RF-integrated hinge for mobile electronic devices

Abstract

A system may include a first hinge element and a second hinge element that is dimensioned to align with the first hinge element. The system may also include a first conducting element dimensioned to run through at least a portion of the first hinge element. The first conducting element may be electrically connected to various electronic components. The system may further include a second conducting element dimensioned to run through at least a portion of the second hinge element. The second conducting element may be dimensioned to at least partially surround the first conducting element and may be configured to rotate around the first conducting element. Various other mobile electronic devices and apparatuses are also disclosed.

Description

RF-INTEGRATED HINGE FOR MOBILE ELECTRONIC DEVICESCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims benefit of and priority to U.S. Non-provisional Patent Application Ser. No. 18 / 391,052 filed December 20, 2023.SUMMARY OF THE INVENTION

[0002] According to the present invention there is provided a system comprising: a first hinge element; a second hinge element that is dimensioned to align with the first hinge element; a first conducting element dimensioned to run through at least a portion of the first hinge element, wherein the first conducting element is electrically connected to one or more electronic components; and a second conducting element dimensioned to run through at least a portion of the second hinge element and dimensioned to at least partially surround the first conducting element, wherein the second conducting element is configured to rotate around the first conducting element.

[0003] Optionally, a first portion of the first conducting element runs horizontally through an insulating layer and a second portion of the first conducting element runs vertically underneath the second conducting element.

[0004] Optionally a first portion of the second conducting element runs horizontally through a second insulating layer and a second portion of the second conducting element runs vertically over the first conducting element.

[0005] Optionally the second conducting element that at least partially surrounds the first conducting element directly touches at least a portion of the first conducting element.

[0006] Optionally a dielectric layer is positioned between the first conducting element and the second conducting element, such that the first conducting element and the second conducting element transfer electromagnetic signals and / or electromagnetic power via capacitive coupling.

[0007] Optionally, the second conducting element is electrically connected to one or more different electronic components.

[0008] Optionally the first and second hinge elements are made of electrically conductive materials, and electromagnetic signals and / or electromagnetic power are transferred through the first and second hinge elements.

[0009] Optionally the first hinge element includes an extended portion that ispositioned to directly touch an extended portion of the hinge element, and the extended portions pivot about the first and second conducting elements.

[0010] Optionally the first hinge element includes an extended portion that is dimensioned to align with an extended portion of the second hinge element, and a dielectric layer is positioned between the extended portions of the first and second hinge elements.

[0011] Optionally the extended portions of the first and second hinge elements are positioned to pivot about the first and second conducting elements.

[0012] Optionally the extended portions of the first and second hinge elements include disk-shaped regions that align with each other and that allow rotation of the first and second hinge elements relative to each other.

[0013] Optionally the first and second hinge elements each include a plurality of extended portions that are dimensioned to overlap each other and to pivot relative to each other.

[0014] According to the present invention there is further provided a mobile electronic device comprising: a first hinge element; a second hinge element that is dimensioned to align with the first hinge element; a first conducting element dimensioned to run through at least a portion of the first hinge element, wherein the first conducting element is electrically connected to one or more electronic components; and a second conducting element dimensioned to run through at least a portion of the second hinge element and dimensioned to at least partially surround the first conducting element, wherein the second conducting element is configured to rotate around the first conducting element.

[0015] Optionally, a first portion of the first conducting element of the mobile electronic device runs horizontally through an insulating layer and a second portion of the first conducting element runs vertically underneath the second conducting element.

[0016] Optionally a first portion of the second conducting element of the mobile electronic device runs horizontally through a second insulating layer and a second portion of the second conducting element runs vertically over the first conducting element.

[0017] Optionally the second conducting element that at least partially surrounds the first conducting element directly touches at least a portion of the first conducting element.

[0018] Optionally a dielectric layer is positioned between the first conductingelement and the second conducting element of the mobile electronic device, such that the first conducting element and the second conducting element transfer electromagnetic signals and / or electromagnetic power via capacitive coupling.

[0019] Optionally the first and second hinge elements of the mobile electronic device are made of electrically conductive materials, and electromagnetic signals and / or electromagnetic power are transferred through the first and second hinge elements.

[0020] Optionally the first hinge element of the mobile electronic device includes an extended portion that is positioned to directly touch an extended portion of the second hinge element of the mobile electronic device, and the extended portions pivot about the first and second conducting elements.

[0021] According to the present invention there is yet further provided an apparatus comprising: a first hinge element; a second hinge element that is dimensioned to align with the first hinge element; a first conducting element dimensioned to run through at least a portion of the first hinge element, wherein the first conducting element is electrically connected to one or more electronic components; and a second conducting element dimensioned to run through at least a portion of the second hinge element and dimensioned to at least partially surround the first conducting element, wherein the second conducting element is configured to rotate around the first conducting element.BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings illustrate a number of exemplary embodiments and are a part of the specification. Together with the following description, these drawings demonstrate and explain various principles of the present disclosure.

[0023] FIGS. 1A and IB illustrate embodiments of a conducting hinge that may be implemented within mobile electronic devices.

[0024] FIGS. 2A and 2B illustrate alternative embodiments of a conducting hinge that may be implemented within mobile electronic devices.

[0025] FIGS. 3A and 3B illustrate alternative embodiments of a conducting hinge that may be implemented within mobile electronic devices.

[0026] FIGS. 4A-4D illustrate alternative embodiments of a conducting hinge that may be implemented within mobile electronic devices.

[0027] FIGS. 5A-5C illustrate embodiments of antenna performance charts that correspond to various conductive hinge embodiments described herein.

[0028] FIG. 6 illustrates a pair of augmented reality (AR) glasses that implement the conductive hinges described herein.

[0029] FIG. 7 is an illustration of exemplary augmented-reality glasses that may be used in connection with embodiments of this disclosure.

[0030] FIG. 8 is an illustration of an exemplary virtual-reality headset that may be used in connection with embodiments of this disclosure.

