Resin composition, resin film, prepreg, laminate board, printed wiring board, and semiconductor package

Abstract

The present invention provides a resin composition that can suppress the production of prepreg powder and can suppress an increase in minimum melt viscosity. The present invention also provides a resin film, a prepreg, a laminate board, a printed wiring board, and a semiconductor package which use the resin composition. The resin composition comprises a maleimide resin (A) and a block copolymer (B), wherein: the component (A) includes a maleimide resin (A1) that includes an indane skeleton and a maleimide resin (A2) that does not include an indane skeleton; the component (B) has a block (b1) that includes a structural unit which is derived from an aromatic hydrocarbon compound and a block (b2) that includes a structural unit which is derived from a conjugated diene compound; and the content of the block (b1) in the component (B) is not less than 15 mass%.

Description

Resin compositions, resin films, prepregs, laminates, printed wiring boards, and semiconductor packages

[0001] The present disclosure relates to a resin composition, a resin film, a prepreg, a laminate, a printed wiring board, and a semiconductor package.

[0002] Mobile communication devices such as mobile phones, their base station equipment, servers, routers, and other network infrastructure devices, and large-scale computers are increasingly using faster and larger-capacity signals. Accordingly, printed wiring boards used in these electronic devices must be compatible with higher frequencies, and substrate materials with low dielectric constants and low dielectric loss tangents (hereinafter, collectively referred to as "high-frequency characteristics") in high-frequency bands (e.g., 10 GHz or higher) that enable reduced transmission loss are in demand. In recent years, in addition to the electronic devices mentioned above, new systems using high-frequency wireless signals have been planned and put into practical use in the fields of intelligent transport systems (ITS) and indoor short-range communications. Therefore, it is expected that low-transmission-loss substrate materials will also be required for printed wiring boards used in these devices in the future.

[0003] Under these circumstances, a resin composition containing a specific polyphenylene ether derivative, a specific thermosetting resin, and a styrene-based thermoplastic elastomer (see Patent Document 1) has been proposed, with the objective of providing a resin composition that has particularly good compatibility and also has high-frequency characteristics, high adhesion to conductors, excellent heat resistance, a high glass transition temperature, low thermal expansion, and high flame retardancy.

[0004] International Publication No. 2016 / 175326

[0005] Prepregs containing a resin composition and a fiber substrate are cut to the desired size and then used to manufacture laminates. Prepregs manufactured using conventional resin compositions sometimes generate powder when cut. Furthermore, when cut prepregs are stacked and transported, or when stacked during laminate production, friction between prepregs can generate powder. If the generated powder adheres to the prepreg, it falls into the equipment when stacking prepregs to manufacture a laminate, causing contamination when manufacturing laminates using prepregs with different components. Furthermore, even if the powder adheres to the blade used during cutting, the powder also adheres when cutting prepregs with different components, which also causes contamination. Therefore, the entire production line, including the prepreg cutting equipment and the laminate production equipment, must be cleaned, reducing production efficiency.

[0006] As a result of intensive research, the present inventors have found that adding a specific component to a resin composition can suppress the generation of powder during cutting of the prepreg. However, in this case, the minimum melt viscosity of the prepreg increases, reducing its fluidity, which tends to result in poor wiring embeddability. Therefore, there is a need for the development of a resin composition that can suppress the generation of powder from the prepreg and also suppress an increase in the minimum melt viscosity.

[0007] In view of the current situation, the present disclosure aims to provide a resin composition that can suppress the generation of powder in prepregs and can suppress an increase in the minimum melt viscosity, as well as to provide resin films, prepregs, laminates, printed wiring boards, and semiconductor packages that use the resin composition.

[0008] As a result of extensive research, the present inventors have found that the resin composition of the present disclosure can achieve the above-mentioned object. The present disclosure includes the following embodiments [1] to

[14] . [1] A resin composition containing a maleimide resin (A) and a block copolymer (B), wherein the component (A) comprises a maleimide resin (A1) having an indane skeleton and a maleimide resin (A2) not having an indane skeleton, the component (B) has a block (b1) containing a structural unit derived from an aromatic hydrocarbon compound and a block (b2) containing a structural unit derived from a conjugated diene compound, and the content of the block (b1) in the component (B) is 15 mass% or more. [2] The resin composition according to the above [1], wherein the number-average molecular weight of the component (B) is 10,000 to 120,000. [3] The resin composition according to the above [1] or [2], wherein the molecular weight distribution (Mw / Mn) of the component (B) is 1.00 to 3.50. [4] The resin composition according to any one of [1] to [3] above, wherein the conjugated diene compound in the block (b2) is at least one selected from the group consisting of butadiene and isoprene. [5] The resin composition according to any one of [1] to [4] above, wherein the component (A2) is a maleimide resin represented by the following general formula (A2-1): (In the formula, X Ａ２－１ is a divalent hydrocarbon group having 1 to 20 carbon atoms (but not including an indane skeleton), and n Ａ２－１is an integer of 2 to 5.) [6] The resin composition according to any one of [1] to [5] above, wherein the content ratio ((A1) / (A2)) (mass ratio) of the (A1) component to the (A2) component is 10 / 90 to 90 / 10. [7] The resin composition according to any one of [1] to [6] above, further comprising a crosslinking agent (C). [8] The resin composition according to any one of [1] to [7] above, further comprising an inorganic filler (D). [9] The resin composition according to any one of [1] to [8] above, further comprising a curing accelerator (E).

[10] A resin film containing the resin composition according to any one of [1] to [9] above or a semi-cured product of the resin composition.

[11] A prepreg containing the resin composition according to any one of [1] to [9] above or a semi-cured product of the resin composition.

[12] A laminate having a cured product of the resin composition according to any one of [1] to [9] above and a metal foil.

[13] A printed wiring board having a cured product of the resin composition according to any one of [1] to [9] above.

[14] A semiconductor package having the printed wiring board according to

[13] above and a semiconductor element.

[0009] According to the present disclosure, it is possible to provide a resin composition that can suppress the generation of powder in prepregs and can suppress an increase in the minimum melt viscosity, and to provide a resin film, a prepreg, a laminate, a printed wiring board, and a semiconductor package that use the resin composition.

[0010] 1 is a photograph showing the state of the cutter when the evaluation of powder generation is A in an example; 2 is a photograph showing the state of the cutter when the evaluation of powder generation is B in a comparative example; and 3 is a photograph showing the state of the cutter when the evaluation of powder generation is C in a comparative example.

