Thermally conductive composite material comprising artificial diamond filler and manufacturing method therefor

Abstract

The present disclosure provides a thermally conductive composite material comprising an artificial diamond filler and a manufacturing method therefor. The thermally conductive composite material includes a polymer resin and a thermally conductive filler, the thermally conductive filler comprising a main filler, a first auxiliary filler, and a second auxiliary filler, wherein the main filler, the first auxiliary filler, and the second auxiliary filler may have different average particle diameters.

Description

Thermally conductive composite material containing artificial diamond filler and method for manufacturing the same

[0001] The present disclosure relates to a thermally conductive composite material and a method for manufacturing the same, and more particularly, to a thermally conductive composite material including an artificial diamond filler and a method for manufacturing the same.

[0002] Due to the miniaturization and multi-functionality of electronic products, semiconductor chip packaging technology is becoming more advanced. As a result, the power consumption of package modules is rapidly increasing, and the problem of heat generation within the package is becoming serious.

[0003] For example, in the case of materials for semiconductor packaging, as the design integration of semiconductor chips becomes more advanced, the importance of the packaging process, which is a semiconductor post-process, is increasing day by day compared to the existing semiconductor pre-process. In particular, as the number of layers of NAND chips increases to over 300, and the line width of DRAM chips becomes more advanced to 2 nm or less, the amount of heat generated is also increasing.

[0004] Another example is the electric vehicle battery management system (BMS). As operating voltage increases, heat generation is rapidly increasing, and this has been identified as a cause of fires in some electric vehicles. Consequently, the need for thermally conductive materials with a thermal conductivity of 20 W / mK or higher for module packaging is growing. Accordingly, led by US silicon manufacturers, the global market for thermally conductive composite materials for semiconductor packaging is growing by over KRW 100 billion annually, with the domestic market accounting for approximately 10% of this growth.

[0005] Previously, to solve the heat generation problem of these electronic components, aluminum oxide (or alumina) (Aluminum Oxide, Alumina, Al2O3) was used for thermal conductivity levels of 1 to 7 W / mK, and aluminum nitride (AlN) was used for levels of 7 to 10 W / mK. However, in the case of thermally conductive materials (heat dissipation materials) that apply these ceramic fillers, the maximum achievable thermal conductivity is less than 10 W / mK, and the thermal conductivity performance of the thermally conductive material is somewhat poor.

[0006] While existing fillers such as Ag and Cu have been applicable to materials with thermal conductivity exceeding 20 W / mK, their electrical insulation properties have limited their versatile use. Therefore, there is a need to develop a thermally conductive composite material that can simultaneously achieve electrical insulation and thermal conductivity exceeding 20 W / mK.

[0007] Embodiments disclosed herein provide a thermally conductive composite material including an artificial diamond filler and a method for manufacturing the same to solve the above-described problems.

[0008] A thermally conductive composite material according to one embodiment of the present disclosure includes a polymer resin and a thermally conductive filler, wherein the thermally conductive filler includes a main filler, a first auxiliary filler, and a second auxiliary filler, and the main filler, the first auxiliary filler, and the second auxiliary filler may have different average particle diameters.

[0009] According to one embodiment of the present disclosure, the main filler has an average particle size of 50 It may correspond to an artificial diamond.

[0010] According to one embodiment of the present disclosure, the first auxiliary filler has an average particle size of 5 to 30 It may correspond to artificial diamond or aluminum oxide.

[0011] According to one embodiment of the present disclosure, the second auxiliary filler has an average particle size of 0.1 to 3.0 It may correspond to artificial diamond or aluminum oxide.

[0012] According to one embodiment of the present disclosure, the polymer resin may correspond to a silicone resin.

[0013] According to one embodiment of the present disclosure, the thermally conductive filler may include 30 to 90 wt% of the main filler, 5 to 50 wt% of the first auxiliary filler, and 5 to 50 wt% of the second auxiliary filler, respectively, in proportion to the total weight of the thermally conductive filler.

[0014] A thermal adhesive for a TIM (Thermal Interface Material) according to one embodiment of the present disclosure may include a thermally conductive composite material according to another embodiment of the disclosure.

