Processing system, processing method, and shaping method

Abstract

This processing system includes: a processing device for performing additive processing for forming a shaped matter on an object by melting a shaping material supplied from a material supply member with an energy beam emitted from an irradiation device; an imaging device for imaging a site where the positional relationship with the material supply member is fixed and the energy beam emitted from the irradiation device or light generated by the energy beam; and a control device for controlling the processing device on the basis of an imaging result from the imaging device.

Description

Processing system, processing method, modeling method

[0001] The present invention relates to the technical field of, for example, a processing system and processing method capable of processing an object, and a modeling method capable of additively forming a model on an object.

[0002] An example of a processing system for processing an object is described in Patent Document 1. One of the technical challenges of such a processing system is to process the object appropriately.

[0003] US Patent Application Publication No. 2016 / 0311059

[0004] According to a first aspect, there is provided a processing system comprising: a material supply member that supplies a modeling material from a supply port; an irradiation device that emits an energy beam; a processing device that performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supply member with the energy beam emitted from the irradiation device; an imaging device that images a portion that has a fixed positional relationship with the material supply member and the energy beam emitted from the irradiation device or the light generated by the energy beam; and a control device that controls the processing device based on the imaging results of the imaging device.

[0005] According to a second aspect, a processing system is provided which includes a material supply member which supplies a modeling material from a supply port, an irradiation device which emits an energy beam, and a processing device which performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supply member with the energy beam emitted from the irradiation device, and an imaging device which captures, on an imaging surface, the part whose positional relationship with the material supply member is fixed, and at least one of an image of the energy beam emitted from the irradiation device and an image of light generated by the energy beam.

[0006] According to a third aspect, a processing method is provided that includes performing additional processing to form a model on an object by melting a modeling material supplied from a supply port of a material supply member with an energy beam, capturing an image of a portion that has a fixed positional relationship with the material supply member and the energy beam or light generated by the energy beam, and controlling the additional processing based on the image capturing results.

[0007] According to a fourth aspect, a processing method is provided that includes performing additional processing to form a model on an object by melting a modeling material supplied from a supply port of a material supply member with an energy beam, detecting a positional relationship between a portion having a fixed positional relationship with the material supply member and the energy beam or light generated by the energy beam, and adjusting the positional relationship using the detection result.

[0008] According to a fifth aspect, there is provided a processing system comprising: a material supply member that supplies a modeling material from a supply port; an irradiation device that emits an energy beam; a processing device that performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supply member with the energy beam emitted from the irradiation device; a detection device that detects the position of a part that has a fixed positional relationship with the material supply member and the position of the energy beam emitted from the irradiation device or the light generated by the energy beam; and a control device that controls the processing device based on the detection results of the detection device.

[0009] According to a sixth aspect, there is provided a modeling method including: supplying a modeling material from a supply port of a material supply member; melting the modeling material supplied from the supply port with an energy beam to additively model a model on an object; detecting the position of a portion whose positional relationship with the material supply member is fixed during a first period; detecting the position of the portion whose positional relationship is fixed during a second period after the first period; detecting the position of the energy beam during the first period; and detecting the position of the energy beam during the second period.

[0010] According to a seventh aspect, there is provided a processing system including: an irradiation device that emits first and second energy beams and that processes a workpiece using the first and second energy beams emitted from the irradiation device; a detection device that includes a beam splitter that splits a portion of the first and second energy beams and detects an irradiation position in a first plane that intersects the traveling direction of the first energy beam via the beam splitter and an irradiation position in a second plane that intersects the traveling direction of the second energy beam via the beam splitter; and a control device that controls the processing device based on the detection result of the detection device, wherein the irradiation device includes a first scanning optical system that scans the first energy beam so that the irradiation position of the first energy beam moves within the first plane, and a second scanning optical system that scans the second energy beam so that the irradiation position of the second energy beam moves within the second plane, and a detection surface of the detection device is located at a position where a scanning range of the first energy beam by the first scanning optical system and a scanning range of the second energy beam by the second scanning optical system do not overlap.

[0011] According to an eighth aspect, there is provided a processing method including: processing an object using first and second energy beams emitted from an irradiation device; splitting a portion of the first and second energy beams; detecting, with a detection device, an irradiation position within a first plane intersecting a traveling direction of the first energy beam split by the splitting; and detecting an irradiation position within a second plane intersecting a traveling direction of the second energy beam split by the splitting, wherein the processing includes scanning the first energy beam so that the irradiation position of the first energy beam moves within the first plane, and scanning the second energy beam so that the irradiation position of the second energy beam moves within the second plane, and a detection plane of the detection device is provided at a position where a scanning range of the first energy beam by scanning the first energy beam and a scanning range of the second energy beam by scanning the second energy beam do not overlap.

[0012] According to a ninth aspect, there is provided a processing system comprising: a material supply member that supplies a modeling material from a supply port; an irradiation device that emits an energy beam; a processing device that performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supply member with the energy beam emitted from the irradiation device; and a detection device that detects light that is returned toward the irradiation device after being emitted from the irradiation device, or light that is generated by the energy beam from the irradiation device and returned toward the irradiation device, and light from the irradiation device that passes through at least a part of the material supply member.

[0013] According to a tenth aspect, there is provided a processing method including: performing additional processing to form a shaped object on an object by melting a shaping material ejected from a supply port of a material supply member with an energy beam emitted from an irradiation device; and detecting light returned toward the irradiation device after being emitted from the irradiation device or light generated by the energy beam from the irradiation device, and light from the irradiation device that passes through at least a part of the material supply member.

[0014] According to an eleventh aspect, there is provided a processing system including an irradiation device that emits first and second energy beams and that processes a workpiece using the first and second energy beams emitted from the irradiation device, a light receiving device that receives light that passes through an object onto which the first and second energy beams emitted from the irradiation device are incident, and a control device that controls the processing device based on the light receiving result of the light receiving device, wherein the irradiation device includes a first scanning optical system that scans the first energy beam so that the irradiation position of the first energy beam moves on the object, and a second scanning optical system that scans the second energy beam so that the irradiation position of the second energy beam moves within the object, and the control device controls the drive of the first scanning optical system and the drive of the second scanning optical system based on drive command values ​​to the first and second deflection scanning optical systems when the first and second energy beams overlap on the object.

[0015] According to a twelfth aspect, there is provided a processing system comprising an irradiation device that emits first and second energy beams and processes a workpiece using the first and second energy beams emitted from the irradiation device, and a detection device that detects light passing through an object onto which the first and second energy beams emitted from the irradiation device are incident, wherein the irradiation device includes a first scanning optical system that scans the first energy beam so that the irradiation position of the first energy beam moves on the object, and a second scanning optical system that scans the second energy beam so that the irradiation position of the second energy beam moves within the object, and the detection device detects that the first and second energy beams overlap on the object.

[0016] According to a thirteenth aspect, there is provided a processing method including: scanning an object with a first energy beam using a first scanning optical system that moves an irradiation position of the first energy beam on the object; scanning the object with a second energy beam using a second scanning optical system that moves an irradiation position of a second energy beam different from the first energy beam on the object; receiving light that passes through the object onto which the first and second energy beams are incident; and performing drive control of the first scanning optical system and drive control of the second scanning optical system based on drive command values ​​for the first and second scanning optical systems when the first and second energy beams overlap on the object.

[0017] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments.

[0018] FIG. 1 is a cross-sectional view showing the configuration of a processing system according to a first embodiment. FIG. 2 is a block diagram showing the configuration of the processing system according to the first embodiment. FIG. 3 is a plan view showing the bottom surface of a material nozzle. FIGS. 4(a) to 4(c) are each a plan view showing an example of a material supply region within a material supply surface. FIG. 5 is a cross-sectional view showing an example of an imaging device that images an object to be imaged. FIG. 6 is a cross-sectional view showing the configuration of an irradiation optical system. FIG. 7(a) is a plan view showing the movement trajectory of a target irradiation region within a processing unit region, and FIG. 7(b) is a plan view showing the movement trajectory of a target irradiation region on a printing surface. FIGS. 8(a) and 8(b) are each a plan view showing the movement trajectory of a target irradiation region within a processing unit region, and FIG. 8(c) is a plan view showing the movement trajectory of a target irradiation region on a printing surface. FIGS. 9(a) to 9(e) are each a cross-sectional view showing a process of printing a structure layer by the first printing operation. FIGS. 10(a) to 10(c) are cross-sectional views showing the process of forming a three-dimensional structure. FIGS. 11(a) to 11(d) are cross-sectional views showing the process of forming a structure layer by the second modeling operation. FIG. 12 shows the processing light passing through the material irradiation surface. FIGS. 13(a), 13(c), and 13(d) are plan views showing the movement trajectory of the target irradiation area within the processing unit area, and FIGS. 13(b) and 13(e) are plan views showing the movement trajectory of the target irradiation area on the modeling surface. FIGS. 14(a) to 14(c) are plan views showing the relationship between the material supply area and the irradiation unit area. FIG. 15 shows an example of an image generated by the imaging device. FIG. 16 is a cross-sectional view showing a state in which the positional relationship between the material nozzle and the processing light is the desired positional relationship. 17(a) shows an example of an image generated by the imaging device when the positional relationship between the material nozzle and the processing light is a desired positional relationship, and FIG. 17(b) shows an example of an image generated by the imaging device when the positional relationship between the material nozzle and the processing light is not a desired positional relationship. FIG. 18(a) is a plan view showing a structure layer SL having an annular shape, and FIG. 18(b) is a graph showing the height of the structure layer when the structure layer shown in FIG. 18(a) is formed without performing a nozzle-beam alignment operation and the height of the structure layer when the structure layer shown in FIG. 18(a) is formed after performing a nozzle-beam alignment operation, for each angle in the circumferential direction of the structure layer.Fig. 19(a) and Fig. 19(b) each show an example of an image generated by an imaging device. Fig. 20(a) to Fig. 20(c) each show an example of an image generated by an imaging device. Fig. 21(a) to Fig. 21(c) each show an example of an image generated by an imaging device. Fig. 22 is a plan view showing a plurality of partial regions where a multi-beam alignment operation is performed. Fig. 23 shows an example of an image generated by an imaging device. Fig. 24 is a cross-sectional view showing an example of an optical member on which an index is formed.

[0019] 25(a) to 25(c) are cross-sectional views showing a reflective optical system that can be used instead of the refractive optical system provided in the irradiation optical system. FIGS. 26(a) and 26(b) are cross-sectional views showing the optical path of the imaging light CL in a fourth modified example. FIG. 27 is a cross-sectional view showing the configuration of the irradiation optical system in a fifth modified example. FIG. 28 is a cross-sectional view showing the configuration of a processing system in a sixth modified example. FIG. 29 is a cross-sectional view showing the configuration of a processing system in a second embodiment. FIG. 30 is a cross-sectional view showing the configuration of the irradiation optical system in the second embodiment. FIG. 31 is a cross-sectional view showing the configuration of the irradiation optical system in the second embodiment. FIGS. 32(a) and 32(b) are plan views showing the irradiation position of the processing light on the detection surface of the irradiation position detection device. FIG. 33 is a plan view showing the amount of positional deviation between two processing light beams. FIGS. 34(a) and 34(b) are plan views showing the amount of positional deviation of the irradiation position of the processing light relative to the target position. FIG. 35 is a cross-sectional view showing the configuration of the irradiation optical system in a first modified example. Fig. 36 is a cross-sectional view showing the configuration of an irradiation optical system of a first modified example. Fig. 37(a) and Fig. 37(b) are cross-sectional views showing the configuration of an irradiation optical system including a light-reducing member. Fig. 38 is a cross-sectional view showing the configuration of an irradiation optical system of a second modified example. Fig. 39 is a cross-sectional view showing the configuration of an irradiation optical system of a third modified example.

[0020] Hereinafter, embodiments of a processing system, a processing method, and a manufacturing method will be described with reference to the drawings. Hereinafter, embodiments of the processing method and the manufacturing method will be described using a processing system SYS capable of processing a workpiece W, which is an example of an object. In particular, below, embodiments of a processing device and a processing method will be described using a processing system SYS that performs additive processing based on laser metal deposition (LMD). Additional processing based on laser metal deposition is additive processing that melts a manufacturing material M supplied to the workpiece W with processing light EL (i.e., an energy beam in the form of light) to form a shaped object that is integrated with the workpiece W or that can be separated from the workpiece W.

[0021] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For convenience of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0022] (1) Machining System SYSa of First Embodiment First, the machining system SYS of the first embodiment will be described. In the following description, the machining system SYS of the first embodiment will be referred to as the "machining system SYSa."

[0023] (1-1) Overall Configuration of Machining System SYSa First, the configuration of the machining system SYSa according to the first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a cross-sectional view schematically showing the configuration of the machining system SYSa according to the first embodiment. Fig. 2 is a block diagram showing the configuration of the machining system SYSa according to the first embodiment.

[0024] The machining system SYSa is capable of performing additive processing on the workpiece W. By performing additive processing on the workpiece W, the machining system SYSa is capable of forming a shaped object that is integrated with (or separable from) the workpiece W. In this case, the additive processing performed on the workpiece W corresponds to processing that adds, to the workpiece W, a shaped object that is integrated with (or separable from) the workpiece W. Note that the shaped object in the first embodiment may refer to any object formed by the machining system SYSa. For example, the machining system SYSa is capable of forming a three-dimensional structure ST (that is, a three-dimensional structure that has a size in all three-dimensional directions, a solid object, in other words, a structure that has a size in the X-axis direction, Y-axis direction, and Z-axis direction) as an example of a shaped object.

[0025] When the workpiece W is a stage 31 (described later), the machining system SYSa can perform additional machining on the stage 31. When the workpiece W is a mounted object, which is an object placed on the stage 31, the machining system SYSa can perform additional machining on the mounted object. The mounted object placed on the stage 31 may be another three-dimensional structure ST (i.e., an existing structure) formed by the machining system SYSa. The workpiece W may also be held by a holder that can be placed on the stage 31. That is, a holder may hold the workpiece W, and the holder holding the workpiece W may be placed on the stage 31. The holder may also be called a jig, holder, holding member, mounting member, or clamp. Note that FIG. 1 shows an example in which the workpiece W is an existing structure placed on the stage 31. In the following description, the workpiece W is an existing structure placed on the stage 31 as an example.

[0026] The workpiece W may be a product that has a missing portion and needs to be repaired. In this case, the machining system SYSa may perform repair processing to repair the product that needs to be repaired by performing additional processing to form a shaped object to fill the missing portion. In other words, the additional processing performed by the machining system SYSa may include additional processing to add a shaped object to the workpiece W to fill the missing portion.

[0027] As described above, the processing system SYSa is capable of performing additive processing based on the laser buildup welding method. In other words, the processing system SYSa can also be said to be a 3D printer that processes an object using additive manufacturing technology. The additive manufacturing technology may also be referred to as rapid prototyping, rapid manufacturing, or additive manufacturing. The laser buildup welding method (LMD) may also be referred to as directed energy deposition (DED).

[0028] The processing system SYSa using additive manufacturing technology sequentially forms multiple structural layers SL (see FIG. 8 , described later) to form a three-dimensional structure ST in which multiple structural layers SL are stacked. In this case, the processing system SYSa first sets the surface of the workpiece W as a printing surface MS on which the object is actually printed, and prints the first structural layer SL on the printing surface MS. Thereafter, the processing system SYSa sets the surface of the first structural layer SL as a new printing surface MS, and prints the second structural layer SL on the new printing surface MS. Thereafter, the processing system SYSa repeats the same operation to form a three-dimensional structure ST in which multiple structural layers SL are stacked.

[0029] The processing system SYSa performs additive processing by processing the modeling material M using processing light EL, which is an energy beam. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the modeling material M. The modeling material M is a powdered material. In other words, the modeling material M is a powder. However, the modeling material M does not have to be a powder. For example, at least one of a wire-shaped modeling material and a gaseous modeling material may be used as the modeling material M.

[0030] Like the forming material M, the workpiece W may also be an object containing a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. The material of the workpiece W may be the same as or different from the forming material M. For example, at least one of a metallic material and a resinous material can be used as the material of the workpiece W. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the material of the workpiece W.

[0031] 1 and 2 , the processing system SYSa includes a material supply source 1, a processing unit 2, a stage unit 3, a light source 4, a gas supply source 5, a control unit 7, and an imaging device 8. The processing unit 2 and the stage unit 3 may be housed in a chamber space 63IN inside the housing 6. In this case, the processing system SYSa may perform additional processing in the chamber space 63IN. Note that at least one of the processing unit 2 and the stage unit 3 does not have to be housed in the chamber space 63IN inside the housing 6.

[0032] The processing unit 2 may be referred to as a processing device. An apparatus including the processing unit 2 and at least one of the material supply source 1, the stage unit 3, the light source 4, the gas supply source 5, and the imaging device 8 may be referred to as a processing device. The control unit 7 may be referred to as a control device. The imaging device 8 may be referred to as an imaging unit.

[0033] The material supply source 1 supplies the processing unit 2 with the modeling material M. The material supply source 1 supplies a desired amount of modeling material M according to the required amount so that the amount of modeling material M required per unit time for performing additive processing is supplied to the processing unit 2.

[0034] The processing unit 2 processes the modeling material M supplied from the material supply source 1 to form a model. That is, the processing unit 2 performs additive processing (additive modeling) to form a model on the workpiece W. In other words, the processing unit 2 processes the workpiece W to form a model on the workpiece W. In order to form the model, the processing unit 2 includes a processing head 21 and a head drive system 22. Furthermore, the processing head 21 includes an irradiation device 210 and a material nozzle 212. The processing head 21 may also be referred to as a processing device.

[0035] The irradiation device 210 is a device for emitting the processing light EL. To emit the processing light EL, the irradiation device 210 is equipped with an irradiation optical system 211. The irradiation optical system 211 is an optical system for emitting the processing light EL. Specifically, the irradiation optical system 211 is optically connected to a light source 4 that emits (generates) the processing light EL via an optical transmission member 41. An example of the optical transmission member 41 is at least one of an optical fiber and a light pipe.

[0036] In the example shown in FIGS. 1 and 2 , the processing system SYSa includes two light sources 4 (specifically, light sources 4#1 and 4#2), and the irradiation optical system 211 is optically connected to the light sources 4#1 and 4#2 via optical transmission members 41#1 and 41#2, respectively. The irradiation optical system 211 emits both the processed light EL propagating from the light source 4#1 via the optical transmission member 41#1 and the processed light EL propagating from the light source 4#2 via the optical transmission member 41#2. In the following description, when it is necessary to distinguish between the two processed light beams EL emitted by the irradiation optical system 211, the processed light EL generated by the light source 4#1 will be referred to as “processed light EL#1,” and the processed light EL generated by the light source 4#2 will be referred to as “processed light EL#2.” On the other hand, when it is not necessary to distinguish between the two processed light beams EL, the term “processed light EL” may refer to at least one of the processed light beams EL#1 and EL#2.

[0037] However, the processing system SYSa may include a single light source 4 instead of the multiple light sources 4. The irradiation optical system 211 may emit a single processing light EL instead of emitting multiple processing light EL.

[0038] The irradiation optical system 211 emits the processing light EL downward (i.e., toward the -Z side). In the example shown in FIG. 1 , the irradiation optical system 211 emits the processing light EL so that the processing light EL travels along the irradiation direction (i.e., the traveling direction) along the Z axis. A stage 31 is disposed below the irradiation optical system 211. When a workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the emitted processing light EL onto the printing surface MS. Specifically, the irradiation optical system 211 may irradiate the processing light EL onto a target irradiation area (target irradiation position) EA set on the printing surface MS as the area to be irradiated (typically, focused) with the processing light EL. Furthermore, the state of the irradiation optical system 211 can be switched, under the control of the control unit 7, between a state in which the processing light EL is irradiated onto the target irradiation area EA and a state in which the processing light EL is not irradiated onto the target irradiation area EA. In the following description, when it is necessary to distinguish between the two target irradiation areas EA onto which the irradiation optical system 211 irradiates the two processing beams EL, the target irradiation area EA onto which the irradiation optical system 211 irradiates the processing beam EL#1 will be referred to as the "target irradiation area EA#1," and the target irradiation area EA onto which the irradiation optical system 211 irradiates the processing beam EL#2 will be referred to as the "target irradiation area EA#2." On the other hand, when it is not necessary to distinguish between the two target irradiation areas EA, the "target irradiation area EA" may mean at least one of the target irradiation areas EA#1 and EA#2.

[0039] The irradiation optical system 211 may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with a processing light EL. For example, the irradiation optical system 211 may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with a processing light EL#1. For example, the irradiation optical system 211 may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with a processing light EL#2. In the following description, when it is necessary to distinguish between the two molten pools MP formed using the two processing lights EL#1 and EL#2, the molten pool MP formed using the processing light EL#1 will be referred to as "molten pool MP#1," and the molten pool MP formed using the processing light EL#2 will be referred to as "molten pool MP#2." On the other hand, when it is not necessary to distinguish between the two molten pools MP, the term "molten pool MP" may refer to at least one of the molten pools MP#1 and MP#2. The molten pools MP#1 and MP#2 may be integrated. Alternatively, the molten pools MP#1 and MP#2 may be spaced apart from each other. However, the molten pool MP#1 may not be formed on the build surface MS by irradiation with the processing light EL#1. The molten pool MP#2 may not be formed on the build surface MS by irradiation with the processing light EL#2.

[0040] As will be described in detail later, the irradiation optical system 211 may irradiate the material irradiation surface ES with the processing light EL. The material irradiation surface ES is a virtual optical surface located between the irradiation optical system 211 and the modeling surface MS. The irradiation optical system 211 may melt the modeling material M passing through the material irradiation surface ES by irradiating the material irradiation surface ES with the processing light EL.

[0041] The material nozzle 212 supplies (e.g., injects, jets, spouts, or sprays) the modeling material M. For this reason, the material nozzle 212 may also be referred to as a material supply member. The material nozzle 212 is physically connected to the material supply source 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixer 12. The material nozzle 212 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixer 12. The material nozzle 212 may pressure-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and a conveying gas (i.e., a pressure-feed gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the conveying gas. For example, a purge gas supplied from the gas supply source 5 is used as the conveying gas. However, a gas supplied from a gas supply source different from the gas supply source 5 may be used as the transport gas.

[0042] The material nozzle 212 supplies the modeling material M downward (i.e., toward the −Z side) from the material nozzle 212. The stage 31 is disposed below the material nozzle 212. When a workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the modeling surface MS.

[0043] A material supply port 2121 is formed on the lower surface of the material nozzle 212. For example, as shown in FIG. 3, which is a plan view showing the lower surface of the material nozzle 212, an annular material supply port 2121 is formed on the lower surface 2120 of the material nozzle 212. In the example shown in FIG. 3, the shape of the outer edge of the material supply port 2121 along a plane intersecting the Z axis is circular, but it may have a shape other than circular. For example, the shape of the outer edge of the material supply port 2121 along a plane intersecting the Z axis may be elliptical or polygonal. Furthermore, in the example shown in FIG. 3, the material supply port 2121, which is a continuous opening having an annular or ring-like shape, is formed on the lower surface 2120 of the material nozzle 212. However, the material nozzle 212 may have a plurality of material supply ports 2121, which are arc-shaped, circular, elliptical, or rectangular openings, formed on the lower surface.

[0044] The material nozzle 212 supplies the modeling material M from the material supply port 2121. When the material supply port 2121 is formed in this manner, the material nozzle 212 may supply the modeling material M so that the shape of the material supply region MSA in a virtual material supply surface PL that intersects with the Z axis between the material nozzle 212 and the modeling surface MS becomes a shape corresponding to the material supply port 2121. For example, as shown in FIG. 4( a), which is a plan view showing an example of the material supply region MSA in the material supply surface PL, the material nozzle 212 may supply the modeling material M so that the shape of the material supply region MSA in each of material supply surfaces PL#1 and PL#2, which are examples of the material supply surface PL, becomes annular in shape corresponding to the annular material supply port 2121. For example, as shown in Figure 4(b), which is a plan view showing an example of the material supply region MSA in the material supply surface PL, the material nozzle 212 may supply the modeling material M so that the shape of the material supply region MSA in each of the material supply surfaces PL#4 and PL#5, which are examples of the material supply surface PL, becomes annular in shape corresponding to the annular material supply port 2121. For example, as shown in Figure 4(c), which is a plan view showing an example of the material supply region MSA in the material supply surface PL, the material nozzle 212 may supply the modeling material M so that the shape of the material supply region MSA in each of the material supply surfaces PL#6 and PL#7, which are examples of the material supply surface PL, becomes annular in shape corresponding to the annular material supply port 2121.

[0045] The material supply area MSA is a virtual area within a virtual material supply surface PL that intersects with the Z-axis between the material nozzle 212 and the printing surface MS, where the printing material M is supplied. In other words, the material supply area MSA is a virtual area within the material supply surface PL through which the printing material M supplied from the material nozzle 212 passes. In this case, the material nozzle 212 may be considered to be supplying the printing material M to the material supply area MSA. Because the printing material M passes through the material supply surface PL, the material supply surface PL may also be referred to as a material passing surface.

[0046] However, if the modeling material M is a powdered material, the amount (supply amount) of modeling material M supplied to each position on the material supply surface PL may vary over time. For example, while the modeling material M may be supplied to a position on the material supply surface PL at a first time, the modeling material M may not be supplied to the same position on the material supply surface PL at a second time different from the first time. In other words, if the modeling material M is a powdered material, the amount (passing amount) of modeling material M passing through each position on the material supply surface PL may vary over time. For example, while the modeling material M may pass through a position on the material supply surface PL at a first time, the modeling material M may not pass through the same position on the material supply surface PL at a second time different from the first time. This is because it is unlikely that the trajectory of the powdered modeling material M supplied from the material nozzle 212 will always be the same. For this reason, in the first embodiment, the material supply area MSA may be a virtual area whose outer edge (in other words, boundary) is a line connecting multiple positions that satisfy the condition that "the integrated value of the supply amount (passing amount) of the building material M per unit time within the material supply surface PL coincides with a predetermined ratio of the maximum integrated value of the supply amount (passing amount) of the building material M per unit time within the material supply surface PL." An example of the predetermined ratio is 50% or a ratio greater than 50%. Another example of the predetermined ratio is 60% or a ratio greater than 60%. Another example of the predetermined ratio is 70% or a ratio greater than 70%. Another example of the predetermined ratio is 80% or a ratio greater than 80%. Another example of the predetermined ratio is 90% or a ratio greater than 90%.

[0047] 1, the material nozzle 212 may supply the modeling material M from the material supply port 2121 along a material supply direction inclined with respect to the Z axis. In this case, the material nozzle 212 may supply the modeling material M from multiple locations in the material supply port 2121 along different material supply directions. In other words, the material nozzle 212 may supply the modeling material M from multiple supply positions in the material supply port 2121 along different material supply directions. 3 and 4(a) to 4(c), the material nozzle 212 may supply the modeling material M so that the modeling material M is supplied from a first supply port portion 2122 of the material supply port 2121 along a first material supply direction inclined with respect to the Z axis, and the modeling material M is supplied from a second supply port portion 2123 of the material supply port 2121, which is different from the first supply port portion 2122, along a second material supply direction inclined with respect to the Z axis and different from the first material supply direction. In this case, as shown in FIGS. 4(a) to 4(c), the size (e.g., outer diameter) of the material supply area MSA within the material supply surface PL typically changes depending on the distance between the material supply surface PL and the material nozzle 212 (particularly the material supply port 2121) along the Z axis.

