Heat exchanger and energy storage apparatus

Abstract

Provided in the present application are a heat exchanger and an energy storage apparatus. The heat exchanger comprises a refrigerant substrate, a plurality of condensing plate heat exchangers and a plurality of evaporating plate heat exchangers. In a first direction, the condensing plate heat exchangers and the evaporating plate heat exchangers are arranged on the same side of the refrigerant substrate. The side surface of each condensing plate heat exchanger facing the refrigerant substrate comprises a refrigerant inlet and a refrigerant outlet, and the side surface of each evaporating plate heat exchanger facing the refrigerant substrate comprises a refrigerant inlet and a refrigerant outlet. The refrigerant substrate comprises two condensing refrigerant flow paths and two evaporating refrigerant flow paths; one condensing refrigerant flow path in the two condensing refrigerant flow paths is used for connecting the refrigerant inlet of each condensing plate heat exchanger, and the other condensing refrigerant flow path is used for connecting the refrigerant outlet of each condensing plate heat exchanger; one evaporating refrigerant flow path in the two evaporating refrigerant flow paths is used for connecting the other condensing refrigerant flow path and the refrigerant inlet of each evaporating plate heat exchanger, and the other evaporating refrigerant flow path is used for connecting the refrigerant outlet of each evaporating plate heat exchanger. The present application can improve the cooling capacity of heat exchangers.

Description

Heat exchangers and energy storage equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on November 27, 2023, with application number 202311613907.0, and priority to the Chinese patent application with the invention name “Heat Exchanger and Energy Storage Equipment”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of heat exchange technology, and in particular to a heat exchanger and energy storage device. Background Art

[0003] With the rapid development of new energy technologies, energy storage technology is gaining increasing attention. Heat exchangers are often installed within energy storage devices to heat or dissipate heat, ensuring their performance and safety. Reusing existing heat exchangers for high-cooling scenarios like energy storage power stations increases the space required and complicates assembly.

[0004] Summary of the Invention

[0005] The present application provides a heat exchanger and energy storage equipment, which can improve the cooling capacity of the heat exchanger. Reusing the heat exchanger can reduce the occupied space of the energy storage power station in large cooling capacity scenarios and simplify the assembly process of the energy storage power station.

[0006] In a first aspect, a heat exchanger is provided, which includes a refrigerant base plate, a plurality of condensing plates, and a plurality of evaporating plates. Each condensing plate and each evaporating plate are arranged on the same side of the refrigerant base plate along a first direction. The side of each condensing plate facing the refrigerant base plate includes a condensing refrigerant inlet and a condensing refrigerant outlet, and the side of each evaporating plate facing the refrigerant base plate includes an evaporating refrigerant inlet and an evaporating refrigerant outlet. The refrigerant base plate includes two condensing refrigerant flow channels and two evaporating refrigerant flow channels. Among them, one of the two condensing refrigerant flow channels is used to connect the condensing refrigerant inlet of each condensing plate, and the other condensing refrigerant flow channel is used to connect the condensing refrigerant outlet of each condensing plate. One of the two evaporating refrigerant flow channels is used to connect the other condensing refrigerant flow channel and the evaporating refrigerant inlet of each evaporating plate, and the other evaporating refrigerant flow channel is used to connect the evaporating refrigerant outlet of each evaporating plate.

[0007] In the heat exchanger provided in the embodiments of the present application, multiple condenser plates and evaporator plates are integrated onto a refrigerant base plate, improving the heat exchanger's cooling capacity. Furthermore, each condenser plate and each evaporator plate are arranged on the same side of the refrigerant base plate, resulting in a simple and compact heat exchanger layout. Furthermore, reusing this heat exchanger can reduce the space occupied by energy storage power plants in high-cooling scenarios and simplify the assembly process.

[0008] In one implementation, another condensing refrigerant flow channel and an evaporating refrigerant flow channel are respectively located between one condensing refrigerant flow channel and another evaporating refrigerant flow channel. This arrangement places the condensing refrigerant flow channel, which transmits high-temperature, high-pressure refrigerant, and the evaporating refrigerant flow channel on the edge of the condensing substrate, reducing heat loss from the refrigerant in the other condensing refrigerant flow channel and the refrigerant in the one evaporating refrigerant flow channel.

[0009] In one implementation, the cross-sectional areas of the two evaporating refrigerant flow channels are respectively larger than the cross-sectional areas of the two condensing refrigerant flow channels.

[0010] Since most of the refrigerant flowing in the condensing refrigerant flow channel is liquid, and most of the refrigerant flowing in the evaporating refrigerant flow channel is gaseous, the flow resistance of the liquid refrigerant is smaller than that of the gaseous refrigerant. Therefore, compared with the cross-sectional area of ​​the condensing refrigerant flow channel, the cross-sectional area of ​​the evaporating refrigerant flow channel is set to be larger, thereby increasing the pressure drop of the refrigerant flowing in the evaporating refrigerant flow channel.

[0011] In one implementation, a cross-sectional area of ​​one condensing refrigerant flow channel is larger than a cross-sectional area of ​​another condensing refrigerant flow channel.

[0012] Since the liquid refrigerant flowing in the other condensing refrigerant flow channel is more than the liquid refrigerant flowing in the one condensing refrigerant flow channel, the flow resistance of the refrigerant flowing in the other condensing refrigerant flow channel is smaller than the flow resistance of the refrigerant flowing in the one condensing refrigerant flow channel. Therefore, relative to the cross-sectional area of ​​the other condensing refrigerant flow channel, the cross-sectional area of ​​one condensing refrigerant flow channel is set to be larger, thereby increasing the pressure drop of the refrigerant flowing in the one condensing refrigerant flow channel.

[0013] In one implementation, the cross-sectional area of ​​the other evaporative refrigerant flow channel is larger than that of the one evaporative refrigerant flow channel.

[0014] Since the liquid refrigerant flowing in the other evaporative refrigerant flow channel is less than the liquid refrigerant flowing in the one evaporative refrigerant flow channel, the flow resistance of the refrigerant flowing in the other evaporative refrigerant flow channel is greater than the flow resistance of the refrigerant flowing in the one evaporative refrigerant flow channel. Therefore, relative to the cross-sectional area of ​​one evaporative refrigerant flow channel, the cross-sectional area of ​​the other evaporative refrigerant flow channel is set to be larger, thereby increasing the pressure drop of the refrigerant flowing in the other evaporative refrigerant flow channel.

[0015] In one implementation, the two condensing refrigerant flow channels and the two evaporating refrigerant flow channels are arranged in the same direction as the multiple condensing plate heat exchangers and the multiple evaporating plate heat exchangers. The arrangement direction of the multiple condensing plate heat exchangers is the same as the direction in which each condensing refrigerant flow channel extends. The arrangement direction of the multiple evaporating plate heat exchangers is the same as the direction in which each evaporating refrigerant flow channel extends.

[0016] According to the deployment method of multiple condensing plate changes and multiple evaporating plate changes, the positions of two condensing refrigerant flow channels and two evaporating refrigerant flow channels are deployed. In this way, the deployment of the pipes connected to the two condensing refrigerant flow channels on the multiple condensing plate changes and the pipes connected to the two evaporating refrigerant flow channels on the multiple evaporating plate changes are relatively regular, which simplifies the assembly process between the multiple condensing plate changes and the two condensing refrigerant flow channels and the assembly process between the multiple evaporating plate changes and the two evaporating refrigerant flow channels.

[0017] In one implementation, multiple condenser panels are spaced apart along the second direction, multiple evaporator panels are spaced apart along the second direction, and multiple condenser panels and multiple evaporator panels are spaced apart along the third direction, with the first, second, and third directions being perpendicular to each other. This facilitates assembly of the condenser panels and evaporator panels.

[0018] In one embodiment, the side of the refrigerant base plate facing the condenser plate includes two groups of condensation holes and two groups of evaporation holes, each group of condensation holes includes multiple condensation holes, and each group of evaporation holes includes multiple evaporation holes. Each condensation hole in one group of condensation holes is used to connect a condensation refrigerant flow channel with a condensation refrigerant inlet of a condenser plate, and each condensation hole in the other group of condensation holes is used to connect another condensation refrigerant flow channel with a condensation refrigerant outlet of a condenser plate. Each evaporation hole in one group of evaporation holes is used to connect an evaporation refrigerant flow channel with an evaporation refrigerant inlet of an evaporation plate, and each evaporation hole in the other group of evaporation holes is used to connect another evaporation refrigerant flow channel with an evaporation refrigerant outlet of an evaporation plate.

[0019] The angle between the line connecting two adjacent condensation holes in the two groups of condensation holes and the second direction is α1, 0°≤α1≤45°. This ensures that the refrigerant in each of the two condensation refrigerant flow channels has the shortest flow path and the lowest flow resistance.

[0020] The angle between the line connecting two adjacent condensing holes in the two groups of evaporation holes and the second direction is α2, 0°≤α2≤45°. In this way, the refrigerant flow path in each of the two evaporation refrigerant flow channels can be kept short and the flow resistance low.

[0021] In one implementation, the refrigerant substrate also includes a confluence channel, which is used to connect another condensing refrigerant channel with an evaporating refrigerant channel. The heat exchanger also includes at least one throttling element, each throttling element is distributed in the confluence channel, and each throttling element is used to control the flow rate from the confluence channel into an evaporating refrigerant channel.

[0022] In one implementation, an evaporative refrigerant flow channel includes a plurality of branch flow channels, one end of each branch flow channel is used to connect to the converging flow channel, and the other end of each branch flow channel is used to connect to the evaporative refrigerant inlet of an evaporation plate exchanger.

