Brain wave measurement device and brain wave measurement method

Abstract

A brain wave measurement device comprising an electrode unit that contacts a measurement site on a subject's head and acquires a brain wave signal, a support member (20) that supports the electrode unit, and an attachment unit (70) (facilitating member) that facilitates the disposition of the support member (20) on the head, wherein: the support member (20) comprises an inelastic film member and a mounting portion (25) that the electrode unit is electrically connected to and fixed to; the film member comprises an inelastic base material and a circuit pattern provided to the base material; and the circuit pattern is connected to the mounting portion (25).

Description

Electroencephalogram measuring device and electroencephalogram measuring method

[0001] The present invention relates to an electroencephalogram measuring device and an electroencephalogram measuring method.

[0002] Various developments have been made with regard to electroencephalogram (EEG) measuring devices for measuring brain waves. One known example of this type of technology is an EEG measuring device that includes a support made of a shape-memory material, which is a headband worn on the user's head, and a vital sensor attached to the support for acquiring the user's biosignals (see, for example, Patent Document 1). According to the technology disclosed in Patent Document 1, when measuring biosignals, the support can be easily restored to a shape that matches the user's body shape, which has been previously stored in shape.

[0003] Patent No. 5900167

[0004] However, in EEG measurement, multiple electrodes are placed in contact with the head (i.e., scalp), which means that the number of signal wires connected to these electrodes increases, and there is a concern that the entire device becomes complicated. The technology disclosed in Patent Document 1 does not take into consideration the wiring structure, and a new technology was needed.

[0005] The present invention has been made in view of the above circumstances, and aims to provide a technique for simplifying the wiring structure connected to the electrodes of an electroencephalogram measuring device.

[0006] According to the present invention, the following techniques are provided: (1) An electroencephalogram (EEG) measuring device comprising: an electrode unit that contacts a measurement site on a subject's head to acquire an EEG signal; a support member that supports the electrode unit; and a support member that assists in positioning the support member on the head, wherein the support member comprises a non-stretchable film member and a mounting portion to which the electrode unit is electrically connected and fixed, and the film member comprises a non-stretchable base material and a circuit pattern provided on the base material, the circuit pattern being connected to the mounting portion. (2) The electroencephalogram (EEG) measuring device according to (1), further comprising an electromagnetic wave shielding member that covers the circuit pattern. (3) The electroencephalogram (EEG) measuring device according to (1) or (2), wherein the film member is elongated, and wherein a plurality of the electrode units are arranged side by side at predetermined intervals in the longitudinal direction of the film member. (4) The electroencephalogram (EEG) measuring device according to any one of (1) to (3), wherein the electrode unit comprises a base portion, a plurality of protrusions provided on the base portion, and electrode portions provided on the protrusions and in contact with the head. (5) The electroencephalogram measuring device according to (4), wherein the convex portion is an elastic member. (6) The electroencephalogram measuring device according to any one of (1) to (5), wherein the support member is provided at an end of the support member, attached to the ear or chin, and supports the positioning of the support member to the shape of the head. (7) The electroencephalogram measuring device according to any one of (1) to (6), wherein the support member has a spring member. (8) The electroencephalogram measuring device 10 according to any one of (1) to (7), wherein the support member has a member for adjusting its length. (9) The electroencephalogram measuring device 10 according to any one of (1) to (8), wherein the support member is bent at the attachment positions of the electrode units, and the vertices are connected in a straight line. (10) An electroencephalogram measuring method for measuring electroencephalograms by wearing the electroencephalogram measuring device according to any one of (1) to (9) on the head of a subject.

[0007] According to the present invention, it is possible to provide a technique for simplifying the wiring structure connected to the electrodes of an electroencephalogram measuring device.

[0008] FIG. 1 is a schematic diagram showing a state in which an electroencephalogram measuring device is attached to a head according to an embodiment. FIG. 2 is a diagram showing a support member and an attachment portion (support member) that support an electrode unit according to an embodiment. FIG. 3 is a diagram showing a circuit pattern of a support member according to an embodiment. FIG. 4 is a cross-sectional view of an electrode unit attached to a support member according to an embodiment. FIG. 5 is a cross-sectional view of an electrode unit attached to a support member according to a modified embodiment of an embodiment. FIG. 6 is a cross-sectional view of a support member according to an embodiment. FIG. 7 is a diagram schematically showing a tension display unit according to an embodiment. FIG. 8 is a diagram explaining a model of the force acting on the head when an electroencephalogram measuring device is attached according to an embodiment. FIG. 9 is a diagram explaining the capstan principle (equation) used for modeling according to an embodiment. FIG. 10 is a graph showing theoretical values ​​(calculated values) and actual measured values ​​of electrode pressing force F according to an example.

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, an electroencephalogram (EEG) measuring device having an electrode unit and worn on the head of a subject to acquire electroencephalograms, and an electroencephalogram measuring method using the electroencephalogram measuring device will be described.

[0010] <General Structure of EEG Measuring Device> Fig. 1 is a schematic diagram showing an EEG measuring device 10 attached to a person's head 99, as viewed from the front. Fig. 2 is a diagram showing a support member 20 and an attachment portion 70 (support member) that support an electrode unit 30. In this embodiment, an EEG measuring device 10 that measures EEGs at electrode positions Cz, C3, C4, T3, and T4 (International 10-20 system) is illustrated. Fig. 3 is a diagram showing a circuit pattern 22 of the support member 20. Fig. 4 is a cross-sectional view of the electrode unit 30 attached to the support member 20.

[0011] The EEG measuring device 10 is attached to a person's head 99, detects EEGs as potential fluctuations from the living body, and outputs the detected EEGs to an EEG display device (not shown). The EEG display device acquires the EEGs detected by the EEG measuring device 10, displays them on a monitor, stores the data, and performs well-known EEG analysis processing (measurement processing).

[0012] The EEG measuring device 10 has a plurality of electrode units 30 that contact measurement sites (i.e., the head 99) of the subject to acquire EEG biosignals, a support member 20 having a non-stretchable film member (also referred to as a long sheet-like member or ribbon member) to which the electrode units 30 are attached and supported, and an attachment section 70 used to secure the support member 20 to the head 99. In this embodiment, the attachment section 70 is attached to the ear of the subject, and functions as a support member for securing the EEG measuring device 10 to the head 99. The attachment section 70 has a tension display section 60. The tension display section 60 recognizably indicates the tension acting on the support member 20. The non-stretchability of the film member is determined by the Poisson's ratio, which will be described later, being within a predetermined range.

[0013] The support member 20 (film member) has a circuit pattern 22 and a mounting portion 25. The mounting portion 25 has the electrode unit 30 electrically connected and fixed thereto. The circuit pattern 22 connects the electrode unit 30 to an external electroencephalogram display device or the like via the mounting portion 25. By employing such a structure, the wiring structure of the electroencephalogram measuring device 10 is made neat and tidy. To achieve such a structure, a flexible circuit (also called a flexible substrate) is used as the support member 20.

[0014] The support member 20 is configured to bend freely to a certain degree at least in the thickness direction. Furthermore, no component (such as a hard component like a helmet) is provided to surround or predefine the shape of the support member 20. When not attached to the head 99, the support member 20 can be flat without any external force. When attached to the head 99, the support member 20 has the flexibility to change shape to fit the shape of the head 99, mainly due to gravity. In this embodiment, the support member 20 bends at the electrode unit 30 (mounting portion 25) so as to form a polygon (or broken line) with the electrode unit 30 (mounting portion 25) as its vertices and the sides connecting the vertices as the support member 20. Because both ends of the electrode unit 30 may be raised above the head 99 due to factors such as hair, the attachment portion 70 is used to support the support member 20 in conforming to the shape of the head 99.

[0015] The support member 20 has a recessed snap button 25a formed of a conductive metal as the mounting portion 25. The recessed snap button 25a is fitted with a convex snap button 35 of the electrode unit 30, thereby fixing the electrode unit 30 to the support member 20. The recessed snap button 25a has sufficient strength so that the electrode unit 30 is stably fixed. This strength is adjusted appropriately depending on the force acting on the electrode unit 30. Furthermore, because the recessed snap button 25a is formed of a conductive metal, when the convex snap button 35 of the electrode unit 30 is fitted with the recessed snap button 25a, the electrode unit 30 is electrically connected to the circuit pattern 22 via the recessed snap button 25a.

[0016] Furthermore, the position in the left-right direction of the support member 20 where the concave snap button 25a is provided is exactly at the bent portion 27 where the support member 20 is bent. The presence of the bent portion 27 allows the extension direction of the support member 20 between the electrode units 30 to be linear. Note that the provision of the concave snap button 25a may result in the bent portion 27 not being completely bent and being deformed to a certain extent, including curvature, etc. Even in this case, it is sufficient as long as the deformation is to the extent that the capstan principle (capstan equation) described below can be applied. This is appropriately adjusted depending on the thickness of the concave snap button 25a and the base material 21, etc. Furthermore, if the support member 20 is sufficiently thin and deformation to the extent that the capstan principle (capstan equation) can be applied can be achieved without providing the bent portion 27, the bent portion 27 can be omitted.

[0017] The attachment section 70 has an ear attachment section 40, an adjustment section 50, and a tension display section 60, which are connected by inextensible members (here, strings 45, 55).

