Radio frequency module and manufacturing method therefor, and electronic device

Abstract

The present application provides a radio frequency module and a manufacturing method therefor, and an electronic device. A bonding wire is replaced with a conductive layer to realize electrical connection of a first electronic device and a second electronic device, so that the restricted evolution of the packaging form of a radio frequency module can be avoided, and the decoupling capability of the first electronic device and the second electronic device is improved. The radio frequency module comprises a first electronic device, a second electronic device, a dielectric layer, and a conductive layer. The first electronic device comprises a first connecting disc, and the second electronic device comprises a second connecting disc. The dielectric layer comprises first through holes and second through holes, and the number of first through holes is m. The conductive layer is disposed on the dielectric layer. The conductive layer comprises first conductive branches and second conductive branches. The number of first conductive branches is m, an i-th first conductive branch is electrically connected to the first connecting disc by means of an i-th first through hole, and the second conductive branches are electrically connected to the second connecting disc by means of the second through holes, wherein m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

Description

Radio frequency module and preparation method thereof, and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 4, 2023, with application number 202311648119.5 and application name “RF module, preparation method thereof, and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of semiconductor technology, and in particular to a radio frequency module, a preparation method thereof, and an electronic device. Background Art

[0003] In mobile communication networks, RF carrier signals are amplified by RF power transistors before being transmitted into space from antennas. RF power transistors primarily consist of an amplifier die, a capacitor die, bonding wires, and a packaging structure. Traditionally, bonding wires are used to electrically connect the pads of any two die, providing impedance matching and transmitting DC and RF signals.

[0004] However, a single binding wire is connected between two bare cores in a one-to-one point-to-point manner, and the number of connection nodes connected to multiple binding wires in the pads of the two bare cores is the same, resulting in low decoupling capability of the corresponding two bare cores and reducing the freedom of chip design.

[0005] Summary of the Invention

[0006] In order to solve the above technical problems, the present application provides a radio frequency module and its preparation method, and an electronic device, which uses a conductive layer instead of a binding wire to achieve electrical connection between a first electronic device and a second electronic device, thereby avoiding the limitation of the packaging form evolution of the radio frequency module and improving the decoupling capability of the first electronic device and the second electronic device.

[0007] In a first aspect, the present application provides a radio frequency module, which includes a first electronic device, a second electronic device, a dielectric layer, and a conductive layer. The first electronic device includes a first connection pad, and the second electronic device includes a second connection pad. The dielectric layer covers the first electronic device and the second electronic device, and the dielectric layer includes a first through hole and a second through hole, and the number of the first through holes is m. The conductive layer is arranged on the dielectric layer, and the conductive layer includes a first conductive branch and a second conductive branch; the number of the first conductive branches is m, and the i-th first conductive branch is electrically connected to the first connection pad through the i-th first through hole; the second conductive branch is electrically connected to the second connection pad through the second through hole; wherein m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

[0008] In the present application, a binding wire is no longer used to connect the first electronic device and the second electronic device. Instead, a dielectric layer and a conductive layer are sequentially formed on the first electronic device and the second electronic device. The first through hole of the dielectric layer exposes the first connection pad, and the first through hole in the dielectric layer exposes m connection nodes on the first connection pad, so that the first conductive branch in the conductive layer is electrically connected to the first connection pad through the m first through holes; the second through hole in the dielectric layer exposes the connection node on the second connection pad, so that the second conductive branch in the conductive layer is electrically connected to the second connection pad through the second through hole, thereby connecting the first electronic device and the second electronic device using the conductive layer. In this way, it is possible to avoid the limitation of the packaging form evolution of the RF module due to the three-dimensional structure of the binding wire, and it is not conducive to stacking with other components or circuit boards. Among them, the connection node refers to: the part of the first connection pad exposed by the first through hole, and the part of the second connection pad exposed by the second through hole. In other words, it refers to the part of the first connection pad that is in direct contact with the first conductive branch, and the part of the second connection pad that is in direct contact with the second conductive branch.

[0009] Moreover, the first conductive branch and the second conductive branch can be equivalent to an inductor. The present application changes the connection path between the first conductive branch and the second conductive branch by changing the pattern of the first conductive branch and the second conductive branch, thereby changing the physical length of the first conductive branch and the second conductive branch. By adjusting the physical length of the first conductive branch and the second conductive branch, as well as the connection method of the second conductive branch and the m first conductive branches, the inductor can achieve any required equivalent inductance value. Therefore, the present application does not limit the number of the first conductive branch (first through-hole) and the second conductive branch (second through-hole), as long as the number of the first conductive branch and the first through-hole is m. It can also be said that the solution of the present application does not limit the number of the first through-hole to be the same as the number of the second through-hole, nor does it limit the number of the first conductive branches to be the same as the number of the second conductive branches. Therefore, the solution of the present application can improve the decoupling capability of the first electronic device and the second electronic device, and improve the freedom of chip design.

[0010] On this basis, in order to meet the requirement that the first electronic device and the second electronic device are electrically connected through multiple connection nodes, the related art has a very large number of binding wires (for example, 7), that is, 7 binding wires are connected in parallel, resulting in a decrease in the equivalent inductance value of the inductor, and the realization of a larger equivalent inductance value is limited. Furthermore, the number of 7 connection nodes and 7 binding wires in the related art is reduced to 4, but the number of connection nodes is sacrificed, which is contrary to the design requirements. Furthermore, the related art proposes to extend the physical length of the 7 binding wires without reducing the number of connection nodes to increase the equivalent inductance value. However, the increase in the physical length of the binding wire means that the spacing between the first electronic device and the second electronic device increases, which leads to an increase in the size of the RF module and indirectly affects the material cost.

[0011] The solution of the embodiment of the present application, without increasing the spacing between the first electronic device and the second electronic device, can achieve any desired equivalent inductance value for the inductor by adjusting the physical lengths of the first and second conductive branches, as well as the connection method between the second conductive branch and the m first conductive branches. Therefore, a reduction in the equivalent inductance value of the inductor can be avoided, and an increase in the size of the RF module can also be avoided.

[0012] In some possible implementations, at least two adjacent first conductive branches are connected to the first connecting portion, and the second conductive branch is connected to the first connecting portion.

[0013] In some possible implementations, the number of second through-holes is n, the number of second conductive branches is n, and the j-th second conductive branch is electrically connected to the second connection pad via the j-th second through-hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n. By designing the number n, m first conductive branches are electrically connected to n second conductive branches; and by designing the physical length of each second conductive branch and the physical length of each first conductive branch, different inductor inductance values ​​can be achieved.

[0014] In some possible implementations, at least two adjacent second conductive branches are connected to the second connecting portion. The conductive layer further includes a connecting conductive branch, which is connected to the first connecting portion and the second connecting portion respectively.

[0015] To improve the phase balance of each connection node and avoid significant differences in signal delay between paths when transmitting signals from the m connection nodes on the first connection pad to the n connection nodes on the second connection pad due to significant differences in path lengths from the m connection nodes on the first connection pad through the conductive layer to the n connection nodes on the second connection pad, optionally, the total length of any first conductive branch is L1, and the total length of the other first conductive branches ranges from (1-0.3)L1 to (1+0.3)L1; where L1 is a positive number. And / or, when the number of second conductive branches is n, the total length of any second conductive branch is L2, and the total length of the other second conductive branches ranges from (1-0.3)L2 to (1+0.3)L2; where L2 is a positive number.

