Optical cage, communication apparatus and thermal conduction device

Abstract

An optical cage, a communication apparatus and a thermal conduction device, which relate to the technical field of communications. The optical cage comprises an insertion portion and an accommodating portion which are adjacent and connected to each other in a first direction, wherein the insertion portion comprises a first insertion wall and a second insertion wall which are arranged opposite each other, the first insertion wall being located on a side of the second insertion wall in a second direction, and an insertion hole penetrating in the first direction is provided between the first insertion wall and the second insertion wall, the insertion hole being adapted for insertion of an optical module; the accommodating portion comprises two side walls which are arranged opposite each other in a third direction, an accommodating cavity for accommodating the optical module is provided between the two side walls, the insertion hole being in communication with the accommodating cavity in the first direction, and an opening on a side of the accommodating cavity in the second direction is formed by means of enclosure of first edges of the two side walls in the second direction, the first edges being configured to come into contact with and support the thermal conduction device; and in the second direction, the height of at least part of the first edge is lower than the height of the outer wall surface of the first insertion wall. The optical cage provided in the present application can reduce the overall height of the optical cage and the thermal conduction device when the thermal conduction device is mounted on the optical cage.

Description

Light cages, communication equipment, and heat conduction devices

[0001] This application claims priority to the Chinese patent application with application number 202311870501.0 filed with the State Intellectual Property Office of China on December 29, 2023, and priority to the Chinese patent application with the invention name “Optical cage, communication equipment and heat conduction device”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of communication equipment, and in particular to an optical cage, communication equipment and a heat conducting device. Background Art

[0003] Fiber-optic communication technology boasts advantages such as high speed, long-distance transmission, and interference resistance, making it widely used in optical transmission equipment, switches, routers, and other communication devices. Currently, communication equipment is equipped with an optical cage, which has an optical module interface. The optical module is pluggable and installed in the cage interface, enabling signal connections between communication devices.

[0004] With the continued development and upgrade of 4G and 5G networks, the deployment of optical modules is becoming increasingly dense. Multiple optical cages are installed in communication equipment, with heat sinks placed on top of the cages. Currently, the stacking design of the heat sink and optical cages needs to be optimized. With the current stacking setup, the combined height of the cages and heat sinks is relatively high, which increases the overall size of the communication equipment and makes it difficult to arrange other components within the equipment. This creates a difficult problem that needs to be solved, especially when achieving high-integration designs within limited space. Summary of the Invention

[0005] The present application provides an optical cage, communication equipment, and a heat conducting device, which can reduce the overall height of the optical cage and the heat conducting device when the heat conducting device is installed on the optical cage.

[0006] In a first aspect, the present application provides an optical cage, comprising a plug-in portion and a accommodating portion adjacent to each other along a first direction, the plug-in portion comprising a first plug-in wall and a second plug-in wall arranged opposite to each other, and further comprising a third plug-in wall and a fourth plug-in wall arranged opposite to each other, the first plug-in wall being located on one side of the second plug-in wall in the second direction, the first plug-in wall, the third plug-in wall, the second plug-in wall and the fourth plug-in wall being sequentially connected and enclosed to form an insertion hole penetrating along the first direction, the insertion hole being used to insert an optical module; the accommodating portion comprising two side walls arranged opposite to each other along a third direction, a accommodating cavity for accommodating the optical module being provided between the two side walls, the insertion hole and the accommodating cavity being connected along the first direction, the first edges of the two side walls along the second direction enclosing to form an opening on one side of the accommodating cavity along the second direction, the first edge being used to contact and support a heat-conducting device; along the second direction, the height of at least a portion of the first edge is lower than the height of the outer wall surface of the first plug-in wall.

[0007] The optical cage provided in this application can be plugged into an optical module. An opening for placing a heat-conducting device is provided in the housing portion of the optical cage. In the second direction, the first edge of the opening is lower than the height of the first plug-in wall. When the heat-conducting device is placed on the first edge, the overall height of the heat-conducting device and the optical cage is reduced. In particular, when a communication device is equipped with multiple optical cages, each of the multiple optical cages is provided with a heat-conducting device. Due to the reduction in the overall height of a single optical cage and the heat-conducting device, the overall height of the multiple optical cages is significantly reduced, thereby enabling the installation of more optical modules within a limited space. When the same number of optical modules is installed, the height of the communication device is reduced, and the space margin is increased and the height of the fins of the heat-conducting device is increased, which is more conducive to heat conduction. In addition, the direct contact between the optical module and the heat-conducting device significantly improves the heat dissipation effect, ensuring the stable operation of the system.

[0008] In one possible implementation, the accommodating portion further includes a support plate, the first plug-in wall, the opening, and the support plate are arranged in sequence, and the second edge of the support plate on the side adjacent to the first plug-in wall serves as a portion of the side edge of the opening. At least a portion of the outer wall surface of the support plate on the second direction side serves as a first wall surface, and the first wall surface is configured to contact and support the heat conducting device. Along the second direction, the height of the first wall surface is lower than the height of the outer wall surface of the first plug-in wall. The support plate serves to support the heat conducting device, and the height of the first wall surface of the support plate along the second direction is lower than the outer wall surface of the first plug-in wall, thereby reducing the overall height of the optical cage and the heat conducting device while still supporting the heat conducting device.

[0009] In one possible implementation, the outer wall surface of the support plate on the second direction side is a first wall surface. The first wall surface is parallel to the outer wall surface of the first plug-in wall and is used to contact and support the heat conducting device. Along the second direction, the height of the first wall surface is lower than the height of the outer wall surface of the first plug-in wall. In the second direction, the overall height of the support plate is lower than the height of the outer wall surface of the first plug-in wall. The support member can support the heat conducting device and, when the heat conducting device is installed on the light cage, the overall height of the heat conducting device and the light cage is lowered.

