Processing process for achieving precision alloy resistor production based on punching operation

Abstract

Disclosed in the present invention is a processing process for achieving precision alloy resistor production based on a punching operation. The processing process comprises the following steps: obtaining a composite plate, which is provided with an A-side plate and a B-side plate; forming several grooves on the A-side plate, wherein each groove extends in the X-axis direction, and the several grooves are arranged at intervals in the Y-axis direction, and / or forming several grooves on the B-side plate, each groove extending in the X-axis direction, and the several grooves being arranged at intervals in the Y-axis direction; forming several rows of holes in the composite plate, wherein each row of holes extends in the Y-axis direction, and the several rows of holes are arranged at intervals in the X-axis direction, thereby obtaining several resistor units distributed in a matrix; testing the resistance values of the resistor units; filling the several grooves and the several rows of holes with an insulating medium; and cutting the composite plate in the X-axis direction and in the Y-axis direction, so as to separate the resistor units from the composite plate. By means of the processing process of the present invention, the material utilization rate during the processing of precision alloy resistors is improved, and the processing efficiency and the product yield are also improved.

Description

Processing technology for precision alloy resistor production based on punching operation Technical Field

[0001] The present invention relates to the technical field of precision alloy resistors, and in particular to a processing technology for producing precision alloy resistors based on a punching operation. Background Art

[0002] Precision alloy resistors, also known as sampling resistors, shunts, etc., are mainly used to measure and monitor the current or voltage of the circuit in the feedback circuit to ensure safe and stable circuit operation. They are mainly used in white goods, new energy, automotive electronics, industrial control, energy storage, electricity and other fields that require monitoring, measurement, and early warning of circuit safety and stability. Technical issues

[0003] A recently developed method for processing precision alloy resistors involves combining copper leads and a resistor alloy through a rolling process to create a copper / resistor alloy or copper / resistor alloy / copper composite plate. The copper is then removed from one or both sides using mechanical, chemical, or electrochemical methods. The gaps are then filled with insulating adhesive or ink. Single resistors are then formed using mechanical methods such as stamping, CNC machining, or laser cutting. The leads on both sides are then electroplated with nickel or electroplated. Finally, resistance testing and packaging are performed. Due to the poor contact and conductivity between the copper and resistor alloy on the upper and lower surfaces, this process often interferes with the resistance adjustment of multiple rows of resistors. Consequently, single-row processing, individual resistor adjustment, or no adjustment at all has been used, resulting in low product yield, low material utilization, and high cost. The process involves forming the copper / resistor alloy or copper / resistor alloy / copper composite, removing the copper, filling the gaps with an insulating medium, single resistor processing, lead plating, resistance testing, and packaging.

[0004] Therefore, how to change the above-mentioned traditional process, improve the material utilization rate of precision alloy resistors during the processing, and improve processing efficiency and product yield is a technical problem that needs to be solved. Technical Solutions

[0005] In view of this, an embodiment of the present invention provides a processing technology for producing precision alloy resistors based on punching operations, thereby improving the material utilization rate of precision alloy resistors during the processing, and enhancing processing efficiency and product yield.

[0006] The processing technology for producing precision alloy resistors based on punching operations includes the following steps:

[0007] A composite plate is obtained, wherein the composite plate has two face plates A and B disposed back to back; the composite plate includes a resistance alloy layer and a copper layer laminated to each other, or the composite plate includes a first copper layer, a resistance alloy layer, and a second copper layer laminated in sequence;

[0008] A plurality of grooves are provided along panel A, each of the grooves extending along the X-axis direction, and the grooves are spaced apart from each other along the Y-axis direction; or a plurality of grooves are provided along panel B, each of the grooves extending along the X-axis direction, and the grooves are spaced apart from each other along the Y-axis direction; or a plurality of grooves are provided along panel A and panel B, each of the grooves extending along the X-axis direction, and the grooves are spaced apart from each other along the Y-axis direction; the grooves are all provided on the copper layer;

[0009] A plurality of rows of holes are formed on the composite plate, each row of holes extending along the Y-axis direction, and a plurality of rows of holes are spaced apart from each other along the X-axis direction, thereby obtaining a plurality of resistor units distributed in a matrix;

[0010] Performing a resistance test on the resistor unit;

[0011] Filling the plurality of grooves and the plurality of holes with an insulating medium and solidifying the insulating medium;

[0012] The composite plate is cut along the X-axis direction and the Y-axis direction to separate each resistor monomer therefrom.