[0018] When the electroencephalogram (EEG) measuring device 10 is attached to the head 99, the positions of the electrode units 30 are roughly the vertices of a polygon, and the electrode units 30 are spanned by the support member 20. In other words, the support member 20 is bent exactly at the portion (bending portion 27) where the electrode units 30 are attached. The bending portion 27 is located at a position corresponding to the vertex of the polygon. The force acting on the head 99 (electrode pressing force F on the head) is calculated using the capstan principle (capstan equation) modeled using this polygon. This will be described later. Each component will be described in detail below.

[0019] <Electrode unit> The electrode units 30 are detachably provided only at the sites required for EEG measurement. The electrode units 30 are attached at positions corresponding to, for example, T3, C3, Cz, C4, and T4 in the International 10-20 electrode placement method, and are arranged symmetrically in front view as shown in Figure 1.

[0020] The electrode unit 30 is configured as a so-called button electrode, as shown in Fig. 4, for example. Specifically, the electrode unit 30 has a cylindrical base 31, a protrusion 32 integrally provided on one end of the base 31 (here, the base bottom surface 36), a conductive contact portion 33 (electrode), a signal line portion 34, and a convex snap button 35 provided on the other end of the base 31 (here, the base top surface 37). Note that, hereinafter, the base 31 and the protrusion 32 will be referred to as an electrode main body 39 for convenience. The convex snap button 35 is detachably attached to a concave snap button 25a provided at a predetermined position on the support member 20.

[0021] The electrode unit 30 may be made entirely of conductive metal, or may have a rubber-like elastic material as a base with a conductive material provided on the surface. The following describes an example of a configuration based on a rubber-like elastic material.

[0022] The detailed structure and materials of the electrode unit 30 are described below. The electrode unit 30 of this embodiment is an electrode (dry electrode) that does not use so-called EEG electrode paste to ensure conductivity. However, a method of forming a gel on the tip of the dry electrode (the tip of the protrusion 32) and immersing it in a wetting liquid or the like to ensure moisture may also be used. Alternatively, instead of using paste or grease, the tip of the dry electrode may be wetted with a conductive auxiliary liquid, such as a low-viscosity liquid like lotion mixed with a small amount of electrolyte such as salt. In other words, the dry electrode of this embodiment is not limited to being completely dry, but rather does not use auxiliary agents that leave significant stains, such as paste.

[0023] The electrode body 39 is integrally formed from a rubber-like elastic member. Specific materials for the elastic member will be described later. The electrode body 39 (i.e., the base 31 and the protrusions 32) are not limited to being integrally formed, but may be formed as separate parts that are attached together with adhesive or a fitting structure.

[0024] <Shapes of Base and Protrusions> The base 31 is generally cylindrical. A plurality of generally conical protrusions 32 protruding downward in the drawing are provided on a circular base undersurface 36 at one end (the lower side in the drawing) of the base 31. The base 31 may be cylindrical, and the cross section may be a circle or other shape such as a polygon. The shape of the protrusions 32 is not limited to a conical shape, and various shapes such as a pyramid such as a triangular pyramid or a cylindrical shape may be used.

[0025] A conductive contact portion 33 is provided on at least the tip side surface of the protrusion 32. The conductive contact portion 33 may be provided on the entire surface of the protrusion 32. The conductive contact portion 33 is formed in a thin film shape, and the state in which the conductive contact portion 33 is provided on the protrusion 32 can be considered to have substantially the same shape as the shape of the protrusion 32 alone.

[0026] The outer diameter of the base 31 is, for example, 10 mm to 50 mm. The height (thickness) of the base 31 is, for example, 0.1 mm to 30 mm. The height of the protrusion 32 is, for example, 1 mm to 20 mm. The width of the protrusion 32 (outer diameter of the base portion) is, for example, 1 mm to 10 mm.

[0027] <Material of Electrode Body (Base and Protrusions)> The material of the electrode body 39 will be described. As described above, the electrode body 39 can be made of a rubber-like elastic material. Specific examples of rubber-like elastic materials include rubber and thermoplastic elastomers (also simply referred to as "elastomers (TPE)"). Examples of rubber include silicone rubber. Examples of thermoplastic elastomers include styrene-based TPE (TPS), olefin-based TPE (TPO), vinyl chloride-based TPE (TPVC), urethane-based TPE (TPU), ester-based TPE (TPEE), and amide-based TPE (TPAE).

[0028] When the material of the electrode body 39 is silicone rubber, the rubber hardness A is, for example, 15 or more and 55 or less, when the Type A durometer hardness on the surface of the electrode body 39 measured at 37°C in accordance with JIS K 6253 (1997) is defined as rubber hardness A.

[0029] Here, the silicone rubber-based curable composition will be described. The silicone rubber can be composed of a cured product of the silicone rubber-based curable composition. The curing process of the silicone rubber-based curable resin composition is carried out, for example, by heating at 100 to 250°C for 1 to 30 minutes (primary curing) and then post-baking at 100 to 200°C for 1 to 4 hours (secondary curing).

[0030] The insulating silicone rubber is a silicone rubber that does not contain a conductive filler, and the conductive silicone rubber is a silicone rubber that contains a conductive filler.

[0031] The silicone rubber-based curable composition according to this embodiment can contain a vinyl group-containing organopolysiloxane (A). The vinyl group-containing organopolysiloxane (A) is a polymer that serves as the main component of the silicone rubber-based curable composition according to this embodiment.

[0032] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of vinyl group-containing linear organopolysiloxane. The same type of vinyl group-containing linear organopolysiloxanes may be different in the amount of vinyl groups in the molecule, the molecular weight distribution, or the amount of vinyl groups added, as long as they contain the same vinyl groups as functional groups and have a linear shape. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different vinyl group-containing organopolysiloxanes.

[0033] The vinyl group-containing organopolysiloxane (A) can include a vinyl group-containing linear organopolysiloxane (A1) having a linear structure.

[0034] The vinyl group-containing linear organopolysiloxane (A1) has a linear structure and contains vinyl groups, and these vinyl groups become crosslinking points during curing.

[0035] The vinyl group content of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but preferably contains two or more vinyl groups in the molecule and is 15 mol% or less, and more preferably 0.01 to 12 mol%. This optimizes the amount of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1), ensuring the formation of networks with the components described below. In this embodiment, the symbol "to" means that both ends of the symbol are included.

[0036] In this specification, the vinyl group content refers to the mol % of vinyl group-containing siloxane units when all units constituting the vinyl group-containing linear organopolysiloxane (A1) are taken as 100 mol %, where it is considered that there is one vinyl group per vinyl group-containing siloxane unit.

[0037] The degree of polymerization of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably within a range of, for example, about 1,000 to 10,000, and more preferably about 2,000 to 5,000. The degree of polymerization can be determined, for example, as the polystyrene-equivalent number average degree of polymerization (or number average molecular weight) measured by GPC (gel permeation chromatography) using chloroform as a developing solvent.

[0038] Furthermore, the specific gravity of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of about 0.9 to 1.1.

[0039] By using a vinyl group-containing linear organopolysiloxane (A1) having a degree of polymerization and specific gravity within the above ranges, the heat resistance, flame retardancy, chemical stability, and other properties of the resulting silicone rubber can be improved.

[0040] As the vinyl group-containing linear organopolysiloxane (A1), those having a structure represented by the following formula (1) are particularly preferred.

[0041]

[0042] In formula (1), R １ is a hydrocarbon group that is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a combination thereof having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl groups, allyl groups, and butenyl groups, with vinyl groups being preferred. Examples of aryl groups having 1 to 10 carbon atoms include phenyl groups.

[0043] Also, R ２is a hydrocarbon group that is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a combination thereof having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl groups, allyl groups, and butenyl groups. Examples of aryl groups having 1 to 10 carbon atoms include phenyl groups.

[0044] Also, R ３ is a substituted or unsubstituted alkyl group or aryl group having 1 to 8 carbon atoms, or a hydrocarbon group combining these. Examples of alkyl groups having 1 to 8 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of aryl groups having 1 to 8 carbon atoms include phenyl groups.

[0045] Furthermore, R in formula (1) １ and R ２ Examples of the substituent of R include a methyl group and a vinyl group. ３ Examples of the substituent include a methyl group.

[0046] In addition, in formula (1), a plurality of R １ are independent of each other and may be different from each other or may be the same. ２ , and R ３ The same is true for .

[0047] Furthermore, m and n are the numbers of repeating units constituting the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1), where m is an integer of 0 to 2000 and n is an integer of 1000 to 10000. m is preferably 0 to 1000, and n is preferably 2000 to 5000.

[0048] Specific examples of the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1) include those represented by the following formula (1-1):

[0049]

[0050] In formula (1-1), R１ and R ２ are each independently a methyl group or a vinyl group, and at least one of them is a vinyl group.

[0051] Furthermore, the vinyl group-containing linear organopolysiloxane (A1) preferably contains a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more vinyl groups in the molecule and a vinyl group content of 0.4 mol% or less, and a second vinyl group-containing linear organopolysiloxane (A1-2) having a vinyl group content of 0.5 to 15 mol%. Combining a first vinyl group-containing linear organopolysiloxane (A1-1) with a vinyl group content typical of crude rubber, which is the raw material for silicone rubber, with a second vinyl group-containing linear organopolysiloxane (A1-2) with a high vinyl group content allows for uneven distribution of vinyl groups and more effectively creates a variation in crosslink density within the crosslinked network of the silicone rubber. As a result, the tear strength of the silicone rubber can be more effectively increased.

[0052] Specifically, the vinyl group-containing linear organopolysiloxane (A1) may be, for example, a vinyl group-containing linear organopolysiloxane represented by the above formula (1-1), １ is a vinyl group and / or R ２ a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more units in the molecule in which R is a vinyl group and containing 0.4 mol% or less of the unit; １ is a vinyl group and / or R ２ It is preferable to use a second vinyl group-containing linear organopolysiloxane (A1-2) containing 0.5 to 15 mol % of units in which each of the units is a vinyl group.