[0010] In one possible implementation, the support plate includes a first portion and a second portion adjacent to each other along the third direction. The first wall is the outer wall of the first portion along the second direction. The inner wall of the first portion opposite the second direction is the second wall. The inner wall of the second portion opposite the second direction is the third wall. The third wall is located on one side of the second wall along the second direction to form a stepped structure. This allows the support member to be compatible with optical modules of different models, such as a QSFPDD optical module.

[0011] In one possible implementation, the outer wall surface of the second part along the second direction is a fourth wall surface, and the fourth wall surface is located on the side of the first wall surface along the second direction. The second part is raised relative to the first part along the second direction. The support plate can be formed by bending an integral plate material and presenting a structure on the outside where the first part is lower than the second part. The heat pipe and other structures of the heat conducting device can be set in the sunken part of the first part to improve the heat conducting efficiency of the heat conducting device.

[0012] In one possible implementation, along the second direction, the fourth wall surface is coplanar with the outer wall surface of the first plug-in wall along the second direction. When a QSFPDD optical module is inserted into the optical cage, the QSFPDD optical module is relatively long, and the fourth wall surface is coplanar with the outer wall surface of the first plug-in wall along the second direction, thereby ensuring that the QSFPDD optical module can be inserted into the optical cage.

[0013] In one possible implementation, the width of the first wall along the third direction is greater than 7 mm. The first wall provides space for arranging heat pipes within the heat conducting device, and can accommodate a heat conducting device structure with internal heat pipes. The installation of heat pipes within the heat conducting device can improve the heat dissipation efficiency of the heat conducting device, thereby providing better heat dissipation for the optical module.

[0014] In one possible implementation, the support plate is provided with an absorbing structure on a side opposite to the second direction, the absorbing structure being configured to absorb electromagnetic radiation. The absorbing structure may be attached to the side of the support plate opposite to the second direction. The absorbing structure can absorb electromagnetic waves radiated by the EMC device, reducing electromagnetic interference and preventing the electromagnetic waves radiated by the EMC device from affecting the functions of other communication devices.

[0015] In one possible implementation, the thickness of the second edge along the second direction is in a range of 0.35 mm to 0.5 mm. The side surface of the second edge opposite to the first direction can better abut the optical module, limiting the position of the optical module inserted into the optical cage along the first direction, thereby ensuring precise positioning and connection between the optical module and the connector.

[0016] In one possible implementation, at least one of the side walls is provided with a first protrusion, extending from the side wall toward a side away from the accommodating cavity; the first protrusion has a support surface on one side along the second direction, the support surface being used to support the heat conducting device. The first protrusion forms a support surface on one side along the second direction, and the width of the support surface along the third direction can be greater than the width of the first edge along the third direction. The support surface can assist the two side walls in supporting the heat conducting device, providing more support area for the heat conducting device.

[0017] In one possible implementation, along the second direction, the support surface is lower than the outer wall of the first insertion wall. The support surface is located between the outer wall of the first insertion wall and the outer wall of the second insertion wall. The support surface supports the heat conducting device and ensures that the overall height of the heat conducting device and the light cage is reduced when the heat conducting device is installed on the light cage.

[0018] In one possible implementation, a limiting structure is provided on one side of the sidewall in the second direction. The limiting structure partially extends into the accommodating cavity and is configured to abut the optical module along the first direction. The portion of the limiting structure extending into the accommodating cavity can abut the optical module along the first direction to limit the insertion depth of the optical module into the optical cage. This limits the insertion position of the optical module into the optical cage along the first direction, enabling precise positioning and connection between the optical module and the connector.

[0019] In one possible implementation, the retaining structure includes a second protrusion extending from the first edge toward the second direction, with the free end of the second protrusion bent toward the side closest to the accommodating cavity. The free end of the second protrusion bends toward the side closest to the accommodating cavity to form a C-shaped structure that mates with a groove on the optical module. When the optical module is inserted into the optical cage, the second protrusion fits into the groove on the optical module, retaining the optical module in place and ensuring accurate insertion of the optical module into the cage, thereby improving the stability of the connection between the optical module and the cage.

[0020] In a second aspect, the present application provides a communication device, comprising a heat-conducting device and the optical cage described in any one of the above items, wherein the heat-conducting device is at least partially located on the side of the outer wall of the first plug-in wall opposite to the second direction, and the heat-conducting device covers the opening and is in contact with the first edge of the optical cage.

[0021] The communication device provided in this application is equipped with an optical cage. When the heat conducting device is installed on the optical cage, it contacts the opening of the optical cage. The first edge of the opening is sunken relative to the outer wall surface of the first plug-in wall, which can reduce the overall thickness of the optical cage and the heat conducting device. In particular, when multiple optical cages are installed in the communication device, multiple optical modules are installed in the optical cage in a one-to-one correspondence, effectively reducing the overall width or height of the communication device equipped with multiple optical cages, thereby allowing more optical cages to be installed within a limited space. When the same number of optical modules are installed, the height of the communication device can also be reduced, and the space margin can be increased, and the height of the fins of the heat conducting device can be increased, which is more conducive to heat conduction. In addition, the heat conducting device can directly contact the optical modules, effectively improving the heat dissipation effect.

[0022] In one possible implementation, the communication device further includes an elastic member that connects the optical cage and the heat-conducting device, wherein the optical cage and the heat-conducting device are detachably connected. The heat-conducting device moves relative to the optical cage along the second direction, and the elastic member is configured to apply an elastic force to the heat-conducting device toward one side of the optical cage in a direction opposite to the second direction.

[0023] When the optical module is inserted into the optical cage, it contacts the side of the heat conducting device facing the opening, causing the heat conducting device to move in a second direction. The elastic member applies a spring force opposite to the second direction to the heat conducting device, causing it to move toward the side of the optical cage. The elastic member limits the heat conducting device in the second direction, ensuring a better connection between the heat conducting device and the optical cage, further improving the fit of the heat conducting device to the optical module and enhancing heat dissipation.

[0024] In a possible implementation, the communication device further includes a circuit board, the optical cage is fixedly connected to the circuit board, and at least one optical cage is mounted on the circuit board.