[0013] Optionally, the composite plate includes a resistance alloy layer and a copper layer bonded to each other, with the surface of the resistance alloy layer being panel A and the surface of the copper layer being panel B; and the groove is opened on the copper layer.

[0014] Optionally, an insulating medium is coated on the surface of the resistance alloy layer.

[0015] Optionally, the composite plate includes a resistance alloy layer and a copper layer bonded to each other, the surface of the copper layer is panel A, and the surface of the resistance alloy layer is panel B; the groove is opened on the copper layer.

[0016] Optionally, an insulating medium is coated on the surface of the resistance alloy layer.

[0017] Optionally, the composite plate includes a first copper layer, a resistance alloy layer, and a second copper layer bonded in sequence, with the surface of the first copper layer being panel A and the surface of the second copper layer being panel B; the grooves are respectively opened on the first copper layer and the second copper layer.

[0018] Optionally, each row of holes has a plurality of single holes, and adjacent single holes are spaced apart and not connected.

[0019] Optionally, each row of holes is integrally connected along the Y-axis direction of the composite plate.

[0020] Optionally, after each resistor unit is separated from the composite board, electroplating, resistance value testing, and packaging are performed on the single resistor unit. Beneficial effects

[0021] The present invention provides a processing technology for producing precision alloy resistors based on a punching operation, thereby improving the material utilization rate of the precision alloy resistors during the processing, and enhancing the processing efficiency and product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The features and advantages of the present invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the present invention in any way. In the accompanying drawings:

[0023] FIG1 is a flowchart of the steps of a processing technique for producing precision alloy resistors based on a punching operation according to the present invention;

[0024] FIG2 is a schematic structural diagram of a composite coil according to a first embodiment of the present invention;

[0025] FIG3 is an enlarged view of FIG2 at point A;

[0026] FIG4 is a schematic structural diagram of a composite coil according to a second embodiment of the present invention;

[0027] FIG5 is an enlarged view of FIG4 at point B;

[0028] FIG6 is a three-dimensional structural diagram of a composite panel of the present invention;

[0029] FIG7 is a perspective view showing a plurality of grooves formed on panel B of the composite panel shown in FIG6 ;

[0030] FIG8 is a plan view showing a plurality of grooves formed on the B panel of the composite panel shown in FIG6 ;

[0031] FIG9 is a cross-sectional view along line AA of FIG8 ;

[0032] FIG10 is a perspective view showing a plurality of rows of holes that are spaced apart but not continuous on the composite plate based on FIG7 ;

[0033] FIG11 is a plan view showing a plurality of rows of holes that are spaced apart but not continuous on the composite plate based on FIG7 ;

[0034] FIG12 is a schematic diagram of obtaining multiple resistor monomers in FIG10;

[0035] FIG13 is a plan view showing a plurality of integrated through-holes formed on the composite plate based on FIG7 ;

[0036] FIG14 is a schematic diagram of filling a plurality of trenches and a plurality of rows of holes with an insulating medium based on FIG10 ;

[0037] FIG15 is a schematic diagram showing a single resistor unit obtained by cutting the composite plate along the X-axis and the Y-axis. Modes for Carrying Out the Invention

[0038] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0039] The present invention discloses a processing technology for producing precision alloy resistors based on a punching operation (as shown in FIG1 ), comprising the following steps:

[0040] [Step 1: Using a rolling process to obtain an infinitely extended composite coil;]

[0041] The composite coil has two specifications: one composite coil 10 includes a resistance alloy layer 11 and a copper layer 12 laminated to each other (as shown in Figures 2 and 3), and the other composite coil 20 includes a first copper layer 21, a resistance alloy layer 22, and a second copper layer 23 laminated to each other (as shown in Figures 4 and 5), that is, copper is laminated to both sides of the resistance alloy in the middle.

