Earpiece

Abstract

The earpiece provided in the present description is provided with a first magnetic bead module between a first earpiece module and a second earpiece module, so as to at least partially stop first wireless electromagnetic radiation from being transmitted outwards by means of a wire. Further, the earpiece provided in the present description is provided with a second magnetic bead module between a communication unit and a first core unit, so as to at least partially stop second wireless electromagnetic radiation from being transmitted outwards by means of a first ear hook line.

Description

A headset Technical Field

[0001] This specification relates to the field of acoustic equipment, and in particular to a headset. Background Art

[0002] Electronic devices radiate electromagnetic waves during operation, which inevitably causes electromagnetic pollution to the surrounding environment, including radiation damage to the human body or signal interference to other electronic devices.

[0003] Headphones are a common electronic device used extensively in daily life, and the issue of electromagnetic radiation during their use is receiving increasing attention. Therefore, there is a need to provide headphones whose radiated electromagnetic energy is controlled within universal safety standards.

[0004] The content of the background technology section is merely information known to the applicant personally, and does not mean that the above information has entered the public domain before the application date of this disclosure, nor does it mean that it can become the prior art of the present disclosure.

[0005] Summary of the Invention

[0006] This specification provides a headset that can effectively block the external radiation of electromagnetic waves.

[0007] In the first aspect, the present specification provides an earphone, comprising a first earphone module, comprising a data transmission unit, which performs wired transmission of target data with the outside world when in operation; a second earphone module, which is electrically connected to the first earphone module via a wire; and a first magnetic bead module, which is arranged between the first earphone module and the second earphone module to at least partially block the first wireless electromagnetic radiation emitted outward at the wire due to the wire transmission.

[0008] In some implementations, a ratio of a wavelength of the first wireless electromagnetic radiation to a length of the conductive line is in a range of 3.7 to 4.3.

[0009] In some implementations, the frequency of the first wireless electromagnetic radiation is in the range of 220 MHz to 260 MHz, and the length of the wire is in the range of 27 centimeters to 37 centimeters.

[0010] In some implementations, the first magnetic bead module includes at least one magnetic bead, and the impedance of the at least one magnetic bead reaches a peak value in a frequency range of 220 MHz to 800 MHz.

[0011] In some implementations, the data transmission unit includes a data transmission interface; a memory for storing the target data; and a data input-output circuit electrically connected to the data transmission interface and the memory, wherein the wired transmission of the target data includes: the data input-output circuit receiving the target data sent from the outside world via the data transmission interface, or sending the target data to the outside world via the data transmission interface.

[0012] In some implementations, the headset further includes a signal shield that at least partially covers the data input and output circuit to at least partially block external radiation generated during wired transmission of the target data.

[0013] In some implementations, the first earphone module includes a communication unit and a first core unit; the second earphone module includes a power supply unit and a second core unit; and the first magnetic bead module is connected to the communication unit to at least partially block at least part of the first wireless electromagnetic radiation generated by the wire due to the clock signal generated by the communication unit.

[0014] In some implementations, the second earphone module also includes a power temperature detector and a button; the communication unit includes: a power interface, a power temperature detection signal interface, a button signal interface, or at least one of a second speaker data interface; and the first magnetic bead module includes at least one of a first magnetic bead unit, a second magnetic bead unit, a third magnetic bead unit, or a fourth magnetic bead unit, wherein the first magnetic bead unit is connected to the power unit through the power interface, the second magnetic bead unit is connected to the power temperature detector through the power temperature detection signal interface, the third magnetic bead unit is connected to the button through the button signal interface, and the fourth magnetic bead unit is connected to the second movement unit through the second speaker data interface.

[0015] In some implementations, the power interface includes a positive power interface and a power ground interface; the second speaker data interface includes a second speaker data positive interface and a second speaker data negative interface, wherein at least one magnetic bead in the first magnetic bead unit is connected to the positive power interface, at least one magnetic bead in the first magnetic bead unit is connected to the power ground interface, at least one magnetic bead in the fourth magnetic bead unit is connected to the second speaker data positive interface, and at least one magnetic bead in the fourth magnetic bead unit is connected to the second speaker data negative interface.

[0016] In some implementations, the communication unit includes an electrically connected control element and a power amplifier element; the control element is connected to at least one of the power interface, the power temperature detection signal interface, or the key signal interface through the first magnetic bead module; and the power amplifier element is connected to the second speaker data interface through the first magnetic bead module.

[0017] In some implementations, the power supply unit includes a battery; the communication unit and the first core unit are connected via a first ear hook wire; and the power supply unit and the second core unit are connected via a second ear hook wire.

[0018] In some implementations, the headset also includes a second magnetic bead module, which is arranged between the communication unit and the first core unit to at least partially block the second wireless electromagnetic radiation emitted outward by the harmonic signal of the clock signal through the first ear hook wire; the first headset module also includes at least one of the first microphone or the second microphone; the communication unit also includes: at least one of the first microphone interface, the second microphone interface, or the first speaker data interface; and the second magnetic bead module includes at least one of the fifth magnetic bead unit, the sixth magnetic bead unit or the seventh magnetic bead unit, wherein the fifth magnetic bead unit is connected to the first microphone through the first microphone interface, the sixth magnetic bead unit is connected to the second microphone through the second microphone interface, and the seventh magnetic bead unit is connected to the first core unit through the first speaker data interface.

[0019] In some implementations, the first microphone interface includes a microphone power positive interface, a microphone power ground interface, a first microphone data positive interface, and a first microphone data negative interface; the second microphone interface includes a second microphone data positive interface and a second microphone data negative interface; and the first speaker data interface includes a first speaker data positive interface and a first speaker data negative interface, wherein at least one magnetic bead in the fifth magnetic bead unit is connected to the microphone power positive interface, at least one magnetic bead in the fifth magnetic bead unit is connected to the microphone power ground interface, at least one magnetic bead in the fifth magnetic bead unit is connected to the first microphone data positive interface, and at least one magnetic bead in the fifth magnetic bead unit is connected to the first microphone data negative interface. At least one magnetic bead in the sixth magnetic bead unit is connected to the second microphone data positive interface, at least one magnetic bead in the sixth magnetic bead unit is connected to the second microphone data negative interface, at least one magnetic bead in the seventh magnetic bead unit is connected to the first speaker data positive interface, and at least one magnetic bead in the seventh magnetic bead unit is connected to the first speaker data negative interface.

