Holding device for holding a substrate, arranging device for holding and connecting at least two substrates, and soldering tool

Abstract

A holding device (1) for holding a substrate (2), comprising: a supporting region (3a) on a front side (3) of the holding device (1), onto which supporting region the substrate (2) is placed as intended, and at least one adjustable holding element (4) which can be adjusted by an adjusting mechanism, which can be actuated in an automated manner, in such a way that, when the substrate (2) is placed onto the supporting region (3a) as intended, it is held on the supporting region (3a) at least with a form fit.

Description

[0001] Description

[0002] Holding device for holding a substrate, arrangement device for holding and connecting at least two substrates and soldering tool

[0003] The invention relates to a holding device for holding a substrate, an arranging device for holding and connecting at least two substrates and a soldering tool.

[0004] Workpiece carriers are known from the prior art for holding workpieces, such as substrates. The workpiece carrier is, for example, a mold into which one or more workpieces can be inserted. However, in the described workpiece carriers, the workpiece is essentially held only in the lateral direction by the shape of the workpiece carrier.

[0005] To fix workpieces, such as substrates, in a vertical direction, workpiece carriers are used into which pins and / or compartment dividers can be inserted in order to fix the workpieces on the surface of the workpiece carrier.

[0006] When using the workpiece carriers, for example, the pins for fixing the workpieces are inserted manually and the pins are positioned individually depending on the location of the workpiece on the workpiece carrier or the shape of the workpiece.

[0007] Accordingly, no vertical fixation of substrates is known from the state of the art for use in automated manufacturing processes. This is because the workpiece carriers of the state of the art are not suitable for mechanical application or actuation and therefore also not suitable for automated production in a process line.

[0008] Furthermore, the precision of securing the workpiece to the workpiece carrier presents a challenge, as the positioning of the workpiece varies depending on the individual insertion process. This can be particularly problematic in a manufacturing or process step that requires precise alignment and positioning of the workpiece. The invention is therefore based on the object of providing means for the efficient handling of substrates with electronic components, particularly for manufacturing or process steps, which enable precise securing of substrates.

[0009] This object is achieved by a holding device for holding a substrate according to claim 1, an arrangement device for holding and connecting at least two substrates according to claim 11 and a soldering tool according to claim 13.

[0010] Preferred embodiments are the subject of the dependent patent claims.

[0011] The holding device according to the invention, which is equipped with a substrate or a contact element that may have contact sections as intended or which holds the substrate as intended, includes an adjustment mechanism as is essential to the invention.

[0012] The holding device according to the invention can be used to transport the substrate in an automated process line and to hold, fix, or secure it in a defined manner during a soldering process. The holding device is particularly used in the production of power modules, such as DSC power modules or IGBT power modules, which are installed in inverters, for example, for electric vehicles.

[0013] Furthermore, the holding device according to the invention can be combined with another holding device according to the invention to form an arrangement device according to the invention. The arrangement device is particularly designed to arrange substrates held by the holding devices, which are preferably components of an electronic module to be connected, in a defined manner relative to one another. One of the holding devices holds a substrate on which an electronic component is preferably arranged, and the other holding device holds, for example, another substrate that serves as a carrier for the electronic component and is intended to be connected to the substrate of one of the holding devices.

[0014] Accordingly, in a process step for the automated production of electronic modules, the corresponding substrates or components of an electronic module or contact elements, held by the one and the further holding device in the arrangement device according to the invention, can first be arranged in a defined manner relative to one another and then connected to one another.

[0015] In particular, the arrangement device according to the invention forms a soldering tool according to the invention, wherein substrates or components or contact elements are held together in the arrangement device in such a way that they can be soldered in one manufacturing step.

[0016] According to the invention, a holding device for holding a substrate has a support area on a front side of the holding device, onto which the substrate is placed as intended, and at least one adjustable holding element which can be adjusted by an automatically actuated adjusting mechanism such that when the substrate is placed on the support area as intended, it is held at least in a form-fitting manner on the support area.

[0017] The holding device can be a plate-like shaped body in its basic form. Cubic shapes with at least one flat surface are particularly suitable as the basic shape of the holding device.

[0018] The holding device according to the invention is intended to hold the substrate.

[0019] A substrate is generally understood to be a carrier for electronic components. The substrate is provided with circuit structures or conductor tracks and represents a central element in circuit design, particularly for inverters.

[0020] Furthermore, the substrate that is intended to be held by the holding device according to the invention is, in particular, a substrate on which an electronic component is arranged, and particularly preferably a substrate with a power module or DSC power module, or a substrate that serves as a carrier for the other substrate, wherein both substrates can represent components for an electronic module. However, the holding device can also be used to hold substrates on which further or other electronic components are arranged, or on which no electronic components are arranged.

