Display module, manufacturing method therefor, and display device including display module

Abstract

A display module according to an embodiment includes: a substrate; a plurality of LED chips mounted on the substrate; a light absorbing material disposed adjacent to LED chips located at the outermost portion of the substrate from among the plurality of LED chips; and a molding layer molding the substrate and the LED chips, wherein the light absorbing material may absorb a portion of light emitted from the LED chip to a side of the molding layer.

Description

Display module, manufacturing method thereof, and display device including display module

[0001] The present invention relates to a display module, a method for manufacturing the same, and a display device including the display module. Specifically, the present invention relates to a display device that improves bright and dark lines between display modules.

[0002] Large-area display devices include liquid crystal displays (LCDs), OLED displays, and micro-LED displays.

[0003] A micro-LED display is a display that uses micro-LEDs, which are semiconductor light-emitting elements with a diameter or cross-sectional area of ​​100㎛ or less, as display elements.

[0004] Micro-LED displays use semiconductor light-emitting diodes (micro-LEDs) as display elements, so they have superior performance in many characteristics, including contrast ratio, response speed, color reproducibility, viewing angle, brightness, resolution, lifespan, luminous efficiency, and brightness.

[0005] In particular, micro-LED displays have the advantage of being able to freely adjust the size and resolution by separating and combining the screen in a modular manner, and are capable of implementing flexible displays. They are being applied not only to TVs but also to digital signage.

[0006]

[0007] Digital signage is a display installed inside or outside a building using a digital information display (DID), and is a device that provides images or videos containing advertisements or various information.

[0008] Types of digital signage include outdoor digital signage and indoor digital signage.

[0009] Outdoor digital signage refers to digital signage installed on building exteriors, billboards, or for outdoor cinemas. Indoor digital signage refers to digital signage installed on the interior walls of large shopping malls or in the form of signboards.

[0010] Digital signage can use mini-sized or micro-sized semiconductor light-emitting diodes (LEDs) as display elements.

[0011]

[0012] Digital signage is a tiling display using micro LED displays. It arranges multiple LED display modules and arranges these modules in cabinet units to create a large-screen display.

[0013] When tiling these products, there is a problem that the immersive feeling of the integrated display is disturbed due to the light scattering phenomenon (brightness line) that occurs between each individual LDM (LED Display Module) when assembling each individual LDM.

[0014]

[0015] Additionally, display signage can operate for extended periods, causing the temperature to rise due to heat generated by the LEDs. This can cause the display module's circuit board and molding layer to expand. This, in turn, can cause the distance between the LEDs to increase due to differences in the coefficients of thermal expansion between the circuit board and the molding layer, leading to the problem of line distortion.

[0016]

[0017] One of the technical challenges of the present invention is to provide a display module that prevents degradation of the image quality of the display module due to bright and dark lines between adjacent display modules, a method for manufacturing the same, and a display device including the display module.

[0018] In addition, one of the technical challenges of the embodiment is to provide a display module that prevents an increase in the size of the gap due to thermal expansion of a substrate and a molding layer caused by heat generation of an LED chip, a method for manufacturing the same, and a display device including the display module.

[0019] The technical tasks of the embodiment are not limited to those described in this article, but include those understood from the description of the invention.

[0020] A display module according to an embodiment may include a substrate, a plurality of LED chips mounted on the substrate, a light absorbing material disposed adjacent to LED chips positioned at the outermost side of the substrate among the plurality of LED chips, and a molding layer molding the substrate and the LED chips. The light absorbing material may absorb a portion of light emitted or emitted from the LED chips to the side of the molding layer.

[0021] The height (h1) of the above light absorbing material can be formed in a range of 70% to 80% of the height (H) of the molding layer.

[0022] The angle of inclination (θ) formed by the upper part of the light absorbing material relative to the upper surface of the LED chip from the edge of the LED chip may be 50° or less.

[0023] The above light absorbing material can reduce thermal expansion of the substrate.

[0024] The above light absorbing material can be arranged continuously along the outermost LED chip.

[0025] The above light absorbing material can be selectively placed only at a position adjacent to the outermost LED chip.

