Multilayer ceramic capacitor

Abstract

Provided is a multilayer ceramic capacitor in which the possibility of occurrence of peeling between an outer layer part, a dielectric layer, and an internal electrode is reduced. In a multilayer ceramic capacitor 1 according to the present invention, an internal electrode 15 has a first internal electrode 151, a second internal electrode 152, a third internal electrode 153, and a fourth internal electrode 154, each including a body part 15A and a lead-out part 15B drawn out to an end surface C. A first connection-side end part 151c of a first lead-out part 151B in the first internal electrode 151 and a third connection-side end part 153c of a third lead-out part 153B in the third internal electrode 153, which are drawn out to a first end surface C1 side, do not overlap each other in the lamination direction, and a second connection-side end part 152c of a second lead-out part 152B in the second internal electrode 152 and a fourth connection-side end part 154c of a fourth lead-out part 154B in the fourth internal electrode 154, which are drawn out to a second end surface C2 side, do not overlap each other in the lamination direction.

Description

Multilayer ceramic capacitors

[0001] The present invention relates to a multilayer ceramic capacitor.

[0002] A multilayer ceramic capacitor has, for example, a plurality of laminated dielectric layers, a plurality of internal electrodes laminated on the dielectric layers, and external electrodes electrically connected to the internal electrodes. In particular, with regard to the shape of the internal electrodes, various shapes have been disclosed in recent years in response to the increasing demand for miniaturization and higher capacitance of multilayer ceramic capacitors.

[0003] However, conventionally, the ends of the internal electrodes overlap in the stacking direction, and when viewed in a cross section in the longitudinal direction and stacking direction including the ends of the internal electrodes, the number of overlapping internal electrodes decreases rapidly from the center of the laminate toward the end face (Prior Document 1).

[0004] Japanese Patent Application Laid-Open No. 2018-093165

[0005] In this way, in conventional products in which the number of overlapping internal electrodes rapidly decreases from the center of the laminate toward the end face, the dielectric layers (outer layer sheets and inner layer sheets) near the ends of the internal electrodes undergo rapid flow and stretching during crimping, causing the dielectric layers to become taut, and there are cases in which the dielectric layers near the ends of the internal electrodes are not attached in a way that follows the shape of the overlapping internal electrode ends.

[0006] This can reduce the adhesion between the outer layer, the dielectric layer, and the internal electrode during crimping, resulting in gaps being formed between the layers, and peeling can occur starting from these gaps.

[0007] An object of the present invention is to provide a multilayer ceramic capacitor in which the possibility of peeling occurring between the outer layer portions, dielectric layers, and internal electrodes is reduced.

[0008] In order to solve the above problems, the present invention provides a multilayer ceramic capacitor comprising: a laminate having a plurality of dielectric layers and a plurality of internal electrodes alternately stacked with each other; first and second main faces opposing each other in a stacking direction; first and second side faces opposing each other in a width direction perpendicular to the stacking direction; and first and second end faces opposing each other in a length direction perpendicular to the stacking direction and the width direction; and a first external electrode arranged on the first end face and a second external electrode arranged on the second end face, wherein the internal electrodes are the first internal electrode and the second internal electrode arranged on different planes. , a third internal electrode, and a fourth internal electrode, the first internal electrode having a first body portion of a substantially rectangular shape or a substantially rectangular shape having a notch on the first end face side, and a first lead portion connected to the first body portion and having a smaller dimension in the width direction than the first body portion and led out to the first end face, the first body portion having a first non-connection side end portion located on the second end face side and a first connection side end portion located on the first end face side, and the second internal electrode having a second body portion of a substantially rectangular shape or a substantially rectangular shape having a notch on the first end face side, and a first lead portion connected to the second body portion and having a smaller dimension in the width direction than the second body portion. the third internal electrode has a third main body portion that is substantially rectangular or substantially rectangular with a notch on the second end face side, a third lead portion that is connected to the third main body portion and has a smaller dimension in the width direction than the third main body portion and is drawn to the first end face, and the third main body portion has a third non-connection side end portion located on the second end face side and a third connection side end portion located on the first end face side, and the fourth internal electrode has The present invention provides a multilayer ceramic capacitor having a fourth main body portion that is substantially rectangular or substantially rectangular with a cutout on the first end face side; a fourth drawn-out portion that is connected to the fourth main body portion, has a smaller dimension in the width direction than the fourth main body portion, and is drawn out to a second end face; and the fourth main body portion has a fourth non-connection side end located on the first end face side and a fourth connection side end located on the second end face side, wherein the first connection side end and the third connection side end do not overlap each other in the stacking direction, and the second connection side end and the fourth connection side end do not overlap each other in the stacking direction.

[0009] According to the present invention, it is possible to provide a multilayer ceramic capacitor in which the possibility of peeling occurring between the outer layer portions, the dielectric layers, and the internal electrodes is reduced.

[0010] 1 is a schematic perspective view of a multilayer ceramic capacitor 1; a diagram showing an internal electrode 15 arranged inside a laminate 2; a cross-sectional view taken along line III-III in FIG. 1; a cross-sectional view taken along line IV-IV in FIG. 1; a cross-sectional view of a conventional multilayer ceramic capacitor 100 corresponding to FIG. 4; a diagram explaining a first modified embodiment of the internal electrode 15; a diagram explaining a second modified embodiment of the internal electrode 15; a diagram explaining third and fourth modified embodiments of the internal electrode 15; a diagram showing an eighth modified embodiment of the internal electrode 15; a diagram showing a ninth modified embodiment of the internal electrode 15; a table showing dimensions of the main body portions of the internal electrodes of the multilayer ceramic capacitor 1 of Example 1; a table showing dimensions of the lead portions of the internal electrodes of the multilayer ceramic capacitor 1 of Example 1; a table showing dimensions of the main body portions of the internal electrodes of the multilayer ceramic capacitor 1 of Example 2; a table showing dimensions of the lead portions of the internal electrodes of the multilayer ceramic capacitor 1 of Example 2. The results of confirming defects due to peeling in Comparative Example 1, Example 1, and Example 2 are shown.

[0011] A multilayer ceramic capacitor 1 according to an embodiment of the present invention will now be described. FIG.

[0012] (Multilayer ceramic capacitor 1) The multilayer ceramic capacitor 1 is substantially rectangular and includes a laminate 2 and a pair of external electrodes 3 provided on both ends of the laminate 2. Fig. 2 is a diagram showing an internal electrode 15 disposed inside the laminate 2. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 1.

[0013] The laminate 2 includes an inner layer portion 11 in which a plurality of dielectric layers 14 and a plurality of internal electrodes 15 are laminated, and an outer layer portion 12 .

[0014] In the following description, the terms used to represent the orientation of the multilayer ceramic capacitor 1 are: a length direction L, which is the direction in which a pair of external electrodes 3 are provided in the multilayer ceramic capacitor 1; a stacking direction T, which is the direction in which the dielectric layers 14 and the internal electrodes 15 are stacked; and a width direction W, which is the direction intersecting both the length direction L and the stacking direction T. In the embodiment, the width direction W is perpendicular to both the length direction L and the stacking direction T.

