Display module and preparation method therefor, and terminal device

Abstract

Disclosed in the embodiments of the present application are a display module and a preparation method therefor, and a terminal device. The display module comprises: a cooling fin, a first back plate, a second back plate and a display panel, wherein a first accommodating cavity is formed between a bending section of the display panel and the cooling fin, the first back plate and the second back plate. Since an edge of the cooling fin is recessed inwards relative to edges of the first back plate and the second back plate to form a clearance region, the volume of the accommodating cavity is increased and more glue can be accommodated, thereby alleviating excessive overflow of glue.

Description

Display module, manufacturing method thereof, and terminal device

[0001] This application claims priority to Chinese patent application No. 202311743247.8 filed on December 15, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of display technology, and specifically to a display module, a preparation method thereof, and a terminal device. Background Art

[0003] The flexible display panel is bent through the bending section, so that the flexible circuit board and some wiring are bent to the back side. The bending section has a bending radius and forms a hollow cavity around it. When the whole machine falls from a high altitude, the huge impact force causes the middle frame to deform significantly, causing defects such as bright lines on the display screen. When the existing technology uses glue to prepare the support part, the glue is easily squeezed and overflows to both sides, resulting in display abnormalities. SUMMARY OF THE INVENTION

[0004] Therefore, the existing display module has a technical problem that the glue forming the support member easily overflows.

[0005] The embodiments of the present application provide a display module, a preparation method thereof, and a terminal device, which can alleviate the technical problem of easy overflow of glue forming a support member in existing display modules.

[0006] An embodiment of the present application provides a display module, comprising:

[0007] heat sink;

[0008] a first back plate, the first back plate being arranged on one side of the heat sink along the film thickness direction;

[0009] a second back plate, the second back plate being arranged on the other side of the heat sink in the film thickness direction;

[0010] a display panel, the display panel comprising a display section, a flat section, and a bent section, the display section being disposed on a side of the first back plate away from the heat sink, the flat section being disposed on a side of the second back plate away from the heat sink, the bent section being bent, and having two ends connected to the display section and the flat section, respectively;

[0011] In which, an accommodating cavity is formed between the bending section and the heat sink, the first back plate, and the second back plate. The edges of the first back plate and the second back plate facing the bending section are arranged beyond the edge of the heat sink. A support member is arranged in the accommodating cavity, and one end of the support member is at least in contact with the heat sink.

[0012] The present invention provides a method for manufacturing a display module, which includes:

[0013] A display panel is provided, wherein the display panel includes a display section, a plane section, and a bending section located on the same plane;

[0014] A first back plate and a heat sink are sequentially prepared on one side of the display section of the display panel;

[0015] A second backplane is prepared on the same side of the planar section of the display panel, and a groove is formed at a distance between the first backplane and the second backplane;

[0016] Filling the groove with glue;

[0017] Bend the bending section so that the second back plate is placed on a side of the heat sink away from the first back plate, wherein a receiving cavity is formed between the bending section and the heat sink, the first back plate, and the second back plate, the support member formed by the adhesive material is arranged in the receiving cavity, one end of the support member at least abuts against the heat sink, and the first back plate and the second back plate are arranged beyond the edge of the heat sink toward the edge of the bending section.

[0018] An embodiment of the present application provides a terminal device, which includes the display module described in the above embodiment, wherein the display module includes:

[0019] heat sink;

[0020] a first back plate, the first back plate being arranged on one side of the heat sink along the film thickness direction;

[0021] a second back plate, the second back plate being arranged on the other side of the heat sink in the film thickness direction;

[0022] a display panel, the display panel comprising a display section, a flat section, and a bent section, the display section being disposed on a side of the first back plate away from the heat sink, the flat section being disposed on a side of the second back plate away from the heat sink, the bent section being bent, and having two ends connected to the display section and the flat section, respectively;

[0023] In which, an accommodating cavity is formed between the bending section and the heat sink, the first back plate, and the second back plate. The edges of the first back plate and the second back plate facing the bending section are arranged beyond the edge of the heat sink. A support member is arranged in the accommodating cavity, and one end of the support member is at least in contact with the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0025] FIG1 is a schematic cross-sectional view of a display module provided by the present application;

[0026] FIG2 is a cross-sectional schematic diagram of the display module manufacturing method provided by the present application after the groove is filled with glue;

[0027] FIG3 is a top cross-sectional view of the cross-sectional schematic diagram of the display module manufacturing method provided by the present application in FIG2 ;

[0028] FIG4 is a schematic diagram of a process for preparing a display module provided in the present application;

[0029] FIG5 is a comparative schematic diagram of the stress resistance of the present invention when using different adhesive materials to prepare the support member and when not providing the support member;

[0030] FIG6 is a graph showing the change in the risk of line breakage with displacement when the bending section of the present application is circular;

[0031] FIG7 is a graph showing the change in the risk of line breakage with displacement when the bending section of the present application is elliptical;

[0032] FIG8 is a schematic diagram comparing the stress resistance of the present application with and without support members.