[0031] Throughout the drawings, identical reference characters and descriptions indicate similar, but not necessarily identical, elements. While the exemplary embodiments described herein are susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in detail herein. However, the exemplary embodiments described herein are not intended to be limited to the particular forms disclosed. Rather, the present disclosure covers all modifications, equivalents, and alternatives falling within the scope of the appended claims.DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

[0032] This application is directed to a conductive hinging system that improves power and data signal transfer through hinges in augmented reality (AR) glasses and other similar mobile electronic devices. In some AR glasses, antennas are placed on the front face of the glasses (e.g., in the rims or on the lenses). In such AR glasses, however, the radio frequency (RF) processing units are typically placed in the sidearms of the glasses. As such, power and data signals often need to be routed through the hinges that connect the sidearms to the frame and to the front face of the AR glasses. To perform this routing, power and data signals are often fed through the bendable corners using either cables or flex connectors. These cables and flex connectors, however, tend to wear out after repeated bending over time.

[0033] In contrast to systems that implement cables and flex connectors to route power and data signals through the hinges of AR glasses, the embodiments described herein provide a conductive hinge that can either directly or capacitively transfer power and / or data signals through each conductive, hinged corner of the AR glasses. The hinge itself (or at least portions thereof) is conductive and may include overlapping conducting elements that are dimensioned to rotate relative to each other. These rotations can occur up to 360 degrees (or more) and can occur repeatedly without using any components that bend. Such embodiments may be used with virtually any type of AR glasses, virtual reality (VR) devices, smartwatches,or other electronic devices that may implement a hinged connection, as will be explained in greater detail below with regard to FIGS. 1A-8.

[0034] Features from any of the embodiments described herein may be used in combination with one another in accordance with the general principles described herein. These and other embodiments, features, and advantages will be more fully understood upon reading the following detailed description in conjunction with the accompanying drawings and claims.

[0035] FIG. 1A illustrates an embodiment of a system 100 that may be used in conjunction with a pair of AR glasses or with other mobile electronic devices. The system 100 may include a first hinge element 101 as well as a second hinge element 102. The second hinge element 102 may be dimensioned to align with the first hinge element 101. For instance, the first and second hinge elements may include extended portions 106 / 105, respectively, that overlap each other and allow the first and second hinge elements to align with each other about a center conducting element. The center conducting element may be a pin or rod other element about which the extended portions 106 / 105 may rotate.

[0036] The first conducting element (107, shown in FIG. IB) may be dimensioned to run through at least a portion of the first hinge element 101. The first conducting element 107 may be electrically connected to various electronic components that may be placed on the front face or front frame of the mobile device. For instance, the first conducting element 107 may be electrically connected to cameras, antennas, sensors, processors, or other electronic components that are located within the front face or frame of the mobile device. Still further, the second conducting element 104 may be dimensioned to run through at least a portion of the second hinge element 102, including at least a portion of an insulating layer 103, and may be dimensioned to at least partially surround the first conducting element 107. At least in some cases, the second conducting element 104 may be configured to rotate around the first conducting element 107. This rotation is shown in FIGS. 2A and 2B, as the second conducting element 204 is rotated 90 degrees around the first conducting element 207.

[0037] For example, FIG. 2A illustrates an embodiment of a hinging system 200 that includes a first hinge element 201, a second hinge element 202, a first conducting element 207, and a second conducting element 204. As mentioned above, the first conducting element 207 may be a pin or a rod or other connecting element that forms a fulcrum or pivotpoint forthe hinging system 200. At least in some embodiments, the first conducting element 207 may remain stationary, while the second conducting element 204 rotates around the first conducting element 207. Thus, as shown in the change between FIGS. 2A and 2B, the second hinge element 202 may be rotated 90 degrees relative to the first hinge element 201, which (at least in this example) remains stationary.

[0038] The second conducting element 204 may be dimensioned to at least partially surround the first conducting element 207. In some cases, the second conducting element 204 may directly touch the first conducting element 207, allowing a direct transfer of power or data signals. Alternatively, the second conducting element 204 may be separated from the first conducting element 207 by a thin dielectric layer. This thin dielectric layer may allow power or data signals to be transferred between the first and second conducting elements using capacitive coupling. Such embodiments will be described further below with regard to FIGS. 3A and 3B.

[0039] Returning, forthe moment, to FIGS. 1A and 2A, it will be noted that the first conducting element 107 is generally shown as running horizontally through an insulating layer 108. The insulating layer 108 may be made of plastic, ceramic, foam, or other insulating material. The insulating layer 108 may shield the first conducting element 107 from other conductive surfaces or materials. At least in some cases, the first hinge element 101 and / or the second hinge element 102 may be electrically conductive and may transfer electrical power and / or data signals from electronic components connected to the first conducting element 107 to electronic components connected to the second conducting element 104. In other cases, the first and second hinge elements may not be electrically conductive. In addition to running horizontally through the insulating layer 108, another portion of the first conducting element 107 may run vertically underneath the second conducting element 104.

[0040] As shown in FIG. 2B, for example, the first conducting element 207 may run horizontally through an insulating layer 203 and may then bend upward, vertically, extending through at least a portion of the second conducting element 204. The first conducting element 207 may extend far enough through the second conducting element 204 that the second conducting element at least partially surrounds the first conducting element. As shown in FIG. 2B, substantially the entire portion extending above the bend is surrounded by the second conducting element 204, although a lesser portion may overlap in some embodiments.

[0041] The first conducting element 207 may touch or directly contact at least a portion of the second conducting element 204. The second conducting element 204 may rotate around the first conducting element 204, providing the hinge substantial freedom of movement. In some cases, the second conducting element 204 may lock into place over the first conducting element 207 and may be held in place via a locking mechanism, via a latch, or via some other fastening mechanism that allows rotation of the sidearm about the hinge.

[0042] FIGS. 3A and 3B illustrate an embodiment of a hinge system 300 in which a dielectric layer 305 is positioned between a first conducting element 307 and a second conducting element 304. The dielectric layer 305 (and / or dielectric layer 306 between the extended portions of the first hinge element 301 and the second hinge element 302) may be made of substantially any type of insulating material. The dielectric layer 305 (and / or 306) may be formed in substantially any thickness. In some cases, the thickness may be regulated or specified to be a defined thickness that will allow for at least a minimum threshold amount of power transfer. In such cases, the first conducting element 307 and the second conducting element 304 may transfer electromagnetic signals and / or electromagnetic power via capacitive coupling. Either or both of the hinge elements 301 and 302 may be connected to other power sources or electronic components.

