Stack structure, display module, electronic device, impact-resistant layer and preparation method therefor

Abstract

A stack structure (90), a display module (2), an electronic device (1), an impact-resistant layer and a preparation method, relating to the technical field of display. The stack structure (90) comprises a protective layer (91) and impact-resistant layers. The elastic modulus of each impact-resistant layers is less than the elastic modulus of the protective layer (91), the hardness of each impact-resistant layer is greater than the hardness of the protective layer (91), and / or the rigidity of each impact-resistant layer is greater than the rigidity of the protective layer (91). The protective layer (91) and the impact-resistant layers are connected by bonding or in other manners. Therefore, the compression resistance characteristic of a high-hardness and / or high-rigidity material is combined with the impact resistance characteristic of a high-elastic-modulus material, to improve the reliability of the stack structure (90). The stack structure (90) is directly connected to a display screen (20) by means of an adhesive layer, such that a display surface layer + cover plate structure is not required any more, and the architecture of the electronic device (1) can be simplified.

Description

Laminated structure, display module, electronic device, impact-resistant layer and preparation method thereof

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on December 22, 2023, with application number 202311792584.6 and invention name “Laminated structure, display module, electronic device, impact-resistant layer and preparation method thereof”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a laminated structure, a display module, an electronic device, an impact-resistant layer, and a preparation method thereof. Background Art

[0003] With the continuous development of display technology, foldable electronic devices are becoming a trend in future mobile electronic products. When unfolded, these devices can provide a larger display area, improving viewing experience. When folded, they can also be compact, making them easier to carry.

[0004] Flexible displays are a key component of foldable electronic devices. Due to the unique nature of their materials, they are susceptible to damage from external forces. For this reason, a screen protector is typically placed on the light-emitting side of the display. Because the electronic device as a whole must be bendable, the screen protector also needs to be bendable. Consequently, the cover glass used in straight-panel electronic devices is no longer suitable for foldable devices, and polymer materials are now being chosen to protect the display.

[0005] To ensure the reliability of the display screen, it is usually necessary to set up multiple polymer film layers on the light-emitting side and backlight side of the display screen. As a result, the formed display screen film layer has a series of problems such as complex structure, many process steps, large thickness, and lack of reliability guarantee.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a laminated structure, a display module, an electronic device, an impact-resistant layer, and a preparation method thereof, which are used to simplify the architecture of the electronic device while improving reliability.

[0008] To achieve the above objectives, this application adopts the following technical solutions:

[0009] In a first aspect of an embodiment of the present application, a laminated structure is provided. The laminated structure is disposed on a display screen, located on a light-emitting side of the display screen. The laminated structure includes a protective layer and a first impact-resistant layer. The first impact-resistant layer is located on one side of the protective layer and is connected to the protective layer. The elastic modulus of the first impact-resistant layer is smaller than the elastic modulus of the protective layer, the hardness of the first impact-resistant layer is greater than the hardness of the protective layer, and / or the stiffness of the first impact-resistant layer is greater than the stiffness of the protective layer.

[0010] The laminated structure provided by the embodiment of the present application is a laminated structure in which a first impact-resistant layer with high hardness and / or high rigidity is stacked with a protective layer with a high elastic modulus, so that the extrusion resistance of the high hardness and / or high rigidity material is combined with the impact resistance of the high elastic modulus material, and the laminated structure includes multiple impact-resistant layers. Thereby, the impact resistance, scratch resistance, extrusion resistance and bending resistance of the laminated structure can be improved, and the refinement of creases and large-area light and shadow can also be improved, thereby improving the reliability and refinement of the laminated structure. Moreover, the first impact-resistant layer is connected to the protective layer, which is conducive to realizing a thin design of the laminated structure, reducing the opening and closing resistance during the bending process, and further improving the reliability and refinement of the laminated structure. Furthermore, the laminated structure can be directly arranged separately on the light-emitting side of the display screen, combining the display surface layer and the cover layer into one, simplifying the architecture of the electronic device.

[0011] In one possible implementation, the protective layer is bonded to the first impact-resistant layer. This bonding of the first impact-resistant layer and the protective layer forms a composite laminate structure, eliminating the need for a connecting layer between the first impact-resistant layer and the protective layer. This facilitates a thinner laminate structure, reduces opening and closing resistance during bending, and further improves the reliability and sophistication of the laminate structure.

[0012] In one possible implementation, the laminate structure further includes a first connecting layer bonded between the protective layer and the first impact-resistant layer. The protective layer and the first impact-resistant layer are connected via the connecting layer. The laminate structure may include at least three film layers, facilitating a thinner design of the laminate structure.

[0013] In one possible implementation, the laminate structure further includes a second impact-resistant layer; the second impact-resistant layer is located on the side of the first impact-resistant layer away from the protective layer; the first connecting layer wraps around the surface of the first impact-resistant layer away from the protective layer, and the second impact-resistant layer is bonded to the first connecting layer. The laminate structure can include multiple impact-resistant layers. By thinning the thickness of each impact-resistant layer, the multiple impact-resistant layers are arranged so that the overall stiffness and hardness of the multiple impact-resistant layers remain unchanged, but the elastic modulus of the multiple impact-resistant layers can be increased, thereby further improving the impact resistance, scratch resistance, compression resistance, and bending resistance of the laminate structure. Moreover, the multiple impact-resistant layers can be directly bonded together via the first connecting layer, simplifying the laminate structure.

[0014] In one possible implementation, the laminate structure further includes a second impact-resistant layer and a second connecting layer; the second impact-resistant layer is located on the side of the first impact-resistant layer away from the protective layer, and the second connecting layer is connected between the first impact-resistant layer and the second impact-resistant layer. The multiple impact-resistant layers can also be connected by chemical bonding or adhesive bonding through the connecting layer, which has a wide range of applications.

[0015] In one possible implementation, the first impact-resistant layer is made of ultra-thin flexible glass or high-entropy glass. Ultra-thin flexible glass and high-entropy glass have good elasticity and recoverability. By using this minimalist architecture with multiple ultra-thin flexible glass or high-entropy glass, the recoverability of creases is significantly improved.

[0016] In one possible implementation, the material of the protective layer includes polyethylene terephthalate, transparent polyimide, or glass fiber, which are polymer materials with high elastic modulus and mature technology.

[0017] In one possible implementation, the first connection layer includes an energy-absorbing and impact-resistant material. The energy-absorbing and impact-resistant material chemically bonds the first impact-resistant layer and the protective layer, resulting in a good connection effect and allowing the first connection layer to be relatively thin.

[0018] In one possible implementation, the second connecting layer comprises a polymer material or an energy-absorbing and impact-resistant material, and the second connecting layer is bonded to the first and second impact-resistant layers. Chemical bonding of the polymer material or the energy-absorbing and impact-resistant material to the first and second impact-resistant layers provides a good connection and allows the second connecting layer to be relatively thin.

[0019] In one possible implementation, the second connection layer includes an adhesive material, and the second connection layer is bonded to the first and second impact-resistant layers, respectively. Connecting the first and second impact-resistant layers with adhesive materials is a mature and easy-to-implement technique.

[0020] In one possible implementation, the first impact-resistant layer is provided with grooves on its surface facing the protective layer and / or its surface facing away from the protective layer. By providing the grooves on the first impact-resistant layer, the thickness of the central region of the first impact-resistant layer is reduced, thereby ensuring the first impact-resistant layer has bendability while ensuring reliability, thereby reducing the risk of fracture of the first impact-resistant layer.

[0021] In one possible implementation, the first impact-resistant layer has a dimension of less than or equal to 50 μm at its thinnest location, which allows the first impact-resistant layer to have both reliability and resilience, thereby optimizing its performance.

[0022] In one possible implementation, the thickness of the laminated structure is less than or equal to 600 μm. The laminated structure provided in the embodiment of the present application can be made relatively thin while meeting reliability requirements, thus meeting the demand for thinner and lighter electronic devices.

[0023] In one possible implementation, the sides of the laminated structure are perpendicular to the protective layer, which ensures that the laminated structure provides almost equal protection at all locations on the display screen, thereby improving the problem of poor protection at the edges of the display screen.

[0024] In one possible implementation, the laminate structure further includes a third connecting layer and a third impact-resistant layer, which are sequentially disposed on a side of the second impact-resistant layer away from the second connecting layer. By thinning each impact-resistant layer and providing multiple impact-resistant layers, the overall stiffness and hardness of the multi-layer impact-resistant layer remain unchanged, but the elastic modulus of the multi-layer impact-resistant layer can be increased, thereby further improving the impact resistance, scratch resistance, compression resistance, and bending resistance of the laminate structure.