[0021] In its intended use, the substrate is placed on the support area on the front side of the holding device. The front side of the holding device is preferably a flat surface of the aforementioned plate-like molded body or the base body of the holding device.

[0022] The support area describes the area on which the substrate is arranged when held by the holding device. For example, the support area can be a section of the front side and is therefore flat. However, the support area can also be a recessed section of the front side into which the substrate can be inserted to secure it against lateral displacement.

[0023] The support area can also be designed differently, but in particular forms a positive connection with a support side of the substrate. Furthermore, the front side or in particular the support area can be provided with at least one positioning section, which serves for the rough positioning of the substrate placed on it as intended and initially secures it loosely before the substrate is held at least positively by the holding device. The positioning section can also contribute to holding the substrate. Furthermore, the holding device according to the invention has at least one adjustable holding element. The holding element can be a finger structure or a spring-plate-like structure that can be adjusted, for example, by rotation, translation, or linear displacement.The holding element is arranged in relation to the substrate in such a way that it can be adjusted in positions so that it can at least partially engage the substrate in a holding manner or not. For this purpose, the holding element is preferably arranged on the front side, laterally to the support area, or adjustable across the support area and the substrate.

[0024] The holding elements can be adjusted, in particular mechanically, into different positions on the holding device or the front of the holding device by the automatically actuated or to be actuated adjustment mechanism of the holding device. For this purpose, the adjustment mechanism has structures that allow easy integration of the holding device into a manufacturing system via a connection mechanism for automatic access. The connection mechanism, in interaction with the adjustment mechanism, allows the holding elements to be adjusted, in particular precisely and reversibly, as described below, when actuated. By appropriately adjusting the holding element, the holding element forms at least a positive connection with the substrate at the support area, at least in sections, in order to hold or fix the substrate.

[0025] Preferably, the holding device has a rear side facing away from the front side, wherein the adjustment mechanism can be actuated from the front side and from the rear side of the holding device.

[0026] The back side is generally a side facing away from the front side, but preferably a surface of the holding device opposite the front side. To enable operation or activation from both sides, the structures of the adjustment mechanism are designed in such a way that automatic or mechanical, as well as manual, connection of the front and back sides is possible.

[0027] For this purpose, the adjustment mechanism of the holding device is preferably designed identically or equally on the front and back. If the holding device is plate-shaped in its basic form, the structures can be designed symmetrically to a plane parallel to the front and back of the holding device.

[0028] The ability to operate or activate the adjustment mechanism from both sides has the advantage that if the front of the holding device is not accessible due to a manufacturing step or because the substrate or product is to be gripped automatically, for example, the adjustment mechanism can be operated from the rear to adjust the holding element or release the substrate.

[0029] Furthermore, the adjustment mechanism preferably has at least one drive element, and the at least one holding element can be adjusted translationally and / or rotationally into a starting position and into a holding position by the drive element. The adjustment mechanism has at least one drive element, which is designed, for example, as a screw drive, preferably as a two-sided or symmetrical screw drive, which can be driven equally from the front and the back of the holding device.

[0030] The holding element is preferably mounted in a linearly translationally adjustable manner, wherein the drive element is in contact with a portion of the holding element by a drive structure in such a way that the holding element can be adjusted, moved or displaced translationally into different positions on the holding device by rotation of the drive element.

[0031] Alternatively, the holding element can also be mounted in a rotational manner. In this case, the drive element is in contact with the holding element, for example, or is provided on the holding element in such a way that the holding element rotates with the drive element when the screw drive rotates, allowing the holding element to be adjusted to various positions, including the starting position and the holding position.

[0032] The starting position and the holding position of the holding element are sometimes defined by the structure and arrangement of the holding element and the adjustment mechanism in relation to the holding device or the substrate on the holding device, wherein the starting position represents a position that is particularly suitable for placing the substrate on the support area of ​​the holding device and the holding position represents a position in which the substrate is held by the holding element or in interaction with other holding elements or also the above-mentioned positioning section.

[0033] The screw drive is preferably hexagonal. However, other drive types, such as slotted, Phillips, or hexagon socket, are also suitable.

[0034] Furthermore, the holding device preferably has a plurality of holding elements, wherein at least one of the plurality of holding elements has an offset section via which it is guided in a guide of the holding device in an offset direction towards the substrate, wherein the holding element is translationally displaceable by the at least one drive element, wherein the drive element interacts with the offset section in a gear-like manner. The holding device preferably has a plurality of holding elements, which, depending on the design of the holding device or the holding elements, can be adapted in terms of their size and structure to the dimensions of the substrate to be held. For example, two, eight, seven, thirteen, fourteen or twenty or more holding elements are provided on the holding device.

[0035] The number is not limited to the examples mentioned, but is selected depending on the application in order to ensure a balanced compromise between automatic machine operability and holding capacity of the holding device.

