Cooling device and server

Abstract

The present disclosure provides a cooling device and a server. A liquid cooling device comprises a heat dissipation assembly and a vapor chamber assembly, the vapor chamber assembly comprises a vapor chamber and first heat dissipation members, and the vapor chamber comprises a first accommodating cavity for accommodating a first cooling medium; the first heat dissipation members extend in the direction perpendicular to the vapor chamber and comprise first chambers and second chambers which are communicated with the first accommodating cavity; each second chamber surrounds the outer peripheral surface of the corresponding first chamber; each first chamber is communicated with the corresponding second chamber by means of a first one-way valve, and the bottom of the second chamber is communicated to the first accommodating cavity by means of a second one-way valve; the heat dissipation assembly is sleeved on the first heat dissipation members and configured to conduct heat exchange with the first cooling medium; the first cooling medium vaporized after heating enters the second chambers by means of the first one-way valves and is condensed into a liquid state after being subjected to heat exchange with the heat dissipation assembly; and the liquid first cooling medium flows back to the bottom of the first accommodating cavity by means of the second one-way valves. The cooling effect of the cooling device is improved.

Description

[0001] Cross-Reference to Cooling Device and Server This disclosure claims priority to Chinese patent application number 202311715802.6, filed with the Patent Office of China on December 13, 2023, entitled "Cooling Device and Server," the entire contents of which are incorporated herein by reference. Technical Field This disclosure relates to the field of server technology, and more particularly to a cooling device and server. Background: With the promotion and application of artificial intelligence technology, the demand for high-computing scenarios has continued to increase, causing the average power consumption of chips within servers to jump from 300W to over 1000W, thereby increasing server temperatures and affecting normal server operation. Currently, air-cooled cooling devices are commonly used to cool the chips within servers to dissipate heat. However, air-cooling technology no longer meets the heat dissipation requirements of server chips. To improve the heat dissipation effect of servers, cooling devices in related art combine air-cooling technology with vapor chamber heat dissipation technology. However, these cooling devices suffer from insufficient heat transfer capacity, significantly reducing the cooling capacity of the cooling devices. SUMMARY OF THE INVENTION Embodiments of the present disclosure provide a cooling device and server. In a first aspect, embodiments of the present disclosure provide a liquid cooling device, comprising: a heat sink assembly, comprising a vapor chamber and a first heat sink disposed on the vapor chamber; the vapor chamber comprising a first accommodating chamber for accommodating a first cooling medium; the first heat sink extending perpendicular to the vapor chamber and comprising a first chamber and a second chamber communicating with the first accommodating chamber; the second chamber surrounding the outer circumference of the first chamber; the first chamber communicating with the second chamber via a first one-way valve, and the bottom of the second chamber communicating with the first accommodating chamber via a second one-way valve; a heat sink assembly, mounted on the first heat sink and configured to exchange heat with the first cooling medium; wherein the heated, vaporized first cooling medium enters the second chamber through the first one-way valve and condenses into a liquid state after exchanging heat with the heat sink assembly; and the liquid first cooling medium flows back to the bottom of the first accommodating chamber through the second one-way valve. In the cooling device provided in the embodiments of the present disclosure, the internal cavity of the first heat sink disposed on the vapor chamber is improved to include a first chamber communicating with the first accommodating chamber and a second chamber, with the second chamber surrounding the outer circumference of the first chamber. The first chamber communicates with the second chamber via a first one-way valve, and the bottom of the second chamber is connected to the first accommodating chamber via a second one-way valve.The first one-way valve allows the heated, vaporized first cooling medium in the first chamber to enter the second chamber, while preventing the condensed first cooling medium in the second chamber from re-entering the first chamber. This allows the condensed first cooling medium to flow back through the second chamber to the bottom of the first chamber. Simultaneously, the second one-way valve prevents the heated, vaporized first cooling medium in the first chamber from entering the second chamber. This arrangement separates the flow paths of the heated, vaporized first cooling medium from the condensed first cooling medium. This prevents the liquid first cooling medium from obstructing the flow of the gaseous first cooling medium, ensuring that heat absorbed by the vapor chamber is promptly transferred to the first heat sink, thereby improving the heat transfer capacity of the vapor chamber assembly. Furthermore, it prevents the gaseous first cooling medium in the first chamber from condensing into a liquid state prematurely when the heat dissipation capacity of the heat sink assembly is too high, preventing the liquid first cooling medium from obstructing the upward flow of the gaseous first cooling medium. This improves the heat transfer capacity of the first heat sink, thereby enhancing the heat dissipation capacity of the cooling device. In one possible implementation, the second chamber surrounds the entire outer circumference of the first chamber, and a heat exchange chamber is formed between the top of the second chamber and the top of the first chamber. In one possible implementation, the second chamber surrounds part of the outer circumference of the first chamber. In one possible implementation, the first heat sink includes a heat pipe and a cylindrical body. The inner cavity of the heat pipe constitutes the first chamber, one end of the heat pipe communicates with the first accommodating chamber, and the other end of the heat pipe is provided with the first one-way valve. The cylindrical body is sleeved over the heat pipe, and the buffer chamber is formed between the top of the heat pipe and the top of the cylindrical body. A first communication hole is provided in the area of ​​the vapor chamber opposite the second chamber, and the second one-way valve is provided in the first communication hole. In one possible implementation, the first accommodating chamber includes at least two relatively independent