[0015] According to one embodiment of the present disclosure, the thermal conductivity of the thermally conductive composite material may be equal to or greater than 20 W / mK.

[0016] According to one embodiment of the present disclosure, the withstand voltage strength of the thermally conductive composite material may be equal to or greater than 10 kV / mm.

[0017] A method for manufacturing a thermally conductive composite material according to one embodiment of the present disclosure includes a step of diluting a polymer resin in a solvent, a step of mixing a thermally conductive filler for increasing thermal conductivity into the solvent, a step of uniformly stirring the thermally conductive filler and the polymer resin, and a step of removing pores or solvent within the compound, wherein the thermally conductive filler may include a main filler, a first auxiliary filler, and a second auxiliary filler.

[0018] According to various embodiments of the present disclosure, a composite material having a thermal conductivity of 20 W / mK or higher can be realized while securing electrical insulation as a TIM material for semiconductor packaging.

[0019] According to various embodiments of the present disclosure, a thermally conductive composite material having a thermal conductivity of 20 W / mK or more can be realized by applying a diamond filler, compared to a thermally conductive composite material having a thermal conductivity of 7 to 12 W / mK by applying existing alumina and AlN fillers, thereby realizing a composite material having price competitiveness as a TIM thermal adhesive material for semiconductor packaging, the market of which is gradually expanding.

[0020] The effects of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs (referred to as “one skilled in the art”) from the description of the claims.

[0021] Embodiments of the present disclosure will be described below with reference to the accompanying drawings, wherein like reference numerals represent similar elements, but are not limited thereto.

[0022] FIG. 1 is a schematic diagram showing an example of a thermally conductive composite material including an artificial diamond filler according to one embodiment of the present invention.

[0023] FIG. 2 is a drawing showing an example of an SEM photograph of an aluminum oxide / aluminum nitride filler according to the prior art.

[0024] FIG. 3 is a drawing showing an SEM photograph of an artificial diamond filler according to one embodiment of the present invention.

[0025] FIG. 4 is a drawing showing the results of evaluating the heat dissipation performance of a heat dissipation adhesive for TIM according to one embodiment of the present invention together with the results of evaluating the heat dissipation performance of a conventional heat dissipation adhesive for TIM.

[0026] Figure 5 is a flowchart showing a method for manufacturing a thermally conductive composite material according to one embodiment of the present invention.

[0027] Hereinafter, specific details for implementing the present disclosure will be described in detail with reference to the attached drawings. However, in the following description, specific descriptions of widely known functions or configurations will be omitted if they may unnecessarily obscure the gist of the present disclosure.

[0028] In the attached drawings, identical or corresponding components are assigned the same reference numerals. Furthermore, in the description of the embodiments below, duplicate descriptions of identical or corresponding components may be omitted. However, even if a description of a component is omitted, it is not intended that such component is not included in any embodiment.

[0029] The advantages and features of the disclosed embodiments, and methods for achieving them, will become clearer with reference to the embodiments described below, along with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below and may be implemented in various different forms. These embodiments are provided solely to ensure the completeness of the disclosure and to fully inform those skilled in the art of the scope of the invention.

[0030] The terms used in this specification will be briefly explained, followed by a detailed description of the disclosed embodiments. The terms used in this specification have been selected from widely used, current terms, taking into account the functions of the present disclosure. However, these terms may vary depending on the intentions of engineers working in the relevant field, precedents, the emergence of new technologies, etc. Furthermore, in certain cases, terms may be arbitrarily selected by the applicant, and in such cases, their meanings will be described in detail in the relevant description of the invention. Therefore, the terms used in this disclosure should not be defined simply as names of terms, but rather based on their meanings and the overall content of the present disclosure.

[0031] In this specification, singular expressions include plural expressions unless the context clearly indicates otherwise. Furthermore, plural expressions include singular expressions unless the context clearly indicates otherwise. When a part of the specification is said to include a component, this does not exclude other components, but rather implies that other components may be included, unless otherwise specifically stated.

