Electronic device

Abstract

An electronic device. The electronic device may include a mobile phone, a tablet computer, a notebook computer and the like. A recess is formed in a front side surface of a middle frame to enlarge a mounting space of a vapor chamber portion, the vapor chamber portion is arranged to be of a structure comprising a first vapor chamber and a second vapor chamber, the first vapor chamber is fixed to the front side surface of the middle frame, and then the second vapor chamber is fixed in a mounting cavity defined by the first vapor chamber and the recess. By providing the second vapor chamber, the overall volume of the vapor chamber portion can be increased, the heat dissipation performance of the electronic device is improved, and the slim and lightweight design of the electronic device is not affected.

Description

An electronic device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 26, 2023, with application number 202323576757.9 and invention name “An Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of communication equipment, and in particular to an electronic device. Background Art

[0003] With industrial development and social progress, electronic devices, such as mobile phones, are being used in a wider range of scenarios and have become essential to human life. However, as our dependence on mobile phones increases, they are required to have more and more functions. This leads to increased power consumption and significant heat generation during use, impacting the user experience.

[0004] The heat dissipation performance of mobile phones is guaranteed by a heat spreader inside the mobile phone. However, as mobile phones become thinner and lighter, the installation space of the heat spreader is limited, and the heat dissipation performance is restricted. How to improve the heat dissipation performance of mobile phones and other electronic devices within a limited space is a technical problem that technicians in this field urgently need to solve.

[0005] Summary of the Invention

[0006] An embodiment of the present application provides an electronic device, which increases the installation space of a heat spreader by setting a groove in a middle frame, and sets the heat spreader to a structure including a first heat spreader and a second heat spreader, wherein the second heat spreader is located in the groove, thereby increasing the overall volume of the heat spreader, thereby improving the heat dissipation performance of the electronic device without affecting the requirements of a lightweight and thin design.

[0007] An embodiment of the present application provides an electronic device comprising a middle frame and a heat spreader, the heat spreader comprising a first heat spreader and at least one second heat spreader. A groove is provided on the front surface of the middle frame, and the first heat spreader is adhesively secured to the front surface of the middle frame and encloses the groove to form a mounting cavity. The groove provided in the middle frame increases the mounting space for the heat spreader. The heat spreader is configured to comprise the first heat spreader and the second heat spreader, with the second heat spreader positioned within the groove. This improves the heat dissipation performance of the heat spreader while maintaining a lightweight and thin design.

[0008] In some embodiments of the present application, the first heat spreader and the middle frame are fixed to each other along the circumference by the first adhesive layer, which provides good fixing stability and a simple structure.

[0009] In some embodiments of the present application, the first vapor chamber and the middle frame are further fixed by glue dots arranged along the circumference to further ensure the bonding stability between the first vapor chamber and the middle frame.

[0010] In some embodiments of the present application, the first and second vapor chambers are integrated into one structure, which simplifies the overall structure of the vapor chamber and facilitates installation.

[0011] In some embodiments of the present application, the first vapor chamber and the second vapor chamber are independent structures and fixed by bonding. This arrangement allows for greater flexibility in the arrangement of the second vapor chamber and reduces costs.

[0012] In some embodiments of the present application, the first and second vapor chambers are bonded together by a second adhesive layer, which is arranged along the circumference of the second vapor chamber. Bonding the first and second vapor chambers together by the second adhesive layer provides good stability and a simple structure.

[0013] In some embodiments of the present application, a first thermally conductive adhesive layer is further provided between the first and second vapor chambers, with the first thermally conductive adhesive layer being located within the area enclosed by the second backing adhesive layer. The provision of the first thermally conductive adhesive layer ensures effective heat conduction between the first and second vapor chambers.

[0014] In some embodiments of the present application, a second thermally conductive adhesive layer is provided between the second vapor chamber and the bottom wall of the groove. The provision of the second thermally conductive adhesive layer ensures heat conduction between the second vapor chamber and the bottom wall of the groove while also balancing processing errors.

