Flexible display and electronic device comprising same

Abstract

According to an embodiment of the present disclosure, an electronic device may include: a flexible display; a first substrate which at least partially overlaps the flexible display and is electrically connected to the flexible display; a display driving integrated circuit positioned on the first substrate; a second substrate which at least partially overlaps the first substrate, is electrically connected to the first substrate, and includes an accommodation portion for accommodating at least a part of the display driving integrated circuit; and a shielding structure positioned on the second substrate and configured to cover the accommodation portion and shield the display driving integrated circuit.

Description

Flexible display and electronic device including the same

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, flexible displays and electronic devices including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, or even functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] As mobile communication services expand into the realm of multimedia services, the size of displays on electronic devices may increase in order for users to fully utilize multimedia services in addition to voice calls and text messages.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No admission is made that any of the above-described matters constitute prior art related to the present disclosure.

[0006] According to one embodiment of the present disclosure, an electronic device may be provided, the electronic device including: a flexible display; a first substrate at least partially overlapping the flexible display and electrically connected to the flexible display; a display driver integrated circuit positioned on the first substrate; a second substrate at least partially overlapping the first substrate, electrically connected to the first substrate, and including a receiving portion that receives at least a portion of the display driver integrated circuit; and a shielding structure positioned on the second substrate, covering the receiving portion, and configured to shield the display driver integrated circuit.

[0007] According to one embodiment of the present disclosure, an electronic device may be provided, the electronic device including: a housing including a first housing portion and a second housing portion configured to move in a first direction relative to the first housing portion; a flexible display positioned in the housing; a first substrate positioned on the flexible display; a display driver integrated circuit positioned on the first substrate; a second substrate positioned on the first substrate in a second direction different from the first direction, the second substrate including a receiving portion electrically connected to the first substrate, the receiving portion accommodating at least a portion of the display driver integrated circuit; and a shielding structure positioned on the second substrate, electrically connected to a ground plane of the second substrate, and covering the display driver integrated circuit.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0009] FIG. 2A is a first side view showing a state in which a second display area of ​​a display is housed inside an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 2B is a front view showing a state in which a second display area of ​​a display is housed inside the electronic device of FIG. 2A according to one embodiment of the present invention.

[0011] FIG. 2C is a rear view showing a state in which a second display area of ​​a display is housed inside the electronic device of FIG. 2A according to one embodiment of the present invention.

[0012] FIG. 2D is a second side view showing a state in which a second display area of ​​a display is housed inside the electronic device of FIG. 2A according to one embodiment of the present invention.

[0013] FIG. 3A is a first side view showing a state in which a second display area of ​​a display is visually exposed to the outside of the electronic device according to one embodiment of the present disclosure.

[0014] FIG. 3b is a front view showing a state in which a second display area of ​​a display is visually exposed to the outside of the electronic device of FIG. 3a according to one embodiment of the present invention.

[0015] FIG. 3C is a rear view showing a state in which a second display area of ​​a display is visually exposed to the outside of the electronic device of FIG. 3A according to one embodiment of the present invention.

[0016] FIG. 3D is a second side view illustrating a state in which a second display area of ​​a display is visually exposed to the outside of the electronic device of FIG. 3A according to one embodiment of the present invention.

[0017] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 5a is a cross-sectional view taken along line A-A' of FIG. 2b according to one embodiment of the present disclosure.

[0019] FIG. 5b is a cross-sectional view taken along line B-B' of FIG. 3b according to one embodiment of the present disclosure.

[0020] FIG. 6 is a perspective view of a display assembly according to one embodiment of the present disclosure.

[0021] FIG. 7 is an exploded perspective view of a display assembly including a first substrate and a second substrate according to one embodiment of the present disclosure.

[0022] FIG. 8 is an exploded perspective view of a display assembly including a first substrate and a second substrate according to one embodiment of the present disclosure.

[0023] FIG. 9 is a rear view of a display assembly according to one embodiment of the present disclosure.

[0024] FIG. 10 is a rear view of a display assembly according to one embodiment of the present disclosure.

[0025] FIG. 11 is a rear view of a display assembly according to one embodiment of the present disclosure.

[0026] FIG. 12 is a rear view of a display assembly according to one embodiment of the present disclosure.

[0027] FIG. 13 is a rear view of a display assembly according to one embodiment of the present disclosure.

[0028] FIG. 14 is a cross-sectional perspective view taken along line CC' of FIG. 9 according to one embodiment of the present disclosure.

[0029] FIG. 15 is a cross-sectional perspective view taken along line CC' of FIG. 9 according to one embodiment of the present disclosure.

[0030] FIG. 16 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 17 is an enlarged view of portion D of FIG. 16 according to one embodiment of the present disclosure.

[0032] FIG. 18 is an enlarged view of portion D of FIG. 16 according to one embodiment of the present disclosure.

[0033] FIG. 19 is a cross-sectional perspective view of an electronic device taken along line EE' of FIG. 2c, according to one embodiment of the present disclosure.

[0034] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the embodiments of the present disclosure may be implemented in various different forms and are not limited to the exemplary embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, for the sake of clarity and conciseness, descriptions of well-known functions and configurations in the drawings and related descriptions may be omitted.

[0035] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0036] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0037] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0038] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0039] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0044] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0045] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0049] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0051] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0054] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0055] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0056] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0059] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0060] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0061] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0062] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0063] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0064] FIGS. 2A to 2D are drawings showing a state in which a second display area of ​​a display (e.g., display area (A2) of FIG. 3B) is housed inside an electronic device (101) according to one embodiment of the present disclosure. The second display area, which extends from the first display area, can be at least partially hidden inside the electronic device in a plane different from the plane of the first display area.

[0065] FIGS. 3A to 3D are diagrams illustrating a state in which a second display area of ​​a display is visually exposed to the outside of an electronic device according to one embodiment of the present disclosure. The second display area, which extends from the first display area, can be visually displayed at least partially to the outside of the electronic device in a substantially coplanar plane with the plane of the first display area based on movement of the second housing portion.

[0066] FIGS. 2A to 2D and 3A to 3D illustrate a structure in which a display (203) (e.g., a flexible display or a rollable display) extends in a longitudinal direction (e.g., +Y direction) when viewed from the front of the electronic device (101). However, the extension direction of the display (203) is not limited to one direction (e.g., +Y direction). For example, the extension direction of the display (203) may be designed to be extendable in an upward direction (+Y direction), a rightward direction (e.g., +X direction), a leftward direction (e.g., -X direction), and / or a downward direction (e.g., -Y direction).

[0067] The states illustrated in FIGS. 2A to 2D may represent a state in which substantially the entire second display area is hidden within the electronic device in a plane different from the plane of the first display area. For example, the states illustrated in FIGS. 2A to 2D may be referred to as a slide-in state of the electronic device (101), or a state in which the second display area (A2) of the display (203) is closed.

[0068] The states illustrated in FIGS. 3A to 3D may represent a state in which the area of ​​the second display area visually exposed to the outside of the electronic device is maximized on a plane substantially identical to the plane of the first display area. For example, the states illustrated in FIGS. 3A to 3D may be referred to as a slide-out state of the electronic device (101), or a state in which the second display area (A2) of the display (203) is open.

[0069] The embodiments of FIGS. 2A to 2D and FIGS. 3A to 3D may be combined with the embodiment of FIG. 1 or the embodiments of FIGS. 4 to 19.

[0070] Referring to FIGS. 2A to 2D and 3A to 3D , an electronic device (101) (e.g., the electronic device (101) of FIG. 1 ) may include a housing (210). The housing (210) may include a first housing portion (201) and a second housing portion (202) that is arranged to be relatively movable with respect to the first housing portion (201). In one embodiment, the electronic device (101) may have a structure in which the first housing portion (201) is arranged to be slidably movable with respect to the second housing portion (202). According to one embodiment, the second housing portion (202) may be arranged to be reciprocally movable a predetermined distance in a direction illustrated with respect to the first housing portion (201), for example, direction 1 of FIG. 3B . The first housing portion (201) may be referred to as a first housing, and the second housing portion (202) may be referred to as a second housing.

[0071] According to one embodiment, the second housing portion (202), which may be referred to as a slide portion or slide housing, may be relatively movable with respect to the first housing portion (201). According to one embodiment, the second housing portion (202) may accommodate various electrical and electronic components, such as a circuit board or a battery. When the electronic device (101) is in a slide-in state, the second housing portion (202) may be defined as a retracted position, and when the electronic device (101) is in a slide-out state, the second housing portion (202) may be defined as an extended position. For example, the second housing portion (202) may be configured to move between the retracted position and the extended position with respect to the first housing portion (201).

[0072] According to one embodiment, the slide-in state of the electronic device (101) (or the slide-out state of the electronic device (101)) may be changed to the slide-out state of the electronic device (101) (or the slide-in state of the electronic device (101)) based on a predefined user input. For example, the slide-in state of the electronic device (101) (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to a user input to a physical button exposed through a portion of the first housing portion (201) or a portion of the second housing portion (202). For example, the slide-in state (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to a touch input to an executable object displayed within a screen display area (e.g., the first display area (A1)). For example, the slide-in state (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to a touch input having a contact point on the screen display area (e.g., the first display area (A1)) and a pressing strength greater than or equal to a reference strength. For example, the slide-in state (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to a voice input received through a microphone of the electronic device (101). For example, the slide-in state (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to an external force applied to the first housing portion (201) and / or the second housing portion (202) to move the second housing portion (202) relative to the first housing portion (201).For example, the slide-in state (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to a user input identified from an external electronic device (e.g., earbuds or a smart watch) connected to the electronic device (101). However, the method of the present disclosure for causing the slide-in / out operation of the electronic device (101) is not limited thereto.

[0073] In one embodiment, the first housing portion (201) can accommodate an actuator (e.g., a motor), a speaker, a SIM socket, and / or a sub-circuit board electrically connected to the main circuit board. The second housing portion (202) can accommodate a main circuit board equipped with electrical components such as an application processor (AP) or a communication processor (CP). In one embodiment, the second housing portion (202) can accommodate an actuator, a speaker, a SIM socket, and / or a sub-circuit board electrically connected to the main circuit board, and the first housing portion (201) can accommodate a main circuit board equipped with electrical components such as an application processor (AP) or a communication processor (CP). In one embodiment, the sub-circuit board and the main circuit board may be disposed in the first housing portion (201), or may be disposed in the second housing portion (202).

[0074] According to one embodiment, the first housing portion (201) may include a first cover member (211) (e.g., a main case). The first cover member (211) may include a first-first side wall (211a), a first-second side wall (211b) extending from the first-first side wall (211a), and a first-third side wall (211c) extending from the first-first side wall (211a) and being substantially parallel to the first-second side wall (211b). According to one embodiment, the first-second side wall (211b) and the first-third side wall (211c) may be formed to be substantially perpendicular to the first-first side wall (211a).

[0075] According to one embodiment, the first-first side wall (211a), the first-second side wall (211b), and the first-third side wall (211c) of the first cover member (211) may be formed in a shape in which one side (e.g., the front face) is open to accommodate (or surround) at least a portion of the second housing portion (202). For example, at least a portion of the second housing portion (202) may be surrounded by the first housing portion (201) and may slide in a direction parallel to the first surface (e.g., the first surface (F1) of FIG. 4), for example, in direction 1, while being guided by the first housing portion (201). According to one embodiment, the first-first side wall (211a), the first-second side wall (211b), and / or the first-third side wall (211c) of the first cover member (211) may be formed as an integral part. According to one embodiment, the first-first side wall (211a), the first-second side wall (211b), and / or the first-third side wall (211c) of the first cover member (211) may be formed as separate structures and then joined or assembled.

[0076] According to one embodiment, the first cover member (211) may be formed to surround at least a portion of the display (203). For example, at least a portion of the display (203) may be formed to surround by the first-first side wall (211a), the first-second side wall (211b), and / or the first-third side wall (211c) of the first cover member (211).