[0048] 4( a) to 4(c), the material nozzle 212 supplies the modeling material M so that the size of the material supply area MSA within the material supply area PL decreases as the distance between the material supply area PL and the material nozzle 212 (particularly the material supply port 2121) along the Z axis increases. In other words, the material nozzle 212 supplies the modeling material M so that the modeling material M supplied from the material nozzle 212 gradually converges. As an example, in the example shown in FIG. 4(a), the size (e.g., outer diameter) of the material supply area MSA on the material supply area PL#2 is smaller than the size (e.g., outer diameter) of the material supply area MSA on the material supply area PL#1 located between the material supply area PL#2 and the material nozzle 212 (i.e., closer to the material nozzle 212 than the material supply area PL#2).

[0049] When the modeling material M is supplied from multiple locations of the material supply port 2121 along different directions, the material nozzle 212 may supply the modeling material M so that multiple virtual material supply axes SX extending along multiple material supply directions intersect. For example, as shown in Figures 4(a) to 4(c), the material nozzle 212 may supply the modeling material M so that a virtual material supply axis SX#1 extending along the material supply direction of the modeling material M supplied from the first supply port portion 2122 of the material supply port 2121 intersects with a virtual material supply axis SX#2 extending along the material supply direction of the modeling material M supplied from the second supply port portion 2123 of the material supply port 2121.

[0050] 4A, the material nozzle 212 may supply the modeling material M such that multiple virtual material supply axes SX extending along multiple material supply directions intersect above the modeling surface MS. In other words, the material nozzle 212 may supply the modeling material M such that multiple virtual material supply axes SX extending along multiple material supply directions intersect in the space between the modeling surface MS and the material nozzle 212. In this case, the modeling material M supplied from multiple locations of the material supply port 2121 along different material supply directions may intersect above the modeling surface MS. In other words, the modeling material M supplied from multiple locations of the material supply port 2121 along different material supply directions may intersect in the space between the modeling surface MS and the material nozzle 212. In this case, as shown in Figure 4(a), within the material supply surface PL (in the example shown in Figure 4(a), material supply surface PL#3) located at the position where the modeling material M supplied from multiple locations of the material supply port 2121 along different material supply directions intersects, the shape of the material supply area MSA may be a shape other than an annular shape. For example, as shown in Figure 4(a), the shape of the material supply area MSA may be a circle or a shape that can be regarded as a circle.

[0051] As another example, as shown in FIG. 4( b), the material nozzle 212 may supply the modeling material M so that multiple virtual material supply axes SX extending along multiple material supply directions intersect below the modeling surface MS. In this case, the modeling material M supplied from multiple locations of the material supply port 2121 along different directions may not intersect. The modeling material M supplied from multiple locations of the material supply port 2121 along different directions may reach the modeling surface MS before intersecting with each other. In this case, as shown in FIG. 4( b), within the modeling surface MS that may be considered the material supply surface PL, the shape of the material supply area MSA may be annular. However, within the modeling surface MS that may be considered the material supply surface PL, the shape of the material supply area MSA may be different from annular. For example, within the modeling surface MS, the shape of the material supply area MSA may be circular or a shape that can be considered circular.

[0052] As another example, as shown in FIG. 4( c), the material nozzle 212 may supply the building material M so that multiple virtual material supply axes SX extending along multiple material supply directions intersect on the building surface MS. In this case, the building material M supplied from multiple locations of the material supply port 2121 along multiple different material supply directions may intersect on the building surface MS. In this case, as shown in FIG. 4( c), within the building surface MS that may be considered the material supply surface PL, the shape of the material supply area MSA may be different from an annular shape. For example, within the building surface MS, the shape of the material supply area MSA may be circular or a shape that can be considered circular.

[0053] In the following description, for convenience of explanation, the position (point) where multiple virtual material supply axes SX extending along multiple material supply directions intersect is referred to as the material control point MCP. Note that, if the modeling material M is a powder, the material control point MCP may also be referred to as a powder control point. In this case, in the example shown in FIG. 4( a), the material nozzle 212 can be said to supply the modeling material M with the material control point MCP located above the modeling surface MS. In the example shown in FIG. 4( a), the material nozzle 212 can be said to supply the modeling material M with the material control point MCP located in the space between the modeling surface MS and the material nozzle 212. On the other hand, in the example shown in FIG. 4( b), the material nozzle 212 can be said to supply the modeling material M with the material control point MCP located below the modeling surface MS. 4(b), the material nozzle 212 supplies the building material M in a state where the material control point MCP is located inside (inside) the workpiece W, below the workpiece W, inside (inside) the already-built structure layer SL, and / or below the already-built structure layer SL. On the other hand, in the example shown in FIG. 4(c), the material nozzle 212 supplies the building material M in a state where the material control point MCP is located on the building surface MS.

[0054] The material supply direction from the material nozzle 212 is typically a direction specific to the material nozzle 212. For this reason, the material control point MCP may be considered to be a point specific to the material nozzle 212. In other words, the material control point MCP may be considered to be a point determined based on the material nozzle 212. Note that, as long as the material control point MCP is a point determined based on the material nozzle 212, a position (point) different from the position (point) at which multiple virtual material supply axes SX intersect may be used as the material control point MCP. Note that, when the material control point MCP is a point determined based on the material nozzle 212, the positional relationship between the material control point MCP and the material nozzle 212 may be considered to be fixed.

[0055] Because multiple virtual material supply axes SX extending along multiple material supply directions intersect at the material control point MCP, when there is no object (e.g., a workpiece W having a printing surface MS on its surface; the same applies below) that blocks the printing material M, the printing material M supplied from the material nozzle 212 along multiple different material supply directions is supplied to the material control point MCP. Therefore, the material control point MCP may be considered to be a point to which the printing material M is supplied from the material nozzle 212 along multiple different material supply directions when there is no object that blocks the printing material M. The material control point MCP may be considered to be a point located in space where the printing material M can be supplied from the material nozzle 212 when there is no object that blocks the printing material M.

[0056] In reality, in a situation where an object (e.g., a printing surface MS) that blocks the printing material M is present, when the material control point MCP is located below the printing surface MS as described above, the material control point MCP may be located in the space occupied by the object (typically, the workpiece W) that blocks the printing material M. The material control point MCP may also be located inside the object (typically, the workpiece W) that blocks the printing material M.

[0057] Because multiple virtual material supply axes SX extending along multiple material supply directions intersect at the material control point MCP, when there is no object blocking the modeling material M, the modeling material M supplied from the material nozzle 212 along multiple different material supply directions intersects at the material control point MCP. Therefore, when there is no object blocking the modeling material M, the material control point MCP may be considered to be the point where the modeling material M supplied from the material nozzle 212 along multiple different material supply directions intersect.

[0058] Because multiple virtual material supply axes SX extending along multiple material supply directions intersect at the material control point MCP, when there is no object blocking the modeling material M, the modeling material M supplied from the material nozzle 212 along multiple different material supply directions converges at the material control point MCP. For this reason, the material control point MCP may be considered to be a point where the modeling material M supplied from the material nozzle 212 along multiple different material supply directions converges when there is no object blocking the modeling material M.

[0059] Because multiple virtual material supply axes SX extending along multiple material supply directions intersect at the material control point MCP, when there is no object blocking the modeling material M, the modeling material M supplied from the material nozzle 212 along multiple different material supply directions is concentrated at the material control point MCP. For this reason, the material control point MCP may be considered to be a point where the modeling material M supplied from the material nozzle 212 along multiple different material supply directions is concentrated when there is no object blocking the modeling material M.

[0060] Because the building material M supplied from the material nozzle 212 along multiple different material supply directions intersect (converge or concentrate) at the material control point MCP, the density of the building material M within the material supply plane PL located at the same position as the material control point MCP in the Z-axis direction is higher than the density of the building material M within the material supply plane PL located away from the material control point MCP along the Z-axis direction. Typically, the density of the building material M is highest within the material supply plane PL located at the same position as the material control point MCP in the Z-axis direction. For this reason, the material control point MCP may be considered to be a point located at the same position in the Z-axis direction as one material supply plane PL that satisfies the condition that "the density of the building material M within the material supply plane PL is highest."

[0061] Because multiple imaginary material supply axes SX extending along multiple material supply directions intersect at the material control point MCP, there is a relatively high possibility that the shape of the material supply area MSA will be circular or a shape that can be regarded as circular (i.e., a shape other than an annular shape) at the position of the material control point MCP, as explained with reference to Figures 4(a) to 4(c). In this case, the material control point MCP may be considered to be a point whose position in the Z-axis direction is the same as that of one material supply surface PL that satisfies the condition that "the shape of the material supply area MSA within the material supply surface PL is circular or a shape that can be regarded as circular (i.e., a shape other than an annular shape)."

[0062] 1 and 2 , the processing light EL emitted from the irradiation optical system 211 may travel through a space at least partially surrounded by the shaping material M supplied from the material nozzle 212. In this case, the processing light EL traveling through the space at least partially surrounded by the shaping material M supplied from the material nozzle 212 may be irradiated onto the shaping surface MS. For example, in the example shown in FIG. 1 (and further in FIGS. 4( a ) to 4 ( c )), the processing light EL emitted from the irradiation optical system 211 may travel through a conical space whose outer edge is the shaping material M supplied from the material nozzle 212. For example, in the example shown in FIG. 1 (and further in FIGS. 4( a ) to 4 ( c )), the processing light EL emitted from the irradiation optical system 211 may travel through a conical space whose outer edge is the shaping material M supplied from the material nozzle 212.

[0063] The processing light EL emitted from the irradiation optical system 211 may travel through a space sandwiched between the shaping materials M supplied from multiple locations on the material nozzle 212. In this case, the processing light EL traveling through the space sandwiched between the shaping materials M supplied from multiple locations on the material nozzle 212 may be irradiated onto the shaping surface MS. For example, in the example shown in FIG. 1 (and further in FIGS. 4(a) to 4(c)), the processing light EL emitted from the irradiation optical system 211 may travel through a space sandwiched between the shaping materials M supplied from the first supply port portion 2122, which is a part of the material supply port 2121, and the shaping materials M supplied from the second supply port portion 2123, which is another part of the material supply port 2121. In other words, the processing light EL emitted from the irradiation optical system 211 may travel through a cone-shaped or frustum-shaped space whose ridgelines are multiple material supply axes SX extending along multiple material supply directions.

[0064] 1 , the processing light EL may travel through a space at least partially surrounded by the modeling material M supplied from the material nozzle 212. In this case, the processing light EL traveling through the space surrounded by at least a portion of the material nozzle 212 may be emitted toward below the material nozzle 212 through an opening 2124 formed in the lower surface 2120 of the material nozzle 212. In other words, the processing light EL may be emitted from the space surrounded by at least a portion of the material nozzle 212 toward the space below the material nozzle 212 through the opening 2124 formed in the lower surface 2120 of the material nozzle 212.

[0065] 1 and 2 , the head drive system 22 moves the machining head 21 under the control of the control unit 7. That is, the head drive system 22 moves the irradiation optical system 211 and the material nozzle 212 under the control of the control unit 7. The head drive system 22 moves the machining head 21, for example, along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. Note that the operation of moving the machining head 21 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the machining head 21 around at least one of the rotation axes along the X-axis, Y-axis, and Z-axis.

[0066] When the head drive system 22 moves the machining head 21, the relative positional relationship between the machining head 21 and the stage 31 and the workpiece W placed on the stage 31 changes. As a result, the relative positional relationship between the stage 31, the workpiece W, and the irradiation optical system 211 provided in the machining head 21 changes. For this reason, the head drive system 22 may be considered to function as a position changing device that can change the relative positional relationship between the stage 31, the workpiece W, and the irradiation optical system 211. Furthermore, when the relative positional relationship between the stage 31, the workpiece W, and the machining head 21 changes, the relative positional relationship between the target irradiation areas EA#1 and EA#2 and the workpiece W also changes. In other words, each of the target irradiation areas EA#1 and EA#2 moves along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction on the surface of the workpiece W (more specifically, the build surface MS on which additional machining is performed). In this case, it may be considered that the head drive system 22 moves the processing head 21 so that the target irradiation areas EA#1 and EA#2 each move on the printing surface MS.

[0067] The stage unit 3 includes a stage 31 and a stage drive system 32 .

[0068] The workpiece W is placed on the stage 31. Specifically, the workpiece W is placed on a stage placement surface 311, which is one surface of the stage 31 (e.g., the upper surface facing the +Z side). The stage 31 is capable of supporting the workpiece W placed on the stage 31. The stage 31 may be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like to hold the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W placed on the stage 31. In this case, the workpiece W may be placed on the stage 31 in a clampless manner. Furthermore, the workpiece W may be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The above-mentioned irradiation optical system 211 emits each of the processing lights EL#1 and EL#2 during at least a portion of the period during which the workpiece W is placed on the stage 31. Furthermore, the material nozzle 212 described above supplies the modeling material M for at least a portion of the period during which the workpiece W is placed on the stage 31 .

[0069] The stage drive system 32 moves the stage 31. The stage drive system 32 moves the stage 31, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. Note that the operation of moving the stage 31 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the stage 31 around at least one of a rotation axis along the X-axis (i.e., A-axis), a rotation axis along the Y-axis (i.e., B-axis), and a rotation axis along the Z-axis (i.e., C-axis).

[0070] When the stage drive system 32 moves the stage 31, the relative positional relationships between the machining head 21 and each of the stage 31 and workpiece W change. As a result, the relative positional relationships between the stage 31, workpiece W, and the irradiation optical system 211 provided in the machining head 21 change. For this reason, the stage drive system 32, like the head drive system 22, may be considered to function as a position changing device that can change the relative positional relationships between the stage 31, workpiece W, and each of the irradiation optical system 211. Furthermore, when the relative positional relationships between the stage 31, workpiece W, and the machining head 21 change, the relative positional relationships between each of the target irradiation areas EA#1 and EA#2 and the workpiece W also change. In other words, each of the target irradiation areas EA#1 and EA#2 moves on the surface of the workpiece W (more specifically, the printing surface MS) along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. In this case, it may be considered that the stage drive system 32 moves the stage 31 so that the target irradiation areas EA#1 and EA#2 each move on the printing surface MS.

[0071] The light source 4 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include a plurality of pulsed lights (i.e., a plurality of pulse beams). The processing light EL may be laser light. In this case, the light source 4 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD)). Examples of laser light sources include fiber lasers, CO ２ At least one of a laser, a YAG laser, an excimer laser, etc. may be used. However, the processing light EL does not have to be laser light. The light source 4 may include any light source (for example, at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0072] As described above, the processing system SYSa includes multiple light sources 4 (specifically, light sources 4#1 and 4#2). In this case, the characteristics of the processing light EL#1 emitted by light source 4#1 and the characteristics of the processing light EL#2 emitted by light source 4#2 may be the same. For example, the wavelength of the processing light EL#1 (typically, the peak wavelength, which is the wavelength at which the intensity is maximum in the wavelength band of the processing light EL#1) and the wavelength of the processing light EL#2 (typically, the peak wavelength) may be the same. For example, the wavelength band of the processing light EL#1 (typically, the range of wavelengths at which the intensity is equal to or greater than a certain value) and the wavelength band of the processing light EL#2 may be the same. For example, the intensity of the processing light EL#1 and the intensity of the processing light EL#2 may be the same. For example, the absorptivity of the workpiece W for the processing light EL#1 (or the object whose surface MS is the surface; the same applies below) may be the same as the absorptivity of the workpiece W for the processing light EL#2. In particular, the absorptivity of the workpiece W for the peak wavelength of processing light EL#1 and the absorptivity of the workpiece W for the peak wavelength of processing light EL#2 may be the same. Alternatively, the characteristics of processing light EL#1 emitted by light source 4#1 and the characteristics of processing light EL#2 emitted by light source 4#2 may be different. For example, the wavelength (typically, peak wavelength) of processing light EL#1 and the wavelength (typically, peak wavelength) of processing light EL#2 may be different. For example, the wavelength band of processing light EL#1 and the wavelength band of processing light EL#2 may be different. For example, the intensity of processing light EL#1 and the intensity of processing light EL#2 may be different. For example, the absorptivity of the workpiece W for processing light EL#1 and the absorptivity of the workpiece W for processing light EL#2 may be different. In particular, the absorptivity of the workpiece W for the peak wavelength of processing light EL#1 and the absorptivity of the workpiece W for the peak wavelength of processing light EL#2 may be different.

[0073] In the first embodiment, an example in which the processing system SYSa includes multiple light sources 4 has been described. However, the processing system SYSa does not necessarily have to include multiple light sources 4. The processing system SYSa may include a single light source 4. As an example, the processing system SYSa may include a light source that emits (supplies) light of a wide wavelength band or multiple wavelengths as the single light source 4. In this case, the processing system SYSa may wavelength-divide the light emitted from this light source to generate processing light EL#1 and processing light EL#2 of different wavelengths. In addition, in this case, the processing system SYSa may amplitude-divide or polarization-divide the light emitted from this light source.

[0074] The gas supply source 5 is a supply source of purge gas for purging the chamber space 63IN inside the housing 6. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas and argon gas. The gas supply source 5 is connected to the chamber space 63IN via a supply port 62 formed in a partition member 61 of the housing 6 and a supply pipe 51 connecting the gas supply source 5 and the supply port 62. The gas supply source 5 supplies purge gas to the chamber space 63IN via the supply pipe 51 and the supply port 62. As a result, the chamber space 63IN becomes a space purged with the purge gas. The purge gas supplied to the chamber space 63IN may be discharged from an exhaust port (not shown) formed in the partition member 61. The gas supply source 5 may be a cylinder containing an inert gas. When the inert gas is nitrogen gas, the gas supply source 5 may be a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material.

[0075] As described above, when the material nozzle 212 supplies the modeling material M together with a purge gas, the gas supply source 5 may supply the purge gas to the mixer 12 to which the modeling material M is supplied from the material supply source 1. Specifically, the gas supply source 5 may be connected to the mixer 12 via a supply pipe 52 connecting the gas supply source 5 and the mixer 12. As a result, the gas supply source 5 supplies the purge gas to the mixer 12 via the supply pipe 52. In this case, the modeling material M from the material supply source 1 may be supplied (specifically, pressure-fed) through the supply pipe 11 toward the material nozzle 212 by the purge gas supplied from the gas supply source 5 via the supply pipe 52. In other words, the gas supply source 5 may be connected to the material nozzle 212 via the supply pipe 52, the mixer 12, and the supply pipe 11. In this case, the material nozzle 212 supplies the modeling material M together with the purge gas for pressure-fed the modeling material M.

[0076] The control unit 7 controls the operation of the machining system SYSa. For example, the control unit 7 may control the machining unit 2 (e.g., at least one of the machining head 21 and the head drive system 22) included in the machining system SYSa to perform additional machining on the workpiece W. For example, the control unit 7 may control the stage unit 3 (e.g., the stage drive system 32) included in the machining system SYSa to perform additional machining on the workpiece W. For example, the control unit 7 may control the material supply source 1 included in the machining system SYSa to perform additional machining on the workpiece W. For example, the control unit 7 may control the light source 4 included in the machining system SYSa to perform additional machining on the workpiece W. For example, the control unit 7 may control the gas supply source 5 included in the machining system SYSa to perform additional machining on the workpiece W. For example, the control unit 7 may control the imaging device 8 included in the machining system SYSa to perform additional machining on the workpiece W.

[0077] The control unit 7 may include, for example, a computing device 71 and a storage device 72. Each of the computing device 71 and the storage device 72 is hardware including at least a circuit (for example, at least one of an electronic circuit and an electric circuit). Therefore, the computing device 71 and the storage device 72 may be referred to as a computing circuit and a storage circuit, respectively. Alternatively, each of the computing device 71 and the storage device 72 may be simply referred to as a circuit.

[0078] The arithmetic device 71 includes at least one processor (i.e., one processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. The processor conforming to the von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. The processor conforming to the non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Circuit). The processor may be realized by a circuit (e.g., an electronic circuit).

[0079] The arithmetic device 71 reads a computer program 721 including at least one of computer program code and computer program instructions. For example, the arithmetic device 71 may read the computer program 321 stored in the storage device 72. For example, the arithmetic device 71 may read the computer program 721 stored in a computer-readable, non-transitory storage medium using a storage medium reading device (not shown) included in the control unit 7. The computer program 721 read from the storage medium may be stored in the storage device 72. The arithmetic device 71 may obtain (i.e., download or read) the computer program 721 from a device (not shown) located outside the control unit 7 via a communication device (not shown). The downloaded computer program 721 may be stored in the storage device 72.

[0080] The arithmetic device 71 executes the loaded computer program 721. As a result, logical functional blocks for executing the processing (operation) to be performed by the control unit 7 are realized within the arithmetic device 71. In other words, the arithmetic device 71, together with the storage device 72 etc. in which the computer program 721 is recorded (in other words, together with the storage device 72 and the computer program 721 recorded in the storage device 72 etc.), can function as a controller or computer for realizing the logical functional blocks for executing the processing to be performed by the control unit 7. In other words, the at least one processor included in the arithmetic device 71, the memory (recording medium) included in the storage device 72 etc., and the computer program 721 are configured so that the control unit 7 performs the processing to be performed by the control unit 7 (for example, the robot control processing described above).

[0081] The storage device 72 includes at least one memory capable of storing desired data. In other words, the storage device 72 includes at least one memory containing desired data. The memory may be realized by a circuit (e.g., an electronic circuit). For example, the storage device 72 may store a computer program 721 executed by the arithmetic device 71. In this case, the storage device 72 (memory) may be used as the above-mentioned recording medium for recording the computer program 721 executed by the arithmetic device 71. The storage device 72 may temporarily store data used by the arithmetic device 71 when the arithmetic device 71 is executing the computer program 721. The storage device 72 may store data that the control unit 7 stores long-term. The storage device 72 may include at least one of a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk device, a magneto-optical disk device, an SSD (Solid State Drive), and a disk array device. That is, the storage device 72 may include a non-transitory recording medium.

[0082] The control unit 7 may control the emission mode of the processing light EL by the irradiation optical system 211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes multiple pulsed lights, the emission mode may include, for example, at least one of the emission duration of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission duration of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control unit 7 may control the movement mode of the processing head 21 by the head drive system 22. The control unit 7 may control the movement mode of the stage 31 by the stage drive system 32. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). Furthermore, the control unit 7 may control the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply time).

[0083] The control unit 7 does not have to be provided inside the machining system SYSa. For example, the control unit 7 may be provided as a server or the like outside the machining system SYSa. In this case, the control unit 7 and the machining system SYSa may be connected via a wired and / or wireless network (or a data bus and / or a communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE 1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an interface compliant with Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a network using radio waves is a network compliant with IEEE 802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control unit 7 and the machining system SYSa may be configured to be able to transmit and receive various information via the network. The control unit 7 may also be able to transmit information such as commands and control parameters to the machining system SYSa via the network. The machining system SYSa may include a receiving device that receives information such as commands and control parameters from the control unit 7 via the network. The machining system SYSa may also include a transmitting device that transmits information such as commands and control parameters to the control unit 7 via the network (i.e., an output device that outputs information to the control unit 7).Alternatively, a first control device that performs part of the processing performed by the control unit 7 may be provided inside the processing system SYSa, while a second control device that performs another part of the processing performed by the control unit 7 may be provided outside the processing system SYSa.

[0084] A computational model that can be constructed by machine learning may be implemented in the control unit 7 by the arithmetic device 71 executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The control unit 7 may use the computational model to control the operation of the machining system SYSa. In other words, the operation of controlling the operation of the machining system SYSa may include the operation of controlling the operation of the machining system SYSa using the computational model. Note that a computational model that has been constructed by offline machine learning using training data may be implemented in the control unit 7. Furthermore, the computational model implemented in the control unit 7 may be updated on the control unit 7 by online machine learning. Alternatively, the control unit 7 may control the operation of the machining system SYSa using a computational model implemented in a device external to the control unit 7 (i.e., a device provided outside the machining system SYSa) in addition to or instead of the computational model implemented in the control unit 7.

[0085] The recording medium for recording the computer program executed by the control unit 7 may be at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control unit 7 when the control unit 7 (i.e., the computer) executes the computer program, or may be realized by a predetermined gate array (hardware such as an FPGA (Field Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit)) provided in the control unit 7, or may be realized in a form that combines logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0086] The imaging device 8 is capable of capturing an image of an object to be imaged. The imaging device 8 may be capable of capturing an image of the object to be imaged by receiving (in other words, detecting or capturing, the same hereinafter) light from the object to be imaged using the imaging element 81 included in the imaging device 8. In other words, the imaging device 8 may be capable of capturing an image of the object to be imaged by receiving light that passes through the object to be imaged. In this case, an image of the light from the object to be imaged (in other words, light that passes through the object to be imaged, the same hereinafter) may be formed on the imaging surface of the imaging device 8 (i.e., the imaging surface of the imaging element 81). In other words, the light from the object to be imaged (i.e., light that passes through the object to be imaged, the same hereinafter) may form an image of the object to be imaged on the imaging surface of the imaging device 8. The imaging surface is a detection surface that detects light from the object to be imaged. As a result, the imaging device 8 may generate an image IMG in which the object to be imaged is captured. An example of such an imaging device 8 is a camera. The imaging device 8 may also be referred to as a detection device or a light receiving device. The imaging element 81 may also be called a detection element, a detector, a light receiving element, or a light receiver.

[0087] The light from the object to be imaged may include light that passes through the object to be imaged and into which the processing light EL emitted from the processing unit 2 is incident.

[0088] The light passing through the imaging target object onto which the processing light EL is incident may include light that is emitted from the processing unit 2 toward the imaging target object and then returned from the imaging target object toward the processing unit 2. Specifically, the light passing through the imaging target object onto which the processing light EL is incident may include a light component of the processing light EL emitted from the processing unit 2 toward the imaging target object that is returned from the imaging target object toward the processing unit 2. In other words, the light passing through the imaging target object onto which the processing light EL is incident may include at least a portion of the processing light EL emitted from the processing unit 2 toward the imaging target object. For example, the light passing through the imaging target object onto which the processing light EL is incident may include a reflected light component of the processing light EL that is incident on the imaging target object and reflected by the imaging target object. For example, the light passing through the imaging target object onto which the processing light EL is incident may include a scattered light component of the processing light EL that is incident on the imaging target object and scattered by the imaging target object. For example, the light passing through the imaging target object onto which the processing light EL is incident may include a transmitted light component of the processing light EL that is incident on the imaging target object and transmitted through the imaging target object. For example, the light that passes through the image capture object and into which the processed light EL is incident may include diffracted light components that are diffracted by the image capture object and are part of the processed light EL that is incident on the image capture object.

[0089] The light passing through the object to be imaged and into which the processing light EL is incident may include light generated by the processing light EL irradiated onto the object to be imaged, in addition to or instead of the light emitted from the processing unit 2 toward the object to be imaged and then returned from the object to be imaged toward the processing unit 2. In other words, the light passing through the object to be imaged and into which the processing light EL is incident may include light generated by the processing light EL from the processing unit 2 and returned toward the processing unit 2.