[0025] In a possible implementation, the communication device further includes a connector, the connector is located in the optical cage, the connector is electrically connected to the circuit board, and the connector is used to be electrically connected to the optical module.

[0026] In a possible implementation, the communication device includes a sub-rack, the sub-rack is provided with a mounting cavity, and the circuit board is mounted and fixed in the mounting cavity.

[0027] In a possible implementation, there is at least one installation cavity, and at least one circuit board is disposed in a single installation cavity.

[0028] In a third aspect, the present application provides a heat-conducting device having a planar heat-conducting surface configured to contact the first edge of the optical cage and the optical module. The heat-conducting device exchanges heat with the optical module via the heat-conducting surface, thereby dissipating heat from the optical module. The heat-conducting surface can directly contact the optical module, and the portion of the heat-conducting device in contact with the optical module is thin, enabling better heat dissipation from the optical module and enhancing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a schematic diagram of the structure of a communication device provided in an embodiment of the present application;

[0030] FIG2 is a schematic diagram of the structure of a light cage provided in an embodiment of the present application;

[0031] FIG3 is a side view of a light cage provided in an embodiment of the present application;

[0032] FIG4 is a top view of a light cage provided in an embodiment of the present application;

[0033] FIG5 is a schematic structural diagram of a light cage provided by an embodiment of the present application after a heat conducting device is placed;

[0034] FIG6 is a schematic structural diagram of an optical module provided in an embodiment of the present application after being inserted into an optical cage;

[0035] FIG7 is a cross-sectional view of FIG6 in the embodiment of the present application;

[0036] FIG8 is a schematic diagram of the structure of a light cage provided in another embodiment of the present application;

[0037] FIG9 is a sectional view taken along line BB in FIG8 according to an embodiment of the present application;

[0038] FIG10 is a schematic structural diagram of an optical module provided in another embodiment of the present application after being inserted into an optical cage;

[0039] FIG11 is a CC cross-sectional view of FIG10 in an embodiment of the present application;

[0040] FIG12 is a CC cross-sectional view of FIG10 in accordance with an embodiment of the present application;

[0041] 13 is a schematic diagram showing the coplanarity of the fourth wall and the first plug-in wall along the second direction provided by an embodiment of the present application;

[0042] FIG14 is a schematic diagram of the structure of a communication device provided in another embodiment of the present application;

[0043] FIG15 is a schematic diagram of the circuit board structure provided in an embodiment of the present application;

[0044] FIG16 is a schematic diagram of the structure of a communication device provided in another embodiment of the present application. DETAILED DESCRIPTION

[0045] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0046] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of this application are explained and described below.

[0047] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0048] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0049] It should be understood that the term "and / or" as used herein is simply a term used to describe the existence of three possible relationships between related objects. For example, "A and / or B" can represent the existence of A alone, the existence of both A and B, and the existence of B alone. Furthermore, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0050] It should be understood that the terms “first”, “second”, etc. used in this application are only used for the purpose of distinguishing descriptions, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying an order.

[0051] In the description of this application, the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting this application.

[0052] When used in this application, "within the range of...", unless it is specifically stated that the end value is not included, it is assumed that both end values ​​of the range are included. For example, in the range of 1 to 5, the two values ​​1 and 5 are included.

[0053] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "install", "connect" and "connect" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a conflicting connection or an integrated connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0054] Communication technology, with its advantages of high speed, long-distance transmission, and anti-interference, is a mainstream technology in the communications field. It is widely used in communication equipment such as switches, routers, and optical transmission equipment. Referring to Figure 1 , communication equipment 10 may include a subrack 600, a circuit board 400, an optical cage 100, and an optical module 20. The subrack 600 is provided with a mounting cavity 610, within which the circuit board 400 is mounted and secured. The optical cage 100 is mounted on the circuit board 400. The optical cage 100 has an optical module interface for mounting the optical module 20. The optical module 20 is pluggable and mounted on the interface of the optical cage 100. The optical module 20 can convert electrical signals into optical signals and vice versa, enabling signal connections between communication devices. There may be multiple mounting cavities 610 in the communication device 10 , and multiple circuit boards 400 may be mounted in the multiple mounting cavities 610 . The multiple circuit boards 400 may be distributed vertically or horizontally in the mounting cavity 610 along the thickness direction.

[0055] With the continued development and upgrade of 4G and 5G networks, the deployment of optical modules is becoming increasingly dense, and more optical cages will be installed in communication equipment. Currently, a heat sink has a boss located in the central opening of the top of the optical cage. The boss inserts into the opening, securing the heat sink to the cage. The boss contacts the optical module and transfers heat through the boss. However, the heat sink is located at the top of the optical cage, and the heat sink and the cage cover abut against each other. This requires the addition of a boss of a certain thickness to insert into the central opening of the top of the optical cage and contact the optical module for heat dissipation. This stacking arrangement results in a relatively high height of the optical cages when stacked, or a relatively wide width when arranged horizontally, resulting in a larger communication equipment size. This makes achieving a highly integrated optical cage layout within a limited space a challenge that needs to be addressed, and the stacking design of the heat sink and optical cages requires optimization. Furthermore, with the increasing capacity of optical modules in communication equipment, the power consumption of the optical modules has increased significantly, and the heat dissipation efficiency of the heat sink contacting and transferring heat through the boss needs to be further improved.

[0056] The present application provides a light cage 100, in which a light module 20 can be plugged, and the light cage 100 is used to protect and fix the light module 20. The shape of the light cage 100 can be a rectangular columnar structure.

[0057] 2 to 4 , FIG. 2 is a schematic structural diagram of the light cage provided in the present application, FIG. 3 is a side view of the light cage 100 provided in the present application, and FIG. 4 is a top view of the light cage 100 provided in the present application.