[0020] In some implementations, the communication unit includes an electrically connected control element and a power amplifier element; the control element is connected to at least one of the first microphone interface or the second microphone interface through the second ferrite module; and the power amplifier element is connected to the first speaker data interface through the second ferrite module.

[0021] In some implementations, the earphone further includes a connecting portion to connect the first earphone module and the second earphone module, the connecting portion including: an elastic bracket; the wire extending along the elastic bracket; and an insulating sheath wrapping the elastic bracket and the wire.

[0022] It can be seen from the above technical solution that the earphone provided in this specification is provided with a first magnetic bead module between the first earphone module and the second earphone module, and the first magnetic bead module has at least a partial blocking effect on the signal of a specific band. When the target data is transmitted in the first earphone module, the first wireless electromagnetic radiation generated during the target data transmission falls into the band range. The first magnetic bead module can at least partially block the first wireless electromagnetic radiation from propagating outward through the wire connected between the two earphone modules. Furthermore, the earphone provided in this specification is provided with a second magnetic bead module between the communication unit and the first core unit of the first earphone module, and the second magnetic bead module has a blocking effect on the signal of a specific band to form at least a partial blocking effect on the second wireless electromagnetic radiation, thereby preventing the second wireless electromagnetic radiation from propagating outward through the first ear hanging wire connected between the communication unit and the first core unit.

[0023] Other features of the headphones provided in this specification are partially listed in the following description. The following figures and examples will be readily apparent to those skilled in the art based on the description. The inventive aspects of the headphones provided in this specification can be fully explained through practice or use of the methods, devices, and combinations provided in the following detailed examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0025] FIG1 is a schematic structural diagram of an earphone provided according to some embodiments of this specification;

[0026] FIG2 shows an exploded view of a connection portion of an earphone according to some embodiments of this specification;

[0027] FIG3 shows a schematic diagram of a module of an earphone according to some embodiments of this specification;

[0028] FIG4 shows a schematic diagram of a module of an earphone according to some embodiments of this specification;

[0029] FIG5 shows a schematic diagram of a magnetic bead impedance-frequency curve according to some embodiments of this specification;

[0030] FIG6 shows a connection diagram of a first magnetic bead module according to some embodiments of this specification;

[0031] FIG7 shows a connection diagram of a second magnetic bead module according to some embodiments of this specification; and

[0032] FIG8 shows a comparative test diagram of headphones provided according to some embodiments of this specification. DETAILED DESCRIPTION

[0033] The following description provides specific application scenarios and requirements for this specification, with the goal of enabling those skilled in the art to make and use the contents of this specification. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but is intended to be accorded the broadest scope consistent with the claims.

[0034] The terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. For example, as used herein, the singular forms "a," "an," and "the" may also include the plural forms unless the context clearly indicates otherwise. When used in this specification, the terms "comprise," "include," and / or "contain" are intended to refer to the presence of the associated integers, steps, operations, elements, and / or components, but do not preclude the presence of one or more other features, integers, steps, operations, elements, components, and / or groups or the addition of other features, integers, steps, operations, elements, components, and / or groups in the system / method.

[0035] These and other features of this specification, as well as the operation and function of the associated elements of the structure, and the economical assembly and manufacture of the components, can be significantly improved with consideration of the following description. Reference is made to the accompanying drawings, all of which form a part of this specification. However, it should be expressly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this specification. It should also be understood that the drawings are not drawn to scale.

[0036] The flowcharts used in this specification illustrate operations implemented by systems according to some embodiments of the present specification. It should be clearly understood that the operations of the flowcharts may not be implemented in sequence. Rather, the operations may be implemented in reverse order or simultaneously. Furthermore, one or more additional operations may be added to the flowcharts. One or more operations may be removed from the flowcharts.

[0037] In this specification, "X includes at least one of A, B, or C" means that X includes at least A, or X includes at least B, or X includes at least C. In other words, X may include only any one of A, B, and C, or any combination of A, B, and C, as well as other possible contents / elements. Any combination of A, B, and C may be A, B, C, AB, AC, BC, or ABC.

[0038] In this specification, unless otherwise specified, the association relationship between structures can be a direct association relationship or an indirect association relationship. For example, when describing "A is connected to B", unless it is clearly stated that A is directly connected to B, it should be understood that A can be directly connected to B or indirectly connected to B; for another example, when describing "A is above B", unless it is clearly stated that A is directly above B (AB are adjacent and A is above B), it should be understood that A can be directly above B or indirectly above B (AB is separated by other elements and A is above B). And so on.

[0039] For ease of understanding, before describing some embodiments provided in this specification, the following background information is introduced:

[0040] When electronic devices operate, the changing electric fields in cables and components create a changing magnetic field around them. This changing magnetic field, in turn, stimulates a changing electric field. The two interact and stimulate each other, radiating electromagnetic waves. Electromagnetic waves can be transmitted through physical conductors, a process known as conduction. They can also propagate through space, a process known as electromagnetic radiation. The frequency of electromagnetic waves varies, and the distance they travel through space also varies. Theoretically, the higher the frequency of an electromagnetic wave, the more electromagnetic energy it contains and the greater its propagation distance. In other words, the higher the frequency of an electromagnetic wave, the higher the average power density, or electromagnetic field strength, at the same distance.

[0041] When electronic devices radiate electromagnetic waves, if there are electromagnetic waves of a specific wavelength that are proportional to the size of the cables or components in the circuit system, the radiation range of the electromagnetic waves will be further expanded. For example, if the cable length is half or one-quarter of the wavelength of the electromagnetic wave, the cable will be equivalent to an antenna, radiating the electromagnetic waves to a wider range. However, electromagnetic radiation may cause crosstalk and electromagnetic compatibility problems in electronic systems, and some may even cause damage to the human body or the environment. Therefore, during the circuit design of electronic devices, especially high-speed circuits, it is necessary to consider the potential electromagnetic radiation and suppress the propagation of electromagnetic radiation as much as possible.

[0042] The following is a detailed description of the headphones provided in this manual.