[0090] The object to be imaged may include a workpiece W. In this case, the imaging device 8 may image the workpiece W. Specifically, the imaging device 8 may image the workpiece W by receiving light from the workpiece W. In this case, an image of the workpiece W may be formed on the imaging surface of the imaging device 8 (i.e., the imaging surface of the imaging element 81). As a result, the imaging device 8 may generate an image IMG in which the workpiece W is captured.

[0091] The object to be imaged may include a structure formed on the workpiece W. For example, the object to be imaged may include at least a portion of a structural layer SL formed as a structure on the workpiece W. For example, the object to be imaged may include at least a portion of a three-dimensional structure ST (i.e., a three-dimensional structure ST in which a plurality of structural layers SL are stacked) formed as a structure on the workpiece W. The imaging device 8 may image the structure. Specifically, the imaging device 8 may image the structure by receiving light from the structure. In this case, an image of the structure may be formed on the imaging surface of the imaging device 8 (i.e., the imaging surface of the imaging element 81). As a result, the imaging device 8 may generate an image IMG in which the structure is captured.

[0092] As described above, the surface of the structure layer SL (i.e., the object) or the surface of the workpiece W is set as the build surface MS on which the structure layer SL is built. When the build surface MS is irradiated with the processing light EL, a molten pool MP is formed on the build surface MS. In this case, the light from the workpiece W or the object may include light from the molten pool MP (i.e., molten metal, etc.) formed on the build surface MS by the processing light EL. The light from the molten pool MP may include light resulting from thermal radiation (e.g., blackbody radiation) of the molten metal. Note that because the molten pool MP is formed by the processing light EL, the light from the molten pool MP may be considered an example of the "light generated by the processing light EL irradiated on the object to be imaged." In this case, the imaging device 8 may image the molten pool MP as the object to be imaged. In other words, the imaging device 8 may image the portion of the workpiece W or the object where the molten pool MP is formed as the object to be imaged. Specifically, the imaging device 8 may capture an image of the molten pool MP by receiving light from the molten pool MP. In this case, an image of the molten pool MP may be formed on the imaging surface of the imaging device 8. As a result, the imaging device 8 may generate an image IMG in which the molten pool MP is captured.

[0093] The image capture target object may include the shaping material M supplied from the material nozzle 212. For example, the image capture target object may include the shaping material M supplied from the material nozzle 212 and before being irradiated with the processing light EL (i.e., the unmelted shaping material M). For example, the image capture target object may include the shaping material M supplied from the material nozzle 212 and after being irradiated with the processing light EL (i.e., the molten shaping material M). In this case, the image capture device 8 may capture the shaping material M as the image capture target object. Specifically, the image capture device 8 may capture the shaping material M by receiving light from the shaping material M. For example, when the shaping material M is not melted, the image capture device 8 may capture the shaping material M by receiving a light component (e.g., a reflected light component) of the processing light EL irradiated on the shaping material M that is returned from the shaping material toward the processing unit 2. For example, when the modeling material M is molten, the imaging device 8 may capture an image of the modeling material M by receiving light resulting from thermal radiation (e.g., blackbody radiation) of the molten modeling material M. Since the modeling material M is melted by the processing light EL, the light from the molten modeling material M may be considered an example of the "light generated by the processing light EL irradiated onto the image-captured object" described above. In these cases, an image of the modeling material M may be formed on the imaging surface of the imaging device 8. As a result, the imaging device 8 may generate an image IMG in which the modeling material M is captured.

[0094] As will be described in detail later when describing the first modeling operation performed by the processing system SYSa, in the first embodiment, the modeling material M may be melted on the modeling surface MS by irradiating the modeling material M that has reached the modeling surface MS with the processing light EL. In this case, the imaged object may include the modeling material M melted on the modeling surface MS. The modeling material M melted on the modeling surface MS may be considered to be at least a part of the molten pool MP. Furthermore, as will be described in detail later when describing the second modeling operation performed by the processing system SYSa, in the first embodiment, the modeling material M may be melted in the space between the modeling surface MS and the material nozzle 212 by irradiating the modeling material M with the processing light EL before the modeling material M reaches the modeling surface MS. In this case, the imaged object may include the modeling material M melted in the space between the modeling surface MS and the material nozzle 212.

[0095] The object to be imaged may include at least a part of the processing system SYSa. In the first embodiment, an example will be described in which the object to be imaged includes a material nozzle 212 included in the processing system SYSa. In this case, the imaging device 8 may image the material nozzle 212. Specifically, the imaging device 8 may image the modeling material M by receiving light from the material nozzle 212. For example, the imaging device 8 may image the material nozzle 212 by receiving ambient light reflected from the material nozzle 212. In this case, an image of the material nozzle 212 may be formed on the imaging surface of the imaging device 8. As a result, the imaging device 8 may generate an image IMG in which the material nozzle 212 is captured.

[0096] In the following description, for convenience of explanation, light from an object to be imaged, which is received by the image capturing device 8 in order to capture an image of the object to be imaged, will be referred to as "image capturing light CL."

[0097] As shown in FIG. 5 , which is a cross-sectional view illustrating an example of an imaging device 8 that captures an image of an object to be imaged, at least a portion of the optical path of the imaging light CL may overlap at least a portion of the optical path of the processing light EL emitted from the irradiation optical system 211. For example, in the example shown in FIG. 5 , the irradiation device 210 includes a mirror 2192 and a beam splitter 2193. In this case, the processing light EL emitted from the irradiation optical system 211 may pass through the beam splitter 2193, and the processing light EL that has passed through the beam splitter 2193 may be irradiated onto the forming material M supplied from the material nozzle 212 to the forming surface MS (or the material irradiation surface ES, which will be described later). In other words, the irradiation optical system 211 may emit the processing light EL toward the forming surface MS (or the material irradiation surface ES, which will be described later) via the beam splitter 2193. In this case, the beam splitter 2193 may be considered to function as an optical element that directs the processing light EL from the irradiation optical system 211 toward the forming surface MS (or the material irradiation surface ES, which will be described later). On the other hand, the imaging light CL from the object to be imaged (in the example shown in FIG. 5 , the workpiece W or structure layer SL whose surface is set as the printing surface MS) may be reflected by the beam splitter 2193, and the imaging light CL reflected by the beam splitter 2193 may be incident on the imaging device 8 via the mirror 2192. That is, the imaging device 8 may receive the imaging light CL via the beam splitter 2193 through which the processing light EL passes. In this case, the beam splitter 2193 may be considered to function as an optical element that directs the imaging light CL from the object to be imaged toward the imaging device 8. In this case, as shown in FIG. 5 , the optical path of the processing light EL between the beam splitter 2193 and the printing surface MS (or the material irradiation surface ES, which will be described later) and the optical path of the imaging light CL between the beam splitter 2193 and the printing surface MS (or the material irradiation surface ES, which will be described later) may overlap. However, at least a portion of the optical path of the imaging light CL does not have to overlap with at least a portion of the optical path of the processing light EL emitted from the irradiation optical system 211 .

[0098] 5, the processing light EL emitted from the irradiation optical system 211 (specifically, emitted from the fθ lens 2162, which is provided as the final optical element of the irradiation optical system 211 and will be described later) is incident on the beam splitter 2193. That is, the beam splitter 2193 is disposed on the optical path of the processing light EL emitted from the irradiation optical system 211 (specifically, emitted from the fθ lens 2162). In other words, the beam splitter 2193 is disposed on the optical path of the processing light EL between the printing surface MS (or the material irradiation surface ES, which will be described later) and the irradiation optical system 211 (particularly, the fθ lens 2162). However, the beam splitter 2193 may be disposed so that the fθ lens 2162 (or a part of the irradiation optical system 211) is disposed on the optical path of the processing light EL between the printing surface MS (or the material irradiation surface ES, which will be described later) and the beam splitter 2193. In this case, the processing light EL emitted from the beam splitter 2193 may be incident on the fθ lens 2162, and the processing light EL emitted from the fθ lens 2162 may be irradiated onto the printing surface MS (or the material irradiation surface ES, which will be described later). Furthermore, the imaging light CL from the printing material M may be incident on the beam splitter 2193 via the fθ lens 2162.

[0099] As described above, the processing light EL emitted from the irradiation optical system 211 may travel through a space at least partially surrounded by the shaping material M supplied from the material nozzle 212. In this case, if at least a portion of the optical path of the imaging light CL overlaps with at least a portion of the optical path of the processing light EL, the imaging light CL may also travel through a space at least partially surrounded by the shaping material M supplied from the material nozzle 212, as shown in FIG. 5 . For example, as shown in FIG. 5 , the imaging light CL may travel through a conical space whose outer edge is the shaping material M supplied from the material nozzle 212. As an example, the imaging light CL may travel through a space sandwiched between the shaping material M supplied from the first supply port portion 2122 of the material supply port 2121 (see FIGS. 4( a ) to 4( c )) and the shaping material M supplied from the second supply port portion 2123 of the material supply port 2121 (see FIGS. 4( a ) to 4( c )). In this case, the imaging light CL is less likely to be blocked by the building material M than when the imaging light CL travels through a space outside the space at least partially surrounded by the building material M supplied from the material nozzle 212. Therefore, the imaging device 84 can properly receive the imaging light CL without being affected by the building material M. In other words, the imaging device 84 can properly image the building material M supplied to the material irradiation surface ES without being affected by the building material M.

[0100] When the imaging light CL travels through a space at least partially surrounded by the building material M supplied from the material nozzle 212, the imaging device 8 may be considered to be imaging the object to be imaged from the space at least partially surrounded by the building material M supplied from the material nozzle 212. In this case, the imaging device 8 may image the object to be imaged by receiving the imaging light CL that passes through the space at least partially surrounded by the building material M supplied from the material nozzle 212 and then passes through the opening 2124 formed in the lower surface 2120 of the material nozzle 212. In other words, the imaging device 8 may image the object to be imaged by receiving the imaging light CL that passes through the space at least partially surrounded by the building material M supplied from the material nozzle 212 and then passes through the inside of the material supply port 2121 formed in the lower surface 2120 of the material nozzle 212. In this manner, the imaging light CL may travel along an optical path that passes through the opening 2124 (i.e., passes through the inside of the material supply port 2121), and the imaging device 8 may have an imaging optical path that passes through the opening 2124 (i.e., passes through the inside of the material supply port 2121). In this case, the imaging device 8 may image the material nozzle 212, which is another imaging target object, along with one imaging target object (e.g., the workpiece W or the structure layer SL whose surface is set to the build surface MS) located below the material nozzle 212. For example, the imaging device 8 may image the lower end (opening 2124) of the material nozzle 212 together with the workpiece W or the structure layer SL below the material nozzle 212. In this case, the beam splitter 2193 may be located closer to the fθ lens 2162 (the third optical system 216) than the lower end (opening 2124) of the material nozzle 212.

[0101] The beam splitter 2193 may be an amplitude division type beam splitter, a polarizing beam splitter, a dichroic mirror, or a pinhole mirror. When an amplitude division type beam splitter is used as the beam splitter 2193, the split ratio does not need to be 1:1, and may be a split ratio in which the transmittance on the optical path side of the processing light EL is higher than the reflectance on the imaging optical path side.

[0102] As shown in FIG. 5 , the irradiation device 210 may include an illumination device 213 that illuminates the image capture target object with illumination light IL. In this case, the image capture device 8 may capture an image of the image capture target object illuminated with the illumination light IL emitted from the illumination device 213. For example, the image capture device 8 may capture an image of the image capture target object illuminated with the illumination light IL emitted from the illumination device 213. For example, the image capture device 8 may capture an image of the image capture target object by receiving, as imaging light CL, a reflected light component of the illumination light IL that illuminates the image capture target object and that is reflected by the image capture target object. For example, the image capture device 8 may capture an image of the image capture target object by receiving, as imaging light CL, a scattered light component of the illumination light IL that illuminates the image capture target object and that is scattered by the image capture target object.

[0103] 5 shows an example in which the illumination device 213 illuminates the workpiece W or the structure layer SL, which are examples of the object to be imaged and whose surface is set as the build surface MS, with the illumination light IL. However, the illumination device 213 may also illuminate at least one of the material nozzle 212 and the build material M, which are other examples of the object to be imaged, with the illumination light IL.

[0104] The imaging device 8 may image the object to be imaged while the machining system SYSa is performing additional machining. The imaging device 8 may image the object to be imaged before the machining system SYSa starts additional machining. The imaging device 8 may image the object to be imaged after the machining system SYSa has finished additional machining. Note that, when the imaging device 8 images the molten pool MP as described above, the imaging device 8 may image the molten pool MP while the machining system SYSa is performing additional machining. This is because the molten pool MP is formed while the machining system SYSa is performing additional machining.

[0105] The above-described control unit 7 may control the operation of the machining system SYSa based on the imaging result of the imaging device 8. That is, the control unit 7 may control the operation of the machining system SYSa based on the image IMG generated by the imaging device 8 as the imaging result of the imaging device 8. In other words, the control unit 7 may control the operation of the machining system SYSa based on the light reception result (i.e., imaging result or detection result, the same hereinafter) of light from the imaging target object by the imaging device 8. For example, the control unit 7 may control at least one of the material supply source 1, the machining unit 2, the stage unit 3, the light source 4, and the gas supply source 5 included in the machining system SYSa based on the image IMG so as to perform additional machining on the workpiece W.

[0106] (1-2) Configuration of Irradiation Optical System 211 Next, the configuration of the irradiation optical system 211 will be described with reference to Fig. 6. Fig. 6 is a cross-sectional view showing the configuration of the irradiation optical system 211.

[0107] As shown in Fig. 6, the irradiation optical system 211 includes a first optical system 214, a second optical system 215, and a third optical system 216. The first optical system 214 is an optical system into which the processing light EL#1 emitted from the light source 4#1 is incident. The first optical system 214 is an optical system that outputs the processing light EL#1 emitted from the light source 4#1 toward the third optical system 216. The second optical system 215 is an optical system into which the processing light EL#2 emitted from the light source 4#2 is incident. The second optical system 215 is an optical system that outputs the processing light EL#2 emitted from the light source 4#2 toward the third optical system 216. The third optical system 216 is an optical system into which the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 are incident. The third optical system 216 is an optical system that emits the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 toward the printing surface MS. Below, the first optical system 214, the second optical system 215, and the third optical system 216 will be described in order.

[0108] The first optical system 214 includes a collimator lens 2141, a parallel plate 2142, a power meter 2143, and a galvanometer scanner 2144. The galvanometer scanner 2144 includes a focus control optical system 2145 and a galvanometer mirror 2146. However, the first optical system 214 does not necessarily have to include at least one of the collimator lens 2141, the parallel plate 2142, the power meter 2143, and the galvanometer scanner 2144. The galvanometer scanner 2144 does not necessarily have to include at least one of the focus control optical system 2145 and the galvanometer mirror 2146.

[0109] The processing light EL#1 emitted from the light source 4#1 is incident on the collimator lens 2141. The collimator lens 2141 converts the processing light EL#1 incident on the collimator lens 2141 into parallel light. Note that if the processing light EL#1 emitted from the light source 4#1 is parallel light (i.e., if the processing light EL#1, which is parallel light, enters the first optical system 214), the first optical system 214 does not need to include the collimator lens 2141. The processing light EL#1 converted into parallel light by the collimator lens 2141 is incident on the parallel plate 2142. The parallel plate 2142 is disposed obliquely with respect to the optical path of the processing light EL#1 incident on the parallel plate 2142. A portion of the processing light EL#1 incident on the parallel plate 2142 passes through the parallel plate 2142. Another portion of the processing light EL#1 incident on the parallel plate 2142 is reflected by the parallel plate 2142.

[0110] The processing light EL#1 that has passed through the parallel plate 2142 is incident on the galvanometer scanner 2144. Specifically, the processing light EL#1 that has passed through the parallel plate 2142 is incident on the focus control optical system 2145 of the galvanometer scanner 2144.

[0111] The focus control optical system 2145 is an optical element that can change the focus position CP of the processing light EL#1 (hereinafter referred to as the "focus position CP#1"). In the first embodiment, the focus position CP#1 of the processing light EL#1 may refer to the focus position where the processing light EL#1 is focused. The focus position CP#1 of the processing light EL#1 may refer to the convergence position where the processing light EL#1 is most convergent in the irradiation direction (travel direction) of the processing light EL#1.

[0112] Specifically, the focus control optical system 2145 can change the focus position CP#1 of the processing light EL#1 along the irradiation direction of the processing light EL#1 emitted from the irradiation optical system 211. In the example shown in FIG. 6 , the irradiation direction of the processing light EL#1 emitted from the irradiation optical system 211 is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2145 can change the focus position CP#1 of the processing light EL#1 along the Z-axis direction. Furthermore, because the irradiation optical system 211 irradiates the processing light EL onto the printing surface MS from above the workpiece W, the irradiation direction of the processing light EL#1 is a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). Therefore, the focus control optical system 2145 can be considered to be able to change the focus position CP#1 of the processing light EL#1 along a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus control optical system 2145 may be considered to be capable of changing the focus position CP#1 of the processing light EL#1 along the direction of the optical axis AX of the irradiation optical system 211 (typically the third optical system 216).

[0113] The irradiation direction of the processing light EL#1 may refer to the irradiation direction of the processing light EL#1 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the third optical system 216. The final optical element may be the fθ lens 2162 described below. Furthermore, if the fθ lens 2162 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 2162.

[0114] It should be noted that the irradiation optical system 211 does not necessarily have to include the third optical system 216. When the irradiation optical system 211 does not include the third optical system 216, the final optical member may be the optical member (Y-scanning mirror 2146MY) that is arranged closest to the printing surface MS among the multiple optical members that make up the first optical system 214. When the irradiation optical system 211 does not include the third optical system 216, the final optical member may be the optical member (Y-scanning mirror 2156MY) that is arranged closest to the printing surface MS among the multiple optical members that make up the second optical system 215.

[0115] The focus control optical system 2145 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL#1. That is, the focus control optical system 2145 may include, for example, multiple refractive optical elements aligned along the irradiation direction of the processing light EL#1. In this case, the focus control optical system 2145 may change the focus position CP#1 of the processing light EL#1 by moving at least one of the multiple optical elements (refractive optical elements) along its optical axis direction. However, the focus control optical system 2145 may also include a reflective optical element such as a mirror, and the focus position CP#1 of the processing light EL#1 may be changed by moving the reflective optical element.

[0116] When the focus control optical system 2145 changes the focus position CP#1 of the processing light EL#1, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS changes. In particular, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 (i.e., the Z-axis direction) changes. Therefore, by changing the focus position CP#1 of the processing light EL#1, the focus control optical system 2145 may be considered to be changing the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS (in particular, the positional relationship in the Z-axis direction). By changing the focus position CP#1 of the processing light EL#1, the focus control optical system 2145 may be considered to be changing the distance between the focus position CP#1 of the processing light EL#1 and the printing surface MS (in particular, the distance in the Z-axis direction).

[0117] When the focus control optical system 2145 changes the focus position CP#1 of the processing light EL#1, the positional relationship between the focus position CP#1 of the processing light EL#1 and the material control point MCP changes. In particular, the positional relationship between the focus position CP#1 of the processing light EL#1 and the material control point MCP in the irradiation direction of the processing light EL#1 (i.e., the Z-axis direction) changes. Therefore, by changing the focus position CP#1 of the processing light EL#1, the focus control optical system 2145 may be considered to be changing the positional relationship (particularly, the positional relationship in the Z-axis direction) between the focus position CP#1 of the processing light EL#1 and the material control point MCP. By changing the focus position CP#1 of the processing light EL#1, the focus control optical system 2145 may be considered to be changing the distance (particularly, the distance in the Z-axis direction) between the focus position CP#1 of the processing light EL#1 and the material control point MCP.

[0118] As described above, the galvanometer scanner 2144 does not necessarily have to include the focus control optical system 2145. Even in this case, if the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#1 changes, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 changes. Therefore, even if the galvanometer scanner 2144 does not include the focus control optical system 2145, the processing system SYSa can change the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1. For example, the processing system SYSa may change the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 by using the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#1. For example, the processing system SYSa may use the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#1, thereby changing the positional relationship between the focus position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the manufacturing surface MS.

[0119] The processing light EL#1 emitted from the focus control optical system 2145 is incident on the galvanometer mirror 2146. The galvanometer mirror 2146 deflects the processing light EL#1, thereby changing the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146. For this reason, the galvanometer mirror 2146 may also be referred to as a deflection optical system.

[0120] When the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146 is changed, the position at which the processing light EL#1 is emitted from the processing head 21 is changed. When the emission position of the processing light EL#1 from the processing head 21 is changed, the target irradiation area EA#1 onto which the processing light EL#1 is irradiated on the printing surface MS moves. In other words, the irradiation position onto the printing surface MS onto which the processing light EL#1 is irradiated moves. As a result, the printing surface MS is scanned by the processing light EL#1. Therefore, the galvanometer mirror 2146 may be considered to function as an irradiation position moving device capable of moving the irradiation position of the processing light EL#1 on the printing surface MS. The galvanometer mirror 2146 may be considered to function as a scanning optical system (deflection scanning optical system) that scans the processing light EL#1 so as to move the target irradiation area EA#1 within the printing surface MS.

[0121] Furthermore, when the position at which the processing light EL#1 is emitted from the processing head 21 is changed, the beam passing area PA#1 through which the processing light EL#1 passes moves within a virtual material supply plane PL that intersects the Z-axis between the material nozzle 212 and the printing surface MS. In other words, the passing position through which the processing light EL#1 passes within the material supply plane PL moves. As a result, the material supply plane PL is essentially scanned by the processing light EL#1. Therefore, the galvanometer mirror 2146 may be considered to function as a passing position moving device capable of moving the passing position of the processing light EL#1 within the material supply plane PL. The galvanometer mirror 2146 may be considered to function as a scanning optical system (deflection scanning optical system) that essentially scans the processing light EL#1 within the material supply plane PL.

[0122] The galvanometer mirror 2146 includes, for example, an X-scan mirror 2146MX, an X-scan motor 2146AX, a Y-scan mirror 2146MY, and a Y-scan motor 2146AY. The processing light EL#1 emitted from the focus control optical system 2145 is incident on the X-scan mirror 2146MX. The X-scan mirror 2146MX reflects the processing light EL#1 incident on the X-scan mirror 2146MX toward the Y-scan mirror 2146MY. The Y-scan mirror 2146MY reflects the processing light EL#1 incident on the Y-scan mirror 2146MY toward the third optical system 216. Note that each of the X-scan mirror 2146MX and the Y-scan mirror 2146MY may be referred to as a galvanometer mirror.

[0123] The X-scan motor 2146AX swings or rotates the X-scan mirror 2146MX around a rotation axis along the Y-axis. As a result, the angle of the X-scan mirror 2146MX relative to the optical path of the processing light EL#1 incident on the X-scan mirror 2146MX is changed. In this case, the swing or rotation of the X-scan mirror 2146MX causes the processing light EL#1 to scan the printing surface MS along the X-axis direction. In other words, the target irradiation area EA#1 (i.e., the irradiation position of the processing light EL#1) moves along the X-axis direction on the printing surface MS. Furthermore, the swing or rotation of the X-scan mirror 2146MX causes the processing light EL#1 to scan the material supply surface PL along the X-axis direction. In other words, the beam passage area PA#1 of the processing light EL#1 (i.e., the passage position of the processing light EL#1) moves along the X-axis direction within the material supply surface PL.

[0124] The Y-scan motor 2146AY swings or rotates the Y-scan mirror 2146MY around a rotation axis along the X-axis. As a result, the angle of the Y-scan mirror 2146MY relative to the optical path of the processing light EL#1 incident on the Y-scan mirror 2146MY is changed. In this case, the swing or rotation of the Y-scan mirror 2146MY causes the processing light EL#1 to scan the printing surface MS along the Y-axis direction. In other words, the target irradiation area EA#1 (i.e., the irradiation position of the processing light EL#1) moves along the Y-axis direction on the printing surface MS. Furthermore, the swing or rotation of the Y-scan mirror 2146MY causes the processing light EL#1 to scan the material supply surface PL along the Y-axis direction. In other words, the beam passage area PA#1 of the processing light EL#1 (i.e., the passage position of the processing light EL#1) moves along the Y-axis direction within the material supply surface PL.

[0125] In the first embodiment, the virtual area on the printing surface MS through which the galvanometer mirror 2146 moves the target irradiation area EA#1 is referred to as the machining unit area PUA (particularly, the machining unit area PUA#1). In this case, the target irradiation area EA#1 may be considered to move on a surface of the printing surface MS that overlaps with the machining unit area PUA#1. Specifically, the virtual area on the printing surface MS through which the galvanometer mirror 2146 moves the target irradiation area EA#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without changing) is referred to as the machining unit area PUA (particularly, the machining unit area PUA#1). The machining unit area PUA#1 indicates the virtual area (in other words, the range) through which the machining head 21 actually performs additional machining using the machining light EL#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#1 indicates a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#1 when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#1 indicates a region (in other words, a range) through which the target irradiation area EA#1 actually moves when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Therefore, the processing unit area PUA#1 may be considered to be a virtual region determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area PUA#1 may be considered to be a virtual region located at a position on the printing surface MS that is determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum region over which the galvanometer mirror 2146 can move the target irradiation area EA#1 on the printing surface MS when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may also be referred to as the processing unit area PUA#1.

[0126] In this case, the machining system SYSa can use the galvanometer mirror 2146 to move the target irradiation area EA#1 within the machining unit area PUA#1. Therefore, the operation of deflecting the machining light EL#1 using the galvanometer mirror 2146 may be considered equivalent to the operation of moving the target irradiation area EA#1 within the machining unit area PUA#1. Furthermore, as described above, the molten pool MP#1 is formed by irradiating the target irradiation area EA#1 with the machining light EL#1. In this case, the machining system SYSa may be considered to use the galvanometer mirror 2146 to move the molten pool MP#1 within the machining unit area PUA#1. Therefore, the operation of deflecting the machining light EL#1 using the galvanometer mirror 2146 may be considered equivalent to the operation of moving the molten pool MP#1 within the machining unit area PUA#1. In other words, the operation of moving the target irradiation area EA#1 within the machining unit area PUA#1 may be considered equivalent to the operation of moving the molten pool MP#1 within the machining unit area PUA#1.

[0127] As described above, even if at least one of the machining head 21 and the stage 31 moves, the target irradiation area EA#1 moves on the printing surface MS. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirror 2146 and the printing surface MS changes. As a result, the machining unit area PUA#1 determined based on the machining head 21 (i.e., the machining unit area PUA#1 to which the galvanometer mirror 2146 moves the target irradiation area EA#1 on the printing surface MS) moves on the printing surface MS. For this reason, in the first embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the machining unit area PUA#1 relative to the printing surface MS.

[0128] As an example of an operation for moving the target irradiation area EA#1 within the processing unit area PUA#1, as shown in FIG. 7A, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area PUA#1 along a single scanning direction along the printing surface MS, assuming that the processing unit area PUA#1 is stationary (i.e., not moving) on ​​the printing surface MS. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along a single scanning direction within a coordinate system defined based on the processing unit area PUA#1. In particular, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth within the processing unit area PUA#1 along the single scanning direction. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on an axis along a single scanning direction within the processing unit area PUA#1. In this case, the shape of the processing unit area PUA#1 along which the target irradiation area EA#1 moves may be a rectangle whose longitudinal direction is the movement direction of the target irradiation area EA#1.

