Epoxy resin composition, cured product, and semiconductor device

Abstract

The present invention provides an epoxy resin composition wherein running on the surface of a BSM-treated silicon chip is less likely to occur.　This epoxy resin composition contains an epoxy resin (A), a curing agent (B), and an inorganic filler (C). The epoxy resin composition has a surface tension of 30-40 mN / m as measured at 110°C using a plate method.

Description

Epoxy resin composition, cured product, and semiconductor device

[0001] The present invention relates to an epoxy resin composition. More specifically, the present invention relates to an epoxy resin composition for semiconductor encapsulation, a cured product, a semiconductor device, and a method for producing a semiconductor device.

[0002] Flip-chip mounting is a technique for mounting semiconductor chips to wiring boards. Flip-chip mounting is a mounting method in which protruding electrodes (bumps) are formed on the surface of a semiconductor chip, the surface with the bumps is oriented toward the wiring board, and the semiconductor chip and wiring board are directly connected via the bumps. To protect the connected semiconductor chip, wiring board, and the bumps in the gap between them (gap), an underfill is filled in the gap and cured to produce a semiconductor component.

[0003] As the underfill, a composition containing a resin component as a base and an inorganic filler, such as an epoxy resin composition, is used. When filling a gap with the underfill, a phenomenon (creeping) may occur in which the resin component of the underfill creeps up to the back surface of the semiconductor chip on which the bumps are formed. Known methods for preventing creeping include treating the surface of the semiconductor chip (i.e., the back surface) to repel creeping components (Patent Document 1) and incorporating a silicone-based additive into the underfill (Patent Document 2).

[0004] JP 2017-188539 A JP 2018-172546 A

[0005] When a semiconductor chip operates, heat is generated. This heat is transferred to a heat spreader via a metal-based or resin-based thermal interface material (TIM) formed on the surface of the semiconductor chip, and then dissipated. When a metal-based TIM is used, a backside metallization (BSM) process is required to improve heat dissipation and metal wettability. The BSM-processed semiconductor chip surface is covered with a gold (Au) film. It has been discovered that filling the gap between a BSM-processed semiconductor chip and a wiring board with underfill can result in the underfill itself, which contains inorganic fillers, climbing onto the surface of the semiconductor chip (the BSM-processed surface). The reason for this phenomenon is thought to be that a gold film with high surface free energy is formed on the silicon chip as a BSM process layer, which makes it easier for not only the metal-based TIM material but also the underfill to wet.

[0006] While creeping is a phenomenon in which only the resin component of the underfill creeps onto the chip, the climbing phenomenon that occurs on BSM-treated surfaces is the climbing of the underfill itself. Therefore, these are completely separate phenomena, and no previous attempts have been made to address this issue. Even if a BSM-treated semiconductor chip surface were treated using a method similar to that described in Patent Document 1 to prevent underfill climbing, it would likely prevent solder from wetting in subsequent processes, resulting in package formation failure. Furthermore, it has been found that blending a silicone-based additive into the underfill, as described in Patent Document 2, reduces the surface tension of the underfill, thereby worsening underfill climbing on BSM-treated surfaces (see Figure 1 and Comparative Example 6 below). Thus, the underfill climbing problem that occurs on BSM-treated surfaces is difficult to solve using conventional technology, and effective solutions are needed.

[0007] Therefore, an object of the present invention is to provide an epoxy resin composition that is less likely to climb onto a BSM-treated silicon chip surface, a cured product of the epoxy resin composition, a semiconductor device including the cured product, and a method for manufacturing the semiconductor device.

[0008] As a result of extensive research into achieving the above object, the present inventors have found that the problems can be solved by using a composition having a specific structure. The present invention was completed based on these findings.

[0009] That is, the present invention provides an epoxy resin composition comprising: an epoxy resin (A); a curing agent (B); and an inorganic filler (C), wherein the epoxy resin composition has a surface tension of 30 to 40 mN / m as measured at 110°C using a plate method.

[0010] The epoxy resin composition preferably further contains a curing accelerator (D).

[0011] The epoxy resin (A) preferably contains a liquid epoxy resin.

[0012] The epoxy resin (A) preferably contains at least one selected from the group consisting of bisphenol F type epoxy resins, bisphenol A type epoxy resins, aminophenol type epoxy resins, and naphthalene type epoxy resins.

[0013] The content of the inorganic filler (C) relative to the epoxy resin composition (100% by mass) is preferably 40 to 75% by mass.

[0014] The inorganic filler (C) preferably has an average particle size of 0.2 to 2.0 μm.

[0015] The inorganic filler (C) is preferably an inorganic filler whose surface has been treated with a silane coupling agent.

[0016] The epoxy resin composition preferably further contains an elastomer (F) (excluding silicone-based elastomers).

[0017] The epoxy resin composition is preferably used for semiconductor encapsulation.

[0018] The epoxy resin composition is preferably an underfill.

[0019] The present invention also provides an epoxy resin composition for use in encapsulating a substrate and a semiconductor element disposed on the substrate, wherein the semiconductor element has a backside metallization treatment performed on the surface opposite to the surface oriented to the substrate.

[0020] The present invention also provides a cured product of the above epoxy resin composition.

[0021] The present invention also provides a semiconductor device comprising: a substrate; a semiconductor element disposed on the substrate; and the cured product that encapsulates the semiconductor element.

[0022] The present invention also provides a method for manufacturing a semiconductor device, comprising the steps of: filling a gap between a substrate and a semiconductor element disposed on the substrate with the epoxy resin composition; and heating and curing the epoxy resin composition.

[0023] The epoxy resin composition of the present invention is less likely to climb onto the surface of a silicon chip that has been treated with BSM, and therefore semiconductor devices comprising a cured product of the epoxy resin composition exhibit high reliability.

[0024] 1 shows a photograph of the BSM-treated surface of a silicon chip in Comparative Example 6. The epoxy resin composition is seen climbing up onto the BSM-treated surface. 2 shows a photograph of the BSM-treated surface of a silicon chip in Example 8. No climbing up of the epoxy resin composition onto the BSM-treated surface is observed.