[0042] [Step 2: Obtain a composite panel having two panels A and B disposed back to back (as shown in FIG6 );]

[0043] According to the design requirements, the composite coil is cut to obtain the required length of the plate, and then the obtained plate is leveled by a leveling machine to ensure that the plate surface is flat and free of warping, bending, etc., thereby obtaining the required composite plate (as shown in Figure 6);

[0044] As can be seen from the above step 1, the composite plate includes the following two forms: one composite plate includes a resistance alloy layer 11 and a copper layer 12 laminated to each other (as shown in FIG3 ), and the other composite plate includes a first copper layer 21, a resistance alloy layer 22, and a second copper layer 23 laminated in sequence (as shown in FIG5 ), that is, copper is laminated to both sides of the resistance alloy in the middle;

[0045] Since the composite panels have the above two specifications, for a clearer and more organized description, the two oppositely disposed panels of the composite panel are designated as panel A and panel B (as shown in FIG6 ). In addition, for ease of description, the concept of a plane rectangular coordinate system is introduced. The plane rectangular coordinate system has mutually perpendicular X-axis and Y-axis (as shown in FIG6 ), with the X-axis being parallel to one side of the composite panel and the Y-axis being parallel to the other side of the composite panel.

[0046] [Step 3: Form a plurality of grooves 100 along panel A, with each groove 100 extending along the X-axis and the grooves 100 spaced apart from each other along the Y-axis; or form a plurality of grooves 100 along panel B, with each groove 100 extending along the X-axis and the grooves 100 spaced apart from each other along the Y-axis; or form a plurality of grooves 100 along panel A and panel B, with each groove 100 extending along the X-axis and the grooves 100 spaced apart from each other along the Y-axis.]

[0047] The spacing between the grooves 100 can be adjusted to any size and quantity, achieving ultra-high compatibility in package size, quantity, and efficiency, and achieving effects that cannot be achieved by molds and other methods. This layout can realize a common process edge for the entire board surface, thereby improving material utilization.

[0048] If the composite plate includes a resistance alloy layer 11 and a copper layer 12 bonded to each other, the surface of the resistance alloy layer 11 is panel A, and the surface of the copper layer 12 is panel B; a groove 100 is opened on the copper layer 12 (as shown in Figures 7, 8 and 9).

[0049] Similarly, if the composite plate includes a resistance alloy layer 11 and a copper layer 12 bonded to each other, the surface of the copper layer 12 is panel A, and the surface of the resistance alloy layer 11 is panel B; a groove 100 is opened on the copper layer 12 (not shown).

[0050] If the composite board includes a first copper layer 21, a resistance alloy layer 22, and a second copper layer 23 laminated in sequence, the surface of the first copper layer 21 is panel A, and the surface of the second copper layer 23 is panel B; grooves 100 (not shown) are respectively provided on the first copper layer 21 and the second copper layer 23.

[0051] It can be seen that no matter what specifications the composite board is, the grooves 100 are all formed on the copper layer. After the grooves 100 are formed on the copper layer, the resistance alloy layer will be exposed.

[0052] The drawings of the present invention mainly use "the composite plate includes a resistance alloy layer 11 and a copper layer 12 bonded to each other" as an example. On this basis, "the composite plate includes a first copper layer 21, a resistance alloy layer 22, and a second copper layer 23 bonded in sequence" can also be easily understood and no detailed illustration is required.

[0053] Step 4: Create a plurality of rows of holes 200 on the composite board (as shown in FIG. 10 and FIG. 11 ). Each row of holes 200 extends along the Y-axis, and the plurality of rows of holes 200 are spaced apart from each other along the X-axis, thereby forming a plurality of resistor units 300 arranged in a matrix (as shown by the dotted lines in FIG. 12 ).

[0054] After a plurality of rows of holes 200 are formed, a plurality of resistor units 300 distributed in a matrix are formed;

[0055] Here, there are many implementation methods for opening the rows of holes 200, for example:

[0056] In Example 1, each row of holes 200 includes several individual holes 210 (as shown in FIG11 ), with adjacent individual holes 210 spaced apart and not connected. In this embodiment, although the composite panel has several rows of holes 200, the spacing between adjacent individual holes 210 (equivalent to forming reinforcing ribs) enhances the overall structural strength of the composite panel, preventing the composite panel from sagging due to external forces. This is a preferred embodiment.