[0026]

[0027] According to another embodiment, a display module may include a substrate, a plurality of LED chips mounted on the substrate and including an upper optical layer, a side optical layer disposed on the substrate and arranged to be in contact with side surfaces of the plurality of LED chips, a light absorbing material disposed adjacent to LED chips located at the outermost side of the substrate (211) among the plurality of LED chips, and a molding layer that molds the light absorbing material, the side optical layer, and the LED chips. The light absorbing material may absorb a portion of light emitted from the LED chips to the side surface of the molding layer.

[0028] The angle of inclination (θ) formed by the upper part of the light absorbing material relative to the upper surface of the upper optical layer from the edge of the upper optical layer may be 50° or less.

[0029]

[0030] A method for manufacturing a display module according to an embodiment may include a step of jetting a light absorbing material onto a substrate on which an LED chip is mounted, a step of molding the substrate and the light absorbing material with a molding layer, and a step of cutting based on the center of the light absorbing material.

[0031] In the process of jetting the above light absorbing material, the light absorbing material may be placed adjacent to the outermost LED chip among the LED chips, and the light absorbing material may be continuously jetted along the outermost LED chip.

[0032] In the process of jetting the above light absorbing material, the light absorbing material may be placed adjacent to the outermost LED chip among the LED chips, and the light absorbing material may be selectively jetted along the outermost LED chip.

[0033] The method may further include forming a groove on the substrate to control the width of the light absorber prior to the jetting process of the light absorber.

[0034]

[0035] A method for manufacturing a display module according to another embodiment may include a step of molding a side optical layer on a substrate on which an LED chip is mounted, a step of jetting a light absorbing material onto the side optical layer, a step of molding a molding layer on the side optical layer and the light absorbing material, and a step of cutting based on the center of the light absorbing material.

[0036] In the process of jetting the above light absorbing material, the light absorbing material may be placed adjacent to the outermost LED chip among the LED chips, and the light absorbing material may be continuously jetted along the outermost LED chip.

[0037] In the process of jetting the above light absorbing material, the light absorbing material may be placed adjacent to the outermost LED chip among the LED chips, and the light absorbing material may be selectively jetted along the outermost LED chip.

[0038] In an embodiment, a light absorbing material is placed adjacent to an LED chip located at the outermost side of the display module, so that a portion of the light emitted from the side of the display module can be absorbed, thereby controlling the occurrence of dark lines and bright lines.

[0039] Additionally, according to the embodiment, the light absorbing material can reduce thermal expansion of the substrate, thereby preventing the gap between display modules from increasing in size.

[0040] FIG. 1 is an exemplary diagram of a display device (1000) including a semiconductor light-emitting element for a display pixel according to an embodiment.

[0041] FIG. 2 is a perspective view of one of a plurality of display modules (200) included in a display device (1000) according to an embodiment.

[0042] Figure 3 is a perspective view showing a plurality of display modules (200) of a display device (1000) assembled according to an internal comparison technique.

[0043] Figure 4 is an enlarged view of area A of Figure 3.

[0044] Fig. 5 is a cross-section showing the gap between display modules (200) according to internal comparison technology.

[0045] Figure 6a shows that a line is recognized in a display device (1000) according to an internal comparison technique.

[0046] Figure 6b shows the gap of the display module (200) according to the internal comparison technology at different viewing angles.

[0047] FIG. 7 is a cross-sectional view showing a display module (200) of a display device (1000) according to one embodiment of the present invention.

[0048] Figure 8 is a drawing briefly showing the relationship between the LED chip (100) and the light absorber (400) of the display module (200).

[0049] FIG. 9 is a cross-sectional view showing a display module (200) of a display device (1000) according to another embodiment of the present invention.

[0050] FIG. 10 is a drawing briefly showing the relationship between an LED chip (100) and a light absorber (400) of a display module (200) according to another embodiment.

[0051] Figures 11a to 11f illustrate a manufacturing process of a display module according to one embodiment of the present invention.

[0052] Figures 12a to 12d illustrate a manufacturing process of a display module (200) according to another embodiment of the present invention.

[0053] Figure 13 is a top view of a side of a display module according to an embodiment of the present invention, measured through a microscope.

