Imaging module and endoscope

Abstract

The present application relates to an imaging module and an endoscope. The imaging module comprises a camera assembly and a light-emitting element. The light-emitting element is arranged on a periphery of the camera assembly, and a surface of the light-emitting element facing the camera assembly is configured as a light-shielding surface. In the above imaging module, the light-shielding surface is capable of effectively blocking light emitted by the light-emitting element toward the camera assembly, thereby effectively preventing deterioration of imaging quality of the camera assembly caused by light leakage from the light-emitting element. This configuration also facilitates reduction of manufacturing difficulty of the imaging module, lowering of manufacturing costs, and minimization of the dimension of the imaging module.

Description

Imaging modules and endoscopes Technical Field

[0001] The present application relates to the field of medical device technology, and in particular to imaging modules and endoscopes. Background Art

[0002] Endoscopes are used to visually inspect hard-to-reach locations such as organs in the human body in order to observe pathological changes. Typically, an endoscope includes an insertion portion with a handle at the end of the insertion portion close to the operator, and an imaging module with a built-in camera at the end of the insertion tube away from the operator. The imaging module of a traditional endoscope generally includes a camera and a light-emitting element provided on the periphery of the camera. The light-emitting element can illuminate the lesion area so that the camera can capture an image of the lesion area. However, the light emitted by the light-emitting element in the traditional imaging module easily leaks into the camera, and the light is scattered in the camera, which easily leads to deterioration of the camera's imaging quality and affects the observation effect. Summary of the Invention

[0003] Based on this, it is necessary to provide an imaging module and an endoscope to address the problem that the camera is prone to image quality degradation due to light leakage from the light-emitting element.

[0004] An imaging module, comprising:

[0005] a camera assembly; and

[0006] The light emitting element is arranged on the peripheral side of the camera component, and the surface of the light emitting element facing the camera component is set as a light shielding surface.

[0007] The imaging module described above configures the surface of the light-emitting element facing the camera assembly as a light-shielding surface, effectively shielding the light-emitting element from emitting light toward the camera assembly, thereby effectively preventing the problem of image quality degradation caused by light leakage from the light-emitting element. Furthermore, configuring the surface of the light-emitting element as a light-shielding surface blocks light from the light-emitting element from being directed toward the camera assembly at its source. Compared to the method of providing a light-shielding plate or light-shielding adhesive between the light-emitting element and the camera assembly, this method provides a better light-shielding effect and a simpler process, which helps reduce the difficulty and cost of manufacturing the imaging module. Furthermore, it helps compress the size of the imaging module, thereby reducing damage to the patient caused by the insertion portion of the endoscope.

[0008] In one embodiment, the imaging module is provided with two light-emitting elements, which are respectively arranged on two opposite sides of the camera component, and the surfaces of the two light-emitting elements facing the camera component are both set as light-shielding surfaces.

[0009] In one embodiment, the light-emitting element is a five-sided light source, the surface of the light-emitting element and the camera assembly facing the same surface, and the four side surfaces connected in sequence are all light-emitting surfaces, and the light-emitting surface of the light-emitting element facing the camera assembly is set as a light-shielding surface.

[0010] In one embodiment, the surface of the light emitting element facing the camera assembly is covered with black glue or ink to form a light shielding surface;

[0011] Alternatively, a light-shielding Mylar sheet or light-shielding tape is affixed to the surface of the light-emitting element facing the camera assembly to form a light-shielding surface.

[0012] In one embodiment, the light-emitting element includes a substrate and a plurality of lamp beads disposed on the substrate, the plurality of lamp beads are arranged in an array, and surfaces of the plurality of lamp beads facing the camera assembly are covered with a light-shielding material to form a light-shielding surface.

[0013] In one embodiment, the shortest distance between the light-shielding surface of the light-emitting element and the camera assembly is greater than or equal to 0.1 mm and less than or equal to 0.15 mm;

[0014] And / or, the distance between the light-emitting surface of the light-emitting element and the camera assembly facing the same direction and the light-receiving surface of the camera assembly is greater than 0 and less than or equal to 0.2 mm.