[0032] Throughout this specification, whenever a part is said to "include" a component, this means that it may include other components, but not to the exclusion of other components, unless otherwise specifically stated.

[0033] The term "about" used throughout this specification is used to encompass the tolerance when there is a tolerance.

[0034] Throughout this specification, the term "at least one" in a Markush format expression means including one or more selected from the group consisting of components described in the Markush format expression.

[0035] Throughout this specification, references to “A and / or B” mean “A, or B, or A and B.”

[0036] In the present disclosure, the term “particle size” may refer to a straight line length measured along the inner diameter of a spherical structure such as a particle in a powder or liquid. For example, the expression “a filler having a particle diameter of 10 mm” may mean that the effective diameter of the particles constituting the filler is 10 mm. In addition, in the present disclosure, the term “average particle size” is a statistical concept used to measure and express the particle size in a powder or liquid, and is a value that summarizes the data distribution obtained by measuring the particle diameters of a diverse set of dispersed particles into a single number, and may refer to a weight-average particle diameter or a number-average particle diameter.

[0037] In this disclosure, "synthetic diamond (or lab-grown diamond, LGD)" may refer to a compound or particle of such a compound with physical and chemical properties very similar to diamond, created through human-controlled rearrangement of the crystal structure of carbon. Diamond is a mineral composed of pure carbon, with each carbon atom forming a fixed ring structure with four neighboring atoms, forming a crystal structure. Similarly, in the crystal structure of synthetic diamond, each atom is arranged in a tetrahedral structure through covalent bonds, forming an extremely strong solid structure.

[0038] For example, the High Temperature High Pressure (HTHP) method best mimics the natural state in which natural diamonds are formed, and can create synthetic diamonds by arranging carbon atoms into a crystal structure under high temperature and high pressure. Another example is the Chemical Vapor Deposition (CVD) method, which creates diamonds by gradually depositing carbon gas in a high-temperature plasma state under high temperature and high pressure. Synthetic diamonds created through these methods can have different characteristics, and these differences can vary depending on the specific purpose or application, such as the manufacturing process, atomic arrangement, and inclusions.

[0039] In the present disclosure, 'polymer resin' may refer to a material whose main component is a polymer, which is a large molecule formed by linking small monomers. For example, the polymer resin may refer to polymethyl methacrylate (PMMA) resin, polyacrylonitrile (PAN) resin, polyacrylic acid (PAA), silicone resin, polyvinyl chloride (PVC) resin, polyethylene resin, melamine resin, polystyrene resin, phenol (Phenol formaldehyde) resin, nylon resin, or a material comprising at least one or more of these.

[0040] In the present disclosure, 'solvent' may refer to a liquid polar or non-polar substance used to dilute a polymer resin. For example, the solvent may refer to a substance including cyclohexanone, dichloromethane, N-methyl-2-pyrrolidone (NMP), dimethylformamide (DMF), dimethylacetamide (DMAc), methyl isobutyl ketone (MIBK), toluene, tetrahydrofuran (THF), propylene glycol monomethyl ether acetate (PMA), acetone, dibasic ester (DBE), dimethyl carbonate (DMC), cyclohexane, methyl ethyl ketone (MEK), or a combination of at least one of these.

[0041] In the present disclosure, a TIM (Thermal Interface Material) may refer to a material used between a heat-generating component and a heat-absorbing component to enhance heat conduction efficiency. For example, a TIM can fill the gap between a heat-generating component, such as a CPU or GPU, in an electronic device or computer and a heat-absorbing component, such as a heat sink or cooling fan, thereby reducing thermal resistance and improving heat transfer efficiency.

[0042] Specifically, TIM may correspond to thermal grease, thermal pads, thermal adhesives, thermally conductive tapes, or phase change materials. The type of TIM used in the present disclosure may vary depending on various factors such as the characteristics of the device to which it is applied, heat transfer requirements, and ease of installation.

