Electronic device including cover plate having support member disposed thereon

Abstract

This electronic device may comprise: a housing including a first surface and a second surface opposite to the first surface, the housing comprising a cover plate including a first plate surface forming at least a part of the second surface and a second plate surface opposite to the first plate surface; and a support member disposed on the second plate surface of the cover plate. The cover plate may comprise: a cover member at least a part of which is exposed to the outside; and an optical layer arranged on the cover member in the direction of the second plate surface and comprising a UV molding material. The support member may comprise: a base layer; and an adhesive layer which is arranged on the base layer to face the cover plate and comprises an adhesive material, and at least a part of which is attached to the cover plate. The adhesive layer may comprise: a plurality of adhesive portions attached directly to the cover plate and spaced apart from each other to form a predetermined pattern; and a non-adhesive portion not adhered to the cover plate.

Description

An electronic device comprising a cover plate on which a support member is arranged

[0001] The disclosure relates to an electronic device comprising a cover plate on which a support member is disposed.

[0002] Electronic devices, such as smartphones, are being developed at a rapid pace. Portability is a crucial feature of these devices, and continuous efforts are being made to make smartphones smaller, lighter, and slimmer. Smartphone cover plates can be equipped with a molding layer to create an optical texture. Various studies are being conducted to ensure that this molding layer does not create a visual discomfort to consumers.

[0003] However, the above-described content should not be construed as the applicant's recognition of the content described in this document as prior art, but should only be construed as technology (related art) related to the invention described in this document.

[0004] In one embodiment, an electronic device may include a housing including a first surface and a second surface opposite the first surface, a first plate surface forming at least a portion of the second surface, and a cover plate including a second plate surface opposite the first plate surface, and a support member disposed on the second plate surface of the cover plate. The cover plate may include a cover member, at least a portion of which is exposed to the outside, and an optical layer disposed on the cover member in the direction of the second plate surface, the optical layer including a UV molding material. The support member may include a base layer, and an adhesive layer disposed on the base layer so as to face the cover plate, the adhesive layer including an adhesive material, at least a portion of which is attached to the cover plate. The adhesive layer may include a plurality of adhesive portions directly attached to the cover plate and formed to be spaced apart from each other to form a predetermined pattern, and a non-adhesive portion that is not attached to the cover plate.

[0005] In one embodiment, an electronic device may include a housing including a first surface and a second surface opposite the first surface, a first plate surface forming at least a portion of the second surface, and a cover plate including a second plate surface opposite the first plate surface, and a support member disposed on the second plate surface of the cover plate. The cover plate may include a cover member, at least a portion of which is exposed to the outside, and an optical layer disposed on the cover member in the direction of the second plate surface, the optical layer including a UV molding material. The support member may include a base layer, an adhesive layer disposed on the base layer so as to face the cover plate, the adhesive layer including an adhesive material, at least a portion of which is attached to the cover plate, a buffer portion disposed on the base layer in a direction opposite to the adhesive layer, and a cover layer disposed on one surface of the adhesive layer so as to face the cover plate. The adhesive layer may include a plurality of adhesive portions directly attached to the cover plate and formed to be spaced apart from each other so as to form a predetermined pattern, and a non-adhesive portion that is not adhered to the cover plate. The cover layer may include a plurality of through holes penetrating the surface of the cover layer and overlapping each of the plurality of adhesive portions.

[0006] In one embodiment, an electronic device may include a housing including a first surface and a second surface opposite the first surface, a first plate surface forming at least a portion of the second surface, and a cover plate including a second plate surface opposite the first plate surface, the housing including a support member disposed on the second plate surface of the cover plate, a display disposed on the first surface of the housing and visually exposed to the outside, a front frame disposed in an internal space of the housing, and a battery supported by the front frame. The cover plate may include a cover member, at least a portion of which is exposed to the outside, and an optical layer disposed on the cover member in the direction of the second plate surface, the optical layer including a UV molding material. The support member may include a base layer, an adhesive layer disposed on the base layer so as to face the cover plate, the adhesive layer including an adhesive material, at least a portion of which is attached to the cover plate, a buffer portion disposed on the base layer in a direction opposite to the adhesive layer, and a cover layer disposed on one surface of the adhesive layer so as to face the cover plate. The adhesive layer may include a plurality of adhesive portions that are directly attached to the cover plate and are formed to be spaced apart from each other to form a certain pattern, and a non-adhesive portion that is not adhered to the cover plate. The cover layer may include a plurality of through holes that penetrate the surface of the cover layer and overlap each of the plurality of adhesive portions.

[0007] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0009] FIG. 2A is a perspective view of an electronic device according to one embodiment, viewed in one direction.

[0010] FIG. 2b is a perspective view of an electronic device according to one embodiment viewed in another direction.

[0011] FIG. 2c is an exploded perspective view of an electronic device according to one embodiment.

[0012] FIG. 3A is a perspective view of a cover plate and a support member disposed on the cover plate according to one embodiment.

[0013] Fig. 3b is a cross-sectional view taken along line A-A' of Fig. 3a.

[0014] Figure 3c is a drawing showing an enlarged view of area B of Figure 3b.

[0015] FIG. 4a is a perspective view of a support member according to one embodiment.

[0016] Figure 4b is an exploded perspective view of a support member according to one embodiment.