[0043] The first and second conducting elements 307 and 304 of FIGS. 3A and 3B may allow power and / or data signals to be transferred between such electronic components, through the hinge system 300. At least in some cases, the dielectric layer may be formed using a material with a low coefficient of friction. The low coefficient of friction may allow the second conducting element 304 to rotate freely about the first conducting element 307. As in the embodiments above, the first and second conducting elements may be at least partially surrounded by insulating materials (e.g., 303) that separate the overlapping conducting elements from the hinge elements 301 / 302.

[0044] In cases where the first and second hinge elements 307 / 304 are, themselves, made of electrically conductive materials, electromagnetic signals and / or electromagnetic power may be transferred through the first and second hinge elements. The electromagnetic signals and / or power may be transferred via direct connections (e.g., where the extended portions of the hinge elements touch each other directly) or via capacitive coupling (where the extended portions of the hinge elements indirectly touch each other through a dielectric layer). The extended portions may be positioned to directly (or closely)touch each other and may provide a platform on which the hinge elements may rotate about the first and second conducting elements 307 / 304.

[0045] FIGS. 4A-4D illustrate embodiments of a hinge system 400 in which a first hinge element 401 and a second hinge element 402 each include a plurality of extended portions that are dimensioned to overlap each other and to pivot relative to each other. For example, the first hinge element 401 may include extended portions 403, 406A, and 406B. At least in some embodiments, extended portion 403 may be fully or partially insulative, while extended portions 406A and 406B are fully or at least partially conductive. The second hinge element 402 may include extended portions 408 and 409. In some embodiments, extended portion 409 may be fully or partially insulative, while extended portion 408 may be fully or at least partially conductive.

[0046] In the embodiment shown in FIGS. 4A-4D, the extended portions 403 and 409 are insulative (non-conducting), and extended portions 406A, 408, and 406B are conducting. In some cases, the extended portions 406A, 408, and 406B may be directly touching and, as such, may directly transfer electromagnetic power or electromagnetic signals. In other cases, the extended portions 406A, 408, and 406B may only touch indirectly and may include a dielectric layer 405 between each extended portion. In those cases, the extended portions 406A, 408, and 406B may indirectly transfer electromagnetic power or electromagnetic signals via capacitive coupling between the conductive extended portions.

[0047] While this embodiment is shown in FIGS. 4A-4D, it will be recognized that, at least in some cases, the hinge elements 401 / 402 and the corresponding extended portions 406A, 408, and 406B may be non-conducting. In such cases, electromagnetic power and / or data signals may be transferred solely through the conducting elements 404 and 407.

[0048] As in the embodiments described above with reference to FIGS. 1A-3B, the hinge elements 401 and 402 may be configured to rotate about a conducting element or two conducting elements that at least partially overlap each other. The first hinge element 401 may include various extended portions (e.g., disk-shaped regions) that are dimensioned to align with corresponding extended portions of the second hinge element 402.

[0049] As noted above, in some embodiments, one or more dielectric layers (e.g., 405, as well as 406, 408, and 410 shown in FIGS. 4C and 4D) may be positioned between the extended portions 406A, 408, and 406B of the first and second hinge elements 401 / 402. The dielectric layers may be thick enough to provide a sufficient amount of separation betweenthe conducting elements 404 / 407 and the extended hinge portions 406A, 408, and 406B to prevent direct contact and direct transfer of energy but may be thin enough to function as a dielectric, thereby allowing energy to flow via capacitive coupling. Thus, threshold amounts may be established for the thickness of the dielectric layers. Minimum thickness threshold amounts may be established for separating the conductive elements and preventing direct contact, whereas maximum thickness threshold amounts may be established to ensure that data can be transferred via conductive coupling between the conducting elements 404 / 407.

[0050] As noted above, the various extended portions 406A, 408, and 406B of the first and second hinge elements may be positioned to pivot about the first and second conducting elements 407 / 404. The first conducting element 407 may attach to various electronic components on one end and may run to a position that abuts the second conducting element 404 on the other end. Similarly, the second conducting element 404 may connect to various electronic components, including processors, batteries, sensors, etc., on one end, and may abut the first conducting element 407 on the other end. The second conducting element 404 may at least partially overlap and / or enclose the first conducting element 407.

[0051] In some cases, the second conducting element 404 may lock into place over the first conducting element 407. The outside surface of the first conducting element 407, as well as the inside surface of the second conducting element 404, may be smooth to allow the first hinge element 401 to rotate relative to the second hinge element 402, or vice versa. The pivoting connection may allow the conducting elements 404 / 407 to continue conducting electricity even while the hinge elements are rotating or pivoting relative to each other. The conducting elements' design may allow for continuous flow of electricity, regardless of how many times the hinge elements rotate during extended use.

[0052] Still further, it will be recognized that, although the conducting elements 404 and 407 are shown as being vertical rods or pins, the conducting elements may be formed in different shapes, may be formed in different sizes, may or may not include bent portions, may include coils or curves or other formations, or may include other variations of shape or size. Moreover, the second conducting element 404 may attach to the first conducting element 407 using a tongue and groove, a locking pin, a screw and threads, or via other fastening mechanisms. Additionally or alternatively, the embodiments described herein may include multiple hinge elements (e.g., three or more) and / or multiple extended portions onthose hinge elements. As such, many different variations may be implemented in order to transfer electricity through a hinge in a manner that will not (or only minimally) degrade over time.

[0053] FIGS. 5A-5C illustrate charts showing different S values for signals routed through the conductive hinges described herein. Chart 500A of FIG. 5A illustrates plotted S values on the y-axis 501A between 2.2GHz and 7.4 GTHz on the x-axis 502A. This plot corresponds to the direct contact embodiment of FIGS. 1A-2B. As can be seen, improved performance is shown at around 2.4GHz and around 5.7GHz. FIG. 5B illustrates a chart 500B showing plotted S values between 0 and -40dB on the y-axis 501B between 2.2GHz and 7.4GHz along the x-axis 502B. This plot corresponds to the two-disk capacitive coupling embodiment of FIGS. 3A-3B. Again, this chart shows highly operational values around 2.2GHz and 5.0GHz.