[0023] By setting the diversion channel on the refrigerant base plate, the diversion problem of multiple evaporation plates can be solved. In addition, the space occupied by the heat exchanger is reduced and the assembly of the heat exchanger is simplified.

[0024] Furthermore, placing the shunt channel on the refrigerant baseplate eliminates the need for sealing between the shunt channel and the refrigerant baseplate, reducing the production cost of the heat exchanger. Furthermore, vibrations in the heat exchanger are not affected by the shunt channel, ensuring the heat exchange performance.

[0025] In one implementation, the refrigerant substrate further includes a diverter flow channel, which is used to connect the converging flow channel with multiple diverter flow channels. The cross-sectional area of ​​the diverter flow channel first decreases and then increases along the direction in which the diverter flow channel and each diverter flow channel are arranged.

[0026] After entering the manifold, the refrigerant contracts slightly, increasing its velocity and decreasing its pressure. It reaches its maximum velocity at the narrowest point of the manifold. It then decelerates and expands, like a nozzle, as it sprays into each manifold. Because the pressure is high, the refrigerant flows quickly, resulting in a more even flow within each manifold.

[0027] In one implementation, the refrigerant substrate further includes a flow guide baffle, which is embedded in the converging flow channel, and a gap is formed at the connection between the flow guide baffle and each diverting flow channel. The flow guide baffle includes a flow guide channel, which is used to connect the converging flow channel and the gap.

[0028] After entering the diversion channel of the diversion baffle, the refrigerant first contracts slightly, increasing its velocity and decreasing its pressure. It reaches its maximum velocity at the junction of the diversion channel outlet and the gap. It then decelerates and expands, spraying into each diversion channel like a nozzle. Because the pressure is relatively high, the refrigerant flows quickly, resulting in a more even flow within each diversion channel.

[0029] In one implementation, the cross-sectional area of ​​each diverter channel is smaller than the cross-sectional area of ​​the converging channel; the lengths of each diverter channel are equal, and the cross-sectional areas of each diverter channel are the same. Alternatively, the length of one diverter channel is smaller than the length of another diverter channel, and the cross-sectional area of ​​one diverter channel is smaller than the cross-sectional area of ​​another diverter channel. This ensures that the pressure drop across each diverter channel is as close as possible to the same.

[0030] In one implementation, the refrigerant substrate further includes at least one cutout, which is distributed in at least one of the following: between two condensing refrigerant flow channels, between two evaporating refrigerant flow channels, between another condensing refrigerant flow channel and an evaporating refrigerant flow channel, and between the inlet and outlet of the throttling element.

[0031] In this way, the cutouts create air barriers, reducing heat transfer from the refrigerant within each refrigerant channel through the refrigerant baseplate, achieving low heat leakage and ensuring high heat transfer performance. Furthermore, by only providing the cutouts between two condensing refrigerant channels and / or two evaporating refrigerant channels, the cutouts are placed only in the baseplate areas that contribute most to heat leakage. This not only simplifies the process but also ensures the structural strength of the refrigerant baseplate.

[0032] In one implementation, the length of the cutout is greater than or equal to the length of each refrigerant flow channel, and the length of the cutout is greater than the width of the throttling element, thereby increasing the thermal insulation effect between the refrigerant flow channels.

[0033] In a second aspect, a thermal management system is provided, which includes a compressor and a heat exchanger as described in any one of the first aspect and the possible implementation methods of the first aspect. The compressor is arranged on the side of the refrigerant substrate away from the condensing plate. The refrigerant substrate includes two side surfaces arranged opposite to each other along a second direction. One of the two side surfaces includes a gas inlet and a gas outlet. The gas inlet is used to connect a condensing refrigerant flow channel with the exhaust port of the compressor, and the gas outlet is used to connect another evaporating refrigerant flow channel with the intake port of the compressor.

[0034] The compressor compresses the low-temperature, low-pressure gaseous refrigerant into a high-temperature, high-pressure gaseous refrigerant, and discharges the high-temperature, high-pressure gaseous refrigerant into a condensing refrigerant flow channel through the gas inlet of the refrigerant base plate. The high-temperature, high-pressure gaseous refrigerant entering a condensing refrigerant flow channel enters each condensing plate through the condensing refrigerant inlet of each condensing plate. After flowing into each condensing plate, the high-temperature, high-pressure gaseous refrigerant releases part of its heat and is converted into a supercooled liquid refrigerant. At the same time, the supercooled liquid flowing out of the condensing refrigerant outlet of each condensing plate flows into another condensing refrigerant flow channel. Furthermore, the supercooled liquid refrigerant in another condensing refrigerant flow channel flows into an evaporating refrigerant flow channel along the confluence channel. The supercooled liquid refrigerant entering an evaporating refrigerant flow channel enters each evaporating plate through the evaporating refrigerant inlet of each evaporating plate. After flowing into each evaporator plate, the supercooled liquid absorbs some heat and is converted into a low-temperature, low-pressure gas-liquid mixed refrigerant. At the same time, the low-temperature, low-pressure gas-liquid mixed refrigerant flowing out of the evaporator refrigerant outlet of each evaporator plate flows into the other evaporator refrigerant flow channel. The gas-liquid mixed refrigerant flowing into the other evaporator refrigerant flow channel flows back into the compressor through the gas outlet of the refrigerant base plate, thus completing the heat exchange cycle.

[0035] Since the thermal management system includes the heat exchanger described in the first aspect, the cooling capacity of the thermal management system can be improved. In addition, the thermal management system has a simple layout and a compact structure, which simplifies the assembly process of the thermal management system.

[0036] In one implementation, the thermal management system also includes a gas-liquid separator, which is arranged on the side of the refrigerant substrate facing away from the condensing plate. The refrigerant substrate includes a gas inlet and a gas outlet. The gas inlet is used to connect another evaporating refrigerant flow channel with the liquid separator, and the gas outlet is used to connect the air intake of the compressor with the liquid separator.

[0037] The gas-liquid mixed refrigerant flowing into another evaporating refrigerant flow channel flows into the gas-liquid separator through the gas separation inlet of the refrigerant base plate. The gas-liquid separator separates the gaseous refrigerant and flows into the compressor again through the gas separation outlet of the refrigerant base plate, thereby completing the heat exchange cycle.

[0038] In a third aspect, an energy storage device is provided, comprising at least one battery cell and a thermal management system as described in any one of the second aspect and possible implementations of the second aspect, wherein the thermal management system is configured to perform heat exchange with each of the battery cells.

[0039] Since the energy storage device includes the heat exchanger described in the first aspect, the space occupied by the energy storage device can be reduced and the assembly process of the energy storage device can be simplified.

[0040] In a fourth aspect, a photovoltaic power generation system is provided, comprising: a photovoltaic panel, a photovoltaic inverter, and an energy storage device as described in the third aspect, wherein the photovoltaic panel is used to convert solar energy into electrical energy, each battery cell is used to store electrical energy from the photovoltaic panel, the photovoltaic inverter is used to convert direct current from the photovoltaic panel into alternating current, and the heat exchanger is also used to perform heat exchange with the photovoltaic inverter.

[0041] Since the photovoltaic power generation system includes the heat exchanger described in the first aspect, the occupied space of the photovoltaic power generation system can be reduced and the assembly process of the photovoltaic power generation system can be simplified.

[0042] In a fifth aspect, an electric vehicle is provided, comprising a powertrain and an energy storage device as described in the third aspect, wherein the energy storage device is used to supply power to the powertrain.

[0043] Since the electric vehicle includes the heat exchanger described in the first aspect, the occupied space of the electric vehicle can be reduced and the assembly process of the electric vehicle can be simplified. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] FIG1 is a schematic diagram of a photovoltaic power generation system provided in an embodiment of the present application.

[0045] FIG2 is a schematic diagram of an electric vehicle provided in an embodiment of the present application.

[0046] FIG3 is a schematic diagram of the three-dimensional structure of a heat exchanger provided in an embodiment of the present application.

[0047] FIG4 is a schematic diagram of the three-dimensional structure of another heat exchanger provided in an embodiment of the present application.

[0048] FIG5 is a schematic diagram of the three-dimensional structure of a condensation plate exchanger provided in an embodiment of the present application.

[0049] FIG6 is a schematic diagram of a three-dimensional structure of an evaporation plate exchanger provided in an embodiment of the present application.

[0050] FIG7 is a schematic diagram of the two-dimensional structure of a substrate in an example of a refrigerant substrate provided in an embodiment of the present application.

[0051] FIG8 is a schematic diagram of the two-dimensional structure of another substrate in an example of a refrigerant substrate provided in an embodiment of the present application.

[0052] FIG9 is a schematic diagram of the two-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.

[0053] FIG10 is a schematic diagram of the two-dimensional structure of another substrate in another example of a refrigerant substrate provided in an embodiment of the present application.

[0054] FIG11 is a schematic diagram of the two-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.

[0055] FIG12 is a schematic diagram of the two-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.

[0056] FIG13 is a schematic diagram of the two-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.

[0057] FIG14 is a schematic diagram of the two-dimensional structure of another substrate in another example of a refrigerant substrate provided in an embodiment of the present application.

[0058] FIG15 is a schematic diagram of the three-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.

[0059] FIG. 16 is an enlarged schematic diagram of portion A of another substrate shown in FIG. 15 .

[0060] FIG17 is a schematic diagram of the three-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.