[0011] In the numerical ranges described in this disclosure, the upper or lower limit of the numerical range may be replaced with the values ​​shown in the examples. Furthermore, the lower and upper limits of a numerical range can be arbitrarily combined with the lower or upper limit of another numerical range. In the expression "AA to BB," the numerical values ​​AA and BB at both ends are included as the lower and upper limits, respectively, of the numerical range. In this disclosure, for example, the expression "10 or more" means 10 and a numerical value greater than 10, and this also applies when the numerical values ​​differ. Furthermore, for example, the expression "10 or less" means a numerical value less than 10 and a numerical value less than 10, and this also applies when the numerical values ​​differ. Furthermore, unless otherwise specified, each component and material exemplified in this disclosure may be used alone or in combination of two or more types. In this disclosure, when multiple substances corresponding to each component are present in the resin composition, the content of each component in the resin composition refers to the total amount of the multiple substances present in the resin composition, unless otherwise specified.

[0012] In the present disclosure, "resin component" refers to all components of the solid content constituting the resin composition, excluding inorganic compounds such as inorganic fillers, which will be described later. In the present disclosure, "solid content" refers to components other than the organic solvent, which will be described later, and components that are liquid at 25°C are also considered to be solid content. The expression "containing XX" described in the present disclosure means that if XX is reactive, XX is contained in a reacted state, or XX is simply contained. Any combination of the items described in the present disclosure is also included in the present disclosure and the present embodiment.

[0013] [Resin Composition] The resin composition of this embodiment is as follows: A resin composition containing a maleimide resin (A) and a block copolymer (B), wherein the component (A) contains a maleimide resin (A1) having an indane skeleton and a maleimide resin (A2) not having an indane skeleton, the component (B) has a block (b1) containing a structural unit derived from an aromatic hydrocarbon compound and a block (b2) containing a structural unit derived from a conjugated diene compound, and the content of the block (b1) in the component (B) is 15 mass% or more. Hereinafter, the components that may be contained in the resin composition of this embodiment will be described.

[0014] [Maleimide Resin (A)] The maleimide resin (A) includes a maleimide resin (A1) containing an indane skeleton and a maleimide resin (A2) not containing an indane skeleton.

[0015] (Maleimide Resin (A1) Having an Indane Skeleton) The indane skeleton contained in the component (A1) preferably has a divalent group represented by the following general formula (a1-1).

[0016] (In the formula, R ａ１ represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group, and n1 is an integer of 0 to 3. ａ２ ~R ａ４ are each independently an alkyl group having 1 to 10 carbon atoms. * represents a bonding site.

[0017] The component (A1) is preferably a bismaleimide resin. From the viewpoints of dielectric constant (Dk), adhesion to a conductor, heat resistance, and ease of production, the component (A1) containing a divalent group represented by the general formula (a1-1) is preferably a bismaleimide resin represented by the following general formula (a1-2):

[0018] (In the formula, R ａ１ ~R ａ４and n1 are the same as those in the general formula (a1-1). ａ５ are each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group; each n2 is independently an integer of 0 to 4, and n3 is a number of 0.95 to 10.0.

[0019] From the viewpoints of dielectric constant (Dk), adhesion to a conductor, solvent solubility, and ease of production, the bismaleimide resin represented by the general formula (a1-2) is more preferably a bismaleimide resin represented by the following general formula (a1-3) or a bismaleimide resin represented by the following general formula (a1-4):

[0020] (In the formula, R ａ１ ~R ａ５ and n1 and n3 are the same as those in the general formula (a1-2).

[0021] (In the formula, R ａ１ ~R ａ４ and n1 and n3 are the same as those in the general formula (a1-2).

[0022] There are no particular restrictions on the method for producing the component (A1), and known methods can be used in conjunction with or adapted from known methods.

[0023] The component (A1) may or may not be an addition reaction product with an amine compound such as a monoamine compound or a diamine compound. Examples of the monoamine compound include monoamine compounds having an acidic substituent, such as o-aminophenol, m-aminophenol, p-aminophenol, o-aminobenzoic acid, m-aminobenzoic acid, p-aminobenzoic acid, o-aminobenzenesulfonic acid, m-aminobenzenesulfonic acid, p-aminobenzenesulfonic acid, 3,5-dihydroxyaniline, and 3,5-dicarboxyaniline. Examples of the diamine compound include 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylethane, 4,4'-diaminodiphenylpropane, 2,2'-bis(4,4'-diaminodiphenyl)propane, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminodiphenylethane, 3,3'-diethyl-4,4'-diaminodiphenylethane, 4,4'-diaminodiphenylether, and 4,4'-diaminodiphenylthioe. aromatic diamine compounds in which an amino group is bonded to an aromatic hydrocarbon group, such as 2,2',6,6'-tetramethyl-4,4'-diaminodiphenylmethane, 3,3'-dichloro-4,4'-diaminodiphenylmethane, 3,3'-dibromo-4,4'-diaminodiphenylmethane, 2,2',6,6'-tetrachloro-4,4'-diaminodiphenylmethane, and 2,2',6,6'-tetrabromo-4,4'-diaminodiphenylmethane; siloxane diamines.

[0024] (Maleimide Resin (A2) Not Containing an Indane Skeleton) The component (A2) is not particularly limited as long as it does not contain an indane skeleton, and any maleimide resin other than the component (A1) can be used. The following description of the component (A2) is based on the assumption that it does not contain an indane skeleton, unless otherwise specified. The component (A2) is preferably at least one selected from the group consisting of maleimide resins having one or more (preferably two or more) N-substituted maleimide groups and derivatives thereof. The maleimide resin having one or more N-substituted maleimide groups is not particularly limited, and examples thereof include aromatic maleimide resins preferably having one N-substituted maleimide group bonded to an aromatic ring, such as N-phenylmaleimide, N-(2-methylphenyl)maleimide, N-(4-methylphenyl)maleimide, N-(2,6-dimethylphenyl)maleimide, N-(2,6-diethylphenyl)maleimide, N-(2-methoxyphenyl)maleimide, and N-benzylmaleimide; bis(4-maleimidophenyl)methane, bis(4-maleimidophenyl)ether, bis(4-maleimidophenyl)sulfone, and 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide. aromatic bismaleimide resins preferably having two N-substituted maleimide groups bonded to an aromatic ring, such as 4-methyl-1,3-phenylene bismaleimide, m-phenylene bismaleimide, and 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane; aromatic polymaleimide resins preferably having three or more N-substituted maleimide groups bonded to an aromatic ring, such as polyphenylmethane maleimide and biphenylaralkyl maleimide; and aliphatic maleimide resins such as N-dodecylmaleimide, N-isopropylmaleimide, N-cyclohexylmaleimide, 1,6-bismaleimide-(2,2,4-trimethyl)hexane, and pyrrolidine acid binder-type long-chain alkylbismaleimide.

