Optical module assembly and communication device

Abstract

The present disclosure belongs to the technical field of communications. Provided are an optical module assembly and a communication device. The optical module assembly comprises an optical module, an optical cage, a radiator and a printed circuit board, wherein the optical module is electrically connected to the printed circuit board, and the optical module comprises an optical module housing, and an electric device and an optical device, which are distributed in the optical module housing at an interval; the optical cage is fixedly connected to the printed circuit board and accommodates the optical module, and an opening is provided in at least one wall of the optical cage; the radiator comprises a boss portion, a base-plate portion and a fin portion, which are connected in sequence, the boss portion passing through the opening in the optical cage and being attached to the optical module housing of the optical module; at least one of the boss portion, the base-plate portion and the optical module housing is provided with a thermal interruption structure; and a projection of the thermal interruption structure on the optical module is located between the electric device and the optical device. By means of making the thermal interruption structure provide thermal interruption between the electric device and the optical device, thermal crosstalk caused by the electric device to the optical device is reduced or even prevented, and thus the heat dissipation efficiency of the optical device is improved.

Description

Optical module assembly and communication device

[0001] This application claims priority to Chinese patent application No. 202323663972.2 filed on December 29, 2023, with utility model name “Optical module assembly and communication device,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present disclosure relate to the field of communication technology, and in particular to optical module components and communication devices. Background Art

[0003] Optical modules are electronic devices used for photoelectric conversion. As the transmission rate of optical modules continues to increase, their power consumption continues to increase. Therefore, it is necessary to dissipate heat from the optical modules.

[0004] In the related art, the optical module assembly includes: an optical module, an optical cage, a heat sink and a printed circuit board. The optical module includes electrical components and optical components. The optical module is electrically connected to the printed circuit board. The optical cage is fixed on the printed circuit board to accommodate the optical module. The boss portion of the heat sink passes through the optical cage and its surface is in contact with the optical module housing to dissipate the heat of the optical module.

[0005] The optical module housing contains optical and electrical components. However, the temperature specifications of the optical components are usually lower than those of the electrical components. This can cause excess heat from the electrical components to be transferred to the optical components, resulting in thermal crosstalk between the electrical components and the optical components, thereby affecting the heat transfer efficiency of the optical components and worsening the heat dissipation of the optical components.

[0006] Public content

[0007] The embodiments of the present disclosure provide an optical module assembly and a communication device, which can solve the technical problems existing in the related art.

[0008] In one aspect, an optical module assembly is provided, the optical module assembly comprising: an optical module, an optical cage, a heat sink, and a printed circuit board;

[0009] The optical module is electrically connected to the printed circuit board, and includes an optical module housing, and electrical components and optical components spaced apart and distributed inside the optical module housing;

[0010] The light cage is fixedly connected to the printed circuit board and accommodates the light module, and at least one wall of the light cage has an opening;

[0011] The heat sink comprises: a boss portion, a base portion and a fin portion connected in sequence, wherein the boss portion passes through the opening of the optical cage and fits with the optical module housing of the optical module;

[0012] At least one of the boss portion, the base plate portion, and the optical module housing has a heat interruption structure, and a projection of the heat interruption structure on the optical module is located between the electrical device and the optical device.

[0013] The optical module assembly provided by the embodiment of the present disclosure provides thermal interruption between the electrical device and the optical device by providing a thermal interruption structure on at least one of the boss portion, the substrate portion, and the optical module housing, and positioning the thermal interruption structure between the electrical device and the optical device, thereby reducing or even avoiding thermal crosstalk caused by the electrical device to the optical device and improving the heat dissipation efficiency of the optical device.

[0014] In some possible implementations, both the boss portion and the base portion have the thermal interruption structure.

[0015] In some possible implementations, the thermal interruption structure on the boss portion is connected to the thermal interruption structure on the base portion.

[0016] In some possible implementations, the boss portion, the base plate portion, and the optical module housing all have the thermal interruption structure.

[0017] In some possible implementations, along a distribution direction between the electrical component and the optical component, the thermal interruption structures are arranged as a group or a plurality of groups distributed at intervals.

[0018] In some possible implementations, the thermal interruption structure includes at least one of a groove structure and a through-hole structure.

[0019] In some possible implementations, the thermal interrupt structure includes a first thermal interrupt structure and a second thermal interrupt structure;

[0020] The first heat interruption structure includes a groove structure, and the groove structure is located on the surface of the boss portion facing the optical module;

[0021] The second thermal interruption structure includes a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the substrate portion and the surface of the boss portion facing the substrate portion;

[0022] The second thermal interrupt structure is in communication with the first thermal interrupt structure.

[0023] In some possible implementations, the thermal interrupt structure includes a first thermal interrupt structure and a second thermal interrupt structure;

[0024] The first heat interruption structure includes a plurality of through-hole structures distributed at intervals, and the through-hole structures pass through the boss portion;

[0025] The second thermal interruption structure includes a plurality of through-hole structures distributed at intervals, and the through-hole structures pass through the substrate portion;

[0026] The plurality of through-hole structures in the second thermal interruption structure are in one-to-one communication with the plurality of through-hole structures in the first thermal interruption structure.

[0027] In some possible implementations, the thermal interrupt structure includes a first thermal interrupt structure and a second thermal interrupt structure;

[0028] The first thermal interruption structure includes a single through-hole structure and passes through the boss portion to separate the boss portion into at least two bosses;

[0029] The second thermal interruption structure includes a plurality of through-hole structures distributed at intervals, and the through-hole structures pass through the substrate portion;

[0030] The second thermal interrupt structure is in communication with the first thermal interrupt structure.