[0077] In one embodiment, the second housing portion (202) may include a second cover member (221) (e.g., a slide plate). The second cover member (221) may have a plate shape and include a first surface (e.g., the first surface (F1) of FIG. 4) that supports internal components. For example, the second cover member (221) may support at least a portion of the display (203) (e.g., the first display area (A1)). In one embodiment, the second cover member (221) may be referred to as a front cover.

[0078] According to one embodiment, the second cover member (221) may include a second-first side wall (221a), a second-second side wall (221b) extending from the second-first side wall (221a), and a second-third side wall (221c) extending from the second-first side wall (221a) and being substantially parallel to the second-second side wall (221b). According to one embodiment, the second-second side wall (221b) and the second-third side wall (221c) may be formed substantially perpendicular to the second-first side wall (221a).

[0079] According to one embodiment, the second housing portion (202) can form a slide-in state and a slide-out state of the electronic device (101) by moving in a first direction (e.g., direction 1 of FIG. 3B) parallel to the second-second side wall (221b) or the second-third side wall (221c). In the slide-in state of the electronic device (101), the second housing portion (202) can be positioned at a first distance from the first-first side wall (211a) of the first housing portion (201), and in the slide-out state of the electronic device (101), the second housing portion (202) can be positioned at a second distance greater than the first distance from the first-first side wall (211a) of the first housing portion (201). In one embodiment, in the slide-in state of the electronic device (101), the first housing portion (201) may be formed to surround a portion of the second-second side wall (221b) and the second-third side wall (221c).

[0080] According to one embodiment, the electronic device (101) may have an intermediate state between the slide-in state (e.g., a fully closed state) of FIGS. 2A to 2D and the slide-out state (e.g., a fully opened state) of FIGS. 3A to 3D. In the intermediate state of the electronic device (101), the distance between the first-first sidewall (211a) and the second-first sidewall (221a) may be shorter than the distance between the first-first sidewall (211a) and the second-first sidewall (221a) of the electronic device (101) in the fully opened state, and may be longer than the distance between the first-first sidewall (211a) and the second-first sidewall (221a) of the electronic device (101) in the fully closed state. According to one embodiment, as at least a portion of the display (203) slides in an intermediate state of the electronic device (101), an area exposed to the outside may vary. For example, in an intermediate state of the electronic device (101), a ratio of a width (e.g., length in the X direction) to a height (e.g., length in the Y direction) of the display (203) and / or a distance between a first side wall (211a) and a second side wall (221a) may vary based on the sliding movement of the electronic device (101).

[0081] According to one embodiment, the electronic device (101) may include a display (203), a key input device (245), a connector hole (243), an audio module (e.g., at least one speaker hole (247a) and at least one microphone hole (247b)) or a camera module (e.g., a first camera module (249a) and a second camera module (249b)). According to one embodiment, the electronic device (101) may further include an indicator (e.g., an LED device) or various sensor modules.

[0082] According to one embodiment, the display (203) may be formed such that the size of a portion visible from the front side of the housing (210) changes based on the sliding movement of the second housing portion (202). According to one embodiment, the display (203) may include a first display area (A1) and a second display area (A2) configured to be exposed to the outside of the electronic device (101) based on the sliding movement of the second housing portion (202).

[0083] According to one embodiment, as the second housing portion (202) moves between a retracted position and an extended position relative to the first housing portion (201), the size of the display (203) viewed toward the exterior front face of the electronic device (101) can be varied. For example, when the second housing portion (202) is positioned in a retracted position relative to the first housing portion (201) (e.g., FIGS. 2A-2D), the size (or area) of the display (203) viewed toward the exterior front face of the electronic device (101) can be substantially minimized. Additionally, when the second housing portion (202) is positioned in an extended position relative to the first housing portion (201) (e.g., FIGS. 3A-3D), the size (or area) of the display (203) viewed toward the exterior front face of the electronic device (101) can be substantially maximized.

[0084] According to one embodiment, the first display area (A1) may be disposed on the second housing portion (202). For example, the first display area (A1) may be disposed on the second cover member (221) of the second housing portion (202). According to one embodiment, the second display area (A2) extends from the first display area (A1) and may be accommodated into the interior of the first housing portion (201) or visually exposed to the exterior of the electronic device (101) as the second housing portion (202) slides relative to the first housing portion (201). According to one embodiment, as the electronic device (101) changes from a slide-in state to a slide-out state, the display (203) may extend in a downward direction (e.g., a -Y direction) of the electronic device (101). For example, in the slide-out state of the electronic device (101), the second display area (A2) can be visually exposed from below (e.g., in the -Y direction) of the display (203). According to one embodiment, as the electronic device (101) changes from the slide-in state to the slide-out state, the display (203) can be expanded in the upper direction (e.g., in the +Y direction) of the electronic device (101). For example, in the slide-out state of the electronic device (101), the second display area (A2) can be visually exposed from above (e.g., in the +Y direction) of the display (203).

[0085] According to one embodiment, the second display area (A2) moves substantially under the guidance of an area of ​​the first housing part (201) (e.g., the guide rail (250) of FIG. 4) and may be stored in a space located inside the first housing part (201) or exposed to the outside of the electronic device (101). According to one embodiment, the second display area (A2) may move based on the sliding movement of the second housing part (202) in a first direction (e.g., direction 1). For example, while the second housing part (202) slides, a portion of the second display area (A2) may be deformed into a curved shape at a position corresponding to the curved surface (213a) of the first housing part (201).

[0086] According to one embodiment, when the electronic device (101) is changed from a slide-in state to a slide-out state (e.g., when the second housing portion (202) slides to extend with respect to the first housing portion (201) when viewed from the top (e.g., in the +Z direction or toward the front of the electronic device) of the second cover member (221) (e.g., the front cover), the second display area (A2) may be gradually exposed to the outside of the first housing portion (201) to form substantially the same plane together with the first display area (A1). According to one embodiment, the display (203) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (e.g., pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. According to one embodiment, regardless of the slide-in or slide-out state of the electronic device (101), a portion of the exposed second display area (A2) may be positioned on a portion of the first housing portion (e.g., the curved surface (213a) of FIG. 4), and a portion of the second display area (A2) may maintain a curved shape at a position corresponding to the curved surface (213a).

[0087] According to one embodiment, the key input device (245) may be located in an area of ​​the housing (210) (e.g., the first housing portion (201) and / or the second housing portion (202)). Depending on the appearance and usage state, the electronic device (101) may omit the key input device (245) or may include additional key input device(s). According to one embodiment, the electronic device (101) may include a key input device (e.g., a home key button or a touch pad disposed around the home key button). According to one embodiment, at least a portion of the key input device (245) may be disposed on the first-first side wall (211a), the first-second side wall (211b), and / or the first-third side wall (211c) of the first housing portion (201). According to one embodiment, at least a portion of the key input device (245) may be disposed on the second-first side wall (221a), the second-second side wall (221b), and / or the second-third side wall (221c) of the second housing portion (202).

[0088] According to one embodiment, the connector hole (243) may be omitted and may accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device. According to one embodiment, the electronic device (101) may include a plurality of connector holes (243), and some of the plurality of connector holes (243) may function as connector holes for transmitting and receiving audio signals with the external electronic device. In the illustrated embodiment, the connector hole (243) is located in the second housing portion (202), but is not limited thereto, and the connector hole (243) or another connector hole may be located in the first housing portion (201).

[0089] According to one embodiment, the audio module may include at least one speaker hole (247a) or at least one microphone hole (247b). One of the speaker holes (247a) may be provided as a receiver hole for voice calls, and the other may be provided as an external speaker hole. The electronic device (101) includes a microphone for acquiring sound, and the microphone may acquire sound from outside the electronic device (101) through the microphone hole (247b). According to one embodiment, the electronic device (101) may include a plurality of microphones for detecting the direction of sound. According to one embodiment, the electronic device (101) may include an audio module in which the speaker hole (247a) and the microphone hole (247b) are implemented as a single hole, or may include a speaker excluding the speaker hole (247a) (e.g., a piezo speaker). According to one embodiment, the speaker hole (247a) and the microphone hole (247b) may be located in the first housing portion (201) and / or the second housing portion (202).

[0090] According to one embodiment, the camera module may include a first camera module (249a) (e.g., a front camera) and a second camera module (249b) (e.g., a rear camera) (e.g., the second camera module (249b) of FIGS. 5A and 5B). According to one embodiment, the electronic device (101) may include at least one of a wide-angle camera, a telephoto camera, and a macro camera. According to one embodiment, the distance to a subject may be measured by including an infrared projector and / or an infrared receiver. The camera module may include one or more lenses, an image sensor, and / or an image signal processor. The first camera module (249a) may be arranged to face the same direction as the facing direction of the display (203). For example, the first camera module (249a) may be disposed around the first display area (A1) or in an area overlapping with the display (203), and when disposed in an area overlapping with the display (203), may capture a subject by passing through the display (203). According to one embodiment, the first camera module (249a) may not be visually exposed to the screen display area (e.g., the first display area (A1)) and may include a hidden under-display camera (UDC). According to one embodiment, the second camera module (249b) may capture a subject in a direction opposite to the facing direction of the first display area (A1). According to one embodiment, the first camera module (249a) and / or the second camera module (249b) may be disposed on the second housing portion (202). According to one embodiment, the second camera module (249b) may be formed in multiples to provide various arrangements. For example, a plurality of second camera modules (249b) may be arranged along a width direction (e.g., X-axis direction) that is substantially perpendicular to the slide movement direction (e.g., Y-axis direction) of the electronic device (101).As another example, a plurality of second camera modules (249b) may be arranged along the slide movement direction (e.g., Y-axis direction) of the electronic device (101). As another example, a plurality of second camera modules (249b) may be arranged along N * M rows and columns like a matrix.

[0091] According to one embodiment, the second camera module (249b) is not visually exposed to the outside of the electronic device (101) when the electronic device (101) is in a slide-in state, and can capture the outside of the electronic device (101) when the electronic device (101) is in a slide-out state. According to one embodiment, the second camera module (249b) can capture the outside of the electronic device (101) when the electronic device (101) is in a slide-in state and / or a slide-out state. For example, at least a portion of the housing (210) (e.g., the first rear plate (215) and / or the second rear plate (225) of FIG. 4) is substantially transparent, and the second camera module (249b) can capture the outside of the electronic device (101) by passing through the first rear plate (215) and / or the second rear plate (225). According to one embodiment, the second camera module (249b) is visually exposed to the outside of the electronic device (101) in the slide-in and slide-out states of the electronic device (101) and can capture the outside. For example, the first housing portion (201) (e.g., the first rear plate (215) of FIG. 4) may include an opening (201a) for the second camera module (249b).

[0092] According to one embodiment, the indicator of the electronic device (101) may be disposed in the first housing portion (201) or the second housing portion (202), and may include a light-emitting diode to provide status information of the electronic device (101) as a visual signal. The sensor modules (e.g., the first sensor module (261a) and the second sensor module (261b)) of the electronic device (101) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor modules (e.g., the first sensor module (261a) and the second sensor module (261b)) may include a proximity sensor, a fingerprint sensor, and / or a biometric sensor (e.g., an iris / facial recognition sensor or an HRM sensor). In one embodiment, the sensor modules (e.g., the first sensor module (261a) and the second sensor module (261b)) may further include at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a temperature sensor, a humidity sensor, and an illumination sensor. According to one embodiment, the sensor modules (e.g., the first sensor module (261a) and the second sensor module (261b)) may be disposed in the first housing portion (201) and / or the second housing portion (202). For example, the sensor modules may include the first sensor module (261a) (e.g., a proximity sensor or an illumination sensor) disposed on the front side of the electronic device (101) and / or the second sensor module (261b) (e.g., a heart rate monitoring (HRM) sensor) disposed on the rear side of the electronic device (101).