[0017] FIG. 4c is a drawing showing the flow path of water vapor on the surface of a support member according to one embodiment.

[0018] FIG. 4d is a drawing showing a cut portion formed on the surface of a support member according to one embodiment.

[0019] FIG. 5 is a perspective view of a cover plate and a support member arranged along the circumference of the cover plate according to one embodiment.

[0020] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0021]

[0022] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments. Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0023] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that may operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0024] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0025] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0026] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0029] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0030] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0035] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0037] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0040] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0041] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0042] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service on its own, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0045] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0046] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0047] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., a foldable electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., the foldable electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0048] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0049] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0050]

[0051] FIG. 2a is a perspective view of an electronic device according to one embodiment viewed in one direction, FIG. 2b is a perspective view of an electronic device according to one embodiment viewed in another direction, and FIG. 2c is an exploded perspective view of an electronic device according to one embodiment.

[0052] Referring to FIGS. 2A to 2C, an electronic device (201) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) having a first surface (210a) (e.g., a front surface), a second surface (210b) (e.g., a back surface), and a third surface (210c) (e.g., a side surface) surrounding a space between the first surface (210a) and the second surface (210b).

[0053] In one embodiment, the first side (210a) may be formed by a first plate (211a) that is at least partially substantially transparent. For example, the first plate (211a) may include a glass plate or a polymer plate including at least one coating layer. In one embodiment, the second side (210b) may be formed by a second plate (211b) that is substantially opaque (e.g., the cover plate (311) of FIG. 3a). For example, the second plate (211b) may be formed by a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination thereof. In one embodiment, the third side (210c) may be formed by a frame (211c) that is joined to the first plate (211a) and the second plate (211b) and includes a metal and / or a polymer. In one embodiment, the second plate (211b) and the frame (211c) may be formed seamlessly as one piece. In one embodiment, the second plate (211b) and the frame (211c) may be formed of substantially the same material (e.g., aluminum).

[0054] In one embodiment, the first plate (211a) may include a plurality of first edge regions (212a-1). The plurality of first edge regions (212a-1) may face the second plate (211b) from at least a portion of the first surface (210a). The plurality of first edge regions (212a-1) may contact the frame (211c). The plurality of first edge regions (212a-1) may extend in one direction (e.g., + / - Y direction). The first plate (211a) may include a plurality of second edge regions (212a-2). The plurality of second edge regions (212a-2) may face the second plate (211b) from at least a portion of the first surface (210a). A plurality of second edge regions (212a-2) may be in contact with the frame (211c). The plurality of second edge regions (212a-2) may extend in a direction (e.g., + / - X direction) different from the extension direction (e.g., + / - Y direction) of the plurality of first edge regions (212a-1). The first plate (211a) may include a plurality of third edge regions (212a-3). The plurality of third edge regions (212a-3) may face the second plate (211b) from at least a portion of the first surface (210a). The plurality of third edge regions (212a-3) may be in contact with the frame (211c). A plurality of third edge regions (212a-3) can be arranged between a plurality of first edge regions (212a-1) and a plurality of second edge regions (212a-2).

[0055] In one embodiment, the second plate (211b) may include a plurality of fourth edge regions (212b-1). The plurality of fourth edge regions (212b-1) may face the first plate (211a) from at least a portion of the second surface (210b). The plurality of fourth edge regions (212b-1) may contact the frame (211c). The plurality of fourth edge regions (212b-1) may extend in one direction (e.g., + / - Y direction). The second plate (211b) may include a plurality of fifth edge regions (212b-2). The plurality of fifth edge regions (212b-2) may face the first plate (211a) from at least a portion of the second surface (210b). A plurality of fifth edge regions (212b-2) may be in contact with the frame (211c). The plurality of fifth edge regions (212b-2) may extend in a direction (e.g., + / - X direction) different from the extension direction (e.g., + / - Y direction) of the plurality of fourth edge regions (212b-1). The second plate (211b) may include a plurality of sixth edge regions (212b-3). The plurality of sixth edge regions (212b-3) may face the first plate (211a) from at least a portion of the second surface (210b). The plurality of sixth edge regions (212b-3) may be in contact with the frame (211c). A plurality of sixth edge regions (212b-3) can be arranged between a plurality of fourth edge regions (212b-1) and a plurality of fifth edge regions (212b-2).

[0056] In one embodiment, the electronic device (201) may include a display (261) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (261) may be positioned on the first surface (210a). In one embodiment, the display (261) may be visible through at least a portion of the first plate (211a) (e.g., the plurality of first edge regions (212a-1), the plurality of second edge regions (212a-2), and / or the plurality of third edge regions (212a-3)). In one embodiment, the display (261) may have a shape substantially the same as the shape of the outer edge of the first plate (211a). In some embodiments, the edge of the display (261) may substantially coincide with the outer edge of the first plate (211a).

