Temperature point display method and computing device

Abstract

Provided in the present application are a temperature point display method and a computing device. In the embodiments, the method comprises: determining a temperature cloud map of a target device, wherein the temperature cloud map indicates the temperature distribution of the target device, the temperature cloud map comprises a plurality of temperature points, and the plurality of temperature points indicate temperatures corresponding to a plurality of component types in the target device; receiving a target component type to be subjected to querying; determining, from among the plurality of temperature points, at least one target temperature point corresponding to the target component type; and separately displaying the at least one target temperature point on the temperature cloud map. Therefore, temperature data of temperature points of the same component type is displayed separately, such that a user can perform fault analysis conveniently.

Description

Temperature point display method and calculation device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on December 13, 2023, with application number 202311708911.5 and application name “Temperature Point Display Method and Calculation Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of computer technology, and in particular to a temperature point display method and a computing device. Background Art

[0003] Temperature information is crucial for understanding server operating status. Currently, the server's baseboard management controller (BMC) obtains temperature data from the server's temperature sensors and displays this data on a two-dimensional image with a hardware diagram of the server motherboard as the background. This intuitively displays the location of each temperature sensor and the temperature data it collects.

[0004] However, since the locations and temperature data of all temperature sensors are displayed, it is more difficult to analyze the relationship between multiple abnormal temperature data.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a temperature point display method and a computing device, which facilitates users to perform fault analysis by separately displaying temperature data of temperature points of the same component type.

[0007] In a first aspect, an embodiment of the present application provides a temperature point display method, including: determining a temperature cloud map of a target device; the temperature cloud map indicates the temperature distribution of the target device, the temperature cloud map includes multiple temperature points, and the multiple temperature points indicate the temperatures corresponding to multiple component types in the target device; receiving the target component type to be queried; determining at least one target temperature point corresponding to the target component type from the multiple temperature points; and separately displaying at least one target temperature point on the temperature cloud map.

[0008] In this solution, the temperature data of temperature points of the same component type are displayed separately, thereby facilitating fault analysis for users.

[0009] In a possible implementation, the target device includes multiple temperature sensors, and each temperature sensor corresponds to any one of multiple temperature points.

[0010] In one possible implementation, the temperature cloud map includes a three-dimensional structure diagram formed based on multiple temperature points, and the display coordinates of the multiple temperature points are (x, y, z), where the x-coordinate and the y-coordinate indicate the corresponding positions of the temperature points in the target device, and the z-coordinate indicates the temperature value of the temperature point.

[0011] In a possible implementation, the temperature cloud map includes a component distribution map, the three-dimensional structure map is arranged above the component distribution map, and the display coordinates of the temperature points indicate the positions of the temperature points in the component distribution map.

[0012] In a possible implementation, each of the multiple component types has at least one component; a temperature point corresponds to a component of any of the multiple component types, and the component type of the component corresponding to the temperature point is the component type corresponding to the temperature point.

[0013] In one possible implementation, the temperature point is configured to display one or more of the following when operated: an identifier of the component type corresponding to the temperature point, an identifier of the component corresponding to the temperature point, a temperature value of the temperature point, and a temperature alarm threshold value of the component corresponding to the temperature point.

[0014] In this solution, relevant information is displayed by operating the temperature point, making it convenient for users to view temperature information.

[0015] In a possible implementation, the temperature point is further configured to enter an alarm state when the temperature value of the temperature point exceeds a temperature alarm threshold value of a component corresponding to the temperature point when the temperature point is operated.

[0016] In this solution, the operating temperature point is specially displayed when an alarm is triggered, thereby conveniently reminding the user of temperature abnormalities.

[0017] In a possible implementation, receiving a target component type to be queried includes: displaying a temperature cloud map in a temperature view, where the temperature view includes a query input box; and acquiring a component type input in the query input box as the target component type.

[0018] In one possible implementation, the method further includes: obtaining other component types other than the target component type from the plurality of component types; and determining the correlation between the target type and the other component types based on temperature data of temperature points corresponding to the target component type and the other component types.

[0019] In this solution, the correlation between component types is determined by analyzing the relationship between the temperature data of two component types, which facilitates the user to perform temperature analysis later.

[0020] In a second aspect, an embodiment of the present application provides a temperature point display method, comprising:

[0021] Display the temperature view interface; the temperature view interface includes a query input box and a temperature cloud map of the target device, the temperature cloud map indicates the temperature distribution of the target device, the temperature cloud map includes multiple temperature points, and the multiple temperature points indicate the temperatures corresponding to multiple component types in the target device; receive the target component type entered in the query input box; separately display at least one target temperature point corresponding to the target component type on the temperature cloud map.

[0022] In this solution, the temperature data of temperature points of the same component type are displayed separately, thereby facilitating fault analysis for users.

[0023] In one possible implementation, the temperature cloud map is a three-dimensional structure diagram formed based on multiple temperature points, and the display coordinates of the multiple temperature points are (x, y, z), where the x-coordinate and y-coordinate indicate the corresponding positions of the temperature points in the target device, and the z-coordinate indicates the temperature value of the temperature point.

[0024] In a possible implementation, the temperature cloud map includes a component distribution map, the three-dimensional structure map is arranged above the component distribution map, and the display coordinates of the temperature points indicate the positions of the temperature points in the component distribution map.

[0025] In a possible implementation, each of the multiple component types has at least one component; a temperature point corresponds to a component of any of the multiple component types, and the component type of the component corresponding to the temperature point is the component type corresponding to the temperature point.

[0026] In one possible implementation, the temperature point is configured to display one or more of the following when operated: an identifier of the component type corresponding to the temperature point, an identifier of the component corresponding to the temperature point, a temperature value of the temperature point, and a temperature alarm threshold value of the component corresponding to the temperature point.

[0027] In this solution, relevant information is displayed by operating the temperature point, making it convenient for users to view temperature information.

[0028] In a possible implementation, the temperature point is further configured to enter an alarm state when the temperature value of the temperature point exceeds a temperature alarm threshold value of a component corresponding to the temperature point when the temperature point is operated.

[0029] In a third aspect, embodiments of the present application provide a temperature display device comprising several modules, each of which is configured to perform each step of the temperature display method provided in the first aspect of the embodiments of the present application. The division of modules is not limited herein. The specific functions performed by each module of the temperature display device and the beneficial effects achieved are described in the respective steps of the temperature display method provided in the first aspect of the embodiments of the present application, and will not be further elaborated here.

[0030] For example, the temperature display device includes:

[0031] A cloud map determination module is used to determine a temperature cloud map of a target device; the temperature cloud map indicates the temperature distribution of the target device, and the temperature cloud map includes multiple temperature points, each of which indicates the temperature corresponding to various component types in the target device;

[0032] A receiving module, configured to receive the target component type to be queried;

[0033] a screening module, configured to determine at least one target temperature point corresponding to a target component type from a plurality of temperature points;

[0034] The display module is used to separately display at least one target temperature point on the temperature cloud map.

[0035] In a possible implementation, the target device includes multiple temperature sensors, and each temperature sensor corresponds to any one of multiple temperature points.

[0036] In one possible implementation, the temperature cloud map includes a three-dimensional structure diagram formed based on multiple temperature points, and the display coordinates of the multiple temperature points are (x, y, z), where the x-coordinate and the y-coordinate indicate the corresponding positions of the temperature points in the target device, and the z-coordinate indicates the temperature value of the temperature point.

[0037] In a possible implementation, the temperature cloud map includes a component distribution map, the three-dimensional structure map is arranged above the component distribution map, and the display coordinates of the temperature points indicate the positions of the temperature points in the component distribution map.

[0038] In a possible implementation, each of the multiple component types has at least one component; a temperature point corresponds to a component of any of the multiple component types, and the component type of the component corresponding to the temperature point is the component type corresponding to the temperature point.