[0015] In one embodiment, the imaging module further includes a substrate, the camera assembly includes a camera and a photosensitive element, the light-emitting element and the photosensitive element are arranged on the substrate, and the camera is arranged on the side of the photosensitive element facing away from the substrate.

[0016] In one embodiment, the imaging module further includes a spacer block, the spacer block is provided on the substrate, and the light emitting element is provided at an end of the spacer block away from the substrate; or,

[0017] The substrate includes a hard circuit board, and the imaging module also includes a bracket. The bracket is connected to the substrate and forms a mounting ear at an end away from the substrate. The light-emitting element is arranged on the mounting ear.

[0018] In one embodiment, the substrate includes a rigid circuit board, the imaging module further includes a rigid board, the rigid board is connected to a side of the substrate facing away from the camera assembly, the width of the photosensitive element is greater than the width of the camera, and the photosensitive element, the substrate, and the rigid board are electrically connected in sequence;

[0019] Alternatively, the imaging module further includes a soft board, the soft board being connected to a side of the substrate facing away from the camera assembly, the width of the photosensitive element being smaller than the width of the camera, and the photosensitive element being electrically connected to the soft board;

[0020] Alternatively, the substrate includes a hard circuit board, and the imaging module also includes a soft board and a hard board, the soft board is connected to the side of the substrate facing away from the camera assembly, and the hard board is connected to the end of the soft board away from the substrate, the width of the photosensitive element is greater than the width of the camera, and the photosensitive element, the substrate, the soft board and the hard board are electrically connected in sequence.

[0021] An endoscope comprises the imaging module as described in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] FIG1 is a schematic structural diagram of an imaging module in some embodiments.

[0023] FIG. 2 is a schematic structural diagram of the imaging module shown in FIG. 1 from another angle.

[0024] FIG3 is a schematic structural diagram of an imaging module in some other embodiments.

[0025] FIG4 is a schematic structural diagram of an imaging module in some other embodiments.

[0026] Reference numerals:

[0027] 10. Imaging module; 11. Camera assembly; 111. Camera; 1111. Light-collecting surface; 112. Photosensitive element; 12. Light-emitting element; 121. Light-shielding surface; 13. Base plate; 14. Heightening block; 15. Bracket; 151. Mounting ear; 16. Hard board; 17. Flexible board. DETAILED DESCRIPTION

[0028] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0029] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0030] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0031] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0032] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0033] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0034] The end of the insertion portion of a traditional endoscope that is away from the operator is usually provided with an imaging module. The imaging module has a camera assembly and a light-emitting element arranged on the side of the camera assembly. The light-emitting element can illuminate the lesion area to supplement the camera assembly. Part of the light emitted by the light-emitting element will leak into the camera of the camera assembly, where it will scatter and form stray light, which can easily lead to deterioration of the camera's imaging quality. Traditional imaging modules usually set a light-shielding structure such as light-shielding glue or a light-shielding plate between the camera and the light-emitting element to block the light leakage of the light-emitting element. However, the light-shielding glue also has a certain degree of light transmittance, and light can easily pass through the light-shielding glue or bypass the light-shielding glue and the light-shielding plate to enter the camera assembly. At the same time, the setting of the light-shielding structure is difficult and costly. In addition, the setting of the light-shielding structure can easily lead to an increase in the size of the imaging module, thereby increasing the size of the insertion head, which can easily cause damage to the patient.

[0035] To solve the above problems, the present application provides an imaging module and an endoscope.