[0025] As the component (A2), from the viewpoints of adhesion to a conductor and mechanical properties, a maleimide resin having two or more N-substituted maleimide groups is preferred, and an aromatic maleimide resin having two or more N-substituted maleimide groups is more preferred. Furthermore, from the viewpoints of heat resistance and flame retardancy, an aromatic maleimide resin having three or more N-substituted maleimide groups is even more preferred, and an aromatic polymaleimide resin having three or more N-substituted maleimide groups bonded to an aromatic ring is particularly preferred.

[0026] The aromatic maleimide resin having three or more N-substituted maleimide groups is more preferably a maleimide resin represented by the following general formula (A2-1):

[0027] (In the formula, X Ａ２－１ is a divalent hydrocarbon group having 1 to 20 carbon atoms (but not including an indane skeleton), and n Ａ２－１ is an integer from 2 to 5.

[0028] X in the general formula (A2-1) Ａ２－１ Examples of the divalent hydrocarbon group having 1 to 20 carbon atoms represented by the formula (A2-1) include divalent aliphatic hydrocarbon groups such as alkylene groups having 1 to 5 carbon atoms and alkylidene groups having 2 to 5 carbon atoms, and divalent hydrocarbon groups containing an aromatic hydrocarbon group represented by the following general formula (A2-2). However, in this embodiment, the divalent hydrocarbon group having 1 to 20 carbon atoms does not contain an indane skeleton. Examples of the alkylene group having 1 to 5 carbon atoms include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, and a 1,5-pentamethylene group. Examples of the alkylene group having 1 to 5 carbon atoms are preferably alkylene groups having 1 to 3 carbon atoms, more preferably alkylene groups having 1 or 2 carbon atoms, and even more preferably a methylene group. The alkylidene group having 2 to 5 carbon atoms is preferably an alkylidene group having 2 to 4 carbon atoms, more preferably an alkylidene group having 2 or 3 carbon atoms, and even more preferably an isopropylidene group.

[0029] (In the formula, Ar Ａ２－２ is a divalent aromatic hydrocarbon group, and X Ａ２－２ and X Ａ２－３are each independently a divalent aliphatic hydrocarbon group having 1 to 5 carbon atoms. * represents a bonding site.

[0030] X in the general formula (A2-2) Ａ２－２ and X Ａ２－３ The divalent aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by X in the general formula (A2-1) is Ａ２－１ Examples of the alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms mentioned above are as follows. Among these, a methylene group is preferred. Ａ２－２ Examples of the divalent aromatic hydrocarbon group represented by include a phenylene group, a naphthylene group, a biphenylene group, and an anthranylene group. Of these, a biphenylene group is preferred. Examples of the biphenylene group include a 4,2'-biphenylene group, a 4,3'-biphenylene group, a 4,4'-biphenylene group, and a 3,3'-biphenylene group, and of these, a 4,4'-biphenylene group is preferred.

[0031] Among the above options, X in the general formula (A2-1) Ａ２－１ is preferably a divalent hydrocarbon group containing an aromatic hydrocarbon group represented by the general formula (A2-2), and in the general formula (A2-2), X Ａ２－２ and X Ａ２－３ is a methylene group and Ar Ａ２－２ More preferably, the divalent hydrocarbon group is a 4,4'-biphenylene group.

[0032] n in the above general formula (A2-1) Ａ２－１ is an integer of 2 to 5, preferably an integer of 2 to 4, and more preferably 2 or 3.

[0033] Furthermore, examples of the maleimide resin derivatives include addition reaction products of the maleimide resin having one or more (preferably two or more) N-substituted maleimide groups with an amine compound such as a monoamine compound or a diamine compound. Examples of the monoamine compound and diamine compound include the same monoamine compounds and diamine compounds as those described in the description of component (A1).

[0034] (Content of Component (A)) The content of component (A) in the resin composition of the present embodiment is not particularly limited, but from the viewpoints of high-frequency characteristics, heat resistance, low thermal expansion, and moldability, it is preferably 20 to 90 parts by mass, more preferably 40 to 90 parts by mass, even more preferably 50 to 85 parts by mass, and particularly preferably 55 to 80 parts by mass, per 100 parts by mass of the resin component in the resin composition of the present embodiment.

[0035] (Ratio of Contents of Component (A1) and Component (A2)) The ratio of the content of the component (A1) to the content of the component (A2) [(A1) / (A2)] (mass ratio) is not particularly limited, but from the viewpoint of a balance between high-frequency characteristics, heat resistance, low thermal expansion, moldability, heat resistance, and flame retardancy, it is preferably 10 / 90 to 90 / 10, more preferably 30 / 70 to 90 / 10, even more preferably 50 / 50 to 90 / 10, particularly preferably 55 / 45 to 90 / 10, and most preferably 65 / 35 to 85 / 15.

[0036] [Block Copolymer (B)] The resin composition of this embodiment contains block copolymer (B), which can suppress the generation of powder when cutting a prepreg and when stacking and transporting the cut prepregs and when stacking them to produce a laminate. The block copolymer (B) has a block (b1) containing a structural unit derived from an aromatic hydrocarbon compound and a block (b2) containing a structural unit derived from a conjugated diene compound.

[0037] Examples of the aromatic vinyl compound in the structural unit derived from the aromatic hydrocarbon compound include styrene, α-methylstyrene, 2,4-dimethylstyrene, 1-vinylnaphthalene, 4-methoxystyrene, monochlorostyrene, divinylbenzene, etc. Among these, styrene is preferred.

[0038] In terms of high frequency characteristics, examples of the structural unit derived from the conjugated diene compound include 1,3-butadiene (hereinafter sometimes simply referred to as butadiene), isoprene, 1,3-pentadiene, 2,3-dimethyl-1,3-butadiene, 2-phenyl-1,3-butadiene, 1,3-hexadiene, etc. The conjugated diene compound is preferably one or more selected from the group consisting of butadiene and isoprene, more preferably contains butadiene, and even more preferably is butadiene.

