Semiconductor package, electronic device, and manufacturing method

Abstract

The present technology relates to a semiconductor package that makes it possible to enhance heat dissipation performance, an electronic device, and a manufacturing method. The semiconductor package comprises: a sheet formed from a thermally conductive material; a semiconductor chip that is arranged on the upper surface side of the sheet and has a peripheral circuit section and a pixel array section including a photoelectric conversion element; and a circuit board that is arranged on the lower surface side of the sheet and processes a signal from the semiconductor chip. The sheet comprises an electrode of the semiconductor chip, a gap through which a wire connecting the circuit board and the electrode is routed, a first area in which the semiconductor chip is arranged, a second area surrounding the first area via the gap, a connection section connecting the first area and the second area, and a third area that is connected with the second area and arranged at least partially outside of the package. The present technology can be applied to, for example, a semiconductor package including an imaging element.

Description

Semiconductor package, electronic device, and manufacturing method

[0001] The present technology relates to a semiconductor package, an electronic device, and a manufacturing method, and more particularly to a semiconductor package, an electronic device, and a manufacturing method having high heat dissipation performance, for example.

[0002] Imaging elements such as CCD (Charge Coupled Device) image sensors and CMOS (Complementary Metal Oxide Semiconductor) image sensors that utilize semiconductor microfabrication technology are widely used in digital cameras, mobile phones, etc. Patent Documents 1 to 3 propose methods for dissipating heat generated in imaging element chips.

[0003] Japanese Patent Publication No. 2023-21774 Japanese Patent Publication No. 2021-36587 Japanese Patent Publication No. 2019-50418

[0004] It is desirable to efficiently dissipate heat generated in the image sensor chip from the chip to the outside.

[0005] The present technology has been made in view of such circumstances, and makes it possible to efficiently dissipate heat from the chip to the outside.

[0006] A semiconductor package according to one aspect of the present technology includes a sheet formed of a thermally conductive material, a semiconductor chip disposed on an upper surface of the sheet and having a pixel array section with photoelectric conversion elements and a peripheral circuit section, and a circuit board disposed on a lower surface of the sheet for processing signals from the semiconductor chip, wherein the sheet includes a gap in which wires are arranged to connect electrodes of the semiconductor chip to electrodes of the circuit board, a first region in which the semiconductor chip is disposed, a second region surrounding the first region via the gap, a connection portion connecting the first region and the second region, and a third region connected to the second region and at least a portion of which is disposed outside the package.

[0007] An electronic device according to one aspect of the present technology is an electronic device comprising: a sheet formed of a material with high thermal conductivity; a semiconductor chip arranged on an upper surface of the sheet and having a pixel array section with photoelectric conversion elements and a peripheral circuit section; and a circuit board arranged on a lower surface of the sheet and processing signals from the semiconductor chip, wherein the sheet is an electronic device comprising a semiconductor package including a gap in which wires connecting electrodes of the semiconductor chip to electrodes of the circuit board are wired, a first region in which the semiconductor chip is arranged, a second region surrounding the first region via the gap, a connection portion connecting the first region and the second region, and a third region connected to the second region and at least a portion of which is arranged outside the package.

[0008] A manufacturing method according to one aspect of the present technology includes adhering the semiconductor chip with a first adhesive to an upper surface of a sheet having a gap in which a wire connecting an electrode of the semiconductor chip to an electrode of a circuit board is routed, a first region in which the semiconductor chip is disposed, a second region surrounding the first region via the gap, a connection portion connecting the first region and the second region, and a third region connected to the second region and at least a portion of which is disposed outside the package, and adhering the circuit board to a lower surface of the sheet with a second adhesive having a lower elastic modulus than the first adhesive.

[0009] A semiconductor package according to one aspect of the present technology includes a sheet made of a thermally conductive material, a semiconductor chip disposed on an upper surface of the sheet and having a pixel array section with photoelectric conversion elements and a peripheral circuit section, and a circuit board disposed on a lower surface of the sheet for processing signals from the semiconductor chip. The sheet includes gaps in which wires are routed to connect electrodes of the semiconductor chip to electrodes of the circuit board, a first region in which the semiconductor chip is disposed, a second region surrounding the first region via the gap, a connecting portion connecting the first region and the second region, and a third region connected to the second region and at least a portion of which is disposed outside the package.

[0010] An electronic device according to one aspect of the present technology includes the semiconductor package.

[0011] A manufacturing method according to one aspect of the present technology includes adhering a semiconductor chip with a first adhesive to an upper surface of a sheet having a gap in which a wire connecting an electrode of the semiconductor chip to an electrode of a circuit board is routed, a first region in which the semiconductor chip is disposed, a second region surrounding the first region via the gap, a connection portion connecting the first region and the second region, and a third region connected to the second region and at least a portion of which is disposed outside the package, and adhering a circuit board with a second adhesive having a lower elastic modulus than the first adhesive to a lower surface of the sheet.

[0012] The electronic device may be an independent device or an internal block that constitutes a single device.

[0013] 1 is a diagram illustrating a configuration of an embodiment of an imaging device to which the present technology is applied. FIG. 1 is a diagram illustrating an example of the shape of a heat dissipation sheet. FIG. 2 is a diagram illustrating a state of a heat dissipation sheet arranged on a circuit board. FIG. 3 is a diagram illustrating an example of the shape of a joint. FIG. 4 is a diagram illustrating another effect of the heat dissipation sheet. FIG. 5 is a diagram illustrating the manufacture of an imaging device. FIG. 6 is a diagram illustrating the manufacture of an imaging device. FIG. 7 is a diagram illustrating an example configuration of an electronic device. FIG. 8 is a diagram illustrating an example cross-sectional configuration of an imaging device in a second embodiment. FIG. 9 is a diagram illustrating an example planar configuration of an imaging device in a second embodiment. FIG. 10 is a diagram illustrating the manufacture of an imaging device in a second embodiment. FIG. 11 is a diagram illustrating the manufacture of an imaging device in a second embodiment. FIG. 12 is a diagram illustrating the number of cuts during singulation. FIG. 13 is a diagram illustrating another method of manufacturing an imaging device in a second embodiment. FIG. 14 is a diagram illustrating another method of manufacturing an imaging device in a third embodiment. FIG. 15 is a diagram illustrating the manufacture of an imaging device in a third embodiment. FIG. 16 is a diagram illustrating the manufacture of an imaging device in a third embodiment. FIG. 17 is a diagram illustrating the manufacture of an imaging device in a third embodiment. FIG. 18 is a diagram illustrating the manufacture of an imaging device in a third embodiment. FIG. 19 ... Fig. 1 is a diagram for explaining connection with a housing. Fig. 2 is a diagram showing an example of a schematic configuration of an endoscopic surgery system. Fig. 3 is a block diagram showing an example of a functional configuration of a camera head and a CCU. Fig. 4 is a block diagram showing an example of a schematic configuration of a vehicle control system. Fig. 5 is an explanatory diagram showing an example of installation positions of an outside-vehicle information detection unit and an imaging unit.

[0014] Hereinafter, modes for carrying out the present technology (hereinafter referred to as embodiments) will be described.

[0015] <Configuration of Image Sensor> Fig. 1 is a diagram showing the configuration of one embodiment of a semiconductor package to which the present technology is applied. Fig. 1 is a schematic cross-sectional view of a semiconductor package 10. In Fig. 1, the semiconductor package 10 houses and packages a semiconductor chip 26 serving as an image sensor.

[0016] Thermosetting resin 22 is placed in the center of circuit board 21 of semiconductor package 10, and adhesive 23-1 is placed on the edges. Heat dissipation sheet 24 is placed on thermosetting resin 22 and adhesive 23-1. A semiconductor chip 26 is placed in the center of the upper surface of heat dissipation sheet 24, with thermosetting resin 25 interposed between them.

[0017] On the upper surface of heat dissipation sheet 24, in the region where adhesive 23-1 is disposed, adhesive 23-2 is disposed, and frame 27 is disposed on adhesive 23-2. Glass substrate 28 is disposed in the center of frame 27. Semiconductor chip 26 is sealed by circuit board 21, frame 27, and glass substrate 28.

[0018] The adhesive 23-1 functions as an adhesive that bonds the circuit board 21 and the heat dissipation sheet 24. The adhesive 23-2 functions as an adhesive that bonds the heat dissipation sheet 24 and the frame 27. The adhesives 23-1 and 23-2 may be made of the same material or different materials. Thermosetting resins may also be used for the adhesives 23-1 and 23-2. The adhesives 23-1 and 23-2 also function to fix and hold the frame 27 on the circuit board 21.

[0019] The heat dissipation sheet 24 is fixed in a sandwiched state between the circuit board 21 and the frame 27. The heat dissipation sheet 24 absorbs heat generated by the semiconductor chip 26, conducts it, and releases it to the outside of the semiconductor package 10. The heat dissipation sheet 24 is pulled out in a planar direction to the outside of the semiconductor package 10, and the heat dissipation member is connected to the housing. The direction in which the heat dissipation sheet 24 is pulled out can be changed as appropriate to match the structure of the camera or the like in which the semiconductor package 10 is mounted. The pulled out portion may be multiple rather than just one. The shape of the heat dissipation sheet 24 will be described later with reference to FIG. 2.

[0020] Thermosetting resin 22 is provided between heat dissipation sheet 24 and circuit board 21. Thermosetting resin 22 functions as an adhesive that bonds heat dissipation sheet 24 and circuit board 21, and also functions as a holder that supports semiconductor chip 26 arranged on heat dissipation sheet 24. Thermosetting resin 22 is provided in a shape that has a gap in the center. Thermosetting resin 22 is provided so that a space surrounded by circuit board 21, heat dissipation sheet 24, and thermosetting resin 22 exists between circuit board 21 and heat dissipation sheet 24.

[0021] The heat dissipation sheet 24 may be a thin, flexible, highly thermally conductive graphite sheet, or a sheet containing metal or ceramic, such as a copper foil sheet or an aluminum foil sheet.