[0054] Still further, chart 500C of FIG. 5C illustrates plotted S values between 0 and -40dB on the y-axis 501C between 2.2GHz and 7.4GHz along the x-axis 502C. This plot corresponds to the three-disk capacitive coupling embodiment of FIGS. 4A-4D. This chart also shows strong operational characteristics around 2.2GHz and 5.7GHz. As such, the conductive hinges described herein may optimally be implemented with AR glasses or other mobile devices that implement antennas operating around 2.4GHz and around 5GHz.

[0055] FIG. 6 illustrates an embodiment of a pair of AR glasses 600. The AR glasses may include a lens 601 (or lenses), along with electronics that display virtual images to the user's eyes. These AR glasses 600 may implement conductive hinges 602A and 602B to connect the sidearms 603A / 603B to the lens frame. In some cases, the conductive hinges 602A and 602B may be the same type of hinge (e.g., both hinges are direct contact hinges, or both hinges implement capacitive coupling). In other cases, the conductive hinges 602A and 602B may be different types of hinges or may each include different numbers of extended portions. At least in some cases, multiple conductive elements may be used (e.g., three, four, five, ten, or more). Thus, different hinge connections may implement different types of conductive hinges. This may allow greater flexibility in where electronic components are positioned within the AR glasses 600 and may provide more robust electrical connections through the hinges that can withstand the repeated rotating that takes place during real- world, multi-year, extended-use scenarios.

[0056] In addition to the system described above, a corresponding mobileelectronic device may include: a first hinge element, a second hinge element that is dimensioned to align with the first hinge element, a first conducting element dimensioned to run through at least a portion of the first hinge element, wherein the first conducting element is electrically connected to one or more electronic components, and a second conducting element dimensioned to run through at least a portion of the second hinge element and dimensioned to at least partially surround the first conducting element, where the second conducting element is configured to rotate around the first conducting element.

[0057] A corresponding apparatus may include: a first hinge element, a second hinge element that is dimensioned to align with the first hinge element, a first conducting element dimensioned to run through at least a portion of the first hinge element, wherein the first conducting element is electrically connected to one or more electronic components, and a second conducting element dimensioned to run through at least a portion of the second hinge element and dimensioned to at least partially surround the first conducting element, where the second conducting element is configured to rotate around the first conducting element.

[0058] Example Embodiments

[0059] Example 1. A system comprising: a first hinge element, a second hinge element that is dimensioned to align with the first hinge element, a first conducting element dimensioned to run through at least a portion of the first hinge element, wherein the first conducting element is electrically connected to one or more electronic components, and a second conducting element dimensioned to run through at least a portion of the second hinge element and dimensioned to at least partially surround the first conducting element, wherein the second conducting element is configured to rotate around the first conducting element.

[0060] Example 2. The system of example 1, wherein a first portion of the first conducting element runs horizontally through an insulating layer, and wherein a second portion of the first conducting element runs vertically underneath the second conducting element.

[0061] Example 3. The system of any of examples 1-2, wherein a first portion of the second conducting element runs horizontally through a second insulating layer, and wherein a second portion of the second conducting element runs vertically over the first conducting element.

[0062] Example 4. The system of any of examples 1-3, wherein the secondconducting element that at least partially surrounds the first conducting element directly touches at least a portion of the first conducting element.

[0063] Example 5. The system of any of examples 1-4, wherein a dielectric layer is positioned between the first conducting element and the second conducting element, such that the first conducting element and the second conducting element transfer electromagnetic signals and / or electromagnetic power via capacitive coupling.

[0064] Example 6. The system of any of examples 1-5, wherein the second conducting element is electrically connected to one or more different electronic components.

[0065] Example 7. The system of any of examples 1-6, wherein the first and second hinge elements are made of electrically conductive materials, and wherein electromagnetic signals and / or electromagnetic power are transferred through the first and second hinge elements.

[0066] Example 8. The system of any of examples 1-7, wherein the first hinge element includes an extended portion that is positioned to directly touch an extended portion of the second hinge element, and wherein the extended portions pivot about the first and second conducting elements.

[0067] Example 9. The system of any of examples 1-8, wherein the first hinge element includes an extended portion that is dimensioned to align with an extended portion of the second hinge element, and wherein a dielectric layer is positioned between the extended portions of the first and second hinge elements.

[0068] Example 10. The system of any of examples 1-9, wherein the extended portions of the first and second hinge elements are positioned to pivot about the first and second conducting elements.

[0069] Example 11. The system of any of examples 1-10, wherein the extended portions of the first and second hinge elements include disk-shaped regions that align with each other and that allow rotation of the first and second hinge elements relative to each other.

[0070] Example 12. The system of any of examples 1-11, wherein the first and second hinge elements each include a plurality of extended portions that are dimensioned to overlap each other and to pivot relative to each other.

[0071] Example 13. A mobile electronic device comprising: a first hinge element, a second hinge element that is dimensioned to align with the first hinge element, a firstconducting element dimensioned to run through at least a portion of the first hinge element, wherein the first conducting element is electrically connected to one or more electronic components, and a second conducting element dimensioned to run through at least a portion of the second hinge element and dimensioned to at least partially surround the first conducting element, wherein the second conducting element is configured to rotate around the first conducting element.

[0072] Example 14. The mobile electronic device of example 13, wherein a first portion of the first conducting element runs horizontally through an insulating layer, and wherein a second portion of the first conducting element runs vertically underneath the second conducting element.

[0073] Example 15. The mobile electronic device of example 13 or Example 14, wherein a first portion of the second conducting element runs horizontally through a second insulating layer, and wherein a second portion of the second conducting element runs vertically over the first conducting element.

[0074] Example 16. The mobile electronic device of any of examples 13-15, wherein the second conducting element that at least partially surrounds the first conducting element directly touches at least a portion of the first conducting element.

[0075] Example 17. The mobile electronic device of any of examples 13-16, wherein a dielectric layer is positioned between the first conducting element and the second conducting element, such that the first conducting element and the second conducting element transfer electromagnetic signals and / or electromagnetic power via capacitive coupling.

