Terminal device

Abstract

A terminal device, comprising: a housing, a circuit board, a heat generating device, an air passage, a heat dissipation member, and a fan apparatus. The housing is provided with an air inlet hole and an air outlet hole. The circuit board is arranged in the housing; the heat generating device is arranged on the circuit board; the air passage is arranged between the housing and the circuit board; the air passage comprises an air inlet and an air outlet; the air inlet is communicated with the air inlet hole; and the air outlet is communicated with the air outlet hole. The heat dissipation member is arranged in a position in the air passage close to the air outlet, and is used for receiving heat conducted by the heat generating device. The fan apparatus is arranged in a position in the air passage close to the air inlet, and is used for guiding airflow to the heat dissipation member, so as to use the airflow to dissipate the heat of the heat dissipation member to the outside of the housing through the air outlet and the air outlet hole in sequence. In the present application, by providing a heat dissipation system comprising the heat dissipation member, the fan apparatus, the air passage, etc. inside the terminal device, active heat dissipation can be realized, so as to achieve the objective of efficiently cooling the heat generating device, so that the terminal device can obtain good performance when operating in a high-load scenario.

Description

terminal equipment

[0001] This invention claims priority to the Chinese patent application filed with the State Intellectual Property Office on December 8, 2023, with application number 202311687758.2 and application name “Terminal Device,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic products, and in particular to a terminal device. Background Art

[0003] With the rapid development of smartphone chip technology and the increasingly demanding performance requirements of third-party applications, mobile phones are shouldering increasing loads and facing increasingly serious overheating issues. Current technical solutions primarily rely on passive cooling, which primarily transfers heat from the phone's components to the phone's surface through conduction, where it then naturally exchanges heat with the air through convection. This results in low heat dissipation efficiency.

[0004] Summary of the Invention

[0005] In view of this, the present application provides a terminal device to improve the heat dissipation efficiency of the main heat-generating components in the terminal device through active heat dissipation.

[0006] An embodiment of the present application provides a terminal device, which includes: a shell, a circuit board, a heating device, an air duct, a heat sink and a fan device. The shell is provided with an air inlet and an air outlet. The circuit board is arranged in the shell. The heating device is arranged on the circuit board. The air duct is arranged between the shell and the circuit board, and the air duct includes an air inlet and an air outlet, the air inlet is connected to the air inlet, and the air outlet is connected to the air outlet. The heat sink is arranged in the air duct at a position close to the air outlet, for receiving the heat conducted by the heating device. The fan device is arranged in the air duct at a position close to the air inlet, for guiding airflow to the heat sink, so that the heat of the heat sink is dissipated to the outside of the shell through the air outlet and the air outlet in turn.

[0007] The terminal device provided in the embodiment of the present application can achieve active heat dissipation by setting up a heat dissipation system including heat dissipation parts, fan devices, air ducts, etc. inside the terminal device, so as to achieve the purpose of efficiently cooling the heating components, so that the terminal device can obtain good performance when operating in a high-load scenario, thereby improving the user experience.

[0008] In one possible design, at least a portion of the projection of the heating element along the thickness direction of the terminal device overlaps with the projection of the heat sink. By aligning at least a portion of the projection of the heating element along the thickness direction of the terminal device with the projection of the heat sink, the heat dissipation path between the heating element and the heat sink can be shortened, allowing most of the heat from the heating element to be quickly transferred to the heat sink and exchanged through the heat sink, thereby achieving rapid and efficient heat dissipation and cooling.

[0009] In one possible design, the terminal device also includes a first heat-conducting medium made of a flexible material, and the first heat-conducting medium is arranged between the circuit board and the air duct, and the heat of the heating device is sequentially conducted to the heat sink through the first heat-conducting medium and the side wall of the air duct. In particular, since the circuit board and the air duct are both made of hard materials, when the circuit board and the air duct are directly connected, it is difficult to ensure a tight connection between the circuit board and the air duct, and it is easy to generate a gap between the circuit board and the air duct, resulting in the heat not being effectively conducted to the heat sink in the air duct. To this end, in this embodiment, by adopting a first heat-conducting medium made of a flexible material, the first heat-conducting medium can be fully filled between the circuit board and the air duct through its own flexible deformation, and can ensure that there is no gap in the heat transfer path between the circuit board and the air duct, thereby improving the efficiency of heat conduction and further improving the heat dissipation efficiency.

[0010] In one possible design, the first heat-conducting medium is made of thermal gel or thermal grease. These materials have good thermal conductivity and are flexible enough to fully fill the gap between the circuit board and the air duct, eliminating gaps in the heat conduction path and improving heat dissipation efficiency.

