Resin composition, film, optical filter, solid-state imaging element, and image display device

Abstract

Provided are: a resin composition comprising a coloring material and a resin, wherein the coloring material includes a coloring material A comprising a cation having a colorant structure and an anion represented by formula (1) or formula (2); and a film, an optical filter, a solid-state imaging element, and an image display device each obtained using the resin composition. In formula (1), R11 and R12 each independently represent a group represented by formula (3). In formula (2), R21 to R23 each independently represent a group represented by formula (3). In formula (3), * indicates a bond, R101 to R103 each independently represent a hydrogen atom or a substituent, and at least one of R101 to R103 includes an electron withdrawing group containing no fluorine atom.

Description

Resin composition, film, optical filter, solid-state imaging device and image display device

[0001] The present invention relates to a resin composition containing a colorant containing a cation and an anion having a dye structure, and also to a film, an optical filter, a solid-state imaging device, and an image display device using the resin composition.

[0002] In recent years, the widespread use of digital cameras and camera-equipped mobile phones has led to a significant increase in demand for solid-state imaging devices such as charge-coupled device (CCD) image sensors. Color filters are used as key devices in displays and optical elements. Color filters typically have pixels of the three primary colors, red, green, and blue, and serve to separate transmitted light into the three primary colors.

[0003] Each color pixel of the color filter is manufactured using a resin composition containing a coloring material.

[0004] Known coloring materials include those containing a cation having a dye structure and an anion.

[0005] Patent Document 1 discloses a triarylmethane dye having a tristrifluoromethanesulfonylmethide anion as a counter anion.

[0006] JP 2010-256598 A

[0007] A colorant containing a cation having a dye structure and an anion is susceptible to decomposition due to nucleophilic attack by the anion at the dye structure, and such a colorant tends to have low heat resistance. Therefore, there is room for further improvement in the heat resistance of a film obtained using a resin composition containing such a colorant.

[0008] Therefore, an object of the present invention is to provide a resin composition capable of forming a film having excellent heat resistance, and a film, an optical filter, a solid-state imaging device, and an image display device using the resin composition.

[0009] The present inventors have found through their investigations that the above object can be achieved by using a resin composition described below, and have thus completed the present invention.

[0010] <1> A resin composition containing a colorant and a resin, wherein the colorant contains a colorant A containing a cation having a dye structure and an anion represented by formula (1) or formula (2); In formula (1), R １１ and R １２ each independently represents a group represented by formula (3); ２１ ~R ２３ each independently represents a group represented by formula (3); In formula (3), * represents a bond, and R １０１ ~R １０３ each independently represents a hydrogen atom or a substituent, R １０１ ~R １０３ <2> At least one of the above-mentioned electron-withdrawing groups not containing a fluorine atom is a nitro group, a cyano group, a —COR Ａ１ , -COOR Ａ１ , -CONR Ａ１ R Ａ２ , -S(=O)R Ａ１ R Ａ２ , -S(=O) ２ OR Ａ１ and -S(=O) ２ NR Ａ１ R Ａ２ and R Ａ１ and R Ａ２ and each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, or a heteroaryl group. Ａ１ and R Ａ１is a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, or a heteroaryl group. <4> The resin composition according to any one of <1> to <3>, wherein the cation having the dye structure is a cation having a polymethine dye structure, a diarylmethane dye structure, a triarylmethane dye structure, a xanthene dye structure, a dithienophosphorine dye structure, a squarylium dye structure, or an iminium dye structure. <5> The resin composition according to any one of <1> to <3>, wherein the cation having the dye structure is a cation having a triarylmethane dye structure, a xanthene dye structure, or an iminium dye structure. <6> The resin composition according to any one of <1> to <5>, wherein the colorant further comprises a colorant other than the colorant A. <7> The resin composition according to any one of <1> to <6>, further comprising a polymerizable compound and a photopolymerization initiator. <8> A film obtained using the resin composition according to any one of <1> to <7>. <9> An optical filter having the film according to <8>. <10> A solid-state imaging device having the film according to <8>. <11> An image display device having the film according to <8>.

[0011] According to the present invention, it is possible to provide a resin composition capable of forming a film having excellent heat resistance. The present invention also provides a film, an optical filter, a solid-state imaging device, and an image display device.

[0012] The present invention will be described in detail below. In this specification, the term "to" is used to mean that the numerical values ​​before and after the term are included as the lower and upper limits. In the description of groups (atomic groups) in this specification, a term without specifying whether it is substituted or unsubstituted encompasses both unsubstituted groups (atomic groups) and substituted groups (atomic groups). For example, the term "alkyl group" encompasses not only unsubstituted alkyl groups (unsubstituted alkyl groups) but also substituted alkyl groups (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams, and other actinic rays or radiation. As used herein, "(meth)acrylate" refers to either or both of acrylate and methacrylate, "(meth)acrylic" refers to either or both of acrylic and methacrylic, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl. In the structural formulae herein, Me refers to a methyl group, Et refers to an ethyl group, Bu refers to a butyl group, and Ph refers to a phenyl group. As used herein, the weight-average molecular weight and number-average molecular weight are polystyrene-equivalent values ​​measured by GPC (gel permeation chromatography). As used herein, the term "total solids" refers to the total mass of all components of a composition excluding the solvent. As used herein, the term "pigment" refers to a coloring material that is difficult to dissolve in a solvent. As used herein, the term "process" refers not only to an independent process, but also to a process that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved.

[0013] <Resin composition> The resin composition of the present invention is a resin composition containing a colorant and a resin, wherein the colorant contains a colorant A containing a cation having a dye structure and an anion represented by formula (1) or formula (2).

[0014] The use of the resin composition of the present invention makes it possible to form a film with excellent heat resistance. The reason for this effect is presumed to be as follows. The colorant A used in the resin composition of the present invention has an anion represented by formula (1) or formula (2). This anion has an electron-withdrawing group near the anion moiety, which is presumed to have a low pKa, thereby suppressing nucleophilic attack by the anion on cations having a dye structure, thereby suppressing decomposition of the dye structure. Furthermore, since this anion has an electron-withdrawing group that does not contain a fluorine atom, it is presumed to be possible to prevent uneven distribution of colorant A on the film surface, thereby suppressing decomposition or denaturation of colorant A due to oxygen in the atmosphere during heating. Therefore, it is presumed that the use of the resin composition of the present invention makes it possible to form a film with excellent heat resistance.

[0015] When the resin composition of the present invention is used to form a pattern by photolithography to form pixels, the variation in the spectral characteristics of the film before and after development can also be suppressed. As described above, since colorant A has the above anion, it is presumed that uneven distribution of colorant A on the film surface layer can be suppressed, and as a result, it is presumed that removal of colorant A from the film by the developer during development can be suppressed. Therefore, it is presumed that the variation in the spectral characteristics of the film before and after development can be suppressed. When the resin composition of the present invention is used for pattern formation by photolithography, it is preferable that the resin composition of the present invention contains a polymerizable compound and a photopolymerization initiator.

[0016] The resin composition of the present invention is preferably used as a resin composition for an optical filter. Examples of the optical filter include a color filter, an infrared transmission filter, and an infrared cut filter, and a color filter is preferred.

[0017] The color filter may have colored pixels that transmit light of a specific wavelength. Examples of the colored pixels include red, green, blue, magenta, cyan, and yellow pixels. The colored pixels of the color filter may be formed using a resin composition containing a chromatic colorant.

[0018] The infrared cut filter preferably has a maximum absorption wavelength in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1300 nm, and even more preferably in the wavelength range of 700 to 1000 nm. The transmittance of the infrared cut filter over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. The transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. The ratio of the absorbance Amax at the infrared cut filter's maximum absorption wavelength to the absorbance A550 at a wavelength of 550 nm (absorbance Amax / absorbance A550) is preferably 20 to 500, more preferably 50 to 500, even more preferably 70 to 450, and particularly preferably 100 to 400. The infrared cut filter can be formed using a resin composition containing an infrared-absorbing colorant.

[0019] The infrared transmission filter is a filter that transmits at least a portion of infrared light. The infrared transmission filter is preferably a filter that blocks at least a portion of visible light and transmits at least a portion of infrared light. Examples of the infrared transmission filter include a filter that satisfies the spectral characteristics of a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1300 nm. The infrared transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5): (1): A filter that has a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 800 to 1500 nm. (2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 750 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 900 to 1500 nm. (3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 830 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm. (4): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 950 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm. (5): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 1050 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm.

[0020] The solids concentration of the resin composition of the present invention is preferably 5 to 30% by mass. The lower limit is preferably 7.5% by mass or more, more preferably 10% by mass or more. The upper limit is preferably 25% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less.

[0021] Each component used in the resin composition of the present invention will be described below.

[0022] <<Colorant>> (Specific Colorant) The resin composition of the present invention contains a colorant. The colorant used includes a colorant A (hereinafter referred to as the specific colorant) that includes a cation having a dye structure and an anion represented by formula (1) or formula (2).

[0023] The specific colorant may be a chromatic colorant or an infrared-absorbing colorant. Examples of chromatic colorants include colorants having a maximum absorption wavelength in the wavelength range of 400 to 700 nm. Examples include green, red, yellow, purple, blue, and orange colorants. Examples of infrared-absorbing colorants include colorants having a maximum absorption wavelength longer than 700 nm. The infrared-absorbing colorant is preferably a colorant having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1800 nm, more preferably a colorant having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1400 nm, even more preferably a colorant having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1200 nm, and particularly preferably a colorant having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1000 nm. Furthermore, the absorbance A of the infrared-absorbing colorant at a wavelength of 500 nm is １ and absorbance A at the maximum absorption wavelength ２ Ratio A １ / A ２ is preferably 0.08 or less, and more preferably 0.04 or less.

[0024] The specific colorant may be a pigment or a dye. When the specific colorant is a pigment, the solubility of the specific colorant in 100 g of water at 23° C. and in 100 g of propylene glycol monomethyl ether acetate at 23° C. is preferably less than 1 g, more preferably 0.5 g or less, and even more preferably 0.1 g or less. When the specific colorant is a dye, the solubility of the specific colorant in 100 g of propylene glycol monomethyl ether acetate at 23° C. is preferably 1 g or more, more preferably 5 g or more.

[0025] -Specific Anion- The specific colorant has an anion represented by formula (1) or formula (2) (hereinafter also referred to as specific anion).

[0026] In formula (1), R １１ and R １２ each independently represents a group represented by formula (3); ２１ ~R ２３ each independently represents a group represented by formula (3); In formula (3), * represents a bond, and R １０１ ~R １０３ each independently represents a hydrogen atom or a substituent, R １０１ ~R １０３ At least one of the groups contains an electron-withdrawing group that does not contain a fluorine atom.

[0027] R in formula (3) １０１ ~R １０３ Examples of the substituent represented by include the substituent T described below, and the substituent is preferably an alkyl group, an aryl group, a heteroaryl group, an alkoxy group, an alkylthio group, an aryloxy group, an arylthio group, a heteroaryloxy group, a heteroarylthio group, or an electron-withdrawing group not containing a fluorine atom, and more preferably an alkyl group, an aryl group, or an electron-withdrawing group not containing a fluorine atom.

[0028] The alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, and even more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include an electron-withdrawing group that does not contain a fluorine atom.

[0029] The number of carbon atoms in the alkoxy group is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkoxy group is preferably linear or branched, more preferably linear. The alkoxy group may have a substituent, but is preferably unsubstituted.

[0030] The number of carbon atoms in the aryl group and aryloxy group is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group and aryloxy group may have a substituent. Examples of the substituent include an electron-withdrawing group that does not contain a fluorine atom.

[0031] The heteroaryl group and heteroaryloxy group preferably have 1 to 15 carbon atoms constituting the ring, and more preferably 1 to 10. The heteroatoms constituting the ring of the heteroaryl group and heteroaryloxy group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the ring of the heteroaryl group and heteroaryloxy group is preferably 1 to 3, and more preferably 1 to 2. The heteroaryl group and heteroaryloxy group may be a monocyclic ring or a fused ring. The heteroaryl group and heteroaryloxy group may have a substituent. Examples of the substituent include an electron-withdrawing group that does not contain a fluorine atom.

[0032] The fluorine atom-free electron-withdrawing group may be a substituent having a Hammett's substituent constant σm value of 0.2 or more, preferably a group having a σm value of 0.25 or more, more preferably a group having a σm value of 0.3 or more, and even more preferably a group having a σm value of 0.35 or more. There is no particular upper limit for the σm value, but it is preferably 1.5 or less.

[0033] Hammett's substituent constant σ value will now be explained. Hammett's rule is an empirical rule proposed by L. P. Hammett in 1935 to quantitatively discuss the influence of substituents on the reaction or equilibrium of benzene derivatives, and it is now widely recognized as valid. The substituent constants calculated by Hammett's rule include σp and σm values, and these values ​​can be found in many general textbooks. For example, see "Lange's Handbook of Chemistry," 12th Edition, 1979 (McGraw-Hill), edited by J. A. Dean; "Chemical Domain," special edition, No. 122, pp. 96-103, 1979 (Nankodo); and Chem. Rev., Vol. 91, pp. 165-195, 1991, for detailed information.

[0034] The electron-withdrawing group not containing a fluorine atom is a nitro group, a cyano group, a -COR Ａ１ , -COOR Ａ１ , -CONR Ａ１ R Ａ２ , -S(=O)R Ａ１ R Ａ２ , -S(=O) ２ OR Ａ１ or -S(=O) ２ NR Ａ１ R Ａ２ Preferably, -COOR Ａ１ It is more preferable that R Ａ１ and R Ａ２ each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, or a heteroaryl group.

[0035] R Ａ１ and R Ａ２ The number of carbon atoms in the alkyl group represented by R is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may have a substituent. Examples of the substituent T described below include an alkoxy group, an aryloxy group, or an alkoxycarbonyl group. Ａ１ and R Ａ２The number of carbon atoms in the alkenyl group represented by is preferably 1 to 15, and more preferably 1 to 10. Examples of the substituent T described below include an alkoxy group, an aryloxy group, or an alkoxycarbonyl group. Ａ１ and R Ａ２ The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, even more preferably 6 to 10, and particularly preferably 6. Examples of the substituent T described below include an alkoxy group, an aryloxy group, or an alkoxycarbonyl group. Ａ１ and R Ａ２ The heteroaryl group represented by the formula (I) preferably has 1 to 15 carbon atoms constituting the ring, more preferably 1 to 10. Examples of heteroatoms constituting the ring of the heteroaryl group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3, more preferably 1 or 2. The heteroaryl group may be a monocyclic ring or a fused ring. Examples of the substituent T described below include an alkoxy group, an aryloxy group, or an alkoxycarbonyl group.

