Mainboard liquid-cooling heat-dissipation device and data processing system

Abstract

The present disclosure relates to the technical field of servers. Disclosed are a mainboard liquid-cooling heat-dissipation device and a data processing system. The mainboard liquid-cooling heat-dissipation device comprises: a base mechanism adapted to be fixed on a substrate, a flow channel for a liquid-cooling medium being provided in the base mechanism; and at least one pair of heat-dissipation mechanisms rotatably connected to the base mechanism by means of rotating mechanisms, wherein the rotating mechanisms are each of a hollow structure, such that the heat-dissipation mechanisms, the rotating mechanisms and the base mechanism form a liquid-cooling loop.

Description

Motherboard liquid cooling device and data processing system

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority and benefits of the Chinese patent application filed with the China Patent Office on December 20, 2023, with application number 202311757505.8, and invention name “Motherboard liquid cooling device and data processing system”, all contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the technical field of servers, and in particular to a motherboard liquid cooling device and a data processing system. Background Art

[0004] As server computing power increases, the power consumption of server processors is also increasing, generating more and more heat, causing the internal temperature of the server to continue to rise. To dissipate heat from the processors and ensure normal operation, the processors are typically equipped with liquid cooling devices, which dissipate heat using a closed liquid circuit.

[0005] However, to ensure that the liquid cooling device effectively dissipates heat from the processor, it is typically removably mounted above the processor. During processor maintenance, technicians must manually remove the liquid cooling device. After maintenance is complete, technicians must manually reinstall the liquid cooling device above the processor.

[0006] Therefore, during the maintenance process, the operation process is too complicated and inconvenient for technicians to operate, resulting in low work efficiency.

[0007] Summary of the Invention

[0008] In a first aspect, the present disclosure provides a motherboard liquid cooling and heat dissipation device, the motherboard liquid cooling and heat dissipation device comprising:

[0009] A base structure, adapted to be fixed on a substrate; a flow channel for a liquid cooling medium is provided in the base structure;

[0010] At least one pair of heat dissipation mechanisms rotatably connected to the base mechanism via a rotating mechanism, wherein the rotating mechanism is a hollow structure, so that the heat dissipation mechanism, the rotating mechanism and the base mechanism form a liquid cooling circuit;

[0011] The rotating mechanism includes a connecting pipe and a rotating sleeve; the connecting pipe is connected to the heat dissipation mechanism; one end of the rotating sleeve is connected to the connecting pipe, and the other end of the rotating sleeve is connected to the base mechanism in a rotating manner, and the rotating sleeve and the base mechanism are in a rotating seal;

[0012] The heat dissipation mechanism, the base mechanism and the substrate surround and form a space for accommodating the device to be dissipated heat.

[0013] In some embodiments, the heat dissipation mechanism and the base mechanism are placed vertically in the same plane.

[0014] In some embodiments, the heat dissipation mechanism and the base mechanism are placed in parallel in the same plane.

[0015] In some embodiments,

[0016] The heat dissipation mechanism is provided with a first water outlet and a first water inlet;

[0017] The base mechanism is provided with a second water outlet and a second water inlet;

[0018] A connecting pipe is connected to the first water outlet or the first water inlet;

[0019] One end of the rotating sleeve is connected to the connecting pipe, and the other end of the rotating sleeve is rotatably connected to the second water outlet or the second water inlet of the base mechanism;

[0020] When the rotating sleeve and the second water outlet rotate relative to each other, a sealed state is maintained; and when the rotating sleeve and the second water inlet rotate relative to each other, a sealed state is maintained.

[0021] In some embodiments, the connecting pipe is threadedly connected to the first water outlet or the first water inlet, and a waterproof member is provided between the connecting pipe and the first water outlet and between the connecting pipe and the first water inlet.

[0022] In some embodiments, the rotating sleeve comprises:

[0023] The sleeve body has a cylindrical structure; the first end of the sleeve body is suitable for docking with the connecting pipe, and the second end of the sleeve body is suitable for sleeved on the second water outlet or the second water inlet of the base mechanism; the sleeve body and the second water outlet or the second water inlet of the base mechanism are rotatably sealed;

[0024] The inner stud is covered with a waterproof component, which extends into the sleeve body and then passes through the first port, so that the waterproof component is located between the inner stud and the first port; the part of the inner stud that passes through is threadedly connected to the connecting pipe; the inner stud has a hollow structure.

[0025] In some embodiments, the waterproof member is a waterproof gasket.

[0026] In some embodiments, the base mechanism comprises:

[0027] a liquid-cooled base adapted to be fixed to a base plate;

[0028] A liquid cooling main pipe is arranged on the liquid cooling base; a flow channel for a liquid cooling medium is arranged in the liquid cooling main pipe; and the heat dissipation mechanism is movably connected to the liquid cooling main pipe.

[0029] In some embodiments, the base mechanism further comprises:

[0030] A support seat is provided on the substrate;

[0031] When the heat dissipation mechanism is in the heat dissipation position, the heat dissipation mechanism abuts against the support seat.

[0032] In some embodiments, the base mechanism further comprises:

[0033] A spring-up member, arranged on the support seat;

[0034] When the pair of heat dissipation mechanisms are close to each other and in the heat dissipation position, the heat dissipation mechanisms abut against the spring-up member, causing the spring-up member to be in a compressed state;

[0035] Under the elastic action of the pop-up member, the heat dissipation mechanism is popped up from the heat dissipation position. Under the action of external force, the pair of heat dissipation mechanisms are separated from each other and are in the maintenance position.

[0036] In some embodiments, the heat dissipation mechanism includes:

[0037] a radiator movably connected to the base mechanism;

[0038] A positioning assembly is provided on the radiator;

[0039] When the pair of heat dissipation mechanisms are in the heat dissipation position, the positioning assembly has a first position for locking the pair of heat dissipation mechanisms with each other, and a second position for separating the pair of heat dissipation mechanisms from each other;

[0040] When the positioning assembly is at the second position, the heat dissipation mechanism is elastically activated by the pop-up member to pop up from the heat dissipation position.

[0041] In some embodiments, the positioning assembly includes:

[0042] a positioning pin, disposed on one of the pair of heat dissipation mechanisms;

[0043] a positioning hole, provided on the other of the pair of heat dissipation mechanisms;

[0044] When the pair of heat dissipation mechanisms are in the heat dissipation position, the positioning pins are adapted to be inserted into the positioning holes to lock the pair of heat dissipation mechanisms with each other; and the positioning pins are adapted to be pulled outward from the positioning holes to separate the pair of heat dissipation mechanisms from each other.

[0045] In some embodiments, the heat dissipation mechanism further comprises:

[0046] A handle is detachably arranged on the radiator; the positioning hole is opened on the handle.

[0047] In some embodiments, the handle is provided with a fixing buckle, and the heat sink is provided with a fixing slot suitable for the fixing buckle to be embedded.

[0048] In some embodiments, the motherboard liquid cooling device further includes:

[0049] a first foam disposed on the heat sink; when the heat sink is in the heat dissipation position, the first foam abuts against the device to be cooled, so that a gap exists between the heat sink and the device to be cooled;

[0050] The second foam is arranged on the radiator; when the radiator is in the maintenance position, the second foam abuts against the substrate.

