Printing device

Abstract

This printing device 100 includes: a squeegee 81; a mask fixing part 7; and a cleaning part 9 including a cleaning head 96 abutting on a lower surface of a mask Ma to clean the mask Ma, and a vertical direction moving part 97 that moves the cleaning head 96 in the vertical direction. When the cleaning head 96 is raised by the vertical moving part 97 and the cleaning head 96 is brought into contact with the lower surface of the mask Ma fixed to the mask fixing part 7, a mask pressing force Prm for pressing the mask Ma is adjusted to a predetermined pressure.

Description

printing device

[0001] The present invention relates to a printing device, and more particularly to a printing device equipped with a cleaning unit.

[0002] A printing device equipped with a cleaning unit is known in the art. Such a printing device is disclosed in, for example, Japanese Patent Application Laid-Open No. 2016-196101.

[0003] Japanese Patent Application Laid-Open No. 2016-196101 discloses a screen printing machine (printing machine) equipped with a cleaning device (cleaning unit). This screen printing machine includes a squeegee unit and a control unit.

[0004] The squeegee unit disclosed in JP 2016-196101 A includes a squeegee configured to slide over a screen mask in contact with a clamped substrate, thereby printing solder paste onto the substrate through pattern holes in the screen mask.

[0005] The cleaning device disclosed in JP 2016-196101 A is configured to remove solder paste adhering to the underside of a screen mask. The cleaning device includes a nozzle unit, a unit lifting mechanism, and a linear movement mechanism. The nozzle unit is configured to scrape off solder paste adhering to the underside of the screen mask and to suck up the scraped-off solder paste. The unit lifting mechanism includes a rod that can be extended and retracted in the vertical direction. The rod is connected to the nozzle unit. The linear movement mechanism is configured to linearly move the nozzle unit. The nozzle unit is raised and lowered by the rod to an upper end position and a lower end position. The upper end position and the lower end position of the rod are each fixed at a predetermined position.

[0006] The control unit in JP 2016-196101 A controls the rod to move the nozzle unit to an elevated end position and bring the nozzle unit into contact with the underside of the screen mask. The control unit controls the movement mechanism to move the nozzle unit linearly while the nozzle unit is in contact with the underside of the screen mask. At this time, the solder is scraped off by the linearly moving nozzle unit. The control unit controls the suction of the scraped solder paste. This controls the underside of the screen mask to be cleaned.

[0007] Japanese Patent Application Laid-Open No. 2016-196101

[0008] However, in the unit lifting mechanism disclosed in JP 2016-196101 A, the lift end position of the rod is fixed at a fixed position. Therefore, if the height position of the portion of the screen mask where the pattern holes are provided becomes higher than the lift end position due to differences in the type of screen mask (differences in the manufacturing method of the screen mask), a gap is formed between the nozzle unit and the underside of the screen mask, weakening the pressing force against the screen mask in some areas, preventing sufficient cleaning of the screen mask. Furthermore, if the height position of the portion of the screen mask where the pattern holes are provided becomes lower than the lift end position, the nozzle unit presses the screen mask with a pressing force greater than a predetermined pressing force, placing an excessive load on the screen mask. For these reasons, it is desirable to be able to sufficiently clean the screen mask by pressing the screen mask with a predetermined pressing force, regardless of differences in the height position of the screen mask due to differences in the type of screen mask, while avoiding placing an excessive load on the screen mask.

[0009] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a printing device that can sufficiently clean a mask regardless of differences in the height position of the mask, and that can prevent excessive load from being placed on the mask.

[0010] A printing device according to one aspect of the present invention comprises a cleaning unit including a squeegee that prints a coating material on a substrate while moving it on a mask, a mask fixing unit that fixes the mask, a cleaning head that contacts the underside of the mask to clean the mask, and a vertical movement unit that moves the cleaning head in an up and down direction, and is configured such that when the cleaning head is raised by the vertical movement unit and contacted with the underside of the mask fixed to the mask fixing unit, the mask pressing force that presses against the mask is adjusted to a predetermined pressure.

[0011] In one aspect of the present invention, the printing device is configured to adjust the mask pressing force to a predetermined pressure when the vertical movement unit raises the cleaning head and abuts the underside of the mask fixed to the mask fixing unit. This allows the cleaning head to be raised to a position where the predetermined mask pressing force and the reaction force based on the tension of the mask are balanced. Therefore, the cleaning head can press the mask with the predetermined pressure even when the height position of the mask is high or low due to differences in the type of mask (differences in the mask manufacturing method), etc. That is, even when the height position of the mask is high, the cleaning head can press the mask with the predetermined pressure, thereby ensuring sufficient cleaning of the mask. Furthermore, even when the height position of the mask is low, the cleaning head can press the mask with the predetermined pressure, thereby preventing excessive stress from being applied to the mask. These features allow the mask to be thoroughly cleaned regardless of the height position of the mask, without excessive stress being applied to the mask. Furthermore, even if the mask bends due to weakening of the mask tension caused by the cushioning material and adhesive contained in the mask due to aging of the mask, the mask can be pressed with a predetermined pressure, allowing the mask to be thoroughly cleaned.

[0012] In the printing apparatus according to the above aspect, the mask pressing force is preferably adjusted to a predetermined pressure that is set for each mask used depending on the type of substrate. With this configuration, the mask can be pressed with an appropriate mask pressing force, which makes it possible to prevent excessive load from being applied to the mask and to thoroughly clean the mask.

[0013] In the printing device according to the above aspect, the vertical movement unit is preferably configured to move the cleaning head upward until it presses the mask with a predetermined mask pressing force. With this configuration, even if the mask is used more frequently and the mask tension weakens, causing the mask to bend, the vertical movement unit can move the cleaning head upward to a position where it presses the mask with the predetermined mask pressing force. As a result, even if the mask tension weakens and the mask bends, the mask can still be pressed with the predetermined pressure, allowing the mask to be sufficiently cleaned.

[0014] In the printing device according to the above aspect, the vertical movement unit preferably includes an air cylinder that raises and lowers the cleaning head, and a regulator that adjusts the mask pressing force applied from the air cylinder to a predetermined pressure when cleaning the mask. While air cylinders generally only allow the cleaning head to move to a certain upper and lower end positions, by adjusting the mask pressing force to a predetermined pressure using the regulator, the cleaning head can be raised to a position where the predetermined mask pressing force and the reaction force based on the tension of the mask are balanced. As a result, even when an air cylinder is used, the mask can be pressed with the predetermined pressure whether the mask is at a high or low height.

[0015] In the printing device according to the above aspect, preferably, the vertical movement unit has a motor that generates a drive force for moving the cleaning head in each of the upward and downward directions, and further includes a control unit that controls the mask pressing force to be adjusted to a predetermined pressure by adjusting the drive force of the motor when cleaning the mask. With this configuration, even when a motor is used, the cleaning head can be raised to a position where the predetermined mask pressing force and the reaction force based on the tension of the mask are balanced, so that the mask can be pressed with the predetermined pressure both when the height position of the mask is high and when it is low.

[0016] In this case, the control unit is preferably configured to adjust the mask pressing force to a predetermined pressure by adjusting the driving force of the motor based on the value of the current for driving the motor when cleaning the mask. With this configuration, by controlling the mask pressing force to a predetermined pressure based on the value of the current for rotating the motor, it is possible to easily achieve control of the mask pressing force by the motor to be adjusted to a predetermined pressure.

[0017] In the printing device in which the vertical movement unit has a motor, the cleaning unit preferably further includes a load measurement unit for measuring the load when the cleaning head contacts the mask, and the control unit is configured to perform control to adjust the mask pressing force to a predetermined pressure by adjusting the driving force of the motor based on the measurement value of the load measurement unit. With this configuration, the load when the cleaning head contacts the mask can be directly obtained by the load measurement unit. As a result, the driving force of the motor can be adjusted using the directly obtained load, and the mask pressing force can be accurately adjusted to a predetermined pressure.

[0018] The printing device according to the above aspect preferably further includes a height measuring unit for measuring the height position of the upper surface of the mask fixed by the mask fixing unit. The display unit is configured to display at least one of information on the change in the height position of the upper surface of the mask and information notifying the user of the need to replace the mask, based on the height position of the upper surface of the mask measured by the height measuring unit during mask cleaning. In the case where the mask is bent due to aging, the mask is pressed with the same predetermined pressure during mask cleaning, and the height position of the mask raised by the cleaning head increases as the mask bends more. This allows the user to recognize the extent of aging (lifespan) of the mask from the height position of the upper surface of the mask measured by the height measuring unit. By checking the information on the change in the height position of the upper surface of the mask displayed on the display unit, the user can predict when to replace the mask. Furthermore, by visually checking the information notifying the user of the need to replace the mask displayed on the display unit, the user can easily recognize whether the mask needs to be replaced. These features facilitate the user's management of mask replacement.

[0019] The printing apparatus according to the above aspect preferably further includes a height measuring unit for measuring the height position of the upper surface of the mask fixed by the mask fixing unit. The speed at which the substrate is released from the mask after printing with the squeegee is set based on the height position of the upper surface of the mask measured by the height measuring unit when cleaning the mask. Here, as described above, if the mask warps due to aging, the position at which the predetermined mask pressing force and the reaction force based on the tension of the mask balance becomes higher than the height position of the mask immediately after use. In such a case, when the substrate is released from the mask after printing with the squeegee, the mask may vibrate due to the mask warping, causing solder on the substrate to adhere to the mask. Therefore, by measuring the height position of the upper surface of the mask when cleaning the mask using the height measuring unit, the extent of aging of the mask can be measured. Therefore, by releasing the substrate from the mask at a speed that matches the height position of the upper surface, vibration of the mask can be suppressed. As a result, solder on the substrate can be prevented from adhering to the mask, thereby suppressing the occurrence of solder printing defects on the substrate.

