Lighting device

Abstract

A lighting device according to an embodiment of the present invention may comprise: a heat dissipation plate including a recessed portion; a circuit board disposed in the recess portion and having multiple pads; a light source unit disposed on the heat dissipation plate and including multiple light-emitting elements and multiple bonding pads; multiple connection members for connecting the circuit board and the light source unit; and an insulation member disposed below the connection members. The circuit board and the light source are spaced apart from each other in a first direction. The multiple connecting members are spaced apart from each other in a second direction that is perpendicular to the first direction. The multiple connection members are interposed between and connected to the respective multiple pads and bonding pads. The insulating member is disposed between the light source unit and the circuit board and may not be in contact with the pads and the bonding pads.

Description

lighting device

[0001] The embodiment relates to a lighting device. The embodiment relates to a vehicle light having the lighting device.

[0002] Lighting applications include vehicle lighting, display, and signage backlights. Light-emitting diodes (LEDs) offer advantages over light sources such as fluorescent and incandescent lamps, including low power consumption, a near-permanent lifespan, fast response times, safety, and environmental friendliness. LEDs are used in various lighting devices, such as displays, indoor and outdoor lighting. Recently, lamps using LEDs as vehicle light sources have been proposed. Compared to incandescent lamps, LEDs offer the advantage of lower power consumption. Furthermore, their small size allows for greater design flexibility, and their near-permanent lifespan makes them economical. However, because the light emission angle from LEDs is small, there is a need to increase the light-emitting area of ​​LED lamps when using LEDs in vehicle lamps. Korean Patent Publication No. KR10-2023-0010550 (January 19, 2023) discloses prior art related to lighting devices.

[0003] The embodiment provides a lighting device having improved reliability. The embodiment also provides a vehicle light and headlamp having the lighting device.

[0004] A lighting device according to an embodiment includes a heat dissipation plate including a recessed portion; a circuit board disposed in the recessed portion and having a plurality of pads; a light source portion disposed on the heat dissipation plate and including a plurality of light-emitting elements and a plurality of bonding pads; a plurality of connecting members connecting the circuit board and the light source portion; and an insulating member disposed below the connecting members, wherein the circuit board and the light source portion are spaced apart in a first direction, the plurality of connecting members are spaced apart in a second direction orthogonal to the first direction, and the plurality of connecting members are connected between the plurality of pads and the plurality of bonding pads, respectively, and the insulating member is disposed between the light source portion and the circuit board, and the insulating member may not be in contact with the pads and the bonding pads.

[0005] According to an embodiment of the invention, the insulating member may be in contact with the plurality of connecting members. The insulating member may not be in contact with the plurality of connecting members.

[0006] According to an embodiment of the invention, the thickness of the insulating member is 90% or more of the height of the plurality of connecting members, and the height of the plurality of connecting members may be the distance from the heat dissipation plate to the connecting members.

[0007] According to an embodiment of the invention, the area where the plurality of pads are arranged has a first width in the second direction, the area where the plurality of bonding pads are arranged has a second width in the second direction, and the width of the insulating member in the second direction may be 1 to 1.5 times the first width, and the width of the insulating member may be 1 to 1.3 times the second width.

[0008] According to an embodiment of the invention, the length of the insulating member in the first direction may be 50% to 80% of the length of the connecting member. The heat dissipation plate includes a plurality of patterns, and the insulating member may be in contact with the patterns.

[0009] A lighting device according to an embodiment of the invention comprises: a heat dissipation plate; a circuit board disposed on the heat dissipation plate and having a plurality of pads; a light source unit disposed on the heat dissipation plate and including a plurality of light-emitting elements and a plurality of bonding pads; a plurality of connecting members connecting the circuit board and the light source unit; and an insulating member disposed on the heat dissipation plate, wherein the circuit board and the light source unit are spaced apart in a first direction, the plurality of connecting members are spaced apart in a second direction orthogonal to the first direction, and each of the plurality of connecting members includes one end connected to the plurality of bonding pads; another end connected to the plurality of pads; and a connecting member connecting the one end and the other end, wherein the connecting member includes a convex portion convex toward the heat dissipation plate, and the insulating member may be disposed below the plurality of connecting members.

[0010] According to an embodiment of the invention, a sealing member surrounding the plurality of connecting members may be included. The sealing member and the insulating member may comprise the same material.

[0011] According to an embodiment of the invention, the light source unit includes a support member, the light emitting element is disposed on the support member, the connection unit includes a central portion, a first outer portion, and a second outer portion, the central portion is disposed in an area between a side surface of the support member and a side surface of the circuit board, and the first outer portion and the second outer portion may be disposed in an area other than between the side surface of the support member and the side surface of the circuit board. The central portion may be convex toward the heat dissipation plate, and the first outer portion and the second outer portion may be convex in an opposite direction of the heat dissipation plate.

[0012] According to an embodiment of the invention, the heat dissipation plate includes a groove having a long length in the second direction, and the groove can be arranged between the light source unit and the circuit board. The insulating member can be arranged inside the groove and vertically overlap with the plurality of connecting members.

[0013] A lighting device according to an embodiment includes an insulating member. The insulating member supports the connecting member. The connecting member is in contact with the insulating member. Accordingly, deformation of the connecting member due to external impact can be prevented. Accordingly, bonding strength of the connecting member, the pad, and the bonding pad is improved. The connecting member is spaced apart from the insulating member by a set range. Accordingly, deformation of the connecting member due to external impact can be prevented. Accordingly, bonding strength of the connecting member, the pad, and the bonding pad is improved. In addition, the connecting member does not contact the insulating member. Accordingly, deformation of the position of the connecting member due to a difference in thermal expansion coefficients between the connecting member and the insulating member can be prevented. Accordingly, bonding strength of the connecting member, the pad, and the bonding pad is improved.

[0014] A lighting device according to another embodiment includes an insulating member. Accordingly, even if the connecting member is deformed toward the heat dissipation portion due to an external impact, the connecting member does not come into contact with the heat dissipation portion due to the insulating member. Accordingly, the connecting member and the heat dissipation portion can be prevented from being electrically connected. Furthermore, even if the shape or position of the connecting member is deformed due to a difference in the thermal expansion coefficients of the connecting member and the molding portion, the connecting member and the heat dissipation portion can be prevented from coming into contact. Accordingly, the reliability of the lighting device can be improved.

[0015] Fig. 1 is a perspective view showing an example of a lighting device according to the first embodiment.

[0016] Figure 2 is a side cross-sectional view of the lighting device of Figure 1.

[0017] Fig. 3 is a perspective view showing the light source and circuit board of the lighting device of Fig. 1.

[0018] Fig. 4 is a plan view of a lighting device having an insulating member as an embodiment of the invention.

[0019] Fig. 5 is another example of the lighting device of Fig. 4.

[0020] Fig. 6 is another example of the lighting device of Fig. 4.

[0021] Fig. 7 is a cross-sectional view taken along the AA' side of the lighting device of Fig. 5.

[0022] Figure 8 is an enlarged view of area A of Figure 7.

[0023] Fig. 9 is a perspective view showing an example of a lighting device according to the second embodiment.

[0024] Fig. 10 is a side cross-sectional view of the lighting device of Fig. 9.

[0025] Fig. 11 is a perspective view showing the light source and circuit board of the lighting device of Fig. 9.

[0026] Fig. 12 is a plan view of the lighting device of Fig. 11.

[0027] Fig. 13 is a cross-sectional view taken along the BB' side of Fig. 12.

[0028] Fig. 14 is another example of a BB' side cross-sectional view of the lighting device of Fig. 12.

[0029] Fig. 15 is another plan view of the lighting device of Fig. 11.

[0030] Fig. 16 is a cross-sectional view taken along the line C-C' of the lighting device of Fig. 15.

[0031] Fig. 17 is another plan view of the lighting device of Fig. 11.

[0032] Fig. 18 is a cross-sectional view taken along the D-D' side of the lighting device of Fig. 17.