[0053] The first vinyl group-containing linear organopolysiloxane (A1-1) preferably has a vinyl group content of 0.01 to 0.2 mol %, and the second vinyl group-containing linear organopolysiloxane (A1-2) preferably has a vinyl group content of 0.8 to 12 mol %.

[0054] Furthermore, when the first vinyl group-containing linear organopolysiloxane (A1-1) and the second vinyl group-containing linear organopolysiloxane (A1-2) are combined and blended, the ratio of (A1-1) to (A1-2) is not particularly limited, but for example, the weight ratio of (A1-1):(A1-2) is preferably 50:50 to 95:5, and more preferably 80:20 to 90:10.

[0055] The first and second vinyl group-containing linear organopolysiloxanes (A1-1) and (A1-2) may each be used alone or in combination of two or more.

[0056] The vinyl group-containing organopolysiloxane (A) may also contain a vinyl group-containing branched organopolysiloxane (A2) having a branched structure.

[0057] <<Organohydrogenpolysiloxane (B)>> The silicone rubber-based curable composition of this embodiment may contain a crosslinking agent. The crosslinking agent may contain an organohydrogenpolysiloxane (B). The organohydrogenpolysiloxane (B) is classified into a linear organohydrogenpolysiloxane (B1) having a linear structure and a branched organohydrogenpolysiloxane (B2) having a branched structure, and may contain either one or both of these.

[0058] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of crosslinking agent. The same type of crosslinking agent only needs to have a common structure, such as a linear or branched structure, and may have different molecular weight distributions or different functional groups in the molecule, or the amounts added may differ. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different crosslinking agents.

[0059] The linear organohydrogenpolysiloxane (B1) has a linear structure and a structure in which hydrogen is directly bonded to Si (≡Si—H), and is a polymer that undergoes a hydrosilylation reaction with the vinyl groups of the vinyl group-containing organopolysiloxane (A) and with vinyl groups of components blended into the silicone rubber-based curable composition, thereby crosslinking these components.

[0060] The molecular weight of the linear organohydrogenpolysiloxane (B1) is not particularly limited, but for example, the weight average molecular weight is preferably 20,000 or less, and more preferably 1,000 or more and 10,000 or less.

[0061] The weight average molecular weight of the linear organohydrogenpolysiloxane (B1) can be measured, for example, by gel permeation chromatography (GPC) using chloroform as a developing solvent, in terms of polystyrene.

[0062] Furthermore, it is generally preferred that the linear organohydrogenpolysiloxane (B1) does not contain a vinyl group, which can reliably prevent the crosslinking reaction from proceeding within the molecule of the linear organohydrogenpolysiloxane (B1).

[0063] As the linear organohydrogenpolysiloxane (B1) described above, for example, one having a structure represented by the following formula (2) is preferably used.

[0064]

[0065] In formula (2), R ４ is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group combining these, or a hydride group having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl groups, allyl groups, and butenyl groups. Examples of aryl groups having 1 to 10 carbon atoms include phenyl groups.

[0066] Also, R ５is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group combining these, or a hydride group having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl groups, allyl groups, and butenyl groups. Examples of aryl groups having 1 to 10 carbon atoms include phenyl groups.

[0067] In addition, in formula (2), a plurality of R ４ are independent of each other and may be different from each other or may be the same. ５ The same applies to multiple R ４ and R ５ At least two of these are hydride groups.

[0068] Also, R ６ is a substituted or unsubstituted alkyl group or aryl group having 1 to 8 carbon atoms, or a hydrocarbon group combining these. Examples of alkyl groups having 1 to 8 carbon atoms include methyl groups, ethyl groups, and propyl groups, and among these, methyl groups are preferred. Examples of aryl groups having 1 to 8 carbon atoms include phenyl groups. ６ are independent of each other and may be different from each other or may be the same.

[0069] In addition, R in formula (2) ４ , R ５ , R ６ Examples of the substituent include a methyl group and a vinyl group, and a methyl group is preferred from the viewpoint of preventing intramolecular crosslinking reactions.

[0070] Furthermore, m and n are the numbers of repeating units constituting the linear organohydrogenpolysiloxane (B1) represented by formula (2), where m is an integer of 2 to 150 and n is an integer of 2 to 150. Preferably, m is an integer of 2 to 100 and n is an integer of 2 to 100.

[0071] The linear organohydrogenpolysiloxane (B1) may be used alone or in combination of two or more.

[0072] Because the branched organohydrogenpolysiloxane (B2) has a branched structure, it forms regions with high crosslink density and is a component that significantly contributes to the formation of a sparsely crosslinked structure in the silicone rubber system. Similarly to the linear organohydrogenpolysiloxane (B1), it has a structure in which hydrogen is directly bonded to Si (≡Si—H), and undergoes a hydrosilylation reaction with the vinyl groups of the vinyl group-containing organopolysiloxane (A) and with the vinyl groups of other components incorporated into the silicone rubber-based curable composition, forming a polymer that crosslinks these components.

[0073] The specific gravity of the branched organohydrogenpolysiloxane (B2) is in the range of 0.9 to 0.95.

[0074] Furthermore, it is generally preferred that the branched organohydrogenpolysiloxane (B2) does not contain a vinyl group, which can reliably prevent the crosslinking reaction from proceeding within the molecule of the branched organohydrogenpolysiloxane (B2).

[0075] The branched organohydrogenpolysiloxane (B2) is preferably one represented by the following average composition formula (c):

[0076] Average compositional formula (c) (H ａ (R ７ ) ３－ａ SiO １／２ ) ｍ (SiO ４／２ ) ｎ (In formula (c), R ７ is a monovalent organic group, a is an integer ranging from 1 to 3, and m is H ａ (R ７ ) ３－ａ SiO １／２ The number of units, n, is SiO ４／２ (the number of units)

[0077] In formula (c), R ７is a monovalent organic group, preferably a substituted or unsubstituted alkyl group or aryl group having 1 to 10 carbon atoms, or a hydrocarbon group consisting of a combination thereof. Examples of alkyl groups having 1 to 10 carbon atoms include methyl, ethyl, and propyl groups, with methyl being preferred. Examples of aryl groups having 1 to 10 carbon atoms include phenyl groups.

[0078] In formula (c), a is the number of hydride groups (hydrogen atoms directly bonded to Si), and is an integer ranging from 1 to 3, preferably 1.

[0079] In addition, in formula (c), m is H ａ (R ７ ) ３－ａ SiO １／２ The number of units, n, is SiO ４／２ The number of units.

[0080] The branched organohydrogenpolysiloxane (B2) has a branched structure. The linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) differ in their structures, that is, whether they are linear or branched, and the number of alkyl groups R bonded to Si (R / Si), where the number of Si is 1, is in the range of 1.8 to 2.1 for the linear organohydrogenpolysiloxane (B1) and 0.8 to 1.7 for the branched organohydrogenpolysiloxane (B2).

[0081] Because the branched organohydrogenpolysiloxane (B2) has a branched structure, it leaves a residue amount of 5% or more when heated, for example, in a nitrogen atmosphere to 1,000° C. at a heating rate of 10° C. / min. In contrast, because the linear organohydrogenpolysiloxane (B1) is linear, it leaves a residue amount of almost zero after heating under the above conditions.

[0082] Specific examples of the branched organohydrogenpolysiloxane (B2) include those having a structure represented by the following formula (3).

[0083]

[0084] In formula (3), R ７is a substituted or unsubstituted alkyl group or aryl group having 1 to 8 carbon atoms, or a hydrocarbon group combining these, or a hydrogen atom. Examples of alkyl groups having 1 to 8 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of aryl groups having 1 to 8 carbon atoms include phenyl groups. R ７ Examples of the substituent include a methyl group.

[0085] In addition, in formula (3), a plurality of R ７ are independent of each other and may be different from each other or may be the same.

[0086] In addition, in formula (3), "-O-Si≡" indicates that Si has a branched structure that spreads three-dimensionally.

[0087] The branched organohydrogenpolysiloxane (B2) may be used alone or in combination of two or more.

[0088] Furthermore, the amount of hydrogen atoms (hydride groups) directly bonded to Si in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is not particularly limited. However, in the silicone rubber-based curable composition, the total amount of hydride groups in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is preferably 0.5 to 5 moles, more preferably 1 to 3.5 moles, per mole of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1). This ensures the reliable formation of a crosslinked network between the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) and the vinyl group-containing linear organopolysiloxane (A1).

[0089] <<Silica Particles (C)>> The silicone rubber-based curable composition according to this embodiment contains a non-conductive filler. The non-conductive filler may contain silica particles (C) as needed. This can improve the hardness and mechanical strength of the elastomer.

[0090] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of non-conductive filler. Non-conductive fillers of the same type may have at least common constituent materials, but may differ in particle size, specific surface area, surface treatment agent, or the amount of surface treatment agent added. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

[0091] The silica particles (C) are not particularly limited, but examples thereof include fumed silica, calcined silica, precipitated silica, etc. These may be used alone or in combination of two or more.

[0092] The silica particles (C) have a specific surface area of, for example, 50 to 400 m2 as measured by the BET method. ２ / g, and 100 to 400m ２ The average primary particle size of the silica particles (C) is preferably, for example, 1 to 100 nm, and more preferably about 5 to 20 nm.