[0058] The optical cage 100 includes a connecting portion 110 and a receiving portion 120 adjacent to each other along a first direction, which is the X direction in Figure 2 (hereinafter referred to as the "first direction"). The receiving portion 120 is located on one side of the connecting portion 110 in the first direction. The connecting portion 110 includes a first connecting wall 111 and a second connecting wall 112, which are oppositely disposed. It also includes a third connecting wall 113 and a fourth connecting wall 114, which are oppositely disposed. The first connecting wall 111 and the second connecting wall 112 are oppositely disposed in a second direction, which is the Z direction in Figure 2 (hereinafter referred to as the "second direction"). The first connecting wall 111, the third connecting wall 113, the second connecting wall 112, and the fourth connecting wall 114 are sequentially connected to form a socket 115 extending therethrough in the first direction. The socket 115 is used to insert the optical module 20. The optical module 20 is inserted into the receiving portion 120 along the first direction. The connecting portion 110 and the receiving portion 120 can be integrally formed or removably connected.

[0059] It is understood that in some other embodiments, the first insertion wall 111, the third insertion wall 113, the second insertion wall 112, and the fourth insertion wall 114 can be formed by bending the same piece of material in sequence. Alternatively, the first insertion wall 111, the third insertion wall 113, the second insertion wall 112, and the fourth insertion wall 114 can be formed by splicing four independent structures together. The third insertion wall 113 and the fourth insertion wall 114 can be a plate-like structure, a hollow mesh structure, or a fence structure, and this application does not impose any restrictions thereto. In addition, the third plug-in wall 113 and the fourth plug-in wall 114 can also be connecting columns connected on both sides of the first plug-in wall 111 and the second plug-in wall 112. In this case, the connecting columns are also fixed on both sides of the first plug-in wall 111 and the second plug-in wall 112 to perform fixed connection in the side spaces on both sides of the first plug-in wall 111 and the second plug-in wall 112, which has the same connecting function as the plate-like or hollow mesh structure, and also falls within the structural scope of the plug-in wall described in this application.

[0060] The accommodating portion 120 includes two side walls 122 arranged opposite to each other along a third direction, and the third direction is the Y direction in Figure 2 (the third direction described below is the Y direction). It should be noted that the side wall 122 refers to all the side walls 122 on one side of the accommodating portion 120 in the third direction. The side wall 122 on one side of the accommodating portion 120 in the third direction can be one, or a combination of two or even more. There are two side walls in the present application, and there is a accommodating cavity 121 for accommodating the optical module between the two side walls 122. The two side walls 122 are partial wall surfaces of the accommodating cavity 121. The jack 115 and the accommodating cavity 121 are connected along the first direction, and the optical module is inserted into the accommodating cavity 121 through the jack 115 along the first direction, so that the optical module can be plugged into the interior of the optical cage 100.

[0061] The first edges 1221 of the two side walls 122 along the second direction enclose an opening 1222 on one side of the accommodating cavity 121 along the second direction. The first edges 1221 of the two side walls 122 along the second direction are partial side edges of the opening 1222. The opening 1222 and the accommodating cavity 121 are connected along the second direction, and the opening 1222 is a part of the accommodating cavity 121.

[0062] As shown in Figure 3, along the second direction, the height H2 of at least part of the first edge 1221 is lower than the height H1 of the outer wall surface of the first plug-in wall 111. Along the second direction, the first edge 1221 is at least partially located between the outer wall surface of the first plug-in wall 111 and the outer wall surface of the second plug-in wall 112. The outer wall surface of the first plug-in wall 111 refers to the upper wall surface of the first plug-in wall 111 along the second direction, and the outer wall surface of the second plug-in wall 112 refers to the lower wall surface of the second plug-in wall 112 in the opposite direction of the second direction. The position of the first edge 1221 in the second direction is lower than the position of the outer wall surface of the first plug-in wall 111 in the second direction. The opening 1222 along the second direction is located on the side of the first plug-in wall 111 in the opposite direction of the second direction (the opposite direction of Y in Figure 2).

[0063] Referring to Figures 5 and 6 , Figure 5 illustrates the structure of the optical cage 100 provided herein after placement of the heat conducting device 200. The heat conducting device 200 is positioned on one side of the optical cage 100 along the second direction (the Z direction in the figure). The heat conducting device 200 can be mounted on the two sidewalls 122 and cover the openings 1222 along the second direction. The first edges 1221 of the two sidewalls 122 are configured to contact and support the heat conducting device 200. When the optical module 20 is inserted into the optical cage 100, the heat conducting device 200 dissipates heat from the side of the optical module 20 closest to the heat conducting device 200 (the top of the optical module 20).

[0064] The heat conducting device 200 may have a step-like structure, wherein the thickness of the heat conducting device 200 on the side close to the plug portion 110, along the direction opposite to the second direction, is less than the thickness of the heat conducting device 200 on the side away from the plug portion 110, along the direction opposite to the second direction. The side of the heat conducting device 200 that contacts the opening 1222 of the light cage 100 is a planar structure.

[0065] Referring to Figures 3, 6, and 7, Figure 6 is a schematic diagram of the structure of the optical cage 100 provided in this application after the optical module 20 is inserted, and Figure 7 is a cross-sectional view taken along line AA in Figure 6. For example, in this application, the optical module 20 may be a QSFP28 optical module. The difference between the height H1 of the plug-in portion 110 of the optical cage 100 and the height H2 of the first edge 1221 in the second direction may be greater than 1 mm, for example, the height difference may be 1.25 mm. The upper limit of the difference between the heights H1 and H2 can be designed based on the structural strength of the sidewall 122 and the position of other structures on the sidewall 122. Compared to the prior art method in which a heat conducting device is inserted into the through hole at the top of the optical cage 100 via a boss, the overall height of the heat conducting device 200 and the optical cage 100 in this application is reduced.

[0066] According to the heat conduction formula "Q = ΔT·λ·S / L," where Q represents heat, ΔT represents temperature difference, R represents thermal resistance, L represents thickness, λ represents thermal conductivity, and S represents heat transfer area, the heat conducting device 200 directly contacts the optical module 20. The side of the heat conducting device 200 that contacts the optical module 20 is a flat structure. This large contact area (i.e., heat transfer area S) and the low thickness (L) of the heat conducting device 200 shorten the heat transfer path. This increases the amount of heat transferred during heat exchange between the optical module 20 and the heat conducting device 200, allowing more heat to be transferred from the optical module 20 to the heat conducting device 200, enhancing the heat transfer effect.