[0016] Furthermore, the total length of the m first conductive branches is the same; and / or the total length of the n second conductive branches is the same. In this way, the length of a path from any connection node on the first connection pad through the conductive layer to any connection node on the second connection pad is the same as the length of a path from another connection node on the first connection pad through the conductive layer to another connection node on the second connection pad. When signals are transmitted from the m connection nodes on the first connection pad to the n connection nodes on the second connection pad, the signal delays between the paths are the same.

[0017] In some possible implementations, in power combining scenarios, a multi-cell design can be used, with multiple first connection pads in the first electronic device and multiple second connection pads in the second electronic device. The m first conductive branches are all electrically connected to the same first connection pad; or, the m first conductive branches are each electrically connected to different first connection pads; and / or, the n second conductive branches are all electrically connected to the same second connection pad; or, the n second conductive branches are each electrically connected to different second connection pads.

[0018] In some possible implementations, the first conductive branch is electrically connected to m first connection nodes in the first connection pad, and the second conductive branch is electrically connected to n second connection nodes in the second connection pad. The spacing between each adjacent first connection node is the same as the spacing between each adjacent second connection node; alternatively, the spacing between each adjacent first connection node is different from the spacing between each adjacent second connection node.

[0019] In some possible implementations, in a power combining scenario, a multi-chip combining design may be adopted, with multiple conductive layers being provided on the same layer.

[0020] In some possible implementations, the first conductive branches of the multiple conductive layers are electrically connected to different first connection pads of the same first electronic device, and the second conductive branches of the multiple conductive layers are electrically connected to different second connection pads of the same second electronic device.

[0021] In some possible implementations, there are multiple first electronic devices, and the second electronic devices are located between adjacent first electronic devices; and / or there are multiple second electronic devices, and the first electronic devices are located between adjacent second electronic devices.

[0022] In a second aspect, the present application provides a method for preparing a radio frequency module, comprising: providing a first electronic device and a second electronic device, the first electronic device comprising a first connection pad, and the second electronic device comprising a second connection pad. Covering the first electronic device and the second electronic device with a dielectric layer, the dielectric layer comprising a first through-hole and a second through-hole, the number of the first through-holes being m. Forming a conductive layer on the dielectric layer, the conductive layer comprising a first conductive branch and a second conductive branch; the number of the first conductive branches being m, the i-th first conductive branch being electrically connected to the first connection pad through the i-th first through-hole; the second conductive branch being electrically connected to the second connection pad through the second through-hole; wherein m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

[0023] In some possible implementations, every at least two adjacent first conductive branches are connected to the first connecting portion, and the second conductive branch is connected to the first connecting portion.

[0024] In some possible implementations, the number of second through holes is n, the number of second conductive branches is n, and the j-th second conductive branch is electrically connected to the second connecting plate through the j-th second through hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n.

[0025] In some possible implementations, every two adjacent second conductive branches are connected to the second connection portion, and / or every three adjacent second conductive branches are connected to the second connection portion. The conductive layer further includes a connecting conductive branch, which is respectively connected to the first connection portion and the second connection portion.

[0026] In some possible implementations, the total length of any first conductive branch is L1, and the total length range of other first conductive branches is (1-0.3)L1 to (1+0.3)L1; wherein L1 is a positive number; and / or, when the number of second conductive branches is n, the total length of any second conductive branch is L2, and the total length range of other second conductive branches is (1-0.3)L2 to (1+0.3)L2; wherein L2 is a positive number.

[0027] In some possible implementations, the total lengths of the m first conductive branches are all the same; and / or, when the number of the second conductive branches is n, the total lengths of the n second conductive branches are all the same.

[0028] The second aspect and any implementation of the second aspect correspond to the first aspect and any implementation of the first aspect, respectively. The technical effects corresponding to the second aspect and any implementation of the second aspect can be referred to the technical effects corresponding to the first aspect and any implementation of the first aspect, and will not be repeated here.

[0029] In a third aspect, the present application provides an electronic device, comprising a circuit board and the radio frequency module described in the first aspect, wherein the radio frequency module is arranged on the circuit board.

[0030] The third aspect and any implementation of the third aspect correspond to the first aspect and any implementation of the first aspect, respectively. The technical effects corresponding to the third aspect and any implementation of the third aspect can be referred to the technical effects corresponding to the first aspect and any implementation of the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG1a is a schematic diagram showing an amplifier die and a capacitor die electrically connected via a bonding wire according to a related art;

[0032] Figure 1b is a side view of Figure 1a;

[0033] FIG2 is a schematic diagram of a radio frequency module provided in an embodiment of the present application;

[0034] FIG3 a is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0035] FIG3 b is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0036] FIG3 c is a schematic structural diagram of a conductive layer, a first connection pad, and a second connection pad provided in an embodiment of the present application;

[0037] FIG4 a is a top view of a binding wire provided by the related art;

[0038] FIG4 b is a top view of a binding wire provided by the related art;

[0039] FIG4c is a top view of a binding wire provided by the related art;

[0040] FIG5a is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0041] FIG5 b is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0042] FIG6 is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0043] FIG7 is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0044] FIG8 a is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0045] FIG8 b is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0046] FIG8c is a schematic structural diagram of a conductive layer, a first connection pad, and a second connection pad provided in an embodiment of the present application;

[0047] FIG8 d is a schematic structural diagram of a conductive layer, a first connection pad, and a second connection pad provided in an embodiment of the present application;

[0048] FIG9 a is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0049] FIG9 b is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0050] FIG9c is a schematic structural diagram of a conductive layer, a first connection pad, and a second connection pad provided in an embodiment of the present application;

[0051] FIG9 d is a schematic structural diagram of a conductive layer, a first connection pad, and a second connection pad provided in an embodiment of the present application;

[0052] FIG10a is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0053] FIG10 b is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0054] FIG10c is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0055] FIG11a is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0056] FIG11 b is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0057] FIG12a is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0058] FIG12 b is a schematic structural diagram of a conductive layer and a first connection pad and a second connection pad provided in an embodiment of the present application;

[0059] FIG13 is a schematic diagram of a radio frequency module provided in an embodiment of the present application;

[0060] FIG14a is a schematic diagram of a radio frequency module provided in an embodiment of the present application;

[0061] FIG14b is a schematic diagram of a radio frequency module provided in an embodiment of the present application;

[0062] FIG15 is a flow chart of the preparation of the RF module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0063] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0064] The term "and / or" in this article is merely a description of the association relationship between associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0065] In the description and claims of the embodiments of this application, the terms "first" and "second" are used to distinguish different objects, rather than to describe a specific order of objects. For example, the terms "first target object" and "second target object" are used to distinguish different objects, rather than to describe a specific order of objects.

[0066] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0067] In the description of the embodiments of this application, unless otherwise specified, "multiple" means two or more. For example, "multiple processing units" means two or more processing units; "multiple systems" means two or more systems.

[0068] An embodiment of the present application provides an electronic device, which may be a communication electronic product, a consumer electronic product, a home electronic product, a vehicle-mounted electronic product, a financial terminal product, or other device that includes a radio frequency chip.

[0069] Communication electronic products include servers, storage devices, radars, base stations and other communication equipment that contain electronic devices such as radio frequency chips. Consumer electronic products include mobile phones, tablet computers, laptops, personal computers (PCs), personal digital assistants (PDAs), smart wearable products (for example, smart watches, smart bracelets, etc.), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, drones, etc. Home electronic products include smart door locks, TVs, smart speakers, refrigerators, sweeping robots, etc. Car-mounted electronic products include car navigation systems, car displays, etc. Financial terminal products include automated teller machines (ATMs) and self-service terminals.