[0031] In some possible implementations, the thermal interrupt structure includes a first thermal interrupt structure and a second thermal interrupt structure;

[0032] The first thermal interruption structure includes a single through-hole structure and passes through the boss portion to separate the boss portion into at least two bosses;

[0033] The second thermal interruption structure includes a single through-hole structure and passes through the substrate portion to separate the substrate portion into at least two substrates;

[0034] The second thermal interruption structure is connected to the first thermal interruption structure, and the at least two bosses correspond to the at least two substrates one by one. The corresponding bosses and substrates, as well as corresponding parts of the fin portion cooperate to form an independent sub-heat sink.

[0035] In some possible implementations, the thermal interruption structure includes a groove structure, and the groove structure is located on a surface of the optical module housing facing the boss portion.

[0036] In some possible implementations, the thermal interruption structure includes a through-hole structure, and the through-hole structure passes through a wall of the optical module housing facing the boss portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG1 is a schematic diagram of the structure of an optical module assembly in the related art;

[0038] FIG2 is a schematic structural diagram of an exemplary optical module assembly provided by an embodiment of the present disclosure;

[0039] FIG3 is a schematic diagram of an exemplary arrangement of a heat dissipation unit of an optical module provided by an embodiment of the present disclosure;

[0040] FIG4 is a schematic structural diagram of an exemplary optical module assembly in implementation scheme (1) provided in an embodiment of the present disclosure;

[0041] FIG5 is a top view of the radiator in implementation scheme (1) provided in an embodiment of the present disclosure;

[0042] FIG6 is a bottom view of the radiator in the embodiment (1) provided in the embodiment of the present disclosure;

[0043] FIG7 is a side view of the boss portion in embodiment (1) provided in the embodiment of the present disclosure;

[0044] FIG8 is a schematic structural diagram of an exemplary optical module assembly in implementation scheme (2) provided in an embodiment of the present disclosure;

[0045] FIG9 is a top view of the radiator in implementation scheme (2) provided in an embodiment of the present disclosure;

[0046] FIG10 is a bottom view of the radiator in embodiment (2) provided in the embodiment of the present disclosure;

[0047] FIG11 is a side view of the boss portion in embodiment (2) provided in an embodiment of the present disclosure;

[0048] FIG12 is a schematic structural diagram of an exemplary optical module assembly in implementation scheme (3) provided in an embodiment of the present disclosure;

[0049] FIG13 is a top view of the radiator in implementation scheme (3) provided in an embodiment of the present disclosure;

[0050] FIG14 is a bottom view of the radiator in embodiment (3) provided in an embodiment of the present disclosure;

[0051] FIG15 is a schematic structural diagram of an exemplary optical module assembly in implementation scheme (4) provided in an embodiment of the present disclosure;

[0052] FIG16 is a schematic diagram of the structure of an exemplary optical module in implementation scheme (5) provided in an embodiment of the present disclosure;

[0053] FIG17 is a schematic structural diagram of another exemplary optical module in implementation scheme (5) provided in an embodiment of the present disclosure;

[0054] FIG18 is a schematic structural diagram of an exemplary optical module assembly in implementation scheme (5) provided in an embodiment of the present disclosure.

[0055] The accompanying drawings respectively represent: 1. optical module; 10. optical module housing; 11. electrical component; 12. optical component; 2. optical cage; 21. opening; 3. heat sink; 31. boss portion; 310. boss; 32. substrate portion; 320. substrate; 33. fin portion; 4. printed circuit board; 5. thermal interruption structure; 51. first thermal interruption structure; 52. second thermal interruption structure; 53. third thermal interruption structure; 001. optical module heat dissipation unit. DETAILED DESCRIPTION

[0056] In the description of the embodiments of the present disclosure, it should be understood that the terms "up", "down", "top", "bottom", "vertical", "horizontal", "depth", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present disclosure.

[0057] For example, directional terms such as "top" and "bottom" are generally based on the relative relationship of the device or component to which they refer as shown in the drawing. The orientation may change when the product is placed in different postures.

[0058] In the related art, as shown in Figure 1, the optical module assembly includes: an optical module 1, an optical cage 2, a heat sink 3 and a printed circuit board 4. The optical module 1 includes an electrical component 11 and an optical component 12. The optical module 1 is electrically connected to the printed circuit board 4. The optical cage 2 is fixed to the printed circuit board 4 to accommodate the optical module 1. The boss portion 31 of the heat sink 3 passes through the opening 21 on the optical cage 2, and the surface of the boss portion 31 is in contact with the optical module housing 10 of the optical module 1 to dissipate heat from the optical module 1.

[0059] The optical module housing 10 contains an electrical device 11 and an optical device 12. However, the temperature specification of the optical device 12 is generally lower than that of the electrical device 11. This causes excess heat from the electrical device 11 to be transferred to the optical device 12, resulting in thermal crosstalk between the electrical device 11 and the optical device 12 (see the horizontal rightward dotted arrow in FIG1 ), thereby affecting the heat transfer efficiency of the optical device 12 and worsening the heat dissipation of the optical device 12.

