Perovskite cell module including stacked encapsulation layer, and preparation method therefor

By adopting a stacked encapsulation layer structure in perovskite solar cells, and using alternating organic and inorganic encapsulation layers, the erosion problem of oxygen and moisture on the battery is solved, the stability and life of the battery are improved, and the photoelectric conversion efficiency is maintained, which is suitable for large-scale production.

WO2025139541A1PCT designated stage expired Publication Date: 2025-07-03XIAN TJ-SOLAR NEW ENERGY CO LTD
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Patent Information

Application Number
PCT/CN2024/134638
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-12-29
Filing Date
2024-11-26
Publication Date
2025-07-03

AI Technical Summary

Technical Problem

The existing perovskite solar cell packaging technology cannot effectively block oxygen and moisture, resulting in attenuation of battery performance, limiting its service life and application range.

Method used

A stacked encapsulation layer structure is adopted, including alternately stacked organic and inorganic encapsulation layers. The multi-layer protective structure is formed by utilizing the high light transmittance and excellent moisture and oxygen barrier properties of the inorganic encapsulation layer, combined with the supplementary performance of the organic layer.

Benefits of technology

It improves the life and stability of perovskite solar cells while maintaining photoelectric conversion efficiency, and is suitable for large-scale production.

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Abstract

The present invention belongs to the technical field of perovskite solar cells, and relates to a perovskite cell module including a stacked encapsulation layer, and a preparation method therefor. The perovskite cell module includes a stacked encapsulation layer. The stacked encapsulation layer is formed by alternately stacking inorganic encapsulation layers on top of each other or alternately stacking organic encapsulation layers and the inorganic encapsulation layers on top of each other, wherein the inorganic encapsulation layers have excellent light transmittance and excellent moisture and / or oxygen barrier performance, and the organic encapsulation layers have different components from the inorganic encapsulation layers, and supplement the performance and effects of the inorganic encapsulation layers, such that the perovskite cell module has better mechanical performance, and can effectively protect a perovskite solar cell from the impact of oxygen and moisture, thereby prolonging the service life of the cell and improving the stability of the cell. Moreover, an encapsulation process involved in the present invention is simple and low-cost and can be used for mass production.
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Description

A perovskite battery assembly containing stacked encapsulation layers and a method for preparing the same Technical Field

[0001] The present invention belongs to the technical field of perovskite solar cells and relates to a perovskite cell assembly containing a stacked encapsulation layer and a preparation method thereof. Background Art

[0002] As a pure, renewable energy source, solar energy offers unparalleled advantages over other energy sources. Since its inception, photovoltaic power generation has rapidly become a technological means of effectively utilizing solar energy. Perovskite solar cells, a rapidly emerging photovoltaic device, have seen their efficiency increase rapidly from an initial 3.8% to a current 26.1%. Compared to other established photovoltaic technologies, perovskite solar cells offer significant advantages such as low cost, simple preparation, and high photoelectric conversion efficiency, demonstrating their potential for commercialization.

[0003] Because the perovskite layer easily reacts with water and oxygen, the performance of perovskite solar cells is particularly susceptible to degradation, significantly reducing the service life and application range of perovskite solar cells. Therefore, it is very necessary to encapsulate perovskite solar cells to improve the environmental stability of the device and block moisture and oxygen in the air. Existing solar cell encapsulation technology cannot meet the requirements of practical applications. For example, there are problems such as unreasonable encapsulation structure and poor mechanical properties after encapsulation. It does not effectively improve the efficiency, stability and service life of the device, which limits the range of application scenarios of the device.