[0070] Taking the RF power tube as an example, the RF power tube includes an RF chip. For example, as shown in Figures 1a and 1b, the RF power tube includes an amplifier bare core 11, a capacitor bare core 12, a binding wire 13, and a packaging structure. The flange 14 serves as a ground layer for carrying the amplifier bare core and the capacitor bare core, while achieving electrical connection between the amplifier bare core 11 and the capacitor bare core 12 and the ground layer respectively. Among them, in the circuit topology of the RF power tube, the binding wire 14 can be equivalent to an inductor, and different equivalent inductance values ​​can be achieved by different connection parameters.

[0071] As shown in Figures 1a and 1b, in RF design and application, the pad nodes within the same chip need to consider the equipotential design requirements in the dimension of distributed parameters to avoid internal signal convection and increase additional losses. For example, multiple bonding wires 13 are usually used to connect the pads in the amplifier bare core 11 and the pads in the capacitor bare core 12. From the bonding equipment of the bonding wire and its process implementation principle, it can be seen that each bonding wire 13 is independent, and multiple bonding wires 13 are prepared one by one. The preparation process is affected by factors such as the size of the equipment splitter, line shape, and tolerance.

[0072] However, the solution of using the binding wire 13 to connect the amplifier die 11 and the capacitor die 12 has the following two drawbacks:

[0073] First, a single binding wire is connected between the amplifier bare core 11 and the capacitor bare core 12 in a one-to-one point-to-point manner. The number of connection nodes connected to multiple binding wires 13 in the solder pads of the amplifier bare core 11 and the capacitor bare core 12 must be the same, and the positions must correspond one to one. That is, the decoupling capability of the amplifier bare core 11 and the capacitor bare core 12 is low, which reduces the freedom of chip design.

[0074] In the present application, the poor decoupling capability of the amplifier core 11 and the capacitor core 12 means that when the relative positions of the amplifier core 11 and the capacitor core 12 remain unchanged, removing a connection node in the amplifier core 11 or the capacitor core 12 will cause an irreversible change in the equivalent inductance value of the inductor. Therefore, it is considered that the number and position of the connection nodes in the solder pads of the amplifier core 11 and the capacitor core 12 must correspond one to one, and cannot be decoupled arbitrarily.

[0075] Second, the binding wire 13 is a three-dimensional structure, and space needs to be reserved in the longitudinal direction (Z direction in the figure). The evolution of the module packaging form is limited, and it is not conducive to stacking and assembling with other components or circuit boards.

[0076] Based on this, as shown in Figure 2, an embodiment of the present application provides a radio frequency module, which may include a first electronic device and a second electronic device. The embodiment of the present application does not limit the first electronic device and the second electronic device, and the first electronic device and the second electronic device may be any two electronic devices that need to be electrically connected via a pad.

[0077] For example, the first electronic device and the second electronic device may be a bare chip, a redistribution layer, an integrated passive device (IPD), etc.

[0078] The first electronic device 21 includes a first connection pad 211, and the second electronic device includes a second connection pad 221. The first connection pad 211 may also be referred to as a solder pad or other term, and the second connection pad 221 may also be referred to as a solder pad or other term.

[0079] As shown in Figure 2, the RF module also includes a dielectric layer 30 and a conductive layer 40 (in the RF field, the conductive layer 40 is used to transmit RF signals) stacked in sequence on the first electronic device 21 and the second electronic device 22. As shown in Figure 3a, the dielectric layer 30 covers the first electronic device 21 and the second electronic device 22. The dielectric layer 30 includes a first through hole and a second through hole, and the number of the first through holes is m. The conductive layer 40 includes a first conductive branch 41 and a second conductive branch 42. The number of the first conductive branches 41 is m. The i-th first conductive branch 41 is electrically connected to the first connecting plate 211 through the i-th first through hole; the second conductive branch 42 is electrically connected to the second connecting plate 221 through the second through hole. Wherein, m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

[0080] In the present application, the binding wire 13 is no longer used to connect the first electronic device 21 and the second electronic device 22. Instead, a dielectric layer 30 and a conductive layer 40 are sequentially formed on the first electronic device 21 and the second electronic device 22. The first through hole of the dielectric layer 30 exposes the first connection pad 211, and the first through hole in the dielectric layer 30 exposes m connection nodes on the first connection pad 211, so that the first conductive branch 41 in the conductive layer 40 is electrically connected to the first connection pad 211 through the m first through holes; the second through hole in the dielectric layer 30 exposes the connection node on the second connection pad 221, so that the second conductive branch 42 in the conductive layer 40 is electrically connected to the second connection pad 221 through the second through hole, thereby connecting the first electronic device 41 and the second electronic device using the conductive layer 40. In this way, it is possible to avoid the limitation of the packaging form evolution of the RF module due to the three-dimensional structure of the binding wire 13, and it is not conducive to stacking with other components or circuit boards. The connection nodes are the portion of the first connection pad 211 exposed by the first through-hole and the portion of the second connection pad 221 exposed by the second through-hole. Alternatively, they are the portion of the first connection pad 211 that is in direct contact with the first conductive branch 41 and the portion of the second connection pad 221 that is in direct contact with the second conductive branch 42.

[0081] Furthermore, the first conductive branch 41 and the second conductive branch 42 can be equivalent to an inductor. The embodiment of the present application changes the connection path between the first conductive branch 41 and the second conductive branch 42 by changing the pattern of the first conductive branch 41 and the second conductive branch 42, thereby changing the physical length of the first conductive branch 41 and the second conductive branch 42. By adjusting the physical length of the first conductive branch 41 and the second conductive branch 42, as well as the connection method of the second conductive branch 42 and the m first conductive branches 41, the inductor can achieve any desired equivalent inductance value. Therefore, the embodiment of the present application does not limit the number of the first conductive branch 41 (first through hole) and the second conductive branch 42 (second through hole), as long as the number of the first conductive branch 41 and the first through hole is m. In other words, the solution of the embodiment of the present application does not limit the number of the first through hole to the same as the number of the second through hole, nor does it limit the number of the first conductive branch 41 to the same as the number of the second conductive branch 42. Therefore, the solution of the embodiment of the present application can improve the decoupling capability of the first electronic device 21 and the second electronic device 22, and improve the freedom of chip design.

[0082] On this basis, as shown in FIG4a, in order to meet the requirement that the first electronic device 21 and the second electronic device 22 are electrically connected through multiple connection nodes, the related art has a very large number of binding wires 13 (for example, 7), that is, 7 binding wires 13 are connected in parallel, resulting in a decrease in the equivalent inductance value of the inductor, and the realization of a larger equivalent inductance value is limited. Further, as shown in FIG4b, the number of 7 connection nodes and 7 binding wires 13 in the related art is reduced to 4, but the number of connection nodes is sacrificed, which violates the design requirements. Further, as shown in FIG4c, the related art proposes to extend the physical length of the 7 binding wires 13 without reducing the number of connection nodes to increase the equivalent inductance value. However, the increase in the physical length of the binding wire 13 means that the spacing between the first electronic device 21 and the second electronic device 22 increases, which leads to an increase in the size of the RF module and indirectly affects the material cost.

[0083] The solution of the embodiment of the present application, without increasing the spacing between the first electronic device 21 and the second electronic device 22, can achieve any desired equivalent inductance value for the inductor by adjusting the physical lengths of the first conductive branch 41 and the second conductive branch 42, as well as the connection method between the second conductive branch 42 and the m first conductive branches 41. Therefore, a reduction in the equivalent inductance value of the inductor can be avoided, and an increase in the size of the RF module can also be avoided.

[0084] The connection relationship between the second conductive branch 42 and the first conductive branch 41 in the conductive layer 40 when m has different values ​​is exemplarily described below with reference to the accompanying drawings.