[0060] Specifically, the heat from the optical device 12 and the electrical device 11 is conducted to the optical module housing 10 and the heat sink 3 along the vertically upward dashed arrows in Figure 1 . Since the heat sink 3 and the optical module housing 10 are generally made of isotropic, highly thermally conductive materials, in addition to conducting the heat from the optical device 12 and the electrical device 11 vertically upward, in the direction indicated by the horizontal, rightward dashed arrows in Figure 1 , since the temperature of the electrical device 11 is high while the temperature of the optical device 12 is low, the optical module housing 10 and the heat sink 3 inevitably conduct heat horizontally from the electrical device 11 to the optical device 12. This causes thermal crosstalk between the electrical device 11 and the optical device 12, worsening the heat dissipation of the optical device 12 and creating a heat dissipation bottleneck.

[0061] To address the technical issues existing in the related art, the present disclosure provides an optical module assembly, as shown in FIG2 . The optical module assembly includes: an optical module 1, an optical cage 2, a heat sink 3, and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4 and includes an optical module housing 10, as well as electrical components 11 and optical components 12 spaced apart within the housing 10. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1. At least one wall of the optical cage 2 has an opening 21. The heat sink 3 includes a boss portion 31, a base portion 32, and a fin portion 33, which are connected in sequence. The boss portion 31 extends through the opening 21 of the optical cage 2 and fits into the housing 10 of the optical module 1. At least one of the boss portion 31, the base portion 32, and the housing 10 includes a thermal interruption structure 5 ( FIG2 only illustrates the boss portion 31 as an example). The thermal interruption structure 5 projects onto the optical module 1 between the electrical component 11 and the optical component 12.

[0062] It should be noted that the above-mentioned “projection of the thermal interruption structure 5 on the optical module 1 is located between the electrical device 11 and the optical device 12 ” means that the projection position of the thermal interruption structure 5 in the area where the entire optical module 1 is located is located in the area between the electrical device 11 and the optical device 12 .

[0063] The optical module assembly provided by the embodiment of the present disclosure provides a thermal interruption structure 5 by providing a thermal interruption structure 5 on at least one of the boss portion 31, the substrate portion 32 and the optical module housing 10, and positioning the thermal interruption structure 5 between the electrical device 11 and the optical device 12 to provide a thermal interruption between the electrical device 11 and the optical device 12, thereby reducing or even avoiding the thermal crosstalk generated by the electrical device 11 on the optical device 12, and improving the heat dissipation efficiency of the optical device 12.

[0064] It should be noted that, as shown in FIG2 , the light cage 2 has at least one wall with an opening 21 to accommodate the boss portion 31 of the heat sink 3. For example, FIG2 illustrates the top wall of the light cage 2 having an opening 21 to accommodate the boss portion 31 of the heat sink 3. This means that the heat sink 3 is positioned above the light cage 2, and accordingly, the boss portion 31 of the heat sink 3 contacts the top wall of the light module housing 10. Alternatively, the light cage 2 may have an opening 21 on its bottom wall, and accordingly, the heat sink 3 is positioned below the light cage 2 (not shown), and accordingly, the boss portion 31 of the heat sink 3 contacts the bottom wall of the light module housing 10. Alternatively, the light cage 2 may have openings 21 on both the top and bottom walls, and accordingly, at least two sets of heat sinks 3 may be positioned above and below the light cage 2, respectively (not shown).

[0065] In some implementations, as shown in FIG2 , the boss portion 31 of the heat sink 3 has a thermal interruption structure 5 , thereby reducing heat transfer from the electrical device 11 to the optical device 12 through the boss portion 31 and optimizing the heat dissipation efficiency of the optical device 12 .

[0066] In other implementations, as shown in FIG4 , both the boss portion 31 and the base portion 32 of the heat sink 3 have a thermal interruption structure 5. The boss portion 31 and the base portion 32 of the heat sink 3 constitute the main heat transfer medium for transferring heat from the electrical device 11 to the optical device 12. By simultaneously arranging the thermal interruption structure 5 on the boss portion 31 and the base portion 32, compared with arranging the thermal interruption structure 5 on the boss portion 31 alone, the heat transfer from the electrical device 11 to the optical device 12 through the heat sink 3 is further isolated, and the thermal crosstalk of the electrical device 11 to the optical device 12 can be more efficiently curbed.

[0067] In some examples, as shown in FIG. 4 , the thermal interruption structure 5 on the boss portion 31 is connected to the thermal interruption structure 5 on the base portion 32 , so that the two cooperate to form an integral thermal interruption structure 5 , thereby further improving the thermal barrier effect.

[0068] In other implementations, as shown in FIG18 , the boss portion 31 , the substrate portion 32 and the optical module housing 10 all have a thermal interruption structure 5 . By further adding a thermal interruption structure 5 to the optical module housing 10 , the thermal crosstalk of the electrical device 11 on the optical device 12 can be further curbed, thereby improving the heat dissipation efficiency of the optical device 12 .

[0069] In some examples, as shown in FIG. 18 , the thermal interruption structure 5 on the boss portion 31 , the thermal interruption structure 5 on the base portion 32 , and the thermal interruption structure 5 on the optical module housing 10 are positioned relative to and connected to enhance the thermal isolation effect.

[0070] Of course, an implementation scheme that is not excluded is that, in the optical module assembly, the thermal interruption structure 5 is only provided on the optical module housing 10 .