[0036] The plurality of holding elements are preferably holding elements that are of similar design, but are arranged at different positions or in different orientations with respect to a surface of the substrate on the holding device. However, the plurality of holding elements can also be formed by holding elements that may differ, for example, in their adjustment mechanism or holding mechanism and may also differ in their dimensions.

[0037] However, at least one holding element of the plurality of holding elements has an offset section. The offset section is preferably an elongated section of the holding element, which is received by a guide of the holding device in order to mount the holding element in a translational manner, preferably linearly. The offset section of the holding element, in cooperation with the structure of the guide, defines the positions and the offset direction in which the holding element can be adjusted. The guide is preferably formed in the longitudinal direction of the holding device parallel to the front and rear. The orientation of the guide defines the offset direction in which the holding element is guided towards the substrate. The offset direction corresponds to a direction towards the substrate on the support area of ​​the holding device.

[0038] Accordingly, the holding element can be adjusted toward or away from the substrate. The guide, in conjunction with the displacement section, can also define the starting position and the holding position, which describe the positions in which the holding element, with the displacement section, abuts the guide end in the displacement direction. The holding element can be translationally displaced within the guide by the drive element, in that the at least one drive element interacts with the displacement section via a gear-like structure.

[0039] Accordingly, the displacement section preferably has a grooved section into which the drive element engages via a gear. By rotating the drive element, the holding element can be translationally displaced, preferably linearly, in the guide direction by the guided displacement section.

[0040] Alternatively, the displacement section and drive element can also interact through friction. The decisive factor for the translational displacement of the holding element is the conversion of the rotational movement of the drive element into a translational movement of the holding element, which is guided by the guide. Furthermore, at least one of the holding elements preferably has at least one holding section with a holding projection, and the holding section can be displaced into the holding position such that the holding projection of the holding section extends at least partially over the substrate in the displacement direction and bears against the surface of the substrate such that the substrate is pressed force-fittingly onto the support area in a holding direction by the holding projection.

[0041] One of the holding elements preferably has a holding section with a holding projection. However, the holding element can also have, for example, two or three holding sections with holding projections, which are adjusted by displacing the displacing section between the starting position and the holding position.

[0042] The at least one holding section of the holding element is therefore preferably formed orthogonally opposite to the holding direction with respect to the offset direction or the extension direction of the offset section, wherein the holding direction describes the direction in which the substrate is held pressingly on the support area by the holding element.

[0043] To ensure that the holding projection presses the substrate in the holding position against the support area in a force-fitting manner, preferably by pressing, the holding section and holding projection are dimensioned such that displacement of the holding projection onto the substrate is possible and the holding projection can create a force-fitting connection with the substrate on the support area. Accordingly, the holding projection is provided on the holding section approximately at the level of an edge of the surface of the substrate facing away from the front of the holding device and protrudes from the holding section in the displacement direction.

[0044] Likewise preferably, the guide extends within the holding device between the front side and the rear side, wherein the holding element received in the guide by the offset section, with the at least one holding section with holding projection, protrudes through a holding recess through the front side, and wherein the drive element can be driven by a drive recess on the front side and on the rear side.

[0045] One of the holding elements is guided at least partially within the holding device by the guide with the offset section. The at least one holding section protrudes with the holding projection through a holding recess on the front side, allowing the holding projection to be displaced over the substrate and hold the substrate against the support area in the holding position. The holding recess is therefore dimensioned to enable the holding section to be moved into the starting position and the holding position by actuating the adjustment mechanism.

[0046] The drive element that accesses the offset section is accordingly formed at least partially in the plane of the offset section within the holding device. The drive element, which is designed to be actuated or operated from the front and rear sides, or from both sides, can be accessed from the front and rear sides. For this purpose, a drive recess can be provided on each side of the holding device for access to the screw drive of the drive element.

[0047] For the assembly of the holding device, it is particularly suitable for the holding device to have an upper plate with the front side and a lower plate with the rear side, which have bearing grooves provided for the holding elements and drive elements, respectively. This allows the holding elements and the drive elements to be installed between the upper and lower plates in bearing grooves provided for the respective elements and to be stored as intended. Furthermore, the guide and the offset section preferably interact via a spring such that the at least one holding element is preloaded in the holding direction, and the holding element can be resiliently lifted against the holding direction.

[0048] A receiving space is provided in the guide, which is designed to guide the holding element via the offset section in the guide in such a way that the offset section in the guide or the holding element can be easily lifted or moved counter to the holding direction. However, the guide and the offset section interact via the spring in such a way that the offset section is preloaded in the holding direction by the spring force or is pressed in the holding direction.

[0049] The retaining projection can include a rounded section to prevent it from interlocking with the respective edge or the edge of the substrate surface on which the retaining projection is intended to rest when moved into the retaining position. This ensures that the retaining projection can slide over the edge of the substrate against the force of the spring, even if the retaining projection is partially located at a height below the substrate edge upon reaching the substrate. In this case, the interaction of the shape of the retaining projection and the edge of the substrate causes the retaining projection to be raised.