[0093] By using silica particles (C) having a specific surface area and average particle size within the above ranges, it is possible to improve the hardness and mechanical strength, particularly the tensile strength, of the silicone rubber formed.

[0094] <<Silane Coupling Agent (D)>> The silicone rubber-based curable composition of this embodiment can contain a silane coupling agent (D). The silane coupling agent (D) can have a hydrolyzable group. The hydrolyzable group is hydrolyzed by water to form a hydroxyl group, and this hydroxyl group undergoes a dehydration condensation reaction with the hydroxyl groups on the surface of the silica particles (C), thereby modifying the surface of the silica particles (C).

[0095] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of silane coupling agent. Silane coupling agents of the same type may have at least a common functional group, but may differ in other functional groups in the molecule or in the amount added. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

[0096] Furthermore, this silane coupling agent (D) can contain a silane coupling agent having a hydrophobic group. This provides the hydrophobic group to the surface of the silica particles (C), thereby reducing the cohesive force of the silica particles (C) in the silicone rubber-based curable composition, and ultimately in the silicone rubber (reducing aggregation due to hydrogen bonding through silanol groups). This is presumably improving the dispersibility of the silica particles (C) in the silicone rubber-based curable composition. This increases the interface between the silica particles (C) and the rubber matrix, enhancing the reinforcing effect of the silica particles (C). Furthermore, it is presumed that the slipperiness of the silica particles (C) within the matrix improves during deformation of the rubber matrix. The improved dispersibility and slipperiness of the silica particles (C) improve the mechanical strength (e.g., tensile strength, tear strength, etc.) of the silicone rubber due to the silica particles (C).

[0097] Furthermore, the silane coupling agent (D) can contain a silane coupling agent having a vinyl group. This allows the vinyl group to be introduced onto the surface of the silica particles (C). Therefore, when the silicone rubber-based curable composition is cured, that is, when the vinyl group of the vinyl group-containing organopolysiloxane (A) and the hydride group of the organohydrogenpolysiloxane (B) undergo a hydrosilylation reaction to form a network (crosslinked structure), the vinyl group of the silica particles (C) also participates in the hydrosilylation reaction with the hydride group of the organohydrogenpolysiloxane (B), and the silica particles (C) are also incorporated into the network. This allows the formed silicone rubber to have a low hardness and a high modulus.

[0098] As the silane coupling agent (D), a silane coupling agent having a hydrophobic group and a silane coupling agent having a vinyl group can be used in combination.

[0099] Examples of the silane coupling agent (D) include those represented by the following formula (4).

[0100] Y ｎ -Si-(X) ４－ｎ ...(4) In the above formula (4), n represents an integer of 1 to 3. Y represents a functional group having a hydrophobic group, a hydrophilic group, or a vinyl group, and when n is 1, it is a hydrophobic group, and when n is 2 or 3, at least one of the groups is a hydrophobic group. X represents a hydrolyzable group.

[0101] The hydrophobic group is an alkyl group having 1 to 6 carbon atoms, an aryl group, or a hydrocarbon group formed by combining these groups, such as a methyl group, an ethyl group, a propyl group, or a phenyl group, with a methyl group being particularly preferred.

[0102] Examples of the hydrophilic group include a hydroxyl group, a sulfonic acid group, a carboxyl group, and a carbonyl group, and among these, a hydroxyl group is particularly preferred. Although a hydrophilic group may be contained as a functional group, it is preferable that the hydrophilic group is not contained from the viewpoint of imparting hydrophobicity to the silane coupling agent (D).

[0103] Further, examples of the hydrolyzable group include an alkoxy group such as a methoxy group or an ethoxy group, a chloro group, or a silazane group. Among these, a silazane group is preferred because of its high reactivity with the silica particles (C). Note that, in the case of a compound having a silazane group as a hydrolyzable group, the (Y ｎ The resulting structure has two —Si— structures.

[0104] Specific examples of the silane coupling agent (D) represented by the above formula (4) are as follows. Examples of the silane coupling agent (D) having a hydrophobic group as the functional group include alkoxysilanes such as methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, and decyltrimethoxysilane; chlorosilanes such as methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, and phenyltrichlorosilane; and hexamethyldisilazane. Among these, silane coupling agents having a trimethylsilyl group containing one or more selected from the group consisting of hexamethyldisilazane, trimethylchlorosilane, trimethylmethoxysilane, and trimethylethoxysilane are preferred.

[0105] As the one having vinyl group as the functional group, for example, can be mentioned alkoxysilane such as methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinylmethyldimethoxysilane; chlorosilane such as vinyltrichlorosilane, vinylmethyldichlorosilane; divinyltetramethyldisilazane.Among these, preferred is the silane coupling agent having vinyl group-containing organosilyl group, comprising one or more selected from the group consisting of methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, divinyltetramethyldisilazane, vinyltriethoxysilane, vinyltrimethoxysilane and vinylmethyldimethoxysilane.

[0106] Furthermore, when the silane coupling agent (D) contains two types of silane coupling agents, one having a trimethylsilyl group and the other having a vinyl group-containing organosilyl group, it is preferable that the silane coupling agent containing the hydrophobic group is hexamethyldisilazane, and the silane coupling agent containing the vinyl group is divinyltetramethyldisilazane.

[0107] When a silane coupling agent (D1) having a trimethylsilyl group and a silane coupling agent (D2) having a vinyl group-containing organosilyl group are used in combination, the ratio of (D1) to (D2) is not particularly limited, but for example, the weight ratio of (D1):(D2) is 1:0.001 to 1:0.35, preferably 1:0.01 to 1:0.20, and more preferably 1:0.03 to 1:0.15. By adjusting the weight ratio within this range, the desired physical properties of the silicone rubber can be obtained. Specifically, a balance can be achieved between the dispersibility of silica in the rubber and the crosslinkability of the rubber.

[0108] In this embodiment, the lower limit of the content of the silane coupling agent (D) is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more, relative to 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). The upper limit of the content of the silane coupling agent (D) is preferably 100% by mass or less, more preferably 80% by mass or less, and even more preferably 40% by mass or less, relative to 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). By setting the content of the silane coupling agent (D) to the above lower limit or more, the adhesion between the columnar portion containing the elastomer and the conductive resin layer can be improved. This can also contribute to improving the mechanical strength of the silicone rubber. Setting the content of the silane coupling agent (D) to the above upper limit or less allows the silicone rubber to have appropriate mechanical properties.

[0109] <<Platinum or Platinum Compound (E)>> The silicone rubber-based curable composition according to this embodiment may contain a catalyst. The catalyst may contain platinum or a platinum compound (E). The platinum or platinum compound (E) is a catalytic component that acts as a catalyst during curing. The amount of platinum or platinum compound (E) added is a catalytic amount.

[0110] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of catalyst. The same type of catalyst is sufficient as long as they have at least common constituent materials, and the catalyst may contain different compositions, and the amounts added may be different. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different catalysts.

[0111] As the platinum or platinum compound (E), known compounds can be used, such as platinum black, platinum supported on silica or carbon black, chloroplatinic acid or an alcohol solution of chloroplatinic acid, a complex salt of chloroplatinic acid and an olefin, and a complex salt of chloroplatinic acid and a vinylsiloxane.

[0112] The platinum or platinum compound (E) may be used alone or in combination of two or more.

[0113] In this embodiment, the content of platinum or platinum compound (E) in the silicone rubber-based curable composition refers to a catalytic amount and can be set as appropriate. Specifically, the amount is an amount such that the platinum group metal is 0.01 to 1000 ppm by weight, preferably 0.1 to 500 ppm, per 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A), silica particles (C), and silane coupling agent (D). By setting the content of platinum or platinum compound (E) to be equal to or greater than the above-mentioned lower limit, the silicone rubber-based curable composition can be cured at an appropriate rate. Furthermore, setting the content of platinum or platinum compound (E) to be equal to or less than the above-mentioned upper limit can contribute to reducing production costs.

[0114] <<Water (F)>> Furthermore, the silicone rubber-based hardening composition according to this embodiment may contain water (F) in addition to the above components (A) to (E).

[0115] Water (F) functions as a dispersion medium for dispersing the components contained in the silicone rubber-based curable composition, and is also a component that contributes to the reaction between the silica particles (C) and the silane coupling agent (D). Therefore, the silica particles (C) and the silane coupling agent (D) can be more reliably bonded to each other in the silicone rubber, and uniform properties can be exhibited overall.

[0116] (Other Components) Furthermore, the silicone rubber-based curable composition of this embodiment may further contain other components in addition to the above components (A) to (F). Examples of these other components include inorganic fillers other than the silica particles (C), such as diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica, as well as additives such as reaction inhibitors, dispersants, pigments, dyes, antistatic agents, antioxidants, flame retardants, and thermal conductivity improvers.

[0117] The conductive solution (conductive silicone rubber composition) according to this embodiment contains the above-mentioned conductive filler and solvent in addition to the above-mentioned silicone rubber-based curable composition that does not contain a conductive filler.

[0118] As the solvent, various known solvents can be used, including, for example, high-boiling point solvents. These may be used alone or in combination of two or more.

[0119] Examples of the solvent include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, decane, dodecane, and tetradecane; aromatic hydrocarbons such as benzene, toluene, ethylbenzene, xylene, trifluoromethylbenzene, and benzotrifluoride; ethers such as diethyl ether, diisopropyl ether, dibutyl ether, cyclopentyl methyl ether, cyclopentyl ethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, 1,4-dioxane, 1,3-dioxane, and tetrahydrofuran; haloalkanes such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,1-trichloroethane, and 1,1,2-trichloroethane; carboxylic acid amides such as N,N-dimethylformamide and N,N-dimethylacetamide; and sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide. These may be used alone or in combination of two or more.

