the main body 25 is an integrated structure. The main body 25 itself does not require assembly operation. Specifically, it can be formed by processing a plate body so that the thickness of each plate part is different. Such a setting can simplify the overall structure and assembly operation.

[0081] Alternatively, as shown in Figure 10, the main body portion 25 can also be a structure including a base plate 26 and a mating plate 27, the front side surface of the base plate 26 is a planar structure, the mating plate 27 can be fixed to the rear side surface of the base plate 26 (such as adhesively fixed), and the base plate 26 is locally thickened to form a second plate portion 22, and the part of the base plate 26 where the mating plate 27 is not fixed forms a first plate portion 21, the first plate portion 21 and the second plate portion 22 have different thicknesses, and the second plate portion 22 is processed to form an inclined surface or an arc surface on the side facing the first plate portion 21 to form a transition section 23.

[0082] The number of mating plates 27 can be set according to the number of plate portions, such as one, two, or more. The thickness of each mating plate 27 can be set according to the specific installation space. The main body 25 is formed by the base plate 26 and the mating plates 27, which can make the molding of the heat spreader 2 more flexible.

[0083] In addition, in this embodiment, there is no restriction on the specific positions of the first plate portion 21 and the second plate portion 22 in the electronic device. They can be arranged according to the actual space conditions inside the electronic device. For example, the thickness of the first plate portion 21 is greater than the thickness of the second plate portion 22, and the first plate portion 21 corresponds to the main board, and the second plate portion 22 corresponds to the battery. Alternatively, the thickness of the first plate portion 21 is less than the thickness of the second plate portion 22, and the first plate portion 21 corresponds to the battery, and the second plate portion 22 corresponds to the main board.

[0084] This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the method and core ideas of this application. It should be noted that for those skilled in the art, without departing from the principles of this application, various improvements and modifications can be made to this application, and such improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. An electronic device, characterized in that, It includes a middle frame (1), a vapor chamber (2) and an insulating layer (3); The vapor chamber (2) includes at least two plate parts with different thicknesses, the front side surfaces of the plate parts are coplanar, and the front side surface of the middle frame (1) is provided with an installation area corresponding to the vapor chamber (2); The insulating layer (3) is fixedly arranged between the vapor chamber (2) and the installation area, and covers the rear side surface of the vapor chamber (2).

2. The electronic device according to claim 1, wherein The vapor chamber (2) includes two plate parts, and the two plate parts include a first plate part (21) and a second plate part (22); The installation area includes a first area (11) corresponding to the first plate part (21) and a second area (12) corresponding to the second plate part (22); The insulating layer (3) includes a first insulating layer (31) and a second insulating layer (32), the first insulating layer (31) is fixedly arranged between the first plate part (21) and the first area (11), and the second insulating layer (32) is fixed between the second plate part (22) and the second area (12).

3. The electronic device according to claim 2, characterized in that The first insulating layer (31) is an insulating adhesive layer, and the first area (11) and the first plate part (21) are adhesively fixed through the first insulating layer (31).

4. The electronic device according to claim 3, characterized in that, When the first area (11) and the first plate part (21) are adhesively fixed through the first insulating layer (31), the distance between the second area (12) and the second plate part (22) is greater than the thickness of the second insulating layer (32). The second insulating layer (32) is provided with a through hole (321) along the thickness direction, and the second area (12) and the second plate part (22) are fixed through a glue dot (4) arranged in the through hole (321).

5. The electronic device according to claim 4, wherein The second insulating layer (32) is an insulating adhesive layer, and the second insulating layer (32) is adhesively fixed to the second area (12) or the second plate part (22).

6. The electronic device according to any one of claims 2-5, characterized in that, The vapor chamber (2) further includes a transition section (23) arranged between the first plate part (21) and the second plate part (22), the installation area further includes a transition area (13) located between the first area (11) and the second area (12), and the insulating layer (3) further includes a transition layer (33) arranged between the first insulating layer (31) and the second insulating layer (32). The transition layer (33) is located between the transition area (13) and the transition section (23); The transition section (23) includes an inclined surface or an arc surface connected between the first plate part (21) and the second plate part (22); The transition area (13) includes an inclined surface or an arc surface connected between the first area (11) and the second area (12).

7. The electronic device according to claim 6, characterized in that, The transition area (13) and the transition section (23) are separated from each other, and at least one side between the front side of the transition layer (33) and the transition section (23) and between the rear side of the transition layer (33) and the transition area (13) is not adhesively fixed.

8. The electronic device according to claim 7, wherein The first insulating layer (31) and the second insulating layer (32) are an integral insulating adhesive layer, and the transition layer (33) further includes a spacer layer (34), and the spacer layer (34) is bonded to the surface of the insulating adhesive layer.

9. The electronic device according to claim 8, wherein The spacer layer (34) is bonded to the front surface of the insulating adhesive layer.

10. The electronic device according to claim 8 or 9, characterized in that, The spacer layer (34) is a Mylar sheet, a graphite sheet or a foam layer.

11. The electronic device according to claim 7, wherein The first insulating layer (31) and the second insulating layer (32) are independent of each other. The two side ends of the transition layer (33) are respectively joined or overlapped with the first insulating layer (31) and the second insulating layer (32), and are fixed to the transition region (13) or the transition section (23) by bonding.

12. The electronic device according to any one of claims 1-11, characterized in that, The heat pipe (2) includes a main body portion (25) and a skirt (24) disposed along the circumference of the main body portion (25). Each plate portion is disposed on the main body portion (25). The installation area is provided with an edge area adapted to the skirt (24). The insulating layer (3) includes a mating layer (36) fixed between the skirt (24) and the edge area.

13. The electronic device according to claim 12, wherein The mating layer (36) is fixedly bonded to the edge area, and the mating layer (36) is fixed to the skirt (24) by dispensing glue (4).

14. The electronic device according to claim 12, wherein The main body portion (25) is of an integral structure.

15. The electronic device according to claim 12, wherein The main body portion (25) includes a bottom plate (26) and at least one mating plate (27). Part of the bottom plate (26) forms one of the plate portions, and each mating plate (27) is respectively fixed to the bottom plate (26) and forms one of the plate portions.

16. The electronic device according to any one of claims 1 to 15, characterized in that, It further includes a display screen (6) and a rear case (7). The display screen (6) and the rear case (7) are respectively fixed on both sides of the middle frame (1) and enclose to form a housing. The heat pipe (2) is located between the middle frame (1) and the display screen (6).

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