Electronic control unit and vehicle

Abstract

The present invention relates to the technical field of vehicles, and specifically provides an electronic control unit and a vehicle, aiming to solve the problem that existing electronic control units have relatively poor heat dissipation effects. To achieve this objective, the electronic control unit of the present invention comprises a plurality of chips, an upper cover, a middle-layer carrier, a lower cover, and a cooling plate; the upper cover and the middle-layer carrier are connected to form a first accommodating space, and the lower cover and the middle-layer carrier are connected to form a second accommodating space; some of the plurality of chips are located in the first accommodating space, and the remaining chips are located in the second accommodating space; the cooling plate is arranged in the first accommodating space or the second accommodating space and is connected to the middle-layer carrier; and chips located in the same accommodating space as the cooling plate are connected to the cooling plate, chips located in a different accommodating space from the cooling plate are connected to the middle-layer carrier, and the middle-layer carrier can transfer heat. According to the present invention, the plurality of chips are arranged in different accommodating spaces, avoiding mutual thermal interference of the chips, and heat of all the chips is ultimately transferred to the cooling plate, achieving a good heat dissipation effect.

Description

Trip computer and vehicle

[0001] This application claims priority to Chinese patent application No. 202323491954.0, filed on December 19, 2023, with the invention name “On-board Computer and Vehicle”. The entire contents of the above-mentioned Chinese patent application are incorporated into this application by reference. Technical Field

[0002] The present invention relates to the technical field of vehicles, and in particular provides a driving computer and a vehicle. Background Art

[0003] A trip computer, also known as an onboard computer, is a comprehensive device that manages and controls the vehicle's electronic systems through internal programs, monitors the vehicle's operating status, sensor output and other data in real time, and calculates, processes and feeds back a series of vehicle operating indicators in real time. It is used to coordinate and control the operation of various electronic systems in the vehicle. It is the core of the vehicle management system and an important representative of automotive electronics.

[0004] With the continuous development of driving computers, more and more chips and electronic components are integrated into driving computers, and their workload has greatly increased. The heating problem is more serious. In order to prevent the driving computer from running slowly or causing failures due to heating and affecting driving safety, it must be subjected to heat dissipation treatment to ensure that the temperature of each component of the driving computer is maintained within a reasonable range.

[0005] The heat dissipation effect of the existing on-board computer is relatively poor, and a new on-board computer is needed in this field to solve the above technical problems.

[0006] Summary of the Invention

[0007] The present invention aims to solve the above technical problem, that is, to solve the problem that the existing on-board computer has a poor heat dissipation effect.

[0008] In a first aspect, the present invention provides a driving computer, comprising a plurality of chips, an upper cover, a middle carrier, a lower cover and a cooling plate.

[0009] The upper cover and the middle carrier are connected to form a first accommodating space, and the lower cover and the middle carrier are connected to form a second accommodating space.

[0010] Part of the plurality of chips is located in the first accommodation space, and another part of the plurality of chips is located in the second accommodation space.

[0011] The cooling plate is arranged in the first accommodating space or the second accommodating space and is connected to the middle carrier.

[0012] The chip in the same accommodation space as the cooling plate is connected to the cooling plate, and the chip in a different accommodation space from the cooling plate is connected to the middle carrier, and the middle carrier is configured to transfer heat.

[0013] In the preferred technical solution of the above-mentioned on-board computer, the cooling plate is arranged at the bottom of the second accommodating space, and the positions of the plurality of chips are higher than the position height of the cooling plate.

[0014] In the preferred technical solution of the above-mentioned on-board computer, the heat capacity of the chip arranged in the first accommodating space is greater than the heat capacity of the chip arranged in the second accommodating space.

[0015] In the preferred technical solution of the above-mentioned driving computer, the driving computer includes

[0016] An autonomous driving circuit board is disposed in the second accommodation space, and an autonomous driving chip is disposed on the autonomous driving circuit board, wherein the autonomous driving chip is bonded and connected to the cooling plate;

[0017] and / or

[0018] A smart antenna circuit board is arranged in the second accommodating space, and a smart antenna chip is arranged on the smart antenna circuit board. The smart antenna chip is attached to the cooling plate and connected.

[0019] In the preferred technical solution of the above-mentioned driving computer, the driving computer includes an automatic driving circuit board arranged above the cooling plate and an automatic driving chip arranged on the automatic driving circuit board, a smart antenna circuit board arranged above the cooling plate and a smart antenna chip arranged on the smart antenna circuit board;

[0020] The cross-sectional area of ​​the cooling plate is greater than or equal to the cross-sectional area of ​​the autonomous driving circuit board and the cross-sectional area of ​​the smart antenna circuit board.