[0057] In one embodiment, the display (261) may include a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0058] In one embodiment, the display (261) may include a screen display area (261a) that is visually exposed and displays content through pixels. In one embodiment, the screen display area (261a) may include a sensing area (261a-1). The sensing area (261a-1) may overlap with at least a portion of the screen display area (261a). The sensing area (261a-1) may allow transmission of an input signal related to a sensor module (276) (e.g., the sensor module (176) of FIG. 1 ). The sensing area (261a-1) may display content similarly to a screen display area (261a) that does not overlap with the sensing area (261a-1). For example, the sensing area (261a-1) may display content while the sensor module (276) is not operating. At least a portion of the camera area (261a-2) may overlap with the screen display area (261a). In one embodiment, the screen display area (261a) may include the camera area (261a-2). The camera area (261a-2) may allow transmission of an optical signal related to the first camera module (280a) (e.g., the camera module (180) of FIG. 1 ). At least a portion of the camera area (261a-2) overlapping the screen display area (261a) may display content similarly to the screen display area (261a) that does not overlap with the camera area (261a-2). For example, the camera area (261a-2) may display content while the first camera module (280a) is not operating.

[0059] In one embodiment, the electronic device (201) may include an audio module (270) (e.g., audio module (170) of FIG. 1). In one embodiment, the audio module (270) may be located on the third surface (210c). In one embodiment, the audio module (270) may obtain sound through at least one hole.

[0060] In one embodiment, the electronic device (201) may include a sensor module (276). In one embodiment, the sensor module (276) may be located on the first surface (210a). The sensor module (276) may form a sensing area (261a-1) in at least a portion of the screen display area (261a). The sensor module (276) may receive an input signal that passes through the sensing area (261a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). For example, the input signal may include a signal related to a user's biometric information (e.g., a fingerprint).

[0061] In one embodiment, the electronic device (201) may include a first camera module (280a) (e.g., the camera module (180) of FIG. 1). In one embodiment, the first camera module (280a) may be positioned on the first surface (210a). In one embodiment, at least a portion of the first camera module (280a) may be positioned below the display (261). In one embodiment, the first camera module (280a) may receive an optical signal that passes through the camera area (261a-2).

[0062] In one embodiment, the electronic device (201) may include a second camera module (280b) (e.g., the camera module (180) of FIG. 1). The second camera module (280b) may be positioned on the second surface (210b). In one embodiment, the second camera module (280b) may include multiple camera modules (e.g., a dual camera, a triple camera, or a quad camera).

[0063] In one embodiment, the electronic device (201) may include a flash (280c). The flash (280c) may be located on the second surface (210b). In one embodiment, the flash (280c) may include a light emitting diode or a xenon lamp.

[0064] In one embodiment, the electronic device (201) may include an audio output module (255) (e.g., the audio output module (155) of FIG. 1). In one embodiment, the audio output module (255) may be located on the third surface (210c). In one embodiment, the audio output module (255) may include one or more holes.

[0065] In one embodiment, the electronic device (201) may include an input module (250) (e.g., the input module (150) of FIG. 1). In one embodiment, the input module (250) may be located on the third surface (210c). In one embodiment, the input module (250) may include at least one key input device.

[0066] In one embodiment, the electronic device (201) may include a connection terminal (278) (e.g., the connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (278) may be positioned on the third surface (210c). For example, when the electronic device (201) is viewed in one direction (e.g., the +Y direction), the connection terminal (278) may be positioned substantially in the center of the third surface (210c), and the audio output module (255) may be positioned on one side (e.g., the right side) with respect to the connection terminal (278).

[0067] In one embodiment, the electronic device (201) may include a front frame (240), a first circuit board (251), a second circuit board (252), and a battery (289) (e.g., battery (189) of FIG. 1). At least a portion of the front frame (240) may form a housing (210) together with the first plate (211a) and the second plate (211b).

[0068] In one embodiment, the front frame (240) may include a first frame structure (241), a second frame structure (243), and a plate structure (242). The first frame structure (241) may surround an edge of the plate structure (242). The first frame structure (241) may connect an edge of the first plate (211a) and an edge of the second plate (211b). The first frame structure (241) may surround a space between the first plate (211a) and the second plate (211b). At least a portion of the first frame structure (241) may form a third surface (210c) of the electronic device (201). The second frame structure (243) may be positioned between the first frame structure (241) and the second plate (211b). The first frame structure (241) and the second frame structure (243) may at least partially form a frame (211c). The plate structure (242) may include a first portion (242a) for accommodating a first circuit board (251) and a second portion (242b) for accommodating a second circuit board (252). A display (261) may be positioned on one surface (e.g., a lower surface or a +Z-axis direction) of the plate structure (242). The first circuit board (251) and the second circuit board (252) may be positioned on the other surface (e.g., a upper surface or a -Z-axis direction) of the plate structure (242). In one embodiment, the plate structure (242) may include an opening (245). The opening (245) may be positioned between the first portion (242a) and the second portion (242b). The opening (245) can pass through both sides of the plate structure (242). The opening (245) can accommodate a battery (289).

[0069] Meanwhile, one or more of the embodiments disclosed in this document may be applied to electronic devices of various shapes / forms (e.g., foldable electronic devices, slideable electronic devices, digital cameras, digital video cameras, tablets, note-shaped electronic devices, and other electronic devices) in addition to the electronic devices illustrated in FIGS. 2A to 2C.

[0070] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0071] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0072] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0073] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0074] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0075]

[0076] FIG. 3a is a perspective view of a cover plate (311) and a support member (320) disposed on the cover plate (311) according to one embodiment, FIG. 3b is a cross-sectional view taken along line A-A' of FIG. 3a, and FIG. 3c is an enlarged view of area B of FIG. 3b.