[0036] Please refer to Figures 1 and 2, which are schematic diagrams of the structure of the imaging module 10 at different angles in some embodiments. The imaging module 10 provided in the present application can be used in an endoscope. The imaging module 10 may include a camera assembly 11 and a light-emitting element 12. The endoscope may also include a handle and an insertion portion, with the two ends of the insertion portion being connected to the handle and the imaging module 10 respectively. During the use of the endoscope, the insertion portion can be inserted into the patient's body, the light-emitting element 12 can emit light to illuminate the lesion area, and the camera assembly 11 is used to obtain images of the lesion area for diagnosis or treatment. The light-emitting element 12 includes but is not limited to an LED, and the camera assembly 11 may include a camera 111 and a photosensitive element 112. The camera 111 may be provided with one or more lenses with optical focal length, and the photosensitive element 112 includes but is not limited to a charge coupled device (CCD) or a complementary metal oxide semiconductor device (CMOS Sensor). The camera assembly 11 can receive light from the lesion area. After being adjusted by the camera 111, the light is projected onto the photosensitive element 112 for photoelectric conversion, thereby outputting image information of the lesion area.

[0037] In some embodiments, the light-emitting element 12 is disposed around the camera assembly 11, and the surface of the light-emitting element 12 facing the camera assembly 11 is configured as a light-shielding surface 121. In other words, the surface of the light-emitting element 12 facing the camera assembly 11 can block light emitted by the light-emitting element 12 from reaching the camera assembly 11. The imaging module 10 described above, in which the surface of the light-emitting element 12 facing the camera assembly 11 is configured as the light-shielding surface 121, can effectively block light emitted by the light-emitting element 12 from the camera assembly 11, thereby effectively preventing the problem of image quality degradation of the camera assembly 11 due to light leakage from the light-emitting element 12. At the same time, the surface of the light-emitting element 12 is set as a light-shielding surface 121, which blocks the light of the light-emitting element 12 from being emitted to the camera component 11 from the source of the light-emitting element 12. Compared with the method of setting a light-blocking plate or light-blocking glue between the light-emitting element 12 and the camera component 11, the light-blocking effect is better and the process is simpler, which is conducive to reducing the difficulty of preparing the imaging module 10 and reducing the preparation cost. In addition, compared with the method of setting a light-blocking structure between the light-emitting element 12 and the camera component 11, the imaging module 10 of the present application is also conducive to compressing the size of the imaging module 10, thereby helping to compress the size of the head end of the insertion part, and helping to reduce the damage of the insertion part of the endoscope to the patient.

[0038] In some embodiments, the imaging module 10 is provided with two light-emitting elements 12, and the two light-emitting elements 12 are respectively provided on opposite sides of the camera assembly 11, and the surfaces of the two light-emitting elements 12 facing the camera assembly 11 are both set as light-shielding surfaces 121. The light-emitting elements 12 are provided on opposite sides of the camera assembly 11, which can effectively supplement the light of the camera assembly 11. The setting of the light-shielding surfaces 121 is conducive to improving the shooting quality of the camera assembly 11. In some embodiments, the imaging module 10 may further include a housing (not shown), and the camera assembly 11 and the light-emitting elements 12 are both provided in the housing. The end of the housing opposite to the light-receiving surface 1111 of the camera 111 can be set to a transparent material. The housing does not block the light-emitting viewing angle of the light-emitting element 12, which is conducive to improving the light intensity of the light-emitting element 12 and optimizing the light uniformity. The setting of the light-shielding surfaces 121 is conducive to improving the shooting quality of the camera assembly 11.

[0039] In some embodiments, the light-emitting element 12 is a five-sided light source, such as a five-sided LED. The light-emitting element 12 faces the same surface as the camera assembly 11, such as the same surface as the light-receiving surface 1111 of the camera assembly 11, and the four side surfaces sequentially connected along the circumference are all light-emitting surfaces of the light-emitting element 12. The light-emitting surface of the light-emitting element 12 facing the camera assembly 11 is set as a shading surface 121. The use of a five-sided light-emitting element 12, in conjunction with the setting of the shading surface 121, can not only prevent the light-emitting element 12 from leaking light to the camera assembly 11, but also improve the light intensity and uniformity, which is beneficial to improving the shooting quality of the camera assembly 11. Of course, there are other applicable settings for the number, orientation and type of the light-emitting element 12, which can be set specifically according to the lighting requirements of the camera assembly 11 and will not be described in detail in this application.