[0085] For example, as shown in Figures 3a-3c, m = 2, the number of first through-holes and first conductive branches 41 are both 2, and the number of first through-holes and second conductive branches 42 are both 1. The two first conductive branches 41 are electrically connected to the first connection pad 211 through the first through-holes, and the one second conductive branch 42 is electrically connected to the second connection pad 221 through the second through-hole. The two first conductive branches 41 are connected to the first connection portion a, and the second conductive branch 42 is connected to multiple first connection portions a.

[0086] Assuming that the equivalent inductance value of the inductor formed by the second conductive branch 42 and the two first conductive branches 41 is L, the equivalent inductance value from the connection node A1 on the first connection disk 211 to the first connection portion a is L(1-1), and the distance from the connection node A1 on the first connection disk 211 to the first connection portion a in the Y direction is d1; the equivalent inductance value from the connection node A2 on the first connection disk 211 to the first connection portion a is L(1-2), and the distance from the connection node A2 on the first connection disk 211 to the first connection portion a in the Y direction is d1; the equivalent inductance value from the connection node B on the second connection disk 221 to the first connection portion a is L(2-1), and the distance from the connection node B on the second connection disk 221 to the first connection portion a in the Y direction is d2.

[0087] The equivalent inductance value L of the inductor is L(2-1)+L(1-1) / / L(1-2). By adjusting the ratio of d1 to d2, the equivalent inductance value L of the inductor can be adjusted.

[0088] For another example, as shown in Figures 5a and 5b, m = 3, the number of first through-holes and first conductive branches 41 is 3, and the number of second through-holes and second conductive branches 42 is 1. Every three adjacent first conductive branches 41 are connected to a first connection portion a, and the second conductive branch 42 is connected to multiple first connection portions a. Similarly, the equivalent inductance L of the inductor can be adjusted by adjusting the distance between the first conductive branch 41 and the second conductive branch 42 in the Y direction.

[0089] For another example, as shown in Figure 6, m = 4, the number of first through-holes and first conductive branches 41 are both 4, and the number of second through-holes and second conductive branches 42 are both 1. The first and second first conductive branches 41 are connected to the first connection portion a1, and the third and fourth first conductive branches 41 are connected to the first connection portion a2. Furthermore, the conductive layer 40 further includes a connecting conductive branch 43, which is connected to the second conductive branch 42, the first connection portion a1, and the first connection portion a2, respectively.

[0090] Similarly, the equivalent inductance L of the inductor can be adjusted by adjusting the physical lengths of the four first conductive branches 41 , the connecting conductive branch 43 , and the second conductive branch 42 .

[0091] For another example, as shown in Figure 7, m = 5, the number of first through-holes and first conductive branches 41 is 5, and the number of second through-holes and second conductive branches 42 is 1. The first and second first conductive branches 41 are connected to the first connection portion a1, and the third, fourth, and fifth first conductive branches 41 are connected to the first connection portion a2. Furthermore, the conductive layer 40 further includes a connecting conductive branch 43, which is connected to the second conductive branch 42, the first connection portion a1, and the first connection portion a2, respectively.

[0092] Similarly, the equivalent inductance L of the inductor can be adjusted by adjusting the physical lengths of the five first conductive branches 41 , the connecting conductive branch 43 , and the second conductive branch 42 .

[0093] The above examples are based on the example of every two adjacent first conductive branches 41 being connected to the first connection portion, and / or every three adjacent first conductive branches 41 being connected to the first connection portion. Of course, more first conductive branches 41 can also be connected to the first connection portion. That is, every at least two adjacent first conductive branches 41 are connected to the first connection portion.

[0094] In some possible implementations, the embodiment of the present application does not limit the arrangement of the m first through holes. Optionally, the m first through holes are arranged along a first direction (X direction), as shown in Figures 3a and 3b, where the X direction is perpendicular to the Y direction; or, as shown in Figure 3c, the connecting line in the first direction is an arc.

[0095] Of course, the first direction depends on the arrangement positions of the multiple connection nodes in the first connection disk 211. The first direction can also be other directions, which is not limited in the embodiment of the present application.

[0096] The embodiment of the present application does not limit the number of the second through holes and the second conductive branches 42. In the conductive layer 40 shown in Figures 3a to 7, the number of the second through hole and the second conductive branch 42 is one.

[0097] In other possible implementations, as shown in Figures 8a-8c, there are n second through-holes, n second conductive branches 42, and the jth second conductive branch 42 is electrically connected to the second connection pad via the jth second through-hole. Here, n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n. By designing the number n, m first conductive branches 41 are electrically connected to n second conductive branches 42. By designing the physical lengths of each second conductive branch 42 and each first conductive branch 41, different inductance values ​​can be achieved.

[0098] At least two adjacent second conductive branches 42 are connected to the second connection portion, for example, at least two adjacent second conductive branches 42 are connected to the second connection portion b, and / or at least three adjacent second conductive branches 42 are connected to the second connection portion b.

[0099] As shown in FIG. 8 a , when there are only one first connection portion a and one second connection portion b, the first connection portion a and the second connection portion b are connected via a connecting conductive branch 43 .

[0100] As shown in Figure 8b, when there are multiple first connection parts a (for example, two) and one second connection part b, the connecting conductive branch 43 includes a first connecting conductive branch 431 and a second connecting conductive branch 432. The first connecting part a1 is connected to the first connecting part a2 through the first connecting conductive branch 431, and the first connecting conductive branch 431 is connected to the second connecting part b through the second connecting conductive branch 432.

[0101] As shown in Figure 8c, when there are multiple first connection parts a and second connection parts b (for example, two), the connecting conductive branch 43 includes a first connecting conductive branch 431, a second connecting conductive branch 432, and a third connecting conductive branch 433. The first connecting part a1 is connected to the first connecting part a2 through the first connecting conductive branch 431, the second connecting part b1 is connected to the second connecting part b2 through the second connecting conductive branch 432, and the first connecting conductive branch 431 is connected to the second connecting conductive branch 432 through the third connecting conductive branch 433.

[0102] In some possible implementations, as shown in FIG. 8 a - FIG 8 c , the embodiment of the present application does not limit the shape of each connected conductive branch 43 , but only needs to ensure that the physical length of each connected conductive branch 43 meets the equivalent inductance value required by the design.

[0103] In some possible implementations, the embodiments of the present application do not limit the shape and total length of each first conductive branch 41 and each second conductive branch 42, and thus do not limit the length of each path from the m connection nodes on the first connection plate 211 through the conductive layer 40 to the n connection nodes on the second connection plate 221.

[0104] To improve the phase balance of each connection node and avoid significant differences in signal delay between paths when transmitting signals from the m connection nodes on the first connection pad 211 to the n connection nodes on the second connection pad 221 due to significant differences in path lengths from the m connection nodes on the first connection pad 211 through the conductive layer 40 to the n connection nodes on the second connection pad 221, the total length of any first conductive branch 41 can be L1, while the total lengths of the other first conductive branches 41 can range from (1-0.3)L1 to (1+0.3)L1, where L1 is a positive number. Alternatively, when the number of second conductive branches is n, the total length of any second conductive branch 42 can be L2, while the total lengths of the other second conductive branches 42 can range from (1-0.3)L2 to (1+0.3)L2, where L2 is a positive number.

[0105] Furthermore, as shown in Figures 2a-2b, 5b, 6, and 8a-8c, the total lengths of the m first conductive branches 41 are all the same; and / or the total lengths of the n second conductive branches 42 are all the same. In this way, the length of the path from any connection node on the first connection pad 211 through the conductive layer 40 to any connection node on the second connection pad 221 is the same as the length of the path from other connection nodes on the first connection pad 211 through the conductive layer 40 to other connection nodes on the second connection pad 221. When signals are transmitted from the m connection nodes on the first connection pad 211 to the n connection nodes on the second connection pad 221, the signal delays between the various paths are the same.