[0067] The light cage 100 provided herein has an opening 1222 disposed within its receiving portion 120 for receiving the heat conducting device 200. A first edge 1221 of the opening 1222 is lower than the height of the first insertion wall 111. When the heat conducting device 200 is placed on the first edge 1221, the overall height of the heat conducting device 200 and the light cage 100 is reduced because the first edge 1221 is lower than the height of the first insertion wall 111.

[0068] In particular, for high-capacity communications equipment with densely packed high-power optical modules 20, multiple optical cages 100 are stacked, with multiple optical modules 20 inserted into the cages. The reduced height of a single optical cage 100 significantly reduces the overall height of the communications equipment when multiple cages 100 are stacked. This allows for the installation of more optical modules 20 within a limited space, or reduces the height of the communications equipment while maintaining the same number of optical modules 20. Furthermore, since multiple optical modules 20 generate more heat, direct contact between the optical modules 20 and the heat conducting device 200 significantly improves heat dissipation, ensuring stable system operation.

[0069] In one possible embodiment, as shown in Figures 2 to 4 , the accommodating portion 120 further includes a support plate 123, and the first plugging wall 111, the opening 1222, and the support plate 123 are sequentially arranged. Specifically, the first plugging wall 111, the opening 1222, and the support plate 123 are sequentially arranged along a first direction, with the support plate 123 located on a side of the accommodating portion 120 away from the plugging portion 110.

[0070] The second edge 123a of the support plate 123 on the side close to the first plug-in wall 111 is part of the side edge of the opening 1222. The second edge 123a of the support plate 123 on the side close to the first plug-in wall 111 and the first edges 1221 of the two side walls 122 along the second direction are part of the opening 1222. At least part of the outer wall surface of the support plate 123 on the side in the second direction is a first wall surface 1231a. The first wall surface 1231a is used to contact and support the heat-conducting device 200. Along the second direction, the height of the first wall surface 1231a is lower than the height of the outer wall surface of the first plug-in wall 111. The first wall surface 1231a is located between the outer wall surface of the first plug-in wall 111 and the outer wall surface of the second plug-in wall 112. The position of the first wall surface 1231a along the second direction is lower than the position of the outer wall surface of the first plug-in wall 111 along the second direction.

[0071] The support plate 123 is used to support the heat conducting device 200. The first wall 1231a of the support plate 123 contacts the heat conducting device 200 to support the heat conducting device 200. The height of the first wall 1231a along the second direction is lower than the outer wall of the first plug wall 111, thereby reducing the overall height of the optical cage 100 and the heat conducting device 200 while still supporting the heat conducting device 200.

[0072] In one possible embodiment, the outer wall surface of the support plate 123 on one side in the second direction is a first wall surface 1231a. The first wall surface 1231a is parallel to the outer wall surface of the first plug-in wall 111 and is used to contact and support the heat-conducting device 200. Along the second direction, the height of the first wall surface 1231a is lower than the height of the outer wall surface of the first plug-in wall 111. The first wall surface 1231a is parallel to the outer wall surface of the first plug-in wall 111 and is lower than the height of the outer wall surface of the first plug-in wall 111 along the second direction, so that the entire height of the support plate 123 is lower than the height of the outer wall surface of the first plug-in wall 111. The support plate 123 can support the heat-conducting device 200. When the heat-conducting device 200 is installed on the light cage 100, the height of the heat-conducting device 200 and the light cage 100 as a whole is reduced.

[0073] In a possible embodiment, referring to Figures 8 and 9, the support plate 123 includes a first portion 1231 and a second portion 1232 adjacent to each other along a third direction, the first wall 1231a is the outer wall of the first portion 1231 along the second direction, the inner wall of the first portion 1231 on the side opposite to the second direction is the second wall 1231b, the inner wall of the second portion 1232 on the side opposite to the second direction is the third wall 1232a, and the third wall 1232a is located on one side of the second wall 1231b along the second direction to form a step structure.

[0074] In one possible embodiment, as shown in FIG8 , the outer wall surface of the second portion 1232 along the second direction is a fourth wall surface 1232b. The fourth wall surface 1232b is located on the side of the first wall surface 1231a along the second direction. The second portion 1232 protrudes relative to the first portion 1231 along the second direction. As described in this embodiment, there may be two second portions 1232, one located on either side of the first portion 1231 along the third direction. Alternatively, there may be only one second portion 1232, located adjacent to the first portion 1231 along the third direction. The support plate 123 may be formed by bending a single sheet of material, with the outer surface of the first portion 1231 being lower than the second portion 1232. The first portion 1231 is located on the opposite side of the second portion 1232 along the second direction, which better matches the QSFPDD optical module 20. Furthermore, the sunken portion of the first portion 1231 may be provided with a heat pipe or other structure of a heat conducting device to improve the heat conduction efficiency of the heat conducting device.

[0075] In one possible embodiment, as shown in Figure 13 , along the second direction, the fourth wall 1232b and the outer wall of the first plug-in wall 111 along the second direction are coplanar. That is, the plane of the fourth wall 1232b and the plane of the outer wall of the first plug-in wall 111 along the second direction are coplanar. When a QSFPDD optical module is inserted into the optical cage 100, the longer QSFPDD optical module becomes coplanar with the outer wall of the first plug-in wall 111 along the second direction, ensuring that the QSFPDD optical module can be inserted into the optical cage 100. Figure 10 illustrates a schematic diagram of a QSFPDD optical module being inserted into the optical cage 100.