[0033] Description of reference numerals:

[0034] Modes for Carrying Out the Invention

[0035] The embodiments of the present application merely illustrate exemplary embodiments of the inventive concept, which may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0037] Please refer to Figures 1, 2, and 3. The display module 1 provided in the present application includes a heat sink 10, a first back plate 20, a second back plate 30, and a display panel 40. The first back plate 20 is arranged on one side of the heat sink 10 along the film thickness direction, and the second back plate 30 is arranged on the other side of the heat sink 10 along the film thickness direction. The display panel 40 includes a display section 401, a plane section 402, and a bending section 403. The display section 401 is arranged on the side of the first back plate 20 away from the heat sink 10, and the plane section 402 is arranged on the second back plate 30 is on the side away from the heat sink 10, the bending section 403 is bent, and the two ends of the bending section 403 are respectively connected to the display section 401 and the plane section 402; an accommodating cavity is formed between the bending section 403 and the heat sink 10, the first back plate 20, and the second back plate 30, and the edges of the first back plate 10 and the second back plate 20 facing the side of the bending section 30 are arranged beyond the edge of the heat sink 10, and a support member 50 is provided in the accommodating cavity, and one end of the support member 50 is at least in contact with the heat sink 10.

[0038] It can be understood that since a support member 50 is provided in the accommodating cavity, when the bending section 403 is squeezed by external force and produces a certain deformation, the support member 50 will support the bending section 403, thereby improving the pressure load resistance of the accommodating cavity and reducing the deformation of the bending section 403 caused by external force.

[0039] In this embodiment, a support member 50 is provided in the accommodating cavity formed around the bending section 403. The support member 50 is used to reduce the deformation of the bending section 403. When the support member 50 is prepared by glue, the edge of the heat sink 10 is retracted relative to the edge of the first back panel 20 and the second back panel 30, so that the glue is at least partially filled between the first back panel 20 and the second back panel 30, so that one end of the support member 50 is at least in contact with the heat sink 10. Since the edge of the heat sink 10 is retracted relative to the edge of the first back panel 20 and the second back panel 30 to form an avoidance zone 4, the volume of the accommodating cavity is increased, and more glue can be accommodated, thereby alleviating excessive overflow of glue, thereby alleviating the technical problem of easy overflow of glue forming the support member in the existing display module.

[0040] The technical solution of this application is now described in conjunction with specific embodiments.

[0041] The viscosity of the adhesive material, the modulus of the adhesive material, the width of the reserved area 3, the selected material of the support member 50, etc. in this application are only described with reference to the best or better implementation methods. Other implementation methods and scopes should also fall within the scope of protection of the present invention and will not be repeated here.

[0042] Optionally, in some embodiments of the present application, the bending section includes a long side and a short side in a bent configuration, the extension direction of the long side is a first direction, and along the first direction, the bending section includes a routing area and reserved areas located on both sides of the routing area, the routing area is provided with metal routing, and the support member at least covers the routing area.

[0043] Optionally, in some embodiments of the present application, the display panel further includes a source electrode and a drain electrode arranged in the same layer, and at least part of the metal wiring is arranged in the same layer as the source electrode and the drain electrode.

[0044] Optionally, in some embodiments of the present application, the display panel further includes a GOA circuit, the GOA circuit includes an outlet terminal located in the routing area, along the first direction, the minimum distance between the edge of the bending section and the outlet terminal is d1, the width of the reserved area is d2, and 0.2 mm ≤ d2 < d1.

[0045] Optionally, in some embodiments of the present application, the other end of the support member abuts against the bending section.

[0046] Optionally, in some embodiments of the present application, the support member and the accommodating cavity are designed to be contoured, and the outer contour surface of the support member and the inner contour surface of the accommodating cavity are arranged to fit together.

[0047] Optionally, in some embodiments of the present application, the supporting member is made of a material including glue.

[0048] Optionally, in some embodiments of the present application, the adhesive material is at least one of optical adhesive 110 and pressure-sensitive adhesive.