[0036] Examples of the substituent T include the following groups: a halogen atom (for example, a chlorine atom, a bromine atom, or an iodine atom), an alkyl group (preferably an alkyl group having 1 to 30 carbon atoms), an alkenyl group (preferably an alkenyl group having 2 to 30 carbon atoms), an alkynyl group (preferably an alkynyl group having 2 to 30 carbon atoms), an aryl group (preferably an aryl group having 6 to 30 carbon atoms), a heterocyclic group (preferably a heterocyclic group having 1 to 30 carbon atoms), an amino group (preferably an amino group having 0 to 30 carbon atoms), an alkoxy group (preferably an alkoxy group having 1 to 30 carbon atoms), an aryloxy group (preferably an aryl group having 6 ... oxy group), heterocyclic oxy group (preferably a heterocyclic oxy group having 1 to 30 carbon atoms), acyl group (preferably an acyl group having 2 to 30 carbon atoms), alkoxycarbonyl group (preferably an alkoxycarbonyl group having 2 to 30 carbon atoms), aryloxycarbonyl group (preferably an aryloxycarbonyl group having 7 to 30 carbon atoms), heterocyclic oxycarbonyl group (preferably a heterocyclic oxycarbonyl group having 2 to 30 carbon atoms), acyloxy group (preferably an acyloxy group having 2 to 30 carbon atoms), acylamino group (preferably an acylamino group having 2 to 30 carbon atoms). , an aminocarbonylamino group (preferably an aminocarbonylamino group having 2 to 30 carbon atoms), an alkoxycarbonylamino group (preferably an alkoxycarbonylamino group having 2 to 30 carbon atoms), an aryloxycarbonylamino group (preferably an aryloxycarbonylamino group having 7 to 30 carbon atoms), a sulfamoyl group (preferably a sulfamoyl group having 0 to 30 carbon atoms), a sulfamoylamino group (preferably a sulfamoylamino group having 0 to 30 carbon atoms), a carbamoyl group (preferably a carbamoyl group having 1 to 30 carbon atoms), an alkylthiazolinone group (preferably an alkylthiazolinone ... an alkylthio group (preferably an alkylthio group having 1 to 30 carbon atoms), an arylthio group (preferably an arylthio group having 6 to 30 carbon atoms), a heterocyclic thio group (preferably a heterocyclic thio group having 1 to 30 carbon atoms), an alkylsulfonyl group (preferably an alkylsulfonyl group having 1 to 30 carbon atoms), an alkylsulfonylamino group (preferably an alkylsulfonylamino group having 1 to 30 carbon atoms), an arylsulfonyl group (preferably an arylsulfonyl group having 6 to 30 carbon atoms), an arylsulfonylamino group (preferably an arylsulfonylamino group having 6 to 30 carbon atoms),Heterocyclic sulfonyl groups (preferably heterocyclic sulfonyl groups having 1 to 30 carbon atoms), heterocyclic sulfonylamino groups (preferably heterocyclic sulfonylamino groups having 1 to 30 carbon atoms), alkylsulfinyl groups (preferably alkylsulfinyl groups having 1 to 30 carbon atoms), arylsulfinyl groups (preferably arylsulfinyl groups having 6 to 30 carbon atoms), heterocyclic sulfinyl groups (preferably heterocyclic sulfinyl groups having 1 to 30 carbon atoms), ureido groups (preferably ureido groups having 1 to 30 carbon atoms), hydroxy groups, nitro groups, carboxy groups, sulfo groups, phosphoric acid groups, carboxylic acid amide groups, sulfonic acid amide groups, imido groups, phosphino groups, mercapto groups, cyano groups, alkylsulfino groups, arylsulfino groups, arylazo groups, heterocyclic azo groups, phosphinyl groups, phosphinyloxy groups, phosphinylamino groups, silyl groups, hydrazino groups, and imino groups. When these groups can be further substituted, they may further have a substituent. Examples of the substituent include the groups described above for the substituent T.

[0037] In formula (3), R １０１ ~R １０３ At least one of the groups contains an electron-withdrawing group that does not contain a fluorine atom.

[0038] R １０１ ~R １０３ In one embodiment, when at least one of R １０１ ~R １０３ In one embodiment, at least one of the groups is an electron-withdrawing group that does not contain a fluorine atom.

[0039] R １０１ ~R １０３ In another embodiment where at least one of R １０１ ~R １０３ In one embodiment, at least one of the above is a group having a fluorine-free electron-withdrawing group as a substituent. Specific examples of this embodiment include alkyl groups having a fluorine-free electron-withdrawing group as a substituent. The number of carbon atoms in the alkyl group is preferably 1 to 10, more preferably 1 to 5, and even more preferably 1 to 3.

[0040] In formula (3), R １０１ ~R １０３ At least one of the following is -COOR Ａ１ According to this embodiment, the effects of the present invention are more pronounced. Ａ１ The details are as described above.

[0041] In formula (3), R １０１ ~R １０３ Preferably, one or two of R １０１ ~R １０３ One or two of the following are -COOR Ａ１ It is more preferred that the composition contains:

[0042] The compound represented by formula (1) preferably contains 2 to 4, and more preferably 2 to 3, electron-withdrawing groups that do not contain fluorine atoms. Ａ１ The compound represented by formula (2) preferably contains 3 to 6, more preferably 3 to 5, electron-withdrawing groups not containing a fluorine atom. Ａ１ It is preferable that the compound contains one or more of these, more preferably 1 to 6 of these, and even more preferably 1 to 5 of these.

[0043] The molecular weight of the compound represented by formula (1) is preferably 100 to 1500. The upper limit is preferably 1200 or less, more preferably 1000 or less. The lower limit is preferably 120 or more, more preferably 150 or more. The molecular weight of the compound represented by formula (2) is preferably 100 to 1500. The upper limit is preferably 1200 or less, more preferably 1000 or less. The lower limit is preferably 120 or more, more preferably 150 or more.

[0044] Among the specific anions, specific examples of the anion represented by formula (1) include the anions shown below.

[0045] Among the specific anions, specific examples of the anion represented by formula (2) include the anions shown below.

[0046] - Cation Having Dye Structure - The specific colorant has a cation having a dye structure. In this specification, the dye structure is a partial structure derived from a dye, and is a chromophore. The dye structure can be a structure derived from a known dye, and is not particularly limited. The cation having a dye structure is preferably a cation having a polymethine dye structure, a triarylmethane dye structure, a xanthene dye structure, a dithienophosphorine dye structure, a squarylium dye structure, or an iminium dye structure, and more preferably a cation having a triarylmethane dye structure, a xanthene dye structure, or an iminium dye structure.

[0047] An embodiment of the cation having a dye structure is a cation represented by formula (C1-1) or (C1-2). In formula (C1-1), X １ and X ２ each independently represents a hydrogen atom or a substituent; n1 and n2 each independently represent an integer of 0 or more; R １ represents a hydrogen atom or a substituent, Ar １ ~Ar ４ each independently represents an aryl group or a heteroaryl group; Ar １ and Ar ３ , X １ and Ar ３ , Ar ２ and Ar ４ , X ２ and Ar ４ may be bonded via a linking group or a single bond to form a ring; １ａ and X ２ａ each independently represents a hydrogen atom or a substituent; n1 and n2 each independently represent an integer of 0 or more; R １ａ represents a hydrogen atom or a substituent; １ａ -O-, -S-, -S(=O)-, -S(=O)２ -, -SiR Ｌ１ R Ｌ２ -, -P(=O)R Ｌ３ represents -, and R Ｌ１ ~R Ｌ３ each independently represents an alkyl group, an aryl group, an alkoxy group, or an aryloxy group; Ar １ａ ~Ar ４ａ each independently represents an aryl group or a heteroaryl group; Ar １ａ and Ar ３ａ , X １ａ and Ar ３ａ , Ar ２ａ and Ar ４ａ , X ２ａ and Ar ４ａ may be bonded via a linking group or a single bond to form a ring;

[0048] X in formula (C1-1) １ , X ２ , R １ , X in formula (C1-2) １ａ , X ２ａ , R １ａ Examples of the substituent represented by include the substituent T described above.

[0049] R in formula (C1-1) １ , R in formula (C1-2) １ａ is preferably an aryl group or a heteroaryl group, more preferably an aryl group. The aryl group and the heteroaryl group may further have a substituent. Examples of the further substituent include the groups listed above for the substituent T.

[0050] X in formula (C1-1) １ , X ２ , X in formula (C1-2) １ａ , X ２ａ is -NR Ｘ１０１ R Ｘ１０２ It is preferable that R Ｘ１０１ and R Ｘ１０２ are each independently a hydrogen atom or a substituent, and are preferably a substituent. Examples of the substituent include the substituents described above, and are preferably an alkyl group.

[0051] Ar in formula (C1-1)１ ~Ar ４ , Ar in formula (C1-2) １ａ ~Ar ４ａ are preferably each independently an aryl group.

[0052] It is preferred that n1 and n2 in formula (C1-1) and n1 and n2 in formula (C1-2) are each independently 0 or 1.

[0053] An example of a cation having a dye structure is a cation represented by formula (C2-1).

[0054] In formula (C2-1), Ar １１ ~Ar １５ each independently represents an aryl group or a heteroaryl group; n1 to n5 each independently represent an integer of 1 or more; R １１ ~R １８ each independently represents a hydrogen atom or a substituent.

[0055] Ar １１ ~Ar １５ is preferably each independently an aryl group. １１ ~R １８ Examples of the substituent represented by R include the above-mentioned substituent T, and R is preferably an alkyl group. １１ ~R １８ are each independently an alkyl group. n1 to n5 are each independently an integer of 1 or more, and are preferably 1.

[0056] The cation represented by formula (C2-1) is preferably a cation represented by formula (C2-2).

[0057] In formula (C2-2), R １１ ~R １８ R each independently represents a hydrogen atom or a substituent. １１ ~R １８ Examples of the substituent represented by R include the above-mentioned substituent T, and R is preferably an alkyl group. １１ ~R １８ are preferably each independently an alkyl group.

[0058] The cation represented by formula (C2-2) can also be represented as a resonance structure represented by formula (C2-2').

[0059] An example of a cation having a dye structure is a cation represented by formula (C3-1). In formula (C3-1), X ３１ and X ３２ each independently represents a nitrogen atom, an oxygen atom, or a sulfur atom; R ３１ ~R ３７ each independently represents a hydrogen atom or a substituent; ３１ When is an oxygen atom or a sulfur atom, R ３２ does not exist, and X ３２ When is an oxygen atom or a sulfur atom, R ３４ does not exist, and R ３１ ~R ３７ may be bonded to each other to form a ring, and n1 represents an integer of 1 to 9.

[0060] R ３１ ~R ３７ Examples of the substituent represented by include the groups exemplified above as the substituent T.

[0061] The cation represented by formula (C3-1) is preferably a cation represented by any one of formulas (C3-2) to (C3-5).

[0062] In the above formula, X ３１ and X ３２ each independently represents a nitrogen atom, an oxygen atom, or a sulfur atom; R ３１ ~R ３７ each independently represents a hydrogen atom or a substituent; ３１ When is an oxygen atom or a sulfur atom, R ３２ does not exist, and X ３２ When is an oxygen atom or a sulfur atom, R ３４ does not exist, and R ３１ ~R ３７ may be bonded to each other to form a ring, Ar ３１ａ and Ar３２ａ represents a heterocycle which may have a substituent; and n2 represents an integer of 0 to 5.

[0063] An example of a cation having a dye structure is a cation represented by formula (C4-1). In formula (C4-1), L １０１ is -P(=O)(R Ｌ１０１ )-,-P(=S)(R Ｌ１０２ ) -, -Si(R Ｌ１０３ ) (R Ｌ１０４ ) -, -B(R Ｌ１０５ ) -, -S(=O) ２ - or -S(=O)-, R Ｌ１０１ ~R Ｌ１０５ represents a hydrogen atom or a substituent, R Ｌ１０３ and R Ｌ１０４ may be bonded to form a ring, X １０１ ~X １０３ are each independently a nitrogen atom or —CR Ｘ１０１ represents -, and R Ｘ１０１ represents a hydrogen atom or a substituent; １０２ and L １０３ are each independently a sulfur atom or —X １０４ =X １０５ represents -, and X １０４ and X １０５ are each independently a nitrogen atom or —CR Ｘ１０２ represents -, and R Ｘ１０２ represents a hydrogen atom or a substituent, １０１ and Ar １０２ are each independently -(CR Ａｒ１０１ =CR Ａｒ１０２ ) ｎ１０１ represents -, an arylene group, a heterocyclic group, or a group formed by combining two or more of these groups; R Ａｒ１０１ and R Ａｒ１０２ each independently represents a hydrogen atom or a substituent, n101 represents an integer of 1 to 3, and Y １０１ and Y １０２ are each independently -OR Ｙ１０１ , -NR Ｙ１０２ R Ｙ１０３ or -SR Ｙ１０４ represents R Ｙ１０１~R Ｙ１０４ each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heteroaryl group; R Ｙ１０２ and R Ｙ１０３ may be bonded to each other via a single bond or a divalent linking group to form a ring, １０１ and X １０１ may be bonded via a single bond or a divalent linking group to form a 5-membered or 6-membered ring, １０１ and Y １０１ may be bonded via a single bond or a divalent linking group to form a 5-membered or 6-membered ring, １０２ and X １０２ may be bonded via a single bond or a divalent linking group to form a 5-membered or 6-membered ring, １０２ and Y １０２ may be bonded via a single bond or a divalent linking group to form a 5- or 6-membered ring.

[0064] An example of a cation having a dye structure is a cation represented by formula (C5-1). In formula (C5-1), R ５１ Ha-OR ５０１ , -NR ５０２ R ５０３ or -SR ５０４ represents R ５０１ ~R ５０４ each independently represents an alkyl group; ５１ and Het ５２ each independently represents a heterocyclic group; ５２ and R ５３ each independently represents a hydrogen atom or a substituent.

[0065] R ５２ and R ５３ Examples of the substituent represented by include the groups exemplified above as the substituent T, and an alkyl group is preferred.

[0066] Specific examples of cations having a dye structure include the cations shown below: In the structural formula shown below, iBu is an isobutyl group.

[0067] (Other Coloring Materials) The resin composition of the present invention may further contain, as a coloring material, a coloring material other than the specific coloring material described above (hereinafter, also referred to as other coloring materials).

[0068] Examples of the other coloring materials include white coloring materials, black coloring materials, chromatic coloring materials, and infrared absorbing coloring materials. The other coloring materials may be pigments or dyes. Pigments and dyes may be used in combination. The pigments may be either inorganic or organic pigments, but organic pigments are preferred from the viewpoints of a wide range of color variations, ease of dispersion, safety, and the like.

[0069] The average primary particle diameter of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. In this specification, the primary particle diameter of the pigment can be determined from a photograph obtained by observing the primary particles of the pigment with a transmission electron microscope. Specifically, the projected area of ​​the primary particles of the pigment is determined, and the corresponding circle-equivalent diameter is calculated as the primary particle diameter of the pigment. In addition, the average primary particle diameter in the present invention is the arithmetic mean value of the primary particle diameters of 400 primary particles of the pigment. Furthermore, primary particles of the pigment refer to independent particles that are not aggregated.

[0070] The crystallite size of the pigment, determined from the half-width of a peak derived from any crystal plane in an X-ray diffraction spectrum obtained using CuKα radiation as an X-ray source, is preferably 0.1 to 100 nm, more preferably 0.5 to 50 nm, even more preferably 1 to 30 nm, and particularly preferably 5 to 25 nm.

[0071] The specific surface area of ​​the pigment is 1 to 300 m ２ / g. The lower limit is 10 m ２ / g or more, and ２ / g or more is more preferable. ２ / g or less, and ２The value of the specific surface area can be determined according to the BET (Brunauer, Emmett and Teller) method in accordance with DIN 66131: Determination of the specific surface area of ​​solids by gas adsorption.

[0072] Chromatic coloring materials include coloring materials having a maximum absorption wavelength in the wavelength range of 400 to 700 nm, such as green coloring materials, red coloring materials, yellow coloring materials, purple coloring materials, blue coloring materials, and orange coloring materials.

[0073] Examples of the red colorant include a diketopyrrolopyrrole compound, an anthraquinone compound, an azo compound, a naphthol compound, an azomethine compound, a xanthene compound, a quinacridone compound, a perylene compound, and a thioindigo compound, and the like, preferably a diketopyrrolopyrrole compound, an anthraquinone compound, or an azo compound, and more preferably a diketopyrrolopyrrole compound. The red colorant is preferably a pigment (red pigment), and more preferably a diketopyrrolopyrrole pigment.

[0074] Specific examples of red colorants include C.I. (Color Index) Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, Examples of red pigments include 150,155,166,168,169,170,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246,254,255,264,269,270,272,279,291,294,295,296,297. In addition, as a red colorant, a compound described in paragraph number 0034 of WO 2022 / 085485, or a brominated diketopyrrolopyrrole compound described in JP-A-2020-085947 can also be used.

[0075] As the red colorant, C.I. Pigment Red 122, 177, 224, 254, 255, 264, 269, 272, and 291 are preferred, C.I. Pigment Red 254, 264, and 272 are more preferred, and C.I. Pigment Red 254 and 264 are even more preferred.

[0076] Examples of the green colorant include phthalocyanine compounds and squarylium compounds, and the phthalocyanine compounds are preferred. The green colorant is preferably a pigment (green pigment), and more preferably a phthalocyanine pigment.