[0025] A second aspect of the embodiments of the present application provides a laminate structure comprising: a protective layer; a first connecting layer bonded between the protective layer and a first impact-resistant layer; the first impact-resistant layer located on one side of the protective layer; a second impact-resistant layer located on a side of the first impact-resistant layer away from the protective layer; and the second connecting layer bonded between the first impact-resistant layer and the second impact-resistant layer. The elastic modulus of the first impact-resistant layer is less than that of the protective layer; the hardness of the first impact-resistant layer is greater than that of the protective layer; and / or the stiffness of the first impact-resistant layer is greater than that of the protective layer. The laminate structure provided by the embodiments of the present application includes multiple impact-resistant layers. By thinning each impact-resistant layer, the multiple impact-resistant layers are arranged. This maintains the overall stiffness and hardness of the multiple impact-resistant layers while increasing the elastic modulus of the multiple impact-resistant layers to further enhance the impact resistance, scratch resistance, compression resistance, and bending resistance of the laminate structure. Furthermore, the multiple impact-resistant layers can be directly bonded together via the first connecting layer, simplifying the laminate structure.

[0026] According to a third aspect of an embodiment of the present application, a display module is provided. The display module includes a display screen and a laminated structure. The laminated structure includes the laminated structure of any one of the first and second aspects. The light-emitting surface of the display screen faces the second impact-resistant layer.

[0027] In one possible implementation, the display module further comprises a first adhesive layer, a flattening layer, a second adhesive layer, and a bamboo book, sequentially arranged on the backlight surface of the display. The flattening layer is connected to the display via the first adhesive layer, and the bamboo book is connected to the flattening layer via the second adhesive layer. Eliminating the support layer on the backlight surface of the display further simplifies the display module architecture, reduces its thickness, and achieves a minimalist, lightweight, and thin display module.

[0028] In one possible implementation, the bamboo book has an elastic modulus greater than or equal to 10 GPa. Choosing a material with a high elastic modulus improves its impact resistance and enhances the refinement of creases and large-scale light and shadow. This simplifies the display module architecture while improving the reliability and refinement of the display module.

[0029] In one possible implementation, the bamboo book includes a first portion and a second portion, with the second portion disposed on opposite sides of the first portion. The first portion has a lower elastic modulus than the second portion. By reducing the elastic modulus in the central region of the bamboo book, the bendability of the central bending region can be guaranteed, further improving the performance of the display module.

[0030] In one possible implementation, bamboo books could be made from a variety of existing materials, eliminating the need for new material development and making them easy to implement.

[0031] In one possible implementation, the projection of the laminated structure on the flat layer covers the projection of the display screen on the flat layer. The laminated structure can protect the display screen, improve the problem of edge extrusion weak areas being easily damaged, and further enhance the reliability of the display module.

[0032] In one possible implementation, the display module further includes a third adhesive layer, with two sides of the third adhesive layer connecting the laminated structure and the display screen, respectively. The laminated structure and the display screen are directly bonded via the third adhesive layer, eliminating the need for additional film layers between them. This simplifies the display module structure, reduces the gap between the display screen and the laminated structure, and thus reduces the overall size of the display module.

[0033] In one possible implementation, the display screen includes a first planar portion, a bent portion, and a second planar portion, the bent portion being connected between the first and second planar portions, the first planar portion being connected to the laminated structure, and the second planar portion being located on the backlight side of the first planar portion. The display module also includes a module adhesive layer, which covers the bent portion and has a thickness of 50 μm to 90 μm. Only a third adhesive layer can be provided between the display screen and the laminated structure. This allows for a relatively small gap between the first planar portion and the laminated structure, reducing the thickness of the display module. Furthermore, there is no need for a support layer between the first and second planar portions, reducing the thickness of the module adhesive layer.

[0034] According to a fourth aspect of the embodiments of the present application, an electronic device is provided. The electronic device includes a display module and a middle frame, and the display module is arranged on the middle frame; the display module includes the display module of any one of the third aspects.

[0035] In one possible implementation, the electronic device also includes a bezel, which is located outside the display module and extends above the laminated structure to overlap the laminated structure. This eliminates any gaps between the bezel and the laminated structure, improving aesthetics and reducing dust absorption. Furthermore, the laminated structure provides protection against pressure on the edges of the electronic device, reducing the need for bezel protection and thus reducing the width of the bezel, achieving a "narrow bezel" effect.

[0036] In one possible implementation, the width of the bezel projected onto the plane where the display module resides is less than or equal to 0.5 mm. Because the laminated structure protects the electronic device from pressure on its edges, a bezel is not required to provide this protection. The bezel only needs to fill the gap between the display module and the midframe. Consequently, the bezel width can be reduced.

[0037] In one possible implementation, the sides of the display module are positioned adjacent to the midframe. Because the laminated structure protects the electronic device from pressure, a frame is not required. Therefore, a frame can be omitted between the display module and the midframe, further achieving a "narrow border" effect.

[0038] In one possible implementation, the electronic device further includes a back cover, the back cover including a first housing, a second housing, and a hinge mechanism, the first housing and the second housing being disposed on either side of the hinge mechanism; the first housing and the second housing moving toward or away from each other via the hinge mechanism, allowing the display module to transition between a flattened state and a closed state. The electronic device of the present application is suitable for use in foldable electronic devices.

[0039] According to a fifth aspect of an embodiment of the present application, a method for preparing an impact-resistant layer is provided, comprising: providing a glass sheet; placing the glass sheet in a hot casting fixture having a protrusion on the inner surface for hot casting to form a glass sheet with grooves on the surface; trimming the glass sheet to a target size to form an impact-resistant layer; the upper surface and / or lower surface of the impact-resistant layer having grooves.

[0040] The embodiment of the present application can adopt a hot casting process to form the impact-resistant layer, which can improve the processing efficiency and machinability of impact-resistant layers of unequal thickness and can be produced on a large scale.

[0041] In one possible implementation, before or after trimming the glass sheet to a target size, the preparation method further includes polishing the glass sheet, which can improve the optical performance of the impact-resistant layer.

[0042] In one possible implementation, trimming the glass sheet to a target size includes trimming the length and width of the glass sheet using a laser or CNC machine tool. This process is technically simple and has a high yield rate.

[0043] In one possible implementation, an etching process is used to trim the thickness of the glass sheet, which is simple in technology and has a high yield rate.

[0044] In a possible implementation, the temperature of the hot casting is 600° C.-1000° C. Such processing is technically simple and has a high yield.

[0045] According to a sixth aspect of an embodiment of the present application, an impact-resistant layer is provided, which is applied to an electronic device including a display screen; the impact-resistant layer has a first surface and a second surface relative to each other, and the first surface and / or the second surface has a groove.

[0046] By providing grooves on the impact-resistant layer and reducing the thickness of the middle region of the impact-resistant layer, the impact-resistant layer has bending properties while ensuring reliability, thereby reducing the risk of fracture of the impact-resistant layer.

[0047] In one possible implementation, the impact-resistant layer is made of ultra-thin flexible glass or high-entropy glass. Ultra-thin flexible glass and high-entropy glass have good elasticity and recoverability, which greatly improves the recoverability of creases in the impact-resistant layer.

[0048] In one possible implementation, the dimension of the impact-resistant layer at its thinnest location is less than or equal to 50 μm, which allows the impact-resistant layer to balance reliability and rebound force, thereby optimizing the performance of the impact-resistant layer.