[0004] In view of this, the present invention is proposed. Summary of the Invention

[0005] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a perovskite battery component containing a stacked encapsulation layer and a preparation method thereof to improve the life and stability of the battery.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] The perovskite battery assembly containing a stacked encapsulation layer comprises: a stacked encapsulation layer disposed on a functional layer of the perovskite battery assembly; the functional layer comprises a substrate, a second electrode layer, a hole transport layer, a perovskite layer, an electron transport layer, and a first electrode layer;

[0008] The stacked encapsulation layer includes an inorganic encapsulation layer; or, the stacked encapsulation layer includes a structure in which organic encapsulation layers and inorganic encapsulation layers are alternately stacked on each other.

[0009] Wherein, the substrate is transparent glass or transparent plastic such as PET;

[0010] The functional layer includes a substrate, a second electrode layer, a hole transport layer, a perovskite layer, an electron transport layer, and a first electrode layer stacked sequentially from bottom to top; or the functional layer includes a substrate, a second electrode layer, an electron transport layer, a perovskite layer, a hole transport layer, and a first electrode layer stacked sequentially from bottom to top;

[0011] The hole transport layer is a layered structure prepared from nickel oxide, doped nickel oxide, cuprous iodide, cuprous thiocyanate, poly[bis(4-phenyl)(2,4,6-trimethylphenyl)amine](PTAA), PEDOT:PSS or Spiro-OMeTAD, and the thickness of the hole transport layer is 10 to 100 nm;

[0012] The electron transport layer is made of titanium dioxide (TiO2), tin oxide (SnO2), indium oxide (InO3), zinc oxide (ZnO), PCBM, C 60 A layered structure prepared by any one of or a mixture of the foregoing, wherein the thickness of the electron transport layer is 10 to 100 nm;

[0013] The material of the second electrode layer is one or more of gold (Au), silver (Ag), copper (Cu), and aluminum (Al). The thickness of the second electrode layer is 10 to 200 nm and can be deposited on the substrate by an evaporation process or a PVD process.

[0014] The material of the first electrode layer is one or more of fluorine-doped tin oxide (FTO), indium tin oxide (ITO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), indium zinc oxide (IZO), and tungsten-doped indium oxide (IWO). The thickness of the first electrode layer is 10 to 200 nm and can be deposited on the electron transport layer or the hole transport layer by magnetron sputtering.

[0015] Further preferably, the stacked encapsulation layer is a multi-layer structure in which organic encapsulation layers and inorganic encapsulation layers are alternately stacked on top of each other, and the outermost layer of the stacked encapsulation layer may be an inorganic encapsulation layer.

[0016] Specifically, the thickness of the organic encapsulation layer is 50 nm to 50 μm; the thickness of the inorganic encapsulation layer is 5 nm to 1000 nm;

[0017] The organic encapsulation layer is a polymeric film formed by coating an ink composition on a substrate by inkjet printing, spraying, roller coating, blade coating or spin coating, and then curing the ink composition by heating or UV exposure, i.e., an organic encapsulation layer.

[0018] Furthermore, the ink composition includes a photocurable monomer and a photoinitiator; the photocurable monomer is any one of methacrylate compounds, acrylate compounds, epoxy compounds, vinyl compounds, vinyl ether compounds, or a mixture thereof.

[0019] Furthermore, the inorganic encapsulation layer can be deposited by chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), sputtering, sublimation, electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD), or any one or a combination thereof.

[0020] Furthermore, the inorganic encapsulation layer may include metal or non-metal, metal or non-metal oxide, metal or non-metal nitride, metal or non-metal carbide, metal or non-metal oxynitride, metal or non-metal silicide, and mixtures thereof.

[0021] Specifically, the inorganic encapsulation layer may include silicon (Si), tin (Sn), antimony (Sb), aluminum (Al), zinc (Zn), antimony (Sb), bismuth (Bi), indium (In), selenium (Se), germanium (Ge), transition metals and lanthanide metals, but is not limited thereto.

[0022] Preferably, the stacked encapsulation layer is a three-layer structure in which a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer are alternately stacked on top of each other. The first inorganic encapsulation layer and the second inorganic encapsulation layer may respectively include silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiOxNy), ZnO, ZnSe, Sb2O3, AlOx, including Al2O3, In2O3, or SnO2. Wherein, x and y are both in the range of 1 to 5.

