Display module and display apparatus

Abstract

A display module, comprising a touch functional layer, a first flexible circuit board and a first support layer. The touch functional layer has a touch side and a non-touch side which are arranged opposite each other, and comprises a first binding portion, wherein the first binding portion is located on the non-touch side. The first flexible circuit board is provided with a second binding portion, a main body portion, and a bending portion arranged between the second binding portion and the main body portion, wherein the second binding portion is partially bound with the first binding portion, and the bending portion is bent towards the non-touch side, such that the main body portion is bent to the non-touch side. The first support layer is arranged on the side of the first flexible circuit board that is away from the touch functional layer, and the first support layer comprises a first support portion and a second support portion which are connected to each other, wherein the first support portion covers the second binding portion and extends to the bending portion, and in a first direction, at least part of the second support portion is located on the side of the first support portion that is away from the touch functional layer, and the bending stiffness of the second support portion is smaller than that of the first support portion.

Description

Display module and display device

[0001] This application claims priority to Chinese patent application No. 202311766983.5 filed on December 20, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0003] With the development of display technology, display devices (such as mobile phones, laptops, and tablets) are increasingly used in people's lives. Among them, organic light-emitting diode (OLED) displays have attracted widespread attention due to their advantages such as active illumination, wide viewing angle, high contrast, fast response, low power consumption, and ultra-thinness. Summary of the Invention

[0004] In one aspect, a display module is provided. The display module includes a touch-functional layer, a first flexible circuit board, and a first supporting layer. The touch-functional layer has a touch side and a non-touch side disposed opposite each other; the touch-functional layer includes a first binding portion; the first binding portion is located on the non-touch side. The first flexible circuit board includes a second binding portion, a main body portion, and a bending portion disposed between the second binding portion and the main body portion; the second binding portion is bound and connected to the first binding portion, and the bending portion bends toward the non-touch side to bend the main body portion toward the non-touch side. A first supporting layer is disposed on a side of the first flexible circuit board away from the touch-functional layer. The first supporting layer includes a first supporting portion and a second supporting portion connected to each other; the first supporting portion covers the second binding portion and extends to the bending portion; along a first direction, at least a portion of the second supporting portion is located on a side of the first supporting portion away from the touch-functional layer, and the bending stiffness of the second supporting portion is less than that of the first supporting portion.

[0005] In some embodiments, the second supporting portion includes a plurality of supporting bars; the plurality of supporting bars are arranged at intervals along a second direction; wherein the second direction intersects the first direction and is parallel to the touch function layer.

[0006] In some embodiments, the second supporting portion includes two supporting bars, and end surfaces of the two supporting bars that are away from each other are flush with the end surface of the first flexible circuit board.

[0007] In some embodiments, the second support portion includes a support bar; along the second direction, the maximum dimension of the support bar is smaller than the minimum dimension of the first support portion; wherein the second direction intersects the first direction and is parallel to the touch function layer.

[0008] In some embodiments, the second supporting portion is symmetrical about a first axis; the first axis extends along the first direction and passes through the center of the first flexible circuit board.

[0009] In some embodiments, along the second direction, a ratio of a size of the second supporting portion to a size of the first flexible circuit board is 0.1 to 0.2.

[0010] In some embodiments, the second supporting portion has a plurality of via holes; at least a portion of the orthographic projections of the plurality of via holes on the first flexible circuit board are located at the bending portion.

[0011] In some embodiments, the plurality of vias are symmetrical about a first axis; the first axis extends along the first direction and passes through a center of the first flexible circuit board.

[0012] In some embodiments, the shape of the orthographic projection of the via hole on the first flexible circuit board includes a long strip, and the via hole extends along a second direction; wherein the second direction intersects the first direction and is parallel to the touch function layer.

[0013] In some embodiments, the first support portion and the second support portion are integrally formed.

[0014] In some embodiments, the elastic modulus of the material of the second support portion is smaller than the elastic modulus of the material of the first support portion.

[0015] In some embodiments, along the first direction, the second supporting portion includes a first sub-portion and a second sub-portion, the first sub-portion is located between the first supporting portion and the second sub-portion, and the elastic modulus of the material of the second sub-portion is smaller than that of the material of the first sub-portion.

[0016] In some embodiments, the material of the first sub-portion includes ink, and the material of the second sub-portion includes foam.

[0017] In some embodiments, the material of the first supporting portion includes polyimide, and the material of the second supporting portion includes at least one of ink, foam, and glue.

[0018] In some embodiments, the material of the first supporting layer includes a main material and a doping material; the doping concentration of the doping material included in the second supporting portion is different from the doping concentration of the doping material included in the first supporting portion.

[0019] In some embodiments, along the first direction, the doping concentration of the doping material included in the second supporting portion gradually increases or gradually decreases.

[0020] In some embodiments, along the first direction, the orthographic projection of the end surface of the second supporting portion distal from the first supporting portion on the first flexible circuit board is located at the bend portion, and the second supporting portion is partially located on the side of the first supporting portion distal from the touch functional layer, and partially located on the side of the first supporting portion distal from the first flexible circuit board. Along the first direction, the portion of the second supporting portion distal from the touch functional layer of the first supporting portion moves away from the surface of the first flexible circuit board, and the distance between the portion and the surface of the first flexible circuit board proximal to the second supporting portion decreases.

[0021] In some embodiments, the maximum distance between the bending portion and the touch functional layer is d1. Along the first direction, the distance between the end surface of the second supporting portion away from the first supporting portion and the end surface of the touch functional layer close to the bending portion is d2, where d1-d2=0.1mm.

[0022] In some embodiments, the bending radius of the first flexible circuit board is 0.3 mm to 0.5 mm.