[0033] Fig. 19 is another plan view of the lighting device of Fig. 11.

[0034] Fig. 20 is a cross-sectional view taken along the line E-E' of the lighting device of Fig. 19.

[0035] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention can be interpreted as having a meaning that can be generally understood by a person having ordinary skill in the technical field to which the present invention pertains, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, can have their meanings interpreted in consideration of the contextual meaning of the related technology. In addition, the terminology used in the embodiments of the present invention is for the purpose of describing the embodiments and is not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “A and (or at least one) of B, C,” it may include one or more of all combinations that can be combined with A, B, and C. In addition, when describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not limited by the nature, order, or sequence of the components. In addition, when it is described that a component is 'connected', 'coupled', or 'connected' to another component, the component may include not only cases where the component is directly connected, coupled, or connected to the other component, but also cases where the component is 'connected', 'coupled', or 'connected' by another component between the component and the other component.Additionally, when it is described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when it is expressed as "above" or "below", it can include the meaning of the downward direction as well as the upward direction based on one component.

[0036]

[0037] Below, a lighting device according to an embodiment is described with reference to the drawings.

[0038] Figures 1 to 8 illustrate a lighting device according to a first embodiment. Referring to Figures 1 to 8, the lighting device according to the first embodiment includes a heat dissipation plate (101), a circuit board (110), a light source unit (130), a connecting member (141, 142), and an insulating member (200).

[0039] The circuit board (110) is disposed on the heat dissipation plate (101). The light source unit (130) includes a plurality of light emitting elements (131). The light source unit (130) is disposed on the heat dissipation plate (101). The connecting members (141, 142) connect the light source unit (130) and the circuit board (110). The connecting members (141, 142) electrically connect the light source unit (130) and the circuit board (110). The insulating member (200) is disposed between the connecting members (141, 142) and the heat dissipation plate (101). The insulating member (200) supports the connecting members (141, 142). The insulating member (200) supports a portion of each of the connecting members (141, 142).

[0040] The lighting device described above is applicable to various lamp devices requiring lighting. For example, the lighting device can be applied to vehicle lamps, household lighting devices, or industrial lighting devices. For example, the lighting device can be applied to the vehicle lamp. The lighting device can be applied to headlamps, side mirror lights, side marker lights, fog lights, tail lights, brake lights, daytime running lights, vehicle interior lights, door scuffs, rear combination lamps, or backup lamps. In addition, the lighting device can be applied to indoor or outdoor advertising devices, display devices, and electric vehicle fields.

[0041]

[0042] The heat dissipation plate (101) supports the circuit board (110). Heat generated in the circuit board (110) moves by the heat dissipation plate (101). The heat dissipation plate (101) includes metal. For example, the heat dissipation plate (101) may be formed in a structure in which a single layer or multiple metal layers are laminated. The heat dissipation plate (101) may be formed in a single layer or multiple layers. The heat dissipation plate (101) may include a ceramic material, AlN, or an aluminum material having an anodized surface layer. The metal layer may include at least one of Al, Ni, Mo, Cu, Cu-alloy, Cu-W, Ag, or Au.

[0043] The heat dissipation plate (101) includes a heat dissipation portion (102) and a side portion (103). The heat dissipation portion (102) includes a recess portion (108). The circuit board (110) is disposed in the recess portion (108). The area of ​​the heat dissipation portion (102) may be larger than the area of ​​the circuit board (110). The side portion (103) is bent downward from an edge of the heat dissipation portion (102). One or more side portions (103) may be disposed along the outer side of the heat dissipation portion (102). An empty space (109) may be provided on the inner side of the side portion (103) and the lower side of the heat dissipation portion (102), or another structure may be combined therewith. The recess portion (108) is formed at a set depth from the upper surface of the heat dissipation portion (102). The depth of the recessed portion (108) may be equal to or smaller than the thickness of the circuit board (110). The top view shape of the recessed portion (108) may be equal to the top view shape of the circuit board (110). For example, the top view shape of the recessed portion (108) may include a polygonal shape.

[0044]

[0045] The circuit board (110) is inserted into the recessed portion (108). The circuit board (110) can be bonded to the bottom surface of the recessed portion (108) with an adhesive member (155). The adhesive member (155) can include a thermally conductive adhesive. The upper surface of the circuit board (110) can be arranged on the same plane as the upper surface of the heat dissipation plate (101). As another example, the upper surface of the circuit board (110) can be arranged higher than the upper surface of the heat dissipation plate (101). The adhesive member (155) is arranged on the outer periphery of the recessed portion (108). The surface of the heat dissipation member (102) can be bonded to the circuit board (110).

[0046] The circuit board (110) may include resin or metal. For example, the circuit board (110) may include any one of a ceramic-based PCB, an MCPCB (Metal Core PCB), a flexible PCB (FPCB, Flexible PCB), and a resin-based PCB. The circuit board (110) includes a lower metal layer, an upper circuit layer including a pad, a protective layer made of an insulating material for protecting the upper circuit layer, and an insulating layer between the metal layer and the circuit layer. The circuit board (110) may be provided as an MCPCB in which a metal layer is disposed at the lower portion. In addition, the circuit board (110) may transfer heat to the heat dissipation plate (101).

[0047] The circuit board (110) may be fastened to the heat dissipation unit (102) by a fastening means (119). The fastening means (119) may include one or more screws. The circuit board (110) and the heat dissipation unit (102) may be fastened and tightly attached by the screws. When the circuit board (110) is fixed by the fastening means (119), the adhesive member (155) may be removed. Accordingly, the circuit board (110) may be easily separated. The circuit board (110) may include a plurality of pads. The pads (111, 112) may include a first pad (111) and a second pad (112) that are spaced apart from each other. The first pad (111) and the second pad (112) are connected to a connector (115) disposed on the upper portion of the circuit board (110) by a circuit layer of the circuit board (110). The connector (115) can receive a driving signal and power from the outside. The pads (111, 112) and the connector (115) can be disposed on both edges of the circuit board (110). The fastening means (119) can be disposed in an area between the pads (111, 112) and the connector (115).

[0048] The first pad (111) and the second pad (112) are arranged adjacent to one side of the circuit board (110). The pads (111, 112) may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, and Au and optional alloys thereof.

[0049]

[0050] The light source unit (130) is disposed on the heat dissipation unit (102). The light source unit (130) may be adjacent to the recessed unit (108). The light source unit (130) may be adjacent to one side of the circuit board (110). One side of the circuit board (110) may be disposed between the pads (111, 112) and the light source unit (130). The light source unit (130) and the circuit board (110) may be spaced apart in a first direction (Y). The first and second pads (111, 112) may be spaced apart in a second direction (X). The first direction (Y) is a direction orthogonal to the first direction (Y). The third direction is the thickness direction of the light source unit (130) and the circuit board (110), and is a direction orthogonal to the first and second directions (Y, X).

[0051] The light source unit (130) may include a support member (133) and at least one light emitting element (131) disposed on the support member (133). The light source unit (130) may include a resin member (132). The resin member (132) may be disposed on the support member (133). The light emitting elements (131) may be disposed in multiple numbers on the support member (133). The resin member (132) is disposed around the plurality of light emitting elements (131) and may seal side surfaces of the light emitting elements (131). The support member (133) may include a ceramic substrate or a semiconductor substrate. The support member (133) may support the plurality of light emitting elements (131).

[0052] The light source unit (130) may include bonding pads (134, 135). The bonding pads (134, 135) may be electrically connected to the connecting members (141, 142). The support member (133) may include a conductive pattern. The plurality of light-emitting elements (131) may be electrically connected by the conductive pattern. The bonding pads (134, 135) may be electrically connected to the light-emitting elements (131) by the conductive pattern. The plurality of light-emitting elements (131) may be connected in series or in parallel.