[0020] In the printing device according to the above aspect, the cleaning unit preferably further includes a swinging unit that swings the cleaning head up and down around the center position of the cleaning head. With this configuration, the swinging unit can swing the cleaning head in accordance with the up and down tilt of the mask, thereby enabling the cleaning head to come into even contact with the underside of the mask. As a result, the mask can be more thoroughly cleaned by the cleaning head.

[0021] The printing device according to the above aspect preferably further includes a linear movement mechanism for linearly moving the cleaning head, and is configured to adjust the mask pressing force to a predetermined pressure while the linear movement mechanism linearly moves the cleaning head in contact with the underside of the mask when cleaning the mask. Here, the edges of the mask are close to the portion of the mask where the mask frame is provided, so the mask reaction force is strong, but the center of the mask is relatively far from the portion of the mask frame, so the mask reaction force is weak. Therefore, by adjusting the mask pressing force to a predetermined pressure, the mask can be pressed with a predetermined pressure at both the edges and the center of the mask during linear movement, allowing the cleaning head to clean the entire mask evenly.

[0022] According to the present invention, as described above, the mask can be sufficiently cleaned regardless of the difference in height position of the mask, and an excessive load can be prevented from being applied to the mask.

[0023] 1 is a side view of a printing device of a first embodiment as seen from the substrate transport direction side. FIG. 2 is a plan view showing a printing device of a first embodiment. FIG. 3 is a side view of a printing device of a first embodiment as seen from the movement direction side of a cleaning unit. FIG. 4 is a block diagram showing the control relationship of a printing device of a first embodiment. FIG. 5 is a side view of a printing device of a first embodiment when the cleaning head is lowered. FIG. 6 is a side view of a printing device of a first embodiment during mask cleaning by the cleaning unit. FIG. 7 is a flowchart showing a mask cleaning method for a printing device of a first embodiment. FIG. 8 is a side view of a printing device of a second embodiment as seen from the movement direction side of the cleaning unit. FIG. 9 is a side view of a printing device of a second embodiment when the cleaning head is lowered. FIG. 10 is a side view of a printing device of a second embodiment during mask cleaning by the cleaning unit. FIG. 11 is a flowchart showing a mask cleaning method for a printing device of a second embodiment. FIG. 12 is a side view of a printing device of a third embodiment as seen from the movement direction side of the cleaning unit. FIG. 13 is a side view of a printing device of a third embodiment when the cleaning head is lowered. FIG. 14 is a side view of a printing device of a third embodiment when the cleaning head is lowered. FIG. 15 is a side view of a printing device of a third embodiment during mask cleaning by the cleaning unit. FIG. 16 is a flowchart showing a mask cleaning method for a printing device of a third embodiment. FIG. 17 is a side view of a printing device of a third embodiment when the cleaning head is lowered. FIG. 18 is a side view of a printing device of a third embodiment during mask cleaning by the cleaning unit. FIG. 19 is a flowchart showing a mask cleaning method for a printing device of a third embodiment. FIG. 19 is a side view of a printing device of a fourth embodiment when seen from the movement direction side of the cleaning unit. 10 is a screen showing the relationship between the mask height and the number of times of printing of the mask, which is displayed on the display unit of the printing device of the fourth embodiment. FIG. 11 is a screen showing a message displayed on the display unit of the printing device of the fourth embodiment. FIG. 12 is a graph showing the relationship between the mask height and the plate separation speed of the substrate in the printing device of the fourth embodiment. FIG. 13 is a side view of the printing device of the fifth embodiment, as seen from the movement direction side of the cleaning unit.

[0024] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0025] 1 to 7, the configuration of a printing apparatus 100 according to a first embodiment of the present invention will be described. The printing apparatus 100 is configured to perform a printing process on the surface of a substrate Su using a metal portion Ma1 in which a predetermined pattern of openings is formed in a mask Ma. The mask Ma has a metal portion Ma1 and a mask frame Ma2. The mask frame Ma2 is a member to which the metal portion Ma1 is fixed by a mask fixing portion 7 described below during the printing process. The metal portion Ma1 and the mask frame Ma2 are connected at the periphery of the metal portion Ma1 via adhesive, cushioning material, or the like.

[0026] As shown in FIG. 1, the printing apparatus 100 includes a base 1, a substrate support unit 2, a pair of conveyors 3 (see FIG. 2), a linear movement mechanism 4, an imaging unit 5, a linear movement mechanism 6, a mask fixing unit 7, a squeegee unit 8, a cleaning unit 9, a control unit 10, a height measurement unit 11 (see FIG. 4), and a solder supply unit 12 (see FIG. 4).

[0027] Here, the conveying direction of the conveyor 3 is the X1 direction, the opposite direction of the X1 direction is the X2 direction, and the X1 and X2 directions together are the X direction. The horizontal direction perpendicular to the X direction is the Y direction. One of the Y directions is the Y1 direction, and the other is the Y2 direction. Furthermore, the up-down direction is the Z direction, with the upward direction being the Z1 direction and the downward direction being the Z2 direction.

[0028] A linear movement mechanism 4, a linear movement mechanism 6, and a squeegee unit 8 are installed on the base 1.

[0029] The substrate support unit 2 is configured to support the substrate Su using a plurality of backup pins 2a. The substrate support unit 2 includes a support plate 21, a linear movement mechanism 22 (see FIG. 4), a linear movement mechanism 23 (see FIG. 4), a rotation mechanism 24 (see FIG. 4), a lifting mechanism 25, and a support plate lifting mechanism 26. The support plate 21 is a member to which a pair of conveyors 3 or the like is attached. The linear movement mechanism 22 is configured to move the substrate Su in each of the X1 and X2 directions. The linear movement mechanism 23 is configured to move the substrate Su in each of the Y1 and Y2 directions. The rotation mechanism 24 is configured to rotate the substrate Su around a rotation center axis extending in the Z direction. The lifting mechanism 25 is configured to move the substrate Su in each of the Z1 and Z2 directions. The support plate lifting mechanism 26 is configured to move the support plate 21 in each of the Z1 and Z2 directions.

[0030] The pair of conveyors 3 is configured to transport the substrate Su in the X1 direction.

[0031] The linear movement mechanism 4 is configured to move the substrate support unit 2, the pair of conveyors 3, and the cleaning unit 9 integrally in each of the Y1 and Y2 directions. Specifically, the linear movement mechanism 4 has a base plate 41, a motor 42, a ball screw 43, and a guide rail 44 (see FIG. 3 ). The base plate 41 is attached to the ball screw 43 via a ball nut. The base plate 41 is attached to the guide rail 44. The guide rail 44 extends along the Y direction. The substrate support unit 2, to which the pair of conveyors 3 are attached, and the cleaning unit 9 are fixed to the base plate 41. As a result, the driving force of the motor 42 moves the base plate 41 in each of the Y1 and Y2 directions, thereby integrally moving the substrate support unit 2, the pair of conveyors 3, and the cleaning unit 9.

[0032] The imaging unit 5 has a linear movement mechanism 51, a substrate camera 52, and a mask camera 53. The linear movement mechanism 51 is configured to move the imaging unit 5 in either the X1 direction or the X2 direction. The substrate camera 52 is configured to capture an image of a position recognition mark on the substrate Su supported by the substrate support unit 2. The mask camera 53 is configured to capture an image of a position recognition mark on the mask Ma fixed by the mask fixing unit 7. The linear movement mechanism 6 is configured to move the imaging unit 5 in either the Y1 direction or the Y2 direction.

[0033] (Mask Fixing Unit) The mask fixing unit 7 is configured to fix the mask Ma at the working position when printing on the substrate Su. Specifically, the mask fixing unit 7 includes a pair of mask support units 71 and a plurality of mask pressing units 72. The pair of mask support units 71 are configured to support the mask frame Ma2 of the mask Ma from below. The plurality of mask pressing units 72 are configured to press the mask frame Ma2 of the mask Ma supported by the pair of mask support units 71 from above (see FIG. 2). This fixes the mask Ma.

[0034] (Squeegee Unit) The squeegee unit 8 is configured to reciprocate in the Y1 and Y2 directions to scrape and move the solder supplied onto the mask Ma by the solder supply unit 12 along the upper surface of the mask Ma. Specifically, the squeegee unit 8 includes a squeegee 81, a linear movement unit 82, a guide rail 83, a lifting / lowering unit 84, and a rotating unit 85. The squeegee 81 is configured to print the solder on the mask Ma onto the substrate Su while moving it. The linear movement unit 82 is configured to move the squeegee 81 in the Y1 and Y2 directions. The lifting / lowering unit 84 is configured to raise and lower the squeegee 81 in the Z1 and Z2 directions. The rotating unit 85 is configured to rotate the squeegee 81 around a rotation axis extending along the X direction. Note that solder is an example of a "coating material" in the claims.