[0051] In some embodiments, the motherboard liquid cooling device further includes:

[0052] A water pump assembly is arranged on the liquid cooling base; the water pump assembly is connected to the liquid cooling main pipe.

[0053] In some embodiments, the water pump assembly comprises:

[0054] a water pump, disposed on the liquid cooling base, the water pump being connected to the liquid cooling main pipe;

[0055] A fixing plate covers the water pump and is connected to the liquid cooling base.

[0056] In some embodiments, the water pump assembly further comprises:

[0057] A temperature sensor is provided on the radiator; the temperature sensor is in communication with the water pump; the temperature sensor is used to detect the current temperature of the radiator, and the water pump regulates the flow rate of the liquid cooling medium based on the current temperature.

[0058] In some embodiments, when the heat dissipation mechanism and the base mechanism are placed in parallel in the same plane, a protrusion is provided on the handle of one heat dissipation mechanism, and a groove suitable for inserting the protrusion is provided on the handle of the other heat dissipation mechanism;

[0059] When a pair of heat dissipation mechanisms are stacked on each other, the protrusion on the handle of one heat dissipation mechanism is inserted into the groove on the handle of the other heat dissipation mechanism, so that the pair of heat dissipation mechanisms are kept in the maintenance position.

[0060] In a second aspect, the present disclosure also provides a data processing system, which includes: a device to be cooled, and a motherboard liquid cooling device as described in any of the above embodiments, wherein the device to be cooled is arranged in the space surrounded by the cooling mechanism, the base mechanism and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] In order to more clearly illustrate the specific embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0062] FIG1 is a schematic diagram of the overall structure of a liquid cooling device for a motherboard according to an embodiment of the present disclosure;

[0063] FIG2 is an exploded view of the liquid cooling device for the motherboard shown in FIG1 ;

[0064] FIG3 is a schematic diagram of the liquid cooling device for the motherboard shown in FIG1 , which is provided with a cooling fan;

[0065] FIG4 is a side view of the liquid cooling device for the motherboard shown in FIG1 , with the heat dissipation mechanism in the heat dissipation position;

[0066] FIG5 is a side view of the liquid cooling device for the motherboard shown in FIG1 , with the heat dissipation mechanism in a maintenance position;

[0067] FIG6 is a schematic diagram of the liquid cooling device for the motherboard shown in FIG1 , with only one of a pair of heat dissipation mechanisms being open;

[0068] FIG7 is a schematic diagram of the liquid cooling device for the motherboard shown in FIG1 , with both heat dissipation mechanisms open;

[0069] FIG8 is an exploded schematic diagram of a heat dissipation mechanism according to an embodiment of the present disclosure;

[0070] FIG9 is a schematic diagram of the assembly of the heat dissipation mechanism and the base mechanism according to an embodiment of the present disclosure;

[0071] FIG10 is a schematic diagram of the assembly of the water pump assembly and the base mechanism according to an embodiment of the present disclosure;

[0072] FIG11 is a schematic diagram of another arrangement of the heat dissipation mechanism and the base mechanism according to an embodiment of the present disclosure;

[0073] FIG12 is another schematic diagram of FIG11 , in which only one of the pair of heat dissipation mechanisms is opened;

[0074] FIG13 is another schematic diagram of FIG11 , with both heat dissipation mechanisms open;

[0075] FIG14 is a schematic diagram of the cooperation of the two handles in FIG11 . DETAILED DESCRIPTION

[0076] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present disclosure.

[0077] In the description of this disclosure, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this disclosure and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this disclosure. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0078] In the description of this disclosure, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components; and wireless or wired connections. A person skilled in the art will understand the specific meanings of the above terms in this disclosure based on the specific circumstances.

[0079] In addition, the technical features involved in different embodiments of the present disclosure described below can be combined with each other as long as they do not conflict with each other.

[0080] In view of this, the present disclosure provides a motherboard liquid cooling device and a data processing system to solve the problem of overly complicated operation procedures during maintenance.

[0081] The following describes embodiments of the present disclosure in conjunction with FIG. 1 to FIG. 14 .

[0082] According to an embodiment of the present disclosure, on one hand, a motherboard liquid cooling heat dissipation device is provided, which includes a base mechanism 1 and a heat dissipation mechanism 3 .

[0083] Specifically, in the embodiment of the present disclosure, as shown in FIG1 , the base mechanism 1 is fixed to the base plate 2. The base can be connected by welding, screw connection, or fixing by snap fasteners. Of course, this embodiment is merely an example of the connection method of the base, but it is not limited to this. Those skilled in the art can make changes according to actual conditions as long as the same technical effect is achieved.

[0084] Furthermore, the base structure 1 is provided with a flow channel for the liquid cooling medium. In other words, the base structure 1 is pre-configured as a hollow structure, and this hollow structure is used as the flow channel for the liquid cooling medium in the liquid cooling heat dissipation. Alternatively, the liquid cooling pipelines can be laid out first and then centrally installed within the hollow structure. This allows for a simpler piping layout and facilitates maintenance operations for technicians.

[0085] Furthermore, in the embodiment of the present disclosure, the heat dissipation mechanisms 3 are arranged in pairs. The number of heat dissipation mechanisms 3 can be one, two, three, etc. Of course, this embodiment is merely an example of the number of pairs of heat dissipation mechanisms 3, but is not intended to be limiting. Those skilled in the art can make changes based on actual conditions as long as the same technical effect is achieved.

[0086] Furthermore, the heat dissipation mechanism 3 is movably connected to the base mechanism 1, and the heat dissipation mechanism 3 is in communication with the base mechanism 1. For example, the heat dissipation mechanism 3 can be connected to the base mechanism 1 via a connecting pipe, and the connecting pipe and the heat dissipation mechanism 3, and the connecting pipe and the base mechanism 1, can be sealed by a dynamic sealing structure. In this way, it is possible to maintain a state of communication while being movably connected. Of course, the connecting pipe can also be made of a soft material, as long as the interfaces between the connecting pipe and the heat dissipation mechanism 3, and between the connecting pipe and the base mechanism 1, are sealed.

[0087] This embodiment is merely an example of the connection method between the heat dissipation mechanism 3 and the base mechanism 1, but does not limit it. Those skilled in the art can make changes according to actual conditions as long as the same technical effect can be achieved.

[0088] Regarding the connection method between the heat dissipation mechanism 3 and the base mechanism 1, the heat dissipation mechanism 3 can be rotatably connected to the base mechanism 1 via a rotating mechanism 7. The rotating mechanism 7 has a hollow structure, so that the heat dissipation mechanism 3, the rotating mechanism 7, and the base mechanism 1 form a liquid cooling circuit. The rotating mechanism 7 can be a bellows, a flexible connecting tube 71, or a pipeline that can achieve a rotary seal. Of course, this embodiment is merely an example of the type of rotating mechanism 7, but it is not limited to this. Those skilled in the art can make changes according to actual circumstances, as long as they can achieve the same technical effect.

[0089] The rotating mechanism 7 can act as a bearing, allowing the heat dissipation mechanism 3 to rotate smoothly with the base mechanism 1. At the same time, the rotating mechanism 7 can also act as a pipeline, allowing the liquid cooling circuit to be connected directly through the hollow structure in the rotating mechanism 7, without the need for additional liquid cooling pipelines. This can simplify the overall structure of the heat dissipation mechanism 3 and facilitate installation and maintenance by technicians. Furthermore, a rotating assembly can be provided on each side of the base mechanism 1, so that the heat dissipation mechanism 3 can be firmly confined within the base mechanism 1 through the rotating assemblies on both sides, preventing the heat dissipation mechanism 3 from detaching from the base mechanism 1 during rotation, thus playing a certain limiting role and ensuring the normal operation of the device.