[0053] A protection element (not shown) for protecting the light emitting elements (131) may be disposed on the support member (133). The protection element may be implemented as a thyristor, a zener diode, or a TVS (transient voltage suppression). By this, the light emitting elements (131) may be protected from ESD (electro static discharge). The support member (133) may be formed of a ceramic material or an MCPCB material. The light source unit (130) may transfer heat generated from the light emitting elements (131) to the heat dissipation plate (101) by the support member (133). The support member (133) and the heat dissipation plate (101) may be bonded by an adhesive (138). The adhesive (138) may include a thermally conductive adhesive having metal powder or inorganic powder in a resin material. For example, the adhesive (138) may include a thermal interface material (TIM). The adhesive (138) may be disposed along the lower surface and the lower side surface of the support member (133). The adhesive (138) may be disposed on the outer side surface of the side surface of the support member (133) and may be in contact with each side surface of the support member (133).

[0054] The plurality of light-emitting elements (131) are arranged in one direction or are arranged in at least one row. The plurality of light-emitting elements (131) may be connected to each other in series. The plurality of light-emitting elements (131) may include at least one of a blue, green, or red LED chip. The plurality of light-emitting elements (131) may be flip-chip or wire-bonded. The light-emitting element (131) may include a plurality of semiconductor layers made of a compound semiconductor of group II and group VI elements or / and a compound semiconductor of group III and group V elements. At least one or all of the plurality of semiconductor layers may include a compound semiconductor of a series such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, InGaAs.

[0055] The resin member (132) may include silicone or epoxy. The phosphor layer (131a) is disposed on the light-emitting element (131) and converts the wavelength of light emitted from the light-emitting element (131). The resin member (132) may include a transparent layer and / or a phosphor layer (131a) on the light-emitting element (131). As another example, the phosphor layer (131a) may be formed separately from the resin member (132) or may be disposed on different regions. The resin member (132) may function as a reflective wall around the light-emitting element (131) and the transparent layer or / and phosphor layer (131a). The resin member (132) may further include a convex lens (not shown). The phosphor layer may include at least one or two or more of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor. The above light source unit (130) can emit one or more of blue, green, and red light, or emit white light.

[0056]

[0057] Referring to FIGS. 3 to 6, the light-emitting element (131) is disposed on an upper portion of one side of the support member (133). Bonding pads (134, 135) are exposed on the upper portion of the other side of the support member (133). The bonding pads (134, 135) may include a first bonding pad (134) connected to the cathodes of the plurality of light-emitting elements (131) and a second bonding pad (135) connected to the anodes of the plurality of light-emitting elements (131). The first bonding pad (134) may have a color-coded mark and function as a cathode terminal, and the second bonding pad (135) may function as an anode terminal. The first bonding pad (134) and the second bonding pad (135) may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au, and optional alloys thereof. The first bonding pad (134) and the second bonding pad (135) are disposed on the support member (133) and are electrically connected to the conductive pattern of the support member (133). The upper surfaces of the first bonding pad (134) and the second bonding pad (135) may be disposed at a lower height than the upper surface of the resin member (132), or may be disposed at a higher height than the upper surface of the resin member (132).

[0058] The first bonding pad (134) and the first pad (111) are connected by a first connecting member (141). The second bonding pad (135) and the second pad (112) are connected by a second connecting member (142). The first connecting member (141) and the second connecting member (142) may be formed of a wire. The first connecting member (141) and the second connecting member (142) may include at least one of Au, Al, Ag, and Ni. The first connecting member (141) and the second connecting member (142) may have a width greater than a thickness. That is, the first connecting member (141) and the second connecting member (142) may be provided as a ribbon-shaped wire.

[0059] The first connecting member (141) and the second connecting member (142) have one end (41) bonded to the first bonding pad (134) and the second bonding pad (135), respectively, and the other end (43) bonded to the first pad (111) and the second pad (112), respectively. The first connecting member (141) and the second connecting member (142) include a center portion (42) extending from the one end (41) toward the other end (43). The center portion (42) may extend from the other side of the light source portion (130) to one side of the circuit board (110). The center portion (42) may extend onto a recess portion (108) between the circuit board (110) and the heat dissipation portion (102). The height of the above-mentioned end (41) may be arranged higher than the height of the other end (43). The height of the center portion (42) may be arranged higher than the above-mentioned end (41).

[0060]

[0061] As shown in FIGS. 4 to 7, the light source unit (310) and the circuit board (110) are electrically connected by the first connecting member (141) and the second connecting member (142). Since the connecting members (141, 142) have a ribbon shape and are provided as long wires in the first direction (Y), they may be deformed by external impact. Accordingly, the electrical connection characteristics between the light source unit (310) and the circuit board (110) may be reduced. In order to prevent the above-described problem, an insulating member (200) according to an embodiment may be disposed between the light source unit (310) and the circuit board (110). In addition, the insulating member (200) may be disposed between the connecting members (141, 142) and the heat dissipation plate (101).

[0062] The insulating member (200) includes a resin. For example, the insulating member may include epoxy, acrylate, urethane, polyolefin, silicone, or a mixture thereof. The connecting member (141, 142) includes a metal. Therefore, when the insulating member (200) covers the entire area of ​​the connecting member (141, 142), the connecting characteristics of the connecting member (141, 142) may be reduced. In detail, the insulating member (200) includes a different material from the connecting member (141, 142). Accordingly, the coefficient of thermal expansion (CTE) of the insulating member is different from that of the connecting member (141, 142). Accordingly, the shrinkage and expansion characteristics of the insulating member (200) are different from those of the connecting member (141, 142). Accordingly, when the temperature of the lighting device changes, the connecting member (141, 142) may be deformed due to the difference in the thermal expansion coefficient. Accordingly, a portion of the connecting member (141, 142) may be separated from at least one of the pads (111, 112) and the bonding pads (134, 135). Accordingly, the electrical characteristics and reliability of the lighting device may be reduced.

[0063] Therefore, the lighting device according to the embodiment can prevent the electrical characteristics of the connecting member (141, 142) from being deteriorated by using the insulating member (200) to solve the above-described problem. Referring to FIGS. 4 to 6, the insulating member (200) is disposed below the connecting member (141, 142). Accordingly, the connecting member (141, 142) is disposed on the insulating member (200). The connecting member (141, 142) can be in contact with the insulating member (200). As another example, the connecting member (141, 142) can be spaced apart from the insulating member (200). As another example, a part of the connecting member (141, 142) can be spaced apart from the insulating member (200), and another part of the connecting member (141, 142) can be in contact with the insulating member (200).

[0064] Referring to Fig. 4, the insulating member (200) may include a single insulating member. Accordingly, the first connecting member (141) and the second connecting member (142) may be supported by a single insulating member. When the insulating member (200) is a single insulating member, it may have a shape formed through a single resin forming process. That is, the insulating member (200) may have an oval shape or a circular shape. In addition, the length (L) of the insulating member (200) may have a largest bottom length in the first direction (Y) of the central region between the first and second connecting members (141, 142) and may gradually decrease as it moves away from the central region in the second direction (X).

[0065] Referring to FIGS. 5 and 6, the insulating member (200) may include a plurality of insulating members. As shown in FIG. 5, the insulating member (200) may include a first insulating member (210) and a second insulating member (220). The first insulating member (210) and the second insulating member (220) may be in contact with or connected to each other. Each of the first insulating member (210) and the second insulating member (220) may have an oval shape or a circular shape. The insulating member (200) may have a curved surface. The insulating member (200) having the first and second insulating members (210, 220) may have a curved surface. The upper surface of the insulating member (200) may have a curved surface. The edge of the insulating member (200) may have a curved shape.

[0066] A portion of each of the first insulating member (210) and the second insulating member (220) may be connected to each other in a central region between the first and second connecting members (210, 220). The first insulating member (210) and the second insulating member (220) are formed sequentially. For example, the first insulating member (210) is formed first, and then the second insulating member (220) is formed. At this time, the second insulating member (220) is formed to partially overlap the first insulating member (210) in the vertical direction. Accordingly, the first insulating member (210) and the second insulating member (220) are connected and arranged. The first and second insulating members (210, 220) may be arranged between the pads (111, 112) and the bonding pads (134, 135).