[0022] The semiconductor chip 26 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor, etc. The semiconductor chip 26 is composed of a pixel array section in which a plurality of pixels, each having a photoelectric conversion element (PD: Photo Diode) that converts incident light into an electric charge, are arranged two-dimensionally in a matrix, and a peripheral circuit section that drives the pixels and performs A / D (Analog / Digital) conversion, etc.

[0023] The electrodes of the semiconductor chip 26 and the electrodes of the circuit board 21 are connected by wires 29, and signals obtained by the semiconductor chip 26 are supplied to the circuit of the circuit board 21 and processed there.

[0024] A thermosetting resin 25 is provided between the heat dissipation sheet 24 and the semiconductor chip 26. The thermosetting resin 25 functions as an adhesive that bonds the heat dissipation sheet 24 and the semiconductor chip 26 together, and also has the function of efficiently conducting heat generated by the semiconductor chip 26 to the heat dissipation sheet 24.

[0025] A thermosetting resin 22 is provided on the lower surface (lower side in the figure) of the heat dissipation sheet 24, and a thermosetting resin 25 is provided on the upper surface (upper side in the figure). The thermosetting resin 22 and the thermosetting resin 25 are formed of materials with different properties. The thermosetting resin 22 provided on the circuit board 21 side is a thermosetting resin with a low elastic modulus, for example, a resin with an elastic modulus of approximately 5 MPa to 500 MPa. The thermosetting resin 25 provided on the semiconductor chip 26 side is a thermosetting resin with a low linear expansion coefficient, a high elastic modulus, and a high thermal conductivity, for example, a resin with an elastic modulus of approximately 500 MPa to 1 GPa.

[0026] In this way, by using different materials on the top and bottom of heat dissipation sheet 24, it is possible to prevent warping of circuit board 21 and semiconductor chip 26. If thermosetting resin 22 and thermosetting resin 25 were made of the same material, there is a possibility that warping will occur in circuit board 21 and semiconductor chip 26 when there is a temperature change due to the difference in the linear expansion coefficients of circuit board 21 and semiconductor chip 26.

[0027] By forming the thermosetting resin 22 and the thermosetting resin 25 from different materials, it is possible to suppress the effects of variations in warpage that occur in the circuit board 21 and the semiconductor chip 26 when there is a temperature change. As will be described later, the heat dissipation sheet 24 also has a shape that suppresses variations in warpage, which further reduces the effects of warpage.

[0028] <Shape of heat dissipation sheet> Figure 2 is a diagram showing the configuration of heat dissipation sheet 24 in a plan view. Heat dissipation sheet 24 has a central portion 51 in the center, and a peripheral portion 52 surrounding central portion 51. Central portion 51 and peripheral portion 52 are connected by connection portions 53-1 to 53-4. Heat dissipation sheet 24 has an extension portion 54 on the right side of the figure that is extended to the outside of semiconductor package 10.

[0029] The central portion 51 is a rectangular area where the semiconductor chip 26 is bonded with the thermosetting resin 25. The peripheral portion 52 is a rectangular area where the frame 27 is bonded with the adhesive 23, and is formed of lines of a predetermined width.

[0030] Between the central portion 51 and the peripheral portion 52, gaps 55-1 to 55-4 are provided, through which wires 29 are wired, connecting electrodes (inner leads) of the circuit board 21 to electrodes of the semiconductor chip 26. As shown in Fig. 3, the gaps 55-1 to 55-4 are regions provided so that, when the heat dissipation sheet 24 is overlaid on the circuit board 21, each of the inner leads 61-1 to 61-4 of the circuit board 21 can be seen in a plan view, and are gaps provided in the heat dissipation sheet 24 as regions through which wires 29 to be wire-bonded are wired.

[0031] Adhesive 23 is applied to peripheral portion 52, which is the region where circuit board 21 and frame 27 come into contact and are bonded together. Connection portions 53-1 to 53-4 are provided in a region that avoids gaps 55-1 to 55-4, and connect central portion 51 and peripheral portion 52. Hereinafter, when there is no need to distinguish between connection portions 53-1 to 53-4, they will simply be referred to as connection portion 53. Other portions will be described in the same manner.

[0032] 2, the connection portions 53 are provided at positions that connect the four corners of the central portion 51 to the four corners of the peripheral portion 52. The connection portions 53 may also be provided in areas within the gaps 55 where the wires 29 (inner leads 61) are not wired.

[0033] In the example shown in Figure 2, the lead-out portion 54 is provided on the right side of the peripheral portion 52, which is formed in a rectangular shape, but the lead-out portion 54 may also be provided on two, three, or four of the four sides of the peripheral portion 52.

[0034] The heat generated by the semiconductor chip 26 is absorbed in the central portion 51 of the heat dissipation sheet 24, and is conducted from the central portion 51 to the peripheral portion 52 via the connection portion 53, and then from the peripheral portion 52 to the lead-out portion 54. Since the lead-out portion 54 is disposed outside the semiconductor package 10, the heat from the semiconductor chip 26 can be dissipated to the outside of the semiconductor package 10.

[0035] <Shape of Connection Portion> The shape of connection portion 53 will be described with reference to Fig. 4. As shown in Fig. 4A, connection portion 53 is composed of curved portion 71 and straight portion 72. Curved portion 71 has a curved shape, and straight portion 72 has a straight shape. By including curved portion 71 in connection portion 53, the influence of variations in warpage that occur in circuit board 21 and semiconductor chip 26 when there is a temperature change can be absorbed, and warping of circuit board 21 and semiconductor chip 26 can be suppressed.

[0036] The widths of the curved portions 71 and the straight portions 72 that make up the connection portion 53 are the same. That is, the connection portion 53 is formed in a linear shape with the same width. If the connection portion 53 had a narrow portion, heat conduction would be hindered in that portion, and heat could accumulate. The width of the connection portion 53 is formed to be approximately uniform so that there are no portions where heat can accumulate.

[0037] If the area where the connection portion 53 and the peripheral portion 52 are connected is formed to be wide, the configuration can be such that heat is conducted more efficiently from the connection portion 53 to the peripheral portion 52 .

[0038] The connection portion 53 is provided to connect the central portion 51 and the peripheral portion 52 while avoiding the inner leads 61. Since the connection portion 53 serves as a heat dissipation path, it is formed to be as wide as possible without interfering with the inner leads 61.

[0039] By providing a curved portion 71 at the connection portion 53, it is possible to alleviate the stress that occurs between the central portion 51 that comes into contact with the semiconductor chip 26 and the peripheral portion 52 that comes into contact with the frame 27 due to temperature changes, thereby preventing the circuit board 21 and the semiconductor chip 26 from warping.

[0040] Fig. 4B is a diagram showing another shape of the connection portion 53. Like the connection portion 53 shown in Fig. 4A, the connection portion 53 shown in Fig. 4B also includes a curved portion 71 and a straight portion 72, but the shape of the curved portion 71 is different. The curved portion 71 shown in Fig. 4A has an arc located on the lower side in the figure, whereas the curved portion 71 shown in Fig. 4B has an arc located on the upper side in the figure.

[0041] The shape of the curved portion 71 is not limited to the shapes shown in FIGS. 4A and 4B, and may be other shapes.

[0042] 4C is a diagram showing another shape of the connection portion 53. The connection portion 53 shown in FIG. 4C is configured to have a straight portion 72-1 and a straight portion 72-2. The straight portion 72-1 and the straight portion 72-2 are connected (integrally formed) so that an angle A formed between the straight portion 72-1 and the peripheral portion 52 and a predetermined side, for example, the side on the bottom in the figure, and an angle B formed between the straight portion 72-2 and a predetermined side of the peripheral portion 52 are different angles.

[0043] Fig. 4D is a diagram showing another shape of the connection portion 53. The connection portion 53 shown in Fig. 4D is configured to have a linear portion 72-1, a linear portion 72-2, and a linear portion 72-3. The linear portions 72-1, 72-2, and 72-3 are connected (integrally formed) so that an angle A formed between the linear portion 72-1 and a predetermined side of the peripheral portion 52, an angle B formed between the linear portion 72-2 and a predetermined side of the peripheral portion 52, and an angle C formed between the linear portion 72-3 and a predetermined side of the peripheral portion 52 are different angles.

[0044] 4C and 4D are formed into a curved shape by combining straight lines having a predetermined width. The curved shape of connection portion 53 can relieve stress that occurs between central portion 51, which contacts semiconductor chip 26, and peripheral portion 52, which contacts frame 27, due to temperature changes, and can prevent circuit board 21 and semiconductor chip 26 from warping.

[0045] The shape of the straight portion 72 is not limited to the shapes shown in Figures 4A to 4D, but may be other shapes, such as a shape having a curved portion or a bent portion, as long as it is a shape that can relieve stress.

[0046] 4A to 4D may be applied to the connection portions 53-1 to 53-4 of the heat dissipation sheet 24. For example, the shape of the connection portion 53 shown in FIG. 4A may be applied to the connection portions 53-1 and 53-4 (see FIG. 2) that are positioned opposite each other, and the shape of the connection portion 53 shown in FIG. 4C may be applied to the connection portions 53-2 and 53-3. In this way, connection portions 53 of different shapes may be provided on one heat dissipation sheet 24.

[0047] 2, the connecting portions 53 are provided at positions corresponding to the four corners of the semiconductor chip 26. However, the connecting portions 53 may be provided at positions other than the four corners of the semiconductor chip 26, or in addition to the four corners, at positions where no inner leads 61 are provided. Increasing the number of connecting portions 53 increases the number of heat dissipation paths connecting the central portion 51 and the peripheral portion 52, thereby improving the heat dissipation efficiency.

[0048] <Other Effects> By providing the heat dissipation sheet 24, it is possible to achieve a structure that can efficiently dissipate heat generated within the semiconductor package 10 to the outside of the semiconductor package 10. Furthermore, by providing the heat dissipation sheet 24, it is possible to reduce noise. This will be further explained with reference to FIG. 5 .

