LED package including bump on window substrate and manufacturing method thereof

Abstract

The present invention relates to an LED package including a bump on a window substrate and a manufacturing method thereof, the LED package comprising: an LED chip having a light-emitting unit for emitting a light source on one surface and having an electrically connected connection pad unit on the other surface opposite to the one surface; a substrate including a plurality of windows perforated at predetermined intervals, a connection pad electrically connected to the outside and disposed on one surface other than the windows, a first contact surface provided on the connection pad close to the windows, a second contact surface provided on the connection pad further outward from the windows than the first contact surface, and a solder ball provided on the second contact surface, wherein the LED chip is disposed on the windows, the light-emitting unit is exposed toward the other surface, and the first contact surface and the connection pad unit are bonded by a conductive wire; and a fluorescent molded member covering the other surface of the substrate and having a groove, into which a portion of the light-emitting unit is inserted, and an inclined surface, which expands the emission angle of the light source emitted from the light-emitting unit.

Description

LED package including bumps on a window substrate and manufacturing method thereof

[0001] The present invention relates to an LED package including a window bump capable of diffusing a light source and a method for manufacturing the same.

[0002] In general, a light emitting diode (LED, hereinafter referred to as LED) is an electronic component that uses the pn junction structure of a semiconductor to create injected minority carriers (electrons or holes) and emit light through their recombination.

[0003] In addition, LEDs are attracting attention as next-generation lighting due to their advantages such as eco-friendliness, long lifespan, and high efficiency, and the application range of these LEDs is expanding from indoor lighting to outdoor streetlights, automobiles, marine lighting, deep-sea lighting, infrared lighting, and ultraviolet lighting.

[0004] Factors that determine these LED characteristics include color, brightness, and light conversion efficiency. These product characteristics are determined by the compound semiconductor material used in the LED chip and its structure, but are also greatly influenced by the structure for mounting the LED chip.

[0005] Therefore, in order to obtain a luminous effect according to user demand, it is necessary to improve the structure of the LED package and the materials used therein in addition to the material or structure of the LED chip.

[0006] In particular, as the scope of application of LED packages has gradually expanded from small lighting such as mobile terminals to general lighting indoors and outdoors, automotive lighting, and backlights for large LCDs (Liquid Crystal Displays), efforts are being made to improve efficiency and brightness.

[0007] However, the LED package is irradiated with light emitted from an LED chip mounted on a substrate, but the irradiation angle of the LED chip does not utilize the light emitted from the side of the LED chip, which causes the light efficiency of the light source to decrease, and there is a problem with the durability of the substrate due to the irradiated light source.

[0008] The present invention relates to an LED package including a bump on a window substrate and a method for manufacturing the same, and aims to provide an LED package capable of improving the emission and reflection efficiency of a light source and enhancing the durability of a substrate so as to increase the light efficiency emitted from the LED package.

[0009] The present invention relates to an LED package including a bump on a window substrate, and the LED package including a bump on a window substrate comprises: an LED chip having a light-emitting portion for emitting light on one surface and a connection pad portion for electrically connecting to the other surface opposite the one surface; a plurality of windows penetrating each other at a predetermined interval, a connection pad for electrically connecting to the outside on one surface excluding the windows, a first contact surface provided on the connection pad close to the windows, a second contact surface provided on the connection pad and further outward from the window than the first contact surface; and a solder ball provided on the second contact surface, wherein the LED chip is disposed on the window, the light-emitting portion is exposed toward the other surface, and the first contact surface and the connection pad portion are bonded with a conductive wire; and a fluorescent molding member covering the other surface of the substrate and having a recess into which a part of the light-emitting portion is inserted, and an inclined surface for expanding an irradiation angle of a light source emitted from the light-emitting portion.

[0010] In addition, a light reflecting layer may be included between the other surface of the substrate and the fluorescent molding member, in which a light reflecting material is applied or attached to reflect the light source emitted from the light emitting part toward the substrate by the fluorescent molding member.

[0011] In addition, it may include a heat dissipation layer formed on one surface of the substrate so that the conductive wire and a portion of the solder ball are submerged but a portion of the end of the solder ball is exposed.