[0077] Referring to FIGS. 3A to 3C, an electronic device (e.g., an electronic device (201) of FIG. 2A) according to an embodiment may include a housing (e.g., a housing (210) of FIG. 2A) forming at least a portion of an outer surface of the electronic device, a front frame (e.g., a front frame (240) of FIG. 2C) disposed in an inner space of the housing, a battery (e.g., a battery (189) of FIG. 1 or a battery (289) of FIG. 2C) supported by the front frame, a support member (320) disposed on a cover plate (311) of the housing, a flow region (330) through which water vapor introduced from the outside of the electronic device can flow, and a display (e.g., a display (261) of FIG. 2A) disposed on a first surface of the housing and visually exposed to the outside.

[0078] In one embodiment, the housing may include a first side (e.g., first side (210a) of FIG. 2a), a second side opposite the first side (e.g., second side (210b) of FIG. 2b), and a side surface surrounding an interior space between the first side and the second side (e.g., side surface (210c) of FIG. 2a). In one embodiment, the housing may include a cover plate (311) forming at least a portion of the second side (e.g., second plate (211b) of FIG. 2b).

[0079] In one embodiment, the cover plate (311) may form at least a portion of an outer surface of the housing. In one embodiment, the cover plate (311) may include a first plate surface (311a) and a second plate surface (311b) opposite to the first plate surface (311a). In one embodiment, the first plate surface (311a) may form at least a portion of a second surface (e.g., the second surface (210b) of FIG. 2B) of the housing (e.g., the housing (210) of FIG. 2B). In one embodiment, at least a portion of the cover plate (311) may be exposed to the outside of the electronic device. The cover plate (311) may protect components arranged in an internal space of the electronic device from external impact.

[0080] In one embodiment, the cover plate (311) may include a cover member (3111) at least partially exposed to the outside of the electronic device, an optical layer (3112) disposed on the cover member (3111), and a printed layer (3113) disposed on the optical layer (3112).

[0081] In one embodiment, the optical layer (3112) may be disposed on the cover member (3111) in the direction of the second plate surface (311b) (e.g., the +Z-axis direction in FIG. 3A). In one embodiment, the optical layer (3112) may be disposed adjacent to the second surface of the housing to form an optical texture of at least a portion of the housing. In one embodiment, at least a portion of the optical layer (3112) may be formed as a UV molding layer. In one embodiment, the print layer (3113) may be disposed on the optical layer (3112) in the direction of the second play surface. In one embodiment, the print layer (3113) may be disposed between the optical layer (3112) and a support member (320) described below.

[0082] In one embodiment, the support member (320) may be disposed on the second plate surface (311b) of the cover plate (311). In one embodiment, the support member (320) may be attached to the optical layer (3112) of the cover plate (311). In one embodiment, while the support member (320) is attached to the optical layer (3112), the support member (320) may be disposed on the cover plate (311) so as to come into contact with a battery supported by a front frame disposed in an internal space of the housing. In one embodiment, the support member (320) may prevent or reduce a play caused by a gap formed between the battery and the cover plate (311) when the battery expands or contracts during use of the electronic device. In one embodiment, the support member (320) may include a plurality of adhesive portions (3221) that are formed to protrude toward the cover plate (311).

[0083] In one embodiment, a plurality of adhesive portions (3221) may be formed to protrude from the surface of the support member (320) toward the cover plate (311). In one embodiment, the plurality of adhesive portions (3221) may be bonded to a print layer (3113) disposed in the direction of the second plate surface (311b) of the cover plate (311). In one embodiment, the plurality of adhesive portions (3221) may be disposed to be spaced apart from each other by a constant distance on the surface of the support member (320). In one embodiment, the plurality of adhesive portions (3221) may be formed to protrude from the surface of the support member (320) and are disposed to be spaced apart from each other, thereby forming a flow region (330) between the support member (320) and the cover plate (311). In one embodiment, water vapor introduced from the outside of the electronic device may flow through the flow region (330) formed between the support member (320) and the cover plate (311). In one embodiment, the plurality of adhesive portions (3221) are formed of a waterproof material, and water vapor can flow between the plurality of adhesive portions (3221). In one embodiment, water vapor flowing in the flow region (330) can flow from the flow region (330) to the optical layer (3112) of the cover plate (311).

[0084] In one embodiment, a moisture gradient may occur on the surface of the optical layer (3112) due to a difference in the density of water vapor. In one embodiment, a large moisture gradient on the surface of the optical layer (3112) may mean that moisture diffusion on the surface of the optical layer (3112) is not widespread, and a small moisture gradient may mean that moisture diffusion is widespread. In one embodiment, when the moisture gradient on the surface of the optical layer (3112) is greater than a predetermined value, the optical layer (3112) may be viewed to the outside through the first plate surface (311a) of the cover plate (311) due to a difference in reflectivity caused by a difference in the density of water vapor.