[0071] In some implementations, the thermal interruption structure 5 provided in the embodiments of the present disclosure includes at least one of a groove structure and a through-hole structure. A groove structure is a hole structure with one end open and the other end closed, and a through-hole structure is a hole structure with both opposite ends open and connected. Air is contained in the groove structure and the through-hole structure, forming a thermal interruption based on the low thermal conductivity of air.

[0072] One example is that the thermal interruption structure 5 is a groove structure; another example is that the thermal interruption structure 5 is a through-hole structure; and yet another example is that the thermal interruption structure 5 includes both a groove structure and a through-hole structure.

[0073] It can be seen that the embodiment of the present disclosure provides a thermal interruption structure 5 on the boss portion 31 and the base portion 32 of the heat sink 3, and on the wall of the optical cage 2 connected to the heat sink 3. The thermal interruption structure 5 is a groove structure and / or a through-hole structure, and utilizes the low thermal conductivity of air to form a thermal interruption, thereby physically reducing the heat transfer from the electrical device 11 to the optical device 12 through at least one of the boss portion 31 and the base portion 32 of the heat sink 3 and the optical module housing 10, thereby preventing the electrical device 11 from generating thermal crosstalk to the optical device 12.

[0074] In other implementations, at least one of the groove structure and the through-hole structure mentioned above may be filled with a thermal insulation material, such as silicon dioxide, to achieve an excellent thermal barrier effect.

[0075] In the disclosed embodiment, the thermal interrupt structures 5 are arranged as a single group or multiple groups spaced apart along the distribution direction of the electrical components 11 and the optical components 12. For example, Figure 5 illustrates the thermal interrupt structures 5 arranged as a single group. When the temperature specifications of the electrical components 11 and the optical components 12 differ significantly, or when there is a large space between the electrical components 11 and the optical components 12, the thermal interrupt structures 5 can also be arranged as multiple groups spaced apart to improve thermal isolation efficiency.

[0076] The distribution direction of the electrical device 11 and the optical device 12 refers to the direction of the line connecting the position of the electrical device 11 and the position of the optical device 12. For example, in FIG2 , the distribution direction of the electrical device 11 and the optical device 12 is horizontal.

[0077] Regarding the assembly of the components in the optical module assembly, one example is that the bottom surface of the optical cage 2 is bonded to the printed circuit board 4. After the boss portion 31 of the heat sink 3 extends through the opening 21 of the optical cage 2, the first surface of the boss portion 31 is bonded to the optical module housing 10 of the optical module 1. The second surface of the boss portion 31 is bonded to the first surface of the base portion 32, which has fins 33 on its second surface. Heat from the optical module 1 is transferred sequentially through the boss portion 31 and base portion 32 to the fins 33, where wind blows through the fins 33 to dissipate the heat.

[0078] In some examples, in order to support repeated plugging and unplugging of the optical module 1, the heat sink 3 is connected to the optical cage 2 through an elastic structure. For example, the elastic structure can be arranged on the surface of the substrate portion 32 of the heat sink 3 facing the optical module 1, or the elastic structure can also be arranged on the surface of the optical module 1 away from the heat sink 3.

[0079] Before the optical module 1 is inserted into the optical cage 2 , the elastic structure is in a relaxed state. After the optical module 1 is inserted into the optical cage 2 , the elastic structure switches to a deformed state and provides elastic force to keep the boss portion 31 of the heat sink 3 in close contact with the optical module 1 .

[0080] In addition, according to actual application requirements, in the optical module assembly package, the number of optical modules 1, optical cages 2, and heat sinks 3 can be set to one group or multiple groups. For example, the optical module 1, optical cages 2, and heat sinks 3 are collectively referred to as optical module heat dissipation units 001. Then, one group of optical module heat dissipation units 001 can be set on the printed circuit board 4, or as shown in Figure 3, multiple groups of optical module heat dissipation units 001 can be set on the printed circuit board 4. In addition, Figure 3 also illustrates that multiple groups of optical module heat dissipation units 001 are arranged side by side and distributed in sequence.

[0081] With respect to the various arrangements of the thermal interruption structure 5 mentioned above, the arrangements of the thermal interruption structure 5 are further described in detail below in combination with different embodiments.

[0082] In some embodiments (1), an optical module assembly is provided, as shown in Figures 4 to 7, comprising: an optical module 1, an optical cage 2, a heat sink 3, and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4 and includes electrical components 11 and optical components 12 that are spaced apart. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1. At least one wall of the optical cage 2 has an opening 21. The heat sink 3 includes a boss portion 31, a base portion 32, and a fin portion 33 that are connected in sequence. The boss portion 31 passes through the opening 21 of the optical cage 2 and fits into the optical module housing 10 of the optical module 1.

[0083] The optical module assembly also includes a thermal interruption structure 5, the projection of which on the optical module 1 is located between the electrical device 11 and the optical device 12. As shown in FIG4 , the thermal interruption structure 5 includes: a first thermal interruption structure 51 and a second thermal interruption structure 52. In combination with FIG5 and FIG6 , it can be seen that the first thermal interruption structure 51 includes a groove structure, and the groove structure is located on the surface of the boss portion 31 facing the optical module 1; the second thermal interruption structure 52 includes a plurality of spaced-apart through-hole structures, and the through-hole structures at least penetrate the substrate portion 32 and the surface of the boss portion 31 facing the substrate portion 32; the second thermal interruption structure 52 is connected to the first thermal interruption structure 51.