[0023] In another aspect, a display device is provided, comprising: a module as described in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0025] FIG1 is a structural diagram of a display device according to some embodiments;

[0026] FIG2 is a cross-sectional view along section line AA in FIG1 ;

[0027] FIG3 is a structural diagram showing a second supporting portion located at a bent portion according to some embodiments;

[0028] FIG4 is a structural diagram showing a second support portion extending to a main body portion according to some embodiments;

[0029] FIG5 is a front view of a first flexible circuit board according to some embodiments;

[0030] FIG6 is a cross-sectional view taken along section line HH in FIG5;

[0031] FIG7 is a rear view of a first flexible circuit board according to some embodiments;

[0032] FIG8 is a structural diagram showing a second supporting portion including two supporting bars according to some embodiments;

[0033] FIG9 is a structural diagram showing a second supporting portion including a supporting bar according to some embodiments;

[0034] FIG10 is a structural diagram showing a second supporting portion with a reduced size along a first direction according to some embodiments;

[0035] FIG11 is a structural diagram showing a second supporting portion including a plurality of via holes according to some embodiments;

[0036] FIG12 is a structural diagram showing a reduction in the number of vias along a first direction according to some embodiments;

[0037] FIG13 is a structural diagram of a second supporting portion including a first sub-portion and a second sub-portion according to some embodiments;

[0038] FIG14 is a cross-sectional view taken along section line BB in FIG13;

[0039] 15 is a structural diagram illustrating a doping concentration of a doping material of a second supporting portion greater than a doping concentration of a doping material of a first supporting portion according to some embodiments;

[0040] FIG16 is a cross-sectional view taken along section line CC in FIG15 ;

[0041] 17 is a structural diagram illustrating a doping concentration of a doping material of a second supporting portion that is lower than a doping concentration of a doping material of a first supporting portion according to some embodiments;

[0042] FIG18 is a cross-sectional view taken along section line DD in FIG17;

[0043] FIG19 is another structural diagram showing a second supporting portion located at a bent portion according to some embodiments;

[0044] FIG20 is a cross-sectional view taken along section line GG in FIG19;

[0045] FIG. 21 is a structural diagram of a first flexible circuit board according to some embodiments. DETAILED DESCRIPTION

[0046] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0047] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0048] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0049] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0050] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0051] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0052] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0053] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0054] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0055] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0056] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0057] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0058] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0059] An embodiment of the present disclosure provides a display device 1000. As shown in FIG1 , the display device 1000 can be any product or component with a display function, such as a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, or a car central control screen.

[0060] The display device 1000 may be a liquid crystal display (LCD), an organic light-emitting display (OLED), a quantum dot light-emitting display (QLED), a micro light-emitting diode (Micro LED), a sub-millimeter light-emitting diode (Mini LED), or an active-matrix organic light-emitting diode (AMOLED) display.

[0061] It should be noted that Micro LED refers to an LED with a size (such as length) less than 50 μm, and Mini LED refers to an LED with a size (such as length) of 50 μm to 200 μm.

[0062] In the following embodiments, the display device 1000 is an OLED display device as an example to schematically illustrate some embodiments of the present disclosure. However, the embodiments of the present disclosure are not limited thereto, and any other display device can also be considered as long as the same technical concept is applied.

[0063] In some embodiments, as shown in FIG. 1 , a display device 1000 includes a display module 100 . As shown in FIG. 2 , the display module 100 includes a display panel 10 . The display panel 10 has a display side 10A and a non-display side 10B that are opposite to each other.

[0064] It should be noted that the display side 10A refers to the side of the display panel 10 displaying an image (the upper side of the display panel 10 in FIG2 ), and the non-display side 10B refers to the other side opposite to the display side 10A (the lower side of the display panel 10 in FIG2 ).

[0065] In some embodiments, as shown in FIG. 2 , the display panel 10 includes a display function layer 11 and a touch function layer 12 .

[0066] As shown in FIG2 , the display function layer 11 is configured to implement the display function of the display panel 10. For example, the display function layer 11 includes a plurality of sub-pixels, and the plurality of sub-pixels may include a first sub-pixel emitting a first color, a second sub-pixel emitting a second color, and a third sub-pixel emitting a third color. The first color, the second color, and the third color are three primary colors. For example, the first color is red, the second color is blue, and the third color is green. This is not specifically limited in the embodiments of the present disclosure.

[0067] As shown in FIG2 , the touch function layer 12 is located on one side of the display function layer 11. The touch function layer 12 is configured to implement the touch function of the display panel 10. For example, the touch function layer 12 includes a plurality of touch electrodes, which include a plurality of touch driving electrodes and a plurality of touch sensing electrodes. The plurality of touch sensing electrodes and the plurality of touch driving electrodes are insulated from each other and arranged in a cross pattern.

[0068] In some embodiments, the display panel further includes a substrate and an encapsulation layer.

[0069] The substrate is located on a side of the display function layer 11 away from the touch function layer 12, and the display function layer 11 is disposed on the substrate. The substrate is a rigid substrate. For example, the rigid substrate can be a glass substrate or a polymethyl methacrylate (PMMA) substrate.

[0070] The encapsulation layer is disposed between the display function layer 11 and the touch function layer 12, and the touch function layer 12 is disposed on the encapsulation layer. The encapsulation layer can be a rigid encapsulation layer or a flexible thin film encapsulation layer. In the case of a rigid encapsulation layer, the encapsulation layer is a glass encapsulation layer. In the case of a flexible thin film encapsulation layer, the encapsulation layer can include a single layer of encapsulation film, or can include two or more layers of encapsulation films stacked in a stacked manner. For example, the encapsulation layer includes three layers of encapsulation films stacked in sequence.