[0085] In one embodiment, when the diffusion of water vapor on the surface of the optical layer (3112) is wide, the size of the moisture gradient may be substantially constant. In one embodiment, when the diffusion of water vapor on the surface of the optical layer (3112) is not above a certain level, the water vapor may be concentrated and distributed in a specific area of ​​the surface of the optical layer (3112), and the size of the moisture gradient may increase. In one embodiment, the size of the moisture gradient may be proportional to the diameter (D) of the bonding portion. In one embodiment, when the diameter (D) of the bonding portion is excessively large, the size of the moisture gradient may increase as the diffusion movement of water vapor (P) to the surface area (S) of the optical layer (3112) overlapping with the bonding portion is restricted. In one embodiment, as the diameter (D) of the bonding portion is smaller, the size of the moisture gradient may decrease as the diffusion movement of water vapor (P) to the surface area (S) of the optical layer (3112) overlapping with the bonding portion is free. In one embodiment, the magnitude of the moisture gradient on the surface of the optical layer (3112) may be inversely proportional to the gap formed between a pair of adjacent bonding portions. In one embodiment, the larger the gap formed between the bonding portions, the wider the diffusion of moisture vapor in the flow region (330), and the wider the diffusion of moisture vapor from the flow region (330) to the surface of the optical layer (3112), thereby reducing the magnitude of the moisture gradient.

[0086]

[0087] FIG. 4a is a perspective view of a support member (320) according to one embodiment, FIG. 4b is an exploded perspective view of a support member (320) according to one embodiment, FIG. 4c is a drawing showing a flow path of water vapor on a surface of a support member (320) according to one embodiment, and FIG. 4d is a drawing showing a cut portion formed on a surface of a support member (320) according to one embodiment.

[0088] Referring to FIGS. 4A to 4D, a support member (320) according to one embodiment may include a base layer (321), an adhesive layer (322) disposed on one surface of the base layer (321), a buffer portion (324) disposed on the other surface of the base layer (321), and a cover layer (323) disposed on the adhesive layer (322) so as to face the cover member (3111).

[0089] In one embodiment, the base layer (321) may form a substrate layer of the support member (320). In one embodiment, the base layer (321) may be formed on both sides with an adhesive material. In one embodiment, the base layer (321) may perform a function of adhering a plurality of layers forming the support member (320) to each other. In one embodiment, the base layer (321) may include a polyethylene terephthalate (PET) material.

[0090] In one embodiment, the cover layer (323) may be disposed on the base layer (321) so as to face the cover member (3111) (e.g., the cover member (3111) of FIG. 3B) (e.g., the −Z-axis direction of FIG. 4A). In one embodiment, the cover layer (323) may form at least a portion of the surface of the support member (320). In one embodiment, the cover layer (323) may include a plurality of through holes (3230). In one embodiment, the plurality of through holes (3230) may be formed by penetrating the surface of the cover layer (323). In one embodiment, the plurality of through holes (3230) may have substantially the same size and may be formed spaced apart from each other by a predetermined distance. In one embodiment, the plurality of through holes (3230) may have at least one shape of a circle and a polygon. In one embodiment, the plurality of through holes (3230) may have substantially the same shape or may have different shapes. For example, the plurality of through holes (3230) may all have a circular or polygonal shape. For example, at least some of the plurality of through holes (3230) may have a circular shape, and the remaining some may have a polygonal shape.

[0091] In one embodiment, the adhesive layer (322) may be disposed on the base layer (321) so as to face the cover member (3111) (e.g., the cover member (3111) of FIG. 3B) (e.g., the −Z-axis direction of FIG. 4A). For example, the adhesive layer (322) may be disposed between the cover layer (323) and the base layer (321). In one embodiment, the adhesive layer (322) may include an adhesive material (e.g., a Pressure Sensitive Adhesive (PSA) or an Optical Clear Adhesive (OCA)). In one embodiment, at least a portion of the adhesive layer (322) may be attached to the cover member (3111). For example, the adhesive layer (322) may include a plurality of adhesive portions (3221) that are directly adhered to the cover member (3111) and non-adhesive portions (3222) that are not adhered to the cover member (3111).

[0092] In one embodiment, a plurality of adhesive portions (3221) may be formed to be spaced apart from each other to form a certain pattern. In one embodiment, the pattern formed by the plurality of adhesive portions (3221) formed to be spaced apart from each other may include a micropattern that forms a flow region (330) that at least partially overlaps the adhesive layer (322).

[0093] In one embodiment, the plurality of adhesive portions (3221) may be formed at positions overlapping the plurality of through holes (3230) formed on the surface of the cover layer (323). In one embodiment, the plurality of adhesive portions (3221) of the adhesive layer (322) may have substantially the same shape as the plurality of through holes (3230) of the cover layer (323). In one embodiment, the plurality of adhesive portions (3221) may pass through the plurality of through holes (3230) formed on the surface of the cover layer (323). For example, with respect to the direction facing the cover member (3111) (e.g., the -Z-axis direction of FIG. 4A), the cover layer (323) may be disposed on top of the adhesive layer (322). In one embodiment, when the support member (320) is attached to the cover member (3111), at least a portion of the adhesive layer (322) (e.g., the plurality of adhesive portions (3221)) may be attached to the cover member (3111) by passing through the plurality of through holes (3230) formed on the surface of the cover layer (323). For example, the plurality of adhesive portions (3221) of the adhesive layer (322) may be formed to protrude relatively toward the cover member (3111) compared to the non-adhesive portions (3222) of the adhesive layer (322).