[0061] FIG. 18 is an enlarged schematic diagram of portion B in another substrate shown in FIG. 17 .

[0062] FIG19 is a schematic diagram of the two-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.

[0063] FIG20 is a schematic diagram of a two-dimensional structure of a refrigerant substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0064] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0065] In the description of the embodiments of the present application, unless otherwise specified, “ / ” means or, for example, A / B can mean A or B; “and / or” in this article is merely a way to describe the association relationship of associated objects, indicating that three relationships can exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0066] In the embodiments of the present application, prefixes such as "first", "second", and "third" are used only to distinguish different description objects, and have no limiting effect on the position, order, priority, quantity or content of the described objects. In the embodiments of the present application, the use of prefixes such as ordinal numbers to distinguish description objects does not constitute a limitation on the described objects. For the statement of the described objects, please refer to the description in the context of the claims or embodiments, and no unnecessary limitations should be constituted due to the use of such prefixes. In addition, in the description of this embodiment, unless otherwise specified, the meaning of "plurality" is two or more.

[0067] The terms "up", "down", "left", "right", "front", "back", "top", "bottom", "inside", "outside", etc. in the embodiments of the present application indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the present application.

[0068] References to "some embodiments" and the like in this specification mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in some embodiments" and the like that appear in different places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0069] The “perpendicular” mentioned in this application is not strictly perpendicular, but within the allowable error range. The “parallel” is not strictly parallel, but within the allowable error range.

[0070] In the embodiments of this application, the same reference numerals represent the same component or part. In the embodiments of this application, for multiple identical parts, only one of the parts may be labeled with a reference numeral in the drawings as an example. The same reference numerals apply to other identical parts or components. In addition, the sizes and dimensions of the parts shown in the drawings are for illustrative purposes only.

[0071] An embodiment of the present application provides a heat exchanger, which includes a refrigerant substrate, multiple condensing plates and multiple evaporating plates, and each condensing plate and each evaporating plate are arranged on the same side of the refrigerant substrate along a first direction. The side of each condensing plate facing the refrigerant substrate includes a condensing refrigerant inlet and a condensing refrigerant outlet, and the side of each evaporating plate facing the refrigerant substrate includes an evaporating refrigerant inlet and an evaporating refrigerant outlet. The refrigerant substrate includes two condensing refrigerant flow channels and two evaporating refrigerant flow channels. Among them, one of the two condensing refrigerant flow channels is used to connect the condensing refrigerant inlet of each condensing plate, and the other condensing refrigerant flow channel is used to connect the condensing refrigerant outlet of each condensing plate, and one of the two evaporating refrigerant flow channels is used to connect the other condensing refrigerant flow channel and the evaporating refrigerant inlet of each evaporating plate, and the other evaporating refrigerant flow channel is used to connect the evaporating refrigerant outlet of each evaporating plate.

[0072] In the heat exchanger provided in the embodiments of the present application, multiple condenser plates and evaporator plates are integrated onto a refrigerant base plate, increasing the heat exchanger's cooling capacity. Furthermore, each condenser plate and each evaporator plate are arranged on the same side of the refrigerant base plate, resulting in a simple and compact heat exchanger layout. Furthermore, reusing this heat exchanger can reduce the space occupied by energy storage power plants in high-cooling scenarios and simplify the assembly process.

[0073] The embodiment of the present application further provides a photovoltaic power generation system. The photovoltaic power generation system provided by the embodiment of the present application is described in detail below in conjunction with FIG1 .

[0074] FIG1 is a schematic diagram of a photovoltaic power generation system provided in an embodiment of the present application. As shown in FIG1 , the photovoltaic power generation system provided in an embodiment of the present application includes one or more photovoltaic modules 1, a photovoltaic inverter 2, a box-type substation 3, a three-phase AC power grid 4, a first DC cable 5, a first AC cable 6, a second AC cable 7, an energy storage device 8, and a second DC cable 9. Among them, one or more photovoltaic modules 1 are connected to the photovoltaic inverter 2 via the first DC cable 5, and the connection relationship between the photovoltaic modules 1 and the photovoltaic inverter 2 can be a many-to-one connection. The energy storage device 8 is connected to the photovoltaic inverter 2 via the second DC cable 5. The photovoltaic inverter 2 converts the DC power output by the photovoltaic module 1 or the energy storage device 8 into AC power, and the AC side of the photovoltaic inverter 2 is connected to the box-type substation 3 via the first AC cable 6. The box-type substation 3 is connected to the three-phase AC power grid 4 via the second AC cable 7. In this way, the AC power output by the photovoltaic inverter 2 flows into the three-phase AC power grid 4 after passing through the box-type substation 3.

[0075] The photovoltaic power generation system is a power generation system that uses the photovoltaic effect of semiconductor materials to convert solar radiation energy into electrical energy. The photovoltaic power generation system provided in the embodiment of the present application can empower electric vehicles. The electric vehicles include pure electric vehicles, hybrid vehicles, extended-range electric vehicles, plug-in hybrid vehicles or new energy vehicles. Among them, pure electric vehicles are also called pure electric vehicle / battery electric vehicle, or simply pure EV / battery EV. Hybrid vehicles are also called hybrid electric vehicles, or simply HEV. Extended-range electric vehicles are also called range extended electric vehicles, or simply REEV. Plug-in hybrid vehicles are also called plug-in hybrid electric vehicles, or simply PHEV. New energy vehicles are also called new energy vehicles, or simply NEV.

[0076] The photovoltaic module 1, also known as a photovoltaic array, comprises multiple photovoltaic strings. Photovoltaic, or simply PV, is also referred to as a string. Each photovoltaic string consists of multiple photovoltaic panels connected in series. Photovoltaic panels convert sunlight into electrical energy. The electricity generated by photovoltaic panels is DC power. The voltage across a photovoltaic string is equal to the sum of the voltages generated by the multiple photovoltaic panels. The output power of a photovoltaic module can be expressed as the amount of electrical energy output per unit time.

[0077] In a photovoltaic power generation system, the area of ​​each photovoltaic module 1 is generally fixed. When the light intensity remains constant, the larger the angle between the light incident on the photovoltaic module 1 and the plane on which the photovoltaic module 1 is located, that is, the smaller the angle of incidence of the light on the photovoltaic module 1, the more electrical energy the photovoltaic module 1 outputs. When the light incident on the photovoltaic module 1 is perpendicular to the photovoltaic module 1, that is, the angle between the light and the plane on which the photovoltaic module 1 is located is 90°, reaching its maximum value, the photovoltaic module 1 outputs the maximum power.

[0078] Each photovoltaic inverter 2 is used to convert input DC into AC, that is, to perform DC-AC conversion. The photovoltaic inverter 2 can also be called a DC-AC converter.

[0079] The box-type substation 3, also known as box-type transformer 3, is a compact power distribution device that integrates high-voltage switchgear, distribution transformers, and low-voltage distribution equipment according to a specific wiring scheme. For example, box-type transformer 3 integrates low-voltage cabinets, transformers, ring main units, auxiliary power supplies, and other equipment into a container, providing a highly integrated power distribution solution for medium-voltage grid-connected photovoltaic power plants.

[0080] The energy storage device 8 includes a thermal management system 80 and at least one battery cell 81 . The thermal management system 80 is configured to perform heat exchange with each battery cell 81 .

[0081] When the photovoltaic power generation system includes multiple photovoltaic modules 1 , the photovoltaic power generation system also includes a combiner box, which is used to combine the direct current generated by the multiple photovoltaic modules 1 and input the combined output into the photovoltaic inverter 2 .

[0082] The embodiment of the present application also provides an electric vehicle, which will be described in detail below with reference to FIG2 .

[0083] Figure 2 is a schematic diagram of an electric vehicle provided in an embodiment of the present application. As shown in Figure 2, the electric vehicle provided in an embodiment of the present application includes an energy storage device 10, wheels 20, and one or more powertrains 30. The powertrain 30 is configured to receive power from the energy storage device 10 and drive the wheels 20, thereby converting electrical energy into mechanical energy.

[0084] The energy storage device 10 includes a thermal management system 11 and at least one battery cell 12. The thermal management system 80 is used to perform heat exchange with each battery cell 12. The powertrain 30 includes a motor controller 31, a motor 32, and a reducer 33. The energy storage device 10 is connected to the motor controller 31 of the powertrain 30. The motor controller 31 receives DC power transmitted by the battery cell 12 through a DC input interface. The motor controller 31 converts the DC power into AC power and transmits it to the terminal of the motor 32 winding through an AC output interface to control the start or stop, forward or reverse rotation, speed increase or decrease, increase or decrease of driving torque, increase or decrease of braking torque, etc. of the motor 32. The output end of the motor shaft transmits power to the wheels 20 of the electric vehicle through the reducer 33 to provide power for the wheels 20.

[0085] The thermal management system 80 shown in Figure 1 or the thermal management system 11 shown in Figure 2 both include a heat exchanger. The specific structure of the heat exchanger provided in the embodiment of the present application will be described in detail below with reference to Figures 3 to 20 .

[0086] As shown in Figures 3 and 4, heat exchanger 100 includes at least one condenser plate 110, at least one evaporator plate 120, and a refrigerant base plate 130. Each condenser plate 110 and each evaporator plate 120 are arranged on the same side of the refrigerant base plate along a first direction. In embodiments where heat exchanger 100 includes multiple condenser plates 110 and multiple evaporator plates 120, the high integration of the heat exchange plates (condenser plates 110 and evaporator plates 120) enables heat exchanger 100 to achieve a high heat transfer capacity.