[0093] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0094] FIG. 5a is a cross-sectional view taken along line A-A' of FIG. 2b according to one embodiment of the present disclosure.

[0095] FIG. 5b is a cross-sectional view taken along line B-B' of FIG. 3b according to one embodiment of the present disclosure.

[0096] Referring to FIGS. 4, 5A, and / or 5B, an electronic device (101) (e.g., the electronic device (101) of FIGS. 1-3) may include a housing (210) including a first housing portion (201) and a second housing portion (202), a display assembly (230), and a drive structure (240). The configuration of the first housing portion (201), the second housing portion (202), and the display assembly (230) of FIGS. 4, 5A, and / or 5B may be all or part of the same as the configuration of the housing (210), the first housing portion (201), the second housing portion (202), and the display (203) of FIGS. 2A-2D and / or 3A-3D.

[0097] The embodiments of FIGS. 4 to 5b may be combined with the embodiments of FIGS. 1 to 3d, or the embodiments of FIGS. 6 to 19.

[0098] According to one embodiment, the housing (210) may include a first housing portion (201), and / or a second housing portion (202) movably coupled to the first housing portion (201).

[0099] According to one embodiment, the first housing portion (201) may include a first cover member (211) (e.g., the first cover member (211) of FIGS. 2 and 3), a frame (213), and a first rear plate (215).

[0100] According to one embodiment, the first cover member (211) can accommodate at least a portion of the frame (213) and accommodate a component (e.g., a battery (289)) positioned in the frame (213). According to one embodiment, the first cover member (211) can be formed to surround at least a portion of the second housing portion (202). According to one embodiment, the first cover member (211) can protect a component (e.g., a second circuit board (249) and the frame (213)) positioned in the first housing portion (201) from external impact. According to one embodiment, a second circuit board (249) electrically connected to an electrical component (e.g., an actuator, a speaker, a SIM socket, and / or the first circuit board (248)) can be connected to the first cover member (211).

[0101] In one embodiment, the frame (213) can be connected to the first cover member (211). For example, the frame (213) can be connected to the first cover member (211), and the second housing portion (202) can move relatively to the first cover member (211) and / or the frame (213). In one embodiment, the frame (213) can accommodate the battery (289). For example, the frame (213) can include a groove for accommodating the battery (289). The frame (213) can be connected to the battery cover (289a) and, together with the battery cover (289a), can surround at least a portion of the battery (289). In one embodiment, the frame (213) can include a curved surface (213a) facing the display assembly (230).

[0102] In one embodiment, the first back plate (215) can substantially form at least a portion of the first housing portion (201) or the exterior of the electronic device (101). For example, the first back plate (215) can be coupled to an outer surface of the first cover member (211). In one embodiment, the first back plate (215) can provide a decorative effect on the exterior of the electronic device (101). The first back plate (215) can be manufactured using at least one of metal, glass, synthetic resin, and ceramic.

[0103] According to one embodiment, the second housing portion (202) may include a second cover member (221) (e.g., the second cover member (221) of FIGS. 2A to 2D and FIGS. 3A to 3D), a rear cover (223), and a second rear plate (225).

[0104] According to one embodiment, the second cover member (221) is connected to the first housing portion (201) via a guide rail (250) and can reciprocate linearly in one direction (e.g., direction 1 of FIG. 3b) while being guided by the guide rail (250).

[0105] According to one embodiment, the second cover member (221) can support at least a portion of the display (231). For example, the second cover member (221) includes a first surface (F1), and a first display area (A1) of the display (231) can be substantially positioned on the first surface (F1) and maintained in a flat shape. According to one embodiment, the second cover member (221) can be formed of a metallic material and / or a non-metallic (e.g., polymer) material. According to one embodiment, a first circuit board (248) that accommodates electronic components (e.g., the processor (120) and / or the memory (130) of FIG. 1) can be connected to the second cover member (221). According to one embodiment, the second cover member (221) can protect components (e.g., the first circuit board (248) and the rear cover (223)) positioned in the second housing portion (202) from external impact.

[0106] According to one embodiment, the rear cover (223) can protect a component (e.g., a first circuit board (248)) located on the second cover member (221). For example, the rear cover (223) can be connected to the second cover member (221) and formed to surround at least a portion of the first circuit board (248). According to one embodiment, the rear cover (223) can include an antenna pattern (e.g., at least one antenna element (223a)) for communicating with an external electronic device. For example, the at least one antenna element (223a) can be disposed on an outer surface (e.g., one surface facing the -Z-axis direction) of the rear cover (223) when the rear cover (223) is formed of an injection-molded product of a dielectric material (e.g., an antenna carrier). For example, at least one antenna element (223a) may include an LDS (laser direct structuring) antenna pattern formed on the outer surface of the rear cover (223). For example, at least one antenna element (223a) may be formed in a manner that it is built in when the rear cover (223) is injected. For example, at least one antenna element (223a) may be configured to transmit or receive a wireless signal in a designated frequency band (e.g., a legacy band) by being electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the first circuit board (248).

[0107] In one embodiment, the second back plate (225) can substantially form at least a portion of the second housing portion (202) or the exterior of the electronic device (101). For example, the second back plate (225) can be coupled to an outer surface of the second cover member (221). In one embodiment, the second back plate (225) can provide a decorative effect on the exterior of the electronic device (101). The second back plate (225) can be manufactured using at least one of metal, glass, synthetic resin, and ceramic.

[0108] According to one embodiment, the display assembly (230) may include a display (231) (e.g., the display (203) of FIGS. 2A to 2D and / or 3A to 3D) and a multi-bar structure (232) supporting the display (231). According to one embodiment, the display (231) may be a flexible display, a foldable display, and / or a rollable display. According to one embodiment, a first display area (A1) of the display (231) may be supported by a rigid body, and a second display area (A2) may be supported by a bendable structure. For example, the first display area (A1) may be supported by a first surface (F1) of the second cover member (221) or a plate (e.g., the support plate (350) of FIG. 6). The second display area (A2) may be supported by the multi-bar structure (232).

[0109] According to one embodiment, the display (231) may include a first end (2311) or a second end (2312). The first end (2311) may be defined as one edge or one end of the display (231). For example, the first end (2311) may form at least a portion of the edge or end of the first display area (A1). The first end (2311) may be arranged substantially parallel to the second-first side wall of the second cover member (221) (e.g., the second-first side wall (221a) of FIGS. 2A to 2D and 3A to 3D). The second end (2312) may be defined as the other edge or the other end of the display (231). For example, the second end (2312) may form at least a portion of an edge or an end of the second display area (A2). As the second display area (A2) is at least partially bent relative to the first display area (A1), the second end (2312) may be positioned to face substantially the same direction as the facing direction of the first end (2311) (e.g., the +Y direction in FIG. 4). The first end (2311) of the display (231) may be electrically connected to a first substrate (e.g., the first substrate (320) in FIG. 7) that is electrically connected to a display driver integrated circuit (e.g., the display driver integrated circuit (324) in FIG. 7).

[0110] According to one embodiment, the multi-bar structure (232) can be connected or attached to at least a portion of the display (231) (e.g., the second display area (A2)). According to one embodiment, as the second housing portion (202) slides, the multi-bar structure (232) can move with respect to the first housing portion (201). In the slide-in state of the electronic device (101) (e.g., FIGS. 2A to 2D), the multi-bar structure (232) can be mostly accommodated within the first housing portion (201) and positioned between the first cover member (211) and the second cover member (221). According to one embodiment, at least a portion of the multi-bar structure (232) can move in response to a curved surface (213a) positioned at the edge of the frame (213). According to one embodiment, the multi-bar structure (232) can be a display support member or support structure, and can be in the form of a single bendable plate.

[0111] In one embodiment, the drive structure (240) can move the second housing portion (202) relative to the first housing portion (201). For example, the drive structure (240) can include an actuator (241) configured to generate a driving force for sliding movement of the second housing portion (202) relative to the first housing portion (201). The drive structure (240) can include a gear (244) (e.g., a pinion) connected to the actuator (241) and a rack (242) configured to mesh with the gear. Referring to FIG. 4, components of the drive structure (240) (e.g., the actuator (241), the rack (242), and the gear (244)) are illustrated inverted within a P1 circle (e.g., facing in the -Z-axis direction).

[0112] In one embodiment, the housing in which the rack (242) is positioned and the housing in which the actuator (241) is positioned may be different. In one embodiment, the actuator (241) may be connected to the first housing portion (201), and the rack (242) may be connected to the second housing portion (202). In one embodiment, the actuator (241) may be connected to the second housing portion (202), and the rack (242) may be connected to the first housing portion (201).

[0113] In one embodiment, the actuator (241) may be controlled by a processor (e.g., the processor (120) of FIG. 1). For example, the processor (120) may include an actuator driver driving circuit and may transmit a pulse width modulation (PWM) signal to the actuator (241) to control the speed of the actuator (241) and / or the torque of the actuator (241). In one embodiment, the actuator (241) may be electrically connected to a processor (e.g., the processor (120) of FIG. 1) located on a circuit board (e.g., the first circuit board (248) of FIG. 4) using a flexible printed circuit board.

[0114] In one embodiment, the second housing portion (202) can accommodate a first circuit board (248) (e.g., a main board). In one embodiment, a processor, a memory, and / or an interface can be mounted on the first circuit board (248). The processor can include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, and a communication processor. In various embodiments, the first circuit board (248) can include a radio frequency cable (FRC) of a flexible printed circuit board type. The first circuit board (248) can be disposed on at least a portion of the second cover member (221) and can be electrically connected to an antenna module (e.g., an antenna module (197) of FIG. 1) and a communication module (e.g., a communication module (190) of FIG. 1).

[0115] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0116] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0117] In one embodiment, the electronic device (101) may include a first circuit board (248) (e.g., a main circuit board) and a second circuit board (249) (e.g., a sub-circuit board) spaced apart from the first circuit board (248) within the first housing portion (201). The second circuit board (249) may be electrically connected to the first circuit board (248) via a flexible substrate. The second circuit board (249) may be electrically connected to electrical components disposed in an end region of the electronic device (101), such as a battery (289) or a speaker and / or a SIM socket, to transmit signals and power. In one embodiment, the second circuit board (249) may accommodate an antenna member (271) (e.g., a coil) or be connected to the antenna member (271). The antenna element (271) may include a multi-function coil (MFC) antenna including a wireless charging antenna for a wireless charging function, an NFC (near field communication) antenna for an NFC function, and / or an MST (magnetic secure transmission) antenna for performing an electronic payment function. For example, the battery (289) may receive power from an external electronic device using the antenna element (271) for wireless charging. As another example, the battery (289) may transmit power to an external electronic device using the antenna element (271) for wireless charging.

[0118] In one embodiment, the battery (289) is a device for supplying power to at least one component of the electronic device (101), and may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (289) may be integrally disposed within the electronic device (101), or may be detachably disposed with the electronic device (101). In one embodiment, the battery (289) may be formed as a single integral battery or may include multiple detachable batteries. In one embodiment, the battery (289) may be positioned in the frame (213). For example, the battery (289) may be surrounded by the frame (213) and a battery cover (289a). In one embodiment, the battery (289) may be positioned within the second housing portion (202) and may slide together with the second housing portion (202).

[0119] In one embodiment, the guide rail (250) can guide the movement of the multi-bar structure (232). For example, the multi-bar structure (232) can slide along a slit (251) formed in the guide rail (250). In one embodiment, the guide rail (250) can be connected to the first housing portion (201). For example, the guide rail (250) can be connected to the first cover member (211) and / or the frame (213). In one embodiment, the slit (251) can be a groove or recess formed on the inner surface of the guide rail (250). Referring to FIG. 4, the guide rail (250) is shown as a P2 circle.

[0120] According to one embodiment, the guide rail (250) can provide force to the multi-bar structure (232) based on the actuation of the actuator (241).

