Power supply apparatus and electronic device

Abstract

The present application relates to the technical field of power and electronics, and discloses a power supply apparatus and an electronic device. The power supply apparatus comprises a chip, a first circuit board, and a power supply, a power supply pin of the chip and the power supply being electrically connected by means of a connection part of the first circuit board, a thickness of the connection part being smaller than a thickness of a main body part of the first circuit board, and the power supply being used to supply power to the power supply pin of the chip.

Description

Power supply devices and electronic equipment

[0001] Cross-references

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on November 28, 2023, with application number 202311613283.2 and invention name “Power Supply Device and Electronic Device”. The entire contents of the application are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of power electronics technology, and in particular to a power supply device and an electronic device. Background Art

[0004] Currently, integrated circuit chips and their core current power supplies are placed on the same side of a system printed circuit board (PCB) to power the integrated circuit chip. However, since the core current power supply supplies power to the integrated circuit chip through the system PCB, the power supply path is relatively long. With the increasing demand for chip computing power and the improvement of chip process integration, the core current continues to increase. Due to the long power supply path, the power loss caused by this power supply method to the integrated circuit chip also increases significantly with the increase in current. Summary of the Invention

[0005] The present application discloses a power supply device and an electronic device.

[0006] In a first aspect, an embodiment of the present application discloses a power supply device, comprising: a chip, a first circuit board and a power supply, wherein: the power supply pin of the chip and the power supply are electrically connected through a connecting portion of the first circuit board, the thickness of the connecting portion is less than the thickness of the main body of the first circuit board, and the power supply is used to supply power to the power supply pin of the chip.

[0007] In a second aspect, an embodiment of the present application discloses an electronic device, comprising the power supply device described in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] FIG1 is a schematic structural diagram of a first power supply device disclosed in an embodiment of the present application;

[0009] FIG2 is a schematic structural diagram of a second power supply device disclosed in an embodiment of the present application;

[0010] FIG3 is a schematic structural diagram of a third power supply device disclosed in an embodiment of the present application;

[0011] FIG4 is a schematic structural diagram of a fourth power supply device disclosed in an embodiment of the present application;

[0012] FIG5 is a schematic structural diagram of a fifth power supply device disclosed in an embodiment of the present application;

[0013] FIG6 is a schematic structural diagram of a second circuit board disclosed in an embodiment of the present application;

[0014] FIG7 is a schematic structural diagram of a sixth power supply device disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0015] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0016] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0017] The present application discloses a power supply device and an electronic device. FIG1 is a schematic structural diagram of a first power supply device disclosed in an embodiment of the present application.

[0018] As shown in Figure 1, the power supply device disclosed in an embodiment of the present application includes: a chip 110, a first circuit board 120 and a power supply 130, wherein: the power supply pin of the chip 110 and the power supply 130 are electrically connected through a connecting part of the first circuit board 120, the thickness of the connecting part is less than the thickness of the main body of the first circuit board 120, and the power supply 130 is used to supply power to the power supply pin of the chip 110.

[0019] In the present application, as shown in FIG1 , the first circuit board 120 is used to provide input power to the power supply 130. The power supply 130 is used to supply power to the power pins of the chip 110. The chip 110, the first circuit board 120, and the power supply 130 are arranged in this order, and the position of the connection portion of the first circuit board 120 corresponds to the position of the power pins of the chip 110 and the position of the power supply 130.

[0020] Since the power supply pin of the chip 110 and the power supply 130 are electrically connected through the connecting portion of the first circuit board 120, and the thickness of the connecting portion of the first circuit board 120 is less than the thickness of the main body of the first circuit board 120, the solution disclosed in the embodiment of the present application can effectively shorten the power supply path, reduce the loss caused by powering the chip, reduce system heat consumption, reduce line parasitic parameters, and improve power supply performance.

[0021] It should be noted that the main body of the first circuit board is the area on the first circuit board excluding the connection portion. The first circuit board may be a system PCB board.

[0022] An embodiment of the present application provides a power supply device, which includes a chip, a first circuit board and a power supply. The power supply pin of the chip and the power supply are electrically connected through a connecting portion of the first circuit board. The thickness of the connecting portion of the first circuit board is less than the thickness of the main body of the first circuit board. The power supply is used to supply power to the power supply pin of the chip, which can effectively shorten the power supply path, reduce the loss caused by powering the chip, and reduce system heat consumption.