[0025] (Epoxy Resin Composition) The epoxy resin composition of the present invention comprises an epoxy resin (A), a curing agent (B), and an inorganic filler (C), and is characterized in that the surface tension measured at 110°C using a plate method is 30 to 40 mN / m. The epoxy resin composition may further comprise one or more of a curing accelerator (D), a coupling agent (E), and an elastomer (F), which will be described later.

[0026] The surface tension of the epoxy resin composition is measured by a plate method at 110° C. More specifically, the surface tension can be measured by the method described in the examples below.

[0027] The surface tension of the epoxy resin composition is not particularly limited as long as it is 30 to 40 mN / m, but is preferably 33 to 38 mN / m.

[0028] Epoxy Resin (A) The epoxy resin composition contains the epoxy resin (A), which allows it to form a cured product with high electrical insulation. The number of epoxy groups in the epoxy resin (A) is not particularly limited as long as it is one or more, but it is preferably two or more (i.e., a polyfunctional epoxy resin). The epoxy resin (A) can be used alone or in combination of two or more.

[0029] The epoxy resin (A) may be liquid or solid at room temperature (25° C.), but is preferably liquid from the viewpoint of the viscosity of the epoxy resin composition. A solid epoxy resin can also be preferably used when it is used in combination with a liquid epoxy resin to form a liquid mixture.

[0030] The epoxy resin (A) is not particularly limited, and examples thereof include bisphenol-type epoxy resins such as bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, and bisphenol AF-type epoxy resins, bixylenol-type epoxy resins, cyclohexane-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol novolac-type epoxy resins, phenol novolac-type epoxy resins, tert-butyl-catechol-type epoxy resins, naphthalene-type epoxy resins, naphthol-type epoxy resins, anthracene-type epoxy resins, glycidylamine-type epoxy resins (glycidylamine-type epoxy resins having no aromatic structure or glycidylamine-type epoxy resins having an aromatic structure), glycidyl ester-type epoxy resins (glycidyl ester-type epoxy resins having no aromatic structure or glycidyl ester-type epoxy resins having an aromatic structure), cresol novolac-type epoxy resins, biphenyl-type epoxy resins, and linear aliphatic epoxy resins (linear aliphatic epoxy resins having no aromatic structure).

[0033] Examples of the epoxy resin include aromatic or aliphatic epoxy resins such as epoxy resins having a butadiene structure (epoxy resins having a butadiene structure without an aromatic structure or epoxy resins having a butadiene structure with an aromatic structure), alicyclic epoxy resins (alicyclic epoxy resins having a butadiene structure without an aromatic structure or alicyclic epoxy resins having an aromatic structure), heterocyclic epoxy resins, spiro ring-containing epoxy resins (spiro ring-containing epoxy resins having a spiro ring without an aromatic structure or spiro ring-containing epoxy resins having an aromatic structure), cyclohexanedimethanol-type epoxy resins (cyclohexanedimethanol-type epoxy resins having a non-aromatic structure or cyclohexanedimethanol-type epoxy resins having an aromatic structure), naphthylene ether-type epoxy resins, trimethylol-type epoxy resins (trimethylol-type epoxy resins having a non-aromatic structure or trimethylol-type epoxy resins having an aromatic structure), tetraphenylmethane-type epoxy resins, aminophenol-type epoxy resins, and silicone-modified epoxy resins.

[0031] Among these, it is more preferable that the epoxy resin (A) contains at least one selected from the group consisting of bisphenol-type epoxy resins such as bisphenol F-type epoxy resins and bisphenol A-type epoxy resins, aminophenol-type epoxy resins, and naphthalene-type epoxy resins. On the other hand, there is a tendency to avoid the use of epoxy resins (e.g., silicone-modified epoxy resins) that lead to a decrease in the surface tension of the epoxy resin composition. In other words, it is preferable to exclude the use of the above-mentioned silicone-modified epoxy resins as the epoxy resin (A).

[0032] Specific examples of liquid epoxy resins include "YDF-8170" (bisphenol F type epoxy resin), "YDF-8125" (bisphenol A type epoxy resin), "ZX-1658" and "ZX-1658GS" (liquid 1,4-glycidylcyclohexane) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "HP-4032", "HP-4032D", and "HP-4032SS" (naphthalene type epoxy resin) manufactured by DIC Corporation; and "jER828US", "jER828EL" (bisphenol A type epoxy resin), "jER806", and "jER807" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation. Examples of epoxy resins include bisphenol A epoxy resin, bisphenol F epoxy resin, jER152 (phenol novolac epoxy resin), jER630, jER630LSD, EP3980S (aminophenol epoxy resin), YX7400 (high impact resilience epoxy resin), ZX1059 (a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., EX-721 (glycidyl ester epoxy resin) manufactured by Nagase ChemteX Corporation, and CELLOXIDE 2021P (alicyclic epoxy resin) manufactured by Daicel Corporation.

[0033] Specific examples of solid epoxy resins include "HP-4032H" (naphthalene type epoxy resin), "HP-4700", "HP-4710" (naphthalene type tetrafunctional epoxy resin), "N-690" (cresol novolac type epoxy resin), "N-695" (cresol novolac type epoxy resin), "HP-7200", "HP-7200L", "HP-7200HH", "HP-7200H", "HP-7200HHH" (dicyclopentadiene type epoxy resin), "EXA850CRP", "EXA7311", and " EXA7311-G3, EXA7311-G4, EXA7311-G4S, HP6000 (naphthylene ether type epoxy resin), Nippon Kayaku Co., Ltd.'s EPPN-502H (trisphenol type epoxy resin), NC-7000-L (naphthol novolac type epoxy resin), NC-3000-H, NC-3000, NC-3000-L, NC-3100 (biphenyl type epoxy resin), Nippon Steel Chemical & Material Co., Ltd.'s ESN475V (naphthol type epoxy resin), ESN 485" (naphthol novolac type epoxy resin), Mitsubishi Chemical Corporation's "YX4000H", "YL6121" (biphenyl type epoxy resin), "YX4000HK" (bixylenol type epoxy resin), "YL7760" (bisphenol AF type epoxy resin), "YX8800" (anthracene type epoxy resin), Osaka Gas Chemicals Co., Ltd.'s "PG-100" and "CG-500", Mitsubishi Chemical Corporation's "YL7800" (fluorene type epoxy resin), Mitsubishi Chemical Corporation's "jER1010" (solid bisphenol A type epoxy resin), Examples of epoxy resins include "jER1031S" (tetraphenylethane type epoxy resin), "jER157S70" (bisphenol novolac type epoxy resin), "YX4000HK" (bixylenol type epoxy resin) and "YX8800" (anthracene type epoxy resin) manufactured by Mitsubishi Chemical Corporation, "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals Co., Ltd., "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical Corporation, and "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation.