[0043] The headphones provided in this specification can be of any type. For example, the headphones can be wired headphones. The receiver in the wired headphones can receive electrical signals from a media player via wired transmission, thereby converting the electrical signals into sound waves audible to the human ear. For example, the headphones can be wireless headphones. The receiver in the wireless headphones can receive electrical signals from a media player via wireless transmission, thereby converting the electrical signals into sound waves audible to the human ear. For another example, the headphones can be air conduction headphones. Air conduction headphones can convert electrical signals into air vibration signals. The air vibration signals can be transmitted to the ear canal. The eardrum in the ear can convert the air vibration signals into sound. For another example, the headphones can be bone conduction headphones. Bone conduction headphones can convert electrical signals into mechanical vibration signals. The mechanical vibration signals can cause the skull to vibrate, causing the perilymph to produce fluctuations of the same frequency, and stimulating the cochlear cochlear organ to produce hearing. For another example, the headphones can be a combination of air conduction headphones and bone conduction headphones. This specification does not limit the type of headphones.

[0044] For wired headphones and wireless headphones, wired and wireless refer to whether the data transmission method between the headphones and the media player is wired or wireless when playing music. Wired headphones need to use the connection cable to transmit and play audio data in real time. Wireless headphones use wireless signals, such as Bluetooth, to achieve connection with the media player and wireless transmission of audio data. In addition to the use scenario of music playback, at other times, users may need to import target data, such as audio data, into the built-in memory of the headphones through a transmission cable for storage. The wired transmission here has nothing to do with whether the headphones are wired headphones or wireless headphones as mentioned above. In other words, whether they are wired headphones or wireless headphones, they can be configured with wired data transmission and storage functions.

[0045] The headset provided in this specification can achieve the transmission and storage of target data. Figure 1 shows a schematic diagram of the structure of a headset 001 provided according to some embodiments of this specification. The headset 001 may include a first headset module 100, a second headset module 200, and a connecting portion 300 connecting the first headset module 100 and the second headset module 200.

[0046] The first and second earphone modules 100 and 200 include at least one core unit 130 and 230 for converting electrical signals into sound waves that can be heard by humans. In addition, the first and second earphone modules 100 and 200 also include other auxiliary devices 110 and 210, such as a main control board module or a battery module. The first core unit 130 and its auxiliary device 110 can be respectively set at different positions of the earphone 001, or they can be integrated together and placed in a compartment; similarly, the second core unit 230 and its auxiliary device 210 can be respectively set at different positions of the earphone 001, or they can be integrated together and placed in a compartment. Figure 1 shows a situation where the core units 130, 230 and their auxiliary devices 110 and 210 can be respectively set at different positions of the earphone 001. At this time, the core units 130, 230 and their auxiliary devices 110 and 210 are connected by a first ear hook wire 120 and a second ear hook wire 220, respectively.

[0047] The first earphone module 100 or the second earphone module 200 includes a data transmission unit that can perform wired transmission and storage of target data. For example, the earphone 001 can include the function of playing MP3 audio, and the first earphone module 100 or the second earphone module 200 includes an MP3 player. The MP3 player includes a storage device for MP3 data and a data interface for wired transmission of MP3 files from a third-party data source, such as a USB interface. Of course, the earphone 001 can also include other functions, and the corresponding modules can be classified as a data transmission unit for wired transmission and storage of target data, which is not limited in this specification.

[0048] This specification will take the case where the data transmission unit is located in the first earphone module 100 as an example for description.

[0049] It should be noted that although the first earphone module 100 in the earphone 001 shown in FIG1 is for use with the right ear and the second earphone module 200 is for use with the left ear, it should be understood that the relative positions of the first earphone module 100 and the second earphone module 200 are not limited by the wearing method. That is, in some embodiments, the module for use with the left ear may be the first earphone module 100, and the module for use with the right ear may be the second earphone module 200.

[0050] As shown in Figure 1 , the connection portion 300 is used to connect the first earphone module 100 and the second earphone module 200 . Figure 2 shows an exploded view of the connection portion of an earphone 001 according to some embodiments of this specification. The connection portion 300 may include an elastic bracket 320 , a wire 310 , and an insulating sheath 330 .

[0051] The elastic bracket 320 can adopt an arc-shaped design to provide a certain clamping force for the user when wearing the headphones. For example, when the user wears the headphones, the two headphone modules can be hung on the outside of the user's ears respectively, and the connecting part is wrapped around the back of the user's head. The clamping force provided by the elastic bracket 320 allows the two headphone modules to be close to the user's skin, thereby improving wearing reliability. In some embodiments, the elastic bracket 320 can be an elastic metal wire. In some embodiments, the elastic bracket 320 can be an elastic plastic bracket. In some embodiments, the elastic bracket can be an elastic polymer material bracket. This specification does not limit the material of the elastic bracket 320.

[0052] The wire 310 can extend along the elastic bracket 320, with both ends of the elastic bracket 320 connected to the first earphone module 100 and the second earphone module 200, respectively. The wire 310 can be used to electrically connect the electronic components of the two earphone modules. The wire 310 can be configured as one or multiple strands depending on circuit connection requirements. For example, the wire 310 can be configured as any number of strands, such as 1, 2, 3, 5, 6, or 8. The length of the wire 310 is determined based on the actual design or functional requirements of the earphone product. For example, the earphones should provide good wearing stability and comfort. For example, in some earphones, the length of the wire 310 ranges from 27 cm to 37 cm. In some embodiments, if the earphones 001 are head-worn earphones, the length of the wire 310 can be determined based on the length of the connecting portion around the upper side of the head of an average user when worn. In some embodiments, if the earphones 001 are back-worn earphones, the length of the wire 310 can be determined based on the length of the connecting portion around the back side of the head of an average user when worn. Average users can be those providing user experience or data for product design or testing. Generally, users can be real people or virtual characters.

[0053] The insulating sheath 330 can encapsulate the elastic support 320 and the wire 310. This encapsulation ensures protection against leakage and water damage. The insulating sheath 330 can be integrally formed or constructed from multiple insulating sheaths. It can be made of a flexible material with a certain degree of elasticity, such as soft silicone or rubber.