[0076] In one possible implementation, referring to FIG9 , the width W of the first wall 1231a along the third direction is greater than 7 mm. In one embodiment, the width of the first wall 1231a along the third direction is 8.5 mm. A heat pipe can be added to the heat-conducting device 200, and the heat pipe can be arranged inside the heat-conducting device 200 by welding or other methods to form a heat-conducting device including a heat pipe. The spacing between the first wall 1231a and the fourth wall 1232b along the second direction provides space for the layout of the heat pipe in the heat-conducting device 200, and can place a portion of the heat-conducting device with a heat pipe arranged inside. The arrangement of heat pipes inside the heat-conducting device 200 can improve the heat dissipation efficiency of the heat-conducting device 200, and bring better heat dissipation effect to the heat dissipation of the optical module 20.

[0077] In one possible embodiment, as shown in FIG12 , a wave-absorbing structure 124 is provided on the side of the support plate 123 opposite to the second direction. The wave-absorbing structure 124 is used to absorb electromagnetic radiation. The wave-absorbing structure 124 can absorb the radiated electromagnetic waves generated by the electromagnetic compatibility device, reduce electromagnetic interference, and prevent the radiated electromagnetic waves of the electromagnetic compatibility device from affecting the functions of other communication devices (which may be optical modules, routers, and switches in other optical cages within the same communication device). The wave-absorbing structure 124 can be attached to the side of the support plate 123 opposite to the second direction. The wave-absorbing structure 124 can be completely attached to the side of the support plate 123 opposite to the second direction, or it can be only partially attached to the side of the support plate 123 opposite to the second direction. The materials used to make the wave-absorbing structure 124 can include, but are not limited to, carbon fiber, polyaniline, and iron.

[0078] In one possible embodiment, the thickness of the second edge 123a along the second direction is in a range of 0.35 mm to 0.5 mm. When the optical module 20 is inserted into the optical cage 100, the second edge 123a (the wall surface of the support plate 123 near the opening 1222) can abut against the optical module 20. The thickness of the second edge 123a along the second direction being in a range of 0.35 mm to 0.5 mm can better abut against the optical module 20, limit the position of the optical module 20, and ensure that the optical module and the connector can be accurately positioned and connected.

[0079] In one embodiment, the thickness of the second edge 123a of the support plate 123 along the second direction is in the range of 0.35 mm to 0.5 mm, and the remaining edges of the support plate 123 are all of equal thickness and are all less than the thickness of the second edge 123a along the second direction. In other words, the support plate 123 is thickened only at the edge that contacts the optical module 20, and the second edge 123a serves to limit the position of the optical module 20.

[0080] In one embodiment, the thickness of the second edge 123a of the support plate 123 and other edges of the support plate 123 along the second direction is in the range of 0.35 mm to 0.5 mm. The thickness of all sides of the support plate 123 along the second direction is equal, which limits the position of the optical module 20.

[0081] In one possible embodiment, at least one side wall 122 is provided with a first protrusion 1223, which extends from the side wall 122 toward a side away from the accommodating cavity 121. The first protrusion 1223 has a support surface 1223a on one side along the second direction, and the support surface 1223a is used to support the heat conducting device 200.

[0082] In one embodiment, referring to Figures 2 to 4 , both side walls 122 of the accommodating portion 120 are provided with a first protrusion 1223 on one side in the second direction. The two first protrusions 1223 can be integrally formed with the two side walls 122, or the two first protrusions 1223 can be fixedly connected to the two side walls 122 by welding or other methods. The first protrusion 1223 on each side wall 122 extends from the side wall 122 toward the side away from the accommodating cavity 121, and the first protrusion 1223 can extend along the second direction. The two first protrusions 1223 continue to bend in directions away from each other in the third direction, forming a support surface 1223a on the side along the second direction. The plane on which the support surface 1223a lies can be perpendicular to the plane of the side wall 122. The width of the support surface 1223a along the third direction may be greater than the width of the first edge 1221 along the third direction. The support surface 1223a can assist the two side walls 122 in supporting the heat conducting device, thereby providing more supporting area for the heat conducting device.

[0083] In one possible embodiment, as shown in FIG3 , along the second direction, the height of support surface 1223a is lower than the height of the outer wall of first insertion wall 111. Support surface 1223a is located between the outer wall of first insertion wall 111 and the outer wall of second insertion wall 112. Support surface 1223a not only supports heat conducting device 200 but also ensures that the overall height of heat conducting device 200 and light cage 100 is reduced when heat conducting device 200 is installed on light cage 100.

[0084] In a possible implementation, referring to FIG. 3 , a limiting structure 1225 is provided on one side of the sidewall 122 in the second direction. The limiting structure 1225 partially extends into the accommodating cavity 121 for contacting the optical module 20 along the first direction.

[0085] In one embodiment, as shown in FIG3 , both side walls 122 of the accommodating portion 120 are provided with a limiting structure 1225 on one side in the second direction. The two limiting structures 1225 can be integrally formed with the two side walls 122, or the two limiting structures 1225 can be fixedly connected to the two side walls 122 by welding or other methods. The limiting structure 1225 on each side wall 122 can partially extend into the accommodating cavity 121. The portion of the limiting structure 1225 extending into the accommodating cavity 121 is used to abut the optical module along the first direction to limit the insertion depth of the optical module in the optical cage, thereby limiting the position of the optical module inserted into the optical cage along the first direction, and enabling precise positioning and connection between the optical module and the connector.

[0086] In one possible embodiment, the limiting structure 1225 includes a second protrusion 1222a extending from the first edge 1221 in the second direction, with the free end of the second protrusion 1222a being bent toward the side closer to the accommodating cavity 121. Specifically, in one embodiment, referring to Figures 2 and 3, the limiting structure 1225 includes a second protrusion 1222a extending from the first edge 1221 in the second direction, with the free end of the second protrusion 1222a being bent toward the side closer to the accommodating cavity 121. The free end of the second protrusion 1222a may be a structure in which the second protrusion 1222a is not connected to the first edge 1221. There may be two second protrusions 1222a, and the free ends of both second protrusions 1222a are bent toward the side closer to the accommodating cavity 121 to form a C-shaped structure that can match the groove on the optical module. When the optical module is inserted into the optical cage, the second protrusion 1222a can be inserted into the groove on the optical module to limit the optical module, ensure the accurate insertion position of the optical module in the optical cage, and improve the stability of the connection between the optical module and the optical cage.