[0050] In this way, the spring force can create a frictional connection between the holding element or the holding projection of the holding element and the surface of the substrate on the support area.

[0051] Particularly preferably, the spring is a sliding spring which is provided on the displacement section, wherein the sliding spring enables a sliding translational displacement of the displacement section in the guide and prestresses the displacement section in the holding direction.

[0052] The sliding spring is provided flat on the offset section and accommodated in the receiving space of the guide in such a way as to preload the holding element or the offset section as holistically as possible in the holding direction, so that the holding element is mounted in the guide via the offset section as flatly as possible. However, the sliding spring can also be provided flat on a side of the guide facing the offset section of the holding element in order to preload the offset section as holistically as possible in the holding direction.

[0053] The sliding spring is designed to enable a translational movement of the holding element in the displacement direction, in particular in a sliding manner, which suppresses a hooking of the holding element within the guide when adjusting the holding element and thus enables an easier, as jerk-free as possible actuation of the adjustment mechanism.

[0054] Also particularly preferably, at least one of the holding elements interacts with the guide by means of a cam structure in such a way that when the holding element is moved between the starting position and the holding position, the holding element is lifted in a preferably wave-like movement against the spring force of the sliding spring, and when the holding element is moved from the starting position into the holding position, the holding element is lifted in a preferably wave-like resilient manner in such a way that the holding projection is lifted over the edge of the substrate before reaching the substrate and is deposited on the substrate when the holding position is reached, and the pretensioning of the holding element contributes to the frictional connection between the holding projection and the substrate.

[0055] The cam structure is preferably formed by a wave-like cam in the guide, which is formed in the guide opposite to the holding direction, wherein the offset section of the holding element has cam recesses which can receive the cam and define at least the starting position and the holding position of the holding element.

[0056] If the holding element is in one of these positions, one of the cams is received by one of the cam recesses, whereby the preloaded offset section is positively supported in the guide. By translationally displacing the holding element in or against the displacement direction, the cam is pushed out of one of the cam recesses of the offset section, whereby the cam is no longer positively received in the respective cam recess. Accordingly, when the holding element is translationally displaced, the holding element is raised counter to the holding direction and the spring force due to the interaction of the cam of the guide and the cam recesses of the offset section, until the cam reaches the next cam recess.In particular, when used as intended, this interaction in the form of the cam structure causes the holding projection of the holding element to be briefly raised by a stroke defined by the cam structure before reaching the substrate and to be placed / lowered on the substrate when the holding position is reached.

[0057] This allows the holding element to be moved while preventing it from catching on the edge of the substrate during translational movement of the holding projection in the direction of displacement relative to the substrate, and preventing any abrasive movement of the holding projection on the substrate. This particularly protects the surface of the substrate, including conductor tracks or components.

[0058] Furthermore, the holding section with the holding projection can be designed to be deeper relative to the edge of the substrate surface in accordance with the stroke, since the holding projection is raised above the edge of the substrate and onto the surface of the substrate before reaching the substrate in accordance with the stroke of the holding element, upon overcoming the cam. In particular, the spring force of the sliding spring is thereby transferred from the holding projection of the holding element to the surface of the substrate, whereby the holding projection exerts pressure on the surface of the substrate and creates a frictional connection between the substrate and the support area.

[0059] Preferably, when the substrate is placed as intended, the substrate is pressed against the support area in a force-locking manner in the holding direction by several holding elements adjusted to the holding position.

[0060] If, for example, the holding device is intended to hold the substrate using only one holding element, the holding projection of the holding element is designed in the holding position to press a properly placed substrate against the support area, in particular through a combination of the dimensions of the holding projection, the compressive force of the sliding spring, and the position on the substrate. The holding projection is therefore dimensioned accordingly and designed to extend as centrally as possible with respect to the surface of the substrate in the holding position in order to lock the substrate. Preferably, however, the substrate is pressed against the support area or held by the holding device by a plurality of holding elements combined to form a holding system. In this case, for example, two, eight, seven, thirteen, fourteen, or twenty or more holding elements hold a properly placed substrate.The holding elements are positioned accordingly to press the substrate against the support area at suitable points on the surface, preferably at the edge of the substrate, in their respective holding positions. The holding elements can be automatically moved from the starting position to the holding position simultaneously or sequentially by the drive elements.

[0061] A holding device in which a substrate is held by several holding elements has the advantage, compared to a holding device that holds the substrate by a few holding elements or only one holding element, that the individual holding projections of the holding elements can be dimensioned smaller and can be arranged laterally at the edge of the substrate, whereby the substrate is better accessible for a manufacturing or process step.