[0054] As previously mentioned, the headset 001 provided in this specification includes a data interface that can connect to a data cable and transfer target data from an external device to the memory within the headset 001 via the data cable. With the advancement of interface technology, data transmission speeds are continuously increasing. This means that when the headset 001 performs high-speed data transmission, high-frequency clock signals will be present within the headset 001. The definition of high frequency varies in different technical fields. In the definition of high-speed circuits, an electronic system is considered high-speed if its clock frequency reaches or exceeds 50 MHz. The term "high frequency" used in this specification should refer to this definition. High-frequency signals can cause many problems within circuit systems. For example, the electromagnetic radiation generated by high-frequency signals may cause crosstalk within the circuit system, resulting in timing errors or affecting the sensitivity of components. Sometimes, the electromagnetic radiation generated by high-frequency signals can radiate outward, causing electromagnetic interference to other electronic devices. For example, the electromagnetic waves radiated by high-frequency signals contain higher-frequency harmonic components, and these higher-frequency harmonics are more likely to be transmitted outward through cables or interfaces.

[0055] In view of this, the earphone 001 provided in this specification is provided with a high-frequency suppression device in the circuit to suppress the electromagnetic waves generated by the high-frequency signal from propagating outward through the cable or interface. Figure 3 shows a module schematic diagram of the earphone 001 provided according to some embodiments of this specification. The earphone 001 provided in this specification is provided with a first magnetic bead module 400 between the first earphone module 100 and the second earphone module 200. The first magnetic bead module 400 has an attenuation effect on electromagnetic waves in a specific band. When target data is transmitted in the first earphone module 100, the first wireless electromagnetic radiation generated during the target data transmission falls within the specific band range. The first magnetic bead module 400 can suppress the first wireless electromagnetic radiation, so that the electromagnetic energy of the first wireless electromagnetic radiation is reduced after passing through the first magnetic bead module 400, thereby suppressing the first wireless electromagnetic radiation from propagating outward from the wire 310.

[0056] The module structure of the earphone 001 provided in this specification is described in detail below with reference to FIG4 .

[0057] Figure 4 shows a module schematic diagram of the earphone 001 provided according to some embodiments of this specification. The first earphone module 100 may include a communication unit 111. In some embodiments, the communication unit 111 can receive and transmit wireless signals, for example, through at least one of Bluetooth, NFC, or Wifi, to achieve communication with an external media player or a main-end device. In some embodiments, the communication unit 111 can achieve communication with the main-end device in a wired manner. In some embodiments, the communication unit 111 can perform audio data decoding or digital-to-analog conversion. In some embodiments, the communication unit 111 can receive and play audio data sent by an external media player through a Bluetooth antenna, that is, play music through a Bluetooth connection.

[0058] In some embodiments, the communication unit 111 may include a control element, and the communication unit 111 may include a power amplifier element, and the control element and the power amplifier element are electrically connected. The control element may be a microprocessor. The microprocessor may send control signals to external devices. In some embodiments, the microprocessor may synchronize clock signals with external devices. The external device may include an I / O device electrically connected to the microprocessor, such as a storage device. The microprocessor may read and process data in the storage device. The power amplifier element is used to amplify the power of the received sound electrical signal so that the sound can be heard by a person. The control element may send control signals to the power amplifier element, and the control element may also send sound electrical signals to the power amplifier element.

[0059] As shown in Figure 4, the first earphone module 100 may include a first core unit 130, and the first core unit 130 and the communication unit 111 are connected via a first ear hook line 120. The first core unit 130 may include a first speaker, which may convert electrical signals into sound waves that can be heard by humans. The first ear hook line 120 may include a first speaker data line connecting the power amplifier element and the first core unit 130. After the sound electrical signal is amplified by the power amplifier element, it is transmitted to the first speaker along the first speaker data line. The first speaker data line may include a first speaker data positive line and a first speaker data negative line.

[0060] As shown in Figure 4, the first core unit 130 may include a first microphone. The first microphone and the communication unit 111 are connected via a first earhook cable 120. In some embodiments, the first microphone is a primary microphone, which can be used to pick up speech and collect ambient sound signals during a call. The first earhook cable 120 may include a first microphone data line connecting the control element and the first microphone. The first microphone data line may include a first microphone positive data line and a first microphone negative data line. The first earhook cable 120 may include a microphone power line for supplying power to the first microphone. The microphone power line may include a microphone positive power line and a microphone ground line. The first core unit 130 may also include a second microphone. The second microphone and the communication unit 111 are connected via the first earhook cable 120. In some embodiments, the second microphone is a secondary microphone, which can be used to collect ambient sound signals and form a feed-forward and forward structure with the primary microphone to reduce ambient sound. The first earhook cable may include a second microphone data line connecting the control element and the second microphone. The second microphone power line may include a second microphone positive data line and a second microphone negative data line.

[0061] As shown in Figure 4 , the accessory device 110 of the first earphone module 100 can be a module that houses the main control circuitry of the earphone 001. For example, the accessory device 110 may include the earphone's motherboard and other components. Figure 4 illustrates that the accessory device 110 may include a data transmission unit 112, a communication unit 111, a first magnetic bead module 400, and a second magnetic bead module 500.

[0062] When the data transmission unit 112 is in operation, it performs wired transmission of target data with the outside world. The target data may be audio data. The data transmission unit 112 is electrically connected to the communication unit 111. The data transmission unit 112 may receive a control signal sent by the communication unit 111. In some embodiments, the control signal may be a switch signal that controls the data transmission unit 112 to start data transmission. In some embodiments, the control signal may be a clock signal for signal synchronization between the communication unit 111 and the data transmission unit 112. The data transmission unit 112 may send a data signal to the communication unit 111. In some embodiments, the data signal may be a 1-bit data signal. The data transmission unit 112 may include a data transmission interface, a memory, and a data input / output circuit. The wired transmission of the target data may include the data input / output circuit receiving the target data sent from the outside world via the data transmission interface, or sending the target data to the outside world via the data transmission interface.

[0063] In order to perform wired transmission of target data, the data transmission unit 112 may include a data transmission interface. The data transmission interface provides a standard interface for wired connection with external devices. The external device can exchange target data with the data transmission interface through a connecting line or connector. In some embodiments, the data transmission interface may be a USB (Universal Serial Bus, a serial bus standard) interface. In some embodiments, the USB interface may be a micro USB interface. In some embodiments, the USB interface may be a type-C interface. In some embodiments, the USB interface may be a USB2.0 interface. The data transmission rate of the USB2.0 interface may be 480Mbps (bps, bit per second, bit rate unit). Since USB2.0 uses inverse non-return-to-zero encoding, 2 bits of data are transmitted per clock cycle, that is, when the data transmission rate is 480Mbps, the corresponding clock frequency is 240MHz (Hz, Hertz, frequency unit). In some embodiments, the control element of the communication unit may provide a 240MHz clock signal.