[0049] In a seventh aspect of an embodiment of the present application, a hot casting fixture is provided, comprising: a first component and a second component, wherein the surface of the first component facing the second component has a protrusion, and / or the surface of the second component facing the first component has a protrusion. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] FIG1A is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0051] FIG1B is a schematic diagram of an electronic device in a folded state provided by an embodiment of the present application;

[0052] FIG1C is a cross-sectional view of a bar electronic device provided in an embodiment of the present application;

[0053] FIG1D is a simplified diagram of a display module provided in an embodiment of the present application;

[0054] FIG1E is a cross-sectional view along the line A1-A2 in FIG1A provided in an embodiment of the present application;

[0055] FIG1F is a cross-sectional view of a display screen provided in an embodiment of the present application;

[0056] FIG1G is an enlarged view of FIG1F at point A;

[0057] FIG2 is a cross-sectional view of a laminated structure provided in an embodiment of the present application;

[0058] 3A-3C are cross-sectional views of a stacked structure provided in an embodiment of the present application;

[0059] 4A-4C are cross-sectional views of a laminated structure provided in an embodiment of the present application;

[0060] FIG5 is a cross-sectional view of a laminated structure provided in an embodiment of the present application;

[0061] FIG6A is a cross-sectional view of a display module provided in an embodiment of the present application;

[0062] FIG6B is a simplified diagram of a display module provided in an embodiment of the present application;

[0063] 7A-7C are assembly diagrams of an electronic device provided in an embodiment of the present application;

[0064] 8A and 8B are cross-sectional views of an electronic device provided in an embodiment of the present application;

[0065] FIG9 is a schematic diagram of a process for preparing an impact-resistant layer provided in an embodiment of the present application. DETAILED DESCRIPTION

[0066] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0067] Hereinafter, the terms "second," "first," etc., are used for descriptive convenience only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature qualified as "second," "first," etc. may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0068] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left", and "right" may be defined including but not limited to the orientation relative to the schematic placement of the components in the drawings. It should be understood that these directional terms may be relative concepts, which are used for relative descriptions and clarifications, and may change accordingly according to changes in the orientation of the components in the drawings.

[0069] In the embodiments of this application, unless otherwise specified or limited, the term "connection" should be understood in a broad sense. For example, "connection" can mean fixed connection, detachable connection, or integration; it can mean direct connection or indirect connection through an intermediate medium. In addition, the term "coupling" can mean direct electrical connection or indirect electrical connection through an intermediate medium. The term "contact" can mean direct contact or indirect contact through an intermediate medium.

[0070] In the embodiments of the present application, "and / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0071] An electronic device is provided in an embodiment of the present application. The electronic device may be, for example, a foldable electronic device. Of course, the electronic device may also be a straight-board electronic device. In an embodiment of the present application, the electronic device may be a marketable electronic device. The electronic device may be, for example, a consumer electronic product, a home electronic product, a vehicle-mounted electronic product, or a financial electronic product. Among them, consumer electronic products include mobile phones, tablet computers, laptop computers, e-readers, personal computers (PCs), personal digital assistants (PDAs), desktop displays, smart wearable products (for example, smart watches, smart bracelets), virtual reality (VR) electronic devices, augmented reality (AR) electronic devices, drones, servers, etc. Home electronic products include smart door locks, televisions, remote controls, refrigerators, rechargeable small household appliances (for example, soymilk machines, sweeping robots), switches, etc. Vehicle-mounted electronic products include car navigation systems, car DVDs, etc. Financial electronic products include ATM machines, electronic devices for self-service transactions, etc.

[0072] FIG1A is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application, and FIG1B is a schematic diagram of the folded state of an electronic device provided in an embodiment of the present application.

[0073] To facilitate understanding of the electronic device provided in the embodiments of the present application, an existing electronic device is described below with reference to FIG1A :

[0074] As shown in Figure 1A, electronic device 1 includes a screen protector 10, a display 20, a middle frame 30, and a back cover (also known as a rear shell, battery cover, etc.) 40. The screen protector 10 is disposed on the display 20, located on the light-emitting side of the display 20. The display 20 is disposed on the middle frame 30, which supports the display 20. The back cover 40 is disposed on the middle frame 30, forming a storage space with the middle frame 30 on the side away from the display 20.

[0075] In the example, the electronic device 1 is a foldable electronic device, and the display screen 20 is a flexible display screen. The display screen 20 is a self-luminous display screen, and a backlight module (BLM) is not required. The display screen 20 is a self-luminous display screen such as an organic light emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (Mini-OLED) display screen, a micro light-emitting diode (Micro-LED) display screen, a micro organic light-emitting diode (Micro-OLED) display screen, or a quantum dot light emitting diode (QLED) display screen.

[0076] The middle frame 30 includes a first frame body 301 and a second frame body 302. The first frame body 301 and the second frame body 302 can be used to support the flexible display screen 20, so that the flexible display screen 20 remains as flat as possible during use and protects the non-display surface of the flexible display screen 20. For example, a portion of the flexible display screen 20 is fixed to the first frame body 301 by an adhesive layer, and a portion is fixed to the second frame body 302 by an adhesive layer. The adhesive layer can be a thin film layer formed by applying glue, and the specific form of the adhesive layer is not limited in this embodiment of the application. In addition, other electronic components can be provided on the side of the first frame body 301 and the second frame body 302 away from the display screen 20, for example, a printed circuit board (PCB), a battery, a receiver, a speaker, a camera, etc. The PCB can integrate electronic components such as the main controller, storage unit, antenna module, power management module, etc. of the electronic device, and the battery can power electronic components such as the display screen 20, circuit board, receiver, speaker, camera, etc. Of course, the embodiment of the present application does not limit the electronic components provided on the first frame body 301 and the second frame body 302 .

[0077] The back cover 40 includes a first housing 401, a second housing 402, and a hinge mechanism 403. The first housing 401 and the second housing 402 are disposed on either side of the hinge mechanism 403. In some embodiments, the display screen 20 may include a first display portion 201 corresponding to the first housing 401, a second display portion 202 corresponding to the second housing 402, and a foldable display portion 203 corresponding to the hinge mechanism 403. The foldable display portion 203 may be connected between the first display portion 201 and the second display portion 202. The first display portion 201 may be connected to the first frame 301, and the second display portion 202 may be connected to the second frame 302.

[0078] Under the action of the hinge mechanism 403, the first shell 401 and the second shell 402 can move closer to or farther from each other. Accordingly, the first display portion 201 and the second display portion 202 of the display screen 20 can move closer to or farther from each other, so that the display screen 20 can be folded or unfolded.

[0079] As shown in Figure 1B, in the folded state, the angle α between the first shell 401 and the second shell 402 can be rotated from 180° to a state where the first shell 401 and the second shell 402 are parallel to each other and opposite each other, and the distance between the first shell 401 and the second shell 402 is minimized. In this case, the first display portion 201 and the second display portion 202 can be considered to be arranged on different planes. Figure 1B illustrates the example of the electronic device 1 being folded with the display screen 20 facing outward and the first shell 401 and the second shell 402 facing each other (folding outward). Similarly, the electronic device 1 can also be folded with the display screen 20 facing inward and the first display portion 201 and the second display portion 202 facing each other (folding inward). In the folded state, the first display portion 201 and the second display portion 202 can be parallel to each other and opposite each other, and the height distance between the first display portion 201 and the second display portion 202 is minimized. Of course, the electronic device 1 is not limited to a two-fold electronic device 1; the electronic device 1 can also be a multi-fold electronic device 1, and this embodiment of the application does not limit this.

[0080] As shown in FIG. 1A , in the unfolded state, the angle α between the first shell 401 and the second shell 402 may be approximately 180°, and the display screen 20 is in the unfolded state.

[0081] FIG1C is a cross-sectional view of a bar electronic device provided in an embodiment of the present application.

[0082] As shown in Figure 1C, the straight electronic device has a simple structure compared to the laminated electronic device and can be simplified into a four-layer structure. The first is the cover layer (cover) that serves as the screen protection layer 10. The material of the cover layer is generally glass, and the thickness is generally above 500um. Below the screen protection layer 10 is the display screen (or display panel, panel) 20. The display screen 20 includes an OLED light-emitting layer, a thin film field effect transistor (TFT) circuit and upper and lower packaging layers, which play a light-emitting role. Below the display screen 20 is the middle frame 30. A supporting layer such as copper foil can be provided between the middle frame 30 and the display screen 20. The middle frame 30 and the back cover 40 are covered to form a through-hole.

[0083] FIG1D is a simplified diagram of a display module provided in an embodiment of the present application, and FIG1E is a cross-sectional view along the A1 - A2 line in FIG1A provided in an embodiment of the present application.

[0084] The structure of a foldable electronic device is relatively complex. The structure above the middle frame 30 can be understood as the display module provided in the embodiment of the present application. As shown in FIG1D , the display module 2 can be simplified to include a five-layer structure. The outermost layer is the display surface layer, which is located on the outermost side of the display screen 20 and can protect the reliability of the screen. Below the display surface layer is the cover layer, which plays a protective role. The screen protection layer 10 includes two layers: the display surface layer and the cover layer. Immediately below is the display screen 20. The backlight surface of the display screen 20 is provided with a support layer 50 and a bamboo book 60. As shown in FIG1E , several main laminated layers are adhered by optically clear adhesive (OCA).

[0085] As shown in FIG1E , a polarizer (POL) or polyethylene terephthalate (PET) layer may be provided on the light-emitting side of the display screen 20. One or more buffer layers (BF) may also be provided on the backlight side of the display screen 20. The material of the support layer 50 may include polyimide (PI), for example.