[0011] In one possible design, the terminal device further includes an electromagnetic shielding component, which is disposed between the first heat-conducting medium and the circuit board. The electromagnetic shielding component is provided with a receiving groove, which is used to receive the components on the circuit board. At least part of the heat of the heating component is conducted to the heat sink through the electromagnetic shielding component, the first heat-conducting medium, and the side wall of the air duct in sequence. The electromagnetic shielding component can be a metal component, such as copper, aluminum, or other metals, which has an electromagnetic shielding function. Components that generate electromagnetic interference or components that are affected by electromagnetic interference can be covered in the receiving groove to isolate the electromagnetic interference through the receiving groove. In addition, since the electromagnetic shielding component is a metal component, that is, the electromagnetic shielding component and the air duct are both rigid components, if the electromagnetic shielding component is directly connected to the air duct, a gap is likely to be generated between the electromagnetic shielding component and the air duct, causing heat to be unable to be effectively conducted to the heat sink at the gap, thereby reducing the heat dissipation efficiency. To this end, in this embodiment, a first thermally conductive medium can be filled between the electromagnetic shielding element and the air duct. Leveraging its flexibility, the first thermally conductive medium can fully fill the gap between the electromagnetic shielding element and the air duct, eliminating any gaps. Furthermore, the metallic electromagnetic shielding element also exhibits excellent thermal conductivity, allowing heat generated by the heat-generating device to be efficiently transferred to the heat sink through the electromagnetic shielding element, the first thermally conductive medium, and the sidewalls of the air duct. The sidewalls of the air duct are intended to connect to the heat sink.

[0012] In a possible design, the electromagnetic shielding component includes a body and a cover plate, the body is arranged on the circuit board, the receiving groove is a through groove, and the through groove passes through the body along the thickness direction of the terminal device. The cover plate is snapped on the side of the body away from the circuit board to close the through groove, and the cover plate is connected to the air duct through the first heat-conducting medium. Among them, after the body is mounted on the circuit board, a second heat-conducting medium such as thermally conductive gel, thermally conductive silicone grease, etc. can also be injected into the through groove to achieve heat conduction of the components in the through groove. In this embodiment, since the cover plate can be snapped on the body to close the through groove, it is conducive to injecting thermally conductive gel with higher thermal conductivity into the through groove to improve the thermal conductivity, thereby improving the heat dissipation efficiency of the heat-generating component.

[0013] In one possible design, the electromagnetic shielding member is made of a heat-conducting metal, thereby achieving the electromagnetic shielding function and improving the heat exchange efficiency.

[0014] In one possible design, the terminal device further includes a second thermally conductive medium made of a flexible material, which is filled between the device in the receiving slot and the inner wall of the receiving slot. The second thermally conductive medium can leverage its flexibility to fully fill the gap between the heating device and the inner wall of the receiving slot, eliminating any gaps. This allows heat generated by the heating device in the receiving slot to be transferred sequentially through the second thermally conductive medium, the electromagnetic shielding element, the first thermally conductive medium, and the wall panels of the air duct to the heat sink, thereby improving heat dissipation efficiency.

[0015] In one possible design, the material of the second heat-conducting medium is thermal gel or thermal grease. These materials have good thermal conductivity and certain flexibility, and can fully fill the space between the circuit board and the air duct, eliminating gaps in the heat conduction path and improving heat dissipation efficiency.

[0016] In one possible design, along the thickness direction of the terminal device, at least a portion of the projections of the first heat-conducting medium and the electromagnetic shielding element overlap with the projections of the heat sink and the fan device. That is, the projections of the first heat-conducting medium and the electromagnetic shielding element in the thickness direction of the terminal device can simultaneously cover the heat sink and the fan device, allowing most of the heat generated by the heating device to be transferred sequentially through the electromagnetic shielding element and the first heat-conducting medium to the relatively nearby heat sink. At the same time, at least a portion of the heat generated by the heating device can also be transferred through the electromagnetic shielding element and the first heat-conducting medium to the relatively distant fan device, allowing the heat to be transferred to structures such as the blades of the fan device and exchange heat with the air through the fan device. This can further expand the heat dissipation area in contact with the air through the fan device, thereby improving heat dissipation efficiency.

[0017] In one possible design, the air duct includes an air inlet and an air outlet, the air inlet communicates with the air outlet, the fan device is disposed in the air inlet, and the heat sink is disposed in the air outlet. The fan device in the air inlet is relatively close to the air inlet of the air duct, enabling air outside the terminal device to be quickly introduced into the air duct through the air inlet, and to be blown toward the heat sink by the fan device to exchange heat with the heat sink. Since the heat sink is disposed in the air outlet and is relatively close to the air outlet of the air duct, the high-temperature air that has undergone heat exchange with the heat sink can be quickly output from the air outlet to the outside of the terminal device, thereby achieving efficient heat dissipation.

[0018] In one possible design, a heat averaging portion is provided on the air duct, and the heat averaging portion is provided on at least a portion of the air duct near the air outlet. The heat averaging portion has good heat conduction capability and a large heat dissipation area. When the lower temperature air input by the fan device exchanges heat with the heat sink, a portion of the high-temperature airflow that has undergone heat exchange can be output from the air outlet and the air outlet hole to the outside of the terminal device, while another portion of the hot airflow contacts the heat averaging portion for heat exchange. The heat averaging portion can diffuse heat into the nearby air and can further exchange heat with the air outside the terminal device through the housing, thereby dissipating the heat within the housing to the outside of the terminal device.

[0019] In one possible design, the heat equalizing part is a graphite layer, which has good thermal conductivity and can improve the efficiency of heat exchange with the hot air flow. At the same time, the graphite layer can be coated on the outer wall of the air duct and part of the inner wall close to the air outlet, which is convenient for processing on the air duct and can be flexibly set according to the actual heat dissipation position. At the same time, the graphite layer can have a smaller thickness, which is conducive to saving space.

[0020] In a possible design, the air duct is connected to the housing by adhesive bonding or by a connecting piece, thereby facilitating the connection between the air duct and the housing.

