Low pressure molding for display module retention and sealing

Abstract

An example computing device includes a display module comprising a glass cover and one or more components, wherein the one or more components include one or more attachment fittings that attach the display module to one or more other modules of the computing device. The computing device further includes a filling comprising resin molded around the one or more components and against a portion of an interior of the glass cover.

Description

LOW PRESSURE MOLDING FOR DISPLAY MODULE RETENTION ANDSEALINGTECHNICAL FIELD

[0001] This disclosure relates to computing devices, and, more specifically, to housings of computing devices.BACKGROUND

[0002] Computing devices, such as smartphones, laptops, wearable devices, and tablets, may include a housing to which a panel is attached. The computing devices may include one or more panels made of glass such as the backing on a phone and a glass panel that covers a display of the computing device. The panels can be attached to the computing device using strips of adhesive.SUMMARY

[0003] In general, aspects of this disclosure are directed towards a display module that includes a glass cover and one or more components with a filling molded against the one or more components and a portion of the interior of the glass cover. Devices may include display modules that are secured to the remainder of the device with adhesives or adhesive strips. While seeming the components within the display module, the use of adhesives or adhesive strips may introduce difficulties in both the design and repairability of the device. The adhesive strips may limit the space available for a display component such that an edge-to-edge display under a glass cover is not possible. In addition, a user or technician may find it challenging to separate a display module from the rest of the device and repair the device.

[0004] The techniques of this disclosure may allow for the assembly of components into a display module without requiring adhesives. For example, the device may include a resin filling that is low-pressure molded around the one or more components and the display module. In this way, the resin filling may hold together the display module and one or more other components. In addition, the filling may enable use of mechanical mounting components to secure the display module to the remainder of the device.

[0005] In one example, a computing device includes a display module comprising a glass cover and one or more components, wherein the one or more components include one or more attachment fittings that attach the display module to one or more other modules ofthe computing device; and a filling comprising resin molded around the one or more components and against a portion of an interior of the glass cover.

[0006] In another example, a method includes molding a filling against an interior of a glass cover and around one or more components, wherein the glass cover is part of a display module, and wherein the one or more components include one or more attachment fittings that attach the display module to one or more modules of a computing device; and attaching the display module to one or more modules of the computing device via the one or more attachment fittings.

[0007] The details of one or more examples are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the disclosure will be apparent from the description and drawings, and from the claims.BRIEF DESCRIPTION OF DRAWINGS

[0008] FIGS. IA-1C are views of a device having a resin attached display, in accordance with one or more aspects of this disclosure.

[0009] FIG. 2 is a side view schematic diagram illustrating a cross-section of a portion of a display module of a device that includes an antenna, in accordance with one or more aspects of this disclosure.

[0010] FIG. 3 is a side view schematic diagram illustrating a cross-section of a portion of a display module that includes an attachment component, in accordance with one or more aspects of this disclosure.

[0011] FIG. 4 is an isometric view of a portion of a display module of a device, in accordance with one or more aspects of this disclosure.

[0012] FIG. 5 is a flow chart illustrating a method of assembling a device, in accordance with one or more aspects of this disclosure.DETAILED DESCRIPTION

[0013] FIGS. 1A-1C are side views and a cross-section view of device 100, in accordance with one or more aspects of this disclosure. FIG. 1A illustrates a top view of device 100, FIG. IB illustrates a side view of device 100, and FIG. 1C illustrates a cross section view of a display module of device 100 along line A-A of FIG. IA. As shown, device 100 may include display module 110, band 120, housing 122, and back cover 124. Examples of device 100 may include computing devices such as smartwatches, tablets, smartphones,portable gaming devices, fitness trackers. Other examples of device 100 include automotive head units, laptop computing devices, and other computing devices that include a display. In the example of FIG. 1A, device 100 is illustrated as being a smartwatch.