[0015] In some embodiments of the present application, a first support portion is further provided between the second vapor chamber and the bottom wall of the groove. The height of the first support portion is less than the distance between the second vapor chamber and the bottom wall of the groove. During the pressure holding test, the first support portion can provide support for the second vapor chamber, and thus for the first vapor chamber, thereby preventing the first vapor chamber from undergoing significant deformation at the groove due to the second thermally conductive adhesive layer being crushed and unable to recover, thereby improving product yield.

[0016] In some embodiments of the present application, the first support portion is a support adhesive layer, which is bonded to the second heat spreader or the bottom wall of the tank. This configuration can simplify the molding process of the first support portion.

[0017] In some embodiments of the present application, the second vapor chamber is bonded to the bottom wall of the groove via a third adhesive layer, which is arranged circumferentially along the second vapor chamber. Bonding the second vapor chamber to the middle frame via the third adhesive layer provides excellent stability and a simple structure.

[0018] In some embodiments of the present application, a third thermally conductive adhesive layer is provided between the second vapor chamber and the bottom wall of the tank. The third thermally conductive adhesive layer is located within the area enclosed by the third backing adhesive layer. The provision of the third thermally conductive adhesive layer ensures effective heat conduction between the second vapor chamber and the bottom wall of the tank.

[0019] In some embodiments of the present application, a fourth thermally conductive adhesive layer is further provided between the first vapor chamber and the second vapor chamber, thereby ensuring heat conduction between the first vapor chamber and the second vapor chamber.

[0020] In some embodiments of the present application, a second support portion is provided between the first and second vapor chambers. The height of the second support portion is less than the distance between the first and second vapor chambers. During the pressure holding test, the second support portion can provide support for the first vapor chamber, preventing the first vapor chamber from undergoing significant and irreversible deformation at the groove due to the fourth thermally conductive adhesive layer being crushed, thereby improving product yield.

[0021] In some embodiments of the present application, the second support portion is a support adhesive layer, which is bonded to the first vapor chamber or the second vapor chamber. This configuration can simplify the molding process of the second support portion.

[0022] In some embodiments of the present application, a display screen and a rear housing are further included. The display screen is fixed to the side of the middle frame facing the heat spreader, and the rear housing is fixed to the side of the middle frame away from the heat spreader. The display screen, rear housing, and middle frame together form a housing. The electronic device can be a mobile phone, tablet computer, etc. The heat spreader ensures the overall heat dissipation performance of the electronic device, thereby ensuring the normal operation of the electronic device.

[0023] Some embodiments of the present application also include a motherboard fixed within the housing. The motherboard is secured to the side of the midframe away from the heat sink, and grooves are provided in the midframe corresponding to the motherboard. The motherboard is the primary heat-generating component within the electronic device, and a second heat sink is positioned corresponding to the motherboard to dissipate heat generated by the motherboard in a timely manner, ensuring overall heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application;

[0025] FIG2 is a front side view of FIG1 with the display screen removed;

[0026] FIG3 is a cross-sectional view of an electronic device provided in an embodiment of the present application;

[0027] FIG4 is a cross-sectional view of the electronic device with the display screen and rear housing removed, wherein the second vapor chamber is fixed to the first vapor chamber;

[0028] FIG5 is a cross-sectional view of the electronic device with the display screen and rear housing removed, wherein a first support portion is fixedly provided on the bottom wall of the groove;

[0029] FIG6 is a cross-sectional view of the electronic device with the display screen and rear housing removed, wherein the bottom wall of the groove is integrally formed with a first support portion;

[0030] FIG7 is a cross-sectional view of the electronic device with the display screen and rear housing removed, wherein the second vapor chamber is fixed with a first support portion;

[0031] FIG8 is a cross-sectional view of the electronic device with the display screen and rear housing removed, wherein the second vapor chamber is integrally formed with the first support portion;

[0032] FIG9 is a cross-sectional view of the electronic device with the display screen and rear housing removed, wherein the second heat sink is fixed to the bottom wall of the tank;

[0033] FIG10 is a cross-sectional view of the electronic device with the display screen and rear housing removed, wherein the second vapor chamber is fixed with a second support portion;

[0034] FIG11 is a cross-sectional view of the electronic device with the display screen and rear housing removed, wherein the second vapor chamber is integrally formed with the second support portion;

[0035] FIG12 is a cross-sectional view of the electronic device with the display screen and rear housing removed, wherein the first vapor chamber is fixed with a second support portion;

[0036] FIG13 is a cross-sectional view of the electronic device with the display screen and the rear cover removed, wherein the first heat spreader is integrally formed with the second support portion.