[0084] For the first thermal interruption structure 51 in the form of a groove structure, as shown in Figure 7, the opening end of the groove structure penetrates to the surface of the boss portion 31 facing the optical module 1, and the bottom end of the groove structure is located inside the boss portion 31 and does not extend to the surface of the boss portion 31 facing the substrate portion 32.

[0085] If the distribution direction between the electrical device 11 and the optical device 12 is defined as the first direction, then the first thermal interrupt structure 51 extends along the second direction (i.e., the central axis of the first thermal interrupt structure 51 is the same as the second direction), wherein the second direction is at an angle to the first direction, which can be, for example, 20° to 90°, or further 60° to 90°. For example, FIG4 illustrates the central axis direction of the first thermal interrupt structure 51, i.e., the angle between the second direction and the first direction is 90°, i.e., the two directions are perpendicular to each other.

[0086] As shown in Figures 5 and 6, the first thermal interruption structure 51 can be a single groove structure, and both ends of the single groove structure respectively penetrate into the corresponding side walls of the boss portion 31. This structural arrangement is conducive to simplifying the molding preparation of the first thermal interruption structure 51.

[0087] Alternatively, the first heat interruption structure 51 may also include a plurality of groove structures, and the plurality of groove structures may be sequentially spaced and distributed along the second direction (not shown in the figure).

[0088] The shape of the groove structure corresponding to the first thermal interruption structure 51 may be a common geometric shape, for example, it may be a regular geometric shape (rectangular groove, arc groove, trapezoidal groove, etc.), or it may be an irregular geometric shape.

[0089] For example, the projection shape of the groove structure corresponding to the first thermal interrupter 51 on a plane perpendicular to the groove depth direction includes, but is not limited to, a rectangle, square, ellipse, arc (e.g., a "C" shape), etc. The cross-sectional shape of the groove structure corresponding to the first thermal interrupter 51 along the groove depth direction includes, but is not limited to, a rectangle, square, V-shape, arc (e.g., a semicircle), etc. The groove depth direction is perpendicular to the plane of the boss portion 31 or the base portion 32. This type of first thermal interrupter 51 has the advantages of simple and convenient molding and preparation, and more controllable dimensions.

[0090] As shown in Figures 5 and 6 , the second thermal interruption structure 52 includes a plurality of through-hole structures that can be sequentially spaced and distributed along the second direction. Each through-hole structure corresponding to the second thermal interruption structure 52 is connected to a corresponding position in the groove structure corresponding to the first thermal interruption structure 51, thereby fully achieving thermal isolation between the electrical device 11 and the optical device 12.

[0091] The shape of the through hole structure corresponding to the second thermal interruption structure 52 can be a common geometric shape, for example, it can be a regular geometric shape (circular hole, elliptical hole, arc hole, rectangular hole, square hole, trapezoidal hole, etc.), or it can also be an irregular geometric shape.

[0092] For example, the projection shape of the through-hole structure corresponding to the second thermal interruption structure 52 on a plane perpendicular to the groove depth direction includes, but is not limited to, a circle, an ellipse, a rectangle, a square, etc. The above-mentioned second thermal interruption structure 52 has the advantages of being easy to form and prepare, and having more controllable dimensions.

[0093] The shapes and sizes of the multiple through-hole structures corresponding to the second thermal interruption structure 52 can be the same, partially the same, or different from each other. For example, Figure 6 illustrates that the shapes and sizes of the multiple through-hole structures corresponding to the second thermal interruption structure 52 are the same to simplify the preparation process.

[0094] In implementation scheme (1), when heat from the electrical device 11 is transferred from the boss portion 31 and the base portion 32 of the heat sink 3 to the optical device 12 in the horizontal direction, the connected first thermal interruption structure 51 and the second thermal interruption structure 52 realize thermal interruption in the horizontal direction, thereby reducing the transfer of heat energy from the area where the electrical device 11 is located to the area where the optical device 12 is located, and effectively avoiding thermal crosstalk from the electrical device 11 to the optical device 12.

[0095] It is not excluded that in other embodiments, the thermal interruption structure 5 includes a first thermal interruption structure 51 and a second thermal interruption structure 52, wherein the first thermal interruption structure 51 can refer to the first thermal interruption structure 51 described in the above embodiment (1). The difference between the second thermal interruption structure 52 and the above embodiment (1) is that the second thermal interruption structure 52 can include a plurality of spaced groove structures, and the groove structure is either only located in the base plate portion 32, or penetrates the base plate portion 32 and partially extends to the surface of the boss portion 31 facing the base plate portion 32, and the second thermal interruption structure 52 is not connected to the first thermal interruption structure 51.

[0096] In some embodiments (2), an optical module assembly is provided, as shown in Figures 8 to 11, comprising: an optical module 1, an optical cage 2, a heat sink 3, and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4 and comprises electrical components 11 and optical components 12 that are spaced apart. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1. At least one wall of the optical cage 2 has an opening 21. The heat sink 3 comprises a boss portion 31, a base portion 32, and a fin portion 33 that are connected in sequence. The boss portion 31 extends through the opening 21 of the optical cage 2 and fits into the optical module housing 10 of the optical module 1.

[0097] The optical module assembly also includes a thermal interrupt structure 5, the projection of which on the optical module 1 is located between the electrical device 11 and the optical device 12. As shown in FIG12 , the thermal interrupt structure 5 includes a first thermal interrupt structure 51 and a second thermal interrupt structure 52. In combination with FIG9 and FIG10 , it can be seen that the first thermal interrupt structure 51 includes a plurality of through-hole structures distributed at intervals, and the through-hole structures pass through the boss portion 31; the second thermal interrupt structure 52 includes a plurality of through-hole structures distributed at intervals, and the through-hole structures pass through the substrate portion 32; the plurality of through-hole structures in the second thermal interrupt structure 52 are connected to the plurality of through-hole structures in the first thermal interrupt structure 51 in a one-to-one correspondence.