[0062] According to the invention, an arrangement device for holding and connecting at least two substrates comprises at least one holding device which is intended to hold a substrate, preferably with an electronic component arranged thereon, and a further holding device which is intended to hold a further substrate, wherein the holding device and the further holding device can be arranged with their front sides in a specific spatial relationship which is suitable for connecting the respective substrates to one another.

[0063] Preferably, the substrate of one holding device is a substrate with an electronic component of a power module arranged thereon, and the substrate of the further holding device is a substrate which is intended to serve as a carrier for the substrate with the component or power module of the one holding device.

[0064] Both holding devices can be arranged with their respective front sides facing each other in a spatial relationship that is ideal for soldering the substrates together. However, the two substrates can also be glued or plugged together as needed. Particularly when combining both substrates to form an electronic module, the holding elements of one or both holding devices can be automatically actuated via the back side. After the substrates are combined, the holding elements are moved to their original position and the electronic module is released.

[0065] The holding devices are preferably adapted in their design to the respective substrate, so that the arrangement is particularly suitable for the repeated or continuous production of the same electronic module.

[0066] By combining the mechanics of the drive element, the sliding spring, and a cam, the substrates can be loaded, secured, and connected automatically using conventional methods such as loading the holding devices with the substrates and actuating the adjustment mechanism. This is an advantage, especially when used on a production line for series production, which leads to errors caused by manual processes and cost savings through automation.

[0067] Furthermore, in the arrangement device, the one holding device and / or the further holding device preferably has at least one spacer element and at least one joining element, wherein the joining element is designed to be inserted into a joining recess of the opposite holding device, and the spacer element is designed to abut on the opposite holding device, so that both holding devices can be arranged in a predefined spatial arrangement and in particular a predefined distance.

[0068] The merging element of the holding device in the arranging device is a portion extending from the front of one holding device, which is dimensioned to be inserted into a merging recess of the further holding device in such a way as to provide a predefined arrangement in a direction parallel to the front of the holding devices.

[0069] A spacer element is a section extending from the front of one holding device, which is designed to provide a predefined distance between the one and the further holding device by abutting against a section of the further holding device or a spacer element of the further holding device.

[0070] The at least one spacer element, the merging element and the merging recess are preferably arranged at positions on the front side of the holding device laterally to the support area.

[0071] The holding devices of the arrangement device are designed such that their position and distance from one another are defined by their design and taking into account the electronic module to be manufactured.

[0072] In particular, such an arrangement device is suitable for two substrates that can be combined to form an electronic module, since these can be connected to each other at a defined distance with the smallest possible height tolerance.

[0073] According to the invention, a soldering tool is formed by an arranging device.

[0074] In particular, the arrangement device is suitable as a soldering tool, wherein a solder is provided on one or both substrates or components at positions which are intended to be connected, in particular electronically, to the other substrate, and the soldering tool, holding the substrates, is introduced into a soldering furnace in order to connect the substrates by a soldering process.

[0075] Preferred embodiments of the invention are explained below by way of example with reference to the figures.

[0076] They show:

[0077] Figure 1 shows a representation of a holding device 1 according to the invention with a substrate 2 placed on it as intended, wherein some of the holding elements 4 are adjusted to the holding position and some of the holding elements 4 are adjusted to the starting position.

[0078] Figure 2 shows a representation of a further holding device 11 according to the invention with a substrate 21 placed as intended as a carrier for the substrate 2, wherein some of the holding elements 4 are adjusted to the holding position and some of the holding elements 4 are adjusted to the starting position.

[0079] Figure 3 is an enlarged view of a drive element 7 according to the invention, which engages in a gear-like manner in an offset section 4a of a holding element 4.

[0080] Figure 4 is an enlarged view of a holding element 4 according to the invention in the starting position, wherein the guide 6 in the holding device 1 is provided with a cam 6a which is received by cam recesses 4d of the holding element 4 and a sliding spring 5 is provided on the offset section 4c which pretensions it in the holding direction.

[0081] Fig. 1 is a plan view of the front side 3 of a holding device 1 according to the invention, depicting an embodiment of the holding device 1 according to the invention, which has been equipped as intended with a substrate 2 with an electronic component (not shown) or a power module or DSC power module. Without limiting the embodiment thereto, in Fig. 1, an x-direction and a y-direction describe the longitudinal directions of the holding device, and a z-direction describes the transverse direction of the substrate, wherein the z-direction is defined orthogonally to the xy-plane in the direction of the plan view.

[0082] The holding device 1 is formed, among other things, by an upper plate 1a and a lower plate 1b, wherein the upper plate 1a has a front side 3 with a support area 3a, and the substrate 2 rests on the support area 3a. The holding device 1 has a plurality of holding elements 4 and the adjustment mechanism with drive elements 7, as well as spacer elements 8 and merging recesses 9. In the plan view, the upper plate 1a with the substrate 2 faces the viewer in the negative z-direction, with the lower plate 1b arranged below it.