[0054] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. The suffixes "module" and "part" used in the following description for components are given or used interchangeably for the sake of ease of writing the specification, and do not in themselves have distinct meanings or roles. In addition, the attached drawings are intended to facilitate easy understanding of the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing "on" another element, this includes that it may be directly on the other element, or that other intermediate elements may exist therebetween.

[0055] The display devices described in this specification may include digital signage, digital TVs, mobile phones, smart phones, laptop computers, digital broadcasting terminals, personal digital assistants (PDAs), portable multimedia players (PMPs), navigation devices, slate PCs, tablet PCs, Ultra-Books, desktop computers, and the like. However, the configuration according to the embodiments described in this specification may also be applied to devices capable of displaying, even if they are new product types developed in the future.

[0056]

[0057] FIG. 1 is an exemplary diagram of a display device (1000) including a semiconductor light-emitting element for a display pixel according to an embodiment. The display device (1000) according to the embodiment may include a plurality of assembled display modules (200).

[0058] The display device (1000) of the embodiment can be applied to digital signage. For example, FIG. 1 is an example of indoor digital signage, but the display device (1000) of the embodiment can also be applied to outdoor digital signage.

[0059]

[0060] FIG. 2 is a perspective view of one of a plurality of display modules (200) included in a display device (1000) according to an embodiment.

[0061] The display module (200) illustrated in FIG. 2 can be mounted on each cabinet and assembled in a block manner to implement the display device (1000) of the embodiment.

[0062] The display module (200) of the embodiment may include a plurality of display panels (210) that output images, a module holder (220) on which the display panels (210) are placed, and a module cover (230) placed on the outside of the module holder (220).

[0063] The above-described plurality of display panels (210) can be arranged in a grid shape on a module holder (220) to form a single display module (200), and the individual display modules (200) can be assembled in a predetermined cabinet shape to implement a display device (1000) according to an embodiment. Display data can be transmitted to the assembled individual display modules (200) via wired or wireless means.

[0064]

[0065] FIG. 3 is a perspective view showing a plurality of display modules (200) assembled in a display device (1000) according to an internal comparison technique, FIG. 4 is an enlarged view of area A of FIG. 3, and FIG. 5 is a cross-section showing a gap between display modules (200) according to an internal comparison technique.

[0066] Referring to FIGS. 3 and 5, the display module (200) includes a plurality of display panels (210).

[0067] The above display panel (210) may include a substrate (211), a molding layer (212), a film layer (213), and an LED chip (100).

[0068] Hereinafter, a problem occurring between adjacent display modules (200) will be described. Although it is a problem between display panels (210) located on each side of the substantially adjacent display modules (200), it will be described by referring to them as display modules (200) for convenience.

[0069] In addition, the LED chip (100) described below can be understood as being described based on the LED chip (100) located at the outermost side of the substrate (211).

[0070] The above display module (200) may include a first display module (200a), a second display module (200b), and a third display module (200c).

[0071] The above plurality of display modules (200) may have assembly tolerances during assembly, and a gap (S) may be formed due to the assembly tolerance. Although not shown, not only the gap (S) due to the assembly tolerance, but also a vertical step difference between the display modules (200) due to the assembly tolerance may occur.

[0072] The light generated by the LED chip (100) through the gap (S) can be emitted toward the side of the display module (200) to generate a bright line.

[0073] To solve this, the width (d2) of the gap (S) must be reduced, but there is a technical limitation that it is difficult to adjust the width (d2) of the gap (S) to less than 60 μm due to process issues.

[0074] Additionally, the side surface of the display module (200) in the internal comparison technology may be inclined depending on the dicing angle. For example, the first display module (200a) may have an inclined side surface (212a) of the molding layer (212) depending on the dicing angle.

[0075] The width (d2) of the gap (S) can be made larger by the slope formed on the side of the display module (200).

[0076] In addition, the molding layer (212) and the substrate (211) may expand due to heat generation of the LED chip (100). At this time, since the substrate (211) expands to a greater degree than the molding layer (212), a problem may arise in which the width (d2) of the gap (S) becomes larger.

[0077] The distance (d1) from the center line (L1, L2) of the LED chip (100) located at the outermost side of the substrate (211) to the side of the display module (200) may vary depending on the dicing position tolerance during the manufacturing process of the display module (200).