[0064] To store target data received from a third-party data source, the data transmission unit 112 may further include a memory. The memory can store the target data. The earphones provided herein can play target audio data stored in the built-in memory without transmitting signals to an external media player. In some embodiments, the memory may be an eMMC, SSD, or UFS.

[0065] The data transmission unit 112 may also include a data input / output circuit. The data input / output circuit is electrically connected to the data transmission interface and the memory, and is used to input target data from the data transmission interface to the memory, or output target data from the memory to the data transmission interface. The data transmission unit 112 is electrically connected to the communication unit 111 to receive control signals from the communication unit 111. The control signal may include an enable signal or a clock signal. In some embodiments, the clock signal has a frequency of 240 MHz, and the data input / output circuit transmits data at a rate of 2 bits per clock cycle. In some embodiments, the 240 MHz clock signal can be derived from the communication unit's base clock signal by multiplying the frequency. The base clock signal of the communication unit may have a frequency of 24 MHz, 48 MHz, or other frequencies. Because the data input / output circuit maintains high-speed data signal changes during data transmission, it may also radiate electromagnetic waves through component surfaces or interfaces. Therefore, in some embodiments, the headset also includes a signal shield. The signal shield at least partially covers the data input / output circuit to at least partially block the radiation generated by the wired transmission of the target data.

[0066] For the earphones 001 provided in this specification, when the data transmission unit 112 performs wired transmission of target data through the data transmission interface, the data transmission unit can receive the clock signal sent by the communication unit 111 for data synchronization. The communication unit 111 can generate a high-frequency clock signal that matches the data transmission interface standard. When wired data transmission is performed through the data transmission unit 112, high-frequency signals exist in at least the circuits of the communication unit 111 and the data transmission unit 112 in the entire circuit system. The high-frequency signals may include clock signals for data synchronization and may include target data signals for high-speed transmission, wherein the signal with the highest energy is the synchronization clock signal. In some embodiments, when the earphones 001 use the USB2.0 data transmission interface for high-speed data transmission, the frequency of the clock signal is 240 MHz. The clock signal can radiate electromagnetic waves outward through cables, wiring on printed circuit boards, or solder joints, and the energy of the electromagnetic waves is mainly concentrated at 240 MHz.

[0067] As previously mentioned, the length of the wire 310 of the headset 001 provided in this specification is 27 cm to 37 cm. When the target data is transmitted by wire, at least a portion of the first wireless electromagnetic radiation in the circuit can enter the wire 310 through the connection between the wire 210 and the communication unit 111. The frequency of the first wireless electromagnetic radiation is in the range of 220 MHz to 260 MHz. According to the wavelength calculation formula:

[0068] Where λ is the wavelength, c is the speed of light, and f is the frequency of the wave. The wavelength corresponding to the first wireless electromagnetic radiation is 1.15 meters to 1.36 meters. The ratio of the wavelength of the first wireless electromagnetic radiation to the length of the wire is 3.7 to 4.3. According to antenna principles, when the ratio of the wavelength of the first wireless electromagnetic radiation to the length of the wire 310 is approximately 4, the wire 310 can just become an equivalent antenna, which can propagate the first wireless electromagnetic radiation to a farther spatial range, thereby causing electromagnetic interference in a larger range. The center frequency of the first wireless electromagnetic radiation is approximately 240 MHz, and the wavelength corresponding to the center frequency is 1.25 meters. When the length of the wire 310 is 31.25 centimeters, the propagation effect on the first wireless electromagnetic radiation is more obvious.

[0069] Therefore, this specification provides an earphone 001 that attenuates the first wireless electromagnetic radiation before it is emitted outward through the wire 310, thereby reducing the energy emitted by the wire 310 as an equivalent antenna. As shown in Figure 4, the earphone 001 includes a first magnetic bead module 400, which is disposed between the first earphone module 100 and the second earphone module 200 to at least partially block the first wireless electromagnetic radiation emitted outward from the wire 310 due to the wired transmission of target data.

[0070] For the convenience of the following description, the second earphone module 200 will be introduced first before the first magnetic bead module 400 is introduced in detail.

[0071] As shown in Figure 4, the second earphone module 200 may include a power supply unit 210. The power supply unit can provide power to the active components in the earphone 001. At least a power cord is connected between the power supply unit and the communication unit 111. The power cord includes a positive power line and a ground power line. The conductor 310 may include a power cord. The power supply unit 210 may include a battery. In some embodiments, the battery may be a rechargeable battery. The rechargeable battery can be charged via a charging port and can supply power externally via a power cable connected thereto.

[0072] The power supply unit 210 may include a power supply temperature detector. The power supply temperature detector is electrically connected to the communication unit 111 to transmit a temperature signal of the power supply unit to the communication unit 111. At least a power supply temperature detection signal line is connected between the power supply temperature detector and the communication unit 111. The wire 310 may include a power supply temperature detection signal line. The power supply temperature detector detects the temperature of the power supply by having a temperature sensor exhibit different component characteristics at different temperatures. In some embodiments, the temperature sensor may be a thermistor. In some embodiments, the second core unit 230 and the power supply unit are connected via a second ear hook wire 220.

[0073] As shown in Fig. 4, the second earphone module 200 may include a second core unit 230. The second core unit 230 may include a second speaker, which may convert electrical signals into sound waves audible to humans.

[0074] The wire 310 may include a second speaker data line, which connects the power amplifier element and the second core unit 230 via the second speaker data line. After the sound electrical signal is amplified by the power amplifier element, it is transmitted to the second core unit 230 along the second speaker data line. The second speaker data line may include a second speaker data positive line and a second speaker data negative line. The second ear hook line 220 may include a second speaker data line. The second speaker data line may be connected via an adapter located in the second earphone module. The second speaker data line may include a second speaker data positive line and a second speaker data negative line.

[0075] The second earphone module 200 may further include at least one button. The at least one button can be operated by the user to control the earphones to implement key functions such as turning them on and off, adjusting the volume, or switching modes. The at least one button can receive user operations and convert them into electrical key signals. The electrical key signals can be transmitted to the communication unit via a key signal line to implement the key functions. The wire may include one or more key signal lines connecting the at least one button to the communication unit.