[0021] In a possible design, the air duct and the shell are integrally formed, that is, the structure of the air duct is integrally formed during the shell processing, thereby improving the structural strength and reliability of the air duct and the shell, and also facilitating production and manufacturing.

[0022] In a possible design, the heating device is arranged on a side of the circuit board facing away from the air duct.

[0023] In one possible design, the heat sink includes a plurality of metal fins, wherein the plurality of fins can be arranged at intervals, thereby greatly expanding the area in contact with the air, enabling efficient heat exchange and achieving the purpose of rapid and effective heat dissipation.

[0024] In one possible design, the housing includes a battery cover and a camera decoration. The camera decoration is arranged on the battery cover, the camera decoration protrudes from the outer wall of the battery cover, the interior of the camera decoration has an accommodation space, and at least a portion of the air duct is arranged in the accommodation space. The camera decoration protrudes from the outer wall of the battery cover and has an accommodation space inside, which can be used to accommodate a camera module, and at least a portion of the air duct can also be arranged in the accommodation space inside the camera decoration. The camera decoration protrudes from the surface of the battery cover, that is, the arrangement of the camera decoration limits the thickness of the entire terminal device, and at least a portion of the air duct can be arranged between the battery cover and the circuit board, and at least a portion of the air duct can also be accommodated in the accommodation space inside the camera decoration, so that part of the thickness of the air duct can be absorbed by the camera decoration, so that the air duct does not need to occupy additional Z-direction space of the entire device, which is conducive to the thin design of the terminal device.

[0025] In one possible design, the camera decorative component has a sidewall along a first direction, with the air inlet and the air outlet provided on the sidewall. The first direction is perpendicular to the thickness direction of the terminal device. Air inlets and air outlets can be provided at appropriate locations on the sidewall, and air inlets and air outlets can be provided at portions of the air duct extending into the camera decorative component. This allows the air inlet and air outlet to be close to or in contact with the air inlet and air outlet on the camera decorative component, respectively, thereby ensuring efficient air intake and exhaust, and thereby improving heat dissipation efficiency.

[0026] In one possible design, the heat generating device is a system on chip, a power management unit, or a UNIX file system.

[0027] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0029] FIG1 is a schematic diagram of the structure of a terminal device provided in an embodiment of the present application;

[0030] FIG2 is a partial cross-sectional view of a terminal device provided by the first embodiment of the present application from a side perspective;

[0031] FIG3 is a partial cross-sectional view of a terminal device provided in a second embodiment of the present application from a side perspective;

[0032] FIG4 is a partial cross-sectional view of a terminal device provided in an embodiment of the present application from a top view;

[0033] FIG5 is a partial cross-sectional view of a terminal device provided in a third embodiment of the present application from a side perspective;

[0034] FIG6 is a partial cross-sectional view of a terminal device provided in a fourth embodiment of the present application from a side perspective;

[0035] FIG7 is a partial cross-sectional view of a terminal device provided in a fifth embodiment of the present application from a side perspective;

[0036] FIG8 is a partial cross-sectional view of a terminal device provided in a sixth embodiment of the present application from a side perspective.

[0037] Figure numerals: 1-housing; 11-battery cover; 12-camera decoration; 13-air inlet; 14-air outlet; 2-circuit board; 3-air duct; 31-air inlet; 311-air inlet; 32-air outlet; 321-air outlet; 33-heat equalizing portion; 4-heat sink; 5-fan device; 6-heating device; 61-double rate synchronous dynamic random access memory; 7-first heat conducting medium; 8-second heat conducting medium; 9-electromagnetic shielding member; 91-body; 92-cover; Z-thickness direction; X-first direction. DETAILED DESCRIPTION

[0038] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0039] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0040] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0041] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0042] In the description of this application, unless otherwise specified or limited, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0043] With the rapid development of smartphone chip technology and the increasingly high performance requirements of third-party applications, mobile phones are shouldering increasingly higher loads and facing increasingly serious heating problems. The current technical solution is mainly passive heat dissipation, that is, heat is mainly transferred to the surface of the mobile phone through heat conduction between mobile phone components, and then naturally exchanged with the air through heat convection. For example, the heat dissipation path for the System-On-a-Chip (SOC) is mainly single-sided heat dissipation, that is, a vacuum cavity heat sink (VC) is used on the screen side for heat dissipation. The heat dissipation path is single and the heat dissipation efficiency is low. In addition, this heat dissipation method cannot achieve efficient heat dissipation in high-load operation scenarios such as gaming, camera recording, and video processing, which will cause the device to heat up seriously and affect the operating performance.

[0044] Embodiments of the present application provide a terminal device, which is also referred to as a terminal, user equipment (UE), mobile station, or mobile terminal. The terminal device can be widely used in various scenarios, such as D2D communication, V2X communication, machine-type communication (MTC), IoT, virtual reality, augmented reality, industrial control, autonomous driving, telemedicine, smart grid, smart furniture, smart office, smart wearable, smart transportation, or smart city. For example, the terminal device can be: a mobile phone, a computer, a mobile internet device (MID), a wearable device, a virtual reality (VR) device, an augmented reality (AR) device, a robotic arm, a camera, a robot, or a smart home device (such as a TV, air conditioner, vacuum cleaner, speaker, set-top box), a relay, or customer premise equipment (CPE).