[0078] For example, the distance (d1) from the first center line (L1) of the LED chip (100) of the first display module (200a) to the side of the first display module (200a) can be formed to be 330 μm to 370 μm.

[0079] The distance (d3) (hereinafter, pitch of the LED chip) from the first center line (L1) of the LED chip (100) of the first display module (200a) to the second center line (L2) of the LED chip (100) of the second display module (200b) is an important factor in the generation of bright lines and dark lines.

[0080] For example, if the pitch (d3) of the LED chips is too close, a bright line may occur, and if the pitch (d3) of the LED chips is too far, a dark line may occur, which may cause problems with the image quality of the display device.

[0081] Fig. 6a shows that a line is recognized in a display device (1000) according to an internal comparison technique, and Fig. 6b shows the gap of a display module (200) according to an internal comparison technique at different viewing angles.

[0082] A display device (1000) according to an internal comparison technology may generate a line in the gap (S) between display modules (200).

[0083] It can be seen that a bright line is generated by the gap (S) between the first display module (200a) and the second display module (200b), and this bright line can be seen more clearly when viewed from an up-down, left-right, and right-hand viewing angle than when viewed from the front.

[0084] FIG. 7 is a cross-sectional view showing a display module (200) of a display device (1000) according to one embodiment of the present invention, and FIG. 8 is a drawing briefly showing the relationship between an LED chip (100) and a light absorber (400) of the display module (200).

[0085] A display device (1000) according to an embodiment shows a location where a plurality of display modules (200) are assembled.

[0086] A display module (200) according to an embodiment may include a substrate (211), a molding layer (212), a film layer (213), an LED chip (100) and a light absorbing material (400) disposed on the substrate (211).

[0087] The above LED chip (100) may include a solder layer (110), a plurality of light-emitting elements (120), and an encapsulating layer (130).

[0088] The above plurality of light-emitting elements (120) are semiconductor light-emitting elements for display pixels, and can be arranged repeatedly to form individual subpixels.

[0089] For example, the light emitting element (120) may include, but is not limited to, a red light emitting element (120a), a green light emitting element (120b), and a blue light emitting element (120c).

[0090] The above light absorbing material (400) can be placed adjacent to the LED chip (100) of the display module (200).

[0091] The above light absorbing material (400) may have a convex elliptical shape, but is not limited thereto. For example, the light absorbing material (400) may include a triangular, square, or circular shape.

[0092] The light absorbing material (400) may include a resin material. The light absorbing material (400) may include a carbon material for absorbing light. The light absorbing material (400) may absorb a portion of the light generated from the LED chip (100). In other words, a portion of the light emitted toward the side of the display module (200) may be absorbed by the light absorbing material (400). For example, the light absorbing material (400) may include a silicon layer or an epoxy layer containing carbon.

[0093] The above light absorbing material (400) may include a material with high viscosity. Accordingly, the light absorbing material (400) may have various shapes, and the width and height of the light absorbing material (400) may be easily adjusted.

[0094] The above light absorbing material (400) may include a material having a thermal expansion coefficient that is the same as or similar to that of the substrate (211). This can prevent the width (d2) of the gap (S) from increasing due to a difference in the thermal expansion coefficients between the substrate (211) and the molding layer (212).

[0095] As another example, the light absorbing material (400) does not expand thermally and can have the function of suppressing thermal expansion of the substrate (211).

[0096] The height (h1) of the light absorbing material (400) can be formed in a range of 70 to 80% of the height (H) of the molding layer. The height (h1) of the light absorbing material (400) is formed to be greater than the height (h3) of the LED chip (100).

[0097] The difference between the height (h1) of the light absorber and the height (h3) of the LED chip (100) can be defined as the height (h2) of a portion of the light absorber (400).

[0098] The angle from the corner of the LED chip (100) to the upper end of the light absorbing material (400) based on the upper surface of the LED chip (100) can be defined as the inclination angle (θ).

[0099] The height (h2) of a portion of the above light absorbing material (400) can be formed as tan(θ) of the width (D) of the above light absorbing material (400).

[0100] For example, the inclination angle (θ) may be formed to be 50° or less. Accordingly, the height (h1) of the light absorbing material (400) may have a range of 70 to 80% of the height (H) of the molding layer (212).