[0076] As previously described, the earphones 001 provided herein include a first magnetic bead module 400 disposed between the first earphone module 100 and the second earphone module 200 to fully or partially suppress the first wireless electromagnetic radiation. The first magnetic bead module includes at least one magnetic bead, and at least one magnetic bead should have a good suppressive effect on the first wireless electromagnetic radiation. Figure 5 shows a schematic diagram of a magnetic bead impedance-frequency curve provided in accordance with some embodiments of this specification. The abscissa of the curve represents frequency, and the ordinate represents impedance, where Z = R + jX, where Z is the impedance modulus, R is the real part of the impedance, i.e., resistance, and X is the imaginary part of the impedance, i.e., reactance. At low frequencies, the impedance of the magnetic bead is low. As the frequency increases, the magnetic bead gradually exhibits resistive properties, exhibiting fully resistive characteristics at the peak impedance point. The impedance of the at least one magnetic bead reaches a peak within the frequency range of 220 MHz to 800 MHz. Because the magnetic bead suppresses high-frequency signals within a specific frequency band and has less impact on low-frequency signals, this characteristic of the magnetic bead can be utilized to attenuate the first wireless electromagnetic radiation without affecting the passage of audio signals. In some embodiments, the magnetic beads can be ferrite beads. In some embodiments, the magnetic beads can be ring-shaped magnetic beads or sheet-shaped magnetic beads. Ring-shaped magnetic beads can be placed on cables, while sheet-shaped magnetic beads can be soldered to circuit boards.

[0077] Figure 6 shows a schematic diagram of the connection of a first magnetic bead module 400 according to some embodiments of this specification. The communication unit 111 of the first earphone module 100 can be connected to the wire 310 via a series of interfaces 111-A, thereby achieving an electrical connection between the first earphone module 100 and the second earphone module 200. The first magnetic bead module 400 is connected to the communication unit 111 and includes at least one of a first magnetic bead unit 410, a second magnetic bead unit 420, a third magnetic bead unit 430, or a fourth magnetic bead unit 440.

[0078] Communication unit 111 may include a power interface, which includes a positive power interface and a ground power interface. The positive power interface is connected to the positive power line, and the ground power interface is connected to the ground power line. First magnetic bead unit 410 is connected to the power supply unit via the power interface. At least one magnetic bead 411 in first magnetic bead unit 410 is connected to the positive power interface, and at least one magnetic bead 413 in first magnetic bead unit 410 is connected to the ground power interface. First magnetic bead unit 410 can prevent the first wireless electromagnetic radiation from entering wire 310 through the power interface.

[0079] Communication unit 111 may include a power supply temperature detection signal interface. This interface is connected to the power supply temperature detection signal line to communicate signals between communication unit 111 and the power supply temperature detector. Second magnetic bead unit 420 is connected to the power supply temperature detector via the interface to prevent the first wireless electromagnetic radiation from entering wire 310 through the interface.

[0080] Communication unit 111 may include a key signal interface. The key signal interface is connected to the key signal line to communicate signals between communication unit 111 and the key. Third magnetic bead unit 430 is connected to the key through the key signal interface to prevent the first wireless electromagnetic radiation from entering wire 310 through the key signal interface.

[0081] The communication unit 111 may include a second speaker data interface, which may include a second speaker data positive interface and a second speaker data negative interface. The second speaker data positive interface is connected to the second speaker data positive line, and the second speaker data negative interface is connected to the second speaker data negative line, to communicate signals between the communication unit 111 and the second core unit 230. The fourth magnetic bead unit 440 is connected to the second core unit 230 via the second speaker data interface. At least one magnetic bead 441 in the fourth magnetic bead unit 440 is connected to the second speaker data positive interface, and at least one magnetic bead 443 in the fourth magnetic bead unit is connected to the second speaker data negative interface, thereby preventing the first wireless electromagnetic radiation from entering the wire 310 through the second speaker data interface.

[0082] As previously described, communication unit 111 may include a control element and a power amplifier element. The control element is connected to at least one of the power interface, the power temperature detection signal interface, or the key signal interface via a first ferrite bead module 400. The power amplifier element is connected to the second speaker data interface via a first ferrite bead module 400.

[0083] In summary, the earphones 001 provided in this specification can exchange target data with the outside world through wired transmission. During the wired transmission process, the communication unit 111 will generate a high-frequency clock signal. The high-frequency clock signal and the high-speed target data signal will form high-frequency electromagnetic radiation that propagates in the circuit. The length of the wire 310 of the earphones 001 is approximately 1 / 4 of the wavelength of the clock signal, which can form an equivalent antenna to transmit the first wireless electromagnetic radiation outward. Therefore, the earphones 001 provided in this specification are provided with a first magnetic bead module 400 between the first earphone module 100 and the second earphone module 200 to at least partially block at least part of the first wireless electromagnetic radiation generated by the wire 310 due to the clock signal generated by the communication unit 111.

[0084] Furthermore, the frequency of the electromagnetic radiation caused by the high-frequency clock signal does not only include the clock frequency, but also contains rich harmonic components, the frequencies of the harmonics being integer multiples of the clock frequency. This means that there is also a second wireless electromagnetic radiation with a higher frequency in the circuit. For the second wireless electromagnetic radiation, the first ear hook wire 120, which is shorter than the wire 310, becomes its possible 1 / 4 wavelength equivalent antenna. If the second wireless electromagnetic radiation is not suppressed before it enters the first ear hook wire 120, the second wireless electromagnetic radiation may be emitted externally using the first ear hook wire 120 as an antenna.

[0085] In view of this, the earphone 001 provided in this specification also includes a second magnetic bead module 500, which is arranged between the communication unit 111 and the first core unit 130 to at least partially block the second wireless electromagnetic radiation generated by the clock signal and / or its harmonic signal through the first ear hook wire 120. The second magnetic bead module includes at least one magnetic bead, and the impedance of at least one magnetic bead reaches a peak value in the frequency range of 220MHz to 800MHz. For a 240MHz clock signal, its harmonic component with the highest energy is 720MHz. The magnetic beads of the second magnetic bead unit have a good inhibitory effect on the second wireless electromagnetic radiation of 720MHz.