[0049] Optionally, in some embodiments of the present application, the viscosity of the adhesive material ranges from 1300 centipoise to 4200 centipoise, and the modulus of the adhesive material ranges from 1 GPa to 3 GPa.

[0050] Optionally, in some embodiments of the present application, the cross-sectional shape of the bending profile of the bending section 403 is arc-shaped.

[0051] Optionally, in some embodiments of the present application, the arc is a part of an ellipse or a circle, the radius of the circle is 0.26 mm, the major axis radius of the ellipse is 0.26 mm, and the minor axis radius of the ellipse is 0.23 mm.

[0052] Optionally, in some embodiments of the present application, the major axis of the semi-ellipse is arranged along the first direction, the minor axis of the semi-ellipse is perpendicular to the first direction and toward the bending vertex of the bending section, wherein the length of the major axis is greater than the length of the minor axis.

[0053] Optionally, in some embodiments of the present application, the bending section is further provided with a stress buffer via, and the stress buffer via at least penetrates a portion of the inorganic film layer within the bending section, and the support member can also enhance the stiffness of the bending section at the stress buffer via.

[0054] Optionally, in some embodiments of the present application, the support member abuts against an area of ​​the bending section where the stress buffering via is provided.

[0055] Optionally, in some embodiments of the present application, the display module further includes a hardening layer, a polarizer, an optical adhesive, a cover plate, a shading member, and a protective layer, wherein the polarizer is arranged on a side of the display segment away from the heat sink, the optical adhesive is arranged on a side of the polarizer away from the heat sink, and the cover plate is arranged on a side of the optical adhesive away from the heat sink, wherein a shading member is arranged at the edge of the cover plate, and the shading member is used to prevent light leakage from the edge.

[0056] Optionally, in some embodiments of the present application, the protective layer is arranged to cover at least the outer side of the bending section.

[0057] Optionally, in some embodiments of the present application, the edge of the hardening layer may be aligned with the edge of the heat sink.

[0058] Optionally, in some embodiments of the present application, the portions of the first back plate and the second back plate that extend beyond the edge of the heat sink are symmetrically arranged.

[0059] The display section 401 of the present application can be used for display function, the planar section 402 can be used to establish electrical connection with the printed circuit board 120, and the bending section 403 is a bending section.

[0060] The display panel 40 of the present application is described by taking a flexible display panel 40 as an example. The GOA circuit of the present application refers to an integrated gate driver on array (GOA).

[0061] Please refer to Figures 1 and 2. The display module 1 provided in the present application also includes: a hardening layer 60, a polarizer 70, an optical adhesive 110, a cover plate 80, a shading member 90, and a protective layer 100. The polarizer 70 is arranged on the side of the display segment 401 away from the heat sink 10, the optical adhesive 110 is arranged on the side of the polarizer 70 away from the heat sink 10, and the cover plate 80 is arranged on the side of the optical adhesive 110 away from the heat sink 10. A shading member 90 is provided at the edge of the cover plate 80, and the shading member 90 is used to prevent light leakage from the edge.

[0062] The protection layer 100 at least covers the outer side of the bending section 403 , thereby preventing water vapor from invading the display panel 40 and adjusting the neutral layer.

[0063] The hardening layer 60 is disposed on a side of the heat sink 10 away from the first back plate 20 , and the second back plate 30 is disposed on a side of the hardening layer 60 away from the heat sink 10 .

[0064] The side of the planar section 402 away from the bent section 403 is further connected to a printed circuit board 120 , on which a chip 140 and a black coating 130 are disposed.

[0065] In one embodiment, the portions of the first back plate 20 and the second back plate 30 that extend beyond the edge of the heat sink 10 are symmetrically arranged.

[0066] The edge of the hardened layer 60 may be aligned with the edge of the heat sink 10 .

[0067] It can be understood that when the edge of the heat sink 10 is fixed inwardly, when the first back panel 20 and the second back panel 30 are symmetrically arranged beyond the edge of the heat sink 10, the volume of the avoidance area 4 is the largest, which can accommodate more glue and further prevent the overflow of glue.

[0068] In one embodiment, the other end of the support member 50 abuts against the bending section 403 .

[0069] It can be understood that the two ends of the support member 50 are respectively arranged to abut against the inner walls on the opposite sides of the accommodating cavity, one end of the support member 50 abuts against at least one of the heat sink 10, the first back plate 20, and the second back plate 30, and the other end of the support member 50 abuts against the bending section 403, so that the support member 50 has a better supporting effect on the bending section 403, further reducing the deformation of the bending section 403.