[0076] Example 18. The mobile electronic device of any of examples 13-17, wherein the first and second hinge elements are made of electrically conductive materials, and wherein electromagnetic signals and / or electromagnetic power are transferred through the first and second hinge elements.

[0077] Example 19. The mobile electronic device of any of examples 13-18, wherein the first hinge element includes an extended portion that is positioned to directly touch an extended portion of the second hinge element, and wherein the extended portions pivot about the first and second conducting elements.

[0078] Example 20. An apparatus comprising: a first hinge element, a second hinge element that is dimensioned to align with the first hinge element, a first conducting elementdimensioned to run through at least a portion of the first hinge element, wherein the first conducting element is electrically connected to one or more electronic components, and a second conducting element dimensioned to run through at least a portion of the second hinge element and dimensioned to at least partially surround the first conducting element, wherein the second conducting element is configured to rotate around the first conducting element.

[0079] E mbodiments of the present disclosure may include or be implemented in conjunction with various types of artificial-reality systems. Artificial reality is a form of reality that has been adjusted in some manner before presentation to a user, which may include, for example, a virtual reality, an augmented reality, a mixed reality, a hybrid reality, or some combination and / or derivative thereof. Artificial-reality content may include completely computer-generated content or computer-generated content combined with captured (e.g., real-world) content. The artificial-reality content may include video, audio, haptic feedback, or some combination thereof, any of which may be presented in a single channel or in multiple channels (such as stereo video that produces a three-dimensional (3D) effect to the viewer). Additionally, in some embodiments, artificial reality may also be associated with applications, products, accessories, services, or some combination thereof, that are used to, for example, create content in an artificial reality and / or are otherwise used in (e.g., to perform activities in) an artificial reality.

[0080] Artificial-reality systems may be implemented in a variety of different form factors and configurations. Some artificial-reality systems may be designed to work without near-eye displays (NEDs). Other artificial-reality systems may include an NED that also provides visibility into the real world (such as, e.g., augmented-reality system 700 in FIG. 7) or that visually immerses a user in an artificial reality (such as, e.g., virtual-reality system 800 in FIG. 8). While some artificial-reality devices may be self-contained systems, other artificialreality devices may communicate and / or coordinate with external devices to provide an artificial-reality experience to a user. Examples of such external devices include handheld controllers, mobile devices, desktop computers, devices worn by a user, devices worn by one or more other users, and / or any other suitable external system.

[0081] Turning to FIG. 7, augmented-reality system 700 may include an eyewear device 702 with a frame 710 configured to hold a left display device 715(A) and a right display device 715(B) in front of a user's eyes. Display devices 715(A) and 715(B) may act together or independently to present an image or series of images to a user. While augmented-realitysystem 700 includes two displays, embodiments of this disclosure may be implemented in augmented-reality systems with a single NED or more than two NEDs.

[0082] In some embodiments, augmented-reality system 700 may include one or more sensors, such as sensor 740. Sensor 740 may generate measurement signals in response to motion of augmented-reality system 700 and may be located on substantially any portion of frame 710. Sensor 740 may represent one or more of a variety of different sensing mechanisms, such as a position sensor, an inertial measurement unit (IMU), a depth camera assembly, a structured light emitter and / or detector, or any combination thereof. In some embodiments, augmented-reality system 700 may or may not include sensor 740 or may include more than one sensor. In embodiments in which sensor 740 includes an IMU, the IMU may generate calibration data based on measurement signals from sensor 740. Examples of sensor 740 may include, without limitation, accelerometers, gyroscopes, magnetometers, other suitable types of sensors that detect motion, sensors used for error correction of the IMU, or some combination thereof.

[0083] In some examples, augmented-reality system 700 may also include a microphone array with a plurality of acoustic transducers 720(A)-720(J), referred to collectively as acoustic transducers 720. Acoustic transducers 720 may represent transducers that detect air pressure variations induced by sound waves. Each acoustic transducer 720 may be configured to detect sound and convert the detected sound into an electronic format (e.g., an analog or digital format). The microphone array in FIG. 7 may include, for example, ten acoustic transducers: 720(A) and 720(B), which may be designed to be placed inside a corresponding ear of the user, acoustic transducers 720(C), 720(D), 720(E), 720(F), 720(G), and 720(H), which may be positioned at various locations on frame 710, and / or acoustic transducers 720(1) and 720(J), which may be positioned on a corresponding neckband 705.

[0084] In some embodiments, one or more of acoustic transducers 720(A)-(J) may be used as output transducers (e.g., speakers). For example, acoustic transducers 720(A) and / or 720(B) may be earbuds or any other suitable type of headphone or speaker.

[0085] The configuration of acoustic transducers 720 of the microphone array may vary. While augmented-reality system 700 is shown in FIG. 7 as having ten acoustic transducers 720, the number of acoustic transducers 720 may be greater or less than ten. In some embodiments, using higher numbers of acoustic transducers 720 may increase the amount of audio information collected and / or the sensitivity and accuracy of the audioinformation. In contrast, using a lower number of acoustic transducers 720 may decrease the computing power required by an associated controller 750 to process the collected audio information. In addition, the position of each acoustic transducer 720 of the microphone array may vary. For example, the position of an acoustic transducer 720 may include a defined position on the user, a defined coordinate on frame 710, an orientation associated with each acoustic transducer 720, or some combination thereof.

[0086] Acoustic transducers 720(A) and 720(B) may be positioned on different parts of the user's ear, such as behind the pinna, behind the tragus, and / or within the auricle or fossa. Or, there may be additional acoustic transducers 720 on or surrounding the ear in addition to acoustic transducers 720 inside the ear canal. Having an acoustic transducer 720 positioned next to an ear canal of a user may enable the microphone array to collect information on how sounds arrive at the ear canal. By positioning at least two of acoustic transducers 720 on either side of a user's head (e.g., as binaural microphones), augmented- reality system 700 may simulate binaural hearing and capture a 3D stereo sound field around about a user's head. In some embodiments, acoustic transducers 720(A) and 720(B) may be connected to augmented-reality system 700 via a wired connection 730, and in other embodiments acoustic transducers 720(A) and 720(B) may be connected to augmented- reality system 700 via a wireless connection (e.g., a BLUETOOTH connection). In still other embodiments, acoustic transducers 720(A) and 720(B) may not be used at all in conjunction with augmented-reality system 700.