[0057] In Example 2, each row of holes 200 integrally penetrates the composite plate along the Y-axis (as shown in FIG13 ). In this embodiment, each row of holes 200 is an integral through-hole structure. Although this embodiment does not form reinforcing ribs as described in Example 1, it can still ultimately produce a plurality of resistor units 300 distributed in a matrix.

[0058] [Step 5: Test the resistance of the resistor unit 300;]

[0059] Use a resistance trimmer to test the resistance of the resistor unit 300. Based on the resistance requirements, use mechanical milling or laser stripping to remove the thickness of the resistor alloy to adjust the resistance from small to large, thereby improving the product's resistance qualification rate and enhancing processing efficiency.

[0060] [Step 6: As shown in FIG. 14 , fill the plurality of grooves 100 and the plurality of rows of holes 200 with an insulating medium 400 and allow the insulating medium to solidify;]

[0061] The plurality of grooves 100 and the plurality of rows of holes 200 are filled with an insulating medium 400 (for example, an epoxy resin material in the prior art) by a process such as silk screen printing, spray coating, or glue injection. The insulating medium 400 is required to have sufficient bonding strength and rigidity. The insulating medium 400 is then solidified at room temperature or under heating and pressure conditions.

[0062] [Step 7: If the composite board includes a resistance alloy layer 11 and a copper layer 12 laminated together, an insulating medium 500 is applied to the surface of the resistance alloy layer 11 using a spray coating, silk screen printing, or other process (as shown in FIG. 14 ) to ensure surface insulation. It will be appreciated that if the composite board includes a first copper layer 21, a resistance alloy layer 22, and a second copper layer 23 laminated together in sequence, since the resistance alloy layer 22 is not exposed, there is no need to apply an insulating medium to the surface of the resistance alloy layer 22.]

[0063] Step 8: Cut the composite board along the X-axis and the Y-axis to separate each resistor unit 300.

[0064] Step 9: Electroplating the side surfaces of the single resistor unit 300, such as copper plating, nickel plating, and tin plating, so that the side surfaces of the resistor unit 300 are coated with an electroplating layer 600 (as shown in FIG. 15 );

[0065] [Step 12: Test the resistance of the single resistor 300;]

[0066]

Step 13: Packaging.

[0067] It should be noted that the purpose of providing multiple rows of holes 200 in the composite board (as shown in Figures 10 and 11) is to physically separate the multiple rows of resistors, forming multiple rows of disconnected structures. Therefore, the opening width of the rows of holes 200 should be as small as possible to improve material utilization. The distance between two adjacent rows of holes 200 must be sufficient to accommodate a single resistor. In other words, the distance between the multiple rows of holes 200 must be adaptively adjusted based on the actual size of the resistor. In addition, the groove width and depth of the grooves 100, as well as the spacing between the multiple grooves 100, are determined based on the product's package size and the product's resistance value.

[0068] It should also be noted that the order of the above steps three and four can be interchanged. For example, a number of rows of holes 200 can be opened on the composite board first, and then grooves 100 can be opened on the copper layer to obtain a number of matrix-distributed resistor units 300, and the effect is the same.

[0069] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention. Such modifications and variations are all within the scope defined by the appended claims. Industrial Applicability