[0012] Meanwhile, a method for manufacturing an LED package including a bump on a window substrate according to the present invention comprises: a step S10 of preparing a substrate having windows perforated at a predetermined interval from each other, a connection pad electrically connected to the outside on one side excluding the window, a first contact surface provided on the connection pad in proximity to the window, and a second contact surface provided further from the window than the first contact surface; a step S20 of generating a solder ball electrically connected to the second contact surface in step S10; a step S30 of forming a light-reflecting layer by applying or attaching a light-reflecting material that reflects a light source emitted from a side of a light-emitting part in proximity to the window on the other side of the substrate in step S20; a step S40 of applying or attaching a fluorescent molding member that mixes a transparent resin and a fluorescent material as a light-reflecting material on the other side of the substrate by aligning the centers of the windows and grooves of the substrate in step S30; and a step S40 of forming an LED chip having a light-emitting part that emits a light source on one side and a connection pad part on the other side, the light-emitting part being on the opposite side of one side of the substrate. It includes a step S50 of mounting the LED chip by inserting it into a window so that the light-emitting portion protrudes from the other surface of the substrate while being arranged toward the other surface, electrically connecting the positive electrodes of the LED chip between the connection pad portion and the first contact surface using a conductive wire, and a step S60 of forming a heat dissipation layer so that the conductive wire of the substrate and a part of the solder ball are submerged, while the remaining part of the solder ball is exposed to protrude.

[0013] The present invention relates to an LED package including a bump on a window substrate and a method for manufacturing the same, which can exhibit the following effects.

[0014] First, according to the LED package including a bump on a window substrate of the present invention and the manufacturing method thereof, there is an effect of providing an LED package capable of maximizing the light efficiency of an LED chip by maximizing the light angle and improving the reflection efficiency so as to increase the light efficiency emitted from the LED package.

[0015] Secondly, according to the LED package including a bump on the window substrate of the present invention and the manufacturing method thereof, a direct heat dissipation effect is possible on the heat-generating portion of the wire and conductive connection, and the optical loss due to the reflective layer is compensated for, so that the optical characteristics can be secured to the maximum.

[0016] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0017] FIG. 1 is a diagram showing an LED package including a bump on a window substrate according to the present invention.

[0018] FIGS. 2 to 9 are diagrams showing a method for manufacturing an LED package including a bump on a window substrate according to the present invention.

[0019] FIG. 10 is a diagram showing a sequence of a method for manufacturing an LED package including a bump on a window substrate according to the present invention.

[0020] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description have been omitted for clarity of description, and the same reference numerals designate identical or similar components throughout the specification.

[0021] In addition, the size and thickness of each component shown in the drawing are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to what is shown.

[0022] In the present invention, "on" means located above or below the target member, and does not necessarily mean located above in the direction of gravity. Furthermore, throughout the specification, when a part is said to "include" a component, this does not exclude other components, but rather means that other components may be included, unless otherwise specifically stated.

[0023] Additionally, throughout the specification, when a part is said to be "connected" to another part, this includes not only cases where it is "directly connected" but also cases where it is "indirectly connected" with another part in between.

[0024] FIG. 1 is a diagram showing an LED package including a bump on a window substrate according to the present invention, FIGS. 2 to 9 are diagrams showing a method for manufacturing an LED package including a bump on a window substrate according to the present invention, and FIG. 10 is a diagram showing a sequence for a method for manufacturing an LED package including a bump on a window substrate according to the present invention.

[0025] Hereinafter, an embodiment of an LED package including a bump on a window substrate of the present invention will be described with reference to the attached drawings.

[0026] Referring to FIG. 1, an LED package including a bump on a window substrate according to the present invention is described. The LED package including a bump on a window substrate includes an LED chip (10) having a light-emitting portion (11) for emitting a light source on one side and a connection pad portion (12) for electrically connecting to the other side opposite the one side, several windows (21) penetrating each other at a predetermined interval, an electrically connecting connection pad (22) integrated on one side (201) excluding the window (21), a first contact surface (221) provided on the connection pad (22) close to the window (21), a second contact surface (222) provided on the connection pad (22) further outward from the window (21) than the first contact surface (221), and a solder ball (23) provided on the second contact surface (222), and the LED chip (10) is arranged on the window (21). The substrate (20) has a light-emitting portion (11) exposed toward the other side (202) and a first contact surface (221) and a connection pad portion (12) wire-bonded, and includes a fluorescent molding member (40) that covers the other side (202) of the substrate (20) and the light-emitting portion (11) and expands the irradiation angle of the light source emitted from the light-emitting portion (11).