[0071] Exemplarily, the substrate is a glass substrate, and the encapsulation layer is a glass encapsulation layer. The display module further includes an adhesive layer, which is located between the substrate and the encapsulation layer and surrounds the plurality of pixels. The adhesive layer can be made of glass glue.

[0072] In some embodiments, as shown in FIG2 , the display module 100 further includes a main flexible printed circuit (MFPC) 1 , which is located on the non-display side B of the display panel 10 . The main flexible printed circuit 1 is configured to provide signals to the display function layer 11 and the touch function layer 12 .

[0073] In some embodiments, as shown in Figure 2, the display module 100 further includes a first flexible printed circuit board 30, which connects the touch function layer 12 to the mainboard 1. In this manner, the mainboard 1 can provide signals to the touch function layer 12 via the first flexible printed circuit board 30, receive feedback signals from multiple touch electrodes, and analyze the feedback signals to determine whether the touch electrodes are touched, thereby implementing the touch function. In this case, the first flexible printed circuit board 30 can be referred to as a touch flexible printed circuit (TFPC).

[0074] It should be noted that the first flexible circuit board 30 has two states: an unfolded state and a bent state. The bent state is shown in Figures 3 and 4, and the unfolded state is shown in Figures 5, 6, 7, and 8. In Figure 8, the shape of the first flexible circuit board 30 in the unfolded state is generally rectangular.

[0075] In this document, "substantially rectangular" means that the overall shape is rectangular, but is not limited to a standard rectangle. In other words, "rectangular" here includes not only basic rectangular shapes but also shapes similar to rectangles. For example, the long and short sides of a rectangle are curved at each intersection (i.e., at the corners), meaning the corners are smooth, resulting in a rounded rectangular shape. The following description uses the example of the first flexible circuit board 30 being substantially rectangular in its unfolded state.

[0076] For example, as shown in Figures 3 and 4 , the touch functional layer 12 has a touch side 12A and a non-touch side 12B that are arranged opposite each other. The touch functional layer 12 includes a first binding portion 121, for example, the first binding portion 121 includes a plurality of first binding pins 1211. The touch side 12A refers to the side of the touch functional layer 12 that implements the touch function (the upper side of the touch functional layer 12 in Figure 2 ), and the non-touch side 12B refers to the other side opposite the touch side 12A (the lower side of the touch functional layer 12 in Figure 2 ).

[0077] 5 and 6 , the first flexible circuit board 30 includes a second binding portion 31, a main body 32, and a bending portion 33 disposed between the second binding portion 31 and the main body 32. For example, the second binding portion 31 includes a plurality of second binding pins 311.

[0078] As shown in FIG. 3 and FIG. 4 , the second binding portion 31 and the first binding portion 121 are bound and connected through a binding process, so that the touch function layer 12 and the first flexible circuit board 30 are bound and connected.

[0079] As shown in FIG. 3 and FIG. 4 , through the bending process, the bending portion 33 can be bent along a bending axis extending in the second direction Y toward the non-touch side 12B, so that the main body 32 is bent toward the non-touch side 12B.

[0080] In some embodiments, as shown in Figures 6 and 7 , the main body 32 includes a plurality of plug pins 321 that connect to the mainboard 1 to connect the first flexible circuit board 30 to the mainboard, thereby connecting the mainboard 1 to the touch function layer 12. The bending axis is not an actual structure in the display panel 10; it is merely a concept proposed to illustrate the bending process of the first flexible circuit board 30.

[0081] It should be noted that, during the binding process, generally, only a portion of the second binding portion 31 is bound to the first binding portion 121. Therefore, during the bending process, the bending portion 33 will cause the unbound second binding portion 31 to also bend toward the non-touch side 12B. That is, as shown in Figures 3 and 4, the second binding portion 31 includes a first binding sub-portion 312 and a second binding sub-portion 313 that are connected. The first binding sub-portion 312 is bound to the first binding portion 121, and the second binding sub-portion 313 is located between the first binding sub-portion 312 and the bending portion, and the second binding sub-portion 313 is bent toward the non-touch side 12B.

[0082] In some embodiments, as shown in Figures 3, 4, 6, and 7, the display module 100 further includes a first supporting layer 40. As shown in Figures 3 and 4, the first supporting layer 40 is disposed on a side of the first flexible circuit board 30 away from the touch function layer 12, and the first supporting layer 40 covers the second binding portion 31. This arrangement allows the first supporting layer 40 to provide support for the second binding portion 31, thereby improving deformation of the second binding portion 31 and enhancing the reliability of the binding between the second binding portion 31 and the first binding portion 121.

[0083] On this basis, as shown in FIG6 , the display module 100 further includes a second adhesive layer 2 . The second adhesive layer 2 is used to bond the first flexible circuit board 30 and the first supporting layer 40 .

[0084] In some embodiments, as shown in FIG6 , the first flexible circuit board 30 includes a substrate layer 34, a first conductive layer 35, and a second conductive layer 36. The first conductive layer 35 is located on one side of the substrate layer 34 and includes second binding pins 311. The second conductive layer 36 is located on a side of the substrate layer 34 away from the first conductive layer 35 and includes a plurality of plug pins 321.

[0085] In some embodiments, as shown in FIG6 , the display module 100 further includes a flattening layer 3 , which is disposed on a side of the first conductive layer 35 away from the second conductive layer 36 . The flattening layer 3 partially covers the second binding pins 311 to improve the flatness of the second binding pins 311 , thereby enhancing the stability and reliability of the connection between the second binding portion 31 and the first binding portion 121 . For example, the material of the flattening layer 3 can be green oil.