[0121] According to one embodiment, when the electronic device (101) changes from a slide-in state to a slide-out state, at least a portion of the second housing portion (202) can slide so as to be visually exposed to the outside from the first housing portion (201) through the actuation of the actuator (241). For example, the gear (244) can rotate in the first rotational direction based on the actuation of the actuator (241). As the rack (242) is fixed on the second cover member (221) of the second housing portion (202), the second housing portion (202) can slide so as to be visually exposed to the outside from the first housing portion (201) based on the slide movement of the rack (242) toward the slide-out direction.

[0122] According to one embodiment, when the electronic device (101) changes from a slide-in state to a slide-out state, the inner portion (252) of the guide rail (250) can provide force to the multi-bar structure (232). The multi-bar structure (232) provided with force moves along the slit (251) of the guide rail (250), and the second housing portion (202) can slide to expand with respect to the first housing portion (201). At least a portion of the display assembly (230) accommodated between the first cover member (211) and the frame (213) can expand toward the front.

[0123] According to one embodiment, when the electronic device (101) changes from a slide-out state to a slide-in state, at least a portion of the second housing portion (202) can slide to be inserted into the first housing portion (201) through the driving of the actuator (241). For example, the gear (244) can rotate in a second rotational direction opposite to the first rotational direction based on the driving of the actuator (241). Since the rack (242) is fixed on the second cover member (221) of the second housing portion (202), the second housing portion (202) can slide to be inserted into the first housing portion (201) based on the sliding movement of the rack (242) toward the slide-in direction.

[0124] According to one embodiment, when the electronic device (101) changes from a slide-out state to a slide-in state, the outer portion (253) of the guide rail (250) can provide force to the curved multi-bar structure (232). The multi-bar structure (232) provided with force moves along the slit (251) of the guide rail (250), and at least a portion of the second housing portion (202) can slide so as to be accommodated in the first housing portion (201). At least a portion of the display assembly (230) can be accommodated between the first cover member (211) and the frame (213).

[0125] According to one embodiment, the electronic device (101) may be configured to stop in a designated intermediate state between the slide-in state and the slide-out state by controlling the driving of the actuator (241) (free stop function). According to one embodiment, the electronic device (101) may be changed to the slide-in state, the intermediate state, or the slide-out state through a user's operation in a state where no driving force is provided to the actuator (241).

[0126] Referring to FIG. 5A, in the slide-in state of the electronic device (101), at least a portion of the second housing portion (202) may be arranged to be received in the first housing portion (201). As the second housing portion (202) is arranged to be received in the first housing portion (201), the overall size of the electronic device (101) may be reduced. In one embodiment, when the second housing portion (202) is received in the first housing portion (201), the size of the visually exposed display (231) may be minimized. For example, when the second housing portion (202) is completely received in the first housing portion (201), the first display area (A1) of the display (231) is visually exposed, and at least a portion (e.g., a portion facing the -Z axis) of the second display area (A2) may be arranged between the battery (289) and the first rear plate (215).

[0127] Referring to FIG. 5B, when the electronic device (101) is in a slide-out state, at least a portion of the second housing portion (202) may protrude from the first housing portion (201). As the second housing portion (202) protrudes from the first housing portion (201), the overall size of the electronic device (101) may increase. According to one embodiment, when the second housing portion (202) protrudes from the first housing portion (201), at least a portion of the second display area (A2) of the display (231) may be visually exposed to the outside of the electronic device (101) together with the first display area (A1).

[0128] The embodiments of FIGS. 6 to 8 can be combined with the embodiments of FIGS. 1 to 5b, or the embodiments of FIGS. 9 to 19.

[0129] Referring to FIGS. 6 to 8, a display assembly (300) (e.g., display assembly (230) of FIG. 4) may include a display (301), a multi-bar structure (303), a first board (320), a second board (330), a shielding structure (340), and / or a support plate (350).

[0130] The display (301) or multi-bar structure (303) of FIGS. 6 to 8 may have a configuration partially or entirely identical to that of the display (231) or multi-bar structure (232) of FIGS. 4 to 5b.

[0131] According to one embodiment, the display (301) may be defined and / or referred to as a display panel or a flexible display. The display (301) may include a first display area (A1) (e.g., the first display area (A1) of FIGS. 4 to 5B ) and / or a second display area (A2) (e.g., the second display area (A2) of FIGS. 4 to 5B ). The second display area (A2) may be supported by a multi-bar structure (303).

[0132] According to one embodiment, the display (301) may include a first end (3011) (e.g., the first end (2311) of FIG. 4) and / or a second end (3012) (e.g., the second end (2312) of FIG. 4). The first end (3011) of the display (301) (e.g., the first end (2311) of FIG. 4) may be electrically connected to a first substrate (320). The display (301) may be electrically connected to a display driver integrated circuit (DDI) (324) disposed or mounted on the first substrate (320).

[0133] In one embodiment, the support plate (350) may be configured to support the display (301). For example, the support plate (350) may be laminated on the inner surface of the display (301). The support plate (350) may provide a force to flatten or maintain the flatness of at least a portion of the display (301) that is visually exposed to the outside of the housing (e.g., the housing (210) of FIGS. 2A to 2D or FIG. 4). The support plate (350) may include a portion corresponding to the first display area (A1) and a portion corresponding to the second display area (A2). At least one through-formed hole or at least one recessed groove may be formed in the portion of the support plate (350) corresponding to the second display area (A2). The hole or the groove may provide flexibility to the support plate (350). For example, the support plate (350) may include, but is not limited to, a bendable metal material. According to one embodiment, at least a portion of the support plate (350) may be positioned between the display (301) and the first substrate (320), but is not limited thereto.

[0134] According to one embodiment, the first substrate (320) may be disposed on an inner surface of the display (301) (e.g., a surface facing the -Z direction of FIGS. 6 to 8 ). For example, the first substrate (320) may be disposed on an inner surface of the first display area (A1) (e.g., a surface facing the -Z direction of FIGS. 6 to 8 ). The inner surface of the display (301) and / or the first display area (A1) may be defined as a surface facing the inside of the electronic device (e.g., the electronic device (101) of FIGS. 2 to 5B ) or a surface that is not exposed to the outside of the electronic device. The inner surface of the first display area (A1) may be supported by a first surface (e.g., the first surface (F1) of FIG. 4 ) of a second cover member (e.g., the second cover member (221) of FIG. 4 ). The first substrate (320) may at least partially overlap the display (301).

[0135] According to one embodiment, the first substrate (320) may be disposed at least partially between the display (301) and the second substrate (330).

[0136] According to one embodiment, the first substrate (320) may be electrically connected to the display (301). The first substrate (320) may provide an electrical path for connecting the display (301) and the display driver integrated circuit (324). For example, the first substrate (320) may include electrical wiring for providing the electrical path. The display driver integrated circuit (324) may be arranged or mounted on the first substrate (320). The first substrate (320) may include at least one of a panel, plastic, glass, and film. The first substrate (320) may include a panel that allows the display driver integrated circuit (324) to be connected to the display (301) in a chip on panel (COP) manner. The first substrate (320) may include plastic that allows the display driver integrated circuit (324) to be connected to the display (301) in a COP (chip on plastic) manner. The first substrate (320) may include glass that allows the display driver integrated circuit (324) to be connected to the display (301) in a COG (chip on glass) manner. The first substrate (320) may include a film that allows the display driver integrated circuit (324) to be connected to the display (301) in a COF (chip on film) manner.

[0137] According to one embodiment, the display driver integrated circuit (324) may be disposed on the first substrate (320) and electrically connected to the display (301) via electrical wiring of the first substrate (320). The display driver integrated circuit (324) may be configured to control the display (301). For example, the display driver integrated circuit (324) may be configured to control image output through the display (301).

[0138] According to one embodiment, the first substrate (320) may be disposed or laminated on the inner surface of the display (301) and / or the first display area (A1). The first substrate (320) may be disposed between the display (301) (e.g., the first display area (A1)) and the second substrate (330).

[0139] In one embodiment, the first substrate (320) may include a first portion (3201). The first portion (3201) may form one edge of the first substrate (320). The first portion (3201) may be configured to be at least partially bendable. For example, the first portion (3201) may be bent from an edge of the first substrate (320) and connected to a first end (3011) of the display (301). For example, the first portion (3201) may be bent such that at least a portion of the first substrate (320) overlaps the display (301). The first portion (3201) may be electrically connected to the first end (3011) of the display (301) and the first substrate (320). Depending on the embodiment, the first portion (3201) may be defined and / or interpreted as a part of the display (301).

[0140] In one embodiment, the first substrate (320) may include a second portion (3202) facing in an opposite direction from the first portion (3201). The second portion (3202) may be defined as a portion of the first substrate (320) that is located furthest from the first end (3011) of the display (301). The second portion (3202) may form the other edge of the first substrate (320).

[0141] According to one embodiment, the display driver integrated circuit (324) may be placed or mounted on the first substrate (320). The display driver integrated circuit (324) may be positioned between the first portion (3201) and the second portion (3202).

[0142] According to one embodiment, the second substrate (330) may be placed or laminated on one surface of the first substrate (320) (e.g., the surface facing the -Z direction of FIGS. 6 to 8). The second substrate (330) may at least partially overlap the first substrate (320). The second substrate (330) may include at least one of a printed circuit board (PCB), a flexible PCB (FPCB), and a rigid-flexible PCB (RF-PCB). The second substrate (330) may include a film including a polyimide (PI) material.

[0143] According to one embodiment, the direction in which the second substrate (330) is laminated on the first substrate (320) (e.g., the Z-axis direction of FIGS. 6 to 8) may be defined and / or referred to as the second direction. The second direction may be a direction different from the first direction (e.g., the Y-axis direction of FIGS. 2 to 5B or the Y-axis direction of FIGS. 6 to 8), which is the direction in which the second housing portion (e.g., the second housing portion (202) of FIGS. 2 to 5B) moves relative to the first housing portion (e.g., the first housing portion (201) of FIGS. 2 to 5B). The second direction may be substantially perpendicular to the first direction.

[0144] In one embodiment, the second substrate (330) may include a second conductive connection member (e.g., the second conductive connection member (339) of FIG. 6). The second conductive connection member (339) may be electrically connected to the second substrate (330) and a main circuit board (e.g., the first circuit board (248) of FIG. 4). The second conductive connection member (339) may include at least one of an FPCB, a conductive wire, and a conductive cable. The second conductive connection member (339) may be defined and / or interpreted as a separate configuration from the second substrate (330). In one embodiment, the main circuit board (e.g., the first circuit board (248) of FIG. 4) may be disposed within a housing (e.g., the housing (210) of FIGS. 4 to 5B). The main circuit board may be spaced apart from the second substrate (330). At least one processor (e.g., processor (120) of FIG. 1) may be mounted on the main circuit board. The main circuit board may be electrically connected to a second substrate (330) via a second conductive connecting member (339).

[0145] According to one embodiment, the second substrate (330) may be electrically connected to the first substrate (320). As the second substrate (330) is electrically connected to the first substrate (320), the second substrate (330) may be electrically connected to a display driving integrated circuit (324) disposed on the first substrate (320).

[0146] In one embodiment, the second substrate (330) may be directly electrically coupled to the first substrate (320) (e.g., FIG. 7). For example, a conductive layer included in the second substrate (330) may be physically and / or electrically connected to a conductive layer included in the first substrate (320) or a conductive wiring included in the first substrate (320).

[0147] According to one embodiment, the second substrate (330) may be indirectly electrically connected to the first substrate (320) through a separate member (e.g., FIG. 8). For example, the display assembly (300) may include a first conductive connection member (307). The second substrate (330) may be electrically connected to the first substrate (320) through the first conductive connection member (e.g., the first conductive connection member (307) of FIG. 8). The first conductive connection member (307) may include at least one of a conductive pad, a conductive hot bar, conductive soldering, and a conductive tape. The first conductive connection member (307) may be disposed between one surface of the first substrate (320) and one surface of the second substrate (330) that face each other. The first conductive connecting member (307) can be electrically connected to the first substrate (320) and the second substrate (330). The first conductive connecting member (307) can be positioned at least partially between the display driver integrated circuit (324) and the second portion (3202), but is not limited thereto.