[0090] In some embodiments, the rotating mechanism 7 includes a connecting tube 71 and a rotating sleeve 72. Specifically, the connecting tube 71 is connected to the heat dissipation mechanism 3, one end of the rotating sleeve 72 is connected to the connecting tube 71, and the other end of the rotating sleeve 72 is rotationally connected to the base mechanism 1. The rotating sleeve 72 and the base mechanism 1 are in a rotational seal, that is, a dynamic sealing structure is used to ensure that the liquid cooling medium does not leak out during the rotation process, so that the device as a whole can operate normally.

[0091] In some embodiments, as shown in Figure 1 , the heat dissipation mechanism 3, the base mechanism 1, and the substrate 2 enclose a space to accommodate the device 6 to be dissipated. The heat dissipation mechanism 3 dissipates heat from the device 6 to be dissipated. Specifically, the base mechanism 1 is fixed to the substrate 2, and the heat dissipation mechanism 3 can cover the base mechanism 1. In this way, the base mechanism 1 is on the side, the substrate 2 is at the bottom, and the heat dissipation mechanism 3 is at the top, thereby enclosing a space. The device 6 to be dissipated can be placed within this space, maximizing its proximity to the heat dissipation mechanism 3 and maximizing the heat dissipation effect of the heat dissipation mechanism 3.

[0092] In some embodiments, in actual operation, when maintenance is desired on the heat dissipation mechanism 3, the heat dissipation mechanism 3 is rotated under the action of an external force, causing the heat dissipation mechanism to rotate relative to the base mechanism 1, so that the heat dissipation mechanism 3 slowly rotates from a position covering the device 6 to be dissipated. Simultaneously, in conjunction with the rotation mechanism 7, the heat dissipation mechanism 3 eventually rotates to a position exposing the device 6 to be dissipated. Similarly, when maintenance on the heat dissipation mechanism 3 is completed, the heat dissipation mechanism 3 can be rotated, causing the heat dissipation mechanism to rotate relative to the base mechanism 1, so that the heat dissipation mechanism 3 slowly rotates from a position exposing the device 6 to be dissipated, and simultaneously in conjunction with the rotation mechanism 7, the heat dissipation mechanism 3 eventually rotates to a position covering the device 6 to be dissipated.

[0093] For the external force type, for example, a technician can personally operate the heat dissipation mechanism 3 to move, or can operate the heat dissipation mechanism 3 to move via a driving device. This embodiment is only an example of the source of the external force, but is not limited to this. Those skilled in the art can make changes according to actual conditions as long as the same technical effect can be achieved.

[0094] The embodiment of the present disclosure makes the heat dissipation mechanism 3 movable so that the heat dissipation mechanism 3 can expose and cover the device to be cooled 6 during the rotation process. Therefore, during the actual maintenance process, the technician does not need to disassemble the heat dissipation mechanism 3, but only needs to move the heat dissipation mechanism 3 from the heat dissipation position to the maintenance position, thereby directly exposing the device to be cooled 6. There is no need to disassemble the heat dissipation mechanism 3 to other positions, but only needs to rotate the heat dissipation mechanism 3 from the heat dissipation position to the maintenance position, so that the heat dissipation mechanism is within its own range of movement and does not occupy the position of other components, thereby saving space, and at the same time greatly reducing the operation process, making it easier for technicians to operate, and thus improving work efficiency.

[0095] In some embodiments, the heat dissipation mechanism 3 and the base mechanism 1 are arranged vertically in the same plane. As shown in Figure 7, the length of the base mechanism 1 is perpendicular to the length of the heat dissipation mechanism 3. Under the action of external forces, the pair of heat dissipation mechanisms 3 have a maintenance position in which they are separated from each other and expose the device 6 to be dissipated, and a heat dissipation position in which they are close together and cover the device 6 to be dissipated.

[0096] Specifically, the base mechanism 1 is provided with heat dissipation mechanisms 3 at both ends along its length. As shown in Figures 5 and 7 , when the two heat dissipation mechanisms 3 are in the maintenance position, they form an "I"-shaped structure with the base mechanism 1. As shown in Figures 1 and 4 , when the two heat dissipation mechanisms 3 are in the heat dissipation position, the two heat dissipation mechanisms 3 can completely cover the base mechanism 1, forming a stacked structure when viewed from the outside.

[0097] Furthermore, the embodiment of the present disclosure places the heat dissipation mechanism 3 and the base mechanism 1 vertically in the same plane. During maintenance, the heat dissipation mechanism 3 only needs to be opened from the side, without occupying the vertical space, thereby improving the overall space utilization of the device. Furthermore, opening the heat dissipation mechanism 3 from the side is significantly more convenient for technicians to operate than opening it from other directions. At the same time, the center of gravity of the device as a whole is low, and the heat dissipation mechanism 3 will not tip over in other directions, thereby ensuring that the device can be used stably.

[0098] Furthermore, in some embodiments, as shown in Figures 11 to 14, another placement form of the heat dissipation mechanism 3 and the base mechanism 1 is provided. If the space on both sides of the heat dissipation mechanism 3 is small and the above placement form cannot be opened normally, another placement form can be adopted, that is, the heat dissipation mechanism 3 and the base mechanism 1 are placed parallel in the same plane.

[0099] As shown in FIG13 , under the action of an external force, the pair of heat dissipation mechanisms 3 have a maintenance position in which they move away from the base mechanism 1 and expose the heat dissipation device 6 when stacked on top of each other, and a heat dissipation position in which they move toward the base mechanism 1 and cover the heat dissipation device 6 when the pair of heat dissipation mechanisms 3 return to their original positions.

[0100] Similarly, the heat dissipation mechanism 3 is rotatably connected to the base mechanism 1 via a rotating mechanism 7 , and the rotating mechanism 7 is a hollow structure, so that the heat dissipation mechanism 3 , the rotating mechanism 7 and the base mechanism 1 form a liquid cooling circuit.

[0101] The embodiment of the present disclosure places the heat dissipation mechanism 3 and the base mechanism 1 in parallel on the same plane. Therefore, during maintenance, the heat dissipation mechanism 3 only needs to be lifted up from both sides, without having to be opened from both sides or occupying horizontal space. This improves the overall space utilization of the device. Furthermore, lifting the heat dissipation mechanism 3 directly from both sides facilitates operation by technicians.

[0102] Furthermore, in some embodiments, the heat dissipation mechanism 3 is provided with a first water outlet and a first water inlet, and the base mechanism 1 is provided with a second water outlet and a second water inlet. As shown in Figure 2, specifically, the connecting pipe 71 is connected to the first water outlet or the first water inlet, one end of the rotating sleeve 72 is connected to the connecting pipe 71, and the other end of the rotating sleeve 72 is rotatably connected to the second water outlet or the second water inlet of the base mechanism 1. In other words, the connecting pipe 71 of the first rotating mechanism 7 is connected to the first water outlet, and after one end of the rotating sleeve 72 of the first rotating mechanism 7 is connected to the connecting pipe 71 of the first rotating mechanism 7, the other end of the rotating sleeve 72 of the first rotating mechanism 7 is connected to the second water inlet. The connecting pipe 71 of the second rotating mechanism 7 is connected to the first water inlet, and after one end of the rotating sleeve 72 of the second rotating mechanism 7 is connected to the connecting pipe 71 of the second rotating mechanism 7, the other end of the rotating sleeve 72 of the second rotating mechanism 7 is connected to the second water outlet.