[0086] In some embodiments, as shown in FIG6 , the display module 100 further includes a second supporting layer 4 . The second supporting layer 4 is located on a side of the first conductive layer 35 away from the second conductive layer 36 and is located on the main body 32 . This arrangement provides support for the main body 32 , thereby improving deformation of the main body 32 .

[0087] In some embodiments, as shown in FIG6 , the display module 100 further includes a third supporting layer 5 . The third supporting layer 5 is located on the side of the first conductive layer 35 away from the second conductive layer 36 , located within the main body 32 , and covers the plurality of plug pins 321 . This configuration provides support for the plurality of plug pins 321 , alleviating deformation issues associated with the plurality of plug pins 321 and improving the reliability of the connection between the plurality of plug pins 321 and the motherboard 1 .

[0088] In some related technologies, the first supporting layer extends to the bend. The portion of the bend covered by the first supporting layer and the total bending stiffness of the first supporting layer are a first bending stiffness, which is relatively large and has strong bending resistance. The portion of the bend not covered by the first supporting layer has a second bending stiffness, which is relatively small and has low bending resistance. This results in a large first bending stiffness difference (the difference between the first and second bending stiffnesses). Near the end face of the first supporting layer away from the touch function layer, the bending shape of the first flexible circuit board is relatively sharp, resulting in a dead bend. The bending radius is also too small, which in turn causes the traces of the first flexible circuit board to break.

[0089] In other related technologies, the first supporting layer extends to the main body, and the bending stiffness and bending resistance of the first supporting layer are too large, which will increase the difficulty of bending the first flexible circuit board, resulting in a large elastic recovery force of the first flexible circuit board after bending, which will cause the first binding part and the second binding part to separate.

[0090] In order to solve the above technical problems, as shown in FIG. 3 and FIG. 4 , some embodiments of the present disclosure provide a first supporting layer 40 including a first supporting portion 41 and a second supporting portion 42 connected to each other.

[0091] The first support portion 41 covers the second binding portion 31 and extends to the bent portion 33. In this way, the first support portion 41 can provide support for the second binding portion 31, thereby improving the problem of deformation of the second binding portion 31 and improving the reliability of the binding between the second binding portion 31 and the first binding portion 121.

[0092] As shown in Figure 3 , along a first direction X (the first direction X is parallel to the horizontal direction in Figure 3 ), at least a portion of the second support portion 42 is located on a side of the first support portion 41 away from the touch functional layer 12. The second support portion 42 has a lower bending stiffness than the first support portion 41. Bending stiffness refers to an object's ability to resist bending deformation.

[0093] As shown in Figure 3, when the second supporting portion 42 is projected orthographically on the first flexible circuit board 30 and is located at the bending portion 33, the portion of the bending portion 33 covered by the first supporting portion 41 and the total bending stiffness of the first supporting portion 41 is the third bending stiffness, the portion of the bending portion 33 covered by the second supporting portion 42 and the total bending stiffness of the second supporting portion 42 is the fourth bending stiffness, the bending stiffness of the portion of the bending portion 33 not covered by the first supporting layer 40 is the fifth bending stiffness, and the difference between the fourth bending stiffness and the fifth bending stiffness is the second bending stiffness difference.

[0094] The third bending stiffness is approximately equal to the first bending stiffness, the fifth bending stiffness is approximately equal to the second bending stiffness, and the bending stiffness of the second support portion 42 is less than the bending stiffness of the first support portion 41. Therefore, the fourth bending stiffness is less than the third bending stiffness, that is, the fourth bending stiffness is less than the first bending stiffness, thereby making the second bending stiffness difference less than the first bending stiffness difference. Consequently, near the end face of the first supporting layer 40 away from the touch function layer 12, the first flexible circuit board 30 has a smoother bending shape and a larger bending radius. Therefore, the first supporting layer 40 provided in some embodiments of the present disclosure can improve the problem of sharp bending shapes leading to dead bends and a small bending radius in the first flexible circuit board 30, reducing the risk of wiring breakage on the first flexible circuit board 30.

[0095] As shown in Figure 4 , when the second support portion 42 extends to the main body portion 32, the bending stiffness of the second support portion 42 is less than that of the first support portion 41. This can reduce the bending stiffness of the first support layer 40, thereby reducing the bending resistance of the first support layer 40. This reduces the difficulty of bending the first flexible circuit board 30 and reduces the elastic restoring force of the first flexible circuit board 30 after bending. Therefore, the first support layer 40 provided in some embodiments of the present disclosure can reduce the risk of separation between the first binding portion 121 and the second binding portion 31.

[0096] In general, the first supporting layer 40 provided in some embodiments of the present disclosure can improve the problem of sharp bends resulting in dead bends and a small bending radius of the first flexible circuit board 30, thereby reducing the risk of breakage of the traces of the first flexible circuit board 30. It can also reduce the risk of separation between the first binding portion 121 and the second binding portion 31.

[0097] In some embodiments, as shown in Figures 7 and 8, the second support portion 42 includes a plurality of support bars 421. For example, the second support portion 42 includes two, three, five, or ten support bars 421, which are not specifically listed in the embodiments of the present disclosure. The plurality of support bars 421 are spaced apart along the second direction Y. The second direction Y intersects the first direction X and is parallel to the touch function layer 12. For example, the second direction Y and the touch function layer 12 are away from the surface of the display function layer 11.

[0098] By configuring in this manner, the bending stiffness of the second support portion 42 can be made smaller than the bending stiffness of the first support portion 41 , thereby improving the problem of the first flexible circuit board 30 having a sharp bending shape resulting in a dead bend and a small bending radius, thereby reducing the risk of wiring breakage of the first flexible circuit board 30 .