[0067] As shown in Fig. 6, the insulating member (200) may include a first insulating member (210), a second insulating member (220), and a third insulating member (230). The first insulating member (210), the second insulating member (220), and the third insulating member (230) may be partially in contact. The first insulating member (210), the second insulating member (220), and the third insulating member (230) are connected. The second insulating member (220) is disposed between the first insulating member (210) and the third insulating member (230), and may be connected to the first insulating member (210) and the third insulating member (230). That is, both ends of the second direction (X) of the second insulating member (220) may be connected to one end of the first insulating member (210) and the other end of the third insulating member (230) or may overlap in the vertical direction.

[0068] Each of the first, second, and third insulating members (210, 220, and 230) may have a circular or oval shape. The insulating member (200) may include a curved surface. The insulating member (200) having the first, second, and third insulating members (210, 220, and 230) may have a curved surface. The upper surface of the insulating member (200) may have a curved surface. The edge of the insulating member (200) may have a curved shape.

[0069] The first insulating member (210) may overlap vertically with the first connecting member (141). The third insulating member (230) may overlap vertically with the second connecting member (142). The second insulating member (220) may overlap vertically with at least one or both of the first and second connecting members (141, 142).

[0070] The first insulating member (210), the second insulating member (220), and the third insulating member (230) are formed sequentially. For example, the first insulating member (210) is formed first, and then the second insulating member (220) is formed. At this time, the second insulating member (220) is formed to partially overlap the first insulating member (210). Subsequently, the third insulating member (230) is formed. The third insulating member (230) is formed to partially overlap the second insulating member (220). Accordingly, the first insulating member (210), the second insulating member (220), and the third insulating member (230) are connected and arranged. The above insulating member (200) may be placed between the pad (111, 112) and the bonding pad (134, 135). The first to third insulating members (210, 220, 230) may be placed between the pad (111, 112) and the bonding pad (134, 135).

[0071] Referring to FIGS. 4 to 6, the insulating member (200) may not vertically overlap with the first pad (111), the second pad (112), the first bonding pad (134), and the second bonding pad (135). As shown in FIG. 4, the insulating member (200) is not disposed on the first pad (111) and the second pad (112). In detail, the insulating member (200) does not contact the first pad (111) and the second pad (112). The insulating member (200) is not disposed on the first bonding pad (134) and the second bonding pad (135). In detail, the insulating member (200) does not contact the first bonding pad (134) and the second bonding pad (135).

[0072] As shown in Fig. 5, the first insulating member (210) and the second insulating member (220) are not disposed on the first pad (111) and the second pad (112). In detail, the first insulating member (210) and the second insulating member (220) do not contact the first pad (111) and the second pad (112). The first insulating member (210) and the second insulating member (220) are not disposed on the first bonding pad (134) and the second bonding pad (135). In detail, the first insulating member (210) and the second insulating member (220) do not contact the first bonding pad (134) and the second bonding pad (135).

[0073] As shown in Fig. 6, the first insulating member (210), the second insulating member (220), and the third insulating member (230) are not disposed on the first pad (111) and the second pad (112). In detail, the first insulating member (210), the second insulating member (220), and the third insulating member (230) do not contact the first pad (111) and the second pad (112). The first insulating member (210), the second insulating member (220), and the third insulating member (230) are not disposed on the first bonding pad (134) and the second bonding pad (135). In detail. The first insulating member (210), the second insulating member (220), and the third insulating member (230) do not contact the first bonding pad (134) and the second bonding pad (135).

[0074]

[0075] As shown in Fig. 4, the top view shape of the insulating member (200) may be, for example, an oval shape. In detail, the insulating member (200) may have a set width (W) and length (L). The width (W) is a length in the second direction (X), which is a size in the width direction of the connecting member (141, 142). The length (L) is a length in the first direction (Y), which is a size in the length direction of the connecting member (141, 142). The insulating member (200) may be formed in an oval shape in which the width (W) is greater than the length (L). That is, when the lighting device is viewed from above, the insulating member (200) may appear to have an oval shape. That is, the top surface of the insulating member (200) may have an oval shape.

[0076] As shown in FIGS. 5 and 6, the insulating member (200) may be formed in a dumbbell shape or a peanut shape. In detail, the first insulating member (210) and the second insulating member (220) may each be formed in an oval shape. The first insulating member (210) and the second insulating member (220) may each be formed in an oval shape in which a width is greater than a length. The first insulating member (210) and the second insulating member (220) overlap. Accordingly, the insulating member (200) may be formed in a dumbbell shape or a peanut shape in which the length of the central portion is small. That is, when the lighting device is viewed from above, the insulating member (200) may have a dumbbell shape or a peanut shape. That is, the bottom shape of the insulating member (200) may have a dumbbell shape or a peanut shape. The side shape of the insulating member (200) may have a hyperbolic shape.

[0077]

[0078] Referring to FIGS. 5, 7, and 8, the insulating member (200) may have a set size. The width (W) of the insulating member (200) may be larger than the size of the area where the first pad (111) and the second pad (112) are arranged and the area where the first bonding pad (134) and the second bonding pad (135) are arranged. The area where the first pad (111) and the second pad (112) are arranged may have a first width (W1) in the second direction (X). In addition, the area where the first bonding pad (134) and the second bonding pad (135) are arranged may have a second width (W2) in the second direction (X). The first width (W1) and the second width (W2) may be different. For example, the second width (W2) may be larger than the first width (W1). For example, the first width (W1) may be 25 mm to 35 mm. In addition, the second width (W2) may be 45 mm to 55 mm. The width (W) of the insulating member may be greater than or equal to the first width (W1). In detail, the width (W) of the insulating member (200) may be 1 to 1.5 times the first width (W1). If the width (W) of the insulating member (200) is less than 1 time the first width (W1), the first connecting member (141) and the second connecting member (142) may not be supported by the insulating member (200). Accordingly, the first connecting member (141) and the second connecting member (142) may be deformed by an external impact. Therefore, the reliability of the lighting device may be reduced.

[0079] If the width (W) of the insulating member (200) exceeds 1.5 times the first width (W1), the area where the insulating member (200) is arranged increases. Accordingly, light emitted from the light-emitting element (131) may interfere with the insulating member (200). Accordingly, the brightness of the lighting device may decrease. The width (W) of the insulating member (200) may be equal to or greater than the second width (W2). In detail, the width (W) of the insulating member (200) may be 1 to 1.3 times the second width (W2). If the width (W) of the insulating member (200) is less than 1 time the second width (W2), the first connecting member (141) and the second connecting member (142) may not be supported by the insulating member (200). Accordingly, the first connecting member (141) and the second connecting member (142) may be deformed by external impact. Therefore, the reliability of the lighting device may decrease. If the width (W) of the insulating member (200) exceeds 1.3 times the second width (W2), the area where the insulating member (200) is arranged increases. Accordingly, the light emitted from the light-emitting element (131) may interfere with the insulating member (200). Accordingly, the brightness of the lighting device may decrease.

[0080]

[0081] The length (L) of the insulating member (200) may be shorter than the length of the connecting member (141, 142). In detail, the length (L) of the insulating member (200) may be 50% or more of the length of the connecting member (141, 142). More specifically, the length (L) of the insulating member (200) may be 50% to 80%, 55% to 75%, or 60% to 70% of the length of the connecting member (141, 142). When the length (L) of the insulating member (200) is less than 50% of the length of the connecting member (141, 142), the area of ​​the connecting member (141, 142) supported by the insulating member (200) may be reduced. Accordingly, the area of ​​the connecting member (141, 142) that is not supported by the insulating member (200) may increase. Accordingly, the supporting force of the connecting member (141, 142) is reduced. Accordingly, the connecting member (141, 142) may be easily deformed by external impact. Accordingly, the electrical connection characteristics of the light source unit (130) and the circuit board (110) may be reduced. Accordingly, the reliability of the lighting device may be reduced.