[0045] The various terminal devices introduced above, if located on a vehicle (for example, placed / installed in a vehicle), can be considered as vehicle-mounted terminal devices. The vehicle-mounted terminal device can be an on-board module, on-board module, on-board component, on-board chip or on-board unit built into the vehicle as one or more components or units, and the vehicle can implement the method of the present application through the built-in on-board module, on-board module, on-board component, on-board chip or on-board unit. The on-board terminal device can be a complete vehicle device, an on-board module, a vehicle, an on-board unit (OBU), a roadside unit (RSU), a vehicle-mounted system (or a vehicle-mounted sending unit) (telematics box, T-box), a chip or a system on chip (SOC), etc. The above chip or SOC can be installed in a vehicle, OBU, RSU or T-box.

[0046] In the embodiments of the present application, the device for implementing the functions of the terminal device can be the terminal device itself, or a device capable of supporting the terminal device in implementing the functions, such as a chip system or a combination of devices or components capable of implementing the functions of the terminal device, which can be installed in the terminal device. The embodiments of the present application do not limit the specific technology and specific device form used by the terminal device.

[0047] Terminal equipment can also be referred to as terminal, terminal device, user equipment (UE), mobile station, mobile terminal, etc. Terminals can be widely used in various scenarios, such as device-to-device (D2D), vehicle to everything (V2X) communication, machine-type communication (MTC), Internet of Things (IOT), virtual reality, augmented reality, industrial control, autonomous driving, telemedicine, smart grid, smart furniture, smart office, smart wearable, smart transportation, smart city, etc. The terminal can be a mobile phone, tablet computer, computer with wireless transceiver function, wearable device, vehicle, drone, helicopter, airplane, ship, robot, robotic arm, smart home device, etc. The embodiments of this application do not limit the specific technology and specific device form adopted by the terminal. Figure 1 is a structural diagram of the terminal device provided in the embodiment of this application. Figure 1 exemplarily shows that the terminal device is a mobile phone, and the terminal device is described as a mobile phone.

[0048] FIG2 is a partial cross-sectional view of a terminal device provided by the first embodiment of the present application from a side perspective. Referring to FIG2 , the terminal device provided by the embodiment of the present application includes a housing 1, a circuit board 2, a heating device 6, an air duct 3, a heat sink 4, and a fan device 5. The housing 1 can be an exterior structural component of an electronic device. For example, when the terminal device is a mobile phone, the housing 1 can be the back shell or battery cover 11 of the mobile phone, or a combination of the battery cover 11 and the camera decorative component 12. The housing 1 has a large space that can be used to arrange components such as the circuit board 2, a battery, a speaker, and a camera.

[0049] The circuit board 2 may be a printed circuit board 2 (PCB), on which various devices may be integrated, and these devices may implement multiple functions of the terminal device. Some of these devices are heating devices 6, which generate a large amount of heat during operation. For example, the heating device 6 may be a system on a chip (SOC), a power management unit (PMU), or a UNIX file system (UFS), and may also be other devices with high heat generation. For ease of explanation, this application takes the heating device 6 as an SOC as an example for explanation.

[0050] The air duct 3 is a channel structure for guiding airflow. For example, the air duct 3 can be manufactured separately and installed in the housing 1 by gluing or assembling with connectors such as screws, thereby facilitating the separate disassembly, replacement, and maintenance of the air duct 3 and the components within it. For example, the air duct 3 can also be integrally formed with the housing 1, that is, the structure of the air duct 3 is integrally formed during the processing of the housing 1. This can improve the structural strength and reliability of the air duct 3 and the housing 1, while also facilitating manufacturing.

[0051] FIG3 is a partial cross-sectional view of a terminal device provided by the second embodiment of the present application from a side perspective. Referring to FIG3 , the air duct 3 provided in this embodiment is arranged between the housing 1 and the circuit board 2. The circuit board 2 and the heating device 6 on the circuit board 2 can conduct heat to the air duct 3. The air duct 3 includes an air inlet 311 and an air outlet 321. The housing 1 may be provided with an air inlet 13 and an air outlet 14. The air inlet 311 is connected to the air inlet 13 of the housing 1, and the air outlet 321 is connected to the air outlet 14 of the housing 1. The relatively low-temperature airflow outside the housing 1 can enter the air duct 3 from the air inlet 13 and the air inlet 311 in sequence, and can generate heat exchange with the relatively high-temperature airflow in the air duct 3, so that the hot airflow can be dissipated to the outside of the housing 1 through the air outlet 321 and the air outlet 14 in sequence. In one embodiment, the air duct 3 may include an air inlet duct 31 and an air outlet duct 32, wherein the air inlet duct 31 is connected to the air outlet duct 32. The fan device 5 may be disposed within the air inlet duct 31, and the heat sink 4 may be disposed within the air outlet duct 32. The fan device 5 within the air inlet duct 31 is relatively close to the air inlet of the air duct 3, enabling air from outside the terminal device to be quickly introduced into the air duct 3 through the air inlet 311. The fan device 5 may be blown toward the heat sink 4 by the fan device 5 to exchange heat with the heat sink 4. Since the heat sink 4 is disposed within the air outlet duct 32, the heat sink 4 is relatively close to the air outlet 321 of the air duct 3. This allows the high-temperature air that has undergone heat exchange with the heat sink 4 to be quickly output from the air outlet 321 to the outside of the terminal device, thereby achieving efficient heat dissipation. In one embodiment, the air duct 3 may be an integrally formed structure, i.e., the air inlet duct 31 and the air outlet duct 32 may be directly formed during the manufacturing process of the air duct 3, thereby ensuring the structural reliability of the air duct 3 and facilitating assembly of the air duct 3 in the terminal device.