[0099] In some examples, as shown in FIG8 , the second support portion 42 includes two support bars 421 , whose end surfaces, facing away from each other, are aligned with the end surface of the first flexible circuit board 30 . In other words, the support bars 421 are located at the edges of the first flexible circuit board 30 . In this manner, the two support bars 421 can support the edge portions of the first flexible circuit board 30 as well as the middle portion of the first flexible circuit board 30 .

[0100] In other embodiments, as shown in Figure 9 , the second support portion 42 includes a support bar 421. Along the second direction Y, the maximum dimension of the support bar 421 is smaller than the minimum dimension of the first support portion 41. This arrangement can reduce the bending stiffness of the second support portion 42 compared to the bending stiffness of the first support portion 41, thereby improving the sharp bends of the first flexible circuit board 30, resulting in dead bends, and reducing the risk of trace breakage on the first flexible circuit board 30.

[0101] In some embodiments, as shown in Figures 8 and 9 , the second support portion 42 is symmetrical about a first axis X1. The first axis X1 extends along the first direction X and passes through the center of the first flexible circuit board 30. This arrangement balances the forces on the portions of the second support portion 42 located on either side of the first axis X1 during bending of the first flexible circuit board 30, reducing the risk of twisting of the bent portion 33.

[0102] In some examples, as shown in FIG. 8 , the second support portion 42 includes two support bars 421 . The two support bars 421 are located on both sides of the first axis X1 and are symmetrical with respect to the first axis X1 .

[0103] In other examples, as shown in FIG. 9 , the second support portion 42 includes a support bar 421 , the first axis X1 passes through the support bar 421 , and portions of the support bar 421 located on both sides of the first axis X1 are symmetrical about the first axis X1 .

[0104] In some embodiments, the ratio of the size of the second support portion 42 to the size of the first flexible circuit board 30 along the second direction Y is 0.1-0.2. For example, the ratio of the size of the second support portion 42 to the size of the first flexible circuit board 30 is any one of 0.1, 0.15, or 0.2.

[0105] In this manner, on the one hand, the ratio of the size of the second support portion 42 to the size of the first flexible circuit board 30 is greater than 0.1, which can increase the portion of the bent portion 33 covered by the second support portion 42, thereby enabling the second support portion 42 to better support the bent portion 33, thereby reducing the risk of the wiring in the first flexible circuit board 30 being broken due to deformation of the bent portion 33.

[0106] Furthermore, the ratio of the size of the second support portion 42 to the size of the first flexible circuit board 30 is less than 0.2, which can reduce the second bending stiffness difference. Near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 is smoother, reducing the risk of breakage of the traces of the first flexible circuit board 30. This also reduces the bending stiffness and bending resistance of the first support layer 40, thereby making it easier to bend the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending, thereby reducing the risk of separation between the first binding portion 121 and the second binding portion 31.

[0107] In some embodiments, as shown in FIG10 , the second support portion 42 decreases in size along the first direction X and along the second direction Y. This arrangement can, on the one hand, reduce the bending stiffness of the second support portion 42 along the first direction X, thereby reducing the second bending stiffness difference. Near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 becomes smoother, thereby reducing the risk of breakage of the wiring of the first flexible circuit board 30.

[0108] On the other hand, the bending stiffness of the first supporting layer 40 can be further reduced, thereby lowering the bending resistance of the first supporting layer 40, thereby reducing the difficulty of bending the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. This can also reduce the risk of separation between the first binding portion 121 and the second binding portion 31.

[0109] In some embodiments, as shown in Figure 11, the second support portion 42 has multiple vias 422. At least a portion of the orthographic projections of the vias 422 onto the first flexible circuit board 30 are located on the bend 33. This arrangement allows the second support portion 42 to have a lower bending stiffness than the first support portion 41. This can alleviate issues such as sharp bends on the first flexible circuit board 30, resulting in dead bends, and smaller bend radii, thereby reducing the risk of trace breakage on the first flexible circuit board 30.

[0110] It should be noted that when the orthographic projection of the second support portion 42 on the end surface away from the first support portion 41 on the first flexible circuit board 30 is located at the bend 33, the orthographic projections of the multiple vias 422 on the first flexible circuit board 30 are located at the bend 33. When the second support portion 42 extends to the main body 32, the orthographic projections of the multiple vias 422 on the first flexible circuit board 30 are partially located at the bend 33 and partially located at the main body 32; alternatively, the orthographic projections of the multiple vias 422 on the first flexible circuit board 30 are all located at the bend 33.

[0111] In some embodiments, as shown in FIG11 , the plurality of vias 422 are symmetrical about the first axis X1. This arrangement allows for balanced forces on the portions of the second support portion 42 located on both sides of the first axis X1 during bending of the first flexible circuit board 30, reducing the risk of distortion of the bent portion 33.

[0112] In some embodiments, the orthographic projection of the via hole 422 on the first flexible circuit board 30 includes a long strip shape, and the via hole 422 extends along the second direction Y.

[0113] For example, as shown in FIG11 , a plurality of vias 422 are arranged into a plurality of columns of vias 422 along the second direction Y. Each column of vias 422 includes a plurality of vias 422 spaced apart along the second direction Y. The vias 422 in two adjacent columns are staggered. It is understood that the vias 422 in two adjacent columns may be partially staggered or completely staggered.

[0114] It should be noted that the shape of the orthographic projection of the via hole 422 on the first flexible circuit board 30 may also be other shapes, such as a circle, a rectangle, a regular polygon, a diamond or a cross.

[0115] In some embodiments, as shown in FIG12 , the orthographic projections of the plurality of vias 422 on the first flexible circuit board 30 have the same shape, and the number of vias 422 decreases along the first direction X. This arrangement, on the one hand, can reduce the bending stiffness of the second support portion 42 along the first direction X, thereby reducing the second bending stiffness difference. Near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 becomes smoother, thereby reducing the risk of breakage of the traces of the first flexible circuit board 30.