sub-chambers. The bottom surfaces of at least two of the sub-chambers are in contact with the object to be cooled, and the top surfaces of at least two of the sub-chambers communicate with the first and second chambers of the first heat sink. In a possible implementation, a plurality of the first heat sinks are disposed at intervals on the vapor chamber; and in at least two of the sub-chambers, any one of the sub-chambers is connected to the first chamber and the second chamber of some of the first heat sinks.In one possible implementation, the heat dissipation assembly includes a heat dissipation housing and a plurality of second heat dissipation members; the heat dissipation housing is disposed on the heat vapor chamber and encloses a second accommodating cavity with the heat vapor chamber; the second accommodating cavity accommodates a second cooling medium; the plurality of second heat dissipation members are spaced apart and sleeved on the first heat dissipation member in a direction perpendicular to the heat vapor chamber and are located in the second accommodating cavity; wherein a flow channel is formed between any adjacent second heat dissipation members, and the flow channel extends in a direction parallel to the heat vapor chamber. In one possible implementation, a liquid inlet pipe is provided on the top surface of the heat dissipation housing, facing away from the vapor chamber. The liquid inlet pipe is connected to the second accommodating chamber and is located on one side of the inlet end of the circulation channel. A flow equalizer is provided between the inlet end of the circulation channel and the liquid inlet pipe. The flow equalizer extends in a direction perpendicular to the vapor chamber, with one end of the flow equalizer connected to the top surface of the heat dissipation housing and the other end connected to the vapor chamber. The flow equalizer includes multiple flow equalizer sections, each configured to balance the flow of the second cooling medium within the multiple circulation channels. In one possible implementation, the flow equalizer includes a flow equalizer and multiple flow equalizer hole groups provided on the flow equalizer. The multiple flow equalizer hole groups are arranged in a direction perpendicular to the vapor chamber, and each flow equalizer hole group is arranged opposite to one of the circulation channels and constitutes a flow equalizer section. Each flow equalizer hole group includes multiple flow equalizer holes, each of which passes through the flow equalizer along the thickness direction of the flow equalizer. In one possible implementation, the heat dissipation housing is provided with a liquid outlet pipe on a top surface facing away from the vapor chamber, the liquid outlet pipe being in communication with the second accommodating chamber; the top surface of the heat dissipation housing facing away from the vapor chamber is square in shape, and the liquid inlet pipe and the liquid outlet pipe are provided at opposite corners of the top surface of the heat dissipation housing facing away from the vapor chamber. In one possible implementation, the cooling device further includes an annular mounting plate and an annular locking member; the mounting plate is provided with a first mounting hole; the vapor chamber is provided with a second mounting hole, the second mounting hole being arranged opposite the first mounting hole; the annular mounting plate is provided on the vapor chamber and sleeved over the outer circumference of the heat dissipation assembly; the locking member is fixedly connected to the component to be cooled after passing through the first and second mounting holes. In one possible implementation, the locking member includes a locking rod and an adapter sleeved on the locking rod; the adapter includes an annular body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular body, and the plurality of elastic claws are arranged at intervals along the circumference of the annular body.In one possible implementation, the locking member further includes an elastic member; the locking rod includes a first and a second boss spaced apart, the second boss and the adapter being located on opposite sides of an annular mounting plate, respectively; the elastic member is sleeved on the locking rod and located between the first and second bosses. In a second aspect, embodiments of the present disclosure provide a server comprising a circuit board, a chip, and the cooling device described in any one of the first aspects; the chip being disposed on the circuit board; the cooling device being disposed on the circuit board, and the heat spreader of the cooling device being attached to the chip. Since the server provided by embodiments of the present disclosure includes the cooling device of the first aspect, the server provided by embodiments of the present disclosure also possesses the same effects as the cooling device of the first aspect, which will not be further described here. In addition to the technical problems solved by the embodiments of the present disclosure, the technical features constituting the technical solutions, and the beneficial effects brought about by these technical features, as described above, other technical problems solved by the cooling device and server provided by embodiments of the present disclosure, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS To more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or prior art descriptions. It should be apparent that the drawings described below represent some embodiments of the present disclosure. Persons skilled in the art can also derive other drawings based on these drawings without inventive effort. FIG1 is an exploded schematic diagram of a cooling device according to an embodiment of the present disclosure; FIG2 is an enlarged schematic diagram of the exploded region of the cooling device in FIG1; FIG3 is a first schematic diagram of a heat spreader assembly according to an embodiment of the present disclosure; FIG4 is a second schematic diagram of a heat spreader assembly according to an embodiment of the present disclosure; FIG5 is a partially exploded schematic diagram of a cooling device according to an embodiment of the present disclosure; FIG6 is an enlarged schematic diagram of the partially exploded region of the cooling device in FIG5; FIG7 is a third schematic diagram of a heat spreader assembly according to an embodiment of the present disclosure; FIG8 is a schematic diagram of a current equalizing plate according to an embodiment of the present disclosure; FIG9 is a top view of a cooling device according to an embodiment of the present disclosure; FIG10 is a perspective view of a locking member according to an embodiment of the present disclosure; FIG11 is a schematic diagram of an adapter according to an embodiment of the present disclosure; and FIG12 is a schematic diagram of a server according to an embodiment of the present disclosure. FIGURE NUMBERS:

[0002] 100: heat soaking assembly;

[0003] 110: heat sink; 111: first accommodating chamber; 1111: sub-chamber; 112: second mounting hole;

[0004] 120: first heat sink; 121: first chamber; 122: second chamber; 123: buffer chamber; 124: heat dissipation pipe; 125: cylindrical body;

[0005] 130: first one-way valve;

[0006] 140: second one-way valve;

[0007] 150: partition;

[0008] 200: heat dissipation component;

[0009] 210: heat dissipation housing; 211: top plate; 2111: groove; 212: annular side plate;

[0010] 220: second heat dissipation element; 221: through hole; 230: circulation channel;

[0011] 240: liquid inlet pipe;

[0012] 250: liquid outlet pipe;

[0013] 260: Flow equalizing component; 261: Flow equalizing portion; 262: Flow equalizing plate;

[0014] 300: mounting plate;

[0015] 400: Locking member; 410: Locking rod; 411: First boss; 412: Second boss; 420: Adapter; 421: Ring-shaped body; 422: Elastic claw; 430: Elastic member;

[0016] 500: circuit board;

[0017] 600: Chip. Specific Embodiments: As described in the background, cooling devices that combine air cooling with vacuum vapor chamber cooling suffer from insufficient heat transfer capacity. The inventors discovered that this problem arises because the vapor chamber in the related art includes heat dissipation columns extending perpendicular to the bottom surface of the vapor chamber. The columns are filled with a cooling medium. A heat sink is mounted over the columns. After absorbing heat and vaporizing, the cooling medium in the vapor chamber moves upward along the height of the columns. It then condenses into a liquid state through air cooling by the heat sink. The liquid then flows back through the inner cavity of the columns under its own gravity, achieving the cooling function of the cooling device. However, during the heat transfer process, the columns contain both gaseous cooling medium moving upward and liquid cooling medium moving downward. In this way, the liquid cooling medium moving downward from top to bottom hinders the movement of the gaseous cooling medium, preventing the heated, vaporized first cooling medium within the vapor chamber from being promptly transferred to the heat sink, resulting in insufficient heat transfer capacity and poor cooling effect. In view of this, embodiments of the present disclosure provide a cooling device and server. By improving the inner cavity of a first heat sink disposed on the vapor chamber, the inner cavity comprises a first chamber communicating with a first accommodating chamber and a second chamber. The second chamber surrounds the outer circumference of the first chamber, and the top of the second chamber and the top of the first chamber form a second chamber. The first chamber communicates with the second chamber via a first one-way valve, while the bottom of the second chamber connects to the first accommodating chamber via a second one-way valve. The first one-way valve allows the heated, vaporized first cooling medium within the first accommodating chamber to enter the second chamber, while preventing the condensed first cooling medium within the second chamber from re-entering the first chamber. This allows the condensed first cooling medium to flow along the second chamber and converge at the bottom of the first accommodating chamber. At the same time, the second one-way valve prevents the heated, vaporized first cooling medium in the first chamber from entering the second chamber. This arrangement separates the flow path of the heated, vaporized first cooling medium from the flow path of the condensed first cooling medium. This prevents the downward movement of the liquid first cooling medium from obstructing the movement of the gaseous first cooling medium, ensuring that heat absorbed by the vapor chamber is promptly transferred to the first heat sink, thereby improving the heat transfer capacity of the vapor chamber assembly. Furthermore, this prevents the gaseous first cooling medium in the first chamber from prematurely condensing to a liquid state when the heat dissipation capacity of the heat sink assembly is excessive, preventing the liquid first cooling medium from obstructing the upward movement of the gaseous first cooling medium. This improves the heat transfer capacity of the first heat sink, thereby enhancing the heat dissipation capacity of the cooling device.To make the above-mentioned objectives, features, and advantages of the embodiments of the present disclosure more readily apparent, the technical solutions in the embodiments of the present disclosure will be described clearly and completely below, in conjunction with the accompanying drawings. It should be understood that the described embodiments represent only a portion of the embodiments of the present disclosure, and are not exhaustive. All other embodiments devised by persons of ordinary skill in the art based on the embodiments of the present disclosure without inventive effort are within the scope of protection of the present disclosure. Referring to Figures 1 to 11, the embodiments of the present disclosure provide a cooling device for dissipating heat from a component to be cooled to ensure its proper operation. For example, the cooling device is used to dissipate heat from a server chip. The cooling device has strong heat dissipation performance, enabling it to quickly dissipate heat generated by the server chip, ensuring its proper operation. The cooling device includes a heat spreader assembly 100 and a heat sink assembly 200. Heat spreader assembly 100 includes a vapor chamber 110 and a first heat sink 120. First heat sink 120 is disposed on vapor chamber 110 and extends perpendicularly to vapor chamber 110. In other words, first heat sink 120 extends vertically. Both vapor chamber 110 and first heat sink 120 have internal cavities, and their internal cavities are interconnected. For example, referring again to Figures 3 and 4 , vapor chamber 110 includes a first accommodating cavity 111, and first heat sink 120 includes a first chamber 121 and a second chamber 122. The first chamber 121 and the second chamber 122 are interconnected with the first accommodating cavity 111. Second chamber 122 surrounds the outer circumference of first chamber 121. The first chamber 121 communicates with the second chamber 122 via a first one-way valve 130. The bottom of the second chamber 122 communicates with the first accommodating chamber 111 via a second one-way valve 140. The first one-way valve 130 only allows the first cooling medium, which has been heated and vaporized within the first accommodating chamber 111, to flow into the first chamber 121. The first cooling medium can also enter the second chamber 122 through the first one-way valve 130, preventing the condensed first cooling medium in the second chamber 122 from re-entering the first chamber 121. This allows the condensed first cooling medium to flow back through the second chamber 122 to the bottom of the first accommodating chamber 111. Simultaneously, the second one-way valve 140 prevents the heated and vaporized first cooling medium in the first accommodating chamber 111 from entering the second chamber 122. Continuing with Figures 1, 5, and 6, the heat dissipation assembly 200 is mounted on the first heat sink 120 and is configured to exchange heat with the first cooling medium.The heat dissipation assembly 200 can be a plate