[0086] The second frame 302 of the middle frame 30 is provided below the bamboo book 60. The bamboo book 60 and the middle frame 30 can be bonded together by OCA, for example. The second shell 402 and the second frame 302 are covered to form a receiving space, and the battery is located in the receiving space.

[0087] Because the foldable display screen 20 must be bendable, the material of the cover plate on the light-emitting side of the display screen 20 must be changed from glass to a foldable, flexible material. In existing electronic devices, the reliability of foldable displays 20 cannot be compared to that of candy-bar phones. When the display screen 20 is subjected to stress scenarios such as drops, bumps on bumps, etc., because the screen surface is mostly made of polymer structures, the display screen 20 is very prone to failures such as black spots and bright spots. Therefore, the reliability of the display screen 20 in foldable electronic devices is not as good as that of the display screen 20 in candy-bar electronic devices. At the same time, because the foldable display screen 20 needs to have specific bendable properties, the thickness of the entire display module 2 cannot be made too thin after changing from a glass cover plate to a polymer cover plate. If the thickness of the display module 2 is thinner, not only will the reliability of the entire display module (such as the risk of impact, squeezing, and screen arching when dropped) be unguaranteed, but the refinement of the display module 2 (such as large-surface light shadows and creases) will also be a challenge. In addition, in order to achieve the reliability and bendability of the foldable display screen 20, a multi-layer design is often used in the display surface layer and the cover layer to achieve multi-layer neutral bendability under small angle bending.

[0088] However, the cover layer in the folding electronic device 1 is different from the glass cover in the straight electronic device 1. The glass cover is strong, harder and wear-resistant. The cover layer in the folding electronic device 1 is mainly protected by PET film and transparent polyimide (colorless polyimide, CPI) film. After the display screen 20 is impacted, it cannot absorb enough energy or dissipate energy like the cover glass in the straight electronic device 1, and the protection performance is poor.

[0089] FIG1F is a cross-sectional view of a display screen provided in an embodiment of the present application, and FIG1G is an enlarged view of point A in FIG1F .

[0090] As shown in FIG. 1F , the display screen 20 generally includes an array substrate 204 , a light-emitting device layer 205 , and an encapsulation layer 206 .

[0091] For example, the array substrate 204 may include a substrate (or backplane (BP)) 111 formed of a PI material, and multiple inorganic insulating layers 123 and multiple metal layers 124 located on one side of the substrate 111. The multiple inorganic insulating layers 123 and the multiple metal layers 124 are used to form electronic devices such as TFTs and capacitors.

[0092] The light-emitting device layer 205 may specifically include a stacked anode 113, a light-emitting layer 114, and a cathode 115. When the electronic device is driven to emit light, the electronic devices in the array layer 112 transmit a driving current to the anode 113, and electrons and holes are respectively injected into the light-emitting layer 114 for combined emission. Of course, the light-emitting device layer 205 may also include a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, etc. Figure 1F is only a schematic diagram.

[0093] The encapsulation layer 206 may specifically include a first inorganic encapsulation layer 120 , an organic encapsulation layer 121 and a second inorganic encapsulation layer 122 , which are stacked. The encapsulation layer 206 is used to prevent water and oxygen from penetrating from the outside and protect the light-emitting devices and electronic devices in the electronic device.

[0094] The array substrate 204 and encapsulation layer 206 include multiple inorganic layers. Inorganic materials have lower bending resistance than organic materials. Even if organic encapsulation technology is subsequently adopted, there is some improvement in bending resistance, but there is still a gap compared to thick glass encapsulation.

[0095] When electronic device 1 is bent or subjected to external forces, the thick and ineffectively patterned substrate 111 prevents the array substrate 204 from being stressed. When the accumulated stress exceeds the cracking thresholds of substrate 111, inorganic insulating layer 123, and encapsulation layer 206, it causes film cracking, making it difficult to ensure the impact resistance and bending reliability of electronic device 1. Furthermore, as shown in FIG1G , cracking of inorganic insulating layer 123 can further cause disconnection of metal layer 124 adjacent to inorganic insulating layer 123, leading to display defects such as broken bright spots, bright lines, cracking, and shedding in electronic device 1.

[0096] In summary, using this multi-layered design to protect the display screen 20 not only brings design complexity but also poses challenges in process manufacturability and supply chain. Therefore, issues such as the structure, thickness, reliability, and sophistication of the film layers on both sides of the display screen 20 have always been areas where the flexible electronic device 1 needs further improvement.

[0097] Based on this, an embodiment of the present application provides a laminated structure, which is set on the light-emitting side of the display screen 20 as a screen protection layer 10 and is applied to the above-mentioned electronic device 1. The laminated structure has certain improvements in reliability and thickness.

[0098] FIG2 is a cross-sectional view of a laminated structure provided in an embodiment of the present application.

[0099] As shown in FIG. 2 , the laminate structure 90 includes a protective layer 91 and a first impact-resistant layer 92 , and the protective layer 91 and the first impact-resistant layer 92 are connected.

[0100] The protective layer 91 has a high elastic modulus and serves as an explosion-proof protective layer. After the laminated structure 90 is applied to the electronic device 1, the protective layer 91 is located on the surface of the display side of the electronic device 1 and can be directly touched.

[0101] The material of the protective layer 91 may include, for example, explosion-proof materials, energy-absorbing and impact-resistant materials, polymer materials, etc. For example, the modulus of the protective layer 91 is 10 mPa-20 GPa. For example, the material of the protective layer 91 includes PET, CPI, glass fiber, CPI composite materials, etc.

[0102] The first impact-resistant layer 92 is located on one side of the protective layer 91 . When the laminated structure 90 is applied to the electronic device 1 , the first impact-resistant layer 92 is located on the side of the protective layer 91 facing the display screen 20 .

[0103] The elastic modulus of the first impact-resistant layer 92 is smaller than the elastic modulus of the protective layer 91, the hardness of the first impact-resistant layer 92 is greater than the hardness of the protective layer 91, and / or the stiffness of the first impact-resistant layer 92 is greater than the stiffness of the protective layer 91. The protective layer 91 is used to provide explosion-proof protection, and the first impact-resistant layer 92 is used to improve the reliability of the laminated structure 90.

[0104] For example, the material of the first impact-resistant layer 92 includes ultra-thin flexible glass (UTG) or high-entropy glass. UTG and high-entropy glass have good elasticity and recoverability. By using this minimalist structure with multiple UTG or high-entropy glass, the recoverability of the crease is greatly improved.

[0105] The laminated structure 90 provided in the embodiment of the present application is a laminated structure that stacks a first impact-resistant layer 92 with high hardness and / or high stiffness with a protective layer 91 with a high elastic modulus. This combines the extrusion resistance of the high hardness and / or high stiffness material with the impact resistance of the high elastic modulus material, which can improve the impact resistance, scratch resistance, extrusion resistance, and bending resistance of the laminated structure 90. It can also improve the refinement of creases and large-surface light and shadow, thereby improving the reliability and refinement of the laminated structure 90. Moreover, the first impact-resistant layer 92 is connected to the protective layer 91, which is conducive to achieving a thin design of the laminated structure 90, reducing the opening and closing resistance during the bending process, and further improving the reliability and refinement of the laminated structure 90. Furthermore, the laminated structure 90 can be directly and separately arranged on the light-emitting side of the display screen 20, combining the display surface layer and the cover layer into one, which can simplify the architecture of the electronic device 1.

[0106] In some embodiments, the protective layer 91 and the first impact-resistant layer 92 are bonded to achieve chemical connection.

[0107] For example, the material of the protective layer 91 includes CPI, the material of the first impact-resistant layer 92 includes UTG, and the siloxane in the CPI and the silanol in the UTG undergo a cross-linking chemical reaction.

[0108] For example, the surface of the first impact-resistant layer 92 facing the protective layer 91 is a plane, and the first impact-resistant layer 92 is chemically bonded to the protective layer 91. Of course, the surface of the first impact-resistant layer 92 facing away from the protective layer 91 can be a plane or a surface of other shapes, which is not limited in this embodiment of the present application.

[0109] The first impact-resistant layer 92 and the protective layer 91 are designed as a composite laminate structure. No connecting layer is required between the first impact-resistant layer 92 and the protective layer 91, which is conducive to achieving a thin design of the laminate structure 90, reducing the opening and closing resistance during the bending process, and further improving the reliability and sophistication of the laminate structure 90.