[0039] In one possible implementation, the temperature point is configured to display one or more of the following when operated: an identifier of the component type corresponding to the temperature point, an identifier of the component corresponding to the temperature point, a temperature value of the temperature point, and a temperature alarm threshold value of the component corresponding to the temperature point.

[0040] In a possible implementation, the temperature point is further configured to enter an alarm state when the temperature value of the temperature point exceeds a temperature alarm threshold value of a component corresponding to the temperature point when the temperature point is operated.

[0041] In a possible implementation, the receiving module is configured to display a temperature cloud map in a temperature view, where the temperature view includes a query input box; and obtain a component type input in the query input box as a target component type.

[0042] In one possible implementation, the device further includes: an analysis module for obtaining other component types other than the target component type from a plurality of component types; and determining the correlation between the target type and other component types based on temperature data of temperature points corresponding to the target component type and other component types.

[0043] Fourthly, embodiments of the present application provide a temperature display device comprising several modules, each of which is configured to perform each step of the temperature display method provided in the second aspect of the embodiments of the present application. The division of modules is not limited herein. The specific functions performed by each module of the temperature display device and the beneficial effects achieved are described in the respective steps of the temperature display method provided in the second aspect of the embodiments of the present application, and will not be further elaborated here.

[0044] For example, the temperature display device includes:

[0045] The second display module is used to display a temperature view interface; the temperature view interface includes a query input box and a temperature cloud map of the target device, the temperature cloud map indicates the temperature distribution of the target device, and the temperature cloud map includes multiple temperature points, which indicate the temperatures corresponding to various component types in the target device;

[0046] A receiving module, configured to receive a target component type input in a query input box;

[0047] The third display module is used to separately display at least one target temperature point corresponding to the target component type on the temperature cloud map.

[0048] In one possible implementation, the temperature cloud map is a three-dimensional structure diagram formed based on multiple temperature points, and the display coordinates of the multiple temperature points are (x, y, z), where the x-coordinate and y-coordinate indicate the corresponding positions of the temperature points in the target device, and the z-coordinate indicates the temperature value of the temperature point.

[0049] In a possible implementation, the temperature cloud map includes a component distribution map, the three-dimensional structure map is arranged above the component distribution map, and the display coordinates of the temperature points indicate the positions of the temperature points in the component distribution map.

[0050] In a possible implementation, each of the multiple component types has at least one component; a temperature point corresponds to a component of any of the multiple component types, and the component type of the component corresponding to the temperature point is the component type corresponding to the temperature point.

[0051] In one possible implementation, the temperature point is configured to display one or more of the following when operated: an identifier of the component type corresponding to the temperature point, an identifier of the component corresponding to the temperature point, a temperature value of the temperature point, and a temperature alarm threshold value of the component corresponding to the temperature point.

[0052] In this solution, relevant information is displayed by operating the temperature point, making it convenient for users to view temperature information.

[0053] In a possible implementation, the temperature point is further configured to enter an alarm state when the temperature value of the temperature point exceeds a temperature alarm threshold value of a component corresponding to the temperature point when the temperature point is operated.

[0054] In a fifth aspect, an embodiment of the present application provides a temperature display device, comprising: at least one memory for storing programs; at least one processor for executing the programs stored in the memory, when the program stored in the memory is executed, the processor is used to execute the method provided in the first aspect, or to execute the method provided in the second aspect.

[0055] In a fourth aspect, an embodiment of the present application provides a temperature display device, characterized in that the device runs computer program instructions to execute the method provided in the first aspect, or the method provided in the second aspect. Exemplarily, the device can be a chip or a processor.

[0056] In one example, the apparatus may include a processor, which may be coupled to a memory, read instructions from the memory, and execute the method provided in the first aspect, or execute the method provided in the second aspect, according to the instructions. The memory may be integrated into a chip or processor, or may be independent of the chip or processor.

[0057] In a fifth aspect, an embodiment of the present application provides a computing device comprising: at least one memory for storing programs; and at least one processor for executing the programs stored in the memory. When the program stored in the memory is executed, the processor is used to execute the method provided in the first aspect, or to execute the method provided in the second aspect.

[0058] In a sixth aspect, an embodiment of the present application provides a computer storage medium, in which instructions are stored. When the instructions are executed on a computer, the computer executes the method provided in the first aspect, or executes the method provided in the second aspect.

[0059] In a seventh aspect, an embodiment of the present application provides a computer program product comprising instructions, which, when executed on a computer, enables the computer to execute the method provided in the first aspect, or to execute the method provided in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] FIG1 is a system architecture diagram of a display system provided in an embodiment of the present application;

[0061] FIG2 is a flow chart of a temperature point display method according to an embodiment of the present application;

[0062] FIG3 is a schematic diagram of a scenario in which a temperature sensor according to an embodiment of the present application detects the temperature of a component;

[0063] FIG4 a is a first schematic diagram of a three-dimensional spatial structure of temperature points and a temperature sensor provided in an embodiment of the present application;

[0064] FIG4 b is a schematic diagram of a three-dimensional spatial structure provided in an embodiment of the present application;

[0065] FIG4 c is a first schematic diagram of a three-dimensional spatial structure color provided by an embodiment of the present application;

[0066] FIG4 d is a second schematic diagram of the three-dimensional spatial structure color provided in an embodiment of the present application;

[0067] FIG4e is a second schematic diagram of the three-dimensional spatial structure of temperature points and temperature sensors provided in an embodiment of the present application;

[0068] FIG4 f is a schematic diagram of a display graph of temperature points provided in an embodiment of the present application;

[0069] FIG5 a is a schematic diagram of a display interface of a CPU temperature point provided by an embodiment of the present application;

[0070] FIG5 b is a schematic diagram of a display interface of temperature points of a hard disk provided in an embodiment of the present application;

[0071] FIG6 a is a schematic diagram of the first interface of a temperature cloud map provided in an embodiment of the present application;

[0072] FIG6 b is a second schematic diagram of the temperature cloud map interface provided in an embodiment of the present application;

[0073] FIG7 a is a schematic diagram of the temperature view interface provided by an embodiment of the present application;

[0074] FIG7b is a schematic diagram of an interface for operating the query input box in FIG7a;

[0075] FIG7c is a schematic diagram of the interface after reworking the CPU in FIG7b;

[0076] FIG7d is a schematic diagram of the first display interface for operating the temperature points of the CPU in FIG7c;

[0077] FIG7e is a second schematic diagram of the display interface for operating the temperature points of the CPU in FIG7c;

[0078] FIG8 is a second flow chart of the temperature point display method provided in an embodiment of the present application;

[0079] FIG9 is a third flow chart of a temperature point display method according to an embodiment of the present application;

[0080] FIG10 is a first structural diagram of a temperature point display device provided in an embodiment of the present application;

[0081] FIG11 is a second structural diagram of the temperature point display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0082] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0083] In the description of the embodiments of the present application, words such as "exemplary," "for example," or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary," "for example," or "for example" in the embodiments of the present application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary," "for example," or "for example" is intended to present the relevant concepts in a concrete manner.

[0084] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, B exists alone, and A and B exist at the same time. In addition, unless otherwise specified, the term "plurality" means two or more. For example, "multiple systems" refers to two or more systems, and "multiple terminals" refers to two or more terminals.

[0085] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly identifying the technical features being referred to. Thus, features specified as "first" or "second" may explicitly or implicitly include one or more of such features. The terms "include," "comprising," "having," and their variations all mean "including but not limited to," unless otherwise specifically emphasized.

[0086] The following is an explanation of some of the terms used in this embodiment. It should be noted that these explanations are for the purpose of facilitating understanding by those skilled in the art and are not intended to limit the scope of protection claimed in this application.

[0087] A 3D model is a polygonal representation of an object, typically displayed on a computer or other video device. The displayed object can be real-world or imaginary. Anything that exists in the physical world can be represented by a 3D model.