[0023] It should be emphasized that the stacked encapsulation layer is formed by an organic encapsulation layer and an inorganic encapsulation layer; wherein the organic encapsulation layer can flatten the inorganic encapsulation layer and prevent defects in the inorganic encapsulation layer, thereby preventing the penetration of external moisture and oxygen; and a stacked encapsulation layer can be formed.

[0024] As shown in Figure 1, in the stacked encapsulation layer, a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer are alternately stacked on top of each other. In other embodiments, the stacked encapsulation layer may be a single inorganic encapsulation layer structure, or the stacked encapsulation layer may be a total of 5 to 7 layers. In a structure in which the stacked encapsulation layer includes a total of 5 layers, the stacked encapsulation layer may include a first inorganic encapsulation layer, a first organic encapsulation layer, a second inorganic encapsulation layer, a second organic encapsulation layer, and a third inorganic encapsulation layer stacked in sequence. The inorganic encapsulation layer or the organic encapsulation layer of the stacked encapsulation layer is formed directly on the perovskite cell to encapsulate the perovskite cell.

[0025] In addition, the present invention also provides a method for preparing a perovskite battery assembly containing a stacked encapsulation layer, the steps of which include:

[0026] S1, pre-treating the substrate;

[0027] S2. sequentially preparing a second electrode layer, a hole transport layer, a perovskite layer, an electron transport layer, and a first electrode layer on the pretreated substrate;

[0028] S3. Preparing an inorganic encapsulation layer on the first electrode layer by chemical vapor deposition, plasma-enhanced chemical vapor deposition (e.g., electron cyclotron resonance plasma-enhanced chemical vapor deposition), sputtering, or sublimation, or a combination thereof;

[0029] S4, coating the organic encapsulation layer on the inorganic encapsulation layer by inkjet printing, spraying, roller coating, doctor blade coating or spin coating, and then curing the organic encapsulation layer by heating or UV exposure to form a polymer film, which is the organic encapsulation layer;

[0030] S5. Deposition and coating are performed on the surface to be encapsulated in an alternating manner of inorganic encapsulation layer-organic encapsulation layer-inorganic encapsulation layer. Finally, the inorganic encapsulation layer-organic encapsulation layer-inorganic encapsulation layer deposited and coated on the surface of the object to be encapsulated is a stacked encapsulation layer.

[0031] It should be noted that the thickness of the organic encapsulation layer can be adaptively prepared according to actual encapsulation requirements, and the optional thickness is 50nm, 300nm, 300nm, 400nm, 600nm, 700nm, 800nm, 900nm, 1000nm, 5μm, 10μm, 20μm, 30μm, 40μm or 50μm. The thickness of the inorganic encapsulation layer can also be adaptively prepared according to actual encapsulation requirements, and the optional thickness is 5nm, 10nm, 20nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 200nm, 300nm, 400nm, 500nm, 600nm, 700nm, 800nm, 900nm, 1000nm.

[0032] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0033] The stacked encapsulation layer provided by the present invention for encapsulating perovskite solar cells can be composed of an inorganic encapsulation layer or an organic encapsulation layer and an inorganic encapsulation layer stacked alternately on top of each other. The inorganic encapsulation layer has excellent light transmittance and excellent moisture and / or oxygen barrier properties. The organic layer has a different composition from the inorganic layer, complementing the performance of the inorganic layer. This encapsulation structure has good mechanical properties and can effectively protect the perovskite solar cell from the effects of oxygen and moisture, thereby improving the battery life and stability. The encapsulation process involved is simple and low-cost, and can be used for mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings are incorporated in and constitute a part of this specification and, together with the description, serve to explain the principles of the invention.