[0082]

[0083] The insulating member (200) may have a set thickness (T). The thickness (T) of the insulating member (200) may be less than or equal to the height (H) of the connecting member (141, 142). The height (H) of the connecting member (141, 142) is the distance from the heat dissipation unit (102) to the connecting member (141, 142). For example, the thickness (T) of the insulating member (200) may be 90% to 100% of the height (H) of the connecting member (141, 142). Therefore, the connecting member (141, 142) may be in contact with the insulating member (200). In detail, the connecting member (141, 142) may include an area in contact with the insulating member (200). Accordingly, the connecting members (141, 142) are supported by the insulating member (200). Accordingly, even if a physical force is applied from the outside, deformation of the connecting members (141, 142) can be prevented. When a physical force is applied from the outside, the shape of the connecting members (141, 142) may change to a concave shape. As a result, the bonding strength of the connecting members (141, 142), the pads (111, 112), and the bonding pads (134, 135) may be reduced. Alternatively, the connection of the connecting members (141, 142), the pads (111, 112), and the bonding pads (134, 135) may be broken.

[0084] The deformation of the above connecting members (141, 142) is limited by the insulating member (200). Therefore, even if a physical force is applied from the outside, deformation of the connecting members (141, 142) can be minimized. Accordingly, the bonding strength of the connecting members (141, 142), pads (111, 112), and bonding pads (134, 135) can be prevented from decreasing due to an external force.

[0085] As another example, the connecting member (141, 142) may be spaced apart from the insulating member (200). Specifically, the connecting member (141, 142) may not include an area in contact with the insulating member (200). Accordingly, the deformation of the connecting member (141, 142) is limited by the insulating member (200). Specifically, even if a physical force is applied from the outside, the deformation of the connecting member (141, 142) is limited to an area in which it comes into contact with the insulating member (200). Therefore, the deformation of the connecting member (141, 142) can be minimized. Accordingly, the bonding force of the connecting member (141, 142), the pad (111, 112), and the bonding pad (134, 135) can be prevented from being reduced by an external force.

[0086]

[0087] The connecting member (141, 142) and the insulating member (200) do not contact each other. The lighting device generates heat during operation. The connecting member (141, 142) and the insulating member (200) contain different materials. Accordingly, the connecting member (141, 142) and the insulating member (200) have different thermal expansion coefficients. Accordingly, the deformation amounts of the connecting member (141, 142) and the insulating member (200) may be different at the same temperature. Accordingly, the connecting member (141, 142) and the insulating member (200) do not contact each other. Accordingly, the connecting member (141, 142) can be prevented from being deformed by the insulating member (200).

[0088] The thickness (T) of the insulating member (200) may be 90% or more of the height (H) of the connecting member (141, 142). If the thickness (T) of the insulating member (200) is less than 90% of the height (H) of the connecting member (141, 142), deformation of the connecting member (141, 142) may increase due to external impact. Accordingly, the bonding strength of the connecting member (141, 142), pad, and bonding pad may decrease.

[0089]

[0090] Referring to Fig. 8, the heat dissipation part (102) may include a pattern (P). The insulating member (200) is formed in a drop shape. Accordingly, the contact area between the insulating member (200) and the heat dissipation part (102) becomes small. Accordingly, the adhesion of the insulating member (200) may decrease. Accordingly, a plurality of patterns (P) may be formed on the surface of the heat dissipation part (102). The insulating member (200) may be in contact with the pattern (P). The contact area between the insulating member (200) and the heat dissipation part (102) may increase by the pattern (P). Accordingly, the adhesion of the insulating member (200) may increase. Accordingly, the insulating member (200) may be prevented from being peeled off. Accordingly, the reliability of the lighting device may be improved.

[0091]

[0092] A lighting device according to a first embodiment includes an insulating member. The insulating member supports the connecting member. The connecting member is in contact with the insulating member. Accordingly, deformation of the connecting member due to external impact can be prevented. Accordingly, bonding strength of the connecting member, the pad, and the bonding pad is improved. The connecting member is spaced apart from the insulating member by a set range. Accordingly, deformation of the connecting member due to external impact can be prevented. Accordingly, bonding strength of the connecting member, the pad, and the bonding pad is improved. In addition, the connecting member does not contact the insulating member. Accordingly, deformation of the position of the connecting member due to a difference in thermal expansion coefficients between the connecting member and the insulating member can be prevented. Accordingly, bonding strength of the connecting member, the pad, and the bonding pad is improved.

[0093]

[0094] Below, a lighting device according to a second embodiment will be described with reference to the drawings. Descriptions similar to those of the lighting device according to the first embodiment described above will be omitted.

[0095] Referring to FIGS. 9 to 20, a lighting device according to a second embodiment includes a heat dissipation plate (101), a circuit board (110), a light source unit (130), and connecting members (141, 142). Unlike the lighting device according to the first embodiment disclosed above, the lighting device according to the second embodiment does not include a recessed unit. Therefore, the circuit board (110) is disposed on the heat dissipation unit (102). The circuit board (110) is disposed on the same plane as the light source unit (130). The circuit board (110) is disposed spaced apart from the light source unit (130).

[0096] Although not shown in the drawing, an adhesive may be placed between the circuit board (110) and the heat dissipation unit (102). The circuit board (1100) may be bonded to the heat dissipation unit (102) by the adhesive. The light source unit (130) and the circuit board (110) are electrically connected by the first connecting member (141) and the second connecting member (142). The connecting members (141, 142) include wires. Accordingly, the connecting members (141, 142) may be damaged by external impact. In addition, when the connecting members (141, 142) are exposed to the outside, they may react with substances in the air and corrode. Accordingly, the electrical connection characteristics of the light source unit (310) and the circuit board (110) may be reduced. In order to solve the above-described problem, the lighting device according to the embodiment controls the shape of the connecting member.

[0097] Referring to FIGS. 11 to 14, the connecting member (141, 142) may have a concave shape. In detail, the connecting member (141, 142) may have a downwardly convex shape. The connecting member (141, 142) includes one end (41), the other end (43), and the connecting portion (42). The connecting portion (42) may include a concave portion. In detail, the connecting portion (42) may have a convex shape or a convex portion toward the heat dissipation plate (101).

[0098] The connecting portion (42) of the connecting member (141, 142) may include a central portion (42a) and an outer portion. The outer portion may include a first outer portion (42b1) and a second outer portion (42b2). The first outer portion (42b1) may be adjacent to a bonding pad (134, 135). The second outer portion (42b2) may be adjacent to the pad (111, 112). The central portion (42a) is an area disposed between the light source portion (131) and the circuit board (110). In detail, the central portion (42a) is an area disposed between a side surface of the insulating member (133) and a side surface of the circuit board (110). The first outer portion (42b1) and the second outer portion (42b2) are regions arranged outside the area between the side surface of the support member (133) and the side surface of the circuit board (110). The central portion (42a) may be concave. Specifically, the central portion (42a) may be convex downward. The central portion (42a) may be convex toward the heat dissipation plate (101). The outer portions (42b1, 42b2) may be convex. Specifically, the outer portions (42b1, 42b2) may be convex upward. Specifically, the outer portions (42b1, 42b2) may be convex in the opposite direction of the heat dissipation plate (101).

[0099] Accordingly, the connecting portion (42) of the connecting member (141, 142) may extend from the bonding pad (134, 135) to the pad (111, 112) and may be convex upward, then convex downward, and may be convex in multiple ways. That is, the connecting portion (42) may be formed in a shape in which an upward convexity, a downward convexity, and an upward convexity are sequentially connected. The length of the central portion (42a) may be longer than the length of at least one of the first outer portion (42b1) and the second outer portion (42b2). For example, the length of the central portion (42a) may be longer than the length of the first outer portion (42b1). Alternatively, the length of the central portion (42a) may be longer than the length of the second outer portion (42b2). Alternatively, the length of the central portion (42a) may be longer than the sum of the lengths of the first outer portion (42b1) and the second outer portion (42b2). For example, the length of the central portion (42a) may be 30% or more of the length of the connecting member (141, 142). Specifically, the length of the central portion (42a) may be 30% to 70%, 35% to 65%, or 40% to 60% of the length of the connecting member (141, 142). If the length of the central portion (42a) is less than 30% of the length of the connecting member (141, 142), a convex area in the opposite direction of the heat dissipation plate may increase. Accordingly, the connecting member may be damaged by an external impact. If the length of the central portion (42a) exceeds 70% of the length of the connecting member (141, 142), the curvature of the central portion (42a) may increase. Accordingly, a crack may form in the connecting member. In addition, the connecting member and the heat dissipation member may come into contact.