[0049] 5 is an enlarged view of the heat dissipation sheet 24 portion of the semiconductor package 10 shown in FIG. Electromagnetic waves may be generated on the circuit board 21. By forming the heat dissipation sheet 24 from a material that absorbs electromagnetic waves, such as graphite, the electromagnetic waves generated on the circuit board 21 can be attenuated by the heat dissipation sheet 24. The electromagnetic waves absorbed by the heat dissipation sheet 24 propagate through the heat dissipation sheet 24 as a current and are released to the outside.

[0050] By providing the heat dissipation sheet 24, it is possible to attenuate the electromagnetic waves generated on the circuit board 21 and prevent them from affecting the semiconductor chip 26. Therefore, it is possible to reduce the electromagnetic wave noise generated between the circuit board 21 and the semiconductor chip 26.

[0051] <Regarding Manufacturing of Semiconductor Package> Manufacturing of the semiconductor package 10 shown in FIG. 1 will be described with reference to FIGS. 6 and 7. FIG.

[0052] In steps S11 to S13, the heat dissipation sheet 24 is attached. In step S11, a circuit board 21 on which a circuit is formed is prepared. The multiple squares on the circuit board 21 shown in step S11 represent electrodes (inner leads 61) to be wire-bonded.

[0053] In step S12, thermosetting resin 22 and adhesive 23-1 are applied onto circuit board 21. As shown in step S12, thermosetting resin 22 is applied to positions where semiconductor chips 26 will be placed, corresponding to the four sides of semiconductor chip 26. Adhesive 23-1 is applied to positions where frame 27 will be placed, corresponding to the four sides of circuit board 21.

[0054] In step S13, the heat dissipation sheet 24 is placed in close contact with the circuit board 21 on which the thermosetting resin 22 and adhesive 23-1 have been applied, and then heated to harden the thermosetting resin 22 and adhesive 23-1.

[0055] Die bonding is performed in steps S14 and S15. In step S14, a thermosetting resin 25 is applied to the entire surface of the heat dissipation sheet 24 in the area where the semiconductor chip 26 is to be disposed.

[0056] In step S15, the semiconductor chip 26 is mounted on the heat dissipation sheet 24 by being tightly attached to the area where the thermosetting resin 25 has been applied, and a heat treatment is performed to thermally harden the thermosetting resin 25. By this die-bonding process, the semiconductor chip 26 is fixed onto the heat dissipation sheet 24.

[0057] In step S16 (FIG. 7), wires 29 are formed between the circuit board 21 and the semiconductor chip 26 by wire bonding, and the circuit board 21 and the semiconductor chip 26 are electrically connected to each other.

[0058] In steps S17 and S18, the frame 27 is adhered. In step S17, adhesive 23-2 is applied to the heat dissipation sheet 24. As shown in step S17, the adhesive 23-2 is applied to each of the four sides of the peripheral portion 52 of the heat dissipation sheet 24, at the positions where the frame 27 will be placed.

[0059] In step S18, the frame 27 is mounted on the heat dissipation sheet 24 by being attached to the area where the adhesive 23-2 is applied, and a heat treatment is performed to thermally harden the adhesive 23-2, thereby fixing the frame 27.

[0060] In step S19, the glass substrate 28 is placed on the frame 27, thereby sealing the semiconductor package 10.

[0061] 1 is manufactured through these steps. Note that the manufacturing steps shown here are merely an example, and cases in which the steps are rearranged or other steps are added are also within the scope of application of the present technology.

[0062] By manufacturing the semiconductor package 10 as described above and mounting it on a heat dissipation member or housing inside an imaging device (camera), it is possible to realize a small, lightweight package with high heat dissipation properties while maintaining the optical precision required for a camera.

[0063] This technology makes it possible to realize a semiconductor package that is small, lightweight, and has high heat dissipation properties, which can prevent warping of the semiconductor chip 26 and the circuit board 21 on which the semiconductor chip 26 is mounted due to temperature changes. Furthermore, by using graphite, for example, for the heat dissipation sheet, the graphite can attenuate electromagnetic waves from the circuit board 21, thereby reducing electromagnetic noise generated between the semiconductor chip 26 and the circuit board 21.

[0064] <Application Examples to Electronic Devices> The present technology is applicable to general electronic devices that use an imaging element in an image capture unit (photoelectric conversion unit), such as imaging devices such as digital still cameras and video cameras, portable terminal devices with imaging functions, copiers that use an imaging element in an image reading unit, etc. The imaging element may be formed as a single chip, or may be in the form of a module having an imaging function in which the imaging unit and a signal processing unit or an optical system are packaged together.

[0065] FIG. 8 is a block diagram showing an example of the configuration of an imaging device as an electronic device to which the present technology is applied.

[0066] 8 includes an optical unit 1001 including a lens group and the like, an image sensor (image capturing device) 1002, and a DSP (Digital Signal Processor) circuit 1003, which is a camera signal processing circuit. The image sensor 1000 also includes a frame memory 1004, a display unit 1005, a recording unit 1006, an operation unit 1007, and a power supply unit 1008. The DSP circuit 1003, frame memory 1004, display unit 1005, recording unit 1006, operation unit 1007, and power supply unit 1008 are interconnected via a bus line 1009.

[0067] The optical unit 1001 takes in incident light (image light) from a subject and forms an image on the imaging surface of the image sensor 1002. The image sensor 1002 converts the amount of incident light formed on the imaging surface by the optical unit 1001 into an electrical signal on a pixel-by-pixel basis and outputs the signal as a pixel signal.

[0068] The display unit 1005 is configured with a thin display such as an LCD (Liquid Crystal Display) or an organic EL (Electro Luminescence) display, and displays moving images or still images captured by the imaging element 1002. The recording unit 1006 records the moving images or still images captured by the imaging element 1002 on a recording medium such as a hard disk or semiconductor memory.

[0069] An operation unit 1007, under user operation, issues operation commands for various functions of the image sensor 1000. A power supply unit 1008 appropriately supplies various types of power to the DSP circuit 1003, frame memory 1004, display unit 1005, recording unit 1006, and operation unit 1007 as operating power sources.

[0070] The semiconductor package 10 including the semiconductor chip 26 described above or below can be applied to a part of the imaging device shown in FIG.

[0071] Second Embodiment Fig. 9 is a diagram showing the configuration of a second embodiment of a semiconductor package to which the present technology is applied. In the following description, the semiconductor package 10 described with reference to Figs. 1 to 8 will be referred to as the semiconductor package 10 of the first embodiment and will be referred to as semiconductor package 10a as appropriate. The semiconductor package 10 of the second embodiment described with reference to Fig. 9 will be referred to as semiconductor package 10b.

[0072] In the following description, the same parts as those in the semiconductor package 10a of the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0073] Fig. 9 is a schematic cross-sectional view of the semiconductor package 10b, and Fig. 10 is a plan view of the semiconductor package 10b. In Fig. 9 and Fig. 10, the semiconductor package 10b houses and packages a semiconductor chip 26 serving as an image sensor.

[0074] A thermosetting resin 22 is disposed on a circuit board 21 of the semiconductor package 10b. A heat dissipation sheet 24 is disposed on the thermosetting resin 22. A semiconductor chip 26 is disposed on the upper surface of the heat dissipation sheet 24 with a thermosetting resin 25 interposed therebetween.

[0075] A thermosetting resin 22 is provided between the heat dissipation sheet 24 and the circuit board 21. The thermosetting resin 22 functions as an adhesive that bonds the heat dissipation sheet 24 and the circuit board 21, and also functions as a holder that supports the semiconductor chip 26 arranged on the heat dissipation sheet 24. The thermosetting resin 22 is provided in a shape that has multiple voids (three in FIG. 9 ). The thermosetting resin 22 is provided so that a space surrounded by the circuit board 21, the heat dissipation sheet 24, and the thermosetting resin 22 exists between the circuit board 21 and the heat dissipation sheet 24.

[0076] The heat dissipation sheet 24 is fixed in a sandwiched state between the circuit board 21 and the semiconductor chip 26. The heat dissipation sheet 24 absorbs heat generated by the semiconductor chip 26, conducts it, and releases it to the outside of the semiconductor package 10b. The heat dissipation sheet 24 is pulled out in a planar direction (toward the right in FIG. 9 ) to the outside of the semiconductor package 10b, and the heat dissipation member is connected to a housing (not shown). The direction in which the heat dissipation sheet 24 is pulled out can be changed as appropriate to suit the structure of a camera or the like in which the semiconductor package 10b is mounted. The heat dissipation sheet 24 may be pulled out from multiple locations, rather than just one location.

[0077] The heat dissipation sheet 24 may be a thin, flexible, highly thermally conductive graphite sheet, or a sheet containing metal or ceramic, such as a copper foil sheet or an aluminum foil sheet.

[0078] The electrodes of semiconductor chip 26 and the electrodes of circuit board 21 are connected by wires 29, and signals obtained by semiconductor chip 26 are supplied to and processed by the circuit on circuit board 21. Wires 29 are contained within glass holding part 101 and molded resin 102, and are provided in a fixed state within glass holding part 101 and molded resin 102.

[0079] A thermosetting resin 25 is provided between the heat dissipation sheet 24 and the semiconductor chip 26. The thermosetting resin 25 functions as an adhesive that bonds the heat dissipation sheet 24 and the semiconductor chip 26 together, and also has the function of efficiently conducting heat generated by the semiconductor chip 26 to the heat dissipation sheet 24.

[0080] A thermosetting resin 22 is provided on the lower surface (lower side in the figure) of the heat dissipation sheet 24, and a thermosetting resin 25 is provided on the upper surface (upper side in the figure). The thermosetting resin 22 and the thermosetting resin 25 are formed of materials with different properties. The thermosetting resin 22 provided on the circuit board 21 side is a thermosetting resin with a low elastic modulus, for example, a resin with an elastic modulus of approximately 5 MPa to 500 MPa. The thermosetting resin 25 provided on the semiconductor chip 26 side is a thermosetting resin with a low linear expansion coefficient, a high elastic modulus, and a high thermal conductivity, for example, a resin with an elastic modulus of approximately 500 MPa to 1 GPa.