[0039] The structural unit derived from the conjugated diene compound is not particularly limited, but examples thereof include a 1,2-bond unit of butadiene, a 1,4-bond unit of butadiene, a 3,4-bond unit of isoprene, a 1,4-bond unit of isoprene, and bond units obtained by hydrogenating these bond units. Specific examples of the hydrogenated bond units include, as shown in the structural formula below, a "butylene unit" which is a bond unit obtained by hydrogenating a 1,2-bond unit of butadiene, an "ethylene unit" which is a bond unit obtained by hydrogenating a 1,4-bond unit of butadiene (generally referred to as such in light of the structural unit enclosed in parentheses in the structural formula below. Note that the parentheses are for explanation purposes only and are not intended to separate the structural units), an "ethylene-butylene unit" which has both the butylene unit and the ethylene unit, an "isopentene unit" ("3-methyl-1-butene unit") which is a bond unit obtained by hydrogenating a 3,4-bond unit of isoprene, and an "ethylene-propylene unit" which is a bond unit obtained by hydrogenating a 1,4-bond unit of isoprene (generally referred to as such in light of the structural unit enclosed in parentheses in the structural formula below. Note that the parentheses are for explanation purposes only and are not intended to separate the structural units) (see the structural formula below).

[0040] From the viewpoint of high frequency characteristics, the structural unit derived from the conjugated diene compound is preferably a butylene unit, an ethylene unit, or an ethylene-butylene unit, more preferably an ethylene-butylene unit.

[0041] In the block (b1), the content of structural units derived from aromatic hydrocarbon compounds is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, particularly preferably 98% by mass or more, and may be 100% by mass. In the block (b2), the content of structural units derived from conjugated diene compounds is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, particularly preferably 98% by mass or more, and may be 100% by mass.

[0042] In this embodiment, by ensuring that the content of the block (b1) in the component (B) is 15% by mass or more, it is possible to suppress the generation of powder in the prepreg and to suppress an increase in the minimum melt viscosity. From the same perspective, the content of the block (b1) in the component (B) is preferably 18% by mass or more, more preferably 20% by mass or more, even more preferably 25% by mass or more, and particularly preferably 28% by mass or more. It may also be 30% by mass or more, or even 35% by mass or more. There is no particular upper limit to the content of the block (b1) in the component (B), but it may be 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 50% by mass or less, or 45% by mass or less. In other words, the content of the block (b1) in the component (B) may be 15 to 70% by mass, and the lower and upper limits of this numerical range can be changed according to the above explanation. In particular, when the content of the block (b1) in the component (B) is 15 to 35 mass %, and further when it is 25 to 35 mass %, the effect of reducing the minimum melt viscosity tends to be even greater.

[0043] There are no particular restrictions on the total content of "block (b1) including a structural unit derived from an aromatic hydrocarbon compound and block (b2) including a structural unit derived from a conjugated diene compound" in the component (B), and it may be 20% by mass or more, 40% by mass or more, 50% by mass or more, 80% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, or 100% by mass, based on the entire component (B).

[0044] In the component (B), when the block (b2) containing a structural unit derived from a conjugated diene compound is hydrogenated, the hydrogenation rate is preferably 70 mol% or more, more preferably 80 mol% or more, even more preferably 90 mol% or more, and particularly preferably 95 mol% or more. There is no particular upper limit to the hydrogenation rate, and it may be 100 mol% or less, or may be 99 mol% or less. In other words, the hydrogenation rate may be 70 to 100 mol%.

[0045] The number-average molecular weight of component (B) is not particularly limited, but is preferably 10,000 to 120,000, more preferably 30,000 to 110,000, even more preferably 50,000 to 100,000, particularly preferably 55,000 to 90,000, and most preferably 55,000 to 85,000. Having the number-average molecular weight of component (B) within this range tends to facilitate suppression of an increase in the minimum melt viscosity. The molecular weight distribution (Mw / Mn) of component (B) is not particularly limited, but is preferably 1.00 to 3.50, and may be 1.05 to 3.00, 1.05 to 2.00, 1.05 to 1.50, or 1.05 to 1.30. In the present disclosure, the weight average molecular weight (Mw) and number average molecular weight (Mn) are values ​​calculated from a calibration curve using standard polystyrene by gel permeation chromatography (GPC), and more specifically, are values ​​determined by the measurement method described in the Examples.

[0046] The component (B) may be modified with an acid anhydride such as maleic anhydride. The acid value of the acid-modified component (B) is not particularly limited, but is preferably 2 to 20 mg CH ３ ONa / g is preferred, 5 to 15 mg CH ３ ONa / g is more preferred, 7 to 13 mg CH ３ ONa / g is more preferred.

[0047] (Content of Component (B)) In the resin composition of this embodiment, the content of component (B) is not particularly limited, but is preferably 1 to 45 parts by mass, more preferably 3 to 35 parts by mass, and even more preferably 5 to 30 parts by mass, and may be 5 to 15 parts by mass, or may be 10 to 25 parts by mass, or may be 15 to 25 parts by mass, relative to 100 parts by mass of the resin components in the resin composition. When the content of component (B) is equal to or greater than the lower limit, high-frequency characteristics tend to be good and the generation of powder in the prepreg tends to be easily suppressed, while when the content is equal to or less than the upper limit, heat resistance, flame retardancy, etc. tend to be easily maintained.

[0048] [Crosslinking Agent (C)] The resin composition of this embodiment preferably further contains a crosslinking agent (C), mainly from the viewpoint of improving the compatibility between the (A) component and the (B) component. As the crosslinking agent (C), a compound having a structure derived from a maleimide skeleton and a structure derived from butadiene is preferred, and a compound having a structure derived from the (A1) component and a structure derived from butadiene is more preferred. The preferred aspects of the (A1) component in the structure derived from the (A1) component are the same as those explained above.

[0049] A compound having a structure derived from a maleimide skeleton and a structure derived from butadiene can be produced by reacting a maleimide resin with butadiene in the presence of an organic peroxide. Examples of the organic peroxide include, but are not limited to, benzoyl peroxide, dicumyl peroxide, methyl ethyl ketone peroxide, and t-butyl perbenzoate. The amount of the organic peroxide used is preferably 0.1 to 10 parts by mass per 100 parts by mass of the total amount of the maleimide resin and butadiene.