[0087] Each condensation plate 110 includes a plurality of condensation substrates, which are spaced apart along the thickness direction of the condensation substrate. As shown in FIG5 , the side surface 111 of each condensation plate 110 includes a condensation refrigerant inlet A. 11 and condensing refrigerant outlet A 12 , condensing refrigerant inlet A 11 and condensing refrigerant outlet A 12 In some embodiments, in order to facilitate the condensation refrigerant inlet A of each condensation plate 110, 11 , condensing refrigerant outlet A 12 Connected to the condensing refrigerant flow channel on the refrigerant substrate 130, the condensing refrigerant inlet A 11 and condensing refrigerant outlet A 12 Aligned along the second direction, i.e., condensed refrigerant inlet A 11 and condensing refrigerant outlet A 12In some embodiments, to prevent heat transfer between the refrigerant substrate 130 and each condenser plate 110, a gap is provided between the side surface 111 of each condenser plate 110 and the side surface of the refrigerant substrate 130 facing the condenser plate 110. For example, the gap may be 1 mm to 10 mm.

[0088] Each evaporation plate 120 includes a plurality of evaporation substrates, which are spaced apart along the thickness direction of the evaporation substrate. As shown in FIG6 , the side surface 121 of each evaporation plate 120 includes an evaporation refrigerant inlet A. 21 and evaporative refrigerant outlet A 22 , evaporative refrigerant inlet A 21 and evaporative refrigerant outlet A 22 In some embodiments, in order to facilitate the evaporation refrigerant inlet A of each evaporation plate 120, 21 , Evaporative refrigerant outlet A 22 Connected to the evaporative refrigerant flow channel on the refrigerant substrate 130, the evaporative refrigerant inlet A 21 and evaporative refrigerant outlet A 22 Aligned along the second direction, i.e., evaporative refrigerant inlet A 21 and evaporative refrigerant outlet A 22 In some embodiments, to prevent heat transfer between the refrigerant substrate 130 and each evaporation plate 120, a gap is provided between the side surface 111 of each condensation plate 110 and the side surface of the refrigerant substrate 130 facing the condensation plate 110. For example, the gap may be 1 mm to 10 mm.

[0089] As shown in FIG7, FIG9, FIG11 to FIG13, the side of the refrigerant substrate 130 facing the condensation plate 110 includes two sets of condensation holes E. 11 -E 12 and two sets of evaporation holes E 21 -E 22 The interior of the refrigerant substrate 130 includes two condensing refrigerant flow channels L1-L2, two evaporating refrigerant flow channels L3-L4 and a converging flow channel H. In the first direction, each condensing hole E in a group of condensing holes 11 Overlapping with the projection of a condensing refrigerant flow channel L1, each condensing hole E in another group of condensing holes 12 Overlapping with the projection of another condensing refrigerant flow channel L2, each evaporation hole E in a group of evaporation holes 21 Overlapping with the projection of one evaporating refrigerant flow channel L3, each evaporating hole E in another group of evaporating holes 22 Overlaps with the projection of another evaporative refrigerant flow channel L4.

[0090] Each group of condensation holes includes at least one condensation hole, and each condensation hole E in a group of condensation holes 11For connecting a condensing refrigerant flow channel L1 with a condensing refrigerant inlet A of a condensing plate exchanger 110 11 , each condensation hole E in the other set of condensation holes 12 Used to connect another condensing refrigerant flow channel L2 with a condensing refrigerant outlet A of a condensing plate exchanger 110 12 In this way, a plurality of condensing plates 110 are connected in parallel to each condensing refrigerant flow channel.

[0091] Each group of evaporation holes includes at least one evaporation hole, and each evaporation hole E in a group of evaporation holes 21 For connecting an evaporative refrigerant flow channel L3 with an evaporative refrigerant inlet A of an evaporation plate exchanger 120 21 , each evaporation hole E in the other group of evaporation holes 22 For connecting another evaporative refrigerant flow channel L4 with an evaporative refrigerant outlet A of an evaporation plate exchanger 120 22 In this way, a plurality of evaporation plates 120 are connected in parallel to each evaporation refrigerant flow channel.

[0092] The confluence flow channel H is used to connect another condensing refrigerant flow channel L2 with an evaporating refrigerant flow channel L3. In this way, the refrigerant in a condensing refrigerant flow channel L1 can flow along the condensing refrigerant inlet A of each condensing plate 110. 11 Flows into each condensation plate exchange 110 and flows along the condensation refrigerant outlet A of each condensation plate exchange 110 12 Flows into another condensing refrigerant flow channel L2. The refrigerant flows along the confluence flow channel H connected to the other condensing refrigerant flow channel L2 into an evaporating refrigerant flow channel L3. The refrigerant in an evaporating refrigerant flow channel L3 can flow along the evaporating refrigerant inlet A of each evaporation plate 120. 21 Flows into each evaporation plate exchange 120 and flows along the evaporation refrigerant outlet A of each evaporation plate exchange 120 22 Flows into another evaporative refrigerant flow channel L4.

[0093] The number of condensation holes in each group is equal to the number of condensation plates 110. The number of evaporation holes in each group is equal to the number of evaporation plates 120. Figures 3 to 18 illustrate a heat exchanger 100 including three condensation plates 110 and three evaporation plates 120, which should not be construed as limiting the present application.

[0094] In some embodiments, as shown in FIG3 , the plurality of condensation panels 110 and the plurality of evaporation panels 120 are spaced apart along the third direction. In other words, the plurality of condensation panels 110 are located on the left side, and the plurality of evaporation panels 120 are located on the right side. Furthermore, the plurality of condensation panels 110 are spaced apart along the second direction, and the plurality of evaporation panels 120 are spaced apart along the second direction. In other embodiments, as shown in FIG4 , the plurality of condensation panels 110 and the plurality of evaporation panels 120 are spaced apart along the second direction. In other words, the plurality of condensation panels 110 are located at the top, and the plurality of evaporation panels 120 are located at the bottom, or the plurality of condensation panels 110 are located at the bottom, and the plurality of evaporation panels 120 are located at the top. Thus, based on the arrangement of multiple condenser panels 110 and multiple evaporator panels 120, the condensing refrigerant flow channels on the refrigerant base plate 130 connected to each condenser panel 110 are arranged on the same side, while the evaporating refrigerant flow channels on the refrigerant base plate 130 connected to each evaporator panel 120 are arranged on the other side. This facilitates the assembly of the condenser panels 110 and evaporator panels 120, as well as the design of the refrigerant flow channels. Furthermore, the embodiment in which multiple condenser panels 110 are positioned above and multiple evaporator panels 120 are positioned below helps reduce the pressure drop of the gas-liquid two-phase refrigerant due to gravity, thereby improving the performance of the heat exchanger 100.

[0095] It should be noted that the first direction involved in the embodiments of the present application can be understood as: the front-to-back direction of the heat exchanger 100, the thickness direction of the condenser substrate, the thickness direction of the evaporation substrate, or the thickness direction of the refrigerant substrate 130. The second direction can be understood as the up-down direction of the heat exchanger 100 or the length direction of the refrigerant substrate 130. The third direction can be understood as the left-right direction of the heat exchanger 100 or the width direction of the refrigerant substrate 130.

[0096] Furthermore, the refrigerant in this application can also be called a refrigerant, coolant, or refrigerant. It is the medium used to complete energy conversion in various heat engines. These substances usually increase power through reversible phase changes (such as gas-liquid phase change).

[0097] In the present application, the refrigerant is a working fluid used to transfer heat energy and produce a freezing effect. In other words, the refrigerant can transfer heat through evaporation and condensation. The refrigerant can be a substance that easily absorbs heat to become a gas and easily releases heat to become a liquid. For example, the refrigerant is an intermediate substance in the refrigeration process. It first receives the coldness of the refrigerant and cools down, and then cools other cooled substances. As an example and not a limitation, in the present application, the refrigerant may include ammonia, air, water, brine, chlorofluorocarbons (or chlorofluorocarbons), etc. In the present application, the gaseous refrigerant releases heat to become a liquid when under pressure, and absorbs heat when the high-pressure liquid is decompressed to become a gas.

[0098] The positional relationship between one condensing refrigerant flow channel L1, another condensing refrigerant flow channel L2, one evaporating refrigerant flow channel L3, and another evaporating refrigerant flow channel L4 is related to the positional relationship between the condensing plate exchanger 110 and the evaporating plate exchanger 120. This allows for a more regular arrangement of the pipes on the multiple condensing plate exchangers 110 that connect to the two condensing refrigerant flow channels L1-L2, and the pipes on the multiple evaporating plate exchangers 120 that connect to the two evaporating refrigerant flow channels L3-L4. This simplifies the assembly process between the multiple condensing plate exchangers 110 and the two condensing refrigerant flow channels L1-L2, and between the multiple evaporating plate exchangers 110 and the two evaporating refrigerant flow channels L3-L4.

[0099] In one example, as shown in FIG3 , a plurality of condensing plate exchanges 110 and a plurality of evaporating plate exchanges 120 are arranged at intervals along a third direction. As shown in FIG7 , FIG9 , FIG11 , and FIG12 , a condensing refrigerant flow channel L1 , another condensing refrigerant flow channel L2 , an evaporating refrigerant flow channel L3 , and another evaporating refrigerant flow channel L4 are arranged along the third direction.