[0098] As shown in FIG10 , the first thermal interruption structure 51 includes a plurality of through-hole structures that can be sequentially spaced apart along the second direction. Furthermore, as shown in FIG9 , the second thermal interruption structure 52 includes a plurality of through-hole structures that can be sequentially spaced apart along the second direction. Each through-hole structure corresponding to the second thermal interruption structure 52 is in one-to-one communication with each through-hole structure corresponding to the first thermal interruption structure 51, thereby fully achieving thermal isolation between the electrical device 11 and the optical device 12.

[0099] The shapes of the through-hole structures corresponding to the first thermal interruption structure 51 and the second thermal interruption structure 52 can be common geometric shapes, for example, they can be regular geometric shapes (circular holes, elliptical holes, arc holes, rectangular holes, square holes, trapezoidal holes, etc.), or they can also be irregular geometric shapes.

[0100] For example, the projection shapes of the through-hole structures corresponding to the first thermal interruption structure 51 and the second thermal interruption structure 52 on a plane perpendicular to the groove depth direction include, but are not limited to, circular, elliptical, rectangular, square, etc. The above-mentioned through-hole structures have the advantages of simple and convenient molding and preparation, and more controllable size.

[0101] The shapes and sizes of the multiple through-hole structures corresponding to the first thermal interruption structure 51 can be the same as each other, partially the same, or different from each other, and the shapes and sizes of the multiple through-hole structures corresponding to the second thermal interruption structure 52 can be the same as each other, partially the same, or different from each other. For example, Figures 9 and 10 illustrate that the shapes and sizes of the multiple through-hole structures corresponding to the first thermal interruption structure 51 and the second thermal interruption structure 52 are the same as each other to simplify the preparation process.

[0102] In implementation scheme (2), the shape and size of the through-hole structure corresponding to the first thermal interruption structure 51 can be the same as the shape and size of the through-hole structure corresponding to the first thermal interruption structure 51, and the central axes of the two coincide with each other, which is conducive to a one-time molding preparation process, and an integral through-hole is prepared on the boss portion 31 and the substrate portion 32 at the same time, and serves as the first thermal interruption structure 51 and the second thermal interruption structure 52 respectively.

[0103] In some embodiments (3), an optical module assembly is provided, as shown in Figures 12 to 14, comprising: an optical module 1, an optical cage 2, a heat sink 3, and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4 and includes electrical components 11 and optical components 12 that are spaced apart. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1. At least one wall of the optical cage 2 has an opening 21. The heat sink 3 includes a boss portion 31, a base portion 32, and a fin portion 33 that are connected in sequence. The boss portion 31 extends through the opening 21 of the optical cage 2 and fits into the optical module housing 10 of the optical module 1.

[0104] The optical module assembly also includes a thermal interrupt structure 5, the projection of which on the optical module 1 is located between the electrical device 11 and the optical device 12. The thermal interrupt structure 5 includes a first thermal interrupt structure 51 and a second thermal interrupt structure 52. As shown in Figures 12 to 14, the first thermal interrupt structure 51 includes a single through-hole structure that passes through the boss portion 31 to separate the boss portion 31 into at least two bosses 310. As shown in Figures 12 to 14, the second thermal interrupt structure 52 includes a plurality of spaced through-hole structures that pass through the substrate portion 32. The second thermal interrupt structure 52 is connected to the first thermal interrupt structure 51.

[0105] The first thermal interruption structure 51 includes a single through-hole structure, the upper end of which extends to the surface of the boss portion 31 facing the optical module 1, and the lower end of which extends to the surface of the boss portion 31 facing the substrate portion 32. The two ends of the single through-hole structure along the second direction respectively penetrate the corresponding side walls of the boss portion 31, thereby dividing the boss portion 31 into at least two bosses 310. That is, in embodiment (3), the heat sink 3 can include a plurality of bosses 310 distributed at intervals.

[0106] The second thermal interruption structure 52 includes a plurality of through-hole structures, which can be spaced apart in sequence along the second direction. Each through-hole structure corresponding to the second thermal interruption structure 52 is connected to a corresponding position of the through-hole structure corresponding to the first thermal interruption structure 51, thereby fully realizing thermal isolation between the electrical device 11 and the optical device 12.

[0107] The shape of the through hole structure corresponding to the second thermal interruption structure 52 can be a common geometric shape, for example, it can be a regular geometric shape (circular hole, elliptical hole, arc hole, rectangular hole, square hole, trapezoidal hole, etc.), or it can also be an irregular geometric shape.

[0108] For example, the projection shape of the through hole structure corresponding to the second thermal interruption structure 52 on a plane perpendicular to the groove depth direction includes but is not limited to: circle, ellipse, rectangle, square, etc. The above-mentioned through hole structure has the advantages of simple and convenient molding and more controllable size.

[0109] The shapes and sizes of the multiple through-hole structures corresponding to the second thermal interruption structure 52 can be the same as each other, partially the same, or different from each other. For example, Figures 13 and 14 illustrate that the shapes and sizes of the multiple through-hole structures corresponding to the second thermal interruption structure 52 are the same as each other to simplify the preparation process.