[0040] There is no limitation on the manner of setting the surface of the light-emitting element 12 facing the camera assembly 11 as the light-shielding surface 121, as long as the light-shielding surface 121 can block the light emitted by the light-emitting element 12 from being directed toward the camera assembly 11. In some embodiments, the surface of the light-emitting element 12 facing the camera assembly 11 is sprayed with black glue or coated with black ink to form the light-shielding surface 121. In some embodiments, the surface of the light-emitting element 12 facing the camera assembly 11 is affixed with a light-shielding Mylar sheet or light-shielding tape to form the light-shielding surface 121. In some embodiments, the light-emitting element 12 is an LED, and the light-emitting element 12 includes a substrate and a plurality of LED lamp beads provided on the substrate, the plurality of lamp beads are arranged in an array, and the surfaces of the plurality of lamp beads facing the camera assembly 11 are covered with a light-shielding material, for example, coated with black ink to form the light-shielding surface 121, thereby blocking the light of the light-emitting element 12 from being directed toward the camera assembly 11 at the source. It can be seen from the above embodiments that the method of setting a light-shielding surface 121 on the light-emitting element 12 has a simpler setting process, lower setting cost, and occupies less space than the method of setting a light-blocking structure such as light-blocking glue or a light-blocking plate between the light-emitting element 12 and the camera assembly 11.

[0041] In some embodiments, the distance between the light-emitting surface of the light-emitting element 12 and the camera assembly 11, which is facing the same direction, and the light-receiving surface 1111 of the camera assembly 11 (i.e., dimension a in the figure) is greater than 0 and less than or equal to 0.1 mm, for example, it can be 0.05 mm, 0.08 mm, 0.1 mm, etc. The light-emitting surface of the light-emitting element 12 and the camera assembly 11, which is facing the same direction, can be parallel to the light-receiving surface 1111 of the camera assembly 11. Therefore, by reasonably setting the height difference between the light-emitting element 12 and the camera assembly 11, so that the light-emitting element 12 is lower than the camera assembly 11 in the axial direction of the camera assembly 11, and the height difference between the light-emitting element 12 and the camera assembly 11 is not too large, the lighting angle of the light-emitting element 12 can better match the shooting field of view of the camera assembly 11, thereby improving the fill light effect on the camera assembly 11, and at the same time, it can also prevent the light emitted by the light-emitting element 12 from entering the camera assembly 11 from the light-receiving surface 1111 of the camera assembly 11.

[0042] In some embodiments, the imaging module 10 further includes a substrate 13, the photosensitive element 112 is provided on the substrate 13, the camera 111 is provided on the side of the photosensitive element 112 facing away from the substrate 13, and the light-emitting element 12 can be provided directly on the substrate 13. When the light-emitting element 12 is provided on the substrate 13, the height difference between the light-emitting element 12 and the camera 111 is difficult to meet the above range. In some embodiments, the imaging module 10 further includes a spacer 14, the spacer 14 is provided on the substrate 13, and the light-emitting element 12 is provided at one end of the spacer 14 away from the substrate 13. The spacer 14 can increase the height of the light-emitting element 12 so that the height of the light-emitting element 12 meets the above range to obtain a good lighting effect. Spacers 14 can be provided on both opposite sides of the camera assembly 11 to support the two light-emitting elements 12.

[0043] As shown in FIG3 , in other embodiments, the imaging module 10 may employ a bracket 15 in place of the spacer 14. The bracket 15 is connected to the base plate 13. The bracket 15 is bent at one end away from the base plate 13 to form a mounting ear 151. The mounting ear 151 may extend perpendicularly to the axial direction of the camera assembly 11, and the light-emitting element 12 is disposed on the mounting ear 151. As a result, the remaining portion of the bracket 15 can be positioned closer to the camera assembly 11, thereby compressing the overall footprint of the imaging module 10 while supporting the light-emitting element 12, thereby reducing the size of the insertion tip of the endoscope.

[0044] The following illustrates the electrical connection settings in several different embodiments of the imaging module 10. Of course, the circuit board and electrical connection method in the imaging module 10 are not limited to this. As long as the camera component 11 and other components such as the light-emitting element 12 of the imaging module 10 can be electrically connected to the circuit board in the endoscope, such as the circuit board in the handle, the specific settings can be made according to the installation space of the imaging module 10 and the electrical connection requirements.