[0077] Specific examples of green colorants include green pigments such as C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, and 66. Furthermore, halogenated zinc phthalocyanine pigments having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms per molecule can also be used as green colorants. Specific examples include the compounds described in WO 2015 / 118720. Furthermore, compounds described in paragraph 0029 of WO 2022 / 085485, aluminum phthalocyanine compounds described in JP-A 2020-070426, and diarylmethane compounds described in JP-A 2020-504758 can also be used as green colorants.

[0078] As the green colorant, C.I. Pigment Green 7, 36, 58, 62, and 63 are preferred.

[0079] Examples of orange colorants include diketopyrrolopyrrole compounds and azo compounds. The orange colorant is preferably a pigment (orange pigment). Specific examples of orange colorants include orange pigments such as C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, and 73.

[0080] Examples of the yellow colorant include an azo compound, an azomethine compound, an isoindoline compound, a pteridine compound, a quinophthalone compound, and a perylene compound. The yellow colorant is preferably a pigment (yellow pigment). Specific examples of the yellow colorant include C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125 , 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236 and the like.

[0081] As the yellow coloring material, an azobarbituric acid nickel complex having the following structure can also be used.

[0082] As the yellow colorant, the compounds described in paragraphs 0031 to 0033 of WO 2022 / 085485, the methine dyes described in JP-A 2019-073695, and the methine dyes described in JP-A 2019-073696 can be used.

[0083] Examples of the purple colorant include an oxazine compound, a quinacridone compound, a perylene compound, and an indigo compound, and the oxazine compound is preferred. The purple colorant is preferably a pigment (purple pigment). Specific examples of the purple colorant include purple pigments such as C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, and 61.

[0084] Examples of blue colorants include phthalocyanine compounds and squarylium compounds, with phthalocyanine compounds being preferred. The blue colorant is preferably a pigment (blue pigment). Specific examples of blue colorants include blue pigments such as C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, and 88. Furthermore, aluminum phthalocyanine compounds having phosphorus atoms can also be used as blue colorants. Specific examples include the compounds described in paragraphs 0022 to 0030 of JP-A No. 2012-247591 and paragraph 0047 of JP-A No. 2011-157478.

[0085] Dyes can also be used as chromatic colorants. There are no particular limitations on the dyes, and known dyes can be used. Examples include pyrazole azo dyes, anilino azo dyes, triarylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylidene dyes, oxonol dyes, pyrazolotriazole azo dyes, pyridone azo dyes, cyanine dyes, phenothiazine dyes, pyrrolopyrazole azomethine dyes, xanthene dyes, phthalocyanine dyes, benzopyran dyes, indigo dyes, and pyrromethene dyes.

[0086] A dye polymer can also be used as a chromatic colorant. The dye polymer is preferably a dye dissolved in a solvent when used. The dye polymer may also form particles. When the dye polymer is particulate, it is typically used in a dispersed state in a solvent. A particulate dye polymer can be obtained, for example, by emulsion polymerization, and specific examples of the compounds and production methods described in JP-A 2015-214682 include those described in JP-A 2015-214682. The dye polymer has two or more dye structures in one molecule, preferably three or more dye structures. The upper limit is not particularly limited, but can be 100 or less. The multiple dye structures in one molecule may be the same dye structure or different dye structures. The weight-average molecular weight (Mw) of the dye polymer is preferably 2,000 to 50,000. The lower limit is more preferably 3,000 or more, and even more preferably 6,000 or more. The upper limit is more preferably 30,000 or less, and even more preferably 20,000 or less. As the dye multimer, compounds described in JP-A-2011-213925, JP-A-2013-041097, JP-A-2015-028144, JP-A-2015-030742, WO 2016 / 031442, etc. can also be used.

[0087] As chromatic colorants, triarylmethane dye polymers described in Korean Patent Publication No. 10-2020-0028160, xanthene compounds described in JP 2020-117638 A, phthalocyanine compounds described in WO 2020 / 174991 A, isoindoline compounds described in JP 2020-160279 A or salts thereof, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069442 A, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069730 A, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069070 A Compounds represented by the formula 1 described in Korean Patent Publication No. 10-2020-0069067, compounds represented by the formula 1 described in Korean Patent Publication No. 10-2020-0069062, halogenated zinc phthalocyanine pigments described in Japanese Patent No. 6809649, isoindoline compounds described in JP-A-2020-180176, phenothiazine compounds described in JP-A-2021-187913, halogenated zinc phthalocyanines described in WO 2022 / 004261, and halogenated zinc phthalocyanines described in WO 2021 / 250883 can be used. The chromatic colorant may be a rotaxane, and the dye skeleton may be used in the cyclic structure of the rotaxane, in the rod-shaped structure, or in both structures. As chromatic colorants, quinophthalone compounds represented by formula 1 in Korean Patent Publication No. 10-2020-0030759, polymer dyes described in Korean Patent Publication No. 10-2020-0061793, chromatic colorants described in JP-A-2022-029701, isoindoline compounds described in WO 2022 / 014635, aluminum phthalocyanine compounds described in WO 2022 / 024926, and JP-A-2022-045 Compounds described in Patent Publication No. 895, compounds described in WO 2022 / 050051, compounds described in JP 2020-090676, compounds described in JP 2020-055956, compounds described in JP 2021-031681, compounds described in JP 2022-056354, compounds described in US Patent Application Publication No. 2021 / 0355327, compounds described in WO 2022 / 065357,Compounds described in JP 2020-045436 A, compounds described in Korean Patent Publication No. 10-2021-0146726 A, compounds described in JP 2018-178039 A, compounds described in Chinese Patent Application Publication No. 113881244 A, compounds described in Chinese Patent Application Publication No. 113881245 A, compounds described in Chinese Patent Application Publication No. 113881246 A, compounds described in JP 2022-104822 A, compounds described in JP 2022-096701 A, compounds described in JP 2020- Compounds described in JP-A-023652, green pigments described on pages 80 to 84 of the Journal of the Color Materials Association (published in 2022), compounds described in JP-A-2022-143135, compounds described in JP-A-2022-140287, compounds described in WO 2022 / 136308, perylene compounds described in Chinese Patent Application Publication No. 113061349, cyan pigments described in Korean Patent Publication No. 10-2017-0018993, isoindoline compounds described in JP-A-2020-180176, Compounds described in JP-A-3-013209, compounds described in JP-A-2023-013166, xanthene compounds described in WO 2023 / 286526, compounds described in JP-A-2021-155746, compounds described in JP-A-2021-155747, compounds described in JP-A-2021-155748, compounds described in JP-A-2021-155749, compounds described in WO 2018 / 051876, compounds described in JP-A-2020-083981, JP-A-2023-05 Compounds described in JP-A-6463, compounds described in JP-T-2023-515473, dioxane compounds described in JP-T-2022-549530, pigment preparations described in JP-A-2022-061494, diketopyrrolopyrrole pigments described in JP-A-2023-057917, diketopyrrolopyrrole compounds described in JP-A-2023-061273, phthalocyanines described in JP-T-2023-519314, and quinophthalones described in JP-A-2023-080419 can also be used.

[0088] Two or more chromatic colorants may be used in combination. When two or more chromatic colorants are used in combination, the combination of the two or more chromatic colorants may form a black color. Examples of such combinations include the following embodiments (1) to (7). When the resin composition contains two or more chromatic colorants and exhibits a black color through the combination of the two or more chromatic colorants, the resin composition of the present invention can be preferably used as a resin composition for forming an infrared transmission filter. (1) An embodiment containing a red colorant and a blue colorant. (2) An embodiment containing a red colorant, a blue colorant, and a yellow colorant. (3) An embodiment containing a red colorant, a blue colorant, a yellow colorant, and a purple colorant. (4) An embodiment containing a red colorant, a blue colorant, a yellow colorant, a purple colorant, and a green colorant. (5) An embodiment containing a red colorant, a blue colorant, a yellow colorant, and a green colorant. (6) An embodiment containing a red colorant, a blue colorant, and a green colorant. (7) An embodiment containing a yellow coloring material and a purple coloring material.

[0089] White Colorant Examples of white colorants include inorganic pigments such as titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, and zinc sulfide. The white colorant may be any of the white pigments described in paragraphs 0040 to 0043 of WO 2022 / 085485.

[0090] -Black Colorant- The black colorant is not particularly limited, and known materials can be used. The black colorant may be an inorganic black colorant or an organic black colorant. The black colorant is preferably a pigment. In this specification, the black colorant refers to a colorant that exhibits absorption over the entire wavelength range of 400 to 700 nm.

[0091] Examples of inorganic black colorants include carbon black, titanium black, graphite, etc., with carbon black and titanium black being preferred, and titanium black being more preferred. Titanium black is a black particle containing titanium atoms, and low-order titanium oxide or titanium oxynitride is preferred. As the titanium black, the titanium black described in paragraph 0044 of WO 2022 / 085485 can be used. As the inorganic black colorant, zirconium nitride powder described in JP 2023-048173 A can also be used.

[0092] Examples of organic black colorants include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds, with bisbenzofuranone compounds and perylene compounds being preferred. The organic black colorant may be a compound described in paragraph 0166 of International Publication No. 2022 / 065215. Furthermore, examples of organic black colorants include perylene black (such as Lumogen Black FK4280) described in paragraphs 0016 to 0020 of JP-A-2017-226821 and black azo pigments described in JP-A-2022-121935.

[0093] The black coloring material may be any of those described in pages 294 to 307 of the Journal of the Color Materials Association, Vol. 96, No. 9, 2023.

[0094] -Infrared absorbing colorant- The infrared absorbing colorant is preferably a compound having a maximum absorption wavelength longer than 700 nm. The infrared absorbing colorant is preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1800 nm, more preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1400 nm, even more preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1200 nm, and particularly preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1000 nm. In addition, the absorbance A of the infrared absorbing colorant at a wavelength of 500 nm １ and absorbance A at the maximum absorption wavelength ２ Ratio A １ / A ２is preferably 0.08 or less, and more preferably 0.04 or less. The infrared absorbing colorant is preferably a pigment, and more preferably an organic pigment.

[0095] Examples of infrared absorbing colorants include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiolene metal complexes, metal oxides, metal borides, etc. Specific examples of these include the compounds described in paragraph 0114 of WO 2022 / 065215.Examples of infrared absorbing colorants include the compounds described in paragraph 0121 of WO 2022 / 065215, squarylium compounds described in JP 2020-075959 A, copper complexes described in Korean Patent Publication No. 10-2019-0135217, croconic acid compounds described in JP 2021-195515 A, infrared absorbing dyes described in JP 2022-022070 A, croconium compounds described in WO 2019 / 021767, compounds described in JP 2019-127549 A, compounds described in WO 2022 / 059619, and compounds described in JP Compounds described in JP-A-2022-151682, squarylium compounds described in JP-A-2022-188858, compounds described in JP-A-2022-184710, compounds described in JP-A-2022-189736, squarylium compounds described in JP-A-2023-004570, squarylium compounds described in WO 2019 / 230660, squarylium compounds described in WO 2020 / Compounds described in JP-A-2023-068643, diiminium compounds described in JP-A-2023-068643, squarylium compounds described in JP-A-2023-052770, phthalocyanine compounds described in Korean Patent Publication No. 10-2022-0163680, indigo monoboron complexes described in JP-A-2023-073064, phthalocyanine compounds described in JP-A-2023-066025 It is also possible to use the following compounds: phthalocyanine compounds described in JP 2020-041127 A; indigo compounds described in JP 2023-073064 A; indigo compounds described in Korean Patent Publication No. 10-2023-0016355 A; squarylium compounds described in WO 2019 / 230570 A; and diiminium compounds described in JP 2023-095824 A.

[0096] The content of the colorant in the total solid content of the resin composition is preferably 1 to 70% by mass, with the upper limit being preferably 65% ​​by mass or less, and more preferably 60% by mass or less, and the lower limit being preferably 2% by mass or more, and more preferably 3% by mass or more.

[0097] The content of the specific colorant in the total solid content of the resin composition is preferably 1 to 50% by mass, with the upper limit being preferably 40% by mass or less, and more preferably 35% by mass or less, and the lower limit being preferably 2% by mass or more, and more preferably 3% by mass or more.

[0098] The content of the specific colorant in the colorant contained in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 15% by mass or more, with the upper limit being 100% by mass or less, 80% by mass or less, or 60% by mass or less.

[0099] The resin composition of the present invention may contain only one colorant or may contain two or more colorants. When two or more colorants are contained, the total amount thereof is preferably within the above range.

[0100] <<Resin>> The resin composition of the present invention contains a resin. The resin is blended, for example, for the purpose of dispersing pigments and the like in the resin composition or for the purpose of using as a binder. Note that resins used primarily to disperse pigments and the like in the resin composition are also called dispersants. However, these uses of resins are only examples, and resins can also be used for purposes other than these uses.

[0101] The weight average molecular weight (Mw) of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is preferably 4,000 or more, and more preferably 5,000 or more.

[0102] Examples of resins include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, and siloxane resins. Further, examples of the resin include the resins described in paragraphs 0091 to 0099 of WO 2022 / 065215, the blocked polyisocyanate resins described in JP 2016-222891 A, the resins described in JP 2020-122052 A, the resins described in JP 2020-111656 A, the resins described in JP 2020-139021 A, the resins described in JP 2017-138503 A containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain, and the resins described in paragraphs 0199 to 0233 of JP 2020-186373 A. Resins described above, alkali-soluble resins described in JP 2020-186325 A, resins represented by formula 1 described in Korean Patent Publication No. 10-2020-0078339 A, copolymers containing epoxy groups and acid groups described in WO 2022 / 030445 A, resins described in JP 2018-135514 A, copolymers described in JP 2020-041046 A, resins described in JP 2023-033156 A, resins described in JP 2023-030386 A, resins described in JP 2023-027753 A, resins described in JP 2020-139021 A. Resins described in JP 2023-074038 A. Resins described in JP 2023-079666 A can also be used.

[0103] The resin to be used is preferably a resin having an acid group, such as a carboxy group, a phosphate group, a sulfo group, or a phenolic hydroxy group.

[0104] The acid value of the resin having acid groups is preferably 30 to 500 mgKOH / g. The lower limit is preferably 40 mgKOH / g or more, and more preferably 50 mgKOH / g or more. The upper limit is preferably 400 mgKOH / g or less, more preferably 300 mgKOH / g or less, and even more preferably 200 mgKOH / g or less. The weight average molecular weight (Mw) of the resin having acid groups is preferably 5,000 to 100,000, and more preferably 5,000 to 50,000. The number average molecular weight (Mn) of the resin having acid groups is preferably 1,000 to 20,000.

[0105] The resin having an acid group preferably contains a repeating unit having an acid group on a side chain, and more preferably contains 5 to 70 mol% of the repeating units having an acid group on a side chain based on all repeating units of the resin. The upper limit of the content of repeating units having an acid group on a side chain is preferably 50 mol% or less, more preferably 30 mol% or less. The lower limit of the content of repeating units having an acid group on a side chain is preferably 10 mol% or more, more preferably 20 mol% or more.

[0106] For resins having acid groups, please refer to the descriptions in paragraphs

[0558] to

[0571] of JP 2012-208494 A (corresponding to paragraphs

[0685] to

[0700] of U.S. Patent Application Publication No. 2012 / 0235099 A) and paragraphs

[0076] to

[0099] of JP 2012-198408 A, the contents of which are incorporated herein by reference. Alternatively, commercially available resins having acid groups can be used. There are no particular limitations on the method for introducing acid groups into the resin, and examples include the method described in Japanese Patent No. 6,349,629 A. Furthermore, examples of methods for introducing acid groups into the resin include a method in which an acid anhydride is reacted with a hydroxy group generated by a ring-opening reaction of an epoxy group to introduce the acid group.

[0107] The resin composition of the present invention also preferably contains a resin having a basic group. The resin having a basic group is preferably a resin containing a repeating unit having a basic group in a side chain, more preferably a copolymer having a repeating unit having a basic group in a side chain and a repeating unit not containing a basic group, and even more preferably a block copolymer having a repeating unit having a basic group in a side chain and a repeating unit not containing a basic group. The resin having a basic group can also be used as a dispersant. The amine value of the resin having a basic group is preferably 5 to 300 mgKOH / g. The lower limit is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more. The upper limit is preferably 200 mgKOH / g or less, more preferably 100 mgKOH / g or less.