[0052] Among them, Figure 4 is a partial cross-sectional view provided in an embodiment of the present application from a top view. Referring to Figure 4, the heat sink 4 has good thermal conductivity and can provide a large area for contact with the air to achieve rapid and effective heat exchange. The heat sink 4 can be a fin made of a metal material, and such a fin can have multiple fins, and the multiple fins can be arranged at intervals, thereby greatly expanding the area in contact with the air, enabling efficient heat exchange and achieving the purpose of rapid and effective heat dissipation. In this embodiment, the heat sink 4 is arranged in the air duct 3 at a position close to the air outlet 321. The heat generated by the heating device 6 can be conducted to the heat sink 4, and heat exchange is performed with the airflow with a lower temperature in the air duct 3 through the heat sink 4. Since the heat sink 4 is close to the air outlet 321, the heat can be quickly dissipated to the outside of the shell 1.

[0053] The fan device 5 can be a centrifugal fan, which can generate negative pressure in the surrounding area during operation. Since the centrifugal fan is close to the air inlet, the air with a relatively low temperature outside the shell 1 can be quickly guided into the air duct 3 and blown toward the heat sink 4, so that the airflow with a relatively low temperature can exchange heat with the heat sink 4 with a relatively high temperature, and can further blow the airflow with a higher temperature after heat exchange from the air outlet 321 and the air outlet 14 to the outside of the shell 1, thereby achieving the purpose of efficient heat dissipation and cooling of the heating device 6.

[0054] Therefore, the terminal device provided in the embodiment of the present application can realize active heat dissipation by setting up a heat dissipation system including a heat sink 4, a fan device 5, an air duct 3, etc. inside the terminal device, so as to achieve the purpose of efficiently cooling the heating device 6, so that the terminal device can obtain good performance when operating in a high-load scenario, thereby improving the user experience.

[0055] In one embodiment, referring to FIG3 , a heat averaging portion 33 may be provided on the air duct 3. The heat averaging portion 33 is provided on at least a portion of the air duct 3 close to the air outlet 321. The heat averaging portion 33 has good heat conduction capability and a large heat dissipation area. When the lower temperature air input by the fan device 5 undergoes heat exchange with the heat sink 4, a portion of the high-temperature airflow that has undergone heat exchange can be output to the outside of the terminal device through the air outlet 321 and the air outlet 14, while another portion of the hot airflow contacts the heat averaging portion 33 for heat exchange. The heat averaging portion 33 can diffuse heat into the nearby air and can further undergo heat exchange with the air outside the terminal device through the housing 1, thereby dissipating the heat in the housing 1 to the outside of the terminal device. That is to say, after the heat generated by the heating device 6 undergoes heat exchange with the heat sink 4, the high-temperature air formed by the heat exchange between the low-temperature air and the heat sink 4 can, on the one hand, diffuse to the outside of the terminal device through the air outlet 321 of the air duct 3 and the air outlet 14 of the shell 1; on the other hand, it can exchange heat with the heat equalizing part 33 and diffuse to the outside of the terminal device through the heat equalizing part 33 and the nearby shell 1, thereby improving the heat dissipation efficiency.

[0056] In one embodiment, the heat equalizing portion 33 can be a graphite layer, which has good thermal conductivity and can improve the efficiency of heat exchange with the hot air flow. At the same time, the graphite layer can be coated on the outer wall of the air duct 3 and part of the inner wall close to the air outlet 321, which is convenient for processing on the air duct 3 and can be flexibly set according to the actual heat dissipation position. At the same time, the graphite layer can have a smaller thickness, which is conducive to saving space.

[0057] In one embodiment, FIG5 is a partial cross-sectional view of a terminal device provided by the third embodiment of the present application from a side view. Referring to FIG5, the heating device 6 can be arranged on the side of the circuit board 2 away from the air duct 3. The heat generated by the heating device 6 can be conducted to the heat sink 4 through the circuit board 2 and the air duct 3 in sequence, and actively dissipated by the fan device 5. Among them, the heating device 6 and the air duct 3 are respectively located on both sides of the circuit board 2, which can provide a larger layout space for the air duct 3 on the circuit board 2. At the same time, through the above-mentioned active heat dissipation method, it is possible to ensure effective heat dissipation of the heating device 6 located on the other side of the circuit board 2, without having to reduce the thermal resistance by opening holes or thinning the circuit board 2 in a local position. In this way, active and efficient heat dissipation can be achieved without damaging the circuit board 2. Of course, in some other embodiments, FIG6 is a partial cross-sectional view of a terminal device provided by the fourth embodiment of the present application from a side view. Referring to FIG6, the heating device 6 can also be arranged on the side of the circuit board 2 facing the air duct 3. The heat generated by the heating device 6 does not need to pass through the circuit board 2, but can be conducted to the heat sink 4 through the wall of the air duct 3. In some other embodiments, referring to FIG. 2 , heating devices 6 may be provided on both sides of the circuit board 2 , which is not limited in this embodiment.