[0100] The length of at least one of the outer portions (42b1, 42b2) of the connecting member (141, 142) may be 15% or more of the length of the connecting member (141, 142). In detail, the length of at least one of the outer portions (42b1, 42b2) may be 15% to 35%, 20% to 30%, or 22% to 28% of the length of the connecting member (141, 142). If the length of the outer portions (42b1, 42b2) is less than 15% of the length of the connecting member (141, 142), the connection characteristics of the connecting member (141, 142) and the bonding pad (134, 135) and the connection characteristics of the connecting member (141, 142) and the pad (111, 112) may be reduced. When the length of the outer portion (42b1, 42b2) exceeds 30% of the length of the connecting member (141, 142), the length of the connecting member (141, 142) may increase. Accordingly, the size of the lighting device may increase due to the connecting member (141, 142).

[0101]

[0102] In the length range of the central portion and the outer portion of the connecting member (141, 142), the length of the central portion (42a) may be longer than the length of at least one of the first outer portion (42b1) and the second outer portion (42b2). For example, the length of the central portion (42a) may be longer than the length of the first outer portion (42b1). Alternatively, the length of the central portion (42a) may be longer than the length of the second outer portion (42b2). Alternatively, the length of the central portion (42a) may be longer than the sum of the lengths of the first outer portion (42b1) and the second outer portion (42b2). That is, most of the area of ​​the connecting member (141, 142) may be formed in a downwardly convex shape. Accordingly, the area of ​​the connecting member (141, 142) can be placed between the light source unit (130) and the circuit board (110).

[0103] The above connecting members (141, 142) can be protected due to their shape. That is, even if an impact is transmitted from the outside, the connecting members (141, 142) can be protected by the light source unit (130) and the circuit board (110). In detail, since the area of ​​the connecting members (141, 142) is arranged between the light source unit (130) and the circuit board (110), an external impact can be prevented from being transmitted to the connecting members (141, 142). Therefore, the connecting members (141, 142) can be prevented from being damaged by an external impact.

[0104] The light source unit (130) and the circuit board (110) may be spaced apart from each other. The light source unit (130) and the circuit board (110) may be spaced apart from each other by a set distance. The first direction distance (d) between the light source unit (130) and the circuit board (110) may be 60% or more of the length of the connecting member (141, 142). In detail, the distance (d) between the light source unit (130) and the circuit board (110) may be 60% to 90%, 65% to 85%, or 70% to 80% of the length of the connecting member (141, 142).

[0105] If the distance (d) between the light source unit (130) and the circuit board (110) is less than 60% of the length of the connecting member (141, 142), the size of the distance (d) between the light source unit (130) and the circuit board (110) is narrowed. Accordingly, the curvature of the central portion (42a) may increase. Accordingly, a crack may be formed in the connecting member. In addition, the connecting member and the heat dissipation unit may come into contact. If the distance (d) between the light source unit (130) and the circuit board (110) exceeds 80% of the length of the connecting member (141, 142), the length of the connecting member may increase. Accordingly, the size of the lighting device may increase due to the connecting member.

[0106]

[0107] The above connecting member (141, 142) can be spaced apart from the heat dissipation part (102). The connecting member (141, 142) and the heat dissipation plate (101) can be spaced apart by a set distance. The minimum distance (D) in the third direction (Z) between the connecting member (141, 142) and the heat dissipation part (102) can be 0.1 mm or more. The minimum distance (D) between the connecting member (141, 142) and the heat dissipation part (102) can be less than the thickness of the support member (133) and the circuit board (110). For example, the minimum distance (D) between the connecting member (141, 142) and the heat dissipation part (102) can be 0.1 mm to 2 mm.

[0108]

[0109] The center (42a) of the above connecting member (141, 142) may have a defined center. Specifically, the center of the central part (42a) may be defined as the area where the distance between the central part (42a) and the heat dissipation member is the smallest. The center of the central part (42a) may be at or adjacent to a point halfway along the length of the central part (42a). Specifically, the center of the central part (42a) may be positioned within an area of ​​±10% of a point halfway along the length of the central part (42a). Accordingly, the connecting member (42) may be prevented from being significantly bent in one direction. Accordingly, cracks in the connecting member may be prevented.

[0110]

[0111] Referring to Fig. 14, the heat dissipation plate (101) may include a groove. In detail, the heat dissipation unit (102) may include a groove (G). The groove (G) is arranged between the light source unit (130) and the circuit board (110). Therefore, the groove (G) may overlap with the connecting member (141, 142). In detail, the groove (G) may overlap with the central portion (42a). Accordingly, contact between the connecting member (141, 142) and the heat dissipation plate (101) may be prevented.

[0112] Since the heat dissipation plate (101) is made of a conductive material, if the connecting member (141, 142) and the heat dissipation plate (101) come into contact, a short circuit may occur between the circuit board (110) and the light source unit (130). Accordingly, the reliability of the lighting device may decrease. Accordingly, the heat dissipation unit (102) includes a groove (G). Accordingly, during the process of forming the connecting member (141, 142), the central portion (42a) and the heat dissipation unit (102) can be prevented from coming into contact. That is, the minimum distance (D) between the connecting member (141, 142) and the heat dissipation unit (102) can be increased. Alternatively, after forming the connecting member (141, 142), the central portion (42a) and the heat dissipation unit (102) can be prevented from coming into contact due to an external impact. Therefore, the reliability of the lighting device is improved.

[0113]

[0114] The height of the upper surface of the light source unit (130) may be different from the height of the upper surface of the circuit board (110). The height (H1) of the upper surface of the light source unit (130) is the height from the heat dissipation unit (102) to the upper surface of the support member (133). The height (H2) of the upper surface of the circuit board (110) is the height from the heat dissipation unit (102) to the upper surface of the circuit board (110). The height (H1) of the upper surface of the light source unit (130) and the height (H2) of the upper surface of the circuit board (110) may be the same as or similar to each other. In detail, the height (H1) of the upper surface of the light source unit (130) may be 90% to 110% of the height (H2) of the upper surface of the circuit board (110). If the height (H1) of the upper surface of the light source unit (130) and the height (H2) of the upper surface of the circuit board (110) are outside the above range, the length of the outer portions (42b1, 42b2) may increase. Accordingly, the length of the connecting members (141, 142) arranged in an area other than between the side surface of the light source unit (130) and the side surface of the circuit board (110) may increase. Accordingly, the connecting members (141, 142) may be damaged by external impact.

[0115]

[0116] The lighting device further includes an insulating member (300). The insulating member (300) is disposed between the light source unit (130) and the circuit board (110). The insulating member (300) is disposed on the heat dissipation unit (102). The insulating member (300) is disposed below the connecting member (141, 142). The insulating member (300) is disposed below the central portion (42a). The insulating member (300) faces the connecting member (141, 142). The insulating member (300) faces the central portion (42a). The insulating member (300) may be disposed inside the groove (G) of the heat dissipation plate as shown in FIG. 14. The groove (G) of the heat dissipation plate may have a long length in the second direction (Y) and may vertically overlap with the connecting member (141, 142). The connecting member (141, 142) is arranged to be concave toward the heat dissipation unit (102). Accordingly, the center portion (42a) is arranged adjacent to the heat dissipation unit (102). Therefore, when handling the lighting device, the connecting member (141, 142) and the heat dissipation unit (102) may come into contact. Alternatively, the connecting member (141, 142) and the heat dissipation unit (102) may come into contact due to an external impact. Since the connecting member (141, 142) and the heat dissipation unit (102) are both made of conductive materials, a short circuit may occur when the connecting member (141, 142) and the heat dissipation unit (102) come into contact. Therefore, the reliability of the lighting device is reduced. Accordingly, an insulating member (300) is arranged on the heat dissipation member (102). Accordingly, it is possible to prevent the connection member (141, 142) and the heat dissipation member (102) from coming into contact with each other due to deformation of the connection member (141, 142). In detail, even if the connection member (141, 142) comes close to the heat dissipation member (102) due to an external impact, the connection member (141, 142) does not come into contact with the heat dissipation member (102) due to the insulating member (300).Accordingly, it is possible to prevent the connecting member (141, 142) and the heat dissipation member (102) from being electrically connected.