[0148] Referring to FIGS. 6 to 8, the second substrate (330) may include at least one electrical component (333). The at least one electrical component (333) may be arranged or mounted on the second substrate (330). The at least one electrical component (333) may include a touch circuit (333a) and / or a memory (333b) (e.g., the memory (130) of FIG. 1). The touch circuit (333a) may include a touch sensor configured to detect a touch input to the display (301) or a pressure sensor capable of measuring the strength (e.g., pressure) of the touch. The memory (333b) may be arranged adjacent to the touch circuit (333a). Instructions may be stored in the memory (333b). The above instructions, when executed by a touch circuit (333a) or a processor (e.g., processor (120) of FIG. 1), may cause an electronic device (e.g., electronic device (101) of FIGS. 2A to 5B) to perform operations corresponding to or responding to a user's touch input. The type of the at least one electrical component (333) is not limited to that described above, and may include various electrical components that provide various functions to the electronic device or display assembly (300).

[0149] According to one embodiment, the second substrate (330) may include a receiving portion (334). The receiving portion (334) may be formed on at least a portion of the second substrate (330). For example, the receiving portion (334) may be formed at a position corresponding to the display driver integrated circuit (324) in the second substrate (330). The receiving portion (334) may provide a space for receiving the display driver integrated circuit (324) when the second substrate (330) is laminated on the first substrate (320). The receiving portion (334) may have a sufficient size to receive the display driver integrated circuit (324). The receiving portion (334) may surround the display driver integrated circuit (324).

[0150] According to one embodiment, the receiving portion (334) may include a hole formed penetrating from one surface (e.g., the surface facing the +Z direction of FIG. 7) to the other surface (e.g., the surface facing the -Z direction of FIG. 7) of the second substrate (330). According to one embodiment, the receiving portion (334) may include a groove formed recessed from one surface of the second substrate (330) toward the other surface. The display driver integrated circuit (324) may be provided in the form of a chip, and the display driver integrated circuit (324) in the form of a chip may have a structure that at least partially protrudes with respect to one surface (e.g., the surface facing the -Z direction of FIG. 7) of the first substrate (320). When the second substrate (330) is laminated on the first substrate (320), at least a portion of the display driver integrated circuit (324) may be received in the receiving portion (334) of the second substrate (330). As the display driver integrated circuit (324) is accommodated in the receiving portion (334), the thickness of the first substrate (320) and the second substrate (330) combined or the thickness of the display assembly (300) can be provided thinly. According to one embodiment, the receiving portion (334) can be defined as a physical space that accommodates the display driver integrated circuit (324). For example, the receiving portion (334) can include a hole, a groove, an opening, a recess, or a slit formed in the second substrate (330) to accommodate or cover the display driver integrated circuit (324). According to one embodiment, the receiving portion (334) can be defined as a portion of the second substrate (330) that contacts or overlaps the display driver integrated circuit (324). For example, a second substrate (330), which may be made of a flexible material, may be in contact with the display driver integrated circuit (324) and may be deformed to be at least partially bent or at least partially stepped to cover the display driver integrated circuit (324).The receiving portion (334) may be defined as at least a portion of the second substrate (330) that is deformed by the display driver integrated circuit (324) or that contacts and / or overlaps the display driver integrated circuit (324).

[0151] According to one embodiment, the shielding structure (340) may be disposed on the second substrate (330). For example, the shielding structure (340) may be disposed on the second substrate (330) to cover the receiving portion (334). The shielding structure (340) may be disposed to cover the display driver integrated circuit (324). The shielding structure (340) may include a shield-can or a shielding sheet. The shielding structure (340) may be configured to block or reduce noise from being applied between electrical components of an electronic device (e.g., the electronic device (101) of FIGS. 2A to 5B) and the display driver integrated circuit (324). The shielding structure (340) may be configured to shield the display driver integrated circuit (324). The shielding structure (340) may be positioned along the inner edge of the second substrate (330) defining the receiving portion (334). The shielding structure (340) may be configured to provide a shielding function by being electrically connected to a ground plane of the second substrate (330).

[0152] According to one embodiment, the first substrate (320), the second substrate (330), and the shielding structure (340) may be sequentially stacked along a thickness direction (e.g., the Z-axis direction of FIGS. 6 to 8 or the Z-axis direction of FIGS. 16 to 18) of an electronic device (e.g., the electronic device (101) of FIGS. 2 to 5B) or a display assembly (300). As the first substrate (320), the second substrate (330), and the shielding structure (340) are sequentially stacked along the thickness direction, the integration of the components of the display assembly (300) may be improved. As the integration of the display assembly (300) is improved, a space for accommodating a battery of the electronic device (e.g., the battery (289) of FIG. 4) may be increased. For example, as the first substrate (320), the second substrate (330), and the shielding structure (340) of the display assembly (300) are laminated along the thickness direction, the mounting space of the battery can be increased in a direction substantially perpendicular to the thickness direction (e.g., the Y-axis direction of FIGS. 6 to 8). The direction substantially perpendicular to the thickness direction can be defined as a longitudinal direction of the electronic device or the display assembly (300) (e.g., the Y-axis direction of FIGS. 6 to 8). The longitudinal direction of the electronic device or the display assembly (300) can be substantially the same direction as a direction in which the second housing part (e.g., the second housing part (202) of FIGS. 2A to 5B) moves relative to the first housing part (e.g., the first housing part (201) of FIGS. 2A to 5B) (e.g., the Y-axis direction of FIGS. 2A to 3D).

[0153] According to one embodiment, the display assembly (300) may include openings (e.g., a first opening (302) and a second opening (305)). The openings (e.g., the first opening (302) and the second opening (305)) may be positioned to be aligned with at least one of a camera (e.g., the first camera module (249a) of FIG. 2B) and a sensor (e.g., the first sensor module (261a) of FIG. 2B).

[0154] According to one embodiment, the display assembly (300) may include a first opening (302) positioned to correspond to a front camera (e.g., the first camera module (249a) of FIG. 2A) of an electronic device (e.g., the electronic device (101) of FIGS. 2A to 5B). The front camera may capture an image of a subject by transmitting light through the display (301). The front camera may capture an image of a subject through the first opening (302). The front camera may be at least partially accommodated in or aligned with the first opening (302). The front camera may include an under display camera (UDC) configured not to be visually exposed to the first display area (A1).

[0155] According to one embodiment, the first opening (302) may include a first opening region (322) formed in a first substrate (320), and / or a second opening region (332) formed in a second substrate (330). The second opening region (332) may be positioned to correspond with the first opening region (322). For example, the second opening region (332) may overlap the first opening region (322). The first opening (302) may be formed by a combination of the first opening region (322) and the second opening region (332).

[0156] According to one embodiment, the display assembly (300) can include a second opening (305) positioned to correspond with a sensor (e.g., the first sensor module (261a) of FIG. 2B) of an electronic device (e.g., the electronic device (101) of FIGS. 2A-5B). The sensor can include a proximity sensor or an illuminance sensor. The sensor can be at least partially accommodated in or aligned with the second opening (305). The second opening (305) can be spaced apart from the first opening (302). The second opening (305) can include a third opening area (325) formed in the first substrate (320) and / or a fourth opening area (335) formed in the second substrate (330). The fourth opening area (335) may be positioned to correspond to the third opening area (325). For example, the fourth opening area (335) may overlap the third opening area (325). The second opening (305) may be formed by a combination of the third opening area (325) and the fourth opening area (335).

[0157] According to one embodiment, the display driver integrated circuit (324) may be positioned between a first portion (3201) of the first substrate (320) and a second portion (3202) of the first substrate (320). The first opening (302) may be positioned between the first portion (3201) and the display driver integrated circuit (324). The second opening (305) may be positioned between the first portion (3201) and the display driver integrated circuit (324).

[0158] The embodiments of FIGS. 9 to 13 can be combined with the embodiments of FIGS. 1 to 8, or the embodiments of FIGS. 14 to 19.

[0159] Referring to FIGS. 9 to 13, a display assembly (300) (e.g., the display assembly (300) of FIGS. 6 to 8) may include a display (301), a first opening (302), a first opening (3021), a second opening (305), a second opening (3051), a first substrate (320), a display driver integrated circuit (324), a display driver integrated circuit (3241), a second substrate (330), at least one electrical component (333), a shielding structure (340), a shielding structure (3401), and / or a support plate (350).

[0160] The configuration of the display (301), the first opening (302), the first opening (3021), the second opening (305), the second opening (3051), the first substrate (320), the display driver integrated circuit (324), the display driver integrated circuit (3241), the second substrate (330), at least one electrical component (333), the shielding structure (340), the shielding structure (3401), and / or the support plate (350) of FIGS. 9 to 13 may be partially or entirely the same as the configuration of the display (301), the first opening (302), the second opening (305), the first substrate (320), the display driver integrated circuit (324), the second substrate (330), at least one electrical component (333), the shielding structure (340), and / or the support plate (350) of FIGS. 6 to 8.

[0161] Referring to FIGS. 9 to 11, the first opening (302) may be formed by overlapping a first opening region (e.g., the first opening region (322) of FIGS. 7 to 8) formed on a first substrate (e.g., the first substrate (320) of FIGS. 6 to 8)) and a second opening region (e.g., the second opening region (332) of FIGS. 7 to 8) formed on a second substrate (330). A front camera (e.g., the first camera module (249a) of FIGS. 2A to 2D) of an electronic device (e.g., the electronic device (101) of FIGS. 2A to 5B) may be arranged and / or positioned in the first opening (302). The first opening (302) may be positioned to be aligned with the front camera.

[0162] According to one embodiment, the second opening (305) may be formed by overlapping a third opening region (e.g., the third opening region (325) of FIGS. 7 to 8) formed in a first substrate (e.g., the first substrate (320) of FIGS. 6 to 8)) and a fourth opening region (e.g., the fourth opening region (335) of FIGS. 7 to 8) formed in a second substrate (330). A sensor (e.g., the first sensor module (261a) of FIGS. 2A to 2D) of an electronic device (e.g., the electronic device (101) of FIGS. 2A to 5B) may be arranged and / or positioned in the second opening (305). The second opening (305) may be positioned to be aligned with the sensor.

[0163] According to one embodiment, the display driver integrated circuit (324) may be disposed on a first substrate (e.g., the first substrate (320) of FIGS. 6 to 8) and covered by a shielding structure (340). The shielding structure (340) may be disposed on a second substrate (330).

[0164] According to one embodiment, at least one electrical component (333) (e.g., at least one electrical component (333) of FIGS. 7 to 8) may be disposed on a second substrate (330). The at least one electrical component (333) may include a touch circuit (333a) (e.g., the touch circuit (333a) of FIGS. 7 to 8) and / or a memory (333b) (e.g., the memory (333b) of FIGS. 7 to 8).

[0165] According to one embodiment, the second substrate (330) may include a first edge (3301) and / or a second edge (3302). The first edge (3301) may be substantially parallel to a first portion (3201) of the first substrate (320) (e.g., the first portion (3201) of FIGS. 7-8 ) or a first end (3011) of the display (301) (e.g., the first end (3011) of FIGS. 7-8 ). The first edge (3301) may be oriented in substantially the same direction as the first portion (3201) of the first substrate (320) (e.g., the first portion (3201) of FIGS. 7-8 ) or the first end (3011) of the display (301). The second edge (3302) may face in an opposite direction from the first edge (3302). The second edge (3302) may be defined as a portion of the second substrate (330) that is located furthest from the first end (3011) of the display (301). The first edge (3301) may form one edge of the second substrate (330). The second edge (3302) may form the other edge of the second substrate (330). The second edge (3302) may be disposed adjacent to a second portion (e.g., the second portion (3202) of FIGS. 7 to 8).