[0021] In the preferred technical solution of the above-mentioned on-board computer, the on-board computer includes a mainboard, which is located in the first accommodating space and connected to the middle-layer carrier, and the chip is arranged on the mainboard.

[0022] In the preferred technical solution of the above-mentioned on-board computer, a plurality of communication ports are provided on the middle layer carrier, a plurality of external sockets are provided on the main board, and the communication ports are communicated with the external sockets.

[0023] In the preferred technical solution of the above-mentioned on-board computer, a dust-proof component is provided between the communication port and the external socket, and a hole is provided on the dust-proof component to connect the external socket and the communication port.

[0024] In the preferred technical solution of the above-mentioned on-board computer, an insulating member is provided between the upper cover and the main board.

[0025] In a second aspect, the present invention further provides a vehicle comprising an on-board computer according to any one of the above-mentioned preferred technical solutions.

[0026] When the above technical solution is adopted, the on-board computer of the present invention includes multiple chips, an upper cover, a middle carrier, a lower cover, and a cooling plate. The upper cover and the middle carrier are connected to form a first accommodating space, and the lower cover and the middle carrier are connected to form a second accommodating space. Some of the multiple chips are located in the first accommodating space, and another part of the multiple chips are located in the second accommodating space. The cooling plate is arranged in the first accommodating space or the second accommodating space and is connected to the middle carrier. The chips in the same accommodating space as the cooling plate are connected to the cooling plate, and the chips in different accommodating spaces from the cooling plate are connected to the middle carrier, and the middle carrier is configured to transfer heat. The present invention arranges multiple chips in different accommodating spaces to avoid mutual influence after the chips heat up, and ultimately transfers the heat of all chips to the cooling plate, resulting in a good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

[0028] FIG1 is a structural diagram of a vehicle-mounted computer according to the present invention;

[0029] FIG2 is an exploded view of the on-board computer of the present invention;

[0030] FIG3 is a schematic diagram of a portion of the structure of the on-board computer of the present invention;

[0031] Figure numerals: 10, shell; 101, upper cover; 102, middle carrier; 1021, connecting port; 103, lower cover; 11, first accommodating space; 12, second accommodating space; 13, cooling plate; 131, first port; 132, second port; 14, first circuit board; 15, second circuit board; 16, heat dissipation glue; 17, main board; 171, external socket; 18, dustproof component; 19, fixing bracket; 20, insulating part. DETAILED DESCRIPTION

[0032] Preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely intended to illustrate the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art may adjust these embodiments as needed to suit specific applications.

[0033] It should be noted that in the description of the present invention, terms such as "upper," "lower," "left," and "right" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. These terms are used solely for ease of description and are not intended to indicate or imply that the device or component described must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] Furthermore, it should be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "communicated" should be understood in a broad sense. For example, they may refer to fixed or detachable connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0035] First, refer to Figures 1 to 3. As shown in Figures 1 to 3, Figure 3 is only for illustration. The on-board computer of the present invention includes multiple chips (not shown in the figure), an upper cover 101, a middle carrier 102, a lower cover 103 and a cooling plate 13. The upper cover 101, the middle carrier 102 and the lower cover 103 are connected in sequence from top to bottom to form a shell 10. The upper cover 101 and the middle carrier 102 are connected to form a first accommodating space 11, and the lower cover 103 and the middle carrier 102 are connected to form a second accommodating space 12. Part of the multiple chips are located in the first accommodating space 11, and another part of the multiple chips are located in the second accommodating space 12. The cooling plate 13 is arranged in the first accommodating space 11 or the second accommodating space 12 and is connected to the middle carrier 102. The middle layer carrier 102 is connected, and the chip in the same accommodation space as the cooling plate 13 is connected to the cooling plate 13. The heat generated by the chip is directly absorbed by the cooling plate 13 to avoid the chip temperature being too high. The chip in a different accommodation space from the cooling plate 13 is connected to the middle layer carrier 102, and the middle layer carrier 102 is configured to transfer heat. The heat generated by the chip is transferred to the middle layer carrier 102, and the middle layer carrier 102 then transfers the heat to the cooling plate 13. The present invention arranges multiple chips in different accommodation spaces to avoid mutual influence after the chips are heated, and finally transfers the heat of all chips to the cooling plate, with good heat dissipation effect, avoiding the slow operation speed or malfunction of the on-board computer due to heat, affecting driving safety.