[0088] 3D temperature model: represents the 3D temperature model.

[0089] Basic Input / Output System (BIOS): The BIOS contains the initialization routines that run when the computer is turned on. The BIOS is stored in a read-only memory (ROM) chip on the motherboard. The contents of this chip are programmed using specialized manufacturing equipment before the computer leaves the factory. Once installed, the BIOS is permanently fixed and generally does not require modification. The BIOS is the first software run by the CPU.

[0090] The Baseboard Management Controller (BMC) is a dedicated controller used to monitor and manage servers. It has four main functions: ① Device information management: recording server information (model, manufacturer, date, component production and technical information, chassis information, motherboard information, etc.) and BMC information (server hostname, IP address, BMC firmware version, etc.); ② Server status monitoring and management: monitoring the health status of various server components (CPU, memory, hard disk, fan, chassis, etc.), including temperature and voltage, and adjusting fan speed in real time based on the temperature data collected at each temperature collection point to ensure the server does not overheat and control overall power consumption. Any abnormalities in single-board components are promptly reported to upper-level network management via various industry-standard protocols such as SNMP, SMTP, and Redfish. ③ Remote control and management of the server: server power on / off, reboot, maintenance, firmware updates, and system installation; ④ Maintenance management: log management, user management, BIOS management, and alarm management. The BMC consists of two parts: the BMC chip and the BMC firmware. The BMC chip is integrated into the motherboard or plugged into the motherboard via a PCI Express connector. This chip serves as the CPU for the BMC firmware, and its peripherals include its own RAM, Flash, and other peripherals. As soon as the server is plugged in, the BMC firmware quickly begins running. BMC firmware is a software program that runs on the BMC chip and can be thought of as software that runs as soon as the server is powered on. It doesn't rely on other system hardware (such as the CPU, memory, etc.) nor on the BIOS or OS. However, the BMC can interact with the BIOS and OS, enabling better platform management. The OS includes system management software that works in conjunction with the BMC for better management. Therefore, it can be seen that the BMC is a small operating system independent of the server system, responsible for implementing remote control, management, and monitoring functions for the server.

[0091] The present application embodiment proposes a temperature display method. This method matches the component type of a target device, such as a server, with the temperature points in a temperature cloud map. The same component type can correspond to multiple temperature points. When the temperature of a certain component type is to be observed, all temperature points corresponding to that component type are filtered based on the association between the component type and the temperature points, and all temperature points corresponding to that component type are displayed separately on the temperature cloud map. The present application embodiment facilitates fault analysis by separately displaying the temperature data of temperature points of the same component type.

[0092] For example, the target device may be a device capable of monitoring the temperature of its internal components, such as a server. The following embodiments of the present application will describe in detail the method for displaying temperature points provided by the server.

[0093] This is just a brief description of the method. For details about the method, please refer to the description below.

[0094] Next, the display system to which the temperature point display method provided in the embodiment of the present application may be applied is introduced. FIG1 shows an example diagram of the architecture of a display system provided in the embodiment of the present application. The embodiment of the present application provides a temperature point display method that can be applied to the system architecture diagram shown in FIG1 . As shown in FIG1 , the display system includes a terminal 101 and a server 102. It should be understood that the number of terminals 101 and servers 102 in FIG1 is merely schematic. Any number of terminals 101 and servers 102 may be provided according to implementation requirements.

[0095] Among them, the terminal 101 can be, but is not limited to, various personal computers, laptops, smart phones, tablet computers and portable wearable devices. Exemplary embodiments of the terminal devices involved in this solution include, but are not limited to, electronic devices equipped with iOS, Android, Windows, Harmony OS or other operating systems. The embodiments of this application do not specifically limit the type of electronic device. The terminal 101 can be various electronic devices, which can be screen devices or screenless devices. Including but not limited to smart phones, tablet computers, smart speakers, smart TVs, PCs (Personal Computers), wearable devices, etc.

[0096] The present embodiment provides a server 102. For example, the server 102 may be a computing device, such as a rack server. The server 102 may also be a computing node in the computing device, where a computing node is the smallest computing unit. The computing device may be a high-density server, a blade server, or a rack-mount server.

[0097] For example, as shown in FIG1 , the server 102 may include a power supply 121 and a mainboard 110 . The power supply 121 is electrically connected to the mainboard 110 to supply power to devices connected to the mainboard 110 .

[0098] Exemplarily, the devices connected to the motherboard 110 include a processor 111, a memory 112, a programmable logic device (PLD) 113, a baseboard management controller (BMC) 114, a PCIE slot 115, a network card 122, a hard disk 123, a hard disk backplane 124, and a fan 125.

[0099] The processor 111 may include a central processing unit (CPU), other general-purpose processors, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor.

[0100] Memory 112 may be implemented as a memory stick that is inserted into a memory slot on motherboard 110 , and memory 112 is used for external high-speed cache. For example, memory 112 may be random access memory (RAM). By way of example and not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM).

[0101] Among them, the PCIE slot 115 is suitable for expanding at least one of a GPU card, a network card, a video capture card, an HBA (Host Bus Adapter) card, a RAID (redundant arrays of independent disks) card, and an SSD (solid state disk or solid state drive), and can also support the expansion of various adapter cards.

[0102] The programmable logic device 113 may be a complex logic device (CPLD, a digital integrated circuit in which users construct logic functions according to their own needs) or a field programmable gate array (FPGA).

[0103] The hard disk 123 may be a hard disk drive (HDD) or a solid state drive (SSD). It should be understood that the hard disk 123 is merely an example of a non-volatile memory and does not constitute a specific limitation. In actual applications, a non-volatile memory may be selected based on actual circumstances.

[0104] The hard disk backplane 124 can be plugged into the hard disk 123 .

[0105] It should be noted that FIG1 is merely an example of the server 102 and does not constitute a specific limitation. In actual applications, more or fewer devices than those in FIG1 may be included.

[0106] In the embodiment of the present application, the server 102 includes multiple component types, which may include a processor 111, memory 112, PLD 113, BMC 114, a PCIE card inserted into a PCIE slot 115, a network card 122, a hard disk 123, a hard disk backplane 125, a fan 125, etc. These are merely examples of components and do not constitute a specific limitation. The specific components can be determined in combination with the specific structure of the server 102. It should be noted that there can be multiple components under each component type. For example, the component type can be processor 111, and there can be multiple processors 111 in the server 102.

[0107] The terminal 101 can communicate with the server 102 via a network. The network can be a wired network and / or a wireless network. It is understood that the network can use any known network communication protocol to achieve different communications, and the network communication protocol can be various wired and / or wireless communication protocols. The network can use any known network communication protocol to achieve different communications, and the network communication protocol can be various wired communication protocols.

[0108] Next, in combination with the display system provided above, a temperature point display method provided in an embodiment of the present application is introduced in detail.

[0109] FIG2 is a flow chart of a method for displaying temperature points according to an embodiment of the present application. This embodiment can be applied to a display system. The present embodiment is described using a terminal 101 and a server 102 as an example. As shown in FIG2 , the method for displaying temperature points according to an embodiment of the present application includes at least the following steps:

[0110] Step 201: The terminal 101 sends a temperature reporting request to the server 102; the temperature reporting request includes: requesting to obtain the location of each temperature sensor of the server 102, the collected temperature value, and the corresponding component type.

[0111] Step 202 : The server 102 sends the location of each temperature sensor in the server 102 , the collected temperature value, and the corresponding component type to the terminal 101 .

[0112] In some possible scenarios, the terminal 101 may access the BMC 114 of the server 102 and configure the temperature sensors, component types, and the corresponding relationships between the components in the BMC 114 .