[0035] 3, the cleaning unit 9 is configured to clean the mask Ma by removing solder that has adhered to the mask Ma during printing. Specifically, the cleaning unit 9 includes a first frame 91, a second frame 92, a third frame 93, a sheet supply unit 94 (see FIG. 4), a sheet recovery unit 95 (see FIG. 4), a cleaning head 96, a vertical movement unit 97, and a pair of guide units 98.

[0036] The first frame 91 is attached to the base plate 41. The second frame 92 is attached to the first frame 91. The third frame 93 is attached to the first frame 91.

[0037] The sheet supply unit 94 holds unused cleaning sheets in a rolled state. The sheet collection unit 95 is configured to take up used cleaning sheets. When the used cleaning sheet is taken up by the sheet collection unit 95, the cleaning sheet passes from the sheet supply unit 94 through multiple guide rollers, covering the top surface of the cleaning head 96, and is then guided to the sheet collection unit 95. The cleaning sheet is made of, for example, a cloth material.

[0038] The cleaning head 96 is a member that comes into contact with the underside of the mask Ma to clean the mask Ma. The cleaning head 96 has suction holes 96a that communicate with a suction unit 101 (see FIG. 3). Negative pressure is supplied to the suction holes 96a from the suction unit 101. This allows the cleaning head 96 to suck the solder that has been wiped off by the cleaning sheet and adsorb it onto the cleaning sheet.

[0039] <Air Cylinder> The vertical movement unit 97 is configured to raise and lower the cleaning head 96. The vertical movement unit 97 has an air cylinder 97a and a regulator 97b.

[0040] The air cylinder 97a has a rod 971a and a cylinder 972a. The rod 971a is configured to protrude from the cylinder 972a toward an uppermost position Up (see FIG. 6) on the Z1 side. The rod 971a is configured to move to a lowermost position on the Z2 side and be accommodated in the cylinder 972a. The Z2 side end of the cleaning head 96 is attached to the Z1 side end of the rod 971a. The rod 971a is attached to the cleaning head 96 in a state where it is inserted into an insertion hole (not shown) provided in the third frame 93.

[0041] The Z2-side end of the cylinder 972a is attached to the second frame 92. The Z1-side end of the cylinder 972a is attached to the third frame 93. The cylinder 972a has a first chamber (not shown) and a second chamber (not shown) in its internal space. The first chamber is a space provided on the Z2-side. A first air pressure is supplied to the first chamber to cause the rod 971a to protrude in the Z1 direction and to prevent the rod 971a from protruding in the Z2 direction. A first air pressure supply path Ar1 is connected to the first chamber. The second chamber is a space provided on the Z1-side of the first chamber. A second air pressure is supplied to the second chamber to prevent the rod 971a from protruding in the Z1 direction and to return the rod 971a in the Z2 direction. A second air pressure supply path Ar2 is connected to the second chamber.

[0042] The regulator 97b is configured to adjust the pressure (rising pressure) applied to the cleaning head 96 from the air cylinder 97a when raising the cleaning head 96. The regulator 97b is also configured to adjust the pressure (lowering pressure) applied to the cleaning head 96 from the air cylinder 97a when lowering the cleaning head 96 (see FIG. 5).

[0043] Specifically, as shown in FIG. 3 , the regulator 97b is attached to the second air pressure supply path Ar2. The regulator 97b is configured to adjust the second air pressure of the air supplied from the second air pressure supply path Ar2 to the cylinder 972a. Thus, the regulator 97b supplies air at the second air pressure to the cylinder 972a through the second air pressure supply path Ar2 in response to air at the first air pressure supplied from the first air pressure supply path Ar1, thereby adjusting the upward pressure and downward pressure applied to the cleaning head 96. When adjusting the upward pressure, the second air pressure is smaller than the first air pressure. When adjusting the downward pressure, the second air pressure is greater than the first air pressure (see FIG. 5 ).

[0044] The cleaning of the mask Ma by the cleaning unit 9 will be described in detail later.

[0045] (Guide Portions) The pair of guide portions 98 are configured to guide the movement of the cleaning head 96, which is raised and lowered by the air cylinder 97 a. One of the pair of guide portions 98 is attached to the Y1 direction side of the third frame 93. The other of the pair of guide portions 98 is attached to the Y2 direction side of the third frame 93.

[0046] 4 , the control unit 10 controls each of the board support unit 2, the pair of conveyors 3, the linear movement mechanism 4, the imaging unit 5, the linear movement mechanism 6, the mask fixing unit 7, the squeegee unit 8, the cleaning unit 9, and the solder supply unit 12 in the printing apparatus 100. The control unit 10 controls the suction unit 101. The control unit 10 includes a CPU (Central Processing Unit), a storage unit such as an SSD (Solid State Drive) or an HDD (Hard Disk Drive), and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0047] (Height Measuring Unit) The height measuring unit 11 is configured to measure the height position of the solder on the substrate Su supported by the substrate supporting unit 2. The solder supplying unit 12 has a syringe or the like that supplies solder onto the mask Ma.

[0048] 6, in the printing device 100, the cleaning unit 9 cleans the underside of the metal portion Ma1 of the mask Ma at a predetermined timing. When cleaning the mask Ma, the cleaning head 96 presses the mask Ma from the Z2 direction side. Here, the printing device 100 of the first embodiment is configured so that the mask pressing force Prm of the cleaning head 96, which presses the mask Ma fixed to the mask fixing unit 7 from the Z2 direction side, becomes a predetermined pressure.

[0049] Specifically, the air cylinder 97a is configured to adjust the mask pressing force Prm that presses against the metal part Ma1 of the mask Ma to a predetermined pressure when the cleaning head 96 is raised and brought into contact with the underside of the metal part Ma1 of the mask Ma fixed to the mask fixing part 7.

[0050] The mask pressing force Prm is a combined force of the above-described upward pressure applied to the cleaning head 96 from the air cylinder 97a and the force of gravity on the cleaning head 96. The mask pressing force Prm is adjusted by the regulator 97b to a predetermined pressure applied to the cleaning head 96 from the air cylinder 97a when cleaning the mask Ma. That is, the mask pressing force Prm is adjusted to a predetermined pressure by supplying air at a second air pressure, adjusted by the regulator 97b, from the second air pressure supply path Ar2 to the cylinder 972a in response to air at a first air pressure supplied from the first air pressure supply path Ar1. The mask pressing force Prm is adjusted to a predetermined pressure by a constant pressure in the Z1 direction applied to the rod 971a by the first air pressure and a constant pressure in the Z2 direction applied to the rod 971a by the second air pressure adjusted by the regulator 97b.

[0051] The mask pressing force Prm is configured to be adjusted to a predetermined pressure that is set for each mask Ma used according to the type of substrate Su. That is, since the second air pressure can be adjusted by changing the set pressure of the regulator 97b, the mask pressing force Prm is set in advance for each mask Ma by changing the set pressure of the regulator 97b. Specifically, the set pressure of the regulator 97b is changed based on a signal from the control unit 10 before cleaning by the cleaning unit 9. Note that the set pressure of the regulator 97b may also be changed manually.

[0052] The air cylinder 97a is configured to raise (move in the Z1 direction) the cleaning head 96 until it presses against the mask Ma with a predetermined mask pressing force Prm. Specifically, the upper end position Up of the rod 971a of the air cylinder 97a is set so that the upper end position Up of the cleaning head 96 is higher than the height position of the support surface of the mask Ma of the mask support part 71. As a result, when the cleaning head 96 is raised to the upper end position Up by the air cylinder 97a, it comes into contact with the mask Ma and rises to a height position where the reaction force based on the tension of the mask Ma and the predetermined mask pressing force Prm are balanced.

[0053] In the printing device 100, when cleaning the mask Ma, the cleaning head 96 is brought into contact with the underside of the metal portion Ma1 of the mask Ma, and the cleaning head 96 is linearly moved by the linear movement mechanism 4 while the mask pressing force Prm is adjusted to a predetermined pressure. That is, the mask pressing force Prm applied to the cleaning head 96 is maintained at the predetermined mask pressing force Prm by the regulator 97b. As a result, when cleaning the mask Ma, the raised cleaning head 96 maintains a state in which it presses the mask Ma with the predetermined mask pressing force Prm, and the cleaning head 96 cleans the mask Ma while moving in both the Y1 direction and the Y2 direction by the linear movement mechanism 4.

[0054] When the linear movement mechanism 4 moves the metal portion Ma1 in the Y1 direction and the Y2 direction, the Y1-side end and the Y2-side end of the metal portion Ma1 are close to the connection between the metal portion Ma1 and the mask frame Ma2, and therefore the reaction force of the mask Ma from the mask frame Ma2 is relatively strong. As a result, the cleaning head 96 does not need to rise very high to balance the reaction force of the mask Ma with the predetermined mask pressing force Prm. Furthermore, the central portion of the metal portion Ma1 in the Y direction is far from the connection between the metal portion Ma1 and the mask frame Ma2, and therefore the reaction force of the mask Ma from the mask frame Ma2 is relatively weak. As a result, the cleaning head 96 rises higher than at the ends, and therefore balances the reaction force of the mask Ma with the predetermined mask pressing force Prm. Note that the above-mentioned relationship between the reaction force of the mask Ma and the predetermined mask pressing force Prm is merely an example.

[0055] The cleaning of the mask Ma described above is controlled by the control unit 10 as follows.