[0070] In one embodiment, referring to FIG3 , the bending section 403 includes a long side and a short side that is bent, the extension direction of the long side is a first direction, and along the first direction, the bending section 403 includes a routing area 2 and reserved areas 3 located on both sides of the routing area 2, the routing area 2 is provided with metal routing, and the support member 50 at least covers the routing area 2.

[0071] The metal wiring in the wiring area 2 is at least partially provided in the same layer as the source and drain electrodes in the display panel 40 .

[0072] It can be understood that when the bending section 403 is squeezed and deformed, the metal routing in the routing area 2 is easily broken due to the stress. By making the support member 50 at least cover the routing area 2 where the metal routing is provided, the metal routing can be better protected and prevented from breaking.

[0073] In this embodiment, the support member 50 is arranged to cover the wiring area 2 , thereby enhancing the protection effect of the support member 50 on the metal wiring in the wiring area 2 .

[0074] In one embodiment, in the direction of the heat sink 10 toward the accommodating cavity, the edges of the first back plate 20 and the second back plate 30 are arranged beyond the edges of the heat sink 10 .

[0075] One end of the support member 50 abuts against both the first back plate 20 and the second back plate 30 .

[0076] It can be understood that since the edges of the first backplane 20 and the second backplane 30 are not flush with the edges of the heat sink 10, the metal traces at the edge contact position between the bending section 403 and the edges of the first backplane 20 and the second backplane 30 are more likely to break as the bending section 403 deforms. By making one end of the support member 50 abut against both the first backplane 20 and the second backplane 30, the metal traces at the edge contact position can be effectively prevented from breaking, and the metal traces at the edge contact position can be better protected.

[0077] In this embodiment, during the deformation of the bending section 403, the metal traces at the edge contact position between the bending section 403 and the first backplane 20 and the second backplane 30 are subjected to greater stress. By making one end of the support member 50 abut against both the first backplane 20 and the second backplane 30, the metal traces at the above-mentioned edge contact position can be better prevented from being broken.

[0078] In one embodiment, referring to FIG. 3 , the display panel 40 further includes a GOA circuit, the GOA circuit 40 includes an outlet terminal located within the routing area 2 , and along the first direction, the minimum distance between the edge of the bending section 403 and the outlet terminal is d1 , the width of the reserved area 3 is d2 , and 0.2 mm ≤ d2 < d1 .

[0079] It can be understood that by limiting the width of the reserved area 3 so that the width of the reserved area 3 is greater than 0.2 mm, when the support member 50 is prepared using glue, the reserved area 3 is used to accommodate the glue flowing to both sides due to extrusion, thereby preventing the glue from overflowing due to extrusion.

[0080] It can be understood that since the output terminal of the GOA circuit is provided in the routing area 2, there may be a certain distance between the output terminal and the edge of the routing area. Therefore, the setting width of the reserved area 3 cannot exceed the minimum distance between the output terminal and the edge of the bending section in the first direction, so as to avoid the setting of the reserved area affecting the setting of the output terminal of the GOA circuit.

[0081] In this embodiment, the reserved area 3 is provided and the width d2 of the reserved area 3 is limited to satisfy: 0.2 mm ≤ d2 < d1; this prevents the glue forming the support member 50 from being squeezed and overflowing after being bent in the bending section 403 during the preparation of the support member 50.

[0082] In one embodiment, the support member 50 is designed to be contoured with the accommodating cavity, and the outer contour surface of the support member 50 is fitted with the inner contour surface of the accommodating cavity.

[0083] It is understandable that the support member 50 can be prepared by a glue material, and the glue material can easily be designed to imitate the shape of the accommodating cavity during the bending process of the bending section 403, so that there is no other gap between the support member 50 and the inner wall of the accommodating cavity, so that the support member 50 can provide a supporting force for the bending section 403 while the bending section 403 is squeezed and deformed, which is equivalent to improving the pressure load resistance.

[0084] Specifically, in this embodiment, the inner wall of the bending section 403 abuts against the support member 50, and when the middle frame squeezes the bending section 403, the compressive load resistance of the bending section 403 and the support member 50 as an integral structure is at least four times the compressive load resistance of the structure with only the bending section 403.

[0085] In this embodiment, since the support member 50 and the accommodating cavity are designed to be contoured, there is no gap between the support member 50 and the accommodating cavity, which further optimizes the supporting effect of the support member 50 on the bending section 403 and enhances the compressive load resistance of the bending section 403 and the support member 50 as an integral structure, so that when the bending section 403 is squeezed by the middle frame, etc., the bending section 403 is not easily deformed.