[0120] The conductive solution can have a viscosity suitable for various application methods such as spray application and dip application by adjusting the amount of solids in the solution.

[0121] Furthermore, when the conductive solution contains the conductive filler and the silica particles (C), the lower limit of the content of the silica particles (C) contained in the electrode part main body 39 can be, for example, 1% by mass or more, preferably 3% by mass or more, and more preferably 5% by mass or more, relative to 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can improve the mechanical strength of the electrode part main body 39. On the other hand, the upper limit of the content of the silica particles (C) contained in the electrode part main body 39 can be, for example, 20% by mass or less, preferably 15% by mass or less, and more preferably 10% by mass or less, relative to 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can achieve a balance between the conductivity of the electrode part main body 39 and the mechanical strength and flexibility.

[0122] The conductive solution can be heated and dried as needed to obtain conductive silicone rubber. The conductive silicone rubber may be configured to not contain silicone oil. This prevents the silicone oil from bleeding out onto the surface of the electrode body 39, thereby preventing a decrease in conductivity.

[0123] <Material of Conductive Contact Portion> The conductive member of the conductive contact portion 33 is, for example, a paste containing a highly conductive metal (so-called conductive paste). The highly conductive metal includes one or more metals selected from the group consisting of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, and alloys thereof. In particular, silver, silver chloride, and copper are suitable from the viewpoints of availability and conductivity.

[0124] When the conductive contact portion 33 is formed from a paste containing a highly conductive metal, the top of the protrusion portion 32 made of a rubber-like elastic body is dipped (dipped and coated) into a paste-like conductive solution containing a highly conductive metal, thereby forming the conductive contact portion 33 on the surface of the protrusion portion 32.

[0125] The conductive contact portion 33 may be formed as a conductive resin layer by applying a conductive solution containing a conductive filler and a solvent to the protrusion portion 32. In this case, by using the same material (silicone rubber) as the solvent for the protrusion portion 32, the adhesion of the conductive contact portion 33 (conductive resin layer) can be improved.

[0126] The conductive solution is heated and dried as needed to obtain a conductive silicone rubber. The conductive silicone rubber may be configured not to contain silicone oil. This prevents the silicone oil from bleeding out onto the surface of the conductive contact 33, thereby preventing a decrease in conductivity.

[0127] This improves the ability to push aside hair when the electroencephalogram measuring device 10 is attached to the head 99. Furthermore, it is possible to ensure a sufficient contact area of ​​the conductive contact portion 33 when the electroencephalogram measuring device 10 is attached.

[0128] <Structure of Signal Wire Portion> The electrode unit 30 is provided with a signal wire portion 34 as a signal path connected to the conductive contact portion 33. Various wiring structures may be employed for the signal wire portion 34 as long as it provides electrical continuity via the base 31 and the protrusion 32. Here, the signal wire portion 34 is provided so as to extend from the conductive contact portion 33 at the tip of the protrusion 32, pass through the interior of the protrusion 32 and the base 31, and be exposed on the base upper surface 37. The portion of the signal wire portion 34 that protrudes from the base upper surface 37 (here, the end portion 34a) is sandwiched between the convex snap button 35 (more specifically, the disk portion 35a described below) and the base upper surface 37, ensuring electrical continuity with the convex snap button 35.

[0129] The lower tip of the signal line portion 34 may have any of a protruding structure, a structure that is substantially flush with the tip of the protrusion 32 or its vicinity, i.e., a structure that is buried in the region where the conductive contact portion 33 is formed. A protruding structure may be used from the viewpoint of connection stability with the conductive contact portion 33. The protruding portion of the tip of the signal line portion 34 is partially or entirely covered with the conductive contact portion 33. The protruding structure of the tip of the signal line portion 34 may be unfolded, folded, or wrapped around the surface of the tip of the protrusion 32.

[0130] As another wiring structure for the signal line portion 34, it may be a structure in which it is provided on the surfaces of the protrusion portion 32 and the base portion 31, or a wiring structure in which a part of it is provided inside and a part of it is provided on the surface. In other words, it is sufficient if the signal detected by the conductive contact portion 33 is ultimately transmitted to the convex snap button 35.

[0131] <Material of Signal Wire Portion> The signal wire portion 34 may be made of a known material, for example, conductive fiber. The conductive fiber may be one or more types selected from the group consisting of metal fiber, metal-coated fiber, carbon fiber, conductive polymer fiber, conductive polymer-coated fiber, and conductive paste-coated fiber. These may be used alone or in combination of two or more types.

[0132] The metal material of the metal fibers and metal-coated fibers is not limited as long as it is conductive, but examples include copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, stainless steel, aluminum, silver / silver chloride, and alloys thereof. These may be used alone or in combination of two or more. Among these, silver can be used from the viewpoint of conductivity. Furthermore, it is preferable that the metal material does not contain metals that put a burden on the environment, such as chromium.

[0133] The fiber materials for the metal-coated fibers, conductive polymer-coated fibers, and conductive paste-coated fibers are not particularly limited, but may be synthetic fibers, semi-synthetic fibers, or natural fibers. Among these, polyester, nylon, polyurethane, silk, cotton, etc. are preferred. These may be used alone or in combination of two or more.

[0134] Examples of the carbon fiber include PAN-based carbon fiber and pitch-based carbon fiber.

[0135] The conductive polymer material for the conductive polymer fibers and conductive polymer-coated fibers may be, for example, a mixture of a conductive polymer such as polythiophene, polypyrrole, polyaniline, polyacetylene, polyphenylene vinylene, polynaphthalene, or a derivative thereof and a binder resin, or an aqueous solution of a conductive polymer such as PEDOT-PSS ((3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid)).

[0136] The resin material contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, but preferably has elasticity, and may contain, for example, one or more selected from the group consisting of silicone rubber, urethane rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, and ethylene propylene rubber. These may be used alone or in combination of two or more.

[0137] The conductive filler contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, and may be any known conductive material, but may include one or more selected from the group consisting of metal particles, metal fibers, metal-coated fibers, carbon black, acetylene black, graphite, carbon fibers, carbon nanotubes, conductive polymers, conductive polymer-coated fibers, and metal nanowires.

[0138] The metal constituting the conductive filler is not particularly limited, but may include, for example, at least one of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, silver / silver chloride, or alloys thereof, or two or more of these. Among these, silver or copper is preferred because of its high conductivity and easy availability.

[0139] The signal line portion 34 may be made of a twisted yarn made by twisting together a plurality of linear conductive fibers, which can prevent the signal line portion 34 from breaking when the device is deformed.

[0140] In this embodiment, the coating of conductive fibers does not simply mean covering the outer surface of the fiber material, but also includes, in the case of a twisted yarn made by twisting together single fibers, impregnating the gaps between the fibers in the twisted yarn with metal, conductive polymer, or conductive paste to coat each of the single fibers that make up the twisted yarn.

[0141] The tensile elongation at break of the signal line portion 34 is, for example, 1% to 50%, and preferably 1.5% to 45%. By setting the elongation at break within this range, excessive deformation of the protrusion 32 can be suppressed while suppressing breakage during deformation.

[0142] <Support Member> The support member 20 will be specifically described mainly with reference to Fig. 3 and Fig. 6. Fig. 3 is a plan view schematically showing the substrate 21 and circuit pattern 22 of the support member 20. The shielding layer 24 is not shown. Fig. 6 is a cross-sectional view of the support member 20, showing the X2-X2 cross-section of Fig. 2.

[0143] The support member 20 is a long, flexible substrate, and includes a long substrate 21, a circuit pattern 22, a protective layer 23, a shielding layer 24, and a string guide portion 26.

[0144] <Base Material> The base material 21 is provided with mounting portions 25 at five positions corresponding to the positions T3, C3, Cz, C4, and T4 in the International 10-20 electrode arrangement method.

[0145] The base material 21 is non-stretchable, flexible in a direction perpendicular to the surface of the base material 21, and configured to have sufficient strength for attaching the electrode units 30. In other words, it has sufficient strength to prevent breakage when the mounting portions 25 are provided and the electrode units 30 are attached. The non-stretchability is defined by the Poisson's ratio, which will be described later. Furthermore, the base material 21 has non-stretchable physical properties so that the multiple electrode units 30 can be pressed against the head 99 with an appropriate pressure, that is, so that the electrode units 30 are linearly aligned between the mounting portions 25 and a constant tension acts thereon.

[0146] The vertical width (depth length) of the substrate 21 depends on the size of the electrode unit 30 to be attached, but can be, for example, 10 mm to 50 mm. The horizontal width (left-right length) of the substrate 21 depends on the size of the head 99 and the electrode positions, but can be, for example, 200 mm to 400 mm. Furthermore, the distance between the electrodes can be, for example, 65 mm to 75 mm, assuming an adult. The thickness of the substrate 21 depends on the material, but can be, for example, 0.01 mm to 1 mm. By setting the thickness of the support member 20 within the above range, it is possible to allow the support member 20 to appropriately conform to the shape of the head 99 and to maintain a state in which the electrode unit 30 is pressed with a constant tension. Note that the substrate 21 may be curved to a degree that does not substantially change the tension, depending on the shape of the head 99 and the condition of the hair. Furthermore, the substrate 21 has non-stretching physical properties so that the multiple electrode units 30 are pressed against the head 99 with an appropriate pressure, i.e., so that a constant tension is applied.