[0056] That is, when cleaning the mask Ma, the control unit 10 controls the mask fixing unit 7 to fix the mask Ma at the work position. The control unit 10 controls the set pressure of the regulator 97b to be set to a set pressure for each mask Ma. After setting the set pressure of the regulator 97b, the control unit 10 controls the linear movement mechanism 4 to move the cleaning head 96 to a cleaning start position in the horizontal direction. The cleaning start position in the horizontal direction is, for example, the Z2 position of the end of the metal portion Ma1 of the mask Ma at the work position on the Y2 side.

[0057] After moving the cleaning head 96 to the cleaning start position, the control unit 10 controls the supply of air at a first air pressure from the first air pressure supply path Ar1 to the air cylinder 97a and the supply of air at a second air pressure from the second air pressure supply path Ar2 to the air cylinder 97a. This causes the cleaning head 96 to rise together with the rod 971a. This allows the cleaning head 96 to reach the cleaning start position. After supplying air at the first air pressure and air at the second air pressure to the air cylinder 97a, the control unit 10 controls the movement of the cleaning head 96 in both the Y1 direction and the Y2 direction using the linear movement mechanism 4 while wiping with the cleaning sheet and suctioning the solder. After cleaning is completed, the control unit 10 adjusts the downward pressure to house the rod 971a in the cylinder 972a, thereby lowering the cleaning head 96.

[0058] (Mask Cleaning Method) Here, a mask cleaning method performed in the control unit 10 will be described with reference to FIG.

[0059] In step S1, when cleaning the mask Ma, the cleaning unit 9 is moved by the linear movement mechanism 4 to a cleaning start position in the horizontal direction. In step S2, the set pressure of the regulator 97b is set to a set pressure that is set for each mask Ma. In step S3, air at a first air pressure is supplied to the air cylinder 97a from the first air pressure supply path Ar1, and air at a second air pressure is supplied to the air cylinder 97a from the second air pressure supply path Ar2, thereby lifting the cleaning head 96 together with the rod 971a. This causes the cleaning head 96 to reach the cleaning start position.

[0060] In step S4, the cleaning head 96 presses the mask Ma with a predetermined mask pressing force Prm, and while wiping with a cleaning sheet and suctioning the solder, the cleaning head 96 is moved in both the Y1 direction and the Y2 direction by the linear movement mechanism 4. This cleans the mask Ma. In step S5, upon completion of cleaning, the cleaning head 96 is lowered together with the rod 971a by the adjusted downward pressure, and the mask cleaning method is then terminated.

[0061] (Effects of First Embodiment) In the first embodiment, the following effects can be obtained.

[0062] In the first embodiment, as described above, the printing device 100 is configured to adjust the mask pressing force Prm, which presses the mask Ma, to a predetermined pressure when the vertical movement unit 97 raises the cleaning head 96 and brings the cleaning head 96 into contact with the underside of the mask Ma fixed to the mask fixing unit 7. This allows the cleaning head 96 to be raised to a position where the predetermined mask pressing force Prm and the reaction force based on the tension of the mask Ma are balanced. Therefore, the cleaning head 96 can press the mask Ma with the predetermined pressure both when the height position of the mask Ma is high and when the height position of the mask Ma is low due to differences in the type of mask Ma (differences in the manufacturing method of the mask Ma), etc. That is, even when the height position of the mask Ma is high, the cleaning head 96 can press the mask Ma with the predetermined pressure, allowing the mask Ma to be sufficiently cleaned. Furthermore, even when the height position of the mask Ma is low, the cleaning head 96 can press the mask Ma with the predetermined pressure, preventing excessive load from being applied to the mask Ma. As a result, the mask Ma can be sufficiently cleaned regardless of differences in the height position of the mask Ma, and excessive loads can be prevented from being applied to the mask Ma. Furthermore, even if the mask Ma bends due to weakening of the mask tension caused by the buffer material, adhesive, and the like contained in the mask Ma due to aging of the mask Ma, the mask Ma can be pressed with a predetermined pressure, and therefore the mask Ma can be sufficiently cleaned.

[0063] Furthermore, in the first embodiment, as described above, the mask pressing force Prm is configured to be adjusted to a predetermined pressure that is set for each mask Ma used in accordance with the type of substrate Su. This allows the mask Ma to be pressed with an appropriate mask pressing force Prm, which prevents excessive load from being applied to the mask Ma and allows the mask Ma to be sufficiently cleaned.

[0064] Furthermore, in the first embodiment, as described above, the vertical movement unit 97 is configured to move the cleaning head 96 in the Z1 direction (upward) until it presses the mask Ma with a predetermined mask pressing force Prm. This allows the vertical movement unit 97 to move the cleaning head 96 upward to a position where it presses the mask Ma with the predetermined mask pressing force Prm, even if the mask Ma is used more frequently and the mask tension weakens, causing the mask Ma to bend. As a result, even if the mask tension weakens and the mask Ma bends, the mask Ma can still be pressed with the predetermined pressure, allowing the mask Ma to be sufficiently cleaned.

[0065] Furthermore, in the first embodiment, as described above, the vertical movement unit 97 includes an air cylinder 97a that raises and lowers the cleaning head 96, and a regulator 97b that adjusts the mask pressing force Prm applied from the air cylinder 97a to the cleaning head 96 when cleaning the mask Ma to a predetermined pressure. While an air cylinder can generally only move the cleaning head 96 to a certain upper and lower limit positions, by adjusting the mask pressing force Prm to a predetermined pressure using the regulator 97b, the cleaning head 96 can be raised to a position where the predetermined mask pressing force Prm and the reaction force of the mask Ma are balanced. As a result, even when the air cylinder 97a is used, the mask Ma can be pressed with a predetermined pressure both when the height position of the mask Ma is high and when the height position of the mask Ma is low.

[0066] Furthermore, in the first embodiment, as described above, the printing device 100 includes a linear movement mechanism 4 that linearly moves the cleaning head 96. When cleaning the mask Ma, the printing device 100 is configured to adjust the mask pressing force Prm to a predetermined pressure while linearly moving the cleaning head 96 using the linear movement mechanism 4 with the cleaning head 96 in contact with the underside of the mask Ma. Here, the edges of the mask Ma are close to the portion of the mask Ma where the mask frame Ma2 is provided, and therefore the reactive force of the mask Ma is strong. However, the central portion of the mask Ma is relatively far from the portion of the mask Ma where the mask frame Ma2 is provided, and therefore the reactive force of the mask Ma is weak. Therefore, by adjusting the mask pressing force Prm to a predetermined pressure, the mask Ma can be pressed with a predetermined pressure at both the edges and the central portion of the mask Ma during linear movement, allowing the cleaning head 96 to evenly clean the entire mask Ma.

[0067] 8 to 11, the configuration of a printing device 200 according to a second embodiment will be described. In the second embodiment, the mask pressing force Prm is adjusted to a predetermined pressure based on the current value of the motor 297a. Note that in the second embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0068] As shown in FIG. 8, the printing device 200 includes a base 1, a substrate support unit 2 (see FIG. 1), a pair of conveyors 3 (see FIG. 2), a linear movement mechanism 4, an imaging unit 5 (see FIG. 1), a linear movement mechanism 6 (see FIG. 1), a mask fixing unit 7, a squeegee unit 8 (see FIG. 1), a cleaning unit 209, and a control unit 210.

[0069] Here, the conveying direction of the conveyor 3 is the X1 direction, the opposite direction of the X1 direction is the X2 direction, and the X1 and X2 directions together are the X direction. The horizontal direction perpendicular to the X direction is the Y direction. One of the Y directions is the Y1 direction, and the other is the Y2 direction. Furthermore, the up-down direction is the Z direction, with the upward direction being the Z1 direction and the downward direction being the Z2 direction.

[0070] 8, the cleaning unit 209 is configured to clean the mask Ma by removing solder that has adhered to the mask Ma during printing. Specifically, the cleaning unit 209 includes a first frame 91, a second frame 292, a sheet supply unit 94 (see FIG. 4), a sheet recovery unit 95 (see FIG. 4), a cleaning head 96, a vertical movement unit 297, and a pair of guide units 98.

[0071] The first frame 91 is attached to the base plate 41. The second frame 292 is attached to the first frame 91. The cleaning head 96 is a member that comes into contact with the lower surface of the mask Ma to clean the mask Ma.

[0072] <Up-and-down direction moving unit> The up-and-down direction moving unit 297 is configured to move the cleaning head 96 in both the Z1 direction and the Z2 direction. The up-and-down direction moving unit 297 has a motor 297 a, a drive force transmission mechanism 297 b, and a ball screw 297 c. The motor 297 a and the ball screw 297 c are connected via the drive force transmission mechanism 297 b.

[0073] The motor 297a generates a driving force for moving the cleaning head 96 in each of the Z1 and Z2 directions. The driving force transmission mechanism 297b is configured to transmit the driving force of the motor 297a to a ball screw 297c. The driving force transmission mechanism 297b includes, for example, a pulley and a belt. The ball screw 297c is configured to move in each of the Z1 and Z2 directions by the driving force transmitted from the driving force transmission mechanism 297b. The ball screw 297c is connected to the cleaning head 96. The cleaning head 96 moves in the Z1 direction together with the ball screw 297c and also moves in the Z2 direction together with the ball screw 297c (see FIG. 9 ).

[0074] The cleaning of the mask Ma by the cleaning unit 209 will be described in detail later.

[0075] (Control Unit) The control unit 210 includes a CPU, a storage unit such as an SSD or HDD, and memories such as a ROM and a RAM. The control unit 210 controls the linear movement mechanism 4 and the motor 297a of the printing device 200.