radiator or a microchannel radiator, and can be air-cooled or water-cooled, which is not specifically limited in this embodiment. During use, the first cooling medium, which is heated and vaporized within the first accommodating chamber 111, passes through the first one-way valve 130 and enters the second chamber 122. After exchanging heat with the heat dissipation assembly 200, it condenses into a liquid state. The liquid first cooling medium then flows back to the bottom of the first accommodating chamber 111 through the second one-way valve 140. It should be noted that in Figures 3 and 4, solid arrows indicate the flow direction of the first cooling medium after being heated and vaporized, while dashed arrows indicate the flow direction of the first cooling medium after condensing after exchanging heat with the heat dissipation assembly 200. With this arrangement, this embodiment separates the flow path of the heated, vaporized first cooling medium from the flow path of the condensed first cooling medium. This prevents the downward movement of the liquid first cooling medium from obstructing the movement of the gaseous first cooling medium, ensuring that heat absorbed by the vapor chamber 110 is promptly transferred to the first heat sink 120, thereby improving the heat transfer capacity of the heat sink assembly 100. Furthermore, this prevents the gaseous first cooling medium within the first chamber 121 from prematurely condensing into a liquid state when the heat dissipation capacity of the heat sink assembly 200 is excessively high, preventing the liquid first cooling medium from obstructing the upward movement of the gaseous first cooling medium. This improves the heat transfer capacity of the first heat sink 120 and, consequently, the heat dissipation capacity of the cooling device. In this embodiment, the second chamber 122 surrounds the outer circumference of the first chamber 121. The second chamber 122 may surround a portion of the outer circumference of the first chamber 121, or the second chamber 122 may surround the entire outer circumference of the first chamber 121. In one example, the second chamber 122 surrounds a portion of the outer circumference of the first chamber 121. For example, the second chamber 122 can be located on one side of the first chamber 121 and surround the outer side of the first chamber 121, so that the height of the second chamber 122 is equal to that of the first chamber 121. This arrangement can simplify the preparation of the first heat sink 120. It should be noted that in this case, the first one-way valve 130 can be disposed on the sidewall of the first chamber 121. For another example, referring to FIG3 , the second chamber 122 is located on one side of the first chamber 121, has a height greater than that of the first chamber 121, and surrounds a portion of the outer side of the first chamber 121, as well as the top surface of the first chamber 121. For example, the cross-section of the second chamber 122 is semicircular, and the second chamber 122 can surround a portion of the outer circumference of the first chamber 121.A buffer chamber 123 is formed between the top of the second chamber 122 and the top of the first chamber 121. Specifically, the height of the first chamber 121 is smaller than that of the second chamber 122, so that the buffer chamber 123 is formed between the tops of the first chamber 121 and the second chamber 122. It should be understood that the area above the dotted line in Figures 3 and 4 is the buffer chamber 123. The volume of the buffer chamber 123 is larger than the volume of the remaining areas of the second chamber 122. When the heated and vaporized first cooling medium enters the buffer chamber 123 through the first one-way valve 130, the buffer chamber 123 slows the flow rate of the first cooling medium, reducing the impact on the first heat sink 120 and improving the safety of the cooling device. Furthermore, the heat exchange time between the second cooling medium and the first cooling medium in the buffer chamber 123 is prolonged, thereby improving the cooling effect of the cooling device. In another example, the second chamber 122 can also surround the entire outer circumference of the first chamber 121, with the top of the second chamber 122 and the top of the first chamber 121 forming a buffer chamber 123. For example, referring to FIG4 , the second chamber 122 surrounds the outer side surfaces and the top surface of the first chamber 121; in other words, the height of the second chamber 122 is greater than that of the first chamber 121. In this way, the second chamber 122 can enclose the first chamber 121. This allows the buffer chamber 123 to slow the flow rate of the first cooling medium, reducing the impact on the first heat sink 120 and improving the safety of the cooling device. Furthermore, the heat exchange time between the second cooling medium and the first cooling medium in the buffer chamber 123 can be extended, improving the cooling effect of the cooling device. In this embodiment, referring again to FIG5 and FIG6 , the heat dissipation assembly 200 is sleeved on the first heat sink 120. If the first heat sink 120 only includes a single chamber, the distance between the heat sink assembly 200 and the chamber of the first heat sink 120 will be shortened. If the heat sink assembly 200 has a strong heat dissipation capability, the vaporized first cooling medium within the chamber of the first heat sink 120 will prematurely condense into a liquid state. Furthermore, as the liquid first cooling medium moves downward, it hinders the upward movement of the heated, vaporized first cooling medium, reducing the cooling efficiency of the cooling device. Therefore, in this embodiment, the second chamber 122 surrounds the entire outer circumference of the first chamber 121, separating the heat sink assembly 200 from the first chamber 121. This increases the distance between the heat sink assembly 200 and the first chamber 121.With this arrangement (see FIG3 ), the heated, vaporized first cooling medium has ample time to conduct upward along the vertical vapor chamber 110, allowing it to quickly diffuse into the second chamber 122. This prevents the first cooling medium in the first chamber 121 from prematurely condensing into a liquid state, thereby improving the heat transfer capacity of the first heat sink 120. Furthermore, the first chamber 121 and the second chamber 122 are completely independent chambers. The first chamber 121 only allows the flow of the heated, vaporized first cooling medium, while the second chamber 122 only allows the flow of the first cooling medium that has condensed after heat exchange with the heat sink assembly 200. This allows the heated, vaporized first cooling medium and the condensed first cooling medium to circulate in two relatively independent chambers, preventing the condensed first cooling medium from obstructing the upward movement of the heated, vaporized first cooling medium, thereby improving the cooling efficiency of the cooling device. It should be noted that the separation between the first chamber 121 and the second chamber 122 can be achieved by a partition disposed within the first heat sink 120, or by two relatively independent components. As a possible implementation of the first heat sink 120, please continue to refer to FIG4 . The first heat sink 120 includes