[0050] The butadiene used in the production of the compound having a structure derived from a maleimide skeleton and a structure derived from butadiene preferably has a number average molecular weight of 200 to 10,000, more preferably 500 to 5,000, even more preferably 500 to 2,500, and particularly preferably 800 to 2,000.

[0051] (Content of Component (C)) When the resin composition of the present embodiment contains component (C), the content of component (C) is not particularly limited, but is preferably 1 to 40 parts by mass, more preferably 3 to 35 parts by mass, even more preferably 5 to 30 parts by mass, and particularly preferably 5 to 25 parts by mass, per 100 parts by mass of the resin components in the resin composition. If the content of component (C) is at least the above-mentioned lower limit, the compatibility between components (A) and (B) tends to be good, and if it is at most the above-mentioned upper limit, it tends to be easier to maintain good heat resistance, flame retardancy, and the like.

[0052] [Inorganic Filler (D)] The resin composition of this embodiment further contains an inorganic filler (D), which tends to improve low thermal expansion, heat resistance, and flame retardancy. The (D) component is not particularly limited, but examples thereof include silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay (calcined clay, etc.), molybdenum compounds (zinc molybdate, etc.), talc, aluminum borate, and silicon carbide. One type of (D) component may be used alone, or two or more types may be used in combination. Among these, from the viewpoints of low thermal expansion, heat resistance, and flame retardancy, silica, alumina, mica, and talc are preferred, silica and alumina are more preferred, and silica is even more preferred. Examples of silica include crushed silica, fumed silica, and fused silica (fused spherical silica).

[0053] The shape and particle size of component (D) are not particularly limited, but the particle size is preferably 0.01 to 20 μm, more preferably 0.1 to 10 μm, even more preferably 0.2 to 1 μm, and particularly preferably 0.3 to 0.8 μm. Here, particle size refers to the average particle size, which is the particle size at the point corresponding to 50% volume when a cumulative frequency distribution curve of particle sizes is calculated, assuming the total volume of particles to be 100%. The particle size of component (D) can be measured using a particle size distribution analyzer using a laser diffraction scattering method.

[0054] (Content of Component (D)) When the resin composition of the present embodiment contains the component (D), the content of the component (D) is not particularly limited, but from the viewpoints of low thermal expansion, heat resistance, and flame retardancy, it is preferably 5 to 70 vol%, more preferably 15 to 60 vol%, even more preferably 20 to 55 vol%, and particularly preferably 25 to 50 vol%, relative to the total amount of solids in the resin composition.

[0055] Furthermore, in order to improve the dispersibility of component (D) and the adhesion between component (D) and the organic components in the resin composition, component (D) may be an inorganic filler that has been previously surface-treated with a coupling agent by dry or wet processing. The coupling agent is not particularly limited, and, for example, a silane coupling agent or a titanate coupling agent can be appropriately selected and used. One type of coupling agent may be used alone, or two or more types may be used in combination. The amount of coupling agent used is also not particularly limited. The coupling agent may be the coupling agent (G) described below.

[0056] When the component (D) is used in this embodiment, in order to improve the dispersibility of the component (D) in the resin composition, the component (D) may be used as a slurry in which the component (D) is dispersed in an organic solvent in advance, as necessary. Examples of the organic solvent include the same organic solvents as those described below.

[0057] <Curing Accelerator (E)> By further containing a curing accelerator (E), the resin composition of this embodiment tends to have improved curability and to obtain better high-frequency characteristics, heat resistance, adhesion to conductors, elastic modulus, and glass transition temperature. When the resin composition of this embodiment contains a curing accelerator (E), a suitable curing accelerator (E) may be appropriately selected depending on the type of thermosetting resin (B) component used. The curing accelerator (E) may be used alone or in combination of two or more types.

[0058] Examples of component (E) include amine-based curing accelerators, imidazole-based curing accelerators, phosphorus-based curing accelerators, organometallic salts, acidic catalysts, and organic peroxides. In this embodiment, imidazole-based curing accelerators are not classified as amine-based curing accelerators. Examples of amine-based curing accelerators include amine compounds having primary to tertiary amines, such as triethylamine, pyridine, tributylamine, dicyandiamide, and N-2-(aminoethyl)-3-aminopropyltrimethoxysilane; and quaternary ammonium compounds. Examples of imidazole-based curing accelerators include imidazole compounds such as methylimidazole, phenylimidazole, 2-undecylimidazole, and isocyanate-masked imidazole (e.g., an addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole). Examples of phosphorus-based curing accelerators include tertiary phosphines such as triphenylphosphine; and quaternary phosphonium compounds such as the addition product of p-benzoquinone and tri-n-butylphosphine. Examples of organic metal salts include carboxylates of manganese, cobalt, zinc, and the like. Examples of acidic catalysts include p-toluenesulfonic acid. Examples of organic peroxides include dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3,2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, and α,α'-di(t-butylperoxy)diisopropylbenzene. Among these, imidazole-based curing accelerators are preferred, and imidazole-based curing accelerators are more preferred, from the viewpoint of achieving superior high-frequency characteristics, heat resistance, adhesion to conductors, elastic modulus, and glass transition temperature. Furthermore, a preferred embodiment is the use of an imidazole-based curing accelerator in combination with an organic peroxide.

[0059] (Content of Component (E)) When the resin composition of the present embodiment contains the component (E), the content of the component (E) is not particularly limited, but is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 6 parts by mass, even more preferably 0.1 to 4 parts by mass, particularly preferably 0.5 to 4 parts by mass, most preferably 1.0 to 4 parts by mass, and may be 1.5 to 3.5 parts by mass, relative to 100 parts by mass of the total of the components (A) and (B). When the content of the component (E) is within the above range, the high-frequency characteristics, heat resistance, storage stability, and moldability tend to be good.

[0060] <Other Components> The resin composition of this embodiment may further contain one or more optional components, such as resin materials other than the above-mentioned components, flame retardants, flame retardant auxiliaries, coupling agents, antioxidants, heat stabilizers, antistatic agents, UV absorbers, pigments, colorants, and lubricants, as necessary. Each of the optional components may be used alone or in combination of two or more. Examples of resin materials other than the above-mentioned components include thermosetting resins other than maleimide resins. The thermosetting resin preferably contains one or more selected from the group consisting of epoxy resins, phenolic resins, polyimide resins, cyanate resins, isocyanate resins, benzoxazine resins, oxetane resins, amino resins, unsaturated polyester resins, allyl resins, dicyclopentadiene resins, silicone resins, triazine resins, and melamine resins.