[0101] If the height (h1) of the light absorbing material (400) is formed to be 70% or less of the height (H) of the molding layer (212), the light generated from the LED chip (100) may not be sufficiently absorbed, so the brightness may become stronger.

[0102] As another example, when the height (h1) of the light absorbing material (400) is formed to be 80% or more of the height (H) of the molding layer (212), the light generated from the LED chip (100) may be excessively absorbed, thereby intensifying the dark line.

[0103] In the embodiment, the inclination angle (θ) is formed to be 50° or less, and thereby the height (h1) of the light absorbing material (400) is controlled to be in the range of 70 to 80% of the height (H) of the molding layer (212), which is a solution for solving the unique technical problem of this application, and it is difficult to easily think of this from the information known at the time of the application.

[0104]

[0105] FIG. 9 is a cross-sectional view showing a display module (200) of a display device (1000) according to another embodiment of the present invention, and FIG. 10 is a drawing briefly showing the relationship between an LED chip (100) and a light absorber (400) of a display module (200) according to another embodiment.

[0106] A display module (200) according to another embodiment may include a substrate (211), a molding layer (212), a film layer (213), an LED chip (100) disposed on the substrate (211), a side optical layer, and a light absorbing material (400).

[0107] According to another embodiment, the LED chip (100) is formed as a stacked chip.

[0108] The above LED chip (100) may further include a light emitting element (120), an encapsulating layer (150), a base material layer (160), and an upper optical layer (170).

[0109] The above light-emitting element (120) may include, but is not limited to, a red light-emitting element (120a), a green light-emitting element (120b), and a blue light-emitting element (120c).

[0110] The encapsulating layer (150) may be transferred and placed on the base material layer (160). The encapsulating layer (150) may include an epoxy material.

[0111] The above-mentioned base material layer (160) can be formed of a transparent substrate made of silicon or sapphire.

[0112] The upper optical layer (170) may be placed on the base material layer (160).

[0113] The upper optical layer (170) can adjust the angle of incidence by refracting light emitted from the light-emitting element (120). The upper optical layer (170) can be formed on the base material layer (160) by a jetting process. The upper optical layer (170) can have a curved shape.

[0114] The upper optical layer may include a silicon diffuser including at least one of SiO2, ZrO2, ZnO, and TiO2.

[0115] The side optical layer (216) can be placed on the substrate (211) on which the LED chip (100) is mounted.

[0116] The above side optical layer (216) is positioned laterally of the LED chip (100) and can reflect light emitted from the LED chip (100) and guide it to the upper optical layer (170).

[0117] The surface where the side optical layer (216) and the LED chip (100) come into contact can function as a reflective surface (216a) that reflects light.

[0118] The above side optical layer (216) may be positioned lower than the height of the upper optical layer (170).

[0119] In another embodiment, the light absorbing material (400) may be positioned adjacent to the LED chip (100) in a display module (200).

[0120] The above light absorbing material (400) can be placed on the side optical layer (216).

[0121] The above light absorbing material (400) may have a convex elliptical shape, but is not limited thereto. For example, the light absorbing material (400) may include a triangular, square, or circular shape.

[0122] The above light absorbing material (400) can absorb a portion of the light generated from the LED chip (100). In other words, a portion of the light emitted from the side of the display module (200) can be absorbed by the light absorbing material (400).

[0123] The height of the above light absorbing material (400) and the above molding layer (212) can be defined with the upper surface of the side optical layer (216) as the reference surface.

[0124] The height (h1) of the above light absorbing material (400) can be formed in a range of 70 to 80% of the height (H) of the molding layer. The height (h1) of the above light absorbing material (400) is formed to be greater than the upper height (not shown) of the upper optical layer (170).

[0125] The height from the top of the upper optical layer (170) to the top of the light absorbing material (400) can be defined as the height (h2) of a portion of the light absorbing material. In other words, the height (h2) of a portion of the light absorbing material can be defined as the height (h1) of the light absorbing material (400) minus the top height (h4) of the upper optical layer (170) from the top of the side optical layer (216).

[0126] The angle from the edge of the upper optical layer (170) to the upper end of the light absorbing material (400) based on the upper surface of the upper optical layer (170) can be defined as the inclination angle (θ).