[0015] 2 , a pair of outer peripheral surfaces facing each other in the stacking direction T will be referred to as a first main surface A1 and a second main surface A2, and when there is no need to distinguish between the first main surface A1 and the second main surface A2, they will be collectively referred to as the main surface A. A pair of outer peripheral surfaces facing each other in the width direction W will be referred to as a first side surface B1 and a second side surface B2, and when there is no need to distinguish between the first side surface B1 and the second side surface B2, they will be collectively referred to as the side surface B. A pair of outer peripheral surfaces facing each other in the length direction L will be referred to as a first end surface C1 and a second end surface C2, and when there is no need to distinguish between the first end surface C1 and the second end surface C2, they will be collectively referred to as the end surface C.

[0016] The multilayer ceramic capacitor 1 including the laminate 2 and the external electrodes 3 preferably has a length L dimension of 0.2 mm or more and 5.7 mm or less, a length T dimension of 0.1 mm or more and 2.7 mm or less, and a width W dimension of 0.1 mm or more and 5.0 mm or less.

[0017] (Laminate 2) The laminate 2 preferably has a substantially rectangular shape, with rounded corners and ridges. The corners are portions where three surfaces of the laminate 2 intersect, and the ridges are portions where two surfaces of the laminate 2 intersect. In addition, irregularities may be formed on part or all of the main surface A, side surface B, and end surface C.

[0018] (Dielectric Layer 14) The dielectric layer 14 is made of, for example, a ceramic material. Examples of the ceramic material include BaTiO ３ , CaTiO ３ , SrTiO ３ , CaZrO ３It is possible to use a dielectric ceramic consisting of the following main components: In addition, depending on the desired properties of the laminate, it is also possible to use a material in which a minor component such as a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound is added to these main components in a smaller amount than the main component.

[0019] The thickness of the dielectric layers 14 is preferably 0.5 μm or more and 10 μm or less. The number of the dielectric layers 14, including the outer layer portions 12, is preferably 15 or more and 700 or less.

[0020] (Internal electrode 15) The internal electrode 15 has a substantially rectangular parallelepiped main body 15A and a lead portion 15B that extends from the main body 15A to one end face C and is connected to the external electrode. In this embodiment, the dimension in the width direction W of the portion (connection portion) of the lead portion 15B that is exposed at the end face C is smaller than the dimension in the width direction W of the main body 15A.

[0021] Moreover, the internal electrode 15 of the embodiment includes a plurality of sets of a first internal electrode 151, a second internal electrode 152, a third internal electrode 153, and a fourth internal electrode 154, which are stacked with the dielectric layer 14 sandwiched therebetween. Hereinafter, unless it is necessary to particularly distinguish between the first internal electrode 151, the second internal electrode 152, the third internal electrode 153, and the fourth internal electrode 154, they will be collectively referred to as the internal electrode 15.

[0022] The internal electrodes 15 can be made of an appropriate conductive material such as a metal such as Ni, Cu, Ag, Pd, or Au, or an alloy containing at least one of these metals, such as an Ag—Pd alloy.

[0023] The thickness of the internal electrodes 15 is preferably, for example, 0.2 μm or more and 2.0 μm or less. The total number of the internal electrodes 15 is preferably 15 or more and 200 or less.

[0024] In the laminate 2, most of the main bodies 15A of the adjacent internal electrodes 15 overlap and face each other in the stacking direction T, and charge is accumulated in the facing portions, thereby exhibiting the characteristics of a capacitor. The internal electrodes 15 will be described in detail later.

[0025] (Outer Layer Portion 12 ) The outer layer portion 12 is an assembly of a plurality of dielectric layers 14 made of the same dielectric ceramic material as the dielectric layers 14 of the inner layer portion 11 .

[0026] (External Electrode 3) The external electrode 3 includes a first external electrode 3A and a second external electrode 3B.

[0027] The first external electrode 3A is disposed so as to cover the first end face C1 of the laminate 2 and to be connected to the internal electrode 15 extended to the first end face C1. The first external electrode 3A is preferably disposed so as to extend to parts of the first principal face A1 and the second principal face A2, and parts of the first side face B1 and the second side face B2. However, the first external electrode 3A may be disposed only on the first end face C1.

[0028] The second external electrode 3B is disposed so as to cover the second end face C2 of the laminate 2 and to be connected to the internal electrode 15 extended to the second end face C2. The second external electrode 3B is preferably disposed so as to extend to parts of the first principal face A1 and the second principal face A2, and parts of the first side face B1 and the second side face B2. However, the second external electrode 3B may be disposed only on the second end face C2.

[0029] Hereinafter, unless it is necessary to particularly distinguish between the first external electrode 3A and the second external electrode 3B, they will be collectively referred to as the external electrode 3. The external electrode 3 includes a base electrode layer 31 and a plating layer 32.

[0030] (Base electrode layer 31) The base electrode layer 31 includes at least one selected from a baked layer, a resin layer, a thin film layer, etc. The base electrode layer 31 covers the end face C of the laminate 2 and is arranged so as to be connected to the internal electrode 15 extended to the end face C.

[0031] (When the base electrode layer 31 includes a baking layer) The baking layer includes a glass component and a metal. The glass component includes at least one selected from B, Si, Ba, Mg, Al, Li, etc. The metal of the baking layer includes at least one selected from Cu, Ni, Ag, Pd, an Ag-Pd alloy, Au, etc. The baking layer may be a multi-layered layer. The baking layer is formed by applying a conductive paste containing glass and a metal to the laminate 2 and baking it. The baking layer may be co-fired with the internal electrodes 15 and the dielectric layers 14, or may be baked after the internal electrodes 15 are baked. Note that when the baking layer is co-fired with the internal electrodes 15 and the dielectric layers 14, it is preferable to form the baking layer by adding a dielectric material instead of the glass component. The thickness of the thickest part of the baking layer is preferably, for example, approximately 10 μm or more and 50 μm or less.

[0032] (When the base electrode layer 31 includes a resin layer) The resin layer may be multiple layers. The resin layer includes, for example, conductive particles and a thermosetting resin. When forming a resin layer, it may be formed directly on the laminate without forming a baked electrode layer, or it may be formed so as to cover the baked layer. The resin layer may be formed on the surface of the baked layer, or it may be formed directly on the surface of the end face C without forming a baked layer. The thickness of the resin layer (at its thickest point) is preferably 10 μm or more and 150 μm or less.

[0033] (When the Base Electrode Layer 31 Includes a Thin Film Layer) The thin film layer is formed by a thin film forming method such as sputtering or vapor deposition, and is a layer of 1 μm or less in thickness on which metal particles are deposited.

[0034] (Plating Layer 32) The plating layer 32 is disposed so as to cover the base electrode layer 31. The plating layer 32 includes, for example, at least one selected from Cu, Ni, Sn, Ag, Pd, an Ag—Pd alloy, Au, and the like. The plating layer 32 may be formed of multiple layers. Preferably, the plating layer 32 has a two-layer structure consisting of Ni plating 321 and Sn plating 322. The Ni plating layer 321 prevents the base electrode layer 31 from being eroded by solder when mounting ceramic electronic components, and the Sn plating layer 322 improves the wettability of solder when mounting ceramic electronic components, facilitating mounting. The thickness of each plating layer 32 is preferably 0.5 μm or more and 10 μm or less.