[0116] On the other hand, the bending stiffness of the first supporting layer 40 can be further reduced, thereby lowering the bending resistance of the first supporting layer 40, thereby reducing the difficulty of bending the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. This can also reduce the risk of separation between the first binding portion 121 and the second binding portion 31.

[0117] In some embodiments, as shown in Figures 4 to 12, the first support portion 41 and the second support portion 42 are integrally formed. In this manner, the processing of the first support portion 41 and the second support portion 42 is simple.

[0118] In some embodiments, the elastic modulus of the material of the second support portion 42 is lower than that of the material of the first support portion 41. This configuration can reduce the bending stiffness of the second support portion 42 compared to the stiffness of the first support portion 41, thereby improving the sharp bends of the first flexible circuit board 30, resulting in dead bends, and reducing the risk of trace breakage on the first flexible circuit board 30.

[0119] Exemplarily, the material of the first supporting portion 41 includes polyimide, and the material of the second supporting portion 42 includes at least one of ink, foam, and glue.

[0120] In some embodiments, as shown in Figures 13 and 14 , the second support portion 42 includes multiple sub-portions, and the elastic modulus of the material of the multiple sub-portions decreases along a direction. This arrangement, on the one hand, can reduce the bending stiffness of the second support portion 42 along the first direction X, thereby reducing the second bending stiffness difference. Near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 is smoother, thereby reducing the risk of breakage of the wiring of the first flexible circuit board 30.

[0121] On the other hand, the bending stiffness of the first supporting layer 40 can be further reduced, thereby lowering the bending resistance of the first supporting layer 40, thereby reducing the difficulty of bending the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. This can also reduce the risk of separation between the first binding portion 121 and the second binding portion 31.

[0122] In some examples, as shown in Figures 13 and 14, the second support portion 42 includes a first sub-portion 423 and a second sub-portion 424, the first sub-portion 423 is located between the first support portion 41 and the second sub-portion 424, and the elastic modulus of the material of the second sub-portion 424 is smaller than the elastic modulus of the material of the first sub-portion 423.

[0123] Illustratively, the material of the first sub-portion 423 includes ink, and the material of the second sub-portion 424 includes foam.

[0124] Exemplarily, along the first direction X, a ratio of a size of the first sub-portion 423 to a size of the second sub-portion 424 is 1.

[0125] In some embodiments, the material of the first supporting layer 40 includes a main material and a dopant material. The dopant concentration of the dopant material included in the second supporting portion 42 is different from the dopant concentration of the dopant material included in the first supporting portion 41, so that the bending stiffness of the second supporting portion 42 is lower than the stiffness of the first supporting portion 41. This can improve the problem of the first flexible circuit board 30 having a sharp bending shape resulting in a dead bend and a small bending radius, thereby reducing the risk of wiring breakage on the first flexible circuit board 30.

[0126] It should be noted that the doping concentration of the doping material included in the second supporting portion 42 may be greater than or less than the doping concentration of the doping material included in the first supporting portion 41 .

[0127] In some examples, as shown in Figures 15 and 16, the main material is polyimide, and the doping material is a plasticizer. The plasticizer can reduce the bending stiffness of the plastic. The doping concentration of the doping material included in the second support part 42 is set to be greater than the doping concentration of the doping material included in the first support part 41, so that the bending stiffness of the second support part 42 is less than the stiffness of the first support part 41.

[0128] For example, the doping material includes aliphatic dicarboxylic acid esters, phthalic acid esters, benzene polycarboxylic acid esters, benzoic acid esters, polyol esters, chlorinated hydrocarbons, epoxy resins, or citrate esters.

[0129] In other examples, as shown in Figures 15 and 16 , the main material is polyimide and the dopant material is a toughening agent, which can also reduce the bending stiffness of the plastic. The doping concentration of the dopant material included in the second support portion 42 is set to be greater than the doping concentration of the dopant material included in the first support portion 41, so that the bending stiffness of the second support portion 42 is lower than that of the first support portion 41.

[0130] For example, the doping material includes liquid polysulfide rubber, liquid acrylic rubber, liquid polybutadiene rubber, nitrile rubber, ethylene propylene rubber or styrene butadiene rubber.

[0131] In some other examples, as shown in Figures 17 and 18, the main material is polyimide, and the doping material is a reinforcing agent, which can increase the bending stiffness of the plastic. The doping concentration of the doping material included in the second support part 42 is less than the doping concentration of the doping material included in the first support part 41, so that the bending stiffness of the second support part 42 is less than the stiffness of the first support part 41.

[0132] For example, the doping material includes carbon fiber, glass fiber, or polyester fiber.

[0133] In some embodiments, the doping concentration of the dopant material included in the second support portion 42 gradually increases or decreases along the first direction X. This configuration can, on the one hand, reduce the bending stiffness of the second support portion 42 along the first direction X, thereby reducing the second bending stiffness difference. Near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 becomes smoother, thereby reducing the risk of breakage of the wiring of the first flexible circuit board 30.

[0134] On the other hand, the bending stiffness of the first supporting layer 40 can be further reduced, thereby lowering the bending resistance of the first supporting layer 40, thereby reducing the difficulty of bending the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. This can also reduce the risk of separation between the first binding portion 121 and the second binding portion 31.

[0135] In some examples, as shown in Figures 15 and 16 , the doping concentration of the doping material included in the second support portion 42 is greater than the doping concentration of the doping material included in the first support portion 41, and the doping concentration of the doping material included in the second support portion 42 gradually increases along the first direction X. This can reduce the bending stiffness of the second support portion 42 along the first direction X, thereby reducing the second bending stiffness difference. Furthermore, it can further reduce the bending stiffness of the first support layer 40, thereby lowering its bending resistance.