[0034] The epoxy equivalent of the epoxy resin (A) is not particularly limited, but is preferably, for example, 30 to 1000 g / eq, more preferably 40 to 500 g / eq, and even more preferably 50 to 300 g / eq.

[0035] The content of the epoxy resin (A) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is, for example, preferably 5% by mass or more, more preferably 8% by mass or more, even more preferably 12% by mass or more, particularly preferably 15% by mass or more, and most preferably 18% by mass or more. Also, for example, it is preferably 60% by mass or less, more preferably 50% by mass or less, even more preferably 45% by mass or less, particularly preferably 40% by mass or less, and most preferably 35% by mass or less. By having the content of the epoxy resin (A) within the above range, the thermal expansion of the cured product tends to be reduced and the toughness tends to be improved.

[0036] Curing agent (B) The curing agent (B) is not particularly limited as long as it initiates, progresses, or accelerates the polymerization of the epoxy resin, and examples thereof include amine-based curing agents, acid anhydride-based curing agents, phenol-based curing agents, and imidazole-based curing agents. The curing agent (B) can be used alone or in combination of two or more.

[0037] Examples of the amine-based curing agents include aromatic amines such as 4,4'-diamino-3,3'-diethyldiphenylmethane, diethyltoluenediamine, dimethylthiotoluenediamine, methylenedianiline, 4,4'-methylenebis(2-ethylaniline), m-phenylenediamine, 4,4'-diaminodiphenylsulfone, and 3,3'-diaminodiphenylsulfone. Examples of the acid anhydride-based curing agents include alkylated tetrahydrophthalic anhydrides such as methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, phthalic anhydride, dodecenyl succinic anhydride, and methylnadic anhydride. Examples of the phenol-based curing agents include phenol novolac resin, cresol novolac resin, naphthol-modified phenolic resin, dicyclopentadiene-modified phenolic resin, and p-xylene-modified phenolic resin. Examples of the imidazole curing agent include 2-methylimidazole, 2-undecylimidazole, 1-cyanoethyl-2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-imidazole, 2-phenylimidazole, and 2-phenyl-4-methylimidazole. Examples of the imidazole curing agent include microcapsule-type imidazole curing agents. Aromatic amines are preferred as the amine curing agent.

[0038] The equivalent weight (molecular weight per functional group) of the curing agent (B) is not particularly limited, but is, for example, preferably 10 to 600 g / eq, more preferably 20 to 400 g / eq, and even more preferably 30 to 200 g / eq.

[0039] The content of the curing agent (B) relative to the epoxy resin composition (100% by mass) of the present invention is not particularly limited, but is, for example, preferably 0.1% by mass or more, more preferably 0.3% by mass or more, even more preferably 0.5% by mass or more, and particularly preferably 1% by mass or more. Furthermore, although not particularly limited, it is, for example, preferably 60% by mass or less, more preferably 50% by mass or less, even more preferably 40% by mass or less, and particularly preferably 30% by mass or less. By having the content of the curing agent (B) within the above range, the thermal expansion of the cured product tends to be reduced and the toughness tends to be improved.

[0040] Inorganic Filler (C) The inorganic filler (C) is not particularly limited, but is preferably (1) one having the property of suppressing volumetric shrinkage (cure shrinkage) resulting from the curing reaction of the epoxy resin composition, (2) one having the property of suppressing volumetric change due to heating of the cured product (thermal shrinkage), i.e., one having the effect of lowering the linear expansion coefficient when added, or (3) one having both of these properties.

[0041] Examples of inorganic filler (C) include silica (silicon dioxide), silicon carbide, silicon nitride, alumina (aluminum oxide), aluminum nitride, aluminum hydroxide, aluminum silicate, magnesium silicate, calcium silicate, calcium carbonate, barium sulfate, barium carbonate, titanium oxide, lime sulfate, potassium titanate, magnesium carbonate, zinc oxide, boron nitride, zirconia (zirconium oxide), and inorganic particles whose surfaces are treated with these.Among these, silica is preferred from the viewpoint of being able to increase the loading amount.The inorganic filler (C) can be used alone or in combination of two or more.

[0042] In order to maintain the viscosity of the epoxy resin composition within an appropriate range, the inorganic filler (C) is preferably surface-treated with a coupling agent having a functional group such as an epoxy group, a (meth)acryloyl group, or an amino group (particularly a phenylamino group). Examples of the coupling agent include silane coupling agents such as 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysilane. For the surface treatment of the inorganic filler (C), one of the above coupling agents can be used alone, or two or more can be used in combination.

[0043] The shape of the inorganic filler (C) is not particularly limited, and examples thereof include spherical (e.g., spherical, nearly spherical), polyhedral, rod-like (e.g., cylindrical, prismatic), plate-like, flaky, and irregular shapes. Among these, spherical shapes are preferred from the viewpoint of achieving a high loading amount.

[0044] The average particle size of the inorganic filler (C) is not particularly limited, but is preferably 1 nm to 10 μm, more preferably 0.1 to 5 μm, and even more preferably 0.2 to 2 μm. When the average particle size of the inorganic filler (C) is within the above range, the particle size is not too large, so that the injectability of the epoxy resin composition is less likely to decrease even in a narrow gap, and the viscosity of the epoxy resin composition can be adjusted to facilitate dispensing. Two or more inorganic fillers with different average particle sizes may be used in combination to adjust the viscosity of the epoxy resin composition. In this specification, the method for measuring the average particle size of the inorganic filler (C) is not particularly limited, but it can be measured, for example, using a laser diffraction / scattering particle size distribution analyzer (product name: LS 13 320, manufactured by Beckman Coulter, Inc.).