[0087] Acoustic transducers 720 on frame 710 may be positioned in a variety of different ways, including along the length of the temples, across the bridge, above or below display devices 715(A) and 715(B), or some combination thereof. Acoustic transducers 720 may also be oriented such that the microphone array is able to detect sounds in a wide range of directions surrounding the user wearing the augmented-reality system 700. In some embodiments, an optimization process may be performed during manufacturing of augmented-reality system 700 to determine relative positioning of each acoustic transducer 720 in the microphone array.

[0088] In some examples, augmented-reality system 700 may include or be connected to an external device (e.g., a paired device), such as neckband 705. Neckband 705 generally represents any type or form of paired device. Thus, the following discussion of neckband 705 may also apply to various other paired devices, such as charging cases, smartwatches, smart phones, wrist bands, other wearable devices, hand-held controllers, tablet computers, laptop computers, other external compute devices, etc.

[0089] As shown, neckband 705 may be coupled to eyewear device 702 via one or more connectors. The connectors may be wired or wireless and may include electrical and / or non-electrical (e.g., structural) components. In some cases, eyewear device 702 and neckband 705 may operate independently without any wired or wireless connection between them. While FIG. 7 illustrates the components of eyewear device 702 and neckband 705 in example locations on eyewear device 702 and neckband 705, the components may be located elsewhere and / or distributed differently on eyewear device 702 and / or neckband 705. In some embodiments, the components of eyewear device 702 and neckband 705 may be located on one or more additional peripheral devices paired with eyewear device 702, neckband 705, or some combination thereof.

[0090] Pairing external devices, such as neckband 705, with augmented-reality eyewear devices may enable the eyewear devices to achieve the form factor of a pair of glasses while still providing sufficient battery and computation power for expanded capabilities. Some or all of the battery power, computational resources, and / or additional features of augmented-reality system 700 may be provided by a paired device or shared between a paired device and an eyewear device, thus reducing the weight, heat profile, and form factor of the eyewear device overall while still retaining desired functionality. For example, neckband 705 may allow components that would otherwise be included on an eyewear device to be included in neckband 705 since users may tolerate a heavier weight load on their shoulders than they would tolerate on their heads. Neckband 705 may also have a larger surface area over which to diffuse and disperse heat to the ambient environment. Thus, neckband 705 may allow for greater battery and computation capacity than might otherwise have been possible on a stand-alone eyewear device. Since weight carried in neckband 705 may be less invasive to a user than weight carried in eyewear device 702, a user may tolerate wearing a lighter eyewear device and carrying or wearing the paired device for greater lengths of time than a user would tolerate wearing a heavy standalone eyewear device, thereby enabling users to more fully incorporate artificial-reality environments into their day-to-day activities.

[0091] Neckband 705 may be communicatively coupled with eyewear device 702 and / or to other devices. These other devices may provide certain functions (e.g., tracking,localizing, depth mapping, processing, storage, etc.) to augmented-reality system 700. In the embodiment of FIG. 7, neckband 705 may include two acoustic transducers (e.g., 720(1) and 720(J)) that are part of the microphone array (or potentially form their own microphone subarray). Neckband 705 may also include a controller 725 and a power source 735.

[0092] Acoustic transducers 720(1) and 720(J) of neckband 705 may be configured to detect sound and convert the detected sound into an electronic format (analog or digital). In the embodiment of FIG. 7, acoustic transducers 720(1) and 720(J) may be positioned on neckband 705, thereby increasing the distance between the neckband acoustic transducers 720(1) and 720(J) and other acoustic transducers 720 positioned on eyewear device 702. In some cases, increasing the distance between acoustic transducers 720 of the microphone array may improve the accuracy of beamforming performed via the microphone array. For example, if a sound is detected by acoustic transducers 720(C) and 720(D) and the distance between acoustic transducers 720(C) and 720(D) is greater than, e.g., the distance between acoustic transducers 720(D) and 720(E), the determined source location of the detected sound may be more accurate than if the sound had been detected by acoustic transducers 720(D) and 720(E).

[0093] Controller 725 of neckband 705 may process information generated by the sensors on neckband 705 and / or augmented-reality system 700. For example, controller 725 may process information from the microphone array that describes sounds detected by the microphone array. For each detected sound, controller 725 may perform a direction-of-arrival (DOA) estimation to estimate a direction from which the detected sound arrived at the microphone array. As the microphone array detects sounds, controller 725 may populate an audio data set with the information. In embodiments in which augmented-reality system 700 includes an inertial measurement unit, controller 725 may compute all inertial and spatial calculations from the IMU located on eyewear device 702. A connector may convey information between augmented-reality system 700 and neckband 705 and between augmented-reality system 700 and controller 725. The information may be in the form of optical data, electrical data, wireless data, or any other transmittable data form. Moving the processing of information generated by augmented-reality system 700 to neckband 705 may reduce weight and heat in eyewear device 702, making it more comfortable to the user.

[0094] Power source 735 in neckband 705 may provide power to eyewear device 702 and / or to neckband 705. Power source 735 may include, without limitation, lithium-ionbatteries, lithium-polymer batteries, primary lithium batteries, alkaline batteries, or any other form of power storage. In some cases, power source 735 may be a wired power source. Including power source 735 on neckband 705 instead of on eyewear device 702 may help better distribute the weight and heat generated by power source 735.

[0095] As noted, some artificial-reality systems may, instead of blending an artificial reality with actual reality, substantially replace one or more of a user's sensory perceptions of the real world with a virtual experience. One example of this type of system is a head-worn display system, such as virtual-reality system 800 in FIG. 8, that mostly or completely covers a user's field of view. Virtual-reality system 800 may include a front rigid body 802 and a band 804 shaped to fit around a user's head. Virtual-reality system 800 may also include output audio transducers 806(A) and 806(B). Furthermore, while not shown in FIG. 8, front rigid body 802 may include one or more electronic elements, including one or more electronic displays, one or more inertial measurement units (IMUs), one or more tracking emitters or detectors, and / or any other suitable device or system for creating an artificial-reality experience.