[0076] (Mask Cleaning) As shown in FIG. 10 , in the printing device 200, the cleaning unit 209 cleans the underside of the metal portion Ma1 of the mask Ma at a predetermined timing. When cleaning the mask Ma, the cleaning head 96 presses the mask Ma from the Z2 direction. Here, the printing device 200 of the second embodiment is configured so that the mask pressing force Prm of the cleaning head 96, which presses the mask Ma fixed to the mask fixing unit 7 from the Z2 direction, is a predetermined pressure. In other words, when the control unit 210 raises the cleaning head 96 and brings the cleaning head 96 into contact with the underside of the metal portion Ma1 of the mask Ma fixed to the mask fixing unit 7, the control unit 210 controls the mask pressing force Prm, which presses the metal portion Ma1 of the mask Ma, to be adjusted to the predetermined pressure.

[0077] Specifically, when cleaning the mask Ma, the control unit 210 adjusts the driving force of the motor 297 a to adjust the mask pressing force Prm to a predetermined pressure. When cleaning the mask Ma, the control unit 210 adjusts the driving force of the motor 297 a based on the current value that drives the motor 297 a to adjust the mask pressing force Prm to a predetermined pressure.

[0078] Here, the current value of the motor 297a increases as the load on the motor 297a increases, and decreases as the load on the motor 297a decreases. Therefore, since the current value of the motor 297a changes depending on the reaction force (load) based on the tension received from the mask Ma when the cleaning head 96 is pressed against the mask Ma, the mask pressing force Prm is adjusted to the predetermined pressure by adjusting the current value of the motor 297a to a predetermined current value corresponding to the predetermined pressure.

[0079] As a result, when cleaning the mask Ma, the control unit 210 controls the mask pressing force Prm to be adjusted to a predetermined pressure by adjusting the current value to a predetermined current value based on the current value driving the motor 297a and the predetermined current value.

[0080] The mask pressing force Prm is configured to be adjusted to a predetermined pressure set for each mask Ma used depending on the type of substrate Su. That is, the mask pressing force Prm is set for each mask Ma by changing the predetermined current value. The predetermined current value is changed before cleaning by the cleaning unit 209.

[0081] The control unit 210 also controls the cleaning head 96 to rise (move in the Z1 direction) until it presses against the mask Ma with a predetermined mask pressing force Prm. Specifically, the upward movement end position Up of the vertical movement unit 297 is set so that the upward movement end position Up of the cleaning head 96 is higher than the height position of the support surface of the mask Ma of the mask support unit 71. As a result, when the cleaning head 96 is raised to the upward movement end position Up by the vertical movement unit 297, it comes into contact with the mask Ma and rises to a height position where the current value of the motor 297a becomes a predetermined current value.

[0082] In the printing device 200, when cleaning the mask Ma, the cleaning head 96 is brought into contact with the underside of the metal portion Ma1 of the mask Ma, and the cleaning head 96 is linearly moved by the linear movement mechanism 4 while the mask pressing force Prm is adjusted to a predetermined pressure. That is, the current value of the motor 297a is maintained at a predetermined current value, and therefore the mask pressing force Prm is maintained at a predetermined pressure. As a result, when cleaning the mask Ma, the raised cleaning head 96 maintains a state in which it presses the mask Ma with the predetermined mask pressing force Prm, and the cleaning head 96 cleans the mask Ma while moving in both the Y1 direction and the Y2 direction by the linear movement mechanism 4.

[0083] (Mask Cleaning Method) Here, a mask cleaning method performed in the control unit 210 will be described with reference to FIG.

[0084] In step S201, when cleaning the mask Ma, the cleaning unit 209 is moved by the linear movement mechanism 4 to a cleaning start position in the horizontal direction. In step S202, the cleaning head 96 is moved in the Z1 direction together with the ball screw 297c by the vertical movement unit 297. At this time, based on the current value driving the motor 297a and a predetermined current value, the cleaning head 96 is moved in the Z1 direction together with the ball screw 297c until the current value reaches the predetermined current value. As a result, the cleaning head 96 reaches the cleaning start position, and the mask pressing force Prm of the cleaning head 96 is adjusted to the predetermined pressure.

[0085] In step S203, the cleaning head 96 presses the mask Ma with a predetermined mask pressing force Prm, and while wiping with a cleaning sheet and suctioning the solder, the cleaning head 96 is moved in both the Y1 direction and the Y2 direction by the linear movement mechanism 4. This cleans the mask Ma. In step S204, upon completion of cleaning, the cleaning head 96 is moved in the Z2 direction together with the ball screw 297c by the vertical movement unit 297, and the mask cleaning method is then terminated.

[0086] The other configurations of the second embodiment are the same as those of the first embodiment, and therefore description thereof will be omitted.

[0087] (Effects of Second Embodiment) In the second embodiment, the following effects can be obtained.

[0088] In the second embodiment, as in the first embodiment, the printing device 200 is configured to adjust the mask pressing force Prm that presses against the mask Ma to a predetermined pressure when the cleaning head 96 is raised by the vertical movement unit 297 and brought into contact with the underside of the mask Ma fixed to the mask fixing unit 7. This makes it possible to sufficiently clean the mask Ma regardless of differences in the height position of the mask Ma, and to prevent excessive load from being applied to the mask Ma.

[0089] Furthermore, in the second embodiment, as described above, the vertical movement unit 297 has a motor 297a that generates a driving force for moving the cleaning head 96 in each of the Z1 direction (upward) and the Z2 direction (downward). The printing device 200 is equipped with a control unit 210 that controls the mask pressing force Prm to a predetermined pressure by adjusting the driving force of the motor 297a when cleaning the mask Ma. As a result, even when the motor 297a is used, the cleaning head 96 can be raised to a position where the predetermined mask pressing force Prm and the reaction force of the mask Ma are balanced, so that the mask Ma can be pressed with the predetermined pressure both when the height position of the mask Ma is high and when it is low.

[0090] Furthermore, in the second embodiment, as described above, when cleaning the mask Ma, the control unit 210 adjusts the driving force of the motor 297a based on the current value for driving the motor 297a, thereby controlling the mask pressing force Prm to be adjusted to a predetermined pressure. This makes it possible to easily achieve the control of adjusting the mask pressing force Prm by the motor 297a to a predetermined pressure by controlling the mask pressing force Prm to be adjusted to a predetermined pressure based on the current value for rotating the motor 297a.

[0091] The other effects of the second embodiment are the same as those of the first embodiment, and therefore description thereof will be omitted.

[0092] 12 to 15, the configuration of a printing device 300 according to a third embodiment will be described. In the third embodiment, the mask pressing force Prm is adjusted to a predetermined pressure based on the measured load. Note that in the third embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0093] As shown in FIG. 12 , the printing device 300 includes a base 1, a substrate support unit 2 (see FIG. 1 ), a pair of conveyors 3 (see FIG. 2 ), a linear movement mechanism 4, an imaging unit 5 (see FIG. 1 ), a linear movement mechanism 6 (see FIG. 1 ), a mask fixing unit 7, a squeegee unit 8 (see FIG. 1 ), a cleaning unit 309, and a control unit 310.

[0094] Here, the conveying direction of the conveyor 3 is the X1 direction, the opposite direction of the X1 direction is the X2 direction, and the X1 and X2 directions together are the X direction. The horizontal direction perpendicular to the X direction is the Y direction. One of the Y directions is the Y1 direction, and the other is the Y2 direction. Furthermore, the up-down direction is the Z direction, with the upward direction being the Z1 direction and the downward direction being the Z2 direction.

[0095] 12 , the cleaning unit 309 is configured to clean the mask Ma by removing solder that has adhered to the mask Ma during printing. Specifically, the cleaning unit 309 includes a first frame 91, a second frame 392, a third frame 393, a sheet supply unit 94 (see FIG. 4 ), a sheet recovery unit 95 (see FIG. 4 ), a cleaning head 96, a vertical movement unit 397, a pair of guide units 98, and a pair of guide units 399.

[0096] The first frame 91 is attached to the base plate 41. The second frame 392 is attached to the first frame 91. The third frame 393 is attached to a vertical movement unit 397 and a pair of guide units 98 so as to be movable in both the Z1 and Z2 directions relative to the second frame 392. The cleaning head 96 is a member that comes into contact with the lower surface of the mask Ma to clean the mask Ma. The cleaning head 96 is attached to the guide units 399.

[0097] <Up-and-down Direction Movement Unit> The up-and-down direction movement unit 397 is configured to move the cleaning head 96 in both the Z1 direction and the Z2 direction. The up-and-down direction movement unit 397 has a motor 397 a, a driving force transmission mechanism 397 b, a ball screw 397 c, and a load measurement unit 397 d. The motor 397 a and the ball screw 397 c are connected via the driving force transmission mechanism 397 b.

[0098] The motor 397a generates a driving force for moving the cleaning head 96 in both the Z1 and Z2 directions. The driving force transmission mechanism 397b is configured to transmit the driving force of the motor 397a to a ball screw 397c. The driving force transmission mechanism 397b includes, for example, a pulley and a belt. The ball screw 397c is configured to move in both the Z1 and Z2 directions by the driving force transmitted from the driving force transmission mechanism 397b. The ball screw 397c is connected to the third frame 393. The cleaning head 96 moves together with the third frame 393 in the Z1 direction and in the Z2 direction (see FIG. 13 ).