[0023] In one implementation, as shown in FIG. 1 , the connection portion may include a groove 121 , and at least a portion of the power supply 130 may be disposed in the groove 121 .

[0024] In an embodiment of the present application, a groove 121 is provided on one side of the first circuit board 120, and solder pads are provided at the bottom of the groove 121 and at a position corresponding to the bottom of the groove 121 on the other side of the first circuit board 120. At least a portion of the power supply 130 extends into the notch of the groove 121 and is provided within the groove 121. The power supply pins of the chip 110 and the power supply 130 are electrically connected through the bottom of the groove 121 provided on the first circuit board 120, that is, the power supply 130 supplies power to the power supply pins of the chip through the bottom of the groove 121, thereby shortening the power supply path, reducing the loss caused by powering the chip, and reducing the heat consumption of the system. In this embodiment, as shown in FIG1 , the input power can be provided to the power supply 130 through the bottom of the groove 121 provided on the first circuit board 120.

[0025] With the solution disclosed in the embodiments of this application, since at least a portion of the power supply 130 is disposed within the recess 121, the available height of the power supply 130 is increased. This can improve the overall power supply conversion efficiency, reduce heat loss, and ease the heat dissipation difficulty of the system by adopting a larger power supply and reducing the switching frequency. Furthermore, by controlling the thickness tolerance of the recessed portion of the first circuit board 120, the height tolerance requirement of the power supply 130 can be reduced, thereby reducing the design and manufacturing difficulty of the power supply 130.

[0026] The production process of the power supply device is simple, and the subsequent maintainability of the power supply 130 is good.

[0027] In another implementation, as shown in FIG. 2 , the connection portion may include a through hole 122 , and at least a portion of the power supply 130 may be disposed in the through hole 122 .

[0028] In this case, as shown in FIG2 , some pins of the chip 110 are electrically connected to the first circuit board, and the power supply pins of the chip are directly electrically connected to the power supply 130 , shortening the power supply path, reducing the loss caused by powering the chip, and reducing system heat consumption.

[0029] Furthermore, with the solution disclosed in the embodiments of this application, since at least a portion of the power supply 130 is disposed within the through-hole 122, the available height of the power supply 130 is increased. By utilizing a larger power supply, the overall efficiency of the power supply can be improved, thereby reducing the design complexity of the power supply. Furthermore, the height of the power supply 130 of the power supply device provided in this embodiment is not affected by the thickness tolerance of the first circuit board 120, further reducing the design and manufacturing complexity of the power supply 130.

[0030] In addition, the side walls of the through hole 122 opened in the first circuit board 120 can be metallized. For example, the side walls of the through hole 122 opened in the first circuit board 120 can be copper-plated, and then the power supply 130 is electrically connected to the side walls of the through hole 122. The first circuit board 120 provides input power to the power supply 130 through the side walls of the through hole 122.

[0031] In the above embodiment, the force directions of the electrical connection points between the chip 110 and the power supply 130, the electrical connection points between the chip 110 and the first circuit board 120, and the electrical connection points between the power supply 130 and the first circuit board 120 are all downward, which can structurally improve the reliability of the electrical connection points.

[0032] In one implementation, as shown in FIG3 , the through hole 122 may include a first limiting portion, and the power supply 130 may include a second limiting portion, and the first limiting portion and the second limiting portion may cooperate with each other in limiting manner.

[0033] For example, the sidewall of through-hole 122 can be partially stepped to serve as the first stopper, or the sidewall of through-hole 122 can be entirely stepped to serve as the first stopper. As shown in FIG3 , the sidewall of power supply 130 is provided with a second stopper corresponding to the first stopper of through-hole 122. The first stopper and the second stopper cooperate to position power supply 130, facilitate soldering, reduce the number of reflow soldering cycles, reduce constraints on component selection and process, and indirectly improve the reliability of the single board. It should be noted that the first stopper can be provided with a solder pad and a solder ball for connecting to the second stopper.

[0034] In addition, the first circuit board 120 provides input power to the power supply 130 through the first limiting portion. This method of providing input power to the power supply 130 can reduce resource usage of the first circuit board 120 and reduce interference with the chip high-speed line.