[0147] The substrate 21 can be a resin film substrate, a metal film member, or a glass film. Examples of resin film substrates include polyimide resin films, polyetherimide resin films, polyamideimide resin films, and other polyimide resin-based films; polyamide resin films, such as polyamide resin films; polyester resin films, such as polyester resin films; PET (polyethylene terephthalate) resin films; and PS (polystyrene) resin films. Among these, polyimide resin films are particularly preferred from the viewpoint of improving flexibility, elastic modulus, and heat resistance. Examples of metal members that can be used include aluminum foil and copper foil.

[0148] <Circuit Pattern> The circuit pattern 22 has, for example, terminals for electrically connecting to the electrode unit 30 and wiring for connecting the electrode unit 30 to an external connection terminal (not shown). For example, the circuit pattern 22 can be obtained by patterning a flexible copper-clad laminate having copper foil provided over the entire upper surface of the substrate 21 into a desired shape by etching. The method for providing the circuit pattern 22 is not limited to the above method, and a method of printing a desired pattern using a conductive paste such as silver ink or copper ink can also be used.

[0149] The circuit pattern 22 has first to fifth circuit patterns 22a to 22e (simply referred to as circuit patterns 22 when not distinguished) provided so as to extend leftward from each of the five openings 29. The first to fifth circuit patterns 22a to 22e are independent of each other and electrically insulated from each other.

[0150] Each circuit pattern 22 has an annular pattern 28a provided in an annular shape around the periphery of the opening 29, and a linear pattern 22b extending linearly from the annular pattern 28a to the left in the drawing. A mounting portion 25 made of an annular conductor is attached to the annular pattern 28a, thereby establishing electrical continuity between the circuit pattern 22 and the mounting portion 25. That is, a portion of the annular pattern 28a functions as a connection terminal with the electrode unit 30. The other portion of the linear pattern 22b functions as wiring to the outside.

[0151] The linear pattern 22b is partially diagonally oriented to separate it from other linear patterns 22b and the annular pattern 28a. Furthermore, since the adjustment portion 50 is sewn between electrode positions C3 and T3 and between electrode positions C4 and T4, the circuit pattern 22 (annular pattern 28a) is formed to avoid the area necessary for sewing. A connector (not shown) for connecting to, for example, external wiring, is provided at the extending end (left end in the drawing) of the linear pattern 28b.

[0152] In order to provide the support member 20 with a predetermined strength, the circuit pattern 22 may be a dummy pattern in addition to an actual wiring structure.

[0153] <Protective Layer> As shown in FIG. 6 , the protective layer 23 is formed by covering the periphery of the circuit pattern 22 (excluding the lower surface) with an insulating material, and may be, for example, a coverlay film made of an insulating resin film and an adhesive, or may be formed by forming a liquid resin composition containing a thermosetting resin by a screen printing method or the like and then heat-curing it.

[0154] <Shielding Layer> The shielding layer 24 is an electromagnetic wave shielding material that covers the circuit pattern 22. The shielding layer 24 is provided to counter noise when an EEG signal is transmitted through the circuit pattern 22, and includes a first shielding layer 24a provided on the upper surface of the protective layer 23 and a second shielding layer 24b provided on the lower surface of the base material 21. The first shielding layer 24a and the second shielding layer 24b may be formed of the same material or different materials.

[0155] The shielding layer 24 (first shielding layer 24a, second shielding layer 24b) is obtained by forming a layer that acts as an electromagnetic wave shield on the protective layer 23 using a method such as screen printing with a conductive paste containing a metal filler. This metal filler can be made of metals such as gold, silver, copper, or aluminum, or alloys, either alone or in combination. There are no particular restrictions on the size of the filler, but fillers ranging from several nanometers to several micrometers are used. The paste is made by mixing this metal filler with a thermosetting epoxy resin or the like.

[0156] The thickness of the shield layer 24 (first shield layer 24a, second shield layer 24b) can be, for example, 5 μm to 50 μm. By setting the thickness within this range, a stable thickness can be achieved when forming the shield layer 24, and desired shielding performance can be achieved.

[0157] The shielding layer 24 may be a laminate in which a conductive metal layer is formed on a resin film by vapor deposition or the like. In this case, the laminate is attached to the upper surface of the protective layer 23 or the lower surface of the substrate 21 using an adhesive or the like. While the shielding layer may be formed by printing, vapor deposition is preferred because it allows the shielding layer to be made thinner and more resistant to bending. The conductive metal layer is connected to the ground (a portion stable at the reference potential) of the circuit pattern 22. Either or both of the first shielding layer 24a and the second shielding layer 24b may be omitted. In this case, noise resistance performance is reduced, but the device can be simplified. Furthermore, noise resistance performance can be addressed to a certain extent by signal processing.

[0158] <Physical Properties of Support Member> The physical properties (Poisson's ratio, Young's modulus, maximum thickness, Young's modulus × thickness) of the support member 20 (more specifically, the substrate 21) are specified, for example, as follows. The Poisson's ratio and Young's modulus are measured by a tensile test in accordance with JIS K7127. In the tensile test, a test piece specified in the above standard (a test piece of the substrate 21 itself) is used. Note that, although this does not comply with the above JIS standard, a test piece in which the circuit pattern 22 is provided on the substrate 21 may also be used.

[0159] (Poisson's ratio) The Poisson's ratio defines the inelasticity of the support member 20. The Poisson's ratio of the support member 20 is 0.15 to 0.4. The lower limit of the Poisson's ratio is preferably 0.2 or more, and more preferably 0.25 or more. The upper limit of the Poisson's ratio is preferably 0.38 or less, and more preferably 0.35 or less.

[0160] By setting the Poisson's ratio of the support member 20 (i.e., the base material 21) within the above range, the support member 20 is less likely to deform. That is, when the EEG measurement device 10 is attached to the head 99, a force acts in the direction of extension of the support member 20 when the electrode unit 30 is pressed against the head 99. In other words, tension acts. If the support member 20 is made of an elastic material such as rubber (a material with a Poisson's ratio of approximately 0.46 to 0.49), the support member 20 may be stretched inappropriately, resulting in uneven pressure applied by the electrode unit 30 to the head 99. This may result in a decrease in the quality of the electroencephalogram signal obtained. However, by setting the Poisson's ratio of the support member 20 within the above range, the pressure applied by the electrode unit 30 to the head 99 can be controlled within a certain range, enabling stable EEG measurement.

[0161] (Young's Modulus) The Young's modulus (elastic modulus) of the support member 20 is 0.4 GPa to 150 GPa. The lower limit of the Young's modulus is preferably 3 GPa or more, and more preferably 5 GPa or more. The upper limit is preferably 140 GPa or less, and more preferably 135 GPa or less. By setting the Young's modulus of the support member 20 within the above range, the strength of the support member 20 can be maintained and deformation can be prevented.

[0162] (Young's modulus x thickness) The product of the Young's modulus (elastic modulus) and thickness of the material constituting the film member is 0.4 to 9.1. Even if the material is easily deformed (i.e., a material with a small Young's modulus), as long as the thickness is above a certain level, the force with which the electrode unit 30 presses against the head 99 can be controlled within a certain range without substantial deformation. Furthermore, in the case of a hard material (i.e., a material with a large Young's modulus), the ability of the electroencephalogram measuring device 10 to conform to the shape of the head 99 is significantly reduced unless the thickness is made thin to a certain extent. Therefore, by setting the product of the Young's modulus (elastic modulus) and thickness within the above range, the force with which the electrode unit 30 attached to the support member 20 presses against the head 99 can be controlled within a certain range, thereby achieving stable electroencephalogram measurement.

[0163] <Connection structure between electrode unit and support member> For example, as shown in Fig. 4, the electrode unit 30 and support member 20 are fixed by snap button engagement. Specifically, a concave snap button 25a of the support member 20 engages with a convex snap button 35 of the electrode unit 30. The concave snap button 25a functions as a mounting portion 25 for attaching the electrode unit 30 by means of a fitting structure.

[0164] The convex snap button 35 is made of, for example, a highly conductive metal and has a disk-shaped disk portion 35a and a convex button-shaped button portion 35b extending from the center of the upper surface of the disk portion 35a. Examples of the highly conductive metal that can be used include stainless steel, copper alloy, aluminum alloy, brass, etc.

[0165] The disk portion 35a is attached to the base upper surface 37 of the base 31 with a conductive adhesive or the like. At this time, as described above, the end portion 34a of the signal line portion 34 is sandwiched between the disk portion 35a and the base upper surface 37, ensuring electrical continuity with the convex snap button 35.

[0166] The button portion 35 b is attached so as to fit into a recessed snap button 25 a provided on the support member 20 .

[0167] The concave snap button 25a, like the convex snap button 35, is made of a metal with good conductivity, and outputs the electroencephalogram signal acquired by the electrode unit 30 to an electroencephalogram display device or the like via the circuit pattern 22.

[0168] Referring to FIG. 5, a modified example of the fixing structure between the electrode unit 30 and the support member 20 will be described, in which a screw fitting is used instead of a snap button fitting.

[0169] In this modification, the electrode unit 30 has a male screw type connection terminal 135 provided at the top thereof, and an electrode attachment portion 160 provided as the mounting portion 25 in place of the recessed snap button 25a.

[0170] The male screw-type connection terminal 135 is made of, for example, a highly conductive metal and has a disk-shaped disk portion 135a and a protrusion 135b extending from the center of the upper surface of the disk portion 135a. The protrusion 135b is formed in a cylindrical shape and has a male screw with a thread formed on its circumferential surface. Examples of the highly conductive metal that can be used include stainless steel, copper alloy, aluminum alloy, brass, etc.