[0043] In the present disclosure, 'heat transfer' may refer to a process in which heat is propagated by transferring energy through molecules or ions within or between materials. In addition, in the present disclosure, 'thermal conductivity' may refer to a value measured by the heat transfer rate according to the temperature difference in unit length per unit area. Specifically, thermal conductivity may be expressed in units of watts per meter*kelvin (W / mK) in the International System of Units (SI). Here, W represents watts, m represents meters, and K represents kelvin. For example, for a material with a thermal conductivity of 1 W / mK, 1 watt of heat is transferred when a temperature difference of 1 Kelvin occurs inside a 1-meter-long object with two sides having an area of ​​1 m2. The thermal conductivity of a material may vary depending on the physical properties and structure of the material, and the heat transfer coefficient, which indicates the material's ability to conduct heat.

[0044] In the present disclosure, 'dielectric withstanding voltage' may refer to the limit of how much electricity can flow inside a material or substance when it is placed in an electric field. Specifically, dielectric withstanding voltage is a physical property that indicates how much electricity a material can withstand, and as an important indicator for evaluating the performance of electrical insulators, it can indicate the material's resistance to electrical stress generated by an electric field. In addition, the unit of dielectric withstanding voltage can be expressed as volts per meter (V / m), which indicates the internal resistance to an electric field that occurs when a voltage difference of 1 volt is applied between two poles of a material over a length of 1 meter. The higher the dielectric withstanding voltage, the stronger the insulating effect the material can exhibit by blocking electricity within the material, and this can vary depending on the material's molecular structure and electrical properties.

[0045] FIG. 1 is a schematic diagram showing an example of a thermally conductive composite material including an artificial diamond filler according to one embodiment of the present invention. As illustrated, in one embodiment, the thermally conductive composite material (100) may include a polymer resin (110) and a thermally conductive filler (120). Since the thermally conductive composite material (100) is a material for semiconductor packaging and must have electrical insulation properties and high thermal conductivity, it may be composed of a polymer resin (110) having insulation properties and a thermally conductive filler (120) having high thermal conductivity. As described below in FIG. 5, the polymer resin (110) and the thermally conductive filler (120) may be uniformly stirred during the process of manufacturing the thermally conductive composite material (100). As a result, the thermally conductive filler (120) particles may be consistently distributed between the polymer resin (110) particles.

[0046] According to one embodiment, the polymer resin (110) may correspond to a silicone resin. Here, the silicone resin may refer to an organic polymer containing a silicon-oxygen bond or a siloxane bond in its molecular structure. Specifically, the silicone resin is a polymer having various molecular structures with multiple branches, and is generally represented by the formula R n SiX m O y (R: non-reactive substituent, X: functional group). Non-reactive substituents may include methyl groups, phenyl groups, vinyl groups, or methylphenyl groups, and functional groups may include hydrogen (H), hydroxyl groups, halogen groups such as chlorine, or alkoxy groups. Various non-reactive substituents or functional groups can be adjusted or substituted to suit specific high-temperature stability, durability, electrical insulation, etc. required by the thermally conductive composite material. For example, to improve the mechanical strength of the thermally conductive composite material, the user can select a vinyl group capable of forming cross-links with the non-reactive substituent of the silicone resin.

[0047] In addition, the polymer resin (110) may refer to a polymer material utilized by those skilled in the art in various industrial fields including medical devices, automobile parts, food processing equipment, and electronic products.

[0048] In addition, in one embodiment according to the present disclosure, the thermally conductive filler (120) may include a main filler (122), a first auxiliary filler (124), and a second auxiliary filler (126). In addition, the main filler (122), the first auxiliary filler (124), and the second auxiliary filler (126) included in the thermally conductive filler (120) may have different average particle sizes. Here, the main filler (122) may refer to a composition material of the thermally conductive filler (120) that accounts for the highest proportion in terms of the total weight of the thermally conductive filler in the thermally conductive filler (120), and the first auxiliary filler (124) and the second auxiliary filler (126) may refer to composition materials of the thermally conductive filler (120) that account for a smaller proportion in terms of the total weight of the thermally conductive filler than the main filler (122).

[0049] For example, in one embodiment, the main filler (122) has an average particle diameter of 50 It may correspond to an artificial diamond. In addition, in another embodiment, the first auxiliary filler (124) has an average particle diameter of 5 to 30 It may correspond to artificial diamond or aluminum oxide. According to another embodiment, the second auxiliary filler (126) has an average particle size of 0.1 to 3.0 It may correspond to artificial diamond or aluminum oxide.