[0045] The content of the inorganic filler (C) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is preferably, for example, 20% by mass or more, more preferably 30% by mass or more, even more preferably 40% by mass or more, particularly preferably 45% by mass or more, and most preferably 50% by mass or more. Furthermore, although not particularly limited, it is, for example, preferably 90% by mass or less, more preferably 80% by mass or less, even more preferably 75% by mass or less, and particularly preferably 70% by mass or less. By keeping the content of the inorganic filler (C) within the above range, the filler tends to be less likely to climb up onto the BSM-treated silicon chip surface.

[0046] Curing Accelerator (D) The curing accelerator (D) has the property of accelerating the curing of epoxy resins. The curing accelerator is not particularly limited, but examples thereof include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-phenyl-4-methylimidazole. Commercially available products include 2-phenyl-4-methylimidazole (manufactured by Shikoku Chemical Industries, Ltd., trade name "2P4MZ"), 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine (manufactured by Shikoku Chemical Industries, Ltd., trade name "2MZA"), and dicyandiamide. Alternatively, encapsulated imidazole, also known as microencapsulated imidazole or epoxy adduct imidazole, may also be used. For example, "HX3941HP", "HXA3942HP", "HXA3922HP", "HXA3792", "HX3748", "HX3721", "HX3722", "HX3088", "HX3741", "HX3742", "HX3613" (all manufactured by Asahi Kasei Chemicals Corporation), "PN-23J", "PN-40J", "PN-50" (manufactured by Ajinomoto Fine-Techno Co., Ltd.), "FXR-1121" (manufactured by Fuji Chemical Industry Co., Ltd.), etc. The curing accelerator (D) can be used alone or in combination of two or more.

[0047] Since the curing accelerator (D) has the property of accelerating the curing of the epoxy resin, the inclusion of the curing accelerator (D) in the epoxy resin composition allows the curing reaction to be completed before the epoxy resin composition begins to climb up. Therefore, from the viewpoint of preventing the epoxy resin composition from climbing up onto the BSM-treated silicon chip surface, it is preferable that the epoxy resin composition of the present invention contains the curing accelerator (D).

[0048] The content of the curing accelerator (D) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is, for example, preferably 0.01% by mass or more, more preferably 0.02% by mass or more, and is, for example, not particularly limited, preferably 5.0% by mass or less, more preferably 3.0% by mass or less.

[0049] Coupling Agent (E) The coupling agent (E) is not particularly limited, and examples thereof include various coupling agents such as vinyl-based, glycidoxy-based, methacryl-based, amino-based, mercapto-based, or imidazole-based silane coupling agents; alkoxide-based, chelate-based, or acylate-based titanium coupling agents; and long-chain spacer coupling agents such as glycidoxyoctyltrimethoxysilane or methacrylooctyltrimethoxysilane. The coupling agent (E) can be used alone or in combination of two or more.

[0050] Examples of the silane coupling agent include 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and 3-methacryloxypropyltrimethoxysilane.

[0051] The content of the coupling agent (E) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, for example, and is not particularly limited, but is preferably 5.0% by mass or less, more preferably 3.0% by mass or less.

[0052] Elastomer (F) The elastomer (F) can impart toughness to the cured product. Therefore, when the above-mentioned epoxy resin composition containing the elastomer (F) is used as an underfill, cracking is reduced and high product reliability is achieved. The elastomer (F) is not particularly limited, but examples thereof include butadiene-based elastomers, silicone-based elastomers, acrylic copolymers, styrene-butadiene-based elastomers, butadiene-acrylonitrile-2,3-epoxypropyl methacrylate-divinylbenzene copolymers, butadiene-acrylonitrile-methacrylic acid-divinylbenzene copolymers, amino-terminated butadiene-acrylonitrile copolymers, and carboxyl-terminated butadiene-acrylonitrile copolymers. On the other hand, there is a tendency to avoid the use of elastomers (e.g., silicone-based elastomers) that reduce the surface tension of the epoxy resin composition. In other words, it is preferable to exclude the use of the above-mentioned silicone-based elastomers as the elastomer (F). The elastomer (F) may be used alone or in combination of two or more kinds.

[0053] The elastomer (F) is preferably a core-shell rubber particle. That is, it is preferably a core-shell rubber type elastomer. The core-shell rubber particle refers to a rubber particle composed of a core portion and one or more shell layers covering the core portion. The core-shell rubber particle has a core portion composed of a material with excellent flexibility and a shell layer composed of a material with excellent affinity for the components contained in the epoxy resin composition, particularly the epoxy resin (A), and thereby exhibits good dispersibility in the epoxy resin composition and can impart high toughness to the cured product.

[0054] In the core-shell rubber particles, the core is formed from a material with excellent flexibility. Examples of materials for forming the core include silicone rubber, butadiene rubber, styrene rubber, acrylic rubber, polyolefin rubber, and silicone / acrylic composite rubber. Materials for forming the shell layer are preferably those having excellent affinity with the components contained in the epoxy resin composition of the present invention (particularly the epoxy resin (A)). Examples of materials for forming the shell layer include epoxy resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, and glycidyl methacrylate, and acrylic resin. One type of core-shell rubber particle can be used alone, or two or more types can be used in combination.

[0055] Commercially available elastomers (F) include "Kane Ace MX-153", "Kane Ace MX-257", "Kane Ace MX-154", "Kane Ace MX-960", "Kane Ace MX-136", "Kane Ace MX-137", "Kane Ace MX-965", "Kane Ace MX-217", "Kane Ace MX-227M75", "Kane Ace MX-334M75", "Kane Ace MX-416", and "Kane Ace MX-451" manufactured by Kaneka Corporation; and "Metablen C-223A", "Metablen C-140A", "Metablen E-860A", "Metablen E-870A", "Metablen E-875A", "Metablen S-2100", and "Metablen E-875A" manufactured by Mitsubishi Chemical Corporation. Examples of such elastomers include "S-2200" and "Metabrene S-2260" manufactured by Aica Kogyo Co., Ltd., "Staphyloid IM-203," "Staphyloid IM-401," "Staphyloid IM-601," "Staphyloid AC3355," and "Staphyloid AC3816" manufactured by Nippon Shokubai Co., Ltd., "Acryset BPA328" and "Acryset BPF307" manufactured by Nippon Shokubai Co., Ltd., and "EP 2240 A," "EP 5340," "PU 5640," "VE3340," and "XP1 / 0767" manufactured by EVONIC Corporation. Among these, core-shell butadiene elastomers are preferred from the viewpoint of crack resistance.