[0110] 3A-3C are cross-sectional views of a stacked structure provided in an embodiment of the present application.

[0111] In some embodiments, as shown in FIG. 3A , the laminate structure 90 further includes a first connection layer 93 , which is bonded between the protective layer 91 and the first impact-resistant layer 92 .

[0112] For example, the material of the first connecting layer 93 includes an energy-absorbing and impact-resistant material, such as a non-Newtonian fluid material. The material of the protective layer 91 includes CPI, and the material of the first impact-resistant layer 92 includes UTG. The first connecting layer 93 is chemically bonded to the protective layer 91 and the first impact-resistant layer 92.

[0113] For example, the empty orbitals of boron (B) atoms in the non-Newtonian fluid material form coordination bonds with the surplus electron pairs on the hydroxyl oxygen of the UTG layer surface, thereby chemically bonding the first connecting layer 93 to the first impact-resistant layer 92. The epoxy or polyester groups in the non-Newtonian fluid material form coordination bonds with the epoxy groups in the CPI layer, thereby chemically bonding the first connecting layer 93 to the protective layer 91.

[0114] In one implementation, the first connection layer 93 may cover the top surface of the first impact-resistant layer 92 facing the protection layer 91 and bonded to the top surface of the first impact-resistant layer 92 .

[0115] In another implementation, as shown in FIG. 3A , the first connection layer 93 may cover the top surface and side surfaces of the first impact-resistant layer 92 and be bonded to both the top surface and side surfaces of the first impact-resistant layer 92 .

[0116] In another implementation, as shown in FIG. 3B , the first connection layer 93 may cover the top surface, side surfaces, and the bottom surface facing away from the protective layer 91 of the first impact-resistant layer 92 , and be bonded to all surfaces of the first impact-resistant layer 92 .

[0117] For example, as shown in FIG3A , the top surface of the first anti-impact layer 92 facing the protective layer 91 and the bottom surface facing away from the protective layer 91 are both flat surfaces.

[0118] Alternatively, for example, as shown in FIG3C , the top surface of the first impact-resistant layer 92 facing the protective layer 91 has a groove, and the bottom surface facing away from the protective layer 91 is flat.

[0119] Alternatively, for example, as shown in FIG3B , the first anti-impact layer 92 has grooves on its top surface facing the protective layer 91 and its bottom surface facing away from the protective layer 91 .

[0120] For example, the grooves on the first impact-resistant layer 92 can be filled with a non-Newtonian fluid layer 92. Alternatively, the grooves on the first impact-resistant layer 92 can be filled with a separate material such as a filling glue. In this case, the thickness of the first impact-resistant layer 92 at the location of the grooves is less than the thickness of the first impact-resistant layer 92 at other locations. The embodiment of the present application does not limit the shape of the grooves; rectangular grooves, arcuate grooves, trapezoidal grooves, and the like are all applicable.

[0121] By providing grooves on the first impact-resistant layer 92 and reducing the thickness of the middle region of the first impact-resistant layer 92 , the first impact-resistant layer 92 has bending properties while ensuring reliability, thereby reducing the risk of breakage of the first impact-resistant layer 92 .

[0122] In some embodiments, the first impact-resistant layer 92 has a uniform thickness at non-grooved locations. For example, the first impact-resistant layer 92 has a film structure with equal thickness on both sides and a thinner thickness in the middle. This can reduce the difficulty of preparing the first impact-resistant layer 92.

[0123] In some embodiments, the first impact-resistant layer 92 has a dimension of less than or equal to 50 μm at its thinnest location. Alternatively, the dimension of the first impact-resistant layer 92 at a location closest to the bottom surface is less than or equal to 50 μm.

[0124] The thickness of the first impact-resistant layer 92 can be selected in combination with reliability and rebound force. For example, the size of the first impact-resistant layer 92 at the thinnest position can be 50um, 45um, 40um, 35um, 30um, 25um, 20um, 15um, 10um, 8um, 7um, 5um, 4um or 3um, etc.

[0125] For example, the top surface and the bottom surface of the first impact-resistant layer 92 are both planes, the first impact-resistant layer 92 is a flat plate structure, and the thickness of each position of the first impact-resistant layer 92 is approximately less than or equal to 50 μm.

[0126] Alternatively, for example, the top and / or bottom surfaces of the first impact-resistant layer 92 may have grooves. Depending on the groove structure, the thickness at the groove locations may be equal or unequal, but the thickness at the groove locations is less than the thickness at non-grooved locations. For example, the thinnest dimension at the groove locations is less than or equal to 50 μm, and the thickness at the non-grooved locations may be less than or equal to 500 μm, for example. The thickness at the non-grooved locations may be, for example, 500 μm, 450 μm, 400 μm, 350 μm, 300 μm, 250 μm, 200 μm, 150 μm, 100 μm, or 50 μm, etc.

[0127] For example, the thickness of the first impact-resistant layer 92 on both sides is 100 μm, and the thickness of the middle groove region is 50 μm. Alternatively, for example, the thickness of the first impact-resistant layer 92 on both sides is 40 μm, and the thickness of the middle groove region is 25 μm.

[0128] The protective layer 91 and the first impact-resistant layer 92 are chemically connected via the first connection layer 93 . The chemical connection has a relatively high connection reliability. Moreover, the first connection layer 93 can be made relatively thin, which has a relatively small impact on the performance of the first impact-resistant layer 92 .

[0129] 4A-4C are cross-sectional views of a stacked structure provided in an embodiment of the present application.

[0130] In some embodiments, as shown in FIG4A , the laminate structure 90 further includes a second impact-resistant layer 94, which is located on a side of the first impact-resistant layer 92 away from the protective layer 91. A first connecting layer 93 wraps around a surface of the first impact-resistant layer 92 away from the protective layer 91, and the second impact-resistant layer 94 is bonded to the first connecting layer 93.

[0131] That is, the first connection layer 93 connects the protective layer 91 and the first impact-resistant layer 92 , and also connects the first impact-resistant layer 92 and the second impact-resistant layer 94 .

[0132] The laminated structure 90 may include multiple impact-resistant layers. By reducing the thickness of each impact-resistant layer, the multiple impact-resistant layers are arranged. While maintaining the overall stiffness and hardness of the multiple impact-resistant layers, the elastic modulus of the multiple impact-resistant layers can be increased, further enhancing the impact resistance, scratch resistance, compression resistance, and bending resistance of the laminated structure 90. Furthermore, the multiple impact-resistant layers can be directly bonded together via the first connecting layer 93, simplifying the laminated structure 90.

[0133] In other embodiments, as shown in Figure 4B, the laminate structure 90 also includes a second impact-resistant layer 94 and a second connecting layer 95. The second impact-resistant layer 94 is located on the side of the first impact-resistant layer 92 away from the protective layer 91, and the second connecting layer 95 is located between the first impact-resistant layer 92 and the second impact-resistant layer 94. The first impact-resistant layer 92 and the second impact-resistant layer 94 are connected through the second connecting layer 95.

[0134] The material and structure of the second impact-resistant layer 94 can refer to the above description of the material and structure of the first impact-resistant layer 92 , and will not be repeated here.

[0135] Regarding the material of the second connection layer 95 , in some embodiments, the material of the second connection layer 95 includes an adhesive material, and the second connection layer 95 is bonded to the first impact-resistant layer 92 and the second impact-resistant layer 94 , respectively.

[0136] The adhesive material includes, for example, optically transparent adhesive materials such as OCA. The first impact-resistant layer 92 and the second impact-resistant layer 94 are connected by the adhesive material. The technology is mature and easy to implement.

[0137] In other embodiments, the material of the second connection layer 95 includes a polymer material, and the second connection layer 95 is bonded to the first impact-resistant layer 92 and the second impact-resistant layer 94 .

[0138] Polymer materials include, for example, PET, CPI, glass fiber, CPI composite materials, etc. The first impact-resistant layer 92 and the second impact-resistant layer 94 are chemically bonded by the polymer material, resulting in a good connection effect, and the thickness of the second connection layer 95 can be made relatively thin.

[0139] In some other embodiments, the material of the second connection layer 95 includes an energy-absorbing and impact-resistant material, and the second connection layer 95 is bonded to the first impact-resistant layer 92 and the second impact-resistant layer 94 .

[0140] The energy-absorbing and impact-resistant material includes, for example, a non-Newtonian fluid material. At this time, the structural relationship between the second connecting layer 95 and the first impact-resistant layer 92 and the second impact-resistant layer 94 can refer to the above description of the structural relationship between the first connecting layer 93 and the first impact-resistant layer 92, which will not be repeated here.