[0171] The disk portion 135a is attached to the base upper surface 37 of the base 31 with a conductive adhesive or the like. At this time, as described above, the end portion 34a of the signal line portion 34 is sandwiched between the disk portion 135a and the base upper surface 37, ensuring electrical continuity with the male screw-type connection terminal 135.

[0172] The electrode attachment part 160 is made of a good conductor and has an attachment part main body 161 that is circular in top view, and a female screw type connection terminal 162 provided in the center of the attachment part main body 161. The female screw type connection terminal 162 is a threaded opening into which the male screw type connection terminal 135 (protrusion 135b) of the electrode unit 30 is threadedly engaged. This allows for stronger fixation than snap button fitting, and can suppress the generation of noise that may be caused by the fitting part.

[0173] The outer diameter of the attachment portion main body 161 is set to be approximately the same as the outer diameter of the electrode unit 30. The upper surface of the attachment portion main body 161 is formed of a hard insulating substrate and is equipped with circuits such as an amplifier (preamplifier) ​​that primarily amplifies the brain waves acquired by the electrode unit 30. The upper surface of the attachment portion main body 161 is covered with a cover member such as a shield layer 24 as necessary.

[0174] The male screw-type connection terminal 135 protruding from the female screw-type connection terminal 162 may be fixed to the mounting body 161 with a nut (not shown). This further strengthens the fixation between the electrode unit 30 and the support member 20, and further stabilizes the transmission of electroencephalogram signals.

[0175] 1 and 2 , the attachment part 70 is a member that is attached to the part of the subject to be measured (such as the ear) to ensure an appropriate attachment state when the EEG measurement device 10 is attached to the subject's head 99. In other words, the attachment part 70 is provided at the end of the support member 20, is attached to the ear or chin of the subject, and functions as a support member that assists in aligning the support member 20 to the shape of the head 99.

[0176] The attachment parts 70 are attached to both longitudinal ends of the support member 20 (both left and right ends in Figures 1 and 2), and are placed between a part of the subject other than the measurement part (here, the ears) and the support member 20. This presses the electrode unit 30 against the head 99 with a predetermined electrode pressing force F.

[0177] Specifically, the attachment unit 70 has an adjustment unit 50, a tension display unit 60, an ear attachment unit 40, a non-elastic string 55 connecting the adjustment unit 50 and the tension display unit 60, and a string 45 connecting the tension display unit 60 and the ear attachment unit 40.

[0178] <Ear Mounting Unit> The ear mounting unit 40 is mounted on the ear of the subject. A string 45 is attached to the ear mounting unit 40, and a ring 46 provided at the end of the string 45 is used to detachably attach the ear mounting unit 40 to the second hook 64 of the tension display unit 60. In this embodiment, the ear mounting unit 40 is mounted with the string 45 wrapped around the subject's ear.

[0179] <Adjustment Unit> The adjustment unit 50 adjusts the distance (length) between the support member 20 and the ear attachment unit 40 to adjust the tension acting on the string 55 .

[0180] The adjustment unit 50 is attached to each end of the support member 20. The adjustment unit 50 has a plate-shaped member 52 attached to the support member 20, a locking unit 51 for fixing the length of the plate-shaped member 52, a string 55 attached to the end of the plate-shaped member 52 on the tension display unit 60 side, and a ring 56 provided on the end of the string 55 on the tension display unit 60 side. A first hook 63 of the tension display unit 60 is detachably attached to the ring 56.

[0181] The plate-like member 52 is a long strip with a plurality of rows of teeth. The locking portion 51 has an opening with a claw formed therein, through which the plate-like member 52 is inserted to lock it in a desired position. The locking portion 51 also has a release portion that works in conjunction with the claw to release the locked state. The material of the adjustment portion 50 is not particularly limited, but various plastics can be used. Nylon 66 is preferably used from the viewpoints of physical properties, processability, cost, etc.

[0182] <Tension Display Unit> The tension display unit 60 is detachably provided between the adjustment unit 50 and the ear attachment unit 40, and displays whether the tension acting on both ends thereof is within an appropriate range. In other words, it is possible to determine whether the tension T1 applied to the end of the support member 20 (film substrate) is within a predetermined range appropriate for electroencephalogram measurement.

[0183] 7, the tension display unit 60 has a cylindrical housing 66, a stretchable elastic body (spring 61) housed inside the housing 66, an indicator 65 that indicates the tension state of the spring 61, a scale 67, and an index unit 68. The elastic body (spring 61) recognizably indicates the tension acting on the support member 20.

[0184] The housing 66 is configured so that at least the position of the indicator 65 can be discerned. In this embodiment, the housing 66 is transparent so that the internal state can be recognized. One end of the housing 66 (here, the end on the adjustment unit 50 side) has a bottom, and the other end (here, the end on the ear attachment unit 40 side) is open. A first hook 63 is provided on the upper end of the housing 66, and is detachably attached to a ring 56 provided at the tip of a string 55 of the adjustment unit 50.

[0185] The spring 61 is, for example, a coil spring. One end of the spring 61 (the end on the adjustment unit 50 side) is fixed to the bottom end (the end on the adjustment unit 50 side) of the housing 66. The spring 61 is configured to extend to a certain degree when the EEG measurement device 10 is attached to the head 99. The degree of extension is set to an extent that the extension state can be visually confirmed using the indicator unit 65 described below, and to an extent that excessive force is not applied to the head 99.

[0186] A non-stretchable wire 62 is attached to the other end of the spring 61 (the end on the ear attachment part 40 side), and extends outward from the end on the opening side of the housing 66. A second hook 64 is provided at the tip of the wire 62. The second hook 64 allows the wire 62 to be detachably attached to a ring 46 provided at the end of the string 45 of the ear attachment part 40.

[0187] An indicator 65 is provided at the attachment portion of the spring 61 and the wire 62. The indicator 65 indicates the extension of the spring 61. A scale 67 and an indicator 68 are provided on the circumferential surface of the housing 66. The scale 67 has multiple horizontal lines arranged at regular intervals. The indicator 68 is provided with a numerical value that allows the tension to be discerned. The indicator 65, the scale 67, and the indicator 68 function as a tension appropriateness indicator that clearly indicates whether the tension is within the appropriate range. Note that the scale 67 may include a mark, such as a red line, indicating the appropriate range so that it can be easily determined that the tension is within the appropriate range.

[0188] It is also possible that the appropriate tension may differ depending on the attributes of the subject (e.g., age, sex, hair condition, etc.). Therefore, multiple types of tension display units 60 with different strengths of the springs 61, ranges of the scales 67 and indicator portions 68, etc. may be prepared, so that the appropriate tension display unit 60 can be selected depending on the subject.

[0189] <Electrode Pressing Force F on Head> Features of this embodiment will be described with reference to Fig. 8 and Fig. 9. Fig. 8 is a diagram illustrating a model of the force (electrode pressing force F on the head) acting on the head 99 when the electroencephalogram measuring device 10 is worn. Fig. 9 is a diagram illustrating the capstan principle (capstan equation) used in the modeling.

[0190] As shown in Figure 8, when the electroencephalogram measuring device 10 is attached to the head 99, a polygon (or broken line) is formed with the electrode units 30 as vertices and the electrode units 30 connected by the support members 20. If it is assumed that the electrode units 30 are pressed against the head 99 by the tension of the support members 20, the force pressing the electrode units 30 against the head 99 (electrode pressing force F) can be expressed by the following formula 1: F = 2 T １cos(θ) Equation 1 In other words, a difference in θ caused by individual differences in head irregularities appears as a difference in the electrode pressing force F.

[0191] Furthermore, the minimum curvature of the inscribed circle is determined from the height and spacing of the electrode units 30. The maximum curvature is also determined from the electrode pressing force F required for the electrode units 30 and the capstan principle. Note that the electrode pressing force F on the head 99 follows the capstan equation, and is therefore greater at the temporal region than at the parietal region.

[0192] Here, it is assumed that the support member 20 (film substrate) is approximately wrapped around the head 99. Because there is friction between the head 99 and the support member 20, the tension of each electrode unit 30 is considered to follow the capstan equation shown in the following equation 2. T １ =T ２ ・e^(μ・φ) ...Formula 2 μ: Friction coefficient φ: Center angle

[0193] From the above formulas 1 and 2, it is possible to understand the relationship between the tension T1 applied to the end of the support member 20 (film substrate) and the load (electrode pressing force F) that the electrode unit 30 applies to the head 99. The load values ​​calculated from the above theoretical calculations and the actually measured load values ​​will be shown in the examples described later (see FIG. 10).

[0194] As described above, according to this embodiment, in the EEG measuring device 10, by providing a circuit pattern 22 on the support member 20, it is possible to eliminate electrical wires, etc., and simplify the wiring structure while allowing the electrode unit 30 of the EEG measuring device 10 to be in appropriate contact with the scalp.

[0195] Furthermore, the electrode units 30 are fixed to the support member 20 made of a film base material, forming a polygon (or broken line) with the electrode units 30 attached only to the necessary areas as vertices. This allows the electrode units 30 to conform well to the shape of the head. Furthermore, the wearing state of the EEG measuring device 10 is modeled using a capstan equation, allowing the electrode pressing force F applied by the electrode units 30 to be properly understood.

[0196] Furthermore, by providing the adjustment unit 50 and the tension display unit 60 on the attachment unit 70, the tension acting on the support member 20 can be adjusted within an appropriate range. Furthermore, by making the tension display unit 60 detachable, an appropriate tension display unit 60 can be selected and used depending on the attributes of the subject, thereby achieving stable electroencephalogram measurement.