[0106] Of course, other methods can also be used to connect the m first conductive branches 41 and the n second conductive branches 42 using the connecting conductive branch 43, and this embodiment of the present application is not limited to this. For example, as shown in Figure 8d, every two adjacent second conductive branches 42 can share one another. And / or every two adjacent first conductive branches 41 can share one another.

[0107] As shown in Figures 8a-8c, the above describes a case where m first conductive branches 41 are electrically connected to the same first connection pad 211 through m first through-holes, and n second conductive branches 42 are electrically connected to the same second connection pad 221 through n second through-holes. In other embodiments, as shown in Figures 9a and 9b, the first electronic device 21 has multiple first connection pads 211, and the second electronic device 22 has multiple second connection pads 221. The m first conductive branches 41 are electrically connected to different first connection pads 211, and / or the n second conductive branches 42 are electrically connected to different second connection pads 221.

[0108] For example, as shown in FIG9a , in a power combining scenario, a multi-cell design can be adopted, where two first conductive branches 41 are electrically connected to two first connection pads 211, and two second conductive branches 42 are electrically connected to two second connection pads 221. The connection nodes A1 and A2 in the same first connection pad 211 are at the same potential, and the connection nodes B1 and B2 in the same second connection pad 221 are at the same potential.

[0109] For another example, as shown in FIG9b , in a power combining scenario, a multi-cell design may be employed, where four first conductive branches 41 are electrically connected to the same first connection pad 211, the first second conductive branch 42 and the second second conductive branch 42 are electrically connected to the first second connection pad 221, and the third second conductive branch 42 and the fourth second conductive branch 42 are electrically connected to the second second connection pad 221. The connection nodes A1, A2, A3, and A4 in the same first connection pad 211 are at the same potential, and the connection nodes B1 and B2 in the same second connection pad 221 are at the same potential.

[0110] The example shown in Figure 9b can be applied to a combiner, where the first second connection pad 221 on the second electronic device 22 is used to transmit the first signal, and the second second connection pad 221 on the second electronic device 22 is used to transmit the second signal. The first signal and the second signal are transmitted to the same first connection pad 211 of the first electronic device 21 through the conductive layer 40, thereby realizing signal combining.

[0111] In some possible implementations, in the example shown in FIG9 b , the first first conductive branch 41 and the second first conductive branch 41 are connected to the first connection portion a1, the third first conductive branch 41 and the fourth first conductive branch 41 are connected to the first connection portion a2, the first second conductive branch 42 and the second second conductive branch 42 are connected to the second connection portion b1, and the third second conductive branch 42 and the fourth second conductive branch 42 are connected to the second connection portion b2. Based on the example shown in FIG9 b , as shown in FIG9 c , the first connection portion a1, the first connection portion a2, the second connection portion b1, and the second connection portion b2 are connected via a connecting conductive branch 43.

[0112] It should be understood that multiple connection nodes in the same first connection pad 211 are electrically connected, and multiple connection nodes in the same second connection pad 221 are electrically connected, while multiple connection nodes in different first connection pads 211 are electrically isolated, and multiple connection nodes in the same second connection pad 221 are electrically isolated.

[0113] In some embodiments, the first conductive branch 41 is electrically connected to m first connection nodes in the first connection pad 211, and the second conductive branch 42 is electrically connected to n second connection nodes in the second connection pad 221. As shown in Figures 9b and 9c, the distance between each two adjacent first connection nodes is different from the distance between each two adjacent second connection nodes; alternatively, as shown in Figure 9d, the distance between each two adjacent first connection nodes is the same as the distance between each two adjacent second connection nodes.

[0114] In some embodiments, as shown in Figures 10a-10c, in a power combining scenario, a multi-die design can be used, with multiple conductive layers 40 provided on the same layer. The present embodiment does not limit the arrangement of the multiple conductive layers 40; the arrangement of the multiple conductive layers 40 depends on the position and arrangement of the first connection pads 211 and the second connection pads 221 electrically connected to the multiple conductive layers 40. For example, the multiple conductive layers 40 are arranged along the X direction.

[0115] In some possible implementations, due to design requirements, the multiple first connection pads 211 and the multiple second connection pads 221 corresponding to the multiple conductive layers 40 need to be electrically connected. Based on this, as shown in FIG10c, in an embodiment of the present application, the first conductive branches 41 of the multiple conductive layers 40 are also electrically connected to different first connection pads 211 of the same first electronic device 21, and the second conductive branches 42 of the multiple conductive layers 40 are also electrically connected to different second connection pads of the same second electronic device 22.

[0116] In some possible implementations, as shown in Figures 11a and 11b, the first electronic device 21 may include a third connection pad 212 in addition to the first connection pad 211; and / or the second electronic device 22 may include a fourth connection pad 222 in addition to the second connection pad 221. The third connection pad 212 and the fourth connection pad 222 may also perform other functions, which are not limited in this embodiment of the present application.

[0117] In some possible implementations, as shown in FIG12 a , the conductive layer 40 may include, in addition to the first conductive branch 41, the second conductive branch 42, and the connecting conductive branch 43, a first auxiliary conductive layer 44 and a second auxiliary conductive layer 45. The first conductive branch 41 is electrically connected to the first connection pad 211 via the first auxiliary conductive layer 44, and the second conductive branch 42 is electrically connected to the second connection pad 221 via the second auxiliary conductive layer 45.

[0118] On this basis, as shown in FIG12b , the number of first auxiliary conductive layers 44 and second auxiliary conductive layers 45 is multiple, and the RF chip may further include a first component 46 and a second component 47. Two adjacent first auxiliary conductive layers 44 are electrically connected via the first component 46, and two adjacent second auxiliary conductive layers 44 are electrically connected via the second component 47. The first component 46 and the second component 47 may be chip resistors, chip capacitors, thin film resistors, thin film capacitors, etc.

[0119] In some possible implementations, as shown in Figure 2, the surface of the dielectric layer 30 facing away from the first electronic device 21 can be a flat surface; or, as shown in Figure 13, the surface of the dielectric layer 30 facing away from the first electronic device 21 can be a slope, which is not limited to this embodiment of the present application.

[0120] The above describes a case where the RF module includes a first electronic device 21 and a second electronic device 22. In other embodiments, as shown in Figures 14a and 14b, the number of first electronic devices 21 is multiple, and the second electronic devices 22 are located between adjacent first electronic devices 21; and / or, the number of second electronic devices 22 is multiple, and the first electronic device 21 is located between adjacent second electronic devices 22.

[0121] In another embodiment, the present application further provides a method for preparing a radio frequency module, as shown in FIG15 , which can be implemented by the following steps:

[0122] S110 , providing a first electronic device 21 and a second electronic device 22 , wherein the first electronic device 21 includes a first connection pad 211 , and the second electronic device 22 includes a second connection pad 221 .

[0123] S120 , covering the first electronic device 21 and the second electronic device 22 with a dielectric layer 30 , wherein the dielectric layer 30 includes first through holes and second through holes, and the number of the first through holes is m.