[0083] The substrate 2 can be held by the plurality of holding elements 4. In Fig. 1, the holding elements 4 are particularly recognizable by their respective holding sections 4a with holding projections 4b, which protrude through holding recesses of the upper plate 1a and are arranged on the front side 3 of the holding device 1.

[0084] The offset sections 4c of the holding elements 4 are accommodated in a translationally displaceable manner in guides 6 which extend between the upper plate 1a and the lower plate 1b. In the view of Fig. 1, these extend between the upper plate 1a and the lower plate 1b and are only partially visible. The holding elements 4 are arranged at positions lateral to an edge of the substrate so that they can be translationally displaced or moved in a direction of displacement toward or away from the substrate. The direction of displacement describes a direction in the xy plane and preferably a positive or negative x- or y-direction.

[0085] In particular, the holding elements 4 arranged on the left in Fig. 1 are shown in the holding position, wherein they are in contact with the holding projections 4b on the substrate 2. Accordingly, they can be adjusted to the starting position by the respective drive element 7, counter to the x-direction.

[0086] In contrast, for example, the holding elements 4 on the right in Fig. 1 are not in contact with the substrate 2 and are arranged next to the substrate 2 in their respective starting positions. Accordingly, they can be adjusted to the holding position in the x-direction by the respective drive element 7.

[0087] The drive elements 7 of the adjustment mechanism of the holding device have screw drives, which are designed as hexagon drives and can be operated, in particular, mechanically or automatically. Figure 1 shows two drive elements 7 as an example, whereby each holding element 4 can preferably be adjusted via an associated drive element 7. However, several holding elements 4 can also be adjusted via a single drive element 7.

[0088] The drive elements 7 are arranged at positions lateral to the displacement sections 4c of the holding element 4, which are accommodated by the guides 6. Via the hexagon drives, the respective holding element 4 can be adjusted by rotation via the adjustment mechanism, in particular mechanically precisely, between the starting position and the holding position in the respective displacement direction, which in this illustration corresponds to the positive or negative x or y direction depending on the holding element. The drive elements 7 also have screw drives on the rear of the holding device, which is not visible in Fig. 1. This means that the drive elements 7 and equally the adjustment mechanism are similarly accessible from the rear of the device as from the front 3 and can therefore be actuated. The adjustment mechanism can be seen in particular in Fig. 3 and is described below using Fig. 3.

[0089] Fig. 3 is an enlarged sectional view of a holding element 4 of the holding device 1, wherein the sectional plane in the xy plane parallel to the surface of the holding device 1 is selected such that the upper plate is not shown. Accordingly, in particular the offset section 3a and the drive element 7 can be seen.

[0090] The drive element 7 has a gear-like section that engages a grooved section of the displacement section 4c, so that the displacement section 4c is translationally displaced upon rotation of the drive element 7, specifically linearly translationally following the guide 6 in the displacement direction, which in this case runs in the negative x-direction. Accordingly, the entire holding element 4 can be moved translationally by rotating the screw drive of the drive element 7 clockwise, and the holding section 4a can be adjusted or shifted into the holding position such that the holding projection 4b would rest on the substrate 2.

[0091] By rotating the screw drive counterclockwise, the holding element 4 can be returned from the holding position to its initial position, in which the holding projection 4b does not rest on the substrate 2 and there is no frictional connection between the holding element 4 and the substrate 2. In this embodiment, the holding projection 4b is rounded on the side facing the substrate in order to prevent, as far as possible, any jamming with the surface of the substrate 2.

[0092] Fig. 4 shows a sectional view of the holding device 1, wherein the sectional plane in the xz plane is selected such that the guide 6 and the offset section 4c of the holding element 4 are clearly shown, wherein these interact in a cam structure. The holding element 4 in Fig. 4, in this specific example, has two holding sections 4a with respective holding projections 4b and the offset section 4c. The offset section 4c of the holding element 4 is guided in the offset direction in the negative x-direction by the guide 6. The guide 6 is provided by a bearing groove of the upper plate 1a and a bearing groove of the lower plate 1b, wherein a receiving space is provided between the upper plate 1a and the offset section 4c.The offset section 4c is pressed in the holding direction in the negative z-direction toward the lower plate 1b by a sliding spring 5, which is provided on the offset section 4c in the receiving space between the upper plate 1a and the offset section 4c. The sliding spring 5 is configured such that it enables the offset section 4c to slide during translational displacement on the guide 6 and continuously presses the offset section 4c in the holding direction.