[0050] In one embodiment according to the present disclosure, the thermally conductive filler may include 30 to 90 wt% of the main filler, 5 to 50 wt% of the first auxiliary filler, and 5 to 50 wt% of the second auxiliary filler, respectively, in proportion to the total weight of the thermally conductive filler. For example, the thermally conductive filler may have an average particle size of 50 wt% in proportion to the total weight of the thermally conductive filler. 80 wt% of artificial diamond, average particle size 15 Artificial diamond of 10 wt% and average particle size of 3.0 The thermal conductivity of a thermally conductive composite material including a thermally conductive filler containing 10 wt% of aluminum oxide can be equal to or greater than 20 W / mK.

[0051] FIG. 2 is a drawing showing an example of an SEM photograph of an aluminum oxide / aluminum nitride filler according to the prior art. According to the prior art, a thermally conductive composite can be manufactured using aluminum oxide having a theoretical thermal conductivity of about 40 W / m·K and aluminum nitride having a theoretical thermal conductivity of about 300 W / m·K as fillers. The thermal conductivities of the thermally conductive composites including the aluminum oxide / aluminum nitride fillers manufactured in this way are both observed to be around 7 W / mK. The reason for the difference between the theoretical thermal conductivities of aluminum oxide and aluminum nitride used as fillers and the thermal conductivity of the thermally conductive composite can be due to a decrease in thermal conductivity caused by the resin forming the sheet and a decrease in thermal conductivity caused by oxidation of the surface of the aluminum nitride powder upon exposure to moisture in the air.

[0052] Furthermore, the micropores formed within the aluminum nitride powder during synthesis can significantly impede heat transfer. To address this, a thermally conductive filler with higher thermal conductivity and resistance to atmospheric moisture is required.

[0053] Fig. 3 is a drawing showing an SEM photograph of an artificial diamond filler according to one embodiment of the present invention. As shown, the artificial diamond (310) has an average particle diameter of 50 may correspond to. For example, artificial diamond (310) may correspond to the main filler (122) in Fig. 1.

[0054] Average particle size 50 The artificial diamond (310) has high thermal conductivity (2000 W / mK) due to very high frequency lattice vibration, so it can transfer a lot of heat. However, as the size of the particles within the material increases, the relative contact area between the particles decreases, which may reduce the heat transfer path. Therefore, as shown in Fig. 1, by using a first auxiliary filler (124) or a second auxiliary filler (126) having a smaller particle size than the main filler (122), the gap between the particles is reduced to secure a heat transfer path, thereby ensuring high thermal conductivity of the thermally conductive filler (120).

[0055] According to one embodiment of the present disclosure, a composite material having a thermal conductivity of 20 W / mK or higher can be realized while securing electrical insulation as a TIM material for semiconductor packaging.

[0056] FIG. 4 is a drawing showing the results of evaluating the heat dissipation performance of a heat dissipation adhesive for TIM according to one embodiment of the present invention together with the results of evaluating the heat dissipation performance of a conventional heat dissipation adhesive for TIM.

[0057] Here, thermal adhesives can refer to special adhesives used to effectively manage the heat of electronic devices or machines while also bonding components together. Conventional thermal adhesives for TIMs can be manufactured by mixing thermally conductive materials, such as metal particles such as silver, copper, and aluminum, with adhesive materials, such as polymers such as epoxy, silicone, and acrylic. These thermal adhesives for TIMs are applied between heat-generating components and heat-absorbing components, such as heat sinks or cooling fans, to enhance heat transfer while stably bonding the components together.

[0058] A thermal adhesive for a TIM (Thermal Interface Material) according to one embodiment of the present disclosure may include a thermally conductive composite material according to another embodiment of the present disclosure. For example, a thermal adhesive for a TIM according to the present disclosure may include a silicone resin and a thermally conductive filler having an average particle size of 50 in a ratio relative to the total weight of the silicone resin and the thermally conductive filler. 80 wt% of artificial diamond, average particle size 15 Artificial diamond of 10 wt% and average particle size of 3.0 A thermally conductive composite material may include a thermally conductive filler comprising 10 wt% of aluminum oxide.