[0081] In this way, by using different materials on the top and bottom of heat dissipation sheet 24, it is possible to prevent warping of circuit board 21 and semiconductor chip 26. If thermosetting resin 22 and thermosetting resin 25 were made of the same material, there is a possibility that warping will occur in circuit board 21 and semiconductor chip 26 when there is a temperature change due to the difference in the linear expansion coefficients of circuit board 21 and semiconductor chip 26.

[0082] The thermosetting resin 22 and the thermosetting resin 25 are made of different materials, so that the influence of variations in warping that occur in the circuit board 21 and the semiconductor chip 26 when there is a temperature change can be suppressed.

[0083] The semiconductor chip 26 is surrounded by a mold resin 102, and the semiconductor chip 26 is contained within the space surrounded by the mold resin 102. A glass holding portion 101 is provided inside the mold resin 102, and the glass substrate 28 is held by this glass holding portion 101.

[0084] The glass holding part 101 is formed in the peripheral region of the semiconductor chip 26, in an area where the imaging element of the semiconductor chip 26 is not provided. The glass substrate 28 is disposed on the glass holding part 101. The glass holding part 101 is formed of a predetermined resin. The area of ​​the semiconductor chip 26 where the imaging element is disposed is sealed by the semiconductor chip 26, the glass holding part 101, and the glass substrate 28.

[0085] Molded resin 102 is provided on the outside of semiconductor chip 26, and the molded resin 102 located on the left side of the figure is provided on circuit board 21, while the molded resin 102 located on the right side of the figure is provided on heat dissipation sheet 24. Semiconductor chip 26 is sealed by circuit board 21, molded resin 102, and glass substrate 28.

[0086] 10, when the semiconductor package 10b is viewed from the glass substrate 28 side, a molded resin 102 is provided to surround the glass substrate 28. A portion of the molded resin 102 (on the right side in the figure) has an area where the heat dissipation sheet 24 is provided in an exposed state. The exposed heat dissipation sheet 24 allows heat generated by the semiconductor chip 26 to be dissipated to the outside of the semiconductor package 10b.

[0087] <Regarding Manufacturing of Semiconductor Package 10b> Manufacturing of the semiconductor package 10b shown in FIG. 9 will be described with reference to FIGS.

[0088] In steps S31 to S33, the heat dissipation sheet 24 is attached. In step S31, a circuit board 21 on which a circuit is formed is prepared. The multiple squares on the circuit board 21 shown in step S31 indicate areas (hereinafter referred to as lead areas 62) where electrodes (inner leads 61) to be wire-bonded are arranged.

[0089] The circuit board 21 prepared in step S31 is an organic assembly board, with multiple circuit boards 21 formed on a single wafer. The example shown in Fig. 11 shows a 3 x 4 arrangement of 12 circuit boards 21 arranged on a single wafer. The example shown in Fig. 11 shows an example in which a lead region 62 is provided on each of the three sides of one circuit board 21.

[0090] In step S32, thermosetting resin 22 is applied onto circuit board 21. As shown in step S32, thermosetting resin 22 is applied to the positions where semiconductor chips 26 are to be disposed, inside where lead areas 62 are disposed, and outside one side where lead areas 62 are not disposed. Thermosetting resin 22 is also applied to the four sides of the outer periphery of the wafer and between circuit boards 21. Note that the application pattern of thermosetting resin 22 shown in FIG. 11 is just an example, and other application patterns, such as solid application, may also be used.

[0091] In step S33, heat dissipation sheet 24 is placed in close contact with circuit board 21 on which thermosetting resin 22 has been applied, and heat is applied to cure thermosetting resin 22. Heat dissipation sheet 24 has a shape that opens in lead region 62. Focusing on one circuit board 21, heat dissipation sheet 24 is attached to circuit board 21, covering the four sides (periphery) of circuit board 21, the central region, and the region connecting the center to the peripheral region (the region on the lower side in the figure).

[0092] Die bonding is performed in steps S34 and S35 (FIG. 12). In step S34, thermosetting resin 25 is applied to the entire surface of the region of heat dissipation sheet 24 where semiconductor chip 26 is to be disposed.

[0093] In step S35 (FIG. 12), the semiconductor chip 26 is mounted on the heat dissipation sheet 24 by being tightly attached to the area where the thermosetting resin 25 has been applied, and a heat treatment is performed to thermally harden the thermosetting resin 25. By this die-bonding process, the semiconductor chip 26 is fixed onto the heat dissipation sheet 24.

[0094] In step S36, wires 29 are formed by wire bonding between the circuit board 21 and the semiconductor chip 26, electrically connecting the circuit board 21 and the semiconductor chip 26. After wire bonding, glass holding portions 101 are formed on the four sides of the outer periphery of the semiconductor chip 26, avoiding the imaging element, and the glass substrate 28 is bonded thereon.

[0095] In step S37, molding is performed using a mold that protects the glass substrate 28 and a portion of the heat dissipation sheet 24 so that the molding resin 102 is not poured into the glass substrate 28 and a portion of the heat dissipation sheet 24. In step S37, the molding resin 102 is poured into the area other than the glass substrate 28 and the portion of the heat dissipation sheet 24, thereby resin-encapsulating the semiconductor chip 26.

[0096] In step S38, the semiconductor packages 10b are singulated. The singulation is performed by cutting once in the vertical direction in the drawing and twice in the horizontal direction. For example, the semiconductor packages 10b are cut along cut line C1, and then cut along cut line C2. The fact that the semiconductor packages 10b are cut twice in this manner will be described with reference to FIG. 13.

[0097] The upper diagram of Fig. 13 shows two semiconductor packages 10b-1 and 10b-2 on the wafer before cutting. The semiconductor packages 10b-1 and 10b-2 are cut along cut lines C1 and C2 to be separated into semiconductor packages 10b-1 and 10b-2 as shown in the lower diagram of Fig. 13.

[0098] The cut line C1 is located on the exposed heat dissipation sheet 24 of the semiconductor package 10b-1, and the cut line C2 is located on the mold resin 102 of the semiconductor package 10b-2.

[0099] If cutting is performed only once along the cut line C1 to separate the semiconductor package 10b-1, the semiconductor package 10b-2 will be separated with the exposed heat dissipation sheet 24 of the semiconductor package 10b-1 remaining. If cutting is performed only once along the cut line C2 to separate the semiconductor package 10b-1, the semiconductor package 10b-1 will be separated with the mold resin 102 of the semiconductor package 10b-2 remaining.

[0100] If singulation were performed by cutting only along cut line C1 or cut line C2, there is a possibility that excess heat dissipation sheet 24 or mold resin 102 would remain. As shown in Figure 13, by cutting twice along cut line C1 and cut line C2, singulation can be performed without excess heat dissipation sheet 24 or mold resin 102 remaining.

[0101] Here, the explanation will be continued assuming that two cuts are performed, but singulation may be performed in a single cut if it is acceptable for excess heat dissipation sheet 24 or mold resin 102 to remain, for example, if a process for removing excess heat dissipation sheet 24 or mold resin 102 is performed in a later process, or if the remaining portions do not pose a problem, etc. Furthermore, singulation may be performed in a single cut if the cutting precision during singulation is high and the cut can be performed in a position where no excess heat dissipation sheet 24 or mold resin 102 remains.

[0102] Through these steps, the semiconductor package 10b shown in Fig. 9 is manufactured. Note that the manufacturing steps shown here are just an example, and cases where the steps are rearranged or other steps are added are also within the scope of application of the present technology.

[0103] By manufacturing the semiconductor package 10b as described above and mounting it on a heat dissipation member or housing inside an imaging device (camera), it is possible to realize a small, lightweight package with high heat dissipation properties while maintaining the optical precision required for a camera.

[0104] This technology makes it possible to realize a semiconductor package that is small, lightweight, and has high heat dissipation properties, which can prevent warping of the semiconductor chip 26 and the circuit board 21 on which the semiconductor chip 26 is mounted due to temperature changes. Furthermore, by using graphite, for example, for the heat dissipation sheet, the graphite can attenuate electromagnetic waves from the circuit board 21, thereby reducing electromagnetic noise generated between the semiconductor chip 26 and the circuit board 21.

[0105] <Regarding Another Method of Manufacturing Semiconductor Package 10b> Another method of manufacturing the semiconductor package 10b shown in Figure 9 will be described with reference to Figures 14 and 15. The method of manufacturing the semiconductor package 10b described with reference to Figures 14 and 15 differs from the method of manufacturing the semiconductor package 10b described with reference to Figures 11 and 12 in that the lead regions 62 provided on the circuit board 21 are provided on all four sides, and because the lead regions 62 are provided on all four sides, the shape of the heat dissipation sheet 24 to be attached is different; however, the basic flow of the manufacturing process is the same. Descriptions of the same processes will be omitted where appropriate.

[0106] In step S51, an organic assembly substrate is prepared, in which a plurality of circuit boards 21 are formed on a single wafer. In the example shown in Fig. 14, 12 circuit boards 21 are arranged in a 3 x 4 arrangement on a single wafer. In the example shown in Fig. 14, lead regions 62 are provided on four sides of each circuit board 21. This configuration is similar to that of the semiconductor package 10a in the first embodiment.

[0107] In step S52, thermosetting resin 22 is applied onto circuit board 21. As shown in step S52, thermosetting resin 22 is applied to the position where semiconductor chip 26 is to be disposed, inside where lead region 62 is disposed. Thermosetting resin 22 is also applied to the four sides of the outer periphery of the wafer and between circuit boards 21. Note that the application pattern of thermosetting resin 22 shown in Figure 14 is just an example, and other application patterns may be used, such as solid application.