[0035] (Internal Electrode 15) Next, the internal electrode 15 will be described in detail. As described above, the internal electrode 15 includes a plurality of sets of a first internal electrode 151, a second internal electrode 152, a third internal electrode 153, and a fourth internal electrode 154. The first internal electrode 151, the second internal electrode 152, the third internal electrode 153, and the fourth internal electrode 154 are all arranged on different planes between the dielectric layers 14.

[0036] The first internal electrode 151 has a substantially rectangular parallelepiped first main body 151A and a first lead portion 151B extending from the first main body 151A to the first end face C1 and connected to a first external electrode described below. The second internal electrode 152 has a substantially rectangular parallelepiped second main body 152A and a second lead portion 152B extending from the second main body 152A to the second end face C2 and connected to a second external electrode described below. The third internal electrode 153 has a substantially rectangular parallelepiped third main body 153A and a third lead portion 153B extending from the third main body 153A to the first end face C1 and connected to a first external electrode described below. The fourth internal electrode 154 has a substantially rectangular parallelepiped fourth main body 154A and a fourth lead portion 154B extending from the fourth main body 154A to the second end face C2 and connected to a second external electrode described below.

[0037] In the embodiment, the internal electrodes 15 are arranged in the order of the first internal electrode 151, the second internal electrode 152, the third internal electrode 153, and the fourth internal electrode 154. However, as long as the first internal electrode 151 or the third internal electrode 153 and the second internal electrode 152 or the fourth internal electrode 154 are arranged alternately, the first internal electrode 151, the second internal electrode 152, the third internal electrode 153, and the fourth internal electrode 154 in each set do not have to be arranged in the same order.

[0038] That is, the internal electrodes may be arranged in the following order: one of the first internal electrode 151 or the third internal electrode 153, one of the second internal electrode 152 or the fourth internal electrode 154, the other of the first internal electrode 151 or the third internal electrode 153, and the other of the second internal electrode 152 or the fourth internal electrode 154.

[0039] For example, the electrodes may be arranged in the order of the first internal electrode 151, the second internal electrode 152, the third internal electrode 153, and the fourth internal electrode 154; the electrodes may be arranged in the order of the first internal electrode 151, the fourth internal electrode 154, the third internal electrode 153, and the second internal electrode 152; the electrodes may be arranged in the order of the third internal electrode 153, the second internal electrode 152, the first internal electrode 151, and the fourth internal electrode 154; the electrodes may be arranged in the order of the third internal electrode 153, the fourth internal electrode 154, the first internal electrode 151, and the second internal electrode 152; or these combinations may be mixed.

[0040] However, if the same set of layers is repeatedly stacked, it is possible to avoid complications in the manufacturing process.

[0041] Hereinafter, unless it is necessary to distinguish between first main body 151A, second main body 152A, third main body 153A, and fourth main body 154A, they will be collectively referred to as main body 15A.Unless it is necessary to distinguish between first drawer 151B, second drawer 152B, third drawer 153B, and fourth drawer 154B, they will be collectively referred to as drawer 15B.

[0042] The main body 15A in this embodiment is a substantially rectangular shape having two end sides along the end face C and two side sides along the side face B. The main body 15A has four end parts that are corners of the rectangle. Of the four end parts, the two end parts on the side where the lead-out portion 15B extends and is connected to the end face C are referred to as connection-side end parts 15c, and the two end parts on the side where the lead-out portion 15B does not extend and is connected to the other end face C are referred to as non-connection-side end parts 15n.

[0043] The first body portion 151A of the first internal electrode 151 has a first non-connection side end portion 151n located on the second end face C2 side and a first connection side end portion 151c located on the first end face C1 side. The second body portion 152A of the second internal electrode 152 has a second non-connection side end portion 152n located on the first end face C1 side and a second connection side end portion 152c located on the second end face C2 side. The third body portion 153A of the third internal electrode 153 has a third non-connection side end portion 153n located on the second end face C2 side and a third connection side end portion 153c located on the first end face C1 side. The fourth body portion 154A of the fourth internal electrode 154 has a fourth non-connection side end portion 154n located on the first end face C1 side and a fourth connection side end portion 154c located on the second end face C2 side.

[0044] As described above, FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1 and passing through two of the four ends of the main body 15A that are located on the first side surface B1 side.

[0045] (Feature 1) As shown in the drawings, the multilayer ceramic capacitor 1 of the embodiment has the following feature 1. In the stacking direction T, the first connection side end 151c and the third connection side end 153c do not overlap with each other, and the second connection side end 152c and the fourth connection side end 154c do not overlap with each other in the stacking direction T. In other words, the first connection side end 151c and the third connection side end 153c are located at different positions in the length direction L, and the second connection side end 152c and the fourth connection side end 154c are located at different positions in the length direction L.

[0046] (Feature 1') In other words, in the embodiment, the first lead portion 151B and the third lead portion 153B have different dimensions in the length direction L, and the second lead portion 152B and the fourth lead portion 154B have different dimensions in the length direction L.

[0047] In the embodiment, the first connection side end 151c and the third connection side end 153c are positioned at the same position in the width direction W, and the second connection side end 152c and the fourth connection side end 154c are positioned at the same position in the width direction W, but this is not limited to this and they may be positioned at different positions in the width direction W.

[0048] In the embodiment, the position of the first connection-side end 151c in the length direction L from the first end face C1 is farther than the third connection-side end 153c, but is not limited to this and may be closer. The position of the second connection-side end 152c in the length direction L from the second end face C2 is farther than the fourth connection-side end 154c, but is not limited to this and may be closer.

[0049] In other words, the dimension of the first drawn section 151B in the length direction L may be smaller or larger than that of the third drawn section 153B. The dimension of the second drawn section 152B in the length direction L may be smaller or larger than that of the fourth drawn section 154B.

[0050] (Effect of Feature 1) Fig. 5 is a cross-sectional view of the conventional multilayer ceramic capacitor 100 corresponding to Fig. 4. In the following description of the conventional multilayer ceramic capacitor 100, the same parts as those in the embodiment will be denoted by the same reference numerals.

[0051] In the conventional multilayer ceramic capacitor 100, the ends of the internal electrodes 15 overlap in the stacking direction T. That is, they are located at the same position in the longitudinal direction L. In this case, as shown in the figure, when moving from the center of the laminate 2 in the longitudinal direction L toward the end face C, the thickness changes abruptly at a position where a plurality of internal electrodes 15 are stacked and a position where no internal electrodes 15 are stacked.

[0052] As a result, in the manufacturing process of the conventional multilayer ceramic capacitor 1, when the laminate 2 is pressure-bonded in the stacking direction T, the dielectric sheets that become the dielectric layers 14 and the outer layer portions 12 experience sudden flow and elongation near the ends of the internal electrodes 15, causing the dielectric sheets to be pulled tightly. As a result, the dielectric sheets near the ends of the internal electrodes 15 may not be able to follow the shape of the sudden thickness change near the ends of the overlapping internal electrodes 15. This may result in a decrease in interlayer adhesion between the outer layer portions 12, the dielectric layers 14, and the internal electrodes 15 during pressure bonding, resulting in the formation of voids between the layers or peeling starting from these voids.