[0099] The load measurement unit 397d is a sensor for measuring the load when the cleaning head 96 contacts the mask Ma. The load measurement unit 397d is configured to transmit a measurement value when the cleaning head 96 contacts the mask Ma to the control unit 310. The load measurement unit 397d is attached to the third frame 393 at a position on the Z1 direction side of the ball screw 397c. The load measurement unit 397d moves in both the Z1 direction and the Z2 direction together with the third frame 393 by the ball screw 397c. Here, after the load measurement unit 397d moves in the Z1 direction and contacts the cleaning head 96, the cleaning head 96 moves in both the Z1 direction and the Z2 direction together with the load measurement unit 397d by the ball screw 397c. This allows the load measurement unit 397d to measure the load of the cleaning head 96, which moves integrally with the cleaning head 96 by the ball screw 397c, when it contacts the mask Ma.

[0100] The cleaning of the mask Ma by the cleaning unit 309 will be described in detail later.

[0101] (Control Unit) The control unit 310 includes a CPU, a storage unit such as an SSD or HDD, and memories such as a ROM and a RAM. The control unit 310 controls the linear movement mechanism 4 and the motor 397a of the printing device 300.

[0102] (Mask Cleaning) As shown in FIG. 14 , in the printing device 300, the cleaning unit 309 cleans the underside of the metal portion Ma1 of the mask Ma at a predetermined timing. When cleaning the mask Ma, the cleaning head 96 presses the mask Ma from the Z2 direction. Here, the printing device 300 of the third embodiment is configured so that the mask pressing force Prm of the cleaning head 96, which presses the mask Ma fixed to the mask fixing unit 7 from the Z2 direction, becomes a predetermined pressure. In other words, when the control unit 310 raises the cleaning head 96 and brings the cleaning head 96 into contact with the underside of the metal portion Ma1 of the mask Ma fixed to the mask fixing unit 7, the control unit 310 controls the mask pressing force Prm, which presses the metal portion Ma1 of the mask Ma, to be adjusted to a predetermined pressure.

[0103] Specifically, when cleaning the mask Ma, the control unit 310 adjusts the driving force of the motor 397 a to adjust the mask pressing force Prm to a predetermined pressure. When cleaning the mask Ma, the control unit 310 adjusts the driving force of the motor 397 a based on the measurement value of the load measurement unit 397 d to adjust the mask pressing force Prm to a predetermined pressure.

[0104] Here, the measurement value of the load measuring unit 397d increases as the load applied to the cleaning head 96 increases, and decreases as the load applied to the cleaning head 96 decreases. Therefore, the measurement value of the load measuring unit 397d changes depending on the load applied to the cleaning head 96 when the cleaning head 96 is pressed against the mask Ma, and therefore the mask pressing force Prm is adjusted to the predetermined pressure by adjusting the measurement value of the load measuring unit 397d to a predetermined measurement value equivalent to the predetermined pressure.

[0105] As a result, when cleaning the mask Ma, the control unit 310 controls the mask pressing force Prm to be adjusted to a predetermined pressure by matching the measurement value to the predetermined measurement value based on the measurement value of the load measuring unit 397d and the predetermined measurement value.

[0106] The mask pressing force Prm is configured to be adjusted to a predetermined pressure set for each mask Ma used depending on the type of substrate Su. That is, the mask pressing force Prm is set for each mask Ma by changing a predetermined measurement value. The predetermined measurement value is changed before cleaning by the cleaning unit 309.

[0107] The control unit 310 also controls the cleaning head 96 to rise (move in the Z1 direction) until it presses the mask Ma with a predetermined mask pressing force Prm. Specifically, the upward movement end position Up of the vertical movement unit 397 is set so that the upward movement end position Up of the cleaning head 96 is higher than the height position of the support surface of the mask Ma of the mask support unit 71. As a result, when the cleaning head 96 is raised to the upward movement end position Up by the vertical movement unit 397, it comes into contact with the mask Ma and rises to a height position at which the measurement value of the load measurement unit 397d becomes the predetermined measurement value.

[0108] In the printing device 300, when cleaning the mask Ma, the cleaning head 96 is brought into contact with the underside of the metal portion Ma1 of the mask Ma, and the cleaning head 96 is linearly moved by the linear movement mechanism 4 while the mask pressing force Prm is adjusted to a predetermined pressure. In other words, the measurement value of the load measurement unit 397d is maintained at a predetermined measurement value, and therefore the mask pressing force Prm is maintained at a predetermined pressure. As a result, when cleaning the mask Ma, the raised cleaning head 96 maintains a state in which it presses the mask Ma with the predetermined mask pressing force Prm, and the cleaning head 96 cleans the mask Ma while moving in both the Y1 direction and the Y2 direction by the linear movement mechanism 4.

[0109] (Mask Cleaning Method) Here, a mask cleaning method performed in the control unit 310 will be described with reference to FIG.

[0110] In step S301, when cleaning the mask Ma, the cleaning unit 309 is moved by the linear movement mechanism 4 to a cleaning start position in the horizontal direction. In step S302, the cleaning head 96 is moved in the Z1 direction together with the ball screw 397c by the vertical movement unit 397. At this time, based on the measurement value of the load measurement unit 397d and a predetermined measurement value, the cleaning head 96 is moved in the Z1 direction together with the ball screw 397c until the measurement value reaches the predetermined measurement value. As a result, the mask pressing force Prm of the cleaning head 96 is adjusted to the predetermined pressure, and the cleaning head 96 is moved to the cleaning start position.

[0111] In step S303, the cleaning head 96 presses the mask Ma with a predetermined mask pressing force Prm, and while wiping with a cleaning sheet and suctioning the solder, the cleaning head 96 is moved in both the Y1 and Y2 directions by the linear movement mechanism 4. This cleans the mask Ma. In step S304, upon completion of cleaning, the cleaning head 96 is moved in the Z2 direction together with the ball screw 397c by the vertical movement unit 397, and the mask cleaning method is then terminated.

[0112] The other configurations of the third embodiment are similar to those of the first embodiment, and therefore description thereof will be omitted.

[0113] (Effects of the Third Embodiment) In the third embodiment, the following effects can be obtained.

[0114] In the third embodiment, as in the first embodiment, the printing device 300 is configured to adjust the mask pressing force Prm that presses the mask Ma to a predetermined pressure when the cleaning head 96 is raised by the vertical movement unit 397 and brought into contact with the underside of the mask Ma fixed to the mask fixing unit 7. This makes it possible to sufficiently clean the mask Ma regardless of differences in the height position of the mask Ma, and to prevent excessive load from being applied to the mask Ma.

[0115] Furthermore, in the third embodiment, as described above, the cleaning unit 309 includes a load measurement unit 397d for measuring the load when the cleaning head 96 contacts the mask Ma. The control unit 310 performs control to adjust the mask pressing force Prm to a predetermined pressure by adjusting the driving force of the motor 397a based on the measurement value of the load measurement unit 397d. This allows the load measurement unit 397d to directly obtain the load when the cleaning head 96 contacts the mask Ma. As a result, the driving force of the motor 397a can be adjusted using the directly obtained load, allowing the mask pressing force Prm to be accurately adjusted to a predetermined pressure.

[0116] The other effects of the third embodiment are the same as those of the first embodiment, and therefore description thereof will be omitted.

[0117] 16 to 19, the configuration of a printing apparatus 400 according to a fourth embodiment will be described. In the fourth embodiment, the mask life is notified and the speed at which the substrate Su separates from the mask Ma is adjusted in accordance with changes in the height position of the mask Ma when the mask Ma is pressed with a predetermined pressure. Note that in the fourth embodiment, detailed descriptions of the same configuration as in the first embodiment will be omitted.

[0118] As shown in FIG. 16 , the printing device 400 includes a base 1, a substrate support unit 2 (see FIG. 1 ), a pair of conveyors 3 (see FIG. 2 ), a linear movement mechanism 4, an imaging unit 5 (see FIG. 1 ), a linear movement mechanism 6 (see FIG. 1 ), a mask fixing unit 7, a squeegee unit 8, a cleaning unit 9, a height measurement unit 410, a display unit 411, and a control unit 412.

[0119] Here, the conveying direction of the conveyor 3 is the X1 direction, the opposite direction of the X1 direction is the X2 direction, and the X1 and X2 directions together are the X direction. The horizontal direction perpendicular to the X direction is the Y direction. One of the Y directions is the Y1 direction, and the other is the Y2 direction. Furthermore, the up-down direction is the Z direction, with the upward direction being the Z1 direction and the downward direction being the Z2 direction.

[0120] (Cleaning Unit) The cleaning unit 9 is configured to clean the mask Ma by removing solder that has adhered to the mask Ma during printing. Specifically, the cleaning unit 9 includes a first frame 91, a second frame 92, a third frame 93, a sheet supply unit 94 (see FIG. 4), a sheet recovery unit 95 (see FIG. 4), a cleaning head 96, a vertical movement unit 97, and a guide unit 98.