[0070] The processing technology for producing precision alloy resistors based on punching operation of the present invention comprises the following steps: obtaining a composite plate, wherein the composite plate comprises two back-to-back panels A and B; the composite plate comprises a resistance alloy layer and a copper layer bonded to each other, or the composite plate comprises a first copper layer, a resistance alloy layer, and a second copper layer bonded in sequence; providing a plurality of grooves along panel A, wherein each groove extends along the X-axis direction, and the plurality of grooves are spaced apart from each other along the Y-axis direction; or providing a plurality of grooves along panel B, wherein each groove extends along the X-axis direction, and the plurality of grooves are spaced apart from each other along the Y-axis direction; or providing a plurality of grooves along panel A, wherein each groove extends along the X-axis direction, and the plurality of grooves are spaced apart from each other along the Y-axis direction; A plurality of grooves are respectively provided on the panel and the B panel, each of the grooves extending along the X-axis direction, and the plurality of grooves are spaced apart from each other along the Y-axis direction; the grooves are all provided on the copper layer; a plurality of rows of holes are provided on the composite board, each of the rows of holes extending along the Y-axis direction, and the plurality of rows of holes are spaced apart from each other along the X-axis direction, thereby obtaining a plurality of matrix-distributed resistor monomers; the resistance value of the resistor monomers is tested; an insulating medium is filled into the plurality of the grooves and the plurality of the rows of holes and solidified; the composite board is cut along the X-axis and the Y-axis directions to separate each of the resistor monomers.

[0071] The present invention provides a processing technology for producing precision alloy resistors based on a punching operation, thereby improving the material utilization rate of the precision alloy resistors during the processing, and enhancing the processing efficiency and product yield.

Claims

1. A processing technology for producing precision alloy resistors based on punching operation, characterized in that: The steps include: A composite plate is obtained, wherein the composite plate has two face plates A and B arranged back to back; the composite plate includes a resistance alloy layer and a copper layer laminated to each other, or the composite plate includes a first copper layer, a resistance alloy layer, and a second copper layer laminated in sequence; A plurality of grooves are provided along the A panel, each of which extends along the X-axis direction, and the plurality of grooves are arranged at intervals along the Y-axis direction; or a plurality of grooves are provided along the B panel, each of which extends along the X-axis direction, and the plurality of grooves are arranged at intervals along the Y-axis direction; or a plurality of grooves are provided along the A panel and along the B panel respectively, each of which extends along the X-axis direction, and the plurality of grooves are arranged at intervals along the Y-axis direction; the grooves are provided on the copper layer; A plurality of rows of holes are provided on the composite plate, each row of holes extends along the Y-axis direction, and a plurality of rows of holes are arranged at intervals from each other along the X-axis direction, thereby obtaining a plurality of resistor monomers distributed in a matrix; Performing a resistance test on the resistor monomer; Filling the plurality of grooves and the plurality of holes with an insulating medium and solidifying the insulating medium; The composite board is cut along the X-axis direction and the Y-axis direction to separate each resistor monomer therefrom.

2. The processing technology for realizing the production of precision alloy resistors based on punching operation according to claim 1 is characterized in that: The composite plate comprises a resistance alloy layer and a copper layer which are bonded to each other, the surface of the resistance alloy layer is panel A, and the surface of the copper layer is panel B; the groove is provided on the copper layer.

3. The processing technology for realizing the production of precision alloy resistors based on punching operation according to claim 2 is characterized in that: An insulating medium is coated on the surface of the resistance alloy layer.

4. The processing technology for realizing the production of precision alloy resistors based on punching operation according to claim 1 is characterized in that: The composite plate comprises a resistance alloy layer and a copper layer which are bonded to each other, the surface of the copper layer is panel A, and the surface of the resistance alloy layer is panel B; the groove is provided on the copper layer.

5. The processing technology for realizing the production of precision alloy resistors based on punching operation according to claim 4 is characterized in that: An insulating medium is coated on the surface of the resistance alloy layer.

6. The processing technology for producing precision alloy resistors based on punching operation according to claim 1 is characterized in that: The composite plate includes a first copper layer, a resistance alloy layer, and a second copper layer which are sequentially bonded together, with the surface of the first copper layer being the A panel and the surface of the second copper layer being the B panel; the grooves are respectively opened on the first copper layer and the second copper layer.

7. The processing technology for producing precision alloy resistors based on punching operation according to claim 1 is characterized in that: Each row of holes has a plurality of single holes, and adjacent single holes are spaced apart but not connected.

8. The processing technology for producing precision alloy resistors based on punching operation according to claim 1 is characterized in that: Each row of holes is integrally connected along the Y-axis direction of the composite plate.

9. The processing technology for producing precision alloy resistors based on punching operation according to claim 1 is characterized in that: After each resistor monomer is separated from the composite board, electroplating, resistance value testing and packaging are performed on the single resistor monomer.

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