[0103] In this way, the liquid cooling medium in the base mechanism 1 flows from the second water outlet into the first water inlet of the heat dissipation mechanism 3, and then flows from the first water outlet of the heat dissipation mechanism 3 into the second water inlet of the base mechanism 1, which can ensure that the heat dissipation mechanism 3 and the base mechanism 1 form a liquid cooling circuit, so that the heat dissipation mechanism 3 can operate normally.

[0104] Furthermore, the rotating sleeve 72 and the second water outlet maintain a sealed state when they rotate relative to each other, and the rotating sleeve 72 and the second water inlet maintain a sealed state when they rotate relative to each other. A dynamic sealing structure can be provided between the rotating sleeve 72 and the second water outlet, and between the rotating sleeve 72 and the second water inlet.

[0105] The embodiment of the present disclosure provides a rotating sleeve 72, which can not only guide the liquid cooling medium but also act as a rotating bearing, thereby reducing the friction generated between the heat dissipation mechanism 3 and the liquid cooling mechanism during rotation, and ensuring that technicians can use them smoothly during maintenance. At the same time, reducing friction can also reduce the wear of the heat dissipation mechanism 3 and the liquid cooling mechanism during use, thereby extending the service life of both. Furthermore, through a dynamic sealing structure, such as a rotary seal, it can be ensured that the liquid cooling medium will not leak outward during rotation, so that the entire device can operate normally.

[0106] Furthermore, in some embodiments, the connecting pipe 71 is threadedly connected to the first water outlet or the first water inlet, and a waterproof member 723 is provided between the connecting pipe 71 and the first water outlet, and between the connecting pipe 71 and the first water inlet. The waterproof member 723 may be a waterproof gasket or a waterproof adhesive. Of course, this embodiment merely illustrates the type of waterproof member 723 and does not limit it. Those skilled in the art may modify it according to actual circumstances, as long as the same technical effect is achieved.

[0107] By providing a waterproof member 723, the disclosed embodiment further ensures the tightness between the rotating assembly and the water inlet, based on the provision of a rotary seal. This prevents the liquid cooling medium from escaping from the gap between the connecting tube 71 and the base mechanism 1 during use, thereby preventing damage to the substrate 2 and the electronic components thereon, and improving the overall safety of the device. Furthermore, the waterproof member 723 can utilize a waterproof gasket, which provides a sealing effect while not occupying excessive internal space. When a motherboard liquid cooling device is provided within a server, this can, to a certain extent, improve the space utilization within the server.

[0108] Furthermore, in some embodiments, as shown in FIG2 , the rotating sleeve 72 includes a sleeve body 721 and an inner stud 722. Specifically, the sleeve body 721 is cylindrical in structure, with a first end of the sleeve body 721 adapted to engage with the connecting pipe 71, and a second end of the sleeve body 721 adapted to fit over the second water outlet or the second water inlet of the base mechanism 1. The sleeve body 721 forms a rotational seal with the second water outlet or the second water inlet of the base mechanism 1.

[0109] Furthermore, the inner stud 722 is sheathed with a waterproof member 723. After extending into the sleeve body 721, it protrudes from the first port, positioning the waterproof member 723 between the inner stud 722 and the first port. The protruding portion of the inner stud 722 is threadedly connected to the connecting tube 71. When the inner stud 722 is fully threaded onto the connecting tube 71, the waterproof member 723 is sandwiched between the edge of the inner stud 722's head and the inner edge of the first port. The edge of the head, the waterproof member 723, and the inner edge fit together, sealing the inner stud 722 and the connecting tube 71. The inner stud 722 is hollow, maintaining communication between the sleeve body 721 and the connecting tube 71.

[0110] The disclosed embodiment provides an inner stud 722, which allows the sleeve body 721 to be detachably connected to the connecting tube 71. During replacement and maintenance, the sleeve body 721 and the connecting tube 71 can be replaced and maintained separately according to their actual conditions, without having to directly replace the entire sleeve body or perform large-scale maintenance on the entire sleeve body. From the perspective of the material itself, this can save material usage to a certain extent. Furthermore, the inner stud 722 is configured as a hollow structure, which can not only play a fixing role, but also a diversion role. There is no need to provide a special thread on the sleeve body 721 to connect with the connecting tube 71, which prevents water leakage caused by the rotating sleeve 72 due to thread wear, thereby improving the overall sealing of the device.

[0111] Furthermore, in some embodiments, the waterproof component 723 is a waterproof gasket.

[0112] Furthermore, in some embodiments, the base mechanism 1 includes a liquid-cooling base 12 and a liquid-cooling manifold 11. Specifically, in the disclosed embodiment, as shown in FIG2 , the liquid-cooling base 12 is adapted to be fixed to the base plate 2. The liquid-cooling base 12 may be welded to the base plate 2, screwed to the base plate 2, or clipped to the base plate 2. Of course, this embodiment merely illustrates the type of waterproof member 723 and does not limit it. Those skilled in the art may modify it according to actual circumstances, as long as the same technical effect is achieved.

[0113] Furthermore, in the embodiment disclosed herein, the liquid cooling main pipe 11 is provided on the liquid cooling base 12, and a flow channel for the liquid cooling medium is provided in the liquid cooling main pipe 11, and the heat dissipation mechanism 3 is movably connected to the liquid cooling main pipe 11. The liquid cooling main pipe 11 is a square tube structure, and the flow channel inside the liquid cooling main pipe 11 is used for the circulation of the liquid cooling medium. As for the material of the liquid cooling main pipe 11, PVC material can be used, or aluminum alloy material with better heat dissipation can be used. Of course, this embodiment is only an example of the material of the liquid cooling main pipe 11, but it does not limit it. Those skilled in the art can make changes according to actual conditions, as long as they can achieve the same technical effect.

[0114] By providing a liquid cooling main pipe 11, the disclosed embodiment integrates the outlet and inlet pipes for the liquid cooling medium, eliminating the need for additional dedicated outlet and inlet pipes for liquid cooling, thereby saving significant planning costs. Furthermore, since the heat dissipation mechanism 3 is movably connected to the liquid cooling main pipe 11, the liquid cooling pipeline provides support for the heat dissipation mechanism 3, preventing the heat dissipation mechanism 3 from directly adhering to the heat dissipation device 6 at the heat dissipation position, thereby ensuring the normal operation of the heat dissipation device 6.

[0115] Furthermore, in some embodiments, as shown in Figures 2, 7, 9 and 10, the base mechanism 1 further includes a support seat 13, which is provided on the substrate 2. When the heat dissipation mechanism 3 is in the heat dissipation position, the heat dissipation mechanism 3 abuts against the support seat 13. In order to ensure that the heat dissipation mechanism 3 is subjected to uniform force, the support seats 13 can be arranged at equal intervals on both sides of the length direction of the liquid cooling main pipe 11. At the same time, a buffer member can be provided on the end face of the support seat 13 close to the heat dissipation mechanism 3, which can convert the rigid contact between the support seat 13 and the heat dissipation mechanism 3 into a flexible contact, thereby achieving a certain protection and buffering effect.