[0086] Figure 7 shows a schematic diagram of the connection of a second magnetic bead module 500 according to some embodiments of this specification. The communication unit 111 of the first earphone module 100 can connect to other components of the first earphone module 100 via a series of interfaces 111-B, thereby achieving electrical connections between the components within the first earphone module 100. The second magnetic bead module 500 includes at least one of the fifth magnetic bead unit 55, the sixth magnetic bead unit 560, or the seventh magnetic bead unit 570.

[0087] The communication unit 111 may also include a first microphone interface, which includes a microphone power positive interface, a microphone power ground interface, a first microphone data positive interface, and a first microphone data negative interface. The microphone power positive interface is connected to the microphone positive line, the microphone power ground interface is connected to the microphone negative line, the first microphone data positive interface is connected to the first microphone data positive line, and the first microphone data negative interface is connected to the first microphone data negative line, so as to connect the power and signal between the first microphone and the communication unit 111. The fifth magnetic bead unit 550 is connected to the first microphone via the first microphone interface. At least magnetic bead 551 in the fifth magnetic bead unit 550 is connected to the microphone power positive interface, magnetic bead 553 is connected to the microphone power ground interface, magnetic bead 555 is connected to the first microphone data positive interface, and magnetic bead 557 is connected to the first microphone data negative interface, so as to block or partially obstruct the second wireless electromagnetic radiation from entering the first ear hook wire 120 through the first microphone interface.

[0088] The communication unit 111 may also include a second microphone interface, which includes a second microphone data positive interface and a second microphone data negative interface. The second microphone data positive interface is connected to the second microphone data positive line, and the second microphone data negative interface is connected to the second microphone data negative line, so as to communicate the signal between the second microphone and the communication unit. The sixth magnetic bead unit 560 is connected to the second microphone through the second microphone interface. At least one magnetic bead 561 in the sixth magnetic bead unit 560 is connected to the second microphone data positive interface, and at least one magnetic bead 563 in the sixth magnetic bead unit 560 is connected to the second microphone data negative interface to prevent the second wireless electromagnetic radiation from entering the first ear hook line 120 through the second microphone interface.

[0089] The communication unit 111 may also include a first speaker data interface, which includes a first speaker data positive interface and a first speaker data negative interface. The first speaker data positive interface is connected to the first speaker data positive line, and the first speaker data negative interface is connected to the first speaker data negative line. The seventh magnetic bead unit 570 is connected to the first core unit 130 through the first speaker data interface. At least one magnetic bead 571 in the seventh magnetic bead unit 570 is connected to the first speaker data positive interface, and at least one magnetic bead 573 in the seventh magnetic bead unit 570 is connected to the first speaker data negative interface to prevent the second wireless electromagnetic radiation from entering the first ear hook line 120 through the first speaker data interface.

[0090] As mentioned above, the communication unit 111 may include a control element and a power amplifier element. The control element is connected to at least one of the first microphone interface or the second microphone interface via the second magnetic bead module 500. The power amplifier element is connected to the first speaker data interface via the second magnetic bead module 500.

[0091] In summary, the high-frequency clock signal generated by the earphone 001 provided in this specification during the wired transmission of the target data will not only radiate electromagnetic waves with the same frequency, but also radiate a set of harmonics that are multiples of the frequency. For higher-frequency harmonics, the shorter first ear hook wire 120 may become the antenna for its external transmission. Therefore, the earphone provided in this specification is provided with a second magnetic bead module 500 between the communication unit and the first core unit to at least partially block the harmonic signal of the clock signal from emitting the second wireless electromagnetic radiation through the first ear hook wire 120.

[0092] Figure 8 shows a comparative test diagram of headphones provided according to some embodiments of this specification. The horizontal axis of the figure represents the frequency of the electromagnetic wave, and the vertical axis represents the electric field strength measured at a distance of 3 meters from the headphones to be tested. The left figure shows the test diagram before the first and second magnetic bead modules are installed, and the right figure shows the test diagram after the first and second magnetic bead modules are installed. By comparison, it can be seen that after the two magnetic bead modules are installed, the electromagnetic waves of 240MHz and 720MHz are effectively suppressed, making the electromagnetic radiation of the headphones lower than the constraints in the current electromagnetic compatibility standards.

[0093] In summary, the earphones provided in this specification have a first magnetic bead module disposed between the first earphone module and the second earphone module to at least partially block the first wireless electromagnetic radiation from being emitted outward through the wire. Furthermore, the earphones provided in this specification have a second magnetic bead module disposed between the communication unit and the first core unit to at least partially block the second wireless electromagnetic radiation from being emitted outward through the first ear hook wire. Furthermore, when the earphones provided in this specification perform high-speed wired data transmission, the electromagnetic interference radiated outward by the earphones provided in this specification is controlled within the specified range of the universal standard.

[0094] The foregoing description describes specific embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in an order different from that described in the embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require a specific or sequential order to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0095] In summary, after reading this detailed disclosure, those skilled in the art will appreciate that the foregoing detailed disclosure may be presented by way of example only and may not be limiting. Although not expressly stated herein, those skilled in the art will understand that the present application requires various reasonable changes, improvements, and modifications to the embodiments. Such changes, improvements, and modifications are intended to be proposed by the present application and are within the spirit and scope of the exemplary embodiments of the present application.

[0096] In addition, certain terms in this application have been used to describe embodiments of the application. For example, "one embodiment," "an embodiment," and / or "some embodiments" mean that a particular feature, structure, or characteristic described in conjunction with that embodiment may be included in at least one embodiment of the application. Therefore, it is emphasized and should be understood that two or more references to "an embodiment," "one embodiment," or "an alternative embodiment" in various sections of this application do not necessarily refer to the same embodiment. Furthermore, particular features, structures, or characteristics may be appropriately combined in one or more embodiments of the application.

[0097] It should be understood that in the foregoing description of the embodiments of this application, in order to facilitate understanding of a feature and to simplify this application, this application combines various features into a single embodiment, figure, or description thereof. However, this does not mean that the combination of these features is required. When reading this application, it is entirely possible for a person skilled in the art to mark out some of the devices and understand them as separate embodiments. In other words, the embodiments of this application can also be understood as the integration of multiple secondary embodiments. This also applies when the content of each secondary embodiment is less than all the features of a single aforementioned disclosed embodiment.