[0117]

[0118] The above connecting member (141, 142) includes metal. Accordingly, the connecting member (141, 142) may be corroded by external moisture. In addition, the connecting member (141, 142) may be separated from the bonding pad (134, 135) or the pad (111, 112) by external impact. Alternatively, after the connecting member (141, 142) is formed, the central portion (42a) and the heat dissipation portion (102) may come into contact by external impact. In order to solve the above problem, the lighting device according to the embodiment may further include a molding portion (250).

[0119]

[0120] Referring to FIGS. 15 and 16, the lighting device may include a molding portion (250). The molding portion (250) is positioned between the light source portion (130) and the circuit board (110).

[0121] The molding part (250) can surround the connecting member (141, 142). Specifically, the molding part (250) can surround a portion of the connecting member (141, 142). Specifically, the molding part (250) can surround the connecting member (42). Specifically, the molding part (250) can surround a portion of the connecting member (240). Specifically, the molding part (250) can surround the central portion (42a). The outer portions (42b1, 42b2) can be arranged on the outside of the molding part (250). The central portion (42a) occupies most of the area of ​​the connecting member (141, 142). Therefore, the molding part (250) can surround most of the area of ​​the connecting member (141, 142). Accordingly, the connecting member (141, 142) can be prevented from being corroded by external moisture. Specifically, the corrosion rate of the connecting member (141, 142) can be reduced. In addition, the connecting member (141, 142) can be prevented from being disconnected from the bonding pad (134, 135) or the pad (111, 112) due to external impact. Accordingly, the reliability of the lighting device is improved. After forming the connecting member (141, 142), the central portion (42a) and the heat dissipation portion (102) can be prevented from coming into contact with external impact. Accordingly, the electrical characteristics of the lighting device can be improved.

[0122]

[0123] Referring to FIGS. 17 and 18, the lighting device may include a molding part (250). The molding part (250) is disposed between the light source part (130) and the circuit board (110). In addition, the molding part (250) is disposed on the circuit board (110). Specifically, the molding part (250) is disposed on the pads (111, 112). The molding part (250) may surround the connecting member (141, 142). Specifically, the molding part (250) may surround a portion of the connecting member (141, 142). Specifically, the molding part (250) may surround the connecting part (42). Specifically, the molding part (250) may surround a portion of the connecting part (240). In detail, the molding part (250) can surround the central part (42a) and the second outer part (42b2). The first outer part (42b1) can be arranged on the outside of the molding part (250). The central part (42a) occupies most of the area of ​​the connecting member (141, 142). Therefore, the molding part (250) can surround most of the area of ​​the connecting member (141, 142).

[0124] The molding part (250) can prevent the connecting member (141, 142) from being corroded by external moisture. Specifically, the corrosion rate of the connecting member (141, 142) can be reduced. In addition, the connecting member (141, 142) can be prevented from being disconnected from the bonding pad (134, 135) or the pad (111, 112) due to external impact. Therefore, the reliability of the lighting device is improved. In addition, after forming the connecting member (141, 142), the central part (42a) and the heat dissipation part (102) can be prevented from coming into contact with an external impact. Therefore, the electrical characteristics of the lighting device can be improved. The molding part (250) surrounds the second outer part (42b2). The second outer portion (42b2) is disposed outside the area between the light source portion (130) and the circuit board (110). Accordingly, the second outer portion (42b2) may be more vulnerable to external impact than the central portion (42a). Since the molding portion (250) is disposed to surround the second outer portion (42b2), the second outer portion can be prevented from being damaged by external impact. The molding portion (250) can surround the pads (111, 112). In detail, the molding portion (250) can surround the joining area of ​​the connecting member (141, 142) and the pads (111, 112). Therefore, the connection between the connecting member (141, 142) and the pads (111, 112) can be prevented from being disconnected.

[0125]

[0126] Referring to FIGS. 19 and 20, the lighting device may include a molding part (250). The molding part (250) is disposed between the light source part (130) and the circuit board (110). In addition, the molding part (250) is disposed on the circuit board (110). Specifically, the molding part (250) is disposed on the pads (111, 112). In addition, the molding part (250) is disposed on the light source part (130). In detail, the molding part (250) is disposed on the support member (133). In detail, the molding part (250) is disposed on the bonding pads (134, 135). The molding part (250) may surround the connecting member (141, 142). In detail, the molding part (250) can wrap the entire area of ​​the connecting member (141, 142).

[0127] The molding part (250) can surround the connecting part (42). Specifically, the molding part (250) can surround the entire area of ​​the connecting part (240). Specifically, the molding part (250) can surround the central part (42a), the first outer part (42b1), and the second outer part (42b2). Therefore, the connecting members (141, 142) can be prevented from being corroded by external moisture. Specifically, the corrosion rate of the connecting members (141, 142) can be reduced. In addition, the connecting members (141, 142) can be prevented from being disconnected from the bonding pads (134, 135) or the pads (111, 112) due to external impact. Therefore, the reliability of the lighting device is improved.

[0128]

[0129] After forming the connecting member (141, 142), the central portion (42a) and the heat dissipation portion (102) can be prevented from coming into contact with external impact. Accordingly, the electrical characteristics of the lighting device can be improved. The molding portion (250) surrounds the first outer portion (42b1). The first outer portion (42b1) is disposed in an area other than between the light source portion (130) and the circuit board (110). Accordingly, the first outer portion (42b1) may be more vulnerable to external impact than the central portion (42a). Since the molding portion (250) is disposed while surrounding the first outer portion (42b1), the first outer portion can be prevented from being damaged by external impact.

[0130] The molding part (250) surrounds the second outer portion (42b2). The second outer portion (42b2) is positioned outside the area between the light source portion (130) and the circuit board (110). Accordingly, the second outer portion (42b2) may be more vulnerable to external impact than the central portion (42a). Since the molding part (250) is positioned to surround the second outer portion (42b2), the second outer portion can be prevented from being damaged by external impact.

[0131] The light source unit (130) and the circuit board (110) may include grooves. Specifically, the light source unit (130) may include a first groove (G1). The first groove (G1) may be formed on the upper surface of the support member (133). The circuit board (110) may include a second groove (G2). The bonding pads (134, 135) may be arranged inside the first groove (G1). In addition, the pads (111, 1120) may be arranged inside the second groove (G2).

[0132] The molding part (250) can surround the bonding pad (134, 135). Specifically, the molding part (250) can surround the end (41). Specifically, the molding part (250) can surround the bonding area of ​​the connecting member (141, 142) and the bonding pad (134, 135). Therefore, the connection between the connecting member (141, 142) and the bonding pad (111, 112) can be prevented from being disconnected. The bonding pad (134, 135) is arranged inside the first groove (G1). Therefore, the molding part (250) can be prevented from moving toward the light emitting element (131). That is, the molding part (250) may be placed only in contact with the lower side of the side of the light-emitting element (131) facing the circuit board (110), or may be placed spaced apart from the side of the light-emitting element (131). Accordingly, it is possible to prevent light emitted from the light-emitting element (131) from interfering with the molding part (250). Accordingly, the brightness of the lighting device may be improved.