[0059] In addition, the thermal conductivity of the thermally conductive composite material included in the thermal adhesive for the TIM (Thermal Interface Material) according to one embodiment of the present disclosure may correspond to 20 W / mK or more, and the withstand voltage strength may correspond to 10 kV / mm or more.

[0060] As illustrated in FIG. 4, the results of the heat dissipation performance evaluation of the heat dissipation adhesive for TIM according to an embodiment of the present invention show that, when compared with the results of the heat dissipation performance evaluation of the heat dissipation adhesive for conventional TIM1 (Thermal Interface Material 1), an improvement in thermal conductivity performance of about 15% or more can be observed over the same period of time. Specifically, the temperature of the conventional TIM1 reached about 52 degrees Celsius after about 20 minutes from the start of the heat dissipation performance test, but it can be confirmed that the temperature of the heat dissipation adhesive for TIM according to an embodiment of the present invention reached about 45 degrees.

[0061] Here, TIM1 can refer to a type of thermal interface material (TIM) used in electronic devices, particularly between a processor die, a semiconductor chip that directly generates heat, and a heat spreader, a component used to quickly and effectively dissipate heat. For example, in conventional TIM1, solder preforms with the exact shape and thickness to perfectly fit between the processor die and the heat spreader can be manufactured to have high heat transfer efficiency.

[0062] In addition, the thermal adhesive for TIM according to one embodiment may be used in a package such as a flip chip ball grid array (fcBGA), a flip-chip chip scale package (fcCSP), a package on package (PoP), a system in package (SiP), or a system in chip (SiC), which are state-of-the-art semiconductor packages, to transfer heat generated from a processor die to a heat spreader lid.

[0063] The heat generated during the operation of electronic devices can degrade the performance of the devices or cause them to malfunction. Therefore, a thermal adhesive for a TIM that dissipates this heat can play a crucial role in improving the performance of the electronic devices, extending their lifespan, and maintaining their stability. Therefore, the thermal adhesive for a TIM according to the present disclosure can be appropriately modified from the disclosed range of configurations to suit the user's requirements and the characteristics of the device, depending on its application field and characteristics.

[0064] According to various embodiments of the present disclosure, a thermally conductive composite material having a thermal conductivity of 7 to 12 W / mK by applying a diamond filler is realized, compared to a thermally conductive composite material having a thermal conductivity of 7 to 12 W / mK by applying a conventional alumina and AlN filler, thereby realizing a thermally conductive composite material having a thermal conductivity of 20 W / mK or more and a dielectric strength of 10 kV / mm or more, thereby realizing a composite material having price competitiveness as a TIM thermal adhesive material for semiconductor packaging, the market of which is gradually expanding.

[0065] Hereinafter, a manufacturing method for implementing a thermally conductive composite material according to the present disclosure will be described in more detail.

[0066] Figure 5 is a flowchart illustrating a method for manufacturing a thermally conductive composite material according to one embodiment of the present invention. The method (500) for manufacturing a thermally conductive composite material may begin by diluting a polymer resin in a solvent (S510). Here, the polymer resin may correspond to a silicone resin. In one embodiment, the solvent may include a dispersant to increase interaction with inorganic materials such as diamond or aluminum oxide. Specifically, the dispersant may correspond to a surfactant or stabilizer commonly used in the art, such as coumarin.

[0067] After that, a thermally conductive filler for increasing thermal conductivity can be mixed into the solvent (S520). Here, the thermally conductive filler may include a main filler, a first auxiliary filler, and a second auxiliary filler. In addition, the main filler, the first auxiliary filler, and the second auxiliary filler may have different average particle sizes. For example, the main filler may have an average particle size of 50 corresponds to an artificial diamond, and the first auxiliary filler (124) has an average particle size of 5 to 30 It may correspond to artificial diamond or aluminum oxide. In addition, the second auxiliary filler (126) has an average particle size of 0.1 to 3.0 It may correspond to artificial diamond or aluminum oxide. In addition, the thermally conductive filler may include 30 to 90 wt% of the main filler, 5 to 50 wt% of the first auxiliary filler, and 5 to 50 wt% of the second auxiliary filler, respectively, in proportion to the total weight of the thermally conductive filler.