[0166] According to one embodiment, the display driver integrated circuit (324) mounted on the first substrate (320) may be positioned between a first edge (3301) and a second edge (3302) when viewed in the thickness direction of the display assembly (300) (e.g., the Z-axis direction of FIGS. 6 to 13). The display driver integrated circuit (324) may be positioned closer to the second edge (3302) than to the first edge (3301).

[0167] According to one embodiment, the first opening (302) may be located between a first edge (3301) and a second edge (3302) when viewed in the thickness direction of the display assembly (300). The first opening (302) may be located between the first edge (3301) and the display driver integrated circuit (324) when viewed in the thickness direction of the display assembly (300). The first opening (302) may be located between the first portion (3201) and the second portion (e.g., the second portion (3202) of FIGS. 7 and 8). The first opening (302) may be located between the first portion (3201) and the display driver integrated circuit (324).

[0168] According to one embodiment, the second opening (305) may be located between the first edge (3301) and the second edge (3302) when viewed in the thickness direction of the display assembly (300). The second opening (305) may be located between the first edge (3301) and the display driver integrated circuit (324) when viewed in the thickness direction of the display assembly (300). The second opening (305) may be located between the first portion (3201) and the second portion (e.g., the second portion (3202) of FIGS. 7 and 8). The second opening (305) may be located between the first portion (3201) and the display driver integrated circuit (324).

[0169] In one embodiment, the second opening (305) may be spaced apart from the first opening (302).

[0170] Referring to FIG. 10, the display assembly (300) may include a cover portion (308). The cover portion (308) may be positioned to cover a second edge (3302) of the second substrate (330). For example, the cover portion (308) may include foam, bond, or resin. The cover portion (308) may cover the second edge (3202) of the second substrate (330) and the second portion of the first substrate (320) (e.g., the second portion (3202) of FIGS. 7 and 8). The cover portion (308) may be configured to supplement the rigidity of the second edge (3302) of the second substrate (330) and the second portion of the first substrate (320), or to limit and / or reduce the occurrence of cracks. According to one embodiment, the cover portion (308) may be defined and / or referred to as a reinforcement portion, a bracket, or a support member.

[0171] Referring to FIG. 11, the display assembly (300) may include at least one wire (309). The at least one wire (309) may be disposed on a first substrate (320). The at least one wire (309) may extend from a first portion (3201) of the first substrate (320) toward a second portion (3202) of the first substrate (320). The second substrate (330) and / or the first substrate (320) may be electrically connected to the display (301) via the at least one wire (309).

[0172] According to one embodiment, at least one wire (309) may include a first wire (309a) and / or a second wire (309b). The first wire (309a) may be configured to be electrically connected to the touch circuit (333a) and the display (301). The first wire (309a) may extend from a first portion (3201) of the first substrate (320) to a first conductive connection member (307) disposed on the first substrate (320) (e.g., the first conductive connection member (307) of FIG. 8 ). The first wire (309a) may be electrically connected to the display (301) and the first conductive connection member (307). For example, a signal corresponding to a user's touch input and / or a signal corresponding to a user's touch pressure may be transmitted to the touch circuit (333a) through the first wire (309a), the first conductive connecting member (307), and the second substrate (330). The second wire (309b) may be configured to be electrically connected to the display driver integrated circuit (324) and the display (301). The second wire (309b) may extend from the first portion (3201) of the first substrate (320) to the display driver integrated circuit (324) disposed on the first substrate (320). The second wire (309b) may transmit a control signal provided from the display driver integrated circuit (324) to the display (301).

[0173] According to one embodiment, the first wiring (309a) or the second wiring (309b) may be positioned to avoid the first opening (302) and / or the second opening (305), but is not limited thereto. According to one embodiment, additional wiring may be provided to transmit signals other than the aforementioned signals.

[0174] According to one embodiment, the first wiring (309a) and / or the second wiring (309b) may extend in a first direction (e.g., the Y-axis direction of FIGS. 2A to 5B or the Y-axis direction of FIG. 11), which is a direction in which the second housing portion (e.g., the second housing portion (202) of FIGS. 2A to 5B) moves with the first housing portion (e.g., the first housing portion (201) of FIGS. 2A to 5B). The length of the first wiring (309a) in the first direction may be defined and / or referred to as the first length. The length of the second wiring (309b) in the first direction may be defined and / or referred to as the second length. The first length may be different from the second length. For example, the first length may be longer than the second length. The first length may be substantially equal to the second length.

[0175] Referring to FIG. 12, the display assembly (300) may not include an opening for arranging a front camera or sensor. A display assembly (300) that does not include an opening for arranging a front camera or sensor may not have limitations in the location of at least one wire (309) as described with reference to FIG. 11 as an example.

[0176] Referring to FIG. 13, a display driver integrated circuit (3241) disposed on a first substrate (320) may be positioned between a first edge (3301) and a second edge (3302) when viewed in the thickness direction of the display assembly (300) (e.g., the Z-axis direction of FIGS. 6 to 13). The display driver integrated circuit (324) may be disposed closer to the first edge (3301) than to the second edge (3302).

[0177] According to one embodiment, the first opening (3021) may be located between a first edge (3301) and a second edge (3302) when viewed in the thickness direction of the display assembly (300). The first opening (3021) may be located between the display driver integrated circuit (3241) and the second edge (3302) when viewed in the thickness direction of the display assembly (300). The first opening (3021) may be located between the first portion (3201) and the second portion (e.g., the second portion (3202) of FIGS. 7 and 8). The first opening (3021) may be located between the display driver integrated circuit (3241) and the second portion (e.g., the second portion (3202) of FIGS. 7 and 8).

[0178] According to one embodiment, the second opening (3051) may be located between the first edge (3301) and the second edge (3302) when viewed in the thickness direction of the display assembly (300). The second opening (3051) may be located between the display driver integrated circuit (3241) and the second edge (3302) when viewed in the thickness direction of the display assembly (300). The second opening (3051) may be located between the first portion (3201) and the second portion (e.g., the second portion (3202) of FIGS. 7 and 8). The second opening (3051) may be located between the display driver integrated circuit (3241) and the second portion (e.g., the second portion (3202) of FIGS. 7 and 8).

[0179] In one embodiment, the second opening (3051) may be spaced apart from the first opening (3021).

[0180] FIG. 14 is a cross-sectional perspective view taken along line CC' of FIG. 9 according to one embodiment of the present disclosure.

[0181] FIG. 15 is a cross-sectional perspective view taken along line CC' of FIG. 9 according to one embodiment of the present disclosure.

[0182] The embodiments of FIGS. 14 to 15 can be combined with the embodiments of FIGS. 1 to 13, or the embodiments of FIGS. 16 to 19.

[0183] Referring to FIGS. 14 to 15, a display assembly (300) (e.g., the display assembly (300) of FIGS. 6 to 13) may include a display (301), a first opening (302), a second opening (305), a first substrate (320), a display driving integrated circuit (324), a second substrate (330), a shielding structure (340), a support plate (350), and / or a display cover member (360).

[0184] The configuration of the display (301), the first opening (302), the second opening (305), the first substrate (320), the first part (3201), the second part (3202), the display driving integrated circuit (324), the second substrate (330), the first edge (3301), the second edge (3302), the shielding structure (340), and / or the support plate (350) of FIGS. 14 to 15 is similar to the configuration of the first opening (302), the second opening (305), the first substrate (320), the first part (3201), the second part (3202), the display driving integrated circuit (324), the display driving integrated circuit (3241), the second substrate (330), the first edge (3301), the second edge (3302), the shielding structure (340), the shielding structure (3401), and / or the support plate (350) of FIGS. 6 to 13. The configuration of the plate (350) may be partly or entirely identical.

[0185] According to one embodiment, a first substrate (320) and a second substrate (330) may be sequentially laminated on an inner surface of the display (301) (e.g., a surface facing the -Z direction in FIGS. 14 and 15 ). For example, the first substrate (320) may be laminated on the inner surface of the display (301), and the second substrate (330) may be laminated on the inner surface of the first substrate (320).

[0186] According to one embodiment, the display driver integrated circuit (324) may overlap with the shielding structure (340) based on the direction in which the second substrate (330) is laminated on the first substrate (320) (e.g., the Z-axis direction of FIGS. 14 and 15). The shielding structure (340) may be arranged to cover the display driver integrated circuit (324).

[0187] According to one embodiment, the second substrate (330) may be arranged to overlap the first substrate (320) with respect to the thickness direction (e.g., the Z-axis direction of FIGS. 2 to 15) of the display assembly (300) and / or the electronic device (e.g., the electronic device (101) of FIGS. 2 to 5B). As the second substrate (330) overlaps the first substrate (320) in the thickness direction, a space occupied by the combined structure of the second substrate (330) and the first substrate (320) in a direction perpendicular to the thickness direction (e.g., the Y-axis direction of FIGS. 2 to 15) may be reduced. Accordingly, a space for mounting a battery (e.g., the battery (289) of FIG. 4) in a direction perpendicular to the thickness direction may be increased, and the capacity or size of a battery arranged or mounted in the electronic device may be increased.

[0188] According to one embodiment, the first portion (3201) may extend from the first substrate (320) and be connected to a first end of the display (301) (e.g., the first end (3011) of FIGS. 7 to 8). The first portion (3201) may have a bent shape.

[0189] According to one embodiment, the display driver integrated circuit (324) may be electrically connected to the display (301) via the first substrate (320) and the first portion (3201).

[0190] According to one embodiment, the second portion (3202) of the first substrate (320) may be arranged parallel to the second edge (3302) of the second substrate (330).

[0191] According to one embodiment, the display assembly (300) may include a display cover member (360). The display cover member (360) may be disposed or laminated on an outer surface of the display (301). The display cover member (360) may include a cover window, a coating film, or a polarizing layer.

[0192] Referring to FIG. 15, the display assembly (300) may include a cover portion (308) (e.g., the cover portion (308) of FIG. 10). The cover portion (308) may be configured to cover a second edge (3302) of the second substrate (330) and a second portion (3202) of the first substrate (320). At least a portion (3081) of the cover portion (308) may be positioned between the second substrate (330) and the first substrate (320). For example, the at least a portion (3081) of the cover portion (308) may be positioned between the second edge (3302) and the second portion (3202). At least a portion (3081) of the cover portion (308) may be defined and / or referred to as a spacer configured to fill a gap formed between an edge of the first substrate (320) and an edge of the second substrate (330). When an external impact is applied to the edge of the second substrate (330) and the edge of the first substrate (320), the external impact may be absorbed by the at least a portion (3081) of the cover portion (308).

[0193] FIG. 16 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0194] FIG. 17 is an enlarged view of portion D of FIG. 16 according to one embodiment of the present disclosure.

[0195] FIG. 18 is an enlarged view of portion D of FIG. 16 according to one embodiment of the present disclosure.

[0196] The embodiments of FIGS. 16 to 18 can be combined with the embodiments of FIGS. 1 to 15, or the embodiment of FIG. 19.

[0197] Referring to FIGS. 16 to 18, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2A to 5B) may include at least one processor (120), a frame (213), a first rear plate (215), a second cover member (221), a second rear plate (225), an actuator (241), a rack (242), a first circuit board (248), a battery (289), a front camera (e.g., a first camera module (249a)), and / or a display assembly (300).

[0198] The configuration of at least one processor (120) of FIGS. 16 to 18 may be partially or entirely identical to the configuration of the processor (120) of FIG. 1. The configuration of the frame (213), the first rear plate (215), the second cover member (221), the second rear plate (225), the actuator (241), the rack (242), the first circuit board (248), and / or the battery (289) of FIGS. 16 to 18 may be partially or entirely identical to the configuration of the frame (213), the first rear plate (215), the second cover member (221), the second rear plate (225), the actuator (241), the rack (242), the first circuit board (248), and / or the battery (289) of FIG. 4. The configuration of the front camera (e.g., the first camera module (249a)) of FIGS. 16 to 18 may be partially or entirely identical to the configuration of the first camera module (249a) of FIGS. 2A to 2D. The configuration of the display assembly (300) of FIGS. 16 to 18 may be partially or entirely identical to the configuration of the display assembly (300) of FIGS. 6 to 15.

