A circuit board system

Abstract

The present invention relates to a breadboard system for prototyping both analogue and digital circuits and provides an electronic prototyping system to construct one or more complex electronic circuits, wherein each circuit board is designed and built to provide a specific function that contributes to an overall system design. The present invention provides an electronic circuit module unit comprising a circuit board device with a plurality of electrical contacts arranged within a circuit layout to enable electronic components to be releasably connected by solderless contacts within the circuit layout. The electrical contacts provide a first configuration of component connections to form a first type of signal processing circuit with a first signal processing function, and a second configuration of component connections to form a second type of signal processing circuit with a second signal processing function. The connection of a first set of electrical components in the first configuration forms the first type of signal processing circuit with the first signal processing function having primary characteristics and replacement of at least one electrical component of a first type having a first value for another electrical component of the first type having a second value changes the primary characteristics whilst maintaining the first type of signal processing circuit with the first signal processing function.

Description

[0001]A Circuit Board System FIELD OF THE INVENTIONThis invention relates to a circuit board system and a bread board system. Inparticular, the present invention relates to a versatile bread board system havingmultiple interchangeable and versatile parts intended to facilitate the electricalconnection among electronic components to construct multiple pre-built circuits. BACKGROUND TO THE INVENTIONSolderless component boards in the form of breadboards typically include holes onthe board and a plurality of electrical jumper connectors. Such breadboards are designed for solderless experimental design in electronic circuits. Bread boardsystems are well known for the semi-permanent rapid construction of prototypeelectronic circuits boards. Unlike other known electronic prototyping systems, breadboard systems do not require soldering or the destruction of any connecting tracks and are hence reusable.A typical bread board system comprises a non-conductive housing of, for example,injection moulded plastics or plastics like material. The housing is formed with aplurality of compartments with each typically having an opening in a top housingsurface for access to the compartment by an insertion of an electrical lead or leg ofan electronic component or the like through the opening.An electrical contact is positioned within each compartment to electrically connectwith an inserted lead or component. The electrical contact is typically formed froma mechanical spring contact. A known problem of these mechanical springs is that they suffer from an issue known as breadboard noise. This noise arises due to theinherent characteristics of the mechanical spring contacts, which induces electricalnoise and signal instability to the constructed circuit. For example, the spring clamp has only limited connection to the round leg of the component thus making it not P5521PC00 specification 21 November 2024 very good for high frequency work and high currents. Such noise can interfere with the functionality of the circuit performance and lead to inaccurate results during the experimentation of the constructed circuit.Electrical noise also arises in complex and cluttered circuit layouts with numerousinterconnected metal tracks. As the circuit complexity increases, the likelihood ofsignal cross talk and interference rises. This is because of electromagneticinterference (EMI) and radiofrequency noise, which causes crosstalk between the circuit traces. This crosstalk leads to reduce the signal to noise ratio (SNR) andcompromises the performance.Prototype circuits are constructed upon known breadboards by connectingelectronic components via jumper wires. Prototype circuits can also be constructedupon known printed circuit board (PCB) strip boards, such as veroboards bysoldering electronic components to printed circuit strips which are then subsequentlycut. The problem with this circuit construction is that it can be time consuming, especially when building complex circuits that involve numerous components and soldered connections. Moreover, when a design change is required, it will be required to disassemble and reconfigure the circuit accordingly. This work increases the amount of time and effort that is required for developing a prototypeboard, along with increasing the likelihood of incurring human errors during theconstruction of the board. When constructing large or complex prototype circuits, a single known breadboard may not be sufficient to accommodate all the required circuit components and connections. Therefore, the construction of large circuits is carried out over multiple known breadboards, which leads to the problem of providing the required interconnections between the required breadboards. Such interconnections may lead to circuit instabilities and increased electrical noise. Power interconnections between multiple known breadboards lead to power related issues that can affect the performance of the constructed circuit, which can result in P5521PC00 specification 21 November 2024 an extended debugging time for the circuit. It is an aim of the present invention to overcome at least one problem associated with the prior art whether referred to herein or otherwise. SUMMARY OF THE INVENTION According to a first aspect of the present invention there is provided an electroniccircuit module unit comprising:a circuit board device, the circuit board device comprising: a printed circuit board including a circuit layout, a plurality of electrical contacts arranged within the circuit layout to enable electronic components to be releasably connected by solderless contacts within the circuit layout; a power input connector; a power output connector; an electronic signal input connector; an electronic signal output connector; wherein the plurality of electrical contacts provides: a first configuration of component connections to form a first type of signal processing circuit with a first signal processing function, and a second configuration of component connections to form a second type of signal processing circuit with a second signal processing function, and wherein connection of a first set of electrical components in the first configuration forms the first type of signal processing circuit with the first signal processing function having primary characteristics and replacement of at least one electrical component of a first type having a first value for another electrical component of the first type having a second value changes the primary characteristics whilst maintaining the first type of signal processing circuit with the first signal processing function. P5521PC00 specification 21 November 2024 Preferably the circuit board device comprises a multi-layered device or laminated device. The multi layered device may comprises an upper layer, at least one intermediate layer and a lower layer. The circuit layout may be provided on an intermediate a layer. The upper layer may comprise a non-conductive substrate. The lower layer may comprise a non-conductive substrate. The upper layer and the lower layer may provide the outermost surfaces for the circuit board device. Preferably the circuit layout comprises tracks or circuit traces and preferably provided on an intermediate layer. The multi layered device may comprise a plurality of intermediate layers. The tracks or circuit traces may be provided on the plurality of intermediate layers. Preferably the circuit board device comprises a matrix of apertures for receiving receptacles to contact the circuit layout and preferably the tracks or circuit traces. The receptacles may be manually releasably securable within a respective aperture. The receptacles may be secured with a push fit and / or interference fit within a respective aperture. The receptacles may be gripped within a respective aperture. The receptacles may be manually removable from a respective aperture. The receptacle may comprise a sleeve member or cylindrical member. The receptacle may comprise an inner opening into which a section of an electrical component may be retained. The inner opening may be arranged to grip an end section of an electrical component. The inner opening may be arranged to grip anend section of a wire which may be provided on or towards an end of a leg of anelectrical component and / or an end section of a jumper wire.The inner opening may comprise an inner resilient surface. The inner opening maycomprise a conducting surface. The receptacle may comprise a conducting material. P5521PC00 specification 21 November 2024 The inner opening may comprise a resilient finger or a plurality of resilient fingers.The or each finger may be biased in an inward position and may be deflected(radially) outwardly by an outer periphery of a part of a component which may resultfrom the insertion of the part of the component within the inner opening. The resilientfingers may be biased inwardly by the engagement of the receptacle within arespective aperture. An inner surface of the aperture may deflect the or each resilient finger inwardly. The inner opening may comprise three resilient fingers or four resilient fingers.Preferably contact between the or each finger with a part of the component isarranged to provide an electrical contact for the component.An electrical component may be removably retained by a receptacle and / or betweena plurality of receptacles. Preferably an electrical component is mounted to thecircuit board device by more than one receptacle.Preferably the receptacle forms an electrical contact for an electrical component to form a part of the circuit. Preferably the electronic circuit module comprises a plurality of receptacles and wherein the receptacles are located within apertures to thereby provide a configuration of component connections to form a signal processing circuit with a specific signal processing function. The electronic circuit enables a component to be swapped within the signal processing circuit with a specific signal processing function in order to provide the same signal processing function but having different characteristics.Preferably the receptacles are placed in specific apertures to provide connectionsfor a first type of circuit. Preferably the layout of the receptacles defines the type ofcircuit which is created once the electrical components are secured therein. The circuit board may be for use with through hole components in which a part (for P5521PC00 specification 21 November 2024 example a leg) of an electrical component may be inserted into a receptacle to provide an electrical contact. The circuit board device may be for use with surface mounted electrical components. The circuit board device may comprise contact pads which are in communication with the circuit layout and more preferably with tracks or circuittraces of the circuit board device. The electronic circuit module unit may comprisea matrix of contact pads for communicating with an electrical component tocommunicate with / contact the circuit layout and preferably the tracks or circuit traces.The circuit board device may comprise securement means to removably secure anelectrical component with a respective contact pad or pads. The securement means may comprise a clip and preferably a resilient clip. The or each clip may urge a part of a surface mounted component on to a contact pad. An electrical component maybe secured to the circuit board device by one or more clips. Preferably an electricalcomponent is secured by two clips. Preferably each contact pad is associated witha respective clip. The clip may comprise a conducting material.The signal processing function of the first or second signal processing circuit mayinclude one of the following: operational amplifier, non-inverting buffer, invertingbuffer, non-inverting amplifier, inverting amplifier, differential amplifier, transimpedance amplifier and these functions may all be provided by an operational amplifier circuit board device. The electrical components may comprise one or more of the following: resistor,capacitor, diode, light emitting diode, transistor, relay, integrated circuit (e.g. semi-conductor device / chip), thermistor, transducer, loudspeaker, buzzer, bleeper, inductor, jumper wire, transformer, fuse, battery, motor, opto-electronic device, solenoid, crystal, microphone, sensor (e.g. micro-electromechanical systems(MEMS) sensor), antenna, switch etc.P5521PC00 specification 21 November 2024 The electronic circuit module may comprise a housing. The housing may comprise a casing. The casing may comprise a plastics material.The housing may comprise a peripheral wall which may extend around