[0136] In other examples, as shown in Figures 17 and 18 , the doping concentration of the doping material included in the second support portion 42 is lower than the doping concentration of the doping material included in the first support portion 41, and the doping concentration of the doping material included in the second support portion 42 gradually decreases along the first direction X. This can reduce the bending stiffness of the second support portion 42 along the first direction X, thereby reducing the second bending stiffness difference. Furthermore, it can further reduce the bending stiffness of the first support layer 40, lowering its bending resistance.

[0137] In some embodiments, as shown in Figures 19, 20, and 21, along the first direction X, the end surface of the second support portion 42 that is away from the first support portion 41 has its orthographic projection on the first flexible circuit board 30 located at the bend 33. The second support portion 42 is partially located on the side of the first support portion 41 away from the touch function layer 12, and partially located on the side of the first support portion 41 away from the first flexible circuit board 30. This increases the contact area between the second support portion 42 and the first support portion 41, thereby improving the reliability of the first support portion 41 and the second support portion 42.

[0138] In some examples, the material of the first supporting portion 41 includes polyimide, and the material of the second supporting portion 42 includes ink. The second supporting portion 42 can be formed by coating ink near an edge of the first supporting portion 41 away from the touch function layer 12 .

[0139] In other examples, the material of the first support portion 41 includes polyimide, and the material of the second support portion 42 includes glue. The second support portion 42 can be formed by attaching glue to the edge of the first support portion 41 away from the touch function layer 12. For example, the glue material includes sealant or UV glue.

[0140] Based on the above embodiment, as shown in Figures 19, 20, and 21, along the first direction X, the portion of the second support portion 42 located on the side of the first support portion 41 away from the touch function layer 12 is further away from the surface of the first flexible circuit board 30, and the distance between the surface of the first flexible circuit board 30 near the second support portion 42 is reduced. This can reduce the bending stiffness of the second support portion 42 along the first direction X, thereby reducing the second bending stiffness difference. Near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 becomes smoother, reducing the risk of breakage of the wiring of the first flexible circuit board 30.

[0141] On the other hand, the bending stiffness of the first supporting layer 40 can be further reduced, thereby lowering the bending resistance of the first supporting layer 40, thereby reducing the difficulty of bending the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. This can also reduce the risk of separation between the first binding portion 121 and the second binding portion 31.

[0142] In some embodiments, as shown in FIG21 , the maximum distance between the bending portion 33 and the touch function layer 12 is d1. As shown in FIG20 , along the first direction X, the distance between the end surface of the second support portion 42 away from the first support portion 41 and the end surface of the touch function layer 12 close to the bending portion 33 is d2, where d1-d2=0.1 mm.

[0143] This arrangement allows the maximum distance between the bent portion 33 and the second support portion 42, when bent, to be less than the maximum distance between the bent portion 33 and the touch functional layer 12. In other words, the end of the bent portion 33 that is further away from the touch functional layer 12 is further away from the touch functional layer 12 than the end of the second support portion 42 that is further away from the touch functional layer 12. This allows the bezel of the display device 1000 corresponding to the bent portion 33 to be designed to be narrower, further facilitating a narrow bezel design for the display device 1000.

[0144] In some embodiments, the bending radius of the first flexible circuit board 30 is 0.3 mm to 0.5 mm. For example, the bending radius of the bending portion 33 can be 0.3 mm, 0.36 mm, 0.38 mm, 0.4 mm, 0.42 mm, 0.46 mm, or 0.5 mm.

[0145] It is understood that the smaller the bending radius of the bend portion 33, the narrower the frame of the display device 1000 corresponding to the bend portion 33 (the lower frame in FIG. 1 ) can be designed, which is more conducive to the narrow frame design of the display device 1000. For example, the bending radius of the bend portion 33 can be 0.3 mm to 0.4 mm. For example, the bending radius of the bend portion 33 can be 0.3 mm, 0.32 mm, 0.36, or 0.4, so that the frame of the display device 1000 corresponding to the bend portion 33 (the lower frame in FIG. 1 ) can be made narrower.

[0146] In some embodiments, as shown in FIG2 , the display module 100 further includes a second flexible circuit board 50 . The second flexible circuit board 50 is connected to the display function layer 11 and the mainboard 1 . In this manner, the mainboard 1 can provide signals to the display function layer 11 via the second flexible circuit board 50 to implement the display function. In this case, the second flexible circuit board 50 can be referred to as a chip-on-film (COF).

[0147] In some embodiments, the display module 100 further includes a cover plate 60, a first adhesive layer 70, a circular polarizer 80, and a buffer layer 90. The circular polarizer 80 is disposed on the display side of the display panel 10 and is configured to reduce reflection of ambient light by the display panel 10.

[0148] The cover plate 60 is disposed on a side of the circular polarizer 80 away from the display panel 10 and is configured to protect the display panel 10 and reduce the risk of the display panel 10 being scratched.

[0149] The first adhesive layer 70 is located between the cover plate 60 and the circular polarizer 80 , and the first adhesive layer 70 bonds the cover plate 60 and the circular polarizer 80 together.

[0150] For example, the material of the first adhesive layer 70 may include optically clear adhesive (OCA) or pressure sensitive adhesive (PSA) with high light transmittance. For example, the material of the first adhesive layer 70 includes optical adhesive.

[0151] The buffer layer 90 is located on the non-display side 10B of the display panel 10 . The buffer layer 90 can play a good buffering role, which is helpful in reducing the risk of damage to the display panel 10 .