[0116] The embodiment of the present disclosure provides a support base 13. When the heat dissipation mechanism 3 is in the heat dissipation position, the support base 13 and the liquid cooling main pipe 11 can simultaneously support the heat dissipation mechanism 3, thereby reducing the pressure of the heat dissipation mechanism 3 on the liquid cooling main pipe 11. During long-term use, the degree of deformation of the liquid cooling main pipe 11 caused by pressure can be reduced, ensuring the normal operation of the entire device. At the same time, since the support base 13 is provided, the technician can directly determine the landing point of the heat dissipation mechanism 3 through the support base 13 during maintenance, so that the heat dissipation mechanism 3 can be directly moved, making it convenient for the technician to operate the heat dissipation mechanism 3.

[0117] Furthermore, in some embodiments, the base mechanism 1 further includes a pop-up member 14, which is disposed on the support base 13. When the pair of heat dissipation mechanisms 3 are close to each other and in the heat dissipation position, the heat dissipation mechanisms 3 abut against the pop-up member 14, causing the pop-up member 14 to be in a compressed state. When the pop-up member 14 transitions from the compressed state to the reset state, the elastic action of the pop-up member 14 causes the heat dissipation mechanism 3 to pop up from the heat dissipation position. Then, under the action of an external force, the pair of heat dissipation mechanisms 3 move away from each other and into the maintenance position.

[0118] The disclosed embodiment provides a pop-up member 14. When a technician wants to operate the heat dissipation mechanism 3 to perform maintenance on the heat dissipation device 6, he or she can directly operate the pop-up member 14 to cause the heat dissipation mechanism 3 to pop up from the heat dissipation position. This allows the technician to easily move the heat dissipation mechanism 3. The technician only needs to move the heat dissipation mechanism 3, without any other unnecessary unlocking actions. Furthermore, when maintenance is completed, the technician can move the heat dissipation mechanism 3 from the maintenance position to the heat dissipation position, causing the pop-up member 14 to return to its original position, thereby enabling the heat dissipation mechanism 3 to resume heat dissipation of the heat dissipation device 6. This simplifies the technician's operating steps and improves work efficiency to a certain extent.

[0119] Furthermore, in some embodiments, as shown in Figures 1 and 2, the heat dissipation mechanism 3 includes a heat sink 31 and a positioning assembly 32. Specifically, in the embodiment of the present disclosure, the heat sink 31 is movably connected to the base mechanism 1, and the positioning assembly 32 is disposed on the heat sink 31, and the positioning assembly 32 is movably connected to the heat sink 31.

[0120] During actual operation, when a pair of heat dissipation mechanisms 3 are in the heat dissipation position, the positioning assembly 32 has a first position for locking the pair of heat dissipation mechanisms 3 with each other, and a second position for separating the pair of heat dissipation mechanisms 3 from each other. When the positioning assembly 32 is in the first position, the heat dissipation mechanism 3 cannot change its position and is locked on the base mechanism 1. When the positioning assembly 32 is in the second position, since the heat dissipation mechanism 3 is not constrained by other mechanisms, the heat dissipation mechanism 3 can be moved from the heat dissipation position to the maintenance position. In addition, since a pop-up member 14 is also provided, when the heat dissipation mechanism 3 is locked on the base mechanism 1, the pop-up member 14 cannot pop the heat dissipation mechanism 3 from the heat dissipation position. When the positioning assembly 32 is in the second position, since the heat dissipation mechanism 3 can move flexibly, the heat dissipation mechanism 3 is popped up from the heat dissipation position under the elastic action of the pop-up member 14.

[0121] The embodiment of the present disclosure is provided with a positioning assembly 32. When maintenance is completed, the technician can move the heat dissipation mechanism 3 from the maintenance position to the heat dissipation position again, so that the pop-up member 14 returns to its original position, and use the positioning assembly 32 to fix the position of the pair of heat dissipation mechanisms 3, so that the heat dissipation mechanism 3 can dissipate heat from the heat dissipation device 6 again, simplifying the technician's operation steps and improving work efficiency to a certain extent. Furthermore, when the technician wants to operate the heat dissipation mechanism 3 to maintain the heat dissipation device 6, he can directly operate the positioning assembly 32 to separate the pair of heat dissipation mechanisms 3 from each other. Under the elastic force of the elastic member, the heat dissipation mechanism 3 can automatically pop up from the heat dissipation position, so that the technician can easily move the heat dissipation mechanism 3, and only needs to move the heat dissipation mechanism 3, without the need for other unnecessary unlocking actions.

[0122] 2 and 4 , the positioning assembly 32 includes a positioning pin 321 and a positioning hole 322. Specifically, in the disclosed embodiment, the positioning pin 321 is movably disposed on one of the pair of heat dissipation mechanisms 3, and the positioning hole 322 is disposed on the other of the pair of heat dissipation mechanisms 3.

[0123] During actual operation, when the pair of heat dissipation mechanisms 3 are in the heat dissipation position, the positioning pins 321 are adapted to be inserted into the positioning holes 322 to lock the pair of heat dissipation mechanisms 3 together. The positioning pins 321 are adapted to be pulled outward from the positioning holes 322 to separate the pair of heat dissipation mechanisms 3 from each other.

[0124] The embodiment of the present disclosure sets a positioning pin 321 and a positioning hole 322. When maintenance is completed, the technician can move the heat dissipation mechanism 3 from the maintenance position to the heat dissipation position again, so that the pop-up member 14 returns to its original position, and move the positioning pin 321 into the positioning hole 322 to fix the position of the pair of heat dissipation mechanisms 3, so that the heat dissipation mechanism 3 can dissipate heat for the heat dissipation device 6 again, simplifying the technician's operation steps and improving work efficiency to a certain extent. Furthermore, when the technician wants to operate the heat dissipation mechanism 3 to perform maintenance on the heat dissipation device 6, the positioning pin 321 can be directly moved from the positioning hole 322 to separate the pair of heat dissipation mechanisms 3 from each other. Under the elastic force of the elastic member, the heat dissipation mechanism 3 can automatically pop up from the heat dissipation position, so that the technician can easily move the heat dissipation mechanism 3, and only needs to move the heat dissipation mechanism 3, without the need for other unnecessary unlocking actions.

[0125] Furthermore, in some embodiments, the heat dissipation mechanism 3 further includes a handle 33 , which is detachably provided on the radiator 31 , and the positioning hole 322 is provided on the handle 33 .

[0126] The disclosed embodiment provides a handle 33 so that technicians can directly touch the handle 33 when operating the radiator 31, preventing burns caused by the high temperature of the radiator 31. Furthermore, the handle 33 facilitates operation by technicians, eliminating the need for additional operating tools, simplifying the technician's operating steps and improving work efficiency to a certain extent.

[0127] Furthermore, in some embodiments, as shown in FIG8 , the handle 33 is provided with a fixing clip 331, and the heat sink 31 is provided with a fixing slot 311 suitable for the fixing clip 331 to be inserted into. The handle 33 can be made of a metal with a certain degree of elasticity, with the fixing clips 331 provided on both sides of the bottom of the handle 33, and the fixing slots 311 provided on both sides of the bottom of the heat sink 31. In this way, when the handle 33 is moved downward and fully inserted into the bottom of the heat sink 31, the elasticity of the handle 33 causes the fixing clips 331 to completely insert into the fixing slots 311, thereby completing the assembly of the handle 33.