an outerperiphery of the circuit board device. The peripheral wall may comprise twolongitudinal (end) walls and two lateral (side) walls. The housing may comprise anopen upper face. The housing may comprise a closed lower face. The housing may comprise an open lower face.The open upper face may enable the circuit board device to be inserted and / orextracted from an engagement position within the housing. The printed circuit boarddevice may be engaged in the engagement position by a push fit and / or interferencefit.The housing may comprise engagement means to engage and retain the printedcircuit board device in the housing. The engagement means may comprise one ormore resilient clips. The or each resilient clip may be provided on one lateral (side)wall of the housing. The housing may define an opening for registering with each of the power inputconnector, the power output connector, the electronic signal input connector and theelectronic signal output connector. The opening may comprise a slot or recess extending inwardly from an upper edge of the peripheral wall. The opening maycomprise an aperture. Preferably two apertures are provided in one lateral (side)wall for two of the connectors (preferably both input connectors or both outputconnectors) and two slots / recesses may be provided in the other lateral (side) wall for the two other connectors (preferably both input connectors or both output connectors). Preferably to install / engage the printed circuit board device in the housing two connectors are located through respective apertures and the printed circuit board device is pivotally moved such that resilient clips are forced / deflectedoutwardly and the two other connectors move down with respective slots until theresilient clips engage and retain the printed circuit board device in the housing. P5521PC00 specification 21 November 2024One of the power input connectors and the power output connector may comprisea series of pins and the other may comprise a series of sockets and each pin mayengage with a respective socket to communicate / transfer power to and / or from theelectronic circuit module (specifically the printed circuit board device). The seriesof pins (and / or sockets) may be provided in a linear arrangement and preferablylocated side by side which may be arranged to be simultaneously engaged.Preferably the power input connector is arranged to engage with a power outputconnector of an adjacent electronic circuit module to form a power connection between two adjacent modules. The connection, and preferably the power inputconnector, may comprise two, three, four and preferably five pins. The pins mayextend laterally from the printed circuit board device and preferably extend laterally from the lateral sides of the housing. All of the pins may be parallel with each other.The power connection, and preferably the power output connector, may comprisetwo, three, four and preferably five sockets. The sockets may locate within anopening / slot defined on a lateral side of the housing. All of the sockets may be parallel with each other. One of the pins or sockets may extend upwardly from an upper face of the electroniccircuit board module and the other of the pins or sockets may extend downwardlyfrom a lower face of the electronic circuit board module. One of the pins or sockets may extend away from a first longitudinal end of the electronic circuit board module and the other of the pins or sockets may extend awayfrom a second longitudinal end of the electronic circuit board module.Preferably the power input connector is engageable with a power output connector using a push fit connection.One of the electronic signal input connector and the electronic signal outputconnector may comprise a series of pins and the other may comprise a series of sockets and each pin may engage with a respective socket to communicate / transfer P5521PC00 specification 21 November 2024a signal(s) to and / or from the electronic circuit module (specifically the printed circuitboard device). The series of pins (and / or sockets) may be provided in a linear arrangement and preferably located side by side which may be arranged to besimultaneously engaged. Preferably the electronic signal input connector isarranged to engage with an electronic signal output connector of an adjacentelectronic circuit module to form an electronic signal connection between twoadjacent modules. The electronic signal connection, and preferably the electronicsignal input connector, may comprise two pins and preferably comprises three pins.The pins may extend laterally from the printed circuit board device and preferably extend laterally from the lateral sides of the housing. All of the pins may be parallel with each other. The electronic signal connection, and preferably the electronicsignal output connector, may comprise two sockets and preferably comprises threefive sockets. The sockets may locate within an opening / slot defined on a lateral side of the housing. One of the pins or sockets may extend upwardly from an upper face of the electronic circuit board module and the other of the pins or sockets may extend downwardly from a lower face of the electronic circuit board module. One of the pins or sockets may extend away from a first longitudinal end of the electronic circuit board module and the other of the pins or sockets may extend away from a second longitudinal end of the electronic circuit board module. The pins of the power connection may be parallel to the pins of the electronic signal connection. The sockets of the power connection may be parallel to the sockets of the electronic signal connection.Preferably the electronic signal input connector is engageable with an electronicsignal output connector using a push fit connection.Preferably the connection of the power input connector and / or the electronic signalinput connector with a power output connector and / or an electronic signal outputP5521PC00 specification 21 November 2024connector of an adjacent module also engages and retains the electronic circuitmodule unit to the adjacent electronic circuit module unit and this may be retainedwithout any other engagement mechanism, such that the connectors may solelyengage and / or retain a first electronic circuit module unit to an adjacent electroniccircuit module unit.Preferably adjacent electronic circuit modules are positioned and engaged in a side by side (lateral) arrangement relative to each other. An assembly may be formedof a plurality of adjacent electronic circuit modules each of which engages with andis retained to at least one other adjacent module.Adjacent electronic circuit modules may be positioned and engaged in a top tobottom arrangement relative to each other with upper and lower faces of eachmodule facing each other. According to a second aspect of the present invention there is provided an assemblycomprising a first electronic circuit module unit and a second electronic circuitmodule unit wherein each electronic circuit module unit is in accordance with thefirst aspect of the present invention.Preferably the first electronic circuit module unit is engaged to the second electroniccircuit module unit. Preferably the first electronic circuit module supplies powerand / or an electronic signal to the second electronic circuit module unit.The assembly may comprise a three or more electronic circuit module units.According to a third aspect of the present invention there is provide a method ofchanging an electronic circuit provided by an electronic circuit module unit, theelectronic circuit module unit comprising:a circuit board device, the circuit board device comprising: a printed circuit board including a circuit layout, P5521PC00 specification 21 November 2024 a plurality of electrical contacts arranged within the circuit layout to enable electronic components to be releasably connected by solderless contacts within the circuit layout; a power input connector; a power output connector; an electronic signal input connector; an electronic signal output connector; wherein the plurality of electrical contacts provides: a first configuration of component connections to form a first type of signal processing circuit with a first signal processing function, and a second configuration of component connections to form a second type of signal processing circuit with a second signal processing function, and the method comprising: connecting a first set of electrical components in the first configuration to formthe first type of signal processing circuit with the first signal processing functionhaving primary characteristics, andreplacing at least one electrical component of a first type having a first valuefor another electrical component of the first type having a second value to change the primary characteristics whilst maintaining the first type of signal processing circuit with the first signal processing function.The method may comprise replacing the components from the first configurationwith the components for the second configuration in order to change the first signalprocessing function to the second signal processing function. According to a fourth aspect of the present invention there is provided a kit comprising a first electronic circuit module unit and a second electronic circuit module unit wherein each electronic circuit module unit is in accordance with the first aspect of the present invention, the kit further comprising a plurality of electrical components. The electrical components may comprise one or more of the following: resistor, P5521PC00 specification 21 November 2024 capacitor, diode, light emitting diode, transistor, relay, integrated circuit (e.g. semi- conductor device / chip), thermistor, transducer, loudspeaker, buzzer, bleeper, inductor, jumper wire, transformer, fuse, battery, motor, opto-electronic device, solenoid, crystal, microphone, sensor (e.g. micro-electromechanical systems (MEMS) sensor), antenna, switch etc. The kit may comprise a plurality of the same type of electrical component having different values / characteristics / parameters. BRIEF DESCRIPTION OF THE DRAWINGS The present invention will now be described by way of example only with reference to the drawing that follows, in which:Figure 1 is an upper perspective view of an electronic circuit board module inaccordance with the present invention.Figure 2 is a cross sectional representation of a four-layer PCB structure.Figure 3 is a top view of a PCB populated with both active and passive electroniccomponents.Figure 4 is a top view of four interconnected unpopulated PCBs.Figure 5 is a top view of another embodiment of an unpopulated PCB.Figure 6 is a top view of a partially populated AC to DC convertor PCB.Figure 7 is a circuit diagram of a populated AC to DC convertor PCB.Figure 8 is a top view of a partially populated operational amplifier PCB. Figure 9 is a circuit diagram of an unpopulated operational amplifier PCB. P5521PC00 specification 21 November 2024 Figure 10 is a circuit diagram of an operational amplifier PCB populated with electronic components to provide a comparator functionality. Figure 11 is a circuit diagram of an operational amplifier PCB populated with electronic components to provide a differential amplifier functionality. Figure 12 is a circuit diagram of an operational amplifier PCB populated with electronic components to provide an inverting amplifier functionality.Figure 13 is a circuit diagram of an operational amplifier PCB populated withelectronic components to provide a non-inverting amplifier functionality.Figure 14 is a circuit diagram of an operational amplifier PCB populated withelectronic components to provide an inverting buffer functionality.Figure 15 is a circuit diagram of an operational amplifier PCB populated with electronic components to provide a non-inverting buffer functionality. Figure 16 is a circuit diagram of an operational amplifier PCB populated with electronic components to provide a transimpedance amplifier functionality.Figure 17 is a circuit diagram of an operational amplifier PCB populated withelectronic components to provide a voltage follower functionality.Figure 18 is a perspective view of an embodiment of a circuit board module case.DESCRIPTION OF THE PREFERRED EMBODIMENTSThe present invention relates to a breadboard system for prototyping both analogue and digital circuits, which may comprise central processing units (CPUs) and othersemiconductor devices. A breadboard system provides a means of constructing ananalogue or digital circuit, which does not require the soldering or destruction of P5521PC00 specification 21 November 2024 circuit tracks and are therefore reusable for developing multiple circuit designs. Thepresent invention provides an electronic prototyping system to construct one ormore complex electronic circuits, wherein each circuit board is designed and built toprovide a specific function that contributes to an overall system design.In the preferred embodiments, a component circuit board, which is designed toperform a specific function, which ensures