[0113] The position of the temperature sensor can be understood as the position of the temperature sensor on the server 102 in the coordinate space of the server 102. The coordinate space of the server 102 can be a plane space constructed with the center position of the server 102 or the intersection position of the edge lines as the origin, assuming that the plane is formed by the x-axis and the y-axis. The x-coordinate and y-coordinate of the temperature sensor in the plane space indicate the position of the temperature sensor in the server 102.

[0114] It should be noted that each temperature sensor corresponds to a component type and a component under that component type. The temperature sensors are distributed among the components, and the temperature values ​​they collect can be considered the temperature values ​​of the components to which they correspond. It is worth noting that there can be one or more components of the same component type in the server 102. The position of the temperature sensor is fixed, and it generally collects the temperature value of one component, so it is necessary to establish a relationship between the temperature sensor and the component. In specific implementations, different components of the same component type can be distinguished by component identifiers. For example, there can be two processors 111, and the component types of these two processors 111 can be CPU. The component identifier of one processor 111 can be CPU1, and the component identifier of the other can be CPU2.

[0115] In some possible scenarios, as shown in FIG3 , server 102 may include multiple temperature sensors, with different temperature sensors used to detect the temperature values ​​of corresponding components in real time, such as inlet air temperature, hard disk temperature, hard disk backplane temperature, CPU temperature, memory temperature, PCIe card temperature, outlet air temperature, etc. The distribution of component temperature locations shown in FIG3 may reflect the distribution of temperature sensor locations. In a specific implementation, server 102 may send the temperature values ​​collected by the temperature sensors to BMC 114 , which in turn sends the temperature values ​​collected by the temperature sensors, the pre-configured locations of each temperature sensor, the corresponding component type, and the corresponding component to terminal 101 .

[0116] In step 203 , the terminal 101 constructs a temperature cloud map of the server 230 based on the temperature value and position collected by each temperature sensor. The temperature cloud map includes multiple temperature points, which indicate temperatures corresponding to various component types in the target device.

[0117] In an embodiment of the present application, as shown in FIG4a, a temperature cloud map may include a three-dimensional structure diagram formed based on multiple temperature points. For each temperature point, the temperature point may correspond to a temperature sensor and a three-dimensional spatial structure. In a specific implementation, the three-dimensional spatial structure corresponding to each temperature point is connected to form a three-dimensional structure diagram. The three-dimensional spatial structure is a structure formed by connecting the temperature point and multiple points around the temperature point, which can reflect the temperature changes of the temperature sensor corresponding to the temperature point and its surrounding area. The three-dimensional spatial structure and the temperature sensor corresponding to the temperature point are also corresponding. It should be noted that, considering that the temperature generally spreads symmetrically from the highest point to the surrounding area and decreases gradually, the three-dimensional spatial structure can be a bilaterally symmetrical protrusion, with the temperature point located at the highest point of the protrusion, so as to more realistically reflect the temperature changes of the temperature sensor and its surrounding area. For example, the shape of the side of the protrusion can be shown in FIG4b, and the bottom contour of the protrusion can be a circle as shown in FIG4b. It is worth noting that the three-dimensional spatial structures of different temperature sensors, such as the shape of the protrusion contour, can be the same or similar, or different, but generally they are similar. In addition, when the three-dimensional spatial structures of multiple temperature sensors, such as protrusions, overlap, the points on the contour within the overlapping range can be retained, which can also be understood as retaining the points on the overlapping line, so as to more realistically reflect the actual temperature situation.

[0118] Specifically, the three-dimensional structure diagram is composed of multiple points, each of which has three-dimensional coordinates (x, y, z) in a spatial rectangular coordinate system; wherein, the three-dimensional structure diagram can be a vector image or a bitmap, and the embodiments of the present application do not make specific limitations on this, and the specific details can be determined in combination with actual needs. The multiple points in the three-dimensional structure diagram include temperature points, and the display coordinates of the temperature points are (x, y, z); as mentioned above, the temperature point and the multiple points at the positions around the point are connected to form a three-dimensional spatial structure with a certain shape, such as a bulge. Correspondingly, the bulge formed by all the temperature points of the server 102 and the points around it constitutes the three-dimensional structure diagram.

[0119] Exemplarily, the (x, y) coordinates of a temperature point indicate the position of the temperature sensor corresponding to the temperature point in the server 102. Specifically, the position of the temperature sensor needs to be mapped to the temperature cloud map to obtain the temperature point; the z-axis coordinate of the temperature point can indicate the size of the temperature value collected by the temperature sensor. In the embodiment of the present application, the higher the actual temperature of the temperature sensor, the larger the z-axis coordinate of the temperature point. It is worth noting that if the (x, y) coordinates of the temperature sensors are the same, then the temperature points corresponding to these temperature sensors are the same, and the temperature points correspond to multiple temperature sensors with the same (x, y) coordinates; for example, the server 102 includes a hard disk backplane, and each of the three hard disk slots in the hard disk backplane is provided with a temperature sensor, for a total of three temperature sensors, and the (x, y) coordinates of the three temperature sensors are the same; in this case, when constructing the three-dimensional spatial structure of the temperature point, the maximum temperature value collected by the corresponding multiple temperature sensors is selected to determine the z-axis coordinate of the temperature point. It should be noted that the z-axis coordinate is used to indicate the size of the temperature value collected by the temperature sensor only as an example and does not constitute a specific limitation. For example, the x-axis coordinate and the y-axis coordinate can also be used. The embodiment of the present application takes the z-axis coordinate as an example to introduce the solution provided in the embodiment of the present application.

[0120] Exemplarily, the z-axis coordinate of a temperature point can be a temperature value collected by a temperature sensor, or a value obtained by weighting the temperature value collected by the temperature sensor. The specific weighting method can be set based on actual conditions. For example, in some possible implementations, assume that server 102 has a global alarm threshold value and component temperature alarm threshold values. The global alarm threshold value can be pre-set or obtained by weighting the temperature alarm threshold values ​​of each component in server 102. The component temperature alarm threshold value can be configured based on actual conditions or historical experience, or can be pre-configured in the BIOS before server 102 leaves the factory. It should be noted that the temperature alarm threshold values ​​of different components of the same component type are generally the same. In some possible scenarios, server 102 can access the configuration of each component in the BIOS to obtain the temperature alarm threshold values ​​of multiple components in server 102 and report them to terminal 101. In addition, the global alarm threshold value can include one or more threshold values; the component temperature alarm threshold value can include one or more threshold values, and the number of temperature alarm threshold values ​​is the same as the number of global alarm threshold values.

[0121] In one possible scenario, there is only one global alarm threshold value, which can be called global alarm threshold value A; there is also only one temperature alarm threshold value for a component, which can be called temperature alarm threshold value B. Then, the z-axis coordinate y of the temperature point can be calculated using the following formula (1).

[0122] In one possible scenario, there are two global alarm threshold values, which can be referred to as the first global alarm threshold value A1 and the second global alarm threshold value A2 for ease of description and distinction; correspondingly, there are also two temperature alarm threshold values ​​for the component, which can be referred to as the first temperature alarm threshold value B1 and the second temperature alarm threshold value B2; the first temperature alarm threshold value B1 is less than the second temperature alarm threshold value B2; wherein the first global alarm threshold value A1 can be a global minor alarm threshold value, which can be pre-set, or can be obtained by weighting the first temperature alarm threshold value B1 of each component of the server 102, and the second global alarm threshold value A2 can be a global serious alarm threshold value, which can be pre-set, or can be obtained by weighting the second temperature alarm threshold value B2 of each component of the server 102; the first temperature alarm threshold value B1 can be the minor alarm threshold value of the component, and the second temperature alarm threshold value B2 can be the serious alarm threshold value of the component. In a specific implementation, for each temperature sensor, when the temperature value T collected by the temperature sensor does not exceed the second temperature alarm threshold value B2 of the corresponding component, the weighted temperature value y can be calculated by the following formula (2); when the temperature value T collected by the temperature sensor exceeds the second temperature alarm threshold value B2 of the corresponding component, the weighted temperature value y is calculated by the following formula (3).