[0014] Device 100 includes display module 110. Display module 110 may include a display, a cover over the display, and one or more other components such as a touch module, cameras, sensors, antennas, mounting components, lasers, and other components. Display module 110 may include multiple components such as a display, a cover, and one or more other components combined together to form a single module or assembly. Display module 110 may output a graphical user interface or other type of display via one or more components of display module 110. For example, display module 110 may display “9:21 am” as illustrated in FIG. 1A via a display panel within display module 110. Display module 110 may be attached to the remainder of device 100 (e.g., housing 122) by one or more types of attachment such as adhesives and mechanical mounting components. Display 110 includes cover 102, display 104, filling 106, antenna 108, and mounting component 112 (alternatively referred to as “attachment component” or “attachment components” throughout).

[0015] Device 100 includes band 120. Band 120 may be used to hold device 100 in place on the person of a user of device 100. For example, band 120 may secure device 100 against the wrist of a user. Band 120 may be comprised of one or more materials such as plastic, rubber, metal, and / or other materials.

[0016] Device 100 includes housing 122. Housing 122 may be a housing that contains one or more components of device 100. For example, housing 122 may contain components of device 100 such as batteries, processors, circuit boards, sensors such as accelerometers, haptic generators, communication components such as radios and modems, and other components of device 100. Housing 122 may be formed of one or more materials such as metals, plastics, rubber, ceramics, composites such as carbon fiber, and other materials. Housing 122 may include one or more channels and seals for securing display module 110 against housing 122 and sealing against water and dust intrusion. For example, housing 122 may include a channel that display module 110 partially slots into when installed. In another example, housing 122 includes an O-ring that protects against water and dust ingress between housing 122 and display module 110. In addition, housing 122 may include one or more attachment components for attaching band 120 to housing 122.

[0017] Housing 122 may include one or more mechanical mounting mechanisms for securing display module 110 to housing 122. Housing 122 may include one or more exterior holes for screws or bolts to be threaded through housing 122 and into a mounting mechanism of housing 122. In addition, housing 122 may include snaps or clips on the interior of housing 122 that enable securing of display module 110 to housing 122.

[0018] Device 100 includes back cover 124. Back cover 124 may be a cover that covers one or more components of device 100 and disposed on a side of device 100 opposite that of display module 110. Back cover 124 may be comprised of similar or different materials as housing 122 such as one or more metals, plastic, rubber, ceramics, composites, or other materials. Back cover 124 may include one or more components such as lasers, lights, thermal cameras, and other sensors. For example, back cover 124 may include one or more sensors for monitoring the health of a user wearing device 100.

[0019] As noted above, FIG. 1C illustrates device 100 as a cross-section of device 100 of FIG. 1A along the line label “A-A”. Further, FIG. 1C illustrates internal components of device 100 and display module 110.

[0020] Display module 110 includes cover 102. Cover 102 may be a cover over one or more components of display module 110 and be planar, curved, or a combination of both. Cover 102 may be curved along one or more edges of cover 102 and flat in a center region of cover 102. Cover 102 may be comprised of one or more transparent materials such as glass or plastic. In an example, cover 102 is a curved piece of glass in the shape of a dome. Cover 102 attaches to a smartwatch and covers a curved display of the smartwatch.

[0021] Display module 110 includes display 104. Display 104 may be one or more types of display such as LED, LCD, OLED, e-ink, or other types of display. Display 104 may be planar or curved. In some examples, display 102 may be flexible and foldable. Display 102 may be disposed against or adjacent to cover 104. Display 102 may extend to the edges of the interior side of cover 102.

[0022] Display module 110 includes antenna 108. Antenna 108 may be one or more types of antennas such as an RF, UWB, WIFI, BLUETOOTH, GPS, or other types of antennas. Antenna 108 may include multiple antennas, where each antenna provides wireless connectivity for a particular type of communication (e.g., WIFI). Antenna 108 may be partially or completely contained within a resin filling such as filling 106 or attached to display module 110 using adhesives.