[0094] In one embodiment, the diameter (D1) of each of the plurality of adhesive portions (3221) may be less than or equal to the gap (D2) formed between a pair of adjacent adhesive portions. The size of the moisture gradient on the surface of the optical layer (3112) according to one embodiment (e.g., the optical layer (3112) (3112) of FIG. 3B) may be proportional to the diameter length (D1) of each of the plurality of adhesive portions (3221) and inversely proportional to the gap (D2) formed between a pair of adjacent adhesive portions. In one embodiment, in order to minimize the size of the moisture gradient on the surface of the optical layer (3112), the diameter of each of the plurality of adhesive portions (3221) may be formed as small as possible (e.g., 0.3 mm to 1.2 mm), and the gap formed between a pair of adjacent adhesive portions may be formed as large as possible (e.g., 0.5 mm to 1.2 mm).

[0095] In one embodiment, the buffer portion (324) of the support member (320) may be disposed on the base layer (321) in a direction opposite to the adhesive layer (322) (e.g., the +Z-axis direction of FIG. 4a). In one embodiment, the buffer portion (324) of the support member (320) may be formed of a compressible and restorable porous material (e.g., a foam sponge material, a sponge material in the form of hollow particles). In one embodiment, the buffer portion (324) may prevent or reduce a play that may occur between the cover plate (311) and the front frame or the cover plate (311) and the battery. For example, the support member (320) may be disposed between the front frame (e.g., the front frame (240) of FIG. 2c) disposed in the internal space of the housing and the cover plate (311), and the buffer portion (324) of the support member (320) may be in contact with the front frame. In one embodiment, the buffer portion (324) of the support member (320) may contact the battery supported by the front frame. In one embodiment, the buffer portion (324) of the support member (320) may compensate for any play that may occur between the cover plate (311) and the battery when the battery expands or contracts during use of the electronic device.

[0096] In one embodiment, a cut portion (325) may be formed on the surface of the support member (320). In one embodiment, the cut portion (325) may be formed by penetrating the surface of the support member (320). In one embodiment, the cut portion (325) may perform a function of discharging air bubbles formed between the support member (320) and the optical layer (3112) of the cover plate (311) while the support member (320) is attached to the cover plate (311). In one embodiment, the cut portion (325) may be formed in at least one shape of a linear slit (e.g., see the cut portion (325) of FIG. 5) and a circle (e.g., a through hole).

[0097]

[0098] FIG. 5 is a perspective view of a cover plate and a support member arranged along the circumference of the cover plate according to one embodiment.

[0099] Referring to FIG. 5, a cover plate (411) according to one embodiment (e.g., cover plate (311) of FIG. 3a) may include a first plate surface (411a) (e.g., first plate surface (311a) of FIG. 3a) forming at least a portion of a second surface (e.g., second surface (201b) of FIG. 2b) of an electronic device (e.g., electronic device (201) of FIG. 2a)) and a second plate surface (411b) (e.g., second plate surface (311b) of FIG. 3a) opposite to the first plate surface (411a).

[0100] In one embodiment, the support member (420) (e.g., the support member (320) of FIG. 3a) may be disposed on the second plate surface (411b) of the cover plate (411). For example, the support member (420) may be disposed on the second plate surface (411b) along the circumferential direction of the cover plate (411). In one embodiment, the support member (420) may include a buffer portion (e.g., the buffer portion (324) of FIG. 4a) that contacts a front frame (e.g., the front frame (240) of FIG. 2c) disposed in an inner space of the housing. In one embodiment, the surface of the buffer portion facing the front frame may be formed of an adhesive material. In one embodiment, the support member may be attached to the cover plate (411) via a plurality of adhesive portions (e.g., a plurality of adhesive portions (3221) of FIG. 4a) and may be attached to a front frame (e.g., a front frame (240) of FIG. 2c) disposed in the interior space of the housing via a surface of the buffer portion facing the interior space.

[0101]

[0102] In one embodiment, an electronic device (101; 201) may include a housing (210) including a first surface (210a) and a second surface (210b) opposite to the first surface (210a), a cover plate (311) including a first plate surface (311a) forming at least a portion of the second surface (210b) and a second plate surface (311b) opposite to the first plate surface (311a); and a support member (320) disposed on the second plate surface (311b) of the cover plate (311). The cover plate (311) may include a cover member (3111) at least a portion of which is exposed to the outside; and an optical layer (3112) disposed on the cover member (3111) in the direction of the second plate surface (311b) and including a UV molding material. The above support member (320) may include a base layer (321); and an adhesive layer (322) disposed on the base layer (321) so as to face the cover plate (311), including an adhesive material, and at least a portion of which is attached to the cover plate (311). The adhesive layer (322) may include a plurality of adhesive portions (3221) that are directly attached to the cover plate (311) and are formed to be spaced apart from each other to form a certain pattern; and a non-adhesive portion (3222) that is not attached to the cover plate (311).

[0103] In one embodiment, the support member (320) may further include a cover layer (323) disposed on one surface of the adhesive layer (322) so as to face the cover plate (311). The cover layer (323) may include a plurality of through holes (3230) penetrating the surface of the cover layer (323) and overlapping each of the plurality of adhesive portions (3221).

[0104] In one embodiment, the non-adhesive portion (3222) of the adhesive layer (322) is attached to the cover layer (323), and the plurality of adhesive portions (3221) of the adhesive layer (322) pass through the plurality of through holes (3230) and can be attached to the cover plate (311).

[0105] In one embodiment, the plurality of adhesive portions (3221) may be formed to protrude relatively toward the cover plate (311) compared to the non-adhesive portions (3222).