[0141] In the embodiment of the present application, the multi-layer impact-resistant layer can also be connected by various methods such as chemical bonding or adhesion of the connecting layer, which has a wide range of applications.

[0142] In some embodiments, the thickness of the stacked structure 90 is less than or equal to 600 um. For example, the thickness of the stacked structure 90 is 600 um, 550 um, 500 um, 450 um, 400 um, 350 um, 300 um, 250 um, 200 um, or 150 um.

[0143] The laminated structure 90 provided in the embodiment of the present application can be made relatively thin while meeting the reliability requirements, thereby meeting the demand for thinness and lightness of the electronic device 1 .

[0144] In some embodiments, as shown in FIG. 4C , the laminate structure 90 further includes a third connection layer 97 and a third impact-resistant layer 98 sequentially disposed on a side of the second impact-resistant layer 94 away from the second connection layer 95 .

[0145] The third connecting layer 97 can refer to the above description of the second connecting layer 95, and the third impact-resistant layer 98 can refer to the above description of the first impact-resistant layer 92, which will not be repeated here. Of course, the laminated structure 90 can also include multiple layers of connecting layers and impact-resistant layers arranged alternately.

[0146] When the laminated structure 90 includes multiple impact-resistant layers, the thicknesses of the multiple impact-resistant layers are not limited to be the same, and the structures of the multiple impact-resistant layers are not limited to be the same, and can be set in combination with the adaptability of the product structure.

[0147] By thinning the thickness of each impact-resistant layer and setting up multiple impact-resistant layers, the overall stiffness and hardness of the multiple impact-resistant layers remain unchanged, but the elastic modulus of the multiple impact-resistant layers can be increased to further improve the impact resistance, scratch resistance, extrusion resistance and bending resistance of the laminated structure 90.

[0148] In some embodiments, the side of the stacked structure 90 is perpendicular to the protective layer 91. Approximately perpendicular angles within the process tolerance range are considered perpendicular in the embodiments of the present application. For example, angles within the range of 90°±10° are considered perpendicular to the side of the protective layer 91 in the embodiments of the present application.

[0149] The side surfaces of the laminated structure 90 are perpendicular to the protective layer 91 , so that the strength of the laminated structure 90 at each position is relatively uniform. The laminated structure 90 provides almost the same protection strength to each position of the display screen 20 , thereby improving the problem of poor protection at the edge of the display screen 20 .

[0150] FIG5 is a cross-sectional view of a laminated structure provided in an embodiment of the present application.

[0151] 5 , the laminate structure 90 further includes a protective layer 91, a first impact-resistant layer 92, a first connecting layer 93, a second connecting layer 95, and a second impact-resistant layer 94. The first connecting layer 93 is an adhesive layer bonded between the protective layer 91 and the first impact-resistant layer 92, and the second connecting layer 95 is bonded between the first impact-resistant layer 92 and the second impact-resistant layer 95.

[0152] The structures of the protective layer 91 , the first impact-resistant layer 92 , the second connection layer 95 , and the second impact-resistant layer 94 may refer to the above-mentioned related descriptions and will not be repeated here.

[0153] The material of the first connection layer 93 includes, for example, transparent adhesive materials such as OCA. In the embodiment of the present application, the protective layer 91 and the first impact-resistant layer 92 can also be connected by adhesive materials to meet various usage requirements.

[0154] FIG6A is a cross-sectional view of a display module provided in an embodiment of the present application, and FIG6B is a simplified diagram of a display module provided in an embodiment of the present application.

[0155] An embodiment of the present application provides a display module, as shown in FIG6A , which includes any of the above-mentioned laminated structures 90 and a display screen 20 . The laminated structure 90 is disposed on the display screen 20 , and the light-emitting surface of the display screen 20 faces the second impact-resistant layer 94 .

[0156] For example, the display module further includes a third adhesive layer 993 , which is located between the laminated structure 90 and the display screen 20 , and two sides of the third adhesive layer 993 are respectively connected to the laminated structure 90 and the display screen 20 .

[0157] The laminated structure 90 and the display screen 20 are directly bonded by the third adhesive layer 993 , and no other film layer is required between the two. This can simplify the structure of the display module, reduce the gap between the display screen 20 and the laminated structure 90 , and thus reduce the overall size of the display module.

[0158] In some embodiments, as shown in FIG6A , the display module further includes a first adhesive layer 991 , a flat layer BF, a second adhesive layer 992 , and a bamboo book 60 , which are sequentially arranged on the backlight surface of the display screen 20 . The flat layer BF is connected to the display screen 20 through the first adhesive layer 991 , and the bamboo book 60 is connected to the flat layer BF through the second adhesive layer 992 .

[0159] The backlight surface of the display screen 20 is no longer provided with the support layer 50 , which can further simplify the structure of the display module, reduce the thickness of the display module, and achieve an extremely simple, lightweight and thin display module.

[0160] In some embodiments, the elastic modulus of the bamboo book 60 is greater than or equal to 10 GPa. For example, the elastic modulus of the bamboo book 60 can be 10 GPa, 50 GPa, 100 GPa, 150 GPa, 200 GPa, 250 GPa, 300 GPa, 350 GPa, 400 GPa, 450 GPa, 500 GPa, 550 GPa, 600 GPa, 650 GPa, 700 GPa, 750 GPa, 800 GPa, 850 GPa, 900 GPa, 950 GPa, 1000 GPa, 1500 GPa, etc.

[0161] For example, the materials of the bamboo book 60 include carbon fiber, graphite fiber, asphalt-based, high entropy alloy, stainless steel, titanium alloy, composite materials of asphalt-based and metal (such as aluminum, titanium, steel, etc.), composite materials of carbon fiber and metal, etc.

[0162] By selecting a material with a high elastic modulus for the bamboo book 60 , the impact resistance of the bamboo book 60 can be improved, and the refinement of creases and large-area light and shadow can be improved, thereby improving the reliability and refinement of the display module while simplifying the display module architecture.

[0163] In some embodiments, the bamboo book 60 includes a first portion and a second portion, with the second portion disposed on opposite sides of the first portion. The elastic modulus of the first portion is smaller than that of the second portion. In other words, the elastic modulus of the middle portion of the bamboo book 60 is smaller than that of the side portions. For example, the first portion corresponds to the foldable display portion 203 of the display screen 20.

[0164] By reducing the elastic module in the middle area of ​​the bamboo book 60, the bendability of the middle bending area can be guaranteed, further improving the performance of the display module.

[0165] For example, the first and second parts of the bamboo book 60 are made of the same material, but have different structures, so that the elastic modulus of the first part is smaller than that of the second part. The same material can be used to reduce the number of materials used in the bamboo book 60.

[0166] Alternatively, for example, the first and second parts of the bamboo book 60 are made of different materials, so that the elastic modulus of the first part is smaller than that of the second part. Using different materials at different modulus positions of the bamboo book 60 can improve the workability of the bamboo book 60.

[0167] In some embodiments, as shown in FIG. 6A , the projection of the stacked structure 90 on the flat layer BF covers the projection of the display screen 20 on the flat layer BF.

[0168] The laminated structure 90 can protect the display screen 20, improve the problem of easy damage in the edge extrusion weak area, and further enhance the reliability of the display module.

[0169] As shown in FIG. 6B , the display module can be simplified to include a laminated structure 90 , a display screen 20 , and a bamboo book 60 , and no supporting layer may be provided between the bamboo book 60 and the display screen 20 .

[0170] 7A-7C are assembly diagrams of an electronic device provided in an embodiment of the present application.

[0171] In some embodiments, as shown in FIG. 7A , the electronic device 1 provided in the embodiment of the present application further includes a frame, which is located at the periphery of the display screen 20 and extends to the top of the laminated structure 90 and overlaps with the laminated structure 90 .

[0172] The frame, which can also be called the "small A shell", is one of the important parts of the folding electronic device 1. Since the display screen 20 will shift when it is bent, a horizontal gap must be reserved between the side wall of the middle frame 30 and the display screen 20. As shown in Figure 7B, during the assembly of the electronic device, the stack formed by the cover plate, the display screen 20, the support layer 50, and the bamboo book 60 is first placed on the middle frame 30. Then the frame is placed. The frame is located between the middle frame 30 and the display screen 20 and overlaps the surface of the cover plate. On the one hand, the existence of the frame is to cover the gap between the display screen 20 and the middle frame 30. On the other hand, it can play a certain protective role against the edge pressure of the electronic device 1. The display surface layer is then placed on the surface of the cover plate. In order to absorb the assembly tolerance, there is a gap between the display surface layer and the frame, which affects the visual appearance.