a heat pipe 124. The inner cavity of the heat pipe 124 constitutes the first chamber 121. One end of the heat pipe 124 communicates with the first accommodating chamber 111. For example, the heat spreader 110 is provided with a second communication hole (not shown in the figure), and one end of the heat pipe 124 is fixedly connected to the first communication hole. The other end of the heat pipe 124 is provided with a first one-way valve 130. The first one-way valve 130 is used to allow the heated and vaporized first cooling medium to flow from the first chamber 121 to the second chamber 122. It should be noted that the heat pipe 124 can be a cylindrical body with openings at both ends, or a cylindrical body with an opening at one end. When the heat dissipation tube 124 is a cylindrical body with an opening at one end, the opening faces the vapor chamber 110, and a mounting hole is provided on the surface of the heat dissipation tube 124 facing away from the opening. The first one-way valve 130 can be disposed within the mounting hole. The first heat dissipation element 120 also includes a cylindrical body 125, which is sleeved over the heat dissipation tube 124, with the top of the heat dissipation tube 124 and the top of the cylindrical body 125 forming a buffer chamber 123. A first communication hole (not shown) is provided in the area of ​​the vapor chamber 110 opposite the second chamber 122. The second one-way valve 140 is disposed in this first communication hole. The second one-way valve 140 is used to allow the condensed first cooling medium to flow from the second chamber 122 into the first accommodating chamber 111.The cylindrical body 125 can have various shapes. For example, the cylindrical body 125 can be cylindrical. For another example, the cylindrical body 125 can be a polyhedron. For example, the cylindrical body 125 can be a tetrahedron, a hexahedron, or another polyhedron. It should be noted that the first accommodating chamber 111 of the vapor chamber 110 and the first and second chambers 121, 122 of the first heat sink 120 are all vacuum chambers. For example, during the specific preparation process, the first cooling medium can be filled into the first accommodating chamber 111, and the first and second chambers 121, 122 can be evacuated to form a vacuum within the first accommodating chamber 111, 121, and 122. In this embodiment, the first heat sink 120 includes relatively independent heat pipes 124 and the cylindrical body 125, which facilitates the preparation of the first heat sink 120 and allows for the proper adjustment of the sizes of the first and second chambers 121, 122. This also facilitates the installation of the first one-way valve 130, reduces the difficulty of assembling the first heat sink 120, and thereby reduces the production cost of the first heat sink 120. In one possible implementation, referring to FIG7 , the first accommodating chamber 111 includes at least two relatively independent sub-chambers 1111. For example, a partition 150 is disposed within the first accommodating chamber 111, which divides the first accommodating chamber 111 into at least two relatively independent sub-chambers 1111. The bottom surfaces of the at least two sub-chambers 1111 are in contact with the object to be cooled, and the top surfaces of the at least two sub-chambers 1111 communicate with the first chamber 121 and the second chamber 122 of the first heat sink 120. In this embodiment, the partition 150 can be a straight plate and can be perpendicular to the bottom surface of the vapor chamber 110 or tilted relative to a direction perpendicular to the bottom surface of the vapor chamber 110, so that the at least two sub-chambers 1111 have a regular shape. The partition 150 can also have an irregular shape, so that at least two sub-chambers 1111 have irregular shapes. In a direction perpendicular to the bottom surface of the vapor chamber 110, one end of the partition 150 is connected to the bottom surface of the vapor chamber 110, and the other end of the partition 150 is connected to the top surface of the vapor chamber 110. This ensures that the bottom surface of each sub-chamber 1111 is in contact with the object to be cooled, and the top surface is in contact with the surface of the first heat sink 120 facing the vapor chamber 110.With this arrangement, the first cooling medium within each subchamber 1111 can absorb heat from the component to be cooled and vaporize. The heated, vaporized first cooling medium can move toward the top of subchamber 1111 and, through first chamber 121 and first one-way valve 130, into second chamber 122. The heated, vaporized first cooling medium exchanges heat with the second cooling medium, condensing into a liquid state. Under the influence of gravity, the liquid first cooling medium flows back through second chamber 122 and second one-way valve 140 to the bottom of subchamber 1111. With this arrangement, if one subchamber 1111 fails, the remaining subchamber 1111 can continue to operate, completing the cooling function of vapor chamber 110, allowing the cooling device to function properly. It should be noted that when the first heat sink 120 is a single heat sink, each subchamber 1111 communicates with both the first chamber 121 and the second chamber 122 of the first heat sink 120. When the first heat sink 120 is composed of multiple units, each sub-chamber 1111 communicates with the first and second chambers 121 and 122 of some of the units. For example, referring again to FIG. 7 , there are multiple first heat sinks 120, each having a first chamber 121 and a second chamber 122 that communicate with the first accommodating chamber 111. Multiple first heat sinks 120 are spaced apart on the vapor chamber 110. Any of the at least two sub-chambers 1111 communicates with the first and second chambers 121 and 122 of some of the first heat sinks 120, so that any sub-chamber 1111 and some of the first heat sinks 120 form a separate vapor chamber assembly 100. It should be noted that the arrangement of the multiple first heat sinks 120 can be optimized based on the layout of the at least two sub-chambers 1111, and this is not specifically limited in this embodiment. Continuing with Figures 1, 2, and 5, the heat dissipation assembly 200 provided in this embodiment includes a heat dissipation housing 210 and multiple second heat dissipation elements 220. The heat dissipation housing 210 is disposed on the vapor chamber 110 and, together with the vapor chamber 110, forms a second accommodating chamber (not shown); the second accommodating chamber accommodates a second cooling medium. It should be noted that the projected area of ​​the heat dissipation housing 210 on the vapor chamber 110 is smaller than the area of ​​the vapor chamber 110, allowing the heat dissipation housing 210 and the vapor chamber 110 to directly form a sealed second accommodating chamber.Multiple second heat sinks 220 are spaced apart and sleeved on the first heat sink 120 in a direction perpendicular to the vapor chamber 110, and are located within the second accommodating cavity. For example, a through hole 221 can be formed in each second heat sink 220, and each first heat sink 120 can be sequentially inserted through a corresponding through hole 221 to connect the multiple second heat sinks 220 with the first heat sink 120. In this example, the multiple second heat