[0037] In Figures 1 to 13, the reference numerals are explained as follows: 1 middle frame, 11 groove, 111 groove bottom wall; 2 heat spreader, 21 first heat spreader, 22 second heat spreader; 3 first adhesive layer; 4 second adhesive layer; 5 third adhesive layer; 6 first thermal conductive adhesive layer; 7 second thermal conductive adhesive layer; 8 third thermal conductive adhesive layer; 9 fourth thermal conductive adhesive layer; 10 first supporting part; 12 second supporting part; 13 display screen; 14 rear cover; 15 mainboard; 16 battery. DETAILED DESCRIPTION

[0038] The embodiments of the present application provide an electronic device, including but not limited to a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a driving recorder, a wearable device, a virtual reality device, a wireless USB flash drive, a Bluetooth speaker / headphone, or a mobile or fixed terminal with a middle frame, such as a car front-end.

[0039] When the electronic device is a mobile phone or a tablet computer, as shown in Figures 1 to 3, the electronic device includes a middle frame 1, a display screen 13 and a back cover 14. The display screen 13 can be fixed to the front side of the middle frame 1 by bonding, snapping, etc., and the back cover 14 can be fixed to the back side of the middle frame 1 by bonding, snapping, fastener connection, etc. The middle frame 1, the display screen 13 and the back cover 14 are combined to form a shell. The electronic device also includes components such as a mainboard 15, a battery 16 and a heat spreader 2 arranged in the shell. The electronic device can improve the heat dissipation performance through the heat spreader 2.

[0040] Among them, the motherboard 15 is fixed on the rear side of the middle frame 1, and the heat spreader 2 is fixed on the front side of the middle frame 1 and is located between the middle frame 1 and the display screen 13. During the use of the electronic device, the motherboard 15, battery 16 and other components will generate heat. The heat spreader can disperse the heat generated by the motherboard 15, battery 16, etc. to avoid local excessive temperature that may cause the electronic device to burn out. At the same time, it can also provide protection for components such as the motherboard 15 and battery 16.

[0041] 1 and 3, "front" refers to the side toward the display screen 13, and "rear" refers to the side toward the rear housing 14.

[0042] As shown in Figures 3 to 13, in this embodiment, the heat spreading part 2 includes a first heat spreading plate 21 and a second heat spreading plate 22 stacked in the front-to-back direction, wherein the heat spreading area of ​​the first heat spreading plate 21 is larger than the heat spreading area of ​​the second heat spreading plate 22, the first heat spreading plate is fixed to the front surface of the middle frame 1, the second heat spreading plate 22 is located between the first heat spreading plate 21 and the middle frame 1, and the rear surface of the second heat spreading plate 22 is fixed to the front surface of the middle frame 1.

[0043] The first vapor chamber 21 is secured to the middle frame 1 via a first adhesive layer 3. This first adhesive layer 3 is arranged along the circumference of the first vapor chamber 21 and is bonded between the skirt of the first vapor chamber 21 and the middle frame 1. This arrangement provides stable attachment and a simple structure. If the first adhesive layer 3 is narrow, adhesive can be applied to the front surfaces of the first vapor chamber 21 and the middle frame 1 to ensure stable attachment.