[0108] Commercially available resins having basic groups include DISPERBYK-161, 162, 163, 164, 166, 167, 168, 174, 182, 183, 184, 185, 2000, 2001, 2050, 2150, 2163, 2164, and BYK-LPN6919 (all manufactured by BYK-Chemie), and Solsperse 112. 00, 13240, 13650, 13940, 24000, 26000, 28000, 32000, 32500, 32550, 32600, 33000, 34750, 35100, 35200, 37500, 38500, 39000, 53095, 56000, 7100 (all manufactured by The Lubrizol Group, Japan), Efka PX 4300, 4330, 4046, 4060, 4080 (all manufactured by BASF), and the like. In addition, the resin having a basic group may be the block copolymer (B) described in paragraphs 0063 to 0112 of JP-A-2014-219665, the block copolymer A1 described in paragraphs 0046 to 0076 of JP-A-2018-156021, or the vinyl resin having a basic group described in paragraphs 0150 to 0153 of JP-A-2019-184763, the contents of which are incorporated herein by reference.

[0109] The resin composition of the present invention preferably contains both a resin having an acid group and a resin having a basic group. According to this embodiment, the storage stability of the resin composition can be further improved. When a resin having an acid group and a resin having a basic group are used in combination, the content of the resin having a basic group is preferably 20 to 500 parts by mass, more preferably 30 to 300 parts by mass, and even more preferably 50 to 200 parts by mass per 100 parts by mass of the resin having an acid group.

[0110] It is also preferable to use a resin having an aromatic carboxy group as the resin. In a resin having an aromatic carboxy group, the aromatic carboxy group may be contained in the main chain of the repeating unit or may be contained in a side chain of the repeating unit. It is preferable that the aromatic carboxy group is contained in the main chain of the repeating unit. In this specification, an aromatic carboxy group refers to a group having a structure in which one or more carboxy groups are bonded to an aromatic ring. In the aromatic carboxy group, the number of carboxy groups bonded to the aromatic ring is preferably 1 to 4, and more preferably 1 to 2. Examples of resins having an aromatic carboxy group include the resins described in paragraphs 0082 to 0107 of WO 2021 / 166858.

[0111] It is also preferable to use a resin having a crosslinkable group as the resin. Examples of the crosslinkable group include a (meth)acryloyl group, an epoxy group, and an oxetanyl group. When a resin having a crosslinkable group is used, the content of the resin having a crosslinkable group in the resin contained in the resin composition is preferably 30% by mass or more, more preferably 50% by mass or more, and even more preferably 70% by mass or more.

[0112] The resin composition of the present invention preferably contains a resin as a dispersant. Examples of dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the term "acidic dispersant (acidic resin)" refers to a resin in which the amount of acid groups is greater than the amount of basic groups. As the acidic dispersant (acidic resin), a resin in which the amount of acid groups is 70 mol% or more is preferred, assuming that the total amount of acid groups and basic groups is 100 mol%. The acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxy group. The acid value of the acidic dispersant (acidic resin) is preferably 10 to 105 mgKOH / g. Furthermore, the term "basic dispersant (basic resin)" refers to a resin in which the amount of basic groups is greater than the amount of acid groups. As the basic dispersant (basic resin), a resin in which the amount of basic groups is greater than 50 mol% is preferred, assuming that the total amount of acid groups and basic groups is 100 mol%. The basic group possessed by the basic dispersant is preferably an amino group.

[0113] The resin used as the dispersant is preferably a graft resin. For details of the graft resin, please refer to the description in paragraphs 0025 to 0094 of JP 2012-255128 A, the contents of which are incorporated herein by reference.

[0114] The resin used as the dispersant is preferably a resin having an aromatic carboxy group, such as those mentioned above.

[0115] The resin used as the dispersant is preferably a polyimine-based dispersant containing a nitrogen atom in at least one of the main chain and the side chain. The polyimine-based dispersant is preferably a resin having a main chain with a partial structure containing a functional group with a pKa of 14 or less and a side chain having 40 to 10,000 atoms, and having a basic nitrogen atom in at least one of the main chain and the side chain. There are no particular restrictions on the basic nitrogen atom, as long as it is a nitrogen atom that exhibits basicity. For details about polyimine-based dispersants, please refer to the description in paragraphs 0102 to 0166 of JP 2012-255128 A, the contents of which are incorporated herein by reference.

[0116] The resin used as a dispersant is preferably a resin having a structure in which multiple polymer chains are bonded to a core portion. Examples of such resins include dendrimers (including star-shaped polymers). Specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP-A-2013-043962.

[0117] The resin used as a dispersant is also preferably a resin containing a repeating unit having an ethylenically unsaturated bond-containing group in a side chain. The content of the repeating unit having an ethylenically unsaturated bond-containing group in a side chain is preferably 10 mol % or more, more preferably 10 to 80 mol %, and even more preferably 20 to 70 mol %, of all repeating units of the resin.

[0118] As the dispersant, the resin described in JP 2018-087939 A, the block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077 A, polyethyleneimine having a polyester side chain described in WO 2016 / 104803, block copolymers described in WO 2019 / 125940 A, block polymers having an acrylamide structural unit described in JP 2020-066687 A, block polymers having an acrylamide structural unit described in JP 2020-066688 A, dispersants described in WO 2016 / 104803, and the like can also be used.

[0119] Dispersants are also available as commercially available products, and specific examples thereof include the DISPERBYK series manufactured by BYK Chemie, the SOLSPERSE series manufactured by Lubrizol Japan, the Efka series manufactured by BASF, and the AJISPER series manufactured by Ajinomoto Fine-Techno Co., Ltd. In addition, the products described in paragraph 0129 of JP 2012-137564 A and the products described in paragraph 0235 of JP 2017-194662 A can also be used as dispersants.

[0120] The content of the resin in the total solid content of the resin composition is preferably 1 to 60% by mass. The lower limit is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 20% by mass or more. The upper limit is preferably 50% by mass or less, and more preferably 40% by mass or less. The content of the resin having an acid group in the total solid content of the resin composition is preferably 1 to 60% by mass. The lower limit is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 20% by mass or more. The upper limit is preferably 50% by mass or less, and more preferably 40% by mass or less.

[0121] The content of the resin is preferably 100 to 1000 parts by mass per 100 parts by mass of the polymerizable compound. The lower limit is preferably 150 parts by mass or more, and more preferably 200 parts by mass or more. The upper limit is preferably 600 parts by mass or less, and more preferably 500 parts by mass or less. The resin composition of the present invention may contain only one type of resin, or may contain two or more types. When two or more types of resins are contained, the total amount thereof is preferably within the above range.

[0122] <<Polymerizable Compound>> The resin composition of the present invention preferably contains a polymerizable compound. Examples of the polymerizable compound include a compound having an ethylenically unsaturated bond-containing group. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a (meth)allyl group, and a (meth)acryloyl group. The polymerizable compound is preferably a radically polymerizable compound.

[0123] The polymerizable compound may be in any chemical form, such as a monomer, prepolymer, or oligomer, but is preferably a monomer. The molecular weight of the polymerizable compound is preferably 100 to 2500. The upper limit is preferably 2000 or less, more preferably 1500 or less. The lower limit is preferably 150 or more, more preferably 250 or more.

[0124] The ethylenically unsaturated bond-containing group value (hereinafter referred to as C=C value) of the polymerizable compound is preferably 2 to 14 mmol / g from the viewpoint of storage stability of the resin composition. The lower limit is preferably 3 mmol / g or more, more preferably 4 mmol / g or more, and even more preferably 5 mmol / g or more. The upper limit is preferably 12 mmol / g or less, more preferably 10 mmol / g or less, and even more preferably 8 mmol / g or less. The C=C value of the polymerizable compound is a value calculated by dividing the number of ethylenically unsaturated bond-containing groups contained in one molecule of the polymerizable compound by the molecular weight of the polymerizable compound.

[0125] The polymerizable compound is preferably a compound containing three or more ethylenically unsaturated bond-containing groups, more preferably a compound containing 3 to 15 ethylenically unsaturated bond-containing groups, and even more preferably a compound containing 3 to 6 ethylenically unsaturated bond-containing groups. Furthermore, the polymerizable compound is preferably a trifunctional to 15-functional (meth)acrylate compound, and more preferably a trifunctional to hexafunctional (meth)acrylate compound. Specific examples of the polymerizable compound include the compounds described in paragraphs 0075 to 0083 of WO 2022 / 065215 and the compounds described in Taiwan Patent Application Publication No. 201832008.

[0126] Preferred polymerizable compounds include dipentaerythritol tri(meth)acrylate (commercially available product: KAYARAD D-330, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra(meth)acrylate (commercially available product: KAYARAD D-320, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available product: KAYARAD D-310, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available products: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., and NK Ester A-DPH-12E, manufactured by Shin-Nakamura Chemical Co., Ltd.), and compounds having a structure in which the (meth)acryloyl group is bonded via an ethylene glycol and / or propylene glycol residue (e.g., SR454, SR499, commercially available from Sartomer).Examples of polymerizable compounds include diglycerin EO (ethylene oxide) modified (meth)acrylate (commercially available product: M-460, manufactured by Toagosei Co., Ltd.), pentaerythritol tetraacrylate (NK Ester A-TMMT, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 1,6-hexanediol diacrylate (KAYARAD, manufactured by Nippon Kayaku Co., Ltd.). HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Toagosei Co., Ltd.), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.), 8UH-1 006, 8UH-1012 (all manufactured by Taisei Fine Chemical Co., Ltd.), Light Acrylate POB-A0 (manufactured by Kyoeisha Chemical Co., Ltd.), Aronix MT-3041, 3042 (manufactured by Toagosei Co., Ltd., polymerizable compounds containing amines), Aronix M-510, 520 (manufactured by Toagosei Co., Ltd., polymerizable compounds having an acidic group), Etercure 6361-100 (Eternal Materials, polymerizable compound having a hyperbranched structure), EBECRYL80 (amine-containing tetrafunctional monomer, manufactured by Daicel-Olknes Co., Ltd.), EBECRYL7100 (amine-containing bifunctional monomer, manufactured by Daicel-Olknes Co., Ltd.), CN371NS (amine-containing bifunctional monomer, manufactured by Arkema), HOA-MPL (2-acryloyloxyethyl-phthalic acid: manufactured by Kyoeisha Chemical Co., Ltd.), HOA-MPE (2-acryloyloxyethyl-2-hydroxyethyl-phthalic acid: manufactured by Kyoeisha Chemical Co., Ltd.), polymerizable compounds having a dendrimer structure or hyperbranched structure described in JP-A No. 2023-043479, and polymerizable compounds described in JP-A No. 2023-529984 can also be used.

[0127] The content of the polymerizable compound in the total solid content of the resin composition is preferably 1 to 30% by mass. The upper limit is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less. The lower limit is preferably 3% by mass or more, and more preferably 5% by mass or more. The resin composition of the present invention may contain only one type of polymerizable compound, or may contain two or more types. When two or more types of polymerizable compounds are contained, the total amount thereof is preferably within the above range.

[0128] <<Photopolymerization initiator>> The resin composition of the present invention preferably contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, a compound having photosensitivity to light in the ultraviolet to visible region is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0129] Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyltriazine compound, a benzyl dimethyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a hexaarylbiimidazole compound, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halomethyloxadiazole compound, or a 3-aryl-substituted coumarin compound, more preferably a compound selected from an oxime compound, an α-hydroxyketone compound, an α-aminoketone compound, and an acylphosphine compound, and even more preferably an oxime compound. Further, as the photopolymerization initiator, compounds described in paragraphs 0065 to 0111 of JP-A-2014-130173, compounds described in Japanese Patent No. 6301489, compounds described in MATERIAL STAGE 37 to 60pp, vol. 19, No. 3,peroxide-based photopolymerization initiators described in WO 2019, photopolymerization initiators described in WO 2018 / 221177, photopolymerization initiators described in WO 2018 / 110179, photopolymerization initiators described in JP 2019-043864 A, photopolymerization initiators described in JP 2019-044030 A, peroxide-based initiators described in JP 2019-167313 A, aminoacetophenone-based initiators having an oxazolidine group described in JP 2020-055992 A, oxime-based photopolymerization initiators described in JP-A-2020-172619, polymers described in JP-A-2020-172619, compounds represented by formula 1 described in WO 2020 / 152120, compounds described in JP-A-2021-181406, photopolymerization initiators described in JP-A-2022-013379, compounds represented by formula (1) described in JP-A-2022-015747, fluorine-containing fluorene oxime ester-based photoinitiators described in JP-T-2021-507058, and those described in Chinese Patent Application Publication No. 110764367. Initiators described in JP-A-2022-518535, initiators described in WO 2021 / 175855, compounds described in Taiwan Patent Application Publication No. 202200534, compounds described in JP-A-2022-078550, compounds described in Korean Patent Publication No. 10-2017-0087330, compounds described in WO 2022 / 075452, oxime ester compounds described in Chinese Patent Application Publication No. 110066225, Korean Patent Publication No. 10-2022-0076157 Compounds described in WO 2019 / 013112, compounds having a triarylamine or N-arylcarbazole skeleton described in paragraphs 0042 to 0062, oxime ester photopolymerization initiators described in Japanese Patent No. 7219378, photopolymerization initiators described in Korean Patent Publication No. 10-2021-0146174, photopolymerization initiators described in WO 2019 / 013112, photopolymerization initiators described in JP 2023-033731, initiators described in JP 2022-515524, initiators described in JP 2023-517304, initiators described in Chinese Patent Publication No. 114149517, and the like.

[0130] Specific examples of hexaarylbiimidazole compounds include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-biimidazole.

[0131] Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.), and Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (all manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, Irgacure 379EG (all manufactured by BASF), etc. Commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (all manufactured by IGM Resins B.V.), Irgacure 819, Irgacure TPO (all manufactured by BASF), etc.

[0132] Examples of the oxime compound include the compounds described in paragraph 0142 of WO 2022 / 085485, the compounds described in Japanese Patent No. 5430746, the compounds described in Japanese Patent No. 5647738, the compounds represented by the general formula (1) of JP-A-2021-173858, and the compounds described in paragraphs 0022 to 0024, and the compounds represented by the general formula (1) of JP-A-2021-170089 and the compounds described in paragraphs 0117 to 0120. Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime), etc. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04, Irgacure OXE05, Irgacure OXE06, Irgacure OXE07, Irgacure OXE08, Irgacure OXE09, Irgacure OXE10, Irgacure OXE11, Irgacure OXE12, Irgacure OXE13, Irgacure OXE14, Irgacure OXE15, Irgacure OXE16, Irgacure OXE17, Irgacure OXE18, Irgacure OXE19, Irgacure OXE20, Irgacure OXE21, Irgacure OXE22, Irgacure OXE23, Irgacure OXE24, Irgacure OXE25, Irgacure OXE26, Irgacure OXE27, Irgacure OXE28, Irgacure OX OXE04 (all manufactured by BASF), TR-PBG-301, TR-PBG-304, TR-PBG-305, TR-PBG-309, TR-PBG-3054, TR-PBG-3057, TR-PBG-314, TR-PBG-327, TR-PBG-345, TR-PBG-346, TR- Examples of the oxime compound include PBG-358, TR-PBG-365, TR-PBG-380, TR-PBG-610, TR-PBG-A, and TR-PBG-B (all manufactured by TRONLY Corporation), and ADEKA OPTOMER N-1919 (manufactured by ADEKA Corporation; photopolymerization initiator 2 described in JP 2012-014052 A). In addition, it is also preferable to use, as the oxime compound, a compound that is not colorable or a compound that is highly transparent and does not easily discolor. Commercially available products include ADEKA ARCLES NCI-730, NCI-831, NCI-831E, and NCI-930 (all manufactured by ADEKA Corporation).

[0133] As the photopolymerization initiator, an oxime compound having a fluorene ring, an oxime compound having a skeleton in which at least one benzene ring of a carbazole ring is replaced with a naphthalene ring, an oxime compound having a fluorine atom, an oxime compound having a nitro group, an oxime compound having a benzofuran skeleton, an oxime compound in which a substituent having a hydroxy group is bonded to a carbazole skeleton, or a compound described in paragraphs 0143 to 0149 of WO 2022 / 085485 can also be used.