[0124] S130: Form a conductive layer 40 on the dielectric layer 30. The conductive layer 40 includes first conductive branches 41 and second conductive branches 42. The number of first conductive branches 41 is m. The i-th first conductive branch 41 is electrically connected to the first connection pad 211 via the i-th first through-hole. The second conductive branch 42 is electrically connected to the second connection pad 221 via the second through-hole. Here, m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

[0125] In the present application, the binding wire 13 is no longer used to connect the first electronic device 21 and the second electronic device 22. Instead, a dielectric layer 30 and a conductive layer 40 are sequentially formed on the first electronic device 21 and the second electronic device 22. The first through hole of the dielectric layer 30 exposes the first connection pad 211, and the first through hole in the dielectric layer 30 exposes m connection nodes on the first connection pad 211, so that the first conductive branch 41 in the conductive layer 40 is electrically connected to the first connection pad 211 through the m first through holes; the second through hole in the dielectric layer 30 exposes the connection node on the second connection pad 221, so that the second conductive branch 42 in the conductive layer 40 is electrically connected to the second connection pad 221 through the second through hole, thereby connecting the first electronic device 41 and the second electronic device using the conductive layer 40. In this way, it is possible to avoid the limitation of the packaging form evolution of the RF module due to the three-dimensional structure of the binding wire 13, and it is not conducive to stacking with other components or circuit boards. The connection nodes are the portion of the first connection pad 211 exposed by the first through-hole and the portion of the second connection pad 221 exposed by the second through-hole. Alternatively, they are the portion of the first connection pad 211 that is in direct contact with the first conductive branch 41 and the portion of the second connection pad 221 that is in direct contact with the second conductive branch 42.

[0126] Furthermore, the first conductive branch 41 and the second conductive branch 42 can be equivalent to an inductor. The embodiment of the present application changes the connection path of the first conductive branch 41 and the second conductive branch 42 by changing the pattern of the first conductive branch 41 and the second conductive branch 42, thereby changing the physical length of each of the first conductive branch 41 and the second conductive branch 42. By adjusting the physical length of each of the first conductive branch 41 and the second conductive branch 42, as well as the connection method of the second conductive branch 42 and the m first conductive branches 41, the inductor can achieve any desired equivalent inductance value. Therefore, the embodiment of the present application does not limit the number of the first conductive branch 41 (first through hole) and the second conductive branch 42 (second through hole), as long as the number of the first conductive branch 41 and the first through hole is m. In other words, the solution of the embodiment of the present application does not limit the number of the first through hole to the same as the number of the second through hole, nor does it limit the number of the first conductive branch 41 to the same as the number of the second conductive branch 42. Therefore, the solution of the embodiment of the present application can improve the decoupling capability of the first electronic device 21 and the second electronic device 22, and improve the freedom of chip design.

[0127] On this basis, as shown in FIG4a, in order to meet the requirement that the first electronic device 21 and the second electronic device 22 are electrically connected through multiple connection nodes, the related art has a very large number of binding wires 13 (for example, 7), that is, 7 binding wires 13 are connected in parallel, resulting in a decrease in the equivalent inductance value of the inductor, and the realization of a larger equivalent inductance value is limited. Further, as shown in FIG4b, the number of 7 connection nodes and 7 binding wires 13 in the related art is reduced to 4, but the number of connection nodes is sacrificed, which violates the design requirements. Further, as shown in FIG4c, the related art proposes to extend the physical length of the distance between the 7 binding wires 13 without reducing the number of connection nodes to increase the equivalent inductance value. However, the increase in the physical length of the binding wire 13 means that the spacing between the first electronic device 21 and the second electronic device 22 increases, which leads to an increase in the size of the RF module and indirectly affects the material cost.

[0128] The solution of the embodiment of the present application, without increasing the spacing between the first electronic device 21 and the second electronic device 22, can achieve any desired equivalent inductance value for the inductor by adjusting the physical lengths of the first conductive branch 41 and the second conductive branch 42, as well as the connection method between the second conductive branch 42 and the m first conductive branches 41. Therefore, a reduction in the equivalent inductance value of the inductor can be avoided, and an increase in the size of the RF module can also be avoided.

[0129] The connection relationship between the second conductive branch 42 and the first conductive branch 41 in the conductive layer 40 when m has different values ​​is exemplarily described below with reference to the accompanying drawings.

[0130] For example, as shown in Figures 3a-3c, m = 2, the number of first through-holes and first conductive branches 41 are both 2, and the number of first through-holes and second conductive branches 42 are both 1. The two first conductive branches 41 are electrically connected to the first connection pad 211 through the first through-holes, and the one second conductive branch 42 is electrically connected to the second connection pad 221 through the second through-hole. The two first conductive branches 41 are connected to the first connection portion a, and the second conductive branch 42 is connected to multiple first connection portions a.

[0131] Assuming that the equivalent inductance value of the inductor formed by the second conductive branch 42 and the two first conductive branches 41 is L, the equivalent inductance value from the connection node A1 on the first connection disk 211 to the first connection portion a is L(1-1), and the distance from the connection node A1 on the first connection disk 211 to the first connection portion a in the Y direction is d1; the equivalent inductance value from the connection node A2 on the first connection disk 211 to the first connection portion a is L(1-2), and the distance from the connection node A2 on the first connection disk 211 to the first connection portion a in the Y direction is d1; the equivalent inductance value from the connection node B on the second connection disk 221 to the first connection portion a is L(2-1), and the distance from the connection node B on the second connection disk 221 to the first connection portion a in the Y direction is d2.

[0132] The equivalent inductance value L of the inductor is L(2-1)+L(1-1) / / L(1-2). By adjusting the ratio of d1 to d2, the equivalent inductance value L of the inductor can be adjusted.

[0133] For another example, as shown in Figures 5a and 5b, m = 3, the number of first through-holes and first conductive branches 41 is 3, and the number of second through-holes and second conductive branches 42 is 1. Every three adjacent first conductive branches 41 are connected to a first connection portion a, and the second conductive branch 42 is connected to multiple first connection portions a. Similarly, the equivalent inductance L of the inductor can be adjusted by adjusting the distance between the first conductive branch 41 and the second conductive branch 42 in the Y direction.

[0134] For another example, as shown in Figure 6, m = 4, the number of first through-holes and first conductive branches 41 are both 4, and the number of second through-holes and second conductive branches 42 are both 1. The first and second first conductive branches 41 are connected to the first connection portion a1, and the third and fourth first conductive branches 41 are connected to the first connection portion a2. Furthermore, the conductive layer 40 further includes a connecting conductive branch 43, which is connected to the second conductive branch 42, the first connection portion a1, and the first connection portion a2, respectively.

[0135] Similarly, the equivalent inductance L of the inductor can be adjusted by adjusting the physical lengths of the four first conductive branches 41 , the connecting conductive branch 43 , and the second conductive branch 42 .

[0136] For another example, as shown in Figure 7, m = 5, the number of first through-holes and first conductive branches 41 is 5, and the number of second through-holes and second conductive branches 42 is 1. The first and second first conductive branches 41 are connected to the first connection portion a1, and the third, fourth, and fifth first conductive branches 41 are connected to the first connection portion a2. Furthermore, the conductive layer 40 further includes a connecting conductive branch 43, which is connected to the second conductive branch 42, the first connection portion a1, and the first connection portion a2, respectively.

[0137] Similarly, the equivalent inductance L of the inductor can be adjusted by adjusting the physical lengths of the five first conductive branches 41 , the connecting conductive branch 43 , and the second conductive branch 42 .

[0138] The above examples are based on the example of every two adjacent first conductive branches 41 being connected to the first connection portion, and / or every three adjacent first conductive branches 41 being connected to the first connection portion. Of course, more first conductive branches 41 can also be connected to the first connection portion. That is, every at least two adjacent first conductive branches 41 are connected to the first connection portion.