[0106] In one embodiment, the plurality of through holes (3230) may have at least one shape of a circle and a polygon, and the plurality of adhesive portions (3221) may have a shape substantially the same as the plurality of through holes (3230).

[0107] In one embodiment, the support member (320) may further include a buffer portion (324) disposed on the base layer (321) in an opposite direction to the adhesive layer (322).

[0108] In one embodiment, the housing (210) further includes a front frame (240) disposed in the internal space, and the support member (320) may be disposed between the cover plate (311) and the front frame (240).

[0109] In one embodiment, the front frame (240) further includes a battery (189; 289) supported by the front frame, and the buffer portion (324) of the support member (320) can contact the outer surface of the battery (189; 289).

[0110] In one embodiment, the support member (420) is arranged at an edge along the circumferential direction of the cover plate (411), and the surface of the buffer portion (324) facing the front frame (240) may include an adhesive material.

[0111] In one embodiment, the support member (320) includes a cut portion (325) formed through the surface of the support member (320), and the cut portion (325) can communicate the space between the support member (320) and the optical layer (3112) with the outside.

[0112] In one embodiment, the cut portion (325) may be formed in at least one of a linear slit and a circular shape.

[0113] In one embodiment, the electronic device (101; 201) may further include a flow region (330) formed between the cover plate (311) and the cover layer (323) of the support member (320), through which water vapor introduced from the outside of the electronic device (101; 201) can flow along between the plurality of adhesive portions (3221).

[0114] In one embodiment, the diameter of each of the plurality of adhesive portions (3221) may be less than or equal to the gap formed between a pair of adjacent adhesive portions (3221).

[0115] In one embodiment, the water vapor flows from the flow region (330) to the optical layer (3112), and a moisture gradient may occur on the surface of the optical layer (3112) due to a difference in the density of the water vapor.

[0116] In one embodiment, the size of the moisture gradient may be proportional to the diameter of the bonding portion (3221) and inversely proportional to the gap formed between the pair of adjacent bonding portions (3221).

[0117] In one embodiment, an electronic device (101; 201) may include a housing (210) including a first surface (210a) and a second surface (210b) opposite to the first surface (210a), a cover plate (311) including a first plate surface (311a) forming at least a portion of the second surface (210b) and a second plate surface (311b) opposite to the first plate surface (311a); and a support member (320) disposed on the second plate surface (311b) of the cover plate (311). The cover plate (311) may include a cover member (3111) at least a portion of which is exposed to the outside; and an optical layer (3112) disposed on the cover member (3111) in the direction of the second plate surface (311b) and including a UV molding material. The above support member (320) may include a base layer (321); an adhesive layer (322) disposed on the base layer (321) so as to face the cover plate (311), including an adhesive material, at least a portion of which is attached to the cover plate (311); a buffer portion (324) disposed on the base layer (321) in a direction opposite to the adhesive layer (322); and a cover layer (323) disposed on one surface of the adhesive layer (322) so as to face the cover plate (311). The adhesive layer (322) may include a plurality of adhesive portions (3221) that are directly attached to the cover plate (311) and are formed to be spaced apart from each other to form a certain pattern; and a non-adhesive portion (3222) that is not attached to the cover plate (311). The above cover layer (323) may include a plurality of through holes (3230) that penetrate the surface of the cover layer (323) and overlap each of the plurality of adhesive portions (3221).

[0118] In one embodiment, the plurality of adhesive portions (3221) are spaced apart from each other by substantially the same interval on the surface of the adhesive layer (322), and the plurality of adhesive portions (3221) spaced apart from each other can form a micro pattern.

[0119] In one embodiment, the non-adhesive portion (3222) of the adhesive layer (322) is attached to the cover layer (323), and a plurality of adhesive portions (3221) of the adhesive layer (322) pass through the plurality of through holes (3230) and are attached to the cover plate (311), and the plurality of adhesive portions (3221) can be formed to protrude relatively toward the cover plate (311) compared to the non-adhesive portions (3222).

[0120] In one embodiment, the electronic device (101; 201) further includes a flow region (330) formed between the cover layer (323) of the cover plate (311) and the support member (320), and through which water vapor introduced from the outside of the electronic device (101; 201) can flow between the plurality of adhesive portions (3221), and each of the plurality of adhesive portions (3221) has a diameter smaller than or equal to a gap formed between a pair of adjacent adhesive portions (3221), and the water vapor flows from the flow region (330) to the optical layer (3112), and a moisture gradient occurs on the surface of the optical layer (3112) due to a density difference of the water vapor, and the size of the moisture gradient may be proportional to the diameter of the adhesive portion (3221) and inversely proportional to a gap formed between the pair of adjacent adhesive portions (3221).