[0087] In one possible embodiment, a heat dissipation structure may be further provided on one side of the heat conducting device 200 in the second direction. For example, in this embodiment, two heat dissipation structures may be provided. Of course, in other embodiments, only one heat dissipation structure or more than two heat dissipation structures may be provided. The heat dissipation structure may be made of metal (such as copper, aluminum, etc.) and may be a heat dissipation fin. The heat dissipation fin may increase the heat dissipation area of ​​the heat conducting device 200 and improve the heat dissipation efficiency of the heat conducting device 200.

[0088] The present application provides a communication device 10, which may include but is not limited to: switches, servers, routers, optical access products, optical transmission equipment, optical transport equipment, and any other communication device that needs to be connected to an optical module. For example, the communication device 10 in the embodiments of the present application may be a switch.

[0089] The communication device 10 may include a heat conducting device 200 and the optical cage 100 described in any of the above embodiments. The heat conducting device 200 is disposed on an opening 1222 on one side of the optical cage 100 along the second direction, and covers the opening 1222. The heat conducting device 200 is in contact with and connected to the first edge 1221 of the optical cage 100. At least a portion of the height of the first edge 1221 in the second direction is lower than the height of the outer wall of the first plug-in wall 111. The heat conducting device 200 is at least partially located on the side of the outer wall of the first plug-in wall 111 opposite to the second direction. After the heat conducting device 200 contacts the first edge 1221, the side of the heat conducting device 200 facing the opening 1222 is located on the side of the outer wall of the first plug-in wall 111 opposite to the second direction.

[0090] The communication device 10 provided in this application is equipped with an optical cage 100. When the heat conducting device 200 is installed on the optical cage 100, it contacts the opening 1222 of the optical cage 100. The height of the first edge 1221 of the opening 1222 in the second direction is lower than the height of the outer wall surface of the first plug-in wall, thereby reducing the overall thickness of the optical cage 100 and the heat conducting device 200. In particular, when multiple optical cages 100 are installed in the communication device 10, multiple optical modules 20 are installed in a one-to-one correspondence within the optical cage 100, effectively reducing the overall width of the communication device 10 equipped with multiple optical cages 100, thereby allowing more optical cages to be installed within a limited space. In addition, the heat conducting device 200 can directly contact the optical modules 20, effectively improving the heat dissipation effect.

[0091] In one possible embodiment, as shown in Figures 10 and 11 , the communication device 10 further includes an elastic member 300. The elastic member 300 connects the optical cage 100 and the heat conducting device 200 to impart an elastic force to the heat conducting device 200 in a direction opposite to the second direction, toward the side of the optical cage 100. The ends of the elastic member 300 are connected to the two sidewalls of the optical cage 100, and the elastic member 300 secures the heat conducting device 200 to the optical cage 100. The optical cage 100 and the heat conducting device 200 are detachably connected. The heat conducting device 200 moves relative to the optical cage 100 in the second direction, and the heat conducting device 200 can move up and down relative to the optical cage 100 in the second direction. When the optical module 20 is inserted into the optical cage 100, it contacts the side of the heat conducting device 200 facing the opening 1222, causing the heat conducting device 200 to move in the second direction, thereby ensuring a better fit between the heat conducting device 200 and the optical module 20, thereby improving heat dissipation.

[0092] When the optical module 20 is inserted into the optical cage 100, the elastic member 300 applies an elastic force to the heat conducting device 200 in a direction opposite to the second direction, forcing the heat conducting device 200 toward one side of the optical cage 100 and preventing excessive movement of the heat conducting device 200 in the second direction. The elastic member 300 limits the heat conducting device 200 in the second direction, ensuring a better connection between the heat conducting device 200 and the optical cage 100, and further improving the fit between the heat conducting device 200 and the optical module 20, thereby enhancing heat dissipation.

[0093] In a possible implementation, the communication device 10 further includes a circuit board 400. The optical cage 100 and the circuit board 400 are fixedly connected, and at least one optical cage 100 is mounted on the circuit board 400. At least one circuit board 400 is provided in the communication device 10.

[0094] In one embodiment, as shown in Figures 14 and 15 , the communication device 10 includes only one circuit board 400. The communication device 10 may include a housing 800, with the circuit board 400 located within the housing 800. The optical cage 100 is mounted on the circuit board 400. Specifically, the optical cage 100 includes a connector 1224 located on the side of the sidewall 122 opposite the second direction. The connector 1224 and the mounting hole 410 on the circuit board 400 are arranged opposite each other. During assembly, a compressive force is applied to the optical cage 100 in a direction opposite the second direction, causing the connector 1224 to be inserted into the mounting hole 410, thereby mounting the optical cage 100 on the circuit board 400. Figure 14 shows eight optical cages 100 mounted on a circuit board 400. A heat conducting device 200 is mounted on one side of each optical cage 100 along the second direction. Optical modules 20 are inserted into the optical cages 100 one by one. When the optical modules 20 are operating, the heat conducting devices 200 dissipate heat from the optical modules 20. It is understood that multiple circuit boards 400 may be provided in the communication device 10, as described below.

[0095] In one possible embodiment, as shown in FIG. 12 , the communication device 10 further includes a connector 500 . The connector 500 is located within the optical cage 100 , with each optical cage 100 correspondingly mounted with a connector 500 . The connector 500 is electrically connected to the circuit board 400 . This electrical connection can be implemented in a variety of ways. For example, the connector 500 and circuit board 400 can be connected using a combination of pins and sockets, or a cable arrangement. The connector 500 is used to electrically connect to the optical module 20 . The optical module 20 is inserted from outside the communication device 10 into the optical cage 100 through the plug-in portion 110 , and the optical module 20 and the connector 500 are plugged together to achieve electrical connection. A heat conducting device 200 is provided at the top of the optical cage 100 to dissipate heat from the top of the optical module 20 .