[0023] In some examples, display module 110 may include adhesives such as adhesive strips that attach display module 110 to housing 122 of device 100 and that adhere one or more components such as antenna 108 to display 104. For example, antenna 108C may be attached to display 104 and / or cover 102 via one or more adhesive strips. Further, display module 110 may be attached to housing 122 of device 100 via one or more strips of adhesive.

[0024] Display module 110, when attached to housing 122 of device 100 via adhesives or when components are attached to display module 110 using adhesive strips, may not enable easy repair of device 100 or display module 110 and may restrict design of device 100. As one example, when display module 110 is attached to housing 122 of device 100 using adhesive strips, display module 110 may require a user to apply heat and a cutting tool to remove display module 110 from the remainder of device 100. In another example, when a component is attached to display module 110 using adhesive strips such as antenna 108, it may be challenging for a user to remove antenna 108 without damaging antenna 108 due to the delicate nature of antenna 108. In yet another example, adhesive strips located along an edge of cover 102 may prevent display 104 from extending to the edges of cover 102 due to the space occupied by the adhesive strips.

[0025] In accordance with one or more aspects of this disclosure, one or more components of display module 110 may be attached to display module 110 via filling 106. Filling 106 may be resin or other types of material used to fill in the space between cover 102, display 104, mounting component 112, and other components and to adhere the components together. Filling 106 may be low pressure molded into display module 110. For example, during manufacture of display module 110, a manufacturer may mold filling 106 into one or more spaces of display module 110 to secure the components of display module 110 together. Filling 106 may be molded against display module 110 using low pressure molding to avoid damaging one or more components of display module 110 (e.g., antenna 108 may be sufficiently delicate that higher-pressure molding would cause antenna 108 to deform).

[0026] Filling 106 may provide structural integrity for one or more components of display module 110. Filing 106 may provide a comparatively large bond area for one or more components in comparison to adhesive strips. For example, filling 106, due to being molded around one or more sides of a component such as antenna 108, may provide a large surface area of adhesion for antenna 108. Filling 106 may secure mounting component 112 to the remainder of display module 110 (e.g., filling 106 may provideanchorage for mounting component 112). In addition, filling 106 may be molded around one or more components such as mounting component 112 using low-pressure molding to enable secure retention of the one or more components while avoiding damage to the components during the molding process. Due to the low pressure used to mold filling 106, filling 106 avoids deforming and damaging components of display module 110 during the molding process, whereas high-pressure molding could result in the deformation of delicate components due to the comparatively higher amounts of force applied.

[0027] Display module 110 includes mounting component 112. In some examples, display module 110 may include one or more mounting components such as mounting component 112. Mounting component 112 may be one or more types of mechanical mounting components such as clips, snaps, threads, and screws, among other types of mechanical mounting components. Mounting component 112 may mechanically attach to one or more components of a device and secure display component 110 to the remainder of device 100 such as housing 122.

[0028] As shown in FIG. 1C, housing 122 may include fastener 114. Examples of fastener 114 include, but are not necessarily limited to, screws, bolts, pins, clips, and the like. Fastener 114 may be inserted into mounting component 112 to secure display module 110 to the remainder of device 100. For example, mounting component 112 may enable a fastener such as fastener 114 to thread into the threads of mounting component 112 and resist the separation of display module 110 from housing 122.

[0029] The techniques of this disclosure provide one or more technical advantages. For example, instead of requiring display module 110 to be attached to a device via adhesives or adhesive strips that make it challenging to remove display module 110 without damaging one or more components of display module 110, the molding of one or more components in filling 106 enables easier removal and repairability as no adhesives are used to attach display module 110 to a computing device. Further, the use of filling 106 may obviate the need for careful application of heat and prying to remove display module 110 from a device. In another example, the use of filling 106 and mechanical mounting components such as mounting component 112 to attach display module 110 to a device may enable display 104 to extend to the edges of cover 102 due to no longer requiring space along the edges of cover 102 for adhesive stripes. In yet another example, as filling 106 may provide structural integrity between one or more mounting components and display module 110, the one or more mounting components do not need to be made ofmetal. Display module 110, due to the non-metallic composition of the mounting components, may provide improved performance for antenna 108.