[0044] The front surface of the middle frame 1 is provided with a groove 11. After the first heat spreader 21 and the middle frame 1 are fixed, an installation cavity can be enclosed between the first heat spreader 21 and the groove 11, and the second heat spreader 22 is fixed in the installation cavity. This arrangement can prevent the second heat spreader 22 from affecting the installation of the first heat spreader 21, and can also prevent the second heat spreader 22 from affecting the overall thickness of the electronic device. In other words, when the overall thickness of the electronic device remains unchanged, by locally providing the groove 11 in the middle frame 1 to increase the installation space of the heat spreader 2, and adding the second heat spreader 22, the overall volume of the heat spreader 2 is increased, thereby improving the heat dissipation performance of the heat spreader 2, and thus improving the heat dissipation capacity of the electronic device, ensuring the stable operation of the electronic device, while not affecting the overall thickness of the electronic device.

[0045] Specifically, in this embodiment, there is no limit to the number of second heat spreaders 22, and it can be one or two or more. The main board 15 is the main heating element inside the electronic device, and the heat spreader 2 is provided with a second heat spreader 22 corresponding to the main board 15. That is, the main board 15 is fixed to the rear side of the middle frame 1, and a groove 11 is provided on the front surface of the middle frame 1 at a position corresponding to the main board 15. With such a setting, the distance between the second heat spreader 22 and the main board 15 is small, and the heat generated by the main board 15 can be transferred to the first heat spreader 21 in a timely and effective manner, thereby improving the heat dissipation performance. The heat spreader 2 can also be provided with a second heat spreader 22 corresponding to the camera element, and the specific setting can be based on actual conditions.

[0046] In this embodiment, there is no specific restriction on the shape, area, thickness, etc. of each heat spreader (including the first heat spreader 21 and the second heat spreader 22). It is not difficult to understand that the larger the area and thickness of the heat spreader, the better the heat dissipation capacity. The shape, area and thickness of each heat spreader can be arranged according to the structure of the middle frame 1 and the space between the middle frame 1 and the screen.

[0047] When there are two or more second vapor chambers 22 , the shapes, areas, thicknesses, etc. of the second vapor chambers 22 may be the same or different, and may be arranged according to the actual space.

[0048] Furthermore, in this embodiment, to further enhance heat dissipation performance, heat spreader 2 may be configured to include a third heat spreader fixedly disposed between the rear surface of second heat spreader 22 and middle frame 1. For example, a receiving slot for accommodating the third heat spreader may be defined in bottom wall 111 of recess 11. The installation method between the third heat spreader, second heat spreader 22, and middle frame 1 may refer to the installation method for second heat spreader 22, and may be specifically configured based on the structure of middle frame 1. Configuring heat spreader 2 to include first heat spreader 21 and second heat spreader 22 improves heat dissipation performance while simplifying the overall structure and the molding process of middle frame 1.

[0049] As shown in Figure 3, in this embodiment, the first vapor chamber 21 and the second vapor chamber 22 can be an integrated structure. In this case, the rear surface of the first vapor chamber 21 is partially raised to form the second vapor chamber 22. This configuration simplifies the molding process and installation. Alternatively, the first vapor chamber 21 and the second vapor chamber 22 can be configured as independent structures. This configuration provides greater flexibility in the configuration of the second vapor chamber 22 and reduces costs.

[0050] As shown in Figures 4 to 6, when the first heat spreader 21 and the second heat spreader 22 are independent structures and are fixed by bonding, the first heat spreader 21 and the second heat spreader 22 are bonded and fixed by the second adhesive layer 4. The second adhesive layer 4 is arranged along the circumference of the second heat spreader 22 to ensure the bonding stability between the first heat spreader 21 and the second heat spreader 22.

[0051] Furthermore, a first thermally conductive adhesive layer 6 is provided between the first heat spreader 21 and the second heat spreader 22. The first thermally conductive adhesive layer 6 is located in the area enclosed by the second back adhesive layer 4. Specifically, the second back adhesive layer 4 is first circumferentially bonded to the front surface of the second heat spreader 22 or the rear surface of the first heat spreader 21, and then the thermally conductive adhesive is filled in the area enclosed by the second back adhesive layer 4. Then, the rear surface of the first heat spreader 21 and the front surface of the second heat spreader 22 are bonded together. The two can be fixed by the second back adhesive layer 4, and the first thermally conductive adhesive layer 6 can be spread flat in the area enclosed by the second back adhesive layer 4. The thickness of the first thermally conductive adhesive layer 6 and the second back adhesive layer 4 are the same.