[0199] According to one embodiment, the display assembly (300) may include a first opening (302) (e.g., the first opening (302) of FIGS. 6 to 15) positioned to be aligned with a front camera (e.g., the first camera module (249a)). The front camera (e.g., the first camera module (249a)) may be configured to photograph a subject through the first opening (302). The front camera (249a) may be positioned adjacent to a second-first side wall (221a) of the second cover member (221) (e.g., the second-first side wall (221a) of FIGS. 2A to 2D).

[0200] According to one embodiment, the display assembly (300) may include a display (301) (e.g., the display (231) of FIG. 4 or the display (301) of FIGS. 6 to 15). The display assembly (300) may include a first substrate (320) (e.g., the first substrate (320) of FIGS. 6 to 15) disposed on at least a portion of an inner surface (e.g., a surface facing the -Z direction of FIGS. 16 to 18) of the display (301). A display driver integrated circuit (324) (e.g., the display driver integrated circuit (324) of FIGS. 6 to 15) may be disposed or mounted on the first substrate (320).

[0201] According to one embodiment, a second substrate (330) (e.g., the second substrate (330) of FIGS. 6 to 15) may be disposed on the first substrate (320). The second substrate (330) may include a receiving portion (334) (e.g., the receiving portion (334) of FIGS. 7 to 8) for receiving a display driver integrated circuit (324). A shielding structure (340) (e.g., the shielding structure (340) of FIGS. 6 to 15) may be disposed on the second substrate (330) defining the receiving portion (334). The shielding structure (340) may be configured to block and / or reduce noise generated from the processor (120) and / or other electrical components from being transmitted to the display driver integrated circuit (324). The shielding structure (340) can be electrically connected to the ground surface of the second substrate (330).

[0202] According to one embodiment, at least one processor (120) may be mounted on a first circuit board (248). The first circuit board (248) may be spaced apart from a second board (330). The at least one processor (120) may be covered by a shield can (2481). The shield can (2481) may be configured to block and / or reduce noise generated from the display driver integrated circuit (324) and / or other electrical components from being transmitted to the at least one processor (120). The shield can (2481) may be electrically connected to a ground plane of the first circuit board (248).

[0203] According to one embodiment, the shielding structure (340) may face the first surface (F1) of the second cover member (221) (e.g., the first surface (F1) of FIG. 4).

[0204] According to one embodiment, the display assembly (300) may include a cushion layer (381) and / or a heat dissipation layer (382). The cushion layer (381) may be disposed on an inner surface of the display (301) (e.g., a surface facing the -Z direction of FIGS. 17 and 18). The cushion layer (381) may be configured to protect the display (301) from external impact. The cushion layer (381) may include an emboss or a tape. The heat dissipation layer (382) may be disposed on an inner surface of the display (301). The heat dissipation layer (382) may be disposed on an inner surface of the cushion layer (381) (e.g., a surface facing the -Z direction of FIGS. 17 and 18). The heat dissipation layer (382) may be configured to block and / or reduce heat generated inside the electronic device (101) from being transferred to the display (301). The heat dissipation layer (382) may be configured to spread heat generated from the display (301) or heat generated from at least one processor (120). The heat dissipation layer (382) may include a vapor chamber or graphite. For example, the heat dissipation layer (382) may include a vapor chamber and a first heat dissipation layer (3821) laminated on an inner surface of the cushion layer (381). The heat dissipation layer (382) may include graphite, and the heat dissipation layer (382) may further include a second heat dissipation layer (3822) laminated on an inner surface of the first heat dissipation layer (3821). In some embodiments, the second heat dissipation layer (3822) may be laminated on an inner surface of the cushion layer (381), and the first heat dissipation layer (3821) may be laminated on an inner surface of the second heat dissipation layer (3822).

[0205] According to one embodiment, the first substrate (320), the second substrate (330), and the shielding structure (340) may overlap in the thickness direction of the display assembly (300) and / or the electronic device (101) (e.g., the Z-axis direction of FIGS. 16 to 18). The display driver integrated circuit (324) and the shielding structure (340) may overlap in the thickness direction of the display assembly (300) and / or the electronic device (101) (e.g., the Z-axis direction of FIGS. 16 to 18).

[0206] According to one embodiment, the second substrate (330) can be laminated on the first substrate (320) in a second direction (e.g., the Z-axis direction of FIGS. 16 to 18). The second direction can be a direction different from the first direction (e.g., the Y-axis direction of FIGS. 2 to 5B or the Y-axis direction of FIGS. 6 to 8), which is a direction in which the second housing portion (e.g., the second housing portion (202) of FIGS. 2 to 5B) moves relative to the first housing portion (e.g., the first housing portion (201) of FIGS. 2 to 5B). The second direction can be substantially perpendicular to the first direction.

[0207] According to one embodiment, the battery (289) may not overlap the first substrate (320) and the second substrate (330) in the second direction (e.g., the Z-axis direction of FIGS. 16 to 18).

[0208] According to one embodiment, the heat dissipation layer (382) may not overlap the first substrate (320) and the second substrate (330) in the second direction (e.g., the Z-axis direction of FIGS. 16 to 18).

[0209] According to one embodiment, as the integration of the display assembly (300) and / or the electronic device (101) is improved in the thickness direction of the display assembly (300), the space for accommodating the battery (289), the cushion layer (381), and / or the heat dissipation layer (382) may increase. For example, as the first substrate (320), the second substrate (330), and the shielding structure (340) of the display assembly (300) are laminated along the thickness direction, the arrangement space of the battery (289), the cushion layer (381), and / or the heat dissipation layer (382) may increase in a direction substantially perpendicular to the thickness direction (e.g., the Y-axis direction of FIGS. 15 to 17). In the case of the above heat dissipation layer (382), since it does not overlap with the first substrate (320) and the second substrate (330) in the thickness direction (or the second direction), the heat dissipation layer (382) may have a planar surface structure rather than a stepped structure.

[0210] According to one embodiment, an accommodation space (304) may be formed between the shielding structure (340) and the first substrate (320). The accommodation space (304) may be defined by the shape of the shielding structure (340) and the accommodation portion (334). For example, a display driving integrated circuit (324) may be placed in the accommodation space (304). The accommodation space (304) may be defined as an air gap.

[0211] Referring to FIG. 18, the display assembly (300) may include a heat dissipation member (3041) disposed or filled in the receiving space (304). The heat dissipation member (3041) may include thermal interface materials (TIM). The heat dissipation member (3041) may include foam disposed or filled in the receiving space (304). The heat dissipation member (3041) may be disposed in the receiving space (304) and configured to reduce and / or mitigate heat generated from the processor (120) from being transferred to the display driver integrated circuit (324). The heat dissipation member (3041) may be configured to diffuse heat generated from the display (301). As the heat dissipation member (3041) fills the receiving space (304), an impact applied to the shielding structure (340) may be absorbed or mitigated. Additionally, the shielding structure (340) or the display driving integrated circuit (324) can be limited and / or reduced from being damaged or crushed by external impact.

[0212] According to one embodiment, the receiving space (304) may be filled with a filler (e.g., resin or thermal interface material (TIM)). As the filler fills the receiving space (304), the filler may limit and / or reduce the transmission of external impact to the display driver integrated circuit (324) and / or the shielding structure (340). The display driver integrated circuit (324) and / or the shielding structure (340) may have their rigidity against external impact enhanced or improved by the filler.

[0213] FIG. 19 is a cross-sectional perspective view of an electronic device taken along line EE' of FIG. 2c, according to one embodiment of the present disclosure.

[0214] The embodiment of FIG. 19 can be combined with the embodiments of FIGS. 1 to 18.

[0215] Referring to FIG. 19, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2A to 5B, or the electronic device (101) of FIG. 16) may include a first cover member (211), a first rear plate (215), a second rear plate (225), a first circuit board (248), a rear camera (e.g., a second camera module (249b)), a display assembly (300), a display (301), a first substrate (320), a second substrate (330), and / or a support plate (350).

[0216] The configuration of the first cover member (211), the first rear plate (215), the second rear plate (225), and / or the first circuit board (248) of FIG. 19 may be partially or entirely identical to the configuration of the first cover member (211), the first rear plate (215), the second rear plate (225), and / or the first circuit board (248) of FIG. 4. The configuration of the rear camera (e.g., the second camera module (249b)) of FIG. 19 may be partially or entirely identical to the configuration of the second camera module (249b) of FIG. 3c. The configuration of the display assembly (300), the display (301), the first substrate (320), the second substrate (330), and / or the support plate (350) of FIG. 19 may be partially or entirely the same as the configuration of the display assembly (300), the display (301), the first substrate (320), the second substrate (330), and / or the support plate (350) of FIGS. 6 to 18.

[0217] According to one embodiment, a rear camera (e.g., a second camera module (249b)) may be positioned or mounted on the first circuit board (248).

[0218] According to one embodiment, the rear camera (e.g., the second camera module (249b)) may be positioned adjacent to the first-third side wall (211c) of the first cover member (211) (e.g., the first-third side wall (211c) of FIGS. 2A to 3D).

[0219] According to one embodiment, the electronic device (101) may include a first conductive contact member (401). The first conductive contact member (401) may include a C-clip or a conductive member disposed on the first circuit board (248). The first conductive contact member (401) may be in contact with a metal portion (2211) of the second cover member (221). The metal portion (2211) may form at least a portion of a first surface (e.g., the first surface (F1) of FIG. 4) of the second cover member (221). The metal portion (2211) may provide a ground.

[0220] According to one embodiment, the electronic device (101) may include a second conductive contact member (402). The second conductive contact member (402) may include a C-clip or a conductive member disposed on the second substrate (330). The second conductive contact member (402) may be brought into contact with a metal portion (2211) of the second cover member (221).

[0221] According to one embodiment, the electronic device (101) may include a third conductive contact member (403). The third conductive contact member (403) may include a conductive tape disposed on a second substrate (330). The third conductive contact member (403) may be in contact with the second substrate (330) and the support plate (350).

[0222] According to one embodiment, the second substrate (330) can be electrically connected to a ground provided by the metal portion (2211) of the second cover member (221) through the second conductive contact member (402). The second substrate (330) can be electrically connected to a ground of the first circuit board (248) through the second conductive contact member (402), the metal portion (2211), and the first conductive contact member (401). The second substrate (330) can be electrically connected to a ground provided by the support plate (350) through the third conductive contact member (403). The second substrate (330) can be electrically connected to a ground provided from various locations through the conductive contact members (e.g., the first conductive contact member (401), the second conductive contact member (402), and the third conductive contact member (403)). Accordingly, the second substrate (330) can provide a shielding function to reduce and / or limit the transmission of noise to a touch circuit (e.g., a touch circuit (333a) of FIGS. 7 to 8) disposed on the second substrate (330) and a display driver integrated circuit (e.g., a display driver integrated circuit (324) of FIGS. 6 to 18) disposed on the first substrate (320).

[0223] According to one embodiment, a display driver integrated circuit (e.g., a display driver integrated circuit (324) of FIGS. 6 to 18) and / or a touch circuit (e.g., a touch circuit (333a) of FIGS. 7 to 8) may overlap a rear camera (e.g., a second camera module (249b)) in a second direction (e.g., a Z-axis direction of FIG. 19) in which the second substrate (330) is laminated to the first substrate (320).