sinks 220 and the first heat sink 120 are continuously immersed in the second cooling medium, and the second cooling medium is in a continuous circulation state, allowing for rapid heat exchange with the first cooling medium, thereby improving the cooling effect of the cooling device. A circulation channel 230 is formed between any adjacent second heat sinks 220, extending parallel to the vapor chamber 110. In this embodiment, the second heat sink 220 is a heat sink fin. The heat sink fin and the vapor chamber 110 are both square in shape. The flow channel 230 can extend in either the longitudinal direction or the width direction of the vapor chamber 110. For example, the extension direction of the flow channel 230 can be changed by properly positioning the liquid inlet pipe 240 and the liquid outlet pipe 250. For example, if the longitudinal direction of the heat sink fin is the same as the longitudinal direction of the vapor chamber 110, i.e., the X direction in FIG1 , and the liquid inlet pipe 240 and the liquid outlet pipe 250 are arranged at intervals along the longitudinal direction of the vapor chamber 110, the flow channel 230 formed between adjacent heat sink fins extends along the longitudinal direction of the vapor chamber 110, i.e., the flow channel 230 extends along the X direction in FIG1 . For another example, if the length of the heat sink fins is the same as the width of the vapor chamber 110, i.e., the Y direction in FIG1 , and the liquid inlet pipes 240 and liquid outlet pipes 250 are spaced apart along the width of the vapor chamber 110, the flow channels 230 formed between adjacent heat sink fins extend along the width of the vapor chamber 110, i.e., the flow channels 230 extend along the Y direction in FIG1 . In this embodiment, multiple second heat sinks 220 are sleeved and fixedly connected to the first heat sink 120, forming multiple flow channels 230, allowing the second cooling medium to contact each second heat sink 220. The heat carried by the first heat sink 120 can also be transferred to the second heat sink 220. With this configuration, the heat carried by the first heat sink 120 can be exchanged not only with the second cooling medium surrounding it, but also with the second cooling medium surrounding the second heat sink 220, thereby greatly increasing the heat dissipation area of ​​the heat dissipation assembly 200 and improving the heat dissipation capacity of the heat dissipation assembly 200.Furthermore, because the heat dissipation area of ​​the heat dissipation assembly 200 is significantly increased, the spacing between adjacent second heat dissipating elements 220 can be increased, reducing resistance to the circulation channel 230 and the flow through the second heat dissipating elements 220, thereby reducing the power consumption of the cooling device's circulation pump. Referring to Figures 1 and 5 , the heat dissipating housing 210 is provided with a liquid inlet pipe 240 on the top surface facing away from the vapor chamber 110. Exemplarily, the heat dissipating housing 210 includes a top plate 211 and an annular side plate 212 disposed on the side of the top plate 211 facing the vapor chamber 110. The liquid inlet pipe 240 is disposed on and extends through the top plate 211. The liquid inlet pipe 240 communicates with the second accommodating chamber and is located on the inlet side of the circulation channel 230 to facilitate the supply of the second cooling medium into the second accommodating chamber. Referring to Figure 8 , a flow equalizer 260 is provided between the inlet end of the circulation channel 230 and the liquid inlet pipe 240. The flow equalizer 260 extends perpendicular to the vapor chamber 110. One end of the flow equalizer 260 is connected to the top surface of the heat dissipation housing 210, and the other end is connected to the vapor chamber 110. The flow equalizer 260 includes multiple flow equalizers 261, which are configured to balance the flow of the second cooling medium within the multiple flow channels 230, thereby ensuring a more uniform and stable flow of the second cooling medium within the multiple flow channels 230, thereby improving the safety and cooling effect of the cooling device. In this example, the flow equalizer 260 also includes a flow equalizer plate 262. The multiple flow equalizers 261 are spaced apart on the flow equalizer plate 262, and each flow equalizer 261 corresponds to one of the flow channels 230. As one possible implementation of the flow equalizer 261, the flow equalizer 261 can be an oblong hole extending along the width of the vapor chamber 110, corresponding to one of the flow channels. In another example, referring to FIG8 , a plurality of flow balancing hole groups are provided on the flow balancing plate 262. The plurality of flow balancing hole groups are spaced apart and arranged in a direction perpendicular to the vapor chamber 110. Each flow balancing hole group is disposed opposite one of the flow channels 230 and constitutes a flow balancing portion 261. It should be noted that the flow balancing holes within the dashed lines in FIG8 represent a flow balancing hole group. Each flow balancing hole group includes a plurality of flow balancing holes, and the plurality of flow balancing holes can be spaced apart and arranged in a direction perpendicular to the extension direction of the flow channels 230, that is, the plurality of flow balancing holes are spaced apart and arranged in the Y direction in FIG1 and FIG5 .Each flow balancing hole penetrates the flow balancing plate 262 along its thickness, allowing the second cooling medium located on the side of the flow balancing plate 262 facing the liquid inlet pipe 240 to flow through the flow balancing holes toward the side of the flow balancing member 260 facing the second heat sink 220. This arrangement allows for more efficient distribution of the second cooling medium, facilitating improved heat exchange efficiency between the second cooling medium and the heated, vaporized first cooling medium. In one possible implementation, a liquid outlet pipe 250 is provided on the top surface of the heat dissipation housing 210, facing away from the vapor chamber 110. The liquid outlet pipe 250 communicates with the second accommodating chamber. In other words, the liquid outlet pipe 250 is provided on the top surface of the top plate 211 of the heat dissipation housing 210 and extends through the top plate 211 along its thickness. The top surface of the vapor chamber 110 of the heat dissipation housing 210 is square; in other words, the top plate 211 of the heat dissipation housing 210 is square in shape. The liquid inlet pipe 240 and the liquid outlet pipe 250 are arranged at opposite corners of the top surface of the heat dissipation housing 210, facing away from the heat spreader 110. The top plate 211 includes intersecting first and second diagonals. Taking the orientation shown in FIG1 as an example, the angle between the first diagonal and the X-direction is acute. The liquid inlet pipe 240 and the liquid outlet pipe 250 can be arranged on either the first or second diagonal. This arrangement extends the flow path of the second cooling medium within the second accommodating chamber, improving the heat dissipation effect of the cooling device. It should be noted that the other ends of the liquid inlet pipe 240 and the liquid outlet