[0121] In one embodiment, an electronic device (101; 201) may include a housing (210) including a first surface (210a) and a second surface (210b) opposite to the first surface (210a), a cover plate (311) including a first plate surface (311a) forming at least a portion of the second surface (210b) and a second plate surface (311b) opposite to the first plate surface (311a); a support member (320) disposed on the second plate surface (311b) of the cover plate (311); a display disposed on the first surface (210a) of the housing (210) and visually exposed to the outside; a front frame (240) disposed in an internal space of the housing (210); and a battery (189; 289) supported by the front frame (240). The cover plate (311) may include a cover member (3111) at least a portion of which is exposed to the outside; and an optical layer (3112) disposed on the cover member (3111) in the direction of the second plate surface (311b) and including a UV molding material. The support member (320) may include a base layer (321); an adhesive layer (322) disposed on the base layer (321) so as to face the cover plate (311), including an adhesive material, and at least a portion of which is attached to the cover plate (311); a buffer portion (324) disposed on the base layer (321) in a direction opposite to the adhesive layer (322); and a cover layer (323) disposed on one surface of the adhesive layer (322) so as to face the cover plate (311). The adhesive layer (322) may include a plurality of adhesive portions (3221) that are directly attached to the cover plate (311) and are formed to be spaced apart from each other to form a certain pattern; And may include a non-adhesive portion (3222) that is not adhered to the cover plate (311).The above cover layer (323) may include a plurality of through holes (3230) that penetrate the surface of the cover layer (323) and overlap each of the plurality of adhesive portions (3221).

Claims

1. In an electronic device (101; 201), A housing (210) including a first side (210a) and a second side (210b) opposite to the first side (210a), The housing (210) including a cover plate (311) including a first plate surface (311a) forming at least a part of the second surface (210b) and a second plate surface (311b) opposite to the first plate surface (311a); and It includes a support member (320) arranged on the second plate surface (311b) of the above cover plate (311), The above cover plate (311) is A cover member (3111) at least partially exposed to the outside; and The cover member (3111) is arranged in the direction of the second plate surface (311b) and includes an optical layer (3112) including a UV molding material. The above support member (320) is Base layer (321); and An adhesive layer (322) is disposed on the base layer (321) so as to face the cover plate (311), includes an adhesive material, and at least a portion of the adhesive layer is attached to the cover plate (311). The above adhesive layer (322) is A plurality of adhesive portions (3221) directly attached to the cover plate (311) and formed spaced apart from each other to form a certain pattern; and An electronic device (101; 201) comprising a non-adhesive portion (3222) that is non-adhesive to the cover plate (311).

2. In paragraph 1, The above support member (320) is It further includes a cover layer (323) arranged on one side of the adhesive layer (322) so as to face the cover plate (311). The above cover layer (323) is An electronic device (101; 201) comprising a plurality of through holes (3230) penetrating the surface of the cover layer (323) and overlapping each of the plurality of adhesive portions (3221).

3. In paragraph 1 or 2, The non-adhesive portion (3222) of the above adhesive layer (322) is attached to the cover layer (323), An electronic device (101; 201) in which a plurality of adhesive portions (3221) of the adhesive layer (322) pass through the plurality of through holes (3230) and are attached to the cover plate (311).

4. In any one of paragraphs 1 to 3, An electronic device (101; 201), wherein the plurality of adhesive portions (3221) are formed to protrude relatively toward the cover plate (311) compared to the non-adhesive portions (3222).

5. In any one of paragraphs 1 to 4, The above plurality of through holes (3230) have at least one shape among circular and polygonal, An electronic device (101; 201) wherein the plurality of adhesive portions (3221) have substantially the same shape as the plurality of through holes (3230).

6. In any one of paragraphs 1 to 5, The above support member (320) is An electronic device (101; 201) further comprising a buffer portion (324) disposed on the base layer (321) in a direction opposite to the adhesive layer (322).

7. In any one of paragraphs 1 to 6, It further includes a front frame (240) arranged in the internal space of the above housing (210), The electronic device (101; 201) wherein the support member (320) is placed between the cover plate (311) and the front frame (240).

8. In any one of paragraphs 1 to 7, It further includes a battery (189; 289) supported by the above front frame (240), The buffer portion (324) of the above support member (320) is in contact with the outer surface of the battery (189; 289), the electronic device (101; 201).

9. In any one of paragraphs 1 to 8, The above support member (420) is arranged at the edge along the circumferential direction of the cover plate (411), An electronic device (101; 201), wherein the surface of the buffer portion (324) facing the front frame (240) includes an adhesive material.

10. In any one of paragraphs 1 to 9, The above support member (320) is It includes a cut portion (325) formed through the surface of the above support member (320), The above-mentioned cut portion (325) is an electronic device (101; 201) that connects the space between the support member (320) and the optical layer (3112) to the outside.

11. In any one of paragraphs 1 to 10, An electronic device (101; 201), wherein the above-mentioned cut portion (325) is formed in at least one of a linear slit and a circular shape.

12. In any one of paragraphs 1 to 11, An electronic device (101; 201) further comprising a flow region (330) formed between the cover plate (311) and the cover layer (323) of the support member (320), in which water vapor introduced from the outside of the electronic device (101; 201) can flow along between the plurality of adhesive portions (3221).

13. In any one of paragraphs 1 to 12, An electronic device (101; 201), wherein each of the plurality of adhesive portions (3221) has a diameter smaller than or equal to a gap formed between a pair of adjacent adhesive portions (3221).

14. In any one of paragraphs 1 to 13, The above water vapor flows from the flow area (330) to the optical layer (3112), An electronic device (101; 201) in which a moisture gradient occurs on the surface of the optical layer (3112) due to a difference in the density of the water vapor.

15. In any one of paragraphs 1 to 14, An electronic device (101; 201), wherein the size of the moisture gradient is proportional to the diameter of the bonding portion (3221) and inversely proportional to the gap formed between the pair of adjacent bonding portions (3221).

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