[0110] In embodiment (3), as shown in FIG12 , the size of the through-hole structure corresponding to the first thermal interruption structure 51 along the first direction may be greater than or equal to the size of the through-hole structure corresponding to the second thermal interruption structure 52 along the first direction.

[0111] In some embodiments (4), an optical module assembly is provided, as shown in FIG15 , comprising: an optical module 1, an optical cage 2, a heat sink 3, and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4, and includes electrical components 11 and optical components 12 that are spaced apart. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1. At least one wall of the optical cage 2 has an opening 21. The heat sink 3 includes a boss portion 31, a base portion 32, and a fin portion 33 that are connected in sequence. The boss portion 31 passes through the opening 21 of the optical cage 2 and fits into the optical module housing 10 of the optical module 1.

[0112] The optical module assembly also includes a thermal interrupt structure 5, the projection of which on the optical module 1 is located between the electrical device 11 and the optical device 12. As shown in FIG15 , the thermal interrupt structure 5 includes a first thermal interrupt structure 51 and a second thermal interrupt structure 52. The first thermal interrupt structure 51 includes a single through-hole structure extending through the boss portion 31, thereby separating the boss portion 31 into at least two bosses 310. The second thermal interrupt structure 52 includes a single through-hole structure extending through the base plate portion 32, thereby separating the base plate portion 32 into at least two base plates 320. The second thermal interrupt structure 52 is connected to the first thermal interrupt structure 51, and the at least two bosses 310 correspond one-to-one with the at least two base plates 320. The corresponding bosses and base plates, as well as the corresponding portions of the fin portion 33, cooperate to form an independent sub-heat sink.

[0113] The first thermal interruption structure 51 includes a single through-hole structure, the upper end of which extends to the surface of the boss portion 31 facing the optical module 1, and the lower end of which extends to the surface of the boss portion 31 facing the substrate portion 32, and the two ends of the single through-hole structure along the second direction respectively penetrate the corresponding side walls of the boss portion 31, so that the boss portion 31 is divided into at least two bosses 310.

[0114] The second thermal interruption structure 52 includes a single through-hole structure, the upper end of which extends to the surface of the substrate portion 32 facing the fin portion 33, and the lower end of which extends to the surface of the substrate portion 32 facing the boss portion 31, and the two ends of the single through-hole structure along the second direction respectively penetrate the corresponding side walls of the substrate portion 32, thereby separating the substrate portion 32 into at least two substrates 320.

[0115] At least two bosses 310 correspond to at least two base plates 320 in a one-to-one manner. The corresponding bosses 310 and base plates 320, as well as the corresponding portions of the fin portion 33, cooperate to form an independent sub-heat sink. That is, in embodiment (4), the heat sink 3 may include a plurality of sub-heat sinks distributed at intervals. Embodiment (4) uses an independent heat sink 3 for each of the optical device 12 and the electrical device 11. Compared with the overall heat dissipation solution, this further reduces the heat transfer from the electrical device 11 to the optical device 12, thereby optimizing the heat dissipation efficiency of the optical device 12.

[0116] In embodiment (4), the size of the through-hole structure corresponding to the first thermal interruption structure 51 along the first direction may be greater than or equal to the size of the through-hole structure corresponding to the second thermal interruption structure 52 along the first direction.

[0117] In some embodiments (5), an optical module assembly is provided, comprising: an optical module 1, an optical cage 2, a heat sink 3, and a printed circuit board 4. The optical module 1 is electrically connected to the printed circuit board 4, and includes electrical components 11 and optical components 12 that are spaced apart. The optical cage 2 is fixedly connected to the printed circuit board 4 and accommodates the optical module 1. At least one wall of the optical cage 2 has an opening 21. The heat sink 3 includes a boss portion 31, a base portion 32, and a fin portion 33 that are connected in sequence. The boss portion 31 passes through the opening 21 of the optical cage 2 and fits into the optical module housing 10 of the optical module 1.

[0118] The optical module assembly also includes a thermal interruption structure 5, the projection of which on the optical module 1 is located between the electrical device 11 and the optical device 12. As shown in FIG16 , the thermal interruption structure 5 comprises a groove structure located on the surface of the optical module housing 10 facing the boss portion 31. Alternatively, as shown in FIG17 , the thermal interruption structure 5 comprises a through-hole structure extending through the wall of the optical module housing 10 facing the boss portion 31. The thermal interruption structure 5 with a through-hole structure provides a more superior thermal barrier effect.

[0119] Through implementation scheme (5), the heat transfer from the electrical device 11 to the optical device 12 through the optical module housing 10 is effectively reduced, thereby optimizing the heat dissipation efficiency of the optical device 12.

[0120] Further referring to FIG18 , which illustrates an implementation scheme in embodiment (5), the thermal interruption structure 5 includes a first thermal interruption structure 51, a second thermal interruption structure 52, and a third thermal interruption structure 53. The first thermal interruption structure 51 includes a plurality of through-hole structures distributed at intervals, and the through-hole structures pass through the boss portion 31; the second thermal interruption structure 52 includes a plurality of through-hole structures distributed at intervals, and the through-hole structures pass through the base portion 32; the third thermal interruption structure 53 includes a plurality of through-hole structures distributed at intervals, and the through-hole structures pass through the wall of the optical module housing 10 facing the boss portion 31.