[0139] In some possible implementations, the embodiment of the present application does not limit the arrangement of the m first through holes. Optionally, the m first through holes are arranged along a first direction (X direction), as shown in Figures 3a and 3b, where the X direction is perpendicular to the Y direction; or, as shown in Figure 3c, the connecting line in the first direction is an arc.

[0140] Of course, the first direction depends on the arrangement positions of the multiple connection nodes in the first connection disk 211. The first direction can also be other directions, which is not limited in the embodiment of the present application.

[0141] The embodiment of the present application does not limit the number of the second through holes and the second conductive branches 42. In the conductive layer 40 shown in Figures 3a to 7, the number of the second through hole and the second conductive branch 42 is one.

[0142] In other possible implementations, as shown in Figures 8a-8c, the number of second through holes is n, the number of second conductive branches 42 is n, and the j-th second conductive branch 42 is electrically connected to the second connecting plate through the j-th second through hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n.

[0143] At least two adjacent second conductive branches 42 are connected to the second connection portion, for example, at least two adjacent second conductive branches 42 are connected to the second connection portion b, and / or at least three adjacent second conductive branches 42 are connected to the second connection portion b.

[0144] As shown in FIG. 8 a , when there are only one first connection portion a and one second connection portion b, the first connection portion a and the second connection portion b are connected via a connecting conductive branch 43 .

[0145] As shown in Figure 8b, when there are multiple first connection parts a (for example, two) and one second connection part b, the connecting conductive branch 43 includes a first connecting conductive branch 431 and a second connecting conductive branch 432. The first connecting part a1 is connected to the first connecting part a2 through the first connecting conductive branch 431, and the first connecting conductive branch 431 is connected to the second connecting part b through the second connecting conductive branch 432.

[0146] As shown in Figure 8c, when there are multiple first connection parts a and second connection parts b (for example, two), the connecting conductive branch 43 includes a first connecting conductive branch 431, a second connecting conductive branch 432, and a third connecting conductive branch 433. The first connecting part a1 is connected to the first connecting part a2 through the first connecting conductive branch 431, the second connecting part b1 is connected to the second connecting part b2 through the second connecting conductive branch 432, and the first connecting conductive branch 431 is connected to the second connecting conductive branch 432 through the third connecting conductive branch 433.

[0147] In some possible implementations, as shown in FIG. 8 a - FIG 8 c , the embodiment of the present application does not limit the shape of each connected conductive branch 43 , but only needs to ensure that the physical length of each connected conductive branch 43 meets the equivalent inductance value required by the design.

[0148] In some possible implementations, the embodiments of the present application do not limit the shape and total length of each first conductive branch 41 and each second conductive branch 42, and thus do not limit the length of each path from the m connection nodes on the first connection plate 211 through the conductive layer 40 to the n connection nodes on the second connection plate 221.

[0149] To improve the phase balance of each connection node and avoid significant differences in signal delay between paths when transmitting signals from the m connection nodes on the first connection pad 211 to the n connection nodes on the second connection pad 221 due to significant differences in path lengths from the m connection nodes on the first connection pad 211 through the conductive layer 40 to the n connection nodes on the second connection pad 221, the total length of any first conductive branch 41 can be L1, while the total lengths of the other first conductive branches 41 can range from (1-0.3)L1 to (1+0.3)L1, where L1 is a positive number. Alternatively, when the number of second conductive branches is n, the total length of any second conductive branch 42 can be L2, while the total lengths of the other second conductive branches 42 can range from (1-0.3)L2 to (1+0.3)L2, where L2 is a positive number.

[0150] Furthermore, as shown in Figures 2a-2b, 5b, 6, and 8a-8c, the total lengths of the m first conductive branches 41 are all the same; and / or the total lengths of the n second conductive branches 42 are all the same. In this way, the length of the path from any connection node on the first connection pad 211 through the conductive layer 40 to any connection node on the second connection pad 221 is the same as the length of the path from other connection nodes on the first connection pad 211 through the conductive layer 40 to other connection nodes on the second connection pad 221. When signals are transmitted from the m connection nodes on the first connection pad 211 to the n connection nodes on the second connection pad 221, the signal delays between the various paths are the same.

[0151] Of course, other methods can also be used to connect the m first conductive branches 41 and the n second conductive branches 42 using the connecting conductive branch 43, and this embodiment of the present application is not limited to this. For example, as shown in Figure 8d, every two adjacent second conductive branches 42 can share one another. And / or every two adjacent first conductive branches 41 can share one another.

[0152] As shown in Figures 8a-8c, the above describes a case where m first conductive branches 41 are electrically connected to the same first connection pad 211 through m first through-holes, and n second conductive branches 42 are electrically connected to the same second connection pad 221 through n second through-holes. In other embodiments, as shown in Figures 9a and 9b, the first electronic device 21 has multiple first connection pads 211, and the second electronic device 22 has multiple second connection pads 221. The m first conductive branches 41 are electrically connected to different first connection pads 211, and / or the n second conductive branches 42 are electrically connected to different second connection pads 221.

[0153] For example, as shown in FIG. 9 a , the two first conductive branches 41 are electrically connected to the two first connection pads 211 , respectively, and the two second conductive branches 42 are electrically connected to the two second connection pads 221 , respectively.

[0154] For another example, as shown in FIG9b , four first conductive branches 41 are electrically connected to the same first connection pad 211 , the first second conductive branch 42 and the second second conductive branch 42 are electrically connected to the first second connection pad 221 , and the third second conductive branch 42 and the fourth second conductive branch 42 are electrically connected to the second second connection pad 221 .

[0155] The example shown in Figure 9b can be applied to a combiner, where the first second connection pad 221 on the second electronic device 22 is used to transmit the first signal, and the second second connection pad 221 on the second electronic device 22 is used to transmit the second signal. The first signal and the second signal are transmitted to the same first connection pad 211 of the first electronic device 21 through the conductive layer 40, thereby realizing signal combining.

[0156] In some possible implementations, in the example shown in FIG9 b , the first first conductive branch 41 and the second first conductive branch 41 are connected to the first connection portion a1, the third first conductive branch 41 and the fourth first conductive branch 41 are connected to the first connection portion a2, the first second conductive branch 42 and the second second conductive branch 42 are connected to the second connection portion b1, and the third second conductive branch 42 and the fourth second conductive branch 42 are connected to the second connection portion b2. Based on the example shown in FIG9 b , as shown in FIG9 c , the first connection portion a1, the first connection portion a2, the second connection portion b1, and the second connection portion b2 are connected via a connecting conductive branch 43.

[0157] It should be understood that multiple connection nodes in the same first connection pad 211 are electrically connected, and multiple connection nodes in the same second connection pad 221 are electrically connected, while multiple connection nodes in different first connection pads 211 are electrically isolated, and multiple connection nodes in the same second connection pad 221 are electrically isolated.

[0158] In some embodiments, as shown in Figures 10a-10c, there are multiple conductive layers 40, and the multiple conductive layers 40 are arranged in the same layer. The present embodiment does not limit the arrangement of the multiple conductive layers 40. The arrangement of the multiple conductive layers 40 depends on the position and arrangement of the first connection pads 211 and the second connection pads 221 electrically connected to the multiple conductive layers 40. For example, the multiple conductive layers 40 are arranged along the X direction.

[0159] In some possible implementations, due to design requirements, the multiple first connection pads 211 and the multiple second connection pads 221 corresponding to the multiple conductive layers 40 need to be electrically connected. Based on this, as shown in FIG10c, in an embodiment of the present application, the first conductive branches 41 of the multiple conductive layers 40 are also electrically connected to different first connection pads 211 of the same first electronic device 21, and the second conductive branches 42 of the multiple conductive layers 40 are also electrically connected to different second connection pads of the same second electronic device 22.