[0129] As another example of the operation of moving the target irradiation area EA#1 within the processing unit area PUA#1, as shown in Figures 8(a) and 8(b), the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along multiple scanning directions along the processing unit area MS within the processing unit area PUA#1, assuming that the processing unit area PUA#1 is stationary (i.e., not moving) on ​​the printing surface MS. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along multiple scanning directions within a coordinate system defined based on the processing unit area PUA#1. In particular, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth along each of the multiple scanning directions within the processing unit area PUA#1. That is, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on axes along each of the multiple scanning directions within the processing unit area PUA#1. Figure 8(a) shows an example in which the target irradiation area EA#1 moves back and forth along each of the X-axis and Y-axis directions within the processing unit area PUA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area PUA#1 is circular. In this case, the shape of the processing unit area PUA#1 through which the target irradiation area EA#1 moves may be circular. Figure 8(b) shows an example in which the target irradiation area EA#1 moves back and forth along each of the X-axis and Y-axis directions within the processing unit area PUA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area PUA#1 is mesh-shaped. In this case, the shape of the processing unit area PUA#1 through which the target irradiation area EA#1 moves may be rectangular.

[0130] 7A, 8A, and 8B, the operation of periodically moving the target irradiation area EA#1 on the printing surface MS may be referred to as a wobbling operation. In other words, the operation of periodically moving (or deflecting) the processing light EL#1 so that the target irradiation area EA#1 moves periodically on the printing surface MS may be referred to as a wobbling operation.

[0131] The control unit 7 may move at least one of the machining head 21 and the stage 31 so that the machining unit area PUA#1 moves on the manufacturing surface MS during a period in which the target irradiation area EA#1 is moved within the machining unit area PUA#1 using the galvanometer mirror 2146. In other words, the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the machining unit area PUA#1 moves on the manufacturing surface MS during a period in which the target irradiation area EA#1 is moved within the machining unit area PUA#1 using the galvanometer mirror 2146.

[0132] For example, in the example shown in FIG. 7A, the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area PUA#1 moves along a target movement trajectory MT0 that intersects (or, in some cases, is perpendicular to) the movement direction (i.e., the scanning direction) of the target irradiation area EA#1 within the processing unit area PUA#1. Conversely, the control unit 7 may control the galvanometer mirror 2146 so that the target irradiation area EA#1 periodically moves along a scanning direction that intersects (or, in some cases, is perpendicular to) the target movement trajectory MT0 of the processing unit area PUA#1 on the printing surface MS. As a result, on the printing surface MS, the target irradiation area EA#1 may move along the movement trajectory MT#1 shown in FIG. 7B. Specifically, the target irradiation area EA#1 may move along the target movement trajectory MT0 of the processing unit area PUA#1 while moving along a scanning direction that intersects with the target movement trajectory MT0. That is, the target irradiation area EA#1 may move along a wave-shaped (for example, sinusoidal) movement locus MT#1 that oscillates around the target movement locus MT0.

[0133] 8(a) or 8(b), the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area PUA#1 moves along a target movement trajectory MT0 extending along at least one of a direction along the movement direction (i.e., the scanning direction) of the target irradiation area EA#1 within the processing unit area PUA#1 and a direction intersecting (or, in some cases, perpendicular to) the movement direction of the target irradiation area EA#1 within the processing unit area PUA#1. Conversely, the control unit 7 may control the galvanometer mirror 2146 so that the target irradiation area EA#1 periodically moves along each of a scanning direction along the target movement trajectory MT0 of the processing unit area PUA#1 on the printing surface MS and a scanning direction intersecting (or, in some cases, perpendicular to) the target movement trajectory MT0. Note that Figure 8(c) shows the movement trajectory MT#1 of the target irradiation area EA#1 on the printing surface MS when the processing unit area PUA#1 shown in Figure 8(a) moves along the target movement trajectory MT0 on the printing surface MS.

[0134] When the machining light EL#1 is irradiated onto the build surface MS in units of machining unit areas PUA#1, a molten pool MP#1 is formed in at least a portion of the machining unit area PUA#1. As a result, a structure is built within the machining unit area PUA#1. As described above, the machining unit area PUA#1 is an area having a width in a direction intersecting the movement direction of the machining unit area PUA#1 on the build surface MS (specifically, the direction in which the target movement trajectory MT0 extends). In this case, a structure having a width in a direction intersecting the target movement trajectory MT0 of the machining unit area PUA#1 is built on the build surface MS. For example, in the example shown in FIGS. 7( a) and 7(b), a structure having a width along the X-axis direction and extending along the Y-axis direction is built. For example, in the example shown in FIGS. 8(a) and 8(c), a structure having a width along the X-axis direction and extending along the Y-axis direction is built.

[0135] When the processing light EL#1 is irradiated onto the printing surface MS in units of processing unit areas PUA#1, the processing unit areas PUA#1 are scanned with the processing light EL#1 by the galvanometer mirror 2146. Therefore, compared to when the processing light EL#1 is irradiated onto the printing surface MS without using the galvanometer mirror 2146, the amount of energy transmitted from the processing light EL#1 to the processing unit areas PUA#1 is less likely to vary within the processing unit areas PUA#1. In other words, the distribution of the amount of energy transmitted from the processing light EL#1 to the processing unit areas PUA#1 can be made uniform. As a result, the processing system SYSa can print a model on the printing surface MS with relatively high printing accuracy.

[0136] However, the machining system SYSa does not have to irradiate the manufacturing surface MS with the machining light EL#1 in units of machining unit areas PUA#1. The machining system SYSa may irradiate the manufacturing surface MS with the machining light EL#1 without using the galvanometer mirror 2146. The machining system SYSa does not necessarily have to perform a wobbling operation. In this case, the target irradiation area EA#1 may move on the manufacturing surface MS in conjunction with the movement of at least one of the machining head 21 and the stage 31.

[0137] The machining system SYSa may non-periodically move the target irradiation area EA#1 on the manufacturing surface MS.

[0138] 6 , the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. The power meter 2143 can detect the intensity of the processing light EL#1 incident on the power meter 2143. For example, the power meter 2143 may include a light-receiving element that detects the processing light EL#1 as light. Alternatively, the higher the intensity of the processing light EL#1, the greater the amount of energy generated by the processing light EL#1. As a result, the amount of heat generated by the processing light EL#1 increases. Therefore, the power meter 2143 may detect the intensity of the processing light EL#1 by detecting the processing light EL#1 as heat. In this case, the power meter 2143 may include a heat-detecting element that detects the heat of the processing light EL#1.

[0139] As described above, the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. Therefore, the power meter 2143 detects the intensity of the processing light EL#1 reflected by the parallel plate 2142. Because the parallel plate 2142 is disposed on the optical path of the processing light EL#1 between the light source 4#1 and the galvanometer mirror 2146, the power meter 2143 may be considered to detect the intensity of the processing light EL#1 traveling along the optical path between the light source 4#1 and the galvanometer mirror 2146. In this case, the power meter 2143 can stably detect the intensity of the processing light EL#1 without being affected by the deflection of the processing light EL#1 by the galvanometer mirror 2146. However, the location of the power meter 2143 is not limited to the example shown in FIG. 6 . For example, the power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path between the galvanometer mirror 2146 and the printing surface MS. The power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path within the galvanometer mirror 2146.

[0140] The detection result of the power meter 2143 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#1 based on the detection result of the power meter 2143 (i.e., the detection result of the intensity of the processing light EL#1). For example, the control unit 7 may control the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on the printing surface MS becomes a desired intensity. For example, the control unit 7 may control the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on a virtual material supply plane PL between the printing surface MS and the material nozzle 212 becomes a desired intensity. To control the intensity of the processing light EL#1, for example, the control unit 7 may control the light source 4#1 to change the intensity of the processing light EL#1 emitted from the light source 4#1 based on the detection result of the power meter 2143. As a result, the processing system SYSa can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#1 having an appropriate intensity.

[0141] As described above, the processing light EL#1 has an intensity capable of melting the shaping material M. Therefore, the processing light EL#1 incident on the power meter 2143 may have an intensity capable of melting the shaping material M. However, if the processing light EL#1 having an intensity capable of melting the shaping material M is incident on the power meter 2143, the power meter 2143 may be damaged by the processing light EL#1. Therefore, the processing light EL#1 may be incident on the power meter 2143 with an intensity not high enough to damage the power meter 2143. In other words, the first optical system 214 may weaken the intensity of the processing light EL#1 incident on the power meter 2143 so that the processing light EL#1 having an intensity not high enough to damage the power meter 2143 is incident on the power meter 2143.

[0142] For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the reflectivity of the parallel plate 2142 for the processing light EL#1 may be set to an appropriate value. Specifically, the lower the reflectivity of the parallel plate 2142 for the processing light EL#1, the lower the intensity of the processing light EL#1 incident on the power meter 2143. Therefore, the reflectivity of the parallel plate 2142 may be set to a value low enough to realize a state in which the processing light EL#1, having an intensity not high enough to damage the power meter 2143, is incident on the power meter 2143. For example, the reflectivity of the parallel plate 2142 may be less than 10%. For example, the reflectivity of the parallel plate 2142 may be less than a few percent. Plain glass may be used as the parallel plate 2142 with such low reflectivity.

[0143] For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the first optical system 214 may cause the processing light EL#1 to be incident on the power meter 2143 via multiple parallel plates 2142. Specifically, the processing light EL#1 may be reflected multiple times by each of the multiple parallel plates 2142 and incident on the power meter 2143. In this case, the intensity of the processing light EL#1 reflected multiple times by each of the multiple parallel plates 2142 is weaker than the intensity of the processing light EL#1 reflected once by a single parallel plate 2142. Therefore, there is a high possibility that the processing light EL#1 having an intensity not high enough to damage the power meter 2143 will be incident on the power meter 2143.

[0144] A desired coating treatment may be applied to the surface of the parallel plate 2142 (particularly, at least one of the incident surface onto which the processing light EL#1 is incident and the reflecting surface onto which the processing light EL#1 is reflected). For example, the surface of the parallel plate 2142 may be subjected to anti-reflection coating (AR).

[0145] The second optical system 215 includes a collimator lens 2151, a parallel plate 2152, a power meter 2153, and a galvanometer scanner 2154. The galvanometer scanner 2154 includes a focus control optical system 2155 and a galvanometer mirror 2156. However, the second optical system 215 does not necessarily have to include at least one of the collimator lens 2151, the parallel plate 2152, the power meter 2153, and the galvanometer scanner 2154. The galvanometer scanner 2154 does not necessarily have to include at least one of the focus control optical system 2155 and the galvanometer mirror 2156.

[0146] The processing light EL#2 emitted from the light source 4#2 is incident on the collimator lens 2151. The collimator lens 2151 converts the processing light EL#2 incident on the collimator lens 2151 into parallel light. Note that if the processing light EL#2 emitted from the light source 4#2 is parallel light (i.e., if the processing light EL#2, which is parallel light, enters the second optical system 215), the second optical system 215 does not need to include the collimator lens 2151. The processing light EL#2 converted into parallel light by the collimator lens 2151 is incident on the parallel plate 2152. The parallel plate 2152 is disposed obliquely with respect to the optical path of the processing light EL#2 incident on the parallel plate 2152. A portion of the processing light EL#2 incident on the parallel plate 2152 passes through the parallel plate 2152. The other portion of the processing light EL#2 incident on the parallel plate 2152 is reflected by the parallel plate 2152.

[0147] Processing light EL#2 that has passed through the parallel plate 2152 is incident on a galvanometer scanner 2154. Specifically, processing light EL#2 that has passed through the parallel plate 2152 is incident on a focus control optical system 2155 of the galvanometer scanner 2154.

[0148] The focus control optical system 2155 is an optical element that can change the focus position CP of the processing light EL#2 (hereinafter referred to as the "focus position CP#2"). In the first embodiment, the focus position CP#2 of the processing light EL#2 may refer to the focus position where the processing light EL#2 is focused. The focus position CP#2 of the processing light EL#2 may refer to the convergence position where the processing light EL#2 is most convergent in the irradiation direction (travel direction) of the processing light EL#2.

[0149] Specifically, the focus control optical system 2155 can change the focus position CP#2 of the processing light EL#2 along the irradiation direction of the processing light EL#2 emitted from the irradiation optical system 211. In the example shown in FIG. 6 , the irradiation direction of the processing light EL#2 emitted from the irradiation optical system 211 is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2155 can change the focus position CP#2 of the processing light EL#2 along the Z-axis direction. Furthermore, because the irradiation optical system 211 irradiates the processing light EL onto the printing surface MS from above the workpiece W, the irradiation direction of the processing light EL#2 is a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). Therefore, the focus control optical system 2155 can be considered to be able to change the focus position CP#2 of the processing light EL#2 along a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus control optical system 2155 may be considered to be capable of changing the focus position CP#2 of the processing light EL#2 along the direction of the optical axis AX of the irradiation optical system 211 (typically the third optical system 216).

[0150] The irradiation direction of the processing light EL#2 may refer to the irradiation direction of the processing light EL#2 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the third optical system 216. The final optical element may be the fθ lens 2162 described below. Furthermore, if the fθ lens 2162 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 2162.

[0151] The irradiation optical system 211 does not necessarily have to include the third optical system 216. When the irradiation optical system 211 does not include the third optical system 216, the final optical member may be the optical member (Y-scanning mirror 2156MY) that is arranged closest to the printing surface MS among the multiple optical members that make up the second optical system 215.

[0152] The focus control optical system 2155 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL#2. That is, the focus control optical system 2155 may include, for example, multiple refractive optical elements aligned along the irradiation direction of the processing light EL#2. In this case, the focus control optical system 2155 may change the focus position CP#2 of the processing light EL#2 by moving at least one of the multiple optical elements (refractive optical elements) along its optical axis direction. However, the focus control optical system 2155 may also include a reflective optical element such as a mirror, and the focus position CP#2 of the processing light EL#2 may be changed by moving the reflective optical element.

[0153] When the focus control optical system 2155 changes the focus position CP#2 of the processing light EL#2, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS changes. In particular, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 (i.e., the Z-axis direction) changes. Therefore, by changing the focus position CP#2 of the processing light EL#2, the focus control optical system 2155 may be considered to be changing the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS (in particular, the positional relationship in the Z-axis direction). By changing the focus position CP#2 of the processing light EL#2, the focus control optical system 2155 may be considered to be changing the distance between the focus position CP#2 of the processing light EL#2 and the printing surface MS (in particular, the distance in the Z-axis direction).

[0154] When the focus control optical system 2155 changes the focus position CP#2 of the processing light EL#2, the positional relationship between the focus position CP#2 of the processing light EL#2 and the material control point MCP changes. In particular, the positional relationship between the focus position CP#2 of the processing light EL#2 and the material control point MCP in the irradiation direction of the processing light EL#2 (i.e., the Z-axis direction) changes. Therefore, by changing the focus position CP#2 of the processing light EL#2, the focus control optical system 2155 may be considered to be changing the positional relationship (particularly, the positional relationship in the Z-axis direction) between the focus position CP#2 of the processing light EL#1 and the material control point MCP. By changing the focus position CP#2 of the processing light EL#2, the focus control optical system 2155 may be considered to be changing the distance (particularly, the distance in the Z-axis direction) between the focus position CP#2 of the processing light EL#1 and the material control point MCP.

[0155] As described above, the galvanometer scanner 2154 does not necessarily have to include the focus control optical system 2155. Even in this case, if the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#2 changes, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 changes. Therefore, even if the galvanometer scanner 2154 does not include the focus control optical system 2155, the processing system SYSa can change the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2. For example, the processing system SYSa may change the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 by using the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#2. For example, the processing system SYSa may use the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#2, thereby changing the positional relationship between the focus position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the manufacturing surface MS.

[0156] The processing light EL#2 emitted from the focus control optical system 2155 is incident on the galvanometer mirror 2156. The galvanometer mirror 2156 deflects the processing light EL#2, thereby changing the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156. For this reason, the galvanometer mirror 2156 may be referred to as a deflection optical system. When the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156 is changed, the position from which the processing light EL#2 is emitted from the processing head 21 is changed.

[0157] When the position at which the processing light EL#2 is emitted from the processing head 21 is changed, the target irradiation area EA#2 onto which the processing light EL#2 is irradiated moves on the printing surface MS. In other words, the irradiation position onto which the processing light EL#2 is irradiated moves on the printing surface MS. In other words, the irradiation position onto which the processing light EL#2 is irradiated moves on the printing surface MS. As a result, the printing surface MS is scanned by the processing light EL#2. Therefore, the galvanometer mirror 2156 may be considered to function as an irradiation position moving device capable of moving the irradiation position onto the printing surface MS of the processing light EL#2. The galvanometer mirror 2156 may also be considered to function as a scanning optical system (deflection scanning optical system) that scans the processing light EL#2 so as to move the target irradiation area EA#2 within the printing surface MS.

[0158] Furthermore, when the position at which processing light EL#2 is emitted from the processing head 21 is changed, the beam passage area PA#2 through which processing light EL#2 passes moves within a virtual material supply plane PL that intersects the Z-axis between the material nozzle 212 and the printing surface MS. In other words, the passage position through which processing light EL#2 passes within the material supply plane PL moves. As a result, the material supply plane PL is essentially scanned by processing light EL#2. Therefore, the galvanometer mirror 2156 may be considered to function as a passage position moving device capable of moving the passage position of processing light EL#2 within the material supply plane PL. The galvanometer mirror 2156 may be considered to function as a scanning optical system (deflection scanning optical system) that essentially scans processing light EL#2 within the material supply plane PL.

[0159] The galvanometer mirror 2156 includes, for example, an X-scan mirror 2156MX, an X-scan motor 2156AX, a Y-scan mirror 2156MY, and a Y-scan motor 2156AY. Processing light EL#2 emitted from the focus control optical system 2155 is incident on the X-scan mirror 2156MX. The X-scan mirror 2156MX reflects the processing light EL#2 incident on the X-scan mirror 2156MX toward the Y-scan mirror 2156MY. The Y-scan mirror 2156MY reflects the processing light EL#2 incident on the Y-scan mirror 2156MY toward the third optical system 216. Note that each of the X-scan mirror 2156MX and the Y-scan mirror 2156MY may be referred to as a galvanometer mirror.

[0160] The X-scan motor 2156AX swings or rotates the X-scan mirror 2156MX around a rotation axis along the Y-axis. As a result, the angle of the X-scan mirror 2156MX relative to the optical path of the processing light EL#2 incident on the X-scan mirror 2156MX is changed. In this case, the swing or rotation of the X-scan mirror 2156MX causes the processing light EL#2 to scan the printing surface MS along the X-axis direction. In other words, the target irradiation area EA#2 (i.e., the irradiation position of the processing light EL#2) moves along the X-axis direction on the printing surface MS. Furthermore, the swing or rotation of the X-scan mirror 2156MX causes the processing light EL#2 to scan the material supply surface PL along the X-axis direction. In other words, the beam passage area PA#2 of the processing light EL#2 (i.e., the passage position of the processing light EL#2) moves along the X-axis direction within the material supply surface PL.

[0161] The Y-scan motor 2156AY swings or rotates the Y-scan mirror 2156MY around a rotation axis along the X-axis. As a result, the angle of the Y-scan mirror 2156MY relative to the optical path of the processing light EL#2 incident on the Y-scan mirror 2156MY is changed. In this case, the swing or rotation of the Y-scan mirror 2156MY causes the processing light EL#2 to scan the printing surface MS along the Y-axis direction. In other words, the target irradiation area EA#2 (i.e., the irradiation position of the processing light EL#2) moves along the Y-axis direction on the printing surface MS. Furthermore, the swing or rotation of the Y-scan mirror 2156MY causes the processing light EL#2 to scan the material supply surface PL along the Y-axis direction. In other words, the beam passage area PA#2 of the processing light EL#2 (i.e., the passage position of the processing light EL#2) moves along the X-axis direction within the material supply surface PL.

[0162] In the first embodiment, the virtual area on the printing surface MS through which the galvanometer mirror 2156 moves the target irradiation area EA#2 is referred to as the machining unit area PUA (particularly, the machining unit area PUA#2). In this case, the target irradiation area EA#2 may be considered to move on a surface (first surface) of the printing surface MS that overlaps with the machining unit area PUA#2. Specifically, the virtual area on the printing surface MS through which the galvanometer mirror 2156 moves the target irradiation area EA#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without changing) is referred to as the machining unit area PUA (particularly, the machining unit area PUA#2). The machining unit area PUA#2 indicates a virtual area (in other words, a range) through which the machining head 21 actually performs additional machining using the machining light EL#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#2 indicates a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#2 when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#2 indicates a region (in other words, a range) through which the target irradiation area EA#2 actually moves when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Therefore, the processing unit area PUA#2 may be considered to be a virtual region determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area PUA#2 may be considered to be a virtual region located at a position on the printing surface MS that is determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum region over which the galvanometer mirror 2146 can move the target irradiation area EA#2 on the printing surface MS when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may also be referred to as the processing unit area PUA#2.

[0163] In this case, the machining system SYSa can use the galvanometer mirror 2156 to move the target irradiation area EA#2 within the machining unit area PUA#2. Therefore, the operation of deflecting the machining light EL#2 using the galvanometer mirror 2156 may be considered equivalent to the operation of moving the target irradiation area EA#2 within the machining unit area PUA#2. Furthermore, as described above, the molten pool MP#2 is formed by irradiating the target irradiation area EA#2 with the machining light EL#2. In this case, the machining system SYSa may be considered to use the galvanometer mirror 2156 to move the molten pool MP#2 within the machining unit area PUA#2. Therefore, the operation of deflecting the machining light EL#2 using the galvanometer mirror 2156 may be considered equivalent to the operation of moving the molten pool MP#2 within the machining unit area PUA#2. In other words, the operation of moving the target irradiation area EA#2 within the machining unit area PUA#2 may be considered equivalent to the operation of moving the molten pool MP#2 within the machining unit area PUA#2.

[0164] As described above, when at least one of the machining head 21 and the stage 31 moves, the target irradiation area EA#2 moves on the printing surface MS. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirror 2146 and the printing surface MS changes. As a result, the machining unit area PUA#2 determined based on the machining head 21 (i.e., the machining unit area PUA#2 to which the galvanometer mirror 2156 moves the target irradiation area EA#2 on the printing surface MS) moves on the printing surface MS. For this reason, in the first embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the machining unit area PUA#2 relative to the printing surface MS.

[0165] The characteristics of the processing unit area PUA#2 (e.g., shape, movement pattern, etc.) may be the same as the characteristics of the processing unit area PUA#1 described above. The movement pattern of the target irradiation area EA#2 within the processing unit area PUA#2 (e.g., movement trajectory, etc.) may be the same as the movement pattern of the target irradiation area EA#1 within the processing unit area PUA#1 described above. Therefore, a detailed description of the characteristics of the processing unit area PUA#2 and the movement pattern of the target irradiation area EA#2 within the processing unit area PUA#2 (e.g., movement trajectory, etc.) will be omitted, but an example will be briefly described below. As shown in FIG. 7A, under the assumption that the processing unit area PUA#2 is stationary (i.e., not moving) on ​​the printing surface MS, the galvanometer mirror 2156 may deflect the processing light EL#2 within the processing unit area PUA#2 so that the target irradiation area EA#2 moves along a single scanning direction along the printing surface MS. 7A , the processing unit area PUA#2 moves along the target movement trajectory MT0 on the printing surface MS, so that the target irradiation area EA#2 moves along the movement trajectory MT#2 (e.g., a wave-shaped movement trajectory MT#2 oscillating around the target movement trajectory MT0) on the printing surface MS. As shown in FIGS. 8A and 8B , the galvanometer mirror 2156 may deflect the processing light EL#2 so that the target irradiation area EA#2 moves along multiple scanning directions within the processing unit area PUA#2, assuming that the processing unit area PUA#2 is stationary (i.e., not moving) on ​​the printing surface MS.

[0166] 7(a), 8(a), and 8(b), the operation of periodically moving the target irradiation area EA#2 on the printing surface MS may be referred to as a wobbling operation. In other words, the operation of periodically moving (or deflecting) the processing light EL#2 so as to periodically move the target irradiation area EA#2 on the printing surface MS may be referred to as a wobbling operation. However, the processing system SYSa does not necessarily have to periodically move the processing light EL#2 so as to periodically move the target irradiation area EA#2 on the printing surface MS. In other words, the processing system SYSa does not necessarily have to perform a wobbling operation.

[0167] Typically, the processing unit area PUA#1 and the processing unit area PUA#2 coincide. In other words, the processing unit area PUA#1 is the same as the processing unit area PUA#2. Therefore, the galvanometer mirror 2156 may be considered to deflect the processing light EL#2 so that the target irradiation area EA#2 moves within the processing unit area PUA#1. The galvanometer mirror 2146 may be considered to deflect the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area PUA#2. However, the processing unit area PUA#1 and the processing unit area PUA#2 may be partially different.

[0168] When the machining light EL#2 is irradiated onto the build surface MS in units of the machining unit area PUA#2, a molten pool MP#2 is formed in at least a part of the machining unit area PUA#2. As a result, an object is built within the machining unit area PUA#2. As described above, the machining unit area PUA#2 is an area having a width in a direction intersecting the movement direction of the machining unit area PUA#2 on the build surface MS (specifically, the direction in which the target movement trajectory MT0 extends). In this case, an object having a width along the direction intersecting the target movement trajectory MT0 of the machining unit area PUA#2 is built on the build surface MS. For example, in the example shown in FIGS. 7( a) and 7(b), an object having a width along the X-axis direction and extending along the Y-axis direction is built. For example, in the example shown in FIGS. 8(a) and 8(c), an object having a width along the X-axis direction and extending along the Y-axis direction is built.

[0169] When the processing light EL#2 is irradiated onto the printing surface MS in units of processing unit areas PUA#2, the processing unit areas PUA#2 are scanned with the processing light EL#2 by the galvanometer mirror 2156. Therefore, compared to when the processing light EL#2 is irradiated onto the printing surface MS without using the galvanometer mirror 2156, the amount of energy transmitted from the processing light EL#2 to the processing unit areas PUA#2 is less likely to vary within the processing unit areas PUA#2. In other words, the amount of energy transmitted from the processing light EL#2 to the processing unit areas PUA#2 can be made uniform. As a result, the processing system SYSa can print a model on the printing surface MS with relatively high printing accuracy.

[0170] However, the machining system SYSa does not have to irradiate the manufacturing surface MS with the machining light EL#2 in units of machining unit areas PUA#2. The machining system SYSa may irradiate the manufacturing surface MS with the machining light EL#2 without using the galvanometer mirror 2156. The machining system SYSa does not necessarily have to perform a wobbling operation. In this case, the target irradiation area EA#2 may move on the manufacturing surface MS in conjunction with the movement of at least one of the machining head 21 and the stage 31.

[0171] The machining system SYSa may non-periodically move the target irradiation area EA#2 on the manufacturing surface MS.