[0123] It is worth noting that, in the scenario where a temperature point is associated with multiple temperature sensors with the same (x, y) coordinates, and the z-axis coordinate of the temperature point is determined based on the maximum temperature value collected by the multiple temperature sensors associated with the temperature point, when determining the z-axis coordinate of the temperature point, the maximum temperature value collected by the multiple temperature sensors associated with the temperature point and the temperature alarm threshold value of the component corresponding to the temperature sensor collecting the maximum temperature value can be considered. For example, assuming that the temperature point is associated with three temperature sensors, and the three temperature sensors are respectively associated with hard disks: Disk1, Disk2, and Disk3, and the temperature values ​​collected by the three temperature sensors are: 40, 39, and 32, then the z-axis coordinate of the temperature point can be determined based on the temperature value: 40. Assuming that the component corresponding to the temperature sensor collecting the temperature value 40 is Disk3, the temperature value: 40 can also be weighted based on the collected temperature value 40 and the temperature alarm threshold value of Disk3 using the above formula (1), (2), or (3).

[0124] In addition, in order to enable the three-dimensional structure diagram to intuitively reflect the temperature of the internal temperature sensor of the server 102 and its surroundings, each point in the three-dimensional structure diagram can be rendered into a suitable color, so that the three-dimensional spatial structure corresponding to the temperature sensor, such as the protrusion, has color. The color can reflect whether an alarm is issued. For example, an alarm is issued when the temperature value collected by the temperature sensor exceeds the temperature alarm threshold value of the component corresponding to the temperature sensor.

[0125] In some possible implementations, the temperature warning threshold value of a component may include one or more threshold values.

[0126] For example, assuming the three-dimensional spatial structure is a protrusion and the component has only one temperature alarm threshold, then for each protrusion corresponding to a temperature sensor, the color of the first surface of the protrusion representing the area below the temperature alarm threshold of the component corresponding to the temperature sensor is the first color; the color of the second surface of the protrusion representing the area above the temperature alarm threshold of the component corresponding to the temperature sensor gradually changes from the first color to the second color. The first color and the second color are different; for example, the first color can be green, and the second color can be yellow or red. It should be noted that if the z-axis coordinate of the temperature point represents the temperature value collected by the temperature sensor, then the area on the protrusion whose height is below the temperature alarm threshold of the component corresponding to the temperature sensor is the area on the protrusion representing the area below the temperature alarm threshold of the component corresponding to the temperature sensor; and the area on the protrusion whose height is above the temperature alarm threshold of the component corresponding to the temperature sensor is the area on the protrusion representing the area above the temperature alarm threshold of the component corresponding to the temperature sensor. If the z-axis coordinate of the temperature point is calculated using the above formula (1), the area on the protrusion whose height is lower than the global alarm threshold value A is the area on the protrusion that represents a temperature lower than the temperature alarm threshold value of the component corresponding to the temperature sensor; the area on the protrusion whose height is greater than the global alarm threshold value is the area on the protrusion that represents a temperature greater than the temperature alarm threshold value of the component corresponding to the temperature sensor.

[0127] For example, as shown in Figure 4c, for temperature sensor 1, the vertex height of protrusion 1 is greater than the global alarm threshold value A, the color of the first surface of the area on protrusion 1 where the height is lower than the global alarm threshold value A is the first color, and the color of the second surface of the area on protrusion 1 where the height is higher than the global alarm threshold value A gradually changes from the first color to the second color; for temperature sensor 2, the vertex height of protrusion 2 is less than the global alarm threshold value A, and the color of protrusion 2 is the first color.

[0128] In one example, assuming the three-dimensional structure is a protrusion, the component can have two temperature alarm thresholds: a first temperature alarm threshold B1 and a second temperature alarm threshold B2. For each temperature sensor corresponding to the protrusion, the color of the first surface of the protrusion, representing the area below the first temperature alarm threshold B1 of the component corresponding to the temperature sensor, is the first color. The color of the second surface of the protrusion, representing the area above the first temperature alarm threshold B1 and below the second temperature alarm threshold B2 of the component corresponding to the temperature sensor, gradually changes from the first color to the second color. The color of the third surface of the protrusion, representing the area above the second temperature alarm threshold B2 of the component corresponding to the temperature sensor, gradually changes from the second color to the third color. The first, second, and third colors are different. For example, the first color can be green, the second color can be yellow, and the third color can be red. It should be noted that, if the z-axis coordinate of the temperature point represents the temperature value collected by the temperature sensor, the area on the protrusion whose height is lower than the first temperature alarm threshold value B1 of the component corresponding to the temperature sensor is the area on the protrusion indicating that the temperature is lower than the first temperature alarm threshold value B1 of the component corresponding to the temperature sensor; the area on the protrusion whose height is greater than the first temperature alarm threshold value B1 of the component corresponding to the temperature sensor and less than the second temperature alarm threshold value B2 is the area on the protrusion indicating that the temperature is greater than the first temperature alarm threshold value B1 of the component corresponding to the temperature sensor and less than the second temperature alarm threshold value B2; the area on the protrusion whose height exceeds the second temperature alarm threshold value B2 of the component corresponding to the temperature sensor is the area on the protrusion indicating that the temperature exceeds the part corresponding to the temperature sensor. The area on the protrusion where the height is greater than the first global alarm threshold value A1 and less than the second global alarm threshold value A2 is the area on the protrusion where the temperature is greater than the first global alarm threshold value A1 and less than the second global alarm threshold value A2, and the area on the protrusion where the height is greater than the first global alarm threshold value A1 and less than the second global alarm threshold value A2 is the area on the protrusion where the temperature is greater than the first temperature alarm threshold value B1 and less than the second temperature alarm threshold value B2 of the component corresponding to the temperature sensor; and the area on the protrusion where the height exceeds the second global alarm threshold value A2 is the area on the protrusion where the temperature is greater than the second temperature alarm threshold value B2 of the component corresponding to the temperature sensor.

[0129] Exemplarily, as shown in Figure 4d, for temperature sensor 1, the vertex height of protrusion 1 is greater than the second global alarm threshold value A2, the color of the first surface of the area on protrusion 1 whose height is lower than the first global alarm threshold value A1 is the first color, the color of the second surface of the area on protrusion 1 whose height is higher than the first global alarm threshold value A1 and lower than the second global alarm threshold value A2 gradually changes from the first color to the second color, and the color of the third surface of the area on protrusion 1 whose height exceeds the second global alarm threshold value A2 gradually changes from the second color to the third color; for temperature sensor 2, the vertex height of protrusion 2 is greater than the first global alarm threshold value A1 and less than the second global alarm threshold value A2, then the color of the first surface of the area on protrusion 2 whose height is lower than the first global alarm threshold value A1 is the first color, and the color of the second surface of the area on protrusion 2 whose height is higher than the first global alarm threshold value A1 and lower than the second global alarm threshold value A2 gradually changes from the first color to the second color.

[0130] In the implementation of this application, in order to make the temperature cloud map more accurately reflect the temperature changes of the components inside the server 102, the temperature cloud map may also include a component distribution map. In specific implementation, the component distribution map may be constructed by the terminal 101.

[0131] The component distribution map indicates the distribution of each server component. The temperature cloud map can also be used to indicate the location of temperature sensors. Furthermore, the location of each temperature sensor in the component distribution map can be represented by its three-dimensional coordinates (x, y, z). In some scenarios, the z-axis coordinate of a temperature sensor can be 0. The (x, y) coordinates of a temperature sensor are the same as the (x, y) coordinates of the corresponding temperature point.

[0132] There are two ways to mark the location of the temperature sensor in the component distribution diagram.