[0096] In a possible implementation, referring to FIG. 16 , the communication device 10 includes a subrack 600 . The subrack 600 is provided with a mounting cavity 610 . The circuit board 400 is mounted and fixed in the mounting cavity 610 .

[0097] In one embodiment, there is at least one mounting cavity 610. Multiple mounting cavities 610 may be provided within the subrack 600, with at least one circuit board 400 disposed within each mounting cavity. This embodiment is illustrated using FIG16 as an example. The subrack is provided with 12 mounting cavities 610, each housing a circuit board 400. The circuit boards 400 are vertically positioned within the communication device 10. Each circuit board 400 is mounted on an optical cage 100, and each optical cage 100 is plugged into an optical module 20. A heat conducting device 200 is disposed on one side of the optical cage 100 along the third direction, contacting the opening 1222 of the optical cage 100. The first edge 1221 of the opening 1222 is lower in the third direction than the outer wall of the first plug-in wall. When the heat conducting device 200 is disposed on the optical cage 100, the overall thickness of the optical cage 100 and the heat conducting device 200 can be reduced, thereby effectively reducing the overall width of the communication device 10 equipped with multiple optical cages 100. In addition, the heat conducting device 200 can directly contact the optical module 20, thereby effectively improving the heat dissipation effect.

[0098] The present application provides a heat conducting device 200. Referring to Figures 10, 11, and 12, the heat conducting device 200 can have a step-like structure, wherein the thickness of the structure of the heat conducting device 200 on the side closer to the plug-in portion 110, along the second direction opposite to the plug-in portion 110, is less than the thickness of the structure of the heat conducting device 200 on the side farther from the plug-in portion 110, along the second direction opposite to the plug-in portion 110. In other words, the portion of the heat conducting device 200 in contact with the optical cage 100 has a smaller thickness along the second direction opposite to the plug-in portion 110. The heat conducting device 200 has a planar heat conducting surface 210, which is configured to contact the first edge 1221 of the optical cage 100 and the optical module 20. The heat conducting surface 210 is the side of the heat conducting device 200 that faces the optical cage 100 and contacts the first edge 1221 of the optical cage 100 and the optical module 20. The heat conducting surface 210 allows heat exchange between the heat conducting device 200 and the optical module 20, thereby dissipating heat from the optical module 20. The heat conducting surface 210 can directly contact the optical module, and the thickness of the portion of the heat conducting device 200 that contacts the optical module 20 is small, which can better dissipate heat from the optical module and improve the heat dissipation effect.

[0099] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A photonic cage, characterized in that, The optical module comprises a plug-in portion and a receiving portion adjacent to each other along a first direction, wherein the plug-in portion comprises a first plug-in wall and a second plug-in wall arranged opposite to each other, and further comprises a third plug-in wall and a fourth plug-in wall arranged opposite to each other, wherein the first plug-in wall is located on one side of the second plug-in wall in the second direction, and the first plug-in wall, the third plug-in wall, the second plug-in wall and the fourth plug-in wall are sequentially connected and enclosed to form a plug hole penetrating along the first direction, and the plug hole is used to insert an optical module; The accommodating portion includes two side walls arranged opposite to each other along the third direction, a accommodating cavity for accommodating the optical module is provided between the two side walls, the insertion hole and the accommodating cavity are connected along the first direction, and the first edges of the two side walls along the second direction enclose an opening on one side of the accommodating cavity along the second direction, and the first edge is used to contact and support the heat conducting device; Along the second direction, a height of at least a portion of the first edge is lower than a height of an outer wall surface of the first inserting wall.

2. The optical cage according to claim 1, wherein The accommodating portion further includes a support plate, the first plug-in wall, the opening and the support plate are arranged in sequence, and a second edge of the support plate on a side close to the first plug-in wall is a partial side edge of the opening; At least part of the outer wall surface of the support plate on one side of the second direction is a first wall surface, and the first wall surface is used for contacting and supporting the heat conducting device. Along the second direction, the height of the first wall surface is lower than the height of the outer wall surface of the first plug-in wall.

3. The optical cage according to claim 2, wherein, The outer wall surface of the support plate on one side of the second direction is a first wall surface, and the first wall surface is used for contacting and supporting the heat conducting device. Along the second direction, the height of the first wall surface is lower than the height of the outer wall surface of the first plug-in wall.

4. The optical cage according to claim 2, characterized in that, The support plate includes a first part and a second part adjacent to each other along the third direction, the first wall surface is the outer wall surface of the first part along the second direction, the inner wall surface of the first part on the side opposite to the second direction is the second wall surface, the inner wall surface of the second part on the side opposite to the second direction is the third wall surface, and the third wall surface is located on one side of the second wall surface along the second direction to form a step structure.

5. The optical cage according to claim 4, wherein An outer wall surface of the second portion along one side of the second direction is a fourth wall surface, and the fourth wall surface is located on one side of the first wall surface along the second direction. The second portion protrudes relative to the first portion along the second direction.

6. The optical cage according to claim 5, wherein, Along the second direction, the fourth wall surface and the outer wall surface of the first plug-in wall along the second direction are coplanar.

7. The optical cage according to claim 5 or 6, characterized in that, The width of the first wall surface along the third direction is greater than 7 mm.

8. The optical cage according to any one of claims 2-7, characterized in that, The support plate is provided with a wave absorbing structure on one side of the support plate in the opposite direction to the second direction, and the wave absorbing structure is used for absorbing electromagnetic radiation.

9. The optical cage according to any one of claims 2-8, characterized in that, A thickness of the second edge along the second direction is in a range from 0.35 mm to 0.5 mm.

10. The optical cage according to any one of claims 1-9, characterized in that, A first protrusion is provided on at least one of the side walls, and the first protrusion extends from the side wall to a side away from the accommodating cavity; the first protrusion has a supporting surface on one side along the second direction, and the supporting surface is used to support the heat conducting device.

11. The optical cage according to claim 10, wherein, Along the second direction, the height of the supporting surface is lower than the height of the outer wall surface of the first inserting wall.

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