[0128] When removing the handle 33 , the fixing buckle 331 can be toggled in the reverse direction. After the fixing buckle 331 is completely separated from the fixing slot 311 , the handle 33 can be moved in the reverse direction to separate the handle 33 from the radiator 31 .

[0129] Furthermore, in some embodiments, as shown in Figures 4, 5, and 7, the motherboard liquid cooling device further includes a support member disposed on the radiator 31. The support member may include a support member disposed on the bottom surface of the radiator 31 facing the device 6 to be cooled, so as to provide a gap between the radiator 31 and the device 6 to be cooled when the radiator 31 is in the cooling position. The support member may also include another support member disposed on a side surface of the radiator 31, for example, so that when the radiator 31 is in the maintenance position, the other support member supports the radiator 31 to prevent damage to the rotating mechanism 7.

[0130] Specifically, the support member may include a first foam 5 and a second foam 4. The first foam 5 is disposed on the heat sink 31. When the heat sink 31 is in the heat dissipation position, the first foam 5 abuts against the component to be cooled 6, creating a gap between the heat sink 31 and the component to be cooled 6. The second foam 4 is disposed on the heat sink 31. When the heat sink 31 is in the maintenance position, the second foam 4 abuts against the substrate 2.

[0131] The disclosed embodiment utilizes a first foam pad 5 to create a gap between the heat sink 31 and the device to be cooled 6 when the heat sink 31 is in the heat dissipation position. This allows the airflow generated by the cooling fan 8 of the motherboard liquid cooling device to dissipate heat from the heat sink 31 to pass through the gap, thereby accelerating the heat dissipation rate of the device to be cooled 6 and improving the heat dissipation effect. Furthermore, the second foam pad 4 provides support for the heat sink 31 when it is in the maintenance position, preventing damage to the rotating mechanism 7 due to the excessive weight of the heat sink 31, thereby ensuring the normal operation of the entire device.

[0132] Furthermore, in the embodiment of the present disclosure, as shown in FIG3 , a cooling fan 8 is also provided, and the cooling fan 8 is used to provide additional air cooling to the radiator 31. In order to ensure the overall stability of the device, the cooling fan 8 and the base plate 2 can be further stabilized. The cooling fan 8 and the base plate 2 can be fixedly connected or detachably connected. For fixed connection, welding, bonding, and the like can be used. For detachable connection, it can be fixed by means of screws and screw holes, it can be fixed by means of snap-on slots, and it can also be fixed by means of magnetic attraction.

[0133] The following examples illustrate the detachable connection method. For example, additional fixing plates can be set around the edge of the substrate 2. Those skilled in the art can change the number of fixing plates according to actual conditions, to 1, 2, 3, 4, etc., and then open a screw hole on the fixing plate, and then open another screw hole on the cooling fan 8 at the position corresponding to the screw hole, and then pass the screw through the screw hole on the fixing plate and the screw hole on the cooling fan 8 in sequence to connect the substrate 2 to the cooling fan 8. Furthermore, when fixing with a clip and a slot, additional clips can be set around the edge of the substrate 2. Those skilled in the art can change the number of clips according to actual conditions, to 1, 2, 3, 4, etc., and then open a slot on the cooling fan 8 that can work with the clip at the position corresponding to the clip, and then directly embed the clip on the substrate 2 into the slot on the cooling fan 8, thereby connecting the substrate 2 to the cooling fan 8. When fixing by magnetic attraction, additional magnetic sheets can be arranged around the edge of the substrate 2. Technicians in this field can change the number of magnetic sheets according to actual conditions, 1, 2, 3, 4, etc., and then provide opposite-sex magnetic sheets that can be attracted to the magnetic sheets at positions corresponding to the magnetic sheets on the cooling fan 8. Then, the magnetic sheets on the substrate 2 are directly aligned with the opposite-sex magnetic sheets embedded in the cooling fan 8, thereby magnetically connecting the substrate 2 and the cooling fan 8.

[0134] Of course, this embodiment is only an example of a fixed connection method and a detachable connection method, but it does not limit this. Those skilled in the art can make changes according to actual conditions as long as they can achieve the same technical effect.

[0135] Furthermore, in some embodiments, the testing device further includes a temperature detection component and an air guide component. The temperature detection component is used to detect the overall temperature distribution of the heat dissipation mechanism 3, and the air guide component is disposed on the cooling fan 8. Specifically, the air guide component is capable of rotating independently, and the temperature detection component is communicatively connected to the air guide component. The temperature detection component is suitable for detecting the temperature of each detection area on the heat dissipation mechanism 3. The air guide component can rotate according to the temperature of each detection area, and the specific air guide direction is adjusted by rotation.

[0136] Specifically, when the actual temperature of a detection area is higher than a predetermined temperature, the temperature detection component controls the air guide component to rotate so that the heat dissipation airflow dissipates heat in the detection area.

[0137] In actual operation, it is necessary to first divide the heat dissipation mechanism 3 into areas, and establish a coordinate system with the center of the heat dissipation mechanism 3 as the origin, the length direction of the heat dissipation mechanism 3 as the vertical axis, and the width direction of the heat dissipation mechanism 3 as the horizontal axis. In this way, the temperature of each detection area on the heat dissipation mechanism 3 is detected by the temperature detection component. Because each detection area has its own coordinate interval, when the actual temperature of a detection area is higher than the predetermined temperature, it is necessary to first obtain the coordinate interval of the detection area, and then control the air guide component to rotate so that the heat dissipation airflow dissipates heat according to the specified range of the coordinate area until the temperature of the detection area is lower than the predetermined temperature again.

[0138] With such a configuration, the embodiment of the present disclosure sets a temperature detection component and an air guide component. When it is detected that the temperature of a certain area on the heat dissipation mechanism 3 is high, the air guide component can be controlled to rotate so that the heat dissipation airflow can accurately dissipate the heat in the detection area, thereby achieving full automation.

[0139] Furthermore, in some embodiments, the temperature detection component includes a control module and an infrared sensor that are communicatively connected to each other. A plurality of infrared sensors can be distributed in an array or set at a specific position. Specifically, in the embodiment of the present disclosure, after the coordinate system is established, the temperature of each detection area on the heat dissipation mechanism 3 is detected by an infrared sensor. Because each detection area has its own coordinate interval, when the actual temperature of a detection area is higher than the predetermined temperature, the control module needs to first obtain the coordinate interval of the detection area, and then the control module controls the cooling fan 8 to dissipate heat according to the specified range of the coordinate area until the temperature of the detection area is lower than the predetermined temperature again.

[0140] As a preferred embodiment, the temperature signal can also be processed into a temperature distribution map and one or more areas that need to be concentrated for heat dissipation can be selected. For example, if the temperature of area A is 80° and the temperature of other areas is lower than 40°, then area A is the area that needs to be concentrated for heat dissipation, and other areas are specific areas that need to be cooled later.

[0141] Furthermore, those skilled in the art may change the number of infrared sensors. This embodiment is merely an example and is not intended to be limiting. It only needs to achieve the same technical effect.