[0086] In one embodiment, the supporting member 50 is made of a material including adhesive.

[0087] The adhesive material is at least one of optical adhesive 110 and pressure-sensitive adhesive.

[0088] It is understandable that, from a process perspective, the adhesive material makes it easier to prepare the support member 50; however, the present application includes but is not limited to the adhesive material, for example: the support member 50 can be an independent component, arranged on the side of the heat sink 10, the first back plate 20, and the second back plate 30 facing the accommodating cavity.

[0089] In one embodiment, the viscosity of the adhesive material ranges from 1300 centipoise to 4200 centipoise, and the modulus of the adhesive material ranges from 1 GPa to 3 GPa.

[0090] The viscosity of the adhesive material may be 1300 centipoise, 2000 centipoise, 3000 centipoise, or 4200 centipoise.

[0091] The modulus of the rubber material may be 1 GPa, 2 GPa, or 3 GPa.

[0092] Optionally, the viscosity of the adhesive material may range from 3000 centipoise to 4200 centipoise.

[0093] Optionally, the modulus of the adhesive material may range from 2 GPa to 3 GPa.

[0094] It is understandable that the viscosity range of the adhesive material may be the viscosity of the adhesive layer that can be selected during the adhesive coating process.

[0095] It can be understood that the greater the viscosity, the lower the fluidity of the adhesive before curing, and the smaller the impact on the metal routing; the greater the modulus of the adhesive, the stronger the compressive load resistance of the support member 50 prepared by the adhesive.

[0096] In this embodiment, by limiting the modulus and viscosity of the adhesive material used to prepare the support member 50, on the one hand, the impact of the adhesive material on the process and wiring stress during the manufacturing process is reduced; on the other hand, the pressure load resistance of the support member 50 is enhanced.

[0097] In one embodiment, the major axis of the semi-ellipse is arranged along the first direction, the minor axis of the semi-ellipse is perpendicular to the first direction and toward the bending vertex of the bending section, wherein the length of the major axis is greater than the length of the minor axis.

[0098] The bending vertex of the bending section refers to: the vertex on the short axis side of the semi-ellipse.

[0099] It can be understood that the setting direction of the short axis is the width direction of the frame, and by reducing the length of the short axis, the effect of a narrow frame can be achieved.

[0100] In one embodiment, the cross-sectional shape of the bending profile of the bending section 403 is an arc, and the arc is a part of an ellipse or a circle.

[0101] Wherein, the radius of the circle may be 0.26 mm.

[0102] The major axis radius of the ellipse may be 0.26 mm, and the minor axis radius of the ellipse may be 0.23 mm.

[0103] It can be understood that the major axis of the ellipse is set along the second direction, and the minor axis of the ellipse is set along the width direction of the frame. By reducing the width of the minor axis of the ellipse, the width of the frame can be reduced; the second direction can be the film thickness direction of the display module 1.

[0104] Optionally, due to the provision of the support member 50, the overall compressive load resistance of the bending section 403 and the support member 50 is stronger, so the major axis and the minor axis of the ellipse can be set smaller to achieve a narrower frame.

[0105] Specifically, the major axis radius of the ellipse may be 0.23 mm, and the minor axis radius of the ellipse may be 0.17 mm.

[0106] It can be understood that when the cross-sectional shape of the bending profile of the bending section 403 is a part of an ellipse, the stress of the metal lines at the edges of the first backplane 20 and the second backplane 30 will be greater than when the cross-sectional shape of the bending profile of the bending section 403 is a part of an ellipse. Therefore, when the cross-sectional shape of the bending profile of the bending section 403 is a part of an ellipse, the support member 50 can better prevent the bending section 403 from being squeezed and deformed.

[0107] It should be noted that, along the second direction, when the major axis radius of the bending section 403 when it is in the form of an ellipse or the radius when it is in the form of a circle are equal, when the bending section 403 is in the form of an ellipse, its minor axis radius is smaller than the radius of the circle, that is, when the cross-sectional shape of the bending profile of the bending section 403 is a part of an ellipse, the frame can be made narrower.

[0108] It is worth noting that, since the above design improves the compressive load resistance of the bending section 403 , the safety distance between the bending section 403 and the middle frame can be further compressed, thereby further realizing a narrow frame design.