[0173] As shown in Figure 7A, the assembly process of the electronic device 1 provided in the embodiment of the present application begins by placing the display module 2, which includes a laminated structure 90, a display screen 20, and a bamboo book 60, on the middle frame 30. This "minimalist" architecture allows for a further reduction in the thickness of the laminated structure, allowing the laminated structure 90 to cover the display screen 20. The laminated structure 90 provides a certain degree of protection against pressure on the edges of the electronic device 1, alleviating the problem of bright lines caused by fingernail compression in the edge area. The frame is then placed between the middle frame 30 and the display screen 20, overlapping the surface of the laminated structure 90. This creates a seamless gap between the frame and the laminated structure 90, enhancing the aesthetics and reducing dust absorption. Furthermore, the laminated structure 90 provides protection against pressure on the edges of the electronic device 1, reducing the need for frame protection and achieving a "narrow frame" effect. Furthermore, since the laminated structure 90 in this application integrates the display surface layer and the cover plate, there is no need to attach the display surface layer after the frame is assembled, streamlining the assembly process of the electronic device 1.

[0174] In some embodiments, the width of the projection of the frame on the plane where the display module is located is less than or equal to 0.5 mm.

[0175] The width of the bezel can be understood as the distance between the edge of the heavy bezel closest to the display module and the edge of the bezel closest to the middle frame. For example, the width of the bezel can be 0.5mm, 0.45mm, 0.4mm, 0.35mm, 0.3mm, 0.25mm, 0.2mm, 0.15mm, or 0.1mm.

[0176] Since the laminated structure 90 protects the edge of the electronic device 1 from being pressed, a frame is not required to protect it. The frame only needs to fill the gap between the display module and the middle frame 30. Therefore, the width of the frame can be reduced.

[0177] In some embodiments, as shown in FIG7C , the electronic device 1 includes a middle frame 30, and the display module is disposed on the middle frame 30. For example, the side surfaces of the display module are disposed adjacent to the middle frame 30. No border is provided between the display module and the middle frame 30; the gap between the display module and the middle frame 30 is sufficient to allow the display screen 20 to shift when bent.

[0178] By not providing a frame between the display module and the middle frame 30 , a “narrow frame” effect can be further achieved.

[0179] 8A and 8B are cross-sectional views of an electronic device provided in an embodiment of the present application.

[0180] As shown in FIG8A , in some embodiments, the display screen 20 includes a first planar portion 21, a bent portion 22, and a second planar portion 23. The bent portion 22 is connected between the first planar portion 21 and the second planar portion 23. The first planar portion 21 is connected to the laminated structure 90, and the second planar portion 23 is located on the backlight side of the first planar portion 21. A bamboo book 60 is disposed between the first planar portion 21 and the second planar portion 23. A flat layer BF is provided on the upper and lower sides of the bamboo book 60. The second planar portion 23 is connected to the middle frame 30 via adhesive.

[0181] The electronic device 1 further includes a module adhesive layer MCL, and the module adhesive layer MCL covers the bent portion 22 .

[0182] As shown in FIG8B , when a display surface layer and a cover plate are provided above the display screen 20 , a first cover plate and a second cover plate are usually provided above the display screen 20 , the first cover plate and the second cover plate are bonded together by an adhesive layer, and the first cover plate and the display surface layer are bonded together by an adhesive layer.

[0183] Since a module coating layer (MCL) exists in the pad bonding area (PB) of the electronic device 1, a certain gap is reserved between the second cover plate above the display screen 20 and the module coating layer MCL to prevent the second cover plate from contacting the module coating layer MCL when bent and dislocated. Above the gap is only a thin first cover plate (CPI / PET), which is a weak area of ​​edge extrusion, resulting in the problem of fingernail extrusion failure in the pad bonding area PB.

[0184] As shown in FIG8A , in the electronic device 1 of the present application, the display screen 20 is directly connected to the laminate structure 90 . Under the premise of ensuring extrusion / impact reliability, the “minimalist” architecture can eliminate the second cover plate, reduce the thickness of the module coating layer MCL, and further reduce the thickness of the laminate.

[0185] In some embodiments, the thickness of the module coating layer MCL is 90um-50um.

[0186] The thickness of the module adhesive layer MCL can be understood as the distance between the surface of the module adhesive layer MCL facing the bend 22 and the surface of the module adhesive layer MCL facing away from the bend 22. The thickness of the module adhesive layer MCL can be equal or unequal at different locations. For example, the thickness of the module adhesive layer MCL can be 90 μm, 85 μm, 80 μm, 75 μm, 70 μm, 65 μm, 60 μm, 55 μm, or 50 μm.

[0187] In this embodiment of the present application, only the third adhesive layer 993 can be provided between the display screen 20 and the laminated structure 90. Therefore, the gap between the first planar portion 21 and the laminated structure 90 can be relatively small, thereby reducing the thickness of the electronic device 1. Furthermore, there is no need for a supporting layer between the first planar portion 21 and the second planar portion 23, thereby reducing the thickness of the module adhesive layer MCL and further achieving a "narrow bezel" effect.

[0188] In some embodiments, the laminated structure 90 covers the display screen 20. If the display screen 20 includes a bent portion 22, since the bent portion 22 and the second planar portion 23 do not have a display function, the laminated structure 90 covering the display screen 20 can be understood as the laminated structure 90 covering the first planar portion 21.

[0189] In the embodiment of the present application, the laminated structure 90 can protect the edge extrusion weak area and the pad bonding area PB located thereunder, thereby improving the edge reliability of the electronic device 1 .

[0190] FIG9 is a schematic diagram of a process for preparing an impact-resistant layer provided in an embodiment of the present application.

[0191] The present application also provides a method for preparing an impact-resistant layer, as shown in FIG9 . The method comprises:

[0192] S1. Provide original glass sheets.

[0193] For example, you can choose 150um-400um glass raw materials and cut them into 4-inch-20-inch glass sheets according to product requirements.

[0194] S2. Place the original glass sheet in a hot casting fixture with protrusions on the inner surface for hot casting to form a glass sheet with grooves on the surface.

[0195] Figure 9 illustrates a glass sheet with grooves on one surface. After hot casting, two glass sheets with grooves can also be formed. Depending on the requirements of the target product, the hot casting step can be performed once or multiple times. Figure 9 illustrates the example of performing two hot casting steps.

[0196] For example, the temperature of the hot casting is greater than or equal to the softening temperature of the glass, for example, the temperature of the hot casting is 600° C.-1000° C. The inner surface of the hot casting fixture can be understood as the surface of the hot casting fixture facing the original glass sheet.

[0197] S3. Trimming the glass sheet to a target size to form an impact-resistant layer; the upper surface and / or lower surface of the impact-resistant layer has grooves.

[0198] For example, step S3 includes trimming the length and width of the glass sheet using laser or CNC machining, and trimming the thickness of the glass sheet using etching. The thickness direction of the glass sheet is, for example, from the surface with the groove to the opposite surface.

[0199] The etching process can be a double-sided etching process to speed up the etching process. Of course, a single-sided etching process can also be used. The etching solution used in the etching process can include a mixed acid such as hydrofluoric acid, sulfuric acid, and nitric acid. After the thickness is reduced to the target size, it can be further cleaned, edge-treated, and strengthened to form a shock-resistant layer of varying thickness.

[0200] In some embodiments, before or after trimming the glass sheet to a target size, the preparation method further includes polishing the glass sheet to improve the optical effect of the impact-resistant layer.

[0201] The embodiment of the present application adopts a hot casting process to form the impact-resistant layer, which can improve the processing efficiency and machinability of impact-resistant layers of unequal thickness and can be produced on a large scale.

[0202] An embodiment of the present application provides an impact-resistant layer for use in the electronic device 1. The impact-resistant layer has a first surface and a second surface facing each other, one of which faces toward the protective layer 91 and the other faces away from the protective layer 91. The first surface and / or the second surface have grooves.

[0203] The impact-resistant layer may be, for example, the first impact-resistant layer 92 or the second impact-resistant layer 94 .

[0204] The present application also provides a hot casting jig for preparing the impact-resistant layer. The hot casting jig includes a first component and a second component. In an applied state, the surface of the first component facing the second component has a protrusion, and / or the surface of the second component facing the first component has a protrusion.