[0134] As the photopolymerization initiator, a compound represented by formula (OX-1) can also be used.

[0135] In formula (OX-1), X １ａ represents a divalent linking group containing at least one ring selected from the group consisting of an aromatic ring and a heterocyclic ring; １ａ represents a hydrogen atom or an acyl group; R ２ａ represents an alkyl group or an aryl group; R ３ａ and R ４ａ each independently represents a hydrogen atom or an alkyl group; Alk １ and Alk ２ each independently represents an alkyl group; R ３ａ and R ４ａ may be bonded to form a ring, Alk １ and Alk ２ may be bonded to form a ring, and n represents 0 or 1.

[0136] X in formula (OX-1) １ａ Examples of the divalent linking group represented by include a divalent aromatic ring group, a divalent heterocyclic group, a divalent group in which two or more aromatic rings are bonded via a single bond or a linking group, a divalent group in which two or more heterocycles are bonded via a single bond or a linking group, and a divalent group in which an aromatic ring and a heterocycle are bonded via a single bond or a linking group. Examples of the linking group that bonds the above-mentioned aromatic rings, heterocyclic groups, or aromatic rings and heterocycles include -CH ２ -, -O-, -CO-, -S-, -NR ｘ - and groups combining these. ｘrepresents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group.

[0137] X in formula (OX-1) １ａ is preferably a group represented by any one of formulas (X-1) to (X-13), more preferably a group represented by formula (X-1), formula (X-2), formula (X-4), formula (X-6) or formula (X-8), and further preferably a group represented by formula (X-2) or formula (X-6). In the formula R Ｘ１ ~R Ｘ９ each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group, and * represents a bond.

[0138] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0139] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkenyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0140] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkynyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0141] R Ｘ１ ~R Ｘ９The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0142] R Ｘ１ ~R Ｘ９ The heterocyclic group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heterocyclic group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0143] R in formula (OX-1) １ａ represents a hydrogen atom or an acyl group, and is preferably an acyl group. １ａ The acyl group represented by is —C(O)—R １０１ It is preferable that R １０１ represents an aryl group or a heterocyclic group, and is preferably an aryl group.

[0144] R １０１ The number of carbon atoms in the aryl group represented by R is preferably 6 to 20, and more preferably 6 to 12. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. １０１ The aryl group represented by is preferably a phenyl group, a methylphenyl group or a naphthyl group, more preferably a methylphenyl group or a naphthyl group.

[0145] R １０１ The heterocyclic group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heterocyclic group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0146] R in formula (OX-1)２ａ represents an alkyl group or an aryl group, and is preferably an alkyl group because the reactivity of the generated radical is high. ２ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ２ａ The alkyl group represented by R is preferably an unsubstituted linear or branched alkyl group, and more preferably an unsubstituted linear alkyl group. ２ａ The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent, but is preferably an unsubstituted aryl group.

[0147] R in formula (OX-1) ３ａ and R ４ａ R each independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom. ３ａ and R ４ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ３ａ and R ４ａ may be bonded to form a ring. The ring formed is preferably a 5- or 6-membered ring, and more preferably a 5- or 6-membered aliphatic hydrocarbon ring.

[0148] Alk of formula (OX-1) １ and Alk ２each independently represents an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. Alk １ and Alk ２ may be bonded to form a ring, and preferably form a ring. The ring formed is preferably a 5- or 6-membered ring, more preferably a 5- or 6-membered aliphatic hydrocarbon ring, and more preferably a cyclopentane ring or a cyclohexane ring.

[0149] In formula (OX-1), n ​​represents 0 or 1, and is preferably 0.

[0150] Specific examples of the compound represented by formula (OX-1) include the compounds described in paragraphs 0092 to 0096 of JP-A No. 2012-113104 and the compound described in paragraph 0041 of JP-A No. 2012-189997.

[0151] As the photopolymerization initiator, a compound represented by formula (OX-2) can also be used.

[0152] In formula (OX-2), R １ｂ and R ２ｂ each independently represents a substituent, R ３ｂ ~R ７ｂ each independently represents a hydrogen atom or a substituent, Ar １ｂ represents an aromatic ring group or a heterocyclic group which may have a substituent; n represents 0 or 1;

[0153] R １ｂ and R ２ｂExamples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heterocyclic group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0154] R ３ｂ ~R ７ｂ Examples of the substituent represented by R include a halogen atom, an alkyl group, and an aryl group. Examples of the alkyl group and the aryl group include those described above. ３ｂ ~R ７ｂ is preferably a hydrogen atom.

[0155] Ar １ｂ represents an aromatic ring group or a heterocyclic group which may have a substituent, Ar １ｂ is preferably an aromatic ring group which may have a substituent. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group. Examples of the substituent include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an alkylthio group, an arylthio group, a nitro group, and an acyl group, and an acyl group is preferred. Examples of the acyl group include the acyl groups described above.

[0156] As the photopolymerization initiator, a compound represented by formula (OX-3) can also be used.

[0157] In formula (OX-3), Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group; Ar ２ｃ represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group; R １ｃ ~R ３ｃeach independently represents a substituent; １ｃ is a single bond or CR １１ｃ R １２ｃ represents R １１ｃ and R １２ｃ each independently represents a hydrogen atom, an alkyl group, or an aryl group; １ｃ Ha-CH ２ represents --, --O-- or --S--; k represents 0 or 1; m represents an integer of 0 to 4; and n represents 0 or 1.

[0158] R １ｃ and R ２ｃ Examples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heterocyclic group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. R ２ｃ is preferably an alkyl group having a branched or cyclic structure.

[0159] R ３ｃ Examples of the substituent represented by include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, and an acyl group, and an acyl group is preferred. Examples of the acyl group include the acyl groups described above.

[0160] L １ｃ is a single bond or CR １１ｃ R １２ｃ represents R １１ｃ and R １２ｃ R each independently represents a hydrogen atom, an alkyl group, or an aryl group. １１ｃ and R １２ｃ The alkyl group and aryl group in R １ｃ and R ２ｃWhen k is 1, L １ｃ is preferably a single bond.

[0161] X １ｃ is -CH ２ It represents -, -O- or -S-, and is preferably -O- or -S-.

[0162] Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group, and is preferably a (k+m+1)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0163] Ar ２ｃ represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group, and is preferably a (k+2)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0164] k represents 0 or 1, and is preferably 0. m represents an integer of 0 to 4, and is preferably 0 or 1, and more preferably 1. n represents 0 or 1, and is preferably 0.

[0165] Specific examples of oxime compounds that can be preferably used in the present invention are shown below, but the present invention is not limited to these.

[0166]

[0167]

[0168]

[0169]

[0170] The oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm. Furthermore, from the viewpoint of sensitivity, the molar absorption coefficient of the oxime compound at a wavelength of 365 nm or 405 nm is preferably high, more preferably 1,000 to 300,000, even more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured using a known method. For example, it is preferable to measure using a spectrophotometer (Varian Cary-5 spectrophotometer) at a concentration of 0.01 g / L using ethyl acetate as a solvent.

[0171] As the photopolymerization initiator, it is also preferable to use a combination of Irgacure OXE01 (manufactured by BASF) and / or Irgacure OXE02 (manufactured by BASF) and Omnirad 2959 (manufactured by IGM Resins B.V.).

[0172] As the photopolymerization initiator, a bifunctional or trifunctional or higher functional photoradical polymerization initiator may be used. By using such a photoradical polymerization initiator, two or more radicals are generated from one molecule of the photoradical polymerization initiator, thereby obtaining good sensitivity. Furthermore, when a compound with an asymmetric structure is used, crystallinity is reduced and solubility in solvents is improved, making it less likely to precipitate over time, thereby improving the storage stability of the resin composition. Specific examples of bifunctional or trifunctional or higher functional photoradical polymerization initiators include the compounds described in paragraph 0148 of WO 2022 / 065215.

[0173] The content of the photopolymerization initiator in the total solid content of the resin composition is preferably 0.1 to 20% by mass. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 1.5% by mass or more. The upper limit is preferably 15% by mass or less, more preferably 10% by mass or less. In the resin composition of the present invention, only one type of photopolymerization initiator may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount thereof be within the above range.

[0174] <<Solvent>> The resin composition of the present invention preferably contains a solvent. Examples of the solvent include organic solvents. The type of solvent is basically not particularly limited as long as the solubility of each component and the coatability of the composition are satisfied. Examples of organic solvents include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. For details of these, please refer to paragraph 0223 of WO 2015 / 166779, the contents of which are incorporated herein by reference. Furthermore, ester-based solvents substituted with a cyclic alkyl group and ketone-based solvents substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether ... Examples of suitable ethylene glycol monomethyl ether acetate include 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, gamma butyrolactone, sulfolane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, and isopropyl alcohol.However, it may be preferable to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents for environmental reasons (for example, the amount may be 50 ppm by mass (parts per million) or less, 10 ppm by mass or less, or 1 ppm by mass or less, relative to the total amount of organic solvents).

[0175] The metal content of the organic solvent is preferably low. The metal content of the organic solvent is preferably, for example, 10 parts per billion (ppb) by mass or less. If necessary, an organic solvent having a metal content of ppt (parts per trillion) by mass may be used, and such an organic solvent is provided, for example, by Toyo Gosei Co., Ltd. (The Chemical Daily, November 13, 2015).

[0176] Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene, or nylon.

[0177] The organic solvent may contain isomers (compounds having the same number of atoms but different structures). The organic solvent may contain only one type of isomer or multiple types of isomers.

[0178] The organic solvent preferably has a peroxide content of 0.8 mmol / L or less, and more preferably contains substantially no peroxide.

[0179] The content of the solvent in the resin composition is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and even more preferably 30 to 90% by mass.

[0180] From the viewpoint of environmental regulations, the resin composition of the present invention preferably does not substantially contain environmentally restricted substances. In the present invention, "substantially does not contain environmentally restricted substances" means that the content of environmentally restricted substances in the resin composition is 50 ppm by mass or less, preferably 30 ppm by mass or less, more preferably 10 ppm by mass or less, and particularly preferably 1 ppm by mass or less. Examples of environmentally restricted substances include benzene; alkylbenzenes such as toluene and xylene; and halogenated benzenes such as chlorobenzene. These substances are registered as environmentally restricted substances under the REACH (Registration Evaluation Authorization and Restriction of Chemicals) regulations, the PRTR (Pollutant Release and Transfer Register) Act, the VOC (Volatile Organic Compounds) regulations, etc., and their usage amounts and handling methods are strictly regulated. These compounds may be used as solvents when producing components used in resin compositions, and may be mixed into the resin composition as residual solvents. From the viewpoints of human safety and environmental considerations, it is preferable to reduce these substances as much as possible. One method for reducing environmentally restricted substances is to heat or reduce the pressure in the system to a temperature above the boiling point of the environmentally restricted substance, thereby distilling off the environmentally restricted substance from the system. Furthermore, when distilling off a small amount of environmentally regulated substances, it is useful to perform azeotropy with a solvent having a boiling point equivalent to that of the solvent in question in order to increase efficiency. Furthermore, when a radically polymerizable compound is contained, a polymerization inhibitor or the like may be added prior to distillation under reduced pressure to prevent intermolecular crosslinking due to the progress of a radical polymerization reaction during distillation under reduced pressure. These distillation methods can be used at any stage, such as the stage of raw materials, the stage of a product obtained by reacting the raw materials (e.g., a resin solution or a polyfunctional monomer solution after polymerization), or the stage of a resin composition prepared by mixing these compounds.

[0181] <<Pigment Derivative>> The resin composition of the present invention can contain a pigment derivative. The pigment derivative is used as a dispersing aid. A dispersing aid is a material that enhances the dispersibility of a colorant such as a pigment in a resin composition. Examples of the pigment derivative include compounds having at least one structure selected from the group consisting of a dye structure and a triazine structure, and an acid group or a basic group.

[0182] Examples of the dye structure include a quinoline dye structure, a benzimidazolone dye structure, a benzisoindole dye structure, a benzothiazole dye structure, an iminium dye structure, a squarylium dye structure, a croconium dye structure, an oxonol dye structure, a pyrrolopyrrole dye structure, a diketopyrrolopyrrole dye structure, an azo dye structure, an azomethine dye structure, a phthalocyanine dye structure, a naphthalocyanine dye structure, an anthraquinone dye structure, a quinacridone dye structure, a dioxazine dye structure, a perinone dye structure, a perylene dye structure, a thiazineindigo dye structure, a thioindigo dye structure, an isoindoline dye structure, an isoindolinone dye structure, a quinophthalone dye structure, a dithiol dye structure, a triarylmethane dye structure, and a pyrromethene dye structure.

[0183] Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, a boronic acid group, a carboxylic acid amide group, a sulfonamide group, an imidic acid group, and salts thereof. Examples of the atom or atomic group constituting the salt include an alkali metal ion (Li ＋ , Na ＋ , K. ＋ etc.), alkaline earth metal ions (Ca ２＋ , Mg ２＋ Examples of the carboxylic acid amide group include -NHCOR, ... Ｘ１ As the sulfonamide group, a group represented by -NHSO is preferred. ２ R Ｘ２ As the imide acid group, a group represented by -SO ２ NHSO ２ R Ｘ３ , -CONHSO ２ R Ｘ４, -CONHCOR Ｘ５ or -SO ２ NHCOR Ｘ６ A group represented by the formula: ２ NHSO ２ R Ｘ３ is more preferred. Ｘ１ ~R Ｘ６ R each independently represents an alkyl group or an aryl group. Ｘ１ ~R Ｘ６ The alkyl group and aryl group represented by may have a substituent. The substituent is preferably a halogen atom, more preferably a fluorine atom.

[0184] Examples of basic groups include amino groups, pyridinyl groups and their salts, ammonium salts, and phthalimidomethyl groups. Examples of atoms or atomic groups that constitute salts include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

[0185] Specific examples of pigment derivatives include compounds described in paragraphs 0037 to 0054 of WO 2016 / 035695, compounds described in paragraphs 0061 to 0086 of WO 2017 / 146092, compounds described in paragraphs 0017 to 0068 of WO 2018 / 230387, compounds described in paragraphs 0085 to 0099 of WO 2020 / 054718, compounds described in paragraph 0099 of WO 2020 / 054718, compounds described in paragraph 0124 of WO 2022 / 085485, benzimidazolone compounds or salts thereof described in JP-A-2018-168244, and compounds having an isoindoline skeleton described in the general formula (1) of Japanese Patent No. 6996282.

[0186] The content of the pigment derivative is preferably 1 to 50 parts by mass relative to 100 parts by mass of the pigment. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less. The resin composition may contain only one type of pigment derivative, or may contain two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

[0187] <<Polyalkyleneimine>> The resin composition of the present invention can also contain a polyalkyleneimine. The polyalkyleneimine is used, for example, as a dispersing aid for pigments. The polyalkyleneimine is a polymer obtained by ring-opening polymerization of an alkyleneimine. The polyalkyleneimine is preferably a polymer having a branched structure containing a primary amino group, a secondary amino group, and a tertiary amino group. The alkyleneimine preferably has 2 to 6 carbon atoms, more preferably 2 to 4 carbon atoms, even more preferably 2 or 3 carbon atoms, and particularly preferably 2 carbon atoms.

[0188] The molecular weight of the polyalkyleneimine is preferably 200 or more, more preferably 250 or more. The upper limit is preferably 100,000 or less, more preferably 50,000 or less, even more preferably 10,000 or less, and particularly preferably 2,000 or less. Regarding the molecular weight value of the polyalkyleneimine, if the molecular weight can be calculated from the structural formula, the molecular weight of the polyalkyleneimine is the value calculated from the structural formula. On the other hand, if the molecular weight of the specific amine compound cannot be calculated from the structural formula or calculation is difficult, the number average molecular weight value measured by the boiling point elevation method is used. If the number average molecular weight cannot be measured by the boiling point elevation method or is difficult to measure, the number average molecular weight value measured by the viscosity method is used. If the number average molecular weight cannot be measured by the viscosity method or is difficult to measure, the number average molecular weight value measured in terms of polystyrene by GPC (gel permeation chromatography) is used.