[0053] In the embodiment, by providing the above-described feature 1, as shown in FIG. 4 , the number of stacked internal electrodes 15 gradually decreases from the center toward the end face C in the longitudinal direction L of the laminate 2. That is, the rate of decrease in the number of overlapping internal electrodes 15 becomes gentler. This suppresses sudden flow or elongation of the dielectric sheets that become the dielectric layers 14 and the outer layer portions 12 near the ends of the internal electrodes 15 when the laminate 2 is pressure-bonded in the stacking direction T. Therefore, it is possible to follow the shape of sudden thickness changes near the ends of the overlapping internal electrodes 15, improving adhesion between the dielectric sheets or between the dielectric sheets and the internal electrodes 15 during pressure bonding, and reducing the possibility of voids occurring between the dielectric sheets or peeling that originates from these voids.

[0054] (Confirmation Method) Whether the multilayer ceramic capacitor 1 has Feature 1 can be confirmed as follows.

[0055] (1) First, in a cross section of the multilayer ceramic capacitor 1 along the length direction L and width direction W at the center of the stacking direction T, for example, a distance W1 (not shown) from the first side surface B1 to the first connection side end 151c, the second connection side end 152c, the third connection side end 153c, and the fourth connection side end 154c is measured.

[0056] (2) Next, the multilayer ceramic capacitor 1 is polished along a cross section passing through the longitudinal direction L and the stacking direction T for a distance W1 from the first side surface B1. As a result, a first connection side end 151c, a second connection side end 152c, a third connection side end 153c, and a fourth connection side end 154c appear in the cross section as shown in Figure 4. In this cross section, if Feature 1 is present, it can be observed that the number of overlapping internal electrodes 15 gradually decreases from the center in the longitudinal direction L toward the first end face C1 and the second end face C2.

[0057] (Feature 2) As a more preferred embodiment, the present embodiment further includes the following feature 2. In the stacking direction T, the first non-connection-side end 151 n, the second connection-side end 152 c, and the fourth connection-side end 154 c do not overlap with each other, the second non-connection-side end 152 n, the first connection-side end 151 c, and the third connection-side end 153 c do not overlap with each other, the third non-connection-side end 153 n, the second connection-side end 152 c, and the fourth connection-side end 154 c do not overlap with each other, and the fourth non-connection-side end 154 n, the first connection-side end 151 c, and the third connection-side end 153 c do not overlap with each other.

[0058] In the embodiment, the first non-connection-side end 151n, the second connection-side end 152c, and the fourth connection-side end 154c are positioned farthest from the second end face C2 in the longitudinal direction L, but this is not limited thereto and the first non-connection-side end 151n may be positioned closest to the second end face C2. Alternatively, the first non-connection-side end 151n may be positioned between the second connection-side end 152c and the fourth connection-side end 154c.

[0059] The positions of the second non-connection-side end 152n, the first connection-side end 151c, and the third connection-side end 153c in the length direction L from the first end face C1 are such that the second non-connection-side end 152n is farthest from the first end face C1, but are not limited to this and may be closest. Also, the second non-connection-side end 152n may be disposed between the first connection-side end 151c and the third connection-side end 153c.

[0060] The third non-connection-side end 153n, the second connection-side end 152c, and the fourth connection-side end 154c are located farthest from the second end face C2 in the longitudinal direction L, but this is not limited thereto and the third non-connection-side end 153n may be located closest to the second end face C2. Alternatively, the third non-connection-side end 153n may be located between the second connection-side end 152c and the fourth connection-side end 154c.

[0061] The fourth non-connection-side end 154n, the first connection-side end 151c, and the third connection-side end 153c are positioned farthest from the first end face C1 in the longitudinal direction L, but this is not limited thereto and the fourth non-connection-side end 154n may be positioned closest to the first end face C1. Alternatively, the fourth non-connection-side end 154n may be positioned between the first connection-side end 151c and the third connection-side end 153c.

[0062] If Feature 1 is present, Feature 2 is not essential, but by adding Feature 2, the effect described in Feature 1 can be further enhanced.

[0063] (Feature 3) As a more preferred embodiment of the present invention, the present embodiment further includes the following feature 3: In the stacking direction T, the first non-connection side end 151 n and the third non-connection side end 153 n do not overlap with each other, and the second non-connection side end 152 n and the fourth non-connection side end 154 n do not overlap with each other.

[0064] In the embodiment, the position of the second non-connection-side end 152n in the length direction L from the first end face C1 is farther from, but not limited to, the fourth non-connection-side end 154n, but may be closer. The position of the first non-connection-side end 151n in the length direction L from the second end face C2 is farther from, but not limited to, the third non-connection-side end 153n, but may be closer.

[0065] If Feature 1 is included, Feature 3 is not essential, but by adding Feature 3, the effect described in Feature 1 can be further enhanced.

[0066] Generally speaking, as long as Feature 1 is included, the other features are not essential, but a more preferred embodiment is one in which none of the ends overlap in the stacking direction T. That is, as the ends of the first end face C1, it is preferred that the first connection side end 151 c of the first internal electrode 151, the second non-connection side end 152 n of the second internal electrode 152, the third connection side end 153 c of the third internal electrode 153, and the fourth non-connection side end 154 n of the fourth internal electrode 154 do not overlap in the stacking direction T.

[0067] As the ends on the second end face C2 side, it is preferable that the first non-connection side end 151n of the first internal electrode 151, the second connection side end 152c of the second internal electrode 152, the third non-connection side end 153n of the third internal electrode 153, and the fourth connection side end 154c of the fourth internal electrode 154 do not overlap in the stacking direction T.

[0068] For example, as long as they do not overlap in the stacking direction T, the positions of the first connection side end 151c, the second non-connection side end 152n, the third connection side end 153c, and the fourth non-connection side end 154n in the length direction L from the first end face C1 may be in any order.

[0069] Furthermore, as long as they do not overlap in the stacking direction T, the positions of the first non-connection side end 151n, the second connection side end 152c, the third non-connection side end 153n, and the fourth connection side end 154c in the length direction L from the second end face C2 may be in any order.

[0070] In the above, the internal electrode 15 has an approximately rectangular main body portion 15A and a lead portion 15B extending from the main body portion 15A to one end face C and connected to the external electrode, and the lead portion 15B is an approximately rectangular main body portion having a smaller dimension in the width direction W than the main body portion 15A. However, this is not limited to this, and the internal electrode 15 may have, for example, the following form.

[0071] (Modification 1) Fig. 6 is a diagram illustrating Modification 1 of the internal electrode 15. In Fig. 6, the first internal electrode 151, the second internal electrode 152, the third internal electrode 153, and the fourth internal electrode 154 will be collectively described. Note that the same reference numerals as in the embodiment will be used in the modification.

[0072] As shown in the figure, the lead portion 15B of the internal electrode 15 of the first modified embodiment has an inclined portion 15C whose dimension in the width direction W decreases from the main body portion 15A side toward one end face.