[0052] The rear surface of the first heat spreader 21 and the front surface of the second heat spreader 22 are fixed together by the second adhesive layer 4 and the first thermal conductive adhesive layer 6 , which can improve the heat transfer effect while ensuring the fixing stability, thereby improving the heat dissipation performance.

[0053] As shown in FIG4-8 , a second thermal conductive adhesive layer 7 is further provided between the second vapor chamber 22 and the bottom wall 111 of the groove 11 to ensure the stability and heat transfer effect of the second vapor chamber 22 and the bottom wall 111 .

[0054] The first heat spreader 21 and the second heat spreader 22 are set as an integrated structure, or after the independent first heat spreader 21 and the second heat spreader 22 are glued and fixed, the heat spreader 2 can be used as an integral structure and assembled with the middle frame 1 as a whole. Specifically, the second thermal conductive adhesive layer 7 can be coated on the bottom wall 111 of the groove 11, and then the heat spreader 2 is fixed to the middle frame 1 as a whole. During the process of the first heat spreader 21 being glued and fixed to the middle frame 1 through the first back adhesive layer 3, the second heat spreader 22 can squeeze the second thermal conductive adhesive layer 7 until the first heat spreader 21 is fixed to the middle frame 1. The heat spreader 2 is fixed to the middle frame 1 as a whole, and the second heat spreader 22 is stably fixed in the installation cavity. That is to say, in the assembled state, the second heat spreader 22 is attached to the first heat spreader 21 through the first thermal conductive adhesive layer 6, and at the same time, the second heat spreader 22 is attached to the bottom wall 111 of the groove through the second thermal conductive adhesive layer 7 to ensure the heat transfer effect.

[0055] In addition, due to errors, the distance between the second heat spreader 22 and the bottom wall 111 of the groove may change before assembly. When the second thermally conductive adhesive layer 7 is set between the second heat spreader 22 and the bottom wall 111 of the groove, the error can be balanced by the second heat spreader 22 squeezing and deforming the second thermally conductive adhesive layer 7. Therefore, during the assembly process, the second heat spreader 22 can be prevented from lifting the first heat spreader 21, resulting in the inability to install the first heat spreader 21. At the same time, it can also avoid the situation where the rear side surface of the second heat spreader 22 cannot fit with the bottom wall 111 of the groove.

[0056] Electronic devices taking mobile phones as an example also need to be subjected to a pressure holding test. During the test, due to the setting of the groove 11, after the first heat spreader 21 is subjected to pressure, the position corresponding to the groove 11 may be deformed and recessed into the groove 11. In order to prevent the first heat spreader 21 from being excessively recessed and deformed and unable to recover, as shown in Figures 3, 5 and 6, in this embodiment, a first supporting portion 10 is further fixed between the second heat spreader 22 and the groove bottom wall 111. The first supporting portion 10 provides support for the second heat spreader 22, and then provides support for the first heat spreader 21, thereby avoiding the situation where the first heat spreader 21 is greatly deformed at the groove 11 and cannot be recovered due to the crushing of the second thermal conductive adhesive layer 7, thereby improving the product yield.

[0057] The height of the first support portion 10 is smaller than the distance between the second vapor chamber 22 and the bottom wall 111 of the groove. In the installed state, the thickness of the second thermally conductive adhesive layer 7 is greater than the thickness of the first support portion 10. The first support portions 10 are arranged continuously or at intervals along the circumference of the second vapor chamber 22. This arrangement can further ensure the support stability of the first support portions 10.

[0058] As shown in Figures 3, 5, and 6, the first support portion 10 is fixed to the tank bottom wall 111. In the installed state, a gap is left between the first support portion 10 and the second vapor chamber 22. Alternatively, as shown in Figures 7 and 8, the first support portion 10 is fixed to the second vapor chamber 22. In the installed state, a gap is left between the first support portion 10 and the tank bottom wall 111.