[0027] The LED chip (10) may be provided with a light-emitting portion (11) on one side and a connection pad portion (12) on the other side opposite the one side. The LED chip (10) has already been described above, and the LED chip (10) is generally configured to be mounted on a substrate (PCB; Printed Circuit Board) and to receive current from an electrode formed on the substrate to emit light, and a detailed description thereof will be omitted.

[0028] A number of windows (21) may be provided on the substrate (20) with a predetermined interval between them. The windows (21) are provided so that the LED chips (10) can pass through them by being perforated (penetrated) in a size that allows them to pass through, and the LED chips (10) can partially pass through them from one surface of the substrate (20) to the other surface, but the light-emitting portion (11) may be provided so that it is exposed or protrudes toward the other surface.

[0029] The window (21) may be made of a silicon or polymer resin series material between the substrate (20) in which the LED chip (10) is inserted (mounted), and in some cases, may be made of a material such as HPL (High Pressure Laminate) or a ceramic series material, or ceramic HPL.

[0030] The connection pad (22) is provided so as to be electrically connected to the outside on one side (201) excluding the window (21), and can be electrically connected to a first contact surface (221) provided on the connection pad (22) close to the window (21) and a second contact surface (222) provided on the connection pad (22) further outward from the window (21) than the first contact surface (221).

[0031] The first contact surface (221) may be provided on the connection pad (22) adjacent to the window (21) and may be provided with a material having high electrical conductivity so as to electrically connect (or connect, etc.) the connection pad (22) and the LED chip (10).

[0032] The second contact surface (222) is provided on the connection pad (22) on the outer side from the window (21) than the first contact surface (221), and may be provided with a material having high electrical conductivity so that the connection pad (22) and the solder ball (23) can be electrically connected. The second contact surface (222) may be provided with a solder ball (23) to be electrically connected.

[0033] The substrate (20) has a light-emitting portion (11) of an LED chip (10) partially protruding to the other surface (202) of the substrate (20) through a window (21). In addition, the first contact surface (221) of the substrate (20) is electrically connected to the connection pad portion (12) of the LED chip (10) by wire bonding, and a conductive wire (25) and a solder ball (23) can be formed together on the other surface (202) of the substrate (20).

[0034] Meanwhile, the size of the substrate increases due to the size of the solder ball, which makes it difficult to achieve a slim design as the volume increases. Therefore, according to another embodiment of the present invention, a pillar bump may be included between the connection pad and the solder ball.

[0035] Referring to Fig. 9, these pillar bumps (24) can be included to protrude on the second contact surface (222) and electrically connect the second contact surface (222) and the solder ball (23).

[0036] The pillar bump (24) can protrude on the second contact surface (222) to electrically connect the second contact surface (222) and the solder ball (23).

[0037] The pillar bump (24) may be formed into a columnar shape and may be provided with a metal filler. Here, the filler may be a material with good conductivity, for example, may be composed of any one of gold (Au), silver (Ag), platinum (Pt), aluminum (Al), iron (Fe), copper (Cu), platinum (Pt), chromium (Cr), and tin (Sn), and may preferably be provided with copper (Cu) to achieve a cost-saving effect.

[0038] The pillar bump (24) is connected to the second contact surface (222) on one side and to the solder ball (23) on the other side, so that an electrical connection is established between the second contact surface (222), i.e., the connection pad (22), and the solder ball (23).

[0039] For example, the pillar bumps (24) may have a predetermined height, and insulation may be provided between the pillar bumps (24) by a heat dissipation layer (30), such as an underfill, which is preferably formed to isolate the substrate (20) from another substrate.

[0040] According to this, the pillar bump (24) is provided to be locked together with the conductive wire (25) by the heat dissipation layer (30) described later, and a part of the solder ball (23) is also locked, but another part of the solder ball (23) protrudes outside the heat dissipation layer (30) and can be electrically connected to another substrate, etc.