[0121] (Height Measurement Unit) As shown in FIG. 16 , the height measurement unit 410 is configured to measure the height position of the upper surface of the mask Ma fixed by the mask fixing unit 7. The height measurement unit 410 is configured, for example, to receive light reflected from the upper surface of the mask Ma by projecting a laser beam and acquire height measurement information for height measurement. The height measurement unit 410 is attached to the squeegee unit 8. The height measurement unit 410 is configured to move in both the Y1 and Y2 directions together with the squeegee unit 8 by the linear movement unit 82. The height measurement unit 410 is configured to measure the height position near the intersection between the axis of the rod 971a of the air cylinder 97a extending parallel to the Z1 direction and the upper surface of the metal portion Ma1 of the mask Ma extending in the horizontal direction. Furthermore, the height measurement unit 410 may have the function of measuring the height position of the solder on the substrate Su, similar to the height measurement unit 11 of the first embodiment. The height measurement unit 410 may be configured to acquire height measurement information based on ultrasound or images other than laser.

[0122] (Display Unit) The display unit 411 is configured to include a liquid crystal screen, etc. The display unit 411 is configured to display information about printing received from the control unit 412 on the screen.

[0123] (Control Unit) The control unit 412 controls the printing device 400. The control unit 412 includes a CPU (Central Processing Unit), a storage unit such as an SSD (Solid State Drive) or an HDD (Hard Disk Drive), and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0124] (Mask cleaning) In the printing device 400, the cleaning unit 9 cleans the underside of the metal portion Ma1 of the mask Ma at a predetermined timing. When cleaning the mask Ma, the cleaning head 96 presses the mask Ma from the Z2 direction side. Here, the printing device 400 of the fourth embodiment is configured so that the mask pressing force Prm of the cleaning head 96, which presses the mask Ma fixed to the mask fixing unit 7 from the Z2 direction side, becomes a predetermined pressure.

[0125] (Height Measurement) Here, the metal part Ma1 and the mask frame Ma2 are connected via adhesive, buffer material, etc., so the mask tension (tension) at the connection part weakens due to aging and the mask pressing force Prm pressing against the cleaning head 96. In this case, if the mask tension (tension) at the connection part weakens due to aging and the mask pressing force Prm, the position where the predetermined mask pressing force Prm and the reaction force based on the tension of the mask Ma are balanced rises.

[0126] Therefore, the control unit 412 of the fourth embodiment controls the height measurement unit 410 to measure the height position of the upper surface of the mask Ma when cleaning the mask Ma.

[0127] In the printing device 400, when cleaning the mask Ma, the raised cleaning head 96 maintains a state in which it presses the mask Ma with a predetermined mask pressing force Prm, and the cleaning head 96 moves in both the Y1 and Y2 directions using the linear movement mechanism 4 to clean the mask Ma. During this cleaning, the control unit 412 controls the height measurement unit 410 to move in both the Y1 and Y2 directions in accordance with the movement of the cleaning head 96 in both the Y1 and Y2 directions. At this time, the control unit 412 controls the calculation of the height position of the upper surface of the mask Ma based on height measurement information acquired from the height measurement unit 410 regarding the position in the Z1 direction of the portion of the upper surface of the mask Ma pressed by the cleaning head 96. Here, the height position of the upper surface of the mask Ma is calculated multiple times during cleaning by the cleaning head 96. After cleaning, the control unit 412 controls the calculation of the average value of the multiple height positions.

[0128] (Display of information) As shown in Figures 17 and 18, the control unit 412 controls the display unit 411 to display information Im1 regarding the change in the height position of the upper surface of the mask Ma, and information Im2 notifying the replacement of the mask Ma, based on the height position of the upper surface of the mask Ma measured by the height measurement unit 410 when cleaning the mask Ma.

[0129] An example of how this information is displayed is given below.

[0130] That is, the control unit 412 controls the display unit 411 to display the average value of multiple height positions calculated after cleaning corresponding to the currently used mask Ma and the number of times the current mask Ma has been used for printing as information Im1 regarding the change in height position of the upper surface of the mask Ma (see FIG. 17). Furthermore, the control unit 412 controls the display unit 411 to display a message such as "The mask life has expired. Please replace the mask" as information Im2 notifying the user to replace the mask Ma based on the fact that the average value of multiple height positions calculated after cleaning exceeds the threshold value Th (see FIG. 18). Note that the display unit 411 displays not only the above-mentioned messages but also other appropriate displays selected by the user.

[0131] (Adjusting the plate separation speed) As shown in Figure 19, the control unit 412 is configured to set the speed at which the substrate Su separates from the mask Ma after printing by the squeegee 81, based on the height position of the upper surface of the mask Ma measured by the height measurement unit 410 when cleaning the mask Ma.

[0132] Here, if the mask tension (tensile force) at the connection portion weakens due to aging and the mask pressing force Prm, the position where the predetermined mask pressing force Prm is balanced with the reaction force based on the tension of the mask Ma rises, so by slowing down the speed at which the substrate Su separates from the mask Ma depending on the height position of the upper surface of the mask Ma measured by the height measurement unit 410, adhesion of solder to the mask Ma after printing is suppressed.

[0133] An example of adjusting the plate separation speed will be described below.

[0134] After cleaning, the control unit 412 acquires the plate release speed corresponding to the average value of the above-mentioned multiple height positions, and controls the setting of the plate release speed for the next time for the multiple backup pins 2a of the substrate support unit 2, etc.

[0135] The other configurations of the fourth embodiment are the same as those of the first embodiment, and therefore the description thereof will be omitted.

[0136] (Effects of Fourth Embodiment) In the fourth embodiment, the following effects can be obtained.

[0137] In the fourth embodiment, similarly to the first embodiment, the printing device 400 is configured to adjust the mask pressing force Prm that presses against the mask Ma to a predetermined pressure when the cleaning head 96 is raised by the vertical movement unit 97 and brought into contact with the underside of the mask Ma fixed to the mask fixing unit 7. This makes it possible to sufficiently clean the mask Ma regardless of differences in the height position of the mask Ma, and to prevent excessive load from being applied to the mask Ma.

[0138] Furthermore, in the fourth embodiment, as described above, the printing device 400 includes a height measurement unit 410 for measuring the height position of the upper surface of the mask Ma fixed by the mask fixing unit 7. The printing device 400 is configured to display both information Im1 indicating a change in the height position of the upper surface of the mask Ma and information Im2 notifying the user to replace the mask Ma on the display unit 411 based on the height position of the upper surface of the mask Ma measured by the height measurement unit 410 when cleaning the mask Ma. Here, if the mask Ma (its metal portion Ma1) is warped due to aging of the mask Ma, by pressing the mask Ma with the same predetermined pressure when cleaning the mask Ma, the height position of the mask Ma raised by the cleaning head 96 increases as the warping of the mask Ma increases. This makes it possible to recognize the extent of aging (lifespan) of the mask Ma from the height position of the upper surface of the mask Ma measured by the height measurement unit 410. This allows the user to predict when to replace the mask Ma by checking information Im1 indicating a change in the height position of the upper surface of the mask Ma displayed on the display unit 411. Furthermore, the user can easily recognize whether or not to replace the mask Ma by visually checking information Im2 notifying the user of the need to replace the mask Ma displayed on the display unit 411. These features allow the user to easily manage mask replacement.

[0139] Furthermore, in the fourth embodiment, as described above, the printing device 400 includes a height measurement unit 410 for measuring the height position of the upper surface of the mask Ma fixed by the mask fixing unit 7. The printing device 400 is configured to set the speed at which the substrate Su separates from the mask Ma after printing with the squeegee 81 based on the height position of the upper surface of the mask Ma measured by the height measurement unit 410 when cleaning the mask Ma. Here, as described above, if the mask Ma bends due to aging, the position at which the mask pressing force Prm of the predetermined pressure and the reaction force based on the tension of the mask Ma balance each other becomes higher than the height position of the mask Ma immediately after starting use. In such a case, when the substrate Su is separated from the mask Ma after printing with the squeegee 81, the mask Ma may vibrate due to the bent mask Ma, which may cause solder on the substrate Su to adhere to the mask Ma. Therefore, by measuring the height position of the upper surface of the mask Ma when cleaning the mask Ma with the height measuring unit 410, it is possible to measure the degree of deterioration of the mask Ma over time, and by moving the substrate Su away from the mask Ma at a speed that matches the height position of the upper surface, it is possible to suppress vibration of the mask Ma. As a result, it is possible to prevent the solder on the substrate Su from adhering to the mask Ma, thereby suppressing the occurrence of printing defects of the solder on the substrate Su.

[0140] The other effects of the fourth embodiment are the same as those of the first embodiment, and therefore will not be described.

[0141] Fifth Embodiment The configuration of a printing device 500 according to a fifth embodiment will be described with reference to Fig. 20. In the fifth embodiment, a swinging unit 599 is provided in a cleaning unit 509. Note that in the fifth embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0142] As shown in FIG. 20 , the printing device 500 includes a base 1, a substrate support unit 2 (see FIG. 1 ), a pair of conveyors 3 (see FIG. 2 ), a linear movement mechanism 4, an imaging unit 5 (see FIG. 1 ), a linear movement mechanism 6 (see FIG. 1 ), a mask fixing unit 7, a squeegee unit 8, a cleaning unit 509, and a control unit 10.

[0143] Here, the conveying direction of the conveyor 3 is the X1 direction, the opposite direction of the X1 direction is the X2 direction, and the X1 and X2 directions together are the X direction. The horizontal direction perpendicular to the X direction is the Y direction. One of the Y directions is the Y1 direction, and the other is the Y2 direction. Furthermore, the up-down direction is the Z direction, with the upward direction being the Z1 direction and the downward direction being the Z2 direction.