[0096] Artificial-reality systems may include a variety of types of visual feedback mechanisms. For example, display devices in augmented-reality system 700 and / or virtual- reality system 800 may include one or more liquid crystal displays (LCDs), light emitting diode (LED) displays, microLED displays, organic LED (OLED) displays, digital light projector (DLP) micro-displays, liquid crystal on silicon (LCoS) micro-displays, and / or any other suitable type of display screen. These artificial-reality systems may include a single display screen for both eyes or may provide a display screen for each eye, which may allow for additional flexibility for varifocal adjustments or for correcting a user's refractive error. Some of these artificial-reality systems may also include optical subsystems having one or more lenses (e.g., concave or convex lenses, Fresnel lenses, adjustable liquid lenses, etc.) through which a user may view a display screen. These optical subsystems may serve a variety of purposes, including to collimate (e.g., make an object appear at a greater distance than its physical distance), to magnify (e.g., make an object appear larger than its actual size), and / or to relay (to, e.g., the viewer's eyes) light. These optical subsystems may be used in a non-pupil- forming architecture (such as a single lens configuration that directly collimates light but results in so-called pincushion distortion) and / or a pupil-forming architecture (such as a multilens configuration that produces so-called barrel distortion to nullify pincushion distortion).

[0097] In addition to or instead of using display screens, some of the artificial-reality systems described herein may include one or more projection systems. For example, display devices in augmented-reality system 700 and / or virtual-reality system 800 may include micro-LED projectors that project light (using, e.g., a waveguide) into display devices, such as clear combiner lenses that allow ambient light to pass through. The display devices may refract the projected light toward a user's pupil and may enable a user to simultaneously view both artificial-reality content and the real world. The display devices may accomplish this using any of a variety of different optical components, including waveguide components (e.g., holographic, planar, diffractive, polarized, and / or reflective waveguide elements), light-manipulation surfaces and elements (such as diffractive, reflective, and refractive elements and gratings), coupling elements, etc. Artificial-reality systems may also be configured with any other suitable type or form of image projection system, such as retinal projectors used in virtual retina displays.

[0098] The artificial-reality systems described herein may also include various types of computer vision components and subsystems. For example, augmented-reality system 700 and / or virtual-reality system 800 may include one or more optical sensors, such as two-dimensional (2D) or 3D cameras, structured light transmitters and detectors, time-of- flight depth sensors, single-beam or sweeping laser rangefinders, 3D LiDAR sensors, and / or any other suitable type or form of optical sensor. An artificial-reality system may process data from one or more of these sensors to identify a location of a user, to map the real world, to provide a user with context about real-world surroundings, and / or to perform a variety of other functions.

[0099] The artificial-reality systems described herein may also include one or more input and / or output audio transducers. Output audio transducers may include voice coil speakers, ribbon speakers, electrostatic speakers, piezoelectric speakers, bone conduction transducers, cartilage conduction transducers, tragus-vibration transducers, and / or any other suitable type or form of audio transducer. Similarly, input audio transducers may include condenser microphones, dynamic microphones, ribbon microphones, and / or any other type or form of input transducer. In some embodiments, a single transducer may be used for both audio input and audio output.

[0100] In some embodiments, the artificial-reality systems described herein may also include tactile (i.e., haptic) feedback systems, which may be incorporated into headwear,gloves, bodysuits, handheld controllers, environmental devices (e.g., chairs, floor mats, etc.), and / or any other type of device or system. Haptic feedback systems may provide various types of cutaneous feedback, including vibration, force, traction, texture, and / or temperature. Haptic feedback systems may also provide various types of kinesthetic feedback, such as motion and compliance. Haptic feedback may be implemented using motors, piezoelectric actuators, fluidic systems, and / or a variety of other types of feedback mechanisms. Haptic feedback systems may be implemented independent of other artificial-reality devices, within other artificial-reality devices, and / or in conjunction with other artificial-reality devices.

[0101] By providing haptic sensations, audible content, and / or visual content, artificial-reality systems may create an entire virtual experience or enhance a user's real- world experience in a variety of contexts and environments. For instance, artificial-reality systems may assist or extend a user's perception, memory, or cognition within a particular environment. Some systems may enhance a user's interactions with other people in the real world or may enable more immersive interactions with other people in a virtual world. Artificial-reality systems may also be used for educational purposes (e.g., for teaching or training in schools, hospitals, government organizations, military organizations, business enterprises, etc.), entertainment purposes (e.g., for playing video games, listening to music, watching video content, etc.), and / or for accessibility purposes (e.g., as hearing aids, visual aids, etc.). The embodiments disclosed herein may enable or enhance a user's artificial-reality experience in one or more of these contexts and environments and / or in other contexts and environments.

[0102] As detailed above, the computing devices and systems described and / or illustrated herein broadly represent any type or form of computing device or system capable of executing computer-readable instructions, such as those contained within the modules described herein. In their most basic configuration, these computing device(s) may each include at least one memory device and at least one physical processor.

[0103] In some examples, the term "memory device" generally refers to any type or form of volatile or non-volatile storage device or medium capable of storing data and / or computer-readable instructions. In one example, a memory device may store, load, and / or maintain one or more of the modules described herein. Examples of memory devices include, without limitation, Random Access Memory (RAM), Read Only Memory (ROM), flash memory,Hard Disk Drives (HDDs), Solid-State Drives (SSDs), optical disk drives, caches, variations or combinations of one or more of the same, or any other suitable storage memory.

[0104] In some examples, the term "physical processor" generally refers to any type or form of hardware-implemented processing unit capable of interpreting and / or executing computer-readable instructions. In one example, a physical processor may access and / or modify one or more modules stored in the above-described memory device. Examples of physical processors include, without limitation, microprocessors, microcontrollers, Central Processing Units (CPUs), Field-Programmable Gate Arrays (FPGAs) that implement softcore processors, Application-Specific Integrated Circuits (ASICs), portions of one or more of the same, variations or combinations of one or more of the same, or any other suitable physical processor.