[0197] More specifically, if the support member 20 and the attachment portion 70 are all non-elastic, changing the length with the adjustment unit 50 directly changes the tension. Because the appropriate range of force for pressing the electrode unit 30 against the scalp is narrow, i.e., the appropriate range of the adjustment unit 50 is also narrow, tending to make adjustment difficult. More specifically, while the deformation and elasticity of the ear and scalp have the effect of slightly widening the appropriate range of the adjustment unit 50, adjustment is still difficult. The adjustment range between a low, loose tension state and a high, painful tension state is narrow, making it difficult to wear the EEG measuring device 10 by pressing the electrode unit 30 with sufficient force without causing discomfort to the subject. On the other hand, if a tension indicator 60 is provided, i.e., if an elastic member is included, the appropriate range of the adjustment unit 50 can be greatly widened by taking into account not only the deformation and elasticity of the ear and scalp but also the deformation of a more elastic elastic body such as a spring, making it easier to wear the EEG measuring device 10 in an appropriate state.

[0198] The plate-like member 152 is a long, rail-like strip with a plurality of protrusions 152a arranged in a row. The locking portion 151 is slidably fitted into the rail formed by the protrusions 152a. The locking portion 151 has a locking mechanism 156 that prevents it from sliding. The non-slidable state is released by performing a predetermined operation on the locking mechanism 156 (for example, by pushing it sideways).

[0199] By sliding the locking portion 151 on the plate-shaped member 152, the distance between the tension display portion 60 (i.e., the ear attachment portion 40) attached to the string 55 and the support member 20, i.e., the tension, can be adjusted.

[0200] Summary of the Embodiments The features of the embodiments can be briefly summarized as follows: (1) An electroencephalogram (EEG) measuring device 10 comprising: an electrode unit 30 that contacts a measurement site on a head 99 of a subject to acquire an EEG signal; a support member 20 that supports the electrode unit 30; and an attachment section 70 (support member) that supports placement of the support member 20 on the head 99, wherein the attachment section 70 (support member) comprises a non-stretchable film member and a mounting section 25 to which the electrode unit 30 is electrically connected and fixed, wherein the film member comprises a non-stretchable base member 21 and a circuit pattern 22 provided on the base member 21, and the circuit pattern 22 is connected to the mounting section 25. (2) The electroencephalogram (EEG) measuring device 10 according to (1), further comprising an electromagnetic wave shielding member (shielding layer 24) that covers the circuit pattern 22. (3) The electroencephalogram measuring device 10 according to (1) or (2), wherein the film member is elongated, and wherein a plurality of the electrode units 30 are arranged in a line at predetermined intervals in the longitudinal direction of the film member. (4) The electroencephalogram measuring device 10 according to any one of (1) to (3), wherein the electrode unit 30 has a base 31, a plurality of protrusions 32 (convex portions) provided on the base 31, and conductive contact portions 33 (electrode portions) provided on the protrusions 32 (convex portions) and in contact with the head 99. (5) The electroencephalogram measuring device 10 according to (4), wherein the protrusions 32 (convex portions) are elastic members. (6) The electroencephalogram measuring device 10 according to any one of (1) to (5), wherein the attachment portion 70 (support member) is provided at an end of the support member 20, is attached to the ear or the chin, and supports the alignment of the support member 20 to the shape of the head 99. (7) The electroencephalogram measuring device 10 according to any one of (1) to (6), wherein the attachment section 70 (support member) has a spring member. (8) The electroencephalogram measuring device 10 according to any one of (1) to (7), wherein the attachment section 70 (support member) has a member for adjusting its length. (9) The electroencephalogram measuring device 10 according to any one of (1) to (8), wherein the support member 20 is bent at the attachment positions (mounting sections 25) of the electrode units 30 as vertices and the vertices are connected in a straight line.(10) An electroencephalogram measuring method for measuring electroencephalograms by attaching the electroencephalogram measuring device 10 according to any one of (1) to (9) to the head 99 of a subject.

[0201] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can also be adopted.

[0202] Hereinafter, the present embodiment will be described in detail with reference to examples. However, the present embodiment is not limited to the description of these examples. The following examples correspond to the first and second embodiments, and confirmation was carried out regarding "verification of the support member (film substrate)" and "verification of modeling based on the capstan equation."

[0203] <<Verification of Support Member (Film Substrate)>> A total of seven samples from Examples 1 to 7 were evaluated for suitability as the support member 20. The evaluation criteria were rated on a three-point scale as follows: Evaluation A: When a constant tension (0.6 N) was applied, the electrode position shift was small (5 mm or less); Evaluation B: When a constant tension (0.6 N) was applied, the electrode position shift was within the allowable range (10 mm or less); Evaluation C: When a constant tension (0.6 N) was applied, the electrode position shift was outside the allowable range (more than 10 mm).

[0204] The materials of each sample in Examples 1 to 7 are as follows. Table 1 shows the physical properties (Poisson's ratio, Young's modulus, maximum thickness, Young's modulus × thickness). Example 1...PET (polyethylene terephthalate) resin Example 2...PI (polyimide) resin Example 3...aluminum foil Example 4...copper foil Example 5...PS (polystyrene) resin Example 6...PE (polyethylene) resin Example 7...glass film

[0205] In Examples 1 to 6, the electrode position shift when a constant tension was applied was small, and electroencephalograms could be stably acquired at the target position. In Example 7, the Young's modulus of the support member was smaller than in Examples 1 to 6, and the thickness was larger than in the other samples in order to suppress deformation, but the electrode position shift when a constant tension was applied was slightly larger.

[0206]

[0207] <<Verification of modeling based on the capstan equation>> The electroencephalogram measuring device shown in the embodiment was attached to a head model, and the electrode pressing force F was measured using a pressure sensor placed on the surface of the head model, and the measured value was compared with the calculated value obtained from the model based on the capstan equation.

[0208] The specific specifications of the electroencephalogram measuring device 10 are as follows: EEG measuring positions: 5 locations: T3, C3, Cz, C4, and T4 Electrode unit: base diameter 10 mm, base thickness 5 mm, protrusion height 5 mm, number of protrusions 7, inter-electrode distance 70 mm Supporting member (film substrate): PI resin Poisson's ratio 0.3 Young's modulus 3.4 GPa Maximum thickness 0.225 mm Instead of fixing to the ears with the ear attachment parts, a 200 g weight was attached to each end to simulate the wearing state of the electroencephalogram measuring device.

[0209] 10 shows a graph of the theoretical (calculated) and measured values ​​of the electrode pressing force F at five locations, T3, C3, Cz, C4, and T4. As can be seen from the graph, the theoretical and measured values ​​are almost identical, confirming the validity of the modeling.

[0210] This application claims priority based on Japanese Patent Application No. 2023-213993, filed December 19, 2023, the disclosure of which is incorporated herein by reference in its entirety.

[0211] DESCRIPTION OF SYMBOLS 10 Electroencephalogram measuring device 20 Support member (film substrate, ribbon member) 22 Circuit pattern 23 Protective layer 24 Shield layer 25 Mounting section 25a Concave snap button 30 Electrode unit 31 Base 32 Protrusion (convex portion) 33 Conductive contact section (electrode section) 34 Signal line section 35 Convex snap button 40 Ear attachment section 50 Adjustment section 60 Tension display section 61 Spring 62 Wire 63 First hook 64 Second hook 65 Indicator section (correct tension display section) 66 Housing 67 Scale (correct tension display section) 68 Indicator section (correct tension display section) 70 Mounting section 135 Male screw type connection terminal 160 Electrode mounting section 161 Mounting section main body 162 Female screw type connection terminal

Claims

1. An electroencephalogram (EEG) measuring device comprising: an electrode unit that contacts a measurement site on a subject's head to acquire an EEG signal; a support member that supports the electrode unit; and a support member that assists in positioning the support member on the head, wherein the support member has a non-elastic film member and a mounting portion to which the electrode unit is electrically connected and fixed, and the film member has a non-elastic base material and a circuit pattern provided on the base material, and the circuit pattern is connected to the mounting portion.

2. The electroencephalogram measuring device according to claim 1, further comprising an electromagnetic wave shielding material covering said circuit pattern.

3. An electroencephalogram measuring device as described in claim 1 or 2, wherein the film member is elongated, and the electrode units are arranged in a row at predetermined intervals in the longitudinal direction of the film member.

4. An electroencephalogram measuring device as described in any one of claims 1 to 3, wherein the electrode unit has a base, a plurality of convex portions provided on the base, and an electrode portion provided on the convex portions and in contact with the head.

5. The electroencephalogram measuring device according to claim 4, wherein the convex portion is an elastic member.

6. An electroencephalogram measuring device as claimed in any one of claims 1 to 5, wherein the support member is provided at an end of the support member and is attached to the ear or chin to assist in positioning the support member to the shape of the head.

7. An electroencephalogram measuring device as claimed in any one of claims 1 to 6, wherein the support member has a spring-like member.

8. An electroencephalogram measuring device as described in any one of claims 1 to 7, wherein the support member has a member for adjusting its length.

9. An electroencephalogram measuring device as described in any one of claims 1 to 8, wherein the support member is bent at the mounting position of the electrode unit as a vertex and connects the vertices in a straight line.

10. An electroencephalogram measuring method for measuring electroencephalograms by attaching an electroencephalogram measuring device according to any one of claims 1 to 9 to the head of a subject.

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