[0061] When the resin composition of this embodiment contains the optional components, their contents are not particularly limited, and may be 0.01% by mass or more, 0.1% by mass or more, 0.5% by mass or more, or 30% by mass or less, 10% by mass or less, 5% by mass or less, or 1% by mass or less, relative to the total amount of the resin components. Furthermore, the resin composition of this embodiment may not contain the optional components, depending on the desired performance.

[0062] (Organic Solvent) The resin composition of this embodiment may be a resin composition containing an organic solvent, a so-called resin varnish, from the viewpoint of ease of handling and facilitating the production of the prepreg described below. Examples of the organic solvent include alcohol-based solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether-based solvents such as tetrahydrofuran; aromatic solvents such as toluene, xylene, and mesitylene; nitrogen-containing solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone; sulfur-containing solvents such as dimethyl sulfoxide; and ester-based solvents such as γ-butyrolactone. These organic solvents may be used alone or in combination of two or more.

[0063] When the resin composition of this embodiment contains an organic solvent, its content is not particularly limited, but is preferably an amount such that the solids concentration of the resin composition of this embodiment is 30 to 90% by mass, more preferably 40 to 80% by mass, and even more preferably 50 to 70% by mass. When the organic solvent content is within the above range, the resin composition is easy to handle, and the impregnation into the substrate and the appearance of the produced prepreg are good. Furthermore, this makes it easy to adjust the solids concentration of the resin in the prepreg, as described below, and tends to make it easier to produce a prepreg with a desired thickness.

[0064] <Minimum Melt Viscosity and Minimum Melt Temperature> The minimum melt viscosity when the resin composition of this embodiment is prepared into a test piece by the method described in the Examples below is not particularly limited, but is preferably 10,000 Pa s or less, and may be 1,000 to 10,000 Pa s, 3,000 to 10,000 Pa s, 4,000 to 9,000 Pa s, 4,000 to 8,000 Pa s, 4,000 to 7,000 Pa s, or 4,500 to 7,000 Pa s. The minimum melt temperature when the resin composition of this embodiment is prepared into a test piece by the method described in the Examples below is not particularly limited, but may be 100 to 140 ° C., 115 to 135 ° C., or 120 to 135 ° C.

[0065] The resin composition of this embodiment can be produced by mixing components (A) and (B) and, if necessary, other components, using a known method. In this process, each component may be dissolved or dispersed in the organic solvent while stirring. The mixing order, temperature, time, and other conditions are not particularly limited and can be set as desired.

[0066] [Resin Film] The resin film of this embodiment is a resin film containing the resin composition of this embodiment or a semi-cured product of the resin composition. The resin film of this embodiment can be produced, for example, by applying a resin composition containing an organic solvent, i.e., a resin varnish, to a support, drying it by heating, and semi-curing (B-staging) as needed. The thickness of the resin film is not particularly limited, but is preferably 1 to 100 μm, more preferably 3 to 70 μm, and even more preferably 5 to 35 μm. Examples of the support include plastic film, metal foil, and release paper. The drying temperature and drying time can be determined appropriately depending on the amount of organic solvent used, the boiling point of the organic solvent, and the like. However, a resin film can be suitably formed by drying at 50 to 200°C for about 1 to 10 minutes.

[0067] [Prepreg] The prepreg of this embodiment is a prepreg containing the resin composition of this embodiment or a semi-cured product of the resin composition. It can also be said that the prepreg of this embodiment is a prepreg containing one or more selected from the group consisting of the resin composition of this embodiment, a semi-cured product of the resin composition, the resin film of this embodiment, and a semi-cured product of the resin film. More specifically, the prepreg of this embodiment contains one or more selected from the group consisting of the resin composition of this embodiment, a semi-cured product of the resin composition, the resin film of this embodiment, and a semi-cured product of the resin film, and a sheet-like fiber substrate. The prepreg is formed using the resin composition of this embodiment or the resin film and a sheet-like fiber substrate. For example, the prepreg can be obtained by impregnating a sheet-like fiber substrate with the resin composition of this embodiment or the resin film of this embodiment, followed by heating and drying to semi-cure (B-staging) as necessary. More specifically, the prepreg of this embodiment can be produced by heating and drying in a drying oven, typically at 80 to 200°C for 1 to 30 minutes, to semi-cure (B-staging). In the present disclosure, "B-staging" refers to achieving the B-stage state defined in JIS K6900 (1994). The amount of resin composition used can be appropriately determined so that the solid content concentration derived from the resin composition in the prepreg after drying is 30 to 90% by mass. By setting the solid content concentration within the above range, better moldability tends to be obtained when the laminate is formed.

[0068] As the sheet-like fiber substrate for the prepreg, known materials used in various laminates for electrical insulating materials are used. Examples of materials for the sheet-like fiber substrate include inorganic fibers such as E-glass, D-glass, S-glass, and Q-glass; organic fibers such as polyimide, polyester, and tetrafluoroethylene; and mixtures thereof. These sheet-like fiber substrates have shapes such as woven fabric, nonwoven fabric, roving, chopped strand mat, and surfacing mat. The thickness of the sheet-like fiber substrate is not particularly limited, but may be 1 to 100 μm, 3 to 70 μm, 5 to 55 μm, 15 to 55 μm, or 25 to 55 μm.