[0068] After this, the thermally conductive filler and the polymer resin can be uniformly stirred (S530). Here, stirring can refer to a process of mechanically mixing a solvent containing the thermally conductive filler and the polymer resin to uniformly disperse each substance.

[0069] After this, voids or solvent within the compound can be removed (S540). Here, the compound may refer to a compound produced by uniformly mixing a thermally conductive filler and a polymer resin. In one embodiment, a vacuum degassing process may be performed to remove voids within the compound. In another example, the compound may be heated to evaporate an additional mixed solvent to uniformly disperse the conductive filler.

[0070] Although not shown, in one embodiment, a process of casting the mixed thermally conductive filler and polymer resin into a desired product shape may be additionally performed. For example, to produce a thermally conductive heat-radiating sheet, a thermally conductive composite material may be manufactured into a flat shape through casting, and then the thickness may be adjusted through a pressing process to produce the thermally conductive heat-radiating sheet.

[0071] While the present disclosure has been described in connection with certain embodiments herein, various modifications and variations may be made without departing from the scope of the present disclosure, which would be apparent to those skilled in the art. Furthermore, such modifications and variations are intended to fall within the scope of the claims appended to this specification.

[0072] The above preferred embodiments of the present invention are disclosed for the purpose of illustration, and those skilled in the art with ordinary knowledge of the present invention will be able to make various modifications, changes, and additions within the spirit and scope of the present invention, and such modifications, changes, and additions should be considered to fall within the scope of the patent claims.

[0073] Anyone having ordinary skill in the art to which the present invention pertains can make various substitutions, modifications, and changes within the scope that does not depart from the technical spirit of the present invention, and therefore the present invention is not limited to the above-described embodiments and the attached drawings.

Claims

1. In thermally conductive composite materials, polymer resin; and Thermally conductive filler Including, A thermally conductive composite material, wherein the thermally conductive filler comprises a main filler, a first auxiliary filler, and a second auxiliary filler, and the main filler, the first auxiliary filler, and the second auxiliary filler have different average particle diameters.

2. In paragraph 1, The above main filler has an average particle size of 50 A thermally conductive composite material equivalent to artificial diamond.

3. In paragraph 1, The above first auxiliary filler has an average particle size of 5 to 30 A thermally conductive composite material corresponding to artificial diamond or aluminum oxide.

4. In paragraph 1, The above second auxiliary filler has an average particle size of 0.1 to 3.0 A thermally conductive composite material corresponding to artificial diamond or aluminum oxide.

5. In paragraph 1, The above polymer resin is a thermally conductive composite material corresponding to silicone resin.

6. In paragraph 1, A thermally conductive composite material, wherein the thermally conductive filler comprises 30 to 90 wt% of the main filler, 5 to 50 wt% of the first auxiliary filler, and 5 to 50 wt% of the second auxiliary filler, in proportion to the total weight of the thermally conductive filler.

7. A thermal adhesive for TIM (Thermal Interface Material), comprising the thermally conductive composite material according to Article 1.

8. In paragraph 7, A thermally conductive adhesive for TIM, wherein the thermal conductivity of the above thermally conductive composite material is 20 W / mK or higher.

9. In paragraph 7, TIM heat-dissipating adhesive having a dielectric strength of 10 kV / mm or more of the above thermally conductive composite material.

10. In a method for manufacturing a thermally conductive composite material, A step of diluting a polymer resin in a solvent; A step of mixing a thermally conductive filler into the solvent to increase thermal conductivity; A step of uniformly stirring the above thermally conductive filler and the above polymer resin; and a step of removing pores or solvent within the compound. Including, A method for manufacturing a thermally conductive composite material, wherein the thermally conductive filler comprises a main filler, a first auxiliary filler, and a second auxiliary filler.

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