[0059] During the pressure holding test, the first heat spreader 22 is recessed into the groove 11 due to the lack of support at the groove 11, and pushes the second heat spreader 22 to continue to squeeze the second thermal conductive adhesive layer 7. The thickness of the second thermal conductive adhesive layer 7 is thinned after being squeezed until the two sides of the first support part 10 are respectively pressed against or fixed to the second heat spreader 22 and the groove bottom wall 111. The first support part 10 can provide support for the second heat spreader 22, and then provide support for the first heat spreader 21.

[0060] In this embodiment, the specific structure of the first support portion 10 is not limited. The first support portion 10 can be set as a supporting adhesive layer, and the supporting adhesive layer can be directly bonded to the bottom wall 111 of the groove (as shown in FIG5 ) or the second heat spreader 22 (as shown in FIG7 ), thereby simplifying the processing technology. Alternatively, a protrusion can be integrally formed on the bottom wall 111 of the groove as shown in FIG6 , or a protrusion can be integrally formed on the rear surface of the second heat spreader 22 as shown in FIG8 , and the first support portion 10 can be formed by the protrusion.

[0061] Moreover, as shown in Figures 5-8, the second thermally conductive adhesive layer 7 is located in the area enclosed by the first support portion 10, or the second thermally conductive adhesive layer 7 can also completely cover the rear surface of the second heat spreader 22, or the second thermally conductive adhesive layer 7 can also completely cover the bottom wall 111 of the groove 11.

[0062] As shown in Figures 9 to 13, when the first heat spreader 21 and the second heat spreader 22 are independent structures, the second heat spreader 22 can also be fixed to the bottom wall 111 of the groove. During assembly, the second heat spreader 22 is first placed in the groove 11 and bonded and fixed to the bottom wall 111 of the groove, and then the first heat spreader 21 is fixed to the middle frame 1.

[0063] Specifically, the second heat spreader 22 and the groove bottom wall 111 are bonded and fixed by a third adhesive layer 5 , and the third adhesive layer 5 is arranged along the circumference of the second heat spreader 22 to ensure the bonding stability between the second heat spreader 22 and the middle frame 1 .

[0064] Furthermore, a third thermally conductive adhesive layer 8 is provided between the second heat spreader 22 and the bottom wall 111 of the groove. The third thermally conductive adhesive layer 8 is located in the area enclosed by the third back adhesive layer 5. Specifically, the third back adhesive layer 5 is first circumferentially bonded to the rear surface of the second heat spreader 22 or the bottom wall 111 of the groove, and then the thermal conductive adhesive is filled in the area enclosed by the third back adhesive layer 5. The rear surface of the second heat spreader 22 and the bottom wall 111 of the groove are then fitted together. The two can be fixed by the third back adhesive layer 5, and the third thermally conductive adhesive layer 8 can be spread flat in the area enclosed by the third back adhesive layer 5. The thickness of the third thermally conductive adhesive layer 8 and the third back adhesive layer 5 are the same.

[0065] The rear surface of the second heat spreader 22 and the groove bottom wall 111 are fixed together by the third backing adhesive layer 5 and the third thermal conductive adhesive layer 8, which can improve the heat transfer effect while ensuring the fixing stability, thereby improving the heat dissipation performance.

[0066] As shown in FIG9-FIG13 , a fourth thermal conductive adhesive layer 9 is further provided between the first vapor chamber 21 and the second vapor chamber 22 to ensure the stability of the bonding and the heat transfer effect of the first vapor chamber 21 and the second vapor chamber 22 .