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0036] FIG1 is a cross-sectional view of a perovskite cell assembly containing stacked encapsulation layers provided in Example 1 of the present invention;

[0037] FIG2 is a cross-sectional view of a perovskite cell assembly containing stacked encapsulation layers provided in Example 5 of the present invention.

[0038] Among them: 1. Perovskite solar cell; 1-1. First electrode layer; 1-2. Hole transport layer; 1-3. Perovskite layer; 1-4. Electron transport layer; 1-5. Second electrode layer; 1-6. Substrate; 2. Stacked encapsulation layer; 2-1. First inorganic encapsulation layer; 2-2. First organic encapsulation layer; 2-3. Second inorganic encapsulation layer. DETAILED DESCRIPTION

[0039] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Instead, they are merely examples consistent with certain aspects of the present invention as detailed in the appended claims.

[0040] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.

[0041] Example 1

[0042] This embodiment provides a perovskite battery component containing stacked packaging layers, which includes, from bottom to top, a substrate 1-6, a second electrode layer 1-5, a hole transport layer 1-2, a perovskite layer 1-3, an electron transport layer 1-4, a first electrode layer 1-1, and a stacked packaging layer 2; as shown in Figure 1, the stacked packaging layer 2 includes a first inorganic packaging layer 2-1, a first organic packaging layer 2-2, and a second inorganic packaging layer 2-3 stacked in sequence above the first electrode layer.

[0043] Furthermore, the first inorganic encapsulation layer 2-1 and the second inorganic encapsulation layer 2-3 may both contain inorganic materials with excellent light transmittance, and the first inorganic encapsulation layer 2-1 and the second inorganic encapsulation layer 2-3 may be formed of the same or different inorganic materials; the inorganic encapsulation layer of this embodiment may be silicon nitride (SiNx), where x is in the range of 1 to 5.

[0044] Optionally, the first inorganic encapsulation layer 2-1 and the second inorganic encapsulation layer 2-3 may also be any one of SiNx, SiOx, SiOxNy, ZnO, ZnSe, Sb2O3, AlOx or a mixture thereof; wherein x and y are both in the range of 1 to 5.

[0045] Furthermore, the substrate is an ITO transparent conductive substrate; the second electrode layer 1-5 is Ag; the hole transport layer 1-2 is nickel oxide; the electron transport layer 1-4 is TiO2; the first electrode layer 1-1 is ITO, which can be deposited on the electron transport layer 1-4 by magnetron sputtering.

[0046] Furthermore, the organic encapsulation layer is a polymeric film formed by applying an ink composition to a substrate by inkjet printing, spraying, roller coating, doctor blade coating, or spin coating, and then curing by heating or UV exposure. The ink composition includes a curable monomer and a photopolymerization initiator; the photocurable monomer is a methacrylate compound, specifically a mixture of dicyclopentenyl ethoxylated methacrylate, 2-phenoxyethyl acrylate, and trimethylolpropane triacrylate; and the photopolymerization initiator can be TPO.

[0047] Optionally, the photocurable monomer may be any one of an acrylate compound, an epoxy compound, a vinyl compound, a vinyl ether compound, or a mixture thereof.

[0048] The method for preparing the above-mentioned perovskite battery assembly containing stacked encapsulation layers comprises the following steps:

[0049] S1, pre-treating substrates 1-6;

[0050] S2, sequentially preparing a second electrode layer 1-5, a hole transport layer 1-2, a perovskite layer 1-3, an electron transport layer 1-4 and a first electrode layer 1-1 on the pretreated substrate 1-6;

[0051] S3, forming a first inorganic encapsulation layer 2-1 on the first electrode layer 1-1 by chemical vapor deposition;

[0052] S4, coating the first organic encapsulation layer 2-2 on the first inorganic encapsulation layer 2-1 by spin coating, and then curing the coated layer by UV exposure to form a polymeric film, namely the first organic encapsulation layer 2-2;

[0053] S5. Then, a second inorganic encapsulation layer 2-3 is formed on the first organic encapsulation layer 2-2 by chemical vapor deposition.