[0056] The content of the elastomer (F) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is, for example, preferably 0.1% by mass or more, more preferably 0.3% by mass or more, even more preferably 0.5% by mass or more, and particularly preferably 1.0% by mass or more. The content is also not particularly limited, but is, for example, preferably 20.0% by mass or less, more preferably 15.0% by mass or less, more preferably 12.0% by mass or less, more preferably 10.0% by mass or less, even more preferably 8.0% by mass or less, particularly preferably 5.0% by mass or less, and most preferably 3.0% by mass or less.

[0057] Other Components (G) The epoxy resin composition may contain components other than the epoxy resin (A), curing agent (B), inorganic filler (C), curing accelerator (D), coupling agent (E), and elastomer (F) (hereinafter referred to as "other components (G)"). Examples of other components (G) include curable compounds other than the epoxy resin (A), thermoplastic resins such as polyethylene resins, polyester resins, polyurethane resins, and polyamide resins, surfactants, ion trapping agents, leveling agents, antioxidants, antifoaming agents, flame retardants, colorants such as carbon black, reactive diluents, and solvents. The other components (G) may be used alone or in combination of two or more.

[0058] The content of the other component (G) relative to the epoxy resin composition (100% by mass) is not particularly limited as long as it does not impair the effects of the present invention, but is, for example, preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, and particularly preferably 1% by mass or less. Also, although not particularly limited, it is, for example, preferably 0.001% by mass or more, more preferably 0.01% by mass or more, and even more preferably 0.1% by mass or more.

[0059] However, from the viewpoint of maintaining the surface tension of the epoxy resin composition within an appropriate range with respect to the surface of a silicon chip that has been subjected to backside metallization treatment, it is preferable that the surfactant is not contained, or if contained, it is contained in a small amount. Specifically, the content of the surfactant relative to the epoxy resin composition (100% by mass) is, for example, preferably 0.1% by mass or less, more preferably 0.01% by mass or less, even more preferably 0.001% by mass or less, particularly preferably 0.0001% by mass or less, and most preferably 0% by mass.

[0060] (Physical Properties and Production Method of Epoxy Resin Composition) The viscosity of the epoxy resin composition at 25°C is not particularly limited, but is, for example, preferably 0.1 to 300 Pa·s, more preferably 1 to 150 Pa·s, even more preferably 3 to 100 Pa·s, and particularly preferably 5 to 80 Pa·s. Having a viscosity within the above range tends to facilitate filling into gaps. As in the examples described below, the viscosity can be measured using a Brookfield viscometer (model number: HBDV-1, manufactured by Brookfield) at a liquid temperature of 25°C and rotated at 50 rpm for 1 minute.

[0061] The viscosity (initial viscosity) of the epoxy resin composition at 110°C is not particularly limited, but is preferably 0.001 to 5 Pa·s, more preferably 0.01 to 1 Pa·s, even more preferably 0.02 to 0.5 Pa·s, and particularly preferably 0.03 to 0.3 Pa·s. Having a viscosity within the above range tends to facilitate gap filling. As described in the Examples below, the viscosity can be measured using a rheometer (HAAKE MARS60, manufactured by Thermo Fisher Scientific) under measurement conditions of 35 mm parallel plates, oscillation mode, and a frequency of 1 Hz. The initial viscosity refers to the viscosity measured within 3 minutes (particularly 30 seconds) after the start of measurement.

[0062] The epoxy resin composition can be prepared by a known, conventional method. For example, the epoxy resin (A), curing agent (B), inorganic filler (C), and, optionally, at least one selected from the group consisting of curing accelerator (D), coupling agent (E), elastomer (F), and other components (G), can be simultaneously or separately introduced into an appropriate mixer and stirred and mixed while melting by heating as needed. If the epoxy resin (A) is solid, it is preferably liquefied or fluidized by heating before mixing. If it is difficult to uniformly disperse the inorganic filler (C) in the epoxy resin composition, the epoxy resin (A) and inorganic filler (C) can be heated and mixed to uniformly disperse the inorganic filler (C) in the epoxy resin (A), followed by cooling as needed, and then mixing with components such as the curing agent (B). This allows the epoxy resin composition to be prepared.

[0063] The mixer is not particularly limited, and examples thereof include a roll mill equipped with a stirrer and a heater, a Raikai mixer, a Henschel mixer, a tumbler, a planetary mixer, etc. The mixing ratio of each component is appropriately set depending on the content of each component in the epoxy resin composition.

[0064] The epoxy resin composition can be preferably used as a material for encapsulating semiconductor elements, wiring, solder (solder bumps), and other materials disposed on a substrate in a semiconductor device (an epoxy resin composition for semiconductor encapsulation). By using the epoxy resin composition as an epoxy resin composition for semiconductor encapsulation, a highly reliable encapsulated body can be produced. The epoxy resin composition can also be preferably used as a material for encapsulating semiconductor elements, etc., disposed on a substrate in a flip-chip semiconductor device (an epoxy resin composition for flip-chip semiconductor encapsulation). Specifically, by filling the gap between the semiconductor element, etc., and the substrate with the epoxy resin composition and subjecting it to thermal curing, the bump electrodes present in the gap can be encapsulated while the semiconductor element and the substrate are fixed together as an encapsulated body, thereby improving thermal cycle resistance.