optimal performance and efficiency for the constructed board and its required functionality. For example, an operationalamplifier (op amp) component circuit board, is configured for various operationalamplifier configurations, while an analogue to digital convertor (ADC) component circuit board is configured for various ADC configurations. Similarly, a frequency filter component board is configured to provide a signal filtering function, and an AC / DC conversion board is configured to provide an alternating current to direct current conversion function. The present invention is not limited to provide thesefunctionalities and may be embodied in other circuit designs that provide otherrequired functionalities. The present invention provides the ability to connect multiple component circuitboards in either series, parallel or a combination of both, thus creating aninterconnected electronic system to meet specific electronic applicationrequirements by connecting these boards together. A skilled person can assemblemultiple component circuit boards in a seamless and modular manner, which provides an easy customisation of the interconnected electronic system. For example, when designing a sophisticated electronic control system, an engineerwould connect multiple component circuit boards together, each of which have beenpre-configured, e.g. into a pre-determined functional configuration and therebyprocess (e.g. amplify) electronic signals. These signals may then be communicatedto an input of a filter board for subsequent noise reduction processing. The filteredsignals may then be subsequently communicated to an input AC / DC conversionboard, which may be followed by an analogue to digital converter (ADC) componentcircuit board to convert analogue signals into digital data for the required application.By connecting multiple component circuit boards together in series / parallel, a skilledP5521PC00 specification 21 November 2024person can design and create a sophisticated electronic control system whichprovides their system requirements, without the complexities of designing all the system components from scratch. Each component circuit board is configured witha predetermined circuit, which allows the skilled person to sequentially connectmultiple component circuit boards, which requires no specialist knowledge. The present invention provides an improved method of constructing a sophisticated electronic control system which provides a means for improved fault finding and diagnostics, system scalability and potential for future design upgrades. When a specific system component or function requires modification or improvement, thepreferred embodiments allow the skilled person to easily replace or upgrade therelevant component circuit board without having to alter or repair the wholeelectronic control system accordingly. Therefore, simplifying the maintenance andrepair issues, which can be isolated to individual component circuit boards and rectified without affecting or impacting other component circuit boards of the electronic control system. The present invention provides a versatile and efficient tool for rapid electronic prototyping and circuit design. Furthermore, the low noise design aspect of each component circuit board provides prototype circuits boards which have a similar level of performance and noise reduction to that of a production circuit board.The present invention provides an electronic circuit module unit 10 comprising ahousing 12 in the form of a case 12 and a circuit board device in the form of acomponent circuit board 14 which is contained and protected by the case 12. Thecircuit board device comprises a printed circuit board including a circuit layout anda plurality of electrical contacts arranged within the circuit layout to enable electronic components to be releasably connected by solderless contacts within the circuitlayout. The circuit board device also comprises a power input connector 24, a poweroutput connector 30, an electronic signal input connector 34 and an electronic signaloutput connector 38. In some boards / circuits the power may directly traverse theboard from the input connector to the output connector and such an arrangementP5521PC00 specification 21 November 2024 may be provided in a passive board. The power input / output may provide the ground connection and this may be connected to help screen against noise. Some boards may also incorporate or be connected to a battery power supply.The power input connector may include a +V rail and -V rail. In some embodimentsa battery source may be used directly on the circuit board or housing to avoid needing the introduction of any power passing through input or output connectorsto the circuit. The present invention may include a range of purely passive circuits,which do not need a +V rail connection to other modules. In addition, the presentinvention may provide an assembly with a unit with the power output connectoromitted, and this may prevent a linear connection of circuits but still usable in a staror other circuit topography. In the preferred embodiments and assemblies thepower connectors are provided and these also assist and create the engagementbetween adjacent units / modules.The plurality of electrical contacts provides a first configuration of componentconnections to form a first type of signal processing circuit with a first signalprocessing function (e.g. an operational amplifier), and a second configuration ofcomponent connections to form a second type of signal processing circuit with asecond signal processing function (e.g. non-inverting buffer). The connection of afirst set of electrical components (e.g. resistors, capacitors etc.) in the first configuration forms the first type of signal processing circuit with the first signal processing function (e.g. an operational amplifier) having primary characteristics(parameters / properties), for example the (voltage) gain and replacement of at leastone electrical component of a first type (e.g. a resistor etc.) having a first value (e.g. X ohms) for another electrical component of the first type (e.g. a resistor) having a second value (e.g. Y ohms) changes the primary characteristics whilst maintainingthe first type of signal processing circuit with the first signal processing function (e.g.an operational amplifier).Accordingly, the electronic circuit module provides a single track or trace of a circuiton a PCB and the user selects (a) which and where to place the components toP5521PC00 specification 21 November 2024provide a particular type of circuit (e.g. an operational amplifier), and also (b) thevalues of the components to enable the characteristics of the circuit to be varied andfine-tuned (e.g. by changing the sizes of the resistors etc.). The single track or traceenables several different types of circuit to be provided by the single board and theuser only needs one board to be able to build several different types of circuits. Theconfiguration of the components on the board which will connect into the circuit trackor trace defines the type of circuit provided by the electronic circuit module. Theability to fine tune the characteristics of the chosen circuit can be easily adjusted bythe user switching one or more of the components for the same component(s) withdifferent value(s). The connections of the electronic components are solderless toprovide the circuits and for the associated characteristics to easily changed andaltered. For example, the connections may be provided by apertures within thecircuit board into which a conducting receptacle (e.g. a cylindrical sleeve) can bepush fitted such that a leg or part of an electronic component can then be grippedwithin the conducting sleeve. The use of such conducting receptacles thereby alsohelps to shroud any unused connections provided within the circuit. Alternatively,the electronic components may comprise surface mounted components and theconnections may be provided by conducting pads and clips or other retainingdevices may be used to connect the components within the circuit by urging the surface mounted components on to the relevant conducting pads. The circuit board device comprises a multi-layered screened device or laminateddevice which minimises cross talk or electrical noise which may significantlyinterfere with the construction and testing of accurate and meticulous signal processing circuits whereby small levels of interference can significantly impact the ability to fine tune a signal processing system. The power connectors may comprise pins which are push fitted into respective retaining sleeves of an adjacent module, i.e. the power input pins (power input connector) of a first module engage and are gripped within sleeves (power output connector). Similarly, the signal connector may comprise pins / sleeves such that pins of a signal input connector are engaged and gripped within respective sleeves P5521PC00 specification 21 November 2024of a signal output connector of an adjacent module. The connectors thereby providea plug and socket arrangement for both the power and the signal. Accordingly, a chain of modules can be built up and constructed with the power and the signal passing consecutively through the modules and undergoing specific processing steps. The engagement of the pins in the sleeves / sockets may also serve to physically secure and retain adjacent modules together.As shown in Figure 1, the circuit board module 10 comprises a substantially flatrectangular case 12, which encloses a component circuit board 14. The side walls16 of the case 12 frames both a top aperture 18 and, in some embodiments, abottom aperture within the case 12. Each side wall 16 of the case 12 comprises agroove 20 arranged within the inner surface of each side wall 16. The side walls 16of the case 12 are arranged to provide a continuous groove 20 which extends aboutthe inner surfaces of the side walls 16 along a horizontal plane.The component circuit board 14, is formed from a rectangular shaped printed circuitboard (PCB). The width of the continuous groove 20 is sized to cooperate with thewidth of the component circuit board 14. The continuous groove 20 retains thecomponent circuit board 14 in a flat orientation within the case 12. The continuousgroove 20 is biased towards the top aperture 18 of the case 12. This has the effectof arranging the component circuit board 14 within the case 12, so that one side ofthe circuit board 14 is easily accessible via the top aperture 18.The component circuit board 14 comprises an array of sockets 22 provided byreceptacles which are electrically connected to multiple conductive elements withinthe PCB. The conductive elements are typically a conductive track or screen. Eachsocket 22 within a receptacle provides a push-fit solderless electrical connection,which cooperates with a leg of an electronic component and the electricalcomponents can be removably plugged into the circuit board via the receptacles.Therefore, the sockets 22 allows the easy and reversible solderless population ofthe component circuit board 14 via the top aperture 18. The receptacle may havethree or four fingers which are deflected inwardly as the receptacle is press fittedP5521PC00 specification 21 November 2024into an aperture 18 or opening provided by the component circuit board 14. In someembodiments, these fingers may comprise a gold covering or may comprise nickelfor better connectivity.The resilient fingers may be biased in an inward position (in an initial unconnectedneutral state but inserted within an aperture) and may be deflected and / or urged(radially) outwardly by an outer periphery of a part of a component (i.e. the end of aleg) due to the insertion of the part of the component within the inner opening. Theinner opening may comprise three resilient fingers or four resilient fingers each ofwhich may make contact and grip the part of the outer surface of the component.The resultant contact between each finger with a part of the component provides agood and reliable electrical contact for the component.In a preferred embodiment, the component circuit board 14 comprises a five-pinelectrical connector 24 which is arranged along a first long edge 26 of the circuitboard 14. The pins of the five-pin electrical connector 24 extend through a firstelongated aperture 28 within a first side wall 16 of the case 12. Each pin of the five-pin connector 24 comprises a ninety-degree angled leg which extends throughcomponent circuit 14 and is electrically connected to a conductive element (notshown) within the PCB.The component circuit board 14 comprises a five-socket connector 30 which isarranged along a second long edge 32 of the circuit board 14. The five-socket connector 30 is arranged so that is symmetrical to the five-pin connector 24. Thesockets of the five-socket connector 30 are arranged within a second elongatedaperture (not shown).The component circuit board 14 comprises a first three-pin electrical connector 34which is arranged along a first long edge 26 of the circuit board 14. The pins of thethree-pin