[0054] Optionally, the inorganic encapsulation layer is prepared by chemical vapor deposition, plasma enhanced chemical vapor deposition, sputtering or sublimation, or a combination thereof.

[0055] Furthermore, the thickness of the first inorganic encapsulation layer 2 - 1 is 50 nm, the thickness of the first organic encapsulation layer 2 - 2 is 20 μm, and the thickness of the second inorganic encapsulation layer 2 - 3 is 70 nm.

[0056] Example 2

[0057] Based on Example 1, the difference from Example 1 is that the encapsulation stack layer 2 is an inorganic encapsulation layer, and the thickness of the inorganic encapsulation layer is 400 nm.

[0058] Example 3

[0059] Based on Example 1, the difference from Example 1 is that the encapsulation stacking layer 2 has a 5-layer structure, namely the first inorganic encapsulation layer 2-1, the first organic encapsulation layer 2-2, the second inorganic encapsulation layer 2-3, the second organic encapsulation layer, and the third inorganic encapsulation layer; wherein the thicknesses of the first inorganic encapsulation layer 2-1, the second inorganic encapsulation layer 2-3, and the third inorganic encapsulation layer are 60 nm, 80 nm, and 100 nm, respectively, and the thicknesses of the first organic encapsulation layer 2-2 and the second organic encapsulation layer are 10 μm and 15 μm, respectively.

[0060] Example 4

[0061] Based on Example 1, the difference from Example 1 is that the encapsulation stacking layer 2 has a 7-layer structure, namely the first inorganic encapsulation layer 2-1, the first organic encapsulation layer 2-2, the second inorganic encapsulation layer 2-3, the second organic encapsulation layer, the third inorganic encapsulation layer, the third organic encapsulation layer, and the fourth inorganic encapsulation layer; wherein the thicknesses of the first inorganic encapsulation layer 2-1, the second inorganic encapsulation layer 2-3, the third inorganic encapsulation layer, and the fourth inorganic encapsulation layer are 10 nm, 20 nm, 90 nm, and 200 nm, respectively, and the thicknesses of the first organic encapsulation layer 2-2, the second organic encapsulation layer, and the third organic encapsulation layer are 7 μm, 12 μm, and 20 μm, respectively.

[0062] Example 5

[0063] Based on Example 1, the difference from Example 1 is that the perovskite battery component containing the stacked packaging layer includes, from bottom to top, a substrate 1-6, a second electrode layer 1-5, an electron transport layer 1-4, a perovskite layer 1-3, a hole transport layer 1-2, a first electrode layer 1-1, and a stacked packaging layer 2, as shown in Figure 2.

[0064] Among them, the stacked packaging layer 2 includes a first inorganic packaging layer 2-1, a first organic packaging layer 2-2, and a second inorganic packaging layer 2-3 stacked in sequence on the first electrode layer 1-1; the thickness of the first inorganic packaging layer 2-1 is 50nm, the thickness of the first organic packaging layer 2-2 is 30μm, and the thickness of the second inorganic packaging layer 2-3 is 40nm.

[0065] Comparative Example

[0066] An existing Chinese patent document (publication number: CN115084386A, publication date: September 20, 2022) discloses a perovskite solar cell packaging structure, which, from bottom to top, comprises a first packaging substrate, a perovskite solar cell and a second packaging substrate; it also includes a pressure component, the pressure component comprising a shell and an elastic component arranged in the shell, the perovskite solar cell is nested in the cavity of the shell, the elastic component is arranged between the perovskite solar cell and the second packaging substrate, and the elastic component is arranged circumferentially along the edge of the perovskite solar cell, which is significantly different from the packaging structure disclosed in the present invention.