[0108] In step S53, the heat dissipation sheet 24 is placed in close contact with the circuit board 21 on which the thermosetting resin 22 has been applied, and is then heated to cure the thermosetting resin 22. The heat dissipation sheet 24 has a shape in which the lead regions 62 are opened. In the example shown in FIG. 14 , four lead regions 62 are provided, and therefore a heat dissipation sheet 24 with four openings is attached to the circuit board 21. The heat dissipation sheet 24 attached to one circuit board 21 has the same shape as the heat dissipation sheet 24 in the first embodiment, for example, the heat dissipation sheet 24 described with reference to FIGS. 2 to 4 . That is, the heat dissipation sheet 24 has connection portions 53, each having a curved portion 71 and a straight portion 72, at its four corners.

[0109] In step S33 described with reference to Figure 11, the shape of the heat dissipation sheet 24 to be attached to the circuit board 21 can also be such that the heat dissipation sheet 24 has connection portions 53 formed on the upper left and upper right.

[0110] 11, the heat dissipation sheet 24 bonded to the circuit board 21 has a wide portion connecting the heat dissipation sheet 24 located on the underside of the semiconductor chip 26 with the portion exposed outside the semiconductor package 10b, thereby improving the heat dissipation performance. The heat dissipation sheet 24 bonded to the circuit board 21 in step S53 described with reference to FIG. 14 may have lower heat dissipation performance than the portion exposed outside the semiconductor package 10b, but it can improve the stress relaxation performance.

[0111] Whether to use the heat dissipation sheet 24 shown in Figure 11 or the heat dissipation sheet 24 shown in Figure 14 depends on the number and positions of the lead areas 62 provided on the circuit board 21, but the choice of which to use can also be made depending on whether heat dissipation performance or stress relaxation performance is given priority.

[0112] Die bonding is performed in steps S54 and S55 (FIG. 15). The processes from step S54 onwards are basically the same as the processes from step S34 (FIG. 12) onwards, so a description thereof will be omitted.

[0113] Through these steps, the semiconductor package 10b shown in Fig. 9 is manufactured. Note that the manufacturing steps shown here are just an example, and cases where the steps are rearranged or other steps are added are also within the scope of application of the present technology.

[0114] By manufacturing the semiconductor package 10b as described above and mounting it on a heat dissipation member or housing inside an imaging device (camera), it is possible to realize a small, lightweight package with high heat dissipation properties while maintaining the optical precision required for a camera.

[0115] This technology makes it possible to realize a semiconductor package that is small, lightweight, and has high heat dissipation properties, which can prevent warping of the semiconductor chip 26 and the circuit board 21 on which the semiconductor chip 26 is mounted due to temperature changes. Furthermore, by using graphite, for example, for the heat dissipation sheet, the graphite can attenuate electromagnetic waves from the circuit board 21, thereby reducing electromagnetic noise generated between the semiconductor chip 26 and the circuit board 21.

[0116] 16 is a diagram showing a configuration of a third embodiment of a semiconductor package 10 to which the present technology is applied. The semiconductor package 10 in the third embodiment described with reference to FIG. 16 will be referred to as a semiconductor package 10c.

[0117] 16 is a schematic cross-sectional view of a semiconductor package 10c, which houses and packages a semiconductor chip 26 serving as an image sensor.

[0118] A thermosetting resin 22 is disposed on a circuit board 21 of the semiconductor package 10. A heat dissipation sheet 24 is disposed on the thermosetting resin 22. A semiconductor chip 26 is disposed on the upper surface of the heat dissipation sheet 24 with a thermosetting resin 25 interposed therebetween.

[0119] Thermosetting resin 22 is provided between heat dissipation sheet 24 and circuit board 21. Thermosetting resin 22 functions as an adhesive that bonds heat dissipation sheet 24 and circuit board 21, and also functions as a holder that supports semiconductor chip 26 placed on heat dissipation sheet 24. Thermosetting resin 22 is provided in a shape that has multiple voids (three in FIG. 16 ). Thermosetting resin 22 is provided so that a space surrounded by circuit board 21, heat dissipation sheet 24, and thermosetting resin 22 exists between circuit board 21 and heat dissipation sheet 24.

[0120] The heat dissipation sheet 24 is fixed in a sandwiched state between the circuit board 21 and the semiconductor chip 26. The heat dissipation sheet 24 absorbs heat generated by the semiconductor chip 26, conducts it, and releases it to the outside of the semiconductor package 10c. The heat dissipation sheet 24 is pulled out in a planar direction (toward the right in FIG. 16 ) to the outside of the semiconductor package 10c, and the heat dissipation member is connected to a housing (not shown). The direction in which the heat dissipation sheet 24 is pulled out can be changed as appropriate to suit the structure of a camera or the like in which the semiconductor package 10c is mounted. The heat dissipation sheet 24 may be pulled out from multiple locations, rather than just one location.

[0121] The heat dissipation sheet 24 may be a thin, flexible, highly thermally conductive graphite sheet, or a sheet containing metal or ceramic, such as a copper foil sheet or an aluminum foil sheet.

[0122] The electrodes of the semiconductor chip 26 and the electrodes of the circuit board 21 are connected by wires 29, and signals obtained by the semiconductor chip 26 are supplied to the circuit of the circuit board 21 and processed there.

[0123] A thermosetting resin 25 is provided between the heat dissipation sheet 24 and the semiconductor chip 26. The thermosetting resin 25 functions as an adhesive that bonds the heat dissipation sheet 24 and the semiconductor chip 26 together, and also has the function of efficiently conducting heat generated by the semiconductor chip 26 to the heat dissipation sheet 24.

[0124] A thermosetting resin 22 is provided on the lower surface (lower side in the figure) of the heat dissipation sheet 24, and a thermosetting resin 25 is provided on the upper surface (upper side in the figure). The thermosetting resin 22 and the thermosetting resin 25 are formed of materials with different properties. The thermosetting resin 22 provided on the circuit board 21 side is a thermosetting resin with a low elastic modulus, for example, a resin with an elastic modulus of approximately 5 MPa to 500 MPa. The thermosetting resin 25 provided on the semiconductor chip 26 side is a thermosetting resin with a low linear expansion coefficient, a high elastic modulus, and a high thermal conductivity, for example, a resin with an elastic modulus of approximately 500 MPa to 1 GPa.

[0125] In this way, by using different materials for the top and bottom of the heat dissipation sheet 24, it is possible to prevent the circuit board 21 and the semiconductor chip 26 from warping.

[0126] The semiconductor chip 26 is surrounded by a mold resin 122, and the semiconductor chip 26 is contained within a space formed by the mold resin 122. The side surfaces of the semiconductor chip 26 and the side surfaces of the mold resin 122 are provided at positions separated from each other so as to leave a space between them. Wires 29 are provided in the space between the side surfaces of the semiconductor chip 26 and the side surfaces of the mold resin 122.

[0127] A glass holding portion 121 is provided on the upper side of the molded resin 122 in the figure, and the glass substrate 28 is held (adhered) by this glass holding portion 121. The semiconductor chip 26 is sealed by the circuit board 21, molded resin 122, glass holding portion 121, and glass substrate 28.

[0128] <Regarding Manufacturing of Semiconductor Package 10c> Manufacturing of the semiconductor package 10c shown in FIG. 16 will be described with reference to FIGS.

[0129] In step S71, a circuit board 21 on which a circuit is formed is prepared. The circuit board 21 shown in step S71 has three lead regions 62. In step S71, an organic assembly substrate is prepared in which a plurality of circuit boards 21 are formed on a single wafer.

[0130] In step S72, thermosetting resin 22 is applied onto circuit board 21. As shown in step S72, thermosetting resin 22 is applied to the positions where semiconductor chips 26 are to be disposed, inside where lead areas 62 are disposed, and outside one side where lead areas 62 are not disposed. Thermosetting resin 22 is also applied between each of the four sides of the outer periphery of the wafer and circuit board 21. Note that the application pattern of thermosetting resin 22 shown in FIG. 17 is just an example, and other application patterns, such as solid application, may also be used.

[0131] In step S73, the heat dissipation sheet 24 is placed in close contact with the circuit board 21 on which the thermosetting resin 22 has been applied, and is then heated to cure the thermosetting resin 22. The heat dissipation sheet 24 has a shape that opens the lead region 62. Focusing on one circuit board 21, the heat dissipation sheet 24 is attached to the circuit board 21, covering the four sides (periphery) of the circuit board 21, the central region, and the region connecting the center to the peripheral region (the region on the lower side in the figure).

[0132] In step S74, molding is performed using a mold that protects the area including the area where the semiconductor chip 26 is arranged and the area where the lead area 62 is provided, and a part of the heat dissipation sheet 24 so that the molding resin 122 is not poured into it.

[0133] In step S75 (FIG. 18), die bonding is performed. In step S75, thermosetting resin 25 is applied to the entire area of ​​heat dissipation sheet 24 where semiconductor chip 26 is to be placed, and semiconductor chip 26 is mounted on heat dissipation sheet 24 by being closely attached to the area where thermosetting resin 25 is applied, and then heat treatment is performed to thermally harden thermosetting resin 25. By this die bonding process, semiconductor chip 26 is fixed on heat dissipation sheet 24.

[0134] In step S76, wires 29 are formed between the circuit board 21 and the semiconductor chip 26 by wire bonding, electrically connecting the circuit board 21 and the semiconductor chip 26. After wire bonding, a glass holding portion 121 is formed on the molding resin 122.

[0135] In step S77, the glass substrate 28 is bonded onto the formed glass holding portion 121.

[0136] In step S78, the semiconductor packages 10c are singulated. In the horizontal direction in the figure, cutting is performed along cut line C1, and then cutting is performed along cut line C2. Singulation is performed by performing two cuts in this manner. The reason for performing two cuts has been explained with reference to step S38 (FIG. 12) and FIG. 13, so further explanation will be omitted here. Alternatively, a process can be applied in which singulation is performed with a single cut.