[0065] The epoxy resin composition for semiconductor encapsulation is used, for example, as an underfill such as a capillary underfill, a liquid mold underfill, a secondary underfill, or a pre-applied underfill, a grab-top material, or a liquid compression molding material. The epoxy resin composition is not limited to the use as the epoxy resin composition for semiconductor encapsulation described above, and can also be used, for example, as an adhesive for fixing, joining, or protecting components that constitute electronic components.

[0066] The epoxy resin composition for semiconductor encapsulation is particularly preferably used for encapsulating a substrate and a semiconductor element disposed on the substrate, the semiconductor element being characterized in that the surface opposite to the surface oriented to the substrate has been subjected to backside metallization treatment.

[0067] (Cured Product of Epoxy Resin Composition) A cured product is formed by curing the epoxy resin composition. The curing method is not particularly limited, but for example, the curing can be carried out by subjecting the epoxy resin composition to a heat treatment. The temperature of the heat treatment is not particularly limited, but for example, 60 to 200°C is preferred, and 80 to 180°C is more preferred. The time of the heat treatment is not particularly limited, but for example, 0.1 to 5 hours is preferred, and 0.5 to 3 hours is more preferred.

[0068] The glass transition temperature (Tg) of the cured product is not particularly limited, but is preferably 60°C or higher, more preferably 80°C or higher, even more preferably 100°C or higher, particularly preferably 120°C or higher, and most preferably 130°C or higher. It is also preferably 250°C or lower, more preferably 240°C or lower, more preferably 230°C or lower, even more preferably 220°C or lower, particularly preferably 210°C or lower, and most preferably 200°C or lower. The glass transition temperature (Tg) can be measured, for example, by the method described in the Examples below. Having a glass transition temperature within the above range tends to result in excellent reliability of the resulting cured product. Here, reliability refers, for example, to the property that, when a semiconductor element is encapsulated with the epoxy resin composition, there is little peeling between the bump and the encapsulant (the cured product).

[0069] (Semiconductor Device) The semiconductor device of the present invention comprises a substrate, a semiconductor element disposed on the substrate, and a cured product of the epoxy resin composition that encapsulates the semiconductor element. The semiconductor device is preferably a flip-chip type semiconductor device. A flip-chip type semiconductor device has a structure in which an electrode portion on a substrate and the semiconductor element are connected via bump electrodes. In addition, in the semiconductor device, the gap between the semiconductor element and the substrate is encapsulated with a cured product (encapsulant) of the epoxy resin composition.

[0070] The semiconductor device particularly comprises a substrate and a semiconductor element disposed on the substrate, and it is preferable that the semiconductor element has a backside metallization treatment performed on the rear surface opposite to the surface oriented to the substrate.

[0071] A semiconductor device can be manufactured by filling the gap between the substrate and a semiconductor element disposed on the substrate with the epoxy resin composition (filling step) and then heating and curing the epoxy resin composition (sealing step). The method for filling the gap with the epoxy resin composition is not particularly limited; for example, the epoxy resin composition can be applied to one end of the substrate or the semiconductor element while heating the substrate to 50 to 120°C, thereby filling the gap between the substrate and the semiconductor element with the epoxy resin composition by capillary action. After filling the gap with the epoxy resin composition, the substrate is heated at a predetermined temperature for a predetermined time, specifically, at the temperature and for the time described above for the heat treatment in forming the cured product, thereby sealing the gap.

[0072] The present invention will be described in more detail below based on examples, but the present invention is not limited to these examples.

[0073] The epoxy resin compositions of Examples 1 to 15 and Comparative Examples 1 to 8 were prepared by mixing an epoxy resin (A), a curing agent (B), an inorganic filler (C), and, if necessary, one or more components selected from the group consisting of a curing accelerator (D), a coupling agent (E), an elastomer (F), and other components (G) in the blending ratios shown in Tables 1 and 2. The numerical values ​​for each component in Tables 1 and 2 indicate parts by mass.

[0074] Each component in Table 1 will be explained below.Epoxy resin (A) YDF-8170 (product name): bisphenol F type epoxy resin, epoxy equivalent 158 ​​g / eq, liquid at 25°C, manufactured by Nippon Steel Chemical & Material Co., Ltd. HP-4032D (product name): naphthalene type epoxy resin, epoxy equivalent 140 eq, liquid at 25°C, manufactured by DIC Corporation jER630 (product name): aminophenol type epoxy resin, epoxy equivalent 98 g / eq, liquid at 25°C, manufactured by Mitsubishi Chemical Corporation EXA850CRP (product name): bisphenol A type epoxy resin, epoxy equivalent 173 g / eq, liquid at 25°C, manufactured by DIC Corporation Curing agent (B) HD AA / product name "KAYAHARD AA": 4,4'-methylenebis(2-ethylaniline), manufactured by Nippon Kayaku Co., Ltd. Ethacure 100 Plus (product name): Diethyltoluenediamine, manufactured by Albemarle Corporation. EH105L (product name): Dimethylthiotoluenediamine (containing modified aromatic amines), manufactured by ADEKA Corporation. Inorganic filler (C) SE2200-SEJ (product name): Silicon dioxide with an average particle size of 1.5 μm and a surface treated with 3-glycidoxypropyltrimethoxysilane, manufactured by Admatechs Co., Ltd. Curing accelerator (D) CG-1400 / product name "AMICURE CG-1400": Dicyandiamide, manufactured by Evonik Japan Co., Ltd. Coupling agent (E) KBM-403 (product name): 3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd. Elastomer (F) MX137: Product name / Kane Ace MX137, manufactured by Kaneka Corporation, bisphenol F epoxy resin containing core-shell butadiene elastomer (mass ratio of bisphenol F epoxy resin:core-shell butadiene elastomer is 67:33). Epoxy equivalent is 227. MX965: Product name / Kane Ace MX965, manufactured by Kaneka Corporation, bisphenol F epoxy resin containing core-shell silicone elastomer (mass ratio of bisphenol F epoxy resin:core-shell silicone elastomer is 75:25). Epoxy equivalent is 224. Other components (G) KF6013 (product name): polyether-modified organopolysiloxane, silicone surfactant Carbon black: manufactured by Orion Engineered Carbons Co., Ltd.