[0036] In a feasible embodiment, the cooling plate 13 is arranged in the first accommodating space 11, and the chip arranged in the first accommodating space 11 is tightly connected to the cooling plate 13 to transfer heat to the cooling plate 13, and the cooling plate 13 located in the first accommodating space 11 is connected to the middle layer carrier 102, and the chip arranged in the second accommodating space 12 is connected to the middle layer carrier 102 to transfer heat to the cooling plate 13 through the middle layer carrier 102.

[0037] In another feasible embodiment, the cooling plate 13 is arranged in the second accommodating space 12, and the chip arranged in the second accommodating space 12 is tightly connected to the cooling plate 13 to transfer heat to the cooling plate 13, and the cooling plate 13 located in the second accommodating space 12 is connected to the middle layer carrier 102, and the chip arranged in the first accommodating space 11 is connected to the middle layer carrier 102 to transfer heat to the cooling plate 13 through the middle layer carrier 102.

[0038] Continuing with Figures 2 and 3 , in this preferred embodiment, a cooling plate 13 is disposed at the bottom of the second accommodating space 12 , with the plurality of chips positioned at a higher height than the cooling plate 13 . Specifically, the cooling plate 13 is positioned closely against the lower cover 103 , with the lower surfaces of the chips within the second accommodating space 12 positioned at a higher height than the upper surface of the cooling plate 13 . Since condensation is generated on the cooling plate 13 during heat dissipation, this condensation is prevented from dripping onto the chips, thereby preventing malfunctions.

[0039] Furthermore, the heat capacity of the chip arranged in the first accommodating space 11 is greater than the heat capacity of the chip arranged in the second accommodating space 12. The amount of heat that needs to be absorbed or released when the temperature increases or decreases by 1 degree is the heat capacity. The heat capacity reflects the ability of a substance to store heat. Since the chip located in the first accommodating space 11 is far away from the cooling plate 13, it needs to transfer heat through the middle carrier 102. Its heat dissipation effect is less than that of the chip located in the second accommodating space 12. Therefore, the heat capacity of the chip in the first accommodating space is increased. Although the heat generated in the chip in the first accommodating space 11 is less absorbed, due to its large heat capacity, its temperature fluctuation is stable, avoiding a large temperature rise caused by a small amount of heat generated by the chip. Of course, this is not restrictive. It is also possible that all chips in the present invention adopt a larger heat capacity. The heat capacity of the chip can be increased by increasing the volume of the chip or using a material with a higher heat capacity to manufacture the chip, for example, ceramic or composite materials.

[0040] In addition, in this preferred embodiment, the on-board computer includes a first circuit board 14 and a second circuit board 15. The first circuit board 14 and the second circuit board 15 are both located in the second accommodating space 12. The chip arranged on the first circuit board 14 is located below the first circuit board 14 and is in direct contact and connection with the cooling plate 13 (not shown in the figure). The chip arranged on the second circuit board 15 is located below the second circuit board 15 and is in direct contact and connection with the cooling plate 13 (not shown in the figure). The heat generated by the chip is directly transferred to the cooling plate 13.

[0041] In another feasible embodiment, the chip arranged on the first circuit board 14 is located above the first circuit board 14, the first circuit board 14 is arranged above the cooling plate 13, and the heat generated by the chip is transferred to the cooling plate 13 through the first circuit board 14; the chip arranged on the second circuit board 15 is located above the second circuit board 15, the second circuit board 15 is arranged above the cooling plate 13, and the heat generated by the chip is transferred to the cooling plate 13 through the second circuit board 15. In the left and right cross-sectional directions, the cross-sectional area of ​​the cooling plate 13 is greater than or equal to the cross-sectional area of ​​the first circuit board 14 and the cross-sectional area of ​​the second circuit board 15. The larger the area of ​​the cooling plate 13, the more conducive it is to cooling.

[0042] The first circuit board 14 is preferably an autonomous driving circuit board, and the chip arranged on the first circuit board 14 is an autonomous driving chip, which is bonded to the cooling plate 13; the second circuit board 15 is an intelligent antenna circuit board, and the chip arranged on the second circuit board 15 is an intelligent antenna chip, which is bonded to the cooling plate 13.

[0043] In another feasible embodiment, only the first circuit board 14 and the autonomous driving chip arranged on the first circuit board 14 are included, or only the second circuit board 15 and the smart antenna chip arranged on the second circuit board are included.

[0044] Regardless of whether the chip is connected to the cooling plate 13 directly or through a circuit board, in the left and right cross-sectional directions, the cross-sectional area of ​​the cooling plate 13 is greater than or equal to the cross-sectional area of ​​the first circuit board 14 and the cross-sectional area of ​​the second circuit board 15, thereby ensuring the heat dissipation effect.