[0127] The height (h2) of a portion of the above light absorbing material (400) can be formed as tan(θ) of the width (D) of the above light absorbing material (400).

[0128] For example, the inclination angle (θ) may be formed to be 50° or less. Accordingly, the height (h1) of the light absorbing material (400) may have a range of 70 to 80% of the height (H) of the molding layer (212).

[0129] Due to this, the dark and bright lines are not visible from the gap (S) between the display modules (200), thereby improving the picture quality of the display module (200).

[0130] Figures 11a to 11f illustrate a manufacturing process of a display module according to one embodiment of the present invention.

[0131] Hereinafter, with reference to FIGS. 11a to 11e, the manufacturing process of the display module (200) will be described starting from the process after the LED chip (100) is placed on the substrate (211).

[0132] Figure 11a shows a process of applying a light absorbing material (400) on a substrate (211).

[0133] The manufacturing process of the above display module (200) may include a jetting process of applying the light absorbing material (400) to a location adjacent to the LED chip (100).

[0134] The above light absorbing material (400) can be jetted longitudinally along the LED chip (100) from a nozzle (60) driven by a motor (50).

[0135] For example, the nozzle (60) can continuously jet the light absorbing material (400). Referring to FIG. 11b, the nozzle (60) can continuously jet the light absorbing material (400) so that the light absorbing material (400) can be placed at the entire position adjacent to the LED chip (100).

[0136] As another example, the nozzle (60) can selectively jet the light absorbing material (400). Referring to FIG. 11c, the nozzle (60) can selectively jet the light absorbing material (400) so that it is disposed only in an adjacent portion of the LED chip (100).

[0137] Referring to FIG. 11d, the manufacturing process of the display module (200) may include a process of forming a groove (211a) in the substrate (211) to adjust the width (D) of the light absorbing material (400) to be jetted.

[0138] A process of etching a portion of the substrate (211) may be performed to form the above-mentioned groove (211a).

[0139] The width of the light absorbing material (400) can be prevented from increasing by the above groove (211a) and maintained constant.

[0140] Referring to FIG. 11e, after the jetting process of the light absorber (400), a process of injecting the molding layer (212) onto the substrate (211), the LED chip, and the light absorber (400) may be performed.

[0141] Referring to FIG. 11f, after the molding layer (212) is injected, a dicing process for cutting the display module (200) may be performed.

[0142] During the above dicing process, the light absorbing material (400) can be cut based on the center.

[0143] During the above dicing process, the light absorbing material (400) can have the function of indicating the cutting position, so the dicing process can be facilitated.

[0144] After the above dicing process, a process of applying the film layer (213) on the molding layer (212) may be performed.

[0145] Figures 12a to 12d illustrate a manufacturing process of a display module (200) according to another embodiment of the present invention.

[0146] Referring to FIG. 12a, a process of applying the side optical layer (216) on the substrate (211) on which the LED chip (100) is mounted can be performed.

[0147] The above side optical layer (216) can mold the side surface of the substrate (211) and the LED chip (100).

[0148] Referring to FIG. 12b, a process of jetting the light absorbing material (400) onto the side optical layer (216) may be performed.

[0149] The process of jetting the above light absorbing material (400) may be the same process as that described in FIGS. 11a to 11c.

[0150] Referring to FIG. 12c, a molding layer (212) disposed on the upper optical layer (170), the side optical layer (216), and the light absorbing material (400) can be injected.

[0151] Referring to FIG. 12d, after the molding layer (212) is cured, a dicing process can be performed based on the center of the light absorbing material (400).

[0152] Figure 13 is a top view of a side of a display module according to an embodiment of the present invention, measured through a microscope.

[0153] Referring to FIG. 13, the light absorbing material (400) may be placed adjacent to the outermost LED chips (100) located on the upper, lower, left, and right sides of the display module (200) according to the embodiment.

[0154] The above light absorbing material (400) can absorb some of the light emitted from the LED chip (100) and allow some of the light to pass through.

[0155] Due to this, the bright line and dark line may not be recognized in the gap (S) between the display modules (200).

[0156] In addition, thermal expansion of the substrate (211) of the display module (200) can be prevented, thereby preventing the gap (S) between the display modules (200) from increasing.