[0172] Referring again to FIG. 6 , the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. The power meter 2153 is a specific example of an electrical component used to control the processing light EL#2. Specifically, the power meter 2153 can detect the intensity of the processing light EL#2 incident on the power meter 2153. For example, the power meter 2153 may include a light-receiving element that detects the processing light EL#2 as light. Alternatively, the higher the intensity of the processing light EL#2, the greater the amount of energy generated by the processing light EL#2. As a result, the amount of heat generated by the processing light EL#2 increases. Therefore, the power meter 2153 may detect the intensity of the processing light EL#2 by detecting the processing light EL#2 as heat. In this case, the power meter 2153 may include a heat-detecting element that detects the heat of the processing light EL#2.

[0173] As described above, the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. Therefore, the power meter 2153 detects the intensity of the processing light EL#2 reflected by the parallel plate 2152. Because the parallel plate 2152 is disposed on the optical path of the processing light EL#2 between the light source 4#2 and the galvanometer mirror 2156, the power meter 2153 may be considered to detect the intensity of the processing light EL#2 traveling on the optical path between the light source 4#2 and the galvanometer mirror 2156. In this case, the power meter 2153 can stably detect the intensity of the processing light EL#2 without being affected by the deflection of the processing light EL#2 by the galvanometer mirror 2156. However, the arrangement position of the power meter 2153 is not limited to the example shown in FIG. 6 . For example, the power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path between the galvanometer mirror 2156 and the printing surface MS. The power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path within the galvanometer mirror 2156.

[0174] The detection result of the power meter 2153 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#2 based on the detection result of the power meter 2153 (i.e., the detection result of the intensity of the processing light EL#2). For example, the control unit 7 may control the intensity of the processing light EL#2 so that the intensity of the processing light EL#2 on the printing surface MS becomes a desired intensity. For example, the control unit 7 may control the intensity of the processing light EL#2 so that the intensity of the processing light EL#2 on a virtual material supply plane PL between the printing surface MS and the material nozzle 212 becomes a desired intensity. To control the intensity of the processing light EL#2, for example, the control unit 7 may control the light source 4#2 to change the intensity of the processing light EL#2 emitted from the light source 4#2 based on the detection result of the power meter 2153. As a result, the processing system SYSa can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#2 having an appropriate intensity.

[0175] As described above, the processing light EL#2 has an intensity capable of melting the shaping material M. Therefore, the processing light EL#2 incident on the power meter 2153 may have an intensity capable of melting the shaping material M. However, if the processing light EL#2 having an intensity capable of melting the shaping material M is incident on the power meter 2153, the power meter 2153 may be damaged by the processing light EL#2. Therefore, the processing light EL#2 may be incident on the power meter 2153 with an intensity not high enough to damage the power meter 2153. In other words, the second optical system 215 may weaken the intensity of the processing light EL#2 incident on the power meter 2153 so that the processing light EL#2 having an intensity not high enough to damage the power meter 2153 is incident on the power meter 2153.

[0176] For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the reflectivity of the parallel plate 2152 for the processing light EL#2 may be set to an appropriate value. Specifically, the lower the reflectivity of the parallel plate 2152 for the processing light EL#2, the lower the intensity of the processing light EL#2 incident on the power meter 2153. Therefore, the reflectivity of the parallel plate 2152 may be set to a value low enough to realize a state in which the processing light EL#2, having an intensity not high enough to damage the power meter 2153, is incident on the power meter 2153. For example, the reflectivity of the parallel plate 2152 may be less than 10%. For example, the reflectivity of the parallel plate 2152 may be less than a few percent. Plain glass may be used as the parallel plate 2152 with such low reflectivity.

[0177] For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the second optical system 215 may cause the processing light EL#2 to be incident on the power meter 2153 via multiple parallel plates 2152. Specifically, the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 may be incident on the power meter 2153. In this case, the intensity of the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 is weaker than the intensity of the processing light EL#2 reflected once by a single parallel plate 2152. Therefore, there is a high possibility that the processing light EL#2 having an intensity not high enough to damage the power meter 2153 will be incident on the power meter 2153.

[0178] A desired coating treatment may be applied to the surface of the parallel plate 2152 (particularly, at least one of the incident surface onto which the processing light EL#2 is incident and the reflecting surface onto which the processing light EL#2 is reflected). For example, the surface of the parallel plate 2152 may be subjected to anti-reflection coating (AR).

[0179] The third optical system 216 includes a prism mirror 2161 and an fθ lens 2162 .

[0180] Processing light EL#1 emitted from the first optical system 214 and processing light EL#2 emitted from the second optical system 215 are each incident on a prism mirror 2161. The prism mirror 2161 reflects each of processing light EL#1 and EL#2 toward an fθ lens 2162. The prism mirror 2161 reflects processing light EL#1 and EL#2, which are incident on the prism mirror 2161 from different directions, in approximately the same direction (specifically, toward the fθ lens 2162).

[0181] Furthermore, if the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 can each be directly incident on the fθ lens 2162, the third optical system 216 does not need to be equipped with a prism mirror 2161.

[0182] The fθ lens 2162 is an optical system for emitting each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 toward the printing surface MS. In other words, the fθ lens 2162 is an optical system for irradiating each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 onto the printing surface MS. As a result, the processing lights EL#1 and EL#2 that have passed through the fθ lens 2162 are irradiated onto the printing surface MS.

[0183] The fθ lens 2162 may be an optical element capable of focusing each of the processing beams EL#1 and EL#2 on a focusing surface. In this case, the fθ lens 2162 may be referred to as a focusing optical system. The focusing surface of the fθ lens 2162 may be set, for example, on the printing surface MS. In this case, the third optical system 216 may be considered to have a focusing optical system whose projection characteristic is fθ. However, the third optical system 216 may also have a focusing optical system whose projection characteristic is different from fθ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f tan θ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f sin θ.

[0184] The optical axis AX of the fθ lens 2162 is an axis along the Z-axis. Therefore, the fθ lens 2162 emits each of the processing lights EL#1 and EL#2 approximately along the Z-axis direction. In this case, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be the Z-axis direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be directions along the optical axis AX of the fθ lens 2162. However, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 do not have to be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be mutually different directions.

[0185] (1-3) Forming Operation Performed by the Machining System SYS Next, the forming operation (additional machining operation for performing additional machining on the workpiece W) performed by the machining system SYS will be described.

[0186] (1-3-1) Overview of the Forming Operation As described above, the processing system SYSa forms the three-dimensional structure ST by performing additional processing based on the laser build-up welding method. Therefore, the processing system SYSa may form the three-dimensional structure ST by performing a forming operation in accordance with the laser build-up welding method.

[0187] The processing system SYSa forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (in other words, three-dimensional model information) of the three-dimensional structure ST to be formed. Measurement data of a three-dimensional object measured by at least one of a measuring device provided within the processing system SYSa and a three-dimensional shape measuring device provided separately from the processing system SYSa may be used as the three-dimensional model data. To form the three-dimensional structure ST, the processing system SYSa sequentially forms, for example, multiple structural layers SL aligned along the Z-axis direction. For example, the processing system SYSa sequentially forms multiple structural layers SL layer by layer based on data of multiple layers obtained by slicing a three-dimensional model of the three-dimensional structure ST along the Z-axis direction. As a result, a three-dimensional structure ST is formed, which is a layered structure in which multiple structural layers SL are stacked. The structural layers SL do not necessarily have to be layered structures.

[0188] Particularly in the first embodiment, the processing system SYSa (mainly, the processing unit 2) may perform at least one of a first and a second modeling operation as the modeling operation. The first and second modeling operations may be different from each other in that a method for modeling the three-dimensional structure ST by the first modeling operation is different from a method for modeling the three-dimensional structure ST by the second modeling operation. In particular, the first and second modeling operations may be different from each other in that a method for modeling each structural layer SL by the first modeling operation is different from a method for modeling each structural layer SL by the second modeling operation.

[0189] The processing system SYSa may form the three-dimensional structure ST by performing the second-forming operation without performing the first-forming operation. The processing system SYSa may form each structural layer SL by performing the second-forming operation without performing the first-forming operation. The processing system SYSa may form the three-dimensional structure ST by performing the first-forming operation without performing the second-forming operation. The processing system SYSa may form each structural layer SL by performing the first-forming operation without performing the second-forming operation. The processing system SYSa may form the three-dimensional structure ST by performing both the first and second-forming operations. The processing system SYSa may form each structural layer SL by performing both the first and second-forming operations.

[0190] The first and second modeling operations will be described below in order.

[0191] (1-3-2) First Modeling Operation The first modeling operation is a modeling operation in which a molten pool MP is formed on the modeling surface MS by irradiating the modeling surface MS with the processing light EL, and a modeling material M is supplied to the formed molten pool MP, thereby forming a model on the modeling surface MS. In other words, the first modeling operation is a modeling operation in which, in order to form a model on the modeling surface MS, a molten pool MP is formed on the modeling surface MS by irradiating the modeling surface MS with the processing light EL, and a modeling material M is supplied to the formed molten pool MP.

[0192] First, the operation of forming each structure layer SL by performing the first forming operation will be described with reference to FIGS. 9A to 9E. Under the control of the control unit 7, the processing system SYSa moves at least one of the processing head 21 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 are set in desired areas on the forming surface MS corresponding to the surface of the workpiece W or the surface of the formed structure layer SL. Then, the irradiation optical system 211 irradiates the processing unit areas PUA#1 and PUA#2 with the processing light beams EL#1 and EL#2, respectively. At this time, the focus position CP#1 of the processing light beam EL#1 and the focus position CP#2 of the processing light beam EL#2 in the Z-axis direction may coincide with the forming surface MS. Alternatively, the focus position CP#1 of the processing light beam EL#1 and the focus position CP#2 of the processing light beam EL#2 in the Z-axis direction may be spaced apart from the forming surface MS. As a result, as shown in Fig. 9(a), molten pools MP#1 and MP#2 are formed on the build surface MS irradiated with the processing beams EL#1 and EL#2, respectively. Furthermore, as shown in Fig. 9(b), the processing system SYSa supplies build material M from the material nozzle 212 under the control of the control unit 7. As a result, build material M is supplied to each of the molten pools MP#1 and MP#2.

[0193] The shaping material M supplied to the molten pool MP#1 is melted by the processing light EL#1 irradiated onto the molten pool MP#1. Alternatively, the shaping material M supplied to the molten pool MP#1 is melted by the molten pool MP#1 formed by the processing light EL#1. Even when the shaping material M is melted by the molten pool MP#1, since the molten pool MP#1 is formed by the processing light EL#1, the shaping material M may be considered to be melted by the processing light EL#1 that formed the molten pool MP#1. In other words, the shaping material M may be considered to be indirectly melted by the processing light EL#1 via the molten pool MP#1 formed by the processing light EL#1. In either case, the shaping material M is melted by the energy of the processing light EL#1.

[0194] Similarly, the shaping material M supplied to the molten pool MP#2 is melted by the processing light EL#2 irradiated onto the molten pool MP#2. Alternatively, the shaping material M supplied to the molten pool MP#2 is melted by the molten pool MP#2 formed by the processing light EL#2. Even when the shaping material M is melted by the molten pool MP#2, since the molten pool MP#2 is formed by the processing light EL#2, the shaping material M may be considered to be melted by the processing light EL#2 that formed the molten pool MP#2. In other words, the shaping material M may be considered to be indirectly melted by the processing light EL#2 via the molten pool MP#2 formed by the processing light EL#2. In either case, the shaping material M is melted by the energy of the processing light EL#1.

[0195] Furthermore, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to move the target irradiation areas EA#1 and EA#2 within the machining unit areas PUA#1 and PUA#2, respectively. That is, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to scan the machining unit areas PUA#1 and PUA#2 with the machining beams EL#1 and EL#2, respectively. When the target irradiation area EA#1 moves and the machining beam EL#1 is no longer irradiated onto the molten pool MP#1, the molten build material M in the molten pool MP#1 cools and solidifies (i.e., solidifies). Similarly, when the target irradiation area EA#2 moves and the machining beam EL#2 is no longer irradiated onto the molten pool MP#2, the molten build material M in the molten pool MP#2 cools and solidifies (i.e., solidifies). Furthermore, as the target irradiation areas EA#1 and EA#2 move, the molten pools MP#1 and MP#2 also move. As a result, as shown in Figure 9(c), within the processing unit areas PUA#1 and PUA#2 through which the molten pools MP#1 and MP#2 move, a molded object made of the solidified mold material M is deposited on the molded surface MS.

[0196] 9C, for ease of explanation, the object made of the solidified shaping material M in the processing unit area PUA#1 is physically separated from the object made of the solidified shaping material M in the processing unit area PUA#2. However, the object made of the solidified shaping material M in the processing unit area PUA#1 may be integrated with the object made of the solidified shaping material M in the processing unit area PUA#2. In particular, when the processing unit areas PUA#1 and PUA#2 coincide (or partially overlap), the object made of the solidified shaping material M in the processing unit area PUA#1 may be integrated with the object made of the solidified shaping material M in the processing unit area PUA#2.

[0197] During the period when the target irradiation areas EA#1 and EA#2 are moving within the machining unit areas PUA#1 and PUA#2, respectively, the machining system SYSa may move at least one of the machining head 21 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the printing surface MS. In other words, the machining system SYSa may move the target irradiation areas EA#1 and EA#2 within the machining unit areas PUA#1 and PUA#2, respectively, and move the machining unit areas PUA#1 and PUA#2 on the printing surface MS in parallel.

[0198] Alternatively, during the period when the target irradiation areas EA#1 and EA#2 are moving within the machining unit areas PUA#1 and PUA#2, respectively, the machining system SYSa may not move the machining head 21 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 do not move on the printing surface MS. In other words, during the period when the target irradiation areas EA#1 and EA#2 are moving within the machining unit areas PUA#1 and PUA#2, respectively, the machining head 21 and the stage 31 may be stopped. In this case, after the additional machining (i.e., printing) within the machining unit areas PUA#1 and PUA#2 is completed, the machining system SYSa may move at least one of the machining head 21 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 are set in another area on the printing surface MS. That is, after the additional machining (i.e., molding) in the machining unit areas PUA#1 and PUA#2 is completed, the machining system SYSa may move at least one of the machining head 21 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the printing surface MS. In this case, the machining system SYSa may move at least one of the machining head 21 and the stage 31 so that the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set (i.e., the area where the additional machining has already been performed) and the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set (i.e., the area where the additional machining is about to be performed) are adjacent to each other. In particular, the machining system SYSa may move at least one of the machining head 21 and the stage 31 so that an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set does not overlap with an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set. However, the machining system SYSa may move at least one of the machining head 21 and the stage 31 so that an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set partially overlaps with an area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set.

[0199] The machining system SYSa repeats a series of manufacturing processes, including forming a molten pool MP#1 by irradiating the machining unit area PUA#1 with the machining light EL#1, forming a molten pool MP#2 by irradiating the machining unit area PUA#2 with the machining light EL#2, supplying the manufacturing material M to the molten pools MP#1 and MP#2, melting the supplied manufacturing material M, and solidifying the molten manufacturing material M, while moving the machining unit areas PUA#1 and PUA#2 on the manufacturing surface MS along the target movement trajectory MTO, as shown in FIG. 9(d). In this case, as the machining unit areas PUA#1 and PUA#2 move, a manufactured object having a width in a direction intersecting the target movement trajectory MTO is manufactured on the manufacturing surface MS. For example, when the machining unit areas PUA#1 and PUA#2 move as shown in FIGS. 7(a) and 7(b), a manufactured object having a width in the X-axis direction and extending in the Y-axis direction is manufactured. For example, when the processing unit areas PUA#1 and PUA#2 move as shown in Figures 8(a) and 8(c), respectively, a structure having a width along the X-axis direction and extending along the Y-axis direction is formed.

[0200] 9( e), a structure layer SL corresponding to a structured object, which is an aggregate of the melted and then solidified building material M, is formed on the building surface MS. That is, a structure layer SL corresponding to an aggregate of objects formed on the building surface MS in a pattern corresponding to the target movement trajectories MT0 of the processing unit areas PUA#1 and PUA#2 is formed. That is, a structure layer SL having a shape corresponding to the target movement trajectories MT0 of the processing unit areas PUA#1 and PUA#2 in plan view is formed.

[0201] Note that, when the target irradiation area EA#1 is set in an area where no object is desired to be formed, the processing system SYSa does not have to irradiate the target irradiation area EA#1 with the processing light EL#1. Alternatively, the processing system SYSa may irradiate the target irradiation area EA#1 with the processing light EL#1 and stop the supply of the building material M. Alternatively, the processing system SYSa may supply the building material M to the target irradiation area EA#1 and irradiate the target irradiation area EA#1 with the processing light EL#1 at an intensity that does not cause the formation of a molten pool MP. The same applies when the target irradiation area EA#2 is set in an area where no object is desired to be formed.

[0202] The target movement trajectories MT0 of the machining unit areas PUA#1 and PUA#2 may be referred to as machining paths (in other words, tool paths). In this case, the control unit 7 may move at least one of the machining head 21 and the stage 31 based on path information indicating the target movement trajectories MT0 (i.e., path information indicating the machining paths) so that each of the machining unit areas PUA#1 and PUA#2 moves along the target movement trajectories MT0 on the build surface MS.

[0203] The machining system SYSa repeatedly performs operations for forming such a structure layer SL based on the three-dimensional model data under the control of the control unit 7. Specifically, before performing operations for forming the structure layer SL, the control unit 7 first slices the three-dimensional model data at the layer pitch to create slice data. The machining system SYSa performs operations for forming the first structure layer SL#1 on the build surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structure layer SL#1. Specifically, the control unit 7 acquires path information for forming the first structure layer SL#1, which is generated based on the slice data corresponding to the structure layer SL#1. Then, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information to form the first structure layer SL#1. As a result, the structure layer SL#1 is formed on the build surface MS as shown in FIG. 10( a). Thereafter, the machining system SYSa sets the surface (i.e., the upper surface) of the structural layer SL#1 as a new build surface MS, and then builds a second structural layer SL#2 on the new build surface MS. To build the structural layer SL#2, the control unit 7 first controls at least one of the head drive system 22 and the stage drive system 32 so that the machining head 21 moves along the Z axis relative to the stage 31. Specifically, the control unit 7 controls at least one of the head drive system 22 and the stage drive system 32 to move the machining head 21 toward the +Z side and / or move the stage 31 toward the −Z side so that the machining unit areas PUA#1 and PUA#2 are set on the surface of the structural layer SL#1 (i.e., the new build surface MS). Thereafter, under the control of the control unit 7, the machining system SYSa forms a structural layer SL#2 on the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2, by performing an operation similar to the operation for forming the structural layer SL#1. As a result, the structural layer SL#2 is formed as shown in FIG. 10( b). Thereafter, similar operations are repeated until all structural layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, as shown in FIG. 10( c), the three-dimensional structure ST is formed by a layered structure in which multiple structural layers SL are stacked.

[0204] (1-3-3) Second Modeling Operation In the first modeling operation described above, the machining system SYSa forms a molten pool MP on the modeling surface MS by irradiating the modeling surface MS with the processing light EL. On the other hand, in the second modeling operation, the machining system SYSa does not necessarily irradiate the modeling surface MS with the processing light EL in order to form a molten pool MP on the modeling surface MS. In the second modeling operation, the machining system SYSa does not necessarily perform the operation of forming a molten pool MP by irradiating the modeling surface MS with the processing light EL. Furthermore, in the first modeling operation described above, the machining system SYSa supplies the modeling material M to the molten pool MP formed on the modeling surface MS, thereby melting the modeling material M in the molten pool MP. In other words, in the first modeling operation described above, the machining system SYSa melts the modeling material M on the modeling surface MS. On the other hand, in the second modeling operation, the machining system SYSa does not need to melt the modeling material M on the modeling surface MS.

[0205] Specifically, in the second modeling operation, the processing system SYSa melts the modeling material M in the space between the material nozzle 212 and the modeling surface MS before the modeling material M reaches the modeling surface MS. That is, in the second modeling operation, the processing system SYSa melts the modeling material M in the space between the material nozzle 212 and the modeling surface MS by irradiating the modeling material M with the processing light EL in the space between the material nozzle 212 and the modeling surface MS. In other words, in the second modeling operation, the modeling material M is melted by the energy of the processing light EL in the space between the material nozzle 212 and the modeling surface MS. The modeling material M melted in the space between the material nozzle 212 and the modeling surface MS is supplied to the modeling surface MS. Therefore, the processing system SYSa supplies the modeling material M melted in the space between the material nozzle 212 and the modeling surface MS to the modeling surface MS. Therefore, to summarize the explanation of the second modeling operation described above, the second modeling operation may be an operation in which the modeling material M is melted by irradiating the processing light EL onto the modeling material M in the space between the material nozzle 212 and the modeling surface MS, and the molten modeling material M is supplied to the modeling surface MS to form a model on the modeling surface MS.

[0206] To form each structure layer SL by performing the second modeling operation, the processing system SYSa, under the control of the control unit 7, moves at least one of the processing head 21 and the stage 31 so that the molten modeling material M is supplied to a desired area on the modeling surface MS corresponding to the surface of the workpiece W or the surface of the modeled structure layer SL. Thereafter, as shown in FIG. 11A, the processing system SYSa, under the control of the control unit 7, emits processing light EL#1 and EL#2 from the irradiation optical system 211. Furthermore, as shown in FIG. 11A, the processing system SYSa, under the control of the control unit 7, supplies the modeling material M from the material nozzle 212.

[0207] As a result, at least one of the processing lights EL#1 and EL#2 is irradiated onto the shaping material M in the space between the material nozzle 212 and the shaping surface MS. In the following description, for convenience of explanation, a virtual material supply surface PL located at a position in the space between the material nozzle 212 and the shaping surface MS where at least one of the processing lights EL#1 and EL#2 is irradiated onto the shaping material M is referred to as a material irradiation surface ES. In this case, as shown in FIG. 11A, the processing system SYSa may be considered to irradiate the material irradiation surface ES with the processing lights EL#1 and EL#2 and to supply the shaping material M to the material irradiation surface ES. However, because the material irradiation surface ES is not a physical surface, the processing lights EL#1 and EL#2 irradiated onto the material irradiation surface ES pass through the material irradiation surface ES, and the shaping material M supplied to the material irradiation surface ES also passes through the material irradiation surface ES. Therefore, the processing system SYSa can be considered to emit processing light EL#1 and EL#2 so that the processing light EL#1 and EL#2 pass through the material irradiation surface ES, and to supply the forming material M so that the forming material M passes through the material irradiation surface ES.

[0208] When at least one of the processing light EL#1 and EL#2 is irradiated onto the building material M at the material irradiation surface ES, the building material M melts at the material irradiation surface ES, as shown in FIG. 11A. The building material M melted at the material irradiation surface ES is supplied from the material irradiation surface ES to the building surface MS. As a result, the building material M melted at the material irradiation surface ES adheres to the building surface MS. In this case, it can be considered that a molten pool MP is formed on the building surface MS by the building material M melted at the material irradiation surface ES. However, in the second building operation, since the object (e.g., the workpiece W or the structural layer SL) having the building surface MS on its surface is rarely melted directly by the processing light EL, the molten pool MP rarely penetrates into the object (e.g., the workpiece W or the structural layer SL) having the building surface MS on its surface. Alternatively, the amount of penetration of the molten pool MP into the interior of the object (e.g., workpiece W or structural layer SL) having the printing surface MS on its surface is relatively small. On the other hand, in the first printing operation, because the object (e.g., workpiece W or structural layer SL) having the printing surface MS on its surface is melted by the processing light EL, there is a high possibility that the molten pool MP will penetrate into the interior of the object (e.g., workpiece W or structural layer SL) having the printing surface MS on its surface. Furthermore, the amount of penetration of the molten pool MP into the interior of the object (e.g., workpiece W or structural layer SL) having the printing surface MS on its surface is relatively large. For this reason, if it is considered that a molten pool MP is formed in the second printing operation, the depth of the formed molten pool MP will typically be shallower than the depth of the molten pool MP formed in the first printing operation.

[0209] Thereafter, the modeling material M supplied to the modeling surface MS is cooled and solidified (i.e., solidified). As a result, as shown in Fig. 11(b), a model made of the solidified modeling material M is deposited on the modeling surface MS.

[0210] The processing system SYSa repeats a series of modeling processes, including melting the modeling material M on the material irradiation surface ES by irradiating it with the processing lights EL#1 and EL#2, supplying the molten modeling material M to the modeling surface MS, and solidifying the molten modeling material M on the modeling surface MS, while moving the processing head 21 relative to the modeling surface MS, as shown in FIG. 11( c). In particular, the processing system SYSa repeats the series of modeling processes while moving the processing head 21 relative to the modeling surface MS along at least one of the X-axis direction and the Y-axis direction. In this case, as the processing head 21 moves, a modeled object having a width along a direction intersecting the movement direction of the processing head 21 is formed on the modeling surface MS. As a result, as shown in FIG. 11( d), a structure layer SL corresponding to a modeled object that is an aggregate of the melted and then solidified modeling material M is formed on the modeling surface MS. The structure layer SL corresponding to a aggregate of models formed on the modeling surface MS is formed in a pattern according to the movement trajectory of the processing head 21. That is, a structure layer SL having a shape corresponding to the movement trajectory of the processing head 21 in a plan view is formed.

[0211] Thereafter, also in the case of performing the second modeling operation, similarly to the case of performing the first modeling operation, the processing system SYSa repeatedly performs the operation for modeling such a structural layer SL based on the three-dimensional model data under the control of the control unit 7. As a result, a three-dimensional structure ST is formed by a layered structure in which a plurality of structural layers SL are stacked.

[0212] As described above, when such a second-modeling operation is performed, an object (e.g., a workpiece W or a structure layer SL) having a modeling surface MS on its surface is rarely directly melted by the processing light EL. Therefore, a relatively shallow molten pool MP is formed on the modeling surface MS by the modeling material M molten at the material irradiation surface ES. Therefore, the time required for the molten modeling material M to cool and solidify is shorter when compared to when a relatively deep molten pool MP is formed. Therefore, when the second-modeling operation is performed, the time required to model the three-dimensional structure ST is shorter when compared to when the first-modeling operation is performed. In other words, the modeling speed of the second-modeling operation is faster than the modeling speed of the first-modeling operation. In other words, when the second-modeling operation is performed, the machining system SYSa can model the three-dimensional structure ST at a higher speed when compared to when the first-modeling operation is performed.

[0213] Since the three-dimensional structure ST can be formed at high speed by the second-forming operation in this manner, the second-forming operation may be referred to as a forming operation conforming to the extreme high speed application (EHLA). The second-forming operation may also be considered to be a forming operation conforming to the extreme high speed application (EHLA).

[0214] When the second modeling operation is performed, similarly to when the first modeling operation is performed, the machining system SYSa may deflect the processing light EL#1 and EL#2 using the galvanometer mirrors 2146 and 2156, respectively. In this case, as shown in FIG. 12 , which shows the processing light EL#1 passing through the material irradiation surface ES, the machining system SYSa may deflect the processing light EL#1 using the galvanometer mirror 2146 to move the beam passing area PA#1 through which the processing light EL#1 passes within the virtual material irradiation surface ES that intersects the Z-axis between the material nozzle 212 and the modeling surface MS. Similarly, as shown in FIG. 11 , which shows the processing light EL#2 passing through the material irradiation surface ES, the machining system SYSa may deflect the processing light EL#2 using the galvanometer mirror 2156 to move the beam passing area PA#2 through which the processing light EL#2 passes within the virtual material irradiation surface ES that intersects the Z-axis between the material nozzle 212 and the modeling surface MS.