[0067] In order to verify the effectiveness of the technical solution provided by the present invention, standard performance tests were performed on the perovskite battery components disclosed in Examples 1 to 5 above. The specific test methods are as follows:

[0068] (1) Photoelectric conversion efficiency change test

[0069] Under a standard sunlight test, the photoelectric conversion efficiency of the perovskite cells in the five examples was tracked and tested, and compared with the photoelectric conversion efficiency of the perovskite cells in the comparative example at the same time. The results are shown in the following table:

[0070] Table 1: Photovoltaic conversion efficiency of perovskite cells in Examples 1 to 5 and Comparative Examples tested at different time points

[0071] It should be noted that each test in each embodiment and comparative example represents the average value of 10 cells. The test results demonstrate that, compared to the comparative example, the packaging structure proposed in the present invention maintains the photovoltaic conversion efficiency of the solar cell while providing superior oxygen isolation and water resistance, thereby extending the battery's lifespan and stability.

[0072] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0073] It should be understood that the present invention is not limited to the above description and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A perovskite battery component containing a stacked encapsulation layer, characterized in that, Comprising: A stacked encapsulation layer (2) disposed on top of the functional layer of the perovskite solar cell module; The stacked encapsulation layer (2) includes an inorganic encapsulation layer; alternatively, the stacked encapsulation layer (2) includes a structure in which an organic encapsulation layer and an inorganic encapsulation layer are alternately stacked on top of each other.

2. The perovskite battery component containing a stacked encapsulation layer according to claim 1, wherein The thickness of the organic encapsulation layer is 50 nm to 50 μm; the thickness of the inorganic encapsulation layer is 5 nm to 1000 nm.

3. The perovskite battery component containing a stacked encapsulation layer according to claim 1, characterized in that The material of the organic encapsulation layer includes any one or a mixture of methacrylate compounds, acrylate compounds, epoxy compounds, vinyl compounds, and vinyl ether compounds.

4. The perovskite battery component containing a stacked encapsulation layer according to claim 1, characterized in that, The organic encapsulation layer is a polymer film formed by coating an ink composition on a substrate by inkjet printing, spraying, roll coating, blade coating, or spin coating, and then curing by heating or ultraviolet exposure.

5. The perovskite battery component containing a stacked encapsulation layer according to claim 1, characterized in that, The inorganic encapsulation layer includes any one or a mixture of metals or non-metals, oxides of metals or non-metals, nitrides of metals or non-metals, carbides of metals or non-metals, oxynitrides of metals or non-metals, and silicides of metals or non-metals.

6. The perovskite battery component containing a stacked encapsulation layer according to claim 5, characterized in that, The inorganic encapsulation layer includes any one or a mixture of SiNx, SiOx, SiOxNy, ZnO, ZnSe, Sb2O3, and AlOx; wherein, both x and y are in the range of 1 to 5.

7. The perovskite battery component containing a stacked encapsulation layer according to claim 1, characterized in that The inorganic encapsulation layer is prepared by any one or a combination of chemical vapor deposition, plasma-enhanced chemical vapor deposition, sputtering, or sublimation.

8. The perovskite battery component containing a stacked encapsulation layer according to claim 1, characterized in that, The material of the first electrode layer (1-1) in the functional layer is one or more of fluorine-doped tin oxide, indium tin oxide, aluminum zinc oxide, gallium zinc oxide, indium zinc oxide, and indium tungsten oxide; the material of the second electrode layer (1-5) in the functional layer is one or more of gold, silver, copper, and aluminum.

9. The perovskite battery component containing a stacked encapsulation layer according to claim 1, characterized in that, The hole transport layer (1-2) in the functional layer is any one or a mixture of nickel oxide, doped nickel oxide, cuprous iodide, cuprous thiocyanate, PTAA, PEDOT:PSS, or Spiro-OMeTAD.

10. The perovskite battery component containing a stacked encapsulation layer according to claim 1, characterized in that, The electron transport layer (1-4) in the functional layer is any one of TiO2, SnO2, InO3, ZnO, PCBM, C 60 or a mixture thereof.

Citation Information

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