[0067] Before fixing the first heat spreader 21 to the middle frame 1, the second heat spreader 22 has been fixed to the bottom wall 111 of the groove. During the process of assembling the first heat spreader 21 so that it is bonded and fixed to the middle frame 1 through the first back adhesive layer 3, the first heat spreader 21 moves toward the side close to the second heat spreader 22 and squeezes the fourth thermal conductive adhesive layer 9 until the first heat spreader 21 is fixed to the middle frame 1, thereby ensuring that the fourth thermal conductive adhesive layer 9 can be stably fitted between the first heat spreader 21 and the second heat spreader 22 in the assembled state.

[0068] Furthermore, due to errors, the distance between the first heat spreader 21 and the second heat spreader 22 may change before assembly. When the fourth thermally conductive adhesive layer 9 is set between the first heat spreader 21 and the second heat spreader 22, the error can be balanced by squeezing and deforming the fourth thermally conductive adhesive layer 9 by the first heat spreader 21 and the second heat spreader 22. This can prevent the second heat spreader 22 from lifting the first heat spreader 21 during the assembly process, causing the first heat spreader 21 to be unable to be installed or to hit the display screen 13. At the same time, it can also prevent the first heat spreader 21 and the second heat spreader 22 from being unable to fit together.

[0069] As shown in Figures 10 to 13, in this embodiment, a second support portion 12 is further fixedly provided between the first heat spreader 21 and the second heat spreader 22. The second support portion 12 provides support to the first heat spreader 21, thereby preventing the first heat spreader 21 from being significantly deformed at the groove 11 and unable to recover due to the fourth thermal conductive adhesive layer 9 being crushed, thereby improving the product yield.

[0070] The height of the second support portion 12 is smaller than the distance between the first vapor chamber 21 and the second vapor chamber 22. In the installed state, the thickness of the fourth thermally conductive adhesive layer 9 is greater than the thickness of the second support portion 12. Specifically, the second support portion 12 is fixed to the first vapor chamber 21 or the second vapor chamber 22. The second support portions 12 are arranged continuously or at intervals along the circumference of the second vapor chamber 22. This arrangement can further ensure the support stability of the first support portion 10.

[0071] As shown in Figures 10 and 11, the second support portion 12 is fixed to the second vapor chamber 22. In the installed state, a gap is left between the second support portion 12 and the first vapor chamber 21. Alternatively, as shown in Figures 12 and 13, the second support portion 12 is fixed to the first vapor chamber 21. In the installed state, a gap is left between the second support portion 12 and the second vapor chamber 22.

[0072] During the pressure holding test, the first heat spreader 22 is recessed into the groove 11 due to lack of support at the groove 11, and squeezes the fourth thermal conductive adhesive layer 9. The thickness of the fourth thermal conductive adhesive layer 9 is thinned after being squeezed until the two sides of the second support part 12 are respectively pressed against or fixed to the first heat spreader 21 and the second heat spreader 22. The second support part 12 can provide support for the first heat spreader 21.

[0073] In this embodiment, the specific structure of the second support portion 12 is not limited. The second support portion 12 can be set as a supporting adhesive layer, and the supporting adhesive layer can be directly bonded to the first heat spreader 21 (as shown in FIG12 ) or the second heat spreader 22 (as shown in FIG10 ), thereby simplifying the processing technology. Alternatively, as shown in FIG13 , a protrusion can be integrally formed on the rear surface of the first heat spreader 21, or as shown in FIG11 , a protrusion can be integrally formed on the front surface of the second heat spreader 22, and the second support portion 12 can be formed by the protrusion.

[0074] Moreover, as shown in FIG. 10 to FIG. 13 , the fourth thermally conductive adhesive layer 9 is located in the area enclosed by the second support portion 12 , or the fourth thermally conductive adhesive layer 9 may completely cover the front surface of the second vapor chamber 22 .

[0075] In addition, in this embodiment, there is no limit on the thickness of each adhesive layer (including the first adhesive layer 3, the second adhesive layer 4, and the third adhesive layer), such as 0.01 mm to 0.05 mm, which can be set according to actual conditions. The thickness of the supporting adhesive layer can be set according to the actual space.