[0041] This allows for the implementation of ultra-slim packages, securing product design diversity and enhancing competitiveness. This also enables the mass production of ultra-slim products.

[0042] Referring again to FIG. 1, one side (201) of the substrate (20) is electrically connected to the LED chip (10), and there is a problem that high heat generation occurs depending on the operation of the LED chip (10). Therefore, a heat dissipation layer (30) that cools the heat generation may be included on one side (201) of the substrate (20).

[0043] A heat dissipation layer (30) can be formed on one surface (201) of the substrate (20) so that a portion of the conductive wire (25) and the solder ball (23) are submerged, while a portion of the end of the solder ball is exposed. The heat dissipation layer (30) is made of an epoxy resin having excellent thermal conductivity, and can disperse heat generated between the LED chip (10) and the substrate (20).

[0044] For example, the heat dissipation layer (30) may include an epoxy resin, a heat dissipating agent, an epoxy curing agent, an activator, and a curing accelerator. The epoxy resin may be at least one selected from the group consisting of bisphenol A type, bisphenol F type, phenol novolac, and cresol novolac resin. When the epoxy resin is less than 5 parts by weight, the heat dissipation property is lowered, and when it exceeds 80 parts by weight, the soldering efficiency is lowered. Therefore, it is preferable that the epoxy resin be provided in an amount of 5 to 80 parts by weight per 100 parts by weight.

[0045] Additionally, the heat sink may be one or more selected from the group consisting of BN, Al2O3, SiO2, carbon nanotubes (CNT), and graphite. The heat sink particle size is preferably 10㎛ or less, as exceeding 10㎛ may reduce the soldering efficiency of the solder ball.

[0046] The epoxy curing agent may be at least one selected from the group consisting of anhydrides, amines, amine-modified latent curing agents, imidazole-based curing agents, and phenol-based curing agents. Preferably, the epoxy curing agent is included in a 1:1 equivalent ratio with the epoxy resin.

[0047] If the content of the epoxy hardener is less than the equivalent ratio, the resin may not be cured well, causing it to become brittle or lose strength. If it exceeds the content, uncured residue remains and may cause a re-reaction when heat is applied, which can cause reliability problems.

[0048] In addition, the activator may be at least one selected from the group consisting of maleic anhydride, tetrahydrophthalic anhydride (THPA), methyl-tetrahydrophthalic anhydride (Me-THPA), hexahydrophthalic anhydride (HHPA), and an acid, and the activators may facilitate removal of an oxide film on a solder ball to facilitate soldering and may help the resin to harden, and the curing accelerator may be mixed with at least one selected from the group consisting of a latent curing agent and an imidazole-based curing accelerator.

[0049] According to this, one surface of the substrate (20) is electrically connected to the LED chip (10), and heat generated by the operation of the LED chip (10) is exchanged with the heat dissipation layer (30), thereby improving the durability of the LED package.

[0050] Since the heat dissipation layer (30) has a thickness equal to the length of the pillar bump (24), the cooling efficiency can be improved by exchanging heat with the heat generated from the LED chip (10).

[0051] Meanwhile, the LED chip (10) emits light through the light emitting part (11), but since the irradiation angle of the light emitting part (11) is generally limited, there was a problem in that the light source was not irradiated at an angle other than the irradiation angle of the light source emitted from the light emitting part (11).

[0052] Therefore, in order to expand the irradiation area by widening the irradiation angle of the light source emitted from the LED chip (10), a part of the substrate (20) close to the light emitting portion (11) and the LED chip (10) is covered with a fluorescent molding member (40), thereby widening the irradiation angle of the light source.

[0053] The fluorescent molding member (40) covers the other surface (202) of the substrate (20) and may be provided with a groove (41) into which a part of the light emitting portion (11) is inserted, and an inclined surface (42) that expands the irradiation angle of the light source emitted from the light emitting portion (11).

[0054] The fluorescent molding member (40) is molded with several grooves (41) spaced at a predetermined interval so that a portion of the light-emitting portion (11) of the LED chip (10) can be inserted, and according to one embodiment, it can be provided according to the interval of the LED chip provided on the substrate.