[0073] That is, in variant 1, the first lead portion 151B of the first internal electrode 151 has a first inclined portion in which the dimension in the width direction W decreases from the first main body portion 151A side of the first lead portion 151B toward the first end face C1, the second lead portion 152B of the second internal electrode 152 has a second inclined portion in which the dimension in the width direction W decreases from the second main body portion 152A side of the second lead portion 152B toward the second end face C2, the third lead portion 153B of the third internal electrode 153 has a third inclined portion in which the dimension in the width direction W decreases from the third main body portion 153A side of the third lead portion 153B toward the first end face C1, and the fourth lead portion 154B of the fourth internal electrode 154 has a fourth inclined portion in which the dimension in the width direction W decreases from the fourth main body portion 154A side of the fourth lead portion 154B toward the second end face C2.

[0074] The dimension Lb1 of the inclined portion 15C in the length direction L is 1% to 100% of the dimension Lb of the lead-out portion 15B in the length direction L. FIG. 6( a) shows an example in which Lb1 is 50% of Lb, and FIG. 6( b) shows an example in which Lb1 is 100% of Lb. As shown in FIG. 6( a), the portion of the lead-out portion 15B other than the inclined portion 15C may be rectangular. As shown in FIG. 6( b), the entire lead-out portion 15B may be an inclined portion whose width gradually decreases.

[0075] (Modification 2) Fig. 7 is a diagram illustrating modification 2 of the internal electrode 15. In Fig. 7 as well, the first internal electrode 151, the second internal electrode 152, the third internal electrode 153, and the fourth internal electrode 154 will be described collectively.

[0076] As shown in the figure, the lead portion 15B of the internal electrode 15 in the second modified embodiment has an inclined portion 15C whose dimension in the width direction W decreases from the main body portion 15A side toward one end face, similar to the first modified embodiment.

[0077] The inclination angle θ of the internal electrode 15 in FIG. 7( a) is smaller than the inclination angle θ of the internal electrode 15 in FIG. 7( b). Here, the inclination angle θ is the angle between a line substantially parallel to the longitudinal direction L and the contour of the inclined portion. In Modification 2, the inclination angle θ of the first lead portion 151B connected to the first end face C1 is different from the inclination angle θ of the third lead portion 153B. For example, if one of FIG. 7( a) and FIG. 7( b) is the first lead portion 151B, the other of FIG. 7( a) and FIG. 7( b) is the third lead portion 153B. The inclination angle θ of the second lead portion 152B connected to the second end face C2 is different from the inclination angle θ of the fourth lead portion 154B. For example, if one of FIG. 7(a) and FIG. 7(b) is the second drawer section 152B, the other of FIG. 7(a) and FIG. 7(b) is the fourth drawer section 154B.

[0078] (Modification 3) Fig. 8 is a diagram illustrating modifications 3 and 4 of the internal electrode 15. In Fig. 8 as well, the first internal electrode 151, the second internal electrode 152, the third internal electrode 153, and the fourth internal electrode 154 will be described collectively.

[0079] As shown in the figure, the lead portion 15B of the internal electrode 15 in the third and fourth modified embodiments also has an inclined portion 15C whose dimension in the width direction W decreases from the main body portion 15A side toward one end face, similar to the first modified embodiment.

[0080] The dimension in the width direction W2 of the connection portion between the lead portion 15B of the internal electrode 15 in Figure 8(a) and the end face C is larger than the dimension in the width direction W2 of the connection portion between the lead portion 15B of the internal electrode 15 in Figure 8(b) and the end face C.

[0081] In the third modified embodiment, the dimension W2 in the width direction W of the connection portion of the first lead portion 151B connected to the first end surface C1 is different from the dimension W2 in the width direction W of the connection portion of the third lead portion 153B. For example, if one of Figures 8(a) and 8(b) is the first lead portion 151B, the other of Figures 8(a) and 8(b) is the third lead portion 153B.

[0082] The dimension W2 of the connection portion of the second lead portion 152B connected to the second end surface C2 in the width direction W is different from the dimension W2 of the connection portion of the fourth lead portion 154B in the width direction W. For example, if one of Figures 8(a) and 8(b) is the second lead portion 152B, the other of Figures 8(a) and 8(b) is the fourth lead portion 154B.

[0083] (Variation 4) In Variation 4, the dimension W2 in the width direction W of the connecting portion of the first lead portion 151B is different from the dimension W2 in the width direction W of the connecting portion of the second lead portion 152B. The dimension W2 in the width direction W of the connecting portion of the third lead portion 153B is different from the dimension W2 in the width direction W of the connecting portion of the fourth lead portion 154B. For example, if one of FIG. 8( a) or FIG. 8(b) is the first lead portion 151B, the other of FIG. 8( a) or FIG. 8(b) is the second lead portion 152B. If one of FIG. 8( a) or FIG. 8(b) is the third lead portion 153B, the other of FIG. 8( a) or FIG. 8(b) is the fourth lead portion 154B.

[0084] (Variant 5) In variant 5, the dimension in the width direction W of the first drawer portion 151B may be different from the dimension in the width direction W of the second drawer portion 152B, and the dimension in the width direction W of the third drawer portion 153B may be different from the dimension in the width direction W of the fourth drawer portion 154B.

[0085] (Variant 6) In variant 6, the dimension in the width direction W of the first internal electrode 151 at the first end face C1 may be different from the dimension in the width direction W of the third internal electrode 153 at the first end face C1, and the dimension in the width direction W of the second internal electrode 152 at the second end face C2 may be different from the dimension in the width direction W of the fourth internal electrode 154 at the second end face C2.

[0086] (Variation 7) In variation 7, further, the first internal electrode 151 may have a first connecting portion connected to the first body portion 151A, arranged on the second end face C2 side, and shaped so that the dimension in the width direction W gradually decreases; the second internal electrode 152 may have a second connecting portion connected to the second body portion 152A, arranged on the first end face C1 side, and shaped so that the dimension in the width direction W gradually decreases; the third internal electrode 153 may have a third connecting portion connected to the third body portion 153A, arranged on the second end face C2 side, and shaped so that the dimension in the width direction W gradually decreases; and the fourth internal electrode 154 may have a fourth connecting portion connected to the fourth body portion 154A, arranged on the first end face C1 side, and shaped so that the dimension in the width direction W gradually decreases.

[0087] 9 is a diagram showing an eighth modified embodiment of the internal electrode 15. As shown in the figure, the non-connection side end 15n of the main body 15A of the internal electrode 15 may have a shape with a notch 15m where a corner is notched at an angle. The shape with the notch 15m where a corner is notched at an angle means that the non-connection side end 15n, which in the embodiment has a substantially right angle, is cut at an angle, i.e., cut into a triangular shape.

[0088] 10 is a diagram showing a 9th modified embodiment of the internal electrode 15. As shown in the figure, the non-connection side end 15n of the main body 15A of the internal electrode 15 may have a shape with a notch 15o cut out in an arc shape at a corner. The shape with the notch 15o cut out in an arc shape at a corner means that the non-connection side end 15n, which was a substantially right angle in the embodiment, is cut into an arc shape, and the contour of the non-connection side end 15n becomes an arc shape.

[0089] (Method of Manufacturing Multilayer Ceramic Capacitor 1) The multilayer ceramic capacitor 1 of the embodiment including the modified form can be manufactured by the following steps.