[0205] The first and second components are made of materials such as graphite and stainless steel, and are assembled into a master-slave mold. If only one surface of the impact-resistant layer to be formed has a groove, then either the first or second surface has a protrusion, with the protrusion facing the original glass sheet. If two opposing surfaces of the impact-resistant layer to be formed have grooves, then both the first and second surfaces have protrusions, with the protrusion facing the original glass sheet. The width and height of the protrusions are related to the dimensions of the grooves to be formed and are selected based on the design of the unequal thickness regions to amplify the expansion coefficient of the original glass sheet.

[0206] The above are only specific embodiments of the present application, but the scope of protection of the present application is not limited thereto. Any changes or replacements within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A laminated structure, characterized in that: The laminated structure is arranged on a display screen, and the laminated structure comprises: Protective layer; A first impact-resistant layer is located on one side of the protective layer and connected to the protective layer; the elastic modulus of the first impact-resistant layer is smaller than the elastic modulus of the protective layer, the hardness of the first impact-resistant layer is greater than the hardness of the protective layer, and / or the stiffness of the first impact-resistant layer is greater than the stiffness of the protective layer.

2. The laminated structure according to claim 1, characterized in that: The protective layer is bonded to the first impact-resistant layer.

3. The laminated structure according to claim 1, characterized in that: The laminate structure further includes a first connecting layer, wherein the first connecting layer is bonded between the protective layer and the first impact-resistant layer.

4. The laminated structure according to claim 3, characterized in that: The laminate structure further includes a second impact-resistant layer; the second impact-resistant layer is located on a side of the first impact-resistant layer away from the protective layer; The first connecting layer wraps the surface of the first impact-resistant layer away from the protective layer, and the second impact-resistant layer is bonded to the first connecting layer.

5. The laminated structure according to any one of claims 1 to 3, characterized in that: The laminate structure further includes a second impact-resistant layer and a second connecting layer; the second impact-resistant layer is located on a side of the first impact-resistant layer away from the protective layer, and the second connecting layer is connected between the first impact-resistant layer and the second impact-resistant layer.

6. The laminated structure according to any one of claims 1 to 5, characterized in that: The material of the first impact-resistant layer includes ultra-thin flexible glass or high entropy glass.

7. The laminated structure according to any one of claims 1 to 6, characterized in that: The material of the first connection layer includes energy-absorbing and impact-resistant material.

8. The laminated structure according to any one of claims 1 to 7, characterized in that: The material of the protection layer includes polyethylene terephthalate, transparent polyimide or glass fiber.

9. The laminated structure according to any one of claims 5 to 8, characterized in that: The material of the second connection layer includes a polymer material or an energy-absorbing and impact-resistant material, and the second connection layer is bonded to the first impact-resistant layer and the second impact-resistant layer respectively.

10. The laminated structure according to any one of claims 5 to 9, characterized in that: The material of the second connection layer includes an adhesive material, and the second connection layer is bonded to the first impact-resistant layer and the second impact-resistant layer respectively.

11. The laminated structure according to any one of claims 1 to 10, characterized in that: A surface of the first impact-resistant layer facing the protective layer and / or a surface facing away from the protective layer is provided with grooves.

12. The laminated structure according to any one of claims 1 to 11, characterized in that: The size of the first impact-resistant layer at its thinnest position is less than or equal to 50 um.

13. The laminated structure according to any one of claims 1 to 12, characterized in that: The thickness of the laminated structure is less than or equal to 600 um.

14. The laminated structure according to any one of claims 1 to 13, characterized in that: The side surface of the stacked structure is perpendicular to the protection layer.

15. A laminated structure, characterized in that: The laminated structure is arranged on a display screen, and the laminated structure comprises: Protective layer; a first connecting layer, bonded between the protective layer and the first impact-resistant layer; a first impact-resistant layer, located on one side of the protective layer; the elastic modulus of the first impact-resistant layer is smaller than the elastic modulus of the protective layer, the hardness of the first impact-resistant layer is greater than the hardness of the protective layer, and / or the stiffness of the first impact-resistant layer is greater than the stiffness of the protective layer; A second impact-resistant layer, located on a side of the first impact-resistant layer away from the protective layer; The second connecting layer is bonded between the first impact-resistant layer and the second impact-resistant layer.

16. A display module, characterized in that: The display module comprises: a display screen and a laminated structure, wherein the laminated structure comprises the laminated structure according to any one of claims 1 to 15, and the laminated structure is arranged on the display screen.

17. The display module according to claim 16, characterized in that: The display module also includes a first adhesive layer, a flat layer, a second adhesive layer and a bamboo book which are sequentially arranged on the backlight surface of the display screen; the flat layer is connected to the display screen through the first adhesive layer, and the bamboo book is connected to the flat layer through the second adhesive layer.

18. The display module according to claim 17, characterized in that: The elastic modulus of the bamboo book is greater than or equal to 10 GPa.

19. The display module according to claim 17 or 18, characterized in that: The bamboo book comprises a first part and a second part, wherein the second parts are respectively arranged on two opposite sides of the first part, and the elastic modulus of the first part is smaller than that of the second part.

20. The display module according to any one of claims 17 to 19, characterized in that: The materials of the bamboo book include carbon fiber, graphite fiber, asphalt-based, high entropy alloy, stainless steel, titanium alloy, asphalt-based and metal composite materials, and carbon fiber and metal composite materials.

21. The display module according to any one of claims 17 to 20, characterized in that: The projection of the stacked structure on the flat layer covers the projection of the display screen on the flat layer.

22. The display module according to any one of claims 16 to 21, characterized in that: The display module further includes a third adhesive layer, and two sides of the third adhesive layer are respectively connected to the stacked structure and the display screen.

23. The display module according to any one of claims 16 to 22, characterized in that: The display screen includes a first plane portion, a bending portion, and a second plane portion, wherein the bending portion is connected between the first plane portion and the second plane portion, the first plane portion is connected to the stacked structure, and the second plane portion is located on the backlight side of the first plane portion; The display module further includes a module adhesive layer, the module adhesive layer covers the bending portion, and the thickness of the module adhesive layer is 50um-90um.

24. An electronic device, characterized in that: The electronic device comprises a display module and a middle frame, wherein the display module is arranged on the middle frame; the display module comprises the display module according to any one of claims 16-23.

25. The electronic device according to claim 24, characterized in that: The electronic device further comprises a frame, which is located at the periphery of the display module and extends above the laminated structure to overlap with the laminated structure.

26. The electronic device according to claim 25, characterized in that: The width of the projection of the frame on the plane where the display module is located is less than or equal to 0.5 mm.

27. The electronic device according to any one of claims 24 to 26, characterized in that: The side surface of the display module is arranged adjacent to the middle frame.

28. The electronic device according to any one of claims 24 to 27, characterized in that: The electronic device further comprises a back cover, the back cover comprises a first shell, a second shell and a hinge mechanism, the first shell and the second shell are arranged on both sides of the hinge mechanism; The first shell and the second shell move toward or away from each other through the rotating shaft mechanism, so that the display module is switched between a flat state and a closed state.

29. A method for preparing an impact-resistant layer, characterized in that: include: Provide original glass sheets; Placing the original glass sheet in a hot casting fixture with protrusions on the inner surface for hot casting to form a glass sheet with grooves on the surface; The glass sheet is trimmed to a target size to form an impact-resistant layer; the upper surface and / or the lower surface of the impact-resistant layer has grooves.

30. The preparation method according to claim 29, characterized in that: Before or after trimming the glass sheet to a target size, the preparation method further includes polishing the glass sheet.

31. The preparation method according to claim 29 or 30, characterized in that: Trimming the glass sheet to a target size comprises: Using laser or CNC machine tool processing to trim the length and width of the glass sheet; and / or, The thickness of the glass sheet is trimmed by an etching process.

32. The preparation method according to any one of claims 29 to 31, characterized in that: The temperature of the hot casting is 600°C-1000°C.

33. An impact-resistant layer, characterized in that: The impact-resistant layer is applied to an electronic device including a display screen; the impact-resistant layer has a first surface and a second surface opposite to each other, and the first surface and / or the second surface has a groove.

34. The impact resistant layer according to claim 33, characterized in that The material of the impact-resistant layer includes ultra-thin flexible glass or high entropy glass.

35. The impact resistant layer according to claim 33 or 34, characterized in that The dimension of the impact-resistant layer at the thinnest position is less than or equal to 50 um.

36. A hot casting fixture, characterized in that: include: A first component and a second component, wherein a surface of the first component facing the second component has a protrusion, and / or a surface of the second component facing the first component has a protrusion.

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