[0109] In this embodiment, by making the cross-sectional shape of the bending profile of the bending section 403 an arc, when the arc is a part of an ellipse, the short axis of the ellipse is arranged along the width direction of the frame, which can further reduce the width of the frame.

[0110] In one embodiment, the cross-sectional shape of the bending profile of the bending section 403 is a semi-ellipse or a semi-circle.

[0111] In one embodiment, the bending section 403 is also provided with a stress buffer via, and the stress buffer via at least passes through a portion of the inorganic film layer within the bending section 403. The support member 50 can also enhance the stiffness of the bending section 403 at the stress buffer via.

[0112] The support member 50 may also abut against the region of the bending section 403 where the stress buffering vias are provided.

[0113] It can be understood that due to the poor bending performance of the inorganic film layer, in order to enable the display panel 40 to bend better in the bending section 403, a stress buffer via is provided. The stress buffer via will penetrate at least part of the inorganic film layer, thereby reducing the thickness of the inorganic film layer and making the bending section 403 easier to bend; the present application provides a support member 50 in the accommodating cavity, and the support member 50 can abut against the area of ​​the bending section 403 where the stress buffer via is provided, thereby improving the stiffness of the bending section 403 at the stress buffer via.

[0114] In this embodiment, the bending section 403 is also provided with a stress buffer via that penetrates at least part of the inorganic film layer. On the one hand, it can better relieve the stress generated by the bending of the bending section 403. On the other hand, by abutting the support member 50 against the area of ​​the bending section 403 where the stress buffer via is provided, the stiffness of the bending section 403 at the stress buffer via can also be improved.

[0115] Referring to FIG. 4 , an embodiment of the present application provides a method for manufacturing a display module 1, comprising:

[0116] S1: providing a display panel 40 , wherein the display panel 40 includes a display section 401 , a flat section 402 , and a bending section 403 located on the same plane;

[0117] S2: preparing a first back plate 20 and a heat sink 10 in sequence on one side of the display section 401 of the display panel 40;

[0118] S3: preparing a second backplane 30 on the same side of the planar section 402 of the display panel 40 , and forming a groove at a distance between the first backplane 20 and the second backplane 30 ;

[0119] S4: Filling the groove with adhesive;

[0120] S5: Bend the bending section 403 so that the second back panel 30 is placed on the side of the heat sink 10 away from the first back panel 20, wherein a accommodating cavity is formed between the bending section 403 and the heat sink 10, the first back panel 20, and the second back panel 30, and the support member 50 formed by the adhesive material is arranged in the accommodating cavity, and one end of the support member 50 is at least in contact with the heat sink 10, and the first back panel 20 and the second back panel 30 are arranged beyond the edge of the heat sink 10 toward the edge of the bending section 403.

[0121] The adhesive is only disposed in the groove, and the adhesive is not disposed on the surface of the first back plate 20 or the second back plate 30 away from the display panel 40 .

[0122] The step of filling the groove with glue may be performed after preparing the heat sink 10 and before preparing the hardening layer 60 .

[0123] Among them, artificial filling can be used.

[0124] A glue dispensing machine may be used for dispensing glue, thereby setting the glue material in the groove, and the glue dispensing machine may be in an offline state.

[0125] In one embodiment, the step of placing the second back panel 30 on the side of the heat sink 10 away from the first back panel 20 also includes: preparing a hardening layer 60 on the side of the heat sink 10 away from the display section, and bending the bending section 403 so that the second back panel 30 is placed on the surface of the hardening layer 60 on the side away from the heat sink 10.

[0126] Please refer to Figure 5. For the randomly selected experimental samples Y1, Y2, and Y3, the support member 50 was prepared using glue A and glue B with different moduli, respectively, and no support member was set as a comparison example, wherein the modulus of glue A is greater than the modulus of glue B. The vertical axis is the value of the extrusion resistance, and the unit is N. It can be understood that by using glue to prepare the support member 50, the extrusion resistance of the bending section 403 and the support member 50 as a whole can be significantly improved, and the support member 50 obtained by using glue with a larger modulus has a stronger extrusion resistance.

[0127] It should be noted that FIG. 5 to FIG. 8 are all experimental groups conducted for the case where the support member 50 is contour-designed and fits the accommodating cavity.

[0128] Compare Figures 6 and 7; Figure 6 shows an experiment on metal routing risk variation with displacement conducted on a sample in which the cross-sectional shape of the bending profile of the bending section 403 is an arc, and the arc is a semicircle with a radius of 0.26 mm; Figure 7 shows an experiment on metal routing risk variation with displacement conducted on a sample in which the cross-sectional shape of the bending profile of the bending section 403 is an arc, specifically, the arc is a semi-ellipse with a major axis radius of 0.26 mm and a minor axis radius of 0.23 mm.