[0121] The multiple through-hole structures in the third thermal interrupt structure 53 , the multiple through-hole structures in the second thermal interrupt structure 52 , and the multiple through-hole structures in the first thermal interrupt structure 51 are connected in a one-to-one correspondence.

[0122] On the other hand, an embodiment of the present disclosure provides a communication device, which includes any of the above-mentioned optical module assemblies. The communication device provided by the embodiment of the present disclosure has all the advantages of the above-mentioned optical module assemblies.

[0123] Exemplarily, the types of communication devices include, but are not limited to: network equipment (eg, routers, transmission network equipment, etc.), wireless base stations, servers, etc.

[0124] In some examples, the communication device may further include an outer shell, a power supply, a fan, etc. The power supply is used to provide a power distribution function for the communication device, and the fan is used to provide the air volume required for cooling.

[0125] The above description is only for the purpose of facilitating those skilled in the art to understand the technical solutions of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the scope of protection of the present disclosure.

Claims

1. An optical module component, wherein, The optical module component includes: an optical module (1), an optical cage (2), a heat sink (3), and a printed circuit board (4); The optical module (1) is electrically connected to the printed circuit board (4). The optical module (1) includes an optical module housing (10), and electrical components (11) and optical components (12) spaced apart and distributed inside the optical module housing (10); The optical cage (2) is fixedly connected to the printed circuit board (4) and houses the optical module (1). At least one wall of the optical cage (2) has an opening (21); The heat sink (3) includes: a boss portion (31), a substrate portion (32), and a fin portion (33) connected in sequence. The boss portion (31) passes through the opening (21) of the optical cage (2) and fits against the optical module housing (10) of the optical module (1); At least one of the boss portion (31), the substrate portion (32), and the optical module housing (10) has a thermal interruption structure (5). The projection of the thermal interruption structure (5) on the optical module (1) is located between the electrical components (11) and the optical components (12).

2. The optical module component according to claim 1, wherein, Both the boss portion (31) and the substrate portion (32) have the thermal interruption structure (5).

3. The optical module component according to claim 2, wherein, The thermal interruption structure (5) on the boss portion (31) communicates with the thermal interruption structure (5) on the substrate portion (32).

4. The optical module component according to claim 1, wherein, The boss portion (31), the substrate portion (32), and the optical module housing (10) all have the thermal interruption structure (5).

5. The optical module component according to claim 1, wherein, Along the distribution direction between the electrical components (11) and the optical components (12), the thermal interruption structure (5) is provided as one group or multiple groups spaced apart.

6. The optical module component according to any one of claims 1-5, wherein, The thermal interruption structure (5) includes at least one of a groove structure and a through-hole structure.

7. The optical module component according to claim 6, wherein, The thermal interruption structure (5) includes a first thermal interruption structure (51) and a second thermal interruption structure (52); The first thermal interruption structure (51) includes a groove structure, and the groove structure is located on the surface of the boss portion (31) facing the optical module (1); The second thermal interruption structure (52) includes a plurality of through-hole structures spaced apart, and the through-hole structures penetrate through the substrate portion (32) and the surface of the boss portion (31) facing the substrate portion (32); The second thermal interruption structure (52) communicates with the first thermal interruption structure (51).

8. The optical module component according to claim 6, wherein, The thermal interruption structure (5) includes a first thermal interruption structure (51) and a second thermal interruption structure (52); The first thermal interruption structure (51) includes a plurality of through-hole structures spaced apart, and the through-hole structures penetrate through the boss portion (31); The second thermal interruption structure (52) includes a plurality of through-hole structures spaced apart, and the through-hole structures penetrate through the substrate portion (32); The plurality of through-hole structures in the second thermal interruption structure (52) communicate with the plurality of through-hole structures in the first thermal interruption structure (51) one by one.

9. The optical module component according to claim 6, wherein, The thermal interruption structure (5) includes a first thermal interruption structure (51) and a second thermal interruption structure (52); The first thermal interruption structure (51) includes a single through-hole structure that penetrates the boss portion (31) to divide the boss portion (31) into at least two bosses (310); The second thermal interruption structure (52) includes a plurality of through-hole structures distributed at intervals, and the through-hole structures penetrate the substrate portion (32); The second thermal interruption structure (52) communicates with the first thermal interruption structure (51).

10. The optical module component according to claim 6, wherein, The thermal interruption structure (5) includes a first thermal interruption structure (51) and a second thermal interruption structure (52); The first thermal interruption structure (51) includes a single through-hole structure that penetrates the boss portion (31) to divide the boss portion (31) into at least two bosses (310); The second thermal interruption structure (52) includes a single through-hole structure that penetrates the substrate portion (32) to divide the substrate portion (32) into at least two substrates (320); The second thermal interruption structure (52) communicates with the first thermal interruption structure (51), and the at least two bosses (310) correspond to the at least two substrates (320) one by one. The corresponding boss (310) and substrate (320), and the corresponding part of the fin portion (33) cooperate to form an independent sub-heat sink.

11. The optical module component according to claim 6, wherein, The thermal interruption structure (5) includes a groove structure, and the groove structure is located on the surface of the optical module housing (10) facing the boss portion (31).

12. The optical module component according to claim 6, wherein, The thermal interruption structure (5) includes a through-hole structure, and the through-hole structure penetrates the wall of the optical module housing (10) facing the boss portion (31).

13. A communication device, wherein, The communication device includes the optical module assembly according to any one of claims 1-12.

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