[0030] FIG. 2 is a side view schematic illustrating a cross-section of a portion of a display module 210 of a device that includes an antenna, in accordance with one or more aspects of this disclosure. Display module 210 may be substantially similar to display module 110 as illustrated in FIGS. 1A-1C. Display module 210 includes cover 202, display 204, filling 206, antenna 208, and component stack 216.

[0031] Cover 202 may be a cover over one or more components of display module 210. Cover 202 may be substantially similar to cover 102 as illustrated in FIG. 1C and be comprised of similar materials. For example, cover 202 may be comprised of glass and provide a cover over one or more components of a device not contained within a housing of the device.

[0032] One or more components may be molded against an interior side of cover 202. Display module 210 may include a display such as display 204. Display 204 may be one or more types of display such as a liquid crystal display (LCD), light emitting diode (LED) display, organic LED (OLED) display, mini-LED display, or other type of display. Display 204 may curve along a side of cover 202 rather than be a flat component placed against a planar side of cover 202. In the example of FIG. 2, display 204 extends along an interior side of cover 202 to the edges of cover 202. Display 204 may be secured against cover 202 by one or more components such as filling 206. In addition, display 204 may be adhered to cover 202 via one or more adhesives such as optically clear adhesives.

[0033] Display module 210 includes filling 206. Filling 206 may be one or more types of filling such as resin that is low-pressure molded into place. Filling 206 may secure one or more components of display module 210 in place and prevent unwanted movement or dislodgement of the components of display module 210. For example, filling 206 may prevent display 204 from becoming detached from cover 202. Filling 206 may provide consistent pressure against a side of display 204 and hold display 204 against cover 202. In some examples, a manufacturer may place display 204 against an interior side of cover 202 and mold filling 206 against display 204 to hold display 204 against cover 202. Filling 206 may be molded to cover the entirety of the interior of cover 202 that is not occupied by other components. For example, filling 206 may occupy the entirety of an interior space between cover 202 and the remainder of an attached device that is not otherwise occupied by other components such as display 204.

[0034] Filling 206 may secure one or more other components within display module 210. Filling 206 may secure one or more components such as antenna 208 and component stack 216. Antenna 208 may include one or more types of antennas for types of wireless transmission such as WIFI, BLUETOOTH, UWB, NFC, and other types of antennas for wireless signals. Component stack 216 may include one or more components such as the touch components, display backlights, charging coils, and other components. Component stack 216 may be disposed between display 204 and one or more other components of display module 210 such as antenna 208.

[0035] Filling 206 may secure the components by applying pressure against the one or more components and resisting the movement of the components. Filling 206 may secure component stack 216 in place by resisting the movement of component stack with respect to the remainder of display module 210. In another example, filling 206 secures antenna 208 by enveloping one or more sides of antenna 208 and prevents antenna 208 from moving with respect to the remainder of display module 210.

[0036] Filling 206 may secure one or more components of display module 210 without damaging the one or more components. A manufacturer or assembler of display module 210 may apply filling 206 using low-pressure molding. The manufacturer or assembler may apply filling 206 using low-pressure molding to avoid damaging delicate components such as antenna 208. For example, when molded into display module 210, filling 206 envelops antenna 208 without applying sufficient pressure to deform antenna 208.

[0037] Filling 206 may include a space such as gland 218 (indicated by the dashed circle in FIG. 2). Gland 218 may be a space left in the volume occupied by filling 206. In some examples, gland 218 may be formed with an edge, channel, tab, or other shape to enable placement of other components within gland 218. A manufacturer of display module 210 may cause filling 206, during the molding process, to leave a space such as gland 218. Gland 218 may provide space for an O-ring or other seal between display module 210 and a device such as device 100 as illustrated in FIG. 1 . In an example, an assembler of display module 210 performs the molding process of molding filling 206 into the components of display module 210. The assembler molds filling 206 into display module 210 such that a space is left for gland 218. Gland 218 provides a seat for an O-ring between display module 210 and a device. In another example, an assembler assembles display module 210 into a device and uses the space of gland 218 to install an O-ring between display module 210 and the device.