[0189] The amine value of the polyalkyleneimine is preferably 5 mmol / g or more, more preferably 10 mmol / g or more, and even more preferably 15 mmol / g or more.

[0190] Specific examples of alkyleneimines include ethyleneimine, propyleneimine, 1,2-butyleneimine, and 2,3-butyleneimine, with ethyleneimine or propyleneimine being preferred, and ethyleneimine being more preferred. It is particularly preferred that the polyalkyleneimine be polyethyleneimine. Furthermore, the polyethyleneimine preferably contains primary amino groups in an amount of 10 mol% or more, more preferably 20 mol% or more, and even more preferably 30 mol% or more, based on the total of primary amino groups, secondary amino groups, and tertiary amino groups. Commercially available polyethyleneimines include Epomin SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (all manufactured by Nippon Shokubai Co., Ltd.).

[0191] The content of polyalkyleneimine in the total solid content of the resin composition is preferably 0.1 to 5% by mass. The lower limit is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. The upper limit is preferably 4.5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less. The content of polyalkyleneimine is preferably 0.5 to 20 parts by mass per 100 parts by mass of pigment. The lower limit is preferably 0.6 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 2 parts by mass or more. The upper limit is preferably 10 parts by mass or less, and even more preferably 8 parts by mass or less. Only one type of polyalkyleneimine may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount thereof is within the above range.

[0192] <<Compound Having a Cyclic Ether Group>> The resin composition of the present invention can contain a compound having a cyclic ether group. Examples of the cyclic ether group include an epoxy group and an oxetanyl group. The epoxy group may be an alicyclic epoxy group. The alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed. The compound having a cyclic ether group is preferably a compound having an epoxy group (hereinafter also referred to as an epoxy compound). Examples of epoxy compounds include compounds having one or more epoxy groups per molecule, and compounds having two or more epoxy groups are preferred. The epoxy compound is preferably a compound having 1 to 100 epoxy groups per molecule. The upper limit of the number of epoxy groups contained in the epoxy compound can be, for example, 10 or less, or 5 or less. The lower limit of the number of epoxy groups contained in the epoxy compound is preferably 2 or more.

[0193] Examples of compounds having a cyclic ether group include the compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, 0147 to 0156 of JP-A-2014-043556, and 0085 to 0092 of JP-A-2014-089408, and the compounds described in JP-A-2017-179172, the xanthene epoxy resins described in JP-A-2021-195421, and the xanthene epoxy resins described in JP-A-2021-195422 can be used.

[0194] The compound having a cyclic ether group may be a low molecular weight compound (for example, a molecular weight of less than 2000, or even less than 1000) or a high molecular weight compound (macromolecule) (for example, a molecular weight of 1000 or more, and in the case of a polymer, a weight average molecular weight of 1000 or more). The weight average molecular weight of the compound having a cyclic ether group is preferably 200 to 100,000, and more preferably 500 to 50,000. The upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and even more preferably 3,000 or less.

[0195] Commercially available examples of compounds having a cyclic ether group include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC Corporation), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, and G-01758 (all manufactured by NOF Corporation, epoxy group-containing polymers).

[0196] The content of the compound having a cyclic ether group in the total solid content of the resin composition is preferably 0.1 to 20% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 15% by mass or less, and more preferably 10% by mass or less. Only one type of compound having a cyclic ether group may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount thereof be in the above range.

[0197] <<Curing Accelerator>> The resin composition of the present invention may contain a curing accelerator. Examples of the curing accelerator include thiol compounds, methylol compounds, amine compounds, phosphonium salt compounds, amidine salt compounds, amide compounds, base generators, isocyanate compounds, alkoxysilane compounds, and onium salt compounds. Specific examples of the curing accelerator include the compounds described in paragraph 0164 of WO 2022 / 085485 and the compounds described in JP 2021-181406 A. The content of the curing accelerator in the total solids content of the resin composition is preferably 0.3 to 8.9% by mass, more preferably 0.8 to 6.4% by mass.

[0198] <<UV Absorber>> The resin composition of the present invention may contain an UV absorber. Examples of UV absorbers include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, triazine compounds, and dibenzoyl compounds. Specific examples of such compounds include the compound described in paragraph 0179 of International Publication No. 2022 / 085485, the reactive triazine UV absorber described in JP-A-2021-178918, the UV absorber described in JP-A-2022-007884, the compound described in Korean Patent Publication No. 10-2022-0014454, and the compound described in JP-A-2023-013321. The content of the UV absorber in the total solids content of the resin composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. The ultraviolet absorber may be used alone or in combination of two or more kinds. When two or more kinds are used, the total amount thereof is preferably in the above range.

[0199] <<Polymerization Inhibitor>> The resin composition of the present invention may contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), and N-nitrosophenylhydroxyamine salts (ammonium salts, cerous salts, etc.). Among these, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the resin composition is preferably 0.0001 to 5 mass%. One type of polymerization inhibitor may be used alone, or two or more types may be used. When two or more types are used, the total amount preferably falls within the above range.

[0200] <<Silane Coupling Agent>> The resin composition of the present invention may contain a silane coupling agent. Examples of the silane coupling agent include silane compounds having a hydrolyzable group, and preferably a silane compound having both a hydrolyzable group and another functional group. The hydrolyzable group refers to a substituent directly bonded to a silicon atom that can form a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, and an acyloxy group, with an alkoxy group being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Furthermore, examples of functional groups other than the hydrolyzable group include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, a mercapto group, an epoxy group, an oxetanyl group, an amino group, a ureido group, a sulfide group, an isocyanate group, and a phenyl group, with an amino group, a (meth)acryloyl group, and an epoxy group being preferred. Specific examples of the silane coupling agent include the compound described in paragraph 0177 of WO 2022 / 085485 and the compound described in JP 2019-183020 A. The content of the silane coupling agent in the total solid content of the resin composition is preferably 0.1 to 15% by mass. The upper limit is preferably 10% by mass or less, more preferably 5% by mass or less. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. Only one type of silane coupling agent may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount be in the above range.

[0201] <<Surfactant>> The resin composition of the present invention may contain a surfactant. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant can be used. The surfactant is preferably a silicone-based surfactant or a fluorine-based surfactant, and more preferably a silicone-based surfactant. For the surfactant, reference can be made to the surfactants described in paragraphs 0238 to 0245 of WO 2015 / 166779, the contents of which are incorporated herein by reference.

[0202] As the fluorine-based surfactant, the compounds described in paragraphs 0167 to 0173 of WO 2022 / 085485 can be used.

[0203] Examples of nonionic surfactants include the compounds described in paragraph 0174 of WO 2022 / 085485.

[0204] Silicone surfactants include DOWSIL SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, and SF 8419. OIL (all manufactured by Dow Toray Industries, Inc.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (all manufactured by BYK-Chemie). Furthermore, compounds having the following structure can also be used as the silicone surfactant.

[0205] The content of the surfactant in the total solid content of the resin composition is preferably 0.001% by mass to 5.0% by mass, more preferably 0.005% by mass to 3.0% by mass. Only one type of surfactant may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount is within the above range.

[0206] <<Antioxidant>> The resin composition of the present invention can contain an antioxidant. Examples of antioxidants include phenolic antioxidants, amine antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants. Examples of phenolic antioxidants include hindered phenol compounds. The phenolic antioxidant is preferably a compound having a substituent at the position adjacent to the phenolic hydroxy group (ortho position). The aforementioned substituent is preferably a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms. The antioxidant is also preferably a compound having a phenol group and a phosphite ester group in the same molecule. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphepin-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-2-yl)oxy]ethyl]amine, ethyl bis(2,4-di-tert-butyl-6-methylphenyl)phosphite, and tris(2,4-di-tert-butylphenyl)phosphite. Commercially available antioxidants include, for example, ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, ADK STAB AO-330 (manufactured by ADEKA Corporation), and JP-650 (manufactured by Johoku Chemical Industry Co., Ltd.). Antioxidants include the compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, the compounds described in WO 2017 / 006600, the compounds described in WO 2017 / 164024, and the compounds described in Korean Patent Publication No. 10-2019-0059371. The content of the antioxidant in the total solid content of the resin composition is preferably 0.01 to 20 mass %, more preferably 0.3 to 15 mass %. Only one type of antioxidant may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount thereof is within the above range.

[0207] <<Other Components>> The resin composition of the present invention may contain, as necessary, a sensitizer, a plasticizer, and other auxiliaries (for example, conductive particles, fillers, antifoaming agents, flame retardants, leveling agents, peeling promoters, fragrances, surface tension modifiers, chain transfer agents, etc.). By appropriately incorporating these components, properties such as film physical properties can be adjusted. As these components, the compounds described in paragraph 0182 of WO 2022 / 085485 can be used.

[0208] The resin composition of the present invention may contain a metal oxide in order to adjust the refractive index of the resulting film. Examples of the metal oxide include TiO ２ , ZrO ２ , Al ２ O ３ , SiO ２ The primary particle size of the metal oxide is preferably 1 to 100 nm, more preferably 3 to 70 nm, and even more preferably 5 to 50 nm. The metal oxide may have a core-shell structure. In this case, the core may be hollow.

[0209] The resin composition of the present invention may contain a light resistance improver. Examples of the light resistance improver include the compounds described in paragraph 0183 of WO 2022 / 085485.

[0210] It is also preferable that the resin composition of the present invention is substantially free of terephthalic acid esters. Here, "substantially free" means that the content of terephthalic acid esters in the total amount of the resin composition is 1,000 ppb by mass or less, more preferably 100 ppb by mass or less, and particularly preferably zero.

[0211] In view of environmental regulations, the resin composition of the present invention preferably has a melamine content of 10,000 ppm by mass or less.

[0212] The resin composition of the present invention preferably has a free metal content of 100 ppm or less, more preferably 50 ppm or less. The free halogen content is preferably 100 ppm or less, more preferably 50 ppm or less. Methods for reducing the free metals and halogens in the resin composition include washing with ion-exchanged water, filtration, ultrafiltration, and purification with an ion-exchange resin.

[0213] From the viewpoint of environmental regulations, the use of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts may be restricted. When the content of the above-mentioned compounds in the resin composition of the present invention is reduced, the content of perfluoroalkyl sulfonic acid (particularly perfluoroalkyl sulfonic acid having a perfluoroalkyl group of 6 to 8 carbon atoms) and its salts, and perfluoroalkyl carboxylic acid (particularly perfluoroalkyl carboxylic acid having a perfluoroalkyl group of 6 to 8 carbon atoms) and its salts is preferably in the range of 0.01 ppb to 1000 ppb, more preferably in the range of 0.05 ppb to 500 ppb, and even more preferably in the range of 0.1 ppb to 300 ppb, relative to the total solids content of the resin composition. The resin composition of the present invention may be substantially free of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts. For example, by using a compound that can replace perfluoroalkyl sulfonic acid and its salts, and a compound that can replace perfluoroalkyl carboxylic acid and its salts, a resin composition that is substantially free of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts, may be selected. Examples of compounds that can replace regulated compounds include compounds that are exempt from regulation due to differences in the number of carbon atoms in the perfluoroalkyl group. However, the above content does not preclude the use of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts. The resin composition of the present invention may contain perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts, within the maximum allowable range.

[0214] The water content of the resin composition of the present invention is usually 3% by mass or less, preferably 0.01 to 1.5% by mass, and more preferably 0.1 to 1.0% by mass. The water content can be measured by the Karl Fischer method.

[0215] The resin composition of the present invention can be used by adjusting the viscosity for the purpose of adjusting the film surface state (flatness, etc.), adjusting the film thickness, etc. The viscosity value can be appropriately selected as needed, but for example, it is preferably 0.3 mPa·s to 50 mPa·s, and more preferably 0.5 mPa·s to 20 mPa·s at 25°C. The viscosity can be measured, for example, using a cone-plate type viscometer, with the temperature adjusted to 25°C.

[0216] <<Storage Container>> The container for storing the resin composition is not particularly limited, and a known container can be used. Further, the container described in paragraph 0187 of WO 2022 / 085485 can be used as the storage container.

[0217] <Method for preparing resin composition> The resin composition of the present invention can be prepared by mixing the above-mentioned components. When preparing the resin composition, all components may be simultaneously dissolved and / or dispersed in a solvent to prepare the resin composition, or, if necessary, each component may be prepared as two or more appropriate solutions or dispersions, which are mixed at the time of use (application) to prepare the resin composition.

[0218] The preparation of the resin composition preferably includes a process for dispersing the pigment. In the process for dispersing the pigment, mechanical forces used to disperse the pigment include compression, squeezing, impact, shear, and cavitation. Specific examples of these processes include a bead mill, a sand mill, a roll mill, a ball mill, a paint shaker, a microfluidizer, a high-speed impeller, a sand grinder, a flow jet mixer, high-pressure wet atomization, and ultrasonic dispersion. Furthermore, when grinding the pigment in a sand mill (bead mill), it is preferable to use small-diameter beads, increase the bead packing ratio, or otherwise increase the grinding efficiency under such conditions. Furthermore, it is preferable to remove coarse particles after the grinding process by filtration, centrifugation, or the like. In addition, the process and disperser for dispersing pigments can be suitably used, for example, the process and disperser described in "Dispersion Technology Encyclopedia," published by Joho Kiko Co., Ltd., July 15, 2005, or "Dispersion Technology and Industrial Applications Focused on Suspension (Solid / Liquid Dispersion System) - Comprehensive Data Collection," published by the Management Development Center Publishing Department, October 10, 1978, and paragraph 0022 of JP 2015-157893 A. In addition, in the process for dispersing pigments, particle refinement may be performed in a salt milling process. For details on the materials, equipment, processing conditions, etc. used in the salt milling process, see, for example, JP 2015-194521 A and JP 2012-046629 A. Examples of materials for beads used in dispersion include zirconia, agate, quartz, titania, tungsten carbide, silicon nitride, alumina, stainless steel, and glass. The beads may also be made of an inorganic compound having a Mohs hardness of at least 2. The resin composition may contain 1 to 10,000 ppm of the beads.

[0219] When preparing the resin composition, it is preferable to filter the resin composition with a filter for the purpose of removing foreign matter, reducing defects, etc. Examples of the types of filters and filtration methods used for filtration include the filters and filtration methods described in paragraphs 0196 to 0199 of WO 2022 / 085485.

[0220] <Film> The film of the present invention is a film obtained from the resin composition of the present invention described above. The film of the present invention can be used in optical filters such as color filters, infrared transmission filters, and infrared cut filters.

[0221] The thickness of the film of the present invention can be adjusted appropriately depending on the purpose. For example, the thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and even more preferably 0.3 μm or more.

[0222] When the film of the present invention is used as a color filter, the film of the present invention preferably has a green, red, blue, cyan, magenta, or yellow hue. The film of the present invention can also be preferably used as a color pixel of a color filter. Examples of the color pixel include a red pixel, a green pixel, a blue pixel, a magenta pixel, a cyan pixel, and a yellow pixel.

[0223] <Film Manufacturing Method> Next, a method for manufacturing a film of the present invention will be described. The film of the present invention can be manufactured via a step of applying the resin composition of the present invention. The film manufacturing method preferably further includes a step of forming a pattern (pixels). An example of a method for forming a pattern (pixel) is photolithography. By forming a pattern by photolithography using the resin composition of the present invention, it is possible to suppress the reduction of colorant from the film during development, and to suppress fluctuations in the spectral properties of the film before and after development.

[0224] The pattern formation by the photolithography method preferably includes the steps of forming a composition layer on a support using the resin composition of the present invention, exposing the composition layer to light in a pattern, and developing and removing the unexposed portions of the composition layer to form a pattern (pixels). If necessary, a step of baking the composition layer (pre-baking step) and a step of baking the developed pattern (pixels) (post-baking step) may be provided.

[0225] In the step of forming a composition layer, a composition layer is formed on a support using the resin composition of the present invention. The support is not particularly limited and can be appropriately selected depending on the application. Examples include a glass substrate and a silicon substrate, with a silicon substrate being preferred. The silicon substrate may also be formed with a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), a transparent conductive film, or the like. A black matrix is ​​sometimes formed on the silicon substrate to isolate each pixel. The silicon substrate may also be provided with an underlayer to improve adhesion with the upper layer, prevent diffusion of substances, or flatten the substrate surface. The surface contact angle of the underlayer is preferably 20 to 70° when measured with diiodomethane. It is also preferably 30 to 80° when measured with water.