[0045] The autonomous driving chip is fixed to the first circuit board 14 via a fixing bracket 19 . The fixing bracket 19 and the first circuit board 14 are connected by screws (not shown in the figure) to improve the stability of the chip after being fixed.

[0046] Furthermore, in this preferred embodiment, the on-board computer includes a motherboard 17, which is located in the first accommodating space 11 and connected to the middle carrier 102. A chip is provided on the motherboard 17, preferably a smart cockpit chip. The heat generated by the chip is transferred to the middle carrier 102 through the motherboard 17, and is transferred to the cooling plate 13 through the middle carrier 102. The chip can be directly connected to the middle carrier 102. For example, the chip is located below the motherboard 17 and embedded in the middle carrier 102, directly transferring heat to the middle carrier 102. Alternatively, the chip is located above the motherboard 17, transferring heat to the middle carrier 102 through the motherboard 17. The motherboard 17 is also a circuit board.

[0047] Furthermore, the gap between the upper end of the outer periphery of the cooling plate 13 and the middle carrier 102 is filled with heat dissipation adhesive 16. Specifically, the gap between the upper end of the outer periphery of the cooling plate 13 and the upper inner wall of the middle carrier 102 in the second accommodating space 12 is filled with heat dissipation adhesive 16, and the heat of the middle carrier 102 is transferred to the cooling plate 13 through the heat dissipation adhesive 16.

[0048] It is understandable to those skilled in the art that the gap between the outer periphery of the cooling plate 13 and the middle layer carrier 102 can be completely filled with the heat dissipation glue 16, or the gap can be partially filled with the heat dissipation glue 16. Those skilled in the art can set it themselves according to actual conditions.

[0049] Although in this preferred embodiment, the middle carrier 102 and the cooling plate 13 are connected by the heat dissipation adhesive 16, this is not restrictive. Alternatively, the cooling plate 13 may be connected to the middle carrier 102 by having upwardly turned edges on all sides, or may be connected to the middle carrier 102 by having raised portions on all sides. Those skilled in the art may set this according to actual conditions.

[0050] The mainboard 17 is provided with a plurality of external sockets 171, and the middle carrier 102 is provided with a plurality of communication ports 1021. The external sockets 171 and the communication ports 1021 are connected. A dustproof member 18 is provided between the external sockets 171 and the communication ports 1021. The dustproof member 18 is used to block dust and prevent dust from entering the first accommodating space 11, providing dustproof, isolation, and protection functions. The dustproof member 18 is provided with holes, which are provided to connect the external sockets 171 and the communication ports 1021, thereby allowing the external sockets 171 to be connected to other plug terminals. The dustproof member 18 is a dustproof foam, which can be polyester foam, polyurethane foam, rubber foam, etc.

[0051] One communication port 1021 may correspond to one external socket 171 , or one communication port 1021 may correspond to multiple external sockets 171 .

[0052] It should be noted that the present invention does not impose any restrictions on the specific structure of the dustproof component 18. A dustproof component 18 can be provided with one hole or multiple holes. The shape of the hole can be set according to the requirements of the external socket 171, and technical personnel in this field can set it according to actual conditions.

[0053] Furthermore, an external socket (not shown in the figure) is also provided on the second circuit board 15 , and a communication port is provided on the corresponding middle carrier 102 , and a dustproof component 18 is also provided between the two to prevent dust from entering the second accommodating space 12 .

[0054] Furthermore, after the upper cover 101, the middle carrier 102 and the lower cover 103 are connected in place, if there is a gap so that the first accommodating space 11 or the second accommodating space 12 is connected to the outside world, foam is set in the gap to prevent dust from entering the interior of the on-board computer.

[0055] 2 , as shown in FIG2 , an insulating member 20 is provided between the upper cover 101 and the main board 17 . The insulating member 20 is plate-shaped or sheet-shaped and can isolate the main board 17 and the upper cover 101 to prevent electrical conduction between the main board 17 and the upper cover 101 .

[0056] A water flow channel (not shown) is provided within the cooling plate 13, and a water inlet and a water outlet are provided on the cooling plate 13, which are connected to the water flow channel. Specifically, the cooling plate 13 is provided with a first port 131 and a second port 132, one of which is a water inlet port, and the other of which is a water outlet port. The water inlet port is connected to a cooling water source. The cooling plate 13 can be hollow, that is, the entire interior of the cooling plate 13 is a water flow channel, or the cooling plate 13 can be provided with a continuous and curved water flow channel to form the water flow channel.