[0038] FIG. 3 is a side view schematic diagram illustrating a cross-section of a portion of a display module 310 that includes an attachment component 314, in accordance with one or more aspects of this disclosure. Display module 310 may be similar to display module 110 as illustrated in FIG. 1C and display module 210 as illustrated in FIG. 2. Display module 310 includes cover 302, display 304, filling 306, antenna 308, mounting component 312, and component stack 316.

[0039] Display module 310 includes filling 306. Filling 306 may include one or more types of filling such as resin and be similar to filling 106 as illustrated in FIG. 1C and filling 206 as illustrated in FIG. 2. Filling 306 may be low-pressure molded around one or more components of display module 310 such as display 304 and attachment component 312.

[0040] Display module 310 includes mounting component 312. Mounting component 312 may be made of one or more materials such as plastic, composites such as carbon fiber, metal, and other materials. In some examples, mounting component 312 may be composed of non-metallic materials to avoid reducing the performance of antenna 308 (e.g., mounting component 312 may be composed of non-conductive materials to avoid impacting the performance of antenna 308). Mounting component 312 may be one or more types of mechanical attachment such as a snap, a bracket with thread for a screw, a clip, or another type of attachment mechanism. Mounting component 312 may enable the seeming of display module 310 to a device without requiring the use of adhesives or adhesive strips. In an example, mounting component 312 is a clip that snaps into a corresponding component of a deGee. Mounting component 312 securely fastens display module 310 to the deGee without requiring the use of adhesives. In addition, mounting component 312 may reduce the difficulty of removing display module 310 from the device during repair work by eliminating the need for the application of heat and sharp instruments to remove adhesives.

[0041] Filling 306 may secure mounting component 312 to the remainder of display module 310. Filling 306 may secure mounting component 312 through adhesion to one or more sides of mounting component 312 during the molding process. In addition, filling 306 may enable securing of mounting component 312 through adhesion to multiple sides of mounting component 312. By way of adhesion to multiple sides of mounting component 312, filling 306 may securely connect the components of display component 310 to a device via mounting component 312.

[0042] FIG. 4 is an isometric view of a portion of a display module 410 of a device, in accordance with one or more aspects of this disclosure. Display module 410 may be similar to display module 110 as illustrated in FIG. 1C, display module 210 as illustrated in FIG. 2, or display module 310 as illustrated in FIG. 3. Display module 410 includes cover 402, display 404, filling 406, antenna 408, and component stack 416.

[0043] Display module 410 includes cover 402 and display 404. Cover 402 may be a transparent cover over one or more components of display module 410. Cover 402 may be comprised of one or more transparent materials such as plastic, acrylic, glass, or other transparent materials such as transparent ceramic. Cover 402 may include one or more coatings applied to one or more sides of cover 402. For example, cover 402 may include anti-reflective and anti-abrasion coatings on the sides of cover 402 opposite that of the side of cover 402 facing the remainder of the device that display module 410 is attached to.

[0044] Cover 402 may cover display 404. Display 404 may be one or more types of display such as LCD, LED, OLED, mini-LED, or another type of display. Display 404 may be disposed against an interior side of cover 402 (e.g., the side facing the device to which display module 410 is attached). In some examples, display 404 may curve along an interior side of cover 402. In an example, display 404 may be a flexible display and extend along a curved interior side of cover 402 to the edge of the interior side of cover 402. Display 404, when display module 410 is installed in a device, may provide an edge- to-edge display for the device (e.g., display 404 visually appears to extend to the edges of cover 402).