[0129] It can be understood that the vertical axis represents the stress exerted on the metal routing of the source and drain layers in the routing area 2. The larger the value, the higher the risk of broken wiring. The horizontal axis of Figures 6 and 7 refers to displacement, and the displacement refers to: the length of the metal routing in the routing area 2. The dotted line BP1 refers to the stress value of the metal routing at the location of the first backplane 20, and the dotted line BP2 refers to the stress value of the metal routing at the location of the second backplane 30.

[0130] Please refer to FIG. 8 , which shows a comparison of the compression resistance of the metal traces with and without the support member 50 when the cross-sectional shape of the bending profile of the bending section 403 is a portion of an ellipse.

[0131] Among them, the horizontal axis is the arc top position, and the arc top position refers to: in the first direction, the three different areas of left, middle and right corresponding to the metal routing of the routing area 2; the vertical axis is the extrusion resistance of different areas for the randomly selected experimental samples Y4 and Y5 when the support part 50 is set and when the support part 50 is not set.

[0132] The present application provides a support member 50 in a receiving cavity surrounded by the bending section 403 of the display panel 40 and the heat sink 10, the first back plate 20, and the second back plate 30. One end of the support member 50 abuts against the side of at least one of the heat sink 10, the first back plate 20, and the second back plate 30. Therefore, when the bending section 403 is squeezed and deformed, the deformation of the bending section 403 is reduced by the support member 50, thereby preventing the metal wiring from breaking due to excessive deformation, and further alleviating the bright line problem caused by the bending section 403 being squeezed and deformed by external force; optionally, the present application may include but is not limited to using glue to fill the receiving cavity to prepare the support member 50.

[0133] The present application provides a support member in the accommodating cavity formed around the bending section, and the support member is used to reduce the deformation of the bending section. When the support member is prepared by glue, the edge of the heat sink is retracted relative to the edges of the first back plate and the second back plate, so that the glue is at least partially filled between the first back plate and the second back plate, so that one end of the support member at least abuts the heat sink. Since the edge of the heat sink is retracted relative to the edges of the first back plate and the second back plate to form an avoidance area, the volume of the accommodating cavity is increased, and more glue can be accommodated, thereby alleviating excessive overflow of glue, thereby alleviating the technical problem of easy overflow of glue forming the support member in the existing display module.

[0134] The present application also proposes a terminal device, which includes the above-mentioned display module, which will not be described in detail here; wherein, the terminal device also includes a front frame and a middle frame, and the terminal device includes but is not limited to a mobile phone, a computer, and a flat-panel display device.

[0135] The display module provided by the embodiment of the present application includes a heat sink, a first back plate, a second back plate, and a display panel, the first back plate is arranged on one side of the heat sink along the film thickness direction, the second back plate is arranged on the other side of the heat sink along the film thickness direction, the display panel includes a display section, a plane section, and a bending section, the display section is arranged on the side of the first back plate away from the heat sink, the plane section is arranged on the side of the second back plate away from the heat sink, the bending section is bent, and the two ends of the bending section are respectively connected to the display section and the plane section; wherein, an accommodating cavity is formed between the bending section and the heat sink, the first back plate, and the second back plate, and the edges of the first back plate and the second back plate facing the side of the bending section exceed the heat sink The edge is set, a support member is set in the accommodating cavity, and one end of the support member is at least in contact with the heat sink; a support member is set in the accommodating cavity formed around the bending section, and the support member is used to reduce the deformation of the bending section. When the support member is prepared by glue, the edge of the heat sink is retracted relative to the edge of the first back plate and the second back plate, so that the glue is at least partially filled between the first back plate and the second back plate, so that one end of the support member is at least in contact with the heat sink. Since the edge of the heat sink is retracted relative to the edge of the first back plate and the second back plate to form an avoidance area, the volume of the accommodating cavity is increased, and more glue can be accommodated, thereby alleviating excessive overflow of glue, thereby alleviating the technical problem of easy overflow of glue forming the support member in the existing display module.