[0100] In another example, as shown in Figure 4, multiple condensing plate exchanges 110 and multiple evaporating plate exchanges 120 are arranged along the second direction, as shown in Figure 13, one condensing refrigerant flow channel L1, another condensing refrigerant flow channel L2, one evaporating refrigerant flow channel L3, and another evaporating refrigerant flow channel L4 are arranged along the second direction.

[0101] It should be noted that the arrangement of the plurality of condenser panels 110 and the plurality of evaporator panels 120 along the second direction can be understood as: all condenser panels 110 and all evaporator panels 120 of the heat exchanger 100 are arranged along the second direction. If the number of the plurality of condenser panels 110 or the number of the plurality of evaporator panels 120 is an odd number, as shown in FIG4 , a condenser panel 110 and an evaporator panel 120 may be arranged adjacent to each other along the third direction. However, since all condenser panels 110 and all evaporator panels 120 of the heat exchanger 100 are arranged along the second direction, in this example, the plurality of condenser panels 110 and the plurality of evaporator panels 120 can also be understood as being arranged along the second direction.

[0102] The extension direction of one condensing refrigerant flow channel L1, the extension direction of another condensing refrigerant flow channel L2, and the plurality of condensing holes E of a group of condensing holes 11 The arrangement direction of the condensation holes E of another group of condensation holes 12 The arrangement directions are respectively related to the positional relationship of the plurality of condensing plates 110. For example, as shown in FIG3 , the plurality of condensing plates 110 are arranged along the second direction. As shown in FIG7 , FIG9 , FIG11 , and FIG12 , the extension direction of one condensing refrigerant flow channel L1 , the extension direction of another condensing refrigerant flow channel L2 , the arrangement direction of the plurality of condensing holes E11 of one group of condensing holes, and the arrangement direction of the plurality of condensing holes E12 of another group of condensing holes are respectively along the second direction.

[0103] The extending direction of one evaporative refrigerant flow channel L3, the extending direction of another evaporative refrigerant flow channel L4, the plurality of evaporation holes E of a group of evaporation holes 21 The arrangement direction of the evaporation holes E of another group of evaporation holes 22 The arrangement directions are respectively related to the positional relationship of the plurality of evaporation plates 120. For example, as shown in FIG3, the plurality of evaporation plates 120 are arranged along the second direction, as shown in FIG7, FIG9, FIG11, and FIG12, the extension direction of one evaporation refrigerant flow channel L3, the extension direction of another evaporation refrigerant flow channel L4, the plurality of evaporation holes E of a group of evaporation holes 21 The arrangement direction of the evaporation holes E of another group of evaporation holes 22 The arrangement directions are respectively along the second direction.

[0104] It should be noted that, as shown in FIG7, FIG9, FIG11 to FIG13, a condensing refrigerant flow channel L1 is used to connect multiple condensing holes E of a group of condensing holes. 11 As an example, another condensing refrigerant flow channel L2 is connected to multiple condensing holes E of another group of condensing holes. 12 As an example, an evaporative refrigerant flow channel L3 is connected to a group of evaporation holes and multiple condensation holes E 21 As an example, another evaporative refrigerant flow channel L4 is connected to multiple evaporation holes E of another group of evaporation holes. 22 The shortest path is taken as an example, which should not limit the present application.

[0105] In some embodiments, the angle between the line connecting two adjacent condensation holes in the two groups of condensation holes and the second direction is α1, where 0°≤α1≤45°. This ensures that the refrigerant in each of the two condensation refrigerant flow channels L1-L2 has the shortest flow path and the lowest flow resistance.

[0106] For example, as shown in FIG7 to FIG12, all condensation holes E of two groups of condensation holes 11 -E 12 They are almost located on a straight line along the second direction, that is, the angle between the line connecting two adjacent condensation holes in the two groups of condensation holes and the second direction is approximately 0°.

[0107] In some embodiments, the angle between the line connecting two adjacent condensing holes in the two groups of evaporating holes and the second direction is α2, where 0°≤α2≤45°. This ensures that the refrigerant in each of the two evaporating refrigerant flow channels L3-L4 has the shortest flow path and the lowest flow resistance.

[0108] For example, as shown in FIG7 to FIG12, all evaporation holes E of two groups of evaporation holes 21 -E 22They are almost located on a straight line along the second direction, that is, the angle between the line connecting two adjacent condensation holes in the two groups of evaporation holes and the second direction is approximately 0°.

[0109] It should be noted that the angle between the connecting line and the second direction involved in the embodiments of the present application can be understood as the angle between the connecting line and the second direction in a clockwise direction or a counterclockwise direction.

[0110] In some embodiments, another condensing refrigerant flow channel L2 and an evaporating refrigerant flow channel L3 are respectively distributed between one condensing refrigerant flow channel L1 and another evaporating refrigerant flow channel L4. In this way, the one condensing refrigerant flow channel L1 and the other evaporating refrigerant flow channel L4, which transmit high-temperature and high-pressure refrigerant, are arranged on the edge of the condensing substrate 130, reducing heat loss from the refrigerant in the other condensing refrigerant flow channel L2 and the refrigerant in the one evaporating refrigerant flow channel L3.

[0111] In some embodiments, the cross-sectional areas of the two evaporating refrigerant flow channels are respectively larger than the cross-sectional areas of the two condensing refrigerant flow channels. Since the refrigerant flowing in the condensing refrigerant flow channels is mostly liquid, while the refrigerant flowing in the evaporating refrigerant flow channels is mostly gaseous, and the flow resistance of liquid refrigerant is smaller than that of gaseous refrigerant, the cross-sectional area of ​​the evaporating refrigerant flow channels can be set larger than the cross-sectional area of ​​the condensing refrigerant flow channels to increase the pressure drop of the refrigerant flowing in the evaporating refrigerant flow channels.

[0112] In some embodiments, the cross-sectional area of ​​one condensing refrigerant flow channel L1 is larger than the cross-sectional area of ​​the other condensing refrigerant flow channel L2. Because more liquid refrigerant flows in the other condensing refrigerant flow channel L2 than in the one condensing refrigerant flow channel L1, the flow resistance of the refrigerant flowing in the other condensing refrigerant flow channel L2 is smaller than the flow resistance of the refrigerant flowing in the one condensing refrigerant flow channel L1. Therefore, by setting the cross-sectional area of ​​the one condensing refrigerant flow channel L1 larger relative to the cross-sectional area of ​​the other condensing refrigerant flow channel L2, the pressure drop of the refrigerant flowing in the one condensing refrigerant flow channel L1 can be increased.

[0113] In some embodiments, the cross-sectional area of ​​the other evaporative refrigerant flow channel L4 is larger than that of the one evaporative refrigerant flow channel L3. Because the amount of liquid refrigerant flowing in the other evaporative refrigerant flow channel L4 is less than that flowing in the one evaporative refrigerant flow channel L3, the flow resistance of the refrigerant flowing in the other evaporative refrigerant flow channel L4 is greater than the flow resistance of the refrigerant flowing in the one evaporative refrigerant flow channel L3. Therefore, by setting the cross-sectional area of ​​the other evaporative refrigerant flow channel L4 larger relative to the cross-sectional area of ​​the one evaporative refrigerant flow channel L3, the pressure drop of the refrigerant flowing in the other evaporative refrigerant flow channel L4 can be increased.

[0114] It should be noted that the cross section of the flow channel involved in the present application can be understood as a cross section perpendicular to the extension direction of the flow channel.

[0115] In some embodiments, as shown in Figures 7, 9, 11 to 13, the heat exchanger 100 also includes at least one throttling element, each throttling element is distributed in the confluence channel H, and each throttling element is used to control the flow rate flowing from the confluence channel H into an evaporative refrigerant channel L3.

[0116] Exemplarily, the projection of the throttling element along the first direction is arranged between the total projection of the plurality of condensation panels 110 and the total projection of the plurality of evaporation substrates 120 .

[0117] In some embodiments, the throttling element achieves throttling via a device. For example, the throttling element can be a device capable of achieving throttling, such as an electronic expansion valve (EEV) or a thermal expansion valve. In this embodiment, as shown in Figures 7, 9, and 11 to 13, the refrigerant substrate 130 further includes a throttling hole T, into which the throttling element is embedded.

[0118] In some embodiments, the throttling element achieves throttling through structural design. The throttling element is a throttling channel, which is used to connect the converging channel H with an evaporative refrigerant channel L3. The cross-sectional area of ​​each throttling channel at the connection with the converging channel H is equal to the cross-sectional area of ​​each throttling channel at the connection with an evaporative refrigerant channel L3.

[0119] In some embodiments, the cross-sectional area of ​​the middle portion of each throttling channel is smaller than the cross-sectional area of ​​the connection between each throttling channel and the converging channel H, and the cross-sectional area of ​​the connection between each throttling channel and an evaporative refrigerant channel L3.

[0120] In some embodiments, the cross-sectional area of ​​the throttling channel decreases first and then increases along the arrangement direction of the inlet and outlet of the throttling channel. The connection between the throttling channel and the converging channel can be called the inlet of the throttling channel, and the connection between the throttling channel and an evaporative refrigerant channel L3 can be called the outlet of the throttling channel.

[0121] In some embodiments, as shown in Figures 7, 9, and 11 to 13, a cutout G may be provided in at least one of the following locations: between two condensing refrigerant flow channels, between two evaporating refrigerant flow channels, between another condensing refrigerant flow channel and an evaporating refrigerant flow channel, or between the inlet and outlet of the throttling element. In this way, the cutout G forms an air barrier, which can reduce heat transfer from the refrigerant in each refrigerant flow channel through the refrigerant substrate 130, thereby achieving low heat leakage in the heat exchanger 100 and ensuring high heat transfer performance. Furthermore, by providing the cutout G only between the two condensing refrigerant flow channels and / or between the two evaporating refrigerant flow channels, i.e., only in the substrate regions that contribute most to heat leakage, this not only simplifies the process steps but also ensures the structural strength of the refrigerant substrate 130.