connector 34 extend through a third elongate aperture 36 within the firstside wall 16 of the case 12. Each pin of the three-pin connector 34 comprises nninety degree angled leg which extends through the component circuit 14 and isP5521PC00 specification 21 November 2024 electrically connected to a conductive element (not shown) within the PCB.The component circuit board 14 comprises a three-socket connector 38 which isarranged along a second long edge 32 of the circuit board 14. The three-socketconnector 38 is arranged so that it is symmetrical to the three-pin connector 34. Thesockets of the three-socket connector 34 are arranged within a fourth elongatedaperture (not shown). Figure 2 shows a preferred embodiment of the invention, which is a multilayeredstructure 40 of the component circuit board 14 that comprises four conductive layersarranged in a stacked circuit board configuration.The multilayered structure 40 comprises a first top conductive layer 42, which has abottom surface that is arranged upon the top surface of a first prepeg layer 44. Themultilayered structure 40 also comprises a second conductive layer 46, which hasa top surface that is arranged upon the bottom surface of the first prepeg layer 44. The second conductive layer has a bottom surface that is arranged upon the top surface of the of a dielectric layer 48. The multilayered structure 40 also comprises a third conductive layer 50, which has a top surface that is arranged upon the bottom surface of the of the dielectric core 48. The third conductive layer has a bottom surface that is arranged upon the top surface of a second prepeg layer 52. The multilayered structure 40 also comprises a fourth bottom conductive layer 54, which has a top surface that is arranged upon the bottom surface of the second prepeg layer 52. All the layers within the multilayered structure 40 are arranged in a stack-up configuration, wherein each layer is bonded to an adjacent layer within the multilayered structure 40. The first and second prepeg layers 44, 52 are typically formed from insulating laminate composites of fibre sheets that are impregnated with a polymer resin. The first prepeg layer 44 provides an insulating layer between the first and second P5521PC00 specification 21 November 2024 conductive layers 42, 46. Therefore, the first prepreg layer 44 prevents an electrical connection from occurring between the first and second conductive layer 42, 26. The second prepeg layer 52 provides an insulation layer between the third and fourth conductive layers 50, 54. Therefore, the second prepeg layer 52 prevents an electrical connection from occurring between third and fourth conductive layers 50, 54.The dielectric layer 48 provides a central layer which is the core of the multilayeredstructure 40. The dielectric layer 48 provides an insulating layer that supports abonded printed circuit board (PCB) trace (not shown) for the required electroniccircuit design.The four conductive layers 42, 46, 50, 54 provide four ground planar members which provide return paths for signals and acting as a reference point for signal voltages. Therefore, the ground planar members provide the effect of shielding the internal PCB trace from any generated electrical noise and interference.Furthermore, the four conductive layers 42, 46, 50, 54 provide an overall improvedlow-impedance return path (also known as ground loops) for signals, along with providing a more stable ground reference for multiple components and signal pathways. When implementing a multiple trace design within the multilayered structure 40, aknown problem is that an electrical signal communicated within a first trace, can becoupled to second trace via electromagnetic induction (EMI) by a magnetic field thatlinks the first and second traces together. This form of electrical noise is called crosstalk. When any of the conductive layers 42, 46, 50, 54 are located close to either the first or second PCB trace, the return currents flow through the ground plane and directly shielding the trace. This confines most of the electromagnetic fields to the area near the shielded trace and consequently reduces the cross talk between the first and second traces. P5521PC00 specification 21 November 2024 The EMI effect between the traces can be further mitigated by employing routing techniques that isolate high speed signals and minimise parallel signal tracks. Therefore, the use of conductive layers 42, 46, 50, 54 within the multilayered structure 40 provides a dramatic reduction in known noise induced issues in PCB designs and thereby provides a substantial improvement in the overall signal quality within the multilayered structure 40. When designing a PCB which employs the multilayered structure 40, the screening of signal tracks requires meticulous attention to detail when setting out the required signal routing of the PCB. The design process for the PCB comprises separatingthe sensitive analogue signals and digital signals to prevent interference andcrosstalk between these signal types.Furthermore, high speed and differential tracks are carefully routed to avoid crossingsensitive analogue signal paths, thereby ensuring that each signal path operates optimally without negatively impacting other electrically connected components. This separation of the high-speed signals results in a circuit which is highly noise resistant, while ensuring a superior signal to noise ratio (SNR). The PCB trace (not shown) within the multilayered structure 40 provides a significant reduction in the number of required conductive tracks, when compared with a more conventional bread boarding method of construction, which employs the use of lengthy wires and conductive track, both of which radiate a substantial amountelectronic noise. The PCB trace can implement an electronic design with 95% fewerconductive tracks, which reduces complexity of the circuit layout, the streamlining of signal paths and the reducing the effects of signal degradation. The PCB trace provides a more optimised bread board design which is a more efficient and compact system, which enables increased functionality and reduced production costs etc. Multiple circuit board modules 10 can be strategically arranged to form a larger P5521PC00 specification 21 November 2024 complete electronic circuit which complies with a required schematic representation.Each circuit board module 10 is configured in accordance with pre-designed circuits.Electronic components can be easily plugged into predetermined positions upon each circuit board module 10 to provide the required electronic circuit. For example,an op amp circuit board module 10 that features pre-designed circuit blocks forvarious operational amplifier configurations, can be easily created by simplyplugging electronic components like resistors and capacitors into the appropriate functional blocks on the PCB within the circuit module. Engineers then have themeans to design complex op amp circuits, such as buffers, amplifiers, filters andcomparators without the need to build an entirely new circuit for each configuration.The use of multiple circuit boards 10, provides the effect of substantially reducing the design complexity, shortens the design cycle, and streamlines the overall circuitdevelopment process, thus making more complex circuit design engineering moreaccessible to engineers of all levels.The push fit component sockets 22 provides the effect of plugging the electroniccomponents into the component circuit board 14, this allows the engineers to focus more on the conceptual aspects of the required electronic design, while exploring various configurations and experimenting with circuit behaviour, rather than spending excessive time on the physical construction of the circuit.The component circuit board 14 comprises an electronic circuit representation,which provides a schematic layout of the required components for the representedcircuit. This layout provides the effect of enabling an engineer to easily swap out the electronic components or rearrange the circuit board module 10 within a largercircuit design and to experiment with different circuit variations. This designflexibility encourages a more iterative design process, which enables a skilledperson to fine tune their circuits in a more rapid and efficient manner.The circuit board module 10 can accommodate multiple circuit configurations, which can be reused across various design projects and applications. This reusableaspect of the circuit board module 10 obviates the need for repeated circuit designsP5521PC00 specification 21 November 2024 and provides a more sustainable and cost-effective development process. The use of multiple circuit board modules 10 allows the design of complex electronic circuits by providing pre-designed circuits within each circuit board module 10 and eliminating the need for extensive wiring, whilst engineers benefit from enhanced speed, simplicity and flexibility provided by multiple board modules 10 throughout the design process. Figure 3 shows a top view of a populated component circuit board 14, which ispopulated with an operational amplifier device 60 and three electrical resistordevices 62. The component circuit board 14 further comprises a schematic layout64 which identifies the electronic components required for the component circuit board 14.Figure 4 shows a top view of four unpopulated component circuit boards 14, whichare interconnected to form an overall larger electronic circuit. Once the populated circuit boards 14 have been populated by the required components, the five-pinelectrical connector 24 arranged on each component circuit board 14 will cooperatewith a five-socket connector 70 arranged on a neighbouring component circuit board14. The five-pin connector 24 allows the communication of electrical power from afirst component circuit board 14, to a neighbouring second component circuit board 14. The five-pin connector comprises at least a 1.8 VDC electrical supply pin which is associated to a 0VDC pin arranged within the same connector. The other neighbouring pins communicate other electrical supplies for the component circuit board. The electrical power may also be communicated between two neighbouring component boards via an electrical connector which comprises more (or less than) than five connecting pins. Additional connecting pins may be provided tocommunicate additional power supply voltages and / or power supply currents.The three-pin electrical connector 28 arranged on each component circuit board 14 P5521PC00 specification 21 November 2024cooperates with a three-socket connector 72 arranged on a neighbouring circuitboard 14. The three-pin connector 28 allows the communication of electronicsignals from a first component circuit board 14, to a second component circuit board14. The three-pin connector comprises a central ground pin, a neighbouring positive communication pin and a negative communication pin. The three pin connector can be used to establish a serial of differential communication means for the component circuit board. The electrical signals may also be communicated between two neighbouringcomponent boards via an electrical connector which comprises more than (or lessthan) three connecting pins. Additional connecting pins may be provided tocommunicate additional signal voltages.The present invention provides a new approach in electronic circuit design, wherepassive and active electronic boards can be placed anywhere within the overallelectronic system, thereby providing added functionalities, and enhancing overall system performance. This design flexibility allows engineers to create highly versatile systems which can be configured to wide range of electronic applications. Figure 5 shows a top view of an unpopulated passive component circuit board 80.The integration of passive component printed circuit boards (PCB) within thecomponent circuit board architecture, offer a number of opportunities for providingsignal conditioning and power regulation, along with other passive electronic functions, such as signal decoupling, signal biasing, signal demodulation, diodeclamping, and passive filters for example high pass, low pass, twin T notch etc.In use, the passive board (PCB) are located at strategic locations within the system to ensure optimal performance and tailored functionality. Engineers can easily customize their electronic systems by incorporating specific passive and signal circuit boards, which achieve superior signal integrity, noise reduction and performance optimization. P5521PC00 specification 21 November 2024The integration printed circuit boards within the overall electronic design provides asubstantial improvement over other known breadboard systems. The present invention allows engineers to build efficient and reliable electronic design solutions which can be applied to applications across many industries. In an alternative embodiment of the invention, a kit of parts is provided for building a circuit board module. The kit comprises at least a case and a PCB, both of whichare subsequently