[0075] (Evaluation 1: Riding Evaluation) A 10 mm silicon chip (manufactured by Cima Electronics Co., Ltd., wafer size 8 inches, thickness 650 μm, Ti / Ni / Au each 0.1 μm) that had been subjected to BSM treatment was bonded to an FR-4 substrate. ２ The specimens were subjected to plasma treatment under conditions of 50 W, 30 sec, and a gas flow rate of 21 sccm. The resulting specimens were heated to 110°C, and the epoxy resin compositions of Examples 1 to 15 and Comparative Examples 1 to 8 were applied to all four sides of the substrate so as to contact the side of the silicon chip. The specimens were then cured at 165°C for 120 minutes. After curing, the BSM-treated surface was observed using a CCD. If any changes resembling lifting were observed on the BSM-treated surface, further EDS analysis was performed using a SEM (scanning electron microscope). Whether or not lifting of the epoxy resin composition had occurred was determined based on whether or not Si, a component of the inorganic filler, was detected. That is, if Si was detected during EDS analysis using SEM, it was determined that lifting had occurred. The results are listed in the "Lifting Evaluation" section of Tables 1 and 2. The evaluation criteria were as follows: when the epoxy resin composition was observed to climb up, as in Comparative Example 6 shown in FIG. 1, it was marked with "X"; and when the epoxy resin composition was not observed to climb up, as in Example 8 shown in FIG. 2, it was marked with "◯".

[0076] (Evaluation 2: Measurement of surface tension at 110°C) The surface tension (unit: mN / m) at 110°C of the epoxy resin compositions of Examples 1 to 15 and Comparative Examples 1 to 8 was measured using a Tension meter K100C manufactured by KRUSS Lab Desk by the plate method under the following conditions: Detection speed: 10 mm / min, Detection Sensitivity: 0.005 g, Immersion Depth: 2.00 mm, and Measurement time: 800 sec. The average value of the values ​​measured over a measurement time of 750 to 800 sec was taken as the surface tension value. The results are shown in Tables 1 and 2 under "Surface tension (mN / m)."

[0077] (Evaluation 3: Measurement of Glass Transition Temperature (Tg)) Using a dynamic viscoelasticity apparatus, the storage modulus (E') and loss modulus (E'') of the cured products of the epoxy resin compositions of Examples 1 to 15 and Comparative Examples 1 to 8 were measured, and the peak value of tan δ, which is the ratio of these values, was determined as the glass transition temperature (Tg). The above measurement was performed in accordance with Japanese Industrial Standard JIS C6481.

[0078] More specifically, a Teflon® sheet was first attached to the surface of a 3 mm thick glass plate, and spacers (heat-resistant tape layered on top) were placed on top of it in two locations to ensure a film thickness of 2000±100 μm for the cured product. Next, the epoxy resin composition was applied between the spacers, sandwiched between two glass plates with Teflon® sheets attached to their surfaces to avoid trapping air bubbles, and cured at 165°C for 2 hours to obtain a cured product. Finally, the cured product was peeled from the Teflon® sheet-attached glass plate and cut to the specified dimensions (10 mm x 50 mm) using a cutting machine to obtain a test specimen. The glass transition temperature (Tg) of this test specimen was measured using a dynamic thermomechanical analyzer (DMA) (DMA7100, Hitachi High-Tech Science Corporation) in the range of -60°C to 260°C, at a frequency of 1 Hz, at a heating rate of 3°C / min, and by a double-support bending method. Tg was calculated from the peak temperature (°C) of tan δ calculated from E" / E'. The results are shown in Tables 1 and 2 under "Glass transition temperature (Tg)".

[0079] (Evaluation 4: Measurement of viscosity at 25°C) The viscosity (Pa s) at 25°C immediately after preparation of the epoxy resin compositions of Examples 1 to 15 and Comparative Examples 1 to 8 was measured using a Brookfield viscometer (model number: HBDV-1, manufactured by Brookfield) at a liquid temperature of 25°C, while rotating at 50 rpm for 1 minute. The results are shown in Tables 1 and 2 under "Viscosity at 25°C (Pa s)."

[0080]

[0081]

[0082] In summary, variations of the present invention are listed below. [1] An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin composition has a surface tension of 30 to 40 mN / m measured at 110°C using a plate method. [2] The epoxy resin composition according to [1], wherein the surface tension is 33 mN / m or more or 38 mN / m or less. [3] The epoxy resin composition according to [1] or [2], wherein the epoxy resin (A) comprises an epoxy resin that is liquid at 25°C. [4] The epoxy resin composition according to any one of [1] to [3], wherein the epoxy resin (A) comprises at least one selected from the group consisting of bisphenol-type epoxy resins such as bisphenol F-type epoxy resins and bisphenol A-type epoxy resins, aminophenol-type epoxy resins, and naphthalene-type epoxy resins. [5] The epoxy resin composition according to any one of [1] to [4], wherein the epoxy resin (A) does not comprise a silicone-modified epoxy resin. [6] The epoxy resin composition according to any one of [1] to [5], wherein the epoxy equivalent of the epoxy resin (A) is 30 to 1000 g / eq, 40 to 500 g / eq, or 50 to 300 g / eq. [7] The epoxy resin composition according to any one of [1] to [6], wherein the content of the epoxy resin (A) relative to the epoxy resin composition (100% by mass) is 5% by mass or more, 8% by mass or more, 12% by mass or more, 15% by mass or more, or 18% by mass or more. [8] The epoxy resin composition according to any one of [1] to [7], wherein the content of the epoxy resin (A) relative to the epoxy resin composition (100% by mass) is 60% by mass or less, 50% by mass or less, 45% by mass or less, 40% by mass or less, or 35% by mass or less. [9] The epoxy resin composition according to any one of [1] to [8], wherein the curing agent (B) comprises at least one selected from the group consisting of an amine-based curing agent, an acid anhydride-based curing agent, a phenol-based curing agent, and an imidazole-based curing agent.

[10] The epoxy resin composition according to [9], wherein the amine-based curing agent comprises at least one aromatic amine selected from the group consisting of 4,4'-diamino-3,3'-diethyldiphenylmethane, diethyltoluenediamine, dimethylthiotoluenediamine, methylenedianiline, 4,4'-methylenebis(2-ethylaniline), m-phenylenediamine, 4,4'-diaminodiphenylsulfone, and 3,3'-diaminodiphenylsulfone.