[0226] Known methods can be used as the coating method for the resin composition. For example, a dropping method (drop casting); a slit coating method; a spray method; a roll coating method; a rotary coating method (spin coating); a casting coating method; a slit and spin method; a pre-wet method (for example, the method described in JP 2009-145395 A); inkjet (for example, on-demand method, piezo method, thermal method), various printing methods such as nozzle jet ejection printing, flexographic printing, screen printing, gravure printing, reverse offset printing, metal mask printing; a transfer method using a mold or the like; a nanoimprint method, etc. can also be used. In addition, the coating method described in paragraph number 0207 of WO 2022 / 085485 A can also be used.

[0227] The composition layer formed on the support may be dried (prebaked). When a film is produced by a low-temperature process, prebaking may not be performed. When prebaking is performed, the prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, or can also be 80°C or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. Prebaking can be performed using a hot plate, an oven, or the like.

[0228] Next, the composition layer is exposed to light in a pattern (exposure step). For example, the composition layer can be exposed to light in a pattern by using a stepper exposure machine, a scanner exposure machine, or the like, through a mask having a predetermined mask pattern. This allows the exposed portion to be cured.

[0229] Examples of radiation (light) that can be used for exposure include g-line and i-line. Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF line (wavelength 248 nm) and ArF line (wavelength 193 nm), with KrF line (wavelength 248 nm) being preferred. Long-wave light sources of 300 nm or more can also be used.

[0230] The exposure may be performed by continuous irradiation with light or by pulsed irradiation (pulse exposure), which is an exposure method in which light irradiation and pauses are repeated in short cycles (for example, milliseconds or less).

[0231] The irradiation amount (exposure amount) is, for example, 0.03 to 2.5 J / cm ２ is preferred, and 0.05 to 1.0 J / cm ２ The oxygen concentration during exposure can be appropriately selected. In addition to being performed in the atmosphere, exposure may be performed in a low-oxygen atmosphere with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially oxygen-free), or in a high-oxygen atmosphere with an oxygen concentration of more than 21% by volume (e.g., 22% by volume, 30% by volume, or 50% by volume). The exposure illuminance can be appropriately set, and is usually 1000 W / m ２ ~100000W / m ２ (For example, 5000 W / m ２ , 15000W / m ２ , or 35,000 W / m ２ The oxygen concentration and exposure illuminance may be appropriately combined. For example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W / m ２ , oxygen concentration 35% by volume, illuminance 20,000 W / m ２etc.

[0232] Next, the unexposed portions of the composition layer are developed and removed to form a pattern (pixels). The unexposed portions of the composition layer can be developed and removed using a developer. As a result, the unexposed portions of the composition layer in the exposure step are dissolved into the developer, leaving only the photocured portions. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, to improve residue removability, the process of shaking off the developer every 60 seconds and then supplying fresh developer may be repeated several times.

[0233] Examples of the developer include organic solvents and alkaline developers, and alkaline developers are preferably used. Regarding the developer and the washing (rinsing) method after development, the developer and washing method described in paragraph 0214 of WO 2022 / 085485 can be used.

[0234] After development and drying, it is preferable to perform additional exposure treatment or heating treatment (post-baking). The additional exposure treatment or post-baking is a post-development curing treatment to ensure complete curing. The heating temperature in post-baking is, for example, preferably 100 to 300°C, more preferably 200 to 270°C. Post-baking can be performed continuously or batchwise using a heating means such as a hot plate, convection oven (hot air circulation dryer), or high-frequency heater to achieve the above conditions for the developed film. When additional exposure treatment is performed, it is preferable that the light used for exposure has a wavelength of 400 nm or less. The additional exposure treatment may also be performed by the method described in Korean Patent Publication No. 10-2017-0122130.

[0235] <Optical Filter> The film of the present invention can be used in an optical filter. Types of optical filters include color filters, infrared cut filters, and infrared transmission filters, and a color filter is preferred. The color filter preferably has the film of the present invention as its pixel, and more preferably has the film of the present invention as a colored pixel.

[0236] The optical filter may have a protective layer provided on the surface of the film of the present invention. By providing a protective layer, various functions can be imparted, such as oxygen blocking, low reflectivity, hydrophilicity / hydrophobicity, and blocking of light of specific wavelengths (ultraviolet rays, infrared rays, etc.). The thickness of the protective layer is preferably 0.01 to 10 μm, more preferably 0.1 to 5 μm. Methods for forming the protective layer include a method of applying a resin composition for forming the protective layer, a chemical vapor deposition method, and a method of attaching a molded resin with an adhesive. Components constituting the protective layer include (meth)acrylic resin, ene-thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyphenylene resin, polyarylene ether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin, melamine resin, urethane resin, aramid resin, polyamide resin, alkyd resin, epoxy resin, modified silicone resin, fluororesin, polyacrylonitrile resin, cellulose resin, Si, C, W, Al ２ O ３ , Mo, SiO ２ , Si ２ N ４ For example, in the case of a protective layer intended to block oxygen, the protective layer may contain a polyol resin and SiO ２ and Si ２ N ４ In the case of a protective layer intended to reduce reflection, the protective layer preferably contains a (meth)acrylic resin and a fluorine resin.

[0237] When forming a protective layer by applying a resin composition, known methods such as spin coating, casting, screen printing, and inkjet printing can be used as a method for applying the resin composition for forming the protective layer. Known organic solvents (e.g., propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used as the organic solvent contained in the resin composition for forming the protective layer. When forming the protective layer by chemical vapor deposition, known chemical vapor deposition methods (thermal chemical vapor deposition, plasma chemical vapor deposition, photochemical vapor deposition) can be used as the chemical vapor deposition method.

[0238] The protective layer may contain additives such as organic or inorganic fine particles, absorbers for light of specific wavelengths (e.g., ultraviolet light, infrared light, etc.), refractive index adjusters, antioxidants, adhesives, and surfactants, as needed. Examples of organic or inorganic fine particles include polymeric fine particles (e.g., silicone resin fine particles, polystyrene fine particles, and melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, titanium nitride, titanium oxynitride, magnesium fluoride, hollow silica, silica, calcium carbonate, and barium sulfate. Known absorbers for light of specific wavelengths can be used. The content of these additives can be adjusted as appropriate, but is preferably 0.1 to 70% by mass, and more preferably 1 to 60% by mass, of the total mass of the protective layer.

[0239] As the protective layer, the protective layers described in paragraphs 0073 to 0092 of JP-A-2017-151176 can also be used.

[0240] The optical filter may have a structure in which each pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern.

[0241] <Solid-state imaging device> The solid-state imaging device of the present invention has the above-described film of the present invention. The configuration of the solid-state imaging device is not particularly limited as long as it has the film of the present invention and functions as a solid-state imaging device, but examples thereof include the following configurations.

[0242] The substrate includes a plurality of photodiodes constituting a light-receiving area of ​​a solid-state imaging device (such as a CCD (charge-coupled device) image sensor or a CMOS (complementary metal-oxide semiconductor) image sensor) and transfer electrodes made of polysilicon or the like. A light-shielding film is formed on the photodiodes and transfer electrodes, with only the light-receiving portions of the photodiodes exposed. A device protection film made of silicon nitride or the like is formed on the light-shielding film so as to cover the entire light-shielding film and the light-receiving portions of the photodiodes. A color filter is also provided on the device protection film. Furthermore, the device protection film may include a light-collecting means (e.g., a microlens, etc.; the same applies hereinafter) below the color filter (on the side closer to the substrate), or on the color filter. The color filter may have a structure in which each color pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern. In this case, the partition walls preferably have a lower refractive index than the color pixels. Examples of imaging devices having such a structure include those described in JP 2012-227478 A, JP 2014-179577 A, and WO 2018 / 043654 A. Furthermore, as shown in JP 2019-211559 A, an ultraviolet absorbing layer may be provided within the structure of the solid-state imaging element to improve light resistance. An imaging device equipped with the solid-state imaging element of the present invention can be used for digital cameras, electronic devices with imaging functions (such as mobile phones), as well as in-vehicle cameras and surveillance cameras.

[0243] <Image Display Device> The image display device of the present invention has the above-described film of the present invention. Examples of image display devices include liquid crystal display devices and organic electroluminescence display devices. Definitions of image display devices and details of each image display device are described, for example, in "Electronic Display Devices" (written by Akio Sasaki, published by Kogyo Chosakai Co., Ltd. in 1990) and "Display Devices" (written by Nobuaki Ibuki, published by Sangyo Tosho Co., Ltd. in 1989). Liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology" (edited by Tatsuo Uchida, published by Kogyo Chosakai Co., Ltd. in 1994). There are no particular limitations on the liquid crystal display device to which the present invention can be applied, and the present invention can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology."

[0244] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, treatment details, treatment procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. In the structural formulas shown below, Me is a methyl group, Et is an ethyl group, iBu is an isobutyl group, Ph is a phenyl group, and Ac is an acetyl group.

[0245] Synthesis Example Synthesis of Potassium Salts of Anions AN001 to AN006 Potassium salts of anions AN001 to AN006 were synthesized according to the following method: A sulfonic acid amide and a sulfonic acid amide were reacted with potassium carbonate in dimethylacetamide solvent to obtain potassium salts of the corresponding anions.

[0246] Specifically, the potassium salts of anions AN001 to AN006 were synthesized according to the following synthesis scheme. 1.67 g of intermediate AN001-1 and 1.38 g of potassium carbonate were added to 20 mL of dimethylacetamide. The reaction solution was cooled to 5°C, and intermediate AN001-2 was added in portions so that the internal temperature did not exceed 10°C. The reaction solution was heated to 25°C and stirred at 25°C for 2 hours. 200 mL of ethyl acetate was then added, and the precipitated crystals were collected by filtration. 50 mL of distilled water was added to the obtained crystals, and the mixture was extracted three times with 100 mL of chloroform. The resulting chloroform layer was collected and concentrated under reduced pressure to obtain 2.10 g of the potassium salt of anion AN001.

[0247] The potassium salts of anions AN002 to AN006 were synthesized using a similar synthesis method.

[0248] [Synthesis of Potassium Salts of Anions AN101 to AN106] Protonated forms of anions AN101 to AN106 were synthesized according to the following scheme using the synthesis method described in US Pat. No. 3,337,636. The resulting protonated forms were dissolved in methanol, and the resulting methanol solution was passed through a column packed with ion exchange resin (strong acid, K type). The resulting methanol solution was concentrated to obtain potassium salts of anions AN101 to AN106.

[0249] [Synthesis of Compound Dye001] 5.14 g of C.I. Basic Blue 7 (chloride salt of the cation moiety) and 3.55 g of the potassium salt of the anion AN001 were dissolved in 100 mL of chloroform, and the chloroform layer was washed five times with 100 mL of distilled water. The chloroform solution was concentrated to obtain Compound Dye001.

[0250] [Synthesis of Compound Dye002] Compound Dye002 was obtained in the same manner as in the synthesis of Compound Dye001, except that in the synthesis of Compound Dye001, C.I. Basic Blue 7 was replaced with an equimolar amount of Basic Violet 11:1.

[0251] [Synthesis of Compound Dye003] In the synthesis of Compound Dye001, C.I. Basic Blue 7 was replaced with an equimolar amount of Compound 8 described in WO 2021 / 176755. Compound Dye003 was obtained in the same manner as in the synthesis of Compound Dye001.

[0252] [Synthesis of Compound Dye004] Compound Dye004 was obtained in the same manner as in Example 4 of JP-A No. 2011-038007, except that sodium pentafluorobenzenesulfonate was replaced with an equimolar amount of potassium salt of anion AN001.

[0253] [Synthesis of Compound Dye005] Compound Dye005 was obtained in the same manner as in the synthesis of Compound Dye001, except that in the synthesis of Compound Dye001, C.I. Basic Blue 7 was replaced with an equimolar amount of Compound 11 of JP-A-2022-188858.

[0254] [Synthesis of Compounds Dye006 to Dye014] Compounds Dye006 to Dye014 were obtained in the same manner as in the synthesis of Compound Dye001.

[0255] [Synthesis of Compounds Dye101 to Dye114] Compounds Dye101 to Dye114 were obtained in the same manner as in the synthesis of Compounds Dye001 to Dye014, except that the potassium salts of anions AN001 to AN006 used in the synthesis of Compounds Dye001 to Dye014 were replaced with equimolar amounts of potassium salts of the corresponding anions AN101 to AN106, respectively.

[0256] <Production of resin solution> [Production Example 1-1] Production of resin solution B-1 A separable flask equipped with a cooling tube was prepared as a reaction vessel, and on the other hand, as a monomer dropping vessel, 162.38 parts by mass of benzyl methacrylate (hereinafter referred to as "BzMA"), 34.00 parts by mass of methacrylic acid (hereinafter referred to as "MAA"), 2,2'-azobis (2-methylpropionate) dimethyl (low metal grade) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. "V-601HP") 6.06 parts by mass of, 435 parts by mass of cyclohexanone, and 5.33 parts by mass of n-dodecanethiol (hereinafter referred to as "n-DM") were stirred and mixed to prepare a mixture. 49 parts by mass of cyclohexanone was charged into the reaction vessel, and after nitrogen substitution, the temperature of the reaction vessel was heated in an oil bath with stirring to 75 ° C. After the temperature of the reaction vessel stabilized at 75°C, dropwise addition from the monomer dropping vessel to the reaction vessel began. The dropwise addition was carried out over 150 minutes while maintaining the temperature at 75°C. 120 minutes after the end of the dropwise addition, the temperature was raised to 90°C and the reaction vessel was then cooled to room temperature. After maintaining 90°C for 2 hours, the reaction solution was cooled to room temperature. After the polymerization reaction was completed, 3.09 parts by mass of N,N-dimethyldodecylamine as an amine compound and 0.5 parts by mass of p-methoxyphenol as a polymerization inhibitor were added in air, followed by the addition of 37.43 parts by mass of glycidyl methacrylate (GMA) and 96 parts by mass of cyclohexanone. Thereafter, the temperature of the reaction solution was raised to 90°C and the reaction vessel was then maintained at 90°C for 6 hours, after which the reaction solution was cooled to room temperature. The cooled reaction solution was poured into a mixed solution of 10,000 parts by mass of methanol and 2,500 parts by mass of water, and the precipitated solid (polymer) was collected by filtration. The collected solid was washed twice with 500 parts by mass of water. The washed solid was dried with air at 50°C for 18 hours to obtain Resin B-1 having the following structure. The resulting Resin B-1 had a weight average molecular weight (Mw) of 12,000, an acid value of 32 mgKOH / g, and an ethylenically unsaturated bond-containing group value of 1.13 mmol / g.

[0257] Resin B-1 obtained by the above procedure was added to propylene glycol monomethyl ether acetate (hereinafter abbreviated as "PGMEA"), and the resin concentration (solid content concentration) of the finally obtained resin solution was adjusted to 30%, thereby producing Resin Solution B-1.