[0045] Display module 410 includes filling 406. Filling 406 may be resin or another type of moldable material that is low-pressure molded around one or more components of display module 410. Filling 406 may envelop one or more sides of the components of display module 410 and secure the components in place. For example, filling 406 may secure display 404 against cover 402 through resisting and dampening any movement by display 404 (e.g., display module 410 experiences an impact and filling 406 dampens the impact and prevents display 404 from moving).

[0046] Display module 410 includes antenna 408. Antenna 408 may include one or more types of antennas and be similar to antenna 108 as illustrated in FIG. 1C, antenna 208 as illustrated in FIG. 2, or antenna 308 as illustrated in FIG. 3. Filling 406 may partially or completely envelop antenna 408 and secure antenna 408 within display module 410. A manufacturer or assembler of display module 410 may use low-pressure molding whenapplying filling 406 to avoid deforming or damaging the delicate components of antenna 408 or other delicate components of display module 410 such as component stack 416.

[0047] Display module 410 includes component stack 416. Component stack 416 may be similar to component stack 216 as illustrated in FIG. 2 or component stack 316 as illustrated in FIG. 3. Component stack 416 may include one or more components such as touch modules, display backlights, infrared lights / laser, infrared sensors, cameras, and other components layered between display 404 and other components of display module 410. One or more components of component stack 416 may be enveloped on one or more sides by filling 406. In addition, filling 406 may secure the one or more components of component stack 416 in place.

[0048] FIG. 5 is a flow chart illustrating a method of assembling a device, in accordance with one or more aspects of this disclosure. For the purposes of clarity, FIG. 5 is described in reference to FIGS. 1A-1C.

[0049] An assembler or manufacturer (hereinafter referred to as “manufacturer”) may mold a filling, such as filling 106, against an interior of a glass cover, such as cover 104, and around one or more components including one or more attachment fittings, such as mounting component 112 (502). As noted above, cover 104 may be part of a display module, such as display module 110. Similarly, the one or more attachment fittings, such as mounting component 112, may provide a mechanism to attach display module 110 to one or more modules of a computing device such as device 100. The assembler may mold filling 106 using low pressure molding. Such low-pressure molding may help to avoid damaging one or more delicate components of display module 110. For example, the assembler may use low pressure molding to avoid deforming an antenna that has a large surface area and that may be easily deformed.

[0050] Tire assembler may attach display module 110 to one or more modules of device 100 via mounting component 112 (502). The assembler may attach display module 110 using a fastener such as fastener 114 to secure display module 110 to the remainder of device 100, such as housing 122. For example, the assembler may thread a screw into mounting component 112 to secure display module 110 to housing 122.

[0051] Example 1: A computing device includes a display module comprising a glass cover and one or more components, wherein the one or more components include one or more attachment fittings that attach the display module to one or more other modules of the computing device; and a filling comprising resin molded around the one or more components and against a portion of an interior of the glass cover.

[0052] Example 2: The computing device of example 1, wherein the resin is low pressured molded around the one or more components.

[0053] Example 3: The computing device of any of examples 1-2, wherein the one or more components include an antenna, and wherein the resin is molded around the antenna to prevent deformation of the antenna.

[0054] Example 4: The computing device of example 3, wherein the antenna is disposed against a side of the display module opposite that of a side of the glass cover.

[0055] Example 5: The computing device of any of examples 1-4, wherein the one or more attachment fittings include one or more components for mechanical mounting.

[0056] Example 6: The computing device of any of examples 1-5, wherein the display module is removable from a remainder of the computing device without breaking one or more pieces of adhesive disposed between the glass cover and the remainder of the computing device.

[0057] Example 7: The computing device of any of examples 1-6, wherein the computing device further inclu des an O-ring disposed around a portion of the filling.

[0058] Example 8: The computing device of example 7, wherein the filling is molded with one or more channels to provide a seat for the O-ring.

[0059] Example 9: The computing device of any of examples 1-8, wherein the filling extends to cover an entirety of the interior of the glass cover.

[0060] Example 10: The computing device of any of examples 1-9, wherein a display component is laminated to the glass cover with optically clear adhesive prior to the molding of the resin.