pipe 250 can also be connected to a storage box, which is used to store the first cooling medium to ensure the normal use of the cooling device. At least two grooves 2111 are spaced apart on the top plate 211. The bottoms of at least two grooves 2111 are located within the top plate 211. Both grooves 2111 have side openings that extend through one side of the top plate 211 along its width. This makes the grooves 2111 easy for an operator to grasp, facilitating installation or removal of the heat dissipation housing 210 and the vapor chamber 110. It should be noted that the cooling device disclosed in the embodiments of the present disclosure needs to be installed on an object to be cooled, such as a circuit board. Therefore, the cooling device disclosed in the embodiments of the present disclosure also includes a mounting plate 300 and a locking member 400. For example, referring to Figures 1, 5, and 9, the mounting plate 300 is an annular member and has a first mounting hole (not shown) defined therein. The vapor chamber 110 has a second mounting hole 112 defined therein; the second mounting hole 112 is positioned opposite the first mounting hole.The mounting plate 300 is mounted on the vapor chamber 110 and fits over the outer circumference of the heat sink assembly 200; that is, the mounting plate 300 fits over the outer circumference of the heat sink housing 210. One end of the locking member 400 passes through the first and second mounting holes 112, respectively, to securely connect with the component to be cooled. For example, one end of the locking member 400 passes through the first and second mounting holes 112, respectively, to securely connect with the circuit board. Referring to Figures 10 and 11, the locking member 400 includes a locking rod 410 and an adapter 420. The adapter 420 fits over the locking rod 410. The adapter 420 is positioned below the mounting plate 300 and within the second mounting hole 112, ensuring that it fits within the second mounting hole 112. Referring to FIG. 11 , the adapter 420 includes an annular body 421 and multiple elastic claws 422. The multiple elastic claws 422 are connected to the inner surface of the annular body 421 and are spaced apart along the circumference of the annular body 421. The end of each elastic claw 422, facing away from the annular body 421, extends toward the center of the annular body 421, such that the diameter of the area enclosed by the multiple elastic claws 422 gradually decreases as it moves away from the annular body 421. This arrangement allows the adapter 420 to adapt to locking rods 410 of varying sizes and improves the connection strength between the vapor chamber 110 and the locking member 400. The locking member 400 also includes an elastic member 430, which may include a spring. The locking rod 410 includes a first boss 411 and a second boss 412, spaced apart from each other. The second boss 412 and the adapter 420 are located on either side of the annular mounting plate 300, respectively. Taking the orientation shown in FIG. 1 as an example, the second boss 412 is located above the mounting plate 300, and the adapter 420 is located below the annular mounting plate 300. An elastic member 430 is sleeved on the locking rod 410 and located between the first boss 411 and the second boss 412. This elastic member can buffer installation forces, reduce damage to the circuit board, and increase the service life of the circuit board. Another embodiment of the present disclosure provides a server, as shown in FIG. 12 . The server includes a circuit board 500, a chip 600, and a cooling device described in any of the above embodiments. The chip 600 is disposed on the circuit board 500; the cooling device is disposed on the circuit board 500, and the vapor chamber 110 of the cooling device is at least in contact with the chip. Since the server provided by the present disclosure includes the cooling device described in any of the above embodiments, the server provided by the present disclosure also achieves the same benefits as the cooling device described in any of the above embodiments, and will not be further described here.It should be noted that other components on the circuit board 500 can also dissipate heat through cooling equipment. For example, other components can be in contact with the bottom surface of the vapor chamber 110 using thermally conductive material to conduct heat generated by the other components to the vapor chamber 110. In the description of the embodiments of the present disclosure, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, indirect connections through an intermediate medium, internal connections between two components, or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in the embodiments of the present disclosure based on specific circumstances. In the embodiments of the present disclosure, devices or components referred to or implied must have specific orientations, be constructed, and operate in specific orientations, and therefore should not be construed as limiting the embodiments of the present disclosure. In the description of the embodiments of the present disclosure, "plurality" means two or more, unless otherwise specifically specified. In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," "third," "fourth," and so forth (if any) are used to distinguish similar objects and are not necessarily used to describe a particular order or sequential sequence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present disclosure described herein can, for example, be implemented in an order other than that illustrated or described herein. Furthermore, the terms "may include" and "have," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product, or apparatus. Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present disclosure, rather than to limit them. Although the embodiments of the present disclosure have been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.Industrial Applicability The solution provided by the embodiment of the present disclosure can be applied to a cooling device. The liquid cooling device includes a heat dissipation component and a heat spreader component. The heat spreader component includes a heat spreader plate and a first heat dissipation element. The heat spreader plate includes a first accommodating chamber for accommodating a first cooling medium. The first heat dissipation element extends in a direction perpendicular to the heat spreader plate, and includes a first chamber and a second chamber connected to the first accommodating chamber. The second chamber surrounds the outer circumference of the first chamber. The first chamber is connected to the second chamber through a first one-way valve, and the bottom of the second chamber is connected to the first accommodating chamber through a second one-way valve. The heat dissipation component is mounted on the first heat dissipation element and is configured to exchange heat with the first cooling medium. The heated and vaporized first cooling medium enters the second chamber through the first one-way valve and condenses into liquid after exchanging heat with the heat dissipation component. The liquid first cooling medium flows back to the bottom of the first accommodating chamber through the second one-way valve, thereby solving the technical problem of poor cooling effect of the cooling device.