[0057] Furthermore, a plurality of protrusions are provided on the cooling plate 13 , and the plurality of protrusions are in contact with and fit against the chip disposed in the second accommodating space. Water flow channels are also provided in the protrusions to better dissipate heat from the chip.

[0058] The cooling plate 13 being a water-cooled plate is only a preferred configuration. Other flowable cooling media may also be introduced, or an electric cooling plate may be used. Those skilled in the art may set the configuration according to actual conditions.

[0059] The present invention does not impose any restrictions on the number and type of chips arranged in the first accommodating space 11 and the second accommodating space. They may include processor chips, sensor chips, communication chips, storage chips or power management chips, etc. As long as the chips can directly or ultimately transfer heat to the cooling plate 13, those skilled in the art can set them according to actual conditions.

[0060] In a second aspect, the present invention further claims protection for a vehicle comprising the on-board computer according to any one of the above embodiments.

[0061] The relevant user personal information that may be involved in the various embodiments of this application is strictly in accordance with the requirements of laws and regulations, following the principles of legality, legitimacy and necessity, and based on the reasonable purposes of business scenarios, to process the personal information that users actively provide during the use of products / services or generated due to the use of products / services, as well as the personal information obtained with the user's authorization.

[0062] The personal information processed by the Applicant will vary depending on the specific product / service scenario and will be based on the specific scenario in which the user uses the product / service. This may involve the user's account information, device information, driving information, vehicle information, or other related information. The Applicant will treat the user's personal information and its processing with a high degree of diligence.

[0063] The Applicant attaches great importance to the security of user personal information and has taken reasonable and feasible security measures that comply with industry standards to protect user information and prevent personal information from being accessed, disclosed, used, modified, damaged or lost without authorization.

[0064] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A driving computer, characterized in that: The driving computer comprises a plurality of chips, an upper cover, a middle carrier, a lower cover and a cooling plate. The upper cover and the middle carrier are connected to form a first accommodating space, and the lower cover and the middle carrier are connected to form a second accommodating space. Part of the plurality of chips is located in the first accommodation space, and another part of the plurality of chips is located in the second accommodation space, The cooling plate is arranged in the first accommodating space or the second accommodating space and connected to the middle layer carrier. The chip in the same accommodation space as the cooling plate is connected to the cooling plate, and the chip in a different accommodation space from the cooling plate is connected to the middle layer carrier, and the middle layer carrier is configured to transfer heat.

2. The driving computer according to claim 1, characterized in that: The cooling plate is disposed at the bottom of the second accommodating space, and the height of the plurality of chips is higher than the height of the cooling plate.

3. The driving computer according to claim 2, characterized in that: The heat capacity of the chip arranged in the first accommodation space is greater than the heat capacity of the chip arranged in the second accommodation space.

4. The driving computer according to claim 2, characterized in that: The on-board computer includes An autonomous driving circuit board is arranged in the second accommodation space, and an autonomous driving chip is arranged on the autonomous driving circuit board, wherein the autonomous driving chip is bonded and connected to the cooling plate; and / or The smart antenna circuit board is arranged in the second accommodation space, and the smart antenna chip is arranged on the smart antenna circuit board, and the smart antenna chip and the cooling plate are attached to each other. even.

5. The driving computer according to claim 2, characterized in that: The driving computer includes an automatic driving circuit board arranged above the cooling plate and an automatic driving chip arranged on the automatic driving circuit board, a smart antenna circuit board arranged above the cooling plate and a smart antenna chip arranged on the smart antenna circuit board; The cross-sectional area of ​​the cooling plate is greater than or equal to the cross-sectional area of ​​the autonomous driving circuit board and the cross-sectional area of ​​the smart antenna circuit board.

6. The driving computer according to claim 2, characterized in that: The on-board computer comprises a mainboard, which is located in the first accommodating space and connected to the middle-layer carrier, and the chip is arranged on the mainboard.

7. The driving computer according to claim 6, characterized in that: The middle layer carrier is provided with a plurality of communication ports, the main board is provided with a plurality of external connection sockets, and the communication ports are connected with the external connection sockets.

8. The driving computer according to claim 7, characterized in that: A dustproof component is arranged between the communication port and the external socket, and a hole is arranged on the dustproof component so that the external socket and the communication port are connected.

9. The driving computer according to claim 6, characterized in that: An insulating member is arranged between the upper cover and the main board.

10. A vehicle, characterized in that: The vehicle includes the on-board computer according to any one of claims 1 to 9.

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