[0090] (1) Ceramic Slurry Preparation Step: Prepare a ceramic raw material powder, such as a barium titanate-based material, a resin binder such as polyvinyl butyral, a plasticizer such as dioctyl phthalate, and a solvent such as ethanol and toluene, and then mix and disperse these to prepare a ceramic slurry.

[0091] (2) Ceramic Green Sheet Preparation Step Next, the ceramic slurry is used to prepare ceramic green sheets having a thickness of 3 μm.

[0092] (3) Internal Electrode Printing Step Then, a conductive paste containing a non-metallic powder as a conductive component is printed on the surface of the ceramic green sheet (ceramic layer) by screen printing. Note that the printing method is not limited to screen printing, and gravure printing may also be used. In this internal electrode printing step, a ceramic green sheet on which patterns of the first internal electrode 151 and the second internal electrode 152 are printed and a ceramic green sheet on which patterns of the third internal electrode 153 and the fourth internal electrode 154 are printed are prepared.

[0093] (When having an inclined portion) In addition, when having an inclined portion 15C as in the modified embodiment, that is, when the first internal electrode 151 has a first lead portion 151B having an inclined portion whose width dimension gradually decreases, the second internal electrode 152 has a second lead portion 152B having an inclined portion whose width dimension gradually decreases, the third internal electrode 153 has a third lead portion 153B having an inclined portion whose width dimension gradually decreases, and the fourth internal electrode 154 has a fourth lead portion 154B having an inclined portion whose width dimension gradually decreases, ceramic green sheets on which internal electrode 15 patterns of these shapes are printed are prepared.

[0094] In this embodiment, the first lead portion 151B and the third lead portion 153B have different dimensions in the length direction L, and the second lead portion 152B and the fourth lead portion 154B have different dimensions in the length direction L, and internal electrode patterns are printed on the ceramic green sheets.

[0095] However, the first lead portion 151B and the third lead portion 153B may be printed to have the same dimensions in the length direction L, and the second lead portion 152B and the fourth lead portion 154B may be printed to have the same dimensions in the length direction L, and in the next (4) stacking process, the internal electrode patterns may be shifted and stacked so that the first connection side end portion 151c and the third connection side end portion 153c, and the second connection side end portion 152c and the fourth connection side end portion 154c do not overlap in the stacking direction T.

[0096] (4) Lamination process: The ceramic green sheets on which the internal electrode patterns are formed are then laminated, and ceramic green sheets (dummy sheets) 3b on which no internal electrode patterns are formed are further laminated on top and bottom of the laminate to form a mother block. After pressing this mother block, it is cut into a product having dimensions of, for example, 3.2 mm in length × 1.6 mm in width × 1.6 mm in height, thereby obtaining an unfired laminate 2.

[0097] Here, when internal electrode patterns in which the first lead portion 151B and the third lead portion 153B have different dimensions in the length direction L and the second lead portion 152B and the fourth lead portion 154B have different dimensions in the length direction L are printed on the surface of the ceramic green sheets, the positions of the ceramic green sheets are adjusted and stacked so that the first non-connection side end portion 151n and the third non-connection side end portion 153n, and the second non-connection side end portion 152n and the fourth non-connection side end portion 154n overlap.

[0098] In this case, the first connection side end 151c and the third connection side end 153c, and the second connection side end 152c and the fourth connection side end 154c naturally do not overlap in the stacking direction T.

[0099] When the first lead portion 151B and the third lead portion 153B are printed to have the same dimension in the length direction L, and the second lead portion 152B and the fourth lead portion 154B are printed to have the same dimension in the length direction L, the ceramic green sheets are stacked with a shift in the length direction L so that the first connection side end portion 151c and the third connection side end portion 153c, and the second connection side end portion 152c and the fourth connection side end portion 154c do not overlap in the stacking direction T. The amount of shift is adjusted so that the first main body portion 151A and the third main body portion 153A do not extend to the second end face C2, and the second main body portion 152A and the fourth main body portion 154A do not extend to the first end face C1.

[0100] (5) Baking process After that, degreasing and further N ２ +H ２ (H ２ The mixture is fired at 1300°C in a furnace with an atmospheric pressure of 5%.

[0101] (6) External Electrode Forming Step After firing, a Cu paste is applied to both ends of the laminate 2 and baked, and Ni plating and Sn plating are then applied thereon to form a pair of external electrodes 3 .

[0102] As a result, the multilayer ceramic capacitor 1 of the embodiment is obtained.

[0103] (Verification Results) Next, a description will be given of the results of an experiment conducted to verify the effect of reducing peeling in the multilayer ceramic capacitor 1 according to the embodiment. In order to verify this effect, a multilayer ceramic capacitor of a comparative example and a multilayer ceramic capacitor of an example according to the embodiment were prepared.

[0104] (Comparative Example) Comparative multilayer ceramic capacitor (conventional product) Chip size: Length L dimension 2.1 mm Width W dimension 1.3 mm Lamination direction T dimension 1.3 mm Internal electrode shape: Main body rectangular Lead-out portion has an inclined portion, and the portion of the lead-out portion other than the inclined portion is rectangular

[0105] The multilayer ceramic capacitor of the comparative example was laminated so that the ends of the first connection side end 151c and the third connection side end 153c all overlapped in the lamination direction T. The ends of the second connection side end 152c and the third connection side end 153c all overlapped in the lamination direction T. The distance in the length direction L between the first connection side end 151c and the third connection side end 153c (the amount of offset of the ends) was 0 μm. The distance in the length direction L between the second connection side end 152c and the fourth connection side end 154c (the amount of offset of the ends) was 0 μm.

[0106] Example 1 Multilayer ceramic capacitor of Example 1 Chip size: Length direction L dimension 2.1 mm Width direction W dimension 1.3 mm Lamination direction T dimension 1.3 mm Internal electrode shape: Main body: rectangular Lead-out portion: has an inclined portion, and the portion of the lead-out portion other than the inclined portion is rectangular

[0107] 11 shows the dimensions of the body portion 151A of the first internal electrode 151, the body portion 152A of the second internal electrode 152, the body portion 153A of the third internal electrode 153, and the body portion 153A of the fourth internal electrode 154 of the multilayer ceramic capacitor 1 of Example 1. Fig. 12 shows the dimensions of the lead portion 151B of the first internal electrode 151, the lead portion 152B of the second internal electrode 152, the lead portion 153B of the third internal electrode 153, and the lead portion 154B of the fourth internal electrode 154 of the multilayer ceramic capacitor 1 of Example 1. The positions of each dimension are shown in Fig. 7(a).

[0108] The first internal electrode 151, second internal electrode 152, third internal electrode 153, and fourth internal electrode 154 having the sizes shown in Figures 11 and 12 were stacked so that the first connection side end 151c and the third connection side end 153c, and the second connection side end 152c and the fourth connection side end 154c did not overlap in the stacking direction T. The distance (shift amount) Ld1 between the first connection side end 151c and the third connection side end 153c in the length direction L was 45 µm, and the distance (shift amount) Ld2 between the second connection side end 152c and the fourth connection side end 154c in the length direction L was 45 µm. The positions of these shift amounts are shown in Figure 4.