[0058] In one embodiment, for some terminal devices such as mobile phones and tablets, their housing 1 may include a battery cover 11 and a camera decorative member 12. The battery cover 11 is a cosmetic component on the back of the terminal device that can be directly touched by the user. The camera decorative member 12 can be positioned over the exterior of the camera module, serving as a protective component of the camera module. The camera decorative member 12 can be attached to the battery cover 11 by gluing or screwing. The camera decorative member 12 protrudes from the outer wall of the battery cover 11 and has an internal storage space for accommodating the camera module. At least a portion of the air duct 3 can also be disposed within the storage space within the camera decorative member 12. The camera decorative member 12 protrudes from the surface of the battery cover 11, and at least a portion of the air duct 3 can be disposed between the battery cover 11 and the circuit board 2. Furthermore, at least a portion of the air duct 3 can also be accommodated within the storage space within the camera decorative member 12. This eliminates the need for the air duct 3 to occupy additional Z-direction space within the entire device, facilitating a thinner design for the terminal device. The Z-direction is the thickness of the terminal device.

[0059] In one embodiment, the camera decorative member 12 has a sidewall along a first direction X, on which an air inlet 13 and an air outlet 14 are provided. The first direction X is perpendicular to the thickness direction Z of the terminal device. The camera decorative member 12 has a sidewall that protrudes from the outer wall of the battery cover 11 and forms an accommodation space therein. The sidewall can be provided with the air inlet 13 and the air outlet 14 at appropriate locations. The portion of the air duct 3 that extends into the camera decorative member 12 can be provided with an air inlet 311 and an air outlet 321, so that the air inlet 311 and the air outlet 321 are close to or in contact with the air inlet 13 and the air outlet 14 on the camera decorative member 12, respectively. This ensures efficient air intake and exhaust, thereby facilitating improved heat dissipation efficiency.

[0060] In one embodiment, referring to FIG3 , along the thickness direction Z of the terminal device, at least a portion of the projection of the heating device 6 overlaps with the projection of the heat sink 4. The heat sink 4 is a primary heat exchange component. By ensuring that at least a portion of the projection of the heating device 6 along the thickness direction Z of the terminal device overlaps with the projection of the heat sink 4, the heat dissipation path between the heating device 6 and the heat sink 4 can be shortened, allowing most of the heat from the heating device 6 to be quickly transferred to the heat sink 4 and heat exchanged through the heat sink 4, thereby achieving rapid and efficient heat dissipation and cooling.

[0061] In one embodiment, referring to FIG3 , the terminal device further includes a first heat-conducting medium 7 made of a flexible material. The first heat-conducting medium 7 is disposed between the circuit board 2 and the air duct 3. The heat of the heating device 6 is sequentially conducted to the heat sink 4 through the first heat-conducting medium 7 and the sidewalls of the air duct 3. Since both the circuit board 2 and the air duct 3 are made of hard materials, when the circuit board 2 and the air duct 3 are directly connected, it is difficult to ensure a tight connection between the circuit board 2 and the air duct 3. A gap is easily generated between the circuit board 2 and the air duct 3, resulting in heat not being effectively conducted to the heat sink 4 in the air duct 3. Therefore, in this embodiment, by using the first heat-conducting medium 7 made of a flexible material, the first heat-conducting medium 7 can be fully filled between the circuit board 2 and the air duct 3 through its own flexible deformation, ensuring that there is no gap in the heat transfer path between the circuit board 2 and the air duct 3, thereby improving the efficiency of heat conduction and further improving the heat dissipation efficiency.

[0062] In one embodiment, the material of the first heat-conducting medium 7 can be thermally conductive gel or thermally conductive silicone grease. These materials have good thermal conductivity and certain flexibility, and can be fully filled between the circuit board 2 and the air duct 3, eliminating gaps in the heat conduction path and improving heat dissipation efficiency.

[0063] The circuit board 2 contains numerous devices, which are densely integrated. The distances between some devices are small, making it easy for electromagnetic interference to occur, potentially affecting the normal operation of some devices. To this end, referring to FIG3 , in one embodiment, the terminal device provided in this embodiment further includes an electromagnetic shielding member 9 , which can be positioned over the heating element 6 . In one embodiment, the heating element 6 is positioned on the surface of the circuit board 2 facing the air duct 3 , and the electromagnetic shielding member 9 is positioned between the first thermal conductive medium 7 and the circuit board 2 . The electromagnetic shielding member 9 is provided with a receiving slot for accommodating some of the devices on the circuit board 2 , which can be heating devices 6 or non-heating devices. For the heating devices, at least a portion of the heat generated by the heating devices 6 is transferred to the heat sink 4 through the electromagnetic shielding member 9 , the first thermal conductive medium 7 , and the wall panels of the air duct 3 . The electromagnetic shielding member 9 can be a metal member, such as copper or aluminum, that provides electromagnetic shielding. Devices generating electromagnetic interference or those affected by electromagnetic interference can be positioned within the receiving slot to isolate them from electromagnetic interference. In addition, since the electromagnetic shielding member 9 is a metal member, that is, the electromagnetic shielding member 9 and the air duct 3 are both rigid members, if the electromagnetic shielding member 9 is directly connected to the air duct 3, a gap is likely to be generated between the electromagnetic shielding member 9 and the air duct 3. In this gap, heat cannot be effectively transferred to the heat sink 4, thereby reducing heat dissipation efficiency. To this end, in this embodiment, a first thermal conductive medium 7 can be filled between the electromagnetic shielding member 9 and the air duct 3. The first thermal conductive medium 7 can fully fill the gap between the electromagnetic shielding member 9 and the air duct 3 by utilizing its own flexibility, eliminating the gap. The metal electromagnetic shielding member 9 also has good thermal conductivity, so that the heat generated by the heating device 6 can be efficiently transferred to the heat sink 4 through the electromagnetic shielding member 9, the first thermal conductive medium 7, and the sidewalls of the air duct 3 in sequence. The sidewalls of the air duct 3 are the sidewalls used to connect to the heat sink 4. In one embodiment, the electromagnetic shielding member 9 can be assembled on the circuit board 2 using surface mount technology (SMT), thereby improving assembly reliability, reducing solder joint defect rate, and facilitating improved integration.