[0069] [Laminate] The laminate of this embodiment is a laminate having a cured product of the resin composition of this embodiment and a metal foil. It can also be said that the laminate of this embodiment is a laminate having a metal foil and one or more selected from the group consisting of a cured product of the resin composition of this embodiment, a cured product of the resin film of this embodiment, and a cured product of the prepreg of this embodiment. An embodiment of the laminate of this embodiment can be produced, for example, by placing a metal foil on one or both sides of a single resin film of this embodiment, or by placing a metal foil on one or both sides of a laminate obtained by stacking two or more resin films of this embodiment, followed by hot-press molding. In the laminate obtained by this production method, the resin film of this embodiment is C-staged. Another embodiment of the laminate of this embodiment can be produced, for example, by placing a metal foil on one or both sides of a single prepreg of this embodiment, or by placing a metal foil on one or both sides of a laminate obtained by stacking two or more prepregs of this embodiment, followed by hot-press molding. In the laminate obtained by this production method, the prepreg of this embodiment is C-staged. In the present disclosure, C-staging refers to bringing the laminate to the C-stage state defined in JIS K6900 (1994). A laminate having a metal foil is sometimes referred to as a metal-clad laminate. The metal of the metal foil is not particularly limited, but from the viewpoint of electrical conductivity, it may be copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, or an alloy containing one or more of these metal elements. Copper and aluminum are preferred, and copper is more preferred. The method for carrying out the hot-press molding is not particularly limited, but examples include a method carried out under conditions of a temperature of 100 to 300°C, a pressure of 0.2 to 10 MPa, and a time of 0.1 to 5 hours. Furthermore, the hot-press molding can be carried out using a vacuum press or the like to maintain a vacuum state for 0.5 to 5 hours.

[0070] [Printed Wiring Board] The printed wiring board of this embodiment has a cured product of the resin composition of this embodiment. It can also be said that the printed wiring board of this embodiment is a printed wiring board having one or more materials selected from the group consisting of a cured product of the thermosetting resin composition of this embodiment, a cured product of the resin film of this embodiment, a cured product of the prepreg of this embodiment, and a laminate of this embodiment. The printed wiring board of this embodiment can be manufactured by performing circuit formation processing such as drilling, metal plating, and etching of metal foil using one or more materials selected from the group consisting of the prepreg of this embodiment, the resin film of this embodiment, and the laminate of this embodiment, using a known method. Furthermore, a multilayer printed wiring board can also be manufactured by further performing multilayer adhesive processing as necessary. In the printed wiring board of this embodiment, the prepreg of this embodiment and the resin film of this embodiment are C-staged.

[0071] [Semiconductor Package] The semiconductor package of this embodiment is a semiconductor package including the printed wiring board of this embodiment and a semiconductor element. The semiconductor package of this embodiment can be manufactured by mounting semiconductor elements such as semiconductor chips and memories at predetermined positions on the printed wiring board of this embodiment.

[0072] The resin composition, resin film, prepreg, laminate, printed wiring board, and semiconductor package of this embodiment can be suitably used in electronic devices that handle high-frequency signals of 10 GHz or more. In particular, the printed wiring board is useful as a printed wiring board for millimeter-wave radar.

[0073] Although preferred embodiments have been described above, these are merely examples for the purpose of explaining the present disclosure, and the scope of the present disclosure is not intended to be limited to these embodiments. The present disclosure also includes various aspects that differ from the above-described embodiments without departing from the gist of the present disclosure.

[0074] The present embodiment will be described in more detail below with reference to examples, although the present disclosure is not limited to the following examples.

[0075] In each example, the weight average molecular weight (Mw) and number average molecular weight (Mn) were measured by the following method. They were calculated by gel permeation chromatography (GPC) from a calibration curve using standard polystyrene. The calibration curve was approximated by a cubic equation using standard polystyrene: TSKstandard POLYSTYRENE (Types: A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation, trade name]. The GPC measurement conditions are shown below. Apparatus: Pump: L-6200 type [manufactured by Hitachi High-Technologies Corporation] Detector: L-3300 type RI [manufactured by Hitachi High-Technologies Corporation] Column oven: L-655A-52 [manufactured by Hitachi High-Technologies Corporation] Column: Guard column; TSK Guard column HHR-L + column; TSKgel G4000HHR + TSKgel G2000HHR (all product names manufactured by Tosoh Corporation) Column size: 6.0 x 40 mm (guard column), 7.8 x 300 mm (column) Eluent: tetrahydrofuran Sample concentration: 30 mg / 5 mL Injection volume: 20 μL Flow rate: 1.00 mL / min Measurement temperature: 40°C

[0076] [Production Example 1: Production of Maleimide-Modified Polybutadiene (Component (C))] 33.8 parts by mass of polybutadiene (1,2-polybutadiene homopolymer, number average molecular weight (Mn) 1,200, vinyl group content = 85 mol% or more), 1.43 parts by mass of maleimide resin (A1-1) described below, 0.0035 parts by mass of α,α'-bis(t-butylperoxy)diisopropylbenzene, and toluene as an organic solvent were placed in a 2 L glass flask equipped with a thermometer, a reflux condenser, and a stirrer. The mixture was then reacted under a nitrogen atmosphere at 90 to 100°C for 5 hours with stirring to obtain a maleimide-modified polybutadiene solution (solids concentration: 35% by mass). The number average molecular weight (Mn) of the resulting maleimide-modified polybutadiene was 2,000.

[0077] Furthermore, GPC was measured by the above-described method for a solution containing the polybutadiene and the maleimide resin (A1-1) before the start of the reaction, and for the solution after the reaction, to determine the peak areas derived from the maleimide resin before and after the reaction. Next, the vinyl group modification rate of the maleimide resin was calculated using the following formula. The vinyl group modification rate corresponds to the rate of decrease in the peak area derived from the maleimide resin due to the reaction. Vinyl group modification rate (%) = [(peak area derived from the maleimide resin before the start of the reaction) - (peak area derived from the maleimide resin after the reaction)] x 100 / (peak area derived from the maleimide resin before the start of the reaction). The vinyl group modification rate calculated using the above formula was 40%.

[0078] Examples 1 to 5, Comparative Examples 1 and 2 (Preparation of Resin Composition) Each component listed in Table 1 was stirred and mixed with toluene and methyl ethyl ketone at room temperature according to the formulation listed in Table 1 to prepare a resin composition (resin varnish) with a solid content concentration of 55 to 65% by mass. The numerical values ​​listed for the formulation in Table 1 are in parts by mass, and in the case of a solution or dispersion, they refer to parts by mass converted to solid content. (Preparation of Prepreg) The resin composition obtained above was applied to a 0.1 mm thick glass cloth and then heated and dried at 130°C for 5 minutes to produce a prepreg with a solid content concentration of approximately 50% by mass derived from the resin composition. (Preparation of Double-Sided Copper-Clad Laminate) Four sheets of this prepreg were stacked, and 12 μm thick copper foil (manufactured by Mitsui Kinzoku Co., Ltd., product name "3EC-M3-VLP-12", M surface (matte surface) Rz: 3.0 μm) was placed on top and bottom of the prepreg so that the M surface was in contact with the prepreg. This laminate was heated and pressurized at a temperature of 230° C. under a pressure of 3.0 MPa for 90 minutes to produce a double-sided copper-clad laminate (thickness: 0.41 mm).