[0055] The fluorescent molding member (40) is cut between grooves to form an LED chip package, and the cut surface can form an inclined surface (42).

[0056] The inclined surface (42) can form a small internal angle toward the groove (41) in which the light emitting portion (11) is installed. Therefore, the fluorescent molded member (40) can utilize the side surface because the light source emitted through the light emitting portion (11) is irradiated to the outside by passing through the inclined surface (42), thereby providing the effect of allowing the light source to be emitted at a wide angle (wide angle).

[0057] In addition to its original function of protecting the LED chip (10), the fluorescent molding member (40) can function as a lens by transmitting or refracting a light source due to the shape of the light-emitting surface.

[0058] The fluorescent molding member (40) may contain an ultraviolet absorber that absorbs ultraviolet rays generated from the LED chip (10) or a fluorescent material that converts monochromatic light into white light, and may include a fluorescent material that emits light of a different wavelength when excited by light.

[0059] The fluorescent molding member (40) is applied and molded on the resultant product on which the LED chip (10) is mounted so that the height is the same as that of the upper surface of the substrate (20).

[0060] The fluorescent molding member (40) can be applied by any one of rolling, spraying, and squeezing methods, and is not limited thereto and can be formed by various methods.

[0061] Here, the fluorescent molding member (40) covers the entire light-emitting portion (11) of the LED chip (10), and a part of the light-emitting portion (11) is inserted into the groove (41) so that the light source emitted from the light-emitting portion (11) can be transmitted. The fluorescent molding member (40) may be made of a transparent resin, i.e., a mixture of silicone and a fluorescent material.

[0062] In addition, the fluorescent molding member (40) can transmit light generated from the LED chip (10) with minimal loss. The fluorescent molding member (40) is generally molded from an opaque or highly reflective resin, and it is preferable to form the package body using a polymer resin that is easy to injection process. However, this is not limited to this, and the package body can be molded from various resin materials.

[0063] The fluorescent molding material (40) is selected from a resin with high transparency. Preferably, an elastic resin can be used. The elastic resin refers to a gel-like resin such as silicone, and has excellent optical properties due to its very low yellowing and high refractive index caused by short-wavelength light.

[0064] In addition, unlike epoxy, it maintains a gel or elastomer state even after curing, so it can more stably protect the LED chip (10) from heat stress, vibration, and external shock.

[0065] For example, the fluorescent molding member (40) may contain an ultraviolet absorbent that absorbs ultraviolet rays generated from the LED chip (10) or a fluorescent material that converts monochromatic light into white light.

[0066] Here, the fluorescent molding member (40) is described as including an ultraviolet ray absorbent and a fluorescent material that converts monochromatic light into white light, but this is only an example and other fluorescent materials may be included according to the user's choice.

[0067] Meanwhile, some of the light sources emitted from the LED chip (10) are emitted laterally, and since these light sources are radiated and absorbed by the substrate, etc., the user cannot obtain the desired light efficiency, so the efficiency of the LED chip (10) is lowered, and the substrate (20) gradually turns black or warps due to the heat from the light source, causing durability problems.

[0068] Accordingly, the substrate (20) may include a light reflecting layer (50) that reflects light emitted to the other surface (202) of the substrate (20) close to the LED chip (10).

[0069] The light reflecting layer (50) may be coated or attached with a light reflecting material that reflects some of the light emitted from the light emitting portion (11) toward the substrate (20) and the light reflected toward the fluorescent molding member (40) between the other surface (202) of the substrate (20) and the fluorescent molding member (40).

[0070] The light reflective layer (50) can improve light efficiency by reflecting the light source emitted from the side of the LED chip (10) toward the front surface (202) of the substrate (20), that is, toward the fluorescent molding member (40). The use of such a light reflective layer (50) can increase the light extraction efficiency from the LED chip (10).

[0071] The light reflective layer (50) can prevent the substrate (20) made of polymer resin from gradually turning black due to light or heat as the device's usage time elapses.

[0072] That is, discoloration is prevented by the light reflective layer (50), brightness reliability is improved, and the increase in brightness means that less power can be used to obtain the same brightness, and thus heat dissipation design can be easily achieved.