[0157]

[0158] Although the above description focuses on examples, these are merely examples and are not intended to limit the examples. Those skilled in the art will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present examples. For example, each component specifically shown in the examples can be modified and implemented. In addition, differences related to such modifications and applications should be interpreted as being included within the scope of the embodiments set forth in the appended claims.

[0159] The embodiment can be adopted in the field of displays that display images or information.

[0160] For example, the display device according to the embodiment may include a digital signage, a digital TV, a mobile phone, a smart phone, a laptop computer, a digital broadcasting terminal, a personal digital assistant (PDA), a portable multimedia player (PMP), a navigation device, a slate PC, a tablet PC, an Ultra-Book, a desktop computer, and the like. In addition, the configuration according to the embodiment described in this specification may be applied to a device capable of displaying, even if it is a new product type developed in the future.

[0161] The display device of the embodiment can be applied to outdoor digital signage and indoor digital signage.

Claims

1. Substrate; A plurality of LED chips mounted on the above substrate; A light absorbing material disposed at the edge of the substrate adjacent to the LED chips located at the outermost side of the substrate among the plurality of LED chips; and A molding layer for molding the substrate and the LED chip; The above light absorbing material absorbs a portion of the light emitted from the LED chip to the side of the molding layer. Display module.

2. In paragraph 1, The height of the above light absorbing material is in the range of 70% to 80% of the height of the above molding layer. Display module.

3. In paragraph 1, The angle of inclination formed by the upper part of the light absorbing material relative to the upper surface of the LED chip from the edge of the LED chip is characterized in that it is 50˚ or less. Display module.

4. In paragraph 1, The above light absorbing material comprises a silicon layer or an epoxy layer including carbon. Display module.

5. In paragraph 1, The above light absorbing material is arranged continuously along the outermost LED chip. Display module.

6. In paragraph 1, The above light absorbing material is selectively placed only in a position adjacent to the outermost LED chip. Display module.

7. Substrate; A plurality of LED chips mounted on the above substrate and including an upper optical layer; A side optical layer disposed on the substrate and positioned so as to be in contact with the side surfaces of the plurality of LED chips; A light absorbing material positioned adjacent to the LED chips located at the outermost side of the substrate among the plurality of LED chips; and A molding layer for molding the light absorbing material, the side optical layer, and the LED chip; The above light absorbing material absorbs a portion of the light emitted from the LED chip to the side of the molding layer. Display module.

8. In paragraph 7, A display module, characterized in that the angle of inclination formed by the upper part of the light absorbing material from the edge of the upper optical layer to the upper surface of the upper optical layer is 50˚ or less.

9. A step of jetting a light absorbing material onto a substrate on which an LED chip is mounted; A step of molding the above substrate and the above light absorbing material into a molding layer; and A step of cutting based on the center of the above light absorbing material; A method for manufacturing a display module.

10. In paragraph 9, In the process of jetting the above light absorbing material, The light absorbing material is positioned adjacent to the outermost LED chip among the LED chips, and the light absorbing material is continuously jetted along the outermost LED chip. A method for manufacturing a display module.

11. In paragraph 9, The process of jetting the above light absorbing material includes: The light absorbing material is positioned adjacent to the outermost LED chip among the LED chips, and the light absorbing material is selectively jetted along the outermost LED chip. A method for manufacturing a display module.

12. In paragraph 9, Further comprising a step of forming a groove for controlling the width of the light absorber on the substrate prior to the jetting process of the light absorber. A method for manufacturing a display module.

13. A step of molding a side optical layer on a substrate on which an LED chip is mounted; A step of jetting a light absorbing material onto the above side optical layer; A step of molding a molding layer on the side optical layer and the light absorbing material; and A step of cutting based on the center of the above light absorbing material; A method for manufacturing a display module.

14. In paragraph 13, In the process of jetting the above light absorbing material, The light absorbing material is positioned adjacent to the outermost LED chip among the LED chips, and the light absorbing material is continuously jetted along the outermost LED chip. A method for manufacturing a display module.

15. In paragraph 13, In the process of jetting the above light absorbing material, The light absorbing material is positioned adjacent to the outermost LED chip among the LED chips, and the light absorbing material is selectively jetted along the outermost LED chip. A method for manufacturing a display module.

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