[0093] In the guide on the section of the lower plate 1b, a wave-shaped cam 6a is provided, which is formed in the positive z-direction opposite to the holding direction. In this case, on the lower side of the offset section 4c in Fig. 4 or the side of the offset section 4c facing the cam 6a in the z-direction, two cam recesses 4d are provided, the shape of which is matched to the cam 6a. The holding element 4 is in its starting position in Fig. 4, wherein in Fig. 4 the right-hand cam recess 4e receives the cam, whereby the offset section 4c is positively mounted in the guide. The cam recesses 4d, in cooperation with the cam 6a, define the starting position and the holding position of the offset section 4c, in each of which the cam 6a is received by one of the cam recesses 4d.In the starting position, as mentioned above, the holding sections 4a with holding projections 4b are located next to the substrate and thus the cam 6a is in the right cam recess 4e in Fig. 4 which is closer to the substrate 2.

[0094] Through the provided receiving space between the offset section 4c and the upper plate 1a, the offset section 4c can be raised in the positive z-direction by the cam structure or the cam 6a against the spring force of the sliding spring 5. When the holding element 4 is translationally displaced to the right in the offset direction or negative x-direction in Fig. 4 by rotating the drive element 7, thereby displacing the offset section 4c from the starting position to the holding position, the offset section 4c is raised to overcome the cam 6a, which is received by the right-hand cam recess 4d.Accordingly, when the holding element 4 is moved from the starting position to the holding position, the holding element is raised in a wave-like manner in the positive z-direction, following the curved path of the cam 6a, counter to the holding direction of the holding device 1, and is lowered again when the left-hand cam recess 4d, which defines the holding position, reaches and receives the cam. Fig. 4 therefore describes how, during a translational displacement in Fig. 4 to the right by actuating the screw drive of the drive element 7 from the starting position to the holding position, the holding element 4 or the holding section 4a with the holding projection 4b is briefly lifted by the cam structure before reaching the edge of the substrate 2, or is lifted over the edge of the substrate and is placed on the substrate 2 or a surface of the substrate 2 with the respective holding projection 4b. By the spring force of the sliding spring 5, which moves the displacement section 4c of the holding element 4 in the holding direction orpre-tensioned, the holding projection 4b is pressed onto the surface of the substrate 2 and, in cooperation with the support area 3a, forms a force connection.

[0095] By lifting the holding element 4, it is achieved that the holding projection 4b is not pushed directly onto the substrate 2, which could possibly cause scratches or lead to damage to the surface of the substrate 2, but the holding projection 4b is placed on the substrate 2 in a circular movement.

[0096] The illustration of a further embodiment of a holding device 11 according to the invention in Fig. 2 with a substrate 21 placed thereon, which is a carrier for the substrate 2 with electronic component or power module, can be understood in an analogous manner to Fig. 1. The substrate 21 can also be held by a plurality of holding elements 4 via a frictional connection. In this case, the positioning of the holding elements 4 is adapted to the shape of the substrate 21 compared to the first holding device 1. The holding elements 4 are generally designed to be translationally displaceable by the screw drives of the drive elements 7 of the adjustment mechanism, analogous to the one holding device 1.

[0097] In particular, both holding devices 1, 11 can be used in a mechanical or automatic manner and can hold the respective substrate 2, 21 for a transport, cleaning and preferably a manufacturing or process step.

[0098] The two holding devices 1, 11 can be combined according to the invention to form an arrangement device, as described above. For this purpose, joining elements 91 are provided on the further holding device 11, and joining recesses 9 are provided on the one holding device 1, as mentioned above. Furthermore, spacer elements 8 are provided on the one holding device 1. To combine the two holding devices 1, 11 to form an arrangement device, they are placed on top of one another or plugged together, as described above, with the joining elements 91 being inserted into the joining recesses 9.

[0099] Both holding devices 1, 11 or both substrates 2, 21 are thus aligned in a defined position and at a defined distance from one another by the guide and the spacer elements 8. The two holding devices 1, 11 can also be connected to one another, particularly mechanically.

[0100] One or both substrates 2, 21 can be coated with a solder at the positions of the substrates 2, 21 to be connected, in particular electronically, after which the substrates 2, 21 can be connected to one another to form an electronic module in the arrangement device or in the soldering tool, introduced into a soldering furnace, which is not shown.

[0101] The electronic module can be released by adjusting the respective holding elements 4 via the respective back sides of the holding devices 1, 11 into the respective starting position.

[0102] However, the holding device 1 according to the invention, the arrangement device according to the invention, and the soldering tool are also suitable for other substrates 2, 21 or plate-like workpieces, in particular if they are to be connected to one another in a predefined position and at a predefined distance. Furthermore, the arrangement device and the soldering tool can be used in particular in the series production of substrates 2, 21 to form an electronic module, preferably a DSC power module or IGBT power module.