[0076] This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the method and core ideas of this application. It should be noted that for those skilled in the art, without departing from the principles of this application, various improvements and modifications can be made to this application, and such improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. An electronic device, characterized in that: It comprises a middle frame (1) and a heat-sinking portion (2), wherein the heat-sinking portion (2) comprises a first heat-sinking plate (21) and at least one second heat-sinking plate (22); The front surface of the middle frame (1) is provided with a groove (11); the first heat spreader (21) is fixed to the front surface of the middle frame (1) and encloses the groove (11) to form an installation cavity; the second heat spreader (22) is fixed in the installation cavity.

2. The electronic device according to claim 1, wherein The first heat spreader (21) and the middle frame (1) are bonded and fixed along the circumferential direction via a first adhesive layer (3).

3. The electronic device according to claim 2, wherein: The first heat spreader (21) and the middle frame (1) are also fixed by glue points arranged along the circumference.

4. The electronic device according to claim 1, wherein: The first heat spreader (21) and the second heat spreader (22) are an integrated structure.

5. The electronic device according to claim 1, wherein The first heat spreader (21) and the second heat spreader (22) are independent structures.

6. The electronic device according to claim 5, characterized in that The first heat spreader (21) and the second heat spreader (22) are bonded and fixed via a second adhesive layer (4), and the second adhesive layer (4) is arranged along the circumference of the second heat spreader (22).

7. The electronic device according to claim 6, wherein: A first thermally conductive adhesive layer (6) is further provided between the first thermally conductive plate (21) and the second thermally conductive plate (22), and the first thermally conductive adhesive layer (6) is located within the area enclosed by the second back adhesive layer (4).

8. The electronic device according to any one of claims 4 to 7, characterized in that: A second heat-conducting adhesive layer (7) is provided between the second heat-spreading plate (22) and the bottom wall (111) of the groove (11).

9. The electronic device according to claim 8, wherein: A first support portion (10) is further provided between the second heat spreader (22) and the groove bottom wall (111), and a height of the first support portion (10) is smaller than a distance between the second heat spreader (22) and the groove bottom wall (111).

10. The electronic device according to claim 9, characterized in that The first supporting portion (10) is a supporting adhesive layer, and the supporting adhesive layer is bonded to the second heat spreader (22) or the groove bottom wall (111).

11. The electronic device according to claim 5, characterized in that The second heat spreader (22) is bonded and fixed to the bottom wall (111) of the groove (11) via a third adhesive layer (5), and the third adhesive layer (5) is arranged along the circumference of the second heat spreader (22).

12. The electronic device according to claim 11, wherein: A third thermally conductive adhesive layer (8) is further provided between the second heat spreader (22) and the groove bottom wall (111), and the third thermally conductive adhesive layer (8) is located within the area enclosed by the third back adhesive layer (5).

13. The electronic device according to claim 12, wherein: A fourth heat-conducting adhesive layer (9) is further provided between the first heat-vaporizing plate (21) and the second heat-vaporizing plate (22).

14. The electronic device according to claim 13, wherein: A second support portion (12) is further provided between the first heat soaking plate (21) and the second heat soaking plate (22), and a height of the second support portion (12) is smaller than a distance between the first heat soaking plate (21) and the second heat soaking plate (22).

15. The electronic device according to claim 14, characterized in that The second supporting portion (12) is a supporting adhesive layer, and the supporting adhesive layer is bonded to the first heat spreader (21) or the second heat spreader (22).

16. The electronic device according to any one of claims 1 to 7, characterized in that: The device further comprises a display screen (13) and a rear shell (14), wherein the display screen (13) is fixedly arranged on a side of the middle frame (1) facing the heat-dissipating portion (2), and the rear shell (14) is fixedly arranged on a side of the middle frame (1) away from the heat-dissipating portion (2), and the display screen (13), the rear shell (14) and the middle frame (1) are enclosed to form a shell.

17. The electronic device according to claim 16, wherein: It also includes a main board (15) fixed in the shell, the main board (15) is fixed to the side of the middle frame (1) away from the heat-dissipating portion (2), and the groove (11) is provided at a position corresponding to the middle frame (1) and the main board (15).

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