[0073] Meanwhile, the light reflecting layer (50) serves to separate the substrate (20) and the external electrode, and can function as an insulating layer because it contains a ceramic material.

[0074] The light reflecting layer (50) may be a material in which one or more materials of TiO2, ZrO2, ZnS, and ZnO are mixed with ceramic powder to increase reflectivity, or may include a material in which a glass component is modified in low-temperature co-fired ceramic (LTCC) powder.

[0075] In addition, since the above-mentioned reflective material is mixed and used in the ceramic powder, it functions as an insulating layer while also acting as a reflective surface with high reflective efficiency, thereby performing the function of increasing the reflectivity.

[0076] In particular, since it contains ceramic material and has high heat resistance, it has the advantage of being able to sufficiently perform its function as a reflective layer without deformation even when sintered at high heat.

[0077] Through this, an LED package having good reflectivity, increased strength due to the light reflecting layer (50), and an antistatic function with improved performance in terms of thermal resistance due to the heat diffusion layer of the external electrode can be manufactured.

[0078] Paint, ink, etc. can be used as the reflective material of this light reflecting layer (50). An example of the ink may be a UV-curable white ink whose main ingredient is TiO2-titanium white.

[0079] A film (light reflective layer (50)) is formed by applying paint to the other surface (202) of the substrate (20), or by printing ink on the substrate (20) by a method such as silk screen printing or stamping printing.

[0080] Additionally, as a material for the light reflecting layer (50), a white plastic film made by mixing white pigment into synthetic resin or creating many fine holes in synthetic resin can be used.

[0081] Therefore, as a means of increasing the brightness of a flat light source, in addition to increasing the brightness of the light source itself of a fluorescent lamp or increasing the transmittance of a diffusion material, a method of increasing the light reflectance of the light reflecting material is generally used.

[0082] In addition, the light reflecting layer (50) can increase the light reflectivity of the light reflecting material by polymerizing multiple white plastic films or increasing the thickness of the film itself.

[0083] That is, the light reflective layer (50) is formed by applying or printing a reflective material or by vacuum deposition, so the manufacturing process is simple and the production cost is low, and it can be formed as a silver film by vacuum deposition.

[0084] According to this light reflective layer (50), the light source emitted from the LED chip (10) can be reflected, thereby increasing efficiency and resolving durability issues. In addition, the light reflective layer (50) reduces the weight and thickness of the substrate (20), thereby reducing the weight and resulting in a cost reduction effect.

[0085] FIGS. 2 to 9 are diagrams showing a method for manufacturing an LED package including a bump on a window substrate according to the present invention, and FIG. 10 is a diagram showing a sequence for a method for manufacturing an LED package including a bump on a window substrate according to the present invention.

[0086] Referring to FIGS. 2 to 9, the sequence of a method for manufacturing an LED package including a bump on a window substrate according to the present invention will be described. First, referring to FIGS. 2 and 10, step S10 prepares a substrate (20) having windows (21) perforated at a predetermined interval from each other, a connection pad (22) electrically connected to the outside on one side except for the window (21), a first contact surface (221) provided on the connection pad (22) close to the window (21), and a second contact surface (222) provided further from the window (21) than the first contact surface (221).

[0087] Referring to FIGS. 3 and 10, step S20 creates a solder ball (23) that is electrically connected to the second contact surface (222).

[0088] Referring to FIG. 4 and FIG. 10, step S30 forms a light reflective layer (50) by applying or attaching a light reflective material that reflects a light source emitted from the side of the light emitting portion (11) close to the window (21) to the other surface (202) of the substrate (20).

[0089]

[0090] *Referring to FIG. 5 and FIG. 10, step S40 aligns the centers of the window (21) and the groove (41) of the substrate (20) and applies or attaches a fluorescent molding member (40) made by mixing a transparent resin, which is a light-reflecting material, and a fluorescent substance to the other surface (202) of the substrate (20).

[0091] Referring to FIGS. 6 to 7 and 10, step S50 includes mounting an LED chip (10) having a light-emitting portion (11) that emits light on one side and a connection pad portion (12) on the other side, by inserting the LED chip (10) into a window (21) so that the light-emitting portion (11) faces the other side (202) opposite to the one side (201) of the substrate (20) and the light-emitting portion (11) protrudes from the other side (201) of the substrate (20), and electrically connecting both electrodes of the LED chip (10) between the connection pad portion (12) and the first contact surface (221) using a conductive wire (25).