[0103] The features of the invention disclosed in the above description, in the figures, and in the claims may be essential for the realization of the invention, both individually and in any combination. List of reference symbols

[0104] 1 , 11 Holding device

[0105] 1a Upper plate

[0106] 1b Lower plate

[0107] 2, 21 Substrat

[0108] 3 Front

[0109] 3a Support area

[0110] 4 Holding element

[0111] 4a holding section

[0112] 4b Holding projection

[0113] 4c Offset section

[0114] 4d cam recesses

[0115] 5 sliding spring

[0116] 6 Guide

[0117] 6a cam

[0118] 7 Drive element

[0119] 8 spacer element

[0120] 9 Merging recess

[0121] 91 Merge element

Claims

Patent claims 1. Holding device (1) for holding a substrate (2), comprising: a support area (3a) on a front side (3) of the holding device (1), onto which the substrate (2) is placed as intended, and at least one adjustable holding element (4) which can be adjusted by an automatically actuated adjusting mechanism in such a way that when the substrate (2) is placed as intended onto the support area (3a), it is held at least in a form-fitting manner on the support area (3a).

2. Holding device (1) according to claim 1, wherein the holding device (1) has a rear side facing away from the front side (3), wherein the adjusting mechanism can be actuated from the front side (3) and from the rear side of the holding device (1).

3. Holding device (1) according to claim 2, wherein the adjusting mechanism has at least one drive element (7), and the at least one holding element (4) can be adjusted translationally and / or rotationally into a starting position and into a holding position by the drive element (7).

4. Holding device (1) according to claim 3, wherein the holding device has a plurality of holding elements (4), wherein at least one of the plurality of holding elements (4) has a displacement section (4c), via which it is guided in a guide (6) of the holding device (1) in a displacement direction towards the substrate, wherein the holding element (4) is translationally displaceable by the at least one drive element (7), wherein the drive element (7) interacts with the displacement section (4c) in a gear-like manner 5. Holding device (1) according to claim 4, wherein the at least one of the holding elements (4) has at least one holding section (4a) with a holding projection (4b) and the holding section (4a) can be displaced into the holding position in such a way that the holding projection (4b) of the holding section (4a) extends over the substrate (2) at least partially in the displacement direction and bears against the substrate in such a way that the substrate (2) is The retaining projection (4b) is pressed force-fittingly onto the support area (3a) in a retaining direction.

6. Holding device (1) according to claim 5, wherein the guide (6) runs within the holding device (1) between the front side (3) and the back side, wherein the holding element (4) received in the guide (6) by the offset section (4c) with the at least one holding section (4a) with holding projection (4b) protrudes through a holding recess through the front side, and wherein the drive element (7) can be driven by a drive recess on the front side (3) and on the back side.

7. Holding device (1) according to claim 6, wherein the guide (6) and the offset section (4c) interact via a spring such that the at least one of the holding elements (4) is pretensioned in the holding direction, and the holding element (4) can be resiliently lifted against the holding direction.

8. Holding device (1) according to claim 7, wherein the spring is a sliding spring (5) provided on the displacement section (4c), the sliding spring (5) enabling a sliding translational displacement of the displacement section (4c) in the guide (6) and prestressing the displacement section (4c) in the holding direction.

9. Holding device (1) according to claim 8, wherein the at least one of the holding elements (4) interacts with the guide (6) by means of a cam structure in such a way that when the holding element (4) is moved between the starting position and the holding position, the holding element (4) is raised in a preferably wave-like movement against the spring force of the sliding spring (5), and when the holding element (4) is moved from the starting position to the holding position, the holding element (4) is raised in a preferably wave-like resilient manner in such a way that the holding projection (4b) is raised above the edge of the substrate (2) before reaching the substrate (2) and is deposited on the substrate (2) upon reaching the holding position, and the prestressing of the holding element (4) contributes to the frictional connection between the holding projection (4b) and the substrate (2).

10. Holding device (1) according to claim 9, wherein when the substrate (2) is placed on it as intended, the substrate (2) is pressed against the support area (3a) in a force-fitting manner in the holding direction by a plurality of holding elements (4) adjusted to the holding position in cooperation. 11 . Arrangement device for holding and connecting at least two substrates (2, 21), comprising at least one holding device (1) according to claims 2 to 10, which is intended to hold a substrate (2), preferably with an electronic component arranged thereon, and a further holding device (11) according to claims 2 to 10, which is intended to hold a further substrate (21), wherein the holding device (1) and the further holding device (11) can be arranged with their front sides in a specific spatial relationship which is suitable for connecting the respective substrates (2, 21) to one another.

12. Arrangement device according to claim 11, wherein the one holding device (1) and / or the further holding device (11) has at least one spacer element (8) and at least one merging element (91), wherein the merging element (91) is designed to be inserted into a merging recess (9) of the opposite holding device (1, 11), and the spacer element (8) is designed to abut on the opposite holding device (1), so that both holding devices (1, 11) can be arranged in a predefined spatial arrangement and in particular a predefined distance.

13. A soldering tool formed by an arranging device according to claim 11 and 12.

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