[0064] In one embodiment, referring to FIG3 , the electromagnetic shielding component 9 can be integrally molded. A receiving groove can be directly formed into the electromagnetic shielding component 9 during the molding process, thereby facilitating processing and ensuring the overall structural reliability of the electromagnetic shielding component 9. The receiving groove can be a slot structure that is open on one side and closed on the other side in the thickness direction Z of the electromagnetic shielding component 9. After the electromagnetic shielding component 9 is assembled onto the circuit board 2, the open side of the receiving groove can be sealed by the circuit board 2 to form a closed space, thereby enhancing the electromagnetic shielding effect. Furthermore, the device contained in the receiving groove can also be a heating device 6. To improve the heat transfer efficiency of the heating device 6 within the receiving groove, the receiving groove can also be filled with a second thermally conductive medium 8 made of a flexible material. The second thermally conductive medium 8 can leverage its own flexibility to fully fill the gap between the heating device 6 and the inner wall of the receiving groove, eliminating any gaps. This allows the heat generated by the heating device 6 within the receiving groove to be transferred to the heat sink 4 through the second thermally conductive medium 8, the electromagnetic shielding component 9, the first thermally conductive medium 7, and the wall panels of the air duct 3. In one embodiment, the material of the second thermally conductive medium 8 can be thermally conductive gel or thermally conductive silicone grease. These materials have excellent thermal conductivity and a certain degree of flexibility, and can fully fill the gap between the circuit board 2 and the air duct 3, eliminating gaps in the heat conduction path and improving heat dissipation efficiency. It is understood that the first thermally conductive medium 7 and the second thermally conductive medium 8 can be the same material or different materials, and this application is not limited to this.

[0065] In one embodiment, FIG7 is a partial cross-sectional side view of a terminal device according to the fifth embodiment of the present application. Referring to FIG7 , an electromagnetic shielding component 9 includes a body 91 and a cover plate 92. The body 91 is mounted on the circuit board 2. The receiving slot is a through slot that extends through the body 91 along the thickness direction Z of the terminal device. The cover plate 92 is snap-fitted to the side of the body 91 facing away from the circuit board 2 to seal the through slot. The cover plate 92 is connected to the air duct 3 via a first thermally conductive medium 7. The electromagnetic shielding component 9 is a structure composed of the body 91 and the cover plate 92, which are assembled separately. After the body 91 is mounted on the circuit board 2 via a surface-mounted metal mounting (SMT) process, the cover plate 92 can be secured to the body 91 by welding, gluing, or other methods to seal the through slot and provide effective electromagnetic shielding. After the body 91 is mounted on the circuit board 2, a second thermally conductive medium 8, such as thermally conductive gel or thermally conductive silicone grease, can be injected into the through slot to conduct heat to the components within the slot. In this embodiment, since the cover plate 92 can be fastened to the main body 91 to close the through groove, it is convenient to inject a thermally conductive gel with a higher thermal conductivity coefficient into the through groove to improve the thermal conductivity and thereby improve the heat dissipation efficiency of the heating element 6.

[0066] In one embodiment, referring to FIG5 , the heating device 6 can also be arranged on the side of the circuit board 2 away from the air duct 3. For example, the heating device 6 can be a system on a chip. In order to reduce the electromagnetic interference between the heating device 6 on the side of the circuit board 2 away from the air duct 3 and the surrounding devices, the heating device 6 can also be electromagnetically shielded by the aforementioned electromagnetic shielding member 9. The structure and effect of the electromagnetic shielding member 9 are the same as those of the aforementioned electromagnetic shielding member, and will not be repeated here. Among them, a second heat-conducting medium 8 can also be filled between the heating device 6 on the side of the circuit board 2 away from the air duct 3 and the electromagnetic shielding member 9. The function of the second heat-conducting medium 8 is the same as that of the aforementioned second heat-conducting medium, and will not be repeated here. In one embodiment, the heating device 6 on the side of the circuit board 2 away from the air duct 3 can be a system on a chip. The side of the system on a chip away from the circuit board 2 can be connected to a double data rate synchronous dynamic random access memory (Double Data Rate SDRAM, DDR SDRAM) 61. The data transmission speed of the DDR SDRAM is twice the system clock frequency, and it has good transmission performance. The system on chip and the DDR SDRAM may be housed as a whole in an electromagnetic shielding member 9 (see FIG. 5 ).