[0109] Example 2 Multilayer ceramic capacitor of Example 2 Chip size: Length direction L dimension 2.0 mm Width direction W dimension 1.2 mm Lamination direction T dimension 1.2 mm Internal electrode shape: Main body: rectangular Lead-out portion: has an inclined portion, and the portion of the lead-out portion other than the inclined portion is rectangular

[0110] 13 shows the dimensions of the body portion 151A of the first internal electrode 151, the body portion 152A of the second internal electrode 152, the body portion 153A of the third internal electrode 153, and the body portion 153A of the fourth internal electrode 154 of the multilayer ceramic capacitor 1 of Example 2. Also, Fig. 14 shows the dimensions of the lead portion 151B of the first internal electrode 151, the lead portion 152B of the second internal electrode 152, the lead portion 153B of the third internal electrode 153, and the lead portion 154B of the fourth internal electrode 154 of the multilayer ceramic capacitor 1 of Example 2.

[0111] 13 and 14 were stacked such that the first connection side end 151c and the third connection side end 153c, and the second connection side end 152c and the fourth connection side end 154c did not overlap in the stacking direction T. The distance (shift amount) Ld1 in the length direction L between the first connection side end 151c and the third connection side end 153c was 88 μm, and the distance (shift amount) Ld1 in the length direction L between the second connection side end 152c and the fourth connection side end 154c was 88 μm.

[0112] (Verification Method) First, it was confirmed by the above-described (confirmation method) whether the multilayer ceramic capacitor 1 has Feature 1 that the shift amount of Comparative Example 1 is 0 μm, the shift amount Ld1 of Example 1 is 45 μm, and the shift amount Ld1 of Example 2 is 88 μm.

[0113] (Method of Defect Confirmation) Next, the confirmation of defects due to peeling in Comparative Example 1, Example 1, and Example 2 was performed using the following method. (1) To observe the internal electrodes 15 near the outer layer portions 12, the internal electrode 15 closest to the outer layer portion 12 was exposed, and the internal electrode 15 was polished along the cross section in the length direction L and width direction W to a thickness (depth in the stacking direction T) equivalent to 3% of the total number of laminated internal electrodes 15. (2) This cross section was continuously observed using a microscope with a magnification of 200x. Multilayer ceramic capacitors in which voids (white) were observed near the non-connection side end 15n and connection side end 15c of the internal electrodes 15 were determined to have peeling. The same confirmation was performed on 50 multilayer ceramic capacitors each in Comparative Example 1, Example 1, and Example 2. The number of multilayer ceramic capacitors 1 in which peeling was observed was then counted.

[0114] Fig. 15 shows the results of confirming defects due to peeling in Comparative Example 1, Example 1, and Example 2. As shown in the table in Fig. 15, in the Comparative Example, one defect in which peeling was found was found out of 50 pieces, while in Examples 1 and 2, there were no defects out of 50 pieces. This proves the effect of reducing the occurrence of peeling in the multilayer ceramic capacitor 1 of the embodiment.

[0115] Although the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various changes and modifications can be made as follows.

[0116] <1> A multilayer ceramic capacitor comprising: a laminate having a plurality of dielectric layers and a plurality of internal electrodes stacked alternately; first and second main surfaces opposing each other in a stacking direction; first and second side surfaces opposing each other in a width direction perpendicular to the stacking direction; and first and second end surfaces opposing each other in a length direction perpendicular to the stacking direction and the width direction; a first external electrode arranged on the first end surface; and a second external electrode arranged on the second end surface, wherein the internal electrodes include a first internal electrode, a second internal electrode, a third internal electrode, and a fourth internal electrode arranged on different planes, the first internal electrode having: a first main body portion that is substantially rectangular or has a notch on the first end surface side; and a first lead portion that is connected to the first main body portion, has a dimension in the width direction smaller than that of the first main body portion, and is led out to the first end surface, the first main body portion having: a first non-connection side end portion located on the second end surface side; and a first connection side end portion located on the first end surface side. the second internal electrode has: a second body portion that is generally rectangular or has a notch on the first end face side; a second lead portion that is connected to the second body portion, has a smaller dimension in the width direction than the second body portion, and is led out to the second end face; the second body portion has: a second non-connection side end portion located on the first end face side; and a second connection side end portion located on the second end face side; the third internal electrode has: a third body portion that is generally rectangular or has a notch on the second end face side; a fourth drawn-out portion connected to the fourth main body portion, having a smaller dimension in the width direction than the fourth main body portion, and drawn out to a second end face; the fourth main body portion has a fourth non-connection side end portion located on the first end face side and a fourth connection side end portion located on the second end face side, and the first connection side end portion and the third connection side end portion do not overlap each other in the stacking direction,the second connection side end and the fourth connection side end do not overlap with each other in the stacking direction.

[0117] <2> The multilayer ceramic capacitor according to <1>, wherein, in the stacking direction, the first non-connection side end, the second connection side end, and the fourth connection side end do not overlap with each other; in the stacking direction, the second non-connection side end, the first connection side end, and the third connection side end do not overlap with each other; in the stacking direction, the third non-connection side end, the second connection side end, and the fourth connection side end do not overlap with each other; and in the stacking direction, the fourth non-connection side end, the first connection side end, and the third connection side end do not overlap with each other.

[0118] <3> The multilayer ceramic capacitor according to <1> or <2>, wherein the first non-connection side end and the third non-connection side end do not overlap with each other in the stacking direction, and the second non-connection side end and the fourth non-connection side end do not overlap with each other in the stacking direction.

[0119] <4> The multilayer ceramic capacitor according to any one of <1> to <3>, wherein the first lead portion and the third lead portion have different dimensions in the length direction, and the second lead portion and the fourth lead portion have different dimensions in the length direction.

[0120] <5> The multilayer ceramic capacitor according to any one of <1> to <4>, wherein the internal electrode is connected to the second end surface side of the first body portion and has a first connecting portion shaped such that the dimension in the width direction decreases from the first body portion side toward the second end surface side; the second internal electrode is connected to the first end surface side of the second body portion and has a second connecting portion shaped such that the dimension in the width direction decreases from the first body portion side toward the first end surface side; the third internal electrode is connected to the second end surface side of the third body portion and has a third connecting portion shaped such that the dimension in the width direction decreases from the first body portion side toward the second end surface side; and the fourth internal electrode is connected to the first end surface side of the fourth body portion and has a fourth connecting portion shaped such that the dimension in the width direction decreases from the first body portion side toward the first end surface side.

[0121] <6> The multilayer ceramic capacitor according to any one of <1> to <5>, wherein a plurality of sets of the first internal electrode, the second internal electrode, the third internal electrode, and the fourth internal electrode are laminated, and in each set, the internal electrode is arranged in the following order: one of the first internal electrode or the third internal electrode, one of the second internal electrode or the fourth internal electrode, the other of the first internal electrode or the third internal electrode, and the other of the second internal electrode or the fourth internal electrode.

[0122] <7> The multilayer ceramic capacitor according to any one of <1> to <6>, wherein the first lead portion has a first inclined portion whose dimension in the width direction decreases from the first main body portion side toward the first end face side; the second lead portion has a second inclined portion whose dimension in the width direction decreases from the second main body portion side toward the second end face; the third lead portion has a third inclined portion whose dimension in the width direction decreases from the third main body portion side toward the first end face; and the fourth lead portion has a fourth inclined portion whose dimension in the width direction decreases from the fourth main body portion side toward the second end face.