[0133] Method 1: The terminal 101 may determine the position of the temperature sensor in the component distribution map based on the position of the temperature sensor (indicating the position of the temperature sensor in the server 102 ) and mark it in the component distribution map to obtain the component distribution map actually used.

[0134] Method 2: Without considering the location of the temperature sensor, the terminal 101 can directly obtain a component distribution map with the location of the temperature sensor marked.

[0135] The three-dimensional structure diagram and the component distribution diagram are in the same spatial rectangular coordinate system. The three-dimensional structure diagram can be set above the component distribution diagram or on the component distribution diagram. The embodiment of the present application does not intend to limit the spatial position relationship between the three-dimensional structure diagram and the component distribution diagram. It can be flexibly set in combination with actual needs. In order to facilitate understanding of the solution provided by the embodiment of the present application, the following description is taken as an example of the three-dimensional structure diagram being set above the component distribution diagram. Specifically, as shown in Figure 4e, the three-dimensional structure diagram can include a three-dimensional spatial structure vertically above the position of the temperature sensor in the component distribution diagram. The three-dimensional spatial structure can be a protrusion with an opening facing the component distribution diagram. In summary, the component distribution diagram can facilitate users to understand the component distribution and the temperature differences between components more clearly and intuitively, and facilitate a more comprehensive understanding of temperature issues.

[0136] Among them, temperature points are used to mark key locations. In the embodiment of the present application, they can be used to mark the location of temperature sensors. In some possible situations, the temperature points are configured to display relevant information of the temperature points under user operation, such as the temperature value collected by the temperature sensor, the temperature alarm threshold value of the corresponding component, and other information, so that users can easily view and understand the temperature situation. In addition, the temperature points can also be configured to enter an alarm state when the temperature collected by the corresponding temperature sensor exceeds the temperature threshold value of the corresponding component. The alarm state can be flashing, highlighted, etc., and the specific design can be based on actual needs.

[0137] In some possible cases, the temperature point may have a display graphic. The display graphic may enter an alarm state when the temperature collected by the temperature sensor is high, such as exceeding the temperature alarm threshold value of the component. The alarm state may be flashing, highlighted, etc., and may be specifically designed in combination with actual needs. In one example, the display graphic may include various graphics such as circles, ellipses, cones, etc. that are convenient for user perception. This may be determined in combination with actual needs, and the embodiments of the present application do not specifically limit this. In a scene where the temperature cloud map includes a component distribution map, the component distribution map is marked with the position of the temperature sensor, and the three-dimensional structure map is set above the component distribution map, as shown in Figure 4f, the display graphic of the temperature point may include a dotted line (or a solid line, which may be set in combination with actual conditions) and a protruding pattern connected by the dotted line. The dotted line may start from the position of the temperature sensor in the component distribution map and extend to the temperature point on the three-dimensional structure map. The position of the temperature point is then connected to the protruding pattern, so that the user can understand the corresponding relationship between the position of the temperature sensor in the component distribution map and the temperature point on the three-dimensional structure map.

[0138] It is worth noting that the (x, y) coordinates of the temperature point represent the position of the temperature sensor corresponding to the temperature point, and the z-axis coordinate of the temperature point indicates the size of the temperature value collected by the temperature sensor; correspondingly, in the scenario where the temperature point is associated with multiple temperature sensors with the same (x, y) coordinates, the temperature point is configured to display relevant information of the temperature point under the condition of user operation, such as the temperature value collected by each corresponding temperature sensor, the temperature alarm threshold value of the corresponding component, and other information, so as to facilitate users to check and understand the temperature situation.

[0139] For example, assuming that the temperature point associated with the CPU is clicked, a display interface can be displayed, as shown in Figure 5a. The display interface shows the current temperature value of the CPU: 49, and the threshold value of the CPU's severe alarm: 120; wherein the current temperature value of the CPU is the temperature collected by the temperature sensor corresponding to the temperature point.

[0140] For example, the temperature point is associated with three temperature sensors, which are respectively associated with the hard disks: Disk41, Disk40, and Disk BP2. Clicking the temperature point will display the display interface, as shown in Figure 5b. The display interface shows the current temperature values ​​of Disk41, Disk40, and Disk BP2: 40, 39, and 32, as well as the minor alarm threshold value of the hard disk: 48 and the severe alarm threshold value: 5.

[0141] In some possible implementations, in an embodiment of the present application, terminal 101 can construct a three-dimensional structural diagram based on the temperature values ​​collected by each temperature sensor; then, based on the three-dimensional structural diagram, the component distribution diagram, and the location of each temperature sensor, a temperature cloud map can be determined. The temperature cloud map can be understood as a three-dimensional temperature model; exemplarily, as shown in Figures 6a and 6b, the temperature cloud map includes a component distribution diagram 310, a three-dimensional structure 320, and temperature points 330, wherein the component distribution diagram 310 includes the location 311 of the temperature sensor, and the three-dimensional structure 320 includes a protrusion 321.

[0142] Step 204 : The terminal 101 displays the temperature cloud map of the server 102 .

[0143] In actual applications, the terminal 101 may display a temperature cloud map in a temperature view, where the temperature view may be understood as a user interface (UI).

[0144] Step 205: Terminal 101 receives the target component type to be queried.

[0145] In actual application, as shown in FIG7a , the temperature view may include a query input box 340 for component types, and the component type entered in the query input box is used as the target component type. For example, by clicking the query input box 340 , a list of component types may be displayed. A component type in the list may be selected, and the selected component type may be entered in the query input box 340 . For example, as shown in FIG7b , by clicking the query input box 340 , a list of component types may be displayed. The list includes multiple selectable component types: CPU, Add-in card (for PCIe card), Power Supply, Main Board, Disk, DIMM, and the component type in the list may be selected: CPU. As shown in FIG7c , the selected component type may be entered in the query input box 340 .

[0146] Step 206: The terminal 101 determines at least one target temperature point corresponding to the target component type from the multiple temperature points.

[0147] It should be noted that the terminal 101 stores the component type corresponding to each of the multiple temperature points. After obtaining the target component type, one or more target temperature points corresponding to the target component type can be directly filtered out from the multiple temperature points.

[0148] Step 207: The terminal 101 displays at least one target temperature point separately on the temperature cloud map.

[0149] In a specific implementation, as shown in Figure 7c, after entering the component type "CPU" in the component type query input box 340, the temperature cloud chart displays four temperature points associated with the CPU. Subsequently, relevant information about each target temperature point can be viewed, such as temperature information and component temperature alarm thresholds. For example, as shown in Figures 7d and 7e, after clicking a temperature point associated with the CPU, the display interface 350 displays the component name, current temperature value, and critical CPU temperature value.

[0150] In this solution, the temperature data of temperature points of the same component type are displayed simultaneously, thereby facilitating fault analysis for the user.

[0151] In some possible scenarios, the terminal 101 may also include the following content:

[0152] Based on the temperature sensors and component types corresponding to the multiple temperature points, the terminal 101 determines at least one target temperature sensor corresponding to the target component type from the multiple temperature sensors; obtains temperature data collected by the at least one target temperature sensor, thereby facilitating subsequent temperature analysis.

[0153] In some other possible scenarios, the terminal 101 may further analyze the relationship between different component types. Specifically, the terminal 101 may further include the following content:

[0154] The terminal 101 obtains other component types other than the target component type from the plurality of component types; and determines the correlation between the target component type and the other component types based on the temperature data of the temperature points corresponding to the target component type and the other component types.