[0142] Furthermore, in some embodiments, as shown in FIG10 , the motherboard liquid cooling device further includes a water pump assembly 9 , which is disposed on the liquid cooling base 12 , and the water pump assembly 9 is connected to the liquid cooling main pipe 11 .

[0143] The control unit for the water pump assembly 9 can be mounted on the side wall of the server or integrated into the server's control panel, allowing it to be controlled by the server's control module. In practice, technicians can monitor the actual operating temperature of each heat dissipation component 6 on the server's baseboard 2 through the server's monitoring panel and adjust the water pump assembly 9 accordingly.

[0144] By providing the water pump assembly 9 in the disclosed embodiment, technicians can adjust the flow rate of the liquid cooling medium according to the actual operating temperature of the device to be cooled 6, thereby preventing the liquid cooling medium from being unable to dissipate heat from the device to be cooled 6 in a timely manner due to rapid changes in the temperature of the device to be cooled 6. After adjusting the flow rate of the liquid cooling medium, the water pump assembly 9 can drive the liquid cooling medium to dissipate heat from the device to be cooled 6 at the corresponding temperature, thereby ensuring the normal operation of the device to be cooled 6.

[0145] Furthermore, in some embodiments, as shown in FIG10 , the water pump assembly 9 includes a water pump 91 and a fixing plate 92. Specifically, in the disclosed embodiment, the water pump 91 is disposed on the liquid cooling base 12, and the water pump 91 is connected to the liquid cooling main pipe 11. The fixing plate 92 covers the water pump 91, and the fixing plate 92 is connected to the liquid cooling base 12. The fixing plate 92 can be made of a metal material with a certain plasticity, and the fixing plate 92 can also fix the water pump 91 in a variety of detachable ways, such as screw fixing, snap fixing, etc.

[0146] The disclosed embodiment provides a fixing plate 92 to detachably secure the water pump 91 to the liquid cooling base 12, making it easier for technicians to maintain and replace the water pump 91. Compared to other connection methods, this simplifies the installation and removal steps, thereby improving the technician's work efficiency.

[0147] Furthermore, in some embodiments, the water pump assembly 9 further includes a temperature sensor, which is disposed on the radiator 31 and is in communication with the water pump 91. The temperature sensor is used to detect the current temperature of the radiator 31, and the water pump 91 regulates the flow rate of the liquid cooling medium based on the current temperature.

[0148] The disclosed embodiment is provided with a temperature sensor. The temperature sensor can automatically control the water pump 91 to adjust the flow rate of the liquid cooling medium according to the actual operating temperature of the device to be cooled 6, so that the actual temperature of the device to be cooled 6 matches the actual flow rate of the liquid cooling medium. This can prevent the liquid cooling medium from being unable to dissipate heat from the device to be cooled 6 in a timely manner due to rapid changes in the temperature of the device to be cooled 6. After adjusting the flow rate of the liquid cooling medium, the water pump assembly 9 can drive the liquid cooling medium to dissipate heat from the device to be cooled 6 to the corresponding temperature, thereby ensuring the normal operation of the device to be cooled 6.

[0149] Furthermore, in some embodiments, as shown in FIG14 , when the heat dissipation mechanism 3 and the base mechanism 1 are placed parallel in the same plane, the handle 33 of one heat dissipation mechanism 3 is provided with a protrusion 332, and the handle 33 of the other heat dissipation mechanism 3 is provided with a groove 333 suitable for inserting the protrusion 332. When the pair of heat dissipation mechanisms 3 are stacked, the protrusion 332 on the handle 33 of one heat dissipation mechanism 3 inserts into the groove 333 on the handle 33 of the other heat dissipation mechanism 3, thereby maintaining the pair of heat dissipation mechanisms 3 in the maintenance position. To separate the two handles 33, simply pull them in opposite directions to disengage the protrusion 332 from the groove 333.

[0150] The embodiment of the present disclosure provides a protrusion 332 and a groove 333 on the handle 33. When the two radiators 31 are lifted up, the handles 33 of the two heat dissipation mechanisms 3 can be buckled together and fixed through the groove 333 and the protrusion 332 to prevent the two radiators 31 from rotating downward and falling, thereby facilitating memory maintenance and facilitating operation by technicians.

[0151] In the second aspect, the present disclosure also provides a data processing system, which includes: a device to be cooled 6, and a motherboard liquid cooling device as described in any of the above embodiments, wherein the device to be cooled 6 is arranged in the space surrounded by the heat dissipation mechanism 3, the base mechanism 1 and the substrate 2.

[0152] Although the embodiments of the present disclosure have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present disclosure, and such modifications and variations are all within the scope defined by the appended claims.

[0153] List of reference numerals:

[0154] 1. Base mechanism;

[0155] 11. Liquid cooling main pipe;

[0156] 12. Liquid cooling base;

[0157] 13. Support seat;

[0158] 14. Pop-up piece;

[0159] 2. Substrate;

[0160] 3. Heat dissipation mechanism;

[0161] 31. Radiator;

[0162] 311, fixed card slot;

[0163] 32. Positioning component;

[0164] 321, positioning pin;

[0165] 322, positioning hole;

[0166] 33. Handle;

[0167] 331, fixed buckle;

[0168] 332, bulge;

[0169] 333, groove;

[0170] 4. Second foam;

[0171] 5. First foam;

[0172] 6. Components to be cooled;

[0173] 7. Rotation mechanism;

[0174] 71. Connecting pipe;

[0175] 72. Rotating sleeve;

[0176] 721, sleeve body;

[0177] 722, internal stud;

[0178] 723, waterproof parts;

[0179] 8. Cooling fan;

[0180] 9. Water pump assembly;

[0181] 91. Water pump;

[0182] 92. Fixing piece.

Claims

1. A motherboard liquid cooling device, characterized in that: include: A base structure (1) is configured to be fixed on a base plate (2), wherein a flow channel for a liquid cooling medium is provided in the base structure (1); and At least one pair of heat dissipation mechanisms (3) which are rotatably connected to the base mechanism (1) via a rotating mechanism (7), wherein the rotating mechanism (7) is a hollow structure, so that the heat dissipation mechanism (3), the rotating mechanism (7) and the base mechanism (1) form a liquid cooling circuit; The rotating mechanism (7) comprises a connecting pipe (71) and a rotating sleeve (72), wherein the connecting pipe (71) is connected to the heat dissipation mechanism (3), one end of the rotating sleeve (72) is connected to the connecting pipe (71), and the other end of the rotating sleeve (72) is rotationally connected to the base mechanism (1), and a rotating seal is formed between the rotating sleeve (72) and the base mechanism (1); The heat dissipation mechanism (3), the base mechanism (1) and the substrate (2) surround and form a space for accommodating the device (6) to be dissipated.

2. The motherboard liquid cooling device according to claim 1, characterized in that: The heat dissipation mechanism (3) and the base mechanism (1) are placed vertically in the same plane.

3. The motherboard liquid cooling device according to claim 1, characterized in that: The heat dissipation mechanism (3) and the base mechanism (1) are placed in parallel in the same plane.