[0092] Referring to FIGS. 8 and 10, step S60 can cool the heat generated between the LED chip (10) and the substrate (20) by dispersing the heat generated between the LED chip (10) and the substrate (20) by a heat dissipation layer (30) formed so that a portion of the conductive wire (25) and the solder ball (23) of the substrate (20) are submerged, while the remaining portion of the solder ball (23) is exposed to protrude.

[0093] According to the LED package including a bump on the window substrate of the present invention and the manufacturing method thereof, an LED package capable of maximizing the light efficiency of the LED chip by maximizing the light angle and improving the reflection efficiency so as to increase the light efficiency emitted from the LED package can be provided, and a direct heat dissipation effect is possible on the heat-generating part of the wire and conductive connection part, and the light loss due to the reflection layer is compensated for, so that the optical characteristics can be secured to the maximum.

[0094] The above description of the present invention is for illustrative purposes only, and a person having ordinary skill in the art to which the present invention pertains will understand that the present invention can be easily modified into other specific forms without changing the technical idea or essential characteristics of the present invention.

[0095] Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. For example, each component described as a single unit may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined manner.

[0096] The scope of the present invention is indicated by the claims described below, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

[0097] Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the patent claims, the detailed description of the invention, and the attached drawings, and it is obvious that this also falls within the scope of the present invention.

Claims

1. An LED chip having a light-emitting portion that emits light on one side and a connection pad portion that is electrically connected to the other side; A substrate including a plurality of windows that are spaced apart from each other, a connection pad electrically connecting one side of the substrate to the outside except for the windows, a first contact surface provided on the connection pad close to the windows, a second contact surface provided on the connection pad further outward from the windows than the first contact surface, and a solder ball provided on the second contact surface, wherein the LED chip is arranged in the windows, the light-emitting portion is exposed toward the other side, and the first contact surface and the connection pad portion are bonded with a conductive wire; and An LED package including a bump on a window substrate, the window substrate including a fluorescent molding member having a groove covering the other surface of the substrate and into which a part of the light emitting part is inserted, and an inclined surface that expands the irradiation angle of the light source emitted from the light emitting part.

2. In paragraph 1, An LED package including a bump on a window substrate, the window substrate including a light reflecting layer having a light reflecting material applied or attached thereto, which reflects the light source emitted from the light emitting portion and reflected onto the substrate by the fluorescent molding member toward the fluorescent molding member between the other surface of the substrate and the fluorescent molding member.

3. In paragraph 1, An LED package including a bump on a window substrate, the window substrate including a heat dissipation layer formed on one surface of the substrate so that a portion of the conductive wire and the solder ball are submerged but a portion of an end of the solder ball is exposed.

4. Step S10 of preparing a substrate having windows spaced apart from each other by a predetermined interval, a connection pad electrically connected to the outside on one side excluding the window, a first contact surface provided on the connection pad in proximity to the window, and a second contact surface provided further from the window than the first contact surface; Step S20, which creates a solder ball electrically connected to the second contact surface in step S10; Step S30 of forming a light reflective layer by applying or attaching a light reflective material that reflects light emitted from the side of the light emitting part close to the window on the other surface of the substrate in step S20; In step S30, the center of the window and groove of the substrate is aligned, and a step S40 is applied or attached to the other surface of the substrate with a fluorescent molding member that is a mixture of a transparent resin and a fluorescent substance, which is a light reflective material; In step S40, an LED chip having a light-emitting portion emitting light on one side and a connection pad portion on the other side is mounted by inserting the light-emitting portion facing the other side of the substrate into the window so that the light-emitting portion protrudes from the other side of the substrate, and electrically connecting both electrodes of the LED chip between the connection pad portion and the first contact surface using conductive wires; and A method for manufacturing an LED package including a bump on a window substrate, comprising: a step S60 of forming a heat dissipation layer so that a conductive wire of the substrate and a part of the solder ball are immersed, while leaving the remaining part of the solder ball protruding and exposed.

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