[0155] Among them, other component types are any component types other than the target component type among the multiple component types. For example, other component types can be component types related to the target component type pre-configured by the terminal 101. For example, if the target component type is a CPU, then other component types can be memory, hard disk, etc., so as to facilitate the user to perform temperature analysis. In this implementation, by analyzing the temperature data of the temperature points of the target component type and the other component types, it is analyzed whether the target component type and the other component types have temperature alarms at the same time. If so, it can be determined that the correlation between the target type and the other component types is high; otherwise, the correlation is low. Alternatively, the number of times the target component type and the other component types have temperature alarms at the same time within a certain period of time is analyzed. The more times, the higher the correlation. When the number is equal to 0, it can be determined that the correlation between the target type and the other component types is low.

[0156] It is worth noting that the temperature cloud map generated by terminal 101 is only used as an example. In some possible scenarios, when the temperature cloud map requires a large computing overhead, steps 201 to 204 can be executed through the management node; subsequently, the management node sends the temperature cloud map to terminal 101, and terminal 101 only needs to render the temperature cloud map, which can reduce the computing overhead of terminal device 101 to a certain extent and improve user experience.

[0157] Based on the same concept as the embodiment of the present invention, the embodiment of the present invention also provides a method for displaying temperature points. FIG8 is a flow chart of the method for displaying temperature points provided by the embodiment of the present invention. This embodiment can be applied to terminal 101. As shown in FIG8, the method for displaying temperature points provided by the embodiment of the present invention includes at least the following steps:

[0158] Step 801: Determine a temperature cloud map of a target device. The temperature cloud map indicates the temperature distribution of the target device. The temperature cloud map includes multiple temperature points, and the multiple temperature points indicate temperatures corresponding to various component types in the target device.

[0159] For example, the target device may be server 102. The target device may include multiple temperature sensors, each of which is distributed within a component type and corresponds to any one of multiple temperature points. The location of each temperature point in the target device corresponds to the location of the component type corresponding to that temperature point. It should be noted that different temperature points may correspond to the same component type. For such multiple temperature points, the locations of the multiple temperature points indicate different locations of the component type on the target device.

[0160] The temperature cloud map is a three-dimensional structure formed by multiple temperature points. The coordinates of each temperature point are (x, y, z), where the x and y coordinates indicate the corresponding position of the temperature point on the target device, and the z coordinate indicates the temperature value of the temperature point. The corresponding position of the temperature point on the target device can be understood as the position of the temperature point relative to other components on the target device.

[0161] In some possible cases, the temperature cloud map also includes a component distribution map, with the three-dimensional structure map positioned above the component distribution map. For example, the three-dimensional structure map includes a projection above the (x, y) position of a temperature point, and the displayed coordinates (x, y, z) of the temperature point indicate the position of the component type corresponding to the temperature point in the component distribution map. Accordingly, the temperature cloud map may be as shown in FIG. 6a . The method for determining the temperature cloud map can be found in the description of step 203 above.

[0162] Step 802: Receive the target component type to be queried.

[0163] Exemplarily, a temperature cloud graph is displayed in a temperature view, which includes a query input box. The component type input in the query input box is obtained as the target component type. For details, please refer to the description of step 205 above.

[0164] Step 803: Determine at least one target temperature point corresponding to the target component type from the multiple temperature points.

[0165] For details, please refer to the above description of step 206.

[0166] Step 804: Display at least one target temperature point separately on the temperature cloud map.

[0167] For details, please refer to the above description of step 207.

[0168] In this solution, the temperature data of temperature points of the same component type are displayed separately, thereby facilitating fault analysis for users.

[0169] According to one possible implementation, the method further includes: determining, from the multiple temperature sensors, at least one target temperature sensor corresponding to the target component type based on the temperature sensors and component types corresponding to the multiple temperature points; and obtaining temperature data collected by the at least one target temperature sensor to facilitate subsequent temperature analysis.

[0170] According to a possible implementation, each of the multiple component types has at least one component; a temperature point corresponds to a component of any of the multiple component types, and the component type of the component corresponding to the temperature point is the component type corresponding to the temperature point.

[0171] In this implementation, the temperature point is configured to display one or more of the following when operated: the identification of the component type corresponding to the temperature point, the identification of the component corresponding to the temperature point, the temperature value of the temperature point, and the temperature alarm threshold value of the component corresponding to the temperature point.

[0172] In one example of the method, the temperature point is further configured to enter an alarm state when being operated and the temperature value of the temperature point exceeds the temperature alarm threshold value of the component corresponding to the temperature point. The alarm state can be highlighted, flashing, etc.

[0173] According to one possible implementation, the method further includes: obtaining component types other than the target component type from the plurality of component types; and determining a correlation between the target component type and the other component types based on temperature data corresponding to temperature points of the target component type and the other component types. Subsequently, the correlation is displayed to facilitate temperature analysis by a user.

[0174] Among them, the "other component type" is any component type other than the target component type among the multiple component types. In this implementation, by analyzing the temperature data of the temperature points of the target component type and the other component types, it is determined whether the target component type and the other component types have temperature alarms at the same time. If so, it can be determined that the correlation between the target component type and the other component types is high; otherwise, the correlation is low. Alternatively, the number of times the target component type and the other component types have temperature alarms at the same time within a certain period of time is analyzed. A greater number of times indicates a higher correlation. When the number is 0, it can be determined that the correlation between the target type and the other component types is low.

[0175] In some possible scenarios, the other component types may be component types related to the pre-configured target component type. For example, if the target component type is a CPU, the other component types may be a memory or a hard disk.

[0176] Based on the same concept as the embodiment of the method of the present application, the embodiment of the present application also provides a method for displaying temperature points. FIG9 is a flow chart of the method for displaying temperature points provided by the embodiment of the present application. This embodiment can be applied to terminal 101. As shown in FIG9, a method for displaying temperature points provided by the embodiment of the present application includes at least the following steps:

[0177] Step 901, display the temperature view interface; the temperature view interface includes a query input box and a temperature cloud map of the target device, the temperature cloud map indicates the temperature distribution of the target device, the temperature cloud map includes multiple temperature points, and the multiple temperature points indicate the temperatures corresponding to various component types in the target device.

[0178] For example, the target device may be server 102. The target device may include multiple temperature sensors, each of which is distributed within a component type and corresponds to any one of multiple temperature points. The location of each temperature point in the target device corresponds to the location of the component type corresponding to that temperature point. It should be noted that different temperature points may correspond to the same component type. For such multiple temperature points, the locations of the multiple temperature points indicate different locations of the component type on the target device.

[0179] For example, a temperature cloud map can be seen in Figure 7a. In some possible scenarios, the temperature cloud map includes a three-dimensional structure diagram based on multiple temperature points. The display coordinates of the multiple temperature points are (x, y, z), where the x and y coordinates indicate the corresponding position of the temperature point on the target device, and z indicates the temperature value of the temperature point. The corresponding position of the temperature point on the target device can be understood as the position of the temperature point relative to other components on the target device.

[0180] In some possible cases, the temperature cloud map also includes a component distribution map, and the three-dimensional structure map is disposed above the component distribution map. For example, the three-dimensional structure map includes a protrusion above the (x, y) position of a temperature point, and the displayed coordinates of the temperature point indicate the position of the temperature point in the component distribution map. Accordingly, the temperature cloud map may be as shown in FIG. 6a. The method for determining the temperature cloud map can be described in the above description of step 203.

[0181] Step 902: Receive the target component type input in the query input box.

[0182] Illustratively, the target component type may be the component type input by the user in the query input box. For details, please refer to the description of step 205 above.

[0183] Step 903: separately display at least one target temperature point corresponding to the target component type on the temperature cloud map.

[0184] For details, please refer to the above description of step 206 and step 207.

[0185] In this solution, the temperature data of temperature points of the same component type are displayed separately, thereby facilitating fault analysis for users.