[0136] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0137] The display module and the display module preparation method provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display module, comprising: Heat sink; A first back plate, the first back plate is arranged on one side of the heat sink along the film thickness direction; A second back plate, the second back plate is arranged on the other side of the heat sink along the film thickness direction; A display panel, the display panel comprising a display section, a plane section, and a bending section, the display section is arranged on a side of the first back plate away from the heat sink, the plane section is arranged on a side of the second back plate away from the heat sink, the bending section is arranged in a bending manner, and two ends of the bending section are respectively connected to the display section and the plane section; Among them, an accommodating cavity is formed between the bending section and the heat sink, the first back plate, and the second back plate. The edges of the first back plate and the second back plate facing the bending section are arranged beyond the edges of the heat sink. A support member is arranged in the accommodating cavity, and one end of the support member at least abuts against the heat sink.

2. The display module according to claim 1, wherein: The bending section includes a long side and a short side that is bent, the extension direction of the long side is a first direction, and along the first direction, the bending section includes a routing area and reserved areas located on both sides of the routing area, the routing area is provided with metal routing, and the support member at least covers the routing area.

3. The display module according to claim 2, wherein: The display panel further includes a source electrode and a drain electrode disposed in the same layer, and at least a portion of the metal wiring is disposed in the same layer as the source electrode and the drain electrode.

4. The display module according to claim 2, wherein: The display panel also includes a GOA circuit, which includes an outlet terminal located in the routing area. Along the first direction, the minimum distance between the edge of the bending section and the outlet terminal is d1, the width of the reserved area is d2, and 0.2 mm≤d2<d1.

5. The display module according to claim 1, wherein: The other end of the support member abuts against the bending section.

6. The display module according to claim 4, wherein: The support member and the accommodating cavity are designed in a contoured manner, and the outer contour surface of the support member and the inner contour surface of the accommodating cavity are arranged to fit each other.

7. The display module according to claim 1, wherein: The supporting member is prepared from a material including a rubber material.

8. The display module according to claim 7, wherein: The adhesive material is at least one of optical adhesive and pressure-sensitive adhesive.

9. The display module according to claim 7, wherein: The viscosity of the adhesive material ranges from 1300 centipoise to 4200 centipoise, and the modulus of the adhesive material ranges from 1 GPa to 3 GPa.

10. The display module according to claim 1, wherein: The cross-sectional shape of the bending profile of the bending section is an arc.

11. The display module according to claim 10, wherein: The arc is a part of an ellipse or a circle, the radius of the circle is 0.26 mm, the radius of the major axis of the ellipse is 0.26 mm, and the radius of the minor axis of the ellipse is 0.23 mm.

12. The display module according to claim 11, wherein: The major axis of the semi-ellipse is arranged along the first direction, the minor axis of the semi-ellipse is perpendicular to the first direction and faces the bending vertex of the bending section, wherein the length of the major axis is greater than the length of the minor axis.

13. The display module according to claim 1, wherein: The bending section is further provided with a stress buffering via hole, and the stress buffering via hole at least penetrates a portion of the inorganic film layer in the bending section.

14. The display module according to claim 13, wherein: The support member abuts against a region of the bending section where the stress buffering via is provided.

15. The display module according to claim 1, wherein: The display module also includes a hardening layer, a polarizer, an optical glue, a cover plate, a shading member, and a protective layer. The polarizer is arranged on a side of the display section away from the heat sink, the optical glue is arranged on a side of the polarizer away from the heat sink, and the cover plate is arranged on a side of the optical glue away from the heat sink, wherein a shading member is arranged at an edge of the cover plate.

16. The display module according to claim 15, wherein: The protective layer is arranged to cover at least the outer side of the bending section.

17. The display module according to claim 15, wherein: The edge of the hardening layer is aligned with the edge of the heat sink.

18. The display module according to claim 1, wherein: Portions of the first back plate and the second back plate that extend beyond the edge of the heat sink are symmetrically arranged.

19. A method for preparing a display module, comprising: A display panel is provided, wherein the display panel comprises a display section, a plane section, and a bending section located on the same plane; A first back plate and a heat sink are sequentially prepared on one side of the display section of the display panel; A second backplane is prepared on the same side of the planar section of the display panel, and a groove is formed at a spacing position between the first backplane and the second backplane; Filling the groove with glue; The bending section is bent so that the second back plate is placed on a side of the heat sink away from the first back plate, wherein a receiving cavity is formed between the bending section and the heat sink, the first back plate and the second back plate, the supporting member formed by the adhesive material is arranged in the receiving cavity, one end of the supporting member at least abuts against the heat sink, and the first back plate and the second back plate are arranged beyond the edge of the heat sink toward the edge of the bending section.

20. A terminal device comprising the display module according to any one of claims 1 to 18.

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