[0105] Although illustrated as separate elements, the modules described and / or illustrated herein may represent portions of a single module or application. In addition, in certain embodiments one or more of these modules may represent one or more software applications or programs that, when executed by a computing device, may cause the computing device to perform one or more tasks. For example, one or more of the modules described and / or illustrated herein may represent modules stored and configured to run on one or more of the computing devices or systems described and / or illustrated herein. One or more of these modules may also represent all or portions of one or more special-purpose computers configured to perform one or more tasks.

[0106] In addition, one or more of the modules described herein may transform data, physical devices, and / or representations of physical devices from one form to another. Additionally or alternatively, one or more of the modules recited herein may transform a processor, volatile memory, non-volatile memory, and / or any other portion of a physical computing device from one form to another by executing on the computing device, storing data on the computing device, and / or otherwise interacting with the computing device.

[0107] In some embodiments, the term "computer-readable medium" generally refers to any form of device, carrier, or medium capable of storing or carrying computer- readable instructions. Examples of computer-readable media include, without limitation, transmission-type media, such as carrier waves, and non-transitory-type media, such as magnetic-storage media (e.g., hard disk drives, tape drives, and floppy disks), optical-storage media (e.g., Compact Disks (CDs), Digital Video Disks (DVDs), and BLU-RAY disks), electronic-storage media (e.g., solid-state drives and flash media), and other distribution systems.

[0108] The process parameters and sequence of the steps described and / or illustrated herein are given by way of example only and can be varied as desired. For example, while the steps illustrated and / or described herein may be shown or discussed in a particular order, these steps do not necessarily need to be performed in the order illustrated or discussed. The various exemplary methods described and / or illustrated herein may also omit one or more of the steps described or illustrated herein or include additional steps in addition to those disclosed.

[0109] The preceding description has been provided to enable others skilled in the art to best utilize various aspects of the exemplary embodiments disclosed herein. This exemplary description is not intended to be exhaustive or to be limited to any precise form disclosed. Many modifications and variations are possible without departing from the scope of the present disclosure. The embodiments disclosed herein should be considered in all respects illustrative and not restrictive. Reference should be made to the appended claims and their equivalents in determining the scope of the present disclosure.

[0110] Unless otherwise noted, the terms "connected to" and "coupled to" (and their derivatives), as used in the specification and claims, are to be construed as permitting both direct and indirect (i.e., via other elements or components) connection. In addition, the terms "a" or "an," as used in the specification and claims, are to be construed as meaning "at least one of." Finally, for ease of use, the terms "including" and "having" (and their derivatives), as used in the specification and claims, are interchangeable with and have the same meaning as the word "comprising."

Claims

WHAT IS CLAIMED IS:

1. A system comprising: a first hinge element; a second hinge element that is dimensioned to align with the first hinge element; a first conducting element dimensioned to run through at least a portion of the first hinge element, wherein the first conducting element is electrically connected to one or more electronic components; and a second conducting element dimensioned to run through at least a portion of the second hinge element and dimensioned to at least partially surround the first conducting element, wherein the second conducting element is configured to rotate around the first conducting element.

2. The system of claim 1, wherein a first portion of the first conducting element runs horizontally through an insulating layer, and wherein a second portion of the first conducting element runs vertically underneath the second conducting element.

3. The system of claim 2, wherein a first portion of the second conducting element runs horizontally through a second insulating layer, and wherein a second portion of the second conducting element runs vertically over the first conducting element.

4. The system of claim 1, wherein the second conducting element that at least partially surrounds the first conducting element directly touches at least a portion of the first conducting element.

5. The system of claim 1, wherein a dielectric layer is positioned between the first conducting element and the second conducting element, such that the first conducting element and the second conducting element transfer electromagnetic signals and / or electromagnetic power via capacitive coupling.

6. The system of claim 1, wherein the second conducting element is electrically connected to one or more different electronic components.

7. The system of claim 1, wherein the first and second hinge elements are made of electrically conductive materials, and wherein electromagnetic signals and / or electromagnetic power are transferred through the first and second hinge elements.

8. The system of claim 7, wherein the first hinge element includes an extended portion that is positioned to directly touch an extended portion of the second hinge element, and wherein the extended portions pivot about the first and second conducting elements; orwherein the first hinge element includes an extended portion that is dimensioned to align with an extended portion of the second hinge element, and wherein a dielectric layer is positioned between the extended portions of the first and second hinge elements; optionally wherein the extended portions of the first and second hinge elements are positioned to pivot about the first and second conducting elements.

9. The system of claim 7 , wherein the extended portions of the first and second hinge elements include disk-shaped regions that align with each other and that allow rotation of the first and second hinge elements relative to each other; or wherein the first and second hinge elements each include a plurality of extended portions that are dimensioned to overlap each other and to pivot relative to each other.

10. A mobile electronic device comprising: a first hinge element; a second hinge element that is dimensioned to align with the first hinge element; a first conducting element dimensioned to run through at least a portion of the first hinge element, wherein the first conducting element is electrically connected to one or more electronic components; and a second conducting element dimensioned to run through at least a portion of the second hinge element and dimensioned to at least partially surround the first conducting element, wherein the second conducting element is configured to rotate around the first conducting element.

11. The mobile electronic device of claim 10, wherein a first portion of the first conducting element runs horizontally through an insulating layer, and wherein a second portion of the first conducting element runs vertically underneath the second conducting element.

12. The mobile electronic device of claim 11, wherein a first portion of the second conducting element runs horizontally through a second insulating layer, and wherein a second portion of the second conducting element runs vertically over the first conducting element.

13. The mobile electronic device of claim 10, wherein the second conducting element that at least partially surrounds the first conducting element directly touches at least a portion of the first conducting element.

14. The mobile electronic device of claim 10, wherein a dielectric layer is positioned between the first conducting element and the second conducting element, suchthat the first conducting element and the second conducting element transfer electromagnetic signals and / or electromagnetic power via capacitive coupling.

15. The mobile electronic device of claim 10, wherein the first and second hinge elements are made of electrically conductive materials, and wherein electromagnetic signals and / or electromagnetic power are transferred through the first and second hinge elements; wherein the first hinge element includes an extended portion that is positioned to directly touch an extended portion of the second hinge element, and wherein the extended portions pivot about the first and second conducting elements.

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