[0215] In the first embodiment, for convenience of explanation, a virtual area through which the galvanometer mirror 2146 or 2156 moves the beam passing area PA#k (where k is a variable indicating 1 or 2) on the material irradiation surface ES is referred to as the irradiation unit area MUA (particularly, the irradiation unit area MUA#k). In this case, the beam passing area PA#k may be considered to move on a surface of the material irradiation surface ES that overlaps with the irradiation unit area MUA#k. Specifically, a virtual area through which the galvanometer mirror 2146 or 2156 moves the beam passing area PA#k on the material irradiation surface ES while the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed (i.e., without change) is referred to as the irradiation unit area MUA (particularly, the irradiation unit area MUA#k). The irradiation unit area MUA#k indicates a virtual area (in other words, a range) through which the processing light EL#k emitted from the processing head 21 actually passes when the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed. The irradiation unit area MUA#k indicates a region (in other words, a range) through which the beam passing area PA#k actually moves when the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed. Therefore, the irradiation unit area MUA#k may be considered to be a virtual area determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the irradiation unit area MUA#k may be considered to be a virtual area located on the material irradiation surface ES at a position determined based on the processing head 21 (particularly, the irradiation optical system 211). Furthermore, the maximum area over which the galvanometer mirror 2146 or 2156 can move the beam passing area PA#k on the material irradiation surface ES while the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed may also be referred to as the irradiation unit area MUA#k.

[0216] In this case, the processing system SYSa can move the beam passing area PA#k within the irradiation unit area MUA#k using the galvanometer mirror 2146 or 2156. Therefore, the operation of deflecting the processing light EL#k using the galvanometer mirror 2146 or 2156 may be considered equivalent to the operation of moving the beam passing area PA#k within the irradiation unit area MUA#k.

[0217] Note that even when at least one of the machining head 21 and the stage 31 moves, the beam passing area PA#k moves on the material irradiation surface ES. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirrors 2146 and 2156 and the material irradiation surface ES changes. As a result, the irradiation unit area MUA#k determined based on the machining head 21 (i.e., the irradiation unit area MUA#k where the galvanometer mirror 2146 or 2156 moves the beam passing area PA#k on the material irradiation surface ES) moves on the material irradiation surface ES. For this reason, in the first embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the irradiation unit area MUA#k relative to the material irradiation surface ES.

[0218] The characteristics of the irradiation unit area MUA#k (e.g., shape, movement pattern, etc.) may be the same as the characteristics of the processing unit area PUA#k described above. The movement pattern (e.g., movement trajectory) of the beam passing area PA#k within the irradiation unit area MUA#k may be the same as the movement pattern of the target irradiation area EA#k within the processing unit area PUA#k described above. Therefore, a detailed description of the characteristics of the irradiation unit area MUA#k and the movement pattern (e.g., movement trajectory, etc.) of the beam passing area PA#k within the irradiation unit area MUA#k will be omitted, but an example will be briefly described below with reference to Figures 13(a) to 13(e). 13(a), under the assumption that the irradiation unit area MUA#k is stationary (i.e., not moving) on ​​the material irradiation surface ES, the galvanometer mirror 2146 or 2156 may deflect the processing light EL#k so that the beam passing area PA#k moves within the irradiation unit area MUA#k along a single scanning direction along the material irradiation surface ES. When the irradiation unit area MUA#k shown in FIG. 13(a) moves along the target movement trajectory MT0 on the material irradiation surface ES, the beam passing area PA#k may move along the movement trajectory MT#k shown in FIG. 13(b) (e.g., a waveform-shaped movement trajectory MT#k oscillating around the target movement trajectory MT0) on the material irradiation surface ES. 13(c) and 13(d), under the assumption that the irradiation unit area MUA#k is stationary (i.e., not moving) on ​​the material irradiation surface ES, the galvanometer mirror 2146 or 2156 may deflect the processing light EL#k so that the beam passing area PA#k moves along a plurality of scanning directions within the irradiation unit area MUA#k. When the irradiation unit area MUA#k shown in FIG. 13(c) moves along the target movement trajectory MT0 on the material irradiation surface ES, the beam passing area PA#k may move along the movement trajectory MT#k shown in FIG. 13(e).

[0219] The material nozzle 212 may supply the modeling material M to the irradiation unit area MUA. In this case, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that the entire material supply area MSA is included in the irradiation unit area MUA, as shown in FIG. 14( a), which is a plan view showing the relationship between the material supply area MSA to which the modeling material M is supplied within the irradiation unit area MUA and the irradiation unit area MUA. In other words, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that a part of the irradiation unit area MUA is included in the material supply area MSA, while another part of the irradiation unit area MUA is not included in the material supply area MSA. Alternatively, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that a part of the material supply area MSA is included in the irradiation unit area MUA, while another part of the material supply area MSA is not included in the irradiation unit area MUA, as shown in FIG. 14( b), which is a plan view showing the relationship between the material supply area MSA and the irradiation unit area MUA. In other words, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that a part of the irradiation unit area MUA is included in the material supply area MSA, while another part of the irradiation unit area MUA is not included in the material supply area MSA. Alternatively, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that the entire irradiation unit area MUA is included in the material supply area MSA, as shown in Figure 14(c), which is a plan view showing the relationship between the material supply area MSA and the irradiation unit area MUA. In other words, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that a part of the material supply area MSA is included in the irradiation unit area MUA, while another part of the material supply area MSA is not included in the irradiation unit area MUA.

[0220] (1-4) Alignment Operation Performed by Machining System SYSa In the first embodiment, the machining system SYSa (particularly, the control unit 7) may perform an alignment operation based on the imaging result of the imaging device 8 (i.e., the image IMG generated by the imaging device 8). In the first embodiment, the control unit 7 may perform at least one of a nozzle-beam alignment operation and a multi-beam alignment operation as the alignment operation.

[0221] The nozzle-beam alignment operation is an operation for aligning the material nozzle 212 that supplies the modeling material M with the processing light EL (i.e., at least one of the processing light EL#1 and EL#2) that melts the modeling material M. On the other hand, the multi-beam alignment operation is an operation for aligning the processing light EL#1 and the processing light EL#2.

[0222] The control unit 7 may perform the alignment operation while the machining system SYSa is performing additional machining. The control unit 7 may perform the alignment operation before the machining system SYSa starts additional machining. The control unit 7 may perform the alignment operation after the machining system SYSa has finished additional machining.

[0223] The nozzle-beam alignment operation and the multi-beam alignment operation will be described below in turn.

[0224] (1-4-1) Nozzle-Beam Alignment Operation To perform the nozzle-beam alignment operation, the imaging device 8 images the material nozzle 212. That is, the imaging device 8 images the material nozzle 212 by receiving imaging light CL from the material nozzle 212. In this case, the imaging device 8 typically images a portion of the material nozzle 212, but it may also image the entire material nozzle 212.

[0225] To perform the nozzle-beam alignment operation, the imaging device 8 further images the material nozzle 212 and at least one of the build surface MS and the material irradiation surface ES. That is, the imaging device 8 receives the imaging light CL from the material nozzle 212 and also receives the imaging light CL from at least one of the build surface MS and the material irradiation surface ES, thereby imaging at least one of the build surface MS and the material irradiation surface ES. In this case, typically, a portion of at least one of the build surface MS and the material irradiation surface ES is imaged, but the entirety of at least one of the build surface MS and the material irradiation surface ES may also be imaged.

[0226] The imaging device 8 may image the printing surface MS when the processing system SYSa performs the first printing operation. On the other hand, the imaging device 8 may image the material irradiation surface ES when the processing system SYSa performs the second printing operation. However, when the processing system SYSa performs the second printing operation, the imaging device 8 may image the printing surface MS in addition to or instead of the material irradiation surface ES.

[0227] When the imaging device 8 images the printing surface MS, the above-described illumination device 213 may illuminate the printing surface MS with illumination light IL. As a result, the imaging device 8 can properly image the printing surface MS. On the other hand, when the imaging device 8 images the material-irradiated surface ES, the above-described illumination device 213 may illuminate the material-irradiated surface ES with illumination light IL. As a result, the imaging device 8 can properly image the printing surface MS.

[0228] Since the printing surface MS and the material irradiation surface ES are each a plane intersecting the Z-axis, the illumination device 213 may illuminate at least one of the printing surface MS and the material irradiation surface ES with a sheet-like illumination light IL along at least one of the printing surface MS and the material irradiation surface ES. The illumination device 213 may illuminate at least one of the printing surface MS and the material irradiation surface ES with a sheet-like illumination light IL that encompasses at least one of the printing surface MS and the material irradiation surface ES. An example of such an illumination device 213 is a sheet light source. However, the illumination device 213 may illuminate at least one of the printing surface MS and the material irradiation surface ES with a sheet-like illumination light IL along a plane intersecting at least one of the printing surface MS and the material irradiation surface ES. In this case, the angle formed between the plane along the sheet-like illumination light IL and at least one of the printing surface MS and the material irradiation surface ES may be an acute angle.

[0229] The imaging device 8 images the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES during the period when the machining unit 2 is emitting the processing light EL toward at least one of the printing surface MS and the material irradiation surface ES. In this case, the imaging device 8 may also image the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES during the period when the machining unit 2 is emitting the processing light EL toward at least one of the printing surface MS and the material irradiation surface ES to actually perform additional processing on the workpiece W. The imaging device 8 may also image the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES during the period when the machining system SYSa is performing additional processing. Alternatively, the imaging device 8 may image the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES during the period when the machining unit 2 is emitting the processing light EL toward at least one of the printing surface MS and the material irradiation surface ES without actually performing additional processing on the workpiece W. In this case, the imaging device 8 may capture an image of the material nozzle 212 and at least one of the manufacturing surface MS and the material irradiation surface ES before or after the machining system SYSa starts or finishes additional machining.

[0230] Note that, when the imaging device 8 images the material nozzle 212 and at least one of the build surface MS and the material irradiation surface ES before or after the machining system SYSa starts or finishes additional machining, a test workpiece used for the nozzle-beam alignment operation may be placed on the stage 31 instead of the workpiece W. In this case, the surface of the test workpiece may be used as the build surface MS.

[0231] When the machining unit 2 emits the processing light EL toward at least one of the building surface MS and the material irradiation surface ES, the building material M melts on at least one of the building surface MS and the material irradiation surface ES, as described above. The imaging device 8 may capture an image of the building material M melted on at least one of the building surface MS and the material irradiation surface ES by capturing an image of at least one of the building surface MS and the material irradiation surface ES. In other words, to perform the nozzle-beam alignment operation, the imaging device 8 may capture an image of the material nozzle 212 and the building material M melted on at least one of the building surface MS and the material irradiation surface ES. The building material M melted on the building surface MS forms a molten pool MP. Therefore, capturing an image of the molten building material M on the building surface MS may be considered equivalent to capturing an image of the molten pool MP. In the following description, for the sake of convenience, the molding material M melted on at least one of the molding surface MS and the material irradiation surface ES will be referred to as the molten material M_melt.

[0232] Alternatively, when the machining unit 2 emits the processing light EL toward the printing surface MS, a beam spot of the processing light EL may be formed on the printing surface MS. For example, if a nozzle-beam alignment operation is performed before or after the machining system SYSa starts or finishes additional processing, the intensity of the processing light EL emitted toward the printing surface MS may be weaker than the intensity required to melt the printing surface MS. In this case, a beam spot of the processing light EL may be formed on the printing surface MS instead of a molten pool MP. The imaging device 8 may capture an image of the beam spot of the processing light EL formed on the printing surface MS by imaging the printing surface MS. In other words, the imaging device 8 may capture an image of the processing light EL on the printing surface MS by imaging the printing surface MS.

[0233] In the following explanation, an example will be described in which the imaging device 8 images the material nozzle 212 and the molten material M_melt in order to perform the nozzle-beam alignment operation. However, the following explanation of the nozzle-beam alignment operation, including the operation of imaging the material nozzle 212 and the molten material M_melt, can be used as an explanation of the nozzle-beam alignment operation, including the operation of imaging the material nozzle 212 and the beam spot of the processing light EL, by replacing "molten material M_melt" with "beam spot of the processing light EL (processing light EL)."

[0234] The imaging device 8 captures an image of the material nozzle 212 and the molten material M_melt to generate an image IMG in which the material nozzle 212 and the molten material M_melt are captured. FIG. 15 shows an example of the image IMG in which the material nozzle 212 and the molten material M_melt are captured. As shown in FIG. 15 , the image IMG may also capture an inner wall surface 2125 of the material nozzle 212 and an opening 2124 formed in the bottom surface 2120 of the material nozzle 212. Note that FIG. 15 shows an example of an image IMG generated when the imaging device 8 captures an image of the material nozzle 212 and the molten material M_melt by receiving imaging light CL that passes through the opening 2124 of the material nozzle 212 (see FIG. 5 ). In this case, the imaging device 8 may be aligned with the material nozzle 212 so that the opening 2124 of the material nozzle 212 is included in the imaging field of the imaging device 8.

[0235] Before the imaging device 8 captures an image of the material nozzle 212 and the molten material M_melt, the control unit 7 controls the machining unit 2 so that the material nozzle 212 and the processing light EL have a desired positional relationship. Specifically, the control unit 7 controls at least one of the galvanometer mirrors 2146 and 2156 included in the machining unit 2 so that the material nozzle 212 and the processing light EL have a desired positional relationship. For example, when aligning the material nozzle 212 with the processing light EL#1, the control unit 7 may control the galvanometer mirror 2146 included in the machining unit 2 so that the material nozzle 212 and the processing light EL#1 have a desired positional relationship. For example, when aligning the material nozzle 212 with the processing light EL#2, the control unit 7 may control the galvanometer mirror 2156 included in the machining unit 2 so that the material nozzle 212 and the processing light EL#2 have a desired positional relationship.

[0236] The control unit 7 generates a drive command value (reference drive command value) for controlling at least one of the galvanometer mirrors 2146 and 2156 so that the positional relationship between the material nozzle 212 and the processing light EL becomes a desired positional relationship. In this case, the control unit 7 outputs the generated reference drive command value to at least one of the galvanometer mirrors 2146 and 2156, thereby controlling at least one of the galvanometer mirrors 2146 and 2156 so that the positional relationship between the material nozzle 212 and the processing light EL becomes a desired positional relationship.

[0237] In the following description, for convenience of explanation, an example will be described in which the state in which the material nozzle 212 and the processing light EL achieve the desired positional relationship is one in which the processing light EL passes through the center C of the opening 2124 formed in the underside 2120 of the material nozzle 212, as shown in Figure 16. That is, an example will be described in which the state in which the material nozzle 212 and the processing light EL achieve the desired positional relationship is one in which the processing light EL passes through the center C of the opening 2124 within a plane that intersects the direction of travel of the processing light EL and includes the opening 2124 (i.e., a plane that is along the XY plane and includes the opening 2124). However, the state in which the material nozzle 212 and the processing light EL achieve the desired positional relationship is not limited to the example shown in Figure 16.

[0238] Note that, under the condition that the attitude (rotation angle) of the galvanometer mirror 2146 is the reference attitude (reference angle), the material nozzle 212 and the galvanometer mirror 2146 may be pre-aligned so that the processing light EL#1 passes through the center C of the opening 2124 formed in the lower surface 2120 of the material nozzle 212. Similarly, under the condition that the attitude (rotation angle) of the galvanometer mirror 2156 is the reference attitude (reference angle), the material nozzle 212 and the galvanometer mirror 2156 may be pre-aligned so that the processing light EL#2 passes through the center C of the opening 2124 formed in the lower surface 2120 of the material nozzle 212. An example of a state in which the attitude of the galvanometer mirror 2146 is the reference attitude is a state in which the rotation angles of each of the X-scanning mirrors 2146MX and 2146MY of the galvanometer mirror 2146 are zero degrees. An example of a state in which the orientation of the galvanometer mirror 2156 is the reference orientation is when the rotation angles of the X-scanning mirrors 2156MX and 2156MY of the galvanometer mirror 2156 are zero degrees. In this case, at least one of the galvanometer mirrors 2146 and 2156 deflects the processing light EL with the center C of the aperture 2124 as the origin. As a result, the maximum deflection amount of the processing light EL from the center C of the aperture 2124 toward the +X side can be made the same as the maximum deflection amount of the processing light EL from the center C of the aperture 2124 toward the -X side. Similarly, the maximum deflection amount of the processing light EL from the center C of the aperture 2124 toward the +Y side can be made the same as the maximum deflection amount of the processing light EL from the center C of the aperture 2124 toward the -Y side. As a result, controllability of at least one of the galvanometer mirrors 2146 and 2156 is facilitated.

[0239] Furthermore, the material nozzle 212 and at least one of the galvanometer mirrors 2146 and 2156 may be pre-aligned so that the processing light EL passing through the center C of the opening 2124 formed in the lower surface 2120 of the material nozzle 212 passes through the above-mentioned material control point MCP where the modeling material M gathers. In this case, the amount of light component of the processing light EL irradiated onto the modeling material M can be increased compared to when the processing light EL passing through the center C of the opening 2124 does not pass through the material control point MCP. As a result, the melting efficiency of the modeling material M is improved.

[0240] The image capturing device 8 captures an image of the material nozzle 212 and the molten material M_melt while at least one of the galvanometer mirrors 2146 and 2156 is controlled so that the material nozzle 212 and the processing light EL have a desired positional relationship. Thereafter, the control unit 7 aligns the material nozzle 212 with the processing light EL based on the image IMG in which the material nozzle 212 and the molten material M_melt are captured.

[0241] Specifically, because the molten material M_melt is generated by irradiating the printing material M with the processing light EL, the position of the molten material M_melt is equivalent to the position at which the printing material M is irradiated with the processing light EL. In other words, the position of the molten material M_melt is equivalent to the position of the processing light EL. Specifically, the position of the molten material M_melt is equivalent to the position on the printing surface MS at which the processing light EL is irradiated or the position through which the processing light EL passes on the material irradiation surface ES, which is equivalent to the printing surface MS. In other words, the position of the molten material M_melt is equivalent to the position of the processing light EL on the printing surface MS or the material irradiation surface ES, which is equivalent to the printing surface MS. Therefore, the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG is equivalent to the positional relationship between the material nozzle 212 and the processing light EL in the processing system SYSa.

[0242] Therefore, the control unit 7 may determine the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG based on the image IMG, thereby substantially determining the positional relationship between the material nozzle 212 and the processing light EL in the processing system SYSa. To determine the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG, the control unit 7 may detect the material nozzle 212 and the molten material M_melt in the image IMG. That is, the control unit 7 may detect the position of the material nozzle 212 and the position of the molten material M_melt in the image IMG. As a result, the control unit 7 can determine the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG. Since the image IMG is used to detect the position of the material nozzle 212 and the position of the molten material M_melt, the imaging device 8 (imaging element 81) that generates the image IMG may be considered to be a detection device (detector) that can detect the position of the material nozzle 212 and the position of the molten material M_melt. Furthermore, since the position of the molten material M_melt is equivalent to the position of the processing light EL, the imaging device 8 (imaging element 81) may be considered to be a detection device (detector) that can detect the position (irradiation position) of the processing light EL.

[0243] The position of the molten material M_melt in the image IMG corresponds to the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8 that generates the image IMG. Therefore, specifying the positional relationship between the material nozzle 212 and the molten material M_melt based on the image IMG may be considered equivalent to specifying the positional relationship between the material nozzle 212 and the molten material M_melt based on the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8. Furthermore, the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8 corresponds to the position of the molten material M_melt on the printing surface MS or the material irradiation surface ES (i.e., the position of the processing light EL on the printing surface MS or the material irradiation surface ES). In other words, there is a mutual correspondence between the position on the imaging surface of the imaging device 8 where the imaging light CL from the molten material M_melt is incident and the position of the molten material M_melt on the printing surface MS or the material irradiation surface ES (i.e., the position of the processing light EL on the printing surface MS or the material irradiation surface ES). Therefore, specifying the positional relationship between the material nozzle 212 and the molten material M_melt based on the image IMG may be considered equivalent to specifying the positional relationship between the material nozzle 212 and the molten material M_melt based on the mutual correspondence between the position on the imaging surface of the imaging device 8 where the imaging light CL from the molten material M_melt is incident and the position of the molten material M_melt on the printing surface MS or the material irradiation surface ES (i.e., the position of the processing light EL on the printing surface MS or the material irradiation surface ES).

[0244] 17(a), which shows an example of an image IMG, illustrates an example in which the material nozzle 212 and the molten material M_melt have a desired positional relationship within the image IMG. Specifically, FIG. 17(a) illustrates an example in which the molten material M_melt appears within the image IMG at a position corresponding to the center C of the opening 2124 of the material nozzle 212. In this case, it is assumed that the positional relationship between the material nozzle 212 and the processing light EL is a desired positional relationship. In other words, it is assumed that the processing light EL actually passes through the center C of the opening 2124 of the material nozzle 212.

[0245] On the other hand, FIG. 17( b), which shows an example of an image IMG, illustrates an example in which the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG is not the desired one. Specifically, FIG. 17( b) illustrates an example in which the molten material M_melt appears in the image IMG at a position away from the position corresponding to the center C of the opening 2124 of the material nozzle 212. In this case, it is assumed that the positional relationship between the material nozzle 212 and the processing light EL is not actually the desired one. In other words, it is assumed that the processing light EL does not actually pass through the center C of the opening 2124 of the material nozzle 212. In this way, when the positional relationship between the material nozzle 212 and the molten material M_melt is not the desired one, it is assumed that the positional relationship between the material nozzle 212 and the processing light EL is not actually the desired one, even though at least one of the galvanometer mirrors 2146 and 2156 is controlled so that the positional relationship between the material nozzle 212 and the processing light EL is the desired one. In this case, a positional misalignment occurs between the material nozzle 212 and the processing light EL. In other words, the material nozzle 212 and the processing light EL are not properly aligned. One example of a reason why the actual positional relationship between the material nozzle 212 and the processing light EL is not the desired one, even though at least one of the galvanometer mirrors 2146 and 2156 is controlled to achieve the desired positional relationship, is a control error of at least one of the galvanometer mirrors 2146 and 2156. Another example of a reason why the actual positional relationship between the material nozzle 212 and the processing light EL is not the desired one, even though at least one of the galvanometer mirrors 2146 and 2156 is controlled to achieve the desired positional relationship, is a positional misalignment of at least one of the galvanometer mirrors 2146 and 2156 (e.g., a positional misalignment from the design or ideal position).Furthermore, even though at least one of the galvanometer mirrors 2146 and 2156 is controlled so that the positional relationship between the material nozzle 212 and the processing light EL is the desired positional relationship, another example of a reason why the positional relationship between the material nozzle 212 and the processing light EL does not actually become the desired positional relationship is a positional deviation of the material nozzle 212 (for example, a positional deviation from the designed or ideal position).

[0246] Therefore, the control unit 7 may calculate a correction command value for correcting the drive command value (reference drive command value) so that the positional relationship between the material nozzle 212 and the processing light EL becomes the desired positional relationship, based on the error between the positional relationship between the material nozzle 212 and the molten material M_melt and the desired positional relationship (i.e., the positional misalignment between the material nozzle 212 and the processing light EL). Specifically, as described above, the state in which the positional relationship between the material nozzle 212 and the processing light EL becomes the desired positional relationship is the state in which the processing light EL passes through the center C of the opening 2124 of the material nozzle 212. Therefore, the positional misalignment between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt in the image IMG corresponds to the positional misalignment between the material nozzle 212 and the processing light EL.

[0247] Specifically, the misalignment in the X-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt in the image IMG corresponds to the misalignment in the X-axis direction between the material nozzle 212 and the processing light EL. Therefore, if the misalignment in the X-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt is reduced, it is expected that the misalignment in the X-axis direction between the material nozzle 212 and the processing light EL will also be reduced. In particular, if the misalignment in the X-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt is eliminated, it is expected that the misalignment in the X-axis direction between the material nozzle 212 and the processing light EL will also be eliminated. For this reason, the control unit 7 may calculate the positional deviation amount ΔX11 (see FIG. 17(b)) in the X-axis direction between the center C of the opening 2124 of the material nozzle 212 in the image IMG and the molten material M_melt, and calculate a correction command value for correcting the drive command value (reference drive command value) so that the positional deviation amount ΔX11 becomes small (typically, becomes zero).

[0248] Similarly, the positional deviation in the Y-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt in the image IMG corresponds to the positional deviation in the Y-axis direction between the material nozzle 212 and the processing light EL. Therefore, if the positional deviation in the Y-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt is reduced, it is expected that the positional deviation in the Y-axis direction between the material nozzle 212 and the processing light EL will also be reduced. If the positional deviation in the Y-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt is eliminated, it is expected that the positional deviation in the Y-axis direction between the material nozzle 212 and the processing light EL will also be eliminated. For this reason, the control unit 7 may calculate the positional deviation amount ΔY1 (see Figure 17 (b)) in the Y-axis direction between the center C of the opening 2124 of the material nozzle 212 in the image IMG and the molten material M_melt, and calculate a correction command value for correcting the drive command value (reference drive command value) so that the positional deviation amount ΔY1 becomes small (typically, becomes zero).

[0249] In this case, the control unit 7 may repeat the above-described operation until at least one of the calculated positional deviation amounts ΔX1 and ΔY1 becomes equal to or less than a predetermined first allowable upper limit value (or becomes zero). Specifically, during a first period, the imaging device 8 may generate a first image IMG by capturing an image of the material nozzle 212 and the molten material M_melt. Thereafter, during the first period, the control unit 7 may calculate at least one of the positional deviation amounts ΔX1 and ΔY1 based on the first image IMG and calculate a first correction command value so as to reduce at least one of the positional deviation amounts ΔX1 and ΔY1. Thereafter, during a second period following the first period, the control unit 7 may correct the drive command value (reference drive command value) using the first correction command value and control at least one of the galvanometer mirrors 2146 and 2156 using the corrected drive command value. Thereafter, during a second period, the imaging device 8 may generate a second image IMG by again capturing an image of the material nozzle 212 and the molten material M_melt. Then, during the second period, the control unit 7 may calculate at least one of the misalignment amounts ΔX1 and ΔY1 based on the second image IMG. If at least one of the misalignment amounts ΔX1 and ΔY1 is equal to or less than a predetermined first allowable upper limit (or equal to zero), the control unit 7 may terminate the nozzle-beam alignment operation. In this case, the first correction command value may be used as the final, determined correction command value. On the other hand, if at least one of the misalignment amounts ΔX1 and ΔY1 is not equal to or less than the predetermined first allowable upper limit (or equal to zero), the control unit 7 may calculate a second correction command value so that at least one of the misalignment amounts ΔX1 and ΔY1 is further reduced. Thereafter, the control unit 7 may repeat the same operation until at least one of the positional deviation amounts ΔX1 and ΔY1 becomes equal to or less than a predetermined first allowable upper limit value (or becomes zero).