[0122] For example, the cutout G may be formed by cutting the refrigerant substrate 130 , and may be a straight line or a curved line.

[0123] In some embodiments, the length of the cutout G is greater than or equal to the length of each refrigerant flow channel, and the length of the cutout G is greater than the width of the throttling element T. In this way, the heat insulation effect between the refrigerant flow channels can be increased.

[0124] Illustratively, the cutout G may be a groove, a gap, or a scratch.

[0125] In some embodiments, the refrigerant base plate 130 further includes thermal insulation material, which is distributed in at least one of the following locations: between two condensing refrigerant flow channels, between two evaporating refrigerant flow channels, between another condensing refrigerant flow channel and one evaporating refrigerant flow channel, or between the inlet and outlet of the throttling element. This insulation reduces heat transfer from the refrigerant in each refrigerant flow channel through the refrigerant base plate 130, thereby minimizing heat leakage from the heat exchanger 100 and ensuring high heat transfer performance.

[0126] This embodiment of the present application also provides a diversion structure, disposed on the refrigerant base plate 130, for diverting the refrigerant from all condenser plates 110 to flow to each evaporator plate 120. Because the diversion structure is directly disposed on the refrigerant base plate 130, it not only reduces the footprint of the heat exchanger 100 and simplifies assembly, but also eliminates the need to consider sealing between the diversion structure and the refrigerant base plate. Furthermore, when the heat exchanger 100 is exposed to vibration, the diversion structure is not affected.

[0127] It should be noted that in the embodiment in which a diversion structure is provided on the refrigerant substrate 130, the one condensing refrigerant flow channel L1, the other condensing refrigerant flow channel L2, the one evaporating refrigerant flow channel L3, and the other evaporating refrigerant flow channel L4 described above may also be provided on the refrigerant substrate 130, and the one condensing refrigerant flow channel L1, the other condensing refrigerant flow channel L2, the one evaporating refrigerant flow channel L3, and the other evaporating refrigerant flow channel L4 described above may also be implemented using external pipelines, which is not limited in this embodiment of the present application.

[0128] The refrigerant base plate 130 includes at least one group of diversion structures, each group of diversion structures includes a plurality of diversion channels, and one end of the converging channel H is used to connect the condensing refrigerant outlet A of each condensing plate exchange 110. 12 The other end of the converging flow channel H is used to connect one end of each branch flow channel of each group of diversion structures, and the other end of each branch flow channel is used to connect the evaporative refrigerant inlet A of an evaporation plate exchanger 120 21 , that is, the number of the branch flow channels is equal to the number of the evaporation plates 120 .

[0129] In one example, the cross-section of the diverter channel is polygonal, such as a square. In another example, the cross-section of the diverter channel is circular, arc-shaped, or elliptical. This reduces the resistance to the refrigerant in the diverter channel and reduces the pressure drop.

[0130] In some embodiments, the flow diversion structure further includes a flow diversion head structure, which can make the refrigerant in each flow diversion channel more uniform.

[0131] As shown in Figures 15, 16, and 19, each group of diversion structures also includes a diverter flow channel D1, which is used to connect the converging flow channel H with multiple diverter flow channels M. The cross-sectional area of ​​the diverter flow channel D1 first decreases and then increases along the direction in which the diverter flow channel D1 and each diverter flow channel M are arranged. In this way, after the refrigerant enters the diverter flow channel D1, it first contracts slightly, increasing its speed and decreasing its pressure. When it reaches the narrowest point of the diverter flow channel D1, it reaches its maximum speed, then decelerates and expands its pressure. Like a nozzle, the refrigerant is sprayed into each diverter flow channel D1. Because the pressure is relatively high and the refrigerant flow rate is relatively fast, the refrigerant flowing into each diverter flow channel will be relatively uniform.

[0132] In some embodiments, the cross-sectional area of ​​each diversion channel M is smaller than the cross-sectional area of ​​the diversion head channel D1 .

[0133] In some embodiments, the angle between the axial direction of the flow channel D1 and the second direction is θ1, 0°≤θ1≤30°. In this way, when the heat exchanger 100 is placed along the second direction, uneven flow distribution caused by gravity can be avoided.

[0134] It should be understood that the axial direction of the diverter flow channel D1 can be understood as the extending direction of the diverter flow channel.

[0135] It should be noted that the angle between the axial direction and the second direction involved in the embodiments of the present application can be understood as the angle between the axial direction and the second direction in a clockwise direction or a counterclockwise direction.

[0136] As shown in Figures 17 and 18, each group of diversion structures also includes a guide baffle D2, which is used to be embedded in the converging flow channel H. The connection between the guide baffle D2 and each diversion flow channel has a gap B. Among them, the guide baffle D2 includes a guide flow channel d, which is used to connect the converging flow channel H and the gap B. In this way, after the refrigerant enters the guide flow channel d of the guide baffle D2, it will first shrink slightly, the speed will increase, and the pressure will decrease. When it reaches the intersection of the outlet of the guide flow channel d and the gap B, it will reach the maximum speed, and then slow down and expand. Like a nozzle, the refrigerant is sprayed into each diversion flow channel. Because the pressure is relatively high and the refrigerant flow rate is relatively fast, the refrigerant flowing into each diversion flow channel is relatively uniform.

[0137] Illustratively, the diversion channel d may be a through hole penetrating the diversion baffle D2 along the extending direction of the converging channel H. Illustratively, the cross-sectional area of ​​the through hole may be in any shape such as circular, elliptical, or square.

[0138] In some embodiments, the distance between the guide baffle D2 and the end of the converging flow channel H facing away from the guide baffle D2 is greater than the gap. That is, the guide baffle D2 is disposed close to each diverting flow channel M.

[0139] In some embodiments, the angle between the axial direction of the flow guide channel d and the second direction is θ2, 0°≤θ2≤30°. In this way, when the heat exchanger 100 is placed along the second direction, uneven flow distribution caused by gravity can be avoided.

[0140] In some embodiments, the cross-sectional area of ​​each branch flow channel is smaller than the cross-sectional area of ​​the converging flow channel and the cross-sectional area of ​​each refrigerant flow channel.

[0141] In one example, the lengths of each diversion channel are approximately equal, and the cross-sectional areas of each diversion channel are approximately the same. In another example, the lengths of each diversion channel and the cross-sectional areas of each diversion channel are approximately positively correlated. For example, the length of one diversion channel is smaller than the length of another diversion channel, and the cross-sectional area of ​​one diversion channel is smaller than the cross-sectional area of ​​another diversion channel. This ensures that the pressure drops of each diversion channel are as close as possible to the same.

[0142] In some embodiments, the angle between the axial direction of the flow diversion channel and the second direction is θ3, 0°≤θ3≤30°. In this way, when the heat exchanger 100 is placed along the second direction, uneven flow diversion caused by gravity can be avoided.

[0143] In some embodiments, the refrigerant base plate 130 includes two side surfaces arranged opposite to each other along the second direction, and the junction between each diverter channel and the converging channel is equidistant from one of the two side surfaces. That is, the junction between each diverter channel M and the converging channel H is aligned along the third direction. This allows the refrigerant from the converging channel H to reach each diverter channel at approximately the same time, resulting in a relatively uniform distribution of the refrigerant within each diverter channel.

[0144] In some embodiments, the heat exchanger 100 includes the same number of condensing plates 110 as the number of evaporating plates 120 .

[0145] The thermal management system also includes a compressor, which is used to provide heat exchange power for the heat exchanger 100. The compressor is arranged on the side of the refrigerant base plate 130 facing away from the condenser plate 110. As shown in Figures 7, 9, 11 to 13, 15, and 17, the refrigerant base plate 130 includes two side surfaces arranged opposite to each other along the second direction. One of the two side surfaces includes a gas inlet C1 and a gas outlet C2. The gas inlet C1 is used to connect a condensing refrigerant flow channel L1 to the exhaust port of the compressor, and the gas outlet C2 is used to connect another evaporating refrigerant flow channel L4 to the intake port of the compressor.

[0146] As shown in Figures 7, 9, and 11 to 13, the refrigerant substrate 130 also includes a first gas flow channel L5 and a second gas flow channel L6. The first gas flow channel L5 is used to communicate with the gas outlet C2, and the second gas channel L6 is used to communicate with the gas inlet C1 of the compressor 140 and the first refrigerant flow channel L1, respectively. In this way, the compressor can draw low-temperature, low-pressure gaseous refrigerant from each evaporator 120 from the first gas flow channel L5 through the gas outlet C2 of the refrigerant substrate 130, compress the low-temperature, low-pressure gaseous refrigerant into high-temperature, high-pressure gaseous refrigerant, and discharge the high-temperature, high-pressure gaseous refrigerant into the second gas flow channel L6 through the gas inlet C1 of the refrigerant substrate 130, and then flow into the first refrigerant flow channel L1.

[0147] In some embodiments, as shown in FIG6 , a pressure-temperature sensor S is further provided on one side of the gas inlet C1 of the first gas flow channel L5 close to the refrigerant substrate 130 . The pressure-temperature sensor S is used to monitor the pressure and temperature of the high-temperature and high-pressure gaseous refrigerant discharged from the compressor in real time.