[0123] <8> The multilayer ceramic capacitor according to <7>, wherein an inclination angle of the first inclined portion is different from an inclination angle of the third inclined portion, and an inclination angle of the second inclined portion is different from an inclination angle of the fourth inclined portion.

[0124] <9> The multilayer ceramic capacitor according to any one of <1> to <8>, wherein the first lead portion and the second lead portion have different widthwise dimensions, and the third lead portion and the fourth lead portion have different widthwise dimensions.

[0125] <10> The multilayer ceramic capacitor according to any one of <1> to <9>, wherein the dimension in the width direction of the first internal electrode at the first end face is different from the dimension in the width direction of the third internal electrode at the first end face, and the dimension in the width direction of the second internal electrode at the second end face is different from the dimension in the width direction of the fourth internal electrode at the second end face.

[0126] C End face C1 First end face C2 Second end face 1 Multilayer ceramic capacitor 2 Laminate 3 External electrode 3A First external electrode 3B Second external electrode 12 Outer layer portion 14 Dielectric layer 15 Internal electrode 15A Main body portion 15B Lead portion 15C Sloped portion 15c Connection side end 15n Non-connection side end 151 First internal electrode 151A First main body portion 151B First lead portion 151c First connection side end 151n First non-connection side end 152 Second internal electrode 152A Second main body portion 152B Second lead portion 152c Second connection side end 152n Second non-connection side end 153 Third internal electrode 153A Third main body portion 153B Third lead portion 153c Third connection side end 153n Third non-connection side end 154 Fourth internal electrode 154A Fourth main body portion 154B Fourth lead portion 154c Fourth connection side end 154n Fourth non-connection side end

Claims

1. A multilayer ceramic capacitor comprising: a laminate having a plurality of dielectric layers and a plurality of internal electrodes stacked alternately with each other; a first main surface and a second main surface opposing each other in a stacking direction; a first side surface and a second side surface opposing each other in a width direction perpendicular to the stacking direction; and a first end surface and a second end surface opposing each other in a length direction perpendicular to the stacking direction and the width direction; a first external electrode arranged on the first end surface; and a second external electrode arranged on the second end surface, wherein the internal electrodes have a first internal electrode, a second internal electrode, a third internal electrode, and a fourth internal electrode each arranged on different planes, the first internal electrode having a first main body portion that is substantially rectangular or has a notch on the first end surface side; and a first lead portion connected to the first main body portion, has a dimension in the width direction smaller than that of the first main body portion, and is led out to the first end surface, and the first main body portion has a first non-connected side end portion located on the second end surface side, the second internal electrode has a second main body portion that is generally rectangular or has a notch on the first end face side, and a second lead portion that is connected to the second main body portion, has a dimension in the width direction smaller than that of the second main body portion, and is led out to the second end face, the second main body portion has a second non-connection side end portion that is located on the first end face side, and a second connection side end portion that is located on the second end face side, the third internal electrode has a third main body portion that is generally rectangular or has a notch on the second end face side, and a third lead portion that is connected to the third main body portion, has a dimension in the width direction smaller than that of the third main body portion, and is led out to the first end face, the third main body portion has a third non-connection side end portion that is located on the second end face side, and a third connection side end portion that is located on the first end face side, a fourth drawn-out portion connected to the fourth main body portion, having a smaller dimension in the width direction than the fourth main body portion, and drawn out to a second end face; the fourth main body portion has a fourth non-connection side end portion located on the first end face side and a fourth connection side end portion located on the second end face side, and in the stacking direction, the first connection side end portion and the third connection side end portion do not overlap each other,the second connection side end portion and the fourth connection side end portion do not overlap with each other in the stacking direction.

2. The multilayer ceramic capacitor according to claim 1, wherein in the stacking direction, the first non-connection side end, the second connection side end, and the fourth connection side end do not overlap each other, in the stacking direction, the second non-connection side end, the first connection side end, and the third connection side end do not overlap each other, in the stacking direction, the third non-connection side end, the second connection side end, and the fourth connection side end do not overlap each other, in the stacking direction, and the fourth non-connection side end, the first connection side end, and the third connection side end do not overlap each other in the stacking direction.

3. The multilayer ceramic capacitor according to claim 1 or 2, wherein the first non-connection side end and the third non-connection side end do not overlap with each other in the stacking direction, and the second non-connection side end and the fourth non-connection side end do not overlap with each other in the stacking direction.

4. A multilayer ceramic capacitor as claimed in any one of claims 1 to 3, wherein the first lead portion and the third lead portion have different dimensions in the length direction, and the second lead portion and the fourth lead portion have different dimensions in the length direction.

5. The multilayer ceramic capacitor according to any one of claims 1 to 4, wherein the internal electrode has a first connecting portion connected to the second end face side of the first body portion and has a shape such that the dimension in the width direction decreases from the first body portion side toward the second end face side; the second internal electrode has a second connecting portion connected to the first end face side of the second body portion and has a shape such that the dimension in the width direction decreases from the first body portion side toward the first end face side; the third internal electrode has a third connecting portion connected to the second end face side of the third body portion and has a shape such that the dimension in the width direction decreases from the first body portion side toward the second end face side; and the fourth internal electrode has a fourth connecting portion connected to the first end face side of the fourth body portion and has a shape such that the dimension in the width direction decreases from the first body portion side toward the first end face side.

6. A multilayer ceramic capacitor according to any one of claims 1 to 5, wherein a plurality of sets of the first internal electrode, the second internal electrode, the third internal electrode, and the fourth internal electrode are laminated, and in each set, the internal electrodes are arranged in the following order: one of the first internal electrode or the third internal electrode, one of the second internal electrode or the fourth internal electrode, the other of the first internal electrode or the third internal electrode, and the other of the second internal electrode or the fourth internal electrode.

7. A multilayer ceramic capacitor as claimed in any one of claims 1 to 6, wherein the first drawn-out portion has a first inclined portion whose width dimension decreases from the first main body portion side towards the first end face side, the second drawn-out portion has a second inclined portion whose width dimension decreases from the second main body portion side towards the second end face, the third drawn-out portion has a third inclined portion whose width dimension decreases from the third main body portion side towards the first end face, and the fourth drawn-out portion has a fourth inclined portion whose width dimension decreases from the fourth main body portion side towards the second end face.

8. The multilayer ceramic capacitor according to claim 7, wherein an inclination angle of the first inclined portion is different from an inclination angle of the third inclined portion, and an inclination angle of the second inclined portion is different from an inclination angle of the fourth inclined portion.

9. A multilayer ceramic capacitor as described in any one of claims 1 to 8, wherein the width dimension of the first lead portion is different from the width dimension of the second lead portion, and the width dimension of the third lead portion is different from the width dimension of the fourth lead portion.

10. A multilayer ceramic capacitor as described in any one of claims 1 to 9, wherein the width dimension of the first internal electrode at the first end face is different from the width dimension of the third internal electrode at the first end face, and the width dimension of the second internal electrode at the second end face is different from the width dimension of the fourth internal electrode at the second end face.

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