[0250] As described above, the state in which the positional deviation amounts ΔX1 and ΔY1 are zero is the state in which the molten material M_melt is located at the center C of the opening 2124 in the image IMG. Here, the position in the image IMG where the center C of the opening 2124 appears is fixed unless the imaging device 8 moves relative to the material nozzle 212. In this case, the position in the image IMG where the center C of the opening 2124 appears may be registered in advance. Instead of calculating the position of the center C of the opening 2124 based on the image IMG, the control unit 7 may use a pre-registered position as the position in the image IMG where the center C of the opening 2124 appears. Thereafter, the control unit 7 may calculate the positional deviation amounts ΔX1 and ΔY1 based on the pre-registered position, and calculate a correction command value so that at least one of the positional deviation amounts ΔX1 and ΔY1 is equal to or less than a predetermined first allowable upper limit value (or becomes zero). Alternatively, in addition to or instead of calculating the positional deviation amounts ΔX1 and ΔY1 and calculating a correction command value so that at least one of the positional deviation amounts ΔX1 and ΔY1 is equal to or less than a predetermined first allowable upper limit value (or becomes zero), the control unit 7 may calculate a correction command value so that the molten material M_melt is positioned at a pre-registered position within the image IMG.

[0251] After the correction command value is calculated, the control unit 7 may use the correction command value to control at least one of the galvanometer mirrors 2146 and 2156. For example, during a period in which the machining system SYSa performs additional machining after the correction command value is calculated, the control unit 7 may use the correction command value to control at least one of the galvanometer mirrors 2146 and 2156.

[0252] As an example, the control unit 7 may generate a drive command value for controlling at least one of the galvanometer mirrors 2146 and 2156 to irradiate the processing light EL at a desired position. However, if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, even if at least one of the galvanometer mirrors 2146 and 2156 is controlled based on the generated drive command value, at least one of the galvanometer mirrors 2146 and 2156 may not be able to irradiate the processing light EL at the desired position. Therefore, the control unit 7 may correct the generated drive command value using a correction command value. As a result, even if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, if at least one of the galvanometer mirrors 2146 and 2156 is controlled based on a drive command value corrected using the correction command value, at least one of the galvanometer mirrors 2146 and 2156 can irradiate the processing light EL at the desired position.

[0253] As another example, instead of generating a drive command value and then correcting the drive command value using a correction command value, control unit 7 may generate a drive command value based on the correction command value, from which the influence of a control error or the like of at least one of galvanometer mirrors 2146 and 2156 is eliminated. As a result, even if a control error occurs in at least one of galvanometer mirrors 2146 and 2156, if at least one of galvanometer mirrors 2146 and 2156 is controlled based on a drive command value generated based on the correction command value so as to eliminate the influence of a control error or the like of at least one of galvanometer mirrors 2146 and 2156, at least one of galvanometer mirrors 2146 and 2156 can irradiate the processing light EL at a desired position.

[0254] Even after calculating the correction command value once in the first period, the control unit 7 may recalculate the correction command value in a second period after the first period if a predetermined nozzle-beam alignment condition is met. In other words, even after performing a nozzle-beam alignment operation once in the first period, the control unit 7 may perform the nozzle-beam alignment operation again in the second period if a predetermined nozzle-beam alignment condition is met. In this case, the control unit 7 can essentially calculate the correction command value after taking into account fluctuations in the position of the material nozzle 212 and fluctuations in the position of the molten material M_melt (i.e., fluctuations in the position of the processing light EL) between the first period and the second period. An example of a predetermined nozzle-beam alignment condition is a condition in which a predetermined time has elapsed since the last nozzle-beam alignment operation.

[0255] As described above, by performing the nozzle-beam alignment operation, the control unit 7 can control at least one of the galvanometer mirrors 2146 and 2156 so as to reduce (particularly eliminate) the positional misalignment between the material nozzle 212 and the processing light EL. Therefore, even if a positional misalignment between the material nozzle 212 and the processing light EL occurs due to a control error of at least one of the galvanometer mirrors 2146 and 2156, the processing system SYSa can appropriately irradiate the processing light EL at the desired position. As a result, the possibility of the molding accuracy of the processing system SYSa being degraded due to a positional misalignment between the material nozzle 212 and the processing light EL is reduced. In other words, the processing system SYSa can accurately mold the three-dimensional structure ST.

[0256] As an example, the modeling accuracy of the processing system SYSa when a structure layer SL having an annular shape in a plan view as shown in FIG. 18( a) is modeled will be described with reference to FIG. 18( b). FIG. 18( b) is a graph showing the height of the structure layer SL when the structure layer SL shown in FIG. 18( a) is modeled without performing a nozzle-beam alignment operation, and the height of the structure layer SL when the structure layer SL shown in FIG. 18( a) is modeled after performing a nozzle-beam alignment operation, for each angle in the circumferential direction of the structure layer SL. As shown in FIG. 18( b), the variation in the height of the structure layer SL modeled after performing the nozzle-beam alignment operation is smaller than the variation in the height of the structure layer SL modeled without performing the nozzle-beam alignment operation. Therefore, the modeling accuracy of the structure layer SL modeled after performing the nozzle-beam alignment operation is higher than the modeling accuracy of the structure layer SL modeled without performing the nozzle-beam alignment operation.

[0257] (1-4-2) Multi-beam alignment operation To perform the multi-beam alignment operation, the imaging device 8 captures an image of at least one of the printing surface MS and the material irradiation surface ES. That is, the imaging device 8 captures an image of at least one of the printing surface MS and the material irradiation surface ES by receiving imaging light CL from at least one of the printing surface MS and the material irradiation surface ES. In this case, typically, a portion of at least one of the printing surface MS and the material irradiation surface ES is captured, but the entirety of at least one of the printing surface MS and the material irradiation surface ES may also be captured.

[0258] The imaging device 8 may image the printing surface MS when the machining system SYSa performs the first printing operation. On the other hand, the imaging device 8 may image the material irradiation surface ES when the machining system SYSa performs the second printing operation. However, when the machining system SYSa performs the second printing operation, the imaging device 8 may image the printing surface MS in addition to or instead of the material irradiation surface ES. Note that, when the imaging device 8 images at least one of the printing surface MS and the material irradiation surface ES, the illumination device 213 may illuminate at least one of the printing surface MS and the material irradiation surface ES with illumination light IL, as in the case where the nozzle-beam alignment operation is performed.

[0259] The imaging device 8 images the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES during the period when the machining unit 2 is emitting both the processing lights EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES. In this case, the imaging device 8 may also image at least one of the printing surface MS and the material irradiation surface ES during the period when the machining unit 2 is emitting both the processing lights EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES in order to actually perform additional machining on the workpiece W. In this case, the imaging device 8 may also image at least one of the printing surface MS and the material irradiation surface ES during the period when the machining system SYSa is performing additional machining. Alternatively, the imaging device 8 may image at least one of the printing surface MS and the material irradiation surface ES during the period when the machining unit 2 is emitting both the processing lights EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES without actually performing additional machining on the workpiece W. In this case, the imaging device 8 may capture an image of at least one of the manufacturing surface MS and the material irradiation surface ES before the machining system SYSa starts or after the machining system SYSa finishes additional machining.

[0260] In addition, when the imaging device 8 images at least one of the manufacturing surface MS and the material irradiation surface ES before or after the machining system SYSa starts or finishes additional machining, a test workpiece used for the multi-beam alignment operation may be placed on the stage 31 instead of the workpiece W. In this case, the surface of the test workpiece may be used as the manufacturing surface MS.

[0261] When the processing unit 2 emits the processing lights EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES, the printing material M melts on at least one of the printing surface MS and the material irradiation surface ES, as described above. The imaging device 8 may capture an image of the printing material M melted on at least one of the printing surface MS and the material irradiation surface ES (i.e., the molten material M_melt). In other words, the imaging device 8 may capture an image of the molten material M_melt to perform the multi-beam alignment operation.

[0262] Here, when the multi-beam alignment operation is performed, the processing unit 2 emits each of the processing beams EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES. Therefore, on at least one of the printing surface MS and the material irradiation surface ES, a molten material M_melt melted by the processing beam EL#1 and a molten material M_melt melted by the processing beam EL#2 are present. In this case, the image capture device 8 captures the molten material M_melt melted by the processing beam EL#1 and the molten material M_melt melted by the processing beam EL#2. However, when the processing beams EL#1 and EL#2 are irradiated at the same position on at least one of the printing surface MS and the material irradiation surface ES, the molten material M_melt melted by the processing beam EL#1 and the molten material M_melt melted by the processing beam EL#2 are integrated. In the following description, when it is necessary to distinguish between the molten material M_melt melted by the processing light EL#1 and the molten material M_melt melted by the processing light EL#2, the molten material M_melt melted by the processing light EL#1 will be referred to as "molten material M_melt#1," and the molten material M_melt melted by the processing light EL#2 will be referred to as "molten material M_melt#2." On the other hand, when it is not necessary to distinguish between the molten material M_melt melted by the processing light EL#1 and the molten material M_melt melted by the processing light EL#2, "molten material M_melt" may mean at least one of the molten material M_melt melted by the processing light EL#1 and the molten material M_melt melted by the processing light EL#2.

[0263] Alternatively, when the machining unit 2 emits the processing light EL#1 and EL#2 toward the printing surface MS, a beam spot of the processing light EL#1 and a beam spot of the processing light EL#2 may be formed on the printing surface MS. For example, if a multi-beam alignment operation is performed before or after the machining system SYSa starts or finishes additional processing, the intensities of the processing light EL#1 and EL#2 emitted toward the printing surface MS may be weaker than the intensity required to melt the printing surface MS. In this case, instead of a molten pool MP, a beam spot of the processing light EL#1 and a beam spot of the processing light EL#2 may be formed on the printing surface MS. The imaging device 8 may capture the beam spot of the processing light EL#1 and the beam spot of the processing light EL#2 formed on the printing surface MS by imaging the printing surface MS. In other words, the imaging device 8 may capture the beam spot of the processing light EL#1 and the beam spot of the processing light EL#2 on the printing surface MS by imaging the printing surface MS.

[0264] In the following description, an example will be described in which the imaging device 8 images the molten materials M_melt#1 and M_melt#2 in order to perform the multi-beam alignment operation. However, the following description of the multi-beam alignment operation including the operation of imaging the molten materials M_melt#1 and M_melt#2 can be used as an explanation of the multi-beam alignment operation including the operation of imaging the beam spot of processing light EL#1 and the beam spot of processing light EL#2 by replacing "molten material M_melt#1" with "beam spot of processing light EL#1 (processing light EL#1)" and "molten material M_melt#2" with "beam spot of processing light EL#2 (processing light EL#2)."

[0265] The imaging device 8 captures images of the molten materials M_melt#1 and M_melt#2 to generate an image IMG in which the molten materials M_melt#1 and M_melt#2 are captured. An example of the image IMG in which the molten materials M_melt#1 and M_melt#2 are captured is shown in FIG. 19( a). As shown in FIG. 19( a), both the molten materials M_melt#1 and M_melt#2 (i.e., two molten materials M_melt) may be captured in the image IMG. However, when the processing beams EL#1 and EL#2 are irradiated at the same position on at least one of the build surface MS and the material irradiation surface ES, the molten materials M_melt#1 and M_melt#2 will be integrated as described above. In this case, as shown in FIG. 19(b), the integrated molten materials M_melt#1 and M_melt#2 (that is, a single molten material M_melt) may appear in the image IMG.

[0266] The control unit 7 aligns the processing light EL#1 and the processing light EL#2 based on the image IMG in which the molten materials M_melt#1 and M_melt#2 are captured. Specifically, as described above, since the molten material M_melt is generated by irradiating the processing light EL onto the forming material M, the position of the molten material M_melt is equivalent to the position at which the processing light EL is irradiated onto the forming material M. In other words, the position of the molten material M_melt is equivalent to the position of the processing light EL. Specifically, the position of the molten material M_melt#1 is equivalent to the position on the forming surface MS where the processing light EL#1 is irradiated or where the processing light EL#1 passes on the material-irradiated surface ES, which is equivalent to the forming surface MS. In other words, the position of the molten material M_melt#1 is equivalent to the position of the processing light EL#1 on the forming surface MS or the material-irradiated surface ES. Similarly, the position of the molten material M_melt#2 is equivalent to the position on the printing surface MS where the processing light EL#1 is irradiated or the position on the material irradiation surface ES, which is equivalent to the printing surface MS, where the processing light EL#2 passes through. In other words, the position of the molten material M_melt#2 is equivalent to the position of the processing light EL#2 on the printing surface MS or the material irradiation surface ES.

[0267] Therefore, the control unit 7 may determine the positional relationship between the molten material M_melt#1 and the molten material M_melt#2 in the image IMG based on the image IMG, thereby substantially determining the positional relationship between the processing light EL#1 and the processing light EL#2 in the processing system SYSa. To determine the positional relationship between the molten material M_melt#1 and the molten material M_melt#2 in the image IMG, the control unit 7 may detect the molten materials M_melt#1 and M_melt#2 in the image IMG. That is, the control unit 7 may detect the positions of the molten material M_melt#1 and the molten material M_melt#2. As a result, the control unit 7 can determine the positional relationship between the molten material M_melt#1 and the molten material M_melt#2 in the image IMG. Since the image IMG is used to detect the positions of the molten material M_melt#1 and the molten material M_melt#2, the imaging device 8 (imaging element 81) that generates the image IMG may be considered to be a detection device (detector) that can detect the positions of the molten material M_melt#1 and the molten material M_melt#2. Furthermore, since the positions of the molten material M_melt#1 and M_melt#2 are equivalent to the positions of the processing beams EL#1 and EL#2, respectively, the imaging device 8 (imaging element 81) may be considered to be a detection device (detector) that can detect the positions (irradiation positions) of the processing beams EL#1 and EL#2.

[0268] The positions of the molten materials M_melt#1 and M_melt#2 in the image IMG correspond to the positions where the imaging light CL from the molten materials M_melt#1 and M_melt#2 is incident on the imaging surface of the imaging device 8 that generates the image IMG. Therefore, specifying the positional relationship between the molten materials M_melt#1 and M_melt#2 based on the image IMG may be considered equivalent to specifying the positional relationship between the molten materials M_melt#1 and M_melt#2 based on the positions where the imaging light CL from the molten materials M_melt#1 and M_melt#2 is incident on the imaging surface of the imaging device 8. Furthermore, the positions on the imaging surface of the imaging device 8 at which the imaging light CL from the molten materials M_melt#1 and M_melt#2 is incident correspond to the positions of the molten materials M_melt#1 and M_melt#2 on the printing surface MS or the material irradiation surface ES (i.e., the positions of the processing light EL#1 and EL#2 on the printing surface MS or the material irradiation surface ES). In other words, the positions on the imaging surface of the imaging device 8 at which the imaging light CL from the molten materials M_melt#1 and M_melt#2 is incident correspond to the positions of the molten materials M_melt#1 and M_melt#2 on the printing surface MS or the material irradiation surface ES (i.e., the positions of the processing light EL#1 and EL#2 on the printing surface MS or the material irradiation surface ES). Therefore, determining the positional relationship between molten material M_melt#1 and molten material M_melt#2 based on image IMG may be considered equivalent to determining the positional relationship between molten material M_melt#1 and molten material M_melt#2 based on the relationship between the positions where imaging light CL from molten material M_melt#1 and M_melt#2 is incident on the imaging surface of imaging device 8 and the positions of molten material M_melt#1 and M_melt#2 on the printing surface MS or material irradiation surface ES (i.e., the positions of processing light EL#1 and EL#2 on the printing surface MS or material irradiation surface ES).

[0269] The control unit 7 then aligns the processing beams EL#1 and EL#2 based on the positional relationship between the molten materials M_melt#1 and M_melt#2 in the image IMG (i.e., the positional relationship between the processing beams EL#1 and EL#2). Note that aligning the processing beams EL#1 and EL#2 may include aligning a target irradiation area EA#1 on the printing surface MS onto which the processing beam EL#1 is irradiated with a target irradiation area EA#2 on the printing surface MS onto which the processing beam EL#2 is irradiated. Aligning the processing beams EL#1 and EL#2 may include aligning a beam passing area PA#1 on the material irradiation surface ES through which the processing beam EL#1 passes with a beam passing area PA#2 on the material irradiation surface ES through which the processing beam EL#2 passes.

[0270] In the first embodiment, the control unit 7 may align the processing light EL#1 and the processing light EL#2 in at least one of two directions that are along at least one of the printing surface MS and the material irradiation surface ES and are perpendicular to each other. For example, the control unit 7 may align the processing light EL#1 and the processing light EL#2 in the X-axis direction. For example, the control unit 7 may align the processing light EL#1 and the processing light EL#2 in the Y-axis direction in addition to or instead of aligning the processing light EL#1 and the processing light EL#2 in the X-axis direction.

[0271] To align the processing beams EL#1 and EL#2 in the X-axis direction, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the processing beams EL#1 and EL#2 each periodically reciprocate along the Y-axis direction while the imaging device 8 images at least one of the build surface MS and the material irradiation surface ES. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the processing beams EL#1 and EL#2 move apart by a predetermined X-offset amount along the X-axis direction and the X-offset amount changes while the imaging device 8 images at least one of the build surface MS and the material irradiation surface ES. In other words, the control unit 7 may generate drive command values ​​for controlling the galvanometer mirrors 2146 and 2156 so that the processing beams EL#1 and EL#2 each periodically reciprocate along the Y-axis direction and so that the processing beams EL#1 and EL#2 move apart by a predetermined X-offset amount along the X-axis direction and the X-offset amount changes.

[0272] As an example, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 periodically move back and forth along the Y-axis direction along the printing surface MS while the imaging device 8 is imaging the printing surface MS. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 move apart by a predetermined X-offset amount along the X-axis direction along the printing surface MS while the imaging device 8 is imaging the printing surface MS, and so that the X-offset amount changes.

[0273] As another example, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the beam passage area PA#1 of the processing light EL#1 and the beam passage area PA#2 of the processing light EL#2 periodically move back and forth along the Y-axis direction along the material irradiation surface ES during the period when the imaging device 8 images the material irradiation surface ES. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the beam passage area PA#1 of the processing light EL#1 and the beam passage area PA#2 of the processing light EL#2 move apart by a predetermined X-offset amount along the X-axis direction along the material irradiation surface ES during the period when the imaging device 8 images the material irradiation surface ES, and so that the X-offset amount changes.

[0274] Then, the imaging device 8 captures an image of at least one of the build surface MS and the material irradiation surface ES. In this case, while the control unit 7 is changing the X-offset amount, the imaging device 8 captures an image of at least one of the build surface MS and the material irradiation surface ES multiple times in succession. As a result, as shown in FIG. 20( a), which shows an example of an image IMG generated by the imaging device 8, the imaging device 8 generates multiple images IMG in which the molten materials M_melt#1 and M_melt#2 are separated (or integrated in some cases) along the X-axis direction. In this case, the control unit 7 selects, from the multiple images IMG, an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap (in other words, are integrated) along the X-axis direction. In other words, the control unit 7 detects the overlap of the molten materials M_melt#1 and M_melt#2 along the X-axis direction based on the multiple images IMG.

[0275] As described above, the position of the molten material M_melt is equivalent to the position of the processing light EL. Therefore, detecting the overlap of the molten materials M_melt#1 and M_melt#2 along the X-axis direction in the image IMG may be considered equivalent to detecting the overlap of the processing light EL#1 and EL#2 along the X-axis direction on the printing surface MS or the material irradiation surface ES. Furthermore, the position of the molten material M_melt in the image IMG corresponds to the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8 that generates the image IMG. Therefore, detecting the overlap of the molten materials M_melt#1 and M_melt#2 along the X-axis direction in the image IMG may be considered equivalent to detecting the overlap of the incident positions of the processing light EL#1 and the processing light EL#2 along the X-axis direction on the imaging surface of the imaging device 8.

[0276] When the molten materials M_melt#1 and M_melt#2 overlap along the X-axis direction as shown in Fig. 20(c), the brightness of the molten materials M_melt#1 and M_melt#2 is higher than when the molten materials M_melt#1 and M_melt#2 are separated along the X-axis direction as shown in Fig. 20(b). For this reason, the control unit 7 may extract the image IMG in which the molten materials M_melt#1 and M_melt#2 have the highest brightness as the image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the X-axis direction (in other words, are integrated).

[0277] As described above, the galvanometer mirrors 2146 and 2156 are controlled so that the processing beams EL#1 and EL#2 are spaced apart by a predetermined X offset amount along the X-axis direction. Even in this case, the processing beams EL#1 and EL#2 may not actually be spaced apart by the predetermined X offset amount along the X-axis direction. For example, even if the galvanometer mirrors 2146 and 2156 are controlled so that the processing beams EL#1 and EL#2 are spaced apart by the predetermined X offset amount along the X-axis direction, due to a control error in at least one of the galvanometer mirrors 2146 and 2156, the processing beams EL#1 and EL#2 may not actually be spaced apart by the predetermined X offset amount along the X-axis direction. For example, even if the galvanometer mirrors 2146 and 2156 are controlled so that the processing lights EL#1 and EL#2 are spaced apart by a predetermined X offset amount along the X-axis direction, it is possible that the processing lights EL#1 and EL#2 are not actually spaced apart by the predetermined X offset amount along the X-axis direction due to a positional misalignment of at least one of the galvanometer mirrors 2146 and 2156 (e.g., a positional misalignment from the designed or ideal position).

[0278] Therefore, the control unit 7 may set the X offset amount used when the molten materials M_melt#1 and M_melt#2 overlap as the X reference offset amount, which is a reference value of the X offset amount. In this case, the X reference offset amount is the X offset amount at which the irradiation positions of the processing light EL#1 and the processing light EL#2 actually coincide with each other in the X axis direction. In other words, the X reference offset amount is the X offset amount at which the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 actually coincide with each other along the X axis direction on the printing surface MS and / or the beam passage area PA#1 of the processing light EL#1 and the beam passage area PA#2 of the processing light EL#2 actually coincide with each other along the X axis direction on the material irradiation surface ES.

[0279] After the X-reference offset amount is set, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 based on the X-reference offset amount. For example, during a period in which the machining system SYSa performs additional machining after the X-reference offset amount is calculated, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 based on the X-reference offset amount. For example, when the target irradiation area EA#1 of the machining light EL#1 and the target irradiation area EA#2 of the machining light EL#2 are to be separated by a desired X distance along the X-axis direction on the manufacturing surface MS, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 using the X-offset amount obtained by adding or subtracting the X distance to or from the X-reference offset amount. As a result, even if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 are actually spaced apart by the desired X distance along the X-axis direction on the manufacturing surface MS. For example, to space the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 by the desired X distance along the X-axis direction on the material irradiation surface ES, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 using an X offset amount obtained by adding or subtracting the X distance from the X reference offset amount. As a result, even if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 are actually spaced apart by the desired X distance along the X-axis direction on the material irradiation surface ES.

[0280] In addition, since a drive command value that controls the galvanometer mirrors 2146 and 2156 is generated based on the X reference offset amount so that the processing light EL#1 and the processing light EL#2 are separated by a predetermined X distance (X offset amount), the X reference offset amount may be considered to be a reference value for the drive command value (especially the drive command value that specifies the X offset amount).

[0281] Alternatively, in addition to selecting the image IMG in which the molten materials M_melt#1 and M_melt#2 have the highest brightness, the control unit 7 may select an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the X-axis direction based on the respective positions of the molten materials M_melt#1 and M_melt#2 in each image IMG. Specifically, the control unit 7 may calculate the respective positions (particularly, the positions in the X-axis direction) of the molten materials M_melt#1 and M_melt#2 in each image IMG based on each image IMG. Thereafter, the control unit 7 may extract, as the image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the X-axis direction, the image IMG in which the calculated position of the molten material M_melt#1 in the X-axis direction and the calculated position of the molten material M_melt#2 in the X-axis direction match.

[0282] Note that, when an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the Y-axis direction is selected based on the respective positions of the molten materials M_melt#1 and M_melt#2 within each image IMG, it is not necessary for both the molten materials M_melt#1 and M_melt#2 to appear in a single image IMG. For example, in a situation where the Y-offset amount is set to a predetermined amount, the machining unit 2 may emit either one of the processing beams EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES, and then emit the other of the processing beams EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES. In a situation where the Y-offset amount is set to a predetermined amount, the imaging device 8 may image at least one of the printing surface MS and the material-irradiated surface ES onto which one of the processing lights EL#1 and EL#2 is emitted, and then image at least one of the printing surface MS and the material-irradiated surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted. Thereafter, the control unit 7 may calculate the position of either one of the molten materials M_melt#1 and M_melt#2 in the Y-axis direction based on the image IMG generated by imaging at least one of the printing surface MS and the material-irradiated surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted, and may calculate the position of the other of the molten materials M_melt#1 and M_melt#2 in the Y-axis direction based on the image IMG generated by imaging at least one of the printing surface MS and the material-irradiated surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted. Then, the control unit 7 may extract an image IMG in which the calculated result of the position of the molten material M_melt #1 in the Y-axis direction matches the calculated result of the position of the molten material M_melt #2 in the Y-axis direction, as an image IMG in which the molten materials M_melt #1 and M_melt #2 overlap along the Y-axis direction.

[0283] To align the processing beams EL#1 and EL#2 in the Y-axis direction, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the processing beams EL#1 and EL#2 each periodically reciprocate along the X-axis direction while the imaging device 8 images at least one of the build surface MS and the material irradiation surface ES. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the processing beams EL#1 and EL#2 move apart by a predetermined Y-offset amount along the Y-axis direction and the Y-offset amount changes while the imaging device 8 images at least one of the build surface MS and the material irradiation surface ES. In other words, the control unit 7 may generate drive command values ​​for controlling the galvanometer mirrors 2146 and 2156 so that the processing beams EL#1 and EL#2 each periodically reciprocate along the X-axis direction and so that the processing beams EL#1 and EL#2 move apart by a predetermined Y-offset amount along the Y-axis direction and the Y-offset amount changes.

[0284] As an example, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 periodically move back and forth along the X-axis direction along the printing surface MS while the imaging device 8 is imaging the printing surface MS. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 move apart by a predetermined Y-offset amount along the Y-axis direction along the printing surface MS while the imaging device 8 is imaging the printing surface MS, and the Y-offset amount changes.

[0285] As another example, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the beam passage area PA#1 of the processing light EL#1 and the beam passage area PA#2 of the processing light EL#2 periodically move back and forth along the X-axis direction along the material irradiation surface ES during the period when the imaging device 8 images the material irradiation surface ES. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the beam passage area PA#1 of the processing light EL#1 and the beam passage area PA#2 of the processing light EL#2 move apart by a predetermined Y-offset amount along the Y-axis direction along the material irradiation surface ES during the period when the imaging device 8 images the material irradiation surface ES, and the Y-offset amount changes.

[0286] Then, the imaging device 8 captures an image of at least one of the build surface MS and the material irradiation surface ES. In this case, while the control unit 7 is changing the Y offset amount, the imaging device 8 captures an image of at least one of the build surface MS and the material irradiation surface ES multiple times. As a result, as shown in FIG. 21( a), which shows an example of an image IMG generated by the imaging device 8, the imaging device 8 generates multiple images IMG in which the molten materials M_melt#1 and M_melt#2 are separated (or integrated in some cases) along the Y-axis direction. In this case, the control unit 7 selects, from the multiple images IMG, an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap (in other words, are integrated) along the Y-axis direction. In other words, the control unit 7 detects the overlap of the molten materials M_melt#1 and M_melt#2 along the Y-axis direction based on the multiple images IMG.