[0148] In some embodiments, as shown in Figure 6, a high-pressure switch K is also provided in the first gas flow channel L5. The high-pressure switch K is used to block the high-temperature and high-pressure gas in the first gas flow channel L5 from flowing into a condensing refrigerant flow channel L1 when the pressure of the high-temperature and high-pressure gaseous refrigerant in the first gas flow channel L5 is greater than a threshold value.

[0149] In some embodiments, the thermal management system further comprises a gas-liquid separator, and the compressor is arranged on the side of the refrigerant base plate 130 away from the condenser plate 110. As shown in Figures 7, 9, 11 to 13, 15, and 17, the refrigerant base plate 130 includes a gas separation inlet E s1 Gas separation outlet E s2 , gas separation inlet E s1 Used to connect another evaporative refrigerant flow channel L4 with the liquid separator, gas separation outlet E s2 It is used to connect the air inlet of the compressor with the liquid separator. In this way, the gas-liquid separator can separate the refrigerant in the gas and liquid states flowing out of the evaporation plate 120 and send the gaseous refrigerant into the compressor.

[0150] As shown in FIG6 , the third refrigerant flow channel L3 includes a confluence hole H and at least one group of diversion structures. One end of the confluence hole H is used to connect to the condensing refrigerant outlet A of each condensing plate exchanger 110. 12 Each group of flow distribution structures includes a guide hole D and multiple diversion holes M. Each group of flow distribution structures includes a guide hole D and multiple diversion holes M. In each group of flow distribution structures:

[0151] One end of the guide hole D is used to connect to the other end of the confluence hole H, and the other end of the guide hole D is used to connect to one end of each diversion hole M, and the other end of each diversion hole M is used to connect to the evaporative refrigerant inlet A of an evaporation plate exchanger 120 21 .

[0152] In some embodiments, the refrigerant substrate 130 includes two substrates, one substrate 131 being arranged on a side of the other substrate 132 facing away from the evaporator plate 110. For example, the refrigerant substrate 130 includes one substrate 131 shown in FIG7 and another substrate 132 shown in FIG8. For another example, the refrigerant substrate 130 includes one substrate 131 shown in FIG9 and another substrate 132 shown in FIG10. For another example, the refrigerant substrate 130 includes one substrate 131 shown in FIG13 and another substrate 132 shown in FIG4.

[0153] Next, the two groups of condensation holes E on the refrigerant substrate 130 are 11 -E 12 , two sets of evaporation holes E 21 -E 22 , the formation of two condensing refrigerant flow channels L1-L2, two evaporating refrigerant flow channels L3-L4 and the converging flow channel H will be explained.

[0154] ① The refrigerant flow channel is distributed on one of the two substrates 131. Thus, the refrigerant flow channel only needs to be processed on one substrate 131, and the two substrates are welded and assembled into a refrigerant substrate, thereby simplifying the processing technology of the refrigerant substrate.

[0155] For example, a groove corresponding to the condensing refrigerant flow channel L1, a groove corresponding to another condensing refrigerant flow channel L2, a groove corresponding to another evaporating refrigerant flow channel L4, a groove corresponding to the first gas flow channel L5, a groove corresponding to the second gas flow channel L6, and a groove corresponding to the confluence flow channel H are respectively processed on the side surface of one substrate 131 facing the other substrate 132. In this way, after the two substrates are welded and assembled into a refrigerant substrate, a groove corresponding to a condensing refrigerant flow channel L1 on one substrate 131 and the side of the other substrate 132 facing one substrate 131 form a condensing refrigerant flow channel L1, a groove corresponding to another condensing refrigerant flow channel L2 and the side of the other substrate 132 facing one substrate 131 form another condensing refrigerant flow channel L2, a groove corresponding to another evaporating refrigerant flow channel L4 and the side of the other substrate 132 facing one substrate 131 form another evaporating refrigerant flow channel L4, a groove corresponding to the first gas flow channel L5 and the side of the other substrate 132 facing one substrate 131 form a first gas flow channel L5, a groove corresponding to the second gas flow channel L6 and the side of the other substrate 132 facing one substrate 131 form a second gas flow channel L6, and a groove corresponding to the confluence flow channel H and the side of the other substrate 132 facing one substrate 131 form a confluence flow channel H.

[0156] In addition, each condensation hole penetrating along the thickness direction of the other substrate 132 is processed on the other substrate 132, and each condensation hole corresponding to each condensation hole on the other substrate 132 is processed on the one substrate 131.

[0157] In an embodiment where the refrigerant substrate includes at least one set of diversion structures, a plurality of diversion holes are processed on the groove wall of the converging groove to serve as diversion channels.

[0158] ② The refrigerant flow channels are distributed on the two base plates. Thus, a portion of the refrigerant flow channels is processed on the two base plates at the same time, and the two base plates are welded and assembled into a refrigerant base plate, thereby shortening the processing time of the refrigerant base plate.

[0159] For example, a groove corresponding to a portion of the condensing refrigerant flow channel L1, a groove corresponding to a portion of another condensing refrigerant flow channel L2, a groove corresponding to a portion of another evaporating refrigerant flow channel L4, a groove corresponding to a portion of the first gas flow channel L5, a groove corresponding to a portion of the second gas flow channel L6, and a groove corresponding to a portion of the confluence flow channel H are respectively processed on the side of one substrate 131 facing the other substrate 132, and a groove corresponding to the remaining portion of the condensing refrigerant flow channel L1, a groove corresponding to the remaining portion of another condensing refrigerant flow channel L2, a groove corresponding to the remaining portion of another evaporating refrigerant flow channel L4, a groove corresponding to the remaining portion of the first gas flow channel L5, a groove corresponding to the remaining portion of the second gas flow channel L6, and a groove corresponding to the remaining portion of the confluence flow channel H are respectively processed on the side of the other substrate 132 facing the one substrate 131. In addition, along the arrangement direction of the two substrates, the projection of the groove corresponding to a portion of a condensing refrigerant flow channel L1 on one substrate 131 overlaps with the projection of the groove corresponding to the remaining portion of a condensing refrigerant flow channel L1 on the other substrate 132, the projection of the groove corresponding to a portion of another condensing refrigerant flow channel L2 on one substrate 131 overlaps with the projection of the groove corresponding to the remaining portion of another condensing refrigerant flow channel L2 on the other substrate 132, and the projection of the groove corresponding to a portion of another evaporative refrigerant flow channel L4 on one substrate 131 overlaps with the projection of the groove corresponding to the remaining portion of another evaporative refrigerant flow channel L5 on the other substrate 132. 4, the projection of the groove corresponding to a portion of the first gas flow channel L5 on one substrate 131 overlaps with the projection of the groove corresponding to the remaining portion of the first gas flow channel L5 on the other substrate 132, the projection of the groove corresponding to a portion of the second gas flow channel L6 on one substrate 131 overlaps with the projection of the groove corresponding to the remaining portion of the second gas flow channel L6 on the other substrate 132, and the projection of the groove corresponding to a portion of the confluence channel H on one substrate 131 overlaps with the projection of the groove corresponding to the remaining portion of the confluence channel H on the other substrate 132.

[0160] Thus, after the two base plates are welded and assembled into a refrigerant base plate, the groove corresponding to a portion of a condensing refrigerant flow channel L1 on one base plate 131 engages with the groove corresponding to the remaining portion of a condensing refrigerant flow channel L1 on the other base plate 132 to form a condensing refrigerant flow channel L1. The groove corresponding to a portion of another condensing refrigerant flow channel L2 on one base plate 131 engages with the groove corresponding to the remaining portion of another condensing refrigerant flow channel L2 on the other base plate 132 to form another condensing refrigerant flow channel L2. The groove corresponding to a portion of another evaporative refrigerant flow channel L4 on one base plate 131 engages with the groove corresponding to the remaining portion of another evaporative refrigerant flow channel L4 on the other base plate 132 to form another evaporative refrigerant flow channel L4. The groove corresponding to a portion of the first gas flow channel L5 on one base plate 131 engages with the groove corresponding to the remaining portion of the first gas flow channel L5 on the other base plate 132 to form the first gas flow channel L5. The second gas flow channel L6 is formed by engaging a portion of the groove corresponding to the second gas flow channel L6 on one substrate 131 with a remaining groove corresponding to the second gas flow channel L6 on another substrate 132. The confluence flow channel H is formed by engaging a portion of the groove corresponding to the confluence flow channel H on one substrate 131 with a remaining groove corresponding to the confluence flow channel H on another substrate 132.

[0161] In addition, each condensation hole penetrating along the thickness direction of the other substrate 132 is processed on the other substrate 132, and each condensation hole corresponding to each condensation hole on the other substrate 132 is processed on the one substrate 131.

[0162] In an embodiment where the refrigerant substrate includes at least one set of diversion structures, a plurality of diversion holes are processed on the groove wall of the converging groove to serve as diversion channels.

[0163] In some embodiments, in which the cross-section of each flow channel is circular, arc-shaped, or elliptical, and each flow channel is distributed in the form of grooves on one substrate 131, as shown in FIG20 , the dimension Δh of each flow channel along the first direction is less than or equal to the maximum dimension H of each refrigerant flow channel. In this way, each branch flow channel formed after the two substrates are covered is ensured to be closed.