assembled to form a circuit board module. Once assembled, thePCB is subsequently populated with passive and / or electronic components toprovide the required circuit functionality.For educational institutions, the component circuit board module is an extremelyuseful tool for teaching electronics, which provides practical learning experiences, such as classroom demonstrations, laboratory exercises, project-based learning and research projects. For electronic design companies, the component circuit board module is beneficial throughout the product development lifecycle, which expedites the design process while ensuring a robust product development, such as rapid prototyping, testing and validation, troubleshooting and debugging and iterative design.For electronic enthusiasts and hobbyists, the component circuit module providesmany opportunities for being creative, such as personal project, learning and skill development. The present invention provides a product that redefines the way circuits are built and designed. It represents a new generation of breadboards, introducing an innovative concept that brings ease of use and versatility to hobbyists, beginners, and professional electronic engineers alike.At its core, the present invention provides a PCB trace, which comprises a layout ofconductive tracks which provides multiple circuit design within the trace itself, for P5521PC00 specification 21 November 2024example a circuit board module comprising a component circuit board for an op ampapplication comprises an internal trace with multiple configurations for circuit design. Each circuit design within the trace is set out by the conductive elements within the trace and their subsequent connection to the array of electrical contacts arranged upon the circuit board. In a preferred embodiment of the invention the electricalcontacts are in the form of electrical via contacts. Each contact comprises anaperture with a conductive wall that extends through the component circuit board.The conductive wall facilities the communication of electrical power and signals from the via electrical contact to the conductive elements of the PCB trace. The electrical contacts may also be in the form of a conductive pad that comprises a core element that extends through the component board. Each circuit design within the PCB trace is selectable by the placing conductivereceptacles within the contact apertures required for a selected design. Eachreceptacle cooperates with a leg extending from an electronic component thatcontributes to the function of the required circuit design. In the preferredembodiment, the receptacle is in the form of a socket that is retained within thecontact aperture via either a push fitting attachment means or a locking nut. Thereceptacles may also be in the form of conductive hooks or clips that retain surfacemounted electronic components arranged upon the circuit board. The schematic layout arranged upon the circuit board indicates the locations of the electronic components required for the selected circuit design. Each aperture indicated for a specific circuit design is then populated with a socket receptacle. The installed receptacles are then populated with the required electronic components at the indicated locations upon the circuit. The installed electronic components will then provide the required functionality for the selected design. The fine tuning ofthe required functionality is accomplished by replacing one or more electroniccomponents, for example the same component with different capabilities such as different sized resistors, capacitors etc. The solderless removal and replacement of the installed electronic components is easily achieved through the use of the socket receptacles arranged upon the circuit board. Such removal and replacement P5521PC00 specification 21 November 2024abilities enable a circuit to be fine tuned easily.Therefore at its core, the present invention provides a new type of breadboard thatallows users to effortlessly plug in components to create circuits without the need for soldering. This design approach eliminates the complexities and limitations associated with traditional breadboards, making it accessible to a wide range of users.One of the key features that sets the present invention apart is its revolutionaryapproach to circuit design. Unlike conventional breadboards, the present invention comes with circuits, which are selected by the placement of electronic components, thereby providing users with a seamless experience. By allowing users to plug together sequential modules, they can easily build complete systems with minimal effort and no or little specialized knowledge.Prior art breadboard designs have remained largely unchanged until thedevelopment of the present invention. With its enhanced features and ultra-lownoise performance, the present invention opens-up new possibilities forexperimentation and innovation. The advantages of the present invention are twofold. Firstly, for hobbyists and beginners, it provides an intuitive and user-friendly platform to explore electronics, encouraging creativity and learning in an enjoyable manner. Secondly, for professional electronic engineers, the present invention offers a powerful and efficient tool for rapid prototyping and circuit design, enabling them to test and implement ideas with ease. Additionally, the low noise design of the presentinvention ensures circuits can be prototyped with a similar level of performance tothat of a production circuit board. Therefore, the present invention has the effect of providing a game-changing innovation in circuit building technology. With its plug-and-play approach, circuits have never been easier to create. P5521PC00 specification 21 November 2024The present invention addresses several issues related to breadboard usage inelectronic prototyping including breadboard noise, time-consuming circuit building and changes, and the lack of interconnection between multiple breadboards.The present invention provides a solution that mitigates breadboard noise,streamlines the circuit-building process, and enables easy interconnection between multiple breadboards. By addressing these challenges, the present inventionprovides the effect of enhancing the overall user experience during electronicprototyping, making it more efficient, accurate, and user-friendly.The preferred embodiment of the invention as the effect of providing an excellentsignal to noise ratio. The preferred embodiment boasts exceptional signal integrity, thanks to its multilayer screened PCB design which reduces electromagnetic interference and crosstalk. This improves signal quality and reduces noise compared to traditional breadboards, meaning prototype circuits can have similar performance to a production-level circuit board.The preferred embodiment of the invention provides a plug-in method of populatingelectronic components, which therefore obviates the requirement of any solderedjoints. With the preferred embodiment, users simply plug electronic components directly into the board's receptacles, making the prototyping process faster, cleaner, and more user-friendly. The present invention also provides a reliable and good connection between the component within the circuit. For example, existing breadboard connections typically have two flat plates that are pressed against round component pins. This surface area is relatively small, and the connection can be unreliable, especially forhigh-frequency or high-current circuits. In the present invention, the receptaclescomprise a number of resilient fingers (e.g. four fingers) to grip the component pin.This provides much more surface area for contact, resulting in a more reliable connection. In addition, conventional breadboards are often permanently sealed, P5521PC00 specification 21 November 2024 making it challenging to rectify any connection issues caused by oversizedcomponents. In contrast, the present invention offers the flexibility to remove theboard from its housing and effortlessly replace damaged receptacles by eitherpushing out the old one or resoldering a new one in its place.The preferred embodiment of the invention provides a pre-designed circuit with anassociated library of pre-designed circuits for various applications. Users no longerneed to manually design circuits; instead, they choose the required component board and then select relevant components and plug them into the component board. The placement of components on the board itself determines the circuit connections, eliminating the need for manual wiring.The preferred embodiment of the invention multiple power connections on PCB’s:To accommodate various power supply requirements, The preferred embodiment features multiple power connections distributed across the product, facilitating a range of circuit configurations. The preferred embodiment of the invention provides the effect of improving the interconnectivity between components of the present invention. Users can connect multiple components of the present invention together seamlessly. This feature allows for the creation of complex systems and larger circuits that span acrossmultiple boards. Each component of the present invention can have its own set ofcircuits or functions, and when connected, they form a complete system.The preferred embodiment of the invention provides the effect of obviating therequirement for lengthy surface wires. The innovative design of the presentinvention eliminates the need for long surface wires typically used in traditionalbreadboards. Therefore, only enhances the neatness of the prototype but alsoreduces interference and signal degradation (transmission) due to excessive wire lengths.The preferred embodiment of the invention provides the effect of reducing radiatingP5521PC00 specification 21 November 2024 track metal. When compared to traditional breadboards, the preferred embodiment minimizes the amount of radiating track metal, which can contribute to unwantedelectromagnetic interference. Therefore, the presentation invention provides theeffect of cleaner signal paths and improved performance, especially at higherfrequencies.The preferred embodiment of the invention comprises a schematic identification,which provides the effect of enabling users to quickly identify each component's role in the circuit. Plugging in the components automatically establishes the circuit connections based on their locations on the board.The present embodiment of the invention provides multiple circuits layoutstherefore, providing the effect of allowing users to experiment with different configurations without the need for additional boards. The present invention may be used in educational institutions for the followingexample applications. Classroom demonstrations, instructors can use the productduring lectures to demonstrate various electronic circuits, components, and principles, making abstract theories more tangible and understandable for students. Laboratory exercises, students can use the product in electronics labs to build and test circuits, gaining practical skills and troubleshooting abilities. The ease with which circuits can be constructed means that more insights can be gained with eachlaboratory session, improving learning outcomes. Project-based learning, thepresent invention can be incorporated into semester-long projects, where studentswork in teams to design, prototype, and implement innovative electronic devices,fostering creativity and teamwork. Research projects, advanced students andresearchers can utilize the product for conducting experiments and exploring new areas in electronics, providing a platform for cutting-edge discoveries. The present invention may be used in by electronic design companies for thefollowing applications. Rapid prototyping, engineers and designers can quickly buildand test prototypes of new electronic products using the present invention, reducing P5521PC00 specification 21 November 2024time-to-market and overall development costs because the manufacture of bespokePCBs is not required which would incur costs and time delays. Testing andvalidation, the present invention facilitates thorough testing and validation of electronic components and circuits, ensuring the final product meets quality andsafety standards. Troubleshooting and debugging, during the design phase, thepresent invention aids in identifying and resolving issues, improving the efficiencyof the debugging process. Iterative design, as new ideas emerge, the presentinvention facilitates iterative design, enabling engineers to experiment and refine product features. The present invention may be used by enthusiasts and hobbyists for the followingapplications. Personal projects, hobbyists can use the present invention to work onpersonal electronics projects, such as building custom audio systems, homeautomation devices, or robotics projects. Learning and skill development, amateurscan enhance their electronics knowledge and skills by experimenting with various components and circuits, fostering a deeper understanding of