[0287] As described above, the position of the molten material M_melt is equivalent to the position of the processing light EL. Therefore, detecting the overlap of the molten materials M_melt#1 and M_melt#2 along the Y-axis direction in the image IMG may be considered equivalent to detecting the overlap of the processing light EL#1 and EL#2 along the Y-axis direction on the printing surface MS or the material irradiation surface ES. Furthermore, the position of the molten material M_melt in the image IMG corresponds to the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8 that generates the image IMG. Therefore, detecting the overlap of the molten materials M_melt#1 and M_melt#2 along the Y-axis direction in the image IMG may be considered equivalent to detecting the overlap of the incident positions of the processing light EL#1 and the processing light EL#2 along the Y-axis direction on the imaging surface of the imaging device 8.

[0288] When the molten materials M_melt#1 and M_melt#2 overlap along the Y-axis direction as shown in Fig. 21(c), the brightness of the molten materials M_melt#1 and M_melt#2 is higher than when the molten materials M_melt#1 and M_melt#2 are separated along the Y-axis direction as shown in Fig. 21(b). For this reason, the control unit 7 may extract the image IMG in which the molten materials M_melt#1 and M_melt#2 have the highest brightness as the image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the Y-axis direction (in other words, are integrated).

[0289] As described above, the galvanometer mirrors 2146 and 2156 are controlled so that the processing beams EL#1 and EL#2 are spaced apart by a predetermined Y offset amount along the Y-axis direction. Even in this case, the processing beams EL#1 and EL#2 may not actually be spaced apart by the predetermined Y offset amount along the Y-axis direction. For example, even if the galvanometer mirrors 2146 and 2156 are controlled so that the processing beams EL#1 and EL#2 are spaced apart by the predetermined Y offset amount along the Y-axis direction, due to a control error of at least one of the galvanometer mirrors 2146 and 2156, the processing beams EL#1 and EL#2 may not actually be spaced apart by the predetermined Y offset amount along the Y-axis direction. For example, even if the galvanometer mirrors 2146 and 2156 are controlled so that the processing lights EL#1 and EL#2 are spaced apart by a predetermined Y offset amount along the Y-axis direction, it is possible that the processing lights EL#1 and EL#2 are not actually spaced apart by the predetermined Y offset amount along the Y-axis direction due to a positional misalignment of at least one of the galvanometer mirrors 2146 and 2156 (e.g., a positional misalignment from the designed or ideal position).

[0290] Therefore, the control unit 7 may set the Y-offset amount used when the molten materials M_melt#1 and M_melt#2 overlap as the Y-reference offset amount, which is a reference value of the Y-offset amount. In this case, the Y-reference offset amount is the Y-offset amount at which the irradiation positions of the processing light EL#1 and the processing light EL#2 actually coincide with each other in the Y-axis direction. In other words, the Y-reference offset amount is the Y-offset amount at which the target irradiation areas EA#1 of the processing light EL#1 and the target irradiation areas EA#2 of the processing light EL#2 actually coincide with each other along the Y-axis direction on the printing surface MS and / or the beam passage areas PA#1 of the processing light EL#1 and the beam passage areas PA#2 of the processing light EL#2 actually coincide with each other along the Y-axis direction on the material irradiation surface ES.

[0291] After the Y-reference offset amount is set, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 based on the Y-reference offset amount. For example, during a period in which the machining system SYSa performs additional machining after the Y-reference offset amount is calculated, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 based on the Y-reference offset amount. For example, when separating the target irradiation area EA#1 of the machining light EL#1 and the target irradiation area EA#2 of the machining light EL#2 by a desired Y distance along the Y-axis direction on the manufacturing surface MS, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 using a Y-offset amount obtained by adding or subtracting the Y distance to or from the Y-reference offset amount. As a result, even if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 are actually spaced apart by the desired Y distance along the Y-axis direction on the manufacturing surface MS. For example, to space the beam passage area PA#1 of the processing light EL#1 and the beam passage area PA#2 of the processing light EL#2 by the desired Y distance along the Y-axis direction on the material irradiation surface ES, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 using a Y offset amount obtained by adding or subtracting the Y distance from the Y reference offset amount. As a result, even if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, the beam passage area PA#1 of the processing light EL#1 and the beam passage area PA#2 of the processing light EL#2 are actually spaced apart by the desired Y distance along the Y-axis direction on the material irradiation surface ES.

[0292] Furthermore, since a drive command value that controls the galvanometer mirrors 2146 and 2156 is generated based on the Y reference offset amount so that the processing light EL#1 and the processing light EL#2 are separated by a predetermined Y distance (Y offset amount), the Y reference offset amount can be considered to be a reference value for the drive command value (particularly, the drive command value that specifies the Y offset amount).

[0293] Alternatively, in addition to selecting the image IMG in which the molten materials M_melt#1 and M_melt#2 have the highest brightness, the control unit 7 may select an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the Y-axis direction based on the respective positions of the molten materials M_melt#1 and M_melt#2 in each image IMG. Specifically, the control unit 7 may calculate the respective positions (particularly, the positions in the Y-axis direction) of the molten materials M_melt#1 and M_melt#2 in each image IMG based on each image IMG. Thereafter, the control unit 7 may extract, as the image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the Y-axis direction, the image IMG in which the calculated position of the molten material M_melt#1 in the Y-axis direction and the calculated position of the molten material M_melt#2 in the Y-axis direction match.

[0294] Note that, when an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the Y-axis direction is selected based on the respective positions of the molten materials M_melt#1 and M_melt#2 within each image IMG, it is not necessary for both the molten materials M_melt#1 and M_melt#2 to appear in a single image IMG. For example, in a situation where the Y-offset amount is set to a predetermined amount, the machining unit 2 may emit either one of the processing beams EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES, and then emit the other of the processing beams EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES. In a situation where the Y-offset amount is set to a predetermined amount, the imaging device 8 may image at least one of the printing surface MS and the material-irradiated surface ES onto which one of the processing lights EL#1 and EL#2 is emitted, and then image at least one of the printing surface MS and the material-irradiated surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted. Thereafter, the control unit 7 may calculate the position of either one of the molten materials M_melt#1 and M_melt#2 in the X-axis direction based on the image IMG generated by imaging at least one of the printing surface MS and the material-irradiated surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted, and may calculate the position of the other of the molten materials M_melt#1 and M_melt#2 in the X-axis direction based on the image IMG generated by imaging at least one of the printing surface MS and the material-irradiated surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted. Then, the control unit 7 may extract an image IMG in which the calculated result of the position of the molten material M_melt #1 in the Y-axis direction matches the calculated result of the position of the molten material M_melt #2 in the Y-axis direction, as an image IMG in which the molten materials M_melt #1 and M_melt #2 overlap along the Y-axis direction.

[0295] As described above, by performing a multi-beam alignment operation, the control unit 7 can control at least one of the galvanometer mirrors 2146 and 2156 so that the positional relationship between the processing light EL#1 and the processing light EL#2 is a desired one, even if a positional deviation occurs between the processing light EL#1 and the processing light EL#2 due to a control error of at least one of the galvanometer mirrors 2146 and 2156. For example, by performing a multi-beam alignment operation, the control unit 7 can control at least one of the galvanometer mirrors 2146 and 2156 so that the positional relationship between the processing light EL#1 and the processing light EL#2 is a desired one in at least one of the X-axis direction and the Y-axis direction. Therefore, the processing system SYSa can appropriately irradiate each of the processing light EL#1 and the processing light EL#2 at the desired position. As a result, the processing system SYSa can accurately form the three-dimensional structure ST.

[0296] The control unit 7 may perform the above-described multi-beam alignment operation on each of multiple partial regions WP obtained by virtually dividing the build surface MS and the material irradiation surface ES. For example, an example of multiple partial regions WP is shown in FIG. 22 . FIG. 22 illustrates an example in which the multiple partial regions WP are arranged regularly (e.g., in a matrix). However, the multiple partial regions WP may be arranged in any arrangement pattern. When the multi-beam alignment operation is performed on each of the multiple partial regions WP in this manner, the control unit 7 may calculate multiple X-reference offset amounts and / or multiple Y-reference offset amounts corresponding to the multiple partial regions WP. In this case, when additional processing is performed by emitting processing light EL toward one partial region WP, the control unit 7 may control the galvanometer mirrors 2146 and 2156 using one X-reference offset amount and / or one Y-reference offset amount corresponding to one partial region WP.

[0297] As described above, because the machining unit areas PUA#1 and PUA#2 coincide (i.e., overlap) on the printing surface MS, the control unit 7 may perform the multi-beam alignment operation on each of the plurality of partial areas WP set in the area where the machining unit areas PUA#1 and PUA#2 coincide (i.e., overlap). In other words, the control unit 7 may perform the multi-beam alignment operation on each of the plurality of partial areas WP set in the area where the machining unit area PUA#1, which is the movement range of the machining light EL#1, and the machining unit area PUA#2, which is the movement range of the machining light EL#2, coincide (i.e., overlap).

[0298] Similarly, as described above, because the irradiation unit areas MUA#1 and MUA#2 coincide (i.e., overlap) on the material irradiation surface ES, the control unit 7 may perform the multi-beam alignment operation on each of the plurality of partial areas WP set in the area where the irradiation unit areas MUA#1 and MUA#2 coincide (i.e., overlap). That is, the control unit 7 may perform the multi-beam alignment operation on each of the plurality of partial areas WP set in the area where the irradiation unit area MUA#1, which is the movement range of the processing light EL#1, and the irradiation unit area MUA#2, which is the movement range of the processing light EL#2, coincide (i.e., overlap).

[0299] In the above description, to align the processing light EL#1 and the processing light EL#2 in at least one of the X-axis direction and the Y-axis direction, the control unit 7 controls the galvanometer mirrors 2146 and 2156 so that the target irradiation areas EA#1 and EA#2 (or the beam passing areas PA#1 and PA#2) periodically reciprocate along at least one of the X-axis direction and the Y-axis direction. However, the control unit 7 does not have to control the galvanometer mirrors 2146 and 2156 so that the target irradiation areas EA#1 and EA#2 (or the beam passing areas PA#1 and PA#2) periodically reciprocate along at least one of the X-axis direction and the Y-axis direction. For example, in a situation where the X offset amount is set to a first predetermined amount and / or the Y offset amount is set to a second predetermined amount, the processing unit 2 may emit the processing light EL#1 and EL#2 toward at least one of the build surface MS and the material irradiation surface ES. The imaging device 8 may capture an image of at least one of the building surface MS and the material irradiation surface ES onto which the processing beams EL#1 and EL#2 are emitted, in a situation where the X offset amount is set to a first predetermined amount and / or the Y offset amount is set to a second predetermined amount. As a result, the imaging device 8 generates an image IMG in which the molten materials M_melt#1 and M_melt#2 are captured. The control unit 7 may then calculate the positions of the molten materials M_melt#1 and M_melt#2 (e.g., positions in at least one of the X-axis direction and the Y-axis direction) based on the image IMG generated by the imaging device 8. The control unit 7 may then calculate at least one of a positional shift amount ΔX2 of the molten materials M_melt#1 and M_melt#2 in the X-axis direction and a positional shift amount ΔY2 of the molten materials M_melt#1 and M_melt#2 in the Y-axis direction, as shown in FIG. 23 , based on the calculation results of the positions of the molten materials M_melt#1 and M_melt#2. Thereafter, the control unit 7 may adjust at least one of the X offset amount and the Y offset amount so that at least one of the positional deviation amounts ΔX2 and ΔY2 becomes small (typically, becomes zero).As a result, at least one of the X offset amount and the Y offset amount that can realize a state in which at least one of the positional deviation amounts ΔX2 and ΔY2 is minimized (typically, becomes zero) may be used as at least one of the X reference offset amount and the Y reference offset amount.

[0300] (1-5) Modified Examples of the Machining System SYSa Next, modified examples of the machining system SYSa in the first embodiment will be described.

[0301] (1-5-1) First Modification In the above description, in order to perform the nozzle-beam alignment operation, the imaging device 8 images the material nozzle 212. However, in order to perform the nozzle-beam alignment operation, in addition to or instead of imaging the material nozzle 212, the imaging device 8 may also image a fixed position portion whose relative position with respect to the material nozzle 212 is fixed. In other words, the imaging device 8 may image a fixed position portion whose positional relationship with the material nozzle 212 is fixed.

[0302] The positional relationship between the material nozzle 212 and the fixed positional portion may be fixed during a period when the processing system SYSa performs additional processing. The positional relationship between the material nozzle 212 and the fixed positional portion may be fixed during a period when the processing system SYSa does not perform additional processing. In other words, the positional relationship between the material nozzle 212 and the fixed positional portion may be the same during a period when the processing system SYSa performs additional processing and a period when the processing system SYSa does not perform additional processing. In other words, the positional relationship between the material nozzle 212 and the fixed positional portion during a period when the processing system SYSa performs additional processing may be the same as the positional relationship between the material nozzle 212 and the fixed positional portion during a period when the processing system SYSa does not perform additional processing.

[0303] Because the positional relationship between the material nozzle 212 and the positional fixing portion is fixed, when the processing head 21 is moved by the head drive system 22 (i.e., the material nozzle 212 is moved), the positional fixing portion also moves together with the material nozzle 212 (i.e., moves together with the processing head 21). In this case, for example, the positional fixing portion may be attached to the processing head 21. For example, the positional fixing portion may be formed on the processing head 21. The positional fixing portion may be a part of the processing head 21. For example, the positional fixing portion may be attached to the irradiation device 210. For example, the positional fixing portion may be formed on the irradiation device 210. The positional fixing portion may be a part of the irradiation device 210. For example, the positional fixing portion may be attached to the irradiation optical system 211. For example, the positional fixing portion may be formed on the irradiation optical system 211. The positional fixing portion may be a part of the irradiation optical system 211. For example, the positional fixing portion may be attached to an optical member included in the irradiation optical system 211. For example, the position fixing portion may be formed on an optical member included in the irradiation optical system 211. The position fixing portion may be a part of the irradiation optical system 211.

[0304] An example of a positionally fixed portion is an index IDX that can be imaged by the imaging device 8. The index IDX may be an index having a predetermined pa...

Claims

1. A processing system comprising: a material supply member which supplies modeling material from a supply port; and an irradiation device which emits an energy beam, and which performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supply member with the energy beam emitted from the irradiation device; an imaging device which images an area having a fixed positional relationship with the material supply member and the energy beam emitted from the irradiation device or the light generated by the energy beam; and a control device which controls the processing device based on the imaging results of the imaging device.

2. The processing system according to claim 1, wherein an image of the portion having a fixed positional relationship with the material supply member and an image of the energy beam or an image of the light generated by the energy beam are formed on the imaging surface of the imaging device.

3. The processing system according to claim 1 or 2, wherein the portion having a fixed positional relationship with the material supplying member is a part of the material supplying member.

4. A processing system as described in any one of claims 1 to 3, wherein the material supply member supplies the modeling material in a first direction from a first portion of the supply port, and supplies the modeling material in a second direction different from the first direction from a second portion of the supply port different from the first portion, and the imaging device images the energy beam or the light generated by the energy beam from between the first and second portions.

5. The processing system according to claim 4, wherein the supply port of the material supply member is annular, and the imaging device has an imaging optical path inside the annular supply port.

6. The processing system according to any one of claims 1 to 5, further comprising: a processing device that controls the processing device based on the imaging result.

7. The processing system according to claim 6, wherein the irradiation device includes a deflection scanning optical system capable of deflecting and scanning the energy beam, and the control device controls the deflection optical system based on the imaging result.

8. The processing system according to claim 7, wherein the control device generates a drive command value for the deflection scanning optical system based on the imaging result.

9. A processing system according to any one of claims 6 to 8, wherein the control device controls the processing device based on the incident position of the energy beam incident on the imaging surface of the imaging device or the light generated by the energy beam.

10. The processing system according to claim 9, wherein the control device controls the processing device based on the relationship between the irradiation position of the energy beam on a printing surface on which the object is to be printed or a surface equivalent to the printing surface, and the incidence position on the imaging surface.

11. A processing system as described in any one of claims 1 to 9, wherein the portion having a fixed positional relationship with the material supply member includes an index portion provided on an optical member arranged in the optical path of the energy beam from the irradiation device.

12. A processing system according to any one of claims 1 to 10, wherein the positional relationship between the part and the supply port of the material supply member is fixed during a period in which the additional processing is performed and a period in which the additional processing is not performed.

13. The processing system according to any one of claims 1 to 12, wherein the imaging device captures an image using light passing through at least a part of the optical system of the irradiation device through which the energy beam passes.

14. A processing system according to any one of claims 1 to 13, wherein the imaging device images the molten pool formed by the energy beam during a period during which the processing device is performing the additional processing.

15. A processing system comprising: a material supply member which supplies modeling material from a supply port; and an irradiation device which emits an energy beam, and which performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supply member with the energy beam emitted from the irradiation device; and an imaging device which captures, on an imaging surface, the part whose positional relationship with the material supply member is fixed, and at least one of an image of the energy beam emitted from the irradiation device and an image of the light generated by the energy beam.

16. A processing method comprising: performing additional processing to form a structure on an object by melting modeling material supplied from a supply port of a material supply member with an energy beam; capturing images of a portion having a fixed positional relationship with the material supply member and the energy beam or light generated by the energy beam; and controlling the additional processing based on the imaging results.

17. A processing method comprising: performing additional processing to form a structure on an object by melting modeling material supplied from a supply port of a material supply member with an energy beam; detecting a positional relationship between a portion having a fixed positional relationship with the material supply member and the energy beam or light generated by the energy beam; and adjusting the positional relationship using the detection result.

18. A processing system comprising: a material supply member which supplies modeling material from a supply port; and an irradiation device which emits an energy beam, and which performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supply member with the energy beam emitted from the irradiation device; a detection device which detects the position of a part whose positional relationship with the material supply member is fixed and the position of the energy beam emitted from the irradiation device or the light generated by the energy beam; and a control device which controls the processing device based on the detection results of the detection device.

19. The processing system according to claim 18, wherein the control device controls the processing device based on a detection result of the position of the part during a first period and a detection result of the position of the part during a second period that is later than the first period.

20. The processing system described in claim 18 or 19, wherein the control device controls the processing device based on a detection result of the position of the light in a third period and a detection result of the position of the light in a fourth period after the third period.

21. The processing system according to any one of claims 18 to 20, wherein the irradiation device includes a deflection scanning optical system capable of deflecting and scanning the energy beam, and the control device controls the deflection optical system based on the detection result of the detection device.

22. The processing system according to claim 21, wherein the control device generates a drive command value for the deflection scanning optical system based on the detection result of the position of the part.

23. A processing system as described in any one of claims 18 to 22, wherein the detection device has a detection surface that detects the energy beam emitted from the irradiation device or the light generated by the energy beam, and the control device controls the processing device based on the incident position of the energy beam emitted from the irradiation device and incident on the detection surface, or the light generated by the energy beam and incident on the detection surface.

24. The processing system according to claim 23, wherein the control device controls the processing device based on the relationship between the irradiation position of the energy beam on a printing surface, which is the surface on which the object is to be printed, or a surface equivalent to the printing surface, and the incidence position on the detection surface.

25. A processing system according to any one of claims 18 to 24, wherein the portion whose positional relationship with the material supplying member is fixed is a part of the material supplying member.

26. A processing system as described in any one of claims 18 to 25, wherein the material supply member supplies the modeling material in a first direction from a first portion of the supply port, and supplies the modeling material in a second direction different from the first direction from a second portion of the supply port different from the first portion, and the detection device detects the energy beam or the light generated by the energy beam from between the first and second portions.

27. A modeling method comprising: supplying a modeling material from a supply port of a material supply member; melting the modeling material supplied from the supply port with an energy beam to additively model a model on an object; detecting a position of a portion whose positional relationship with the material supply member is fixed during a first period; detecting the position of the portion whose positional relationship is fixed during a second period after the first period; detecting the position of the energy beam during the first period; and detecting the position of the energy beam during the second period.

28. The method for manufacturing as described in claim 27, wherein the additive manufacturing step includes additive manufacturing while changing the irradiation position of the energy beam on the object based on the position detection results of the part in the first and second time periods and the position detection results of the energy beam in the first and second time periods.

29. The method for modeling according to claim 27 or 28, wherein the additive modeling includes additive modeling while changing the irradiation position of the energy beam on the object based on the detection result of the position of the light in a third period and the detection result of the position of the light in a fourth period after the third period.

30. A modeling method according to any one of claims 27 to 29, wherein the detecting includes detecting the energy beam incident on a detection surface of a detection device or light generated by the energy beam and incident on the detection surface, and the additive modeling includes additive modeling while changing the irradiation position of the energy beam on the object based on the incident position of the energy beam incident on the detection surface or the incident position of the light generated by the energy beam and incident on the detection surface.

31. The method for manufacturing according to claim 30, wherein the additive manufacturing step includes additive manufacturing while changing the irradiation position of the energy beam with respect to the object based on the relationship between the irradiation position of the energy beam on a printing surface, which is the surface on which the object is to be manufactured, or a surface equivalent to the printing surface, and the incident position on the detection surface.

32. A processing system comprising: an irradiation device which emits first and second energy beams, and which processes a workpiece using the first and second energy beams emitted from the irradiation device; a detection device which includes a beam splitter which splits a portion of the first and second energy beams, and which detects an irradiation position in a first plane intersecting a traveling direction of the first energy beam via the beam splitter and an irradiation position in a second plane intersecting a traveling direction of the second energy beam via the beam splitter; and a control device which controls the processing device based on a detection result of the detection device, wherein the irradiation device includes a first scanning optical system which scans the first energy beam so that the irradiation position of the first energy beam moves within the first plane, and a second scanning optical system which scans the second energy beam so that the irradiation position of the second energy beam moves within the second plane, and the detection surface of the detection device is provided at a position where a scanning range of the first energy beam by the first scanning optical system and a scanning range of the second energy beam by the second scanning optical system do not overlap.

33. The processing system according to claim 32, wherein the control device controls the processing device based on detection results of the irradiation positions of the first and second energy beams on a third plane intersecting the traveling direction of the first and second energy beams toward the object side via the beam splitter and detection results from the detection device.

34. The processing system according to claim 32 or 33, wherein the control device controls the processing device based on the incident positions of the first and second energy beams emitted from the irradiation device and incident on the detection surface.

35. The processing system according to claim 34, wherein the control device controls the processing device based on the relationship between the irradiation positions of the first and second energy beams on the processed surface of the object or a surface equivalent to the processed surface, and the incidence positions on the detection surface.

36. The processing system according to any one of claims 32 to 35, wherein the detection device detects the irradiation position during at least a portion of a period during which the workpiece is processed using the first and second energy beams from the processing device.

37. The processing system according to claim 36, wherein the control device determines irradiation positions of the first and second energy beams by the first and second scanning optical systems based on the detection results during at least a portion of the period.

38. A processing method comprising: processing an object using first and second energy beams emitted from an irradiation device; dividing a portion of the first and second energy beams; detecting with a detection device an irradiation position within a first plane intersecting the traveling direction of the first energy beam divided by the dividing; and detecting an irradiation position within a second plane intersecting the traveling direction of the second energy beam divided by the dividing; wherein the processing comprises scanning the first energy beam so that the irradiation position of the first energy beam moves within the first plane, and scanning the second energy beam so that the irradiation position of the second energy beam moves within the second plane, and the detection surface of the detection device is provided at a position where a scanning range of the first energy beam by scanning the first energy beam and a scanning range of the second energy beam by scanning the second energy beam do not overlap.

39. A processing system comprising: a material supply member which supplies a modeling material from a supply port; and an irradiation device which emits an energy beam, and which performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supply member with the energy beam emitted from the irradiation device; and a detection device which detects light returned toward the irradiation device after being emitted from the irradiation device, or light generated by the energy beam from the irradiation device and returned toward the irradiation device, and light from the irradiation device which passes through at least a part of the material supply member.

40. The processing system of claim 39, wherein the irradiation device emits an energy beam for melting the build material and light for detection by the detection device.

41. The processing system according to claim 39 or 40, further comprising a control device that controls the processing device based on the detection result of the detection device.

42. A processing method comprising: performing additional processing to form a structure on an object by melting a modeling material ejected from a supply port of a material supply member with an energy beam emitted from an irradiation device; and detecting light returned toward the irradiation device after being emitted from the irradiation device or light generated by the energy beam from the irradiation device, and light from the irradiation device that passes through at least a part of the material supply member.

43. A processing system comprising: an irradiation device which emits first and second energy beams, and which processes a workpiece using the first and second energy beams emitted from the irradiation device; a light receiving device which receives light passing through an object onto which the first and second energy beams emitted from the irradiation device are incident; and a control device which controls the processing device based on a light receiving result of the light receiving device, wherein the irradiation device includes a first scanning optical system which scans the first energy beam so that the irradiation position of the first energy beam moves on the object, and a second scanning optical system which scans the second energy beam so that the irradiation position of the second energy beam moves within the object, and the control device performs drive control of the first scanning optical system and drive control of the second scanning optical system based on drive command values ​​to the first and second deflection scanning optical systems when the first and second energy beams overlap on the object.

44. The processing system of claim 43, further comprising a beam splitter disposed between said first and second scanning optical systems and said object, for directing said first and second energy beams from said first and second scanning optical systems to said object and for directing said light through said object to said light receiving device.

45. The processing system according to claim 43 or 44, wherein the light receiving device includes a detector for detecting the irradiation positions of the first and second energy beams irradiated onto the object.

46. ​​The processing system described in claim 45, wherein the control device drives the first and second scanning optical systems so as to overlap the first and second energy beams at multiple locations in an area where a moving range of the irradiation position of the first energy beam on the object and a moving range of the irradiation position of the second energy beam on the object overlap, and performs drive control of the first scanning optical system and drive control of the second scanning optical system based on multiple drive command values ​​to the first and second scanning optical systems when the first and second energy beams overlap.

47. A processing system as described in claim 45 or 46, wherein the control device controls the drive of the first scanning optical system and the drive of the second scanning optical system based on drive command values ​​for the first and second scanning optical systems when the incident positions of the first and second energy beams on the detection surface of the detector overlap.

48. A processing system comprising: an irradiation device which emits first and second energy beams, and which processes a workpiece using the first and second energy beams emitted from the irradiation device; and a detection device which detects light passing through an object onto which the first and second energy beams emitted from the irradiation device are incident, wherein the irradiation device includes a first scanning optical system which scans the first energy beam so that the irradiation position of the first energy beam moves on the object, and a second scanning optical system which scans the second energy beam so that the irradiation position of the second energy beam moves within the object, and the detection device detects overlap of the first and second energy beams on the object.

49. A processing method comprising: scanning an object with a first energy beam using a first scanning optical system that moves an irradiation position of the first energy beam on the object; scanning the object with the second energy beam using a second scanning optical system that moves an irradiation position of a second energy beam different from the first energy beam on the object; receiving light that passes through the object onto which the first and second energy beams are incident; and controlling the drive of the first scanning optical system and the drive of the second scanning optical system based on drive command values ​​for the first and second scanning optical systems when the first and second energy beams overlap on the object.

Images