[0137] Through these steps, the semiconductor package 10c shown in Fig. 16 is manufactured. Note that the manufacturing steps shown here are just an example, and cases where the steps are rearranged or other steps are added are also within the scope of application of the present technology.

[0138] By manufacturing the semiconductor package 10c as described above and mounting it on a heat dissipation member or housing inside an imaging device (camera), it is possible to realize a small, lightweight package with high heat dissipation properties while maintaining the optical precision required for a camera.

[0139] This technology makes it possible to realize a semiconductor package that is small, lightweight, and has high heat dissipation properties, which can prevent warping of the semiconductor chip 26 and the circuit board 21 on which the semiconductor chip 26 is mounted due to temperature changes. Furthermore, by using graphite, for example, for the heat dissipation sheet, the graphite can attenuate electromagnetic waves from the circuit board 21, thereby reducing electromagnetic noise generated between the semiconductor chip 26 and the circuit board 21.

[0140] <Regarding Another Method of Manufacturing Semiconductor Package 10c> Another method of manufacturing the semiconductor package 10c shown in Figure 16 will be described with reference to Figures 19 and 20. The method of manufacturing the semiconductor package 10c described with reference to Figures 19 and 20 differs from the method of manufacturing the semiconductor package 10c described with reference to Figures 17 and 18 in that the lead regions 62 provided on the circuit board 21 are provided on all four sides, and because the lead regions 62 are provided on all four sides, the shape of the heat dissipation sheet 24 that is attached is different; however, the basic flow of the manufacturing process is the same. Descriptions of the same processes will be omitted where appropriate.

[0141] In step S91, an organic assembly substrate is prepared, in which a plurality of circuit boards 21 are formed on a single wafer. The example shown in Fig. 19 shows an example in which 12 circuit boards 21 are arranged in a 3 x 4 arrangement on a single wafer. The example shown in Fig. 19 shows an example in which each circuit board 21 has lead regions 62 on each of its four sides. This configuration is similar to that of the semiconductor package 10a in the first embodiment.

[0142] In step S92, thermosetting resin 22 is applied onto circuit board 21. As shown in step S92, thermosetting resin 22 is applied in a rectangular shape at the position where semiconductor chip 26 is to be disposed, inside where lead region 62 is disposed. Thermosetting resin 22 is also applied between each of the four sides of the outer periphery of the wafer and circuit board 21. Note that the application pattern of thermosetting resin 22 shown in Figure 19 is just one example, and other application patterns may be used, such as solid application.

[0143] In step S93, the heat dissipation sheet 24 is brought into close contact with the circuit board 21 on which the thermosetting resin 22 has been applied, and heating is performed to harden the thermosetting resin 22. The heat dissipation sheet 24 has a shape in which the lead regions 62 are opened. In the example shown in FIG. 19 , four lead regions 62 are provided, and therefore a heat dissipation sheet 24 with four openings is attached to the circuit board 21. The heat dissipation sheet 24 attached to one circuit board 21 has the same shape as the heat dissipation sheet 24 in the first embodiment, for example, the heat dissipation sheet 24 described with reference to FIGS. 2 to 4 . That is, the heat dissipation sheet 24 has connection portions 53, each having a curved portion 71 and a straight portion 72, at its four corners.

[0144] In addition, the shape of the heat dissipation sheet 24 to be attached to the circuit board 21 in step S73 described with reference to Figure 17 can also be a heat dissipation sheet 24 having connection portions 53 formed on the upper left and upper right.

[0145] Whether to use the heat dissipation sheet 24 shown in Figure 17 or the heat dissipation sheet 24 shown in Figure 19 depends on the number and positions of the lead areas 62 provided on the circuit board 21, but the choice of which to use can also be made depending on whether heat dissipation performance or stress relaxation performance is given priority.

[0146] Molding is performed in step S94. The processes from step S94 onwards are basically the same as those from step S74 (FIG. 18) onwards, and therefore a description thereof will be omitted.

[0147] Through these steps, the semiconductor package 10c shown in Fig. 16 is manufactured. Note that the manufacturing steps shown here are just an example, and cases where the steps are rearranged or other steps are added are also within the scope of application of the present technology.

[0148] By manufacturing the semiconductor package 10c as described above and mounting it on a heat dissipation member or housing inside an imaging device (camera), it is possible to realize a small, lightweight package with high heat dissipation properties while maintaining the optical precision required for a camera.

[0149] This technology makes it possible to realize a semiconductor package that is small, lightweight, and has high heat dissipation properties, which can prevent warping of the semiconductor chip 26 and the circuit board 21 on which the semiconductor chip 26 is mounted due to temperature changes. Furthermore, by using graphite, for example, for the heat dissipation sheet, the graphite can attenuate electromagnetic waves from the circuit board 21, thereby reducing electromagnetic noise generated between the semiconductor chip 26 and the circuit board 21.

[0150] 21 and 22 are diagrams showing a configuration example of a semiconductor package according to a fourth embodiment to which the present technology is applied. The semiconductor package 10 according to the fourth embodiment, which will be described with reference to FIGS. 21 and 22, will be referred to as a semiconductor package 10d.

[0151] As shown in FIG. 21, the semiconductor package 10d of the fourth embodiment differs from the semiconductor package 10 of the first to third embodiments in that a circuit board 21 is used in which a heat dissipation sheet 141 made of a resin material with low elasticity and high thermal conductivity is patterned on the surface of the circuit board 21 on an organic assembly substrate prepared at the time of manufacture.

[0152] 21 shows an organic assembly substrate (wafer) prepared during manufacturing, for example, in step S31 (FIG. 11). A plurality of circuit boards 21 are formed on the organic assembly substrate. A heat dissipation sheet 141 made of a resin material with low elasticity and high thermal conductivity is formed on the surface of the plurality of circuit boards 21 (the outermost surface of the organic assembly substrate). The heat dissipation sheet 141 has the functions of the thermosetting resin 22 and the heat dissipation sheet 24 provided in the semiconductor package 10 in the first to third embodiments. That is, the heat dissipation sheet 141 is formed of a resin material that has the stress-relieving function of the thermosetting resin 22 and the efficient heat dissipation function of the heat dissipation sheet 24.

[0153] In Figure 21, a circuit board 21 having four lead areas 62 is used as an example, but the fourth embodiment can also be applied to a circuit board 21 having three, two, or one lead areas 62.

[0154] A semiconductor package 10d manufactured using the circuit board 21 shown in Fig. 21 has a cross-sectional configuration as shown in Fig. 22. Fig. 22 is a schematic cross-sectional view of the semiconductor package 10d. In Fig. 22, the semiconductor package 10d houses and packages a semiconductor chip 26 serving as an image sensor.

[0155] A heat dissipation sheet 141 made of a resin material with low elasticity and high thermal conductivity is disposed on the circuit board 21 of the semiconductor package 10. A semiconductor chip 26 is disposed on the upper surface of the heat dissipation sheet 141 with a thermosetting resin 25 interposed therebetween.

[0156] The heat dissipation sheet 141 is fixed in a sandwiched state between the circuit board 21 and the semiconductor chip 26. The heat dissipation sheet 141 absorbs heat generated by the semiconductor chip 26, conducts it, and releases it to the outside of the semiconductor package 10d. The heat dissipation sheet 141 is pulled out in a planar direction (toward the right in FIG. 22 ) to the outside of the semiconductor package 10d, and the heat dissipation member is connected to a housing (not shown). The direction in which the heat dissipation sheet 141 is pulled out can be changed as appropriate to suit the structure of a camera or the like in which the semiconductor package 10d is mounted. The heat dissipation sheet 141 may be pulled out from multiple locations, rather than just one location.

[0157] The electrodes of the semiconductor chip 26 and the electrodes of the circuit board 21 are connected by wires 29, and signals obtained by the semiconductor chip 26 are supplied to the circuit of the circuit board 21 for processing. The semiconductor package 10d shown in Fig. 22 has a configuration similar to that of the semiconductor package 10b shown in Fig. 9, and the wires 29 are enclosed in the glass holding portion 101 and the molded resin 102. Although not shown, it may also have a configuration similar to that of the semiconductor package 10c shown in Fig. 16, and the wires 29 may be positioned in spaces provided on the side surfaces of the semiconductor chip 26 and the molded resin 122.

[0158] A thermosetting resin 25 is provided between the heat dissipation sheet 141 and the semiconductor chip 26. The thermosetting resin 25 functions as an adhesive that bonds the heat dissipation sheet 141 and the semiconductor chip 26, and also has the function of efficiently conducting heat generated in the semiconductor chip 26 to the heat dissipation sheet 141. Note that the thermosetting resin 25 may be omitted, and the heat dissipation sheet 141 may be configured to be directly bonded to the semiconductor chip 26.

[0159] The semiconductor chip 26 is surrounded by a mold resin 102, and the semiconductor chip 26 is contained within the space surrounded by the mold resin 102. A glass holding portion 101 is provided inside the mold resin 102, and the glass substrate 28 is held by this glass holding portion 101.

[0160] The glass holding part 101 is provided in the peripheral region of the semiconductor chip 26, in other words, in a region where the imaging element of the semiconductor chip 26 is not provided. The glass substrate 28 is disposed on the glass holding part 101. The imaging element of the semiconductor chip 26 is sealed by the semiconductor chip 26, the glass holding part 101, and the glass substrate 28.

[0161] Molded resin 102 is provided on the outside of semiconductor chip 26, and the molded resin 102 located on the left side of the figure is provided on circuit board 21, while the molded resin 102 located on the right side of the figure is provided on heat dissipation sheet 141. Semiconductor chip 26 is sealed by circuit board 21, molded resin 102, and glass substrate 28.

[0162] In the example shown in Figure 21, the heat dissipation sheet 141 is formed in an area other than the lead area 62 on the circuit board 21, but it may also be formed in a part of the area other than the lead area 62 on the circuit board 21.