[0144] (Cleaning Unit) The cleaning unit 509 is configured to clean the mask Ma by removing solder that adheres to the mask Ma during printing. Specifically, the cleaning unit 509 includes a first frame 91, a second frame 92, a third frame 93, a sheet supply unit 94 (see FIG. 4), a sheet recovery unit 95 (see FIG. 4), a cleaning head 96, a vertical movement unit 97, a guide unit 98, and a swing unit 599.

[0145] 20 , the swinging portion 599 is configured to swing the cleaning head 96 in each of the Z1 direction and the Z2 direction around the center position of a rotation center axis extending in the Y direction of the cleaning head 96. Specifically, the swinging portion 599 has a mounting frame 599 a, a swing support portion 599 b, and a pair of swing restriction portions 599 c.

[0146] The mounting frame 599a is attached to the first frame 91. A swing support portion 599b and a pair of swing restriction portions 599c are attached to the mounting frame 599a.

[0147] The swing support part 599b is attached to the mounting frame 599a at a position on the rod 971a in the Z1 direction. The swing support part 599b has a plate member 5991b and a pin 5992b. The plate member 5991b protrudes in the Z1 direction to a position overlapping the center position of the cleaning head 96 when viewed from the Y2 direction side. The pin 5992b is provided to align with the center position of the cleaning head 96. The pin 5992b penetrates the plate member 5991b and the cleaning head 96 at the center position of the cleaning head 96. The pin 5992b is rotatably attached to the plate member 5991b and the cleaning head 96.

[0148] The pair of swing restriction portions 599c are configured to restrict swing of the cleaning head 96 in the Z1 and Z2 directions. The pair of swing restriction portions 599c are formed of rubber or resin. The swing restriction portion 599c on the X1 side of the pair of swing restriction portions 599c is disposed in the Z2 direction at the end of the mounting frame 599a on the X1 side of the cleaning head 96. The swing restriction portion 599c on the X2 side of the pair of swing restriction portions 599c is disposed in the Z2 direction at the end of the mounting frame 599a on the X2 side of the cleaning head 96. A gap is formed between the Z2 side surface of the cleaning head 96 and each of the pair of swing restriction portions 599c. This allows the cleaning head 96 to swing in each of the Z1 and Z2 directions by the amount of the gap.

[0149] (Mask cleaning) In the printing device 500, the cleaning unit 509 cleans the underside of the metal portion Ma1 of the mask Ma at a predetermined timing. When cleaning the mask Ma, the cleaning head 96 presses the mask Ma from the Z2 direction side. Here, the printing device 500 of the fifth embodiment is configured so that the mask pressing force Prm of the cleaning head 96, which presses the mask Ma fixed to the mask fixing unit 7 from the Z2 direction side, becomes a predetermined pressure.

[0150] When cleaning the mask Ma, the raised cleaning head 96 maintains a state in which it presses the mask Ma with a predetermined mask pressing force Prm, and cleans the mask Ma while moving in both the Y1 direction and the Y2 direction by the linear movement mechanism 4. During this cleaning, the raised cleaning head 96 cleans the mask Ma while swinging in both the Z1 direction and the Z2 direction by the swinging unit 599 in accordance with the inclination of the lower surface of the mask Ma.

[0151] The other configurations of the fifth embodiment are the same as those of the first embodiment, and therefore the description thereof will be omitted.

[0152] (Effects of Fifth Embodiment) In the fifth embodiment, the following effects can be obtained.

[0153] In the fifth embodiment, similarly to the first embodiment, the printing device 500 is configured to adjust the mask pressing force Prm that presses against the mask Ma to a predetermined pressure when the cleaning head 96 is raised by the vertical movement unit 97 and brought into contact with the underside of the mask Ma fixed to the mask fixing unit 7. This makes it possible to sufficiently clean the mask Ma regardless of differences in the height position of the mask Ma, and to prevent excessive load from being applied to the mask Ma.

[0154] Furthermore, in the fifth embodiment, as described above, the cleaning unit 509 includes a swinging unit 599 that swings the cleaning head 96 up and down around the center position of the cleaning head 96. This allows the swinging unit 599 to swing the cleaning head 96 in accordance with the up and down tilt of the mask Ma, so that the cleaning head 96 can be brought into even contact with the underside of the mask Ma. As a result, the cleaning head 96 can more thoroughly clean the mask Ma.

[0155] The other effects of the fifth embodiment are the same as those of the first embodiment, and therefore description thereof will be omitted.

[0156] [Modifications] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the description of the above-mentioned embodiments, and further includes all modifications (modifications) within the meaning and scope of the claims.

[0157] For example, in the fourth embodiment described above, the control unit 412 controls the display unit 411 to display information Im1 regarding a change in the height position of the upper surface of the mask Ma and information Im2 notifying the user of a need to replace the mask Ma based on the height position of the upper surface of the mask Ma measured by the height measurement unit 410 when cleaning the mask Ma. However, the present invention is not limited to this. In the present invention, it is sufficient that the control unit controls the display unit to display at least one of the information regarding the change in the height position of the upper surface of the mask and the information notifying the user of a need to replace the mask. Furthermore, the information regarding the change in the height position of the upper surface of the mask and the information notifying the user of a need to replace the mask may be displayed not on a display unit provided in the printing device, but on a display unit of a mobile terminal carried by the user, a management device such as a server, a stationary terminal used by the user, or the like.

[0158] In the fifth embodiment, the swinging portion 599 includes the mounting frame 599 a, the swing support portion 599 b, and the pair of swing restriction portions 599 c. However, the present invention is not limited to this. In the present invention, the swinging portion may swing the cleaning head using rubber or the like.

[0159] Furthermore, in the above-described first to fifth embodiments, for convenience of explanation, examples have been shown in which the control processing of the control unit 10 (210, 310, 412) is explained using a flow-driven flowchart in which processing is performed sequentially according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or may be performed in a combination of event-driven and flow-driven processing.

[0160] 4 Linear movement mechanism 7 Mask fixing part 9, 209, 309, 509 Cleaning part 10, 210, 310, 412 Control part 81 Squeegee 96 Cleaning head 97, 297, 397 Up-down movement part 97a Air cylinder 97b Regulator 100, 200, 300, 400, 500 Printing device 297a, 397a Motor 397d Load measurement part 410 Height measurement part 411 Display part 599 Swing part Im1 Information of change in height position of upper surface of mask Im2 Information notifying replacement of mask Ma Mask Prm Mask pressing force Su Substrate

Claims

1. A printing apparatus comprising: a squeegee for printing on a substrate while moving a coating material on a mask; a mask fixing portion for fixing the mask; a cleaning head for cleaning the mask by contacting the lower surface of the mask; and a cleaning portion including a vertical movement portion for vertically moving the cleaning head, wherein when the cleaning head is lifted by the vertical movement portion and the cleaning head is brought into contact with the lower surface of the mask fixed to the mask fixing portion, the mask pressing force for pressing the mask is configured to be adjusted to a predetermined pressure.

2. The printing apparatus according to claim 1, wherein the mask pressing force is configured to be adjusted to the predetermined pressure set for each mask used according to the type of the substrate.

3. The printing apparatus according to claim 1, wherein the vertical movement portion is configured to move the cleaning head upward until the mask is pressed with the mask pressing force of the predetermined pressure.

4. The printing apparatus according to claim 1, wherein the vertical movement portion includes an air cylinder for raising and lowering the cleaning head, and a regulator for adjusting the mask pressing force applied from the air cylinder to the cleaning head when cleaning the mask to the predetermined pressure.

5. The printing apparatus according to claim 1, wherein the vertical movement portion has a motor for generating a driving force for moving the cleaning head in each of the upward and downward directions, and further includes a control portion for performing control to adjust the mask pressing force to the predetermined pressure by adjusting the driving force of the motor when cleaning the mask.

6. The printing apparatus according to claim 5, wherein the control portion is configured to perform control to adjust the mask pressing force to the predetermined pressure by adjusting the driving force of the motor based on a current value for driving the motor when cleaning the mask.

7. The printing apparatus according to claim 5, wherein the cleaning portion further includes a load measuring portion for measuring a load when the cleaning head contacts the mask, and the control portion is configured to perform control to adjust the mask pressing force to the predetermined pressure by adjusting the driving force of the motor based on a measurement value of the load measuring portion.

8. The printing apparatus according to claim 1, further comprising a height measuring unit for measuring the height position of the upper surface of the mask fixed by the mask fixing unit, and configured to display at least one of information on a change in the height position of the upper surface of the mask and information for notifying replacement of the mask on a display unit based on the height position of the upper surface of the mask measured by the height measuring unit when cleaning the mask.

9. The printing apparatus according to claim 1, further comprising a height measuring unit for measuring the height position of the upper surface of the mask fixed by the mask fixing unit, and configured such that a speed at which the substrate moves away from the mask after printing by the squeegee is set based on the height position of the upper surface of the mask measured by the height measuring unit when cleaning the mask.

10. The printing apparatus according to claim 1, wherein the cleaning unit further includes a swing unit that swings the cleaning head in the vertical direction around a central position of the cleaning head.

11. The printing apparatus according to claim 1, further comprising a linear movement mechanism for linearly moving the cleaning head, and configured to adjust the mask pressing force to the predetermined pressure while linearly moving the cleaning head by the linear movement mechanism with the cleaning head in contact with the lower surface of the mask when cleaning the mask.

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