[0035] In an embodiment of the present application, as shown in FIG2 and FIG4 , the power supply 130 and the side wall of the through hole 122 can be electrically connected via a conductive member 140, and the first circuit board 120 provides input power to the power supply 130 via the side wall of the through hole 122. Exemplarily, the conductive member 140 may include an elastic member or a connector to improve the stability and reliability of the connection between the power supply 130 and the side wall of the through hole 122. Furthermore, the stability and reliability of the connection between the power supply 130 and the side wall of the through hole 122 can be further improved by adding solder or other welding materials at the connection position between the side wall of the through hole 122 and the power supply 130.

[0036] In one possible implementation, the power supply device may further include a filter capacitor 150, which may be disposed within the power supply 130 near the power supply pin of the chip 110. By disposing the filter capacitor 150 within the power supply 130 near the power supply pin of the chip 110, filtering performance can be improved, thereby improving power supply quality.

[0037] It should be noted that the positive pole of the power supply 130 and the positive pole of the power supply pin of the chip 110 are electrically connected at a first connection point, the negative pole of the power supply 130 and the negative pole of the power supply pin of the chip 110 are electrically connected at a second connection point, the positive pole of the filter capacitor 150 is electrically connected to the first connection point, and the negative pole of the filter capacitor 150 is electrically connected to the second connection point.

[0038] In another possible implementation, the power supply device may further include a filter capacitor 150, which may be disposed between the power supply 130 and the power supply pin of the chip 110. By disposing the filter capacitor 150 between the power supply 130 and the power supply pin of the chip 110, filtering performance can be improved, thereby improving power supply quality.

[0039] It should be noted that the connection method between the filter capacitor 150, the power supply 130 and the chip 110 is the same as above, and this application will not repeat it here.

[0040] In one implementation, when the connecting portion includes a through hole 122 and the power supply is at least partially disposed in the through hole 122, as shown in Figure 5, the power supply device may further include a second circuit board 160, which is disposed between the chip 110 and the first circuit board 120, and the second circuit board 160 is electrically connected to the power supply pin of the chip 110, the first circuit board 120 and the power supply 130, respectively.

[0041] In this case, as shown in FIG5 , the power supply 130 supplies power to the power pins of the chip 110 via the second circuit board 160, and the first circuit board 120 provides input power to the power supply 130 via the second circuit board 160. By adopting the solution disclosed in this embodiment, since the power supply 130 supplies power to the power pins of the chip 110 via the second circuit board 160, the pins of the power supply 130 and the pins of the chip do not need to correspond one-to-one. A single power supply can supply power to different chips. When supplying power to different chips via a single power supply, only the second circuit board 160 needs to be adjusted accordingly. By adopting the power supply device disclosed in this embodiment, the power supply has good reusability and can reduce costs.

[0042] In addition, the current path from the power supply 130 to the chip 110 on the second circuit board 160 can be designed in a dense hole form to reduce the power supply path and parasitic parameters.

[0043] It should be noted that in practical applications, the material of the second circuit board can be selected according to needs. While ensuring rigidity, the thickness of the second circuit board can be reduced to shorten the power supply path and reduce the loss and parasitic parameters caused by powering the chip.

[0044] In one implementation, as shown in FIG6 , the power supply device may further include a filter capacitor 150, which may be disposed inside the second circuit board 160. For example, the filter capacitor at the output end of the power supply 130 may be disposed inside the second circuit board 160 by embedding or patching followed by plastic sealing, thereby reducing the distance between the filter capacitor 150 and the chip 110, improving filtering performance, and thereby improving power supply quality while saving space. Furthermore, the filter capacitor in this application may be a ceramic filter capacitor.

[0045] It should be noted that the connection method between the filter capacitor 150, the power supply 130 and the chip 110 is the same as above, and this application will not repeat it here.

[0046] In addition, the present application does not limit the number of layers of the second circuit board 160 and the number of layers of devices embedded in the second circuit board 160. The circuits can be laid out according to actual needs to achieve connections between the layers.