[0164] The compressor compresses the low-temperature, low-pressure gaseous refrigerant into a high-temperature, high-pressure gaseous refrigerant, and discharges the high-temperature, high-pressure gaseous refrigerant into the second gas flow channel L6 through the gas inlet C1 of the refrigerant base plate 130, and then flows into a condensing refrigerant flow channel L1. The high-temperature, high-pressure gaseous refrigerant entering a condensing refrigerant flow channel L1 passes through the condensing refrigerant inlet A of each condensing plate 110. 11 After entering each condensation plate exchange 110, the high-temperature and high-pressure gaseous refrigerant releases part of its heat and is converted into supercooled liquid refrigerant. At the same time, the condensed refrigerant outlet A of each condensation plate exchange 11021 The outflowing supercooled liquid flows into another condensing refrigerant flow channel L2. Then, the supercooled liquid refrigerant in the other condensing refrigerant flow channel L2 flows along the confluence channel H into an evaporating refrigerant flow channel L3. The supercooled liquid refrigerant entering the evaporating refrigerant flow channel L3 passes through the evaporating refrigerant inlet A of each evaporation plate 120. 21 The supercooled liquid refrigerant enters each evaporation plate exchanger 120; or the supercooled liquid refrigerant in another condensation refrigerant flow channel L2 is diverted into each diversion flow channel through the diversion structure in the converging channel H, and then flows into each evaporation plate exchanger 120 through each diversion flow channel. After flowing into each evaporation plate exchanger 120, the supercooled liquid absorbs part of the heat and is converted into a low-temperature and low-pressure gas-liquid mixed refrigerant. At the same time, the evaporation refrigerant outlet A of each evaporation plate exchanger 120 22 The outflowing low-temperature and low-pressure gas-liquid mixed refrigerant flows into another evaporative refrigerant flow channel L4. In an embodiment without a gas-liquid separator, the gas-liquid mixed refrigerant flowing into another evaporative refrigerant flow channel L4 flows into the compressor again through the gas outlet C2 of the refrigerant base plate 130, thereby completing the heat exchange cycle. In an embodiment with a gas-liquid separator, the gas-liquid mixed refrigerant flowing into another evaporative refrigerant flow channel L4 flows through the gas separation inlet E2 of the refrigerant base plate 130. s1 The gas-liquid separator separates the gaseous refrigerant and passes through the gas separation outlet E of the refrigerant substrate 130. s2 The gas flows into the first gas flow channel L5 and then flows into the compressor again through the gas inlet C1 connected to the first gas flow channel L5, thereby completing the heat exchange cycle.

[0165] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A heat exchanger, characterized in that: The heat exchanger includes a refrigerant substrate, a plurality of condensing plates and a plurality of evaporating plates, each of the condensing plates and each of the evaporating plates are arranged on the same side of the refrigerant substrate along a first direction, each of the condensing plates includes a condensing refrigerant inlet and a condensing refrigerant outlet on the side facing the refrigerant substrate, each of the evaporating plates includes an evaporating refrigerant inlet and an evaporating refrigerant outlet on the side facing the refrigerant substrate, and the refrigerant substrate includes two condensing refrigerant flow channels and two evaporating refrigerant flow channels, wherein: One of the two condensing refrigerant flow channels is used to connect the condensing refrigerant inlet of each of the condensing plate exchangers, and the other condensing refrigerant flow channel is used to connect the condensing refrigerant outlet of each of the condensing plate exchangers. One of the two evaporative refrigerant flow channels is used to connect the other condensing refrigerant flow channel and the evaporative refrigerant inlet of each evaporative plate exchanger, and the other evaporative refrigerant flow channel is used to connect the evaporative refrigerant outlet of each evaporative plate exchanger.

2. The heat exchanger according to claim 1, characterized in that: The other condensing refrigerant flow channel and the one evaporating refrigerant flow channel are respectively distributed between the one condensing refrigerant flow channel and the other evaporating refrigerant flow channel; The cross-sectional areas of the two evaporating refrigerant flow channels are respectively larger than the cross-sectional areas of the two condensing refrigerant flow channels; The cross-sectional area of ​​the one condensing refrigerant flow channel is greater than the cross-sectional area of ​​the other condensing refrigerant flow channel; The cross-sectional area of ​​the other evaporative refrigerant flow channel is larger than that of the one evaporative refrigerant flow channel.

3. The heat exchanger according to claim 1 or 2, characterized in that: The arrangement direction of the two condensing refrigerant flow channels and the two evaporating refrigerant flow channels is the same as the arrangement direction of the multiple condensing plate exchangers and the multiple evaporating plate exchangers; The arrangement direction of the plurality of condensing plates is the same as the extension direction of each of the condensing refrigerant flow channels; The arrangement direction of the plurality of evaporation plates is the same as the extension direction of each of the evaporative refrigerant flow channels.

4. The heat exchanger according to any one of claims 1 to 3, characterized in that: The plurality of condensation panels are arranged at intervals along the second direction, the plurality of evaporation panels are arranged at intervals along the second direction, the plurality of condensation panels and the plurality of evaporation panels are arranged at intervals along the third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

5. The heat exchanger according to any one of claims 1 to 4, characterized in that: The side of the refrigerant substrate facing the condensation plate exchanger includes two groups of condensation holes and two groups of evaporation holes, each group of condensation holes includes a plurality of condensation holes, each group of evaporation holes includes a plurality of evaporation holes, each of the condensation holes in one group of condensation holes is used to connect the one condensation refrigerant flow channel with the condensation refrigerant inlet of the condensation plate exchanger, each of the condensation holes in the other group of condensation holes is used to connect the other condensation refrigerant flow channel with the condensation refrigerant outlet of the condensation plate exchanger, each of the evaporation holes in one group of evaporation holes is used to connect the one evaporation refrigerant flow channel with the evaporation refrigerant inlet of the evaporation plate exchanger, each of the evaporation holes in the other group of evaporation holes is used to connect the other evaporation refrigerant flow channel with the evaporation refrigerant outlet of the evaporation plate exchanger, wherein: The angle between the line connecting two adjacent condensation holes in the two groups of condensation holes and the second direction is α1, 0°≤α1≤45°, and the angle between the line connecting two adjacent condensation holes in the two groups of evaporation holes and the second direction is α2, 0°≤α2≤45°.

6. The heat exchanger according to any one of claims 1 to 5, characterized in that: The refrigerant substrate also includes a confluence flow channel, which is used to connect the other condensing refrigerant flow channel with the one evaporating refrigerant flow channel. The heat exchanger also includes at least one throttling element, each of which is distributed in the confluence flow channel, and each of the throttling elements is used to control the flow rate flowing from the confluence flow channel into the one evaporating refrigerant flow channel.

7. The heat exchanger according to claim 6, characterized in that The one evaporative refrigerant flow channel includes a plurality of branch flow channels, one end of each of the branch flow channels is used to connect to the converging flow channel, and the other end of each of the branch flow channels is used to connect to an evaporative refrigerant inlet of the evaporator plate exchanger.

8. The heat exchanger according to claim 7, characterized in that The refrigerant substrate further includes a diverter flow channel, which is used to connect the converging flow channel with the plurality of diverter flow channels. The cross-sectional area of ​​the diverter flow channel first decreases and then increases along the direction in which the diverter flow channel and each of the diverter flow channels are arranged.

9. The heat exchanger according to claim 7, characterized in that: The refrigerant substrate further includes a guide baffle, which is used to be embedded in the converging flow channel, and a gap is formed at the connection between the guide baffle and each of the diverting flow channels, wherein: The guide baffle includes a guide channel, and the guide channel is used to connect the converging channel and the gap.

10. The heat exchanger according to any one of claims 7 to 9, characterized in that: The cross-sectional area of ​​each of the branch flow channels is smaller than the cross-sectional area of ​​the converging flow channel; the lengths of each of the branch flow channels are equal, and the cross-sectional areas of each of the branch flow channels are the same, or, The length of one of the branch flow channels is smaller than the length of the other branch flow channel, and the cross-sectional area of ​​the one branch flow channel is smaller than the cross-sectional area of ​​the other branch flow channel.

11. The heat exchanger according to any one of claims 1 to 10, characterized in that: The refrigerant substrate further includes at least one cutout, and the cutout is distributed in at least one of the following: between the two condensing refrigerant flow channels, between the two evaporating refrigerant flow channels, between the other condensing refrigerant flow channel and the one evaporating refrigerant flow channel, and between the inlet and outlet of the throttling element.

12. The heat exchanger according to claim 11, characterized in that The length of the incision is greater than or equal to the length of each refrigerant flow channel.

13. A thermal management system, characterized in that: The thermal management system includes a compressor and a heat exchanger as described in any one of claims 1 to 12, the compressor is arranged on the side of the refrigerant substrate away from the condensation plate, the refrigerant substrate includes two side surfaces arranged opposite to each other along a second direction, one of the two side surfaces includes a gas inlet and a gas outlet, the gas inlet is used to connect the one condensing refrigerant flow channel with the exhaust port of the compressor, and the gas outlet is used to connect the other evaporating refrigerant flow channel with the intake port of the compressor.

14. The thermal management system according to claim 13, characterized in that: The thermal management system also includes a gas-liquid separator, which is arranged on the side of the refrigerant substrate away from the condensing plate. The refrigerant substrate includes a gas inlet and a gas outlet. The gas inlet is used to connect the other evaporative refrigerant flow channel with the liquid separator, and the gas outlet is used to connect the air intake of the compressor with the liquid separator.

15. An energy storage device, characterized in that: The energy storage device comprises at least one battery cell and the thermal management system according to claim 13 or 14, wherein the thermal management system is configured to perform heat exchange with each of the battery cells.

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