electronics.The present invention empowers hobbyists to create their gadgets and savingmoney and gaining a sense of accomplishment. Joining maker communities, Withthe skills acquired using the present invention, hobbyists can participate in maker communities, sharing their creations and collaborating with like-minded individuals. Overall, the present invention provides a versatile and valuable resource across diverse scenarios, supporting education, innovation, and skill development in the fields of electronics and technology. The present invention differs from known electronic prototyping apparatus in at leastthe following distinct ways. Power distribution, unlike many competitors, the presentinvention offers efficient power distribution capabilities. It ensures stable and reliablepower delivery to all circuit blocks and components, reducing the risk of power- related issues that can affect performance and accuracy and lead to extendeddebugging time. Versatile analogue and digital conversion, the present inventionexcels in both analogue-to-digital and digital-to-analogue conversion processes. It P5521PC00 specification 21 November 2024 provides high precision and fidelity in converting signals between these domains, making it ideal for a wide range of applications requiring seamless data conversion.Comprehensive set of ready-made circuits and schematics, the present invention isvaluable for users who want to save time and effort in designing circuits andimmediately implement proven solutions for their projects. Robust and accessibledesign for all skill levels, the present invention is carefully designed to cater to usersof all skill levels. From professionals to students and hobbyists, everyone can benefit from its user-friendly interface and functionalities. Beginners can quickly get started with plug-and-play simplicity, while advanced users can leverage its full potential.Efficient power management with multiple ground planes, the present inventionincorporates multiple ground planes to optimize power management and reduce noise. This design element sets it apart from competitors that may lack suchattention to detail, providing enhanced performance and signal integrity. Compactsize with multiple circuit blocks, the small size of the present invention does notcompromise its functionality. It boasts multiple circuit blocks that allow users to perform various tasks and experiments without the need for external components,making it a space-efficient and versatile choice. Low noise for precisemeasurements, the low noise performance of the present invention ensuresaccurate and reliable measurements in sensitive applications. This advantage distinguishes it from some competitors that may suffer from signal distortions andinterference. Ease of use with plug-and-play functionality, the present invention’splug-and-play design simplifies the setup process, making it incredibly easy to get started with minimal hassle. This aspect makes it more accessible and appealing to users who value convenience and efficiency.In conclusion, the present invention’s unique combination of efficient powerdistribution, versatile analogue and digital conversion, ready-made circuits,accessible design for all skill levels, multiple ground planes, compact size with various circuit blocks, low noise operation, and plug-and-play functionality sets it apart from competitors. Whether you're a professional, student, or hobbyist, our product offers the tools and features needed to excel in a wide range of electronic projects and experiments. P5521PC00 specification 21 November 2024 The preferred embodiment of the invention provides a revolutionary approach by incorporating multiple ground planes across all four layers of the component board. These ground planes serve as effective shields, minimizing crosstalk between traces, and providing a stable ground reference for various components and signal pathways. The result is a dramatic reduction in noise-induced issues and a notable enhancement in the overall signal quality. Therefore, the preferred embodiment of the invention provides the effect of optimizing the signal-to-noise ratio in circuit design, which encompasses several innovative techniques that revolutionize the way electronic circuits are engineered. By significantly reducing metal tracks, minimizing radiated signals, incorporatingmultiple ground planes, meticulously screening all signal tracks and improvedelectronic component connectivity due to the cooperating receptacles this approachpaves the way for reliable, high-performance electronic devices. As technology continues to advance, this inventive step represents a significant milestone in creating more efficient, compact, and noise-resistant circuits that meet the demanding requirements of modern electronics.Traditional circuit design techniques often require meticulous wiring and connectingvarious components, which can be time-consuming and prone to human errors. Furthermore, errors in circuit design may also destroy the connected electronic components. However, engineers using the present invention can bypass the need for tedious wiring, as the connections are already integrated into the board layout. By plugging components into the corresponding blocks, engineers can achieve the desired circuit configuration effortlessly. Therefore, the effect of using multiple modules in series offers a highly efficient and flexible approach to circuit design. By capitalizing on the individual strengths of specialized boards and their seamless interconnectivity, engineers can build intricate electronic systems tailored to their specific needs. This innovative methodology empowers engineers to create complex circuits with ease while P5521PC00 specification 21 November 2024 providing the versatility to adapt and evolve their designs for various applications and future advancements in electronics. The preferred embodiment of the invention provides the integration of passive circuit boards, which comprise the following functionalities. Passive Boards, the integration of passive boards within the present invention’s architecture offers a wealth of possibilities for signal conditioning and power regulation. Some key passive boards and their functionalities include: Decoupling, decoupling is essential in reducing noise and interference between different components of the circuit. By strategically placing decoupling capacitors near sensitive components, they stabilize power supply lines and suppress voltage fluctuations, ensuring smooth and reliable operation. Biasing, biasing is critical for setting the DC level of components and signal paths. Biasing circuit provides a stable DC reference, optimizing the performance of active devices like transistors and amplifiers, and preventing signal distortion. Demodulator, in communication systems, demodulators are used to recover the original baseband signal from modulated signals. This circuit extracts information from amplitude-modulated (AM) or frequency-modulated (FM) signals, enabling accurate data retrieval. Diode clamping, to protect sensitive components from voltage spikes or excessive signal swings, diode clamping circuits are employed. This circuit limits the signal amplitude using diodes, ensuring safe operation and preserving the integrity of the system. Passive filters, signal filtering is essential to remove unwanted frequencies or noise, ensuring that the system operates with only the desired frequencies. Filters are used in audio systems, communication devices, and various other applications where P5521PC00 specification 21 November 2024 signal clarity is crucial.The present invention allows these passive boards to be placed at strategiclocations within the system, ensuring optimal performance and tailored functionality. Engineers can easily customize their electronic systems by incorporating specific passive and signal boards, achieving superior signal integrity, noise reduction, and performance optimization. Overall, the present invention’s integration of passive or signal boards represents a significant leap in circuit design, offering a versatile and highly adaptable platformfor creating sophisticated electronic systems. This effect empowers engineers tobuild efficient and reliable electronic solutions that cater to diverse applications across industries, from consumer electronics to industrial automation and beyond. The present invention also provides the feature of automatically distributing power when the boards are plugged together. This unique design enables a seamless and efficient power management system for the entire setup. When the component boards are connected, the power is distributed automatically, streamlining the process of powering each board without the need for complex external wiring. Moreover, each individual board has a plug-in decoupling capability, which further enhances the system's performance and stability. Decoupling capacitors are integrated into the board's design, strategically placed near sensitive components to suppress noise and voltage fluctuations. This ensures smooth and reliable operation, as well as enhanced signal integrity throughout the system. The combination of automatic power distribution and plug-in decoupling offers engineers an innovative and user-friendly approach to building electronic systems. It simplifies the design process, reduces potential sources of error, and minimizes the time required for circuit assembly and testing. By integrating these inventive features into the component board design, engineers P5521PC00 specification 21 November 2024 can focus more on the functionality and performance of their circuits, rather than getting bogged down by the complexities of power management and signal conditioning. Ultimately, this inventive step empowers engineers to create robust and efficient electronic systems that meet the demanding requirements of modern technology.Figure 6 shows a top view of an AC / DC convertor PCB 80 comprising an array ofapertures 82, wherein each aperture is populated with may be electronic componentreceptacle 84. The AC / DC PCB 80 further comprises an operational amplifier semiconductor device 86 which cooperates with an array of receptacles 82. TheAC / DC PCB 80 further comprises a five-pin connector 88 and a three-pin connector90. Figure 7 is a circuit diagram of the AC / DC PCB 80, which is populated with the required electronic components to provide the required AC / DC functionality. TheAC / DC functionality is provided by populating the AC / DC PCB 80 with a plurality ofresistors 92, which cooperates with an array of receptacles located at uniquelyreferenced locations upon the AC / DC PCB 80. Each resistor 92 provides a predetermined resistance value which is required for the uniquely referenced location.The AC / DC PCB 80 is also populated with a plurality of capacitors 94, whichcooperates with an array of receptacles located at uniquely referenced locations upon AC / DC 80. Each capacitor 94 provides a predetermined capacitance value which is required for the uniquely referenced location.The AC / DC PCB 80 is also populated with a plurality of link components 96 (e.g.jumper leads / wires), which cooperates with an array of receptacles located at uniquely referenced locations upon AC / DC 80. Each link component 96 provides a predetermined interconnection which is required for the uniquely referenced location. P5521PC00 specification 21 November 2024The AC / DC PCB 80 is also populated with a plurality of diodes 98, which cooperateswith an array of receptacles located at uniquely referenced locations upon AC / DC80. Each diode 98 provides an electrical current flow in a predetermined directionwhich is required for the uniquely referenced location.The overall functionality of AC / DC 80 can be fine-tuned by replacing the electroniccomponents (resistors, capacitors et.) within the AC / DC circuit accordingly. Figure 8 shows a top view of an operational amplifier (op amp) PCB 100 comprisingan array of apertures 102, wherein each aperture may be populated with anelectronic component receptacle 104. The op amp PCB 100 further comprises an operational amplifier semiconductor device 106 which cooperates with an array of receptacles 102. The op amp PCB 100 further comprises a five-pin connector 108for the power supply and a three-pin connector 110 for the signal supply.Figure 9 is a circuit diagram of the op amp PCB 100, which when populated with the required electronic components, the circuit can provide multiple functionalities. Therequired functionality is selected by populating the op amp PCB 80 with the requiredelectronic components, into the receptacles which are located at uniquelyreferenced locations upon the op amp PCB 80. The installed electroniccomponents will subsequently provide a predetermined function. Thus, the requiredfunction of the op amp PCB 100 is selected by installing electronic components inthe receptacles at predetermined locations within the circuit of op amp PCB 100.Figure 10 is a circuit diagram of the op amp PCB 100, which is