[0163] 21 and 22 have been described with reference to an example in which the heat dissipation sheet 141 is formed on the outermost surface of the circuit board 21, but a layer other than the heat dissipation sheet 141 may be formed on the outermost surface of the circuit board 21, with the heat dissipation sheet 141 formed below that layer. For example, this can also be applied to the hollow semiconductor package 10c shown in FIG. 16. It is also possible to form the heat dissipation sheet 141 on the outermost surface of the circuit board 21, or to form the heat dissipation sheet 141 on the back surface of the semiconductor chip 26.

[0164] According to the present technology, it is possible to realize a semiconductor package that is small, lightweight, and has high heat dissipation properties, and that can prevent the semiconductor chip 26 and the circuit board 21 on which the semiconductor chip 26 is mounted from warping due to temperature changes.

[0165] <Regarding Connection to Housing> The semiconductor packages 10a to 10d in the first to fourth embodiments are configured so that a portion of the heat dissipation sheet 24 (heat dissipation sheet 141) is exposed to the outside of the semiconductor package 10. This exposed portion is connected to the housing in which the semiconductor package 10 is installed, so that heat from the semiconductor package 10 is transferred to the housing.

[0166] 23 is a diagram illustrating an example of a connection between a housing and a semiconductor package 10 installed in the housing. The semiconductor package 10 is installed in a housing 201. A heat dissipation sheet 221 of the same type as the heat dissipation sheet 24 is connected to an exposed portion of the semiconductor package 10. One end of the heat dissipation sheet 221 is connected to the heat dissipation sheet 24 of the semiconductor package 10, and the other end is connected to a part of the housing 201.

[0167] The heat dissipation sheet 24 and the heat dissipation sheet 221 may be made of different materials. The heat dissipation sheet 221 may be in the shape of a plate or a line, instead of a sheet.

[0168] With this configuration, heat generated within the semiconductor package 10 is transferred to the heat dissipation sheet 221 via the heat dissipation sheet 24, and then transferred to the housing 201 via the heat dissipation sheet 221, and can be dissipated from the housing 201 to the outside of the housing 201.

[0169] In this way, according to the present technology, it is possible to realize a semiconductor package that is small, lightweight, and has high heat dissipation properties, and that can prevent the semiconductor chip 26 and the circuit board 21 on which the semiconductor chip 26 is mounted from warping due to temperature changes.

[0170] <Application Example to Endoscopic Surgery System> The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

[0171] FIG. 24 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (the present technology) can be applied.

[0172] 24 shows an operator (doctor) 11131 performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 is composed of an endoscope 11100, other surgical tools 11110 such as an insufflation tube 11111 and an energy treatment tool 11112, a support arm device 11120 that supports the endoscope 11100, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0173] The endoscope 11100 is composed of a lens barrel 11101, a region of a predetermined length from the tip of which is inserted into a body cavity of a patient 11132, and a camera head 11102 connected to the base end of the lens barrel 11101. In the example shown, the endoscope 11100 is configured as a so-called rigid scope having a rigid lens barrel 11101, but the endoscope 11100 may also be configured as a so-called flexible scope having a flexible lens barrel.

[0174] An opening into which an objective lens is fitted is provided at the tip of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 11101, and is irradiated via the objective lens toward an object to be observed inside the body cavity of the patient 11132. The endoscope 11100 may be a direct-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0175] An optical system and an image sensor are provided inside the camera head 11102, and light reflected from the object of observation (observation light) is collected onto the image sensor by the optical system. The observation light is photoelectrically converted by the image sensor to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. The image signal is sent to a camera control unit (CCU) 11201 as RAW data.

[0176] The CCU 11201 is configured with a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and comprehensively controls the operations of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102 and performs various types of image processing on the image signal, such as development processing (demosaic processing), to display an image based on the image signal.

[0177] Under the control of the CCU 11201, the display device 11202 displays an image based on an image signal that has been subjected to image processing by the CCU 11201.

[0178] The light source device 11203 is composed of a light source such as an LED (light emitting diode), and supplies irradiation light to the endoscope 11100 when photographing the surgical site, etc.

[0179] The input device 11204 is an input interface for the endoscopic surgery system 11000. A user can input various information and instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (type of irradiation light, magnification, focal length, etc.) of the endoscope 11100.

[0180] The treatment tool control device 11205 controls the driving of the energy treatment tool 11112 for cauterizing tissue, incising, sealing blood vessels, etc. The insufflation device 11206 inflates the body cavity of the patient 11132 through the insufflation tube 11111 in order to ensure a clear field of view for the endoscope 11100 and a working space for the surgeon. The recorder 11207 is a device capable of recording various types of information related to the surgery. The printer 11208 is a device capable of printing various types of information related to the surgery in various formats such as text, images, or graphs.

[0181] The light source device 11203, which supplies illumination light to the endoscope 11100 when photographing the surgical site, can be configured from a white light source, such as an LED, a laser light source, or a combination of these. When the white light source is configured from a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, allowing the light source device 11203 to adjust the white balance of the captured image. In this case, it is also possible to time-share images corresponding to each RGB by irradiating the object of observation with laser light from each RGB laser light source and controlling the drive of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, color images can be obtained without providing a color filter to the image sensor.

[0182] Furthermore, the light source device 11203 may be controlled to change the intensity of light it outputs at predetermined time intervals. By controlling the driving of the image sensor of the camera head 11102 in synchronization with the timing of the change in light intensity to acquire images in a time-division manner and combining the images, it is possible to generate an image with a high dynamic range that is free from so-called blocked-up shadows and blown-out highlights.

[0183] The light source device 11203 may also be configured to supply light in a predetermined wavelength band corresponding to special light observation. Special light observation, for example, utilizes the wavelength dependence of light absorption in body tissues to irradiate light with a narrower band than the light irradiated during normal observation (i.e., white light), thereby capturing high-contrast images of specific tissues, such as blood vessels on the surface of mucous membranes, known as narrow-band imaging. Alternatively, special light observation may involve fluorescence observation, in which images are obtained using fluorescence generated by irradiating excitation light. Fluorescence observation may involve irradiating excitation light onto body tissues and observing the fluorescence from the tissue (autofluorescence observation), or by locally injecting a reagent such as indocyanine green (ICG) into the body tissue and irradiating the tissue with excitation light corresponding to the fluorescent wavelength of the reagent to obtain a fluorescent image. The light source device 11203 may be configured to supply narrow-band light and / or excitation light corresponding to such special light observation.

[0184] FIG. 25 is a block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown in FIG.

[0185] The camera head 11102 has a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 has a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other via a transmission cable 11400 so that they can communicate with each other.

[0186] The lens unit 11401 is an optical system provided at the connection portion with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and enters the lens unit 11401. The lens unit 11401 is composed of a combination of multiple lenses including a zoom lens and a focus lens.

[0187] The imaging unit 11402 may include one imaging element (a so-called single-chip type) or multiple imaging elements (a so-called multi-chip type). When the imaging unit 11402 is configured as a multi-chip type, for example, each imaging element may generate an image signal corresponding to each of RGB, and a color image may be obtained by combining these signals. Alternatively, the imaging unit 11402 may be configured to have a pair of imaging elements for acquiring image signals for the right eye and the left eye corresponding to a 3D (dimensional) display. The 3D display allows the surgeon 11131 to more accurately grasp the depth of the biological tissue at the surgical site. Note that when the imaging unit 11402 is configured as a multi-chip type, multiple lens units 11401 may be provided corresponding to each imaging element.

[0188] Furthermore, the imaging unit 11402 does not necessarily have to be provided in the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101, immediately after the objective lens.

[0189] The driving unit 11403 is configured by an actuator, and moves the zoom lens and focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. This allows the magnification and focus of the image captured by the imaging unit 11402 to be adjusted appropriately.

[0190] The communication unit 11404 is configured by a communication device for transmitting and receiving various types of information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 to the CCU 11201 via the transmission cable 11400 as RAW data.

[0191] Furthermore, the communication unit 11404 receives a control signal for controlling the driving of the camera head 11102 from the CCU 11201 and supplies the control signal to the camera head control unit 11405. The control signal includes information on the imaging conditions, such as information specifying the frame rate of the captured image, information specifying the exposure value at the time of imaging, and / or information specifying the magnification and focus of the captured image.

[0192] The image capturing conditions such as the frame rate, exposure value, magnification, and focus may be appropriately specified by the user, or may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. In the latter case, the endoscope 11100 is equipped with a so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function.

[0193] The camera head control unit 11405 controls the driving of the camera head 11102 based on a control signal received from the CCU 11201 via the communication unit 11404 .

[0194] The communication unit 11411 is configured by a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

[0195] Furthermore, the communication unit 11411 transmits to the camera head 11102 a control signal for controlling the driving of the camera head 11102. The image signal and the control signal can be transmitted by electrical communication, optical communication, or the like.

[0196] The image processing unit 11412 performs various image processing operations on the image signal, which is RAW data transmitted from the camera head 11102 .

[0197] The control unit 11413 performs various controls related to the imaging of the surgical site, etc. by the endoscope 11100 and the display of the captured image obtained by imaging the surgical site, etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera head 11102.

[0198] Furthermore, the control unit 11413 displays the captured image showing the surgical site, etc., on the display device 11202 based on the image signal subjected to image processing by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition technologies. For example, the control unit 11413 can recognize surgical tools such as forceps, specific biological parts, bleeding, mist generated when using the energy treatment tool 11112, etc., by detecting the shape and color of the edges of objects included in the captured image. When displaying the captured image on the display device 11202, the control unit 11413 may use the recognition results to superimpose various surgical support information on the image of the surgical site. By superimposing the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced and the surgeon 11131 can proceed with the surgery reliably.

[0199] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable for electrical signal communication, an optical fiber for optical communication, or a composite cable of these.

[0200] In the illustrated example, communication is performed wired using a transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may also be performed wirelessly.