Claims

Claims 1. A cooling device, comprising: A heat spreader assembly, comprising a heat spreader and a first heat sink disposed on the heat spreader, the heat spreader comprising a first accommodating chamber for accommodating a first cooling medium; the first heat sink extends in a direction perpendicular to the heat spreader, and comprises a first chamber and a second chamber connected to the first accommodating chamber; the second chamber surrounds the outer circumference of the first chamber; the first chamber is connected to the second chamber through a first one-way valve, and the bottom of the second chamber is connected to the first accommodating chamber through a second one-way valve; a heat dissipation assembly, which is sleeved on the first heat dissipation assembly and is configured to exchange heat with the first cooling medium; wherein the heated and vaporized first cooling medium enters the second chamber through the first one-way valve, and condenses into a liquid after exchanging heat with the heat dissipation assembly; the liquid first cooling medium flows back to the bottom of the first accommodating chamber through the second one-way valve.

2. The cooling device according to claim 1, wherein: The second chamber surrounds the entire outer circumference of the first chamber, and a buffer chamber is formed between the top of the second chamber and the top of the first chamber.

3. The cooling device according to claim 1, wherein: The second chamber surrounds the outer circumference of the first chamber portion.

4. The cooling device according to claim 2, wherein: The first heat sink comprises a heat dissipation tube and a cylindrical body; the inner cavity of the heat dissipation tube constitutes the first chamber, one end of the heat dissipation tube is connected with the first accommodating chamber, and the other end of the heat dissipation tube is provided with the first one-way valve; the cylindrical body is sleeved on the heat dissipation tube, and the buffer chamber is surrounded by the top of the heat dissipation tube and the top of the cylindrical body; the first connecting hole is provided on the area of ​​the heat spreader opposite to the second chamber, and the second one-way valve is provided in the first connecting hole.

5. The cooling device according to any one of claims 1 to 4, wherein: The first accommodating cavity includes at least two relatively independently arranged sub-chambers, the bottom surfaces of at least two of the sub-chambers are in contact with the component to be cooled, and the top surfaces of at least two of the sub-chambers are connected with the first chamber and the second chamber of the first heat dissipation component.

6. The cooling device according to claim 5, wherein: A plurality of the first heat sinks are disposed at intervals on the heat spreader; and in at least two of the sub-chambers, any one of the sub-chambers is communicated with the first chamber and the second chamber of some of the first heat sinks.

7. The cooling device according to any one of claims 1 to 4, wherein: The heat dissipation assembly includes a heat dissipation housing and a plurality of second heat dissipation members; the heat dissipation housing is disposed on the heat spreader and encloses a second accommodating chamber with the heat spreader; the second accommodating chamber accommodates a second cooling medium; the plurality of second heat dissipation members are spaced and sleeved on the first heat dissipation member in a direction perpendicular to the heat spreader, and is located in the second accommodating cavity; wherein a flow channel is formed between any adjacent second heat dissipating members, and the flow channel extends in a direction parallel to the heat spreader.

8. The cooling device according to claim 7, wherein: A liquid inlet pipe is provided on the top surface of the heat dissipation shell facing away from the heat spreader, the liquid inlet pipe is connected to the second accommodating chamber and is located on one side of the inlet end of the circulation channel; a flow equalizer is provided between the inlet end of the circulation channel and the liquid inlet pipe, the flow equalizer extends in a direction perpendicular to the heat spreader, and one end of the flow equalizer is connected to the top surface of the heat dissipation shell, and the other end of the flow equalizer is connected to the heat spreader; the flow equalizer includes a plurality of flow equalizer portions, and the plurality of flow equalizer portions are configured to balance the flow of the second cooling medium in the plurality of the circulation channels.

9. The cooling device according to claim 8, wherein: The flow balancing component includes a flow balancing plate and a plurality of flow balancing hole groups arranged on the flow balancing plate; the plurality of flow balancing hole groups are arranged at intervals in a direction perpendicular to the heat balancing plate, and each of the flow balancing hole groups is arranged opposite to one of the flow channels to form a flow balancing portion; each of the flow balancing hole groups includes a plurality of flow balancing holes, and each of the flow balancing holes penetrates the flow balancing plate in the thickness direction of the flow balancing plate.

10. The cooling device according to claim 9, wherein: The heat dissipation shell is provided with a liquid outlet pipe on the top surface facing away from the heat spreader, and the liquid outlet pipe is communicated with the second accommodating chamber; the top surface of the heat dissipation shell facing away from the heat spreader is square in shape, and the liquid inlet pipe and the liquid outlet pipe are arranged at the diagonals of the top surface of the heat dissipation shell facing away from the heat spreader.

11. The cooling device according to any one of claims 1 to 4, wherein: The cooling device also includes an annular mounting plate and an annular locking piece, the mounting plate is provided with a first mounting hole; the heat spreader is provided with a second mounting hole, and the second mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the heat spreader and is sleeved on the outer peripheral surface of the heat dissipation component; the locking piece is fixedly connected to the part to be cooled after passing through the first mounting hole and the second mounting hole.

12. The cooling device according to claim 11, wherein: The locking member includes a locking rod and an adapter sleeved on the locking rod; the adapter includes an annular body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular body, and the plurality of elastic claws are arranged at intervals along the circumference of the annular body.

13. The cooling device according to claim 12, wherein: The locking member also includes an elastic member; the locking rod includes a first boss and a second boss arranged at intervals, the second boss and the adapter are respectively located on both sides of the annular mounting plate; the elastic member is sleeved on the locking rod and is located between the first boss and the second boss.

14. The cooling device according to claim 4, wherein: The vapor chamber includes an inner cavity, and the inner cavity of the vapor chamber is communicated with the inner cavity of the heat dissipation pipe.

15. The cooling device according to claim 1, wherein: The second one-way valve is used to prevent the first cooling medium that is heated and vaporized in the first accommodating chamber from entering the second chamber.

16. The cooling device according to claim 1, wherein: The heat dissipation component is a plate-type heat sink or a microchannel heat sink.

17. The cooling device according to claim 2, wherein: The height of the first chamber is smaller than the height of the second chamber.

18. The cooling device according to claim 2, wherein: The second chamber surrounds the outer side surface of the first chamber and surrounds the top surface of the first chamber.

19. The cooling device according to claim 3, wherein: The second chamber is located at one side of the first chamber and surrounds the outer side of the first chamber.

20. A server, comprising a circuit board, a chip and the cooling device according to any one of claims 1 to 19; the chip is arranged on the circuit board; the cooling device is arranged on the circuit board, and a heat spreader of the cooling device is attached to the chip.

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