[0160] In some possible implementations, as shown in Figures 11a and 11b, the first electronic device 21 may include a third connection pad 212 in addition to the first connection pad 211; and / or the second electronic device 22 may include a fourth connection pad 222 in addition to the second connection pad 221. The third connection pad 212 and the fourth connection pad 222 may also perform other functions, which are not limited in this embodiment of the present application.

[0161] In some possible implementations, as shown in FIG12 a , the conductive layer 40 may include, in addition to the first conductive branch 41, the second conductive branch 42, and the connecting conductive branch 43, a first auxiliary conductive layer 44 and a second auxiliary conductive layer 45. The first conductive branch 41 is electrically connected to the first connection pad 211 via the first auxiliary conductive layer 44, and the second conductive branch 42 is electrically connected to the second connection pad 221 via the second auxiliary conductive layer 45.

[0162] On this basis, as shown in FIG12b , there are multiple first auxiliary conductive layers 44 and multiple second auxiliary conductive layers 45, and the RF chip may further include a first component 46 and a second component 47. Two adjacent first auxiliary conductive layers 44 may be electrically connected via the first component 46, and two adjacent second auxiliary conductive layers 44 may be electrically connected via the second component 47. The first component 46 and the second component 47 may be chip resistors, chip capacitors, thin film resistors, thin film capacitors, etc.

[0163] In some possible implementations, as shown in Figure 2, the surface of the dielectric layer 30 facing away from the first electronic device 21 can be a flat surface; or, as shown in Figure 13, the surface of the dielectric layer 30 facing away from the first electronic device 21 can be a slope, which is not limited to this embodiment of the present application.

[0164] The above describes a case where the RF module includes a first electronic device 21 and a second electronic device 22. In other embodiments, as shown in Figure 14a and Figure 14b, there are multiple first electronic devices 21, and the second electronic devices 22 are located between adjacent first electronic devices 21; and / or, there are multiple second electronic devices 22, and the first electronic device 21 is located between adjacent second electronic devices 22.

[0165] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A radio frequency module, characterized in that: include: A first electronic device and a second electronic device, the first electronic device comprising a first connection pad, the second electronic device comprising a second connection pad; a dielectric layer covering the first electronic device and the second electronic device, the dielectric layer comprising a first through hole and a second through hole, the number of the first through holes being m; A conductive layer disposed on the dielectric layer, the conductive layer comprising a first conductive branch and a second conductive branch; The number of the first conductive branches is m, the i-th first conductive branch is electrically connected to the first connecting plate through the i-th first through hole; the second conductive branch is electrically connected to the second connecting plate through the second through hole; wherein m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

2. The radio frequency module according to claim 1, characterized in that: At least two adjacent first conductive branches are connected to a first connecting portion, and the second conductive branch is connected to the first connecting portion.

3. The radio frequency module according to claim 1 or 2, characterized in that: The number of the second through holes is n, the number of the second conductive branches is n, and the jth second conductive branch is electrically connected to the second connecting plate through the jth second through hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n.

4. The radio frequency module according to claim 3, characterized in that: At least two adjacent second conductive branches are connected to the second connecting portion; The conductive layer further includes connected conductive branches, and the connected conductive branches are respectively connected to the first connecting portion and the second connecting portion.

5. The radio frequency module according to any one of claims 2 to 4, characterized in that: The total length of any one of the first conductive branches is L1, and the total lengths of the other first conductive branches range from (1-0.3)L1 to (1+0.3)L1; wherein L1 is a positive number; and / or, When the number of the second conductive branches is n, the total length of any second conductive branch is L2, and the total lengths of other second conductive branches range from (1-0.3)L2 to (1+0.3)L2; wherein L2 is a positive number.

6. The radio frequency module according to claim 5, characterized in that: The total lengths of the m first conductive branches are all the same; and / or, When the number of the second conductive branches is n, the total lengths of the n second conductive branches are all the same.

7. The radio frequency module according to any one of claims 3 to 6, characterized in that: The number of the first connection pads in the first electronic device is multiple, and the number of the second connection pads in the second electronic device is multiple; The m first conductive branches are all electrically connected to the same first connecting pad; or, the m first conductive branches are respectively electrically connected to different first connecting pads; and / or, The n second conductive branches are all electrically connected to the same second connecting pad; or, the n second conductive branches are respectively electrically connected to different second connecting pads.

8. The radio frequency module according to any one of claims 3 to 7, characterized in that: The first conductive branch is electrically connected to m first connection nodes in the first connection plate, and the second conductive branch is electrically connected to n second connection nodes in the second connection plate; The distance between each two adjacent first connection nodes is the same as the distance between each two adjacent second connection nodes; or The distance between each two adjacent first connection nodes is different from the distance between each two adjacent second connection nodes.

9. The radio frequency module according to any one of claims 1 to 8, characterized in that: There are multiple conductive layers, and the multiple conductive layers are arranged in the same layer.

10. The radio frequency module according to claim 9, characterized in that: The first conductive branches of the plurality of conductive layers are electrically connected to different first connection pads of the same first electronic device, respectively, and the second conductive branches of the plurality of conductive layers are electrically connected to different second connection pads of the same second electronic device.

11. The radio frequency module according to any one of claims 1 to 10, characterized in that: There are multiple first electronic devices, and the second electronic devices are located between adjacent first electronic devices; and / or, There are multiple second electronic devices, and the first electronic devices are located between adjacent second electronic devices.

12. A method for preparing a radio frequency module, characterized in that: include: Providing a first electronic device and a second electronic device, wherein the first electronic device comprises a first connection pad, and the second electronic device comprises a second connection pad; Covering the first electronic device and the second electronic device with a dielectric layer, wherein the dielectric layer comprises a first through hole and a second through hole, and the number of the first through holes is m; A conductive layer is formed on the dielectric layer, the conductive layer comprising a first conductive branch and a second conductive branch; the number of the first conductive branches is m, the i-th first conductive branch is electrically connected to the first connecting plate through the i-th first through hole; the second conductive branch is electrically connected to the second connecting plate through the second through hole; wherein m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

13. The method for preparing a radio frequency module according to claim 12, characterized in that: At least two adjacent first conductive branches are connected to a first connecting portion, and the second conductive branch is connected to the first connecting portion.

14. The method for preparing a radio frequency module according to claim 12 or 13, characterized in that: The number of the second through holes is n, the number of the second conductive branches is n, and the jth second conductive branch is electrically connected to the second connecting plate through the jth second through hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n.

15. The method for preparing a radio frequency module according to claim 14, characterized in that: At least two adjacent second conductive branches are connected to the second connecting portion; The conductive layer further includes connected conductive branches, and the connected conductive branches are respectively connected to the first connecting portion and the second connecting portion.

16. The method for preparing a radio frequency module according to any one of claims 13 to 15, characterized in that: The total length of any one of the first conductive branches is L1, and the total lengths of the other first conductive branches range from (1-0.3)L1 to (1+0.3)L1; wherein L1 is a positive number; and / or, When the number of the second conductive branches is n, the total length of any second conductive branch is L2, and the total lengths of other second conductive branches range from (1-0.3)L2 to (1+0.3)L2; wherein L2 is a positive number.

17. The method for preparing a radio frequency module according to claim 16, characterized in that: The total lengths of the m first conductive branches are all the same; and / or, When the number of the second conductive branches is n, the total lengths of the n second conductive branches are all the same.

18. An electronic device, characterized in that: It comprises a circuit board and the radio frequency module according to any one of claims 1 to 11, wherein the radio frequency module is arranged on the circuit board.

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