[0224] According to one embodiment, the electronic device (101) may include an electrical component, such as a vibration motor (e.g., a haptic module (179) of FIG. 1). A display driving integrated circuit (e.g., a display driving integrated circuit (324) of FIGS. 6 to 18) and / or a touch circuit (e.g., a touch circuit (333a) of FIGS. 7 to 8) may not overlap with the electrical component, such as the vibration motor, in the second direction (e.g., the Z-axis direction of FIG. 19). The electronic device (101) may be provided such that the display driving integrated circuit, the touch circuit, the first substrate (320) and the second substrate (330) overlap in the second direction, thereby increasing the space for arranging and / or mounting the electrical component, such as the vibration motor. The electronic device (101) is provided such that the display driving integrated circuit, the touch circuit, the first substrate (320) and the second substrate (330) overlap in the second direction, so that the space for placing the main circuit board (e.g., the first circuit board (248) of FIG. 4) can be increased.

[0225] Electronic devices, including displays, may have limitations in implementing screens larger than the size of the electronic device due to the fixed structure of the display. Therefore, an electronic device including a rollable display may be provided.

[0226] An electronic device including a rollable display may have an area of ​​a display area of ​​the display and / or a portion of the electronic device expanded or reduced when a slide motion is implemented.

[0227] An electronic device including a rollable display may include components (e.g., an actuator or a gear structure) for implementing a sliding motion of the electronic device. The rollable display may be at least partially bent and accommodated inside the electronic device when the sliding motion of the electronic device is implemented. The rollable display may include a display driver integrated circuit (DDI). The display driver integrated circuit may be electrically connected to a main circuit board of the electronic device through a separate component (e.g., an FPCB).

[0228] Electronic devices including rollable displays may have difficulty securing sufficient space for mounting a battery due to components for implementing the slide motion, the space occupied by the display within the electronic device, or components such as FPCBs.

[0229] According to one embodiment of the present disclosure, an electronic device can be provided in which a space for mounting a battery is improved by improving the bonding structure of a display driving integrated circuit, a first substrate, and a second substrate.

[0230] However, the problems solved by the embodiments of the present disclosure are not limited to the problems mentioned above, and other problems may be solved by the embodiments of the present disclosure.

[0231] According to one embodiment of the present disclosure, an electronic device can be provided in which a battery mounting space and a heat dissipation sheet mounting area can be sufficiently secured in the longitudinal direction of the electronic device by stacking components for mounting a display driver integrated circuit and components for providing a shielding function for the display driver integrated circuit in the thickness direction of the electronic device.

[0232] The effects that can be obtained by the embodiments of the present disclosure are not limited to the effects mentioned above, and other effects of the embodiments of the present disclosure that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs.

[0233] According to one embodiment of the present disclosure, an electronic device (101) may include a flexible display (e.g., display (301)), a first substrate (320), a display driver integrated circuit (324), a second substrate (330), and / or a shielding structure (340). The first substrate (320) may at least partially overlap the flexible display (e.g., display (301)). The first substrate (320) may be electrically connected to the flexible display (e.g., display (301)). The display driver integrated circuit (324) may be disposed on the first substrate (320). The second substrate (330) may at least partially overlap the first substrate (320). The second substrate (330) may be electrically connected to the first substrate (320). The second substrate (330) may include a receiving portion (334). The receiving portion (334) may receive at least a portion of the display driving integrated circuit (324). The shielding structure (340) may be disposed on the second substrate (330). The shielding structure (340) may cover the receiving portion (334). The shielding structure (340) may be configured to shield the display driving integrated circuit (324).

[0234] According to one embodiment, the first substrate (320) may include a first portion (3201) and / or a second portion (3202). The first portion (3201) may be connected to a first end (3011) of the flexible display (e.g., display (301)). The second portion (3202) may face in an opposite direction to the first portion (3201). The first portion (3201) may be bent such that at least a portion of the first substrate (320) overlaps the flexible display (e.g., display (301)). The display driver integrated circuit (324) may be positioned between the first portion (3201) and the second portion (3202).

[0235] According to one embodiment, the electronic device (101) may further include openings (e.g., a first opening (302) and a second opening (305)). The openings (e.g., the first opening (302) and the second opening (305)) may be formed in the first substrate (320) and the second substrate (330). The openings (e.g., the first opening (302) and the second opening (305)) may be positioned to be aligned with at least one of a camera (e.g., a first camera module (249a)) and a sensor (e.g., a first sensor module (261a)).

[0236] According to one embodiment, the openings (e.g., the first opening (302) and the second opening (305)) may be positioned between the first portion (3201) and the display driver integrated circuit (324).

[0237] According to one embodiment, the openings (e.g., the first opening (3021) and the second opening (3051)) may be positioned between the second portion (3202) and the display driver integrated circuit (3241).

[0238] According to one embodiment, the second substrate (330) may include a first edge (3301) and / or a second edge (3302). The first edge (3301) may face substantially the same direction as the first portion (3201). The second edge (3302) may face in an opposite direction to the first edge (3301). The second edge (3302) may be disposed adjacent to the second portion (3202).

[0239] According to one embodiment, the electronic device (101) may further include a cover portion (308). The cover portion (308) may cover the second edge (3302) and the second portion (3202).

[0240] According to one embodiment, the cover portion (308) may include a spacer (e.g., portion (3081)) disposed between the first substrate (320) and the second substrate (330).

[0241] According to one embodiment, the first substrate (320) may be positioned at least partially between the flexible display (e.g., display (301)) and the second substrate (330).

[0242] According to one embodiment, the electronic device (101) may further include a housing (210). The housing (210) may include a first housing portion (201) and / or a second housing portion (202). The second housing portion (202) may be configured to move in a first direction with respect to the first housing portion (201). The flexible display (e.g., display (301)) may be disposed on the housing (210). The second substrate (330) may be laminated on the first substrate (320) in a second direction different from the first direction.

[0243] In one embodiment, the second direction may be substantially perpendicular to the first direction.

[0244] According to one embodiment, the electronic device (101) may further include a battery (289). The battery (289) may be placed within the housing (210). The battery (289) may not overlap the first substrate (320) and the second substrate (330) in the second direction.

[0245] According to one embodiment, the electronic device (101) may further include a heat dissipation layer (382). The heat dissipation layer (382) may be disposed on an inner surface of the flexible display (e.g., display (301)). The heat dissipation layer (382) may not overlap the first substrate (320) and the second substrate (330) in the second direction.

[0246] According to one embodiment, the electronic device (101) may further include a touch circuit (333a), a main circuit board (e.g., a first circuit board (248)), and / or at least one processor (120). The touch circuit (333a) may be mounted on the second substrate (330). The main circuit board (e.g., the first circuit board (248)) may be disposed within the housing (210). The main circuit board (e.g., the first circuit board (248)) may be electrically connected to the second substrate (330). The at least one processor (120) may be mounted on the main circuit board (e.g., the first circuit board (248)).

[0247] According to one embodiment, the electronic device (101) may further include a heat dissipation member (3041). The heat dissipation member (3041) may be placed in the receiving space (304). The receiving space (304) may be defined by the receiving portion (334) and the shielding structure (340).

[0248] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (210), a flexible display (e.g., display (301)), a first substrate (320), a display driving integrated circuit (324), a second substrate (330), and / or a shielding structure (340). The housing (210) may include a first housing portion (201) and / or a second housing portion (202). The second housing portion (202) may be configured to move in a first direction relative to the first housing portion (201). The flexible display (e.g., display (301)) may be disposed on the housing (210). The first substrate (320) may be laminated to the flexible display (e.g., display (301)). The display driving integrated circuit (324) may be disposed on the first substrate (320). The second substrate (330) may be laminated on the first substrate (320) in a second direction different from the first direction. The second substrate (330) may be electrically connected to the first substrate (320). The second substrate (330) may include a receiving portion (334). The receiving portion (334) may receive at least a portion of the display driving integrated circuit (324). The shielding structure (340) may be disposed on the second substrate (330). The shielding structure (340) may be electrically connected to a ground surface of the second substrate (330). The shielding structure (340) may cover the display driving integrated circuit (324).

[0249] According to one embodiment, the electronic device (101) may further include a conductive connecting member (e.g., a first conductive connecting member (307)) and / or at least one electrical component (333). The conductive connecting member (e.g., the first conductive connecting member (307)) may be electrically connected to the first substrate (320) and the second substrate (330). The at least one electrical component (333) may be mounted on the second substrate (330).

[0250] According to one embodiment, the first substrate (320) may include a first wiring (309a) and / or a second wiring (309b). The first wiring (309a) may be electrically connected to the flexible display (e.g., display (301)) and the conductive connecting member (e.g., first conductive connecting member (307)). The second wiring (309b) may be electrically connected to the flexible display (e.g., display (301)) and the display driving integrated circuit (324).

[0251] According to one embodiment, the first length of the first wiring (309a) in the first direction may be longer than the second length of the second wiring (309b) in the second direction.

[0252] According to one embodiment, the electronic device (101) may further include a support plate (350) and / or a conductive contact member (e.g., a third conductive contact member (403)). The support plate (350) may be configured to support an inner surface of the flexible display (e.g., the display (301)). The conductive contact member (e.g., the third conductive contact member (403)) may be in contact with the second substrate (330) and the support plate (350).

[0253] Although non-limiting exemplary embodiments of the present disclosure have been described above with reference to the drawings, it will be apparent to those skilled in the art that various changes in form and detail can be made therein without departing from the spirit and scope of the present disclosure.

Claims

1. In electronic devices, flexible display; A first substrate at least partially overlapping the flexible display and electrically connected to the flexible display; A display driving integrated circuit located on the first substrate; A second substrate at least partially overlapping the first substrate, electrically connected to the first substrate, and including a receiving portion for receiving at least a portion of the display driver integrated circuit; and An electronic device comprising a shielding structure positioned on the second substrate, covering the receiving portion, and configured to shield the display driving integrated circuit.

2. In paragraph 1, The above first substrate, A flexible display comprising a first part connected to a first end of the flexible display and a second part facing in an opposite direction to the first part, The above first part is, At least a portion of the first substrate is bent to overlap the flexible display, The above display driving integrated circuit, An electronic device positioned between the first part and the second part.

3. In paragraph 2, An opening is formed in the first substrate and the second substrate, The above opening is, An electronic device aligned with at least one of the cameras and sensors of said electronic device.

4. In paragraph 3, The above opening is, An electronic device positioned between the first portion and the display driving integrated circuit.

5. In paragraph 3, The above opening is, An electronic device positioned between the second portion and the display driving integrated circuit.

6. In paragraph 2, The above second substrate, It comprises a first edge facing in the same direction as the facing direction of the first portion, and further comprises a second edge facing in the opposite direction to the facing direction of the first edge, The second corner above, An electronic device adjacent to the second section.

7. In paragraph 6, An electronic device further comprising a cover portion covering the second edge and the second portion.

8. In paragraph 7, The above cover part is, An electronic device comprising a spacer positioned between the first substrate and the second substrate.

9. In paragraph 1, The above first substrate, An electronic device positioned at least partially between said flexible display and said second substrate.

10. In paragraph 1, Further comprising a housing including a first housing portion and a second housing portion configured to move in a first direction relative to the first housing portion; The above flexible display is located in the housing, The second substrate is an electronic device positioned on the first substrate in a second direction different from the first direction.

11. In clause 10, The second direction above is, An electronic device perpendicular to the first direction.

12. In paragraph 11, Further comprising a battery positioned within the housing, The above battery, An electronic device that does not overlap the first substrate and the second substrate in the second direction.

13. In paragraph 11, Further comprising a heat dissipation layer positioned on the inner surface of the flexible display; The above heat dissipation layer, An electronic device that does not overlap the first substrate and the second substrate in the second direction.

14. In paragraph 10, a touch circuit located on the second substrate; and a main circuit board positioned within the housing and electrically connected to the second substrate; and An electronic device further comprising at least one processor located on said main circuit board.

15. In paragraph 1, Further comprising a heat dissipation member positioned within the receiving space, An electronic device in which the above-mentioned accommodation space is defined by the above-mentioned accommodation portion and the above-mentioned shielding structure.

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