populated withelectronic components to provide the required comparator functionality. An engineer can fine tune the required comparator functionality by replacing one or more electronic components. The comparator functionality is provided by populating theop amp PCB 100 with a plurality of resistors 110, which cooperates with an array ofreceptacles located at uniquely referenced locations upon the op amp PCB 100.Each resistor 110 provides a predetermined resistance value which is required for the uniquely referenced location. P5521PC00 specification 21 November 2024The op amp PCB 100 is also populated with a plurality of capacitors 112, whichcooperates with an array of receptacles located at uniquely referenced locationsupon op amp PCB 100. Each capacitor 112 provides a predetermined capacitancevalue which is required for the uniquely referenced location.The op amp PCB 100 is also populated with a plurality of link components 114 (e.g.jumper leads), which cooperates with an array of receptacles located at uniquelyreferenced locations upon op amp PCB 100. Each link component 114 provides apredetermined interconnection which is required for the uniquely referenced location.The overall functionality of op amp 100 can be fine-tuned by replacing / swappingone or more of the electronic components within the op amp circuit with a same typeof component of a different value.Figure 11 is a circuit diagram of the op amp PCB 100, which is populated withelectronic components to provide the required differential amplifier functionality. An engineer can fine tune the required differential amplifier functionality by replacing one or more electronic components. The differential amplifier functionality isprovided by populating the op amp PCB 100 with a plurality of resistors 110,capacitors 112 and link components 114 at uniquely referenced locations upon theop amp PCB 100.Figure 12 is a circuit diagram of the op amp PCB 100, which is populated withelectronic components to provide the required inverting amplifier functionality. An engineer can fine tune the required inverting amplifier functionality by replacing one or more electronic components. The inverting amplifier functionality is provided bypopulating the op amp PCB 100 with a plurality of resistors 110, capacitors 112 andlink components 114 at uniquely referenced locations upon the op amp PCB 100.Figure 13 is a circuit diagram of the op amp PCB 100, which is populated withP5521PC00 specification 21 November 2024 electronic components to provide the required non-inverting amplifier functionality. An engineer can fine tune the required non-inverting amplifier functionality by replacing one or more electronic components. The non-inverting amplifier functionality is provided by populating the op amp PCB 100 with a plurality ofresistors 110, capacitors 112 and link components 114 at uniquely referencedlocations upon the op amp PCB 100.Figure 14 is a circuit diagram of the op amp PCB 100, which is populated withelectronic components to provide the required inverting buffer functionality. Anengineer can fine tune the required inverting amplifier functionality by replacing oneor more electronic components. The inverting buffer functionality is provided bypopulating the op amp PCB 100 with a plurality of resistors 110, capacitors 112 andlink components 114 at uniquely referenced locations upon the op amp PCB 100.Figure 15 is a circuit diagram of the op amp PCB 100, which is populated withelectronic components to provide the required non-inverting buffer functionality. An engineer can fine tune the required non-inverting buffer functionality by replacing one or more electronic components. The non-inverting buffer functionality isprovided by populating the op amp PCB 100 with a plurality of capacitors 112 andlink components 114 at uniquely referenced locations upon the op amp PCB 100.Figure 16 is a circuit diagram of the op amp PCB 100, which is populated withelectronic components to provide the required transimpedance amplifierfunctionality. An engineer can fine tune the required transimpedance amplifierfunctionality by replacing one or more electronic components. The transimpedanceamplifier functionality is provided by populating the op amp PCB 100 with a pluralityof resistors 110, capacitors 112 and link components 114 at uniquely referencedlocations upon the op amp PCB 100.Figure 17 is a circuit diagram of the op amp PCB 100, which is populated withelectronic components to provide the required voltage follower functionality. Anengineer can fine tune the required voltage follower functionality by replacing oneP5521PC00 specification 21 November 2024or more electronic components. The voltage follower functionality is provided bypopulating the op amp PCB 100 with a plurality of resistors 110, capacitors 112 andlink components 114 at uniquely referenced locations upon the op amp PCB 100.Figure 18 shows a perspective view of the circuit board module case 132 or housing,in accordance with the present invention in which a component circuit board (notshown) which is releasably attachable to the rectangular case 132. The rectangularcase 132 comprises a large opening 134 within the top surface of the case 132. Therectangular case 132 comprises a first 138 and second opening 140 within a firstside wall 142 of the case 132. The rectangular case 132 further comprises a first144 and second recess 146 within a second side wall 148 of the case 132. Therectangular case 132 comprises releasable attachment means 150 which isarranged on the second side wall 148 of the case 132. The releasable attachmentmeans 150 is in the form of a flexible or resilient clip or clips, which is integral to thesecond side wall 148 of the case 132. The clip 150 comprises a lip 152 whichcooperates with a side of the component circuit board.The component circuit board is housed within the rectangular case 132 by insertingboth the five socket and three connectors of the circuit component board into thefirst 138 and second 140 openings of the first side wall 142 of the case 132. In thepreferred embodiment, the power output connector (5 pin) and the electronic signal output connector (3 pin) locate and project through and outwardly from the respective openings 138, 140. The circuit component board is then lowered andpivoted into the opening 134 within the top surface of the case 132 until the clips152 arranged on the second side 148 of the case 132 engage with a side edge ofthe component circuit board. Once engaged, the flexible clips 150 retain thecomponent circuit board horizontally flat within the case. The case houses the interchangeable component circuit boards, where each component circuit board provides multiple circuit design configuration for a predetermined function. When a change of functionality is required, the relevant component circuit board that comprises the circuit designs associated to the P5521PC00 specification 21 November 2024 required function is installed within the case. As previously descried, a more complex system can be constructed by connecting several electronic circuit modules together. In particular, the power output connector from a first module is connected to a power input connector of a second adjacent module. Similarly, the signal output connector of the first module is connected to the signal input of the second module. A number of modules can be linked together to provide more complex circuits. The overall system thereby provides a modular system whereby the types of circuits can be changed and the characteristics of the circuits can also be easily changed without changing anything else in the overall system. The connection of the output connectors to the respective input connectors also physically secures the adjacent modules together. For example, the pins of an input connector may be press fitted into a cylindrical gripping sleeve of an output connector and such gripping forces accumulated by the number of parallel pins / sleeves provides sufficient attachment force for adjacent modules. In some embodiments further supplemental securement physical connectors may be provided. The boards may include the following: op amp functions, Sallen Key filter functions, instrument amplifier, passive circuits, transistor circuits, AC / DC convertor, analogue to digital convertor, power supply, digital potentiometer, prototype board, digital toanalogue convertor and / or waveform generator etc.As examples, the op amp board may have the ability to provide the following circuits: non-inverting buffer, inverting buffer, non-inverting amplifier, inverting amplifier,differential amplifier, transimpedance amplifier, voltage follower and / or comparatorwith hysteresis etc. The Sallen Key filter function may provide the following: highpass filter, 3rd order filter – high pass, high pass filter with gain, low pass filter, 3rdorder filter – low pass and / or low pass filter with gain etc. The instrument amplifiermay provide the following: basic amplifier, Wheatstone bridge amplifier, P5521PC00 specification 21 November 2024thermocouple amplifier, capacitively coupled amplifier and / or single input amplifieretc. The passive circuits may provide the following: mid rail bias, variable bias,demodulation, diode clamp, low pass filter, high pass filter and / or twin T notch filteretc. The transistor circuit may provide a common – emitter amplifier. The AC / DCconvertor may provide a full wave including low pass filter. The analogue to digital convertor may provide the following: single input, differential input, Wheatstonebridge, thermocouple and / or capacitive coupling etc. The digital potentiometer mayprovide the following: attenuator and / or amplifier etc.Accordingly, from the above, it can be seen that a relatively small number of different electronic circuit module units may be provided which can be used to provide numerous different types of circuits all of which can be easily manipulated and fine- tuned for individual situations and also tested and then easily reconfigured in order to produce a final complex circuit with the required signal processing properties. The present invention may be used by chip (semi-conductor devices / integrated circuits, e.g. computer processors) manufacturers. Chip manufacturers constantly strive to bring cutting-edge solutions to the market. However, the process of evaluating and showcasing new chips can be time-consuming and resource-intensive. The present invention provides chip manufacturers with a comprehensiveplatform to create, customize, and distribute evaluation boards, enabling them to accelerate product development, expand market reach, and foster a loyal customer base. Advantages of the present invention include: ^Insource Evaluation Board Production: Chip manufacturers can insource theproduction of evaluation boards, eliminating the need for external partnerships and regaining control over the quality and timing of their product introductions. This empowers them to respond swiftly to market demands and stay ahead of the competition. ^Create a Versatile Ecosystem of Components: The present invention offersa wide range of pre-designed boards, including Op Amp, ADC, P5521PC00 specification 21 November 2024 instrumentation amp, regulators, and many more. This allows chip manufacturers to easily create a comprehensive ecosystem of components, catering to the diverse needs of their customers. ^Connect Boards to Build Complete Systems: The present invention can beseamlessly interconnected, enabling chip manufacturers to showcase the capabilities of their chips within complete systems. This provides a more holistic and realistic evaluation experience for potential customers, leading to faster adoption and increased market share. ^Expand Market Reach with Community Engagement: The present inventionfacilitates community engagement by providing a platform for chip manufacturers to distribute their evaluation boards to universities and engineers. This fosters a wider understanding and appreciation of their chips, increasing brand recognition and loyalty among potential customers. ^Enhance Market Stickiness through Familiarity: By providing a consistentevaluation experience across their product line, chip manufacturers can cultivate familiarity among their customers. This encourages engineers to stick with a particular manufacturer, securing long-term market dominance.Accordingly, the present invention provides a strategic toolkit that empowers chipmanufacturers to accelerate innovation, expand market reach, and establish themselves as industry leaders. The present invention enables chip manufacturers to: ^Reduce Time-to-Market: Streamline the evaluation board developmentprocess, bringing new chips to market faster and capitalizing on fleeting market opportunities. ^Increase Market Share: Expand market reach by providing a comprehensiveevaluation experience that resonates with a wider audience. ^Cultivate Customer Loyalty: Foster brand loyalty by providing a consistentand engaging evaluation experience across product lines. P5521PC00 specification 21 November 2024