4. The motherboard liquid cooling device according to any one of claims 1 to 3, characterized in that: The heat dissipation mechanism (3) is provided with a first water outlet and a first water inlet; The base mechanism (1) is provided with a second water outlet and a second water inlet; The connecting pipe (71) is connected to the first water outlet or the first water inlet; One end of the rotating sleeve (72) is connected to the connecting pipe (71), and the other end of the rotating sleeve (72) is rotatably connected to the second water outlet or the second water inlet of the base mechanism (1); When the rotating sleeve (72) and the second water outlet rotate relative to each other, the rotating sleeve (72) and the second water outlet remain in a sealed state; and when the rotating sleeve (72) and the second water inlet rotate relative to each other, the rotating sleeve (72) and the second water inlet remain in a sealed state.

5. The motherboard liquid cooling device according to claim 4, characterized in that: The connecting pipe (71) is threadedly connected to the first water outlet or the first water inlet, and a waterproof component (723) is provided between the connecting pipe (71) and the first water outlet and between the connecting pipe (71) and the first water inlet.

6. The liquid cooling device for a motherboard according to claim 5, characterized in that: The rotating sleeve (72) comprises: The sleeve body (721) is a cylindrical structure, wherein a first port of the sleeve body (721) is suitable for docking with the connecting pipe (71), and a second port of the sleeve body (721) is suitable for sleeve-mounted on the second water outlet or the second water inlet of the base mechanism (1), and a rotation seal is formed between the sleeve body (721) and the second water outlet or the second water inlet of the base mechanism (1); and The inner stud (722) is sleeved with a waterproof component (723). The inner stud (722) extends into the sleeve body (721) and passes through the first port, so that the waterproof component (723) is located between the inner stud (722) and the first port. The portion of the inner stud (722) passing through the first port is threadedly connected to the connecting pipe (71).

7. The liquid cooling device for a motherboard according to claim 6, characterized in that: The waterproof component (723) is a waterproof gasket.

8. The liquid cooling device for a motherboard according to any one of claims 1 to 3, characterized in that: The base mechanism (1) comprises: A liquid cooling base (12) adapted to be fixed on the base plate (2); and A liquid cooling main pipe (11) is arranged on the liquid cooling base (12), wherein a flow channel for a liquid cooling medium is arranged in the liquid cooling main pipe (11), and the heat dissipation mechanism (3) is movably connected to the liquid cooling main pipe (11).

9. The liquid cooling device for a motherboard according to claim 8, characterized in that: The base mechanism (1) further comprises: A support seat (13) is arranged on the substrate (2); When the heat dissipation mechanism (3) is in the heat dissipation position, the heat dissipation mechanism (3) abuts against the support seat (13).

10. The liquid cooling device for a motherboard according to claim 9, characterized in that: The base mechanism (1) further comprises: A pop-up member (14) is arranged on the support seat (13); When a pair of the heat dissipation mechanisms (3) are close to each other and are in the heat dissipation position, the heat dissipation mechanism (3) abuts against the pop-up member (14), so that the pop-up member (14) is in a compressed state; Under the elastic action of the pop-up member (14), the heat dissipation mechanism (3) pops up from the heat dissipation position, and under the action of an external force, a pair of heat dissipation mechanisms (3) move away from each other and are in a maintenance position.

11. The liquid cooling device for a motherboard according to claim 10, characterized in that: The heat dissipation mechanism (3) comprises: a heat sink (31) movably connected to the base mechanism (1); and A positioning assembly (32) is arranged on the radiator (31); When the pair of heat dissipation mechanisms (3) are in the heat dissipation position, the positioning assembly (32) has a first position for locking the pair of heat dissipation mechanisms (3) with each other, and a second position for separating the pair of heat dissipation mechanisms (3) from each other; When the positioning assembly (32) is in the second position, the heat dissipation mechanism (3) is caused to pop up from the heat dissipation position under the elastic action of the pop-up member (14).

12. The liquid cooling device for a motherboard according to claim 11, characterized in that: The positioning assembly (32) comprises: A positioning pin (321) is arranged on one of the pair of heat dissipation mechanisms (3); and A positioning hole (322) is provided on the other one of the pair of heat dissipation mechanisms (3); Wherein, when the pair of heat dissipation mechanisms (3) are in the heat dissipation position, the positioning pin (321) is configured to be inserted into the positioning hole (322) to lock the pair of heat dissipation mechanisms (3) with each other; and the positioning pin (321) is configured to be removed from the positioning hole (322) to separate the pair of heat dissipation mechanisms (3) from each other.

13. The liquid cooling device for a motherboard according to claim 12, characterized in that: The heat dissipation mechanism (3) further comprises: a handle (33) detachably disposed on the radiator (31), wherein the positioning hole (322) is positioned on the handle (33); and The handle (33) is also provided with a fixing buckle (331), and the heat sink (31) is provided with a fixing slot (311) for the fixing buckle (331) to be embedded therein.

14. The liquid cooling device for a motherboard according to any one of claims 11 to 13, characterized in that: The mainboard liquid cooling device also includes a support member arranged on the radiator (31).

15. The liquid cooling device for a motherboard according to claim 14, characterized in that: The support member comprises: a first foam (5) arranged on the bottom surface of the heat sink (31), wherein when the heat sink (31) is in the heat dissipation position, the first foam (5) abuts against the device to be cooled (6), so that a gap exists between the heat sink (31) and the device to be cooled (6); and / or A second foam (4) is arranged on a side surface of the heat sink (31), wherein when the heat sink (31) is in the maintenance position, the second foam (4) abuts against the substrate (2).

16. The liquid cooling device for a motherboard according to any one of claims 9 to 14, characterized in that: The mainboard liquid cooling device also includes: A water pump assembly (9) is arranged on the liquid cooling base (12), wherein the water pump assembly (9) is connected to the liquid cooling main pipe (11).

17. The liquid cooling device for a motherboard according to claim 16, characterized in that: The water pump assembly (9) comprises: a water pump (91), arranged on the liquid cooling base (12), wherein the water pump (91) is connected to the liquid cooling main pipe (11); and A fixing plate (92) covers the water pump (91), wherein the fixing plate (92) is connected to the liquid cooling base (12).

18. The liquid cooling device for a motherboard according to claim 17, characterized in that: The water pump assembly (9) further comprises: A temperature sensor is arranged on the radiator (31), wherein the temperature sensor is communicatively connected with the water pump (91), the temperature sensor is used to detect the current temperature of the radiator (31), and the water pump (91) regulates the flow rate of the liquid cooling medium based on the current temperature.

19. The liquid cooling device for a motherboard according to claim 13 or 14, characterized in that: When the heat dissipation mechanism (3) and the base mechanism (1) are placed in parallel in the same plane, A protrusion (332) is provided on the handle (33) of one of the heat dissipation mechanisms (3), and a groove (333) for inserting the protrusion (332) is provided on the handle (33) of the other heat dissipation mechanism (3); When a pair of the heat dissipation mechanisms (3) are stacked on top of each other, the protrusion (332) on the handle (33) of one of the heat dissipation mechanisms (3) is inserted into the groove (333) on the handle (33) of the other heat dissipation mechanism (3), thereby keeping the pair of heat dissipation mechanisms (3) in the maintenance position.

20. A data processing system, characterized in that: include: A device to be cooled (6), and a mainboard liquid cooling device as claimed in any one of claims 1 to 19, wherein the device to be cooled (6) is arranged in a space surrounded by a cooling mechanism (3), a base mechanism (1) and the substrate (2).

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