[0045] 1 and 2 , in some embodiments, substrate 13 may be a rigid circuit board, such as a rigid printed circuit board. Imaging module 10 further includes rigid board 16, which may also be a rigid circuit board. Rigid board 16 is connected to the side of substrate 13 facing away from camera assembly 11. Photosensitive element 112, substrate 13, and rigid board 16 are electrically connected in sequence. Light-emitting element 12 may also be electrically connected to substrate 13 and rigid board 16. In this embodiment, the end of rigid board 16 facing away from substrate 13 may be electrically connected to a circuit board in the handle via a flexible circuit board or transmission line.

[0046] It should be noted that when the imaging module 10 is provided with a raising block 14 or a bracket 15, the light-emitting element 12 can be electrically connected to the substrate 13 or the circuit board through a wire, and the wire can be attached to the raising block 14 or the bracket 15 and extend. Of course, the light-emitting element 12 can also be electrically connected to the circuit board through the metal traces provided on the raising block 14 or the bracket 15.

[0047] 3 , in some embodiments, the substrate 13 may be a rigid circuit board, and the imaging module 10 further includes a flexible board 17 and a rigid board 16 . The flexible board 17 may be a flexible circuit board, and the rigid board 16 may be a rigid printed circuit board. The flexible board 17 is connected to the side of the substrate 13 facing away from the camera assembly 11 , and the rigid board 16 is connected to the end of the flexible board 17 facing away from the substrate 13 . The photosensitive element 112 , the substrate 13 , the flexible board 17 , and the rigid board 16 are electrically connected in sequence. The light-emitting element 12 may also be electrically connected to the substrate 13 , the flexible board 17 , and the rigid board 16 in sequence via wires attached to the bracket 15 . In this embodiment, the rigid board 16 may be electrically connected to the circuit board in the handle via a transmission line or a flexible circuit board.

[0048] As shown in FIG4 , in some embodiments, the imaging module 10 further includes a soft board 17, which can be a flexible circuit board. The photosensitive element 112 is electrically connected to the soft board 17, and the light-emitting element 12 can also be electrically connected to the soft board 17 via a wire attached to the spacer 14. In this embodiment, the end of the soft board 17 away from the substrate 13 can extend into the handle and be electrically connected to the circuit board inside the handle.

[0049] In the embodiments shown in Figures 2 and 3, the photosensitive element 112 is electrically connected to the substrate 13 using a rigid circuit board. In this case, the width of the photosensitive element 112, that is, the dimension of the photosensitive element 112 in the axial direction perpendicular to the camera assembly 11, can be greater than the width of the camera head 111. Providing a rigid circuit board electrically connected to the photosensitive element 112 can improve the stability of the electrical connection between the photosensitive element 112 and other components, thereby improving the stability of the structure and electrical connection performance of the imaging module 10. In the embodiment shown in Figure 4, the photosensitive element 112 is electrically connected to the flexible board 17. The width of the photosensitive element 112 can be less than the width of the camera head 111, and the space occupied by the flexible board 17 can also be compressed, which is beneficial for compressing the overall space occupied by the imaging module 10 and reducing damage to the patient caused by the insertion portion.

[0050] In some embodiments, the shortest distance between the light-shielding surface 121 of the light-emitting element 12 and the camera assembly 11 is greater than or equal to 0.1 mm and less than or equal to 0.15 mm, that is, the dimension b shown in the figure is 0.1 mm-0.15 mm. This configuration can reasonably configure the distance between the light-emitting element 12 and the camera 111, ensuring that the light-emitting element 12 has a sufficient lighting angle to adapt to the shooting field of view of the camera 111, thereby improving the lighting effect. At the same time, it can also reduce the risk of light emitted by the light-emitting element 12 entering the camera 111, which is beneficial to improving the shooting quality of the camera assembly 11.