[0186] Based on the same concept as the embodiment of the method of the present invention, the embodiment of the present application also provides a temperature point display device. The temperature point display device includes several modules, each of which is used to perform each step of the temperature point display method provided in the embodiment of the present application. The division of the modules is not limited here. Those skilled in the art will clearly understand that in actual applications, the various steps of the temperature point display method provided in the embodiment of the present application can be assigned to different modules as needed, that is, the internal structure of the device can be divided into different modules to complete all or part of the functions described above. The modules in the embodiment can be integrated into a processing unit, or each unit can exist physically separately, or two or more modules can be integrated into a unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the modules are only for the convenience of distinguishing each other and are not used to limit the scope of protection of the present invention. The specific working process of the modules in the above-mentioned device can refer to the corresponding process in the aforementioned method embodiment and will not be repeated here.

[0187] For example, a temperature point display device is used to perform the temperature point display method provided in an embodiment of the present application. FIG10 is a schematic structural diagram of a temperature point display device provided in an embodiment of the present application. As shown in FIG10 , the temperature point display device provided in an embodiment of the present application includes:

[0188] A cloud map determining module 1001 is configured to determine a temperature cloud map of a target device. The temperature cloud map indicates the temperature distribution of the target device. The temperature cloud map includes multiple temperature points, each of which indicates the temperatures corresponding to various component types in the target device.

[0189] The first receiving module 1002 is configured to receive a target component type to be queried;

[0190] A screening module 1003 is configured to determine at least one target temperature point corresponding to a target component type from a plurality of temperature points;

[0191] The first temperature point display module 1004 is configured to separately display at least one target temperature point on the temperature cloud graph.

[0192] For example, a temperature point display device is used to perform the temperature point display method provided in an embodiment of the present application. FIG11 is a schematic structural diagram of a temperature point display device provided in an embodiment of the present application. As shown in FIG11 , the temperature point display device provided in an embodiment of the present application includes:

[0193] The second display module 1101 is used to display a temperature view interface; the temperature view interface includes a query input box and a temperature cloud map of the target device, which indicates the temperature distribution of the target device. The temperature cloud map includes multiple temperature points, which indicate the temperatures corresponding to various component types in the target device;

[0194] Receiving module 1102, for receiving the target component type input in the query input box;

[0195] The third display module 1103 is configured to separately display at least one target temperature point corresponding to the target component type on the temperature cloud map.

[0196] Based on the same concept as the embodiment of the method of the present application, the embodiment of the present application also provides a computing device. The computing device can be a server 102 or a terminal 101. The structure of the computing device can be referred to as the server 102 in Figure 1. In addition, when the computing device is a terminal 101, it can also include more components than 102 in Figure 1, such as a display screen, a microphone, a speaker, a virtual keyboard, a camera, etc.

[0197] In a specific application, the hard disk 123 can store a computer program. When the computing device is running, the processor 111 can read the computer program stored in the hard disk 123 into the memory, and read the computer program from the memory to implement the steps in the above-mentioned temperature point display method, such as steps 205 to 207 in Figure 2, steps 801 to 804 in Figure 8, or steps 901 to 903 in Figure 9.

[0198] Exemplarily, a computer program may be divided into one or more modules / units, each of which may be a series of computer program instruction segments capable of performing specific functions. The one or more modules / units are stored in hard disk 123 and executed by processor 111 to complete the present application. For example, the computer program may be divided into a temperature value cloud map determination module 1001, a receiving module 1002, a screening module 1003, and a display module 1004; or a second display module 1101, a receiving module 1102, and a third display module 1103. The specific functions of each module are described above.

[0199] In addition to the above-mentioned methods, apparatuses, and computing devices, embodiments of the present application may also provide a computer program product comprising computer program instructions, which, when executed by a processor, cause the processor to execute the steps of the temperature point display method of various embodiments of the present application described in the "Method" section above. The computer program product may be written in any combination of one or more programming languages ​​to write computer program code for executing the operations of the embodiments of the present application. The programming languages ​​include object-oriented programming languages ​​such as Java, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The computer program code may be in source code form, object code form, an executable file, or some intermediate form. The computer program code may be executed entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device, partially on a remote computing device, or entirely on a remote computing device or server.

[0200] In addition, an embodiment of the present application may also provide a computer-readable storage medium having computer program instructions stored thereon, which, when executed by a processor, causes the processor to perform the steps of the temperature point display method according to various embodiments of the present disclosure described in the "Method" section above. The computer-readable storage medium may adopt any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may include, for example, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. It should be noted that the content contained in the computer-readable medium may be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.

[0201] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0202] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0203] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of the present disclosure. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit the present disclosure to necessarily being implemented using the above specific details.

[0204] The block diagrams of the devices, devices, equipment, and systems involved in this disclosure are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0205] It should also be noted that in the apparatus, device, and method of the present disclosure, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present disclosure.

[0206] The above description has been provided for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present disclosure to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

[0207] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

Claims

1. A temperature point display method, characterized in that: include: Determine a temperature cloud map of the target device; the temperature cloud map indicates the temperature distribution of the target device, the temperature cloud map includes a plurality of temperature points, and the plurality of temperature points indicate temperatures corresponding to a plurality of component types in the target device; receiving a target component type to be queried; Determine at least one target temperature point corresponding to the target component type from the multiple temperature points; The at least one target temperature point is displayed separately on the temperature cloud graph.

2. The method according to claim 1, characterized in that The temperature cloud map is a three-dimensional structure diagram formed based on the multiple temperature points, and the display coordinates of the multiple temperature points are (x, y, z), where the x-coordinate and the y-coordinate indicate the corresponding positions of the temperature points in the target device, and the z-coordinate indicates the temperature value of the temperature point.

3. The method according to claim 2, characterized in that The temperature cloud map also includes a component distribution map, the three-dimensional structure map is arranged above the component distribution map, and the display coordinates of the temperature points indicate the position of the component type corresponding to the temperature point in the component distribution map.

4. The method according to any one of claims 1 to 3, characterized in that: Each of the multiple component types has at least one component; the temperature point corresponds to a component of any component type among the multiple component types, and the component type of the component corresponding to the temperature point is the component type corresponding to the temperature point; The temperature points are configured to display one or more of the following when operated: The identifier of the component type corresponding to the temperature point, the identifier of the component corresponding to the temperature point, the temperature value of the temperature point, and the temperature alarm threshold value of the component type corresponding to the temperature point.

5. The method according to claim 4, characterized in that The temperature point is also configured to enter an alarm state when the temperature value of the temperature point exceeds a temperature alarm threshold value of a component corresponding to the temperature point when the temperature value of the temperature point is operated.

6. The method according to any one of claims 1 to 5, characterized in that: The receiving of the target component type to be queried includes: Displaying a temperature cloud map in a temperature view, wherein the temperature view includes a query input box; The component type input in the query input box is obtained as the target component type.

7. The method according to any one of claims 1 to 6, characterized in that: The method further comprises: Acquire other component types other than the target component type from the multiple component types; The correlation between the target component type and the other component types is determined based on the temperature data of the temperature points corresponding to the target component type and the other component types.

8. A temperature point display method, characterized in that: include: Displaying a temperature view interface; the temperature view interface includes a query input box and a temperature cloud map of the target device, the temperature cloud map indicates the temperature distribution of the target device, the temperature cloud map includes multiple temperature points, and the multiple temperature points indicate the temperatures corresponding to multiple component types in the target device; Receiving a target component type input in the query input box; At least one target temperature point corresponding to the target component type is separately displayed on the temperature cloud diagram.

9. The method according to claim 8, characterized in that The temperature cloud map is a three-dimensional structure diagram formed based on the multiple temperature points, and the display coordinates of the multiple temperature points are (x, y, z), where the x-coordinate and the y-coordinate indicate the corresponding positions of the temperature points in the target device, and the z-coordinate indicates the temperature value of the temperature point.

10. A computing device, characterized in that comprising a processor and a memory; wherein, The memory is used to store programs; The processor is used to execute the program stored in the memory. When the program stored in the memory is executed, the method described in any one of claims 1 to 9 is performed.

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