[0098] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, documents, articles, and the like, cited herein, except any historical prosecution documents to which it relates, any equivalent that may be inconsistent or conflicting with this document, or any equivalent historical prosecution documents that may have a limiting effect on the broadest scope of the claims, is hereby incorporated by reference for all purposes now or hereafter connected with this document. In addition, in the event of any inconsistency or conflict between the descriptions, definitions, and / or use of terms associated with any incorporated material and the terminology, descriptions, definitions, and / or use associated with this document, the terminology in this document shall control.

[0099] Finally, it should be understood that the embodiments of the application disclosed herein are illustrations of the principles of the embodiments of the present application. Other modified embodiments are also within the scope of the present application. Therefore, the embodiments disclosed in the present application are merely examples and not limitations. Those skilled in the art can adopt alternative configurations based on the embodiments in the present application to implement the applications in the present application. Therefore, the embodiments of the present application are not limited to the embodiments precisely described in the application.

Claims

1. An earphone, comprising: A first earphone module, including a data transmission unit, which performs wired transmission of target data with the outside world when working; A second earphone module, electrically connected to the first earphone module through a wire; And A first bead module, disposed between the first earphone module and the second earphone module to at least partially block the first wireless electromagnetic radiation emitted outward at the wire due to the wired transmission.

2. The earphone according to claim 1, characterized in that, The ratio of the wavelength of the first wireless electromagnetic radiation to the length of the wire is in the range of 3.7 to 4.

3.

3. The earphone according to claim 1 or 2, characterized in that, The frequency of the first wireless electromagnetic radiation is in the range of 220 MHz to 260 MHz, and the length of the wire is in the range of 27 cm to 37 cm.

4. The earphone according to any one of claims 1-3, characterized in that, The first bead module includes at least one bead, and the impedance of the at least one bead reaches a peak in the frequency range of 220 MHz to 800 MHz.

5. The earphone according to any one of claims 1 to 4, characterized in that, The data transmission unit includes: A data transmission interface; A memory for storing the target data; and A data input / output circuit, electrically connected to the data transmission interface and the memory, wherein the wired transmission of the target data includes: the data input / output circuit wired receives the target data sent by the outside world through the data transmission interface, or wired sends the target data to the outside world through the data transmission interface.

6. The earphone according to claim 5, wherein It further includes a signal shield, at least partially covering the data input / output circuit to at least partially block the external radiation generated during the wired transmission of the target data.

7. The earphone according to any one of claims 1-6, characterized in that The first earphone module includes a communication unit and a first movement unit; The second earphone module includes a power supply unit and a second movement unit; and The first bead module is connected to the communication unit to at least partially block at least part of the first wireless electromagnetic radiation generated by the clock signal of the communication unit causing the wire.

8. The earphone according to claim 7, characterized in that The second earphone module further includes a power supply temperature detector and a button; The communication unit includes at least one of a power supply interface, a power supply temperature detection signal interface, a button signal interface, or a second speaker data interface; and The first bead module includes at least one of a first bead unit, a second bead unit, a third bead unit, or a fourth bead unit, wherein the first bead unit is connected to the power supply unit through the power supply interface, The second bead unit is connected to the power supply temperature detector through the power supply temperature detection signal interface, The third bead unit is connected to the button through the button signal interface, The fourth bead unit is connected to the second movement unit through the second speaker data interface.

9. The earphone according to claim 8, characterized in that The power supply interface includes a power supply positive interface and a power supply ground interface; The second speaker data interface includes a second speaker data positive interface and a second speaker data negative interface, wherein at least one bead in the first bead unit is connected to the power supply positive interface, At least one bead in the first bead unit is connected to the power supply ground interface, At least one bead in the fourth bead unit is connected to the positive second speaker data interface, and At least one bead in the fourth bead unit is connected to the negative second speaker data interface.

10. The earphone according to claim 8 or 9, characterized in that, The communication unit includes a control element and a power amplifier element that are electrically connected; The control element is connected to at least one of the power supply interface, the power supply temperature detection signal interface, or the key signal interface through the first bead module; And The power amplifier element is connected to the second speaker data interface through the first bead module.

11. The earphone according to any one of claims 7-10, wherein The power supply unit includes a battery; The communication unit and the first movement unit are connected by a first ear hook wire; and The power supply unit and the second movement unit are connected by a second ear hook wire.

12. The earphone according to claim 11, characterized in that, It further includes a second bead module, which is arranged between the communication unit and the first movement unit to at least partially block the second wireless electromagnetic radiation of the harmonic signal of the clock signal from being emitted outward through the first ear hook wire; The first earphone module further includes at least one of a first microphone or a second microphone; The communication unit further includes at least one of a first microphone interface, a second microphone interface, or a first speaker data interface; and The second bead module includes at least one of a fifth bead unit, a sixth bead unit, or a seventh bead unit, wherein, at least one bead in the fifth bead unit is connected to the first microphone through the first microphone interface, At least one bead in the sixth bead unit is connected to the second microphone through the second microphone interface, and At least one bead in the seventh bead unit is connected to the first movement unit through the first speaker data interface.

13. The earphone according to claim 12, wherein The first microphone interface includes a microphone power supply positive interface, a microphone power supply ground interface, a first microphone data positive interface, and a first microphone data negative interface; The second microphone interface includes a second microphone data positive interface and a second microphone data negative interface; and The first speaker data interface includes a first speaker data positive interface and a first speaker data negative interface, wherein, at least one bead in the fifth bead unit is connected to the microphone power supply positive interface, At least one bead in the fifth bead unit is connected to the microphone power supply ground interface, At least one bead in the fifth bead unit is connected to the first microphone data positive interface, At least one bead in the fifth bead unit is connected to the first microphone data negative interface. At least one bead in the sixth bead unit is connected to the second microphone data positive interface, At least one bead in the sixth bead unit is connected to the second microphone data negative interface, At least one bead in the seventh bead unit is connected to the first speaker data positive interface, and At least one bead in the seventh bead unit is connected to the first speaker data negative interface.

14. The earphone according to claim 12 or 13, characterized in that, The communication unit includes a control element and a power amplifier element that are electrically connected; The control element is connected to at least one of the first microphone interface and the second microphone interface through the second bead module; And The power amplifier element is connected to the first speaker data interface through the second bead module.

15. The earphone according to any one of claims 1 to 14, characterized in that, It further includes a connecting portion for connecting the first earphone module and the second earphone module, and the connecting portion includes: An elastic bracket; The wire extends along the elastic bracket; And An insulating outer skin that wraps the elastic bracket and the wire.

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