[0152] Exemplarily, the material of the buffer layer 90 includes a super clean foam composite film (English: Super Clean Foam, abbreviated as: SCF).

[0153] For example, the ultra-clean foam composite film includes an adhesive layer, a buffer layer, and a heat dissipation layer stacked in sequence in a direction away from the display panel.

[0154] The adhesive layer is used to bond the buffer layer and the heat dissipation layer to one side of the display panel, and the adhesive layer may be flexible, which is beneficial to the flexible design of the display module 100. For example, the adhesive layer is made of a hydrophobic material.

[0155] The buffer layer can not only buffer the stress acting on the display panel 10, but also shield light, thereby improving the display effect of the display panel 10. For example, the buffer layer includes foam and is dark in color (for example, black).

[0156] The heat dissipation layer can be used to dissipate heat generated by the display panel 10 during operation, so as to reduce the risk of the display panel 10 being burned due to high heat of the display panel 10. For example, the heat dissipation layer is made of a metal material.

[0157] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0158] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display module, comprising: The touch function layer has a touch side and a non-touch side that are arranged opposite to each other; the touch function layer includes a first binding portion, and the first binding portion is located on the non-touch side; The first flexible circuit board comprises a second binding portion, a main body portion, and a bending portion disposed between the second binding portion and the main body portion; the second binding portion is bound and connected to the first binding portion, and the bending portion is bent toward the non-touch side so that the main body portion is bent to the non-touch side; A first supporting layer is arranged on a side of the first flexible circuit board away from the touch function layer, the first supporting layer comprising a first supporting portion and a second supporting portion connected to each other; the first supporting portion covers the second binding portion and extends to the bending portion; Along the first direction, at least a portion of the second supporting portion is located on a side of the first supporting portion away from the touch function layer, and the bending stiffness of the second supporting portion is smaller than the bending stiffness of the first supporting portion.

2. The display module according to claim 1, wherein: The second supporting portion includes a plurality of supporting bars; the plurality of supporting bars are arranged at intervals along a second direction; the second direction intersects with the first direction and is parallel to the touch function layer.

3. The display module according to claim 2, wherein: The second supporting portion includes two supporting bars, and end surfaces of the two supporting bars that are away from each other are flush with the end surface of the first flexible circuit board.

4. The display module according to claim 1, wherein: The second supporting portion includes a supporting bar; along the second direction, the maximum size of the supporting bar is smaller than the minimum size of the first supporting portion; the second direction intersects the first direction and is parallel to the touch function layer. 5 . The display module according to claim 2 , wherein the second supporting portion is symmetrical about a first axis; the first axis extends along the first direction and passes through a center of the first flexible circuit board.

6. The display module according to any one of claims 2 to 5, wherein: Along the second direction, the ratio of the size of the second supporting portion to the size of the first flexible circuit board is 0.1 to 0.

2.

7. The display module according to any one of claims 1 to 6, wherein: The second supporting portion has a plurality of via holes; at least part of the orthographic projections of the plurality of via holes on the first flexible circuit board are located at the bending portion.

8. The display module according to claim 7, wherein: The plurality of via holes are symmetrical about a first axis; the first axis extends along the first direction and passes through the center of the first flexible circuit board.

9. The display module according to claim 8, wherein: The shape of the orthographic projection of the via hole on the first flexible circuit board includes a long strip, and the via hole extends along a second direction; the second direction intersects the first direction and is parallel to the touch function layer. 10 . The display module according to claim 2 , wherein the first supporting portion and the second supporting portion are integrally formed.

11. The display module according to any one of claims 1 to 9, wherein: The elastic modulus of the material of the second support portion is smaller than the elastic modulus of the material of the first support portion.

12. The display module according to claim 11, wherein: Along the first direction, the second supporting portion includes a first sub-portion and a second sub-portion, the first sub-portion is located between the first supporting portion and the second sub-portion, and an elastic modulus of a material of the second sub-portion is smaller than an elastic modulus of a material of the first sub-portion.

13. The display module according to claim 12, wherein: The material of the first sub-portion includes ink, and the material of the second sub-portion includes foam.

14. The display module according to any one of claims 11 to 13, wherein: The material of the first supporting part includes polyimide, and the material of the second supporting part includes at least one of ink, foam and glue.

15. The display module according to any one of claims 1 to 9, wherein: The material of the first supporting layer includes a main material and a doping material; The doping concentration of the doping material included in the second supporting portion is different from the doping concentration of the doping material included in the first supporting portion.

16. The display module according to claim 15, wherein: Along the first direction, the doping concentration of the doping material included in the second supporting portion gradually increases or gradually decreases.

17. The display module according to any one of claims 1 to 16, wherein: Along the first direction, the orthographic projection of the end surface of the second supporting portion away from the first supporting portion on the first flexible circuit board is located at the bending portion, and the second supporting portion is partially located at a side of the first supporting portion away from the touch function layer, and partially located at a side of the first supporting portion away from the first flexible circuit board; Along the first direction, a portion of the second supporting portion located on a side of the first supporting portion away from the touch function layer is away from the surface of the first flexible circuit board, and a distance between the portion and the surface of the first flexible circuit board close to the second supporting portion is reduced.

18. The display module according to claim 17, wherein: Along the first direction, the maximum distance between the bending portion and the touch function layer is d1, and the distance between the end surface of the second supporting portion away from the first supporting portion and the end surface of the touch function layer close to the bending portion is d2, wherein d1-d2=0.1 mm.

19. The display module according to any one of claims 1 to 18, wherein: The bending radius of the first flexible circuit board is 0.3 mm to 0.5 mm.

20. A display device comprising the display module according to any one of claims 1 to 19.

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