[0079] [Evaluation Method] Measurements and evaluations were carried out according to the following methods. The results are shown in Table 1.

[0080] (1. Evaluation of Powder Generation) When the prepreg produced in each example was cut with a cutter, the blade and its surroundings were visually observed. When there was no powder adhering to the blade and its surroundings (see Figure 1), it was judged as "A", when there was little powder adhering to the blade and its surroundings (see Figure 2), it was judged as "B", and when there was a lot of powder adhering to the blade and its surroundings (see Figure 3), it was judged as "C". The color of the powder was yellow.

[0081] (2. Minimum Melt Viscosity and 3. Minimum Melt Temperature) The prepreg produced in each example was kneaded to obtain a resin powder. The obtained resin powder was heated at a constant heating rate, and the minimum melt viscosity and the temperature showing the minimum melt viscosity (minimum melt temperature) were measured. The details of the measurement method and conditions are as follows. Measurement sample: The resin powder was molded by uniaxial molding and adjusted to a thickness of 1 mm to obtain a measurement sample. Measurement conditions: Using the measurement sample, measurements were carried out using a DISCOVERY HR-2 (manufactured by TA Instruments Japan Co., Ltd.) under conditions of applying a constant pressure of 0.2 N in the temperature range of 30°C to 200°C at a heating rate of 4°C / min.

[0082]

[0083] The abbreviations for each material in Table 1 are as follows: [Maleimide Resin (A)] (A1) Maleimide resin containing an indane skeleton Maleimide resin (A1-1): Bismaleimide resin containing an indane skeleton (A2) Maleimide resin not containing an indane skeleton Maleimide resin (A2-1): Polymaleimide resin "MIR-3000" (manufactured by Nippon Kayaku Co., Ltd.), a compound represented by the general formula (A2-1) above, wherein X Ａ２－１ In the general formula (A2-2), X Ａ２－２ and X Ａ２－３ is a methylene group and Ar Ａ２－２ corresponds to a divalent hydrocarbon group which is a 4,4'-biphenylene group.

[0084] [Component (B)] SEBS (B'-1): SEBS "TUFTECH (registered trademark) H1221" (manufactured by Asahi Kasei Corporation), styrene content 12 mass%, number average molecular weight (Mn) = 155,000, Mw / Mn = 1.24 SEBS (B-2): SEBS "KRATON (registered trademark) MD1648", styrene content 20 mass%, number average molecular weight (Mn) = 67,500, Mw / Mn = 1.17 SEBS (B-3): maleic anhydride-modified SEBS "TUFTECH (registered trademark) M1913" (manufactured by Asahi Kasei Corporation), acid value 10 mg CH ３ ONa / g, styrene content 30%, number average molecular weight (Mn) = 62,100, Mw / Mn = 3.06 SEBS (B-4): SEBS "KRATON (registered trademark) MD1653", styrene content 31% by mass, number average molecular weight (Mn) = 72,100, Mw / Mn = 1.06・SEBS (B-5): SEBS "Tuftec (registered trademark) H1051" (manufactured by Asahi Kasei Corporation), styrene content 42% by mass, number average molecular weight (Mn) = 84,800, Mw / Mn = 1.10

[0085] [Component (C)] Crosslinking agent (C-1): maleimide-modified polybutadiene obtained in Production Example 1

[0086] [Component (D)] Silica (D-1): spherical fused silica, average particle size: 0.5 μm, 70 mass% slurry (solvent: methyl isobutyl ketone)

[0087] [Component (E)] Curing accelerator (E-1): α,α'-di(t-butylperoxy)diisopropylbenzene Curing accelerator (E-2): isocyanate-masked imidazole

[0088] As is clear from the results shown in Table 1, in Examples 1 to 5, the generation of prepreg powder was suppressed, and the minimum melt viscosity, which was previously difficult to achieve, was also reduced. On the other hand, in Comparative Example 1, which did not contain block copolymer (B), a large amount of prepreg powder was generated. Furthermore, in Comparative Example 2, which used a block copolymer in which the content of block (b1) containing structural units derived from an aromatic hydrocarbon compound was less than 15 mass%, a small amount of prepreg powder was generated and the minimum melt viscosity was significantly increased.

Claims

1. A resin composition containing a maleimide resin (A) and a block copolymer (B), wherein the (A) component contains a maleimide resin (A1) having an indane skeleton and a maleimide resin (A2) not having an indane skeleton, the (B) component has a block (b1) containing a structural unit derived from an aromatic hydrocarbon compound and a block (b2) containing a structural unit derived from a conjugated diene compound, and the content of the block (b1) in the (B) component is 15 mass% or more.

2. The resin composition according to claim 1, wherein the number average molecular weight of component (B) is 10,000 to 120,000.

3. The resin composition according to claim 1, wherein the molecular weight distribution (Mw / Mn) of component (B) is 1.00 to 3.

50.

4. The resin composition according to claim 1, wherein the conjugated diene compound in the block (b2) is at least one selected from the group consisting of butadiene and isoprene.

5. The resin composition according to claim 1, wherein the component (A2) is a maleimide resin represented by the following general formula (A2-1): (In the formula, X Ａ２－１ is a divalent hydrocarbon group having 1 to 20 carbon atoms (but not including an indane skeleton), Ａ２－１ is an integer from 2 to 5.

6. The resin composition according to claim 1, wherein the content ratio (A1) of the component (A1) to the content (A2) of the component (A2) [(A1) / (A2)] (mass ratio) is 10 / 90 to 90 / 10.

7. The resin composition according to claim 1, further comprising a crosslinking agent (C).

8. The resin composition according to claim 1, further comprising an inorganic filler (D).

9. The resin composition according to claim 1, further comprising a curing accelerator (E).

10. A resin film containing the resin composition according to claim 1 or a semi-cured product of said resin composition.

11. A prepreg containing the resin composition according to claim 1 or a semi-cured product of said resin composition.

12. A laminate comprising a cured product of the resin composition according to claim 1 and a metal foil.

13. A printed wiring board having a cured product of the resin composition according to claim 1.

14. A semiconductor package comprising the printed wiring board according to claim 13 and a semiconductor element.

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