[0133] The molding part (250) can surround the pads (111, 112). Specifically, the molding part (250) can surround the other end (43). Specifically, the molding part (250) can surround the joining area of ​​the connecting member (141, 142) and the pad (111, 112). Therefore, the connection between the connecting member (141, 142) and the pad (111, 112) can be prevented from being disconnected. The pad (111, 112) is arranged inside the second groove (G2). Therefore, the size of the molding part moving toward the circuit board (110) can be controlled. Therefore, the bezel area of ​​the circuit board is reduced. Therefore, the size of the lighting device can be reduced.

[0134]

[0135] Referring to FIGS. 15 to 20, the insulating member (300) is covered by the molding part (250). The insulating member (300) and the molding part (250) may include the same material. Alternatively, the insulating member (300) and the molding part (250) may include materials having similar thermal expansion coefficients. Since the insulating member (300) and the molding part (250) have similar thermal expansion coefficients, it is possible to prevent a gap from being formed between the insulating member (300) and the molding part (250) due to peeling of the insulating member (300) and the molding part (250) due to heat generated during operation of the lighting device.

[0136] Since the connecting members (141, 142) are made of metal and the molding part (250) is made of a non-metallic material, the thermal expansion coefficients of the connecting members (141, 142) and the molding part (250) are different. Accordingly, the shape or position of the connecting members (141, 142) may be deformed due to heat generated during operation of the lighting device. Accordingly, the connecting members (141, 142) may move toward the heat dissipation part (102) so that the connecting members (141, 142) and the heat dissipation part (102) may come into contact. The insulating member (300) is arranged on the heat dissipation part (102). Accordingly, even if the shape or position of the connecting member (141, 142) is deformed due to a difference in the thermal expansion coefficients of the connecting member (141, 142) and the molding member (250), the connecting member (141, 142) and the heat dissipation member (102) can be prevented from coming into contact. Accordingly, the reliability of the lighting device is improved.

[0137]

[0138] A lighting device according to a second embodiment includes a connecting member. The connecting member connects a light source unit and a circuit board. Specifically, the connecting member is connected to the bonding pad and the pad. The connecting member includes one end, another end, and a connecting portion. The connecting portion connects the one end and the other end. The connecting portion includes a central portion and an outer portion. The central portion occupies most of the area of ​​the connecting portion. The central portion is formed concavely. Specifically, the central portion is formed convexly downward. Therefore, the central portion is disposed in an area between the light source unit and the circuit board. Therefore, when an impact is transmitted from the outside, the central portion can be protected by the light source unit and the circuit board. Therefore, the connecting portion can be prevented from being damaged by an external impact. Therefore, the reliability of the lighting device can be improved.

[0139] The lighting device may further include a molding member. The molding member may be arranged to surround at least one of the connecting member, one end, and the other end. Accordingly, corrosion of the connecting member can be prevented. In addition, the fixing strength of the connecting member can be improved. Furthermore, short-circuiting of the connecting member, bonding pad, and pad can be prevented.

[0140] In addition, the light source part includes a first groove, and the circuit board includes a second groove. The bonding pad is disposed within the first groove, and the pad is disposed within the second groove. The area of ​​the molding part is controlled by the first groove and the second groove. Therefore, the molding part can be prevented from moving toward the light source part. Therefore, the brightness of the lighting device can be improved. In addition, the bezel area of ​​the circuit board can be prevented from increasing due to the molding part. Therefore, the size of the lighting device can be reduced. In addition, the lighting device includes an insulating member on the heat dissipation member. Accordingly, even if the shape or position of the connecting member is deformed due to an external impact or a difference in thermal expansion coefficient with respect to the molding part, contact between the connecting member and the heat dissipation member can be prevented. Accordingly, electrical connection between the connecting member and the heat dissipation member is prevented, so the reliability of the lighting device is improved.

[0141] The above lighting device can be applied to lighting of mobile devices such as vehicles, drones, etc. In addition, the lighting device can be applied to various types of lighting of the vehicle, such as headlamps.

[0142]

[0143] The features, structures, effects, etc. described in the above-described embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person skilled in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention. In addition, although the above description focuses on the embodiments, these are merely examples and do not limit the present invention. Those skilled in the art to which the present invention pertains will appreciate that various modifications and applications not illustrated above are possible without departing from the essential characteristics of the present embodiments. For example, each component specifically shown in the embodiments can be implemented by modification. And the differences related to such modifications and applications should be interpreted as being included in the scope of the present invention defined in the appended claims.

Claims

1. A heat dissipation plate including a recessed portion; A circuit board disposed in the above recessed portion and having a plurality of pads; A light source unit disposed on the heat dissipation plate and including a plurality of light-emitting elements and a plurality of bonding pads; A plurality of connecting members connecting the circuit board and the light source unit; and The circuit board and the light source are spaced apart in the first direction, The above plurality of connecting members are spaced apart in a second direction orthogonal to the first direction, Including an insulating member arranged at the bottom of the above connecting member, The above plurality of connecting members are respectively connected between the plurality of pads and the plurality of bonding pads, The above insulating material is placed between the light source and the circuit board, A lighting device in which the above insulating material does not come into contact with the above pad and the above bonding pad.

2. In paragraph 1, A lighting device in which the above insulating material is in contact with the plurality of connecting materials.

3. In paragraph 1, A lighting device in which the above insulating material does not come into contact with the plurality of connecting materials.

4. In any one of paragraphs 1 to 3, The thickness of the above insulating material is 90% or more of the height of the above multiple connecting materials, A lighting device in which the height of the plurality of connecting members is the distance from the heat dissipation plate to the connecting members.

5. In any one of paragraphs 1 to 3, The area where the above plurality of pads are arranged has a first width in the second direction, The area where the above plurality of bonding pads are arranged has a second width in the second direction, The width of the insulating material in the second direction is 1 to 1.5 times the first width, A lighting device wherein the width of the insulating material is 1 to 1.3 times the second width.

6. In any one of paragraphs 1 to 3, A lighting device wherein the length of the insulating member in the first direction is 50% to 80% of the length of the connecting member.

7. In paragraph 1, The above heat dissipation plate includes a plurality of patterns, The above insulating material is a lighting device in contact with the above pattern.

8. Heat dissipation plate; A circuit board having a plurality of pads and disposed on the heat dissipation plate; A light source unit disposed on the heat dissipation plate and including a plurality of light-emitting elements and a plurality of bonding pads; A plurality of connecting members connecting the circuit board and the light source unit; and Including an insulating material arranged on the above heat dissipation plate, The above circuit board and the light source are spaced apart in the first direction, The above plurality of connecting members are spaced apart in a second direction orthogonal to the first direction, Each of the above plurality of connecting members includes one end connected to the plurality of bonding pads; another end connected to the plurality of pads; and a connecting portion connecting the one end and the other end. The above connecting portion includes a convex portion that is convex toward the heat dissipation plate, A lighting device in which the above insulating material is placed at the bottom of the plurality of connecting materials.

9. In paragraph 8, A lighting device comprising a sealing member surrounding the plurality of connecting members.

10. In paragraph 9, A lighting device wherein the sealing member and the insulating member comprise the same material.

11. In paragraph 8, The above light source portion includes a support member, The above light emitting element is arranged on the support member, The above connecting portion includes a central portion, a first outer portion, and a second outer portion, The above central portion is arranged in an area between the side of the support member and the side of the circuit board, A lighting device in which the first outer portion and the second outer portion are positioned in an area other than between the side surface of the support member and the side surface of the circuit board.

12. In paragraph 11, The above central portion is convex toward the heat dissipation plate, A lighting device convex in the opposite direction of the first outer portion and the second outer portion of the heat dissipation plate.

13. In paragraph 8, The above heat dissipation plate includes a groove having a long length in the second direction, The above home is a lighting device arranged between the light source and the circuit board.

14. In paragraph 13, A lighting device in which the insulating member is placed inside the groove and vertically overlaps the plurality of connecting members.

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