[0201] <Application to a Mobile Body> The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0202] FIG. 26 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0203] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 26, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (Interface) 12053.

[0204] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0205] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0206] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc. based on the received images.

[0207] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0208] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0209] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the distance between vehicles, maintaining vehicle speed, vehicle collision warning, vehicle lane departure warning, etc.

[0210] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0211] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12030 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0212] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying the passengers of the vehicle or the outside of the vehicle of information. In the example of Fig. 26, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0213] FIG. 27 is a diagram showing an example of the installation position of the imaging unit 12031.

[0214] In FIG. 27, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0215] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided on the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0216] 27 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0217] At least one of the image capturing units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image capturing units 12101 to 12104 may be a stereo camera made up of multiple image capturing elements, or may be an image capturing element having pixels for phase difference detection.

[0218] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation.

[0219] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines a collision risk that indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0220] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the images captured by the image capturing units 12101 to 12104. Such pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104 as infrared cameras and performing pattern matching on a series of feature points that indicate the outline of an object to determine whether the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0221] In this specification, a system refers to an entire device made up of multiple devices.

[0222] The effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0223] It should be noted that the embodiments of the present technology are not limited to the above-described embodiments, and various modifications are possible within the scope of the present technology.

[0224] The present technology can also be configured as follows. (1) A semiconductor package comprising: a sheet formed of a thermally conductive material; a semiconductor chip disposed on an upper surface of the sheet, the semiconductor chip having a pixel array section with photoelectric conversion elements and a peripheral circuit section; and a circuit board disposed on a lower surface of the sheet for processing signals from the semiconductor chip, wherein the sheet comprises: gaps in which wires connecting electrodes of the semiconductor chip to electrodes of the circuit board are routed; a first region in which the semiconductor chip is disposed; a second region surrounding the first region via the gap; a connection portion connecting the first region and the second region; and a third region connected to the second region and at least a portion of which is disposed outside the package. (2) The semiconductor package according to (1), wherein at least a portion of the connection portion is curved or bent. (3) The semiconductor package according to (1) or (2), wherein the connection portion comprises a linear portion and a curved portion having a predetermined width. (4) The semiconductor package according to any one of (1) to (3), wherein the connecting portion includes a linear portion having a predetermined width and a curved portion. (5) The semiconductor package according to any one of (1) to (4), wherein the third region is provided on at least one of the first to fourth sides of the second region formed in a rectangular shape. (6) The semiconductor package according to any one of (1) to (5), wherein the connecting portion is provided at a position connecting each of the four corners of the first region and the four corners of the second region. (7) The semiconductor package according to (6), wherein the connecting portion is also provided in the gap. (8) The semiconductor package according to any one of (1) to (7), wherein the sheet is a graphite sheet. (9) The semiconductor package according to any one of (1) to (7), wherein the sheet is a sheet containing metal or ceramic. (10) The semiconductor package according to any one of (1) to (9), further comprising: a first adhesive for bonding the sheet and the semiconductor chip; and a second adhesive for bonding the sheet and the circuit board, wherein the first adhesive and the second adhesive are thermosetting resins having different properties.(11) The semiconductor package according to (10), wherein the first adhesive is a resin with a high elastic modulus, and the second adhesive is a resin with a lower elastic modulus than the first adhesive. (12) The semiconductor package according to (10) or (11), wherein the first adhesive is applied to the entire region on the upper surface of the first region where the semiconductor chip is to be placed, and the second adhesive is applied to a portion on the lower surface of the first region. (13) The semiconductor package according to any of (1) to (12), wherein the semiconductor chip is a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. (14) The semiconductor package according to any of (1) to (13), further comprising: a frame; and a glass substrate placed on the frame, wherein the frame is placed on the upper surface of the second region, and the semiconductor chip is sealed by the circuit board, the frame, and the glass substrate. (15) The semiconductor package according to any one of (1) to (14), further comprising: a molding resin; a glass holding portion; and a glass substrate disposed on the glass holding portion, wherein the semiconductor chip is sealed by the circuit board, the molding resin, and the glass substrate. (16) The semiconductor package according to (15), wherein the wire is contained within the molding resin and the glass holding portion. (17) The semiconductor package according to (15), wherein the wire is disposed in a space between the molding resin and the semiconductor chip.(18) An electronic device comprising a semiconductor package comprising: a sheet formed of a material with high thermal conductivity; a semiconductor chip arranged on the upper surface of the sheet and having a pixel array section with photoelectric conversion elements and a peripheral circuit section; and a circuit board arranged on the lower surface of the sheet and processing signals from the semiconductor chip, wherein the sheet comprises: gaps in which wires are arranged to connect electrodes of the semiconductor chip to electrodes of the circuit board; a first region in which the semiconductor chip is arranged; a second region surrounding the first region via the gap; a connection section connecting the first region and the second region; and a third region connected to the second region and at least a portion of which is arranged outside the package. (19) A manufacturing method including: adhering the semiconductor chip with a first adhesive to an upper surface of a sheet having: gaps through which wires connecting electrodes of the semiconductor chip to electrodes of a circuit board are routed; a first region in which the semiconductor chip is disposed; a second region surrounding the first region via the gap; a connection portion connecting the first region and the second region; and a third region connected to the second region, at least a portion of which is disposed outside the package; and adhering the circuit board with a second adhesive having a lower elastic modulus than the first adhesive to a lower surface of the sheet.

[0225] REFERENCE SIGNS LIST 1 semiconductor package, 21 circuit board, 22 thermosetting resin, 23 adhesive, 24 heat dissipation sheet, 25 thermosetting resin, 26 semiconductor chip, 27 frame, 28 glass substrate, 29 wire, 51 center portion, 52 peripheral portion, 53 connection portion, 54 lead-out portion, 55 gap, 61 inner lead, 71 curved portion, 72 straight portion, 101 glass holding portion, 102 molded resin, 121 glass holding portion, 122 molded resin, 141 heat dissipation sheet, 201 housing, 221 heat dissipation sheet

Claims

1. A semiconductor package comprising: a sheet formed of a thermally conductive material; a semiconductor chip arranged on an upper surface of the sheet, the semiconductor chip having a pixel array section having photoelectric conversion elements and a peripheral circuit section; and a circuit board arranged on the lower surface of the sheet for processing signals from the semiconductor chip, wherein the sheet comprises: gaps in which wires are arranged to connect electrodes of the semiconductor chip to electrodes of the circuit board; a first region in which the semiconductor chip is arranged; a second region surrounding the first region via the gaps; a connection section connecting the first region and the second region; and a third region connected to the second region, at least a portion of which is arranged outside the package.

2. The semiconductor package according to claim 1, wherein the connection portion is at least partially curved or bent.

3. The semiconductor package according to claim 1, wherein the connecting portion has a straight portion having a predetermined width and a curved portion.

4. The semiconductor package according to claim 1, wherein the connecting portion has a straight portion having a predetermined width and a bent portion.

5. The semiconductor package according to claim 1, wherein the third region is provided on at least one of the first to fourth sides of the second region formed in a rectangular shape.

6. The semiconductor package according to claim 1, wherein the connection portions are provided at positions that connect the four corners of the first region and the four corners of the second region, respectively.

7. The semiconductor package according to claim 6, wherein the connection portion is also provided in the gap.

8. The semiconductor package according to claim 1, wherein the sheet is a graphite sheet.

9. The semiconductor package according to claim 1, wherein the sheet is a sheet containing metal or ceramic.

10. The semiconductor package according to claim 1, further comprising: a first adhesive for bonding the sheet and the semiconductor chip; and a second adhesive for bonding the sheet and the circuit board, wherein the first adhesive and the second adhesive are thermosetting resins having different properties.

11. The semiconductor package according to claim 10, wherein the first adhesive is a resin having a high elastic modulus, and the second adhesive is a resin having a lower elastic modulus than that of the first adhesive.

12. The semiconductor package according to claim 10, wherein the first adhesive is applied to the entire area on the upper surface side of the first region in which the semiconductor chip is disposed, and the second adhesive is applied to a portion of the lower surface side of the first region.

13. The semiconductor package according to claim 1, wherein the semiconductor chip is a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor.

14. The semiconductor package according to claim 1, further comprising: a frame; and a glass substrate disposed on the frame, the frame being disposed on an upper surface side of the second region, and the semiconductor chip being sealed by the circuit board, the frame, and the glass substrate.

15. The semiconductor package according to claim 1, further comprising: a molding resin; a glass holding portion; and a glass substrate arranged on said glass holding portion, wherein said semiconductor chip is sealed by said circuit board, said molding resin, and said glass substrate.

16. The semiconductor package according to claim 15, wherein the wire is enclosed within the molding resin and the glass holding portion.

17. The semiconductor package according to claim 15, wherein the wires are disposed in a space between the molding resin and the semiconductor chip.

18. An electronic device comprising: a sheet formed of a material with high thermal conductivity; a semiconductor chip arranged on the upper surface of the sheet, the semiconductor chip having a pixel array section having photoelectric conversion elements and a peripheral circuit section; and a circuit board arranged on the lower surface of the sheet for processing signals from the semiconductor chip, wherein the sheet comprises: a gap in which a wire is arranged to connect an electrode of the semiconductor chip to an electrode of the circuit board; a first region in which the semiconductor chip is arranged; a second region surrounding the first region via the gap; a connection section connecting the first region and the second region; and a third region connected to the second region, at least a portion of which is arranged outside the package.

19. A manufacturing method comprising: adhering the semiconductor chip with a first adhesive to an upper surface side of a sheet having: a gap through which wires connecting electrodes of the semiconductor chip to electrodes of a circuit board are routed, a first region in which the semiconductor chip is disposed, a second region surrounding the first region via the gap, a connection portion connecting the first region and the second region, and a third region connected to the second region and at least a portion of which is disposed outside the package; and adhering the circuit board to the lower surface side of the sheet with a second adhesive having a lower elastic modulus than the first adhesive.

Images