[11] The epoxy resin composition according to any one of [1] to

[10] , wherein the equivalent weight (molecular weight per functional group) of the curing agent (B) is 10 to 600 g / eq, 20 to 400 g / eq, or 30 to 200 g / eq.

[12] The epoxy resin composition according to any one of [1] to

[11] , wherein the content of the curing agent (B) relative to the epoxy resin composition (100% by mass) is 0.1% by mass or more, 0.3% by mass or more, 0.5% by mass or more, or 1% by mass or more.

[13] The epoxy resin composition according to any one of [1] to

[12] , wherein the content of the curing agent (B) relative to the epoxy resin composition (100% by mass) is 60% by mass or less, 50% by mass or less, 40% by mass or less, or 30% by mass or less.

[14] The epoxy resin composition according to any one of [1] to

[13] , wherein the inorganic filler (C) comprises at least one selected from the group consisting of silica (silicon dioxide), silicon carbide, silicon nitride, alumina (aluminum oxide), aluminum nitride, aluminum hydroxide, aluminum silicate, magnesium silicate, calcium silicate, calcium carbonate, barium sulfate, barium carbonate, titanium oxide, lime sulfate, potassium titanate, magnesium carbonate, zinc oxide, boron nitride, zirconia (zirconium oxide), and inorganic particles having their surfaces treated.

[15] The epoxy resin composition according to any one of [1] to

[14] , wherein the inorganic filler (C) is an inorganic filler that has been surface-treated with a coupling agent having a functional group such as an epoxy group, a (meth)acryloyl group, or an amino group (particularly a phenylamino group).

[16] The epoxy resin composition according to

[15] , wherein the coupling agent comprises at least one silane coupling agent selected from the group consisting of 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysilane.

[17] The epoxy resin composition according to any one of [1] to

[16] , wherein the inorganic filler (C) has an average particle size of 1 nm to 10 μm, 0.1 to 5 μm, or 0.2 to 2 μm.

[18] The epoxy resin composition according to any one of [1] to

[17] , wherein the content of the inorganic filler (C) relative to the epoxy resin composition (100 mass%) is 20 mass% or more, 30 mass% or more, 40 mass% or more, 45 mass% or more, or 50 mass% or more.

[19] The epoxy resin composition according to any one of [1] to

[18] , wherein the content of the inorganic filler (C) relative to the epoxy resin composition (100% by mass) is 90% by mass or less, 80% by mass or less, 75% by mass or less, or 70% by mass or less.

[20] The epoxy resin composition according to any one of [1] to

[19] , further comprising a curing accelerator (D).

[21] The epoxy resin composition according to any one of [1] to

[20] , further comprising an elastomer (F) (excluding silicone-based elastomers).

[22] The epoxy resin composition according to any one of [1] to

[21] , which is used for semiconductor encapsulation.

[23] The epoxy resin composition according to

[22] , which is used as an underfill.

[24] The epoxy resin composition according to any one of [1] to

[23] , which is used to encapsulate a substrate and a semiconductor element disposed on the substrate, wherein the semiconductor element is characterized in that the surface opposite to the surface oriented to the substrate is subjected to backside metallization treatment.

[25] A cured product of the epoxy resin composition according to any one of [1] to

[23] .

[26] A semiconductor device comprising: a substrate; a semiconductor element disposed on the substrate; and the cured product according to

[25] that encapsulates the semiconductor element.

[27] A method for manufacturing a semiconductor device, comprising: a step of filling a gap between a substrate and a semiconductor element disposed on the substrate with the epoxy resin composition according to any one of [1] to

[23] ; and a step of heating and curing the epoxy resin composition.

[0083] The epoxy resin composition of the present invention is less likely to climb onto the surface of a silicon chip that has been treated with BSM, and therefore semiconductor devices comprising a cured product of the epoxy resin composition exhibit high reliability.

Claims

1. An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), and an inorganic filler (C), the epoxy resin composition having a surface tension of 30 to 40 mN / m measured at 110°C using a plate method.

2. The epoxy resin composition according to claim 1, further comprising a curing accelerator (D).

3. The epoxy resin composition according to claim 1 or 2, wherein the epoxy resin (A) comprises an epoxy resin that is liquid at 25°C.

4. The epoxy resin composition according to claim 1 or 2, wherein the epoxy resin (A) comprises at least one selected from the group consisting of bisphenol F type epoxy resins, bisphenol A type epoxy resins, aminophenol type epoxy resins, and naphthalene type epoxy resins.

5. The epoxy resin composition according to claim 1 or 2, wherein the content of the inorganic filler (C) relative to the epoxy resin composition (100 mass%) is 40 to 75 mass%.

6. The epoxy resin composition according to claim 1 or 2, wherein the inorganic filler (C) has an average particle size of 0.2 to 2 μm.

7. The epoxy resin composition according to claim 1 or 2, wherein the inorganic filler (C) is an inorganic filler which has been surface-treated with a silane coupling agent.

8. The epoxy resin composition according to claim 1 or 2, further comprising an elastomer (F) (excluding silicone-based elastomers).

9. The epoxy resin composition according to claim 1 or 2, which is used for encapsulating semiconductors.

10. The epoxy resin composition according to claim 9, which is an underfill.

11. The epoxy resin composition according to claim 1 or 2, which is used to encapsulate a substrate and a semiconductor element disposed on the substrate, the semiconductor element being characterized in that the rear surface thereof opposite to the surface oriented with the substrate is subjected to a backside metallization treatment.

12. A cured product of the epoxy resin composition according to claim 1 or 2.

13. A semiconductor device comprising: a substrate; a semiconductor element disposed on the substrate; and the cured product according to claim 12 that encapsulates the semiconductor element.

14. A method for manufacturing a semiconductor device, comprising: filling a gap between a substrate and a semiconductor element disposed on the substrate with the epoxy resin composition according to claim 1 or 2; and heating and curing the epoxy resin composition.

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