[0061] Example 11: A method includes molding a filling against an interior of a glass cover and around one or more components, wherein the glass cover is part of a display module, and wherein the one or more components include one or more attachment fittings that attach the display module to one or more modules of a computing device; and attaching the display module to one or more modules of the computing device via the one or more attachment fittings.

[0062] Example 12 : The method of example 11, wherein molding the filling further comprises low-pressure molding the filling against the interior of the glass cover and around the one or more components.

[0063] Example 13: The method of any of examples 11-12, wherein the one or more components include an antenna, and wherein molding further comprises: molding the filling around the antenna to prevent deformation of the antenna.

[0064] Example 14: The method of example 13, wherein the antenna is disposed against a side of the display module opposite that of a side of the glass cover.

[0065] Example 15: The method of any of examples 11-14, wherein the one or more attachment fittings include one or more components for mechanical mounting.

[0066] Example 16: The method of any of examples 11-15, wherein the glass cover is removable from a remainder of the computing device without breaking one or more pieces of adhesive disposed between the glass cover and the remainder of the computing device.

[0067] Example 17: The method of any of examples 11-16, wherein the computing device includes an O-ring disposed around a portion of the filling.

[0068] Example 18: The method of example 17, wherein molding the filling against an interior of the glass cover and around the one or more components further comprises: molding the filling with one or more channels to provide a seat for the O-ring.

[0069] Example 19: The method of example of any of examples 11-18, wherein the filling extends to cover an entirety of an interior of the glass cover.

[0070] Example 20: The method of any of examples 11-19, further includes laminating a display component to the glass cover with optically clear adhesive.

[0071] Various aspects have been described in this disclosure. These and other aspects are within the scope of the following claims.

Claims

CLAIMS:What is claimed is:

1. A computing device comprising: a display module comprising a glass cover and one or more components, wherein the one or more components include one or more attachment fittings that attach the display module to one or more other modules of the computing device; and a filling comprising resin molded around the one or more components and against a portion of an interior of the glass cover.

2. The computing device of claim 1, wherein the resin is low pressured molded around the one or more components.

3. The computing device of any of claims 1 -2, wherein the one or more components include an antenna, and wherein the resin is molded around the antenna to prevent deformation of the antenna.

4. The computing device of claim 3, wherein the antenna is disposed against a side of the display module opposite that of a side of the glass cover.

5. The computing device of any of claims 1-4, wherein the one or more attachment fittings include one or more components for mechanical mounting.

6. The computing device of any of claims 1-5, wherein the display module is removable from a remainder of the computing device without breaking one or more pieces of adhesive disposed between the glass cover and the remainder of the computing device.

7. The computing device of any of claims 1-6, wherein the computing device further includes an O-ring disposed around a portion of the filling.

8. The computing device of claim 7, wherein the filling is molded with one or more channels to provide a seat for the O-ring.

9. The computing device of any of claims 1-8, wherein the filling extends to cover an entirety of the interior of the glass cover.

10. The computing device of any of claims 1-9, wherein a display component is laminated to the glass cover with optically clear adhesive prior to the molding of the resin.

11. A method, comprising: molding a filling against an interior of a glass cover and around one or more components, wherein the glass cover is part of a display module, and wherein the one or more components include one or more attachment fittings that attach the display module to one or more modules of a computing device; and attaching the display module to one or more modules of the computing device via the one or more attachment fittings.

12. The method of claim 11 , wherein molding the filling further comprises low- pressure molding the filling against the interior of the glass cover and around the one or more components.

13. The method of any of claims 11-12, wherein the one or more components include an antenna, and wherein molding further comprises: molding the filling around the antenna to prevent deformation of the antenna.

14. The method of claim 13, wherein the antenna is disposed against a side of the display module opposite that of a side of the glass cover.

15. The method of any of claims 11-14, wherein the one or more attachment fittings include one or more components for mechanical mounting.

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