[0047] In another implementation, as shown in FIG7 , the power supply 130 and the second circuit board 160 are electrically connected via a connector 190 , and a filter capacitor 150 is disposed between the power supply 130 and the second circuit board 160 to improve filtering performance and, thereby, power supply quality. For example, the connector 190 may include, but is not limited to, a copper block or a pin header, and the filter capacitor 150 may be disposed at either the power supply end or the second circuit board end.

[0048] It should be noted that the connection method between the filter capacitor 150, the power supply 130 and the chip 110 is the same as above, and this application will not repeat it here.

[0049] In addition, in addition to the filter capacitor 150 , other components may be soldered to the position on the second circuit board 160 corresponding to the through hole 122 provided on the first circuit board 120 according to actual needs.

[0050] In an embodiment of the present application, as shown in FIG1 , the power supply device may further include a heat-conducting medium 170 and a lining plate 180, and the power supply 130 and the lining plate 180 are connected via the heat-conducting medium 170. In other words, the heat of the power supply 130 can be conducted to the lining plate 180 through the heat-conducting medium 170 and dissipated. When adopting this heat dissipation method, the power supply 130 can be designed to dissipate heat from the bottom. Exemplarily, the lining plate 180 can be a metal structure. It should be noted that the surface where the power supply 130 contacts the heat-conducting medium 170 is the bottom of the power supply 130.

[0051] In this case, the height of the power supply 130 can be determined based on the connection portion of the first circuit board 120 and the backing plate 180 , and the thermal conductive medium 170 can also absorb part of the assembly tolerance to reduce the tolerance requirement for the power supply 130 .

[0052] In addition, the power supply device may further include a heat dissipation device for the chip 110 . The heat dissipation device for the chip 110 may be disposed on the first circuit board 120 or the backing plate 180 .

[0053] It should be noted that the above power supply device can be used in situations where integrated circuit chips are powered, especially low-voltage and high-current integrated circuit chips are powered.

[0054] The present application also discloses an electronic device, comprising the power supply device described above.

[0055] Exemplarily, the electronic device may include but is not limited to a wireless server, a wired router, a switch, and the like.

[0056] The above embodiments of this application focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0057] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. A power supply device, wherein: include: A chip (110), a first circuit board (120) and a power supply (130), wherein: The power supply pin of the chip (110) and the power supply (130) are electrically connected via a connecting portion of the first circuit board (120), the thickness of the connecting portion is smaller than the thickness of a main body of the first circuit board (120), and the power supply (130) is used to supply power to the power supply pin of the chip (110).

2. The power supply device according to claim 1, wherein: The connecting portion comprises a groove (121), and at least a portion of the power supply (130) is arranged in the groove (121).

3. The power supply device according to claim 1, wherein: The connecting portion comprises a through hole (122), and at least a portion of the power supply (130) is arranged in the through hole (122).

4. The power supply device according to claim 3, wherein: The through hole (122) comprises a first limiting portion, the power supply (130) comprises a second limiting portion, and the first limiting portion and the second limiting portion cooperate in limiting manner.

5. The power supply device according to claim 3, wherein: The power supply (130) is electrically connected to the side wall of the through hole (122) via a conductive member (140).

6. The power supply device according to claim 5, wherein: The conductive member (140) comprises an elastic member or a plug-in member.

7. The power supply device according to any one of claims 1 to 6, wherein: It also includes a filter capacitor (150), which is arranged in the power supply (130) at a position close to the power supply pin of the chip (110).

8. The power supply device according to any one of claims 1 to 6, wherein: It also includes a filter capacitor (150), wherein the filter capacitor (150) is arranged between the power supply (130) and the power supply pin of the chip (110).

9. The power supply device according to claim 3, wherein: The device further comprises a second circuit board (160), wherein the second circuit board (160) is arranged between the chip (110) and the first circuit board (120), and the second circuit board (160) is electrically connected to the power supply pin of the chip (110), the first circuit board (120) and the power supply (130), respectively.

10. The power supply device according to claim 9, wherein: It also includes a filter capacitor (150), wherein the filter capacitor (150) is arranged inside the second circuit board (160).

11. The power supply device according to claim 1, wherein: It also includes a heat-conducting medium (170) and a lining plate (180), and the power supply (130) and the lining plate (180) are connected via the heat-conducting medium (170).

12. An electronic device, wherein: A power supply device comprising any one of claims 1 to 11.

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