[0258] [Production Example 1-2] Production of resin solution B-2 A separable flask equipped with a cooling tube was prepared as a reaction vessel, and on the other hand, as a monomer dropping vessel, 30.7 parts by mass of dimethyl-2,2'-[oxybis (methylene)] bis-2-propenoate, 43.1 parts by mass of MAA, 14.3 parts by mass of methyl methacrylate (hereinafter abbreviated as "MMA"), 113.5 parts by mass of BzMA, 4 parts by mass of benzoyl peroxide (PBO), and 60 parts by mass of diethylene glycol dimethyl ether (hereinafter referred to as "DMDG") were prepared by stirring and mixing, and as a chain transfer agent dropping vessel, 8 parts by mass of n-DM and 32 parts by mass of DMDG were prepared by stirring and mixing. 375 parts by mass of DMDG were charged into the reaction vessel, and after nitrogen substitution, the temperature of the reaction vessel was heated in an oil bath with stirring and raised to 90 ° C. After the temperature of the reaction vessel stabilized at 90°C, dropwise addition from the monomer dropping vessel and the chain transfer agent dropping vessel to the reaction vessel began. The dropwise addition was carried out over 135 minutes, while maintaining the temperature at 90°C. Sixty minutes after the end of the dropwise addition, the temperature was raised to 110°C. After maintaining 110°C for three hours, a gas inlet tube was attached to the separable flask, and bubbling of a 5 / 95 (v / v) oxygen / nitrogen mixed gas began. Next, 50.9 parts by mass of GMA, 0.4 parts by mass of 2,2'-methylenebis(4-methyl-6-t-butylphenol) (hereinafter referred to as "MBMTB"), and 0.8 parts by mass of triethylamine (hereinafter referred to as "TEA") were charged into the reaction vessel, and the mixture was allowed to react at 110°C for three hours. After confirming the completion of the reaction by measuring the acid value of the reaction solution, 155 parts by mass of DMDG was added to the reaction solution, and the mixture was cooled to room temperature. To the cooled reaction solution, 1,000 parts by mass of water was added, and the precipitated solid (polymer) was collected by filtration. The collected solid was washed twice with 100 parts by mass of ethanol and once with 500 parts by mass of water to obtain Resin B-2 having the following structure. The resulting Resin B-2 had a weight average molecular weight (Mw) of 18,000, an acid value of 32 mgKOH / g, and an ethylenically unsaturated bond-containing group value of 1.42 mmol / g.

[0259] Resin B-2 obtained by the above procedure was added to PGMEA, and the resin concentration (solid content concentration) of the final resin solution was adjusted to 30%, thereby producing Resin Solution B-2.

[0260] [Production Example 1-3] Production of Resin Solution B-3 A mixture was obtained by introducing 30.4 parts by mass of a macromonomer represented by the following formula (MM), 51 parts by mass of ω-carboxy-polycaprolactone monoacrylate (Aronix M-5300, manufactured by Toagosei Co., Ltd.), and 180 parts by mass of PGMEA into a three-neck flask. The mixture was stirred while blowing in nitrogen. Next, while flowing nitrogen gas into the flask, the mixture was heated to 75°C. Next, 0.82 parts by mass of n-DM and then 0.43 parts by mass of 2,2'-azobis(methyl 2-methylpropionate) (V-601, manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) were added to the mixture to initiate the polymerization reaction. After heating the mixture at 75°C for 2 hours, an additional 0.43 parts by mass of 2,2'-azobis(methyl 2-methylpropionate) was added to the mixture. After 2 hours, an additional 0.43 parts by mass of 2,2'-azobis(methyl 2-methylpropionate) was added to the mixture. After reacting for another 2 hours, the mixture was heated to 90°C and stirred for 3 hours. The polymerization reaction was completed by the above operation. After the polymerization reaction was completed, 9.6 parts by mass of dimethyldodecylamine as an amine compound and 0.3 parts by mass of 2,2,6,6-tetramethylpiperidine-1-oxyl (TEMPO) as a polymerization inhibitor were added under air, followed by the dropwise addition of 9 parts by mass of 4-hydroxybutyl acrylate glycidyl ether (4HBAGE). After the dropwise addition was completed, the reaction was continued under air at 90°C for 24 hours, after which the completion of the reaction was confirmed by acid value measurement, and the reaction solution was cooled to room temperature. 1,000 parts by mass of water was added to the cooled reaction solution, and the precipitated solid (polymer) was collected by filtration. The collected solid was washed twice with 100 parts by mass of ethanol and once with 500 parts by mass of water to obtain Resin B-3 having the following structure. The weight-average molecular weight (Mw) of the resulting Resin B-3 was 17,200, the acid value was 70 mgKOH / g, and the ethylenically unsaturated bond-containing group value was 0.50 mmol / g.

[0261] Resin B-3 obtained by the above procedure was added to PGMEA, and the resin concentration (solid content concentration) of the final resin solution was adjusted to 30%, thereby producing Resin Solution B-3.

[0262] [Production Example 1-4] Production of Resin Solution B-4 A reaction vessel equipped with a gas inlet tube, a thermometer, a condenser, and a stirrer was charged with 8 parts by mass of 3-mercapto-1,2-propanediol, 12 parts by mass of pyromellitic anhydride, 80 parts by mass of PGMEA, and 0.2 parts by mass of monobutyltin oxide as a catalyst, and then purged with nitrogen gas. The reaction was carried out at 120 ° C. for 5 hours (first step). It was confirmed that 95% or more of the acid anhydride was half-esterified by measuring the acid value. Next, 30 parts by mass of methyl methacrylate, 10 parts by mass of t-butyl acrylate, 10 parts by mass of ethyl acrylate, 5 parts by mass of methacrylic acid, 10 parts by mass of benzyl methacrylate, and 35 parts by mass of 2-hydroxyethyl methacrylate were charged, and the reaction vessel was heated to 80 ° C., and 1 part by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) was added, and the reaction was carried out for 12 hours (second step). It was confirmed by measuring the solid content that 95% had reacted. Then, the atmosphere in the flask was replaced with air, and 35.0 parts by mass of 2-methacryloyloxyethyl isocyanate and 0.1 parts by mass of hydroquinone were added, followed by a reaction at 70°C for 4 hours (third step). Infrared absorption spectroscopy revealed a peak at 2270 cm based on the isocyanate group. －１ After confirming that the peak had disappeared, the reaction solution was cooled to obtain Resin B-4 having the following structure: The resulting Resin B-4 had an acid value of 40 mg KOH / g, a weight average molecular weight of 12,000, and an ethylenically unsaturated bond-containing group value of 1.44 mmol / g. In formula (B-4), either *1 or *2 is bonded to *5 or *6 to form a polyester main chain, and the other is bonded to *3 or *4 to form a polyester main chain. Either *3 or *4 is bonded to *1 or *2 to form a polyester main chain, and the other is bonded to an OH group to form a carboxylic acid. Either *5 or *6 is bonded to *1 or *2 to form a polyester main chain, and the other is bonded to an OH group to form a carboxylic acid.

[0263] Resin B-4 obtained by the above procedure was added to PGMEA, and the resin concentration (solid content concentration) of the final resin solution was adjusted to 30%, thereby producing Resin Solution B-4.

[0264] <Production of Micronized Pigment> [Production Example 2-1] 100 parts by mass of C.I. Pigment Blue 15:6 ("LIONOL BLUE ES" manufactured by Toyocolor Co., Ltd.), 1200 parts by mass of sodium chloride, and 120 parts by mass of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 4 hours at 60 ° C. The obtained kneaded composition was added to 3000 parts by mass of warm water and stirred for 1 hour to form a slurry, which was then repeatedly filtered and washed with water to remove the sodium chloride and diethylene glycol, and then dried at 80 ° C. for one day to obtain a micronized pigment PB15:6M.

[0265] [Production Example 2-2] The same treatment as in Production Example 2-1 was carried out, except that the pigment used in Production Example 2-1 was changed from C.I. Pigment Blue 15:6 to Pigment PPB001 having the following structure, to obtain a micronized pigment PPB001M.

[0266] <Preparation of Pigment Dispersions> The materials listed in the table below were mixed and then dispersed for 3 hours in an Eiger mill (Mini Model M-250 MKII, manufactured by Eiger Japan Co., Ltd.) using zirconia beads with a diameter of 0.5 mm. The resulting mixture was then filtered through a filter with a pore size of 5.0 μm to prepare pigment dispersions PD-1 and PD-2.

[0267] Details of the materials listed in the table above are as follows:

[0268] (Finely divided pigments) PB15:6M: Finely divided pigment PB15:6M produced as above PPB001M: Finely divided pigment PPB001M produced as above

[0269] (Pigment derivatives) Derivative 1 and Derivative 2: Compounds having the following structures

[0270] (Resin solution) B-3: Resin solution B-3 prepared above

[0271] (Solvent) S-1: Propylene glycol monomethyl ether acetate

[0272] <Production of Resin Composition> The materials shown in the table below were mixed in the parts by mass shown in the table below, respectively, and stirred. The mixture was then filtered through a nylon filter with a pore size of 0.45 μm (manufactured by Nippon Pall Co., Ltd.) to produce a resin composition.

[0273]

[0274]

[0275] The details of the materials indicated by the abbreviations in the table showing the formulation of the above resin composition are as follows.

[0276] (Dyes) dye001 to dye014, dye101 to dye114: Compounds synthesized above dye001 to dye014, dye101 to dye114 cdye001: Compound having the following structure

[0277] (Pigment dispersions) PD-1 and PD-2: Pigment dispersions PD-1 and PD-2 prepared above

[0278] (Resin solutions) B-1, B-2, B-4: Resin solutions B-1, B-2, B-4 prepared above

[0279] (Polymerizable Compounds) M-1: Aronix M-305 (manufactured by Toagosei Co., Ltd., a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate, the content of pentaerythritol triacrylate being 55% by mass to 63% by mass) M-2: KAYARAD RP-1040 (manufactured by Nippon Kayaku Co., Ltd., ethylene oxide-modified pentaerythritol tetraacrylate) M-3: Aronix M-510 (manufactured by Toagosei Co., Ltd., polybasic acid-modified acrylic oligomer)

[0280] (Photopolymerization initiator) I-1: Compound having the following structure I-2: ADEKA ARCLES NCI-730 (manufactured by ADEKA Corporation) I-3: Compound having the following structure

[0281] (Ultraviolet absorber) U-1: Uvinul 3050 (manufactured by BASF, benzophenone compound) U-2: Adeka STAB LA-F70 (manufactured by ADEKA Corporation, triazine compound) U-3: Adeka STAB LA-31RG (manufactured by ADEKA Corporation, benzotriazole compound)

[0282] (Polymerization inhibitor) IN-1: p-methoxyphenol IN-2: 2,2,6,6-tetramethylpiperidine 1-oxyl free radical IN-3: Adekastab AO-80 (manufactured by ADEKA Corporation)

[0283] (Surfactant) W-1: Compound having the following structure (number average molecular weight 1800, silicone surfactant) W-2: Megafac F-781F (manufactured by DIC Corporation, fluorine-based surfactant) W-3: Surfynol 440 (manufactured by Nissin Chemical Industry Co., Ltd., nonionic surfactant)

[0284] (Solvent) S-1: Propylene glycol monomethyl ether acetate S-2: 1-methoxy-2-propanol S-3: Cyclopentanone

[0285] <Evaluation of Heat Resistance> Each resin composition was applied to a glass substrate by spin coating so that the film thickness after post-baking would be 0.5 μm. Then, the substrate was heated at 100° C. for 2 minutes using a hot plate. Next, the resulting composition layer was irradiated with light (KrF line) with a wavelength of 248 nm at an illuminance of 35,000 W / m using a KrF scanner exposure device. ２ , exposure dose 200 mJ / cm ２The film was exposed to light by irradiation with 1000 nm. Next, a heat treatment (post-baking) was performed for 300 seconds using a hot plate at 200 ° C. to form a film. The transmittance of the glass substrate on which the above film was formed was measured in a wavelength range of 400 to 1500 nm using a spectrophotometer (UV3600, manufactured by Shimadzu Corporation, reference: glass substrate). Next, the glass substrate on which the above film was formed was heated at 200 ° C. for 5 minutes using a hot plate. The change in transmittance (ΔT) at the maximum absorption wavelength before heating in the wavelength range of 400 to 1500 nm before and after heating was determined, and the heat resistance was evaluated according to the following evaluation criteria based on the largest ΔT value in the entire measured wavelength range. The smaller the ΔT value, the better the heat resistance. Change in transmittance (ΔT) = |Transmittance of film before heating−Transmittance of film after heating| -Evaluation criteria- A: ΔT<3% B: 3%≦ΔT<5% C: 5%≦ΔT<8% D: 8%≦ΔT

[0286] <Evaluation of Color Loss> A composition for forming an underlayer (CT-4000L, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was applied to a glass substrate so that the dry film thickness was 0.1 μm, and the mixture was dried to form an underlayer, which was then heat-treated at 220°C for 5 minutes. The above-described resin composition was applied to the underlayer of the glass substrate on which the underlayer had been formed, using a spin coater, so that the film thickness after pre-baking would be 1.0 μm, and the composition was then heat-treated (pre-baked) for 2 minutes using a hot plate at 100°C. Next, the resulting composition layer was exposed to light (KrF radiation) with a wavelength of 248 nm at an illuminance of 35,000 W / m using a KrF scanner exposure machine. ２ , exposure dose 200 mJ / cm ２The film was exposed to light at 1000 nm. The transmittance of the resulting film was measured in the wavelength range of 400 to 1500 nm using a spectrophotometer (UV3600, manufactured by Shimadzu Corporation, reference: glass substrate). The film after transmittance measurement was placed on the horizontal rotating table of a spin-shower developer (DW-30 model, manufactured by Chemitronics Corporation) and paddle-developed at 23°C for 60 seconds using a CD-2000 (manufactured by Fujifilm Electronic Materials Co., Ltd.). While rotating the silicon wafer substrate at a rotation speed of 50 rpm using a rotating device, pure water was supplied in a shower-like manner from a spray nozzle from above the center of rotation to perform a rinse treatment, and then spray-dried. After drying, spectroscopic measurement was carried out again, and the transmittance change of the film before and after development was calculated using the following formula, and color loss was evaluated using the following evaluation criteria. Transmittance change = |T ０ -T １ | T ０ is the transmittance at the maximum absorption wavelength in the wavelength range of 400 to 1500 nm before development, and T １ Is T ０ is the transmittance of the film after development at the wavelength at which the above was measured. -Evaluation criteria- A: The transmittance fluctuation is less than 3%. B: The transmittance fluctuation is 3% or more and less than 5%. C: The transmittance fluctuation is 5% or more and less than 10%. D: The transmittance fluctuation is 10% or more.

[0287]

[0288] As shown in the above table, the examples were able to form films that were excellent in heat resistance and prevented color loss during development.

[0289] For the resin composition used in Example 1, the exposure light source was changed from KrF rays to i rays (wavelength 365 nm) and the heat resistance and color bleeding were similarly evaluated, and the results were equivalent to those obtained with KrF exposure.

Claims

1. A resin composition comprising a colorant and a resin, the colorant comprising a colorant A containing a cation having a dye structure and an anion represented by formula (1) or formula (2); In formula (1), R １１ and R １２ each independently represents a group represented by formula (3); ２１ ~R ２３ each independently represents a group represented by formula (3); In formula (3), * represents a bond; １０１ ~R １０３ each independently represents a hydrogen atom or a substituent; R １０１ ~R １０３ At least one of the groups contains an electron-withdrawing group that does not contain a fluorine atom.

2. The electron-withdrawing group not containing a fluorine atom is a nitro group, a cyano group, a -COR Ａ１ , -COOR Ａ１ , -CONR Ａ１ R Ａ２ , -S(=O)R Ａ１ R Ａ２ , -S(=O) ２ OR Ａ１ and -S(=O) ２ N.R. Ａ１ R Ａ２ and R Ａ１ and R Ａ２ The resin composition according to claim 1 , wherein each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, or a heteroaryl group.

3. The electron-withdrawing group not containing a fluorine atom is -COOR Ａ１ and R Ａ１ The resin composition according to claim 1 or 2, wherein represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, or a heteroaryl group.

4. The resin composition according to claim 1 or 2, wherein the cation having a dye structure is a cation having a polymethine dye structure, a diarylmethane dye structure, a triarylmethane dye structure, a xanthene dye structure, a dithienophosphorine dye structure, a squarylium dye structure or an iminium dye structure.

5. The resin composition according to claim 1 or 2, wherein the cation having a dye structure is a cation having a triarylmethane dye structure, a xanthene dye structure or an iminium dye structure.

6. The resin composition according to claim 1 or 2, wherein the coloring material further comprises a coloring material other than the coloring material A.

7. The resin composition according to claim 1 or 2, further comprising a polymerizable compound and a photopolymerization initiator.

8. A film obtained by using the resin composition according to claim 1 or 2.

9. An optical filter having the film according to claim 8.

10. A solid-state imaging device having the film according to claim 8.

11. An image display device comprising the film according to claim 8.

Images