Claims

Claims1. An electronic circuit module unit comprising:a circuit board device, the circuit board device comprising: a printed circuit board including a circuit layout, a plurality of electrical contacts arranged within the circuit layout to enable electronic components to be releasably connected by solderless contacts within the circuit layout; a power input connector; a power output connector; an electronic signal input connector; an electronic signal output connector; wherein the plurality of electrical contacts provides: a first configuration of component connections to form a first type of signal processing circuit with a first signal processing function, and a second configuration of component connections to form a second type of signal processing circuit with a second signal processing function, and wherein connection of a first set of electrical components in the first configuration forms the first type of signal processing circuit with the first signal processing function having primary characteristics and replacement of at least one electrical component of a first type having a first value for another electrical component of the first type having a second value changes the primary characteristics whilst maintaining the first type of signal processing circuit with the first signal processing function.

2. An electronic circuit module unit according to Claim 1 in which the circuitboard device comprises a matrix of apertures for receiving receptacles to contactthe circuit layout and, in which the receptacles are manually releasably securablewithin a respective aperture.

3. An electronic circuit module unit according to Claim 2 in which theP5521PC00 specification 21 November 2024receptacles comprise sleeve members comprising an inner opening into which asection of an electrical component may be retained.

4. An electronic circuit module unit according to Claim 3 in which the inneropening comprises a plurality of resilient fingers.

5. An electronic circuit module unit according to Claim 4 in which each finger isbiased in an inward position and is deflected radially outwardly by an outer peripheryof a part of a component which results from the insertion of the part of the componentwithin the inner opening.

6. An electronic circuit module unit according to any one of Claim 2 to Claim 5in which the electronic circuit module comprises a plurality of receptacles and wherein the receptacles are located within apertures to thereby provide a configuration of component connections to form a signal processing circuit with a specific signal processing function.

7. An electronic circuit module unit according to Claim 6 in which the electroniccircuit enables a component to be swapped within the signal processing circuit with a specific signal processing function in order to provide the same signal processing function but having different characteristics.

8. An electronic circuit module unit according to any one of Claim 2 to Claim 7in which the receptacles are placed in specific apertures to provide connections for a first type of circuit.

9. An electronic circuit module unit according to Claim 8 in which the layout ofthe receptacles defines the type of circuit which is created once the electrical components are secured therein.

10. An electronic circuit module unit according to any preceding claim in whichthe circuit board is for use with through hole components in which a part of anP5521PC00 specification 21 November 2024electrical component is inserted into a receptacle to provide an electrical contact.

11. An electronic circuit module unit according to any preceding claim in whichthe circuit board device is for use with surface mounted electrical components.

12. An electronic circuit module unit according to Claim 11 in which the circuitboard device comprises contact pads which are in communication with the circuitlayout and the electronic circuit module unit comprises a matrix of contact pads forcommunicating with an electrical component and to communicate with the circuitlayout.

13. An electronic circuit module unit according to any preceding claim in whichthe electronic circuit module unit comprises a housing.

14. An electronic circuit module unit according to Claim 13 in which the housingcomprises a peripheral wall which extends around an outer periphery of the circuitboard device.

15. An electronic circuit module unit according to Claim 14 in which the peripheralwall comprises two longitudinal walls and two lateral walls, the housing furthercomprising an open upper face and a closed lower face.

16. An electronic circuit module unit according to Claim 15 in which the openupper face enables the circuit board device to be inserted and extracted from anengagement position within the housing and, in which, the printed circuit boarddevice is engaged in the engagement position by a push fit.

17. An electronic circuit module unit according to any one of Claim 13 to Claim16 in which the housing defines an opening for registering with each of the powerinput connector, the power output connector, the electronic signal input connectorand the electronic signal output connector. P5521PC00 specification 21 November 202418. An electronic circuit module unit according to Claim 17 in which toinstall / engage the printed circuit board device in the housing two connectors are located through respective apertures and the printed circuit board device is pivotally moved such that resilient clips are deflected outwardly and the two other connectors move down with respective slots until the resilient clips engage and retain the printed circuit board device in the housing.

19. An electronic circuit module unit according to any preceding claim in whichone of the power input connector and the power output connector comprises aseries of pins and the other comprises a series of sockets and each pin engageswith a respective socket to communicate power to and / or from the electronic circuit module.

20. An electronic circuit module unit according to any preceding claim in whichthe power input connector is engageable with a power output connector using a push fit connection.

21. An electronic circuit module unit according to any preceding claim in whichone of the electronic signal input connector and the electronic signal outputconnector comprises a series of pins and the other comprises a series of socketsand each pin engages with a respective socket to communicate a signal to and / orfrom the electronic circuit module.

22. An electronic circuit module unit according to any preceding claim in whichthe electronic signal input connector is engageable with an electronic signal outputconnector using a push fit connection.

23. An electronic circuit module unit according to Claim 11 in which theconnection of the power input connector and the electronic signal input connector with a power output connector and an electronic signal output connector of an adjacent module also engages and retains the electronic circuit module unit to the adjacent electronic circuit module unit. P5521PC00 specification 21 November 202424. An assembly comprising a first electronic circuit module unit and a secondelectronic circuit module unit wherein each electronic circuit module unit is in accordance with any one of Claim 1 to Claim 23.

25. A method of changing an electronic circuit provided by an electronic circuitmodule unit, the electronic circuit module unit comprising:a circuit board device, the circuit board device comprising: a printed circuit board including a circuit layout, a plurality of electrical contacts arranged within the circuit layout to enable electronic components to be releasably connected by solderless contacts within the circuit layout; a power input connector; a power output connector; an electronic signal input connector; an electronic signal output connector; wherein the plurality of electrical contacts provides: a first configuration of component connections to form a first type of signal processing circuit with a first signal processing function, and a second configuration of component connections to form a second type of signal processing circuit with a second signal processing function, and the method comprising: connecting a first set of electrical components in the first configuration to form the first type of signal processing circuit with the first signal processing function having primary characteristics, and replacing at least one electrical component of a first type having a first value for another electrical component of the first type having a second value to change the primary characteristics whilst maintaining the first type of signal processing circuit with the first signal processing function. P5521PC00 specification 21 November 2024

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