[0067] As previously described, heat sink 4 is the primary heat dissipation component. By aligning the projections of heating element 6, first thermally conductive medium 7, and electromagnetic shielding element 9 along the thickness direction Z of the terminal device with the projection of heat sink 4, the heat dissipation path can be shortened, achieving rapid and effective heat dissipation. FIG8 is a partial cross-sectional view of a terminal device provided in accordance with a sixth embodiment of the present application, viewed from a side perspective. Referring to FIG8 , to further improve heat dissipation efficiency, in one embodiment, at least a portion of the projections of first thermally conductive medium 7 and electromagnetic shielding element 9 along the thickness direction Z of the terminal device overlap with the projections of heat sink 4 and fan assembly 5. That is to say, the projections of the first heat-conducting medium 7 and the electromagnetic shielding component 9 in the thickness direction Z of the terminal device can simultaneously cover the heat sink 4 and the fan device 5, so that most of the heat generated by the heating device 6 can be conducted to the relatively nearby heat sink 4 through the electromagnetic shielding component 9 and the first heat-conducting medium 7 in sequence. At the same time, at least part of the heat generated by the heating device 6 can also be conducted to the relatively distant fan device 5 through the electromagnetic shielding component 9 and the first heat-conducting medium 7, so that the heat can be conducted to the blades and other structures of the fan device 5, and heat exchange with the air through the fan device 5, so that the fan device 5 can further expand the contact heat dissipation area with the air and improve the heat dissipation efficiency.

[0068] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A terminal device, characterized in that: include: A shell body, wherein the shell body is provided with an air inlet and an air outlet; A circuit board is arranged in the housing; A heating device is arranged on the circuit board; An air duct is arranged between the housing and the circuit board, the air duct comprises an air inlet and an air outlet, the air inlet is connected to the air inlet hole, and the air outlet is connected to the air outlet hole; A heat sink, disposed in the air duct close to the air outlet; The fan device is arranged in the air duct at a position close to the air inlet.

2. The terminal device according to claim 1, characterized in that: Along the thickness direction of the terminal device, at least a partial projection of the heat generating device overlaps with a projection of the heat dissipating element.

3. The terminal device according to claim 1, characterized in that: It also includes a first heat-conducting medium, which is arranged between the circuit board and the air duct.

4. The terminal device according to claim 3, characterized in that: The material of the first heat-conducting medium is heat-conducting gel or heat-conducting silicone grease.

5. The terminal device according to claim 3 or 4, characterized in that: It also includes an electromagnetic shielding component, on which a receiving groove is provided, and the receiving groove is used to receive the device on the circuit board.

6. The terminal device according to claim 5, characterized in that: The electromagnetic shielding component is arranged between the first heat-conducting medium and the circuit board, and / or the electromagnetic shielding component is arranged on a side of the circuit board away from the air duct.

7. The terminal device according to claim 5 or 6, characterized in that: The electromagnetic shielding member comprises a body and a cover plate, wherein the body is arranged on the circuit board, and the receiving slot is a through slot, and the through slot passes through the body along the thickness direction of the terminal device; The cover plate is buckled on a side of the body away from the circuit board to close the through slot, and the cover plate is connected to the air duct through the first heat conducting medium.

8. The terminal device according to any one of claims 5 to 7, characterized in that: The electromagnetic shielding component is made of heat-conductive metal.

9. The terminal device according to any one of claims 5 to 8, characterized in that: It also includes a second heat-conducting medium, which is filled between the device in the containing groove and the inner wall of the containing groove.

10. The terminal device according to claim 9, characterized in that: The material of the second heat-conducting medium is heat-conducting gel or heat-conducting silicone grease.

11. The terminal device according to any one of claims 3 to 10, characterized in that: Along the thickness direction of the terminal device, at least a portion of the projection of the first heat-conducting medium and the electromagnetic shielding component overlaps with the projection of the heat sink and the fan device.

12. The terminal device according to any one of claims 1 to 11, characterized in that: The air duct comprises an air inlet duct and an air outlet duct, the air inlet duct is communicated with the air outlet duct, the fan device is arranged in the air inlet duct, and the heat sink is arranged in the air outlet duct.

13. The terminal device according to any one of claims 1 to 12, characterized in that: The air duct is provided with a heat equalizing portion, and the heat equalizing portion is provided on at least a portion of the air duct close to the air outlet.

14. The terminal device according to claim 13, characterized in that: The heat-averaging portion is a graphite layer.

15. The terminal device according to claims 1-14, characterized in that: The air duct is connected to the shell by adhesive bonding, or the air duct is connected to the shell by a connecting piece, or the air duct is integrally formed with the shell.

16. The terminal device according to any one of claims 1 to 15, characterized in that: The heating device is arranged on a side of the circuit board away from the air duct.

17. The terminal device according to any one of claims 1 to 16, characterized in that: The heat sink includes a plurality of metal fins.

18. The terminal device according to any one of claims 1 to 17, characterized in that: The shell includes a battery cover and a camera decoration, wherein the camera decoration is arranged on the battery cover and protrudes from the outer wall of the battery cover. The interior of the camera decoration has an accommodating space, and at least a part of the air duct is arranged in the accommodating space.

19. The terminal device according to claim 18, characterized in that: Along a first direction, the camera decoration has a side wall, and the air inlet and the air outlet are arranged on the side wall. The first direction is perpendicular to the thickness direction of the terminal device.

20. The terminal device according to any one of claims 1 to 19, characterized in that: The heating device is a system on chip, a power management unit or a UNIX file system.

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