[0051] It can be understood that in the embodiments shown in Figures 2 and 3, when the width of the photosensitive element 112 is greater than the width of the camera 111, the shortest distance between the light-shielding surface 121 and the camera assembly 11 can be understood as the shortest distance from the light-shielding surface 121 to the side of the photosensitive element 112 in the direction perpendicular to the axis of the camera 111, and in the embodiment shown in Figure 4, when the width of the photosensitive element 112 is less than the width of the camera 111, the shortest distance from the light-shielding surface 121 to the camera assembly 11 can be understood as the shortest distance from the light-shielding surface 121 to the side of the camera 111 in the direction perpendicular to the axis of the camera 111.

[0052] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An imaging module, characterized in that, Comprising: An imaging component; And, A light-emitting element, disposed on the periphery of the imaging component, and the surface of the light-emitting element facing the imaging component is set as a light-shielding surface.

2. The imaging module according to claim 1, wherein The imaging module is provided with two of the light-emitting elements, and the two light-emitting elements are respectively disposed on two opposite sides of the imaging component, and the surfaces of the two light-emitting elements facing the imaging component are both set as light-shielding surfaces.

3. The imaging module according to claim 1, wherein The light-emitting element is a five-sided light-emitting light source, and the surface of the light-emitting element facing the same direction as the imaging component and the four side surfaces connected in sequence are all light-emitting surfaces, and the light-emitting surface of the light-emitting element facing the imaging component is set as a light-shielding surface.

4. The imaging module according to claim 1, wherein The surface of the light-emitting element facing the imaging component is covered with black glue or ink to form a light-shielding surface; Or, a light-shielding mylar sheet or a light-shielding tape is attached to the surface of the light-emitting element facing the imaging component to form a light-shielding surface.

5. The imaging module according to claim 1, characterized in that The light-emitting element includes a substrate and a plurality of lamp beads disposed on the substrate, the plurality of lamp beads are arranged in an array, and the surface of the plurality of lamp beads facing the imaging component is covered with a light-shielding material to form a light-shielding surface.

6. The imaging module according to claim 1, wherein The shortest distance between the light-shielding surface of the light-emitting element and the imaging component is greater than or equal to 0.1 mm and less than or equal to 0.15 mm; And / or, the distance between the light-emitting surface of the light-emitting element facing the same direction as the imaging component and the light-receiving surface of the imaging component is greater than 0 and less than or equal to 0.2 mm.

7. The imaging module according to claim 1, wherein The imaging module further includes a substrate, the imaging component includes a camera and a photosensitive element, the light-emitting element and the photosensitive element are disposed on the substrate, and the camera is disposed on the side of the photosensitive element facing away from the substrate.

8. The imaging module according to claim 7, wherein The imaging module further includes a spacer block, the spacer block is disposed on the substrate, and the light-emitting element is disposed at one end of the spacer block away from the substrate; or, The substrate includes a rigid circuit board, the imaging module further includes a bracket, the bracket is connected to the substrate, and forms a mounting ear at one end away from the substrate, and the light-emitting element is disposed on the mounting ear.

9. The imaging module according to claim 7, wherein The substrate includes a rigid circuit board, the imaging module further includes a rigid board, the rigid board is connected to the side of the substrate facing away from the imaging component, the width of the photosensitive element is greater than the width of the camera, and the photosensitive element, the substrate and the rigid board are electrically connected in sequence; Or, the imaging module further includes a flexible board, the flexible board is connected to the side of the substrate facing away from the imaging component, the width of the photosensitive element is less than the width of the camera, and the photosensitive element is electrically connected to the flexible board; Or, the substrate includes a rigid circuit board, the imaging module further includes a flexible board and a rigid board, the flexible board is connected to the side of the substrate facing away from the imaging component, the rigid board is connected to one end of the flexible board away from the substrate, the width of the photosensitive element is greater than the width of the camera, and the photosensitive element, the substrate, the flexible board and the rigid board are electrically connected in sequence.

10. An endoscope, characterized in that, Comprising the imaging module according to any one of claims 1-9.

Images